Substrate processing apparatus and substrate processing method

Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method. The substrate processing apparatus is made to have higher productivity and reduced floor space. The apparatus includes: a first unit module including a first substrate conveying region, first and second processing units respectively provided on left and right sides of the first substrate conveying region, a second processing unit, first and second conveying mechanisms respectively provided on the left and right sides of the first substrate conveying region and respectively used for handing over a substrate to the first and second processing units; a second unit module including a second substrate conveying region and a third conveying mechanism, stacked with the first unit module; a substrate in-out module provided on the left side with respect to the stack of the unit modules and respectively handing over a substrate to the first and third conveying mechanisms; and a relay module provided on the right side with respect to the stack of the unit modules and respectively handing over a substrate to the second and third conveying mechanisms.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method. Background Art

[0002] To manufacture semiconductor devices, various processes are performed on semiconductor wafers (hereinafter referred to as wafers), which serve as substrates. Photolithography, for example, is one of the processes in the semiconductor device manufacturing process. Specifically, photolithography involves applying a resist to a wafer to form a resist film, and then supplying a developer to develop the exposed resist film. For example, Patent Document 1 describes a substrate processing apparatus that performs such resist film formation and development.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2010-219434 Summary of the Invention

[0006] Problems to be solved by the invention

[0007] The present disclosure provides a technology that can achieve higher productivity and reduce the footprint of a substrate processing apparatus.

[0008] Solutions for solving problems

[0009] The substrate processing apparatus of the present invention includes: a first unit module, which includes a first substrate conveying area extending left and right, a first processing assembly arranged to face one left and right side of the first substrate conveying area, a second processing assembly arranged to face the other left and right side of the first substrate conveying area, and a first conveying mechanism arranged on one left and right side of the first substrate conveying area and used to transfer substrates to the first processing assembly, and a second conveying mechanism arranged on the other left and right side of the first substrate conveying area and used to transfer substrates to the second processing assembly; a second unit module, which includes a second substrate conveying area extending left and right and a third conveying mechanism for conveying the substrates left and right in the second substrate conveying area, the second unit module being stacked with the first unit module; a substrate carrying module, which is arranged on one left and right side relative to the stacked unit module composed of the first unit module and the second unit module, and the substrate carrying module includes a side loading portion for loading the substrate at the height of the first unit module and the height of the second unit module, so as to respectively load the substrate to the first conveying mechanism , the third conveying mechanism hands over the substrate, and the substrate feeding-in and feeding-out module includes a carrier table for carrying a carrier for accommodating the substrate; a relay module, which is arranged on the other side of the left and right sides relative to the stacking body of the unit modules, and the relay module includes the other side loading portion for loading the substrate at the height of the first unit module and the height of the second unit module, so as to respectively hand over the substrate to the second conveying mechanism and the third conveying mechanism; the other side conveying mechanism, which is arranged on the relay module to transport the substrate between each of the other side loading portions; and a one side conveying mechanism, which transports the substrate between the carrier and each of the one side loading portions, so that the substrate after the first processing component completes processing and before the second processing component performs processing passes through the second unit module and the relay module in sequence and is transported from the other side of the first unit module to the second processing component, the one side conveying mechanism is arranged on the substrate feeding-in and feeding-out module to transport the substrate from the one side loading portion at the height of the first unit module to the one side loading portion at the height of the second unit module.

[0010] For the above-mentioned substrate processing device, a third processing component for receiving the substrate using the third conveying mechanism may be provided in the second unit module facing the second substrate conveying area, and the third processing component processes the substrate after being processed by the first processing component and before being processed by the second processing component.

[0011] In the above substrate processing apparatus, the first processing module and the third processing module may include a coating module that supplies a coating liquid to the substrate to form a coating film.

[0012] For the above-mentioned substrate processing device, it can also be that the second unit module includes: an outward unit module for conveying the substrate from the substrate feeding and unloading module to the relay module; and a return unit module for conveying the substrate from the relay module to the substrate feeding and unloading module, the outward unit module and the return unit module both include the second substrate conveying area and the third conveying mechanism, the outward unit module includes the third processing component, and the return unit module includes a fourth processing component for processing the substrate processed in the first processing component, the second processing component and the third processing component, and the one side loading portion and the other side loading portion are arranged at the height of the outward unit module and the height of the return unit module.

[0013] For the above-mentioned substrate processing device, it may also be that any one of the first processing component, the second processing component and the third processing component of the unit module for the outward path includes a resist coating component that supplies resist to the substrate to form a resist film, and the fourth processing component is a developing component arranged facing the second substrate conveying area, which develops the resist film exposed by the exposure machine connected to the relay module in order to expose the resist film.

[0014] For the above-mentioned substrate processing device, the first processing component and the second processing component can also be arranged in a left-right arrangement, and the first processing component, the second processing component and the third processing component are liquid processing components that supply processing liquid to the substrate for processing, and a supply machine is provided between the first processing component and the second processing component for supplying the processing liquid to the first processing component, the second processing component and the third processing component respectively.

[0015] For the above-mentioned substrate processing device, the first processing component may be a coating component that supplies a coating liquid to the substrate to form a coating film, and the second processing component may be a cleaning component that cleans the substrate after the formation of the anti-etching film and before exposure using the exposure machine.

[0016] For the above-mentioned substrate processing device, the other side loading section may be arranged in a row in the longitudinal direction, and the relay module is provided with: a post-exposure processing component for processing the substrate after exposure by the exposure machine and before development processing; and a retention component for retaining the substrate at a position deviated from the row of the other side loading section before being processed by the second processing component, and the other side conveying mechanism includes: a first other side conveying mechanism, which conveys the substrate between the post-exposure processing component, the retention component and the other side loading section; and a second other side conveying mechanism, which conveys the substrate between the retention component and the other side loading section, and the conveying area of ​​the substrate conveyed by the second other side conveying mechanism is longer in the longitudinal direction than the conveying area of ​​the substrate conveyed by the first other side conveying mechanism.

[0017] For the above-mentioned substrate processing device, the processing component as a unit module of the stacked body constituting the unit modules may be provided with a plurality of liquid processing components arranged on the left and right and supplying processing liquid to the substrate for processing, and the additional equipment of the processing component on the left, the additional equipment of the processing component in the center, and the additional equipment of the processing component on the right in the column of liquid processing components are separated from each other.

[0018] In the substrate processing apparatus, the liquid processing assembly may include a cup for accommodating the substrate and supplying the processing liquid to the substrate, and the additional equipment may include an exhaust path forming member connected to the cup and for forming an exhaust path for exhausting air in the cup.

[0019] In the substrate processing apparatus, the liquid processing assembly may include a cup for accommodating the substrate and supplying the processing liquid to the substrate, and the unit module may include a larger number of cups than another unit module forming a stack of the unit modules.

[0020] For the above-mentioned substrate processing device, the other side loading section may be arranged in a row in the longitudinal direction of the relay module, the other side conveying mechanism may be composed of a plurality of conveying mechanisms, and one conveying mechanism among the plurality of conveying mechanisms and an additional equipment setting section including an additional equipment of the second processing component may be arranged as a row clamping the other side loading section from the front and back.

[0021] In the above substrate processing apparatus, the first unit modules may be arranged in a plurality of layers continuously in a vertical direction, and the second processing module may be provided in each layer of the first unit modules.

[0022] For the above-mentioned substrate processing device, the left and right sides of the first substrate conveying area can also be divided into layers, and the first conveying mechanism is provided on each layer. The other left and right sides of the first substrate conveying area are connected between the layers, and the second conveying mechanism is a freely liftable conveying mechanism shared by each layer.

[0023] For the above-mentioned substrate processing device, it can also be that the one-side conveying mechanism includes: a first side conveying mechanism, which conveys the substrate in and out relative to the carrier; and a second side conveying mechanism, which is arranged to be closer to the stack of the unit modules than the first side conveying mechanism, and the second side conveying mechanism is raised and lowered to transfer the substrate between the first conveying mechanism and the third conveying mechanism. The substrate processing device includes: a filter, which is arranged above the conveying area where the substrate is conveyed by the first side conveying mechanism, so that the supplied gas is purified and discharged to the conveying area; a gas supply mechanism, which is arranged at a position that does not overlap with the filter when viewed from above, sucks gas and supplies it to the filter; and a carrier temporary loading part, which is used to temporarily load the carrier on the conveying area.

[0024] For the above-mentioned substrate processing device, the first processing component may be a coating component that supplies a coating liquid to the substrate to form a coating film, and the second processing component may be a cleaning component that cleans the substrate. The substrate processing device is provided with a gas supply and exhaust part that supplies and exhausts gas relative to the first unit module in a manner that makes the pressure of the first substrate conveying area lower than the pressure of the first processing component and higher than the pressure of the second processing component.

[0025] For the above-mentioned substrate processing device, it may also be that the second processing component includes a cup for accommodating the substrate and supplying processing liquid to the substrate, and is respectively arranged in front and rear relative to the first substrate conveying area, and a moving mechanism for moving the holding body holding the substrate provided in the second conveying mechanism left and right is provided in the first substrate conveying area.

[0026] The substrate processing method disclosed in the present invention includes the following steps: in a first unit module provided with a first substrate conveying area extending left and right, a first processing component provided on one side facing the left and right of the first substrate conveying area, and a second processing component provided on the other side facing the left and right of the first substrate conveying area, a substrate is delivered to the first processing component by using a first conveying mechanism provided on one side of the left and right of the first substrate conveying area, and a substrate is delivered to the second processing component by using a second conveying mechanism provided on the other side of the left and right of the first substrate conveying area; in the second substrate conveying area of ​​the second unit module including the second substrate conveying area extending left and right and stacked with the first unit module, the substrate is conveyed left and right by using a third conveying mechanism; in a substrate carrying-in and carrying-out module provided on one side of the left and right relative to the stack of unit modules composed of the first unit module and the second unit module, the substrate is placed on a side loading portion provided at a height of the first unit module and a height of the second unit module, and ... the second unit module, and the substrate is placed on a side loading portion provided at a height of the first unit module and the second unit module, and the substrate is placed on a side loading portion provided at a height of the second unit module and the second unit module, and the substrate is placed on a side loading portion provided at a height of the first unit module and the second unit module, and the substrate is placed on a side loading portion provided at a height of the second unit module and the second unit module, and the substrate is placed on a side loading portion provided at a height of the 3 conveying mechanisms for transferring each substrate; placing a carrier for accommodating the substrate on a carrier table provided on the substrate feeding-in and feeding-out module; placing the substrate on the carrier table provided on the substrate feeding-in and feeding-out module; placing the substrate on the other side loading portion provided at the height of the first unit module and the height of the second unit module in a relay module provided on the other side of the stacked body relative to the unit modules, and transferring each substrate between the relay module, the second conveying mechanism and the third conveying mechanism; conveying the substrate between each of the other side loading portions by utilizing the other side conveying mechanism provided on the relay module; conveying the substrate between the carrier and each of the one side loading portions by utilizing the one side conveying mechanism provided on the substrate feeding-in and feeding-out module; and conveying the substrate from the other side of the first unit module to the second processing component by utilizing the one side conveying mechanism from the one side loading portion at the height of the first unit module to the one side loading portion at the height of the second unit module in order to allow the substrate to pass through the second unit module and the relay module in sequence after the first processing component completes processing and before the second processing component performs processing.

