Ceramic slice debonding and film tearing mechanism

By designing the degluing and film tearing mechanism for ceramic slices, using ultraviolet lamps to deglue and simulate artificial film tearing, the problem of difficult to remove the film automatically after the ceramic slice is cut, and efficient and automated film tearing is achieved.

CN113479643BActive Publication Date: 2025-08-29SUZHOU DA VINCI AUTOMATION TECH CO LTD
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Patent Information

Application Number
CN202110947233.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2021-05-12
Filing Date
2021-08-18
Publication Date
2025-08-29
Estimated Expiration
2041-08-18

AI Technical Summary

Technical Problem

In the prior art, it is difficult to automatically remove the small piece adhered to the adhesive film after the ceramic sheet is cut, resulting in low manual operation efficiency, fatigue and inconvenient flow.

Method used

A degluing and film tearing mechanism for ceramic slices is designed, including a degluing platform, a membrane tearing mechanism, a feeding robot and a silo. UV lamps are used to deglue and simulate manual film tearing, and combined with a rotating cylinder and suction cup mechanism to achieve automatic tearing of the adhesive film.

Benefits of technology

It realizes rapid degluing and tearing of adhesive film, improves work efficiency and meets the needs of automated production lines.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a debonding and film-tearing mechanism for ceramic slices, comprising a debonding platform equipped with a debonding mechanism, a film-tearing mechanism, a feeding robot, and a silo for placing ceramic slices. The debonding mechanism is used to detackify the film on the back of the ceramic slice; the film-tearing mechanism is used to tear the debonded film from the ceramic slice; the silo is used to place the ceramic slices; and the feeding robot is used to absorb the ceramic slices as they flow between different workstations. The present invention enables rapid debonding and film-tearing, improves work efficiency, and meets the requirements of automated production lines.
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Description

Technical Field

[0001] The present invention relates to the technical field of PCB production equipment, in particular to a debonding and film tearing mechanism for ceramic slices. Background Art

[0002] Embedding ceramic sheets in PCBs is primarily designed to address the issue of high-power heat-generating components on PCBs aging and shortening their lifespan during use due to heat dissipation. Therefore, ceramic sheets must be embedded in the corresponding locations on the PCB where the high-power heat-generating components are located. High positioning accuracy (±0.005mm) is required. This process is currently widely used in mainstream automotive lighting manufacturers abroad and is essential for PCBs with LED and laser light sources.

[0003] The raw materials of ceramic sheets are whole pieces. When using, the whole piece of ceramic sheet needs to be cut into the required size, and then matched with the through holes opened on the PCB board to realize the placement of the ceramic sheet on the PCB board. Figure 1 The figure shows the ceramic sheet raw material after cutting, including the upper ceramic sheet 1b and the lower film 1a. In order to facilitate the tearing of the film 1a, a tearing notch 1c is reserved at at least one corner. The commonly used film 1a is UV film.

[0004] During the ceramic sheet embedding process, the entire sheet is cut into relatively small dimensions, typically square or rectangular, with sides ranging from a few to a dozen millimeters. Furthermore, these small dimensions make them difficult to transport. Therefore, a layer of adhesive film is applied to the back of the entire sheet. The cut pieces adhere to the film, preventing them from falling apart and facilitating easy transport. However, before inserting the ceramic sheet into a through-hole on a PCB, the film on the back of the sheet must be removed before the small piece can be inserted. Manual removal of the cut pieces is difficult due to their small size, and prolonged operation can be tiring, resulting in high workload and low efficiency. Therefore, a device is needed to automatically remove the adhesive film from ceramic sheets to meet the requirements of PCB production processes. Summary of the Invention

[0005] The technical problem to be solved by the present invention is: in order to overcome the deficiencies in the prior art, the present invention provides a debonding and film tearing mechanism for ceramic slices.

