Marking method

Abstract

The present invention provides a marking method that does not cause contamination caused by protrusions or debris, etc. The marking method for a wafer includes the following steps: a cutting device preparation step of preparing a cutting device (1); an identification information registration step of registering the information of the identification to be marked in the control unit; a position determination step of holding the wafer (10) on the chuck table (38), photographing the wafer by the photographing unit (28) and displaying it on the display unit (2), and determining the desired position to be marked on the wafer by the X coordinate and the Y coordinate; and a marking step. According to the X coordinate and the Y coordinate of the desired position determined in the position determination step, the control unit (100) operates the X-axis feed unit (40) and the Y-axis feed unit (50) to position the cutting tool (21) at the desired position, and operates the Z-axis feed unit (60) to perform marking with the cutting tool.

Description

Technical Field

[0001] The present invention relates to a marking method for marking a wafer. Background Art

[0002] After grinding the back surface of a wafer divided by dicing lines and having a plurality of devices such as ICs and LSIs formed on the front surface to a desired thickness by a grinding device, the wafer is divided into individual device chips by a dicing device and used in electronic devices such as mobile phones and personal computers.

[0003] In addition, text or ID identification including barcodes, product numbers, product names, lot numbers, etc. for managing the wafer is marked at a required position of the wafer (for example, an outer peripheral remaining area adjacent to the orientation plane), and the identification is confirmed in each manufacturing process while continuing past information, and desired processing is performed on the wafer, or traceability of the wafer is achieved (for example, refer to Patent Document 1).

[0004] Patent Document 1: Japanese Patent Laid-Open No. 08-330196

[0005] According to the technique described in Patent Document 1, the above-mentioned ID identification and the like are marked by irradiating a laser beam. Therefore, for example, there are the following problems: bulges are generated on both sides of the groove formed by irradiating the laser beam, and even when a film is formed on the front surface of the wafer during the process of forming a device on the front surface of the wafer, film peeling occurs from the portion where the bulge is generated, or debris scatters when the groove is formed and contaminates the surface on which the device is formed, or the debris accumulated in the groove contaminates the environment in subsequent processes. Summary of the Invention

[0006] The present invention has been made in view of the above facts, and its main technical problem is to provide a marking method that is not contaminated by bulges or debris.

[0007] In order to solve the above-described main technical problems, according to the present invention, there is provided a marking method for a wafer, the marking method comprising the following steps: a cutting device preparation step of preparing a cutting device having at least a chuck table, a cutting unit, an X-axis feed unit, a Y-axis feed unit, a Z-axis feed unit, a photographing unit, a display unit, and a control unit, wherein the chuck table holds the wafer and is rotatable, the cutting unit has a cutting tool for cutting the wafer held by the chuck table and the cutting tool is rotatable, the X-axis feed unit relatively feeds the chuck table and the cutting unit in the X-axis direction for machining, the Y-axis feed unit relatively feeds the chuck table and the cutting unit in the Y-axis direction for machining, the Z-axis feed unit relatively feeds the chuck table and the cutting unit in the Z-axis direction perpendicular to the X-axis direction and the Y-axis direction for plunge feed, the photographing unit photographs the wafer held by the chuck table, and the display unit displays the image photographed by the photographing unit; an identification information registration step of registering the information of the identification to be marked in the control unit; a position determination step of holding the wafer on the chuck table, photographing the wafer by the photographing unit and displaying it on the display unit, and determining the desired position to be marked on the wafer by X coordinates and Y coordinates; and a marking step of, based on the X coordinates and Y coordinates of the desired position determined in the position determination step, operating the X-axis feed unit and the Y-axis feed unit to position the cutting tool at the desired position, and operating the Z-axis feed unit to perform marking with the cutting tool.

[0008] Preferably, in the position determination step, the desired position to be marked on the wafer is determined by the outer peripheral remaining area around the device formation area on the front surface of the wafer. Additionally, preferably, the desired position to be marked on the wafer is the side where the crystal orientation mark of the outer peripheral remaining area is located. Alternatively, in the position determination step, the desired position to be marked on the wafer may be the back surface of the wafer.