[0027] Effects of the Invention

[0028] According to the present disclosure, a substrate processing apparatus can achieve higher productivity and reduce floor space. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a cross-sectional plan view of a coating and developing device according to one embodiment of the present disclosure.

[0030] Figure 2 It is a longitudinal sectional front view of the coating and developing device.

[0031] Figure 3It is a longitudinal sectional front view of the coating and developing device.

[0032] Figure 4 This is a perspective view of a carrier module provided in the coating and developing device.

[0033] Figure 5 This is a perspective view of the front side of a process module provided in the coating and developing device.

[0034] Figure 6 is a longitudinal sectional side view of the processing module.

[0035] Figure 7 It is a top view of a unit module for forming a coating film provided in the processing module.

[0036] Figure 8 It is a top view of a unit module for development provided in the processing module.

[0037] Figure 9 It is a schematic diagram showing a schematic plan view of the coating and developing device.

[0038] Figure 10 It is a schematic diagram showing a schematic plan view of a unit module for coating provided in the processing module.

[0039] Figure 11 It is a longitudinal sectional side view of the interface module of the coating and developing device.

[0040] Figure 12 This is a diagram showing the correspondence between the wafer conveyance path and the conveyance mechanism used in the coating and developing apparatus.

[0041] Figure 13 It is a schematic diagram showing a conveyance path of wafers in the coating and developing device.

[0042] Figure 14 It is a schematic diagram showing a conveyance path of wafers in the coating and developing device.

[0043] Figure 15 It is a schematic side view of the coating device. DETAILED DESCRIPTION

[0044] While referring to Figure 1 Cross-sectional top view, Figure 2 and Figure 3The longitudinal sectional front view of FIG2 illustrates a coating and developing apparatus 1 of one embodiment of a substrate processing apparatus disclosed herein. The coating and developing apparatus 1 forms various films, including a resist film, on a wafer W serving as a substrate. The coating and developing apparatus 1 then develops the resist film, which has been exposed by an exposure unit D5 connected to the coating and developing apparatus 1, to form a resist pattern. The exposure unit D5 performs exposure while a liquid film, such as pure water, is formed on the surface of the wafer W. Specifically, the exposure unit D5 is an apparatus that performs immersion exposure, and the coating and developing apparatus 1 includes processing components corresponding to this immersion exposure.

[0045] This coating and developing apparatus 1 is installed in a clean room within a semiconductor manufacturing facility. As will be described in detail below, the coating and developing apparatus 1 includes a fan filter unit (FFU) that draws in ambient air and a filter that exhausts the drawn air downward, creating a downflow. These filters are located in the moving areas of each conveyor mechanism that transports wafers W and in the cups that receive wafers W and undergo liquid processing, suppressing the dispersion of particles from the conveyor mechanisms and mist from the cups.

[0046] A carrier C called a FOUP (Front Opening Unify Pod) stores multiple wafers W, and a transport mechanism located outside the coating and developing apparatus 1 transports the wafers W to the coating and developing apparatus 1. The external transport mechanism that transports the carrier C, which serves as a transport container, is called, for example, an OHT (Over Head Transport) and is located on the ceiling of the clean room.

[0047] The coating and developing apparatus 1 consists of a carrier module D1, an inspection module D2, a processing module D3, and an interface module D4, arranged in this order horizontally and interconnected. The bottoms of these modules, D1, D2, D3, and D4, are aligned, with the carrier module D1 being shorter than the other modules D2-D4. An exposure unit D5 is connected to the interface module D4 on the side opposite the processing module D3. The carrier module D1 and inspection module D2 serve as substrate loading and unloading modules, while the interface module D4 serves as a relay module.

[0048] In the following description, the arrangement direction of the above-mentioned modules D1 to D4 is set as the left-right direction, the carrier module D1 side is set as the left side, and the interface module D4 side is set as the right side. In addition, with respect to the front-to-back direction of the device, the near-front side when viewed with the carrier module D1 on the left and the interface module D4 on the right is set as the front side, and the deep side is set as the rear side. In each figure, mutually orthogonal X-direction, Y-direction, and Z-direction are respectively shown. The X-direction represents the left-right direction, the Y-direction represents the front-to-back direction, and the Z-direction represents the height direction. In addition, Figure 2and Figure 3 Although longitudinal sections of the coating and developing device 1 are shown in all figures, longitudinal sections at different front and rear positions are shown for parts of the device.

[0049] The carrier module D1 is a module for transporting the carrier C by a carrier transport mechanism provided outside the coating and developing device 1 and for transferring the wafer W between the carrier C and the coating and developing device 1. Figure 4 The left and right sides of the housing 11 forming the carrier module D1 are respectively formed as a lower portion 12 and a higher portion 13 .

[0050] Four carrier stages 14 are provided on the upper surface of the lower portion 12 at intervals in the front-to-back direction. Carriers C are placed on these carrier stages 14 to transport wafers W into and out of the coating and developing apparatus 1. A wafer W transfer port is formed in the housing 11 on the side wall facing leftward as the upper portion 13 is formed, at positions corresponding to the carrier stages 14. This transfer port is opened and closed by an opening and closing mechanism 16.

[0051] Inside the shell 11, a conveying mechanism 17 is provided at the upper body 13. The conveying mechanism 17 includes a movable body that can move freely forward and backward, rotate freely around a vertical axis, and rise and fall freely, and a holding body that can move forward and backward freely relative to the movable body and holds the wafer W. The conveying mechanism 17, which serves as the first side conveying mechanism, is used to transfer the wafer W between the carrier C on the carrier table 14 and the inspection module D2. A filter 18 is provided at the top of the upper body 13. The filter 18 is provided to cover the conveying area where the wafer W is conveyed by the conveying mechanism 17 at the upper body 13, and to form a downward airflow as described above. The filter 18 will also be described when explaining the structure of the inspection module D2. For example, an exhaust port (not shown) is formed at the bottom of the shell 11, and the air in the shell 11 is removed from the exhaust port.

[0052] The inspection module D2 is used to inspect wafers W before and after processing by the coating and developing apparatus 1. The processing module D3 is composed of six stacked layers for transporting wafers W. However, the inspection module D2 also functions to lift and transport wafers W and transfer wafers W between layers of the processing module D3. The inspection module D2 includes a square housing 21, which forms a step with the upper portion 13 of the carrier module D1 when viewed from the front.

[0053] The stack of the transfer assembly TRS, the conveying mechanism 22, and the tower T1 are arranged in the front and back central parts of the shell 21 in this order from the left to the right. In addition, a pre-processing inspection assembly 23 is provided above the stack of the transfer assembly TRS. The pre-processing inspection assembly 23 is a assembly for optically inspecting the wafers W before being processed by the various processing assemblies in the device 1. In addition, a post-processing inspection assembly 24 is provided behind the stack of the transfer assembly TRS and the conveying mechanism 22. The post-processing inspection assembly 24 is a assembly for optically inspecting the wafers W after being processed by the various processing assemblies in the device 1, that is, the wafers W on which the resist pattern has been formed. A conveying mechanism 25 is provided behind the tower T1. The conveying mechanisms 22 and 25 are second side conveying mechanisms that are closer to the processing module D3 than the conveying mechanism 17 to which the above-mentioned carrier C is connected, and together with the conveying mechanism 17, constitute a side conveying mechanism.

[0054] In addition, the component is configured as a place for placing wafers W. Sometimes the component that processes (including inspecting) the wafer W is referred to as a processing component, and sometimes the component in the processing component that uses a processing liquid for processing is referred to as a liquid processing component. If the above-mentioned delivery component TRS is described in advance, the delivery component TRS includes a loading portion on which a plurality of wafers W are arranged in a longitudinal arrangement. That is, one delivery component TRS can carry a plurality of wafers W in a longitudinal arrangement. In order to distinguish the TRSs provided in various parts of the coating and developing device 1, numbers are marked after TRS to indicate them. The delivery components of the stacked body constituting the above-mentioned delivery component TRS are set to TRS41 and TRS42. TRS41 is a delivery component for carrying each wafer W in order to carry it from the carrier module D1 to the inspection module D2, and TRS42 is a delivery component for carrying each wafer W in order to carry it out from the inspection module D2 to the carrier module D1.

[0055] The tower T1 is composed of a plurality of transfer modules TRS and a plurality of temperature adjustment modules SCPL stacked together, and these modules form a side loading portion. The processing module D3 is composed of 6 layers. In order to transfer wafers W between these layers and the inspection module D2, a transfer module TRS and / or a temperature adjustment module SCPL is provided at the height of each layer. For the transfer module TRS of the tower T1, the TRS at the lowest layer is placed at the same height as the TRS at the lowest layer. Figure 3 Indicated as TRS11 and TRS21, the TRS at the second lowest level is Figure 3 In the figure, they are shown as TRS12 and TRS22. In addition, the delivery module TRS in the tower T1 includes TRSs used for delivery of wafers W in the inspection module D2, which are shown as TRS17 and TRS18.

[0056] The temperature control unit SCPL includes a loading portion for loading wafers W and a refrigerant flow path in the loading portion, and is used to control the temperature of the wafers W loaded on the loading portion to a desired temperature. Similar to the TRS, the SCPL is also indicated by a number after the SCPL to distinguish each SCPL. In the tower T1, the temperature control unit is installed at the height of each floor of the processing module D3. Figure 3 The layers are represented in order from the bottom as SCPL11 to SCPL16.

[0057] The transport mechanism 22 includes a movable body that can rotate freely about a vertical axis and can be raised and lowered, and a holding body that can move freely forward and backward relative to the movable body and holds the wafer W. The transport mechanism 22 is connected to the transfer assembly TRS, pre-processing inspection assembly 23, and post-processing inspection assembly 24 within the inspection module D2, transferring wafers W between these assemblies. The transport mechanism 25 is connected to the various assemblies of the tower T1, transferring wafers W between these assemblies.

[0058] Within the housing 21 of the inspection module D2, the stacked structure of the transfer assembly TRS and the front side of the conveyor mechanism 22 form a liquid storage area 26, which is equipped with a storage unit for various processing liquids used in the liquid processing performed by the coating and developing device 1. In addition, at the top of the housing 21, a filter 28 is installed above the conveyor mechanism 22, and a filter 29 is installed above the conveyor mechanism 25 to form a downward airflow.

