A planar array jetting step-down enhanced heat dissipation device applied to high-power light source chips

Abstract

The object of the present invention is to solve the problem of how to reduce the internal pressure of a heat dissipation device on the premise of meeting the heat dissipation capacity of the existing heat dissipation device, and to provide a surface array jet pressure reduction and enhanced heat dissipation device applied to a high-power light source chip. The heat dissipation device includes an upper sealing laminate, an upper cooling laminate, a flow guiding laminate, a lower cooling laminate, and a lower sealing laminate that are stacked on top of each other from top to bottom. A surface array jet structure is provided on the flow guiding laminate, and the surface array jet structure is composed of N×M jet holes, where N is the number of columns and M is the number of rows; inside the fourth hollow microstructure of the upper cooling laminate, a heat guiding sheet is provided at a position corresponding to the surface array jet structure. The heat guiding sheet is made of copper, diamond, or silicon carbide, and includes X ribs. The X ribs form X + 1 microchannels, and the distance between each rib and its adjacent rib is equal; the width of the outermost microchannel is greater than that of the inner side. The surface array jet structure is used for pressure reduction, and the heat guiding sheet is used to compensate for the temperature rise of the surface array jet structure.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor optoelectronic technologies, and particularly to a surface array jet step-down enhanced heat dissipation device applied to high-power light source chips. Background Art

[0002] Semiconductor light source chips are widely used in industries such as scientific research and industry, and the parameter performance requirements for light source products are gradually increasing. Generally, 20%-30% of the electric power of semiconductor light source chips is converted into heat energy, and the heat directly acts on the chips, increasing the temperature rise and affecting the reliability and lifespan of the chips. The temperature rise and efficiency form a negative feedback. If the photoelectric conversion efficiency is reduced, it will directly burn out seriously.

[0003] The design of existing semiconductor light source chip heat dissipation devices mainly improves the turbulent flow state by changing the structure of microchannels to increase the heat transfer coefficient, such as the design of a single jet hole. The design and principle of the existing heat dissipation device are shown in Figures 1-3 . The heat dissipation device includes an upper sealing laminate 05, an upper cooling laminate 04, a diversion laminate 03, a lower cooling laminate 02, and a lower sealing laminate 01 that are stacked on top of each other from top to bottom. The lower sealing laminate 01 includes a water inlet 06 and a water outlet 013 that are isolated from each other; the lower cooling laminate 02 is provided with a first hollow microstructure 07 corresponding to the position of the water inlet 06 and a third hollow microstructure 012 corresponding to the position of the water outlet 013, and the two are isolated from each other. The first hollow microstructure 07 is provided with a plurality of first cooling channels 08 of the same width formed by a plurality of rib plates. The third hollow microstructure 012 extends along both sides of the lower cooling laminate 02 to the first cooling channels 08. The lengths of the plurality of first cooling channels 08 decrease from the middle region to the two side regions; the diversion laminate 03 is provided with a plurality of jet holes 09 corresponding to the positions of the first cooling channels 08, a second hollow microstructure 011 identical to the third hollow microstructure 012, and a second water inlet 014 corresponding to the position of the first hollow microstructure 07, and the three are isolated from each other; the upper cooling laminate 04 includes a fourth hollow microstructure 015, a third water inlet 016, and a second water outlet 017 that are isolated from each other. The fourth hollow microstructure 015 is provided with a second cooling channel 010 formed by a plurality of rib plates and corresponding to the positions of the plurality of jet holes 09. The positions of the third water inlet 016 and the second water outlet 017 respectively correspond to the second water inlet 014 and the second hollow microstructure 011; the upper sealing laminate 05 includes a fourth water inlet 018 and a third water outlet 019 that are isolated from each other.