[0006] The technical solution adopted by the present invention to solve its technical problems is: a degumming and film tearing mechanism for ceramic slices, including a degumming platform, on which a degumming mechanism, a film tearing mechanism, a feeding robot and a silo for placing ceramic slices are provided. The degumming mechanism is used to make the film on the back of the ceramic slice lose its stickiness; the film tearing mechanism is used to tear off the film that has lost its stickiness from the ceramic slice; the silo is located on the side of the feeding robot and is used to place ceramic slices; the execution end of the feeding robot is connected to a feeding suction cup mechanism, which is used to adsorb ceramic slices and flow between different workstations.

[0007] Furthermore, the debonding mechanism includes debonding lamps, a light box, and a light controller. Multiple debonding lamps are installed in parallel within the light box, which is secured to the debonding platform and has a light-transmitting upper surface. The light controller is mounted on the platform and connected to the debonding lamp circuitry to control the operating status of the debonding lamps. The light emitted by debonding lamps for films made of different materials may not be the same. For example, the film on the back of a ceramic sheet is a UV film. Therefore, a UV lamp is typically used for the UV film debonding lamp. UV light can debond the UV film, causing it to lose its stickiness. While it still maintains a certain degree of adhesion to the ceramic sheet, it can be easily removed by external force.

[0008] Furthermore, to achieve film removal, the present invention designs a film-tearing mechanism that simulates manual film tearing. The film-tearing mechanism is located on one side of the disassembly mechanism and includes a vertical plate, a clamp, and a film-tearing cylinder. The bottom of the vertical plate is fixed to the disassembly platform, the clamp is fixed to the top of the vertical plate, and one end of the clamp extends outward to form a film clamping portion. The film-tearing cylinder is fixed below the film clamping portion, and the push rod of the film-tearing cylinder is directly opposite the film clamping portion. When tearing the film, the push rod of the film-tearing cylinder moves upward to clamp the film at the tearing notch of the ceramic slice between the push rod and the film clamping portion. The feeding robot drives the ceramic slice to move to achieve film tearing.

[0009] Furthermore, the feeding suction cup mechanism includes a rotary cylinder, the cylinder body of the rotary cylinder is horizontally connected to the execution end of the feeding robot through a cylinder connecting column, the swing end of the rotary cylinder can rotate and swing in a vertical plane, and a transfer plate is fixedly connected to the swing end, and a group of suction cup assemblies are respectively provided on the upper and lower surfaces of the transfer plate, and each group of the suction cup assemblies includes a suction cup, a Y-shaped plate and a suction cup connecting column, the Y-shaped plate is fixedly connected to the surface of the transfer plate, and a suction cup connecting column is respectively connected to the three branches of the Y-shaped plate, and the suction cup is fixed to the top of the suction cup connecting column, and the suction cup is fixed to the transfer plate through the suction cup connecting column and the Y-shaped plate, the suction cup connecting column is a stud with a nut on it, and the upper and lower ends are locked by the nut, and an air pipe joint is provided on the back of the suction cup, and the air pipe joint is connected to the air duct on the front of the suction cup.

[0010] A set of suction cup assemblies are set on the upper and lower surfaces of the adapter plate, which can simultaneously adsorb two ceramic slices and improve work efficiency. The rotary cylinder can meet the alternation of the upper and lower sets of suction cup assemblies.

[0011] Furthermore, there is at least one hopper, comprising a hopper base, at least one adjustment plate, and multiple positioning posts. The bottom of the hopper base is fixed to the disintegration platform. The adjustment plate and multiple positioning posts together form a rectangular cavity on the upper surface of the hopper base with an open side, and the opening of the rectangular cavity faces the feeding robot. At least one side of the rectangular cavity is formed by the positioning posts, and at least one side is formed by the adjustment plate. The adjustment plate is movable on the upper surface of the hopper base to adjust the size of the rectangular cavity opening. When there are multiple hoppers, each hopper can hold ceramic slices of different specifications, meeting the needs of ceramic slices of different sizes on PCB boards.