[0059] FFUs 31, 32, and 33 are arranged in this order on housing 21 from left to right. FFUs 32 and 33 supply the air they draw in to filters 28 and 29, respectively, and exhaust the air from filters 28 and 29 to the rear and downward directions. The exhausted air flows, for example, toward carrier module D1 and is exhausted. Furthermore, one end of a duct 34 is connected to FFU 31, which serves as the gas supply mechanism. The other end of duct 34 extends downward along the side wall of housing 21 and connects to filter 18 in the upper portion 13 of carrier module D1. In other words, the air drawn in by FFU 31 is exhausted downward from filter 18.

[0060] In addition, three layers of racks are provided above the high body 13, each of which can hold a plurality of carriers C arranged in a front-to-back arrangement. Each rack is provided so as to protrude from the side wall of the inspection module D2. The two racks on the lower side serve as the carrier standby section 20, and the rack on the upper side serves as the carrier delivery section 19. The carrier delivery section 19 is a place where the carriers C are placed in order to be delivered to an external transport mechanism such as the OHT described above. The carrier standby section 20 is a place where the carriers C are placed before being delivered to the coating and developing device 1, and before being retrieved after being delivered. In this way, the carrier delivery section 19 and the carrier standby section 20 constitute a temporary carrier placement section for temporarily placing the carriers C.

[0061] The lower portion 12 of the carrier module D1 is provided with a transfer mechanism (not shown) for the carriers C. This transfer mechanism transfers the carriers C, which have been transported to the carrier loading / unloading section 19 by an external transport mechanism, in the order of the carrier stage 14, the carrier standby section 20, the carrier stage 14, and the carrier loading / unloading section 19. The carriers C thus transferred are then transported from the carrier loading / unloading section 19 to another device by the external transport mechanism.

[0062] Next, let's describe process module D3. As mentioned above, process module D3 is constructed from six stacked layers, each of which serves as a unit module and is represented from the bottom as E1 to E6. Furthermore, two vertically consecutive layers contain the same type of processing components, enabling the same processing to be performed on wafers W. Specifically, the same type of processing can be performed between unit modules E1 and E2, between unit modules E3 and E4, and between unit modules E5 and E6.

[0063] In the processing module D3, a chemical solution (coating liquid), a developer, and a cleaning liquid for forming a coating film are supplied to the wafer W as processing liquids, thereby forming, developing, and cleaning the coating film. As the coating film, an anti-reflective film, a resist film, and a protective film are formed on the surface of the wafer W in this order. The protective film is a film used to protect the resist film during immersion exposure. In addition, the cleaning performed in the processing module D3 is the cleaning of the back side of the wafer W before exposure. This cleaning is performed to prevent foreign matter attached to the back side of the wafer W when the wafer W is placed on the mounting table of the exposure machine D5, causing the height of the surface of the wafer W to be abnormal and defocusing.

[0064] As previously described, the liquid processing performed in each unit module E (E1-E6) involves forming an antireflective film as a lower layer for the resist film and cleaning the backside of the wafer W before exposure in unit modules E1 and E2. Resist and protective films are formed in unit modules E3 and E4, and development processing is performed in unit modules E5 and E6. Therefore, wafers W are transported in the order: unit modules E1 and E2 → unit modules E3 and E4 → unit modules E1 and E2 → E5 and E6. Unit modules E1-E6 are separated from each other, and wafers W are transported in separate transport areas for each unit module. However, as will be described in detail below, this transport area separation is not performed on the right side of unit modules E1 and E2.

[0065] The stack of unit modules E1 to E6 is formed into a square shape. Furthermore, additional equipment installation sections 35 and 36 are provided to sandwich the front side of the stack from left and right. The additional equipment installation section 35 is located on the inspection module D2 side, enters the housing 21 of the inspection module D2, and is located in front of the tower T1 described above. Therefore, the additional equipment installation section 35 is configured to sandwich the tower T1 from the front and back together with the conveying mechanism 25. The additional equipment installation section 36 is located on the interface module D4 side, and its detailed location will be described later. The additional equipment installation sections 35 and 36 are modules for installing additional equipment for the liquid processing components of each unit module E and are located in a height area that spans the unit modules E1 to E6.

[0066] The additional equipment for the liquid processing assembly includes cables for supplying power to the assembly, exhaust piping that forms an exhaust path for exhausting air from the cups that make up the assembly, a drain pipe that forms a drainage path for draining liquid from the assembly, and a supply pipe that forms a supply path for supplying treatment liquid to the assembly. The power supply cables, exhaust piping, drain pipe, and treatment liquid supply pipe are routed downwardly through additional equipment installation section 35 for the liquid processing assembly on the left side of unit module E, while the equipment related to the liquid processing assembly on the right side of unit module E is routed downwardly through additional equipment installation section 36.

[0067] Figure 5 The schematic structure of the front side of the processing module D3 is shown. The cups constituting the above-mentioned liquid processing components are provided on a base separated on the left and right sides of each unit module E1 to E6, with the base on the left side being set as 91 and the base on the right side being set as 92. Moreover, the gap between the bases 91 and 92 of each unit module E is set as 93. In addition, in the unit modules E1 and E2, the setting portion 39 of the processing liquid supply machine described later is interposed between the bases 91 and 92, and the space between the setting portion 39 and the base 91 is set as a gap 93. In each unit module E, a gap 93 is formed in the central portion on the left and right, and the gap 93 is utilized by the configuration of the additional equipment of the liquid processing component, i.e., the developing component, of the unit modules E5 and E6, but will be described in detail later. With respect to the bases 91, 92 and the gap 93, in this Figure 5 and the structure of the unit module E5 described later. Figure 8 Other than that, its representation is omitted.

[0068] Next, refer also to the longitudinal sectional side view of the processing module D3. Figure 6 First, the unit module E3 will be described. Figure 7This is a top view of the unit module E3. A wafer W conveyance path (conveying area) 30 extending horizontally is formed in the front and rear center of the unit module E3. A filter 37 is provided to create a downward airflow throughout the entire conveyance path 30. This filter 37 is located at the top of the unit module E3, forming the conveyance path 30. In front of the conveyance path 30, a resist coating module 4A is provided on the left side, and a chemical solution coating module 4B for forming a protective film is provided on the right side, facing the conveyance path 30. Therefore, these resist coating modules 4A and chemical solution coating modules 4B are arranged side by side.

[0069] The resist coating module 4A includes a partition wall 41 that partitions the resist coating module 4A from the conveying path 30 and other modules. A conveying port 42 ( Figure 7 (not shown) so that the wafer W can be transported into the cup 43 described later. The resist coating assembly 4A includes three cups 43 that respectively accommodate wafers W and are arranged on the left and right. A rotary chuck 44 is provided in the cup 43 to adsorb and hold the back side of the wafer W and rotate it. The cup 43 is connected to an exhaust source such as the factory's exhaust duct by means of the above-mentioned exhaust pipe as an additional equipment, so that the inside of the cup 43 is exhausted. That is, the resist coating assembly 4A exhausts air using the cup 43. In addition, the above-mentioned drain pipe as an additional equipment is connected to the cup 43. Moreover, the resist coating assembly 4A is provided with a nozzle 45 that is shared by the three cups 43 and sprays the resist onto the surface of the wafer W. The nozzle 45 is moved between the wafer W in each cup 43 and, for example, a standby area not shown in the figure, which is provided between the cups 43, by means of a nozzle moving mechanism 46.

[0070] Furthermore, a filter 47 is provided on the top of the unit module E3 so as to overlap the three cups 43. This filter 47 is arranged to form a downward airflow toward the cups 43. Furthermore, in the resist coating unit 4A, the unit module E3 is provided on the left side, and therefore, as described above, its additional equipment is provided in the additional equipment installation portion 35.

[0071] The chemical solution coating unit 4B for forming a protective film is similar to the resist coating unit 4A except that the chemical solution for forming a protective film is sprayed from the nozzle 45 instead of the resist and the additional equipment is installed in the additional equipment installation part 36. In addition, the cup 43 of the resist coating unit 4A is installed in the Figure 5 The base 91 of the illustrated embodiment, the cup 43 of the chemical solution coating assembly 4B is provided on the base 91 of the illustrated embodiment. Figure 5 A substrate 92 is illustrated.

[0072] At the rear of the conveyor path 30, processing components are stacked in two layers facing the conveyor path 30, and 8 stacked bodies of the processing components are arranged in a left-right arrangement to form a processing component group. As components constituting the processing component group, for example, a plurality of heating components 51, a plurality of heating components 52 and an inspection component 53 are included. The heating components 51 and 52 include a hot plate for heating the wafer W placed on the hot plate to remove the solvent in the coating film. The heating component 51 heats the wafer W after the anti-etching film is formed and before the protective film is formed, and the heating component 52 heats the wafer W after the protective film is formed. The inspection component 53 photographs the wafer W to inspect the anti-etching film of the wafer W after being heated by the heating component 51.

[0073] The unit module E3 is provided with a conveying mechanism F3. This conveying mechanism F3 delivers wafers W to each assembly facing the conveyance path 30 from the front and rear, to an assembly at the level of the unit module E3 in tower T1, and to an assembly at the level of the unit module E3 in tower T2, described later, located in the interface module D4. The conveying mechanism F3 includes two holders 61 that each hold the wafer W; a movable body 62 that independently moves each holder 61 forward and backward; a rotating unit 63 that rotates the movable body 62 about a vertical axis; an elevating unit 64 that raises and lowers the rotating unit 63; and a moving mechanism 65 including a drive shaft that moves the elevating unit 64 left and right.

[0074] The holding member 61, the movable member 62, the rotating portion 63, and the lifting portion 64 are provided on the conveyor path 30. The moving mechanism 65 is provided below the processing module cluster on the rear side of the conveyor path 30. The conveyor path 30 is exhausted from the conveying port (not shown) for wafers W formed in the processing module cluster and the area where the moving mechanism 65 is provided. In other words, the conveyor path 30 is configured so that exhaust is provided from the rear. Furthermore, the conveyor mechanism 17 of the carrier module D1 described above has the same structure as the conveyor mechanism F3, except that the direction of movement by the moving mechanism 65 is different. The conveyor mechanisms 22 and 25 of the inspection module D2 have the same structure as the conveyor mechanism F3, except that the moving mechanism 65 is not provided.

