Vibration sensor and electronic device

Abstract

The application discloses a vibration sensor and electronic equipment, wherein the vibration sensor comprises a circuit board assembly, a shell, a vibration pickup assembly, a support shell and a chip assembly, the shell covers one side of the circuit board assembly to form an installation space; the vibration pickup assembly is arranged in the installation space, and is used for picking up bone vibration of the outside world to generate a response vibration; the support shell is connected to the side of the vibration pickup assembly away from the circuit board assembly; the chip assembly is connected to the side of the support shell away from the circuit board assembly, and is electrically connected with the circuit board assembly; wherein a conduction cavity is formed among the vibration pickup assembly, the support shell and the chip assembly, so that the response vibration is transmitted to the chip assembly through the conduction cavity. The technical scheme of the application aims at simplifying the structure of the vibration sensor, reducing the processing difficulty and cost, and improving the structural reliability of the vibration sensor.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of sensors, in particular to a vibration sensor and an electronic device using the same. BACKGROUND

[0002] The bone conduction sensor is a sensor that uses the vibration of the diaphragm to drive air flow, excites the MEMS diaphragm, and detects the flow signal, so that the bone conduction sensor can collect the slight vibration of the head and neck caused by the human speech to convert the sound signal into an electrical signal. Therefore, it can collect sound through air conduction, which is different from traditional microphones, so it can also transmit sound in a very noisy environment.

[0003] In the related art, the bone conduction sensor generally includes a vibration pickup unit and a microphone unit. The vibration pickup unit is used to pick up the bone vibration of the outside world and transmit it to the microphone unit. The microphone unit is used to convert the vibration signal into an electrical signal. The microphone unit is usually formed by a plurality of circuit boards to enclose an internal space, and a chip module is arranged in the internal space, so that there are a plurality of bonding positions between the plurality of circuit boards, resulting in low product performance reliability. At the same time, a hole needs to be opened on the circuit board to make the chip module communicate with the mounting space of the vibration pickup unit, which has a complex structure, a long process, and high cost, resulting in low product yield. SUMMARY

[0004] The main purpose of the present application is to provide a vibration sensor, which aims to simplify the structure of the vibration sensor, reduce the processing difficulty and cost, and improve the structural reliability of the vibration sensor.

[0005] To achieve the above purpose, the vibration sensor provided by the present application comprises:

[0006] A circuit board assembly;

[0007] An outer shell covering one side of the circuit board assembly to enclose a mounting space;

[0008] A vibration pickup assembly arranged in the mounting space, the vibration pickup assembly being used to pick up the bone vibration of the outside world to generate a response vibration;

[0009] A support shell connected to the side of the vibration pickup assembly away from the circuit board assembly; and

[0010] A chip assembly connected to the side of the support shell away from the circuit board assembly and electrically connected to the circuit board assembly;

[0011] Among them, the vibration pickup assembly, the support shell and the chip assembly enclose a conduction cavity.

[0012] In an embodiment of the present application, the chip assembly comprises:

[0013] a MEMS element connected to a side of the support shell away from the pickup assembly, the MEMS element and the support shell enclosing the conduction cavity with the pickup assembly; and

[0014] an ASIC chip connected to the support shell and electrically connected to the MEMS element and the circuit board assembly respectively.

[0015] In an embodiment of the present application, the support shell and the pickup assembly enclose a first cavity, the MEMS element and the support shell enclose a second cavity, the support shell is provided with a vibration transmission through hole, and the first cavity and the second cavity are communicated through the vibration transmission through hole to form the conduction cavity.

[0016] In an embodiment of the present application, the vibration transmission through hole is a micro hole;

[0017] and / or, the vibration sensor further comprises an air flow buffering structure covering the vibration transmission through hole;

[0018] and / or, the vibration transmission through hole is a plurality of vibration transmission through holes which are spaced apart on the support shell;

[0019] and / or, the volume of the first cavity is V1, 0.1mm 3 ≤V1≤20mm 3 .

[0020] In an embodiment of the present application, a pressure relief cavity is formed between the chip assembly and the shell, the shell is provided with a pressure relief hole communicating with the pressure relief cavity, and the MEMS element is provided with a first air flow channel communicating with the second cavity and the pressure relief cavity.

[0021] In an embodiment of the present application, the pressure relief hole is arranged in a position different from the MEMS element.

[0022] In an embodiment of the present application, the pickup assembly and the circuit board assembly are connected to enclose a vibration cavity.