[0012] Furthermore, a guide groove perpendicular to the plane where the adjustment plate is located is provided on the base of the silo, and a guide bar matching the guide groove is provided at the bottom of the adjustment plate, and the guide bar is embedded in the guide groove; when the adjustment plate moves, it is guided to facilitate maintaining the shape of the rectangular silo, thereby better realizing the positioning and storage of ceramic slices.

[0013] The silo base also features a row of connection holes on either side of the guide chute. The bottom surface of the adjustment plate features a circular through-hole, which aligns vertically with the connection holes. Screws inserted into these holes secure the adjustment plate to the silo base. The multiple connection holes facilitate adjustment of the adjustment plate's position based on the size of the ceramic slices, and the circular through-holes allow for fine-tuning of the plate's position, allowing the same silo to accommodate ceramic slices of varying sizes.

[0014] Furthermore, in order to achieve the loading of ceramic sheets, it also includes at least one adsorption-type discharge platform fixed on the debonding platform, the adsorption-type discharge platform includes an adsorption bottom plate, an adsorption upper plate and a backlight source, the adsorption bottom plate is fixed on the embedding platform, and the upper surface of the adsorption bottom plate is provided with a plurality of concentric annular air grooves, the adsorption upper plate is fixed on the adsorption bottom plate, and the adsorption upper plate is provided with adsorption air holes, the adsorption air holes are connected to the annular air grooves, and are used to adsorb the ceramic sheet tray placed on the adsorption upper plate, and the surface of the ceramic sheet tray is also provided with adsorption air holes for adsorbing the ceramic sheet with the film removed; the small ceramic sheets after slicing are relatively small in size and are directly placed on the ceramic sheet tray, and the gaps between adjacent small ceramic sheets are not easy to identify, so the ceramic sheet tray is a transparent structure, and the backlight source is provided below the ceramic sheet tray to illuminate the bottom of the ceramic sheet tray. The ceramic sheets are illuminated from below the ceramic sheet tray by the backlight source, and light will pass through the cut gaps between adjacent small ceramic sheets, making it easy for the camera to distinguish and determine the position of the small ceramic sheets.

[0015] Specifically, the degumming platform includes a box body and a bracket for supporting and fixing the box body. The degumming mechanism, film tearing mechanism, adsorption-type discharge table, feeding robot and hopper are all arranged on the top of the box body, the electric control box is arranged on the side of the box body, and the film tearing mechanism, adsorption-type discharge table and feeding robot controller are all arranged inside the box body. Universal casters are provided at the four corners of the bottom of the box body, and feet are provided at the four corners of the bracket.

[0016] The beneficial effects of the present invention are as follows: the debonding and film tearing mechanism for ceramic slices provided by the present invention can realize rapid debonding and film tearing, thereby improving work efficiency and meeting the requirements of automated production lines. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further described below with reference to the accompanying drawings and examples.

[0018] Figure 1 It is a structural diagram of the raw material for ceramic slices.

[0019] Figure 2 It is a three-dimensional structural diagram of the glue dissolving and film tearing mechanism.

[0020] Figure 3 It is a top view structural diagram of the glue dissolving and film tearing mechanism.

[0021] Figure 4 It is a structural diagram of the film tearing mechanism.

[0022] Figure 5 It is a schematic diagram of the film tearing process of the film tearing mechanism.

[0023] Figure 6 It is a structural diagram of the feeding suction cup mechanism.

[0024] Figure 7 It is a structural diagram of the adsorption type discharge table.

[0025] Figure 8 It is a structural diagram of a single silo.

[0026] Figure 9 This is a schematic diagram of the structure in which large-sized ceramic slices are placed in a double silo.

[0027] Figure 10 It is a schematic diagram of the structure in which small-sized ceramic slices are placed in a double silo.