[0075] The unit module E4 has the same structure as the unit module E3, and the transport mechanism equivalent to the transport mechanism F3 is set as F4. Next, the unit modules E1 and E2 will be described with the focus on the differences between the unit modules E1 and E2 and the unit modules E3 and E4. Figure 1 The top view of the unit module E1 is shown, except for the reference to the longitudinal section of the main view. Figure 2 、 Figure 3 and represents the longitudinal side view Figure 6 In addition, refer to the Figure 1The left sides of unit modules E1 and E2 are configured similarly to unit modules E3 and E4. In front of the conveyor path 30 of each unit module E1 and E2, a chemical solution coating unit 4C for forming an anti-reflective film is provided, facing the conveyor path 30, in place of the resist coating unit 4A. Chemical solution coating unit 4C is configured similarly to resist coating unit 4A, except that a chemical solution for forming an anti-reflective film is sprayed from nozzle 45 instead of resist.

[0076] In addition, in unit modules E1 and E2, a stack of processing components of two layers are arranged in the same manner as in unit module E3, forming a processing component group on the rear side of conveyor path 30. However, in unit modules E1 and E2, only 5 stacks of these processing components are provided, which are configured to be close to the left side of unit modules E1 and E2. In this processing component group, for example, a plurality of hydrophobic treatment components 54, a plurality of heating components 55, and an inspection component 56 are included. The hydrophobic treatment component 54 includes a hot plate for carrying wafer W and heating it and a gas supply portion for supplying gas for hydrophobic treatment to the surface of the wafer W heated by the hot plate. The heating component 55 is the same structure as the heating components 51 and 52, and is used to heat the wafer W after the anti-reflection film is formed and remove the solvent in the film. The inspection component 56 shoots the wafer W after the anti-reflection film is formed to inspect it.

[0077] Conveyor mechanisms F1 and F2, equivalent to conveyor mechanism F3, are provided on the left sides of unit modules E1 and E2, respectively. Conveyor mechanism F1 accesses the processing module group behind unit module E1's conveyor path 30, the chemical solution coating module 4C of unit module E1, and the components at the level of unit module E1 in tower T1, transferring wafers W between these components. Conveyor mechanism F2 transfers wafers W in the same manner as conveyor mechanism F1, except that it accesses components within unit module E2 and components at the level of unit module E2 in tower T1.

[0078] The conveying path 30 is interconnected between the unit modules E1 and E2. That is, no top portion is provided on the right side of the unit module E1 to divide the conveying path 30. Hereinafter, the conveying path (conveying area) connected vertically on the right side of the unit modules E1 and E2 will be referred to as a common conveying path 66, and will be described separately from the conveying path 30 separated between the unit modules on the left side of the unit modules E1 and E2. Since there is no structure to divide the conveying path 30 on the unit module E1, a downward airflow is formed in the common conveying path 66 using the filter 37 of the second unit module E2. The above-mentioned conveying mechanisms F1 and F2 move only in the conveying path 30 between the conveying path 30 and the common conveying path 66 to transfer the wafer W.

[0079] On the right side of unit modules E1 and E2, a backside cleaning module 4D is provided as a cleaning module for cleaning the backside of wafer W. This backside cleaning module 4D faces the common conveyor path 66 and is located in front of and behind this common conveyor path 66. Therefore, the backside cleaning module 4D and the chemical solution coating module 4C are arranged side by side in front of the unit modules E1 and E2. The backside cleaning module 4D has a structure similar to that of the resist coating module 4A. The differences between the backside cleaning module 4D and the resist coating module 4A will be described below. Two cups 43 of the backside cleaning module 4D are arranged side by side. Similar to the resist coating module 4A, a downward airflow is formed from the filter 37 at the top of the unit module toward these cups 43.

[0080] In addition to the rotating chuck 44, each cup 43 is provided with a nozzle (not shown) that sprays a cleaning liquid onto the back side of the rotating wafer W. Unlike the resist coating assembly 4A, the back side cleaning assembly 4D does not have a nozzle 45 for supplying a coating liquid onto the surface of the wafer W, nor does it have a nozzle moving mechanism 48 corresponding to the nozzle 45. Since the nozzle 45 is not provided, there is no standby area for the nozzle 45. Therefore, the distance between the cups 43 of the back side cleaning assembly 4D is smaller than the distance between the cups 43 of the resist coating assembly 4A and the chemical solution coating assemblies 4B and 4C described above. In addition, the back side cleaning assembly 4D is configured to be able to process the front and back sides of the wafer W without flipping it over. To be more specific, the wafer W is transported to the back side cleaning assembly 4D with its back side facing downward, and its back side is held by a holding portion. In addition, a brush is provided inside the cup 43 of the back side cleaning assembly 4D. The back side of the wafer W held by the holding portion is cleaned by supplying cleaning liquid from the nozzle in the cup 43 and sliding the brush. The holding portion holding the back side of the wafer W comprises a rotary chuck 44 and a holding mechanism (not shown) that holds a portion of the back side of the wafer W different from the portion held by the rotary chuck 44. These components sequentially hold the back side of the wafer W so that the entire back side of the wafer W can be cleaned.

[0081] Furthermore, the two cups 43 constituting the backside cleaning assembly 4D are provided on the aforementioned base 92, which is common to each cup 43. Therefore, the rotary chuck 44 within the cup 43, the rotating mechanism for rotating the rotary chuck 44, and the nozzle for spraying cleaning liquid onto the backside of the wafer W are also provided on the base 92. By providing a plurality of cups 43 on a common base 92, it is possible to reduce maintenance work such as adjusting the levelness of each rotary chuck 44. Furthermore, a portion of the power supply system for supplying power to, for example, the aforementioned rotating mechanism and the moving mechanism for moving the nozzle is shared between the cups 43 and provided on the base 92. By providing a plurality of cups 43 on the base 92, it is possible to share the components required for processing each cup 43, thereby reducing the manufacturing cost of the backside cleaning assembly 4D and, by extension, the manufacturing cost of the coating and developing apparatus 1.

[0082] The auxiliary equipment of the back cleaning unit 4D on the rear side of the common conveying path 66, namely, the power supply cable, exhaust duct, drain pipe, and process liquid supply pipe, are respectively routed through the space outside the row of cups 43. In contrast, the power supply cable, exhaust duct, drain pipe, and process liquid supply pipe of the back cleaning unit 4D on the front side of the common conveying path 66 are respectively routed through the auxiliary equipment installation portion 36 described above.

[0083] In each of the unit modules E1 and E2, a processing liquid supply unit installation unit 39 is provided in front of the conveyor path 30, between the chemical solution coating unit 4C for forming the anti-reflective film and the backside cleaning unit 4D. This processing liquid supply unit includes pumps and valves for supplying processing liquid to the resist coating unit 4A, chemical solution coating unit 4B, chemical solution coating unit 4C, backside cleaning unit 4D, the developing unit (described later), and the post-exposure cleaning unit. Specifically, the processing liquids stored in the liquid storage area 26 of the inspection module D2 are supplied to the respective liquid processing units via the pumps in this installation unit 39.

[0084] Unit modules E1 and E2 are equipped with a conveyor mechanism F7 shared by both modules. This conveyor mechanism F7 can access the backside cleaning modules 4D of the unit modules E1 and E2 and the tower T2 of the interface module D4 at each level of the unit modules E1 and E2, transferring wafers W between these modules. Specifically, the conveyor mechanism F7 moves only along the common conveyor path 66, out of the conveyor path 30 and the common conveyor path 66, to transfer wafers W.

[0085] The conveying mechanism F7 is constructed in a similar manner to the conveying mechanisms F1 to F4. The difference is that the length of the holding body 61 of the conveying mechanism F7 that can be raised and lowered is greater than the length of the holding body 61 of the conveying mechanisms F1 to F4 that can be raised and lowered in order to accommodate the back cleaning units 4D at various heights. Figure 6 As shown, the moving mechanism 65 of the conveying mechanism F7 is provided at the bottom of the common conveying path 66 .

[0086] In the back cleaning module 4D, the cup 43 is set at a sufficient height to suppress the spread of liquid, and a rotating mechanism is provided below the spin chuck 44. Therefore, the height of the module is greater than the height of the various modules that make up the processing module group behind the conveyor path 30. On the other hand, because wafers W are conveyed from above the cup 43, the conveyor mechanism F7 is accessed from a relatively high position relative to the back cleaning module 4D. In other words, even if the moving mechanism 65 of the conveyor mechanism F7 is located at the bottom of the common conveyor path 66 as described above, access to the back cleaning module 4D in the unit module E1 is not hindered. Furthermore, sometimes it is necessary to reduce the height of the clean room where the coating and developing apparatus 1 is installed, thereby reducing the height of the unit module E. Therefore, by providing the moving mechanism 65 in the common conveyor path 66, the above-described structure of arranging the moving mechanism 65 without overlapping the back cleaning module 4D allows the back cleaning module 4D to be located behind the common conveyor path 66 in the unit module E1, thereby increasing the number of back cleaning modules 4D that can be installed.

[0087] Next, refer to Figure 8 , while explaining the unit module E5 with the differences from the unit module E3 as the center. The component group on the rear side of the conveying path 30 includes, for example, a heating component and an inspection component 59. As the heating component, there are a plurality of heating components 57 for heating the wafer W after exposure (so-called PEB: post exposure bake) and a plurality of heating components 58 for heating the wafer W after development, each of which is constructed similarly to the heating component 51. The inspection component 59 is a component that photographs the wafer W processed by the heating component after development in order to inspect it. In addition, in the unit module E5, a conveying mechanism equivalent to the conveying mechanism F3 of the unit module E3 is set to F5.

[0088] In front of the conveying path 30 of the unit module E5, a first developing module 4E and a second developing module 4F are provided instead of the resist coating module 4A and the chemical solution coating module 4B. The first developing module 4E supplies a developer for developing a positive resist to the wafer W, and the second developing module 4F supplies a developer for developing a negative resist to the wafer W. The wafer W is processed in either the first developing module 4E or the second developing module 4F depending on the type of resist film formed. In this example, five first developing modules 4E are arranged on the left and right and close to the left side of the unit module E5, and three second developing modules 4F are arranged on the left and right and close to the right side of the unit module E5. Therefore, there are eight developing modules. The four developing modules on the left are provided on the base 91, and the four developing modules on the right are provided on the base 92.

[0089] The first developing assembly 4E includes a cup 43 and a rotary chuck 44, similar to the resist coating assembly 4A, but only one of each is provided. A nozzle for supplying developer to the surface of wafer W moves from the front standby area toward the cup to process wafer W, but the nozzle is not shown. Aside from the aforementioned developer type, the second developing assembly 4F is constructed similarly to the first developing assembly 4E. The distances between the cups 43 of the four left developing assemblies and the distances between the cups 43 of the four right developing assemblies are shorter than the distances between the cups 43 of the aforementioned liquid processing assemblies. More cups 43 are provided in unit module E5 compared to unit modules E1 to E4.

