Substrate Cleaning Device and Method

Abstract

A substrate cleaning apparatus may include a chamber body configured to hold a substrate and a brush assembly. The brush assembly may include a first roller, a second roller, and a belt extending between the first roller and the second roller. At least one of the first roller and the second roller may be movable between a first position and a second position, at which the belt contacts a first surface of the substrate disposed in the chamber body and at which the belt is spaced apart from the first surface. Other substrate cleaning apparatuses and methods of cleaning a substrate are disclosed.

Description

Technical Field

[0001] The present disclosure relates to a substrate cleaning apparatus and an operation method thereof. Background Art

[0002] During semiconductor device manufacturing, the substrate on which the semiconductor device is fabricated undergoes many processes. One such process is cleaning, in which the substrate may be placed in a brush box. A cleaning roller may be located in the brush box and may rotate against the substrate to clean the substrate. Summary of the Invention

[0003] In some embodiments, a substrate cleaning apparatus is provided. The substrate cleaning apparatus includes: a chamber body configured to hold a substrate; a first brush assembly including a first roller, a second roller, and a first belt extending between the first roller and the second roller, at least one of the first roller and the second roller being movable between a first position and a second position, at the first position the first belt contacting a first surface of the substrate disposed in the chamber body, and at the second position the first belt being spaced apart from the first surface; and a second brush assembly including a first roller, a second roller, and a second belt extending between the first roller and the second roller, at least one of the first roller and the second roller being movable between a first position and a second position, at the first position the second belt contacting a second surface of the substrate, and at the second position the second belt being spaced apart from the second surface.

[0004] In some embodiments, a method of cleaning a substrate is provided. The method may include: providing a first brush assembly including a first roller, a second roller, and a first belt extending between the first roller and the second roller; providing a second brush assembly including a first roller, a second roller, and a second belt extending between the first roller and the second roller; rotating the first belt; rotating the second belt; moving at least one of the first roller and the second roller of the first brush assembly to a first position, at the first position the first belt contacting a first surface of the substrate; and moving at least one of the first roller and the second roller of the second brush assembly to a first position, at the first position the second belt contacting a second surface of the substrate.

[0005] In some embodiments, a substrate cleaning apparatus is provided. The substrate cleaning apparatus may include: a chamber body configured to hold a substrate; a first brush assembly including a first roller, a second roller, and a belt extending between the first roller and the second roller, at least one of the first roller and the second roller being movable between a first position and a second position, wherein at the first position the belt contacts a first surface of the substrate disposed in the chamber body and at the second position the belt is spaced apart from the first surface; and a magnetic coupler located outside the chamber body and magnetically coupled to one of the first roller and the second roller, wherein the magnetic coupler is configured to move one of the first roller and the second roller between the first position and the second position.

[0006] In these and other embodiments of the present disclosure, numerous other aspects and features are provided. Other features and aspects of the embodiments of the present disclosure will become more fully apparent from the following detailed description, claims, and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The drawings described below are for illustrative purposes only and are not necessarily drawn to scale. The drawings are not intended to limit the scope of the present disclosure in any way. Identical or similar reference numerals will be used throughout all the drawings to refer to the same or similar parts as much as possible.

[0008] Figure 1A A side view of a substrate cleaner in a cleaning state according to an embodiment disclosed herein is illustrated.

[0009] Figure 1B A side view of a substrate cleaner in a release state according to an embodiment disclosed herein is illustrated.

[0010] Figure 2A A side view of another embodiment of a substrate cleaner in a cleaning state according to an embodiment disclosed herein is illustrated.

[0011] Figure 2B A side view of another embodiment of a substrate cleaner in a cleaning state according to an embodiment disclosed herein is illustrated.

[0012] Figure 3 A top view of a substrate cleaner according to an embodiment disclosed herein including a belt having zones is illustrated.

[0013] Figure 4 A side view of another embodiment of a substrate cleaner according to an embodiment disclosed herein is illustrated.

[0014] Figure 5 A top view of a substrate cleaner according to an embodiment disclosed herein including a magnetic coupling between a motor and a belt is illustrated.

