Suspension transportation equipment and laser processing equipment

Abstract

The present invention relates to a suspension transport device and a laser processing device. The suspension transport device according to an embodiment includes a suspension unit configured to suspend a substrate by ejecting gas onto the lower surface of the substrate. The suspension unit includes: a plurality of ejection ports provided on the surface facing the substrate and configured to eject gas; and a slit penetrating the suspension unit in the vertical direction. The suspension transport device is configured such that the gas trapped between the surface of the suspension unit facing the substrate and the substrate is discharged to the lower surface side of the suspension unit via the slit.

Description

Technical Field

[0001] The present invention relates to a suspension transport device and a laser processing device. In particular, the present invention relates to a suspension transport device and a laser processing device for transporting a substrate while suspending the substrate. Background Art

[0002] In the process of manufacturing a liquid crystal display panel, an organic EL panel, etc., since the substrate to be used is large, a suspension transport device for transporting the substrate while suspending the substrate is widely used. Japanese Unexamined Patent Application Publication No. 2019-192681 discloses a technology related to a suspension transport device that suspends and transports a substrate by blowing air onto the substrate. Summary of the Invention

[0003] The problem is that in a suspension transport device that transports a substrate while suspending the substrate, the suspension amount of the substrate changes. In particular, a laser processing device for irradiating a laser beam onto a substrate is required to improve the suspension accuracy of the substrate because the change in the suspension amount of the substrate greatly affects the quality of a thin film or the like on the substrate after laser processing.

[0004] Based on the description of this specification and the drawings, other problems and novel features will become easily understandable.

[0005] An exemplary aspect is a suspension transport device including a suspension unit that suspends a substrate by ejecting a gas onto the lower surface of the substrate. The suspension unit includes: a plurality of ejection ports provided on a surface facing the substrate and configured to eject the gas; and a slit penetrating the suspension unit in the vertical direction. The suspension transport device is configured such that the gas trapped between the surface of the suspension unit facing the substrate and the substrate is discharged to the lower surface side of the suspension unit via the slit.

[0006] A laser processing device according to an example aspect includes the above-described suspension transport device and a laser generation unit configured to generate a laser beam to be applied to a substrate.

[0007] According to the above aspects, a suspension transport device and a laser processing device that can improve the suspension accuracy of a substrate can be provided.

[0008] Based on the detailed description and the drawings given below, the above and other objects, features, and advantages of the present disclosure will be more fully understood. The drawings are given only by way of illustration and should not be regarded as limiting the present disclosure. Brief Description of the Drawings

[0009] Figure 1 A cross-sectional view of the suspension transport device for the first embodiment.

[0010] Figure 2 Top view of the upper plate of the levitation unit included in the levitation transportation device.

[0011] Figure 3 Top view of the lower plate of the levitation unit included in the levitation transportation device.

[0012] Figure 4 Cross-sectional view of the levitation transportation device of the first embodiment.

[0013] Figure 5 Cross-sectional view of the levitation transportation device of the prior art.

[0014] Figure 6 Top view of the laser processing device adopting the levitation transportation device of the second embodiment.

[0015] Figure 7 Top view of the laser processing device adopting the levitation transportation device of the second embodiment.

[0016] Figure 8 Top view of the laser processing device adopting the levitation transportation device of the third embodiment.

[0017] Figure 9 Top view of the laser processing device adopting the levitation transportation device of the third embodiment.

[0018] Figure 10 Top view of the laser processing device adopting the levitation transportation device of the fourth embodiment. Specific embodiments

[0019] First embodiment

[0020] The following describes the first embodiment with reference to the accompanying drawings. Figure 1 Cross-sectional view of the levitation transportation device of the first embodiment. As Figure 1 shown, the levitation transportation device 1 of this embodiment is a device that transports the substrate 30 in the transportation direction (the positive direction of the x-axis) while levitating the substrate 30 by jetting gas onto the lower surface of the substrate 30.

[0021] As Figure 1 shown, the levitation transportation device 1 according to this embodiment includes a levitation unit 5. The levitation unit 5 is composed of an upper plate 10 and a lower plate 20. The upper plate 10 is disposed on the upper side (the positive side in the z-axis direction) of the levitation transportation device 1. The lower plate 20 is arranged below the upper plate 10 (the negative side in the z-axis direction). For example, the upper plate 10 and the lower plate 20 can be made of a metal material such as aluminum alloy, and the metal material can be optionally plated.

[0022] Figure 2 Top view of the upper plate 10 of the levitation unit 5 included in the levitation transportation device 1. AsFigure 2 As shown, a plurality of ejection ports 11 for ejecting gas upward are provided on the surface of the upper plate 10 (the surface facing the substrate 30). As Figure 1 shown, the suspension transport device 1 of the present embodiment ejects gas from the plurality of ejection ports 11 toward the positive side in the z-axis direction, and causes the ejected gas to collide with the lower surface of the substrate 30, thereby suspending the substrate 30. By moving the substrate 30 in the transport direction (the positive direction of the x-axis) using a transport unit described below, the substrate 30 can be transported in the transport direction while being suspended.