[0090] exist Figure 8 1 and 2. The diagram also schematically illustrates the additional equipment of the developing units (first developing unit 4E and second developing unit 4F). The additional equipment includes an exhaust duct, which is an exhaust path-forming member connected to the cup 43 of the developing unit, indicated by 71. Furthermore, a power supply cable connected to the developing unit is indicated by 72, and a developer supply pipe connected to the developing unit is indicated by 73.

[0091] The exhaust duct 71, power supply cable 72, and developer supply pipe 73 are shared by the three first developer assemblies 4E on the left end of the eight developer assemblies. Specifically, the exhaust duct 71 is installed in each of these three assemblies, with its upstream end connected to them. However, its downstream end merges, making it shared across all three assemblies. This shared portion extends from the unit module E5 to the additional equipment installation section 36, heading downward from the apparatus. Similarly to the exhaust duct 71, the power supply cable 72 and developer supply pipe 73 are also shared, formed at the upstream end of each assembly, and merged. Their shared portions extend to the additional equipment installation section 36, heading downward from the apparatus.

[0092] Furthermore, the exhaust ducts 71, power supply cables 72, and developer supply pipes 73 of the three second developer assemblies 4F on the right side of the eight developer assemblies are constructed similarly to the exhaust ducts 71, power supply cables 72, and developer supply pipes 73 of the developer assemblies on the left side described above. In other words, these additional devices are shared among the three developer assemblies, and the shared portions are led out of the unit module E5 to the additional device installation section 36 and then to the bottom of the device.

[0093] Next, the first exhaust pipe 71, power supply cable 72, and developer supply pipe 73 of the two first developing units 4E in the center of the eight developing units are shared. Figure 5The liquid is led out toward the bottom of the device through the gap 93 between the base bodies 91 and 92 described above, and then through the gap 93 between the base bodies 91 and 92 of the lower unit module E. Furthermore, as an additional device, the drain pipe connected to the cup 43 of each developing unit is omitted from the figure, but is divided and routed in the unit module E5 in the same manner as the exhaust pipe 71 described above.

[0094] In this way, in unit module E5, the auxiliary equipment is divided into three sections: auxiliary equipment for the three left-side developing assemblies, auxiliary equipment for the two central developing assemblies, and auxiliary equipment for the three right-side developing assemblies. Therefore, exhaust is exhausted from the left, central, and right-side developing assemblies separately using separate exhaust ducts. This reduces variations in the distance from the exhaust source connected to the exhaust duct to each developing assembly. Consequently, exhaust can be uniformly exhausted from the cups 43 of each developing assembly, preventing deficiencies in exhaust performance caused by a particular cup 43 being too far from the exhaust source and improving processing uniformity across each developing assembly.

[0095] Furthermore, corresponding to the above-described division of the exhaust duct into three sections, the power supply cable 72, developer supply pipe 73, and drain pipe are also divided into three sections. Therefore, if any developing unit experiences an abnormality, only the developing unit sharing the auxiliary equipment can be stopped for maintenance. In other words, processing can continue without stopping developing units that do not share the auxiliary equipment for maintenance, thus advantageously preventing a decrease in productivity.

[0096] The unit module E6 is similar to the unit module E5 in structure. In the unit module E6, the transport mechanism equivalent to the transport mechanism F3 of the unit module E3 is set as F6. On the upper side of the unit module E6, that is, on the upper side of the processing module D3, an FFU74 is provided (see Figure 6 The air sucked in by the FFU 74 is supplied via ducts (not shown) to filters 37 located in the conveying paths 30 of the unit modules E1 to E6, the shared conveying path 66 of the unit modules E1 and E2, and filters 47 located in each liquid processing unit, thereby forming a downward airflow. The FFU 74 and the cups 43 of each unit module E constitute the air supply and exhaust section.

[0097] Furthermore, pressure distribution is formed in each unit module E by exhausting air from the rear side of the conveying path 30 and the cup 43 of the liquid processing unit and supplying air from each filter 37, 47. Figure 9 、 Figure 10 The schematic top view illustrates the pressure distribution. Figure 9 Indicates modules D1 to D4 including unit module E1, Figure 10 The unit module E3 is shown, and the direction of the airflow formed by the pressure distribution is indicated by arrows in these figures.

[0098] In the unit modules E1 and E2, by supplying and exhausting air in each part as described above, the pressure of the conveying path 30 and the common conveying path 66 is controlled to be lower than the pressure of the chemical solution coating component 4C used for forming the anti-reflection film, and higher than the pressure of the back cleaning component 4D. The reason for controlling the pressure of each part in this way is described. A higher cleanliness level is preferably applied to the chemical solution coating component 4C that forms the coating film to prevent particles from mixing into the coating film and causing defects. Therefore, a flow of air is formed from the chemical solution coating component 4C toward the conveying path 30 to prevent particles from flowing into the chemical solution coating component 4C from the conveying path 30 and the common conveying path 66. On the other hand, since the back cleaning component 4D does not perform film formation, the risk of the process becoming abnormal due to particles flowing in from the conveying path 30 and the common conveying path 66 is lower than that of the chemical solution coating component 4C. Furthermore, an air flow is formed from the common transport path 66 toward the backside cleaning module 4D to more reliably prevent mist generated during the cleaning of the wafers W from flowing into the common transport path 66 and the transport path 30 and adhering to the wafers W. As described above, the pressure distribution described above is formed between the transport paths 30 and the common transport path 66, the chemical solution coating module 4C, and the backside cleaning module 4D to form this air flow.

[0099] On the other hand, in the unit modules E3 and E4, the pressure of the conveying path 30 is controlled to be lower than the pressure of the resist coating unit 4A and the chemical solution coating unit 4B in order to prevent the particles from being mixed into the coating film. Figure 10 As shown, air flows from the resist coating module 4A and the chemical solution coating module 4B to the conveying path 30. In the unit modules E5 and E6, the pressure of the conveying path 30 is also controlled to be lower than the pressure of the first developing module 4E and the second developing module 4F, thereby suppressing the adhesion of particles to the wafer W during development. Figure 9 、 Figure 10 As shown, the air supplied to the conveying path 30 and the common conveying path 66 of each unit module E is exhausted from the rear of the conveying path 30 or from the cup 43 of the back cleaning module 4D, and is removed by flowing into the inspection module D2 and the interface module D4.

[0100] Unit modules E1 and E2 are the first unit modules. Furthermore, unit modules E3 to E6 are the second unit modules. Unit modules E3 and E4 are outbound unit modules, and unit modules E5 and E6 are return unit modules. The conveyor path 30 and shared conveyor path 66 of unit modules E1 and E2 constitute the first substrate conveying area, while the conveyor path 30 of unit modules E3 and E4 constitutes the second substrate conveying area. Conveyor mechanisms F1 and F2 constitute the first conveyor mechanism, conveyor mechanism F7 constitutes the second conveyor mechanism, and conveyor mechanisms F3 to F6 constitute the third conveyor mechanism. Furthermore, the chemical solution coating module 4C for forming an anti-reflective film is the first processing module, the back surface cleaning module 4D is the second processing module, and the resist coating module 4A and the chemical solution coating module 4B for forming a protective film are the third processing module. The first developing module 4E and the second developing module 4F constitute the fourth processing module.

[0101] Next, in addition to referring to the top view Figure 1 and the longitudinal section main view Figure 2 、 Figure 3 In addition, refer to the longitudinal side view Figure 11 The interface module D4 is described. The interface module D4 includes a square shell 81. A tower T2 is provided in the center of the front and rear parts of the shell 81 near the processing module D3. The tower T2 enters the shell 81 and is located behind the additional equipment setting part 36. The tower T2 is composed of a plurality of transfer components TRS and a plurality of temperature adjustment components SCPL stacked together, and these components constitute the other side loading part. In addition, a temperature adjustment component for adjusting the temperature of the wafer W before it is sent to the exposure machine D5 is provided on the lower side of the tower T2, and the temperature adjustment component is set as ICPL. In addition, in Figure 11 In the figure, for the convenience of illustration, the original position of the tower T2 is indicated by a dot-dash line, and the components included in the interface module D4 are clearly indicated by a solid line outside the interface module D4.

[0102] On the upper side of the interface module D4, to the right of the additional equipment installation section 36, four post-exposure cleaning modules 80, serving as post-exposure processing modules, are arranged vertically. The post-exposure cleaning modules 80 are rectangular in plan view, with their long sides extending from front to back to minimize the left-right length of the interface module D4. These post-exposure cleaning modules 80 are constructed similarly to the developing modules, except that they supply a cleaning solution to the surface of the wafer W, instead of a developer, to remove the protective film and clean the surface of the wafer W.

[0103] Furthermore, a vertically long buffer assembly 82 is provided to the rear and right of tower T2, located above interface module D4. Therefore, buffer assembly 82 is positioned offset from the rows of TRSs and SCPLs included in tower T2. As a retention assembly, buffer assembly 82 is configured to hold wafers W before processing in backside cleaning module 4D and is capable of holding and retaining a greater number of wafers W than the transfer module TRS.

[0104] Furthermore, interface module D4 includes conveyor mechanisms 87, 88, and 89, which constitute the other-side conveyor mechanism. Conveyor mechanisms 87 and 88 include the same components as conveyor mechanisms F1 to F7, except that the moving mechanism 65 is not provided. Conveyor mechanism 87, which serves as the second other-side conveyor mechanism and a conveyor mechanism, is located behind tower T2. Therefore, conveyor mechanism 87 and the additional equipment installation section 36 sandwich tower T2 in front and behind. Conveyor mechanism 87 can connect to the transfer module TRS, temperature adjustment module SCPL, temperature adjustment module ICPL, and buffer module 82 at each height of tower T2, and transfer wafers W between these components.

[0105] Moreover, the conveying mechanism 88, which serves as the first other-side conveying mechanism, is located on the right side of the tower T2 and can access the buffer assembly 82, the various transfer assemblies TRS on the upper side of the tower T2, and the temperature adjustment assembly SCPL, and transfer wafers W between these assemblies. That is, in contrast to the conveying mechanism 88 transferring wafers W on the upper side of the interface module D4, the conveying mechanism 87 is a conveying mechanism that transfers wafers W between the upper side and the lower side of the interface module D4. To this end, the retaining body 61 of the conveying mechanism 87 is configured to be able to be raised and lowered a longer distance than the retaining body 61 of the conveying mechanism 88. That is, the conveying area for conveying wafers W using the conveying mechanism 87 is longer in the longitudinal direction than the conveying area for conveying wafers W using the conveying mechanism 88. The buffer assembly 82, the conveying mechanism 88, and the post-exposure cleaning assembly 80 are configured to be arranged in a row from front to back when viewed from above.