[0015] Figure 6 The flowchart illustrates a method of cleaning a substrate according to the description of the embodiments disclosed herein. Detailed Description

[0016] Figure 1A The side view of the substrate cleaning apparatus 100 in the cleaning state is illustrated, and Figure 1B the substrate cleaning apparatus 100 in the release state is illustrated. The features of the substrate cleaning apparatus 100 described herein can be applied to other substrate processing apparatuses. The substrate cleaning apparatus 100 may include a chamber body 102 (e.g., a brush box) that defines a processing space 104. The chamber body 102 may be a tank configured to hold a processing liquid (such as a cleaning liquid for cleaning the substrate 110 located therein). The substrate 110 may be supported within the chamber body 102 by a plurality of rollers, where the first roller 114A and the second roller 114B are shown in Figure 1A and Figure 1B . The substrate 110 may be supported by more rollers (not shown).

[0017] The substrate 110 includes a first surface 110A and a second surface 110B opposite the first surface 110A, and the first surface 110A and the second surface 110B can be cleaned by the substrate cleaning apparatus 100. In some embodiments, both the first surface 110A and the second surface 110B can be cleaned and / or processed simultaneously by the substrate cleaning apparatus 100. In other embodiments, the first surface 110A and the second surface 110B can be cleaned and / or processed continuously by the substrate cleaning apparatus 100, and / or a single surface (e.g., the first surface 110A or the second surface 110B) can be cleaned and / or processed by the substrate cleaning apparatus 100. The drive mechanism 116 may be coupled to the second roller 114B or another support roller and may rotate the substrate 110 in the direction 118A and / or the direction 118B during the cleaning process.

[0018] The substrate cleaning apparatus 100 may include a first brush assembly 120A and a second brush assembly 120B. The first brush assembly 120A may include a first motor 122A and a first roller 124A coupled to the first motor 122A. The second brush assembly 120B may include a second motor 122B and a first roller 124B coupled to the second motor 122B. In some embodiments, a single motor (not shown) may replace the first motor 122A and the second motor 122B and may rotate both the first roller 124A and the first roller 124B.

[0019] The first belt 126A can extend between the first roller 124A and the second roller 132A. The second belt 126B can extend between the first roller 124B and the second roller 132B. The first belt 126A can include an outer surface 128A and an inner surface 128B. The second belt 126B can also include an outer surface 130A and an inner surface 130B. The inner surface 128B of the first belt 126A can contact the first roller 124A and the second roller 132A. The inner surface 130B of the second belt 126B can contact the first roller 124B and the second roller 132B. For example, the inner surface 128B can include surface features such as teeth and / or friction surfaces (not shown) that can contact the first roller 124A and / or the second roller 132A. Similarly, the inner surface 130B can include surface features such as teeth and / or friction surfaces (not shown) that contact the first roller 124B and / or the second roller 132B.

[0020] Rotation of the first motor 122A moves the first belt 126A via the first roller 124A, where the first belt 126A rotates around the first roller 124A and the second roller 132A. Similarly, rotation of the second motor 122B moves the second belt 126B via the first roller 124B, where the second belt 126B rotates around the first roller 124B and the second roller 132B. In some embodiments, the substrate cleaning device 100 can include additional rollers that can contact the first belt 126A and the second belt 126B. In some embodiments, the second roller 132A and / or the second roller 132B can be driven by one or more motors (in addition to or instead of the first roller 124A and / or the first roller 124B).

[0021] In Figure 1A and Figure 1B the depicted embodiment, the first motor 122A can rotate the first roller 124A in the direction D11, and the second motor 122B can rotate the first roller 124B in the direction D12. Accordingly, the first belt 126A moves around the second roller 132A in the direction D11, and the second belt 126B moves around the second roller 132B in the direction D12. Accordingly, both the first belt 126A and the second belt 126B move relative to the substrate 110 in the direction D13. In some embodiments, the first belt 126A and / or the second belt 126B can move relative to the substrate 110 in a direction opposite to the direction D13.