[0009] The marking method of the present invention is a method for marking a wafer, and this marking method is configured to include the following processes: a cutting device preparation process, preparing a cutting device, which at least has a chuck table, a cutting unit, an X-axis feed unit, a Y-axis feed unit, a Z-axis feed unit, a photographing unit, a display unit, and a control unit, wherein the chuck table holds the wafer and can rotate, the cutting unit has a cutting tool for cutting the wafer held by the chuck table and the cutting tool can rotate, the X-axis feed unit relatively processes and feeds the chuck table and the cutting unit in the X-axis direction, the Y-axis feed unit relatively processes and feeds the chuck table and the cutting unit in the Y-axis direction, the Z-axis feed unit relatively performs plunge feed on the chuck table and the cutting unit in the Z-axis direction perpendicular to the X-axis direction and the Y-axis direction, the photographing unit photographs the wafer held by the chuck table, and the display unit displays the image photographed by the photographing unit; an identification information registration process, registering the information of the identification to be marked in the control unit; a position determination process, holding the wafer on the chuck table, photographing the wafer by the photographing unit and displaying it on the display unit, and determining the desired position to be marked on the wafer by X coordinates and Y coordinates; and a marking process, according to the X coordinates and Y coordinates of the desired position determined in the position determination process, operating the X-axis feed unit and the Y-axis feed unit to position the cutting tool at the desired position, and operating the Z-axis feed unit to perform marking with the cutting tool. Therefore, the bulges on both sides of the processing groove formed in the case of forming a processing groove on the wafer by laser processing and implementing marking are not formed, and the problem of film peeling generated in the film forming process implemented during the process of forming a device is eliminated. In addition, the debris generated by laser processing does not scatter, and problems such as the surface on which the device is formed being contaminated or the debris remaining in the laser processing groove contaminating the environment in subsequent processes are eliminated. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is an overall perspective view of the cutting device.

[0011] Figure 2 is a schematic view showing Figure 1 the internal structure of the cutting device shown in a schematic perspective view.

[0012] Figure 3 (a) of is a conceptual diagram showing a state where a part of the wafer photographed by the photographing unit is displayed on the display unit, Figure 3 (b) of is a conceptual diagram showing the manner of implementing the position determination process.

[0013] Figure 4 (a) of is an enlarged perspective view showing a part of the cutting unit implementing the marking process, Figure 4(b) is a side view and a top view of a groove formed by a marking process.

[0014] Figure 5 (a), (b), and (c) are conceptual diagrams showing the process of forming an ID mark by a marking process.

[0015] Figure 6 is a top view showing an enlarged part of the ID mark formed by the marking process.

[0016] Figure 7 (a) of is a perspective view of a wafer on which an ID mark is formed, Figure 7 (b) of is after forming Figure 7 is a perspective view of a wafer on which a device is formed after the ID mark of (a) of.

[0017] Reference numeral description

[0018] 1: Cutting device; 1A: Base; 1B: Gantry frame; 2: Display unit; 4: Operation panel; 10: Wafer; 1,0a: Front side; 10b: Back side; 10c: Device formation area; 10d: Outer peripheral remaining area; 10e: Notch side outer peripheral remaining area; 12: Crystal orientation mark; 14: Device; 16: Dicing line; 20: Cutting unit; 20A: Spindle housing; 21: Cutting tool; 22: Spindle; 24: Cutting water supply unit; 28: Imaging unit; 30: Holding unit; 32: X-axis movable plate; 38: Chuck table; 40: X-axis feed unit; 42: Pulse motor; 50: Y-axis feed unit; 56: Y-axis moving base; 58: Pulse motor; 60: Z-axis feed unit; 62: Z-axis moving base; 64: Pulse motor; 100: Control unit. Detailed description of the preferred embodiment

[0019] Hereinafter, an embodiment of a marking method according to the present invention will be described in detail with reference to the accompanying drawings.

[0020] When implementing the marking method of the present embodiment, first, a cutting device preparation process is performed, and in this cutting device preparation process, a cutting device suitable for implementing the marking method of the present embodiment is prepared.