[0106] The transport mechanism 89 is located below the post-exposure cleaning module 80. The moving mechanism 65 that constitutes the transport mechanism 89 is configured to move components such as the holder 61 in the front-rear direction. The transport mechanism 89 can access the transfer module TRS and the temperature control module ICPL located below the tower T2, and transfer wafers W between these modules.

[0107] The transfer assembly TRS and the temperature adjustment assembly SCPL provided in the tower T2 are supplemented. The TRS is located at the height of the unit modules E1 to E6, and the TRS used for the transfer relative to these unit modules E1 to E6 are set as TRS31 to TRS36. In addition, in addition to TRS33 and TRS34, the TRSs located at the height of the unit modules E3 and E4 and used for the transfer relative to these unit modules E3 and E4 are respectively represented as TRS43 and TRS44. In addition, TRS37 for transferring wafers W between the conveying mechanism 87 and the conveying mechanism 89 is provided on the lower side of the tower T2, and TRS38 for transferring wafers W between the conveying mechanism 87 and the conveying mechanism 88 is provided on the upper side of the tower T2. The temperature adjustment assembly SCPL of the tower T2 is provided at the height of the unit modules E3 to E6 and is represented as SCPL33 to SCPL36.

[0108] The FFU 86 provided on the upper portion of the interface module D4 is directed to the filter 85 (see FIG. 1 ) provided on the upper side of the cup 43 of each post-exposure cleaning unit 80. Figure 3 ) supplies air to form a downward airflow. In addition, in addition to the filter 85, the interface module D4 is also provided with a filter that uses the air supplied from the FFU 86 to form a downward airflow in the wafer W conveying area within the housing 81, but the representation of this filter is omitted.

[0109] In addition, the coating and developing device 1 includes a control unit 10 (see Figure 1 The control unit 10 is composed of a computer and includes a program, a memory, and a CPU. The program includes a group of steps to implement a series of actions of the coating and developing device 1. The control unit 10 then uses the program to output control signals to various parts of the coating and developing device 1 to control the actions of these parts. This allows the wafer W to be transported and processed, as described later. The program is stored on a storage medium such as a CD, hard disk, or DVD, and is loaded into the control unit 10.

[0110] Next, refer to Figures 12 to 14 , a conveyance path of the wafer W in the coating and developing apparatus 1 will be described. Figure 12The diagram shows the correspondence between the components and the conveying mechanisms used for the input and output of the components. If described in more detail, the components are recorded in the horizontal arrangement of the table according to the order of conveying the wafer W, and the conveying mechanisms are recorded in the vertical arrangement, and the squares in the table corresponding to the conveying mechanisms used for the input and output of the components are marked with oblique lines. In addition, in the table, TRS is represented as T, SCPL is represented as S, ICPL is represented as I, and the carrier C is also represented as a component. In addition, the table also shows which of the modules D1 to D5 each component belongs to, but for the convenience of illustration, the temperature adjustment component SCPL of the inspection module D2 and the interface module D4 and a part of the handover component TRS are represented as being provided in the processing module D3. In addition, Figure 13 、 Figure 14 The transport path is schematically shown using arrows, and some components through which the wafer W passes are omitted. Figure 13 The path of the wafer W from the carrier C to the exposure machine D5 is shown. Figure 14 1 and 2 show the path of the wafer W from the exposure device D5 to the carrier C.

[0111] Wafers W are transported from carrier C to transfer module TRS41 of inspection module D2 by transport mechanism 17 of carrier module D1, transported to pre-processing inspection module 23 by transport mechanism 22 for inspection, and then transported to transfer module TRS17 of tower T1 by transport mechanism 22. Wafers W transported to transfer module TRS17 are distributed to transfer modules TRS11 and TRS12 of tower T1 by transport mechanism 25.

[0112] The wafer W transported to the transfer assembly TRS11 is sent into the unit module E1 using a conveying mechanism F1. Then, the wafer W is sequentially transported to the hydrophobic treatment assembly 54, the temperature adjustment assembly SCPL11 of the tower T1, the chemical solution coating assembly 4C, the heating assembly 55, and the inspection assembly 56, and is sequentially subjected to hydrophobic treatment, temperature adjustment treatment, the formation treatment of the anti-reflective film, heat treatment, and inspection. Then, the wafer W is transported to the transfer assembly TRS21 of the tower T1 using a conveying mechanism F1 and sent out from the unit module E1. On the other hand, the wafer W transported to the transfer assembly TRS12 is sent into the unit module E2 using a conveying mechanism F2. Then, it is processed in the same manner as the wafer W sent into the unit module E1, and thereafter, it is transported to the transfer assembly TRS22 of the tower T1, thereby being sent out from the unit module E2.

[0113] The wafer W transported to the transfer assembly TRS12 and TRS22 is distributed to the temperature adjustment assembly SCPL13 and SCPL14 of the tower T1 by the conveying mechanism 25. The wafer W transported to the temperature adjustment assembly SCPL13 is sent to the unit module E3 by the conveying mechanism F3. Then, the wafer W is sequentially transported to the resist coating assembly 4A, the heating assembly 51, the inspection assembly 53, the transfer assembly TRS33 of the tower T2, the temperature adjustment assembly SCPL33, the chemical solution coating assembly 4B for forming the protective film, and the heating assembly 52. ​​Thus, the wafer W is subjected to temperature adjustment treatment, resist film formation treatment, heating treatment, inspection, temperature adjustment treatment, and heating treatment in sequence. Then, the wafer W is transported to the transfer assembly TRS43 of the tower T2 by the conveying mechanism F3, and is sent to the interface module D4 from the unit module E3.

[0114] The wafer W transferred to the temperature control module SCPL14 is transported to the unit module E4 by the transport mechanism F4, and is processed in the same manner as the wafer W transferred to the unit module E3. Thereafter, the wafer W is transported to the transfer module TRS44 of the tower T2. In other words, the wafer W is transported from the unit module E4 to the interface module D4.

[0115] The wafers W from the transfer assemblies TRS43 and TRS44 are transported to the buffer assembly 82 using the conveying mechanism 88 located in the center of the front and rear of the interface module D4. They are then transported to the transfer assembly TRS31 of the tower T2 using the conveying mechanism 87 on the rear side of the interface module D4. The wafers W from the transfer assembly TRS31 are then transported again to the unit modules E1 and E2 using the conveying mechanism F7 and transported to the back cleaning assembly 4D. The wafers W are then back-cleaned in the back cleaning assembly 4D before being transported to the transfer assembly TRS32 of the tower T2 using the conveying mechanism F7 and returned to the interface module D4. The wafers W are then transported to the temperature adjustment assembly ICPL using the conveying mechanism 87 and temperature adjusted. They are then transported to the exposure machine D5 using the conveying mechanism 89 to expose the resist film on the surface.

[0116] After exposure, the wafer W is transported by transport mechanism 89 to transfer module TRS37 of tower T2, then by transport mechanism 87 to transfer module TRS38 of tower T2. Then, it is transported by transport mechanism 88 to post-exposure cleaning module 80 for cleaning. The wafer W is then distributed by transport mechanism 88 to transfer modules TRS35 and TRS36.

[0117] Wafers W delivered to transfer module TRS35 are transported to unit module E5 by transport mechanism F5. They are then sequentially transported to heating module 57, temperature control module SCPL35 in tower T2, first developing module 4E or second developing module 4F, heating module 58, and inspection module. Thus, wafers W undergo heating, temperature control, development, heating, and inspection in sequence. Afterwards, they are transported to temperature control module SCPL15 in tower T1 by transport mechanism F5 and discharged from unit module E5 to inspection module D2.

[0118] The wafer W transported to the transfer assembly TRS36 is sent to the unit module E6 by the conveying mechanism F6. Then, the wafer W is processed in the same way as the wafer W sent to the unit module E5, and then transported to the temperature adjustment assembly SCPL16 of the tower T1. That is, it is sent from the unit module E6 to the inspection module D2. The wafer W transported to the temperature adjustment assemblies SCPL15 and SCPL16 in this way is transported to the transfer assembly TRS18 of the tower T1 by the conveying mechanism 25, and then transported to the post-processing inspection assembly 24 by the conveying mechanism 22 and inspected. The inspected wafer W is transported to the transfer assembly TRS42 by the conveying mechanism 22 and returned to the carrier C by the conveying mechanism 17. Among them, the conveying path of the wafer W in the unit modules E2, E4, and E6 is briefly described, but it is transported in a manner that passes through the same components as the components of the unit modules E1, E3, and E5. However, the transfer assembly TRS and the temperature adjustment assembly SCPL use components configured at the height of each unit module.

[0119] As described above, in the coating and developing device 1, a chemical solution coating assembly 4C and conveying mechanisms F1 and F2 for transferring wafers W between the chemical solution coating assembly 4C and the inspection module D2 capable of lifting and conveying wafers W are provided on the left side of the unit modules E1 and E2. On the other hand, a back cleaning assembly 4D and a conveying mechanism F7 for transferring wafers W between the back cleaning assembly 4D and the interface module D4 capable of lifting and conveying wafers W are provided on the right side of the unit modules E1 and E2. Unit modules E3 and E4 including conveying mechanisms F3 and F4 are stacked on the unit modules E1 and E2. Therefore, after the chemical solution coating assembly 4C and the back cleaning assembly 4D process the wafer W in sequence, the wafer W is conveyed to the exposure machine D5. At this time, the wafer W processed in the chemical solution coating assembly 4C is temporarily sent from the unit modules E1 and E2 to the inspection module D2. Afterwards, the wafer W is transported to the back cleaning assembly 4D via the unit modules E3, E4, and the interface module D4 in sequence, and returns to the interface module D4 after the back cleaning is performed. According to such a structure, it is possible to perform another action without affecting one of the actions of the wafer W in the handover between the chemical solution coating assembly 4C and the inspection module D2 and the handover between the wafer W in the back cleaning assembly 4D and the interface module D4. That is, the wafer W can be quickly sent in and out of the chemical solution coating assembly 4C and the wafer W can be quickly sent in and out of the back cleaning assembly 4D. In addition, there is no need to set a component such as a handover component TRS for handing over wafer W between conveying mechanisms between the conveying area where the wafer W is transported by the conveying mechanism F1 and F2 and the conveying area where the wafer W is transported by the conveying mechanism F7. Therefore, the left and right widths of the coating and developing device 1 can be reduced. Therefore, according to the coating and developing device 1, higher productivity can be obtained and the floor space of the device can be reduced. Furthermore, in Patent Document 1, when transferring wafers W between conveyance mechanisms disposed on the left and right sides of a layer (unit module) at the same height, a wafer W loading section is used between the conveyance mechanisms. This loading section increases the length of the layer, making it difficult to reduce the footprint of the device.