[0022] The outer surface 128A of the first strip 126A can be configured to contact the first surface 110A of the substrate 110. The outer surface 130A of the second strip 126B can be configured to contact the second surface 110B of the substrate 110. The outer surface 128A and the outer surface 130A can include the same surface features as conventional pads that can be cleaned or otherwise treated to clean the substrate surface. In some embodiments, the first strip 126A and / or the second strip 126B can be made of materials commonly used in polishing pads. In some embodiments, the first strip 126A and / or the second strip 126B can be made of or include polyurethane and / or polyvinyl alcohol (PVA). The first strip 126A and / or the second strip 126B can be made of other materials. The first strip 126A and the second strip 126B can be manufactured by three-dimensional printing and / or other manufacturing processes. In some embodiments, the outer surfaces 128A and 130A of the first strip 126A and the second strip 126B can include different materials across their width and / or their length. Such a configuration enables different portions of the first strip 126A and the second strip 126B to perform different processes on the substrate 110.

[0023] The first port 138A can be located near the first surface 110A of the substrate 110, and the second port 138B can be located near the second surface 110B. The first port 138A and the second port 138B can dispense and / or remove chemicals, such as cleaning chemicals or other fluids, to and / or from the first surface 110A and the second surface 110B of the substrate 110. For example, the first port 138A and the second port 138B can dispense a fluid (such as a gas used in substrate processing) onto the substrate 110. In some embodiments, the fluid can include hydrofluoric acid (HF), ozone, hydrochloric acid (HCl), and / or ammonium hydroxide (NH4OH). Other fluids can be used.

[0024] The first brush assembly 120A may include a first port 140A and a second port 140B near the outer surface 128A of the first belt 126A. The second brush assembly 120B may include a first port 142A and a second port 142B near the outer surface 130A of the second belt 126B. The first port 140A, the first port 142A, the second port 140B, and the second port 142B may dispense and / or remove chemicals, such as cleaning chemicals, to and / or from the outer surfaces 128A and 130A of the first belt 126A and the second belt 126B. In some embodiments, the cleaning chemical may include an alkaline solution such as NH4OH at a concentration of about 0.05% to 1.0%. Higher or lower concentrations of NH4OH or other alkaline solutions may be used. In some embodiments, the first brush assembly 120A and / or the second brush assembly 120B may include a regulator (not shown) that regulates the outer surfaces 128A and 130A of the first belt 126A and the second belt 126B. For example, the regulator may apply deionized water or another solution to the outer surfaces 128A and 130A of the first belt 126A and the second belt 126B.

[0025] The first brush assembly 120A may include a first pivot point 146A, and the second brush assembly 120B may include a second pivot point 146B. In Figure 1A and Figure 1B the depicted embodiment, the first pivot point 146A may be near the center of the first roller 124A, and the second pivot point 146B may be near the center of the first roller 124B. The first brush assembly 120A may pivot about the first pivot point 146A in direction D14, and the second brush assembly 120B may pivot about the second pivot point 146B in direction D15. For example, a motor and / or a servo mechanism (not shown) may pivot the first brush assembly 120A about the first pivot point 146A and pivot the second brush assembly 120B about the second pivot point 146B.

[0026] Figure 1A the substrate cleaning apparatus 100 depicted in is in a cleaning state. In the cleaning state, the first belt 126A and the second belt 126B are in contact with the first surface 110A and the second surface 110B of the substrate 110, respectively. For example, the first belt 126A and the second belt 126B may perform a process on the first surface 110A and the second surface 110B of the substrate 110. Before and / or after the first belt 126A and / or the second belt 126B perform a process on the substrate 110, the substrate cleaning apparatus 100 may be placed in a release state to enable the substrate 110 to be placed into and / or removed from the chamber body 102.

[0027] Figure 1BFIG. illustrates the substrate cleaning apparatus 100 in a release state. The first brush assembly 120A has rotated counterclockwise relative to the position of the first brush assembly 120A shown in Figure 1A The second brush assembly 120B has rotated clockwise relative to the position of the second brush assembly 120B shown in Figure 1B Accordingly, when the substrate cleaning apparatus 100 is in the release state, the first brush assembly 120A and the second brush assembly 120B are spaced apart from the substrate 110, which enables the substrate 110 to be removed from the chamber body 102. The release state of the substrate cleaning apparatus 100 further enables a substrate to be placed within the chamber body 102. In some embodiments, the outer surface 128A of the first belt 126A and the outer surface 130A of the second belt 126B may be spaced approximately 10 mm to 15 mm from the first surface 110A and the second surface 110B of the substrate 110, although other spacings may be used.