[0023] In Figure 2 the example shown, the plurality of ejection ports 11 are regularly arranged at a predetermined interval in the x-axis direction and the y-axis direction. However, in the present embodiment, the arrangement of the plurality of ejection ports 11 is not limited to Figure 2 the arrangement shown, and can be any arrangement. Further, a slit 50 is formed in the upper plate 10. The slit 50 is arranged to penetrate the suspension unit 5 (upper plate 10) in the vertical direction. Details of the slit 50 will be described below. A plurality of through holes 13 are formed near the outer periphery of the upper plate 10, and leveling bolts 42 (refer to Figure 1 ) described later are inserted into the through holes 13.

[0024] Figure 3 is a plan view of the lower plate 20 of the suspension unit 5 included in the suspension transport device 1. As Figure 3 shown, a plurality of flow paths 21_1, 21_2, 22_1, and 22_2 for supplying gas to the plurality of ejection ports 11 included in the upper plate 10 are formed on the upper surface of the lower plate 20 (the surface on the positive side in the z-axis direction).

[0025] Specifically, as Figure 3 shown, a first flow path 21_1 and 21_2 and a second flow path 22_1 and 22_2 are provided on the surface of the lower plate 20. In the following description, the first flow path 21_1 and 21_2 are collectively referred to as the first flow path 21. Similarly, the second flow path 22_1 and 22_2 are collectively referred to as the second flow path 22, and the gas supply ports 27_1 and 27_2 are collectively referred to as the gas supply port 27.

[0026] The first flow path 21_1 is provided on the positive side in the y-axis direction of the lower plate 20 and extends in the x-axis direction. Gas is supplied to the first flow path 21_1 from two gas supply ports 27_1. Similarly,

[0027] The first flow path 21_2 is provided on the negative side in the y-axis direction of the lower plate 20 and extends in the x-axis direction. Gas is supplied to the first flow path 21_2 from two gas supply ports 27_2.

[0028] The second flow path 22_1 is a flow path for supplying gas from the gas supply port 27_1 to the plurality of ejection ports 11 provided on the positive side of the y-axis of the lower plate 20 via the first flow path 21_1 (refer to Figure 2 ). Specifically, the end of the second flow path 22_1 on the upstream side is connected to the first flow path 21_1, and each end 23_1 of the second flow path 22_1 on the downstream side is connected to the ejection port 11 (refer to Figure 2 ).

[0029] Similarly, the second flow path 22_2 is a flow path for supplying gas from the gas supply port 27_2 to the plurality of ejection ports 11 provided on the negative side in the y-axis direction of the lower plate 20 via the first flow path 21_2 (refer to Figure 2 ). Specifically, the end of the second flow path 22_2 on the upstream side is connected to the first flow path 21_2, and each end 23_2 of the second flow path 22_2 on the downstream side is connected to each ejection port 11 (refer to Figure 2 ).

[0030] In Figure 3 the illustrated example, the cross-sectional area of the first flow path 21 is configured to be larger than the cross-sectional area of the second flow path 22. That is, since the first flow path 21 is a flow path for supplying gas from the gas supply port 27 to each second flow path 22, the amount of gas flowing through the first flow path 21 is larger than the amount of gas flowing through the second flow path 22. Therefore, by making the cross-sectional area of the first flow path 21 larger than the cross-sectional area of the second flow path 22, the resistance of the flow path from the gas supply port 27 to the ejection port 11 can be reduced. This reduces the pressure loss of the gas and enables the gas maintained at a pressure substantially the same as the pressure of the gas supplied to the gas supply port 27 to be supplied to the ejection port 11.

[0031] Figure 3 The illustrated arrangement of the first flow path 21 and the second flow path 22 is an example, and in the present embodiment, the arrangement and number of the first flow path 21 and the second flow path 22 can be freely determined. That is, the arrangement and number of the first flow path 21 and the second flow path 22 can be freely determined as long as the first flow path 21 and the second flow path 22 are configured to supply gas from the gas supply port 27 to the ejection port 11 via the first flow path 21 and the second flow path 22.

[0032] A slit 50 is provided in the lower plate 20. The slit 50 is configured to penetrate the suspension unit 5 (lower plate 20) in the vertical direction. That is, the position of the slit 50 in the lower plate 20 corresponds to the position of the slit 50 in the upper plate 10. Details of the slit 50 will be described later. A through hole 28 is formed near the outer periphery of the lower plate 20, and a leveling bolt 42 (refer to Figure 1 ) described later is inserted into the through hole 28. The position of the through hole 28 in the lower plate 20 corresponds to the position of the through hole 13 in the upper plate 10.

[0033] In the present embodiment, the upper plate 10 and the lower plate 20 are fastened to each other by a plurality of fastening bolts 41 (see Figure 1 and Figure 4 ). For example, the upper plate 10 and the lower plate 20 can be fastened to each other by a plurality of fastening bolts 41 inserted from the side of the lower plate 20.