[0120] The advantage of the coating and developing device 1 being shorter in left and right is supplemented. Generally, when a coating and developing device is installed in a clean room, its left and right width is limited. Specifically, the range of movement within the clean room of the external transport mechanism that transports the carrier C to the coating and developing device is limited. Consequently, the locations where the modules that transport the carrier C in and out of the coating and developing device can be located are restricted. On the other hand, the placement of the exposure machine D5 within the clean room is sometimes already determined. Due to this situation, there is a problem in that a coating and developing device with a longer left and right length cannot be installed within a clean room. However, compared to the above-described structure, the left and right length of the coating and developing device 1 is relatively shorter, thus resolving this problem. Furthermore, in the coating and developing device 1, the back cleaning assembly 4D is arranged in the unit modules E1 and E2 as described above, and the wafer W is transported along the above-described path, eliminating the need to arrange the back cleaning assembly 4D in the interface module D4. Thus, preventing the interface module D4 from becoming larger also contributes to shortening the left and right length of the coating and developing device 1.

[0121] Furthermore, unit modules E3 and E4 of the coating and developing apparatus 1 are equipped with a resist coating assembly 4A and a chemical solution coating assembly 4B for forming a protective film. Specifically, the resist coating assembly 4A and the chemical solution coating assembly 4B for forming a protective film are installed in unit modules E3 and E4, which wafers W pass through as they are transported from the left side to the right side of unit modules E1 and E2. Consequently, wafers W do not need to be transported to unit modules E other than unit modules E1 to E4 until their back surfaces are cleaned. This prevents the transport path for wafers W from becoming longer, thereby more reliably suppressing a decrease in productivity. Furthermore, by preventing an increase in the number of unit modules E, the size of the apparatus can be suppressed.

[0122] In addition, back cleaning assembly 4D is respectively located at unit module E1, E2, so is configured to two layers. Back cleaning assembly 4D is made into multilayer like this, thereby at the tower T2 of interface module D4, also can be provided with the transfer assembly TRS (as mentioned above, is expressed as TRS31, TRS32) that is used for the handover with respect to this back cleaning assembly 4D in a wider range of height. Can be provided with and can make this transfer assembly TRS be configured to carry more wafer W in a wider range of height. By can carrying more wafer W like this, even in the processing assembly of the back section of this transfer assembly TRS, produce processing and be temporarily suspended such undesirable situation, also can continue the processing of wafer W in each processing assembly of the front section of this transfer assembly TRS. That is, can prevent whole device from stopping the processing of wafer W, therefore can prevent the decline of the productivity of device. In addition, conveying mechanism F7 is lifted and lowered at the common conveying road 66 of unit module E1, E2, therefore can access the wider range of height of tower T2. Therefore, the above-mentioned transfer components TRS31 and TRS32 can be configured to be able to carry more wafers W. In addition, the conveying mechanism F7 uses the TRS31 and TRS32 of the tower T2 to respectively receive the wafer W from the interface module D4 and send the wafer W to the interface module D4. That is, components of different layers (heights) are used to transfer the wafer W between the conveying mechanism of the interface module D4 and the conveying mechanisms of the unit modules E1 and E2. Such a structure also helps to ensure sufficient configuration space for the transfer components TRS31 and TRS32 as described above, and to carry out efficient transportation between the interface module D4 and the conveying mechanism F7.

[0123] Furthermore, by utilizing the fact that the backside cleaning assembly 4D is arranged in two layers and that the spacing between the cups 43 of the backside cleaning assembly 4D is narrow due to the absence of the nozzle 45, a portion 39 for a processing liquid supply device including a pump is provided between the chemical solution coating assembly 4C and the backside cleaning assembly 4D. Specifically, the processing liquid supply device is provided between the cups 43 that constitute the liquid processing assembly of the unit module E. This arrangement of the processing liquid supply device prevents the length of the processing liquid supply pipe from the pump to the nozzle of each liquid processing assembly from increasing. Thus, when a filter is provided in the processing liquid supply pipe upstream of the pump to suppress pressure loss in the processing liquid, the distance between the filter and the nozzle is shortened, thereby improving the capture effect of foreign matter in the processing liquid. In other words, the configuration of the processing liquid supply device described above has the advantage of helping to prevent a decrease in the yield of semiconductor products manufactured from the wafer W. Furthermore, since the processing liquid supply device is provided at E1 and E2 on the lower side of the unit module E, it has the advantage of being easily maintained by operators.

[0124] Furthermore, the unit module E7 equipped with the conveyor mechanism F7 can accept fewer types of components than the unit modules E1 and E2. In other words, the conveyor mechanism F7 has fewer conveying steps than the conveyor mechanisms F1 and F2. By making the conveyor mechanism F7, which has fewer conveying steps, a common structure for the unit modules E1 and E2, it is possible to reduce the manufacturing cost of the device while ensuring sufficient productivity.

[0125] Furthermore, in the coating and developing device 1, as described above, the height of the carrier module D1 is smaller than the height of the inspection module D2 adjacent to the carrier module D1, and the carrier C is on standby above the carrier module D1. This structure eliminates the need to locate the carrier standby section 20 and the carrier delivery section 19 to the left of the carrier module D1. Consequently, the left-right length of the coating and developing device 1 can be more reliably reduced. When the carrier standby section 20 and the carrier delivery section 19 are located on the carrier module D1 in this manner, the FFU 31 for forming a downward airflow in the carrier module D1 is located on the inspection module D2, which is a position that does not overlap with the filter 18 when viewed from above. That is, this configuration of the FFU 31 prevents the left-right length of the coating and developing device 1 from increasing. Furthermore, the FFU 31 is not limited to being located on the inspection module D2; for example, it can also be located in front of or behind the coating and developing device 1.

[0126] Furthermore, in the coating and developing apparatus 1, in the interface module D4, a conveying mechanism 87 capable of accessing the tower T2 is disposed at the rear of the tower T2 for transferring wafers W between the processing module D3. On the other hand, an additional equipment installation portion 36 is disposed in front of the tower T2, protruding from the unit module E of the processing module D3. The additional equipment installation portion 36 and the conveying mechanism 87 sandwich the tower T2 from the front and back. This arrangement of the various components can suppress the left-right length of the coating and developing apparatus 1 from increasing due to the additional equipment installation portion 36, thereby more reliably reducing the footprint of the coating and developing apparatus 1. Furthermore, in the inspection module D2, the additional equipment installation portion 35 and the conveying mechanism 25 are disposed so as to sandwich the tower T2 from the front and back. This arrangement of the various components can also suppress the left-right length of the coating and developing apparatus 1 from increasing.

[0127] Furthermore, in the interface module D4, the wafer W before backside cleaning is placed on standby in the buffer assembly 82. Therefore, the wafer W passes through fewer components between backside cleaning and delivery to the exposure machine D5. This more reliably prevents the wafer W from being delivered to the exposure machine D5 with foreign matter attached to its backside, thereby more reliably preventing defocusing during exposure.

[0128] Interface module D4 is also equipped with a central conveyor mechanism 87 and a rear conveyor mechanism 88. The central conveyor mechanism 87 can access the post-exposure cleaning unit 80, tower T2 components, and buffer unit 82, respectively, while the rear conveyor mechanism 88 can access tower T2 components and buffer unit 82. Furthermore, conveyor mechanism 88, which does not access the post-exposure cleaning unit 80, has a wider range of elevation than conveyor mechanism 87, allowing the holder 61 of conveyor mechanism 88 to access components located lower in tower T2. This structure prevents unbalanced loads between conveyor mechanisms 87 and 88, further reliably improving productivity.

[0129] Furthermore, in unit modules E1 to E4, the additional equipment is divided into two parts: one for the left cup 43 and the other for the right cup 43. The additional equipment in unit modules E1 to E4 can also be divided into three parts, similar to unit modules E5 and E6. However, to simplify the structure of the additional equipment, it is preferable to divide only unit modules E5 and E6, which have a larger number of cups than unit modules E1 to E4, into three parts as described above.

[0130] In the coating and developing apparatus 1 described above, two identical unit modules E are provided. However, this configuration is not limited to this configuration. For example, only one unit module or three or more units may be provided. Furthermore, the order in which the unit modules E are arranged is not limited to the example described above. For example, unit modules E1 and E2 may be located above unit modules E3 and E4.

[0131] In addition, the configuration of the components of the coating and developing device 1 is not limited to the above-mentioned example. For example, instead of providing the back cleaning component 4D on the right side of the unit modules E1 and E2, a chemical solution coating component 4B for forming a protective film and a heating component 52 for heating the wafer W after the protective film is formed are provided. Furthermore, in the unit modules E3 and E4, only the resist coating component 4A is provided as a liquid processing component, and the chemical solution coating component 4B is not provided. The wafer W passes through each unit module E along the above-mentioned conveying path and receives the same treatment as the above-mentioned treatment, except that it does not receive the back cleaning treatment and the formation of the protective film and the heating treatment after the formation in the unit modules E1 and E2. Therefore, the components provided on the right side of the unit modules E1 and E2 are not limited to the cleaning components.

[0132] As another example of the component configuration of the coating and developing apparatus 1, for example, a layout may be employed in which a resist coating assembly 4A is positioned to the left of unit modules E1 and E2, a backside cleaning assembly 4D is positioned to the right, and a chemical solution coating assembly 4B for forming a protective film is positioned in unit modules E3 and E4. In other words, a component configuration may be employed in which no anti-reflective film is formed, with the wafer W being fed into the exposure machine D5 via the aforementioned path through each unit module. Alternatively, if the exposure machine D5 does not perform immersion exposure, a configuration in which no protective film is formed may be employed, with only the resist coating assembly 4A positioned as a liquid processing assembly in unit modules E3 and E4, allowing wafers W to be transported and processed between the modules in the manner described above.

[0133] In addition, the present technology is not limited to application to coating and developing devices. Figure 15 The coating device 9 is shown. The differences between the coating device 9 and the coating and developing device 1 are that the coating device 9 is not connected to the exposure device D5. Furthermore, the unit module E only includes two units: unit modules E1 and E3. Therefore, unit module E1 does not have a shared conveyor path 66 that connects to unit module E2. Conveyor mechanisms F1 and F7 convey wafers W on the left and right sides of conveyor path 30, respectively. In unit module E1, a chemical solution coating module 4C for forming an anti-reflective film is provided on the left side as a liquid processing module, and a resist coating module 4A is provided on the right side. Unit module E3 does not include any processing modules.