[0004] The flow direction of the cooling water is as shown in Figure 2As shown in the figure, the cooling water enters the first hollow microstructure 07 from the water inlet 06 of the lower sealing laminate 01, passes through the first cooling channel 08, then enters the second cooling channel 010 through the jet holes 09, and then enters the fourth hollow microstructure 015, the second hollow microstructure 011 and the third hollow microstructure 012 in sequence, and finally flows out from the water outlet 013.

[0005] The above heat dissipation device mainly enhances the heat transfer coefficient by improving the turbulent flow state of the internal cooling water. As Figure 3 shown, the jet holes 09 with a size of 0.20mm * 1.00mm are arranged at the top of the guiding laminate 03. Although the heat transfer coefficient is increased and the heat dissipation capacity of the heat dissipation device is improved, the effective area through which the cooling water flows accounts for a relatively small proportion, resulting in a sharp increase in the internal pressure of the heat exchange device. As a result, the driving force required for the cooling water becomes larger, which not only causes energy waste, but also requires a higher pressure resistance performance for the device, leading to a poor reliability of the heat dissipation device. Especially when multiple heat dissipation devices are assembled into a stack array, the requirements for the driving pressure and the sealing performance will be even higher. Therefore, how to reduce the internal pressure of the heat dissipation device without reducing its heat dissipation capacity, and then reduce the driving pressure of the coolant, is a technical problem that urgently needs to be solved. Summary of the Invention

[0006] The purpose of the present invention is to solve the problem of how to reduce the internal pressure of the heat dissipation device on the premise of meeting the heat dissipation capacity of the existing heat dissipation device, and provide a surface array jet pressure reduction and enhanced heat dissipation device applied to high-power light source chips.

[0007] To achieve the above purpose, the technical solutions provided by the present invention are as follows:

[0008] A surface array jet pressure reduction and enhanced heat dissipation device applied to high-power light source chips, comprising an upper sealing laminate, an upper cooling laminate, a guiding laminate, a lower cooling laminate and a lower sealing laminate which are stacked on top of each other from top to bottom;

[0009] The lower sealing laminate is provided with a first water inlet and a first water outlet that are isolated from each other;

[0010] The lower cooling laminate is provided with a first hollow microstructure and a second hollow microstructure that are isolated from each other; the position of the first hollow microstructure corresponds to the first water inlet; the first hollow microstructure is provided with a cooling channel composed of a plurality of rib plates; the position of the second hollow microstructure corresponds to the first water outlet;

[0011] The guiding laminate is provided with a second water inlet, a third hollow microstructure and a guiding structure that are isolated from each other; the position of the second water inlet corresponds to the first hollow microstructure; the position of the guiding structure corresponds to a plurality of cooling channels;

[0012] The upper cooling laminated sheet is provided with a third water inlet, a second water outlet, and a fourth hollow microstructure that are isolated from each other; the positions of the third water inlet and the second water outlet correspond to the second water inlet and the third hollow microstructure respectively.

[0013] The upper sealing laminated sheet is provided with a fourth water inlet and a third water outlet that are isolated from each other, and their positions correspond to the third water inlet and the second water outlet respectively.

[0014] Its characteristic lies in that:

[0015] The flow guiding structure is a matrix jet structure; the matrix jet structure is composed of N×M jet holes, where N is the number of columns and M is the number of rows.

[0016] Inside the fourth hollow microstructure, and at a position corresponding to the matrix jet structure on the flow guiding laminated sheet, there is a heat guiding sheet.

[0017] The heat guiding sheet is made of copper or diamond or silicon carbide, and includes X ribs. The X ribs form X + 1 microchannels, and the distance between each rib and its adjacent rib is equal; the width of the outermost microchannel is greater than the width of the inner microchannels.

[0018] Further, the jet holes are divided into rectangular jet holes and square jet holes according to their shapes.

[0019] The rectangular jet holes are provided with two columns and are arranged on both sides of the matrix jet structure; the square jet holes are provided with N - 2 columns and are arranged between the two columns of rectangular jet holes.

