Die embedded in substrate with stress buffer

Abstract

The present disclosure relates to a package, such as a wafer level chip scale package (WLCSP) or a package containing a semiconductor die, wherein the die is embedded in a substrate surrounded by an elastomer. The package includes a non-conductive layer on the surface of the substrate and the elastomer, as well as a conductive layer and conductive vias extending through these layers to form electrical connections in the package. The package includes surfaces of conductive material, which may be referred to as contacts. These surfaces of conductive material are exposed on both sides of the package and allow the package to be mounted in an electronic device and enable other electronic components to be coupled to the package, or allow the package to be included in a stacked configuration of semiconductor dies or packages.

Description

Technical Field

[0001] The present disclosure relates to a die embedded within a substrate and a method of manufacturing the same. Background Art

[0002] Typically, a semiconductor device package, such as a chip scale package, wafer level chip scale package (WLCSP), or other conventional semiconductor package, has a die coupled to a surface of a substrate. The die can be an integrated circuit, a processor, an application specific integrated circuit, or a sensor configured to detect any quantity or quality of the external environment outside or inside the semiconductor package.

[0003] Stacking die on top of a substrate such as a printed circuit board results in a relatively bulky package.As demand for smaller packages, packages with more complex functionality, and cost-effective manufacturing increases, manufacturers have to balance external stresses that can cause device failure. Summary of the Invention

[0004] Embodiments of the present disclosure overcome significant challenges associated with semiconductor packaging, such as increasing the robustness of semiconductor packages by reducing the likelihood of die failure within the semiconductor package. One significant challenge is improving the robustness of semiconductor packages against being dropped. For example, when a semiconductor package is dropped, electrical components within the semiconductor package, such as the die or electrical connections, may crack or break, causing the semiconductor package to fail.

[0005] The present disclosure relates to a package that includes a rigid substrate having a die positioned within an opening in the substrate. A flexible dielectric material surrounds the die within the opening and holds the die in place within the substrate opening. The dielectric material provides cushioning or other resilience to minimize damage in the event of a drop or other action that would otherwise damage the die or the electrical connection between the die and the substrate.

[0006] In one embodiment of the present disclosure, a semiconductor package includes a die and an elastomer within an opening in a substrate. A first non-conductive layer is located on a first surface of the substrate and the elastomer, and a second non-conductive layer is located on a second surface of the substrate and the elastomer. A third non-conductive layer is located on the first non-conductive layer, and a fourth non-conductive layer is located on the second non-conductive layer. Electrical connections extend through the elastomer, the substrate, and the first and second non-conductive layers as conductive layers and vias to contact pads. Openings are formed in the third and fourth non-conductive layers to expose the conductive layer, which serves as the contact pads of the package. An elastomer or flexible dielectric surrounds the die within the opening in the substrate and acts as a stress buffer, protecting the die when the semiconductor package is dropped or exposed to external stresses and forces. The elastomer protects the die because the elastic material of the elastomer can compress, flex, and expand in response to external stresses and forces applied to the semiconductor package. Similarly, the elastomer protects the die from failure due to thermal expansion because the elastomer can bend and flex when the semiconductor package and its layers expand and compress due to changes in temperature. Therefore, it is beneficial for the elastomer to surround the die within the opening in the substrate.

[0007] Another significant challenge is reducing the thickness of semiconductor packages while maintaining package functionality. For example, as electronic devices become thinner and more segmented (e.g., foldable displays or devices, bendable displays or devices, etc.), the space available within the electronic device to provide interactive features (e.g., touch screens, tactile feedback, etc.) for the semiconductor die can be significantly reduced. Making the semiconductor package thin and small enough allows it to be incorporated into the small available space within the electronic device to provide the functionality and information for the electronic device to function optimally.

[0008] In the present disclosure, a die within an opening in a substrate and surrounded by an elastomer within the substrate reduces the overall thickness of the semiconductor package. The thickness of the elastomer and the die is substantially the same as the thickness of the substrate. As a result, the semiconductor package can be thinner than other conventional semiconductor packages, which have a die coupled to a surface of the substrate and encased in a molding compound or covered by a cap, rather than being embedded within the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] To better understand the embodiments, reference will now be made to the accompanying drawings by way of example. In the accompanying drawings, unless the context otherwise indicates, the same reference numerals denote similar elements or actions. The sizes and relative positions of the elements in the accompanying drawings are not necessarily drawn to scale. For example, some of these elements may be enlarged and positioned to improve the readability of the drawings.

