Silicon Wafer Suspension Transmission Mechanism

Abstract

The present invention relates to a silicon wafer suspension transfer mechanism, which includes a suspension stage. A plurality of air holes are provided on one side surface of the suspension stage to blow out gas through the air holes and / or suck gas into the suspension stage, so that the silicon wafer is suspended on the side of the suspension stage where the air holes are provided; a limiting mechanism is provided on the suspension stage, and the limiting mechanism has a movable stopper, and the stopper can move to block the edge portion of the silicon wafer from the side of the silicon wafer away from the suspension stage. The silicon wafer suspension transfer mechanism provided by the present invention realizes the suspension of the silicon wafer on one side surface of the suspension stage by setting air holes. By setting a limiting mechanism, and the limiting mechanism has a movable stopper, the silicon wafer can be blocked from the side of the silicon wafer away from the suspension stage, so that the silicon wafer can always be suspended on the side of the suspension stage where the air holes are provided. In this way, the requirements for air-floating control can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of solar cell production equipment, and particularly to a silicon wafer suspension transfer mechanism. Background Art

[0002] Silicon wafers are the basic components of solar cells. When manufacturing solar cells, it is usually necessary to transfer silicon wafers from one position to another. Among them, silicon wafers are usually placed in a flower basket for the texturing process. After the texturing is completed, the silicon wafers need to be transferred to a carrier plate for the coating process. Therefore, after the texturing process of the silicon wafers is completed, they need to be transferred from the flower basket to the carrier plate. Usually, after the silicon wafers are taken out of the flower basket, they are placed on a belt and conveyed through the belt. Then, the silicon wafers are transferred to the carrier plate by other transfer mechanisms. However, when transferring silicon wafers by belt conveyance, since the silicon wafers are directly placed on the belt, the lower surface of the silicon wafers is likely to stick with belt imprints or stains on the belt, thus affecting the quality of the silicon wafers. For this reason, someone has proposed to use the air-floating method to carry the silicon wafers. However, the air-floating method is likely to blow the silicon wafers away or off, and has a high requirement for the control of air-floating. Summary of the Invention

[0003] In view of this, it is necessary to provide a silicon wafer suspension transfer mechanism that carries silicon wafers by the air-floating method and can reduce the control requirement for air-floating.

[0004] The present invention provides a silicon wafer suspension transfer mechanism, including a suspension stage. A plurality of air holes are provided on one side surface of the suspension stage to blow out gas outward through the air holes and / or suck gas into the suspension stage, so that the silicon wafer is suspended on the side of the suspension stage where the air holes are provided; a limiting mechanism is provided on the suspension stage, and the limiting mechanism has a movable stopper, and the stopper can move to block the edge portion of the silicon wafer from the side of the silicon wafer away from the suspension stage.

[0005] In one embodiment, a retaining edge portion is provided on the suspension platform, and the retaining edge portion encloses a receiving groove for receiving the silicon wafer. The limiting mechanism is provided on the retaining edge portion, and the stopper can rotate to block the edge portion of the silicon wafer.

[0006] In one embodiment, the stopper includes an eccentric wheel portion and a baffle portion. The eccentric wheel portion is connected with a rotating shaft, and the stopper is rotatably mounted on the retaining edge portion through the rotating shaft. The baffle portion is connected to one side of the eccentric wheel portion and faces the receiving groove, and the baffle portion is used to block the edge portion of the silicon wafer.

[0007] In one embodiment, the stopper has a limiting state for restricting the silicon wafer within the receiving groove and an open state for allowing the silicon wafer to move into or out of the receiving groove; when the stopper is in the limiting state, the projection of the end of the baffle portion away from the eccentric wheel portion on the floating stage is located within the receiving groove; when the stopper is in the open state, the projection of the end of the baffle portion away from the eccentric wheel portion on the floating stage is located outside the receiving groove.