[0020] The width of the rectangular jet hole is equal to the side length of the square jet hole.

[0021] Further, the length of the rectangular jet hole is 0.5 mm, and the side length of the square jet hole is 0.2 mm.

[0022] Further, the lengths of the ribs are distributed in an orderly manner. The outermost three ribs are short ribs, and the lengths of the remaining ribs alternate.

[0023] Further, the width of the outermost microchannel is 0.5 mm, and the width of the inner microchannels is 0.2 mm.

[0024] Further, the fourth hollow microstructure extends along both sides of the third water inlet to the second water outlet.

[0025] Further, the second hollow microstructure includes a main flow region, two mutually symmetrical first microchannels, and two mutually symmetrical second microchannels.

[0026] The position of the main flow region corresponds to the first water outlet.

[0027] The first microchannel extends from the main flow region to the first hollow micro-structure; the second microchannel extends from the main flow region to the edge of the first microchannel and is isolated from the first microchannel;

[0028] The third hollow micro-structure is exactly the same as the second hollow micro-structure.

[0029] Furthermore, the two middle rib plates in the first hollow micro-structure are of equal length and gradually decrease towards both sides.

[0030] Furthermore, the fourth water inlet and the third water outlet have the same radius, the first water inlet, the second water inlet, the third water inlet, the first water outlet and the second water outlet have the same radius, and the radius of the fourth water inlet is greater than that of the first water inlet;

[0031] Sealing rings are provided on the fourth water inlet and the third water outlet, and the inner diameter of the sealing ring is the same as the diameter of the first water inlet.

[0032] Furthermore, the upper sealing laminate, the upper cooling laminate, the flow guiding laminate, the lower cooling laminate and the lower sealing laminate are all provided with a first positioning hole, a second positioning hole and a third positioning hole at the central position; the second positioning hole and the third positioning hole are symmetrically arranged; the five first positioning holes, the five second positioning holes and the five third positioning holes are all coaxially arranged.

[0033] The present invention has the following advantages:

[0034] 1. On the premise of ensuring the heat exchange effect, reduce the internal pressure. The present invention reduces the internal pressure of the heat dissipation device by setting up a surface array injection structure. Compared with a row of jet holes in the prior art, the present invention increases the effective fluid flow area, reduces the pressure, thereby reducing the driving force of the cooling water, saving energy, reducing the requirement of the heat dissipation device for pressure resistance performance, improving its reliability, and being not affected by the disturbance of the cooling water at different positions on the plane. Since the flow area increases and the cooling water flow rate decreases, the chip temperature rise increases significantly. In order to compensate for the reduction in the heat transfer coefficient caused by the decrease in the cooling water flow rate, the present invention also sets up a heat guiding sheet to improve the heat transfer efficiency. The heat flow is transferred from the upper sealing laminate to the heat guiding sheet and converges with the cooling water to generate heat exchange and take away the heat. The heat flow guiding sheet plays a role as a bridge for guiding and transferring heat, and thus has the purpose of controlling the surface temperature uniformity. The reason is that the heat guiding sheet is made of a material with a relatively high thermal conductivity, such as a solid copper sheet, whose thermal conductivity is close to 400 W / m·K, much larger than the thermal conductivity of fluids such as water, which is 0.55 - 0.6 W / m·K. And compared with the second cooling channel in the prior art, the microchannels on the heat guiding sheet in the present invention are arranged more densely, increasing the heat exchange area with the cooling water and strengthening the heat exchange. Compared with the structure of the prior art, in the cooling test with the same heat generation power and the same flow rate, the pressure of the present invention is reduced by 86%, and the temperature of the high-power light source chip changes little, rising slightly by 1°C.

