Crimping device and crimping method

Abstract

The present invention provides a crimping device and a crimping method, which can reduce the operation time spent on changing the crimping conditions of components while suppressing enlargement. The crimping device (100) comprises: a plurality of formal crimping heads (120), each used to crimp a component (5) to a substrate (3); a head holding portion (110), each holding the formal crimping heads (120) to be able to slide freely along a first direction; a working cylinder (151), which enables a rod (152) to move forward and backward along the first direction; and a position changing portion (130), which has a mechanism for changing the relative position of the head holding portion (110) and the rod (152) in a second direction intersecting the first direction, and selectively switching the formal crimping head (120) pressed by the rod (152) that is entered along the first direction among the plurality of formal crimping heads (120) through the change of the relative position.

Description

Technical Field

[0001] The present disclosure relates to a crimping device and the like for crimping a component to a substrate. Background Art

[0002] Conventionally, there has been provided a compression bonding device for, for example, compression bonding an electronic component (hereinafter simply referred to as a “component”) to a substrate such as a liquid crystal panel substrate.

[0003] The crimping device includes a crimping head, a head body, and a tool mounted on the front end of the head body. The crimping device heat-compresses the component temporarily crimped to the substrate by pushing the heated tool toward the substrate side.

[0004] Furthermore, the inner bonding apparatus of Patent Document 1 includes two or more bonding tools for thermocompression bonding the electrodes of the semiconductor element and the inner leads of the carrier tape.

[0005] Prior Art Literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 5-109815

[0008] The crimping of components requires crimping conditions suitable for the components. The crimping conditions suitable for the components are, for example, the shape or temperature of the tool.

[0009] Specifically, when there are a first component and a second component of different types, and the first component is crimped to the substrate, a tool having a shape suitable for the first component is mounted on the head body for crimping the first component. Furthermore, when the second component is crimped to the substrate, a tool having a shape suitable for the second component is mounted on the head body for crimping the second component. In this way, when the type of component to be crimped to the substrate is switched, the replacement and adjustment of the tool in the crimping head is performed as a change in the crimping conditions.

[0010] Therefore, when a plurality of components having different crimping conditions are crimped, time is required to change the crimping conditions of one crimping head to crimping conditions suitable for the component.

[0011] Therefore, for example, if the crimping device includes two or more joining tools as the crimping heads, as in the internal joining device of Patent Document 1, the operation time required for changing the crimping conditions can be reduced. That is, the crimping device is provided with a crimping head for crimping a component requiring a first crimping condition and a crimping head for crimping a component requiring a second crimping condition, thereby reducing the operation time required for changing the crimping conditions.

[0012] However, if a plurality of crimping heads are simply provided in a crimping device, a number of mechanisms for driving the crimping heads corresponding to the number of the crimping heads will be required, and the crimping device may become larger. Summary of the invention

[0013] Problems to be solved by the invention

[0014] Therefore, the present disclosure provides a crimping device or the like that can reduce the time required for changing crimping conditions of components while suppressing an increase in size.

[0015] Means for solving problems

[0016] One embodiment of the present invention involves a crimping device comprising: a plurality of crimping heads, each used to crimp a component to a substrate; a head holding portion, which holds the plurality of crimping heads so as to be able to slide freely along a first direction; a working cylinder, which enables a rod to advance and retreat along the first direction; and a position changing portion, which has a mechanism for changing the relative position of the head holding portion and the rod in a second direction intersecting the first direction, and selectively switching the crimping head among the plurality of crimping heads to be pressed by the rod entered along the first direction by changing the relative position.

[0017] In addition, these general or specific methods can be implemented by a system, method, integrated circuit, computer program or a computer-readable CD-ROM or other recording medium, or by any combination of a system, method, integrated circuit, computer program and recording medium. In addition, the recording medium can also be a non-volatile recording medium.

[0018] Effects of the Invention

[0019] The crimping device of the present disclosure can reduce the work time required for changing the crimping conditions of components while suppressing enlargement.

[0020] Further advantages and effects in one embodiment of the present disclosure become clear from the specification and drawings. Although the corresponding advantages and / or effects are provided by the features described in several embodiments and the specification and drawings, it is not necessary to provide all of them in order to obtain one or more of the same features. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a diagram showing a schematic structure of a component mounting line in the embodiment.

[0022] Figure 2 It is a top view of the component mounting line in the embodiment.

[0023] Figure 3This is a diagram showing a computer included in a component mounting line according to the embodiment and each component controlled by the computer.

[0024] Figure 4 It is a block diagram showing the functional structure of the crimping device in the embodiment.

[0025] Figure 5 This is an external perspective view showing an example of a main crimping section included in the crimping device according to the embodiment.

[0026] Figure 6 It is a diagram showing an example of the operation of the crimping device in the embodiment.

[0027] Figure 7 This is a diagram showing an example of the positional relationship between the components and parts included in the crimping device in the embodiment.

[0028] Figure 8 It is a flowchart of the crimping method in the embodiment.

[0029] Fig. 9 This is a diagram showing an example of four brackets included in a crimping device according to a modified example of the embodiment.

[0030] Fig.10 This is a diagram showing an example of the positional relationship between components and parts included in a crimping device according to a modified example of the embodiment.

[0031] Fig.11 This is a diagram showing an example of a partial cross section of a crimping device according to a modified example of the embodiment.

[0032] Explanation of symbols

[0033] 1. Component installation line;

[0034] 1a, 1b, 1c abutment;

[0035] 2. Computer;

[0036] 2a Control unit;

[0037] 2b storage unit;

[0038] 3 substrate;

[0039] 4. Electrode section;

[0040] 5 parts;

[0041] 10 Substrate loading department;

[0042] 11, 23, 49, 51 workbenches;

[0043] 20 pasting part;

[0044] 21, 31, 41 substrate moving mechanism;

[0045] 22 Pasting mechanism;

[0046] 30 temporary crimping section;

[0047] 32 Component carrying mechanism;

[0048] 33. Parts supply department;

[0049] 34 Temporary crimping joint;

[0050] 35 parts moving part;

[0051] 40 Formal crimping department;

[0052] 41 substrate moving mechanism;

[0053] 42 crimping mechanism;

[0054] 49 workbench;

[0055] 50 Board unloading department;

[0056] 100 crimping device;

[0057] 110 head holding part;

[0058] 111 groove;

[0059] 112 Spring;

[0060] 120 Formal crimping joint;

[0061] 120a Formal crimping head (for IC);

[0062] 120b Formal crimping head (for TCP);

[0063] 121 head body;

[0064] 122a Tools (for IC);

[0065] 122b tool (for TCP);

[0066] 123 convex part;

[0067] 130 Position Change Department;

[0068] 141 crimping support portion;

[0069] 150 head drive mechanism;

[0070] 151 working cylinder;

[0071] 152 strokes;

[0072] 153 front end;

[0073] 160 brackets;

[0074] 161 fixed part;

[0075] 162 snap-fit ​​part;

[0076] 163 recess;

[0077] u1 crimping unit;

[0078] u2 Crimp unit. DETAILED DESCRIPTION

[0079] One embodiment of the present disclosure relates to a crimping device comprising: a plurality of crimping heads, each used to crimp a component to a substrate; a head holding portion, each holding the plurality of crimping heads to be able to slide freely along a first direction; a cylinder, which moves a rod forward and backward along the first direction; and a position changing portion, which has a mechanism for changing the relative position of the head holding portion and the rod in a second direction intersecting the first direction, and selectively switching the crimping head pressed by the rod entered along the first direction among the plurality of crimping heads by changing the relative position. For example, the first direction may be a vertical direction, and the cylinder may press any one of the plurality of crimping heads in the vertical direction by moving the rod. In addition, the second direction may be a horizontal direction, and the position changing portion may change the relative position by moving the head holding portion in the horizontal direction.

[0080] Thus, the crimping device is provided with a plurality of crimping heads, and thus these crimping heads can be used according to the crimping conditions. Therefore, even when the crimping conditions of the plurality of components to be crimped are different and the crimping conditions thereof need to be switched, the component requiring the crimping condition can be crimped to the substrate in a short time by using a crimping head that satisfies the crimping condition. In other words, the operation time of changing the crimping condition that can be achieved by one crimping head to the crimping condition suitable for the component can be saved.