[0021] As Figure 1 shown, the cutting device 1 of the present embodiment is covered with a device housing H. A display unit 2 and an operation panel 4 are provided on the device housing H, and the operation panel 4 is used when an operator inputs information and gives operation instructions. In addition, the cutting device 1 has a cutting unit 20 and a holding unit 30 for holding a wafer 10 as a workpiece.

[0022] In Figure 2FIG. 0 shows a schematic perspective view of the internal structure of the cutting device 1 with the device housing H removed and a wafer 10 marked by the cutting device 1. The wafer 10 is, for example, a silicon (Si) wafer and is an unprocessed wafer on which no devices are formed on the front surface 10a and the back surface 10b. Figure 2 The illustrated wafer 10 has: a device formation region 10c, which is divided by a predetermined line and can form a plurality of devices on the front surface; and an outer peripheral remaining region 10d, which surrounds the device formation region 10c. At a predetermined position at the outer peripheral end of the wafer 10, a crystal orientation mark 12 indicating the crystal orientation of the wafer 10 is formed by a U-shaped cut (notch). As the mark indicating the crystal orientation, it is not limited to Figure 2 the illustrated U-shaped cut, and it may also be a V-shaped cut or an orientation plane formed linearly at the outer peripheral end. In addition, in Figure 2 the illustrated wafer 10, for the sake of convenience of explanation, a dashed line S for distinguishing the device formation region 10c and the outer peripheral remaining region 10d surrounding the device formation region 10c is shown, but the dashed line S is an imaginary line and is not actually drawn on the front surface 10a.

[0023] Refer to Figure 2 for a more specific description of the schematic structure of the cutting device 1 prepared through the cutting device preparation process.

[0024] As Figure 2 shown, the cutting device 1 has: a cutting unit 20, which has a base 1A and a gantry frame 1B disposed on the base 1A and cuts the wafer 10 as a workpiece; a holding unit 30, which holds the wafer 10; an X-axis feed unit 40, which relatively feeds the cutting unit 20 and the holding unit 30 in the X-axis direction; a Y-axis feed unit 50, which relatively feeds the cutting unit 20 and the holding unit 30 in the Y-axis direction perpendicular to the X-axis direction and forming a horizontal plane together with the X-axis direction; a Z-axis feed unit 60, which relatively feeds the cutting unit 20 and the holding unit 30 in the Z-axis direction perpendicular to the X-axis direction and the Y-axis direction; a photographing unit 28, which photographs the wafer 10 held by the holding unit 30; and a control unit 100. In addition, for the sake of convenience of explanation, the control unit 100 is shown outside the cutting device 1, but actually the control unit 100 is housed inside the housing H of the cutting device 1.

[0025] The holding unit 30 includes: a rectangular X-axis movable plate 32 that is movably placed on the base 1A in the X-axis direction; a cylindrical member 34 disposed on the upper surface of the X-axis movable plate 32; a cover member 36 disposed on the upper part of the cylindrical member 34; and a chuck table 38 disposed so as to extend upward from the center of the cover member 36. The chuck table 38 is configured to be rotatable by a rotation drive unit (not shown). The holding surface 38a defined by the X-axis direction and the Y-axis direction on the upper surface of the chuck table 38 is formed of a porous material having air permeability and is connected to an attracting unit (not shown) through the cylindrical member 34 and a flow path inside the chuck table 38.

[0026] The cutting unit 20 is a unit that performs marking by cutting the wafer 10 attracted and held by the chuck table 38, and is supported by the gantry frame 1B by means of the Y-axis feed unit 50 and the Z-axis feed unit 60. The cutting unit 20 includes: a spindle housing 20A that rotatably holds a spindle 22; an annular cutting tool 21 mounted on the front end of the spindle 22; and a tool cover 23 that covers the cutting tool 21. A motor (not shown), which is a rotation drive source for rotating the spindle 22, is housed in the spindle housing 20A.