[0008] In one embodiment, a placement groove is formed in the edge portion corresponding to the eccentric wheel portion, and the limiting mechanism further includes a push rod, a first magnet, and a second magnet; the push rod is movably disposed within the placement groove and can move in a direction approaching or away from the eccentric wheel portion; the first magnet is disposed at the end of the push rod facing the eccentric wheel portion, and the second magnet is disposed on the side of the eccentric wheel portion away from the baffle portion, and the first magnet and the second magnet attract each other. When the push rod moves in a direction approaching the push rod, the push rod pushes against the eccentric wheel portion to cause the stopper to rotate in a first direction; when the push rod moves in a direction away from the eccentric wheel portion, the gravitational force between the first magnet and the second magnet causes the stopper to rotate in a second direction; when the stopper rotates in the first direction, the stopper can rotate from the open state to the limiting state; when the stopper rotates in the second direction, the stopper can rotate from the limiting state to the open state.

[0009] In one embodiment, the limiting mechanism further includes a first elastic member, and the first elastic member connects the push rod and the edge portion to cause the push rod to have a tendency to move towards the eccentric wheel portion.

[0010] In one embodiment, a step is provided in the placement groove, the first elastic member is a compression spring, a convex ring is provided at the end of the push rod close to the eccentric wheel portion, the first elastic member is sleeved outside the push rod, and both ends of the first elastic member respectively abut against the step and the convex ring.

[0011] In one embodiment, the limiting mechanism further includes a traction member, and the traction member is connected to the push rod to drive the push rod to move in a direction away from the eccentric wheel portion through the traction member.

[0012] In one embodiment, the limiting mechanism further includes a limiting plate provided on the edge portion, and the limiting plate is located on the side of the eccentric wheel portion away from the receiving groove and away from the placement groove. When the stopper is in the limiting state, the eccentric wheel portion abuts against the limiting plate.

[0013] In one embodiment, the limiting mechanism further includes a second elastic member, and the second elastic member connects the baffle portion and the edge portion to enable the stopper to have a tendency to rotate in the first direction.

[0014] In one embodiment, the second elastic member is a tension spring.

[0015] In one embodiment, the suspension stage is provided with an independent first chamber and a second chamber, the air holes include a first hole and a second hole, the first hole communicates with the first chamber, and the second hole communicates with the second chamber.

[0016] In one embodiment, the suspension stage is further provided with a first inlet / outlet hole, and the first inlet / outlet hole communicates with the first chamber to introduce gas into the first chamber or suck out the gas in the first chamber through the first inlet / outlet hole; the suspension stage is further provided with a second inlet / outlet hole, and the second inlet / outlet hole communicates with the second chamber to introduce gas into the second chamber or suck out the gas in the second chamber through the second inlet / outlet hole.

[0017] The silicon wafer suspension transfer mechanism provided by the present invention realizes the suspension of the silicon wafer on one side surface of the suspension stage by setting air holes. By setting a limiting mechanism, and the limiting mechanism has a movable stopper, the silicon wafer can be blocked from the side away from the suspension stage, so that the silicon wafer can always be suspended on the side of the suspension stage provided with air holes. In this way, the requirements for air-floating control can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic structural diagram of a silicon wafer suspension transfer mechanism according to an embodiment of the present invention;

[0019] Figure 2 is a schematic structural diagram of an edge portion and a limiting mechanism according to an embodiment of the present invention;

[0020] Figure 3 is Figure 2 an exploded view of the shown structure;

[0021] Figure 4 is a partial structural cross-sectional view of a silicon wafer suspension transfer mechanism according to an embodiment of the present invention, and the stopper is in a limiting state;

[0022] Figure 5 is a partial structural cross-sectional view of a silicon wafer suspension transfer mechanism according to an embodiment of the present invention, and the stopper is in an open state;

[0023] Figure 6 is a partial structural cross-sectional view of a silicon wafer suspension transfer mechanism according to another embodiment of the present invention, and the stopper is in a limiting state;

[0024] Figure 7Partial structural cross-sectional view of the wafer suspension transfer mechanism according to another embodiment of the present invention, with the stopper in an open state;

[0025] Figure 8 Cross-sectional view of the suspension stage according to an embodiment of the present invention;

[0026] Figure 9 Schematic structural diagram of the wafer suspension transfer mechanism according to another embodiment of the present invention.

