Radiator with adjustable fin spacing

Abstract

The present invention discloses a heat sink with adjustable fin spacing. A device includes: at least one heat pipe adapted to be thermally coupled to an integrated circuit and having an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins attached to the first condenser portion; a first movable support thermally coupled to the first condenser portion and configured to move a second plurality of cooling fins relative to the first plurality of cooling fins; and a second plurality of cooling fins attached to the first movable support.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Patent Application Serial No. 62 / 978,283, entitled “HEAT SINK WITH ADJUSTABLE FIN PITCH,” filed on February 18, 2020. The subject matter of this related application is incorporated herein by reference in its entirety. Technical Field

[0003] Various embodiments relate generally to computer systems and computer architecture, and more particularly, to heat sinks with adjustable fin pitch. Background Art

[0004] In modern computing systems, central processing units (CPUs), graphics processing units (GPUs), and other integrated circuits (ICs) generate a lot of heat during use. For the proper operation of the integrated circuits and computing systems, this heat needs to be removed. For example, a single high-power chip (such as a CPU or GPU) can generate hundreds of watts of heat during operation, and if this heat is not effectively removed, the temperature of the chip may rise to the point where the chip is at risk of being damaged. To prevent thermal damage during operation, many systems implement clock speed throttling when the operating temperature of the processor exceeds a certain threshold. Therefore, in these systems, the processing speed of the high-power chip is limited by the chip design and how the heat is effectively removed from the chip.

[0005] To reduce the impact of thermal constraints on the performance of high-power chips, heat exchangers are often used, which allow high-power chips to run at greater processing speeds and generate more heat. Heat exchangers are designed to efficiently transfer heat from the chip to the ambient air, which then carries the heat away from the chip. Heat exchangers can include passive devices, such as heat sinks, or more complex heat transfer devices, such as heat pipes. Heat sinks typically include an array of fins that increase the effective surface area of ​​the chip exposed to the ambient air, while heat pipes rely on phase changes (e.g., evaporation of a liquid) to efficiently transfer heat between two solid interfaces. In some cases, heat pipes are used in conjunction with heat sinks to increase the amount of heat that can be removed from high-power chips.

[0006] To further facilitate cooling of the high-power chips, computing systems typically also include one or more cooling fans that are arranged to push or pull air through a heat exchanger coupled to the high-power chips. Because cooling fans typically generate unidirectional airflow within a computer system, certain high-power chips and heat-generating devices are typically located downstream of other high-power chips or heat-generating devices in a given computing device. As the cooling air passes over upstream devices, those devices add heat to the cooling air, which causes the downstream devices to be cooled by substantially warmer air than the upstream devices. As a result, downstream devices tend to "run hotter" than upstream devices, which can limit the processing speed of the downstream devices.

[0007] One approach to addressing the above phenomenon is to couple a less efficient heat exchanger to an upstream device within a computing device. For example, a heat exchanger with fewer cooling fins can be coupled to an upstream device within a given computing device. In this way, less heat is added to the cooling air as it passes through the upstream device, which results in more efficient cooling of the downstream device as the cooling air passes through the downstream device.

[0008] One disadvantage of this approach is that a processor board configured in this manner is compatible with airflow in a single direction and performs best when mounted to receive airflow in that direction. Therefore, the flexibility of placement of such a processor board is limited. In addition, for certain computer systems, such as cloud computing servers, the direction of airflow through the computer system can vary depending on site-specific factors, such as the layout design of the computer system. Therefore, when used in a cloud computing server, two configurations of the same processor board can be manufactured, one for applications where cooling airflow passes through the computer system in one direction and the other for applications where cooling airflow passes through the computer system in the opposite direction.

[0009] As previously stated, what is needed in the art is a more efficient way to cool electronic equipment within a computer system. Summary of the invention

[0010] An apparatus comprises: at least one heat pipe adapted to be thermally coupled to an integrated circuit and having an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins attached to the first condenser portion; a first movable support thermally coupled to the first condenser portion and configured to move a second plurality of cooling fins relative to the first plurality of cooling fins; and a second plurality of cooling fins attached to the first movable support.

[0011] At least one technical advantage of the disclosed method is that the disclosed method results in more efficient cooling of electronic devices within a computer system disposed downstream of an adjustable heat sink. More specifically, when the adjustable heat sink is coupled to an upstream electronic device within a computer system, the cooling efficiency of the adjustable heat sink can be reduced, thereby resulting in a reduction in the temperature of the cooling air leaving the adjustable heat sink. As relatively cooler air passes through the downstream electronic device within the computer system, the downstream device is relatively more efficiently cooled. Therefore, the adjustable heat sink can selectively change the cooling efficiency of the upstream electronic device relative to the downstream electronic device. Since the adjustable heat sink can be used as both an upstream heat sink and a downstream heat sink in a computer system, the manufacturing process of the computer system is simplified. In addition, when operating, the adjustable heat sink provides flexibility in placement or direction within a computer system including a processor board of upstream and downstream heat-generating electronic devices. These technical advantages provide one or more technical advances relative to prior art methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order that the manner in which the above-described features of various embodiments may be understood in detail, the inventive concept briefly summarized above may be described in more detail by reference to various embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the drawings illustrate only typical embodiments of the inventive concept and are therefore not to be considered in any way limiting of the scope and that there are other equally effective embodiments.