[0035] 2. Further reduce the pressure through other settings. The fourth hollow microstructure in the prior art only extends to the third water inlet, and the area ratio of the connection with the second hollow structure is small. While the fourth hollow structure in the present invention extends to the second water outlet, and the area ratio of the connection with the third hollow structure is large, improving its flow space, eliminating resistance, and reducing the pressure. In addition, the second hollow microstructure in the present invention includes a main flow region, a first microchannel, and a second microchannel that do not communicate with each other. The first microchannel extends to both sides of the first hollow structure, and the second microchannel extends to the first microchannel. Compared with the second hollow microstructure and the third hollow microstructure in the prior art, its area ratio is larger, and thus the flow space of the cooling water is larger, which is beneficial to the outflow of the cooling water and reduces the pressure. Description of the Drawings

[0036] Figure 1 is the overall structural schematic diagram of the light source chip heat dissipation device in the background art;

[0037] Figure 2 is the exploded schematic diagram of the light source chip heat dissipation device in the background art (the black arrow represents the flow direction of the cooling water);

[0038] Figure 3 is the structural schematic diagram of each layer of the light source chip heat dissipation device in the background art;

[0039] Figures 1 to 3 The reference numerals are as follows:

[0040] 01 - Lower sealing laminate, 02 - Lower cooling laminate, 03 - Flow - guiding laminate, 04 - Upper cooling laminate, 05 - Upper sealing laminate, 06 - Water inlet, 07 - First hollow microstructure, 08 - First cooling channel, 09 - Jet hole, 010 - Second cooling channel, 011 - Second hollow microstructure, 012 - Third hollow microstructure, 013 - Water outlet, 014 - Second water inlet, 015 - Fourth hollow microstructure, 016 - Third water inlet, 017 - Second water outlet, 018 - Fourth water inlet, 019 - Third water outlet;

[0041] Figure 4 is a schematic diagram of the overall structure of the area - array jetting pressure - reducing and heat - strengthening device in the embodiment of the present invention;

[0042] Figure 5 is an exploded - view structure schematic diagram of the area - array jetting pressure - reducing and heat - strengthening device in the embodiment of the present invention (the thick arrow represents the flow direction of the cooling water, and the thin arrow represents the heat transfer direction);

[0043] Figure 6 is a schematic diagram of the structure of each layer of the area - array jetting pressure - reducing and heat - strengthening device in the embodiment of the present invention;

[0044] Figure 7 is a schematic diagram of the structure of the lower sealing laminate in the embodiment of the present invention;

[0045] Figure 8 is a schematic diagram of the structure of the lower cooling laminate in the embodiment of the present invention;

[0046] Figure 9 is a schematic diagram of the structure of the flow - guiding laminate in the embodiment of the present invention;

[0047] Figure 10 is a schematic diagram of the structure of the upper cooling laminate in the embodiment of the present invention;

[0048] Figure 11 is a schematic diagram of the structure of the upper sealing laminate in the embodiment of the present invention;

[0049] Figure 12 is a schematic diagram of the area - array jetting structure in the embodiment of the present invention;

[0050] Figure 13 is a schematic diagram of the structure of the heat - guiding sheet in the embodiment of the present invention

[0051] Figures 4 to 12 The reference numerals are as follows:

[0052] 1 - Upper sealing laminate, 2 - Upper cooling laminate, 3 - Flow guiding laminate, 4 - Lower cooling laminate, 5 - Lower sealing laminate, 6 - First water inlet, 7 - First water outlet, 8 - First hollow microstructure, 9 - Second hollow microstructure, 91 - Main flow area, 92 - First microchannel, 93 - Second microchannel, 10 - Cooling channel, 11 - Second water inlet, 12 - Third hollow microstructure, 13 - Area array injection structure, 131 - Rectangular injection hole, 132 - Rectangular injection hole, 14 - Third water inlet, 15 - Second water outlet, 16 - Fourth hollow microstructure, 17 - Heat guiding sheet, 18 - Fourth water inlet, 19 - Third water outlet, 20 - First positioning hole, 21 - Second positioning hole, 22 - Third positioning hole, 23 - Microchannel. Detailed implementation manners

[0053] The technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings.