[0010] Figure 1A It is along Figure 1B A cross-sectional view of one embodiment of a package taken along line 1A-1A in FIG.

[0011] Figure 1B Yes Figure 1A A top view of an embodiment of a package shown in FIG;

[0012] Figure 2 It is taken along route 1A-1A Figure 1B A cross-sectional view of an alternative embodiment of a package;

[0013] Figure 3 It is taken along route 1A-1A Figure 1B A cross-sectional view of an alternative embodiment of a package;

[0014] Figure 4 It is taken along route 1A-1A Figure 1B A cross-sectional view of an alternative embodiment of a package of

[0015] Figures 5A to 5J Is the manufacturing package (such as Figure 1A A cross-sectional view of a method of an embodiment of the package shown in FIG. DETAILED DESCRIPTION

[0016] In the following description, certain specific details are set forth in order to provide a thorough understanding of the various embodiments of the present disclosure. However, those skilled in the art will appreciate that the present disclosure can be practiced without these specific details. In other instances, known structures associated with electronic components and semiconductor manufacturing techniques are not described in detail to avoid unnecessarily obscuring the description of the embodiments of the present disclosure.

[0017] Unless the context requires otherwise, in the specification and the following claims, the word "comprise" and variations such as "comprises" and "comprising" are to be interpreted in an open, inclusive sense, that is, as meaning "including, but not limited to."

[0018] The use of ordinal numbers such as first, second, and third does not necessarily imply an ordering sense of sequence but may simply distinguish between multiple instances of an action or structure.

[0019] Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, various appearances of the phrases "in one embodiment" or "in an embodiment" throughout this specification are not necessarily referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0020] The terms "left," "right," "top," and "bottom" are used only for discussion purposes based on the orientation of components in the following discussion of the drawings of the present disclosure. These terms are not limited to possible positions as explicitly disclosed, implicitly disclosed, or inherently disclosed in the present disclosure.

[0021] The term “substantially” is used to clarify that there may be slight deviations when packages are manufactured in the real world, as nothing can be made exactly equal or identical. In other words, substantially means that there may be some slight variations in actual practice, however, they are within acceptable tolerances.

[0022] As used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the content clearly dictates otherwise.

[0023] The present disclosure relates to various embodiments of packages, each of which includes a die embedded in a substrate. The die embedded in the substrate is located in an opening in the substrate. An elastomer is also located in the opening and surrounds the die. The elastomer acts as a stress buffer to protect the die from external stresses, such as those caused by dropping, thermal expansion, bending, flexing, and any other external stress to which the package may be exposed. In some embodiments, the substrate may have multiple openings and multiple dies within the multiple openings, the multiple dies being surrounded by the elastomer. In other embodiments, multiple dies may be present in one opening and surrounded by the elastomer.

[0024] Although various embodiments are shown and described with respect to packages containing a die, it will be readily understood that the embodiments of the present disclosure are not limited thereto. In various embodiments, the structures, devices, methods, etc. described herein may be embodied or otherwise utilized in any suitable type or form of package and may be manufactured using any suitable type or form of packaging technology as desired.

[0025] Figure 1A 1 is a cross-sectional view of an embodiment of a package 100. The package 100 includes a substrate 102. The substrate 102 includes a first surface 104 and a second surface 106 opposite the first surface 104. The substrate 102 includes an opening 108 that has been filled with a die 110 and an elastomer 112. The opening 108 extends through the substrate 102 and extends from the first surface 104 of the substrate 102 to the second surface 106 of the substrate 102. The opening 108 may be a cavity, a hole, a recess, a trench, or some other opening extending through or in the substrate 102.

[0026] The elastomer 112 surrounds the die 110 and extends between the first surface 104 and the second surface 106 of the substrate 102. The elastomer 112 has a first surface 114 that is substantially flush with the first surface 104 of the substrate 102 and a second surface 116 that is substantially flush with the second surface 106 of the substrate 102. The die 110 is surrounded by the elastomer 112, and the sidewalls 117 of the die 110 are separated or spaced apart from the sidewalls 118 of the opening 108 in the substrate by the elastomer 112 by a first dimension d1, which can be any dimension suitable for manufacturing parameters. The elastomer 112 can be a silicone material, a die attach film (DAF) material, an elastic non-conductive material, a flexible dielectric, rubber, a polymer with elastic properties, or some other suitable elastic material or combination of elastic materials. In some embodiments, the elastomer 112 can be a multilayer elastomer made of a combination of elastic materials.