[0013] Figure 1 is a perspective view of a computer system configured to implement one or more aspects of various embodiments;

[0014] Figure 2 According to various embodiments, Figure 1 A perspective view of a heat exchanger implemented in a computer system;

[0015] Figure 3 is arranged in accordance with various embodiments Figure 2 A perspective view of a movable support within a heat exchanger;

[0016] Figure 4A is an upstream heat exchanger configuration according to various embodiments Figure 2 An end view of a heat exchanger;

[0017] Figure 4B is a downstream heat exchanger configuration according to various embodiments Figure 2 An end view of a heat exchanger;

[0018] Figures 5A-5C The present invention includes a Figure 2 Individual cooling fins in an adjustable heat exchanger;

[0019] Figure 6 is according to various embodiments when the parts are assembled Figure 2 A perspective view of a heat exchanger;

[0020] Figure 7 illustrates various cooling fins, each included in a different set of adjustable cooling fins that may be implemented in an adjustable heat sink, according to various embodiments; and

[0021] Figure 8 is a flow chart of method steps for controlling an adjustable heat sink according to various embodiments.

[0022] For clarity, like reference numerals have been used, where applicable, to designate like elements that are common between the figures. It is contemplated that features of one embodiment may be incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0023] In the following description, numerous specific details are set forth to provide a more thorough understanding of various embodiments. However, it will be apparent to one skilled in the art that the inventive concept may be practiced without one or more of these specific details.

[0024] Computer system with adjustable heat sink

[0025] Figure 1 1 is a perspective view of a computer system 100 according to various embodiments. The computer system 100 is a computing device or a portion of a computing device, such as a server, a personal computer, a laptop, a tablet computer, a video game console, a personal digital assistant, a mobile phone, a mobile device, or any other electronic device suitable for practicing the embodiments herein. Figure 1 In the illustrated embodiment, the computer system 100 is depicted as a server board of a distributed computing system or a cloud computing system, which includes multiple integrated circuits (ICs) mounted on a single printed circuit board (PCB) 102. Therefore, the computer system 100 is configured to be installed with multiple other server boards in, for example, a server rack. However, Figure 1 The scope of the embodiments described herein is in no way limited or intended to be limited, and computer system 100 may be any other computing system that includes multiple ICs, each coupled to a respective heat exchanger 103. In such an embodiment, some or all of the multiple ICs are coupled to respective heat exchangers 103. Figure 1 In addition to the multiple ICs not visible in the figure, the computer system 100 may also include various other electronic components 104 mounted on the PCB 102. Figure 1In the example shown, the direction of the airflow is from left to right, but in other embodiments, the direction of the airflow may be a different direction.

[0026] As shown, the computer system 100 may include two or more rows of ICs and associated heat exchangers 103. In addition, in some embodiments, cooling air is directed by one or more fans (not shown) that push or pull air in one direction across the computer system 100 and the heat exchangers 103. Thus, the flow of cooling air (or other cooling fluid) over the computer system 100 is unidirectional and flows sequentially through a first row 120 of "upstream" heat exchangers 103A of the computer system 100 and then through a second row 130 of "downstream" heat exchangers 103B of the computer system 100. Thus, the upstream heat exchangers 103A in the first row 120 receive cooling air (or other cooling fluid) before the downstream heat exchangers 103B in the second row 130 receive cooling air (or other cooling fluid).

[0027] Since the upstream heat exchanger 103A receives the airflow before the downstream heat exchanger 103B, the temperature of the cooling airflow received by the upstream heat exchanger 103A is generally lower than the temperature of the cooling airflow received by the downstream heat exchanger 103B. Generally, heat transfer from the cooling fluid at a lower temperature is more effective than heat transfer from the cooling fluid at a higher temperature. Therefore, heat transfer from the downstream heat exchanger 103B is generally more difficult than heat transfer from the upstream heat exchanger 103A. For example, when the upstream heat exchanger 103A and the downstream heat exchanger 103B have the same configuration, heat transfer generally occurs at a higher rate from the upstream heat exchanger 103A. As a result, the IC cooled by the downstream heat exchanger 103B tends to operate at a higher temperature than the IC cooled by the upstream heat exchanger 103A.

[0028] According to various embodiments, an adjustable heat sink having an adjustable and / or variable fin spacing may be used as both an upstream heat exchanger 103A and a downstream heat exchanger 103B in a computer system 100. Advantageously, a single adjustable heat sink may be manufactured for the computer system 100, rather than a heat sink having an upstream configuration and a heat sink having a downstream configuration, which reduces manufacturing cost and complexity. Furthermore, in operation after manufacturing, the fin spacing of the adjustable heat sink described herein may be changed depending on whether the adjustable heat sink is used for an upstream heat exchanger or a downstream heat exchanger. Thus, flexibility is provided in the placement or orientation of the computer system 100 in a larger system. One such embodiment is in Figure 2 Shown in.

[0029] Figure 22 is a perspective view of a heat exchanger 200 that can be implemented in the computer system 100 according to various embodiments. The heat exchanger 200 is a heat exchanger for the IC 201 and can be implemented in the computer system 100 according to various embodiments. Figure 1 The heat exchanger 200 is used as one or more of the upstream heat exchangers 103A and one or more of the downstream heat exchangers 103B in the computer system 100. The heat exchanger 200 includes one or more heat pipes 240 and an adjustable heat sink 220 having a plurality of cooling fins 221. Figure 2 In the illustrated embodiment, one or more heat pipes 240 are thermally coupled to the IC 201 and the cooling fins 221. The heat exchanger 200 and the IC 201 together form an electronic device that can be mounted on a PCB (not shown) (such as Figure 1 On PCB102).

