Substrate positioning device, substrate positioning method and bonding device

Abstract

The present invention provides a substrate positioning device, a substrate positioning method and a bonding device that improve the positioning accuracy of a substrate. The substrate positioning device disclosed in the present invention comprises a holding portion and a rotating mechanism. The holding portion holds the substrate. The rotating mechanism rotates the holding portion. In addition, the rotating mechanism comprises a rotating shaft portion, a bearing portion, a base portion, a driving portion, and a damping mechanism. The rotating shaft portion is fixed to the holding portion. The bearing portion supports the rotating shaft portion in a non-contact state. The base portion fixes the bearing portion. The driving portion rotates the rotating shaft portion. The damping mechanism comprises a track connected to the base portion and a sliding member connected to the rotating shaft portion, and utilizes the resistance generated between the track and the sliding member to generate a damping force for the relative movement between the rotating shaft portion and the base portion.

Description

Technical Field

[0001] The present disclosure relates to a substrate positioning device, a substrate positioning method and a bonding device. Background Art

[0002] Conventionally, there is known a bonding apparatus for bonding substrates such as semiconductor wafers to each other (see Patent Document 1).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2018-147944 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] The present disclosure provides a technology for improving the positioning accuracy of a substrate.

[0008] Solutions for solving problems

[0009] A substrate positioning device in one form of the present disclosure includes a holding portion and a rotating mechanism. The holding portion holds the substrate. The rotating mechanism rotates the holding portion. In addition, the rotating mechanism includes a rotating shaft portion, a bearing portion, a base portion, a driving portion, and a damping mechanism. The rotating shaft portion is fixed to the holding portion. The bearing portion supports the rotating shaft portion in a non-contact state. The base portion fixes the bearing portion. The driving portion rotates the rotating shaft portion. The damping mechanism includes a track connected to the base portion and a sliding member connected to the rotating shaft portion, and utilizes the resistance generated between the track and the sliding member to generate a damping force for the relative movement between the rotating shaft portion and the base portion.

[0010] Effects of the Invention

[0011] According to the present disclosure, it is possible to improve the positioning accuracy of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram showing the structure of the joining system according to the embodiment.

[0013] Figure 2 It is a schematic diagram showing a state before the first substrate and the second substrate of the embodiment are bonded together.

[0014] Figure 3 It is a schematic diagram showing the structure of the bonding apparatus according to the embodiment.

[0015] Figure 4 It is a top view of the rotating mechanism of the embodiment.

[0016] Figure 5It is a top view of the damping mechanism of the embodiment.

[0017] Figure 6 This is a flowchart showing the procedure of processing executed by the joining system according to the embodiment. DETAILED DESCRIPTION

[0018] Hereinafter, with reference to the accompanying drawings, the form of the substrate positioning device, substrate positioning method and bonding device for implementing the present disclosure (hereinafter, recorded as "embodiment") is described in detail. In addition, the present disclosure is not limited to the embodiment. In addition, each embodiment can be appropriately combined within the scope that does not cause the processing content to be contradictory. In addition, in each of the following embodiments, the same reference numerals are marked on the same parts, and repeated descriptions are omitted.

[0019] In the embodiments described below, there are cases where expressions such as "certain", "orthogonal", "perpendicular" or "parallel" are used, but these expressions do not need to be strictly "certain", "orthogonal", "perpendicular" or "parallel". That is, the above expressions are set to allow for deviations such as manufacturing accuracy and setting accuracy.

[0020] In addition, in order to make the description easier to understand, in the various drawings referred to below, there is a case where an orthogonal coordinate system is represented, which specifies the X-axis direction, the Y-axis direction, and the Z-axis direction that are orthogonal to each other, and the positive direction of the Z-axis is set as the vertical upward direction. In addition, there is a case where the rotation direction with the vertical axis as the rotation center is called the θ direction.

[0021] In a bonding device for bonding substrates to each other, the substrates are positioned in a rotational direction before bonding the substrates to each other. Improving the positioning accuracy in the rotational direction involves improving the bonding accuracy of the substrates. Therefore, it is expected that the positioning accuracy in the rotational direction of the substrates will be improved.

[0022] In addition, the improvement of the positioning accuracy of the substrate in the rotation direction is not limited to the bonding device, and is also expected in other devices such as the substrate inspection device (probe device). The following describes an embodiment of the substrate positioning device and substrate positioning method disclosed in the present invention applied to the bonding device, but the substrate positioning device and substrate positioning method disclosed in the present invention can also be applied to devices other than the bonding device.

[0023] <Joint system structure>

[0024] First, refer to Figure 1 and Figure 2 Next, the structure of the joining system according to the embodiment will be described. Figure 1 Schematic diagram showing the structure of the joining system according to the embodiment. Figure 2 It is a schematic diagram showing a state before the first substrate and the second substrate of the embodiment are bonded together.

[0025] Figure 1 The bonding system 1 shown in FIG. 1 forms a superimposed substrate T (see FIG. 1 ) by bonding a first substrate W1 and a second substrate W2. Figure 2 ).

[0026] The first substrate W1 and the second substrate W2 are single crystal silicon wafers, and a plurality of electronic circuits are formed on the surface of the substrate. The first substrate W1 and the second substrate W2 have substantially the same diameter. In addition, one of the first substrate W1 and the second substrate W2 may be a substrate without an electronic circuit, for example.