[0034] As Figure 1 shown, a plurality of leveling bolts 42 protruding downward from the lower surface of the suspension unit 5 are provided in the suspension unit 5. In the present embodiment, the suspension unit 5 (suspension transport device 1) is mounted on the mounting surface 35 by bringing the plurality of leveling bolts 42 into contact with the mounting surface 35.

[0035] The leveling bolts 42 are provided in through holes 13 and 28 formed in the upper plate 10 and the lower plate 20 of the suspension unit 5, and are configured to move positions in the up-and-down direction (z-axis direction) within the through holes 13 and 28. For example, the leveling bolts 42 are configured to be threadedly coupled to the suspension unit 5. By rotating the leveling bolts 42, the protruding amount of the leveling bolts 42 protruding from the lower surface of the suspension transport device 1 can be changed.

[0036] As described above, the suspension transport device 1 according to the present embodiment supplies gas from the gas supply port 27 to the ejection port 11 via the first flow path 21 and the second flow path 22. Therefore, as Figure 1 shown, gas can be ejected from the plurality of ejection ports 11 to the lower surface of the substrate 30, thereby suspending the substrate 30. Although the substrate 30 is typically a glass substrate, the substrate 30 transported by the suspension transport device 1 is not limited to a glass substrate.

[0037] A gas supply port 27 for supplying gas to the flow paths 21 and 22 provided on the lower plate 20 is provided on the lower surface of the lower plate 20 (see Figure 3 ). As Figure 1 shown, when the leveling bolts 42 are brought into contact with the mounting surface 35 to mount the suspension transport device 1, a space is formed between the lower surface (lower plate 20) of the suspension unit 5 and the mounting surface 35. Pipes can be arranged in this space, and gas can be supplied to the gas supply port 27 through these pipes.

[0038] In this embodiment, the suspension transport device 1 can be composed of one suspension unit 5, or a plurality of suspension units 5 can be combined to constitute the suspension transport device 1.

[0039] As described above, slits 50 are formed in both the upper plate 10 and the lower plate 20 constituting the suspension unit 5. As Figure 4As shown, the slit 50 penetrates the suspension unit 5 in the vertical direction. In the suspension transport device 1 according to the present embodiment, by providing the slit 50 in the suspension unit 5, the gas trapped between the surface of the suspension unit 5 facing the substrate 30 and the substrate 30 can be discharged to the lower surface side of the suspension unit 5 via the slit 50.

[0040] More specifically, as Figure 4 shown, since the suspension unit 5 is mounted on the mounting surface 35 using a plurality of leveling bolts 42, a space 45 is formed between the lower surface of the suspension unit 5 and the mounting surface 35. Therefore, the gas trapped between the upper surface (the surface facing the substrate 30) of the suspension unit 5 and the substrate 30 is discharged into the space 45 between the lower surface of the suspension unit 5 and the mounting surface 35 via the slit 50. The gas discharged into the space 45 between the lower surface of the suspension unit 5 and the mounting surface 35 passes through the gaps between the leveling bolts 42 (in Figure 2 and Figure 4 the air flow is shown by way of example with the arrow 46), and the gas is discharged to the outside.

[0041] More specifically, when the substrate 30 is suspended in a state where the substrate 30 covers the entire surface of the suspension unit 5, the gas may stay near the central portion of the suspension unit 5 (near the inside of the suspension unit 5). When the substrate 30 is suspended in a state where the substrate 30 covers a part of the suspension unit 5, the gas is likely to stay near the central portion of the upper surface of the suspension unit 5 covered by the substrate 30 (near the inside of the suspension unit 5). In the suspension transport device 1 according to the present embodiment, in the above manner, the gas remaining between the upper surface of the suspension unit 5 and the substrate 30 is discharged into the space 45 between the lower surface of the suspension unit 5 and the mounting surface 35 via the slit 50. The gas near the end of the suspension unit 5 and the gas near the end of the substrate 30 are discharged in the lateral surface (xy plane) direction of the space formed between the suspension unit 5 and the substrate 30.

[0042] As described above, in the suspension transport device 1 of the present embodiment, the gas trapped between the suspension unit 5 and the substrate 30 can be discharged to the lower surface side of the suspension unit 5 through the slit 50. Therefore, it is possible to effectively prevent the gas that has been ejected onto the substrate 30 from staying between the suspension unit 5 and the substrate 30, thereby stabilizing the posture of the suspended substrate 30. Therefore, a suspension transport device 1 can be provided that can improve the suspension accuracy of the substrate 30.

[0043] Figure 5 It is a cross-sectional view for explaining a conventional suspension transport device. Figure 5 The shown suspension transport device 101 according to the prior art and Figure 4The suspended transport device 1 according to the present embodiment shown is different in that the slit 50 is not provided in the suspended transport device 101. Except for the slit 50, the structure of the suspended transport device 101 according to the prior art is the same as that of the suspended transport device 1 according to the present embodiment. In Figure 5 In the suspended transport device 101 according to the prior art shown, each component is represented by a number in the 100 series. More specifically, the suspended transport device 101 includes a suspension unit 105, fastening bolts 141, and leveling bolts 142. The suspension unit 105 includes an upper plate 110 and a lower plate 120.