[0030] In some embodiments, IC 201 includes a single microchip, such as a graphics processing unit (GPU) or a central processing unit (CPU). Optionally, in some embodiments, IC 201 includes multiple microchips, such as one or more stacks of processor dies and memory dies, which are all mounted on the same package substrate. In such embodiments, the package substrate can be configured to mount the IC to a PCB (not shown), for example, via solder balls (not shown). In addition, in such embodiments, IC 201 may include a package cover that protects one or more stacks of processor dies and memory dies from physical damage, but also increases the thermal resistance associated with the packaging of IC 201. In addition, in some multi-microchip embodiments, IC 201 may include other configurations of the chip, such as a system-on-chip (SoC) configuration.

[0031] The heat pipe 240 is a sealed container, such as a copper tube, which contains an evaporating working fluid (not shown) (such as water or alcohol). The heat pipe 240 effectively transfers heat from the IC 201 to the cooling fins 221 and then to the cooling air (or any other cooling fluid) passing through the cooling fins 221 through a combination of evaporation and condensation. More specifically, in the heat pipe 240, evaporation of the working fluid into vapor occurs in the evaporator portion 241 of each heat pipe 240, while condensation of the working fluid occurs in one or more condenser portions 242. Each evaporator portion 241 is coupled to a surface from which thermal energy is to be removed. Each condenser portion 242 extends away from the surface from which thermal energy is to be removed. Figure 2In the illustrated embodiment, each heat pipe 240 includes two condenser sections 242, but in other embodiments, each heat pipe 240 may include more or less than two condenser sections 242. The condensed working fluid from the condenser section 242 flows to the corresponding evaporator section 241, where it absorbs thermal energy from the IC 201 and evaporates the working fluid. The vapor then moves to the condenser section 242 and condenses in the condenser section 242, releasing latent heat. In some embodiments, each heat pipe 240 also includes a wicking structure or material (not shown) on some or all of the inner surfaces to facilitate the return of the condensed cooling fluid to the evaporator section 241 of the heat pipe 240.

[0032] In the illustrated embodiment, the heat pipe 240 is mounted on a metal plate 250, such as a copper or aluminum plate, which is thermally coupled to the IC 201. In such an embodiment, the metal plate 250 can be thermally coupled to the surface of the IC 201 via a thermal interface material (TIM) such as a highly thermally conductive paste. Figure 2 In the illustrated embodiment, the metal plate 250 spreads heat over a larger surface area than the IC 201. As a result, a greater number of heat pipes 240 may be thermally coupled to the IC 201 on the metal plate 250 than if attached directly to the IC 201.

[0033] The cooling fins 221 may be any material that conducts heat effectively, such as copper or aluminum. The cooling fins 221 are oriented to allow a cooling fluid (referred to herein as "cooling air") to flow between the cooling fins 221 along either of the airflow directions 203 or 204. The cooling air flowing between the cooling fins 221 also flows through the condenser portion 242 of the heat pipe 240.

[0034] According to various embodiments, the cooling fins 221 include a plurality of groups of cooling fins, wherein at least one group of cooling fins is coupled to one or more heat pipes 240, and at least one group of cooling fins is coupled to the movable support 260. Figure 2 In the illustrated embodiment, the first group 231 of cooling fins 221 is coupled to the condenser portion 242 of the heat pipe 240 near the evaporator portion 241, the third group 233 of cooling fins 221 is coupled to the condenser portion 242 of the heat pipe 240 away from the evaporator portion 241, and the second group 232 of cooling fins 221 is coupled to the evaporator portion 241 and is disposed between the first group 231 and the third group 233. In addition, the fourth group 234 of cooling fins 221 is coupled to the movable support 260 and is disposed between the first group 231 and the third group 233. The cooling fins of the first group 231, the second group 232, and the third group 233 are fixed in place, that is, fixed. In contrast, the cooling fins of the fourth group 234 are adjustable because the cooling fins of the fourth group 234 can be moved in the vertical direction 202 by the movable support 260.

[0035] The cooling fins of the first group 231 are configured with a fixed fin spacing 231A, the cooling fins of the second group 232 are configured with a fixed fin spacing 232A, the cooling fins of the third group 233 are configured with a fixed fin spacing 233A, and the cooling fins of the fourth group 234 are configured with a fixed fin spacing 234A. Figure 2 In the illustrated embodiment, stator spacing 232A and stator spacing 234A are equal and greater than stator spacing 231A and stator spacing 233A. In other embodiments, stator spacing 231A and stator spacing 233A may be greater than stator spacing 232A and stator spacing 234A.

[0036] As shown, the cooling fins of the fourth group 234 are staggered between at least a portion of the fixed cooling fins of the second group 232. Thus, the cooling fins of the fourth group 234 alternate with the cooling fins of the second group 232 in the vertical direction 202 so that each adjustable cooling fin is placed between two corresponding fixed cooling fins. Thus, the movement of the cooling fins of the fourth group 234 in the vertical direction 202 can change the effective fin spacing of the central region 239 of the heat exchanger 200, thereby changing its cooling efficiency.

[0037] During operation, the cooling efficiency of the heat exchanger 200 is adjusted by changing the position of the movable support 260 in the vertical direction 202. For example, in order to reduce the cooling efficiency of the heat exchanger 200, the movable support 260 is positioned so that each of the cooling fins of the fourth group 234 coupled to the movable support 260 is close to or in contact with the corresponding fixed cooling fins of the second group 232. Conversely, when the movable support 260 moves along the vertical direction 202, the cooling fins of the fourth group 234 move away from the corresponding fixed cooling fins of the second group 232, thereby improving the cooling efficiency of the heat exchanger 200. Figure 3 One embodiment of the movable support 260 is described.