[0081] Furthermore, by changing the relative position of the head holding portion and the rod in the second direction, the crimping head pressed by the rod for crimping the components can be selectively switched, thereby suppressing the size of the crimping device. That is, the necessity of providing a cylinder and a rod for each of the plurality of crimping heads can be eliminated.

[0082] Therefore, it is possible to reduce the time required for changing the crimping conditions of the components while suppressing an increase in the size of the crimping device.

[0083] Furthermore, each of the plurality of crimping heads may include a tool that contacts a member crimped to the substrate, and the form of the tool of each of the plurality of crimping heads may be different from each other.

[0084] Thus, even when the type of component to be crimped to the substrate is switched, if a crimping head having a tool suitable for the shape of the component is used, the component can be crimped to the substrate without replacing or adjusting the tool of the crimping head. As a result, the operation time spent on switching the type of component can be reduced.

[0085] In addition, the crimping device may include a plurality of crimping units, each of which includes: the plurality of crimping heads held by the head holding portion; and a head driving mechanism including the working cylinder and the rod, and the position changing portion changes the relative positions of the plurality of crimping heads and the rod contained in each of the plurality of crimping units by changing the relative positions. For example, the position changing portion may change the relative positions of the plurality of crimping heads and the rod contained in each of the plurality of crimping units by moving the head holding portion in the second direction.

[0086] This makes it possible to effectively reduce the work time required for, for example, switching between types of components in each of the plurality of crimping units.

[0087] Furthermore, the plurality of crimping heads included in each of the plurality of crimping units may be arranged at equal intervals along the second direction, and intervals at which the plurality of crimping heads are arranged to be spaced apart from each other may be equal in each of the plurality of crimping units.

[0088] Thus, the intervals at which the plurality of crimping heads are spaced apart from each other are equal in the plurality of crimping units, and therefore the crimping heads to be pressed in the first direction by the plurality of crimping units can be switched simultaneously and appropriately.

[0089] In addition, the crimping device may also include a bracket fixed to each of the plurality of crimping heads, and the bracket is used to engage with the rod pressing the crimping head. For example, the bracket may include: a substantially plate-shaped engaging portion, which is arranged separately from the end of the crimping head fixed to the bracket in the first direction, the end being the end pressed by the rod, a recess is formed in the engaging portion into which the middle portion of the rod is inserted along the second direction due to the change in the relative position, the front end of the rod is formed to be wider than the middle portion, the front end presses the end of the crimping head by the rod inserted into the middle portion in the recess, and when the retention of the crimping head by the head retaining portion is released, the front end of the rod inserted into the middle portion in the recess engages with the peripheral portion of the recess in the engaging portion in the first direction.

[0090] Thus, the bracket and the rod are engaged with each other, thereby preventing the crimping head fixed to the bracket from falling.

[0091] Furthermore, the plurality of crimping heads may include a first crimping head and a second crimping head adjacent to each other, and the recessed portion of the bracket fixed to the first crimping head and the recessed portion of the bracket fixed to the second crimping head may face each other.

[0092] Thus, no matter which direction the head holding part moves along the second direction, the middle part of the rod can be inserted into the recess of the bracket of any one of the first crimping head and the second crimping head. As a result, the bracket can be made to engage with the rod, and the crimping head fixed to the bracket can be suppressed from falling.

[0093] Hereinafter, the embodiments will be described in detail with reference to the drawings.

[0094] In addition, the embodiments described below all illustrate general or specific examples. The numerical values, shapes, materials, structural elements, configuration positions of structural elements, and connection methods, steps, and the order of steps shown in the following embodiments are examples, and their purport is not to limit the present disclosure. In addition, regarding the structural elements in the following embodiments that are not recorded in the independent technical solutions representing the highest concept, they are described as arbitrary structural elements. In addition, each figure is a schematic diagram, not a strict illustration. In addition, in each figure, the same symbol is marked for the same structural member. In addition, in the following embodiments, expressions such as roughly rectangles are utilized. For example, roughly rectangles not only mean completely rectangular, but also mean substantially rectangular. The same is true for other expressions that utilize "roughly".

[0095] (Implementation Method)

[0096] [Schematic structure of component mounting line]

[0097] Figure 1 It is a diagram showing a schematic structure of a component mounting line in this embodiment.

[0098] The component mounting line 1 in this embodiment is a system for producing display panels by mounting components 5 on substrates 3, wherein the substrate 3 is a display panel substrate such as a liquid crystal panel substrate, an organic EL (Electro-Luminescence) panel substrate, etc. In addition, the component 5 is, for example, an electronic component such as a drive circuit. Specifically, Figure 1 As shown, the component mounting line 1 includes a substrate carrying-in section 10, a pasting section 20, a temporary crimping section 30, a final crimping section 40, and a substrate carrying-out section 50. The substrate carrying-in section 10, the pasting section 20, the temporary crimping section 30, the final crimping section 40, and the substrate carrying-out section 50 are connected in this order.

[0099] The substrate carrying-in unit 10 receives the rectangular substrate 3 carried in from an operator or another device on the upstream side, and then carries out the substrate 3 to the attaching unit 20 on the downstream side.

[0100] The pasting section 20 receives the substrate 3 unloaded from the substrate loading section 10, and pastes the adhesive member on each of the plurality of electrode sections 4 located at the periphery of the substrate 3. Then, the substrate 3 with the adhesive member pasted thereon is unloaded to the temporary crimping section 30. In addition, each of the plurality of electrode sections 4 includes, for example, a plurality of electrodes. In addition, the adhesive member is, for example, an anisotropic conductive member, i.e., an ACF (Anisotropic Conductive Film) tape.

[0101] The temporary pressure-bonding section 30 receives the substrate 3 conveyed from the bonding section 20 , places the component 5 on the portion of the substrate 3 to which the adhesive member is bonded, and temporarily pressure-bonds the substrate 3 . Then, the substrate 3 to which the component 5 is temporarily pressure-bonded is conveyed to the final pressure-bonding section 40 .

[0102] The final crimping section 40 receives the substrate 3 unloaded from the temporary crimping section 30 and performs final crimping, ie, thermal crimping, on the component 5 temporarily crimped to the substrate 3. The final crimped substrate 3 is then unloaded to the substrate unloading section 50.

[0103] The substrate carrying-out section 50 receives the substrate 3 carried out from the final crimping section 40. The substrate 3 received by the substrate carrying-out section 50 is carried out to the downstream side.

[0104] In this way, the component mounting line 1 performs a component mounting operation of mounting components 5 on each of the plurality of electrode portions 4 provided on the periphery of the carried-in substrate 3 , and unloads the substrate 3 with the components 5 mounted thereon from the substrate unloading unit 50 .

[0105] [Detailed structure of the component mounting line]

[0106] Figure 2 1 is a top view of the component mounting line 1 in this embodiment. Specifically, Figure 2 The structure of the component mounting line 1 viewed from above is shown. In addition, in the present embodiment, the conveying direction of the substrate is referred to as the X-axis direction, the vertical direction is referred to as the Z-axis direction, and the direction perpendicular to the X-axis direction and the Z-axis direction, that is, the depth direction is referred to as the Y-axis direction. In addition, the negative side and the positive side of the X-axis direction correspond to the upstream side and the downstream side of the conveying direction of the substrate, respectively, the negative side and the positive side of the Z-axis direction correspond to the lower side and the upper side of the vertical direction, respectively, and the negative side and the positive side of the Y-axis direction correspond to the front side and the back side, or the front side and the rear side, respectively, of the depth direction.

[0107] The substrate loading section 10 is provided with a base 1a for placing the loaded substrate 3. A workbench 11 for placing the substrate 3 is provided on the base 1a of the substrate loading section 10. The workbench 11 is raised and lowered in the Z-axis direction relative to the base 1a. In addition, a plurality of suction holes 11a are provided on the upper surface of the workbench 11. On such a workbench 11, a vacuum suction is performed from the suction holes 11a to hold the substrate 3 loaded from an operator or other device on the upstream side and loaded on the workbench 11 by a suction device such as a pump (not shown).