[0054] An area array injection step-down enhanced heat dissipation device applied to a high-power light source chip, as Figures 4 to 6 shown, includes an upper sealing laminate 1, an upper cooling laminate 2, a flow guiding laminate 3, a lower cooling laminate 4 and a lower sealing laminate 5 which are stacked on top of each other from top to bottom and have a length of 28m and a width of 11.30mmm.

[0055] As Figure 7 shown, a first water inlet 6 and a first water outlet 7 which are isolated from each other are arranged on the lower sealing laminate 5.

[0056] As Figure 8 shown, a first hollow microstructure 8 and a second hollow microstructure 9 which are isolated from each other are arranged on the lower cooling laminate 4. The positions of the first hollow microstructure 8 and the second hollow microstructure 9 respectively correspond to the first water inlet 6 and the first water outlet 7. The widest length of the connection between the first hollow microstructure 8 and the first water inlet 6 is 6.00mm; a cooling channel 10 composed of several rib plates is arranged in the first hollow microstructure 8. Since the temperatures at both sides of the high-power light source chip are lower and the temperature in the middle is higher during use, the lengths of several rib plates in the first hollow microstructure 8 are designed such that the two rib plates in the middle are of equal length and gradually decrease towards both sides in turn, so that the heat exchange effect in the middle area is better than that on both sides, improving the temperature uniformity between the two sides and the middle of the chip. As Figure 8 can be seen, the rib plates on the lower cooling laminate 4 are symmetrically arranged. The lengths of the upper rib plates are 1.85mm, 2.85mm, 3.35mm, 6mm in turn, and the widths of the cooling channels 10 formed by them are 0.90mm, 1.00mm, 0.60mm, 1.00mm, 1.40mm in turn.

[0057] In addition, the second hollow microstructure 9 includes a main flow region 91, two symmetric first microchannels 92, and two symmetric second microchannels 93. The position of the main flow region 91 corresponds to the first water outlet 7, and its diameter is 6 mm. The first microchannel 92 extends from the main flow region 91 to the first hollow microstructure 8, and the maximum width of the first microchannel 92 is 1.85 mm. The second microchannel 93 extends from the main flow region 91 to the edge of the first microchannel 92 and is isolated from the first microchannel 92. Compared with the third hollow microstructure of the prior art, the second microchannel 93 is added, increasing the flow space of the cooling water and facilitating the reduction of the internal pressure of the heat dissipation device.

[0058] As Figure 9 shown, the diversion stack 3 is provided with a second water inlet 11, a third hollow microstructure 12, and a matrix jet structure 13 that are isolated from each other. The position of the second water inlet 11 corresponds to the first hollow microstructure 8; the position of the matrix jet structure 13 corresponds to a plurality of cooling channels 10. The third hollow microstructure 12 is exactly the same as the second hollow microstructure 9.

[0059] As Figure 12 shown, the matrix jet structure 13 is composed of 24×6 (24 columns and 6 rows) jet holes. The jet holes in each column are arranged at equal intervals, and it has stronger support ability compared with the all-hollow structure. The jet holes are divided into rectangular jet holes 131 and square jet holes 132 according to their shapes. There are two columns of rectangular jet holes 131, which are arranged on both sides of the matrix jet structure 13, and there are 22 columns of square jet holes 132, which are arranged between the two columns of rectangular jet holes 131. The length of the rectangular jet hole 131 is 0.5 mm, and the width is 0.2 mm. The side length of the square jet hole 132 is 0.2 mm. In addition, for the single-row jet holes in the prior art, there is no obvious guiding measure for heat transfer, and it is impossible to adjust the heat according to the heat generation situation of the actual high-power light source chip, resulting in uneven temperature distribution of the high-power light source chip. However, the matrix jet structure 13 of the present invention is provided with two columns of rectangular jet holes 131. Since the temperature rise in the middle of the high-power light source chip is higher than that on both sides, and the length of the rectangular jet hole 131 is long, the flow area of the cooling water here is larger than that of the square jet hole 132, the flow velocity here is lower, and the heat dissipation ability is less than that of the square jet hole 132, thereby improving the uniformity of the surface temperature of the high-power light source chip. The design of the matrix jet structure 13 can be applied to similar heat dissipation device designs, not limited to this type of microchannel heat dissipation.