[0028] In the figure: 1. Ceramic slice, 1a. Film, 1b. Ceramic sheet, 1c. Film tearing notch, 2. Debonding platform, 21. Foot, 22. Universal caster, 24. Box, 3. Debonding mechanism, 4. Film tearing mechanism, 41. Vertical plate, 42. Film tearing cylinder, 43. Clip, 44. Film clamping part, 5. Adsorption type unloading platform, 51. Ceramic sheet tray, 52. Adsorption upper plate, 53. Adsorption bottom plate, 54. Adsorption pores, 55. Annular air Slot, 6. Feed suction cup mechanism, 61. Adapter plate, 62. Y-shaped plate, 63. Air pipe joint, 64. Suction cup connecting column, 65. Suction cup, 66. Air duct, 67. Rotary cylinder, 68. Cylinder connecting column, 7. Hopper, 71. Hopper base, 72. Positioning column, 73. Adjustment plate, 74. Guide slide, 75. Guide bar, 76. Connecting hole, 77. Waist round through hole, 8. Waste box, 9. Feeding robot, 10. Electric control box. DETAILED DESCRIPTION

[0029] The present invention will now be described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram, which only illustrates the basic structure of the present invention in a schematic manner, and therefore only shows the components related to the present invention.

[0030] like Figure 2 and Figure 3 As shown, a degumming and film-tearing mechanism 4 for a ceramic slice 1 of the present invention comprises a degumming platform 2, on which a degumming mechanism 3, a film-tearing mechanism 4, an adsorption-type discharge table 5, a feeding robot 9 and a silo 7 for placing ceramic slices 1b are provided. The degumming mechanism 3 is used to make the adhesive film 1a on the back of the ceramic slice 1b lose its stickiness; the film-tearing mechanism 4 is used to tear off the adhesive film 1a that has lost its stickiness from the ceramic slice 1b; the adsorption-type discharge table 5 is used to place the ceramic slice 1b after the adhesive film 1a is removed; the silo 7 is located on the side of the feeding robot 9, for placing ceramic slices 1; the execution end of the feeding robot 9 is connected with a feeding suction cup mechanism 6, for adsorbing the ceramic slices 1 for circulation between different workstations.

[0031] The disassembly mechanism 3 includes disassembly lamps, a light box, and a light controller. Multiple disassembly lamps are mounted in parallel within the light box, which is secured to the disassembly platform 2 and has a light-transmitting upper surface. The light controller is mounted on the disassembly platform 2 and connected to the disassembly lamp circuitry to control the disassembly lamp's operating state. The light emitted by the disassembly lamps corresponding to different adhesive films 1a may not be identical. For example, the adhesive film 1a on the back of the ceramic slice 1b is a UV film. Therefore, a UV lamp is typically used for the UV film disassembly lamp. UV light irradiation desensitizes the UV film, rendering it less viscous. While some adhesion to the ceramic slice 1 remains, the film 1a can be easily removed by external force.

[0032] like Figure 4As shown, in order to achieve the removal of the film 1a, the present invention simulates manual film tearing and designs a film tearing mechanism 4, which is located on one side of the debonding mechanism 3, and includes a vertical plate 41, a clamping piece 43 and a film tearing cylinder 42. The bottom of the vertical plate 41 is fixed on the debonding platform 2, the clamping piece 43 is fixed on the top of the vertical plate 41, and one end of the clamping piece 43 extends outward to form a film clamping portion 44, the film tearing cylinder 42 is fixed below the film clamping portion 44, and the push rod of the film tearing cylinder 42 is facing the film clamping portion 44.