[0044] As Figure 5 shown, the suspended transport device 101 according to the prior art transports the substrate 130 while suspending the substrate 130 by ejecting gas from the suspension unit 130 to the lower surface of the substrate 130. At this time, in the suspended transport device 101 according to the prior art, a part of the gas ejected onto the substrate 130 may stay between the suspension unit 105 and the substrate 130, and thus an air accumulation 133 may be formed. That is, when the amount of gas ejected from the suspension unit 105 and discharged to the outside is small, the gas may stay near the central portion between the substrate 130 and the suspension unit 105 (close to the inside of the suspension unit 105), and an air accumulation 133 may be formed. When the air accumulation 133 is formed in this way, the attitude of the suspended substrate 130 becomes unstable. Specifically, as Figure 5 shown, the substrate 130 floats to a large extent on the portion where the air accumulation 133 is formed (the central portion of the substrate 130), and the amount of suspension at the end of the substrate 130 decreases. As described above, when the amount of suspension at the end of the substrate 130 decreases, the problem is that when transporting the substrate 130, a part of the substrate 130 comes into contact with the suspension unit 105. For comparison, in Figure 5 the substrate 30 suspended in the suspended transport device 1 according to the present embodiment shown in Figure 4 is indicated by a dashed line.

[0045] On the other hand, in the suspended transport device 1 according to the present embodiment, as Figure 4 shown, a slit 50 penetrating the suspension unit 5 in the vertical direction is provided, and the gas staying between the suspension unit 5 and the substrate 30 is discharged to the lower surface side of the suspension unit 5 through the slit 50. Therefore, it is possible to effectively prevent the gas ejected onto the substrate 30 from staying between the suspension unit 5 and the substrate 30 and prevent the generation of air accumulation, thereby stabilizing the posture of the suspended substrate 30. In this way, a suspended transport device 1 can be provided, which can improve the suspension accuracy of the substrate.

[0046] In addition, in the levitation transport device 1 according to the present embodiment, since the slit 50 is provided to discharge the gas trapped between the levitation unit 5 and the substrate 30, there is no need to provide a separate suction device to discharge the gas trapped between the levitation unit 5 and the substrate. Therefore, the gas trapped between the levitation unit 5 and the substrate 30 can be discharged while simplifying the structure of the levitation transport device 1.

[0047] In addition, the levitation transport device 1 of the present embodiment may also be configured such that the density of the ejection ports 11 provided around the slit 50 is higher than the density of the ejection ports 11 provided in other regions of the levitation unit 5. In other words, the number of ejection ports 11 per unit area provided around the slit 50 may be greater than the number of ejection ports 11 per unit area provided in other regions of the levitation unit 5. For example, in Figure 2 the structural example shown, the number of ejection ports 11 per unit area provided around the slit 50 is greater than the number of ejection ports 11 per unit area in the region without the slit 50. With this configuration, it is possible to effectively prevent a decrease in the levitation amount of the substrate 30 near the slit 50 when transporting the substrate 30, thereby further improving the levitation accuracy of the substrate 30.

[0048] In the levitation transport device 1 according to the present embodiment, the position where the slit 50 is provided can be freely determined. For example, the slit 50 can be provided at a position where air accumulation may occur between the levitation unit 5 and the substrate 30 when transporting the substrate 30. The position where air accumulation may occur is, for example, a place where the length of the levitation unit in the width direction ( Figure 1 the y-axis direction in) is long or a place where gas is difficult to flow from the upper surface of the levitation unit 5 in the xy-plane direction. For example, when a transport unit (e.g., a transport track) is provided on the side surface of the levitation unit 5, the side surface of the levitation unit 5 on the transport unit side is a place where gas is difficult to flow (see the second and third embodiments described below).

[0049] In the levitation transport device 1 according to the present embodiment, it is preferable to provide the slit 50 such that the longitudinal direction of the slit 50 is parallel to the transport direction of the substrate 30. With such a configuration, the portion where the substrate 30 overlaps the opening of the slit 50 in the plan view can be reduced at the end portion on the downstream side in the transport direction of the substrate 30. This effectively prevents the end portion of the substrate 30 on the downstream side in the transport direction from colliding with the opening of the slit 50.

[0050] Second Embodiment

[0051] Hereinafter, the second embodiment will be described. Figure 6 and Figure 7Top view of the levitation transportation device of the second embodiment. In this embodiment, the levitation transportation device of the first embodiment is applied to a laser processing device. Note that the basic structure of the levitation transportation device 2 according to the second embodiment is the same as that of the levitation transportation device 1 described in the first embodiment, so repeated descriptions are appropriately omitted.

[0052] As Figure 6 shown, the levitation transportation device 2 (laser processing device) according to this embodiment includes a levitation unit 6, a transportation unit 61, and a laser source (laser generation unit) 65. The structure of the levitation unit 6 is substantially the same as that of the levitation unit 5 described in the first embodiment, so repeated descriptions are omitted.