[0027] A die 110 is embedded within an elastomer 112 in an opening 108 of a substrate 102. The die 110 includes an active surface 120 having at least one contact 122 and a passivation surface 124 opposite the active surface 120. The at least one contact 122 couples the die 110 to an external electrical component, which may be another die, a sensor, or some other electronic component or combination of electronic components. The active surface 120 is closer to the first surface 104 of the substrate 102 than to the second surface 106 of the substrate 102, and the passivation surface 124 is closer to the second surface 106 of the substrate 102 than to the first surface 104 of the substrate 102. The elastomer 112 is on both the active surface 120 and the passivation surface 124 of the die 110. In one embodiment, the die 110 is aligned with the center of the opening 108. Die 110 may be an application specific integrated circuit (ASIC), a processor, a sound sensor, a temperature sensor, a micro-electromechanical system (MEMS) die, or some other combination of semiconductor die or sensors.

[0028] A first nonconductive layer 126 is disposed on the first surfaces 104, 114 of the substrate 102 and the elastomer 112, respectively. Sidewalls 128 of the first nonconductive layer 126 are substantially flush with sidewalls 130 of the substrate 102. The first nonconductive layer 126 may be a dielectric layer, an insulating layer, or some other suitable nonconductive layer or combination of nonconductive layers.

[0029] A second non-conductive layer 132 is disposed on the second surfaces 106, 116 of the substrate 102 and the elastomer 112. The sidewalls 134 of the second non-conductive layer 132 are substantially flush with the sidewalls 128, 130 of the first non-conductive layer 126 and the substrate 102. The second non-conductive layer 132 can be a dielectric layer, an insulating layer, or some other suitable non-conductive layer or combination of non-conductive layers. In one embodiment, the sidewalls of both the first and second non-conductive layers are flush with the sidewalls of the substrate.

[0030] The second non-conductive layer 132 is separated or spaced apart from the die by the elastomer 112 by a dimension d2, which can be any suitable dimension. Similarly, the first non-conductive layer can be separated or spaced apart from the die 110 by the elastomer 112 by a dimension d2 or a suitable different dimension. In this embodiment, the dimension d2 is smaller than the dimension d1.

[0031] A third nonconductive layer 136 is disposed on the first nonconductive layer 126. Sidewalls 138 of the third nonconductive layer 136 are substantially flush with the sidewalls 128, 130, 134 of the substrate 102, the first nonconductive layer 126, and the second nonconductive layer 132. The third nonconductive layer 136 can be a dielectric layer, an insulating layer, a solder mask layer, or some other suitable nonconductive layer or combination of nonconductive layers. The third nonconductive layer 136 is thinner than the first nonconductive layer 126.

[0032] A fourth nonconductive layer 140 is disposed on the second nonconductive layer 132. Sidewalls 142 of the fourth nonconductive layer 140 are substantially flush with the sidewalls 128, 130, 134, 138 of the substrate 102, the first nonconductive layer 126, the second nonconductive layer 132, and the third nonconductive layer 136. The fourth nonconductive layer 140 is disposed on the opposite side of the package 100 from the third nonconductive layer 136. The fourth nonconductive layer 140 may be a dielectric layer, an insulating layer, a solder mask layer, or some other suitable nonconductive layer or combination of nonconductive layers. The fourth nonconductive layer 140 is thinner than the second nonconductive layer 132. The third nonconductive layer 136 and the fourth nonconductive layer 140 may be passivation layers that expose electrical contacts or contact pads. Multiple electrical connections, layers, or vias may be interspersed between the nonconductive layers 126, 132, 136, 140, which may be similar to redistribution layers.

[0033] At least one opening 144 is formed in third non-conductive layer 136. Opening 144 exposes surface 146 of conductive layer 148. Conductive layer 148 is formed in first non-conductive layer 126. Surface 146 may be referred to as a contact. Conductive layer 148 is coupled to via 150, which extends from conductive layer 148 to contact 122 of die 110. Via 150 extends through first non-conductive layer 126 and elastomer 112 to reach contact 122. Via 150 electrically couples contact 122 to conductive layer 148. Multiple additional conductive layers, vias, and dielectric layers may be present to form all electrical connections suitable for manufacturing parameters.