[0033] like Figure 5 As shown in the figure, the hollow arrows indicate the changes in the film tearing state, and the small arrows indicate the movement direction of the ceramic slice 1. During film tearing, the ceramic slice 1 moves in the direction of arrow a close to the film tearing mechanism 4, so that the film 1a at the film tearing notch 1c of the ceramic slice 1 moves to the bottom of the film clamping portion 44, located between the film clamping portion 44 and the push rod of the film tearing cylinder 42. The push rod of the film tearing cylinder 42 moves upward to clamp the film 1a at the film tearing notch 1c of the ceramic slice 1 between the push rod and the film clamping portion 44, thereby simulating the process of pinching the film 1a with fingers; in order to avoid the ceramic slice 1b from colliding with the film clamping portion 44 of the clamping piece 43, the ceramic slice 1 is first lifted upward in the direction of arrow b, and then the ceramic slice 1 is moved horizontally in the direction of arrow c to tear off the film 1a at the bottom of the ceramic slice 1, and then the ceramic slice 1b with the film 1a torn off is placed on the adsorption-type discharge table 5.

[0034] like Figure 6 As shown, the feeding suction cup mechanism 6 includes a rotary cylinder 67, the cylinder body of the rotary cylinder 67 is horizontally connected to the execution end of the feeding manipulator 9 through a cylinder connecting column 68, the swing end of the rotary cylinder 67 can rotate and swing in a vertical plane, and a transfer plate 61 is fixedly connected to the swing end, and a group of suction cup assemblies are respectively provided on the upper and lower surfaces of the transfer plate 61, each group of the suction cup assemblies includes a suction cup 65, a Y-shaped plate 62 and a suction cup connecting column 64, and the Y-shaped plate 62 is fixedly connected to the suction cup assemblies. It is connected to the surface of the adapter plate 61, and a suction cup connecting column 64 is connected to each of the three branches of the Y-shaped plate 62, and the suction cup 65 is fixed to the top of the suction cup connecting column 64. The suction cup 65 is fixed to the adapter plate 61 through the suction cup connecting column 64 and the Y-shaped plate 62. The suction cup connecting column 64 is a stud with a nut on it, and the upper and lower ends are locked by the nut. An air pipe connector 63 is provided on the back of the suction cup 65, and the air pipe connector 63 is connected to the air duct 66 on the front of the suction cup 65.

[0035] A set of suction cup assemblies are set on the upper and lower surfaces of the adapter plate 61, which can simultaneously adsorb two ceramic slices 1 and improve work efficiency. The rotary cylinder 67 can meet the alternation of the upper and lower sets of suction cup assemblies.

[0036] In order to realize the loading of ceramic sheets 1b to the visual embedding mechanism, it also includes at least one adsorption-type discharge table 5 fixed on the degumming platform 2 and close to one side of the embedding platform. The adsorption-type discharge table 5 is arranged on the periphery of the degumming mechanism 3, which is convenient for placement nearby after degumming and film tearing. The adsorption-type discharge table 5 needs to be close to the visual embedding mechanism of the ceramic sheet 1b to facilitate the grabbing of the embedding robot in the embedding process. Several can be set on the degumming platform 2, and then several can be set on the embedding platform to facilitate the placement of ceramic sheets 1b of different sizes.

[0037] like Figure 7 As shown, the suction-type unloading platform 5 includes a suction base plate 53, a suction upper plate 52, and a backlight (not shown). The suction base plate 53 is fixed to the inserting platform 1 and has multiple concentric annular air grooves 55 on its upper surface. The suction upper plate 52 is fixed to the suction base plate 53 and has suction holes 54 on it. These holes 54 communicate with the annular air grooves 55 and are used to absorb the ceramic wafer tray 51 placed on the suction upper plate 52. The ceramic wafer tray 51 also has suction holes 54 on its surface for absorbing the ceramic wafer 1b after the film 1a has been removed. The ceramic wafer tray 51 is transparent, and a backlight is located below the ceramic wafer tray 51 to illuminate the bottom of the ceramic wafer tray 51 for easy identification. Ceramic wafers 1b may be broken after cutting. Therefore, to remove waste from the suction-type unloading platform 5, the inserting platform 1 is also equipped with a waste box 8 for storing unqualified ceramic wafers 1b. In this embodiment, the adsorption-type discharge table 5 is two disassembly platforms 2 respectively arranged on both sides of the disassembly mechanism 3.