[0053] The levitation transportation device 2 (laser processing device) of this embodiment is configured to eject gas onto the lower surface of the substrate 30 by using the levitation unit 6, thereby levitating the substrate 30, and to transport the substrate 30 in the transportation direction (x-axis direction) by using the transportation unit 61. Note that in Figure 6 and Figure 7 the ejection port 11 is not shown.

[0054] As Figure 6 shown, the transportation unit 61 includes a holding mechanism 62 and a moving mechanism 63. The holding mechanism 62 holds the substrate 30. For example, a suction-type vacuum adsorption mechanism or a vacuum adsorption mechanism including a porous body can be used to constitute the holding mechanism 62. The moving mechanism 63 is connected to the holding mechanism 62. The moving mechanism 63 is arranged to be able to move the holding mechanism 62 in the transportation direction (X-axis direction). The transportation unit 61 (holding mechanism 62 and moving mechanism 63) is provided on the end side in the y-axis direction of the levitation unit 6. While holding the substrate 30 by the holding mechanism 62, the substrate 30 is transported by the moving mechanism 63 moving in the transportation direction.

[0055] The levitation transportation device 2 (laser processing device) according to this embodiment includes a rotation mechanism 68. As Figure 7 shown, the rotation mechanism 68 is provided on the positive side in the x-axis direction of the levitation unit 6, and is configured to rotate the substrate 30 transported to the positive side in the x-axis direction by 180 degrees while maintaining the horizontal plane (xy plane) of the substrate 30. That is, the levitation transportation device 2 (laser processing device) uses the transportation unit 61 to transport the substrate 30 to the positive side in the x-axis direction, and when the substrate 30 passes by the laser source 65, irradiates the substrate 30 with a laser beam (the part of the substrate 30 irradiated by the laser beam is indicated by the mark 31). After that, the substrate 30 is rotated 180 degrees by using the rotation mechanism 68, transported to the negative side in the x-axis direction, and irradiated with a laser beam. By operating in this way, the entire surface of the substrate 30 can be irradiated with the laser beam.

[0056] A plurality of ejection ports 11 (see Figure 2 , not shown in Figure 6 and Figure 7 ) are provided on the upper surface of the suspension unit 6, and the substrate 30 is suspended by ejecting gas from the plurality of ejection ports 11 onto the lower surface of the substrate 30. At this time, the gas colliding with the lower surface of the substrate 30 moves along the xy plane on the suspension unit 6 and flows laterally outward through the end of the suspension unit 6. However, as shown in Figure 6 and Figure 7 , the transport unit 61 is provided on the positive side in the y-axis direction of the suspension unit 6, so that a part of the gas colliding with the lower surface of the substrate 30 in this part flows toward the positive side in the y-axis direction, and an air accumulation 133 (see Figure 5 ) may be formed. In other words, the transport unit 61 (e.g., a transport rail) is provided on the positive side in the y-axis direction of the suspension unit 6. Therefore, the transport unit 61 can prevent the gas that has collided with the lower surface of the substrate 30 from flowing out of the suspension unit 6.

[0057] Therefore, in the present embodiment, as shown in Figure 6 and Figure 7 , a plurality of slits 50 are provided along the transport direction (x-axis direction) on the transport unit 61 side of the suspension unit 6. In other words, among the upper surface of the suspension unit 6, in the direction (y-axis direction) perpendicular to the transport direction, the slits 50 are provided closer to the transport unit 61 than to the central position. The slits 50 are provided such that the length direction of the slits 50 is parallel to the transport direction (x-axis direction) of the substrate.

[0058] By providing the slits 50 in this way, the gas trapped between the suspension unit 6 and the substrate 30 can be discharged to the lower surface side of the suspension unit 6 via the slits 50. Therefore, the generation of the air accumulation 133 (see Figure 5 ) on the transport unit 61 side of the suspension unit 6 can be effectively prevented, thereby improving the suspension accuracy of the substrate 30.

[0059] In the present embodiment, the density of the slits 50 at the position where the substrate 30 is stationary can be higher than the density of the slits 50 at the position where the substrate 30 moves continuously. That is, as shown in Figure 7 , at the position where a rotation mechanism 68 for rotating the substrate 30 in the in-plane direction is provided, the substrate 30 is stationary. Compared with the position where the substrate 30 moves continuously, air accumulation is more likely to occur at the position where the substrate 30 is stationary (i.e., air accumulation is more likely to be generated at the position where the rotation mechanism 68 is located than at the position on the negative side in its x-axis direction).

[0060] Therefore, in the present embodiment, the density of the slit 50 at the position 51_2 where the substrate 30 is stationary is higher than the density of the slit 50 at the position 51_1 where the substrate 30 moves continuously. With such a configuration, it is possible to effectively prevent air accumulation from occurring at the position where the substrate 30 is stationary.