[0108] The attaching section 20 has a function of performing an attaching operation (in other words, an attaching step) of attaching the ACF as an adhesive member to the electrode section 4 of the substrate 3. The attaching section 20 includes a substrate moving mechanism 21 and an attaching mechanism 22.

[0109] The substrate moving mechanism 21 is a mechanism for moving the substrate 3. The substrate moving mechanism 21 includes, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, a Z-axis table movable in the Z-axis direction, and a table 23. In the substrate moving mechanism 21, the X-axis table, the Y-axis table, the Z-axis table, and the table 23 are sequentially overlapped on the base 1b in order from bottom to top.

[0110] The Y-axis table extends in the Y-axis direction and is movable on the X-axis table. The Z-axis table is movable on the Y-axis table, so that the table 23 disposed on the upper part can be raised and lowered in the Z-axis direction and rotated around the Z-axis.

[0111] In addition, a plurality of adsorption holes 23a are provided on the upper surface of the workbench 23, and the workbench 23 vacuum adsorbs and holds the substrate 3 placed on the upper surface thereof. In this way, the substrate moving mechanism 21 adsorbs and holds the substrate 3 and moves it in a horizontal plane (specifically, in the X-axis direction and the Y-axis direction), and moves it up and down in the vertical direction (specifically, in the Z-axis direction) and rotates around the Z-axis.

[0112] The pasting mechanism 22 is provided with, for example, two pasting heads arranged along the X-axis direction above the base 1b. Each pasting head is provided with a supply unit for supplying the ACF and a pasting tool for pasting the ACF to the substrate 3. The two pasting heads paste the ACF at positions corresponding to the plurality of electrode portions 4 on the substrate 3, respectively. In addition, a pasting support table is provided at positions corresponding to the two pasting heads, respectively, below.

[0113] The temporary press bonding unit 30 performs a temporary press bonding process of placing and temporarily pressing the component 5 on the ACF-attached region (ie, the press bonding target region) of the substrate 3. The temporary press bonding unit 30 includes a substrate moving mechanism 31, a component mounting mechanism 32, a component supply unit 33, and a component moving unit 35.

[0114] The substrate moving mechanism 31 has the same structure as the substrate moving mechanism 21 of the pasting section 20. Specifically, the substrate moving mechanism 31 has a workbench 37 for holding the substrate 3. A plurality of adsorption holes 37a are provided on the upper surface of the workbench 37. The substrate moving mechanism 31 vacuum adsorbs and holds the substrate 3 placed on the workbench 37 through the adsorption holes 37a. In addition, the substrate moving mechanism 31 has the function of moving the workbench 37 for adsorbing and holding the substrate 3 in a horizontal plane, lifting and lowering it in the vertical direction, and rotating it around the Z axis. The substrate moving mechanism 31 positions the region of the substrate 3, which is adsorbed and held, to the upper side of the lower receiving portion 36 of the component mounting mechanism 32, which is a supporting workbench, by moving and rotating the workbench 37.

[0115] The component supply unit 33 is provided to protrude from the rear of the base 1b on the inner side (i.e., the positive side in the Y-axis direction) of the component mounting mechanism 32. For example, the component supply unit 33 supplies the component 5 to the component moving unit 35. The component 5 is, for example, a TCP (Tape carrier package) component or an IC (Integrated Circuit) component.

[0116] When the component 5 is a TCP component, the component supply unit 33 includes a supply reel on which TCP is wound, and sequentially punches the TCP components arranged on the TCP from the leading end side of the TCP drawn out from the supply reel. Then, the component supply unit 33 supplies the punched TCP components to the component moving unit 35.

[0117] When the component 5 is an IC component, the component supply unit 33 includes a plurality of stacked trays. A plurality of IC components are placed in a matrix on each of the trays. The component supply unit 33 selects any one of the plurality of trays and supplies the plurality of IC components placed on the tray to the component moving unit 35 for each selected tray.

[0118] The component moving section 35 moves the component 5 supplied from the component supply section 33 toward the temporary crimping head 34 included in the component mounting mechanism 32 .

[0119] The component mounting mechanism 32 is provided on the base 1 b and includes a temporary crimping head 34 and a lower receiving portion 36 .

[0120] The lower receiving portion 36 supports from below a predetermined portion to be crimped in the substrate 3 held on the stage 37. The crimped portion is a portion of the substrate 3 to which the ACF is attached.

[0121] The temporary crimping head 34 holds the component 5 and crimps the component 5 to the crimping target portion supported by the lower receiving portion 36. Specifically, the temporary crimping head 34 moves up and down in the Z-axis direction, and adsorbs (that is, picks up) the component 5 moved by the component moving portion 35 from above. Then, the temporary crimping head 34 places the adsorbed component 5 on the ACF and pushes it to the lower receiving portion 36 for each substrate 3, thereby temporarily crimping the component 5 to the substrate 3. In addition, the temporary crimping unit 30 may also have a mechanism for rotating the direction of the substrate 3 held by the substrate moving mechanism 31 by 90 degrees.

[0122] The final crimping section 40 performs a final crimping process (i.e., a thermal crimping process) of final crimping, i.e., thermally crimping, the component 5 temporarily crimped to the substrate 3 by the temporary crimping section 30 to the substrate 3. In this way, the electrode section 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF. Such a final crimping section 40 includes a substrate moving mechanism 41 and a crimping mechanism 42.

[0123] The substrate moving mechanism 41 has the same structure as the substrate moving mechanism 21 of the pasting section 20. Specifically, the substrate moving mechanism 41 has a workbench 49. A plurality of suction holes 49a are provided on the upper surface of the workbench 49. The substrate moving mechanism 41 vacuum-adsorbs and holds the substrate 3 placed on the workbench 49 through the suction holes 49a. In addition, the substrate moving mechanism 41 has the function of moving the workbench 49 that adsorbs and holds the substrate 3 in a horizontal plane, lifting and lowering it in the vertical direction, and rotating it around the Z axis. The substrate moving mechanism 41 positions the area of ​​the substrate 3 that is temporarily crimped with the component 5, which is adsorbed and held, above the crimping support portion of the crimping mechanism 42 by moving and rotating the workbench 49.

[0124] The crimping mechanism 42 includes a crimping support portion and a formal crimping head, and uses a heated tool of the formal crimping head to press the component 5 temporarily crimped to the substrate 3 to the crimping support portion. Thus, the component 5 is formally crimped, and the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF.

[0125] The substrate unloading unit 50 has a function of vacuum-adsorbing and holding the substrate 3 conveyed from the final crimping unit 40 on the stage 51. The substrate 3 held in the substrate unloading unit 50 is unloaded to another device on the downstream side or taken out from the stage 51 by an operator.

[0126] The table 51 is moved up and down in the Z-axis direction relative to the base 1 c. A plurality of suction holes 51 a are provided on the upper surface of the table 51 , and the table 51 vacuum-suctions and holds the substrate 3 transferred from the final crimping section 40 on the upper surface.

[0127] The conveying section 60 is a device for conveying the substrate 3. Specifically, the conveying section 60 has a function of transferring the substrate 3 carried into the substrate carrying-in section 10 to the pasting section 20, the temporary crimping section 30, the final crimping section 40, and the substrate carrying-out section 50 in this order. The conveying section 60 is arranged in the front area of ​​the pasting section 20, the temporary crimping section 30, and the final crimping section 40 (i.e., the negative side in the Y-axis direction).

[0128] The conveying unit 60 includes a substrate conveying mechanism 62A, a substrate conveying mechanism 62B, a substrate conveying mechanism 62C, and a substrate conveying mechanism 62D arranged in order from the upstream side on a movable base 61 extending in the X-axis direction across bases 1a, 1b, and 1c.

[0129] Each of the substrate transport mechanisms 62A to 62D includes a base 63 and one or more arm units 64. In the present embodiment, a case where each of the substrate transport mechanisms 62A to 62D includes two arm units 64 is exemplified.

[0130] The base 63 is provided on the moving base 61 and is movable in the X-axis direction. Two arm units 64 are arranged side by side in the X-axis direction on the base 63. The arm units 64 vacuum-absorb the substrate 3 from above.