[0038] like Figures 8-10As shown, the silo 7 can be either a single silo or a double silo, specifically comprising a silo base 71, at least one adjustment plate 73, and a plurality of positioning posts 72. The bottom of the silo base 71 is fixed to the disintegration platform 2. The upper surface of the silo base 71 is formed by the adjustment plate 73 and the plurality of positioning posts 72 to form a rectangular cavity with an open side, and the opening of the rectangular cavity faces the feeding robot 9. The rectangular cavity has at least one side formed by the positioning posts 72 and at least one side formed by the adjustment plate 73. The adjustment plate 73 can move on the upper surface of the silo base 71 to adjust the opening size of the rectangular cavity. In this embodiment, each rectangular cavity has an adjustment plate 73 and two sets of positioning posts 72, which surround the rectangular cavity on three sides. The silo base 71 is provided with a guide slot 74 perpendicular to the plane where the adjustment plate 73 is located. The bottom of the adjustment plate 73 is provided with a guide bar 75 that matches the guide slot 74. The guide bar 75 is embedded in the guide slot 74. When the adjustment plate 73 moves, it guides the silo 7 to maintain the shape of the rectangular silo 7, thereby better positioning and storing the ceramic slices 1. A row of connecting holes 76 are also provided on both sides of the guide slot 74 of the silo base 71. A waist-shaped through hole 77 is provided on the bottom surface of the adjustment plate 73, and the waist-shaped through hole 77 is aligned with the connecting hole 76. The adjustment plate 73 is connected and fixed to the silo base 71 by screws set in the waist-shaped through hole 77 and the connecting hole 76. The multiple connecting holes 76 can facilitate the adjustment of the position of the adjustment plate 73 according to the size of the ceramic slice 1, and the waist-shaped through hole 77 can achieve fine-tuning of the position of the adjustment plate 73, so that the same silo 7 can accommodate the placement of ceramic slices 1 of different sizes.

[0039] In this embodiment, there are four silos 7, two of which are placed on each side of the feeding robot 9, and one of them is a single silo with a rectangular material cavity on the silo base 71, and the single silo is tilted; the other is a double silo with two rectangular material cavities on the same silo base 71.

[0040] like Figure 1 As shown, the degumming platform includes a box body 24 and a bracket for supporting and fixing the box body 24. The degumming mechanism 3, film tearing mechanism 4, adsorption type discharge table 5, feeding robot 9 and silo are all arranged on the top of the box body 24, the electric control box 10 is arranged on the side of the box body 24, and the film tearing mechanism 4, adsorption type discharge table 5 and feeding robot 9 controllers are all arranged inside the box body 24. Universal casters 22 are provided at the four corners of the bottom of the box body 24, and feet 21 are provided at the four corners of the bracket.

[0041] With the above-described preferred embodiments of the present invention as inspiration, and with reference to the above description, relevant personnel may make various changes and modifications without departing from the scope of the present invention. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A debonding and film tearing mechanism for ceramic slices, characterized by: It includes a debonding platform, on which a debonding mechanism, a film-tearing mechanism, a feeding manipulator, and a silo for placing ceramic sheets are provided. The debonding mechanism is used to make the film on the back of the ceramic sheet lose its stickiness; the film-tearing mechanism is used to tear the film that has lost its stickiness from the ceramic sheet; the silo is located on the side of the feeding manipulator and is used to place ceramic sheet slices; the execution end of the feeding manipulator is connected to a feeding suction cup mechanism for absorbing ceramic sheet slices and transferring them between different workstations; The film tearing mechanism is located on one side of the disassembly mechanism, and includes a vertical plate, a clamping piece, and a film tearing cylinder. The bottom of the vertical plate is fixed on the disassembly platform, the clamping piece is fixed on the top of the vertical plate, and one end of the clamping piece extends outward to form a film clamping portion. The film tearing cylinder is fixed below the film clamping portion, and the push rod of the film tearing cylinder is facing the film clamping portion. The feeding suction cup mechanism includes a rotary cylinder, the cylinder body of the rotary cylinder is horizontally connected to the execution end of the feeding robot through a cylinder connecting column, the swing end of the rotary cylinder can rotate and swing in a vertical plane, and an adapter plate is fixedly connected to the swing end, and a group of suction cup assemblies are respectively provided on the upper and lower surfaces of the adapter plate, and each group of the suction cup assemblies includes a suction cup, a Y-shaped plate and a suction cup connecting column, the Y-shaped plate is fixedly connected to the surface of the adapter plate, and a suction cup connecting column is respectively connected to the three branches of the Y-shaped plate, and the suction cup is fixed to the top of the suction cup connecting column, and an air pipe joint is provided on the back of the suction cup, and the air pipe joint is connected to the air duct on the front of the suction cup.