[0027] The following, such as Figure 2 As shown, the plate surface of the first substrate W1 on the side bonded to the second substrate W2 is recorded as a "bonding surface W1j", and the plate surface on the side opposite to the bonding surface W1j is recorded as a "non-bonding surface W1n". In addition, the plate surface of the second substrate W2 on the side bonded to the first substrate W1 is recorded as a "bonding surface W2j", and the plate surface on the side opposite to the bonding surface W2j is recorded as a "non-bonding surface W2n".

[0028] like Figure 1 As shown, the bonding system 1 includes a carrying-in / out station 2 and a processing station 3. The carrying-in / out station 2 is disposed on the negative side of the processing station 3 in the X-axis direction and is connected to the processing station 3 in an integral manner.

[0029] The loading and unloading station 2 includes a loading platform 10 and a conveying area 20. The loading platform 10 includes a plurality of loading plates 11. Boxes C1 to C4 for storing a plurality of (e.g., 25) substrates in a horizontal state are placed on each loading plate 11. Box C1 can store a plurality of first substrates W1, box C2 can store a plurality of second substrates W2, and box C3 can store a plurality of overlapping substrates T. Box C4 is a box for recovering, for example, a substrate that has a defective condition. In addition, the number of boxes C1 to C4 placed on the loading plate 11 is not limited to the number shown in the figure.

[0030] The conveying area 20 is arranged on the positive X-axis side of the stage 10 in a manner adjacent to the stage 10. A conveying path 21 extending in the Y-axis direction and a conveying device 22 that can move along the conveying path 21 are provided in the conveying area 20. The conveying device 22 can move not only in the Y-axis direction but also in the X-axis direction and can rotate around the Z-axis. The conveying device 22 conveys the first substrate W1, the second substrate W2, and the overlapped substrate T between the cassettes C1 to C4 mounted on the mounting plate 11 and the third processing block G3 of the processing station 3 to be discussed later.

[0031] For example, three processing blocks G1, G2, and G3 are provided in the processing station 3. The first processing block G1 is arranged on the back side of the processing station 3 ( Figure 1In addition, the second processing block G2 is arranged on the front side of the processing station 3 ( Figure 1 The third processing block G3 is arranged on the side of the feeding and unloading station 2 of the processing station 3 ( Figure 1 negative side of the X-axis).

[0032] The first processing block G1 is provided with a surface modification device 30 for modifying the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2. The surface modification device 30 modifies the bonding surfaces W1j and W2j in the following manner: SiO2 in the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2 are cut off; 2 The SiO2 is converted from a single bond to a single bond, which can be easily hydrophilized later.

[0033] Specifically, in the surface modification device 30, oxygen or nitrogen as a processing gas is excited to be plasma-formed and ionized in, for example, a reduced pressure atmosphere. Then, the oxygen ions or nitrogen ions are irradiated to the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2, thereby performing plasma treatment and modifying the bonding surfaces W1j and W2j.

[0034] In addition, a surface hydrophilization device 40 is disposed in the first processing block G1. The surface hydrophilization device 40 hydrophilizes the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2 using, for example, pure water, and cleans the bonding surfaces W1j and W2j. Specifically, the surface hydrophilization device 40 supplies pure water to the first substrate W1 or the second substrate W2 while rotating the first substrate W1 or the second substrate W2 held by the spin chuck. Thus, the pure water supplied to the first substrate W1 or the second substrate W2 spreads on the bonding surface W1j of the first substrate W1 or the bonding surface W2j of the second substrate W2, and the bonding surfaces W1j and W2j are hydrophilized.

[0035] Here, an example is shown in which the surface modification device 30 and the surface hydrophilization device 40 are arranged side by side. However, the surface hydrophilization device 40 may be stacked above or below the surface modification device 30 .

[0036] The second processing block G2 is provided with a bonding device 41. The bonding device 41 bonds the hydrophilized first substrate W1 and the second substrate W2 by intermolecular force. The specific structure of the bonding device 41 will be described later.

[0037] A conveying area 60 is formed in an area surrounded by the first processing block G1, the second processing block G2, and the third processing block G3. A conveying device 61 is arranged in the conveying area 60. The conveying device 61 has a conveying arm that is free to move in, for example, a vertical direction, a horizontal direction, and around a vertical axis. The conveying device 61 moves in the conveying area 60 and conveys the first substrate W1, the second substrate W2, and the superimposed substrate T to predetermined devices in the first processing block G1, the second processing block G2, and the third processing block G3 adjacent to the conveying area 60.

[0038] In addition, the joining system 1 is provided with a control device 70. The control device 70 controls the operation of the joining system 1. The control device 70 is, for example, a computer, and is provided with a control unit and a storage unit, which are not shown in the figure. The control unit includes a microcomputer and various circuits. The microcomputer has a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), an input and output port, etc. The CPU of the microcomputer realizes the control discussed later by reading and executing the program stored in the ROM. In addition, the storage unit is implemented by a semiconductor memory element such as a RAM, a flash memory, or a storage device such as a hard disk or an optical disk.

[0039] Alternatively, the program may be recorded on a computer-readable recording medium and installed from the recording medium into the storage unit of the control device 70. Examples of computer-readable recording media include a hard disk (HD), a floppy disk (FD), a compact disk (CD), a magneto-optical disk (MO), and a memory card.