[0028] Prior to operation, the substrate cleaning apparatus 100 may be in the release state, as shown in Figure 1B A substrate 110 may be placed into the chamber body 102, as shown in Figure 1B The substrate cleaning apparatus 100 may then be transitioned from the release state to the cleaning state, as shown in Figure 1A Specifically, the first brush assembly 120A may pivot about the first pivot point 146A in a clockwise direction to a position where the outer surface 128A of the first belt 126A contacts the first surface 110A of the substrate 110. The second brush assembly 120B may pivot about the second pivot point 146B in a counterclockwise direction to a position where the outer surface 130A of the second belt 126B contacts the second surface 110B of the substrate 110. In some embodiments, the first brush assembly 120A and the second brush assembly 120B may pivot simultaneously. For example, the first brush assembly 120A and the second brush assembly 120B may be coupled to a single motor or other moving means that simultaneously pivots the first brush assembly 120A and the second brush assembly 120B.

[0029] When the substrate cleaning apparatus 100 is in the cleaning state, the drive mechanism 116 may rotate the substrate 110. Additionally, the first motor 122A may rotate the first belt 126A and the second motor 122B may rotate the second belt 126B to process the first surface 110A and the second surface 110B of the substrate 110. In some embodiments, the first motor 122A and / or the second motor 122B may monitor the load and / or torque applied to the first belt 126A and / or the second belt 126B to determine when the force applied to the substrate 110 and / or the processing of the substrate 110 is complete. In some embodiments, during cleaning and / or processing, the first belt 126A and / or the second belt 126B may apply a pressure between approximately 0.3 pounds per square inch (psi) and 8.0 psi to the substrate 110.

[0030] The use of the first belt 126A and the second belt 126B provides many advantages compared to conventional rollers and pads used for processing substrates. For example, the surface area of the belts can be larger than the surface area of conventional pads or rollers. The larger surface area of the belts enables the belts to have a longer service life than conventional pads and rollers, which can result in fewer belt replacements compared to pad or roller replacements in conventional substrate cleaning apparatuses. As Figure 1A and Figure 1B shown, the first belt 126A extends between the first roller 124A and the second roller 132A, and the second belt 126B extends between the first roller 124B and the second roller 132B. The extension lengths of the first belt 126A and the second belt 126B enable an adjustment process and / or chemicals to be applied to the first belt 126A and the second belt 126B. In some embodiments, the adjustment can include applying deionized water to a rough material (such as a diamond-coated disk), which is applied to the first belt 126A and the second belt 126B with a light pressure (e.g., 0.1 psi to 3 psi). Other adjustment processes and / or pressures can be used. Accordingly, there are more choices for the positions of the first ports 140A, the second ports 140B, the first ports 142A, and the second ports 142B that can adjust and / or apply chemicals to the first belt 126A and the second belt 126B. Additionally, the adjustment and / or application of chemicals can be applied to the straight and / or curved sections of the first belt 126A and the second belt 126B.

[0031] Now referring to Figure 2A and Figure 2B , embodiments of a substrate cleaning apparatus 100 with different belt configurations are illustrated. In the embodiments of Figure 2A and Figure 2B , the first brush assembly 120A includes a third roller 250A, and the second brush assembly 120B includes a third roller 250B. The third roller 250A provides a straight section 252A of the first belt 126A ( Figure 2B ), and the straight section 252A is capable of contacting the first surface 110A of the substrate 110. The straight section 252A provides a larger contact area between the first belt 126A and the first surface 110A compared to a conventional roller. The third roller 250B provides a similar straight section 252B of the second belt 126B ( Figure 2B ). In some embodiments, the straight section 252A and / or the straight section 252B can be between one-eighth and seven-eighths of the diameter of the substrate 110. In other embodiments, the straight section 252A and / or the straight section 252B can be between one-eighth and one-half of the diameter of the substrate 110. In still other embodiments, the straight section 252A and / or the straight section 252B can be between one-eighth and one-quarter of the diameter of the substrate 110. Other straight section lengths can be used.