[0023] In an embodiment of the present application, the pickup assembly comprises:

[0024] a support fixedly connected to the circuit board assembly;

[0025] an elastic pickup connected to the support, one side of the elastic pickup and the circuit board assembly enclosing the vibration cavity, and the other side of the elastic pickup and the chip assembly and the support shell enclosing the conduction cavity; and

[0026] a vibration adjusting member connected to the elastic pickup.

[0027] In an embodiment of the present application, the elastic pickup is connected to the support on the side away from the circuit board assembly, and the periphery of the elastic pickup covers the support, and the support shell is connected to the elastic pickup on the side away from the support;

[0028] and / or, the side of the circuit board assembly facing the vibration cavity forms a relief groove;

[0029] and / or, the elastic pickup and the vibration adjusting member are provided with a second airflow channel, which communicates the conduction cavity and the vibration cavity.

[0030] In an embodiment of the present application, the circuit board assembly comprises a plurality of stacked circuit boards.

[0031] The present application also provides an electronic device comprising a vibration sensor, the vibration sensor comprising:

[0032] a circuit board assembly;

[0033] a shell covering one side of the circuit board assembly to form a mounting space;

[0034] a pickup assembly arranged in the mounting space, the pickup assembly being used to pick up the bone vibration of the external environment to generate a response vibration;

[0035] a support shell connected to the pickup assembly on the side away from the circuit board assembly; and

[0036] a chip assembly connected to the support shell on the side away from the circuit board assembly and electrically connected to the circuit board assembly;

[0037] wherein the pickup assembly, the support shell and the chip assembly enclose a conduction cavity.

[0038] The vibration sensor of the technical scheme of the present application is covered by the shell on one side of the circuit board assembly to directly enclose the mounting space, and the vibration pickup assembly, the supporting shell and the chip assembly are all arranged in the mounting space, and the supporting shell is fixed to the side of the vibration pickup assembly away from the circuit board assembly, and the vibration pickup assembly is connected to the side of the supporting shell away from the vibration pickup assembly, so that the internal structure is compact and the installation is more convenient, and the vibration pickup assembly, the supporting shell and the chip assembly are enclosed to form a conduction cavity, so that the response vibration generated by the vibration pickup assembly picking up the bone vibration of the outside is transmitted to the chip assembly through the conduction cavity. Thus, the vibration sensor of the present application does not need to form a space for mounting the chip assembly in the circuit board assembly, thereby reducing the number of adhesion positions exposed to the outside of the circuit board assembly, simplifying the installation process, ensuring the stability of the overall structure of the circuit board assembly, reducing the reliability risk, and also not needing to open a hole in the circuit board, thereby simplifying the structure of the vibration sensor and reducing the processing difficulty and cost. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the drawings shown.

[0040] Figure 1 FIG. 1 is a structural schematic diagram of an embodiment of the vibration sensor of the present application.

[0041] BRIEF DESCRIPTION OF DRAWINGS

[0042]

[0043]

[0044] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0045] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0046] It should be noted that all the direction indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative position relationship, movement condition, etc. between components in a certain specific posture (as shown in the drawings), and if the specific posture changes, the direction indications will also change accordingly.

[0047] In the present application, unless otherwise explicitly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense, for example, "fixation" can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be direct connection, or indirect connection through an intermediate medium; can be internal communication of two elements or interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0048] In addition, the description such as "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing throughout the text is to include three parallel solutions, for example, "A and / or B" includes A solution, or B solution, or A and B solutions at the same time. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor within the scope of protection required by the present application.

[0049] The present application provides a vibration sensor 100.

[0050] Referring to Figure 1 In the embodiments of the present application, the vibration sensor 100 comprises a circuit board assembly 10, a shell 20, a vibration pickup assembly 30, a support shell 50 and a chip assembly 40, the shell 20 covers one side of the circuit board assembly 10 to form an installation space 90; the vibration pickup assembly 30 is arranged in the installation space 90, the vibration pickup assembly 30 is used to pick up external bone vibration to generate a response vibration; the support shell 50 is connected to the side of the vibration pickup assembly 30 away from the circuit board assembly 10; the chip assembly 40 is connected to the side of the support shell 50 away from the circuit board assembly 10 and is electrically connected with the circuit board assembly 10; wherein the vibration pickup assembly 30, the support shell 50 and the chip assembly 40 form a conduction cavity 60 therebetween.