[0027] Reference numerals: 100, suspension stage; 101, air hole; 1011, first hole; 1012, second hole; 102, receiving groove; 103, first chamber; 104, second chamber; 105, first inlet / outlet hole; 106, second inlet / outlet hole; 110, edge portion; 111, placing groove; 1111, step; 121, first part; 122, second part; 200, limiting mechanism; 210, stopper; 211, eccentric wheel portion; 2111, shaft hole; 212, baffle portion; 213, rotating shaft; 220, ejector rod; 221, convex ring; 230, first elastic member; 240, traction member; 250, first magnet; 260, second magnet; 270, limiting plate; 280, second elastic member; 900, wafer. Detailed implementation manners

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0029] It should be noted that when an element is referred to as being "provided on" another element, it can be directly provided on the other element or there may also be an intermediate element. When an element is considered to be "disposed on" another element, it can be directly disposed on the other element or there may be an intermediate element at the same time. When an element is considered to be "fixed to" another element, it can be directly fixed to the other element or there may be an intermediate element at the same time.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0031] Please refer to Figure 1, the present invention provides a silicon wafer suspension transfer mechanism, which includes a suspension stage 100. A plurality of air holes 101 are provided on one side surface of the suspension stage 100 to blow out gas through the air holes 101 and / or suck the gas into the suspension stage 100, so that the silicon wafer 900 is suspended on the side of the suspension stage 100 where the air holes 101 are provided.

[0032] During use, the side surface of the suspension stage 100 where the air holes 101 are provided can be arranged upward or downward, and the present invention does not limit this. When the surface of the suspension stage 100 where the air holes 101 are provided is arranged upward, by controlling the air holes 101 to blow out air and making the blowing force equal to the gravity of the silicon wafer 900, the silicon wafer 900 can be suspended above the suspension stage 100. Or, some of the air holes 101 blow out air and some of the air holes 101 suck in air. By controlling the amount of blowing and sucking, the silicon wafer 900 can also be suspended above the suspension stage 100. When the surface of the suspension stage 100 where the air holes 101 are provided is arranged downward, by controlling the air holes 101 to suck gas and making the suction force equal to the gravity of the silicon wafer 900, the silicon wafer 900 can be suspended below the suspension stage 100; or, some of the air holes 101 blow out air and some of the air holes 101 suck in air. By controlling the amount of blowing and sucking, the silicon wafer 900 can also be suspended below the suspension stage 100. Thus, due to the arrangement of the air holes 101, only by controlling the amount of blowing and / or sucking can the suspension of the silicon wafer 900 be achieved. It is worth mentioning that in the following embodiments, when it is mentioned that the silicon wafer 900 is suspended above the suspension stage 100, the case where the surface of the suspension stage 100 where the air holes 101 are provided is arranged upward is taken as an example.

[0033] Please refer to Figure 1 and Figure 2 , a limiting mechanism 200 is provided on the suspension stage 100. The limiting mechanism 200 has a movable stopper 210, and the stopper 210 can move to block the edge portion of the silicon wafer 900 from the side of the silicon wafer 900 away from the suspension stage 100. In this way, the silicon wafer 900 can be prevented from being blown away (for the case where the surface of the suspension stage 100 where the air holes 101 are provided is arranged upward) or falling due to gravity (for the case where the surface of the suspension stage 100 where the air holes 101 are provided is arranged downward). That is to say, by providing the limiting mechanism 200, the silicon wafer 900 can be blocked, so that the silicon wafer 900 can always be suspended on the side of the suspension stage 100 where the air holes 101 are provided. Due to the arrangement of the limiting mechanism 200, even if the force of the gas blown out by the air holes 101 is large, the silicon wafer 900 will not be blown away or deflected. It can be seen that the requirement for air float control is reduced. Since the stopper 210 blocks the edge portion of the silicon wafer 900, the contact between the stopper 210 and the silicon wafer 900 is less, so the pollution to the silicon wafer 900 can be reduced and the surface of the silicon wafer 900 can be kept clean.

[0034] Further, as Figure 1 shown, a retaining edge portion 110 is provided on the floating stage 100. The retaining edge portion 110 encloses a receiving groove 102 for receiving the silicon wafer 900. In this way, when the floating stage 100 moves, it can drive the silicon wafer 900 to move together, thereby realizing the floating transfer of the silicon wafer 900. The limiting mechanism 200 is provided on the retaining edge portion 110, and the stopper 210 can be rotated to block the edge portion of the silicon wafer 900.