[0032] AsFigure 2B As shown, an embodiment of the substrate cleaning apparatus 100 can rotate the first brush assembly 120A about the first pivot point 146A and rotate the second brush assembly 120B about the second pivot point 146B to transition the substrate cleaning apparatus 100 between a cleaning state and a release state.

[0033] Now referring to Figure 3 , a top view of an embodiment of the substrate cleaning apparatus 100 is illustrated. In Figure 3 's embodiment, the first belt 126A and the second belt 126B are divided into a plurality of zones. For example, the first belt 126A can include a plurality of zones 360, which are respectively referred to as zones 360A - 360G. The outer surface 128A of the first belt 126A can have different materials or different material configurations in each of the zones 360A - 360G. In a similar manner, the outer surface 130A of the second belt 126B can be divided into a plurality of zones 362, which are respectively referred to as zones 362A - 362G. The outer surface 128A and the outer surface 130A can have a smaller or larger number of zones 360 and zones 362 than shown in Figure 3 (e.g., 2, 3, 4, 5, 6, 8, 9, etc. zones 360 and 362).

[0034] The zones 360A - 360G of the outer surface 128A and the zones 362A - 362G of the outer surface 130A can have different materials or different material configurations. Thus, the zones 360A - 360G and the zones 362A - 362G enable different portions of the first belt 126A and the second belt 126B to perform different processes on the substrate 110. The material of each of the zones 360A - 360G can be or include PVA or a similar material. The materials of at least two of the zones 360A - 360G can have different hardnesses. Additionally, at least two of the zones 360A - 360G can have different surface finishes. In other embodiments, a separate pressure membrane can be located under at least one of the zones 360A - 360G and can independently pressurize the separate pressure membrane.

[0035] Now referring to Figure 4 , an embodiment of the substrate cleaning apparatus 100 is illustrated, in which the first motor 122A and the second motor 122B are located above the second rollers 132A and 132B. This configuration of the substrate cleaning apparatus 100 can provide different cleaning and / or processing of the substrate 110. For example, the chemicals applied to the substrate 110 can accumulate and / or distribute differently onto the substrate 110, which can improve performance.

[0036] Now referring to Figure 5, a substrate cleaning apparatus 100 is illustrated, including a magnetic coupling between a motor and a drum. The first drive assembly 550A and the second drive assembly 550B may be located outside the chamber body 102. The first drive assembly 550A may be substantially similar to or the same as the second drive assembly 550B. The following description of the components of the first drive assembly 550A may apply to the second drive assembly 550B. The first drive assembly 550A may include a motor 552, which may be coupled to a first magnetic coupler 554 and may rotate the first magnetic coupler 554. The first magnetic coupler 554 may be magnetically coupled to a second magnetic coupler 556, and the second magnetic coupler 556 may be coupled to the drum 532A. The first belt 126A may rotate around the drum 532A and the drum 524. The motor 552 may rotate the first magnetic coupler 554, which may cause the second magnetic coupler 556 to rotate. The second magnetic coupler 556 may be coupled to the drum 532A, and the drum 532A may rotate when the second magnetic coupler 556 rotates. Thus, the first belt 126A may rotate around the drum 532A and the drum 524.

[0037] The first drive assembly 550A may be movably coupled to a moving mechanism 560, and the moving mechanism 560 may move the first drive assembly 550A along an axis 562. For example, the movement of the first drive assembly 550A along the axis 562 may cause the first brush assembly 120A to switch between a cleaning state and a release state. In some embodiments, the moving mechanism 560 may include a linear slider 564, where the first drive assembly 550A may be coupled to the linear slider 564 and slide relative to the linear slider 564. An actuator 566 (such as a cylinder) may move the first drive assembly 550A relative to the linear slider 564. In some embodiments, other devices may move the first drive assembly 550A along the axis 562.

[0038] The bending mount 570 may be attached to the first drum 532A and may provide movement for the first drum 532A, such as movement along the axis 562. The movement of the first drum 532A may enable the first belt 126A to conform to the first surface 110A of the substrate 110.

