Differential force sensing sensor

Abstract

The application relates to a differential force-sensitive sensor, two quartz chips are vertically arranged in the internal bearing position of a bearing body, external force conducts force through the bearing body and directly acts on one of the quartz chips, so that the quartz chip is subjected to pressure, and the other quartz chip is subjected to tension due to the vertical arrangement, the two quartz chips are subjected to tension and pressure respectively, frequency changes in opposite directions are generated, a differential structure is formed, and finally the force detection can be realized through the detection of the frequency change, and the influence of external temperature can be reduced. The application has the advantages of simple structure, high synchronous level of torque sensing precision and resolution, easy industrial production, saving of product production cost and the like.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of force test scenes, monitoring of robot arm joint movement processes and the like, and particularly relates to a differential force sensitive sensor. BACKGROUND

[0002] In recent years, as manufacturing industries are developing more and more towards high-end, the precision requirement for contact force in various industries such as precision machining and service robots will be increasingly high, and the force parameter test quantity needs to be accurately and quickly achieved to meet the design requirements, so as to ensure that the mechanical force can accurately complete the task in manufacturing or service. To complete such a task, a high-speed, accurate and high-resolution force sensitive unit and a control algorithm are usually required to cooperate to achieve the implementation.

[0003] The key to whether the input of the control algorithm can be realized lies in obtaining high-sensitivity touch information. For the information about the force related to the movement of a robot arm, it is the most critical factor for completing the robot action and accuracy. During the process, the state of the working scene is generally monitored through the movement path process and the force on the joints of the robot arm.

[0004] In addition to the current intelligent manufacturing robot industry, there are also monitoring of pressure gauges (instruments) and wind power generation equipment, such as offshore wind turbines. How to perceive the wind speed in the environment to generate power efficiently and reasonably, when a high-intensity typhoon is encountered, the wind turbine takes protective measures in time, so that the equipment stops in time and enters a safe state to avoid loss; when the wind speed of the power generation site is low, the power generation efficiency is low, how to perceive to stop the generator and wait for use to improve the service life of the wind turbine. In the above-mentioned scene process, torque testing is required for monitoring and feedback to improve the benefits and reduce the cost. The force sensitive sensor will play an important role in many fields. SUMMARY

[0005] The technical problem to be solved by the present application is to provide a differential force sensitive sensor to solve the problems of complex structure and poor processing and manufacturing of existing force sensitive sensors, high manufacturing cost, low force test precision and resolution, slow feedback force information response and the like.

[0006] The technical solution adopted by the present application to solve the technical problem is to provide a differential force sensitive sensor, which comprises a bearing body and a lower support body arranged in a stacked manner, a first quartz chip and a second quartz chip are sequentially arranged from top to bottom in the middle part of the bearing body, the second quartz chip is arranged vertically with the first quartz chip and does not contact the first quartz chip, and an oscillation IC package body is arranged at the bottom of the lower support body. The oscillation IC package body, the first quartz chip, the second quartz chip and the circuit arranged on the lower support body constitute an oscillation circuit of a force sensitive unit.

[0007] As a supplement to the technical scheme of the application, the upper step hole is provided with a first quartz chip, and the upper end of the upper step hole is penetrated through the upper end surface of the carrier body.

[0008] As a supplement to the technical scheme of the application, the bottom of the upper step hole on the front and rear sides is formed with two upper steps with the intermediate channel, and the two upper steps correspond to the first quartz chip.

[0009] As a supplement to the technical scheme of the application, the upper step and the first quartz chip are fixed and bonded by rigid glue.

[0010] As a supplement to the technical scheme of the application, the upper step hole and the lower step hole are rectangular grooves.

[0011] As a supplement to the technical scheme of the application, the upper end of the upper step hole is sealed by a cover. The upper end of the carrier body is provided with an embedding groove, and the cover is installed in the embedding groove.

[0012] As a supplement to the technical scheme of the application, the circuit is provided with a connection interface for providing power input and frequency signal output.

[0013] As a supplement to the technical scheme of the application, the lower surface of the lower support body and the oscillation IC package body are connected by patch welding.

[0014] As a supplement to the technical scheme of the application, the carrier body is arranged in left-right symmetry.

[0015] As a supplement to the technical scheme of the application, the first quartz chip and the oscillation IC package body and the second quartz chip and the oscillation IC package body are connected by conductive glue.