[0061] Third Embodiment

[0062] Hereinafter, the third embodiment will be described. Figure 8 And Figure 9 FIG. is a top view of the suspension transport device according to the third embodiment. In the present embodiment, the case where the suspension transport device of the first embodiment is applied to a laser processing device is described. Note that the basic configuration of the suspension transport device 3 according to the third embodiment is the same as the configuration of the suspension transport device 1 described in the first embodiment, and thus repeated descriptions are appropriately omitted.

[0063] As Figure 8 shown, the suspension transport device 3 (laser processing device) according to the present embodiment includes a suspension unit 7, transport units 61_1 to 61_4, and a laser source 65. The configuration of the suspension unit 7 is substantially the same as the configuration of the suspension unit 5 described in the first embodiment, and thus repeated descriptions are omitted.

[0064] The suspension unit 7 is configured to eject gas from the surface of the suspension unit 7, and the gas ejected from the surface of the suspension unit 7 collides with the lower surface of the substrate 30, thereby suspending the substrate 30. The suspension unit 7 includes four regions 7a to 7d. In Figure 8 and 9 the ejection ports 11 are not shown.

[0065] As Figure 8 shown, the suspension unit 7 has a rectangular shape in a plan view. Each of the transport units 61_1 to 61_4 is provided to transport the substrate 30 along each side of the suspension unit 7. Specifically, the transport unit 61_1 is provided on the side of the positive y-axis direction of the suspension unit 7 and includes a holding mechanism 62_1 and a moving mechanism 63_1. As Figure 9 shown, while the holding mechanism 62_1 holds the substrate, the moving mechanism 63_1 moves in the positive x-axis direction, and the substrate 30 can be transported from the region 7a to the region 7b.

[0066] In the suspension transport device 3 (laser processing device) of the present embodiment, the laser source 65 is provided between the regions 7a and 7b. Therefore, when the substrate 30 is transported from the region 7a to the region 7b, the substrate 30 is irradiated with a laser beam. In Figure 9 FIG., the surface portion of the substrate 30 irradiated with the laser beam is indicated by the reference numeral 31.

[0067] The transport unit 61_2 is provided on the edge on the positive side in the x-axis direction of the suspension unit 7, and includes a holding mechanism 62_2 and a moving mechanism 63_2. While the holding mechanism 62_2 holds the substrate 30, the moving mechanism 63_2 moves in the negative y-axis direction, and the substrate 30 can be transported from the area 7b to the area 7c.

[0068] The transport unit 61_3 is provided on the edge on the negative side in the y-axis direction of the suspension unit 7, and includes a holding mechanism 62_3 and a moving mechanism 63_3. While the holding mechanism 62_3 holds the substrate 30, the moving mechanism 63_3 moves in the negative x-axis direction, and the substrate 30 can be transported from the area 7c to the area 7d.

[0069] The transport unit 61_4 is provided on the edge on the negative side in the x-axis direction of the suspension unit 7, and includes a holding mechanism 62_4 and a moving mechanism 63_4. While the holding mechanism 62_4 holds the substrate 30, the moving mechanism 63_4 moves in the positive y-axis direction, and the substrate 30 can be transported from the area 7d to the area 7a.

[0070] As described above, in the suspension transport device 3 (laser processing device) according to the present embodiment, the suspension unit 7 includes four areas 7a to 7d (rectangular areas surrounded by solid lines and dotted lines), and the substrate 30 is processed by being sequentially transported through these four areas 7a to 7d. In the suspension transport device 3 (laser processing device) according to the present embodiment, since the laser source 65 is provided between the areas 7a and 7b, when the substrate 30 is transported from the area 7a to the area 7b, the substrate 30 is irradiated with a laser beam.

[0071] In the area 7d of the suspension unit 7, a rotating mechanism 68 is provided, and the rotating mechanism 68 is used to rotate the substrate 30 by 180 degrees while maintaining the horizontal plane (xy plane) of the substrate 30. That is, the transport unit 61_1 is used to transport the substrate 30 from the area 7a to the area 7b, and the substrate 30 is irradiated with a laser beam. Then, while the substrate 30 is transported by the transport units 61_2 to 61_4, the substrate 30 is rotated by 180 degrees by the rotating mechanism 68. Then, by using the transport unit 61_1 again to transport the substrate 30 from the area 7a to the area 7b and irradiating the substrate 30 with a laser beam, the entire surface of the substrate 30 can be irradiated with a laser beam.

[0072] A plurality of ejection ports 11 (see Figure 2 , not shown in Figure 8 and Figure 9 ) are provided on the upper surface of the suspension unit 7, and the substrate 30 is suspended by ejecting gas from the plurality of ejection ports 11 onto the lower surface of the substrate 30. At this time, the gas colliding with the lower surface of the substrate 30 flows out in the in-plane direction of the suspension unit 7. However, as in Figure 8 and9 As shown, since the transport units 61_1 to 61_4 are provided around the suspension unit 7, the gas colliding with the lower surface of the substrate 30 is difficult to flow outward in the portions where the transport units 61_1 to 61_4 are located, and air accumulation 133 is likely to be formed (see Figure 5 ). In other words, since the transport units 61_1 to 61_4 (e.g., transport tracks) are provided to surround the periphery of the suspension unit 7, the gas colliding with the lower surface of the substrate 30 can be prevented from flowing out of the suspension unit 7 through the transport units 61_1 to 61_4.