[0131] The substrate conveying mechanisms 62A to 62D each move to a substrate transfer position for vacuum-adsorbing the substrate 3 held by the worktables 11, 23, 37, 49, and 51 from above, and receive or transfer the substrate 3 from the elevated worktables 11, 23, 37, 49, and 51. For example, the substrate conveying mechanism 62A receives the substrate 3 placed on the worktable 11 of the substrate carrying-in section 10, and transfers it to the worktable 23 of the pasting section 20. In addition, for example, the substrate conveying mechanism 62B receives the substrate 3 from the worktable 23 of the pasting section 20, and transfers it to the worktable 37 of the temporary crimping section 30. In addition, for example, the substrate conveying mechanism 62C receives the substrate 3 from the worktable 37 of the temporary crimping section 30, and transfers it to the worktable 49 of the final crimping section 40. In addition, for example, the substrate conveying mechanism 62D receives the substrate 3 from the worktable 49 of the final crimping section 40, and transfers it to the worktable 51 of the substrate carrying-out section 50.

[0132] Figure 3 This is a diagram showing a computer included in the component mounting line 1 and each component controlled by the computer.

[0133] like Figure 3 As shown, the component mounting line 1 includes a computer 2. The computer 2 is connected to, for example, a bonding unit 20, a temporary crimping unit 30, a final crimping unit 40, and a conveying unit 60 through a control line to communicate with each of these units. The computer 2 includes a control unit 2a and a storage unit 2b.

[0134] The storage unit 2b stores various data required for component installation work, such as the size of the substrate 3, the type of component 5 mounted on the substrate 3, the mounting position, the mounting direction, and the timing of transferring the substrate 3, and the control program executed by the control unit 2a. The storage unit 2b is implemented by a ROM (Read Only Memory) or a RAM (Random Access Memory) or the like.

[0135] The control unit 2a controls the substrate moving mechanism 21 of the pasting unit 20, the substrate moving mechanism 31 of the temporary crimping unit 30, the substrate moving mechanism 41 of the final crimping unit 40, and the conveying unit 60 to perform a substrate transfer operation of transferring the substrate 3 to the next process between the respective units. The transfer of the substrate 3 from the upstream side to the downstream side in the substrate transfer operation is synchronously performed between the respective units.

[0136] For example, the control unit 2a controls the pasting unit 20 to change the orientation and position of the substrate 3 held by the substrate moving mechanism 21, and changes the interval between multiple pasting heads by the head moving motor, so that the pasting unit 20 performs the pasting operation of pasting ACF on the substrate 3 by the pasting mechanism 22.

[0137] In addition, for example, the control unit 2a controls the temporary crimping unit 30 to change the orientation and position of the substrate 3 held by the substrate moving mechanism 31, so that the component mounting mechanism 32 performs temporary crimping of the component 5 to the substrate 3. In addition, the control unit 2a controls the component moving unit 35 to move the component 5 temporarily crimped to the substrate 3 toward the component mounting mechanism 32 side.

[0138] Furthermore, for example, the control unit 2 a controls the final crimping unit 40 to change the orientation and position of the substrate 3 held by the substrate moving mechanism 41 , and causes the crimping mechanism 42 to final crimp the component 5 temporarily crimped to the substrate 3 .

[0139] Such a control unit 2a is realized by, for example, a control program stored in the storage unit 2b for controlling each portion and each mechanism of the component mounting line 1, and a processor such as a CPU (Central Processing Unit) that executes the control program.

[0140] [Structure of crimping device]

[0141] Figure 4 1 is a block diagram showing the functional structure of the crimping device 100 in this embodiment.

[0142] The crimping device 100 includes a main crimping section 40 in the component mounting line 1 and a control section 2 a of a computer 2 .

[0143] Specifically, the crimping device 100 includes a control unit 2a, a substrate moving mechanism 41, and a crimping mechanism 42. The crimping mechanism 42 includes a plurality of final crimping heads 120, a head holding unit 110, a head driving mechanism 150, a crimping support unit 141, and a position changing unit 130.

[0144] The plurality of regular crimping heads 120 are heads for crimping the component 5 to the substrate 3. As described later, in the present embodiment, the regular crimping heads 120 include two types of regular crimping heads 120a and 120b (see Figure 5 ) In addition, the crimping performed by the crimping device 100 is full crimping, that is, thermal crimping.

[0145] The head holding portion 110 holds the final crimping heads 120 so as to be slidable.

[0146] The head driving mechanism 150 has a cylinder 151 and a rod 152, and has a function of sliding and pushing down any one of the plurality of final crimping heads 120, that is, a function of pressing the final crimping head 120. The component 5 is crimped to the substrate 3 by the final crimping head 120 pushed down.

[0147] The position changing unit 130 changes the relative position between the head holding unit 110 and the rod 152 by moving the head holding unit 110 .

[0148] The pressure-bonding support portion 141 supports, from below, a region of the substrate 3 held by suction on the table 49 of the substrate moving mechanism 41 to which the component 5 is temporarily pressure-bonded.

[0149] Figure 5 1 is a perspective view showing an external appearance of an example of the main crimping section 40 included in the crimping device 100 according to the present embodiment.

[0150] The substrate moving mechanism 41 moves the substrate 3 held by adsorption on the worktable 49 in the X-axis direction, the Y-axis direction, and the Z-axis direction, or rotates around the Z-axis, so that the crimping support portion 141 supports the area of ​​the substrate 3 to which the component 5 is temporarily crimped from the bottom. In this way, the component 5 is thermally crimped to the substrate 3 by the formal crimping portion 40 while the area of ​​the substrate 3 to which the component 5 is temporarily crimped is supported by the crimping support portion 141. Figure 5 In the example shown, two substrates 3 are held by suction on the stage 49, and the region of each substrate 3 to which the component 5 is temporarily crimped is supported by the crimping support portion 141. Then, in this state, the final crimping portion 40 thermally crimps the component 5 of each substrate 3.

[0151] Here, for example, Figure 5 As shown, the final crimping section 40 of the crimping device 100 in the present embodiment includes two final crimping heads 120 a and two final crimping heads 120 b as the final crimping heads 120 described above.

[0152] The full crimping head 120a includes a head body 121 and a tool 122a for, for example, an IC component mounted at the lower end of the head body 121. In addition, the full crimping head 120b includes a head body 121 and a tool 122b for, for example, a TCP component mounted at the lower end of the head body 121. The tool 122a for the IC component is configured to appropriately press the component 5 configured as an IC component, and the tool 122b for the TCP component is configured to appropriately press the component 5 configured as a TCP component. Therefore, the tool 122b for the TCP component is larger than the tool 122a for the IC component.

[0153] In addition, the full crimping head 120 having the tool 122a is hereinafter referred to as the full crimping head 120a for IC components, and the full crimping head 120 having the tool 122b is hereinafter referred to as the full crimping head 120b for TCP components.

[0154] As described above, each of the four regular crimping heads 120 in the present embodiment includes the tool 122a or 122b that contacts the component 5 crimped to the substrate 3, and the tool 122a and the tool 122b are different in form from each other.

[0155] Furthermore, a convex portion 123 that comes into contact with the rod 152 is formed at the upper end of the head main body 121 of each of the four final crimping heads 120 .

[0156] The head holding portion 110 holds four formal crimping heads 120, namely, two formal crimping heads 120a and two formal crimping heads 120b. Specifically, the head holding portion 110 holds the four formal crimping heads 120 in a state where the four formal crimping heads 120 are arranged along the X-axis direction. More specifically, the head holding portion 110 holds the formal crimping heads 120 in a state where the formal crimping heads 120a and the formal crimping heads 120b are alternately arranged. In addition, the four formal crimping heads 120 are held in a state where the tool 122a or 122b of the formal crimping head 120 faces downward along the X-axis direction.

[0157] In addition, the head holding part 110 holds the four regular crimping heads 120 so that they can slide freely along the first direction. In this embodiment, the first direction is the Z-axis direction, that is, the vertical direction. For example, the head holding part 110 holds the regular crimping heads 120 so that they can slide freely along the Z-axis direction by suspending the regular crimping heads 120 with springs 112. Specifically, for example, Figure 5 As shown, the head holding portion 110 includes a roughly rectangular plate-shaped component. Moreover, four grooves 111 along the Z-axis direction are respectively formed on the negative side of the two surfaces of the head holding portion 110 perpendicular to the Y-axis direction. The above-mentioned springs 112 are respectively embedded in these four grooves 111. The upper end of the spring 112 is connected to the upper end in the groove 111, and the lower end of the spring 112 is connected to the upper end side of the back side of the head body 121. As a result, the four formal crimping heads 120 are respectively held by the springs 112 so as to slide freely along the Z-axis direction.