[0040] <Structure of bonding device>

[0041] Next, refer to Figure 3 Next, the structure of the bonding device 41 will be described. Figure 3 It is a schematic diagram showing the structure of a bonding device 41 according to the embodiment.

[0042] like Figure 3 As shown, the bonding device 41 includes a housing 100, a first holding portion 101, and a second holding portion 102. In addition, the bonding device 41 includes an upper imaging portion 103 and a lower imaging portion 104. In addition, the bonding device 41 includes a lifting mechanism 105 (an example of a moving mechanism), a first horizontal moving portion 106, a second horizontal moving portion 107, and a rotating mechanism 108.

[0043] The housing 100 includes, for example, a base 100 a , a plurality of pillars 100 b erected on the base 100 a , and a beam 100 c spanned on the plurality of pillars 100 b .

[0044] The first holding part 101 is, for example, a vacuum suction cup, and is connected to a suction device such as a vacuum pump (not shown). The first substrate W1 located on the suction surface (the lower surface of the first holding part 101) is vacuumed using the suction force generated by the suction device, so that the first holding part 101 holds the first substrate W1 by suction from above.

[0045] The second holding part 102 is, for example, a vacuum suction cup, and is connected to a suction device such as a vacuum pump (not shown). The second substrate W2 located on the suction surface (the upper surface of the second holding part 102) is vacuumed using the suction force generated by the suction device, so that the second holding part 102 holds the second substrate W2 by suction from below.

[0046] The upper imaging unit 103 images the upper surface (joining surface W2j) of the second substrate W2 held by the second holding unit 102. The upper imaging unit 103 is attached to, for example, the beam 100c of the housing 100. As the upper imaging unit 103, for example, a CCD (Charge Coupled Device) camera or the like can be used.

[0047] The lower imaging unit 104 images the lower surface (joining surface W1j) of the first substrate W1 held by the first holding unit 101. The lower imaging unit 104 is attached to, for example, the side of the lifting mechanism 105. As the lower imaging unit 104, for example, a CCD camera or the like can be used.

[0048] The second holding part 102 is fixed to a lifting mechanism 105, and the lifting mechanism 105 is provided below the second holding part 102. The lifting mechanism 105 moves the second holding part 102 in the vertical direction (Z-axis direction).

[0049] The lifting mechanism 105 is fixed to the first horizontal moving part 106, and the first horizontal moving part 106 is provided below the lifting mechanism 105. The first horizontal moving part 106 moves the lifting mechanism 105 in the horizontal direction. Specifically, a pair of rails 161 extending in the Y-axis direction are provided below the first horizontal moving part 106, and the lifting mechanism 105 moves in the Y-axis direction by the first horizontal moving part 106 moving along the pair of rails 161.

[0050] The pair of rails 161 is fixed to the second horizontal moving part 107. The second horizontal moving part 107 moves the first horizontal moving part 106 in the horizontal direction by means of the pair of rails 161. Specifically, a pair of rails 171 extending in the X-axis direction is provided below the second horizontal moving part 107. The second horizontal moving part 107 moves along the pair of rails 171, so that the first horizontal moving part 106 moves in the X-axis direction by means of the pair of rails 161. The pair of rails 171 is fixed to the base 100a of the housing 100.

[0051] The first holding portion 101 is fixed to a rotating mechanism 108 provided above the first holding portion 101. The rotating mechanism 108 rotates the first holding portion 101 about a vertical axis (Z axis), thereby adjusting the position of the first substrate W1 held by the first holding portion 101 in the θ direction.

[0052] The rotating mechanism 108 includes a rotating shaft portion 181 fixed to the first holding portion 101 , a plurality of air bearings 182 for supporting the rotating shaft portion 181 in a non-contact state, and a base portion 183 for fixing the plurality of air bearings 182 .

[0053] The rotating shaft portion 181 includes, for example, a cylindrical portion 181a extending in the vertical direction, a first flange portion 181b provided at the bottom of the cylindrical portion 181a, and a second flange portion 181c provided at the top of the cylindrical portion 181a. The first holding portion 101 is fixed to the bottom surface of the first flange portion 181b.

[0054] The plurality of air bearings 182 are disposed on the outer periphery of the second flange portion 181c of the rotating shaft portion 181. In the embodiment, the rotating mechanism 108 includes four air bearings 182 (see the following description). Figure 4 ). The four air bearings 182 are evenly arranged in the circumferential direction of the second flange portion 181c, that is, arranged at intervals of 90 degrees. Therefore, two of the four air bearings 182 are arranged opposite to each other with the center of the second flange portion 181c (that is, the center of the rotating shaft portion 181) therebetween, and the remaining two are also arranged opposite to each other with the center of the second flange portion 181c therebetween.

[0055] In addition, here, the rotating mechanism 108 may include one air bearing formed in an annular shape instead of the plurality of air bearings 182 .

[0056] The plurality of air bearings 182 eject compressed air vertically upward from the bottom of the second flange 181c toward the lower surface of the second flange 181c (an example of a shaft support surface), thereby floating the rotating shaft 181. In addition, the plurality of air bearings 182 eject compressed air from the outside of the second flange 181c toward the peripheral surface of the second flange 181c (an example of a shaft support surface). Specifically, each air bearing 182 ejects compressed air along the radial direction ( Figure 4 In other words, each air bearing 182 ejects compressed air toward another air bearing 182 that is disposed opposite to the center of the second flange portion 181c.