[0073] Therefore, in the present embodiment, as Figure 8 and Figure 9 shown, on the side of the suspension unit 7 where the transport units 61_1 to 61_4 are provided, a plurality of slits 50 are provided along the transport direction of the substrate 30. Specifically, a plurality of slits 50 are provided at a position 52_1 outside the region 7a of the suspension unit 7. Similarly, a plurality of slits 50 are provided at a position 52_2 outside the region 7b of the suspension unit 7, a position 52_3 outside the region 7c of the suspension unit 7, and a position 52_4 outside the region 7d of the suspension unit 7. The positions 52_1 to 52_4 correspond to the positions where the transport units 61_1 to 61_4 transfer the substrate 30 to the next one of the transport units 61_1 to 61_4, and these positions are also the positions where the substrate is temporarily stationary.

[0074] As Figure 8 and Figure 9 shown, the slits 50 are provided such that the length direction of the slits 50 is parallel to the transport direction of the substrate.

[0075] By providing the slits 50 in this way, the gas trapped between the suspension unit 7 and the substrate 30 can be discharged to the lower surface side of the suspension unit 7 via the slits 50. Therefore, air accumulation 133 near the outer periphery of the suspension unit 7 can be effectively prevented (see Figure 5 ), thereby improving the suspension accuracy of the substrate 30.

[0076] In the present embodiment, when the substrate 30 is transported from the region 7a to the region 7b, the substrate 30 is irradiated with a laser beam. Therefore, when transporting the substrate from the region 7a to the region 7b, it is necessary to transport the substrate 30 with particularly high precision. For this purpose, in the present embodiment, more slits 50 are also provided at positions 53 near the outer peripheries of the regions 7a and 7b of the suspension unit 7. By providing the slits 50 at the positions 53 in this way, when the substrate 30 passes near the laser source 65, air accumulation between the substrate 30 and the suspension unit 7 can be effectively prevented. Therefore, the substrate 30 can be accurately transported near the laser source 65.

[0077] Fourth Embodiment

[0078] Hereinafter, a fourth embodiment will be described. Figure 10 It is a top view of the levitation transport device of the fourth embodiment. In the present embodiment, a configuration example in which a levitation unit 8_2 is added to the levitation transport device 2 (laser processing device) described in the second embodiment on the positive side in the y-axis direction is shown. Note that the configuration of the levitation transport device 4 according to the fourth embodiment is substantially the same as the configurations of the levitation transport devices 1 and 2 described in the first and second embodiments, and thus repeated descriptions are omitted.

[0079] As Figure 10 shown, the levitation transport device 4 (laser processing device) according to the present embodiment includes levitation units 8_1 and 8_2, a transport unit 61, and a laser source 65. In the present embodiment, the levitation unit 8_1 is provided on the negative side in the y-axis direction, and the levitation unit 8_2 is provided on the positive side in the y-axis direction. The transport unit 61 is provided between the levitation unit 8_1 and the levitation unit 8_2. A rotation mechanism 68 is provided on the positive side in the x-axis direction of the levitation unit 8_1. The configurations of the transport unit 61 and the rotation mechanism 68 are the same as the configurations of the transport unit and the rotation mechanism according to the second embodiment, and thus repeated descriptions are omitted.

[0080] The levitation transport device 4 (laser processing device) of the present embodiment is configured to jet a gas onto the lower surface of the substrate 30 using the levitation units 8_1 and 8_2, thereby levitating the substrate 30, and to transport the substrate 30 in the transport direction (x-axis direction) using the transport unit 61. Note that in Figure 10 , the jet ports 11 are not shown.

[0081] In the present embodiment, as Figure 10 shown, a plurality of slits 50_1 are provided on the transport unit 61 side of the levitation unit 8_1. A plurality of slits 50_2 are also provided on the transport unit 61 side in the levitation unit 8_2. The slits 50_1 and 50_2 are provided such that the longitudinal directions of the slits 50_1 and 50_2 are parallel to the transport direction (x-axis direction) of the substrate.

[0082] Also in the present embodiment, by providing the slits 50_1 and 50_2 in this way, the gas staying between the levitation units 8_1 and 8_2 and the substrate 30 can be discharged to the lower surface side of the levitation units 8_1 and 8_2 via the slits 50_1 and 50_2. Therefore, it is possible to effectively prevent the generation of air accumulation 133 (see Figure 5 ) in the levitation units 8_1 and 8_2 on the transport unit 61 side, thereby improving the levitation accuracy of the substrate 30.