[0038] Figure 3 is a perspective view of a movable support 260 disposed within a heat exchanger 200 according to various embodiments. Figure 3 In FIG. 2 , the movable support 260 is mounted on a portion of the heat pipe 240 of the heat exchanger 200. For clarity, in FIG. Figure 3 The first group 231, the second group 232, the third group 233 and the fourth group 234 of the cooling fins 221 are omitted. The movable support member 260 is configured to be coupled to Figure 2234. In addition, the movable support 260 is configured to move the portion of the cooling fins of the heat exchanger 200 in the vertical direction 202. Since the portion of the cooling fins of the heat exchanger 200 (e.g., the fourth group 234) are all coupled to the movable support 260, when the movable support 260 moves along the vertical direction 202, each cooling fin in the portion moves simultaneously in the vertical direction 202.

[0039] exist Figure 3 In the illustrated embodiment, the movable support 260 includes one or more posts 361, each of which is mounted on or coupled to a base plate 362. Each post is configured to be mounted around and slide along the axis 342 of the respective condenser portion 242 of the heat pipe 240. Therefore, when the base plate 362 is actuated in the vertical direction 202, one or more posts 361 and the portion of the cooling fin coupled thereto move simultaneously in the vertical direction 202. In some embodiments, the posts 361 of the movable support 260 are configured with one or more alignment features 364 that match corresponding features in the cooling fins of the fourth group 234. Additionally or alternatively, in some embodiments, the condenser portion 242 of the heat pipe 240 is configured with one or more alignment features 342 that match corresponding features in the cooling fins of the first group 231, the second group 232, and / or the third group 233.

[0040] The movable support member 260 is also configured to be in thermal contact with one or more condenser portions 242. Specifically, each column 361 is in thermal contact with the corresponding condenser portion 242, thereby promoting heat transfer from the corresponding condenser portion 242 to each column 361. In some embodiments, the thermal contact between each column 361 and the corresponding condenser portion 242 is enhanced via a thermally conductive material 363 disposed between each column 361 and the corresponding condenser portion 242. In such an embodiment, the thermally conductive material 363 can be selected to further serve as a lubricant to promote relative movement between each column 361 and the corresponding condenser portion 242. Examples of materials suitable for use as the thermally conductive material 363 include graphite-based thermal paste, some other graphite-based material, or thermal grease. Figure 3 , only the visible portion of the thermally conductive material 363 disposed on the surface of the condenser portion 242 is shown (indicated by cross-hatching).

[0041] In order to move the movable support 260 along the vertical direction 202, the movable support 260 is coupled to one or more actuators 310. In some embodiments, the one or more actuators 310 are disposed between the movable support 260 and the metal plate 250 or within the metal plate 250. In other embodiments, the one or more actuators 310 may be placed at different locations on or within the heat exchanger 200. The one or more actuators 310 may be any technically feasible actuator, including a mechanical actuator, a thermal actuator, an electromechanical actuator, and the like.

[0042] In some embodiments, one or more actuators 310 are configured to move the movable support 260 to a set position relative to the IC 201 and / or relative to one or more condenser portions 242. For example, in one such embodiment, the actuator 310 is a screw-based or other mechanical actuator that can be manually adjusted to a specific position during assembly and / or manufacture of the heat exchanger 200. In such an embodiment, the heat exchanger 200 can be changed from an upstream heat exchanger configuration to a downstream heat exchanger configuration (or vice versa) depending on the target application of the heat exchanger 200. Figure 4A and Figure 4B One such embodiment is shown in .

[0043] Figure 4A is an end view of a heat exchanger 200 in an upstream heat exchanger configuration according to various embodiments, and Figure 4B is an end view of a heat exchanger 200 in a downstream heat exchanger configuration according to various embodiments. Figure 4A As shown, the heat exchanger 200 is configured in an upstream heat exchanger configuration in which the cooling fins coupled to the movable support 260 are adjusted so that each is in contact with one of the fixed cooling fins of the heat exchanger 200. When the cooling fins coupled to the movable support 260 are so adjusted, the effective fin pitch of the central region 239 is increased to the fixed fin pitch 232A, thereby eliminating the increased cooling capacity associated with the cooling fins of the group 234 coupled to the movable support 260. In contrast, in Figure 4B In the embodiment, the heat exchanger 200 is configured in a downstream heat exchanger configuration, wherein the cooling fins coupled to the movable support 260 are adjusted relative to the fixed cooling fins of the heat exchanger 200, each cooling fin being disposed at a designated position. Figure 4B In the illustrated embodiment, the designated location of each cooling fin coupled to the movable support 260 is a location equidistant from two adjacent fixed cooling fins of the second set 232 .

[0044] return Figure 3In some embodiments, one or more actuators 310 are configured to move movable support 260 relative to IC 201 and / or one or more condenser portions 242 to a set position that is a function of a temperature associated with IC 201. In such embodiments, when the temperature associated with IC 201 changes, one or more actuators 310 adjust the position of movable support 260 accordingly. Figure 4A and Figure 4B In contrast to the illustrated embodiment, the one or more actuators 310 are configured to adjust the position of the movable support 260 in the vertical direction 202 over a continuous range of positions.