[0027] The X-axis feed unit 40 is disposed on the base 1A, converts the rotational motion of the pulse motor 42 into a linear motion via a ball screw 44, and transmits it to the X-axis movable plate 32, so that the chuck table 38 disposed on the X-axis movable plate 32 along the guide rails 46, 46 on the base 1A moves forward and backward in the X-axis direction.

[0028] The Y-axis feed unit 50 includes a ball screw mechanism and has: a pair of guide rails 52 disposed on the gantry frame 1B and extending in the Y-axis direction; a ball screw 54 disposed in parallel with the guide rails 52; a Y-axis moving base 56 having a nut portion (not shown) that moves forward and backward through the ball screw 54 on the back surface; and a pulse motor 58 that rotationally drives the ball screw 54. The Y-axis moving base 56 is guided in the Y-axis direction by the guide rails 52. The Y-axis feed unit 50 rotates the ball screw 54 by the pulse motor 58 to move the Y-axis moving base 56 in the Y-axis direction, so that the Z-axis feed unit 60 supported by the Y-axis moving base 56 and supporting the cutting unit 20 moves in the Y-axis direction.

[0029] The Z-axis feed unit 60 includes: a pair of guide rails (not shown), which are disposed on the Y-axis moving base 56 and extend in the Z-axis direction; a ball screw (not shown), which is arranged parallel to the guide rails; a Z-axis moving base 62, which has a nut (not shown) screwed to the ball screw on its back; and a pulse motor 64, which provides power for rotating the ball screw. The Z-axis feed unit 60 rotates the ball screw by the pulse motor 64, and moves the Z-axis moving base 62 along the guide rails in the Z-axis direction, so that the cutting unit 20 supported by the Z-axis moving base 62 moves in the Z-axis direction.

[0030] The photographing unit 28 is integrally formed with the spindle housing 20A of the cutting unit 20. Therefore, the X-axis feed unit 40, the Y-axis feed unit 50, and the Z-axis feed unit 60 can be operated to move the photographing unit 28 relative to the holding unit 30 together with the cutting unit 20 in the X-axis direction, the Y-axis direction, and the Z-axis direction. The photographing unit 28 is disposed at a position that coincides with the cutting tool 21 of the cutting unit 20 in the X-axis direction, and the central position of the area photographed by the photographing unit 28 coincides with the Y coordinate position cut by the cutting tool 21.

[0031] A rotational angle position detection unit for detecting the rotational angle position of the chuck table 38, an X-axis coordinate position detection unit for detecting the position (X coordinate position) of the chuck table 38 in the X-axis direction, a Y-axis coordinate position detection unit for detecting the position (Y coordinate position) of the cutting unit 20 in the Y-axis direction, and a Z-axis coordinate position detection unit for detecting the position (Z coordinate position) of the cutting unit 20 in the Z-axis direction (all not shown) are disposed on the cutting device 1, and the rotational angle position and the X-axis coordinate position of the chuck table 38, the Y-axis coordinate position and the Z-axis coordinate position of the cutting unit 20 are precisely detected and sent to the control unit 100.

[0032] The control unit 100 is composed of a computer and includes: a central processing unit (CPU), which performs arithmetic processing according to a control program; a read-only memory (ROM), which stores the control program and the like; a random access memory (RAM) that can be read and written, which is used for temporarily storing detection values, arithmetic results, etc.; and an input interface and an output interface (detailed diagrams are omitted). The control unit 100 of the present embodiment is connected to the above-mentioned display unit 2, operation panel 4, cutting unit 20, photographing unit 28, X-axis feed unit 40, Y-axis feed unit 50, Z-axis feed unit 60, and the rotational angle position detection unit, X-axis coordinate position detection unit, Y-axis coordinate position detection unit, and Z-axis coordinate position detection unit (not shown).

[0033] The cutting device 1 generally has the structure as described above. In the case of implementing the marking method of this embodiment, a cutting device preparation process for preparing the cutting device 1 is implemented, and the following processes are implemented.