[0134] Figure 15 The arrow in the figure indicates the conveying path of the wafer W. After being processed in the chemical solution coating component 4B, the wafer W returns to the inspection module D2, is transported to the interface module D4 via the unit module E3, and is then transported to the resist coating component 4A and processed. After that, the wafer W returns to the interface module D4, passes through the unit module E3 and the inspection module D2 in sequence, and returns to the carrier C. In addition, in towers T1 and T2, a transfer component TRS is arranged at a position where such transportation can be performed. The coating device 9 also has the same effect as the coating and developing device 1. The unit module E that transports the wafer W from the inspection module D2 to the interface module D4 and the unit module E that transports the wafer W from the interface module D4 to the inspection module D2 can be the same as the coating device 9, or different like the coating and developing device 1.

[0135] The liquid processing performed in the device is not limited to the examples described above and may also include the formation of an insulating film by applying a chemical solution, the application of an adhesive for bonding wafers W to each other, and the like. Furthermore, the embodiments disclosed herein should be considered in all respects to be illustrative and non-restrictive. The embodiments described above may be omitted, replaced, modified, and combined in various forms without departing from the scope and spirit of the claims.

Claims

1. A substrate processing device, characterized in that: The substrate processing device comprises: The first unit module includes a first substrate conveying area extending left and right, a first processing assembly arranged to face one left and right side of the first substrate conveying area, a second processing assembly arranged to face the other left and right side of the first substrate conveying area, and a first conveying mechanism arranged on one left and right side of the first substrate conveying area and used to deliver substrates to the first processing assembly, and a second conveying mechanism arranged on the other left and right side of the first substrate conveying area and used to deliver substrates to the second processing assembly, wherein the first substrate conveying area includes a first conveying path located on one side of the first unit module and a second conveying path located on the other side of the first unit module, the first conveying mechanism moves only on the first conveying path, and the second conveying mechanism moves only on the second conveying path; a second unit module including a second substrate conveying area extending horizontally and a third conveying mechanism for conveying the substrate horizontally in the second substrate conveying area, the second unit module being stacked on the first unit module; a substrate loading and unloading module, which is provided on one side of the stack of unit modules consisting of the first unit module and the second unit module, and includes a side loading portion for loading the substrate at the height of the first unit module and the height of the second unit module, so as to deliver the substrate to the first conveying mechanism and the third conveying mechanism respectively, and includes a carrier table for loading a carrier for accommodating the substrate; a relay module provided on the other left or right side of the stacked body of the unit modules, the relay module including a second side placement portion for placing the substrate at the height of the first unit module and the height of the second unit module, so as to transfer the substrate to the second conveying mechanism and the third conveying mechanism, respectively; a second-side conveying mechanism provided in the relay module to convey the substrate between the second-side placing portions; and A one-side conveying mechanism conveys the substrate between the carrier and each of the one-side loading portions. In order to allow the substrate to pass through the second unit module and the relay module in sequence after being processed by the first processing component and before being processed by the second processing component and to be conveyed from the other side of the first unit module to the second processing component, the one-side conveying mechanism is provided on the substrate feeding and unloading module to convey the substrate from the one-side loading portion at the height of the first unit module to the one-side loading portion at the height of the second unit module.

2. The substrate processing apparatus according to claim 1, wherein: In the second unit module, a third processing assembly for receiving and delivering the substrate by the third conveying mechanism is provided facing the second substrate conveying area. The third processing module processes the substrate after it has been processed by the first processing module and before it has been processed by the second processing module.

3. The substrate processing apparatus according to claim 2, wherein: The first processing module and the third processing module include a coating module that supplies a coating liquid to the substrate to form a coating film.

4. The substrate processing apparatus according to claim 2, wherein: The second unit module includes: a unit module for conveying the substrate from the substrate carrying-in / out module to the relay module; and a unit module for conveying the substrate from the relay module to the substrate carrying-in / out module. The outward unit module and the return unit module both include the second substrate conveying area and the third conveying mechanism. The outgoing unit module includes the third processing component, The return unit module includes a fourth processing module for processing the substrate processed by the first processing module, the second processing module, and the third processing module. The one side placement portion and the other side placement portion are provided at a height of the outward unit module and a height of the return unit module.

5. The substrate processing apparatus according to claim 4, wherein: Any one of the first processing module, the second processing module, and the third processing module of the outgoing unit module includes a resist coating module for supplying a resist to the substrate to form a resist film. The fourth processing module is a developing module provided facing the second substrate conveying area, and develops the resist film exposed by an exposure device connected to the relay module for exposing the resist film.

6. The substrate processing apparatus according to claim 5, wherein: The first processing component and the second processing component are arranged side by side. The first processing module, the second processing module, and the third processing module are liquid processing modules that supply processing liquid to the substrate to perform processing. A supply device for supplying the processing liquid to the first processing module, the second processing module, and the third processing module is provided between the first processing module and the second processing module.

7. The substrate processing apparatus according to claim 6, wherein: The first processing module is a coating module that supplies a coating liquid to the substrate to form a coating film. The second processing module is a cleaning module that cleans the substrate after the resist film is formed and before exposure by the exposure device.

8. The substrate processing apparatus according to claim 5, wherein: The other side loading parts are arranged in a row in the longitudinal direction, The relay module is provided with: a post-exposure processing component for processing the substrate after exposure by the exposure machine and before development processing; and a retention component for retaining the substrate at a position offset from the row of the other side loading portion before being processed by the second processing component. The other side conveying mechanism includes: a first other-side transport mechanism configured to transport the substrate between the post-exposure processing module, the retention module, and the other-side placement portion; and a second other-side transport mechanism for transporting the substrate between the retention module and the other-side placement portion; The conveyance region where the substrate is conveyed by the second other-side conveyance mechanism is longer in the longitudinal direction than the conveyance region where the substrate is conveyed by the first other-side conveyance mechanism.

9. The substrate processing apparatus according to any one of claims 1 to 8, wherein: The processing module as one unit module constituting the stack of unit modules is provided with a plurality of liquid processing modules arranged on the left and right and supplying a processing liquid to the substrate for processing. In the row of liquid processing modules, the additional equipment of the processing module on the left, the additional equipment of the processing module in the center, and the additional equipment of the processing module on the right are separated from each other.

10. The substrate processing apparatus according to claim 9, wherein: The liquid processing assembly includes a cup for accommodating the substrate and supplying the processing liquid to the substrate, and the additional equipment includes an exhaust path forming member connected to the cup and for forming an exhaust path for exhausting the inside of the cup.

11. The substrate processing apparatus according to claim 9, wherein: The liquid processing assembly includes a cup for receiving the substrate and supplying the processing liquid to the substrate, and the unit module has a larger number of cups than another unit module forming a stack of the unit modules.

12. The substrate processing apparatus according to any one of claims 1 to 8, wherein: The other side placement parts are arranged in a row in the longitudinal direction on the relay module. The other side conveying mechanism is composed of multiple conveying mechanisms. One of the plurality of conveying mechanisms and an additional equipment installation portion including the second processing unit are arranged in a row sandwiching the other-side placement portion from the front and rear.

13. The substrate processing apparatus according to any one of claims 1 to 8, wherein: The first unit modules are continuously provided in multiple layers in the vertical direction, and the second processing module is provided in each layer of the first unit modules.

14. The substrate processing apparatus according to claim 13, wherein: The left and right sides of the first substrate conveying area are divided into layers. The first conveying mechanism is provided on each floor. The other left and right sides of the first substrate conveying area are connected between the layers. The second conveying mechanism is a freely ascending and descending conveying mechanism commonly used on each floor.

15. The substrate processing apparatus according to any one of claims 1 to 8, wherein: The one-side conveying mechanism includes: a first one-side conveying mechanism for conveying the substrate in and out relative to the carrier; and a second one-side conveying mechanism, which is arranged closer to the stack of unit modules than the first one-side conveying mechanism, and the second one-side conveying mechanism is raised and lowered to transfer the substrate between the first conveying mechanism and the third conveying mechanism. The substrate processing device comprises: a filter provided above a conveying area where the substrate is conveyed by the first side conveying mechanism, and purifying the supplied gas and discharging it to the conveying area; a gas supply mechanism disposed at a position not overlapping the filter when viewed from above, for sucking gas and supplying it to the filter; and A carrier temporary placement portion is used to temporarily place the carrier on the conveying area.

16. The substrate processing apparatus according to any one of claims 1 to 8, wherein: The first processing module is a coating module that supplies a coating liquid to the substrate to form a coating film, and the second processing module is a cleaning module that cleans the substrate. The substrate processing apparatus includes a gas supply and exhaust section for supplying and exhausting gas to and from the first unit module so that the pressure of the first substrate transfer area is lower than that of the first processing module and higher than that of the second processing module.

17. The substrate processing apparatus according to any one of claims 1 to 8, wherein: The second processing assembly includes a cup for receiving the substrate and supplying a processing liquid to the substrate and is respectively arranged in front of and behind the first substrate conveying area. A moving mechanism for moving a holding body provided in the second conveying mechanism and holding the substrate leftward and rightward is provided in the first substrate conveying region.

18. A substrate processing method, characterized in that: The substrate processing method includes the following steps: In a first unit module provided with a first substrate conveying area extending left and right, a first processing assembly arranged to face one left and right side of the first substrate conveying area, and a second processing assembly arranged to face the other left and right side of the first substrate conveying area, a substrate is delivered to the first processing assembly by a first conveying mechanism arranged on one left and right side of the first substrate conveying area, and a substrate is delivered to the second processing assembly by a second conveying mechanism arranged on the other left and right side of the first substrate conveying area, wherein the first substrate conveying area includes a first conveying path located on one side of the first unit module and a second conveying path located on the other side of the first unit module, the first conveying mechanism moves only on the first conveying path, and the second conveying mechanism moves only on the second conveying path; The substrate is transported left and right by a third transport mechanism in the second substrate transport area of ​​the second unit module which includes a second substrate transport area extending left and right and is stacked on the first unit module; In a substrate loading and unloading module provided on one side of a stack of unit modules consisting of the first unit module and the second unit module, the substrates are placed on a side loading portion provided at each height of the first unit module and the second unit module, and each substrate is transferred between the substrate loading and unloading module, the first conveying mechanism, and the third conveying mechanism. A carrier for receiving the substrate is placed on a carrier table provided on the substrate carrying in and out module; In a relay module provided on the other side of the stack of unit modules, the substrates are placed on the other side placement sections provided at the heights of the first unit module and the second unit module, and each substrate is transferred between the relay module, the second conveying mechanism, and the third conveying mechanism. transporting the substrate between the other-side loading portions using the other-side transport mechanism provided on the relay module; transporting the substrate between the carrier and each of the one-side loading portions using a one-side transport mechanism provided on the substrate carrying-in / out module; and In order to allow the substrate to be transported from the other side of the first unit module to the second processing component through the second unit module and the relay module in sequence after the substrate is processed by the first processing component and before being processed by the second processing component, the one-side transport mechanism is used to transport the substrate from the one-side loading portion at the height of the first unit module to the one-side loading portion at the height of the second unit module.

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