[0060] As Figure 10As shown in the figure, the upper cooling laminated sheet 2 is provided with a third water inlet 14, a second water outlet 15, and a fourth hollow microstructure 16 that are isolated from each other. The positions of the third water inlet 14 and the second water outlet 15 respectively correspond to the second water inlet 11 and the third hollow microstructure 12. The fourth hollow microstructure 16 extends along both sides of the third water inlet 14 to the second water outlet 15, and the area communicating with the third hollow structure 12 accounts for a large proportion, increasing its flow space, eliminating resistance, and reducing pressure. In the background technology, the fourth hollow microstructure only extends to the third water inlet, and the area communicating with the second hollow structure accounts for a small proportion, with relatively large resistance and high pressure.

[0061] Inside the fourth hollow microstructure 16, a heat guiding sheet 17 is provided at a position corresponding to the surface array ejection structure 13 on the flow guiding laminated sheet 3. As Figure 13 shown, the heat guiding sheet 17 includes 23 ribs. The 23 ribs form 24 micro-channels 23, and the distance between each rib and its adjacent rib is equal. The width of the outermost micro-channel 23 is greater than the width of the inner micro-channel 23, and the lengths of the ribs are distributed in an orderly manner. The outermost three ribs are short ribs, and the rest of the ribs are alternately long and short. The width of the outermost micro-channel 23 is 0.5 mm, and the width of the inner micro-channel 23 is 0.2 mm. The reason for this design is that the temperature rise in the middle of the high-power light source chip is higher than that on both sides, in order to enhance the uniformity of the surface temperature of the high-power light source chip. The ribs are made of materials with relatively high thermal conductivity, such as copper, diamond, or silicon carbide. The ribs in the heat guiding sheet 17 can be in a straight structure or a curved structure.

[0062] As Figure 11 shown, the upper sealing laminated sheet 1 is provided with a fourth water inlet 18 and a third water outlet 19 that are isolated from each other, and their positions respectively correspond to the third water inlet 14 and the second water outlet 15.

[0063] As a further optimization of the present invention, the radii of the fourth water inlet 18 and the third water outlet 19 are equal, being 8 mm. The radii of the first water inlet 6, the second water inlet 11, the third water inlet 14, the first water outlet 7, and the second water outlet 15 are equal, being 6 mm, and the radius of the fourth water inlet 18 is greater than the radius of the first water inlet 6; Sealing rings are provided on the fourth water inlet 18 and the third water outlet 19, and the inner diameter of the sealing ring is the same as the diameter of the first water inlet 6.

[0064] As a further optimization of the present invention, as Figure 4 、 Figure 5As shown in the figure, in order to facilitate positioning during multi-layer laminate installation, a first positioning hole 20 (with a diameter of 4.7 mm), a second positioning hole 21, and a third positioning hole 22 are provided at the center positions of the upper sealing laminate 1, the upper cooling laminate 2, the flow guiding laminate 3, the lower cooling laminate 4, and the lower sealing laminate 5; the second positioning hole 21 and the third positioning hole 22 are symmetrically arranged; the five first positioning holes 20, the five second positioning holes 21, and the five third positioning holes 22 are all coaxially arranged. The provision of the first positioning hole 20, the second positioning hole 21, and the third positioning hole 22 is also beneficial for the installation of multiple heat dissipation devices stacked one above the other from top to bottom. When installing, the alignment of the upper sealing laminate 5, the upper cooling laminate 4, the flow guiding laminate 3, the lower cooling laminate 2, and the lower sealing laminate 1 in a straight line can be ensured by inserting a pin shaft, improving the assembly accuracy and efficiency.