[0039] The magnetic retainers can be located at positions opposite to the first drive assembly 550A and the second drive assembly 550B. For example, the first magnetic retainer 576A can be located at a position opposite to the first drive assembly 550A, and the second magnetic retainer 576B can be located at a position opposite to the second drive assembly 550B. In some embodiments, the first magnetic retainer 576A and / or the second magnetic retainer 576B can be located outside the chamber body 102. In other embodiments, the first magnetic retainer 576A and / or the second magnetic retainer 576B can be located within the chamber body 102. In some embodiments, the first magnetic retainer 576A and the second magnetic retainer 576B can be similar or identical to the first drive assembly 550A, except that the first magnetic retainer 576A and the second magnetic retainer 576B may not include a motor. The first magnetic retainer 576A can be magnetically coupled to the magnetic coupler 578A on the drum 532A, and the second magnetic retainer 576B can be magnetically coupled to the magnetic coupler 578B on the drum 532B. The first magnetic retainer 576A and / or the second magnetic retainer 576B can move the drum 532A and / or the drum 532B in the same or similar manner as the first drive assembly 550A. In some embodiments, the first drive assembly 550A and the first magnetic retainer 576A can be coupled together and move together. Similarly, the second drive assembly 550B and the second magnetic retainer 576B can be coupled together and move together. Such coupling can hold the first belt 126A and / or the second belt 126B in a fixed orientation relative to the substrate 110.

[0040] Via the magnetic coupling of the first drive assembly 550A, the second drive assembly 550B, the first magnetic retainer 576A, and / or the second magnetic retainer 576B, the first belt 126A and / or the second belt 126B can be enabled to move by a mechanism located outside the chamber body 102. For example, the first belt 126A and / or the second belt 126B can be rotated by the first drive assembly 550A and / or the second drive assembly 550B, which can be located outside the chamber body 102. Additionally, the first brush assembly 120A and / or the second brush assembly 120B can be switched between a cleaning state and a release state by the movement of the first drive assembly 550A, the second drive assembly 550B, the first magnetic retainer 576A, and / or the second magnetic retainer 576B along the axis 562.

[0041] In another aspect, Figure 6A method of cleaning a substrate (e.g., substrate 110) is illustrated in the flowchart 600. The method includes, at step 602, providing a first brush assembly (e.g., first brush assembly 120A), the first brush assembly including a first roller (e.g., first roller 124A), a second roller (e.g., second roller 132A), and a first belt (e.g., first belt 126A) extending between the first roller and the second roller. The method includes, at step 604, providing a second brush assembly (e.g., second brush assembly 120B), the second brush assembly including a first roller (e.g., first roller 124B), a second roller (e.g., second roller 132B), and a second belt (e.g., second belt 126B) extending between the first roller and the second roller. The method includes, at step 606, rotating the first belt. The method includes, at step 608, rotating the second belt. The method includes, at step 610, moving at least one of the first roller and the second roller of the first brush assembly to a first position where the first belt contacts a first surface (e.g., first surface 110A) of the substrate (e.g., substrate 110). The method includes, at step 612, moving at least one of the first roller and the second roller of the second brush assembly to a first position where the second belt contacts a second surface (e.g., second surface 110B) of the substrate.

[0042] The foregoing description has disclosed only exemplary embodiments. Modifications to the above-disclosed apparatus and methods that fall within the scope of the present disclosure will be apparent to those of ordinary skill in the art.

Claims

1. A substrate cleaning device, comprising: A chamber body configured to hold a substrate; A first brush assembly including a first roller, a second roller, a third roller, and a first belt extending between the first roller, the second roller, and the third roller, wherein the first belt includes a first straight section between the second roller and the third roller of the first brush assembly, and wherein the second roller and the third roller of the first brush assembly are movable between a first position and a second position, at the first position, the second roller and the third roller of the first brush assembly are adjacent to the substrate via the first belt such that the entire first straight section of the first belt contacts a first surface of the substrate disposed in the chamber body, and at the second position, the first belt is spaced apart from the first surface; And A second brush assembly including a first roller, a second roller, a third roller, and a second belt extending between the first roller, the second roller, and the third roller, wherein the second belt includes a first straight section between the second roller and the third roller of the second brush assembly, and wherein the second roller and the third roller of the second brush assembly are movable between a first position and a second position, at the first position, the second roller and the third roller of the second brush assembly are adjacent to the substrate via the second belt such that the entire first straight section of the second belt contacts a second surface of the substrate, and at the second position, the second belt is spaced apart from the second surface.