[0035] Please refer to Figure 3 and Figure 4 , the stopper 210 includes an eccentric wheel portion 211 and a baffle portion 212. The eccentric wheel portion 211 is connected with a rotating shaft 213. The stopper 210 is rotatably mounted on the retaining edge portion 110 through the rotating shaft 213. The baffle portion 212 is connected to one side of the eccentric wheel portion 211 and extends towards the receiving groove 102. The baffle portion 212 is used to block the edge portion of the silicon wafer 900.

[0036] In one embodiment, the eccentric wheel portion 211 is provided with a shaft hole 2111, and the rotating shaft 213 passes through the shaft hole 2111. Of course, in other embodiments, the rotating shafts 213 may protrude from both sides of the eccentric wheel portion 211. The present invention does not limit this.

[0037] Please refer to Figure 4 and Figure 5 , the stopper 210 has a limiting state for restricting the silicon wafer 900 within the receiving groove 102 and an open state for allowing the silicon wafer 900 to be moved into or out of the receiving groove 102. As Figure 4 shown, when the stopper 210 is in the limiting state, the projection of the end of the baffle portion 212 away from the eccentric wheel portion 211 on the floating stage 100 is located within the receiving groove 102, so that the edge portion of the silicon wafer 900 can be blocked by the baffle portion 212 to prevent the silicon wafer 900 from moving out of the receiving groove 102. As Figure 5 shown, when the stopper 210 is in the open state, the projection of the end of the retaining edge portion 110 away from the eccentric wheel portion 211 on the floating stage 100 is located outside the receiving groove 102, so that the retaining edge portion 110 does not block the silicon wafer 900, and the silicon wafer 900 can be moved into or out of the receiving groove 102.

[0038] Please refer to Figures 3 to 5, a storage groove 111 is provided on the edge portion 110 corresponding to the eccentric wheel portion 211. The limiting mechanism 200 further includes a push rod 220, a first magnet 250, and a second magnet 260. The push rod 220 is movably disposed in the storage groove 111, and the push rod 220 can move in a direction approaching or away from the eccentric wheel portion 211. The first magnet 250 is disposed at one end of the push rod 220 facing the eccentric wheel portion 211, and the second magnet 260 is disposed on a side of the eccentric wheel portion 211 away from the baffle portion 212. The first magnet 250 and the second magnet 260 attract each other. When the first magnet 250 moves in a direction approaching the push rod 220, the push rod 220 pushes against the eccentric wheel portion 211 to cause the stopper 210 to rotate in the first direction; when the push rod 220 moves in a direction away from the eccentric wheel portion 211, the gravitational force between the first magnet 250 and the second magnet 260 causes the stopper 210 to rotate in the second direction. When the stopper 210 rotates in the first direction, the stopper 210 can rotate from the open state to the limiting state. When the stopper 210 rotates in the second direction, the stopper 210 can rotate from the limiting state to the open state. As Figure 4 and Figure 5 shown in the embodiment, the first direction is the counterclockwise direction, and the second direction is the clockwise direction.

[0039] The limiting mechanism further includes a first elastic member 230. The first elastic member 230 connects the push rod 220 and the edge portion 110 to make the push rod 220 have a tendency to move towards the eccentric wheel portion 211.

[0040] The limiting mechanism 200 further includes a traction member 240. The traction member 240 is connected to the push rod 220 to drive the push rod 220 to move in a direction away from the eccentric wheel portion 211 through the traction member 240.

[0041] It can be understood that since the gravitational force between the first magnet 250 and the second magnet 260 can cause the stopper 210 to rotate in the second direction, when the stopper 210 is in the limiting state, there is a certain distance between the first magnet 250 and the second magnet 260, and as the stopper 210 rotates in the second direction, the distance between the first magnet 250 and the second magnet 260 gradually decreases. Thus, when the ejector rod 220 is pulled by the traction member 240 and moves in a direction away from the eccentric wheel portion 211, under the attraction of the first magnet 250 and the second magnet 260, the stopper 210 rotates in the second direction, so that the stopper 210 can rotate from the limiting state to the open state. At this time, the silicon wafer 900 can be placed into the receiving groove 102 or taken out from the receiving groove 102. Then, the traction member 240 is released, and under the elastic force of the first elastic member 230, the ejector rod 220 moves toward the eccentric wheel portion 211, thereby pushing against the eccentric wheel portion 211 and causing the stopper 210 to rotate in the first direction, so that the stopper 210 rotates to the limiting state. Since the stopper 210 is subject to the gravitational force, the thrust of the ejector rod 220, and the magnetic force between the first magnet 250 and the second magnet 260, by setting appropriate gravitational, thrust, and magnetic forces, the stopper 210 can be kept in the limiting state, so that the limiting mechanism 200 can intercept the silicon wafer 900, causing the silicon wafer 900 to float on one side of the floating stage 100.