[0158] In addition, for example, Figure 5 As shown, the final crimping unit 40 of the crimping device 100 in this embodiment has two head driving mechanisms 150. That is, the final crimping unit 40 includes two head driving mechanisms 150 including a cylinder 151 and a rod 152. The two head driving mechanisms 150 are arranged, for example, along the X-axis direction.

[0159] The cylinder 151 holds the upper end of the rod 152 in a state where the rod 152 is along the Z-axis direction, and moves the rod 152 forward and backward along the Z-axis direction, which is a first direction.

[0160] The cylinder 151 moves the rod 152 downward, thereby pressing any one of the four formal crimping heads 120 toward the vertical downward side. Here, the front end 153 at the lower end of the rod 152 is formed to be wide. When the rod 152 moves downward by the cylinder 151 as described above, the front end 153 of the rod 152 makes point contact with the convex portion 123 formed at the upper end of the head body 121 of any formal crimping head 120, and the convex portion 123 is pressed downward. As a result, the formal crimping head 120 is pressed and slides toward the vertical downward side.

[0161] The position changing unit 130 has a mechanism that enables the relative position of the head holding unit 110 and the rod 152 to be changed in the second direction intersecting the above-mentioned first direction. Thus, the position changing unit 130 selectively switches the formal crimping head 120 that is pressed along the first direction by the rod 152 that enters among the four formal crimping heads 120 by changing the relative position. In the present embodiment, the second direction is a horizontal direction, and the position changing unit 130 changes the relative position of the head holding unit 110 by moving the head holding unit 110 in the horizontal direction. Specifically, the position changing unit 130 has an actuator such as a motor, and the actuator moves the head holding unit 110 in the X-axis direction. As a result, since the two head driving mechanisms 150 are fixed, the relative position of the rod 152 and the head holding unit 110 contained in each of the two head driving mechanisms 150 is changed.

[0162] Therefore, the position changing section 130 can selectively switch the regular crimping heads 120 pressed by the downward movement of the rods 152 of the two head driving mechanisms 150 by changing the relative positions. In other words, the position changing section 130 can switch the pressed regular crimping heads 120 to the regular crimping heads 120a for IC components and the regular crimping heads 120b for TCP components.

[0163] [Operation of the crimping device]

[0164] Figure 6 This is a diagram showing an example of the operation of the crimping device 100 in this embodiment.

[0165] For example, when the component 5 to be crimped to the substrate 3 is an IC component, the control unit 2a of the crimping device 100 controls the component 5 to be crimped to the substrate 3. Figure 6As shown in (a), the position changing unit 130 is controlled to move the head holding unit 110 toward the positive side in the X-axis direction. That is, the relative position of the head holding unit 110 and the rod 152 in the X-axis direction is changed. As a result, the front end portion 153 of the rod 152 of each of the two head driving mechanisms 150 is opposed to the convex portion 123 of the formal crimping head 120a for the IC component held in the head holding unit 110 in the Z-axis direction. Moreover, the control unit 2a controls the working cylinder 151 of each of the two head driving mechanisms 150 to move the rod 152 corresponding to the working cylinder 151 toward the negative side (i.e., the lower side) in the Z-axis direction.

[0166] As a result, the tip end 153 of each rod 152 of the two head driving mechanisms 150 makes point contact with the convex portion 123 of the regular crimping head 120a opposite to the tip end 153, and presses the regular crimping head 120a toward the negative side in the Z-axis direction. Figure 5 The spring 112 shown is stretched and slides toward the negative side of the Z-axis direction against the tension of the spring 112. Then, the tool 122a of the sliding formal crimping head 120a presses the component 5 temporarily crimped to the substrate 3, that is, the IC component. In addition, at this time, the tool 122a is heated by, for example, a built-in heater. Therefore, the heated tool 122a presses the IC component, thereby thermally crimping the IC component to the substrate 3.

[0167] On the other hand, when the component 5 to be crimped to the substrate 3 is a TCP component, the control unit 2a of the crimping device 100 controls the component 5 to be crimped to the substrate 3. Figure 6 As shown in (b), by controlling the position change unit 130, the head holding unit 110 is moved in the opposite direction to the example shown in (a), that is, the negative side in the X-axis direction. That is, the relative position of the head holding unit 110 and the rod 152 in the X-axis direction is changed. As a result, the front end portion 153 of the rod 152 of each of the two head driving mechanisms 150 is opposed to the convex portion 123 of the formal crimping head 120b for the TCP component held in the head holding unit 110 in the Z-axis direction. Moreover, the control unit 2a controls the working cylinder 151 of each of the two head driving mechanisms 150, thereby causing the rod 152 corresponding to the working cylinder 151 to enter the negative side (i.e., the lower side) in the Z-axis direction.

[0168] As a result, the tip 153 of the rod 152 of each of the two head drive mechanisms 150 makes point contact with the convex portion 123 of the formal crimping head 120b opposite to the tip 153, and presses the formal crimping head 120b toward the negative side in the Z-axis direction. Figure 5The spring 112 shown is stretched and slides toward the negative side of the Z-axis direction against the tension of the spring 112. Then, the tool 122b for the TCP component of the sliding formal crimping head 120b presses the component 5 temporarily crimped to the substrate 3, i.e., the TCP component. In addition, at this time, the tool 122b is heated by, for example, a built-in heater. Therefore, the heated tool 122b presses the TCP component, thereby thermally crimping the TCP component to the substrate 3.

[0169] Here, in this embodiment, the crimping unit is formed by combining two kinds of formal crimping heads 120a and 120b and a head driving mechanism 150. That is, the crimping device 100 in this embodiment has two crimping units u1 and u2. The two crimping units u1 and u2 each have: two kinds of formal crimping heads 120a and 120b held in a head holding portion 110, and a head driving mechanism 150 including a cylinder 151 and a rod 152.

[0170] Therefore, the position changing unit 130 changes the relative positions of the two types of regular crimping heads 120a and 120b and the rod 152 included in the two crimping units u1 and u2 by changing the relative position of the head holding unit 110. Specifically, the position changing unit 130 changes the relative positions of the two types of regular crimping heads 120a and 120b and the rod 152 included in the two crimping units u1 and u2 by moving the head holding unit 110 in the second direction (specifically, the X-axis direction).

[0171] In addition, in the present embodiment, the interval between the two types of formal crimping heads 120a and 120b, that is, the interval in the X-axis direction between the formal crimping heads 120a and 120b, is equal in the two crimping units u1 and u2. Thus, the switching performed by the two crimping units u1 and u2, that is, the switching of the formal crimping heads 120 pressed along the first direction (specifically, the Z-axis direction), can be performed simultaneously and appropriately. Specifically, the switching of the formal crimping heads 120a for IC components and the formal crimping heads 120b for TCP components can be performed simultaneously and appropriately.

[0172] In addition, in the present embodiment, the crimping units u1 and u2 each have two types of formal crimping heads 120a and 120b, but the type or number of the formal crimping heads 120 may be more than three. In this case, the three or more formal crimping heads 120 included in each of the two crimping units u1 and u2 are arranged at equal intervals along the second direction (i.e., the X-axis direction). Thus, even if the type or number of the formal crimping heads 120 included in each of the two crimping units u1 and u2 is more than three, the formal crimping heads 120 respectively performed by the two crimping units u1 and u2 can be switched simultaneously and appropriately.

[0173] Figure 7 1 is a diagram showing an example of the positional relationship between each component included in the crimping device 100 and the component 5 in the present embodiment. Specifically, Figure 7 (a) shows an example of the positional relationship when the IC component is crimped. Figure 7 (b) shows an example of the positional relationship when the TCP components are crimped.