[0051] In operation, the vibration pickup assembly 30 is configured to pick up the vibration of the bone of the user (or other vibration source) and generate a response vibration, i.e., the vibration of the bone of the user is transmitted to the vibration pickup assembly 30, the elastic vibration pickup 32 of the vibration pickup assembly 30 vibrates to generate a response vibration, and the response vibration is transmitted to the chip assembly 40 through the transmission cavity 60, so that the chip assembly 40 generates an electrical signal according to the received response vibration and is electrically transmitted to the circuit board assembly 10.

[0052] The vibration sensor 100 of the present application is covered by the shell 20 on one side of the circuit board assembly 10 to directly enclose the mounting space 90, and the vibration pickup assembly 30, the support shell 50, and the chip assembly 40 are all arranged in the mounting space 90, and the support shell 50 is fixed to the side of the vibration pickup assembly 30 away from the circuit board assembly 10, and the vibration pickup assembly 10 is connected to the side of the support shell 50 away from the vibration pickup assembly 30, so that the internal structure is compact and easy to install, and the vibration pickup assembly 30, the support shell 50, and the chip assembly 40 enclose the transmission cavity 60, so that the response vibration of the vibration pickup assembly 30 is transmitted to the chip assembly 40 through the transmission cavity 60. Thus, the vibration sensor 100 of the present application does not need to form a space for installing the chip assembly 40 in the circuit board assembly 10, thereby reducing the number of adhesive positions exposed to the outside of the circuit board assembly 10, simplifying the installation process, ensuring the stability of the overall structure of the circuit board assembly 10, reducing the risk of reliability, and also eliminating the need for a hole in the circuit board, thereby simplifying the structure of the vibration sensor 100 and reducing the processing difficulty and cost.

[0053] In an embodiment of the present application, the chip assembly 40 includes a MEMS element 411 and an ASIC chip 42, the MEMS element 411 is connected to the side of the support shell 50 away from the vibration pickup assembly 30, and the MEMS element 411 and the support shell 50 enclose the transmission cavity 60 with the vibration pickup assembly 30; the ASIC chip 42 is connected to the support shell 50 and is electrically connected to the MEMS element 411 and the circuit board assembly 10, respectively. The support shell 50 can be fixed to the side of the vibration pickup assembly 30 away from the circuit board assembly 10, and the MEMS element 411 and the ASIC chip 42 are installed on the same side of the support shell 50 away from the vibration pickup assembly 30, so as to provide installation positions for the MEMS element 411 and the ASIC chip 42, which not only ensures the stability after installation, but also facilitates synchronous installation in the early stage and maintenance and disassembly in the later stage. The MEMS element 411 and the support shell 50 enclose the transmission cavity 60 with the vibration pickup assembly 30, so that the response vibration of the vibration pickup assembly 30 can be transmitted to the MEMS element 411 to receive the response vibration and electrically transmitted to the ASIC chip 42 for processing and outputting an electrical signal. The MEMS element 411 can be a capacitor structure, a piezoresistive structure, or a piezoelectric structure.

[0054] Further, the support shell 50 and the vibration pickup assembly 30 form a first cavity 61, the MEMS element 411 and the support shell 50 form a second cavity 62, the support shell 50 is provided with a vibration transmission hole 51, and the first cavity 61 and the second cavity 62 are communicated through the vibration transmission hole 51 to form the transmission cavity 60. It can be understood that the support shell 50 and the vibration pickup assembly 30 form the first cavity 61, thereby forming a vibration space for the elastic vibration pickup 32 of the vibration pickup assembly 30, and by providing the vibration transmission hole 51 in the support shell 50, the vibration response in the first cavity 61 is formed after the vibration pickup assembly 30 vibrates, and is transmitted to the second cavity 62 formed by the MEMS element 411 and the support shell 50 through the vibration transmission hole 51, so that the MEMS element 411 can receive the vibration response and electrically transmit it to the ASIC chip 42 for processing and outputting an electric signal.

[0055] Further, the vibration transmission hole 51 is a micro-hole, wherein the diameter of the micro-hole can be selected as 1 um-100 um, so that by setting the vibration transmission hole 51 as a micro-hole, the airflow between the first cavity 61 and the second cavity 62 can be damped, thereby suppressing the peak sensitivity of the vibration sensor 100, improving the frequency response characteristics of the vibration sensor 100, expanding the working frequency width of the vibration sensor 100, and improving the product performance.