[0065] When stacking the above heat dissipation devices from top to bottom in sequence to form a stack array, due to the provision of the surface array spraying structure 13 and the heat guiding sheet 17, compared with the existing stack array, the requirements for the driving pressure of the cooling water and the sealing performance are lower, which is beneficial for saving energy and improving its reliability.

[0066] The specific flow direction of the cooling water in the present invention is as follows:

[0067] As Figure 5 shown in the figure, the cooling water enters the first hollow microstructure 8 from the first water inlet 6, flows into each cooling channel 10, and then enters each micro-channel 23 on the heat guiding sheet 17 through the surface array spraying structure 13. Since the chip is located at the position corresponding to the upper sealing laminate 1 and the heat guiding sheet 17, at this time, the heat of the chip is transferred to the heat guiding sheet 17. After the cooling water exchanges heat with the heat guiding sheet 17 and takes away the heat, the cooling water then flows out through the fourth hollow microstructure 16, the third hollow microstructure 12, the second hollow microstructure 9, and the first water outlet 7, meeting the conditions for recycling.

[0068] The structural principle of the present invention lies in that: the surface array spraying structure 13 increases the effective flow area of the cooling water and reduces the pressure. However, the simple surface array spraying structure 13 will surely reduce the flow rate of the cooling water, causing a significant increase in the chip temperature rise. To compensate for the reduction in the convective heat transfer coefficient caused by the reduction in the cooling water flow rate, a heat guiding sheet is provided to strengthen the guiding of the heat generated by the high-power light source chip to the cooling water in the micro-channel 23 through the heat transfer method of a solid (the heat guiding sheet 17). The heat guiding sheet 17 plays a role of bridging and guiding, improving the convective heat transfer coefficient. Combining the surface array spraying structure 13 with the heat guiding sheet 17 can reduce the internal pressure while ensuring the heat exchange effect.

[0069] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A matrix jetting step-down enhanced heat dissipation device for a high-power light source chip, comprising an upper sealing laminate (1), an upper cooling laminate (2), a flow guiding laminate (3), a lower cooling laminate (4) and a lower sealing laminate (5) which are stacked on top of each other from top to bottom; A first water inlet (6) and a first water outlet (7) which are isolated from each other are arranged on the lower sealing laminate (5); A first hollow microstructure (8) and a second hollow microstructure (9) which are isolated from each other are arranged on the lower cooling laminate (4); the position of the first hollow microstructure (8) corresponds to the first water inlet (6); a cooling channel (10) formed by a plurality of rib plates is arranged in the first hollow microstructure (8); the position of the second hollow microstructure (9) corresponds to the first water outlet (7); A second water inlet (11), a third hollow microstructure (12) and a flow guiding structure are arranged on the flow guiding laminate (3) and are isolated from each other; the position of the second water inlet (11) corresponds to the first hollow microstructure (8); the position of the flow guiding structure corresponds to a plurality of cooling channels (10); A third water inlet (14), a second water outlet (15) and a fourth hollow microstructure (16) which are isolated from each other are arranged on the upper cooling laminate (2); the positions of the third water inlet (14) and the second water outlet (15) correspond to the second water inlet (11) and the third hollow microstructure (12) respectively; A fourth water inlet (18) and a third water outlet (19) which are isolated from each other are arranged on the upper sealing laminate (1), and their positions correspond to the third water inlet (14) and the second water outlet (15) respectively; It is characterized in that: The flow guiding structure is a matrix jetting structure (13); the matrix jetting structure (13) is composed of N×M jetting holes, where N is the number of columns and M is the number of rows; the matrix jetting structure (13) is used to increase the effective flow area of cooling water; A heat guiding sheet (17) is arranged at a position corresponding to the matrix jetting structure (13) on the flow guiding laminate (3) inside the fourth hollow microstructure (16); The heat guiding sheet (17) is made of copper or diamond or silicon carbide and includes X rib strips. The X rib strips form X + 1 micro-channels (23), and the distance between each rib strip and its adjacent rib strip is equal. The lengths of the rib strips are distributed in an orderly manner; the width of the outermost micro-channel (23) is greater than the width of the inner micro-channel (23).