[0174] in addition, Figure 7 The head holding unit 110 and the cylinder 151 are shown as viewed from the negative side in the Y-axis direction, while the table 49, the substrate 3, and the component 5 are shown as viewed from the positive side in the Z-axis direction. Figure 7 In the illustrated example, the pressure-bonding device 100 includes two stages 49 , and the substrate 3 is suction-held on each of the two stages 49 .

[0175] For example, when the component 5 to be crimped to the substrate 3 is an IC component, the control unit 2a of the crimping device 100 controls the component 5 to be crimped to the substrate 3. Figure 6 Similarly, as shown in the example (a) Figure 7 As shown in (a), the head holding part 110 is moved to the positive side in the X-axis direction by controlling the position changing part 130. As a result, the two regular crimping heads 120a, each having a tool 122a for IC components, are in a state where they can be pressed by the cylinder 151 and the rod 152.

[0176] Then, the control unit 2a moves the two work tables 49 of the substrate moving mechanism 41. As a result, the component 5, i.e., the IC component, which is temporarily crimped on the substrate 3 on the work table 49 is arranged to face the negative side of the tool 122a for IC components in the Z-axis direction. In addition, at this time, the portion of the substrate 3 to which the component 5 is temporarily crimped is supported by the crimping support portion 141 from the bottom.

[0177] After the position alignment of the component 5 as the IC component is performed in this manner, the control unit 2 a controls the two cylinders 151 to cause the two final crimping heads 120 a to perform thermal crimping of the component 5 , respectively.

[0178] On the other hand, when the component 5 to be crimped to the substrate 3 is a TCP component, the control unit 2a of the crimping device 100 controls the component 5 to be crimped to the substrate 3. Figure 6 Similarly, as shown in the example (b) Figure 7 As shown in (b), the head holding portion 110 is moved to the negative side in the X-axis direction by controlling the position changing portion 130. Thus, the two regular crimping heads 120b having the tool 122b for the TCP component are in a state where they can be pressed by the cylinder 151 and the rod 152.

[0179] Then, the control unit 2a moves the two work tables 49 of the substrate moving mechanism 41. As a result, the component 5 temporarily crimped on the substrate 3 on the work table 49, that is, the TCP component, is arranged to face the negative side of the tool 122b for the TCP component in the Z-axis direction. In addition, at this time, the portion of the substrate 3 to which the component 5 is temporarily crimped is supported by the crimping support portion 141 from the bottom.

[0180] After the position alignment of the component 5 as the TCP component is performed in this manner, the control unit 2 a controls the two cylinders 151 to cause the two final crimping heads 120 b to perform thermal crimping of the component 5 , respectively.

[0181] Figure 8 This is a flow chart of the crimping method in this embodiment.

[0182] The crimping device 100 in this embodiment performs the following steps S1 and S2 using four final crimping heads 120 for crimping the component 5 to the substrate 3 and a head holding portion 110 that holds the four final crimping heads 120 slidably in the first direction.

[0183] First, in the position changing process, the crimping device 100 changes the relative position of the head holding portion 110 and the rod 152 in the second direction intersecting the first direction. Thus, the crimping device 100 selectively switches the formal crimping head 120 pressed by the rod 152 among the four formal crimping heads 120 (step S1).

[0184] Next, in the pressing process, the cylinder 151 of the crimping device 100 moves the rod 152 in the first direction, thereby pressing the formal crimping head 120 selectively switched in the position changing process in the first direction (step S2). The component 5 is thermally crimped to the substrate 3 by the pressed formal crimping head 120.

[0185] As described above, in the present embodiment, the crimping device 100 is provided with a plurality of regular crimping heads 120, so that these regular crimping heads 120 can be used according to the crimping conditions. Therefore, even when the crimping conditions of the plurality of components 5 to be crimped are different and the crimping conditions thereof need to be switched, by using the regular crimping head 120 that satisfies the crimping conditions thereof, the components requiring the crimping conditions thereof can be crimped to the substrate 3 in a short time. That is, the operation time of changing the crimping conditions that can be realized by one regular crimping head 120 to the crimping conditions suitable for the components 5 can be saved.

[0186] Furthermore, by changing the relative position of the head holding portion 110 and the rod 152 in the X-axis direction, the regular crimping head 120 pressed by the rod 152 for crimping the component 5 can be selectively switched, thereby suppressing the size increase of the crimping device 100. That is, the necessity of providing the working cylinder 151 and the rod 152 for each of the plurality of regular crimping heads 120 can be eliminated.

[0187] Therefore, it is possible to reduce the time required for changing the crimping conditions of the component 5 while suppressing an increase in size of the crimping device 100 .

[0188] In this embodiment, the crimping head 120a has a tool 122a, and the crimping head 120b has a tool 122b. The tools 122a and 122b have different shapes. That is, the crimping conditions are the shapes of the tools.

[0189] Therefore, even when the type of component 5 to be crimped to the substrate 3 is switched, by using the regular crimping head 120a or 120b having a tool suitable for the shape of the component 5, the component 5 can be crimped to the substrate 3 without replacing or adjusting the tool of the regular crimping head 120a or 120b. As a result, the operation time required for switching the type of component 5 can be reduced.

[0190] In addition, in the present embodiment, the above-mentioned crimping condition is the form of the tool, but the crimping condition may also be the temperature of the tool. In this case, a plurality of formal crimping heads 120 can be used separately according to the temperature of the tool required for the crimped components. Therefore, even if the temperature of the tool required for the plurality of components 5 to be crimped is different and the temperature needs to be switched, if the formal crimping head 120 having the tool pre-set to the temperature required for crimping the component 5 is used, the component 5 can be crimped to the substrate 3 in a short time. In other words, the operation time of changing the temperature of the tool of one formal crimping head 120 to the temperature required for crimping the component 5 can be saved.

[0191] In this embodiment, the crimping device 100 includes two crimping units u1 and u2. The position changing unit 130 moves the head holding unit 110 in the X-axis direction, thereby changing the relative positions of the two regular crimping heads 120a and 120b and the rod 152 included in the two crimping units u1 and u2.

[0192] Thereby, in each of the two crimping units u1 and u2, the work time required for switching the types of components 5, for example, can be effectively reduced.

[0193] In addition, in the present embodiment, the intervals at which the two formal crimping heads 120a and 120b are separated from each other are equal in the two crimping units u1 and u2. Therefore, the formal crimping heads 120 pressed along the Z-axis direction by the two crimping units u1 and u2 can be switched simultaneously and appropriately. Here, in the case where the two crimping units u1 and u2 each include more than three formal crimping heads 120, the more than three formal crimping heads 120 included in the two formal crimping units u1 and u2 can also be arranged at equal intervals along the X-axis direction. Thus, even in the case where the two crimping units u1 and u2 each include more than three formal crimping heads 120, the formal crimping heads 120 pressed along the Z-axis direction by the two crimping units u1 and u2 can be switched simultaneously and appropriately.

[0194] (Variation Example)

[0195] The crimping device 100 according to this modification further includes a bracket.

[0196] Fig. 9 1 is a diagram showing an example of four brackets included in the crimping device 100 according to this modification. Specifically, Fig. 9 (a) shows the appearance of the bracket and the front end portion 153 of the rod 152 as viewed from the positive side in the Z-axis direction. Fig. 9 (b) shows the appearance of the bracket, the head holding part 110, etc., as viewed from the negative side in the Y-axis direction.

[0197] like Fig. 9 As shown, the crimping device 100 involved in this modification example has a bracket 160 fixed to each of the four formal crimping heads 120, and the bracket is used to engage with the rod 152 that presses the formal crimping head 120. Therefore, in this modification example, the bracket 160 engages with the rod 152, thereby preventing the formal crimping head 120 fixed to the bracket 160 from falling.

[0198] The bracket 160 is formed, for example, by bending a metal plate into a substantially L-shape, and has a substantially plate-shaped fixing portion 161 and a substantially plate-shaped engaging portion 162. The fixing portion 161 is fixed to the head body 121 of the formal crimping head 120. The engaging portion 162 is arranged to be separated from the end of the formal crimping head 120 fixed to the fixing portion 161 in the first direction (i.e., the Z-axis direction), and the end is the end pressed by the rod 152. The end of the formal crimping head 120 is a convex portion 123 formed on the head body 121.