[0045] In some embodiments, one or more actuators 310 include a thermomechanical actuator that produces movement of the first movable support in response to a change in temperature associated with IC 201. Examples of thermomechanical actuators suitable for use as actuators 310 include bimetallic strips or other components that change shape with temperature and wax-based thermal actuators (e.g., diaphragm or piston thermal actuators). In wax-based thermal actuators, actuator 310 includes a thermally actuated mechanism, such as a wax reservoir, which expands when heated and contracts when cooled. As the temperature of the wax reservoir changes, a piston attached to the reservoir and movable support 260 moves along a specific axis of linear movement (e.g., vertical direction 202). In this way, actuator 310 moves movable support 260 in response to a temperature change of the wax reservoir caused by a temperature change of IC 201. Therefore, actuator 310 achieves thermally controlled movement based on the temperature of IC 201.

[0046] In some embodiments, one or more actuators 310 include an electronically controlled actuator, such as a coupled motor and a controller that controls the motor. In such an embodiment, the motor is coupled to a mechanical actuator, such as a piston, attached to the movable support 260. In response to receiving a signal indicating a temperature associated with the IC 201, the controller causes the actuator to move the movable support 260 in the vertical direction 202. In such embodiments, the signal indicating the temperature associated with the IC 201 can be generated by the IC 201 itself or by a temperature sensor included in or near the adjustable heat sink 220. In some embodiments, multiple inputs can be used to generate a signal indicating a temperature associated with the IC 201, such as a processor temperature and a fan speed. In such an embodiment, the controller can use a suitable algorithm based on multiple inputs and / or a signal indicating a temperature associated with the IC 201 to determine the amount of actuation of the motor.

[0047] In some embodiments, a controller for one or more actuators 310 may be integrated into one or more actuators 310, included in heat exchanger 200, or implemented as one of electronic components 104 mounted on PCB 102 (e.g., Figure 1 In some embodiments, the controller for one or more actuators 310 may be configured to control similar actuators included in other similar heat exchangers included in the same computer system. For example, in one such embodiment, the controller may control Figure 1 One or more actuators for each of the upstream heat exchanger 103A and the downstream heat exchanger 103B in the computer system 100.

[0048] Adjustable radiator cooling fins

[0049] Figures 5A-5C Various cooling fins 221 included in the adjustable heat sink 220 are shown according to various embodiments. Figure 5A A representative cooling fin 531 included in the first group 231 and the second group 232 of cooling fins 221 is shown. Figure 5B A representative cooling fin 533 included in the third group 233 of cooling fins 221 is shown, and Figure 5C A representative cooling fin 534 included in the fourth group 234 of cooling fins 221 is shown. For reference, the positions of the condenser portion 242, the alignment features 342, the posts 361, and the alignment features 364 are shown in FIG. Figures 5A-5C Indicated by dotted line.

[0050] like Figure 5A As shown, the representative cooling fin 531 generally has an opening 501 configured to allow the column 361 to move relative to the representative cooling fin 531. The representative cooling fin 531 also includes an opening 502 configured to mechanically couple the representative cooling fin 531 to one or more condenser portions 242 when the representative cooling fin 531 is installed in the heat exchanger 200. For example, each opening 502 can be configured to couple to a condenser portion 242 and an alignment feature 342 formed thereon. Figure 5A In the illustrated embodiment, the representative cooling fin 531 extends from the first cooling air receiving edge 511 to the second air receiving edge 512. That is, in order to maximize or otherwise increase the heat transfer capability of the representative cooling fin 531, the representative cooling fin 531 is mechanically coupled to all heat pipes 240 of the heat exchanger 200 and has as large a surface area as possible. As a result, the representative cooling fin 531 has a larger surface area than the representative cooling fin 534.

[0051] like Figure 5BAs shown, the representative cooling fin 533 generally has an opening 502 that is configured to mechanically couple the representative cooling fin 533 to one or more condenser portions 242 when the representative cooling fin 531 is installed in the heat exchanger 200. For example, each opening 502 can be configured to couple to a condenser portion 242 and form an alignment feature 342 thereon. Figure 5B In the illustrated embodiment, representative cooling fins 533 extend from the first cooling air receiving edge 511 to the second cooling air receiving edge 512 and therefore have a larger surface area than representative cooling fins 534 .

[0052] like Figure 5C As shown, the representative cooling fin 534 generally has an opening 503 configured to allow the condenser portion 242 to move relative to the representative cooling fin 534. The representative cooling fin 534 also includes an opening 504 configured to mechanically couple the representative cooling fin 532 to one or more posts 361 when the representative cooling fin 534 is installed in the heat exchanger 200. For example, each opening 504 can be configured to couple to a post 361 and form an alignment feature 364 thereon. Figure 5C In the illustrated embodiment, representative cooling fins 534 have a smaller surface area than representative cooling fins 531. In other embodiments, representative cooling fins 533 have a similar surface area as representative cooling fins 531 and extend from first cooling air receiving edge 511 to second cooling air receiving edge 512.

[0053] Figure 6 is a perspective view of a partially assembled heat exchanger 200 according to various embodiments. Figure 6 In the embodiment, the cooling fins 221 of the first group 231 and one of the adjustable cooling fins 221 of the fourth group 234 are installed in the heat exchanger 200. Figure 6 In the illustrated embodiment, the placement sequence in the central region 239 of the heat exchanger 200 alternates between the fourth group 234 of adjustable cooling fins 221 and the second group 232 of fixed cooling fins.

