A multi-functional wire bonding machine with a clamp heating table and its process

Abstract

This invention relates to a multifunctional wire bonding machine with a clamping heating table, comprising an adjustable clamping device and a closed-loop feedback heating mechanism located on the adjustable clamping device; the adjustable clamping device includes a worktable, on which an adjustable baffle plate and a pressure claw located on the opposite side of the adjustable baffle plate are provided, the adjustable baffle plate being parallel and movable relative to the pressure claw, and a fastening screw is provided on the adjustable baffle plate; the closed-loop feedback heating mechanism includes a heating rod and a thermistor respectively disposed in the worktable.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging equipment technology, specifically to a multifunctional wire bonding machine with a fixture heating stage and its process. Background Technology

[0002] A wire bonding machine is a semiconductor packaging device that uses fine metal wires and heat, pressure, and ultrasonic energy to tightly bond metal wires to substrate pads, thereby achieving electrical interconnection between chips and substrates and information exchange between chips.

[0003] Semi-automatic ball / wedge bonding multi-functional wire bonding equipment is an important piece of equipment in the field of wire bonding machines. It is suitable for laboratory, pilot, or small-batch production lines. Only the wedge needs to be changed; a single bonding head can be used for ball / wedge or wedge / wedge bonding modes. To meet multiple needs with a single multi-functional wire bonding machine for different bonding modes and chip packaging structures, a compatible fixture heating stage is required to accommodate the equipment's versatility. Summary of the Invention

[0004] This invention addresses the shortcomings of existing technologies by providing a semi-automatic ball / wedge bonding multifunctional wire bonding equipment and process with a fixture heating system. It can be adapted to different chip substrates and wire bonding modes, reducing equipment costs and improving work efficiency. It also features a closed-loop temperature control system that can precisely control the worktable temperature, ensuring a constant working temperature of the chip substrate and guaranteeing the quality of wire bonding.

[0005] To achieve the above objectives, the technical solution of the present invention is as follows: a multifunctional wire bonding machine with a clamping heating table, comprising an adjustable clamping device and a closed-loop feedback heating mechanism located on the adjustable clamping device; the adjustable clamping device includes a worktable, on which an adjustable baffle plate and a pressure claw located on the opposite side of the adjustable baffle plate are provided, the adjustable baffle plate is parallel and movable relative to the pressure claw, and a fastening screw is provided on the adjustable baffle plate; the closed-loop feedback heating mechanism includes a heating rod and a thermistor respectively disposed in the worktable.

[0006] Furthermore, the adjustable clamping device also includes a base, on which a bracket is fixedly mounted. The top of the bracket is fixedly connected to the bottom of the worktable. A pressure rod is hinged to the bracket near the pressure claw. The upper end of the pressure rod extends to the pressure claw and is fixedly connected to it. The lower end of the pressure rod extends to the outside of the base. A return mechanism is provided between the lower end of the pressure rod and the base. The worktable is made of H copper alloy material with high thermal conductivity.

[0007] Furthermore, the upper end face of the bracket is screwed to the bottom surface of the workbench, the lower end face of the bracket is screwed to the upper end face of the base, and the pressure rod is connected to the side of the bracket by a pivot pin.

[0008] Furthermore, a spring is installed between the lower end of the pressure rod and the base.

[0009] Furthermore, a first deep hole and a second deep hole are provided on the side of the worktable away from the pressure claw. The heating rod is inserted into the first deep hole of the worktable, and a locking device is provided on the side of the heating rod. The thermistor is assembled in the second deep hole.

[0010] Furthermore, a thermally conductive silicone grease layer is provided on the outer surface of the heating rod, which fills the gap between the heating rod and the first deep hole. A channel for arranging a locking component is provided on the side of the first deep hole where the heating rod is assembled. The locking component is a set screw, and the top end of the set screw abuts against the outer wall of the thermally conductive silicone grease layer of the heating rod.

[0011] Furthermore, the thermistor is connected to the control unit of the wire bonding machine.