[0056] Optionally, the vibration sensor 100 further comprises an airflow buffering structure (not shown) covering the vibration transmission hole 51, wherein in order to further improve the damping effect of the vibration transmission hole 51, the airflow buffering structure can be provided at the vibration transmission hole 51, which can be a gas permeable film or a micro-hole adapter plate, so as to further improve the frequency response characteristics of the vibration sensor 100, expand the working frequency width of the vibration sensor 100, and improve the product performance.

[0057] Optionally, the vibration transmission hole 51 is a plurality of vibration transmission holes 51, and the plurality of vibration transmission holes 51 are spaced apart on the support shell 50. Wherein, the vibration transmission hole 51 can also be provided with a plurality of vibration transmission holes 51, so as to prevent the single vibration transmission hole 51 from being blocked and to ensure the normal flow of the airflow between the first cavity 61 and the second cavity 62.

[0058] Optionally, the volume of the first cavity 61 is V1, 0.1mm 3 ≤V1≤20mm 3 . Wherein, the first volume V1 is set as 0.1mm 3 to 20mm 3, so that the vibration space required by the elastic pickup 32 can be obtained, and meanwhile, the overall size of the vibration sensor 100 can be prevented from being too large.

[0059] In an embodiment of the present application, referring to Figure 1 , the pressure relief cavity 80 is formed between the chip assembly 40 and the shell 20, the shell 20 is provided with the pressure relief hole 21 communicating with the pressure relief cavity 80, and the MEMS element 411 is provided with the first airflow passage 411 communicating with the second cavity 62 and the pressure relief cavity 80. Wherein, when the pickup assembly 30 vibrates, the pressure of each cavity in the mounting space 90 formed by the shell 20 and the circuit board assembly 10 changes, in order to ensure the stability of the use of each component in the mounting space 90, the pressure relief cavity 80 is formed between the chip assembly 40 and the shell 20, the shell 20 is provided with the pressure relief hole 21 communicating with the pressure relief cavity 80, and the MEMS element 411 is provided with the first airflow passage 411 communicating with the second cavity 62 and the pressure relief cavity 80, so that the airflow in the internal space of the second cavity 62 after the pickup assembly 30 vibrates can flow to the pressure relief cavity 80 through the first airflow passage 411, and then flow to the outside through the pressure relief hole 21, so as to ensure the normal use of each component in the mounting space 90. It should be noted that the MEMS element 411 is a capacitor structure, which can be selected from single diaphragm / single back electrode, double diaphragm / single back electrode, single diaphragm / double back electrode, etc., and the air vent hole for air vent is placed on the diaphragm to form the first airflow passage 411. The hole shape can be a circular hole with a diameter of 1um to 30um, or a fan-shaped gap with a width of 0.2um to 20um. When the MEMS element 411 is a piezoresistance or piezoelectric structure, a fan leaf structure can be selected, and the number thereof can be between 1 and 50. The fan leaf gap is preferably 0.1um to 30um. In addition, a gas connection passage can also be provided between the vibration cavity 70 and the pressure relief cavity 80 formed by the pickup assembly 30 and the circuit board assembly 10. The passage shape is not limited, and the opening area can be between 1um 2 and 1000um 2 . The passage can be arranged at the connection position of the circuit board assembly 10 and the pickup assembly 30, or arranged at the connection position of the two, or arranged at another position. Of course, a pipe can also be arranged to communicate, which can be selected by those skilled in the art.

[0060] Further, the pressure relief hole 21 and the MEMS element 411 are arranged in a staggered manner. In order to prevent external light and other factors from directly passing through the pressure relief hole 21 to affect the normal work of the MEMS element 411, the pressure relief hole 21 is arranged in a staggered manner with the MEMS element 411, so as to ensure the stability of the work of the MEMS element 411 and improve the reliability.

[0061] In an embodiment of the present application, referring to Figure 1The vibration pickup assembly 30 is connected with the circuit board assembly 10 to form a vibration cavity 70.