[0057] The compressed air ejected in the horizontal direction from the plurality of air bearings 182 pushes the rotating shaft portion 181 in the horizontal direction. The position where the force pushing the rotating shaft portion 181 in the horizontal direction is balanced becomes the rotation center R0 of the rotating shaft portion 181 (see Figure 4 ).

[0058] The base portion 183 is, for example, a plate-shaped member, and is fixed to the beam portion 100 c of the housing 100 . The plurality of air bearings 182 described above are fixed to the upper surface of the base portion 183 .

[0059] In addition, a through hole 183a is formed in the base portion 183, which passes through the base portion 183 in the vertical direction. The through hole 183a has a larger diameter than the cylindrical portion 181a of the rotating shaft portion 181. The cylindrical portion 181a of the rotating shaft portion 181 passes through the through hole 183a. The first flange portion 181b of the rotating shaft portion 181 is arranged at a position lower than the base portion 183, and the second flange portion 181c is arranged at a position higher than the base portion 183. In this way, the rotating shaft portion 181 and the base portion 183 are not in contact.

[0060] As described above, the rotating mechanism 108 of the embodiment supports the rotating shaft portion 181 in a non-contact state using a plurality of air bearings 182. Thus, compared with the case where the rotating shaft portion 181 is supported using a contact-type bearing member such as a ball bearing, the rotating mechanism 108 of the embodiment can rotate the rotating shaft portion 181 with an extremely small force. Therefore, the rotating mechanism 108 of the embodiment can obtain high responsiveness even when the rotating shaft portion 181 is rotated at a nanometer level, for example.

[0061] However, the method of supporting the rotating shaft portion 181 in a non-contact state may cause problems in the static stability of the rotating shaft portion 181. That is, as described above, the rotation center R0 of the rotating shaft portion 181 is formed by the balance of the force of the compressed air ejected from the plurality of air bearings 182 in the horizontal direction. However, the position of this balance may deviate slightly due to a small external force such as vibration. Therefore, the method of supporting the rotating shaft portion 181 in a non-contact state makes it difficult to maintain the rotation center R0 of the rotating shaft portion 181 with good accuracy. Such a static stability problem is particularly significant when the rotating shaft portion 181 is rotated at the nm level.

[0062] The deviation of the rotation center R0 of the rotation shaft portion 181 leads to a decrease in the bonding accuracy between the first substrate W1 and the second substrate W2. Therefore, it is preferable to minimize the deviation of the rotation center R0 of the rotation shaft portion 181.

[0063] Therefore, in the rotating mechanism 108 of the embodiment, a damping mechanism is provided to apply resistance to the driving of the rotating shaft portion 181, so that the static stability of the rotating shaft portion 181 is improved. Thus, by improving the static stability of the rotating shaft portion 181, the rotating mechanism 108 of the embodiment can improve the positioning accuracy of the first substrate W1 in the rotation direction. The specific structure of the rotating mechanism 108 is described below.

[0064] In addition, the bonding device 41 is omitted in the figure, but Figure 4 The front section of the first holding section 101, the second holding section 102, etc. shown in the figure is provided with a conveying section, a position adjustment mechanism, a flipping mechanism, etc. The conveying section is used to temporarily place the first substrate W1, the second substrate W2, and the superimposed substrate T. The position adjustment mechanism is used to adjust the horizontal direction of the first substrate W1 and the second substrate W2. The flipping mechanism is used to flip the front and back of the first substrate W1.

[0065] <Structure of the rotating mechanism>

[0066] Next, refer to Figure 4 Next, the structure of the rotating mechanism 108 will be described. Figure 4 It is a top view of the rotation mechanism 108 according to the embodiment.

[0067] like Figure 4 As shown, the rotating mechanism 108 further includes a driving unit 184 , a position sensor 185 , and a damping mechanism 186 .

[0068] The driving part 184 is, for example, a direct-acting actuator, and includes a slider 184a, a screw 184b, and a driving source 184c. The slider 184a is fixed to the rotating shaft part 181 and the screw 184b. The screw 184b extends in the horizontal direction (here, the X-axis direction). The screw 184b is fixed to the base part 183. The driving source 184c is, for example, a motor, fixed to the base part 183, and is used to rotate the screw 184b.

[0069] The driving unit 184 rotates the screw 184b using the driving source 184c, thereby moving the slider 184a fixed to the screw 184b along the X-axis direction. Thus, the driving unit 184 can rotate the rotating shaft 181 fixed to the slider 184a. The driving unit 184 rotates the rotating shaft 181 within a range of, for example, about ±1 degree.

[0070] The position sensor 185 is, for example, a linear scale. The position sensor 185 is fixed to the base portion 183 and is used to detect the horizontal position of the rotating shaft portion 181. Although not shown in the figure, a plurality of position sensors 185 are provided on the outer periphery of the second flange portion 181c of the rotating shaft portion 181. For example, the rotating mechanism 108 Figure 4In addition to the positions shown, position sensors 185 are also provided at positions where the drive unit 184 is provided and where the damping mechanism 186 is provided. The joining device 41 can measure the rotation amount (rotation angle) and eccentricity of the rotating shaft 181 using these multiple position sensors 185 .