[0012] Furthermore, a protective mechanism is fitted around the outside of the workbench, the protective mechanism including a protective liner, with a gap between the protective liner and the workbench, and a heat-insulating liner on the outer wall of the protective liner; multiple through holes are opened on the support arm of the bracket.

[0013] Furthermore, a push rod is fixed to the outside of the pressure rod, and the free end of the push rod extends to the outside of the heat insulation liner.

[0014] A process for a multi-functional wire bonding machine with a fixture heating table includes the following steps:

[0015] 1) Take the substrate to be bonded, loosen the two fastening screws of the adjustable baffle plate, and gently press down the push rod to make the pressure claw rotate around the pivot. Loosen the pressure claw and place the substrate between the adjustable baffle plate and the pressure claw on the upper surface of the worktable, with one side of the substrate close to the pressure claw. Release the pressure rod, and the pressure claw will return to its initial position under the preload of the spring, pressing down on one side of the substrate. Move the adjustable baffle plate along the length of the adjustable baffle plate to the other side of the substrate until the substrate is pressed down and will not be displaced by applying appropriate force. Then tighten the two fastening screws.

[0016] 2) Determine whether the dimensions of the previous substrate are consistent with the dimensions of the next substrate;

[0017] If the dimensions of the previous substrate and the next substrate are the same: press the push rod lightly, the pressure claw pops up to remove the previous substrate, place the new next substrate along the pressing edge of the adjustable baffle plate, release and push it open, the pressure claw presses the other side of the substrate; bonding;

[0018] If the dimensions of the previous substrate are inconsistent with the dimensions of the next substrate: repeat step 1), and after fixing the substrate, proceed with the subsequent bonding process.

[0019] The technical advantages of this invention are as follows: This invention is a multifunctional wire bonding machine and process with a fixture heating stage. It is a multifunctional wire bonding machine and process compatible with a fixture heating stage system, which can be adapted to different chip substrates and wire bonding under different bonding modes, reducing equipment costs and improving work efficiency. At the same time, it has a closed-loop temperature control system, which can accurately control the stage temperature, ensure a constant working temperature of the chip substrate, and ensure the quality of wire bonding. Attached Figure Description

[0020] Figure 1 This is a front view structural diagram of the present invention;

[0021] Figure 2 for Figure 1 QQ cross-sectional view;

[0022] Figure 3 This is a top view of the adjustable clamping device of the present invention;

[0023] Figure 4 for Figure 3 AA section view;

[0024] Figure 5 This is a three-dimensional structural diagram of the bracket of the present invention;

[0025] In the figure, the components are: 1. Insulation liner; 2. Protective liner; 3. Top screw; 4. Thermistor; 5. Worktable; 6. Adjustable baffle plate; 7. Claw; 8. Push rod; 9. Pressure rod; 10. Spring; 11. Shaft pin; 12. Base; 13. Bracket; 14. Heating rod; 15. Fastening screw; and 6. Base plate A. Detailed Implementation

[0026] To more vividly illustrate the specific implementation steps of the present invention, the following further explanation will be provided in conjunction with the accompanying drawings:

[0027] Referring to the accompanying drawings, the present invention provides a multi-functional wire bonding machine with a fixture heating stage. This multi-functional wire bonding machine is compatible with a fixture heating stage system and can be adapted to different chip substrates and wire bonding in different bonding modes. It reduces equipment costs, improves work efficiency, and has a closed-loop temperature control system that can precisely control the stage temperature, ensure a constant working temperature of the chip substrate, and guarantee the quality of wire bonding.

[0028] Specifically, to make the technical problems, technical solutions and advantages of the present invention clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0029] A multifunctional wire bonding machine with a clamping heating table includes an adjustable clamping device and a closed-loop feedback heating mechanism located on the adjustable clamping device. The adjustable clamping device includes a worktable 5, on which an adjustable baffle 6 and a pressure claw 7 located on the opposite side of the adjustable baffle 6 are provided. The adjustable baffle 6 is parallel and movable relative to the pressure claw 7, and a fastening screw 15 is provided on the adjustable baffle 6. The closed-loop feedback heating mechanism includes a heating rod 14 and a thermistor 4 respectively provided in the worktable 5.