[0054] In combination with the above Figure 1-6 In the described embodiments, a single set of adjustable cooling fins can be repositioned via a movable support. In other embodiments, the adjustable heat sink includes multiple sets of adjustable cooling fins, wherein each set of adjustable cooling fins is mechanically coupled to a different movable support. Figure 7 One such embodiment is described.

[0055] Figure 7 Various cooling fins 221 are shown, each included in a different group of adjustable cooling fins of the adjustable heat sink 700, according to various embodiments. Figure 7A representative cooling fin 731 included in the first group of adjustable cooling fins, a representative cooling fin 732 included in the second group of adjustable cooling fins, and a representative cooling fin 733 included in the third group of adjustable cooling fins are shown. For reference, the positions of the condenser section 242 and the columns 761, 771, and 781 are shown in FIG. Figure 7 In addition, the adjustable heat sink 700 includes a first movable support 760 (mechanically coupled to the representative cooling fin 731), a second movable support 770 (mechanically coupled to the representative cooling fin 732) and a third movable support 780 (mechanically coupled to the representative cooling fin 733).

[0056] Each representative cooling fin 731-733 includes an opening 705 configured to allow the representative cooling fin 731-733 to move relative to the condenser portion 242. The representative cooling fin 731 also includes an opening 701 configured to mechanically couple the representative cooling fin 731 to one or more posts 761 of the first movable support 760 when the representative cooling fin 731 is installed in the adjustable heat sink 700. Similarly, the representative cooling fin 732 also includes an opening 702, which is configured to mechanically couple the representative cooling fin 732 to one or more columns 771 of the second movable support member 770 when the representative cooling fin 732 is installed in the adjustable radiator 700, and the representative cooling fin 733 also includes an opening 703, which is configured to mechanically couple the representative cooling fin 733 to one or more columns 781 of the third movable support member 780 when the representative cooling fin 733 is installed in the adjustable radiator 700.

[0057] and Figure 2 , the first movable support 760 is coupled to one or more actuators 310, the second movable support 770 is coupled to one or more actuators 310, and the third movable support 780 is coupled to one or more actuators 310. As a result, each of the first movable support 760, the second movable support 770, and the third movable support 780 can be independently moved relative to the condenser portion 242, for example as a function of the temperature associated with the IC coupled to the adjustable heat sink 700. Figure 7In the illustrated embodiment, a group of cooling fins including representative cooling fin 731 can be independently repositioned independently of a group of cooling fins including representative cooling fin 732 and a group of cooling fins including representative cooling fin 733. As a result, one or more actuators 310 can be configured to move the first movable support 760 and the group of cooling fins including representative cooling fin 731 when the temperature is within a first temperature range, one or more actuators 310 can be configured to move the second movable support 770 and the group of cooling fins including representative cooling fin 732 when the temperature is within a second temperature range, and one or more actuators 310 can be configured to move the third movable support 780 and the group of cooling fins including representative cooling fin 733 when the temperature is within a third temperature range.

[0058] In some embodiments, the first, second, and third temperature ranges may be overlapping temperature ranges or non-overlapping temperature ranges. In either case, when the heat exchanger includes a plurality of movable supports, each movable support being independently movable, the cooling efficiency of the adjustable heat sink 700 may be continuously varied within a plurality of temperature ranges.

[0059] Controlling adjustable radiators

[0060] Figure 8 is a flow chart of method steps for controlling cooling efficiency in an adjustable heat sink according to various embodiments. Figures 1 to 7 The method steps are described herein with reference to a system, but those skilled in the art will understand that any system configured to perform the method steps in any order is within the scope of the present invention.

[0061] As shown, method 800 begins at step 801, where a suitable controller receives one or more signals indicative of a temperature associated with IC 201. In some embodiments, at least one such signal is generated by IC 201 itself. Alternatively, in some embodiments, at least one such signal is generated by a temperature sensor included in or near heat sink 201. In some embodiments, at least one such signal is generated by a component of computer system 100 (e.g., a fan generating a fan speed signal), a temperature sensor measuring the temperature of a portion of computer system 100 proximate to IC 201, and / or a heat exchanger located upstream or downstream of IC 201.

[0062] In step 802, the controller determines a heat sink adjustment to make based on one or more signals received in step 801. In some embodiments, the heat sink adjustment is determined based on a signal indicating a temperature of IC 201. Additionally or alternatively, in some embodiments, the heat sink adjustment is determined based on a signal indicating a temperature associated with a heat exchanger upstream or downstream of IC 201. For example, in one such embodiment, when a downstream heat exchanger (or an IC associated with a downstream heat exchanger) exceeds a threshold temperature value, the controller determines a heat sink adjustment for adjustable heat sink 220 (which reduces the cooling efficiency of heat sink 220), reduces the temperature of the cooling air leaving heat sink 220, and increases the heat transfer capacity of the downstream heat exchanger.

[0063] Additionally or alternatively, in some embodiments, heat sink adjustment is determined based on multiple signals, each signal indicating or associated with a temperature of an IC other than IC 201. For example, in one such embodiment, the controller determines heat sink adjustment for adjustable heat sink 220 based on a first temperature of or associated with IC 201, a second temperature of or associated with a heat exchanger in computer system 100 upstream of IC 201, and / or a third temperature of or associated with a heat exchanger in computer system 100 downstream of IC 201.

[0064] In some embodiments, the controller controls the regulation of a plurality of adjustable heat exchangers 220 included in the computer system 100. In such embodiments, in step 802, the controller also determines in which adjustable heat exchanger 220, if any, regulation is to be performed.