[0034] When implementing the marking method of this embodiment, if the cutting device preparation process for preparing the cutting device 1 is implemented, an identification information registration process for registering the information of the identification to be marked on the wafer 10 in the control unit 100 is implemented. In this embodiment, the identification marked on the wafer 10 is, for example, an ID identification that individually identifies the wafer 10, and "T175-43" is registered as an example. The operator inputs this ID identification from the operation panel 4 or the display unit 2 having a touch panel function, and stores this ID identification in the memory of the control unit 100. In addition, the method of registering the information of this identification in the identification information registration process is not necessarily limited to being implemented by the operator through manual input. For example, information can also be obtained online for registration, or the identification to be marked can be selected according to a pre-registered screen display. Thus, the identification information registration process is completed.

[0035] Next, the following position determination process is implemented: The wafer 10 is held on the chuck table 38, the wafer 10 is photographed by the photographing unit 28, and the photographed part is displayed on the display unit 2, and the desired position to be marked on the wafer 10 is determined by X coordinates and Y coordinates.

[0036] A more specific description of the position determination process is as follows. First, as Figure 2 shown, the front surface 10a of the wafer 10 is oriented upward, the back surface 10b side is oriented downward, and it is placed on the holding surface 38a of the chuck table 38, and an unillustrated suction unit is operated to perform suction holding. Next, the X-axis feed unit 40, the Y-axis feed unit 50, and the Z-axis feed unit 60 are operated to position the photographing unit 28 above the wafer 10 held by the chuck table 38. Next, the photographing unit 28 is operated, and as Figure 3 shown in (a) of, the photographing area is displayed on the display unit 2. In this embodiment, the area for marking the ID identification is the outer peripheral remaining area 10d on the front surface 10a side of the wafer 10, which is the outer peripheral remaining area 10e on the notch side where the crystal orientation identification 12 is formed.

[0037] If the photographing unit 28, the X-axis feed unit 40, the Y-axis feed unit 50, and the Z-axis feed unit 60 are operated and the outer peripheral remaining area 10e on the notch side for marking the ID identification is displayed on the display unit 2, then as Figure 3 shown in (a) of, the area P for forming the ID identification is specified. The area P is determined by adjusting the positions of two points (P1, P2) on the diagonal of the rectangle (represented by a dotted line) surrounding the area for forming the ID identification.

[0038] When the above-mentioned area P is specified, as shown by the dashed line in (b) of Figure 3 it is also determined which position within area P (indicated by the dashed line) the ID mark ("T175-43") registered in the above-mentioned identification information registration process will be formed at. The X coordinate positions and Y coordinate positions of each line of the characters and marks constituting each ID mark are determined by the operation of the control unit 100. In addition, letters, numbers, and marks used in the ID mark are pre-registered in the control unit 100, and it is calculated how to combine the lines of the registered characters and marks for drawing within area P. Thus, the position determination process is completed.

[0039] Figure 4 (a) of shows the cutting unit 20. As described above, the cutting unit 20 has: a circular cutting tool 21 mounted on the front end of the spindle 22; a tool cover 23 covering the cutting tool 21; and a cutting water supply unit 24 supplying cutting water to the cutting part. The cutting tool 21 has a radius of, for example, 2500 μm and a thickness of 30 μm. In the present embodiment, the ID mark is formed by this cutting tool 21. Considering the efficiency and visual confirmation when forming the ID mark, the cutting depth of the cutting tool 21 when forming the ID mark is set to a depth of 4 μm. Here, as described above, since the radius of the cutting tool 21 is 2500 μm and the thickness is 30 μm, as Figure 4 shown in the upper figure of (b) of Figure 4 when the cutting tool 21 is rotated and fed in by 4 μm, as shown in the lower figure of (b) of

[0040] a groove formed on the wafer 10 becomes a straight line (hereinafter referred to as "short straight line L1") with a cutting length of 283 (≈282.7) μm and a cutting width of 30 μm. The mark formed by the marking method of the present embodiment is formed by a combination of the above-mentioned short straight line L1 and a groove (hereinafter referred to as "long straight line L2") with a cutting width of 30 μm and a length of 1000 μm longer than the short straight line L1.