2. The substrate cleaning device according to claim 1, further comprising at least one port configured to distribute fluid onto at least one of the first belt and the second belt.

3. The substrate cleaning device according to claim 1, further comprising: A second straight section of the first belt between the first roller and the second roller; And At least one port configured to distribute fluid onto the second straight section of the first belt.

4. The substrate cleaning device according to claim 1, further comprising at least one port configured to distribute fluid onto at least one of the first surface of the substrate and the second surface of the substrate.

5. The substrate cleaning device according to claim 1, further comprising one or more magnetic couplers located outside the chamber body and magnetically coupled to at least one of the second roller of the first brush assembly and the second roller of the second brush assembly.

6. The substrate cleaning device according to claim 5, wherein the one or more magnetic couplers are configured to rotate at least one of the second roller of the first brush assembly and the second roller of the second brush assembly by magnetic coupling.

7. The substrate cleaning apparatus according to claim 5, wherein the one or more magnetic couplers are configured to move at least one of the second rollers of the first brush assembly and the second rollers of the second brush assembly between the first position and the second position by magnetic coupling.

8. The substrate cleaning apparatus according to claim 1, wherein the first belt and the second belt each include an outer surface, and wherein the outer surface of at least one of the first belt and the second belt includes a plurality of zones including different materials.

9. The substrate cleaning apparatus according to claim 8, wherein the different materials have different hardnesses.

10. The substrate cleaning apparatus according to claim 1, wherein the first belt includes a plurality of zones, and at least one of the plurality of zones includes a pressurizing film below the first belt.

11. A method of cleaning a substrate, comprising: providing a first brush assembly including a first roller, a second roller, a third roller, and a first belt extending between the first roller, the second roller, and the third roller, wherein the first belt includes a first linear section between the second roller and the third roller of the first brush assembly; providing a second brush assembly including a first roller, a second roller, a third roller, and a second belt extending between the first roller, the second roller, and the third roller, wherein the second belt includes a first linear section between the second roller and the third roller of the second brush assembly; rotating the first belt; rotating the second belt; moving the second roller and the third roller of the first brush assembly to a first position where the second roller and the third roller of the first brush assembly are adjacent to the substrate via the first belt such that the entire first linear section of the first belt contacts a first surface of the substrate; and moving the second roller and the third roller of the second brush assembly, at the first position, the second roller and the third roller of the second brush assembly are adjacent to the substrate via the second belt such that the entire first linear section of the second belt contacts a second surface of the substrate.

12. The method according to claim 11, further comprising: moving the second roller and the third roller of the first brush assembly to a second position where the first belt is spaced apart from the first surface of the substrate; and moving the second roller and the third roller of the second brush assembly to a second position where the second belt is spaced apart from the second surface of the substrate.

13. A substrate cleaning apparatus, comprising: a chamber body configured to hold a substrate; A first brushing assembly, the first brushing assembly comprising a first roller, a second roller, and a belt extending between the first roller and the second roller, at least one of the first roller and the second roller being movable between a first position and a second position, at the first position the belt contacting a first surface of a substrate disposed in the chamber body, and at the second position the belt being spaced apart from the first surface; A magnetic coupler, the magnetic coupler being located outside the chamber body and magnetically coupled to one of the first roller and the second roller, A drive assembly, the drive assembly being coupled to the magnetic coupler, wherein the drive assembly and the magnetic coupler are configured to move one of the first roller and the second roller between the first position and the second position; And A magnetic retainer, the magnetic retainer being magnetically coupled to the one of the first roller and the second roller, wherein the magnetic retainer and the drive assembly are located on opposite sides of the one of the first roller and the second roller, and wherein the magnetic retainer and the drive assembly are configured to be coupled together and move together such that the belt is held in a fixed orientation relative to the substrate.

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