[0083] In this embodiment, a structure in which a transport unit 61 is provided between a suspension unit 8_1 and a suspension unit 8_2 is described, but it can also be applied to the suspension transport device 3 of the third embodiment (see Figure 8 ). That is to say, in the suspension transport device 3 of the third embodiment shown in Figure 8 , the suspension unit can also be provided outside the transport units 61_1 to 61_4.

[0084] From the disclosure thus described, it is obvious that the embodiments of the present disclosure can be changed in many ways. Such changes should not be regarded as departing from the spirit and scope of the present disclosure, and all such modifications that are obvious to those skilled in the art are intended to be included within the scope of the appended claims.

Claims

1. A suspension transportation device, characterized in that, Comprising a suspension unit for suspending the substrate by ejecting gas onto the lower surface of the substrate, the suspension unit comprising: A plurality of ejection ports provided on the surface facing the substrate and configured to eject the gas; and a slit penetrating the suspension unit in the vertical direction; Wherein, the suspension transport device is configured such that the gas retained between the surface of the suspension unit facing the substrate and the substrate is discharged to the side where the lower surface of the suspension unit is located via the slit, The density of the ejection ports provided around the slit is higher than the density of the ejection ports provided in the regions of the suspension unit other than the regions around the slit.

2. The suspension transport device according to claim 1, wherein, A plurality of leveling bolts protruding downward from the lower surface of the suspension unit are further provided in the suspension unit, By bringing a plurality of the leveling bolts into contact with the mounting surface, the suspension unit is mounted on the mounting surface, and The gas retained between the surface of the suspension unit facing the substrate and the substrate is discharged into the space between the lower surface of the suspension unit and the mounting surface via the slit.

3. The suspension transport device according to claim 2, wherein, The gas discharged into the space between the lower surface of the suspension unit and the mounting surface is further discharged to the outside via the gaps between the leveling bolts.

4. The suspension transport device according to claim 1, wherein, The slit is arranged such that the length direction of the slit is parallel to the transport direction of the substrate.

5. The suspension transport device according to claim 1, wherein, A transport unit is provided on one side of the suspension unit, and the transport unit transports the substrate in the transport direction of the substrate while holding the substrate, and In the upper surface of the suspension unit and in a direction perpendicular to the transport direction, the slit is arranged closer to the transport unit than to the central position.

6. The suspension transport device according to claim 5, wherein, The slit is arranged on the transport unit side of the suspension unit in the transport direction.

7. The suspension transport device according to claim 5, wherein, The density of the slit at the position where the substrate is stationary is higher than the density of the slit at the position where the substrate is continuously moving.

8. The suspension transport device according to claim 7, wherein, The position where the substrate is stationary is the position where a rotation mechanism for rotating the substrate in the in-plane direction is provided.

9. The suspension transport device according to claim 7, wherein, The position where the substrate is stationary is the position where the substrate is transported from one transport unit to the next transport unit.

10. A laser processing device, characterized in that, Comprising: A suspension transport device comprising a suspension unit for suspending the substrate by ejecting gas onto the lower surface of the substrate; And A laser generation unit configured to generate a laser beam to be applied to the substrate; Wherein, the suspension unit comprises: A plurality of ejection ports, provided on a surface facing the substrate, and configured to eject the gas; and A slit, penetrating the suspension unit in a vertical direction; Wherein, the suspension transport device is configured such that the gas retained between the surface of the suspension unit facing the substrate and the substrate is discharged to the side where the lower surface of the suspension unit is located via the slit, The density of the ejection ports provided around the slit is higher than the density of the ejection ports provided in areas other than the area around the slit of the suspension unit.

11. The laser processing device according to claim 10, wherein The suspension unit is further provided with a plurality of leveling bolts protruding downward from the lower surface of the suspension unit, By bringing the plurality of leveling bolts into contact with the mounting surface, the suspension unit is mounted on the mounting surface, and The gas retained between the surface of the suspension unit facing the substrate and the substrate is discharged into the space between the lower surface of the suspension unit and the mounting surface via the slit.

12. The laser processing device according to claim 11, wherein The gas discharged into the space between the lower surface of the suspension unit and the mounting surface is further discharged to the outside via the gaps between the leveling bolts.

13. The laser processing device according to claim 10, wherein The slit is provided such that the length direction of the slit is parallel to the transport direction of the substrate.

14. The laser processing device according to claim 10, wherein A transport unit is provided on one side of the suspension unit, the transport unit transports the substrate along the transport direction of the substrate while holding the substrate, and In the upper surface of the suspension unit and in a direction perpendicular to the transport direction, the slit is provided closer to the transport unit than to the central position.

15. The laser processing device according to claim 14, wherein The slit is provided on the transport unit side of the suspension unit along the transport direction.

16. The laser processing device according to claim 14, wherein The density of the slit at the position where the substrate is stationary is higher than the density of the slit at the position where the substrate is continuously moving.

17. The laser processing device according to claim 16, wherein The position where the substrate is stationary is the position where a rotation mechanism for rotating the substrate in the in-plane direction is provided.

18. The laser processing device according to claim 16, wherein The position where the substrate is stationary is the position where the substrate is transported from one transport unit to the next transport unit.

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