[0042] In one embodiment, please refer to Figure 4 , a step 1111 is provided in the storage groove 111, the first elastic member 230 is a compression spring, a convex ring 221 is provided at one end of the ejector rod 220 close to the eccentric wheel portion 211, the first elastic member 230 is sleeved outside the ejector rod 220, and both ends of the first elastic member 230 respectively abut against the step 1111 and the convex ring 221. In this way, the structure is very simple, easy to process, and easy to assemble, and the first elastic member 230 can provide a force for the ejector rod 220 to move toward the eccentric wheel portion 211.

[0043] In one embodiment, the traction member 240 is a pull rope, which has a simple structure, is easy to connect to the ejector rod 220, and is easy to operate.

[0044] Please refer to Figures 2 to 5, in one embodiment, the limiting mechanism 200 further includes a limiting plate 270 provided on the edge portion 110. The limiting plate 270 is located on the side of the eccentric wheel portion 211 away from the receiving groove 102 and away from the placing groove 111. When the stopper 210 is in the limiting state, the eccentric wheel portion 211 abuts against the limiting plate 270 to limit the rotation of the stopper 210 in the first direction. Thus, by providing the limiting plate 270, the continuous rotation of the stopper 210 in the first direction can be restricted, so that the stopper 210 remains in the limiting state. If the elastic force of the first elastic member 230 is too large, it is easy for the stopper 210 to rotate beyond the limiting state when rotating in the first direction, thereby pressing the silicon wafer 900 and causing the silicon wafer 900 to move towards the bottom of the receiving groove 102. In this way, there is a possibility that the silicon wafer 900 contacts the bottom wall of the receiving groove 102. To avoid this situation, the limiting plate 270 is provided in this embodiment. In this way, the rotation range of the stopper 210 can be restricted, so that when the stopper 210 rotates to the limiting state, it will no longer continue to rotate in the first direction, thereby avoiding the situation that the stopper 210 presses the silicon wafer 900 and causes the silicon wafer 900 to contact the bottom wall of the receiving groove 102.

[0045] Please refer to Figure 6 and Figure 7 , in one embodiment, the limiting mechanism 200 further includes a second elastic member 280. The second elastic member 280 connects the baffle portion 212 and the edge portion 110 to make the stopper 210 have a tendency to rotate in the first direction. The provision of the second elastic member 280 provides a force for the stopper 210 to rotate from the open state to the limiting state. In this way, even if the elastic force provided by the first elastic member 230 is slightly insufficient, the second elastic member 280 can still provide sufficient elastic force, so that the stopper 210 rotates from the open state to the limiting state. Due to the provision of the limiting plate 270, the stopper 210 will not rotate over-position, so that the stopper 210 can be well maintained in the limiting state, which is beneficial to the limitation of the silicon wafer 900. The limiting mechanism 200 can block the silicon wafer 900 from the side of the silicon wafer 900 away from the suspension stage 100, so that the silicon wafer 900 can be stably suspended on the side of the suspension stage 100 provided with the air holes 101. Thus, when the silicon wafer suspension transmission mechanism is applied, the side of the suspension stage 100 provided with the air holes 101 can face upward, or the side of the suspension stage 100 provided with the air holes 101 can face upward, and the application is very flexible and the applicability is high.

[0046] In this embodiment, the second elastic member 280 is a tension spring, which has a simple structure and is easy to install.

[0047] Please refer to Figure 8, in order to better achieve the control of blowing air and / or pumping air through the air holes 101, an independent first chamber 103 and a second chamber 104 are provided inside the suspension stage 100. The air holes 101 include a first hole 1011 and a second hole 1012. The first hole 1011 communicates with the first chamber 103, and the second hole 1012 communicates with the second chamber 104. In this way, the first hole 1011 and the second hole 1012 can be independently controlled respectively. The first hole 1011 can either blow air outwards or suck air inwards. Similarly, the second hole 1012 can either blow air outwards or suck air inwards. In this way, the control is very convenient.