[0062] It should be noted that the elastic vibration pickup 32 of the vibration pickup assembly 30 is bidirectional vibration, so that when the vibration pickup assembly 30 is connected with the circuit board assembly 10, the vibration cavity 70 is formed synchronously to provide a vibration space for the elastic vibration pickup 32, thereby ensuring the sensitivity of the vibration pickup assembly 30. The volume of the vibration cavity 70 can be 0.1mm 3 to 20mm 3 , so that the vibration space required by the elastic vibration pickup 32 can be provided, and the overall volume of the vibration sensor 100 can be avoided. The chip assembly 40 is connected to the side of the vibration pickup assembly 30 away from the circuit board to form a conduction cavity 60, so that the vibration pickup assembly 30 and the chip assembly 40 can be assembled with the circuit board assembly 10 first, and then the shell 20 is covered on the circuit board assembly 10, so that the installation process is simplified, the installation efficiency is improved, and the internal elements are covered and protected.

[0063] Further, the vibration pickup assembly 30 comprises a support 31, an elastic vibration pickup 32 and a vibration adjusting member 33, the support 31 is fixedly connected to the circuit board assembly 10; the elastic vibration pickup 32 is connected to the support 31, one side of the elastic vibration pickup 32 and the circuit board assembly 10 form the vibration cavity 70, the other side of the elastic vibration pickup 32 and the chip assembly 40 and the support shell 50 form the conduction cavity 60; the vibration adjusting member 33 is connected with the elastic vibration pickup 32. The support 31 is fixedly connected to the circuit board assembly 10, thereby ensuring the stability of the vibration pickup assembly 30, and the elastic vibration pickup 32 is connected to the support 31, and the upper and lower sides of the elastic vibration pickup 32 form the conduction cavity 60 and the vibration cavity 70 respectively, so that the elastic vibration pickup 32 affects the pressure of the conduction cavity 60 and the vibration cavity 70 when it vibrates to generate a response vibration. The elastic vibration pickup 32 can be made of organic polymer film or glue, metal sheet or other elastic materials, and the vibration area is selected to be 0.2mm 2 to 200mm 2 , so as to ensure the vibration amplitude of the elastic vibration pickup 32, and the vibration adjusting member 33 can be a block structure such as a circle, a square and a rectangle, and the mass can be selected to be between 0.2mg and 20mg. The vibration adjusting member 33 can be embedded in the upper part or the lower part of the elastic vibration pickup 32, so that the vibration adjusting member 33 can increase the amplitude of the response vibration generated by the elastic vibration pickup 32 when it receives bone vibration.

[0064] Further, the elastic vibration pickup 32 is connected to the support 31 away from the circuit board assembly 10, and the outer periphery of the elastic vibration pickup 32 covers the support 31, and the support shell 50 is connected to the side of the elastic vibration pickup 32 away from the support 31; wherein the support 31, the elastic vibration pickup 32 and the support shell 50 are sequentially stacked and installed in the direction away from the circuit board assembly 10, so as to facilitate the processing of the vibration sensor 100 as a whole, thereby improving the installation efficiency.

[0065] Further, the side of the circuit board assembly 10 facing the vibration cavity 70 is formed with a relief groove 11; wherein in order to further increase the vibration space of the vibration cavity 70, the relief groove 11 can be formed on the side of the circuit board assembly 10 facing the vibration cavity 70, and the depth can be between 10mm and 1000mm, so as to ensure that the vibration amplitude of the elastic vibration pickup 32 in the vibration cavity 70 is not affected, and the vibration sensitivity of the vibration pickup assembly 30 is improved.

[0066] Optionally, the elastic vibration pickup 32 and the vibration adjusting member 33 are provided with a second airflow channel 34, and the second airflow channel 34 communicates the conduction cavity 60 and the vibration cavity 70. Wherein the elastic vibration pickup 32 and the vibration adjusting member 33 are provided with the second airflow channel 34 to communicate the conduction cavity 60 and the vibration cavity 70, so as to ensure the stability of the airflow flowing in the conduction cavity 60 and the vibration cavity 70, and the shape of the second airflow channel 34 is not limited, and the opening area can be between 1um 2 and 1000um 2 , which can be specifically arranged at the connection position of the elastic vibration pickup 32 and the vibration adjusting member 33, or can be additionally arranged with a pipe for communication, which can be specifically selected by a person skilled in the art. The second airflow channel 34 can damp the airflow flowing between the conduction cavity 60 and the vibration cavity 70, so as to suppress the peak sensitivity of the vibration sensor 100, improve the frequency response characteristics of the vibration sensor 100, expand the working frequency width of the vibration sensor 100, and improve the product performance.