[0030] Furthermore, the adjustable clamp device also includes a base 12, on which a bracket 13 is fixedly mounted. The top of the bracket 13 is fixedly connected to the bottom of the worktable 5. A pressure rod 9 is hinged to the bracket 13 near the pressure claw 7. The upper end of the pressure rod 9 extends to the pressure claw 7 and is fixedly connected to the pressure claw 7. The lower end of the pressure rod 9 extends to the outside of the base 12. A return mechanism is provided between the lower end of the pressure rod 9 and the base 12.

[0031] Furthermore, the upper end face of the bracket 13 is screwed to the bottom surface of the workbench 5, the lower end face of the bracket 13 is screwed to the upper end face of the base 12, and the pressure rod 9 is connected to the side of the bracket 13 via a shaft pin 11.

[0032] Furthermore, a spring 10 is installed between the lower end of the pressure rod 9 and the base 12.

[0033] Furthermore, the worktable 5 has a first deep hole and a second deep hole on the side away from the pressure claw 7. The heating rod 14 is inserted into the first deep hole of the worktable 5, and a locking device is provided on the side of the heating rod 14. The thermistor 4 is assembled in the second deep hole.

[0034] Furthermore, a thermally conductive silicone grease layer is provided on the outer surface of the heating rod 14, which fills the gap between the heating rod 14 and the first deep hole. A channel for arranging a locking member is provided on the side of the first deep hole where the heating rod 14 is assembled. The locking member is a set screw 3, and the top end of the set screw 3 abuts against the outer wall of the thermally conductive silicone grease layer of the heating rod 14.

[0035] Furthermore, the thermistor 4 is connected to the control unit of the wire bonding machine.

[0036] Furthermore, a protective mechanism is fitted on the outer side of the workbench 5. The protective mechanism includes a protective liner 2, which has a gap with the workbench 5. A heat-insulating liner 1 is provided on the outer wall of the protective liner 2.

[0037] Furthermore, a push rod 8 is fixedly connected to the outside of the pressure rod 9, and the free end of the push rod 8 extends to the outside of the heat insulation liner 1.

[0038] Furthermore, multiple through holes are made on the support arm of the support 13.

[0039] The worktable 5 is made of H62 copper alloy with high thermal conductivity to ensure temperature uniformity. The surface of the worktable 5 is coated with a WC-CoCr coating using a thermal spraying process to improve its wear resistance. In the adjustable clamping device, the base 12 is moved by the operator to find the optimal working position. The selected material is POM engineering plastic, which combines the rigidity of metal with the low thermal conductivity and good insulation of plastic, while also possessing good thermal stability. The adjustable baffle 6 can slide linearly along the rotation direction of the pressure claw 7 on the worktable 5. The worktable 5 has a movement direction limit design to accommodate the installation of chip substrates of different sizes. In the closed-loop feedback heating mechanism, the heating rod 14 has a power of 200W, with a maximum heating temperature of 200℃. Using a PID algorithm combined with an adaptive algorithm, the temperature control accuracy can reach ±0.1℃. Furthermore, the control unit uses PID control to keep the worktable 5 in a constant temperature state, forming a closed-loop heating system. The protective liner 2 has a 15mm gap with the workbench 5, which is used for heat insulation by air.