[0071] The damping mechanism 186 generates a damping force against the relative movement between the rotating shaft portion 181 and the base portion 183 .

[0072] <Structure of damping mechanism>

[0073] Next, refer to Figure 5 Next, the structure of the damping mechanism 186 will be described. Figure 5 It is a top view of the damping mechanism 186 according to the embodiment.

[0074] like Figure 5 As shown, the damping mechanism 186 of the embodiment includes a rail 201 and a slider 202 capable of linear movement relative to the rail 201. The damping mechanism 186 of the embodiment is used to generate a damping force against the relative movement between the rotating shaft portion 181 and the base portion 183 by using the resistance generated between the rail 201 and the slider 202.

[0075] The relative movement between the rotating shaft portion 181 and the base portion 183 refers to the displacement of the rotating shaft portion 181 (detected by the plurality of position sensors 185) with respect to the base portion 183. The relative movement between the rotating shaft portion 181 and the base portion 183 includes, for example, a rotational movement of the rotating shaft portion 181 around the rotation center R0 and also includes a horizontal movement of the rotating shaft portion 181.

[0076] The horizontal movement of the rotating shaft portion 181 refers to the deviation (eccentricity) of the rotation center R0 in the horizontal direction. The horizontal movement of the rotating shaft portion 181 may be caused by disturbances such as vibration. If the base portion 183 vibrates due to the disturbance, the multiple air bearings 182 fixed to the base portion 183 vibrate. As a result, the position of the force balance of the compressed air ejected from the multiple air bearings 182 changes, and the rotating shaft portion 181 moves horizontally. Specifically, the rotating shaft portion 181 (in other words, the rotation center R0) vibrates within the nm range.

[0077] The rail 201 is fixed to the base 183 via a first mounting member 203. The first mounting member 203 has a plurality of (two in this case) pillars 231 fixed to the base 183, and supports the rail 201 at a position higher than the rotation shaft 181. The rail 201 is linear and extends in the horizontal direction (in this case, the X-axis direction).

[0078] The slider 202 is connected to the rail 201 via the bearing 221 and moves along the rail 201. The slider 202 is connected to the rotating shaft 181 via the first rotating member 204 and the second rotating member 205 described later and moves on the rail 201 following the movement of the rotating shaft 181.

[0079] The damper mechanism 186 further includes a first rotating member 204 , a second rotating member 205 , and a biasing member 206 .

[0080] The first rotating member 204 is fixed to the second mounting member 207, and the second mounting member 207 is fixed to the rotating shaft portion 181. The second rotating member 205 is fixed to the slider 202, and moves on the rail 201 together with the slider 202. Therefore, the slider 202 moves on the rail 201 following the movement of the rotating shaft portion 181. In addition, the above-mentioned position sensor 185 (linear scale) may be provided on the second mounting member 207.

[0081] The first rotating member 204 is, for example, a cam follower, and includes a first rotating shaft 241 and a first rotating body 242. The first rotating shaft 241 extends in the vertical direction. The first rotating shaft 241 has its base end fixed to the second mounting member 207, and supports the first rotating body 242 at its tip end so that it can rotate. The first rotating body 242 is, for example, a cylindrical roller, and rotates around a rotation axis R1 extending in the vertical direction.

[0082] The second rotating member 205 is, for example, a cam follower, and includes a second rotating shaft 251 and a second rotating body 252. The second rotating shaft 251 extends in the horizontal direction. The second rotating shaft 251 has a base end fixed to the slider 202, and supports the second rotating body 252 at the tip end so that it can rotate. The second rotating body 252 is, for example, a cylindrical roller, and rotates around a rotation axis R2 extending in the horizontal direction. The second rotating member 205 is arranged on the positive direction side of the X axis of the first rotating member 204.

[0083] exist Figure 5 1 shows the rotating mechanism 108 in an initial state in which the driving force of the driving unit 184 does not act on the rotating shaft portion 181. In this initial state, the first rotating body 242 of the first rotating member 204 is in contact with the second rotating body 252 of the second rotating member 205. In addition, the contact state between the first rotating body 242 and the second rotating body 252 is maintained by the urging member 206 discussed later.

[0084] In the initial state, the rotation axis R2 of the second rotation member 205 is aligned with the rotation center R0 of the connecting rotation shaft portion 181 (see Figure 4) and the straight line L1 of the rotation axis R1 of the first rotating member 204 are inclined. The angle between the rotation axis R2 and the straight line L1 is set to be larger than the rotation range (for example, ±1 degree) of the rotating shaft portion 181. For example, the angle between the rotation axis R2 and the straight line L1 is larger than 1 degree and smaller than 10 degrees.

[0085] The urging member 206 urges the first rotating body 242 of the first rotating member 204 and the second rotating body 252 of the second rotating member 205 in a direction of contacting each other. The urging member 206 is, for example, a tension spring, and is arranged parallel to the rail 201. Specifically, an imaginary spring axis L2 of the urging member 206 extends in the X-axis direction. One end of the urging member 206 is mounted on a first support 261, and the first support 261 is fixed to the slider 202. In addition, the other end of the urging member 206 is mounted on a second support 262, and the second support 262 is fixed to the second mounting member 207.

[0086] Furthermore, in the initial state, the above-mentioned straight line L1 extends in the Y-axis direction and is orthogonal to the spring axis L2 of the urging member 206 .