2. The debonding and film tearing mechanism for ceramic slices according to claim 1, characterized in that: The degumming mechanism includes a degumming lamp, a light box and a light controller. The degumming lamps are installed in parallel in the light box. The light box is fixed on the degumming platform, and the upper surface of the light box is a light-transmitting structure. The light controller is arranged on the degumming platform and connected to the degumming lamp circuit to control the working state of the degumming lamp.

3. The debonding and film tearing mechanism for ceramic slices according to claim 1, characterized in that: There is at least one silo, which includes a silo base, at least one adjustment plate and multiple positioning columns. The bottom of the silo base is fixed on the degumming platform, and the upper surface of the silo base is surrounded by the adjustment plate and multiple positioning columns to form a rectangular material cavity with a side opening, and the opening of the rectangular material cavity faces the feeding robot; at least one side of the rectangular material cavity is composed of the positioning columns, and at least one side is composed of the adjustment plate; the adjustment plate can move on the upper surface of the silo base to adjust the opening size of the rectangular material cavity.

4. The debonding and film tearing mechanism for ceramic slices according to claim 3, characterized in that: The silo base is provided with a guide chute perpendicular to the plane where the adjustment plate is located, and the bottom of the adjustment plate is provided with a guide strip matching the guide chute, and the guide strip is embedded in the guide chute; A row of connecting holes are also provided on both sides of the guide slide of the silo base. A waist-shaped through hole is provided on the bottom surface of the adjustment plate, and the waist-shaped through hole is aligned with the connecting hole up and down. The adjustment plate is connected and fixed to the silo base by screws set in the waist-shaped through hole and the connecting hole.

5. The debonding and film tearing mechanism for ceramic slices according to claim 1, characterized in that: It also includes at least one adsorption-type discharge platform fixed on the degumming platform, the adsorption-type discharge platform includes an adsorption bottom plate, an adsorption upper plate and a backlight source, the adsorption bottom plate is fixed on the embedding platform, and the upper surface of the adsorption bottom plate is provided with a plurality of concentric annular air grooves, the adsorption upper plate is fixed on the adsorption bottom plate, and the adsorption upper plate is provided with adsorption air holes, the adsorption air holes are connected with the annular air grooves, and are used to adsorb the ceramic wafer tray placed on the adsorption upper plate, the surface of the ceramic wafer tray is also provided with adsorption air holes, which are used to adsorb the ceramic wafer with the film removed; the ceramic wafer tray is a transparent structure, and the backlight source is arranged below the ceramic wafer tray to illuminate the bottom of the ceramic wafer tray.

6. The debonding and film tearing mechanism for ceramic slices according to claim 1, characterized in that: The degumming platform includes a box body and a bracket for supporting and fixing the box body. The degumming mechanism, film tearing mechanism, adsorption-type discharge table, feeding robot and silo are all arranged on the top of the box body, the electric control box is arranged on the side of the box body, and the film tearing mechanism, adsorption-type discharge table and feeding robot controller are all arranged inside the box body. Universal casters are provided at the four corners of the bottom of the box body, and the four corners of the bracket are provided with feet.

Citation Information

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