[0048] Furthermore, the suspension stage 100 is also provided with a first inlet / outlet hole 105. The first inlet / outlet hole 105 communicates with the first chamber 103 to introduce gas into the first chamber 103 or suck out the gas in the first chamber 103 through the first inlet / outlet hole 105. Since the first chamber 103 communicates with the first hole 1011, when blowing air or pumping air through the first inlet / outlet hole 105, blowing air outwards or sucking air inwards through the first hole 1011 can be achieved.

[0049] The suspension stage 100 is also provided with a second inlet / outlet hole 106. The second inlet / outlet hole 106 communicates with the second chamber 104 to introduce gas into the second chamber 104 or suck out the gas in the second chamber 104 through the second inlet / outlet hole 106. Since the second chamber 104 communicates with the second hole 1012, when blowing air or pumping air through the second inlet / outlet hole 106, blowing air outwards or sucking air inwards through the second hole 1012 can be achieved.

[0050] The suspension stage 100 can be set into various shapes according to needs. The arrangement of the first hole 1011 and the second hole 1012 can be reasonably set according to the shape of the suspension stage 100. In an embodiment, the suspension stage 100 is rectangular, and the first hole 1011 and the second hole 1012 are distributed in a matrix on the suspension stage 100. Please refer to Figure 9, in one embodiment, the suspension stage 100 includes a connected first part 121 and a second part 122. The first part 121 is rectangular, and the second part 122 is provided on both sides of the first part 121 in the length direction, and the second part 122 extends away from the first part 121 in the width direction of the first part 121. In this way, the suspension stage 100 has a regular shape, which is beneficial to carrying the silicon wafer 900. Further, the second parts 122 are symmetrically arranged on both sides of the first part 121. In this embodiment, two second parts 122 are provided on both sides of the first part 121. The first holes 1011 and the second holes 1012 can be respectively provided on the first part 121 and the second part 122. Specifically, a plurality of first holes 1011 are provided on the first part 121, and a plurality of second holes 1012 are provided on the second part 122. Correspondingly, the first part 121 is provided with a first cavity 103, and the second part 122 is provided with a second cavity 104. The second cavities 104 on each second part 122 are independently arranged. In this way, the suspension stage 100 has a simple structure and is easy to process. In this way, when blowing air out through the first holes 1011 and inhaling air in through the second holes 1012, or when blowing air out through the second holes 1012 and inhaling air in through the first holes 1011, the silicon wafer 900 can be well controlled to maintain balance.

[0051] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0052] Those of ordinary skill in the art of this technology should recognize that the above embodiments are only used to illustrate the present invention, rather than to limit the present invention. As long as it is within the scope of the spirit of the present invention, appropriate changes and variations made to the above embodiments fall within the scope of the present invention claimed.

Claims

1. A silicon wafer suspension transfer mechanism, characterized in that, it includes a suspension stage (100), a plurality of air holes (101) are provided on one side surface of the suspension stage (100), and the air holes (101) blow out gas and / or suck gas into the suspension stage (100) to make the silicon wafer (900) suspended on the side of the suspension stage (100) where the air holes (101) are provided; a first chamber (103) and a second chamber (104) independent of each other are provided in the suspension stage (100), the air holes (101) include a first hole (1011) and a second hole (1012), the first hole (1011) communicates with the first chamber (103), and the second hole (1012) communicates with the second chamber (104), a limiting mechanism (200) is provided on the suspension stage (100), the limiting mechanism (200) has a rotatable stopper (210), and the stopper (210) can rotate to block the edge portion of the silicon wafer (900) from the side of the silicon wafer (900) away from the suspension stage (100).

2. The silicon wafer suspension transfer mechanism according to claim 1, characterized in that, a retaining edge portion (110) is provided on the suspension stage (100), the retaining edge portion (110) encloses a receiving groove (102) for receiving the silicon wafer (900), and the limiting mechanism (200) is provided on the retaining edge portion (110).

3. The silicon wafer suspension transfer mechanism according to claim 2, characterized in that, the stopper (210) includes an eccentric wheel portion (211) and a baffle portion (212), the eccentric wheel portion (211) is connected with a rotating shaft (213), the stopper (210) is rotatably mounted on the retaining edge portion (110) through the rotating shaft (213), the baffle portion (212) is connected to one side of the eccentric wheel portion (211) and extends towards the receiving groove (102), and the baffle portion (212) is used to block the edge portion of the silicon wafer (900).