[0065] In step 803, in response to the signal received in step 801 and / or the heat sink adjustment determined in step 802, the controller causes one or more actuators 310 to move a movable support, such as movable support 260, relative to condenser portion 242 and / or IC 201. In this way, the cooling efficiency of one or more adjustable heat sinks is modified in response to temperature changes of one or more ICs included in computer system 100.

[0066] In summary, various embodiments shown and provided herein describe an adjustable heat sink for an integrated circuit. The adjustable heat sink is configured with one or more sets of movable cooling fins that modify the effective cooling efficiency of the adjustable heat sink when they move relative to the fixed cooling fins contained in the adjustable heat sink. Because the cooling efficiency of the adjustable heat sink is not fixed, the same heat sink can be used in an upstream heat exchanger and a downstream heat exchanger. In addition, in some embodiments, the adjustable heat sink is configured with a controllable actuator that enables dynamic control of the cooling efficiency of the adjustable heat sink.

[0067] At least one technical advantage of the disclosed method is that the disclosed method results in more efficient cooling of electronic devices disposed downstream of an adjustable heat sink in a computer system. More specifically, when the adjustable heat sink is coupled to an upstream electronic device in a computer system, the cooling efficiency of the adjustable heat sink can be reduced, thereby resulting in a reduction in the temperature of the cooling air leaving the adjustable heat sink. As relatively cooler air flows through the downstream electronic devices in the computer system, the downstream devices are relatively more efficiently cooled. Therefore, the adjustable heat sink can selectively modify the cooling efficiency of the upstream electronic devices relative to the downstream electronic devices. Since the adjustable heat sink can be used as both an upstream heat sink and a downstream heat sink in a computer system, the manufacturing process of the computer system is simplified. In addition, when running, the adjustable heat sink provides flexibility in placement or direction in a computer system including a processor board of upstream and downstream heat-generating electronic devices. These technical advantages provide one or more technical advances relative to the prior art methods.

[0068] 1. In some embodiments, a device includes: at least one heat pipe adapted to be thermally coupled to an integrated circuit and having an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins attached to the first condenser portion; a first movable support thermally coupled to the first condenser portion and configured to move a second plurality of cooling fins relative to the first plurality of cooling fins; and the second plurality of cooling fins attached to the first movable support.

[0069] 2. The apparatus of clause 1, wherein the first movable support is configured to slide along an axis of the at least one heat pipe to move the second plurality of cooling fins relative to the first plurality of cooling fins.

[0070] 3. An apparatus according to clause 1 or 2, wherein the first movable support is configured to move a cooling fin of the second plurality of cooling fins from a first position between two cooling fins of the first plurality of cooling fins to a second position between the two cooling fins of the first plurality of cooling fins.

[0071] 4. The apparatus of any one of clauses 1-3, wherein the first movable support is configured to simultaneously move each cooling fin of the second plurality of cooling fins from a respective first position to a respective second position.

[0072] 5. The apparatus of any one of clauses 1-4, wherein each cooling fin of the first plurality of cooling fins has a first shape, each cooling fin of the second plurality of cooling fins has a second shape, and the first shape is different from the second shape.

[0073] 6. A device according to any one of clauses 1-5, wherein the first shape has a larger surface area than the second shape.

[0074] 7. The apparatus of any of clauses 1-6, further comprising an actuator configured to move the first movable support relative to the first condenser portion.

[0075] 8. The apparatus of any one of clauses 1 to 7, wherein the actuator is configured to move the first movable support to a set position relative to the first condenser portion.

[0076] 9. The apparatus of any of clauses 1-8, wherein the actuator is configured to move the first movable support relative to the first condenser portion based on a temperature associated with the integrated circuit.

[0077] 10. Apparatus according to any of clauses 1 to 9, wherein the actuator comprises a thermomechanical actuator which moves the first movable support in response to a change in the temperature.

[0078] 11. The apparatus of any one of clauses 1-10, further comprising a controller configured to receive a signal indicative of a temperature associated with the integrated circuit and, in response to the signal, cause an actuator to move the first movable support relative to the first condenser portion.

[0079] 12. The apparatus of any of clauses 1-11, wherein the signal is generated by one of the integrated circuit or a temperature sensor included with the integrated circuit within an electronic device.

[0080] 13. The device according to any one of clauses 1-12 further includes: a third plurality of cooling fins; and a second movable support member, which is mechanically coupled to the third plurality of cooling fins and thermally coupled to the second condenser portion of the heat pipe of the heat exchanger, and is configured to move the third plurality of cooling fins relative to the first plurality of cooling fins.

[0081] 14. The apparatus of any one of clauses 1-13, further comprising: a first actuator configured to move the first movable support relative to the first condenser portion; and a second actuator configured to move the second movable support relative to the second condenser portion.

[0082] 15. An apparatus according to any one of clauses 1-14, wherein the first actuator is configured to move the first movable support relative to the first condenser portion based on a temperature associated with the integrated circuit, and the second actuator is configured to move the second movable support relative to the second condenser portion based on the temperature.

[0083] 16. An apparatus according to any one of clauses 1-15, wherein the first actuator is configured to move the first movable support relative to the first condenser portion when the temperature is within a first temperature range, and the second actuator is configured to move the second movable support relative to the second condenser portion when the temperature is within a second temperature range.

[0084] 17. In some embodiments, a method of controlling an adjustable heat sink comprises: receiving one or more signals indicating a temperature associated with a first integrated circuit; determining a heat sink adjustment to be performed based on the one or more signals; and causing an actuator to perform the heat sink adjustment.