[0087] The urging member 206 urges the slider 202 in the negative direction of the X axis. As a result, the second rotating member 205 fixed to the slider 202 is urged in the negative direction of the X axis, that is, in the direction of contact with the first rotating member 204. Thus, the first rotating body 242 of the first rotating member 204 and the second rotating body 252 of the second rotating member 205 are maintained in a state of contact.

[0088] If microvibration is applied to the rotating shaft portion 181 due to, for example, disturbance, the vibration of the rotating shaft portion 181 is transmitted to the rail 201 via the slider 202. As described above, there is sliding resistance between the rail 201 and the slider 202, specifically, rolling resistance of the bearing 221. This resistance becomes a damping force for the relative movement between the rotating shaft portion 181 and the base portion 183, and can suppress the vibration of the rotating shaft portion 181. In other words, the static stability of the rotating shaft portion 181 can be improved.

[0089] Thus, the damping mechanism 186 of the embodiment can improve the static stability of the rotation center R0 by generating a damping force for the relative movement between the rotation shaft portion 181 and the base portion 183, even when the rotation shaft portion 181 is supported in a non-contact state. Therefore, according to the bonding device 41 of the embodiment, the positioning accuracy of the first substrate W1 can be improved, and further, the bonding accuracy between the first substrate W1 and the second substrate W2 can be improved.

[0090] The bearing 221 is specifically a ball bearing, and may also be a roller bearing. The roller bearing is a surface contact type, and therefore has a higher vibration damping performance than a point contact type bearing such as a ball bearing. Therefore, by using a roller bearing, the static stability can be further improved for the relative movement between the rotating shaft portion 181 and the base portion 183. In addition, however, the bearing of the sliding member 202 is not limited to the bearing 221, and a ball bearing may also be used.

[0091] In addition, the damping mechanism 186 of the embodiment has a link mechanism composed of the first rotating member 204 and the second rotating member 205. Thus, the damping mechanism 186 of the embodiment can absorb the error of the rotational motion of the rotating shaft portion 181 and the linear motion of the slider 202 by utilizing the rotational motion of the first rotating body 242 and the second rotating body 252, and mechanically connect the base portion 183 and the rotating shaft portion 181.

[0092] In addition, the first rotating member 204 and the second rotating member 205 are maintained in a state of contact with each other due to the force of the urging member 206. Most of the force of the urging member 206 serves as a force for pressing the second rotating member 205 against the first rotating member 204. However, as described above, the rotation axis R2 of the second rotating member 205 is relatively close to the rotation center R0 (refer to FIG. 1 ) of the connecting rotating shaft portion 181. Figure 4 ) and the straight line L1 of the rotation axis R1 of the first rotation member 204 are inclined. In other words, the rotation axis R2 of the second rotation member 205 and the spring axis L2 of the force applying member 206 are inclined relative to a right angle. Therefore, a part of the force applied by the force applying member 206 becomes a force that causes the rotation shaft portion 181 to rotate in a direction that eliminates the inclination of the rotation axis R2, that is, in the counterclockwise direction. This force functions as a preload on the rotation shaft portion 181.

[0093] By providing preload to the rotating shaft 181 in this way, it is possible to increase the rigidity of the linear system composed of the rail 201 and the slider 202. By increasing the rigidity of the linear system, the damper mechanism 186 of the embodiment becomes more robust against disturbances such as vibration, and more precise positioning can be performed.

[0094] In addition, the damping mechanism 186 of the embodiment hardly changes the deformation amount (elongation amount) of the force applying member 206 regardless of the change of the rotation position within the rotation driving range of the rotating shaft portion 181. Therefore, it is possible to apply a substantially constant preload at any position of the rotation positioning. Therefore, according to the damping mechanism 186 of the embodiment, it is possible to avoid the change of the positioning accuracy caused by the change of the applied preload, and to improve the static stability.

[0095] exist Figure 5In the initial state shown, when the rotating mechanism 108 is viewed from the vertical direction, the rotation axis R1 of the first rotating member 204 is arranged at a position outside the rotating shaft portion 181 relative to the imaginary spring axis L2 of the force applying member 206. By setting this arrangement, compared with, for example, a case where the spring axis L2 is arranged outside the rotation axis R1, it is possible to suppress the application of an extra force other than the force in the rotation direction, such as a force to move the rotation center R0, to the rotating shaft portion 181. Therefore, according to the damping mechanism 186 of the embodiment, the positioning accuracy of the first substrate W1 can be further improved.

[0096] The slider 202 of the damping mechanism 186 is arranged on the opposite side of the slider 184a of the driving unit 184 across the center of the rotating shaft 181 (see Figure 4 and Figure 5 ). By arranging the damping mechanism 186 at this position, the damping force can be effectively generated.

[0097] <Specific operation of the joint system>

[0098] Next, refer to Figure 6 Next, the specific operation of the joint system 1 will be described. Figure 6 This is a flowchart showing the procedure of processing executed by the joining system 1 according to the embodiment. Figure 6 The various processes shown are executed based on the control of the control device 70 .

[0099] First, a cassette C1 containing a plurality of first substrates W1, a cassette C2 containing a plurality of second substrates W2, and an empty cassette C3 are placed on a predetermined placement plate 11 of the carry-in / carry-out station 2. Then, the first substrate W1 in the cassette C1 is taken out by the conveyor device 22 and conveyed to the transfer device arranged in the third processing block G3.