[0040] In the above-mentioned position determination process, if the control unit 100 determines and stores the X coordinates and Y coordinates of the lines (grooves) forming the characters and numbers constituting the ID mark, then based on these X coordinates and Y coordinates, the X-axis feed unit 40 and the Y-axis feed unit 50 are operated to relatively move the chuck table 38 and the cutting tool 21 of the cutting unit 20. More specifically, the chuck table 38 is positioned below the cutting unit 20, and the cutting tool 21 is positioned at Figure 5above the end of the region P specified within the remaining outer peripheral region 10e on the notch side shown in (a) of [description] and forming the straight line P11 that constitutes the upper end of the "T". Next, the cutting unit 20 is operated to rotate the cutting tool 21. While supplying cutting water toward the vicinity of the tip of the cutting tool 21 through the cutting water supply unit 24, the Z-axis feed unit 60 is operated to lower the cutting tool 21, and it is cut and fed by 4 μm from the front surface 10a of the wafer 10. The wafer 10 is moved in the X-axis direction shown by the arrow X in the figure, and a straight line P11 formed by a long straight line L2 with a cutting length of 1000 μm is formed on the front surface 10a of the wafer 10. Then, the cutting tool 21 is raised. In addition, the method of forming the long straight line L2 with a cutting length of 1000 μm is not limited to this. For example, cutting processing can also be performed in which four short straight lines L1 are formed four times in a partially overlapping manner in the X-axis direction to form the 1000-μm straight line P11.

[0041] As described above, after the straight line P11 is formed, next, the X-axis feed unit 40 is operated to move the wafer 10 in the direction shown by the arrow X in the figure, and the cutting tool 21 is positioned at the position of the straight line P12 that constitutes the upper end of the "1". Next, the Z-axis feed unit 60 is operated to lower the cutting tool 21 and cut and feed by 4 μm to form a short straight line L1 that is a groove with a length of 283 μm. Thus, the straight line P12 is formed. Next, the cutting unit 20, the X-axis feed unit 40, and the Z-axis feed unit 60 are operated to appropriately form the grooves of the short straight line L1 and the long straight line L2, thereby forming the straight line P13 that constitutes the upper end of the "7", the straight line P14 that constitutes the upper end of the "5", the straight line P15 that constitutes the upper end of the "4", and the straight line P16 that constitutes the upper end of the "3". If the straight line P16 that constitutes the "3" of the last ID mark is formed, then the Y-axis feed unit 50 is operated to move the wafer 10 97 μm in the Y-axis direction shown by the arrow Y, and further the X-axis feed unit 40 is operated to position the cutting tool 21 above the position of the straight line P17 that constitutes the "T". Next, the Z-axis feed unit 60 is operated to lower the cutting tool 21 and perform cutting feed, and the X-axis feed unit 40 is operated to form a straight line P17 with a cutting length of 1000 μm. Next, the straight lines P18 to P22 arranged in the X-axis direction are formed in the same manner as above.

[0042] As Figure 5 shown in (a) of [description], if the straight lines P11 to P22 are formed in the region P of the wafer 10, then the X-axis feed unit 40 and the Y-axis feed unit 50 are further operated. While moving the position of the cutting tool 21 in the X-axis direction and the Y-axis direction, the Z-axis feed unit 60 is operated to form the straight lines that constitute the ID mark along the X-axis direction through the cutting tool 21. Then, midway throughFigure 5 In the state of (b) as Figure 5 shown in (c) of, the ID identifier (“T175 - 43”) registered through the identification information registration process is marked in the remaining outer peripheral area 10e on the notch side of the front surface 10a of the wafer 10. Thus, the marking process is completed, and the marking method of the present embodiment is completed.

[0043] Figure 6 An enlarged view shows a part of the ID identifier formed in Figure 5 the area P0 shown in (c) of. As shown in the figure, the ID identifier is marked on the wafer 10 by combining the short straight line L1 and the long straight line L2 having an arbitrary length set to be longer than the short straight line L1. In addition, in the present embodiment, the cutting width of the groove is set to 30 μm, the interval of the grooves is set to 67 μm, and the ID identifier is formed by 11 grooves in the Y - axis direction. Thus, as Figure 6 shown, one character or mark when forming the ID identifier converges within a region of 1000 μm square. In addition, the cutting depth when forming the ID identifier and the interval of the straight lines in the Y - axis direction are appropriately adjusted according to the material of the wafer 10, the radius of the cutting tool 21, and the thickness of the cutting tool, considering visual confirmability, and are not limited to the above values.