[0034] Conductive layer 148 is coupled to via 152 that extends from conductive layer 148 to conductive layer 154 in first surface 104 of substrate 102. Figure 1A The conductive layer 154 on the right hand side includes an end portion 156 that contacts the elastomer 112. The end portion 156 is part of one of the sidewalls 118 of the substrate 102. Figure 1A The conductive layer 154 on the right hand side is different, Figure 1A The conductive layer 158 on the left-hand side of is on the substrate 102 and has an end 160 that is spaced apart and separated from the elastomer 112 by a portion of the substrate 102 .

[0035] Conductive layer 154 is coupled to vias 162 that extend through substrate 102 to conductive layer 164 in second surface 106 of substrate 102. The vias electrically couple conductive layer 154 in first surface 104 of substrate 102 to conductive layer 164 on second surface 106 of substrate 102. Figure 1A The via 162 on the right hand side has a first width W1. Figure 1A The vias 162 on the right-hand side are different. Figure 1A The via 166 on the left-hand side has a second width W2 that is greater than the first width W1 of the via 162 .

[0036] Conductive layer 164 is coupled to via 168, which extends through second non-conductive layer 132, and via 168 is coupled to conductive layer 170. Conductive layer 170 is in second non-conductive layer 132 and aligned with opening 172 in fourth non-conductive layer 140, which exposes surface 174 of conductive layer 170. Surface 174 may be referred to as a contact. Surface 174 of conductive layer 170 is exposed through opening 172 on the side of package 100 opposite the side of the package, on which surface 146 of conductive layer 148 is exposed through opening 144 in third non-conductive layer 136.

[0037] In the drawings, for ease of illustration, the conductive layers are illustrated with a single hatch pattern. It should be understood that there will be different layers where the conductive layers are coupled together when the conductive material is deposited at different times during the manufacturing process.

[0038] Conductive layers 148, 154, 158, 164, 170 and vias 150, 152, 162, 166, 168 form electrical connections that extend from one side of package 100 to the other side of package 100. Conductive layers 148, 154, 158, 164, 170 and vias 150, 152, 162, 166, 168 allow electrical signals to be transmitted to or from contacts 146, 174 and at least one contact 122 of die 110. The conductive material of conductive layers 148, 154, 158, 164, 170 and vias 150, 152, 162, 166, 168 may be copper, gold, silver, an alloy, or some other suitable conductive material or combination of conductive materials.

[0039] In some embodiments of package 100, package 100 can be utilized similarly to a printed circuit board (PCB) within which die 110 is embedded. When package 100 is used similarly to a PCB, substrate 102 is the core of the PCB and can be referred to as a substrate core, and non-conductive layers 126 and 132 on substrate 102 can be referred to as prepreg layers. Substrate 102 can be a woven fiberglass material that is reinforced and bonded together with a resin. The woven fiberglass material can include a first plurality of fiberglass yarns oriented in a first direction, a second plurality of fiberglass yarns oriented in a second direction, or any suitable combination of any number of fiberglass yarns twisted together. Non-conductive layers 126 and 132 can be laminated prepreg layers. In alternative embodiments, the PCB, substrate 102, and non-conductive layers 126 and 132 can be made of multiple layers of woven fiberglass material. The woven fiberglass material of substrate 102 and non-conductive layers 126 and 132 can have multiple fiberglass yarns oriented in a similar manner, oriented in different manners, or oriented in any suitable manner.

[0040] For purposes of this discussion, a woven fiberglass material includes a first plurality of fiberglass yarns oriented in a first direction and a second plurality of fiberglass yarns oriented in a second direction, the first plurality of fiberglass yarns and the second plurality of fiberglass yarns being intertwined by crossing over, under, or side by side with each other. The first direction is transverse to the second direction. For example, the first direction can be perpendicular to the second direction, the first direction can be at a 30° angle transverse to the second direction, or the first direction can be at any suitable angle transverse to the second direction. The first plurality of fiberglass yarns and the second plurality of fiberglass yarns can have a zigzag pattern, such that the first plurality of fiberglass yarns and the second plurality of fiberglass yarns pass under, over, or side by side with each other.