[0199] In addition, the engaging portion 162 is formed with a recessed portion 163 into which the middle portion of the rod 152 is inserted along the second direction (i.e., the X-axis direction) due to the change in the relative position described above. In addition, the front end portion 153 of the rod 152 is formed to be wider than the middle portion thereof. In addition, the middle portion of the rod 152 is the portion other than the two ends of the rod 152. Furthermore, by the rod 152 with the middle portion inserted into the recessed portion 163 entering toward the negative side in the Z-axis direction, the front end portion 153 of the rod 152 presses the convex portion 123, which is the end portion of the formal crimping head 120.

[0200] In addition, in this embodiment, the four regular crimping heads 120 include the regular crimping head 120a for IC components and the regular crimping head 120b for TCP components that are adjacent to each other. Moreover, the recessed portion 163 of the bracket 160 fixed to the regular crimping head 120a for IC components and the recessed portion 163 of the bracket 160 fixed to the regular crimping head 120b for TCP components are opposed to each other. In other words, the recessed portion 163 of the bracket 160 formed on the regular crimping head 120a for IC components and the recessed portion 163 of the bracket 160 formed on the regular crimping head 120b for TCP components are opposed in the second direction, that is, the X-axis direction.

[0201] Therefore, no matter which direction the head holding part 110 moves along the X-axis direction, the middle part of the rod 152 can be inserted into the recess 163 of the bracket 160 of the formal crimping head 120. As a result, the bracket 160 can be made to be engaged with the rod 152, and the fall of the formal crimping head 120 fixed to the bracket 160 can be suppressed.

[0202] Fig.10 1 is a diagram showing an example of the positional relationship between each component included in the crimping device 100 according to this modification and the component 5. Specifically, Fig.10 (a) shows an example of the positional relationship when the IC component is crimped. Fig.10 (b) shows an example of the positional relationship when the TCP components are crimped. Fig.11 1 is a diagram showing an example of a partial cross-section of the crimping device 100 according to this modification. Specifically, Fig.11 (a) shows Fig.10 The cross section at line AA of (a) is Fig.11 (b) shows Fig.10 (b) Cross section at line BB.

[0203] in addition, Fig.10 The head holding unit 110 and the cylinder 151 are shown as viewed from the negative side in the Y-axis direction, while the table 49, the substrate 3, and the component 5 are shown as viewed from the positive side in the Z-axis direction. Fig.10In the illustrated example, the pressure-bonding device 100 includes two stages 49 , and the substrate 3 is suction-held on each of the two stages 49 .

[0204] For example, when the component 5 to be crimped to the substrate 3 is an IC component, the control unit 2a of the crimping device 100 controls the component 5 to be crimped to the substrate 3. Figure 7 Similarly, as shown in the example (a) Fig.10 As shown in (a), the head holding part 110 is moved to the positive side in the X-axis direction by controlling the position changing part 130. As a result, the two regular crimping heads 120a, each having a tool 122a for IC components, are in a state where they can be pressed by the cylinder 151 and the rod 152.

[0205] At this time, the two rods 152 are respectively configured to be able to engage with the bracket 160 of the regular crimping head 120a for IC components. Fig.10 (a) and Fig.11 As shown in (a), the middle portion of the rod 152 is inserted into the recess 163 formed in the bracket 160 of the regular crimping head 120a for IC components. As a result, the front end 153 of the rod 152 and the engaging portion 162 of the bracket 160 are opposed in the Z-axis direction. Specifically, the front end 153 of the rod 152 and the peripheral edge of the recess 163 in the engaging portion 162 are opposed in the Z-axis direction. As a result, the front end 153 of the rod 152 and the bracket 160 are in a state where they can be engaged.

[0206] Therefore, when the holding of the IC component crimping head 120a by the head holding portion 110 is released, the front end portion 153 of the rod 152 engages with the bracket 160 of the crimping head 120a. That is, the front end portion 153 of the rod 152, the middle portion of which is inserted into the recess 163 of the bracket 160, engages with the peripheral portion of the recess 163 in the engaging portion 162 of the bracket 160 in the first direction, i.e., the Z-axis direction. For example, when the spring 112 for holding the IC component crimping head 120a is pulled and disconnected due to the pressing of the crimping head 120a by the rod 152, the holding of the crimping head 120a by the head holding portion 110 is released. Even in such a case, since the front end portion 153 of the rod 152 engages with the bracket 160 of the crimping head 120a, it is possible to suppress the crimping head 120a from falling.

[0207] Furthermore, if the IC component crimping head 120a and the rod 152 are arranged in the above-mentioned state, the control unit 2a moves the two work tables 49 of the substrate moving mechanism 41 respectively, similarly to the above-mentioned embodiment. As a result, the component 5, i.e., the IC component, which is temporarily crimped on the substrate 3 on the work table 49 is arranged to be opposite to the negative side of the tool 122a for the IC component in the Z-axis direction. In addition, at this time, the portion of the substrate 3 to which the component 5 is temporarily crimped is supported by the crimping support unit 141 from the bottom.

[0208] After the position alignment of the component 5 as the IC component is performed in this manner, the control unit 2 a controls the two cylinders 151 to cause the two final crimping heads 120 a to perform thermal crimping of the component 5 , respectively.

[0209] On the other hand, when the component 5 to be crimped to the substrate 3 is a TCP component, the control unit 2a of the crimping device 100 controls the component 5 to be crimped to the substrate 3. Figure 7 Similarly, as shown in the example (b) Fig.10 As shown in (b), the head holding portion 110 is moved to the negative side in the X-axis direction by controlling the position changing portion 130. Thus, the two regular crimping heads 120b having the tool 122b for the TCP component are in a state where they can be pressed by the cylinder 151 and the rod 152.

[0210] At this time, the two rods 152 are respectively in a state where they can be engaged with the bracket 160 of the regular crimping head 120b for the TCP component. Fig.10 (b) and Fig.11 As shown in (b), the middle portion of the rod 152 is inserted into the recess 163 formed in the bracket 160 of the regular crimping head 120b for the TCP component. As a result, the front end 153 of the rod 152 and the engaging portion 162 of the bracket 160 are opposed in the Z-axis direction. Specifically, the front end 153 of the rod 152 and the peripheral edge of the recess 163 in the engaging portion 162 are opposed in the Z-axis direction. As a result, the front end 153 of the rod 152 and the bracket 160 are in a state where they can be engaged.

[0211] Therefore, when the holding of the final crimping head 120b for TCP components by the head holding part 110 is released, the front end 153 of the rod 152 and the bracket 160 of the final crimping head 120b are engaged in the same manner as in the case of IC components. For example, when the spring 112 for holding the final crimping head 120a for TCP components is pulled and disconnected due to the pressing of the final crimping head 120b by the rod 152, the holding of the final crimping head 120b by the head holding part 110 is released. Even in such a case, since the front end 153 of the rod 152 and the bracket 160 of the final crimping head 120b are engaged, it is possible to suppress the final crimping head 120b from falling.

[0212] Furthermore, if the TCP component crimping head 120b and the rod 152 are arranged in the above-mentioned state, the control unit 2a moves the two work tables 49 of the substrate moving mechanism 41 respectively, similarly to the above-mentioned embodiment. Thus, the component 5 temporarily crimped on the substrate 3 on the work table 49, i.e., the TCP component, is arranged to be opposite to the negative side of the tool 122b for the TCP component in the Z-axis direction. In addition, at this time, the portion of the substrate 3 to which the component 5 is temporarily crimped is supported by the crimping support unit 141 from the bottom.

[0213] After the position alignment of the component 5 as the TCP component is performed in this manner, the control unit 2 a controls the two cylinders 151 to cause the two final crimping heads 120 b to perform thermal crimping of the component 5 , respectively.

[0214] As described above, in this modified example, the bracket 160 is fixed to each of the four final crimping heads 120, and the bracket 160 fixed to the final crimping head 120 opposite to the front end 153 of the rod 152 is configured to be able to engage with the front end 153. Thus, even if the holding of the final crimping head 120 by the head holding portion 110 is released, the bracket 160 fixed to the final crimping head 120 will engage with the front end 153 of the rod 152. As a result, the fall of the final crimping head 120 can be suppressed.