[0040] As shown in the figure, the multifunctional wire bonding machine with a clamping heating table of the present invention is mainly divided into two modules: an adjustable clamping device and a closed-loop feedback heating mechanism. The adjustable clamping device mainly consists of an adjustable baffle plate 6, a worktable 5, pressure claws 7, pressure rods 9, push rods 8, a bracket 13, and a base 12. The upper end face of the bracket 13 is connected to the bottom surface of the worktable 5 with screws, and the lower end face of the bracket 13 is connected to the upper end face of the base 12 with screws. The pressure rod 9 is connected to the side of the bracket 13 through a shaft pin 11, providing the pressure rod 9 with rotational freedom around the shaft pin 11. A spring 10 is installed between the pressure rod 9 and the base 12 to provide preload force for the pressure rod 9, so that the pressure claws 7 connected to the pressure rod 9 can press the substrate material in a natural state. The push rod 8 is threadedly connected to the pressure rod 9, extending the rotational arm. The adjustable baffle plate 6 is placed on the worktable 5 and, together with the pressure claws 7, fixes the two sides of the substrate to achieve reliable fixation of the substrate material.

[0041] The closed-loop feedback heating mechanism maintains a stable operating temperature for the worktable 5 over a long period, ensuring bonding quality. As shown in the figure, the heating rod 14 is inserted into a deep hole on one side of the worktable 5. Thermal grease (layer) is applied to the outer surface of the heating rod 14 to ensure no air gap between it and the deep hole on one side of the worktable 5. It is secured with set screws 3 on the side. As shown in the figure, the thermistor 4 is installed in a deep hole on the other side of the worktable 5. The heating rod 14 and the thermistor 4 are positioned on both sides of the worktable 5. The heating rod 14 heats the entire worktable, while the thermistor 4 provides real-time temperature feedback to the control unit. The control unit maintains the worktable 5 at a constant temperature, forming a closed-loop heating system. A protective liner 2 surrounds the worktable 5 with a certain gap, using air for insulation. The outermost layer is an insulating liner 1 to prevent burns.

[0042] As shown in the figure, in order to achieve the effect of rapid cooling, the support arm of the bracket 13 has many through holes to increase air circulation, quickly remove heat, and minimize the amount of heat from the workbench 5 that is transferred to the base 12.

[0043] The specific workflow of this invention is as follows: First, take a substrate A to be bonded, loosen the two fastening screws 15 of the adjustable baffle plate 6, gently press down the push rod 8, causing the pressure claw 7 to rotate at an angle around the pivot 11, loosen the pressure claw 7, place the substrate A on the upper surface of the worktable 5 (between the adjustable baffle plate 6 and the pressure claw 7), bringing one side close to the pressure claw 7, loosen the pressure rod 9, and the pressure claw 7 returns to its initial position under the preload of the spring 10, pressing down on one side of the substrate A; move the adjustable baffle plate 6 along... Figure 3 The two slides shown are aligned with the other side of substrate A. Once substrate A is firmly pressed and will not shift due to appropriate force, tighten the two fastening screws 15. If the size of the next substrate is the same as the previous one, simply press the push rod 8 lightly to release the pressure claw 7 and remove the previous substrate. Place the new (next) substrate along the pressing edge of the adjustable baffle 6, release the push rod 8, and the pressure claw 7 will press the other side of the substrate. If the size of the next substrate is different, repeat the previous process: loosen the fastening screws 15, readjust the position of the adjustable baffle 6, fix substrate A, and manually move the base 12 to the appropriate position for subsequent bonding processes.