4. The silicon wafer suspension transfer mechanism according to claim 3, characterized in that, the stopper (210) has a limiting state of restricting the silicon wafer (900) within the receiving groove (102) and an open state allowing the silicon wafer (900) to move into or out of the receiving groove (102); when the stopper (210) is in the limiting state, the projection of the end of the baffle portion (212) away from the eccentric wheel portion (211) on the suspension stage (100) is located within the receiving groove (102); when the stopper (210) is in the open state, the projection of the end of the baffle portion (212) away from the eccentric wheel portion (211) on the suspension stage (100) is located outside the receiving groove (102).

5. The silicon wafer suspension transfer mechanism according to claim 4, characterized in that, A placement groove (111) is provided on the edge stop portion (110) corresponding to the eccentric wheel portion (211). The limiting mechanism (200) further includes a push rod (220), a first magnet (250), and a second magnet (260). The push rod (220) is movably disposed in the placement groove (111), and the push rod (220) can move in a direction approaching or departing from the eccentric wheel portion (211). The first magnet (250) is disposed at one end of the push rod (220) facing the eccentric wheel portion (211), and the second magnet (260) is disposed on a side of the eccentric wheel portion (211) away from the baffle portion (212). The first magnet (250) and the second magnet (260) attract each other. When the push rod (220) moves in a direction approaching the push rod (220), the push rod (220) pushes against the eccentric wheel portion (211) to cause the stopper (210) to rotate in a first direction; when the push rod (220) moves in a direction departing from the eccentric wheel portion (211), the gravitational force between the first magnet (250) and the second magnet (260) causes the stopper (210) to rotate in a second direction. When the stopper (210) rotates in the first direction, the stopper (210) can rotate from an open state to a limiting state; when the stopper (210) rotates in the second direction, the stopper (210) can rotate from the limiting state to the open state.

6. The silicon wafer suspension transfer mechanism according to claim 5, wherein, the limiting mechanism (200) further includes a first elastic member (230). The first elastic member (230) connects the push rod (220) and the edge stop portion (110) to cause the push rod (220) to have a tendency to move towards the eccentric wheel portion (211).

7. The silicon wafer suspension transfer mechanism according to claim 6, wherein, a step (1111) is provided in the placement groove (111). The first elastic member (230) is a compression spring. A convex ring (221) is provided at one end of the push rod (220) close to the eccentric wheel portion (211). The first elastic member (230) is sleeved outside the push rod (220), and two ends of the first elastic member (230) respectively abut against the step (1111) and the convex ring (221).

8. The silicon wafer suspension transfer mechanism according to claim 5, wherein, the limiting mechanism (200) further includes a traction member (240). The traction member (240) is connected to the push rod (220) to drive the push rod (220) to move in a direction departing from the eccentric wheel portion (211) through the traction member (240).

9. The silicon wafer suspension transfer mechanism according to claim 5, wherein, The limiting mechanism (200) further includes a limiting plate (270) disposed on the edge portion (110). The limiting plate (270) is located on a side of the eccentric wheel portion (211) away from the accommodation groove (102) and away from the storage groove (111). When the stopper (210) is in a limiting state, the eccentric wheel portion (211) abuts against the limiting plate (270).

10. The silicon wafer suspension transfer mechanism according to claim 9, wherein, the limiting mechanism (200) further includes a second elastic member (280). The second elastic member (280) connects the baffle portion (212) and the edge portion (110) to enable the stopper (210) to have a tendency to rotate in a first direction.

11. The silicon wafer suspension transfer mechanism according to claim 10, wherein, the second elastic member (280) is a tension spring.

12. The silicon wafer suspension transfer mechanism according to claim 1, wherein, the suspension stage (100) is further provided with a first inlet / outlet hole (105). The first inlet / outlet hole (105) communicates with the first chamber (103) to introduce gas into the first chamber (103) or suck out the gas in the first chamber (103) through the first inlet / outlet hole (105); the suspension stage (100) is further provided with a second inlet / outlet hole (106). The second inlet / outlet hole (106) communicates with the second chamber (104) to introduce gas into the second chamber (104) or suck out the gas in the second chamber (104) through the second inlet / outlet hole (106).

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