2. The area array jet step-down enhanced heat dissipation device applied to a high-power light source chip according to claim 1, wherein: The jetting holes are divided into rectangular jetting holes (131) and square jetting holes (132) according to their shapes; There are two columns of the rectangular jetting holes (131), and they are arranged on both sides of the matrix jetting structure (13); there are N - 2 columns of the square jetting holes (132), and they are arranged between the two columns of rectangular jetting holes (131); The width of the rectangular jetting holes (131) is equal to the side length of the square jetting holes (132).

3. The matrix jet step-down enhanced heat dissipation device for a high-power light source chip according to claim 2, wherein: The length of the rectangular jetting holes (131) is 0.5 mm, and the side length of the square jetting holes (132) is 0.2 mm.

4. The area array jetting step-down enhanced heat dissipation device applied to a high-power light source chip according to claim 3, characterized in that: The outermost three rib strips are short rib strips, and the lengths of the remaining rib strips are alternately distributed.

5. The matrix jet step-down enhanced heat dissipation device applied to a high-power light source chip according to claim 4, characterized in that: The width of the outermost micro-channel (23) is 0.5 mm, and the width of the inner micro-channel (23) is 0.2 mm.

6. The area array jet step-down enhanced heat dissipation device applied to a high-power light source chip according to claim 5, wherein: The fourth hollow micro-structure (16) extends along both sides of the third water inlet (14) to the second water outlet (15).

7. The matrix injection step-down enhanced heat dissipation device for a high-power light source chip according to claim 6, characterized in that: The second hollow micro-structure (9) includes a main flow area (91), two symmetric first micro-channels (92) and two symmetric second micro-channels (93); The position of the main flow area (91) corresponds to the first water outlet (7); The first micro-channel (92) extends from the main flow area (91) to the first hollow micro-structure (8); the second micro-channel (93) extends from the main flow area (91) to the edge of the first micro-channel (92) and is isolated from the first micro-channel (92); The third hollow micro-structure (12) is exactly the same as the second hollow micro-structure (9).

8. The surface array jet pressure reduction and enhanced heat dissipation device applied to a high-power light source chip according to claim 7, wherein: The two middle ribs in the first hollow micro-structure (8) are of equal length and gradually decrease towards both sides.

9. A planar array jet step-down enhanced heat dissipation device applied to a high-power light source chip according to any one of claims 1-8, characterized in that: The fourth water inlet (18) and the third water outlet (19) have the same radius. The first water inlet (6), the second water inlet (11), the third water inlet (14), the first water outlet (7) and the second water outlet (15) have the same radius, and the radius of the fourth water inlet (18) is greater than that of the first water inlet (6); Sealing rings are provided on the fourth water inlet (18) and the third water outlet (19), and the inner diameter of the sealing ring is the same as the diameter of the first water inlet (6).

10. A matrix jet step-down enhanced heat dissipation device applied to a high-power light source chip according to claim 9, characterized in that: The upper sealing laminate (1), the upper cooling laminate (2), the flow guiding laminate (3), the lower cooling laminate (4) and the lower sealing laminate (5) are all provided with a first positioning hole (20), a second positioning hole (21) and a third positioning hole (22) at the central position; the second positioning hole (21) and the third positioning hole (22) are symmetrically arranged; the five first positioning holes (20), the five second positioning holes (21) and the five third positioning holes (22) are all coaxially arranged.

Images