[0100] Next, the first substrate W1 is transported to the surface modification device 30 of the first processing block G1 by the transport device 61. In the surface modification device 30, oxygen gas as a processing gas is excited to be plasma-formed and ionized under a predetermined reduced pressure atmosphere. The oxygen ions are irradiated to the bonding surface of the first substrate W1 to perform plasma treatment on the bonding surface. Thus, the bonding surface of the first substrate W1 is modified (step S101).

[0101] Next, the first substrate W1 is transported to the surface hydrophilizing device 40 of the first processing block G1 by the transport device 61. In the surface hydrophilizing device 40, pure water is supplied to the first substrate W1 while the first substrate W1 held by the spin chuck is rotated. Thus, the bonding surface of the first substrate W1 is hydrophilized. In addition, the bonding surface of the first substrate W1 is cleaned by the pure water (step S102).

[0102] Next, the first substrate W1 is transported to the bonding device 41 of the second processing block G2 by the transport device 61. The first substrate W1 input to the bonding device 41 is transported to the position adjustment mechanism by the conveyor, and the horizontal direction is adjusted by the position adjustment mechanism (step S103).

[0103] After that, the first substrate W1 is handed over from the position adjustment mechanism to the flipping mechanism, and the front and back sides of the first substrate W1 are flipped by the flipping mechanism (step S104). Specifically, the bonding surface W1j of the first substrate W1 is directed downward. Next, the first substrate W1 is handed over from the flipping mechanism to the first holding portion 101, and the first substrate W1 is held by the first holding portion 101 by suction (step S105).

[0104] Then, the position of the first substrate W1 in the rotation direction is adjusted using the rotation mechanism 108 (step S106). Then, the floating of the rotation shaft portion 181 caused by the plurality of air bearings 182 is released, and the rotation shaft portion 181 is adsorbed to the plurality of air bearings 182 using an exhaust device (not shown). Thus, the rotation shaft portion 181 is fixed in the state after the position in the rotation direction is adjusted.

[0105] The processing of the second substrate W2 is performed overlapping with the processing of steps S101 to S106 performed on the first substrate W1. First, the second substrate W2 in the cassette C2 is taken out by the transport device 22 and transported to the transfer device arranged in the third processing block G3.

[0106] Next, the second substrate W2 is transported by the transport device 61 to the surface modification device 30, and the bonding surface W2j of the second substrate W2 is modified (step S107). After that, the second substrate W2 is transported by the transport device 61 to the surface hydrophilization device 40, and the bonding surface W2j of the second substrate W2 is hydrophilized, and the bonding surface is cleaned (step S108).

[0107] Thereafter, the second substrate W2 is transported to the bonding device 41 by the transport device 61. The second substrate W2 input to the bonding device 41 is transported to the position adjustment mechanism by the conveyor. Then, the horizontal orientation of the second substrate W2 is adjusted by the position adjustment mechanism (step S109).

[0108] Thereafter, the second substrate W2 is conveyed to the second holding unit 102 and is suction-held by the second holding unit 102 with the notch facing a predetermined direction (step S110 ).

[0109] Next, the positions of the first substrate W1 held by the first holding portion 101 and the second substrate W2 held by the second holding portion 102 are adjusted in the horizontal direction (step S111). After that, the second substrate W2 is raised using the lifting mechanism 105, and the first substrate W1 and the second substrate W2 are joined (step S112). Alternatively, in step S112, after the second substrate W2 is raised, a pressing member (not shown) provided on the first holding portion 101 is used to press the center of the first substrate W1 from top to bottom so that the center of the first substrate W1 contacts the center of the second substrate W2.

[0110] As described above, the substrate positioning device of the embodiment (as an example, the bonding device 41) includes a holding portion (as an example, the first holding portion 101) and a rotating mechanism (as an example, the rotating mechanism 108). The holding portion is used to hold the substrate (as an example, the first substrate W1). The rotating mechanism is used to rotate the holding portion. In addition, the rotating mechanism includes a rotating shaft portion (as an example, the rotating shaft portion 181), a bearing portion (as an example, the air bearing 182), a base portion (as an example, the base portion 183), a driving portion (as an example, the driving portion 184), and a damping mechanism (as an example, the damping mechanism 186). The rotating shaft portion is fixed to the holding portion. The bearing portion is used to support the rotating shaft portion in a non-contact state. The base portion is used to fix the bearing portion. The driving portion is used to rotate the rotating shaft portion. The damping mechanism includes a rail (as an example, rail 201) connected to the base portion and a slider (as an example, slider 202) connected to the rotating shaft portion, and the damping mechanism is used to generate a damping force for the relative movement between the rotating shaft portion and the base portion by using the resistance generated between the rail and the slider. Therefore, according to the substrate positioning device of the embodiment, the positioning accuracy of the substrate can be improved.

[0111] The damping mechanism includes a first rotating member (for example, the first rotating member 204), a second rotating member (for example, the second rotating member 205), and a biasing member (for example, the biasing member 206). The first rotating member is fixed to the rotating shaft. The second rotating member is fixed to the sliding member. The biasing member is used to bias the first rotating member and the second rotating member in a direction of contacting each other.