[0215] (Other Modifications)

[0216] The above is a description of the crimping device involved in one or more modes based on the above-mentioned embodiment and its variants, but the present disclosure is not limited to the embodiment and its variants. As long as it does not deviate from the main purpose of the present disclosure, various modified forms that a person skilled in the art can think of for the above-mentioned embodiment and its variants, and forms constructed by combining the structural elements in the above-mentioned embodiment and its variants can also be included in the scope of the present disclosure.

[0217] For example, in the above-mentioned embodiment and its modified example, the crimping device 100 performs the formal crimping of the component 5, but it may perform the temporary crimping of the component 5 instead. That is, the crimping device 100 may also include a temporary crimping portion 30 instead of the formal crimping portion 40. In this case, the temporary crimping portion 30 includes a plurality of temporary crimping heads 34, and these temporary crimping heads 34 are used like the plurality of formal crimping heads 120 in the above-mentioned embodiment and its modified example.

[0218] In addition, in the above-mentioned embodiment and its modified example, the position changing unit 130 automatically moves the head holding unit 110 using an actuator or the like, but the head holding unit 110 may be moved manually without using an actuator. In this case, the position changing unit 130 has a mechanism that enables the relative position of the head holding unit 110 and the rod 152 in the second direction (i.e., the X-axis direction) to be changed, but it may not have an actuator. Therefore, the structure of the crimping device 100 can be simplified, and the power consumption can be reduced.

[0219] Furthermore, in the above-mentioned embodiment and its modified example, in order to reduce the operation time spent on switching the types of components, the crimping device 100 includes two regular crimping heads 120a and 120b, each of which has a tool of different form, but it may also include a plurality of regular crimping heads 120, each of which has a tool of the same form. In this case, the temperature of the tool of each of the plurality of regular crimping heads 120 can also be made different. As a result, even if the temperature switching is required due to the difference in the temperature of the tool required for each of the plurality of components 5 to be crimped, if the regular crimping head 120 having the tool pre-set to the temperature required for crimping the component 5 is used, the component 5 can be crimped to the substrate 3 in a short time. In other words, the operation time of changing the temperature of the tool of one regular crimping head 120 to the temperature required for crimping the component 5 can be saved.

[0220] In addition, in the above-mentioned embodiment and its modified example, the relative position of the head holding part 110 and the rod 152 is changed by moving the head holding part 110 in the horizontal direction, but conversely, the rod 152 may be moved in the horizontal direction. In other words, the head driving mechanism 150 including the rod 152 may be moved in the horizontal direction.

[0221] In addition, the product switching in the above-mentioned embodiment and its modified example is the switching between IC components and TCP components, but it is not limited to these types, and can also be the switching between any types. For example, the product switching can also be the switching between IC components and FPC (Flexible Printed Circuits) components.

[0222] Furthermore, in the above-described embodiment and its modified example, the two head driving mechanisms 150 move the respective rods 152 forward and backward at the same time, but the rods 152 may be moved forward and backward at mutually different timings.

[0223] In addition, in the above-mentioned embodiment and its modified example, the crimping device 100 has two cylinders 151, but the number of cylinders 151 in the crimping device 100 may be one. In this case, one cylinder 151 may move the two rods 152 forward and backward. In other words, the number of cylinders 151 in the crimping device 100 may be any number as long as it is less than the number of the regular crimping heads 120 in the crimping device 100.

[0224] In addition, in the above-mentioned embodiment and its variant, all or part of the components of the computer 2 may include dedicated hardware, or may be implemented by executing a software program suitable for each component. Each component may also be implemented by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded in a recording medium such as a HDD (Hard Disk Drive) or a semiconductor memory. For example, the program execution unit causes the formal crimping unit 40 to execute Figure 8 The steps included in the flowchart shown.

[0225] In addition, the structural elements of the computer 2 may include one or more electronic circuits. One or more electronic circuits may be either general-purpose circuits or dedicated circuits. In one or more electronic circuits, for example, semiconductor devices, ICs (Integrated Circuits) or LSIs (Large Scale Integrations) may be included. ICs or LSIs may be integrated into one chip or multiple chips. Although they are referred to as ICs or LSIs, the names may be changed depending on the degree of integration, and may also be referred to as system LSIs, VLSIs (Very Large Scale Integrations), or ULSIs (Ultra Large Scale Integrations). In addition, FPGAs (Field Programmable Gate Arrays) programmed after the manufacture of LSIs may be used for the same purpose.

[0226] Industrial Applicability

[0227] The present disclosure can be utilized, for example, in a crimping device included in a component mounting line for producing a display panel.

Claims

1. A crimping device comprising: A plurality of crimping heads, each used for crimping a component to a substrate; A head holding portion, which holds the plurality of crimping heads respectively so as to be slidable along a first direction; A working cylinder, which enables the rod to move forward and backward along the first direction; a position changing section having a mechanism for changing the relative position of the head holding section and the rod in a second direction intersecting the first direction, and selectively switching the crimping head pressed by the entered rod along the first direction among the plurality of crimping heads by changing the relative position; and Multiple crimping units, Each of the plurality of crimping units comprises: the plurality of crimping heads held by the head holding portion; and a head driving mechanism including the cylinder and the rod. The position changing section changes the relative positions of the plurality of crimping heads and the rod included in each of the plurality of crimping units together by changing the relative positions.

2. The crimping device according to claim 1, wherein: Each of the plurality of crimping heads has a tool for contacting a component crimped to the substrate, The plurality of crimping heads have respective tools that are different in form from one another.

3. The crimping device according to claim 1, wherein: The first direction is the vertical direction, The cylinder presses any one of the plurality of crimping heads in a vertical direction by advancing the rod.

4. The crimping device according to claim 1, wherein: The second direction is a horizontal direction, The position changing unit changes the relative position by moving the head holding unit in a horizontal direction.

5. The crimping device according to any one of claims 1 to 4, wherein: The position changing section moves the head holding section in the second direction, thereby collectively changing relative positions of the plurality of crimping heads and the rod included in each of the plurality of crimping units.

6. The crimping device according to any one of claims 1 to 4, wherein: The plurality of crimping heads included in each of the plurality of crimping units are arranged at equal intervals along the second direction, The intervals at which the plurality of crimping heads are arranged to be spaced apart from each other are equal in the plurality of crimping units.

7. The crimping device according to claim 1, wherein: The crimping device also includes: A bracket is fixed to each of the plurality of crimping heads, and is used to engage with the rod for pressing the crimping head.

8. The crimping device according to claim 7, wherein: The bracket has a substantially plate-shaped engaging portion which is arranged apart from an end portion of the crimping head fixed to the bracket in the first direction, the end portion being an end portion pressed by the rod, A recess is formed in the engagement portion so that the middle portion of the rod is inserted along the second direction due to the change in the relative position. The front end portion of the rod is formed to be wider than the middle portion, The front end portion presses the end portion of the crimping head by the entry of the rod having the intermediate portion inserted into the recess. When the holding of the crimping head by the head holding portion is released, the front end portion of the rod having the intermediate portion inserted into the recess engages with the peripheral edge portion of the recess in the engaging portion in the first direction.

9. The crimping device according to claim 8, wherein: The plurality of crimping heads include a first crimping head and a second crimping head adjacent to each other, The recessed portion of the bracket fixed to the first crimping head and the recessed portion of the bracket fixed to the second crimping head face each other.

10. A crimping method, which is a method for crimping components by a crimping device, the crimping device comprising a plurality of crimping units and a head holding portion, Each of the plurality of crimping units comprises: A plurality of crimping heads, each used to crimp the components to the substrate; and a head driving mechanism, including a working cylinder and a rod, The head holding portion holds the plurality of crimping heads included in each of the plurality of crimping units so as to be slidable along a first direction. The crimping method comprises: a position changing step of changing the relative positions of the head holding portion and the respective rods of the plurality of crimping units in a second direction intersecting the first direction, thereby changing the relative positions of the plurality of crimping heads and the rods contained in each of the plurality of crimping units, and selectively switching the crimping heads pressed by the rods among the plurality of crimping heads in each of the plurality of crimping units by changing the relative positions; and In the pressing step, in each of the plurality of crimping units, the rod is advanced in the first direction by the cylinder, thereby pressing the selectively switched crimping head in the first direction.

Images