[0016] Beneficial effects: the present application relates to a differential force sensitive sensor, two pieces of quartz chip are vertically arranged in the inside of the carrier, external force conducts force through the carrier and directly acts on one of the quartz chips, so that the quartz chip is subjected to pressure, and the other quartz chip is subjected to tension due to vertical placement, two quartz chips are subjected to tension and pressure respectively, which will produce frequency changes in opposite directions, forming a differential structure, and finally the detection of frequency change can realize the detection of force, and the influence of external temperature can be reduced. The response time of the quartz chip in the stress process is extremely fast, and the designed structure is simple and clear, which ensures the accuracy of the sensor and improves the resolution of the sensor, and can also effectively reduce the cost. The differential force sensitive sensor can use single channel detection function, and can also form a plurality of product matrixes, through the calculation result of high-order calculator chip, a multi-dimensional, high-precision, high-resolution, extremely fast response time use scene can be formed. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a perspective view of the present application;

[0018] Figure 2 is a left side view of the present application;

[0019] Figure 3 is an exploded view of the present application;

[0020] Figure 4 is a structural schematic view of the carrier.

[0021] Fig. 1, cover, 2, carrier, 3, lower support, 4, upper step hole, 5, lower step hole, 6, soft conductive glue, 7, oscillation IC package, 8, first quartz chip, 9, second quartz chip, 10, middle channel, 11, embedding groove, 12, upper step, 13, lower step. DETAILED DESCRIPTION

[0022] The present application will be further described below in conjunction with specific embodiments. It should be understood that these embodiments are only used to illustrate the present application and not to limit the scope of the present application. In addition, it should be understood that after reading the content taught by the present application, those skilled in the art can make various modifications or modifications to the present application, and these equivalent forms also fall within the scope defined by the appended claims of the present application.

[0023] The embodiment of the present application relates to a differential force sensitive sensor, as Figures 1-4As shown, it comprises a carrier 2 and a lower support 3 arranged in a top-bottom stacking manner, a middle portion of the carrier 2 is sequentially provided with a first quartz chip 8 and a second quartz chip 9 from top to bottom, the second quartz chip 9 is arranged vertically to the first quartz chip 8 and is not in contact with the first quartz chip 8, the lower support 3 is provided with an oscillation IC package 7 at the bottom, the oscillation IC package 7, the first quartz chip 8, the second quartz chip 9 and the circuit provided on the lower support 3 form an oscillation circuit of a force sensitive unit.

[0024] The carrier 2 is sequentially provided with an upper stepped hole 4, a middle passage 10 and a lower stepped hole 5 from top to bottom, the first quartz chip 8 is installed in the upper stepped hole 4, the upper stepped hole 4 is provided with a port penetrating through the upper end surface of the carrier 2, the second quartz chip 9 is installed in the lower stepped hole 5, the lower stepped hole 5 is provided with a port penetrating through the lower end surface of the carrier 2.

[0025] The bottom of the front and rear sides of the upper stepped hole 4 and the middle passage 10 form two upper steps 12, the two upper steps 12 correspond to the first quartz chip 8, the top of the front and rear sides of the lower stepped hole 5 and the middle passage 10 form two lower steps 13, the two lower steps 13 correspond to the second quartz chip 9.

[0026] The upper step 12 and the first quartz chip 8 and the lower step 13 and the second quartz chip 9 are fixed and bonded by rigid glue.

[0027] The upper stepped hole 4 and the lower stepped hole 5 are both rectangular grooves.

[0028] The upper port of the upper stepped hole 4 is sealed by a cover 1, the upper end of the carrier 2 is provided with an embedding groove 11, and the cover 1 is installed in the embedding groove 11. The cover 1, the carrier 2 and the lower support 3 can share the role of protecting the quartz chip in force transmission.

[0029] The circuit is provided with a connection interface for providing power input and frequency signal output, which provides a necessary path for the power supply and signal output of the oscillation circuit.

[0030] The lower surface of the lower support 3 and the oscillation IC package 7 are connected by patch welding.

[0031] The first quartz chip 8 and the oscillation IC package 7 and the second quartz chip 9 and the oscillation IC package 7 are connected by conductive glue 6, the stepped height of the carrier 2 meets the support of the conductive glue 6, so that the conductive glue 6 has sufficient conductive connection performance. The conductive glue 6 connects the quartz chip electrode and the IC 7 of the lower support 3 to form an oscillation loop to generate a quartz resonant frequency.

[0032] Two upper steps 12 correspond to the mounting of the first quartz chip 8, and two lower steps 13 correspond to the mounting of the second quartz chip 9, forming a bridge type structure, and providing a mechanical energy and electrical energy conversion space inside the first quartz chip 8 and the second quartz chip 9.

[0033] The first quartz chip 8 and the second quartz chip 9 must be in a cavity space orthogonal vertical symmetry structure of the carrier 2, and better distribute (pressure, tension) force balance, so as to improve test accuracy.