[0067] In an embodiment of the present application, the circuit board assembly 10 comprises a plurality of stacked circuit boards. Wherein in order to ensure the structural strength of the circuit board assembly 10 as a whole to ensure the stability of the support shell 20, a plurality of circuit boards can be stacked to ensure the stability of the circuit board assembly 10 as a whole, and the number of adhesion positions exposed to the outside of the circuit board assembly 10 can be further reduced, and the reliability risk can be reduced, and the specific number of the circuit boards can be set by a person skilled in the art according to the specific situation.

[0068] The application further provides an electronic device, which can be but is not limited to a head-mounted device, earphones, a smart watch, a smart bracelet, a vehicle-mounted noise reduction device, a vibration sensing device and other electronic devices known to those skilled in the art. The electronic device comprises the vibration sensor 100, the specific structure of which is referred to the above embodiments. Since the electronic device adopts all the technical solutions of the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0069] The above description is only the preferred embodiments of the application, and does not limit the patent scope of the application. Any equivalent structural transformation, direct / indirect application in other related technical fields, or the like made by using the content of the application specification and drawings within the inventive concept of the application are included in the patent protection scope of the application.

Claims

1. A vibration sensor, characterized by The vibration sensor comprises: a circuit board assembly; a housing covering one side of the circuit board assembly to form an installation space; a vibration pickup assembly arranged in the installation space, the vibration pickup assembly being used to pick up external bone vibration to generate a response vibration; a support shell connected to a side of the vibration pickup assembly away from the circuit board assembly; and a chip assembly connected to a side of the support shell away from the circuit board assembly and electrically connected to the circuit board assembly; wherein the vibration pickup assembly, the support shell and the chip assembly form a conduction cavity therebetween; the chip assembly comprises: a MEMS element connected to a side of the support shell away from the vibration pickup assembly, the MEMS element and the support shell forming the conduction cavity with the vibration pickup assembly; and an ASIC chip connected to the support shell and electrically connected to the MEMS element and the circuit board assembly respectively; the support shell and the vibration pickup assembly form a first cavity, the MEMS element and the support shell form a second cavity, the support shell is provided with a vibration transmission through hole, and the first cavity and the second cavity are communicated through the vibration transmission through hole to form the conduction cavity; the vibration transmission through hole is a micro hole, the diameter of the micro hole is 1-100 um, the vibration transmission through hole is a plurality of vibration transmission through holes, and the plurality of vibration transmission through holes are arranged on the support shell at intervals; or the vibration sensor further comprises an airflow buffering structure covering the vibration transmission through hole.

2. The vibratory sensor of claim 1, wherein, The volume of the first chamber is V1, 0.1 mm 3 ≤ V1≤ 20 mm 3 .

3. The vibratory sensor of claim 1, wherein, A pressure relief cavity is formed between the chip assembly and the housing, the housing is provided with a pressure relief hole communicating with the pressure relief cavity, and the MEMS element is provided with a first airflow channel communicating the second cavity and the pressure relief cavity.

4. The vibratory sensor of claim 3, wherein, The pressure relief hole is arranged in a staggered manner with the MEMS element.

5. A vibrating sensor as claimed in any one of claims 1 to 4, characterised in that The vibration pickup assembly and the circuit board assembly are connected to form a vibration cavity.

6. The vibratory sensor of claim 5, wherein, The vibration pickup assembly comprises: a support fixedly connected to the circuit board assembly; an elastic vibration pickup element connected to the support, one side of the elastic vibration pickup element forming the vibration cavity with the circuit board assembly, and the other side of the elastic vibration pickup element forming the conduction cavity with the chip assembly and the support shell; and a vibration adjusting element connected to the elastic vibration pickup element.

7. The vibratory sensor of claim 6, wherein, The elastic vibration pickup element is connected to a side of the support away from the circuit board assembly, and the outer periphery of the elastic vibration pickup element covers the support, and the support shell is connected to a side of the elastic vibration pickup element away from the support; and / or, a side of the circuit board assembly facing the vibration cavity is formed with a relief groove; and / or, the elastic vibration pickup element and the vibration adjusting element are provided with a second airflow channel, and the second airflow channel communicates the conduction cavity and the vibration cavity.

8. A vibrating sensor as claimed in any one of claims 1 to 4, characterised in that The circuit board assembly comprises a plurality of stacked circuit boards.

9. An electronic device, comprising: The vibration sensor comprises the vibration sensor according to any one of claims 1-8.

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