[0044] After implementing the above - mentioned marking method and marking the ID identifier on the wafer 10 as Figure 7 shown in (a) of, by performing a known film - forming process, photoresist process, wiring process, etc. on the front surface 10a of the wafer 10, as Figure 7 shown in (b) of, a plurality of devices 14 are formed by being divided by the division lines 16 in the device - forming region 10c on the front surface 10a of the wafer 10.

[0045] By implementing the marking method of the present embodiment, the ID identifier is marked on the wafer 10 using the cutting tool 21. Therefore, the bulges on both sides of the processing groove formed in the case of forming a processing groove on the wafer 10 by laser processing are not formed, and the problem of film peeling generated in the film - forming process performed during the formation of the device 14 is eliminated. In addition, the debris generated by laser processing does not scatter, and problems such as the surface for forming the device being contaminated or the debris remaining in the laser processing groove contaminating the environment in the subsequent process are eliminated.

[0046] The present invention is not limited to the above-described embodiments. For example, in the above-described embodiments, in the marking process, the ID identification "T175-43" was marked on the wafer 10, but the present invention is not limited thereto, and the product name, product number, lot number, company name of the manufacturer, barcode, etc. of the wafer 10 may also be marked. In addition, in the above-described embodiments, the marking was performed in the remaining area 10e on the outer periphery of the notch side of the front surface 10a of the wafer 10, but it may also be formed in an area other than the remaining area 10e on the outer periphery of the notch side. Furthermore, the marking may be performed on the back surface 10b side of the wafer 10.

Claims

1. A marking method for wafers, comprising the following steps: The marking method is configured to include the following processes: Cutting device preparation process: Prepare a cutting device that at least has a chuck table, a cutting unit, an X-axis feed unit, a Y-axis feed unit, a Z-axis feed unit, a photographing unit, a display unit, and a control unit. The chuck table holds the wafer and can rotate. The cutting unit has a cutting tool for cutting the wafer held by the chuck table and the cutting tool can rotate. The X-axis feed unit relatively processes and feeds the chuck table and the cutting unit in the X-axis direction. The Y-axis feed unit relatively processes and feeds the chuck table and the cutting unit in the Y-axis direction. The Z-axis feed unit relatively performs plunge feed on the chuck table and the cutting unit in the Z-axis direction perpendicular to the X-axis direction and the Y-axis direction. The photographing unit photographs the wafer held by the chuck table, and the display unit displays the image photographed by the photographing unit; Identification information registration process: Register the information of the identification to be marked in the control unit; Position determination process: Hold the wafer on the chuck table, photograph the wafer with the photographing unit and display it on the display unit, and determine the desired position to be marked on the wafer through the X coordinate and the Y coordinate; and Marking process: According to the X coordinate and the Y coordinate of the desired position determined in the position determination process, make the X-axis feed unit and the Y-axis feed unit act to position the cutting tool at the desired position, and make the Z-axis feed unit act to perform marking with the cutting tool, In the marking process, within the desired position determined according to the X coordinate and the Y coordinate, use the cutting tool to form a plurality of grooves along the X-axis direction in the Y-axis direction, and depict the letter or number character shape through the combination of the positions where the grooves are formed.

2. The marking method according to claim 1, wherein, In the position determination process, the desired position to be marked on the wafer is determined by the outer peripheral remaining area around the device formation area on the front side of the wafer.

3. The marking method according to claim 2, wherein, In the position determination process, the desired position to be marked on the wafer is the side where the crystal orientation mark of the outer peripheral remaining area is located.

4. The marking method according to claim 1, wherein, In the position determination process, the desired position to be marked on the wafer is the back side of the wafer.

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