[0034] The force end face of the first quartz chip 8 and the second quartz chip 9 directly contacts the inner wall of the carrier 2, and the auxiliary fixing material adhesive is bonded on the interlayer of the step face of the carrier 2 and the first quartz chip 8 and the second quartz chip 9, so as to improve the accuracy of the (pressure, tension) force of the first quartz chip 8 and the second quartz chip 9.

[0035] The first quartz chip 8 and the second quartz chip 9 are installed in the same cavity, the influence of temperature on the frequency characteristics of the chip is reduced, the working stability can be ensured, and the output accuracy is further improved.

[0036] Figure 1 As shown, the Y1 direction of the outer surface of the carrier 2 is a force sensitive sensor (pressure) force surface, the force surface of the first quartz chip 8 directly senses the pressure from the inner wall of the carrier 2 in the Y1 direction, and at the same time, the Y2 direction of the carrier 2 generates a tension force that deforms outward, so that the force surface of the second quartz chip 9 is passively pulled up in the Y2 direction. Two forces accurately change the oscillation frequency of the first quartz chip 8 and the second quartz chip 9, the frequency of the first quartz chip 8 changes (the frequency rises) from before being subjected to pressure to after being subjected to pressure; the frequency of the second quartz chip 9 changes (the frequency drops) from before being subjected to tension to after being subjected to tension, is connected to a measurement circuit, and then the force frequency coefficient and the differential method are used to calculate data. In this process, it can be a static force adding process or a dynamic force adding process. Finally, the force sensitive sensor completes the full mode state of force adding (input) and force applying result (output). This state can be used in various high-precision monitoring scenes.

[0037] The response time of the first quartz chip 8 and the second quartz chip 9 in the force process is extremely fast, the designed structure is simple and clear, the accuracy of the sensor is ensured, the resolution of the sensor is improved, and the cost can be effectively reduced. The differential force sensitive sensor can use single-channel detection function, or can be composed of multiple product matrices. Through the calculation results of a high-order calculator chip, a multi-dimensional, high-precision, high-resolution, and extremely fast response time use scene can be formed. Therefore, compared with the traditional contradiction between accuracy and resolution and cost, the present application is a better solution, and the use scene provides multi-dimensional high-precision high-resolution expansion conditions under effective cost control.

Claims

1. A differential force sensitive sensor comprising a load carrier (2) and a lower support (3) arranged one on top of the other, characterized in that: The middle part of the carrier (2) is sequentially provided with a first quartz chip (8) and a second quartz chip (9) from top to bottom, the second quartz chip (9) is vertically arranged with the first quartz chip (8) and is not in contact with the first quartz chip (8) up and down, the bottom of the lower support body (3) is provided with an oscillation IC package body (7), the oscillation IC package body (7), the first quartz chip (8), the second quartz chip (9) and the circuit provided on the lower support body (3) constitute an oscillation circuit of a force sensitive unit; the inside of the carrier (2) is sequentially provided with an upper step hole (4), a middle channel (10) and a lower step hole (5) from top to bottom, the first quartz chip (8) is installed in the upper step hole (4), the upper end of the upper step hole (4) penetrates the upper end surface of the carrier (2), the second quartz chip (9) is installed in the lower step hole (5), the lower end of the lower step hole (5) penetrates the lower end surface of the carrier (2); the bottom of the front and rear sides of the upper step hole (4) forms two upper steps (12) with the middle channel (10), the two upper steps (12) correspond to the first quartz chip (8), the top of the left and right sides of the lower step hole (5) forms two lower steps (13) with the middle channel (10), the two lower steps (13) correspond to the second quartz chip (9).

2. A differential force sensing sensor according to claim 1, wherein: The upper step (12) and the first quartz chip (8) and the lower step (13) and the second quartz chip (9) are fixed and bonded by rigid glue.

3. A differential force sensing sensor according to claim 1, wherein: The upper step hole (4) and the lower step hole (5) are rectangular grooves.

4. A differential force sensing sensor according to claim 1, wherein: The upper end of the upper step hole (4) is sealed by the cover (1).

5. A differential force sensing sensor according to claim 1, wherein: The circuit is provided with a connection interface for providing power input and frequency signal output.

6. A differential force sensing sensor according to claim 1, wherein: The lower surface of the lower support body (3) and the oscillation IC package body (7) are connected by patch welding.

7. A differential force sensing sensor according to claim 1, wherein: The carrier (2) is arranged symmetrically left and right.

8. A differential force sensing sensor according to claim 1, wherein: The first quartz chip (8) and the oscillation IC package body (7) and the second quartz chip (9) and the oscillation IC package body (7) are connected by conductive glue (6).

Images