[0085] 18. The method of clause 17, wherein causing the actuator to perform the heat sink adjustment comprises causing the actuator to move a movable support mechanically coupled to a first plurality of cooling fins in the adjustable heat sink relative to a second plurality of cooling fins in the adjustable heat sink.

[0086] 19. The method of clause 17 or 18, wherein the adjustable heat sink is thermally coupled to the second integrated circuit upstream of the first integrated circuit when a computing device including the first integrated circuit and the second integrated circuit is operating.

[0087] 20. In some embodiments, a computer system comprises: a first integrated circuit; a second integrated circuit, wherein when the computing system is running, the second integrated circuit is arranged downstream relative to the first integrated circuit with respect to the cooling airflow; and an adjustable heat exchanger, which comprises: at least one heat pipe, which is suitable for being thermally coupled to the first integrated circuit and has an evaporator portion and a condenser portion, wherein the condenser portion extends away from the evaporator portion; a first plurality of cooling fins attached to the condenser portion; a second plurality of cooling fins; and a first movable support member, which is mechanically coupled to the second plurality of cooling fins and thermally coupled to the condenser portion, and is configured to move the second plurality of cooling fins relative to the first plurality of cooling fins.

[0088] Any and all combinations of any claim elements recited in any claim and / or any elements described in this application in any manner are within the intended scope of the invention and protection.

[0089] Descriptions of various embodiments have been given for purposes of illustration, but are not intended to be exhaustive or limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments.

[0090] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope of the disclosure is determined by the claims that follow.

Claims

1. A device comprising: at least one heat pipe adapted to be thermally coupled to the integrated circuit and having an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins attached to the first condenser portion, wherein at least one fin included in the first plurality of cooling fins extends along a first planar direction; a second plurality of cooling fins; as well as A first movable support is thermally coupled to the first condenser portion and is configured to move the second plurality of cooling fins relative to the first plurality of cooling fins by sliding along an axis of the at least one heat pipe during heat dissipation.

2. The apparatus of claim 1 , wherein the first movable support is configured to move a cooling fin of the second plurality of cooling fins from a first position between two cooling fins of the first plurality of cooling fins along a first axis to a second position aligned with the two cooling fins of the first plurality of cooling fins along the first axis. 3 . The apparatus of claim 1 , wherein the first movable support is configured to simultaneously move each cooling fin of the second plurality of cooling fins from a respective first position to a respective second position. 4 . The apparatus of claim 1 , wherein each cooling fin of the first plurality of cooling fins has a first shape, each cooling fin of the second plurality of cooling fins has a second shape, and the first shape is different from the second shape.

5. The device of claim 4, wherein the first shape has a larger surface area than the second shape.

6. The apparatus of claim 1, further comprising an actuator configured to move the first movable support relative to the first condenser portion.

7. The apparatus of claim 6, wherein the actuator is configured to move the first movable support to a set position relative to the first condenser portion.

8. The apparatus of claim 6, wherein the actuator is configured to move the first movable support relative to the first condenser portion based on a temperature associated with the integrated circuit.

9. The apparatus of claim 8, wherein the actuator comprises a thermomechanical actuator that moves the first movable support in response to a change in the temperature.

10. The apparatus of claim 1, further comprising a controller configured to receive a signal indicative of a temperature associated with the integrated circuit and, in response to the signal, cause an actuator to move the first movable support relative to the first condenser portion.

11. The apparatus of claim 10, wherein the signal is generated by one of the integrated circuit or a temperature sensor included with the integrated circuit within an electronic device.

12. The apparatus according to claim 1, further comprising: a third plurality of cooling fins; as well as a second movable support mechanically coupled to the third plurality of cooling fins and thermally coupled to a second condenser portion of a first heat pipe, wherein the first heat pipe is spaced apart from the at least one heat pipe, and wherein the second movable support is configured to move the third plurality of cooling fins relative to the first plurality of cooling fins during heat dissipation.

13. The apparatus according to claim 12, further comprising: a first actuator configured to move the first movable support relative to the first condenser portion; and a second actuator configured to move the second movable support relative to the second condenser portion.

14. An apparatus according to claim 13, wherein the first actuator is configured to move the first movable support relative to the first condenser portion based on a temperature associated with the integrated circuit, and the second actuator is configured to move the second movable support relative to the second condenser portion based on the temperature associated with the integrated circuit.

15. An apparatus according to claim 14, wherein the first actuator is configured to move the first movable support relative to the first condenser portion when the temperature associated with the integrated circuit is within a first temperature range, and the second actuator is configured to move the second movable support relative to the second condenser portion when the temperature associated with the integrated circuit is within a second temperature range.

16. A computer system comprising: First integrated circuit; a second integrated circuit, the second integrated circuit being disposed downstream relative to the first integrated circuit with respect to cooling airflow when the computer system is in operation; as well as An adjustable heat exchanger comprising: at least one heat pipe adapted to be thermally coupled to the first integrated circuit and having an evaporator portion and a condenser portion, wherein the condenser portion extends away from the evaporator portion; a first plurality of cooling fins attached to the condenser portion, wherein the first plurality of cooling fins includes at least one fin extending in a first planar direction; a second plurality of cooling fins; and A first movable support is mechanically coupled to the second plurality of cooling fins and thermally coupled to the condenser portion and is configured to move the second plurality of cooling fins relative to the first plurality of cooling fins by sliding along an axis of the at least one heat pipe during heat dissipation.

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