[0112] Thus, the base portion and the rotating shaft portion are mechanically connected while the rotational motion of the first rotating member and the second rotating member can absorb the error between the rotational motion of the rotating shaft portion and the linear motion of the slider.

[0113] The first rotating member can rotate about a vertical axis (as an example, the rotation axis R1), and the second rotating member can rotate about a horizontal axis (as an example, the rotation axis R2). In addition, in an initial state where the driving force of the driving unit does not act on the rotating shaft unit, when the rotating mechanism is viewed from the vertical direction, the horizontal axis of the second rotating member is inclined relative to a straight line (as an example, the straight line L1) connecting the rotation center of the rotating shaft unit and the vertical axis of the first rotating member.

[0114] Thus, a preload can be applied to the rotating shaft portion. Therefore, the rigidity of the linear system composed of the rail and the slider can be improved. By improving the rigidity of the linear system, it becomes more resistant to disturbances such as vibration, and more precise positioning can be performed.

[0115] The force-applying member is a spring. In addition, in the initial state where the driving force of the driving unit does not act on the rotating shaft, when the rotating mechanism is viewed from the vertical direction, the vertical axis of the first rotating member is arranged at a position outside the rotating shaft than the imaginary spring axis of the force-applying member (for example, the spring axis L2). By setting it as this configuration, the positioning accuracy of the substrate can be further improved.

[0116] The damping mechanism is arranged on the side opposite to the driving unit across the center of the rotating shaft unit. By arranging the damping mechanism at this position, the damping force can be effectively generated.

[0117] It should be considered that the embodiments disclosed this time are illustrative in all points and are not restrictive. In fact, the above-mentioned embodiments can be embodied in various forms. In addition, the above-mentioned embodiments can also be omitted, replaced, and changed in various forms without departing from the attached claims and their gist.

Claims

1. A substrate positioning device, comprising: a holding portion that holds the substrate; and a rotating mechanism that rotates the holding portion, The rotating mechanism comprises: a rotating shaft portion, which is fixed to the holding portion; a bearing portion that supports the rotating shaft portion in a non-contact state; a base portion to fix the bearing portion; a driving portion that rotates the rotating shaft portion; and A damping mechanism includes a rail connected to the base portion and a sliding member connected to the rotating shaft portion, and the damping mechanism generates a damping force against the relative movement between the rotating shaft portion and the base portion by using a resistance generated between the rail and the sliding member.

2. The substrate positioning device according to claim 1, wherein: The bearing portion is an air bearing, and compressed air is ejected toward the shaft support surface of the rotating shaft portion to float the rotating shaft portion, so that the bearing portion supports the rotating shaft portion in a non-contact state.

3. The substrate positioning device according to claim 1 or 2, wherein: The track is straight.

4. The substrate positioning device according to claim 1 or 2, wherein: The damping mechanism comprises: a first rotating member fixed to the rotating shaft portion; a second rotating member fixed to the sliding member; and The urging member urges the first rotating member and the second rotating member in a direction in which the first rotating member and the second rotating member come into contact with each other.

5. The substrate positioning device according to claim 4, wherein: The first rotating member is rotatable about a vertical axis. The second rotating member is rotatable about a horizontal axis. In an initial state where the driving force of the driving unit does not act on the rotating shaft unit, when the rotating mechanism is viewed from a vertical direction, the horizontal axis of the second rotating member is inclined relative to a straight line connecting the rotation center of the rotating shaft unit and the vertical axis of the first rotating member.

6. The substrate positioning device according to claim 5, wherein: The force applying member is a spring, In an initial state where the driving force of the driving portion does not act on the rotating shaft portion, when the rotating mechanism is viewed in the vertical direction, the vertical axis of the first rotating member is arranged outside the rotating shaft portion rather than a virtual spring axis of the urging member.

7. The substrate positioning device according to claim 1 or 2, wherein: The damper mechanism is arranged on the side opposite to the driving portion across the center of the rotating shaft portion.

8. A substrate positioning method, comprising the following steps: a step of holding the substrate using a holding portion that holds the substrate; and A process for positioning the substrate in a rotation direction using a rotating mechanism, wherein the rotating mechanism rotates the holding portion and comprises: a rotating shaft portion, which is fixed to the holding portion; a bearing portion, which supports the rotating shaft portion in a non-contact state; a base portion, which fixes the bearing portion; a driving portion, which rotates the rotating shaft portion; and a damping mechanism, which includes a rail connected to the base portion and a sliding member connected to the rotating shaft portion, and the damping mechanism utilizes the resistance generated between the rail and the sliding member to generate a damping force for the relative movement between the rotating shaft portion and the base portion.

9. A bonding device comprising: a first holding portion that sucks and holds the first substrate from above; a second holding portion disposed below the first holding portion and sucking and holding the second substrate from below; a moving mechanism that moves one of the first holding portion and the second holding portion closer to the other; and a rotating mechanism that rotates the first holding portion, The rotating mechanism comprises: A rotating shaft portion, which is fixed to the first holding portion; a bearing portion that supports the rotating shaft portion in a non-contact state; a base portion to fix the bearing portion; a driving portion that rotates the rotating shaft portion; and A damping mechanism includes a rail connected to the base portion and a sliding member connected to the rotating shaft portion, and the damping mechanism generates a damping force against the relative movement between the rotating shaft portion and the base portion by using a resistance generated between the rail and the sliding member.

Images