[0044] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A process of a multi-functional wire bonder with tape gripper heating stage, characterized by: The utility model provides a multifunctional wire bonding machine with clamp heating table, which comprises an adjustable clamp device and a closed-loop feedback heating mechanism on the adjustable clamp device. The utility model provides a process of the multifunctional wire bonding machine with clamp heating table, which comprises the following steps: 1) taking a substrate (A) to be bonded, loosening the two fastening screws (15) of the adjustable stop plate (6), pressing the push rod (8) downward, and rotating the pressure jaw (7) around the shaft pin (11) to loosen the pressure jaw (7), then placing the substrate (A) between the adjustable stop plate (6) and the pressure jaw (7) on the upper end surface of the workbench (5), with one side of the substrate (A) close to the pressure jaw (7), loosening the pressure rod (9), and returning the pressure jaw (7) to the initial position under the pre-tightening force of the spring (10) to press the other side of the substrate (A), then tightly pressing the other side of the substrate (A) along the length direction of the adjustable stop plate (6), and locking the two fastening screws (15) when the substrate (A) is pressed tightly without displacement caused by appropriate force; 2) judging whether the size of the previous substrate is consistent with the size of the next substrate; if the size of the previous substrate is consistent with the size of the next substrate, pressing the push rod (8) to lift the pressure jaw (7) and unload the previous substrate, tightly pressing the next substrate along the pressing side of the adjustable stop plate (6), loosening the push rod (8), and pressing the other side of the substrate with the pressure jaw (7); and bonding; if the size of the previous substrate is not consistent with the size of the next substrate, repeating step 1), fixing the substrate (A), and then performing the subsequent bonding process.

2. The process of claim 1, wherein the multi-functional wire bonder is a belt gripper heating table multi-functional wire bonder. The adjustable clamp device further comprises a base (12), the base (12) is fixedly provided with a support (13), the top of the support (13) is fixedly connected with the bottom of the workbench (5), the support (13) is hingedly connected with the pressure rod (9) near the side of the pressure jaw (7), the upper end of the pressure rod (9) extends to the pressure jaw (7) and is fixedly connected with the pressure jaw (7), the lower end of the pressure rod (9) extends to the outside of the base (12), and the return mechanism is arranged between the lower end of the pressure rod (9) and the base (12); and the workbench (5) is made of H62 copper alloy material with high thermal conductivity.

3. The process of claim 2, wherein the multi-functional wire bonder is further characterized by: The upper end surface of the support (13) is screw-connected with the bottom surface of the workbench (5), the lower end surface of the support (13) is screw-connected with the upper end surface of the base (12), and the pressure rod (9) is connected with the side edge of the support (13) through the shaft pin (11).

4. The process of claim 2, wherein the multi-functional wire bonder with a belt gripper heating stage is characterized by: The spring (10) is arranged between the lower end of the pressure rod (9) and the base (12).

5. The process of claim 1, wherein the multi-functional wire bonder with a belt gripper heating stage is characterized by: The workbench (5) is provided with a first deep hole and a second deep hole away from the pressure jaw (7) on one side, the heating rod (14) is inserted into the first deep hole of the workbench (5), the side surface of the heating rod (14) is provided with a locking piece, and the thermistor (4) is arranged in the second deep hole.

6. The process of claim 5, wherein the multi-functional wire bonder is further characterized by: The outer surface of the heating rod (14) is provided with a heat-conducting silicone grease layer, the heat-conducting silicone grease layer fills the gap between the heating rod (14) and the first deep hole, the first deep hole side of the assembled heating rod (14) is provided with a channel for arranging a locking piece, the locking piece is a jackscrew (3), and the top end of the jackscrew (3) abuts against the outer wall of the heat-conducting silicone grease layer of the heating rod (14).

7. The process of claim 5, wherein the multi-functional wire bonder is further characterized by: The thermistor (4) is connected with a control unit of the wire bonding machine.

8. The process of claim 1-7, wherein the process is carried out by the multi-functional wire bonder with a belt gripper heating table. The outer side of the workbench (5) is sleeved with a protection mechanism, the protection mechanism comprises a protection lining plate (2), a gap is formed between the protection lining plate (2) and the workbench (5), and a heat insulation lining plate (1) is arranged on the outer wall of the protection lining plate (2); a plurality of through holes are formed in the support arms of the support (13).

9. The process of claim 8, wherein the multi-functional wire bonder is further characterized by: The outer side of the pressing rod (9) is fixedly connected with a push rod (8), and the free end of the push rod (8) extends to the outer side of the heat insulation lining plate (1). The outer side of the pressing rod (9) is fixedly connected with a push rod (8), and the free end of the push rod (8) extends to the outer side of the heat insulation lining plate (1).

Images