[0041] The resin that binds the woven fiberglass material together can be a dielectric material. For example, the dielectric material can be an epoxy material, a plastic material, a molding compound material, a resin material, or some other suitable non-conductive material or combination of non-conductive materials. The resin fills the spaces between the wound plurality of fiberglass yarns, further reinforcing the plurality of fiberglass yarns and binding them together.

[0042] Conductive layers 148, 154, 158, 164, 170 and vias 150, 152, 162, 166, 168 that form electrical connections in the PCB are located below, above, and alongside the plurality of glass fiber yarns in the substrate 102 and non-conductive layers 126, 132. For example, the conductive layers 148, 154, 158, 164, 170 and vias 150, 152, 162, 166, 168 may pass through spaces and openings between the plurality of glass fiber yarns that are wound within the substrate 102 and non-conductive layers 126, 132.

[0043] Figure 1B 1 is a top view of an embodiment of package 100. Opening 144 may be one of a plurality of openings 144, and contact 146 may be one of a plurality of contacts 146. Figure 1B As can be seen in FIG, opening 144 exposes contact 146 of package 100. Although Figure 1A to Figure 1B The opening 144 is shown as a square in the embodiment of package 100 , but in some embodiments, the opening 144 may be rectangular, circular, triangular, or any other shape or combination of shapes as desired.

[0044] Although not shown, the package 100 and Figure 1BThe opening 172 on the opposite side of the package 100 shown in FIG1 may be one of a plurality of openings 172, and the contact 174 on the opposite side of the package 100 exposed through the opening 172 may be one of a plurality of contacts 174 on the opposite side of the package 100. The plurality of openings 172 in the opposite sides of the package 100 exposes a plurality of contacts 174 on the opposite side of the package 100. The openings 172 may be square, rectangular, circular, triangular, or any other shape or combination of shapes as desired.

[0045] exist Figure 1B In the package 100 of FIG. 1 , the plurality of contacts 146, 174 on both sides of the package 100 surround the elastomer 112 and the die 110. In some embodiments, these plurality of contacts 146, 174 on both sides of the package 100 may not surround the die 110 and the elastomer 112. Instead, the plurality of contacts 146, 174 may be along only two sides of the package 100, along only one side of the package 100, or along any number of sides of the package 100 as appropriate.

[0046] exist Figure 1B In the package 100 of FIG. 1 , the plurality of contacts 146, 174 on both sides of the package 100 do not overlap and are not aligned with the die 110 and the elastomer 112. In some embodiments, the plurality of contacts 146, 174 may overlap or overlap the die 110 and the elastomer 112. In some embodiments, the plurality of contacts 146, 174 may be aligned with the die 110 and the elastomer 112. In some embodiments, the plurality of contacts 146, 174 on both sides of the package 100 may have the same orientation or different orientations from one another and may have different sizes from one another.

[0047] exist Figure 1B In the illustrated package 100 , the plurality of contacts 146 , 174 are square shaped. In some embodiments, the plurality of contacts 146 , 174 on both sides of the package 100 may be square, circular, rectangular, or any other suitable shape or combination of shapes.

[0048] The elastomer 112 is indicated by the outer dashed line of the boundary formed around the die 110. The elastomer 112 separates the sidewalls 117 of the die 110 from the sidewalls 118 of the opening 108. The elastomer 112 separates the sidewalls 117 of the die 110 from the sidewalls 118 of the opening 108 by a dimension d1 along all sides of the die 110. In some embodiments, the dimension d1 separating the die 110 from the sidewalls 118 of the opening 108 can be different dimensions along different sidewalls 117 of the die 110. The elastomer 112 formed around the boundary around the die 110 acts as a stress buffer to protect the die from external stresses, which will be discussed in more detail later in this disclosure.

[0049] The die 110 is located at the center of the opening 108. In some other embodiments, the die 110 may not be located at the center of the opening 108. For example, the die 110 may be separated, spaced apart, or offset from the center of the opening 108.

[0050] Figure 2 、 Figure 3 and Figure 4 1 and 2 are cross-sectional views of alternative embodiments of packages 200, 300, 400. These cross-sectional views of packages 200, 300, 400 are taken along the same lines as those for package 100. Figure 1B Packages 200, 300, and 400 have the same Figure 1A The embodiment of the package 100 shown in FIG. Figure 2 、 Figure 3 and Figure 4 are denoted by the same reference numerals.

[0051] Figure 2 Package 200 is shown including a first elastomer 202 on the second non-conductive layer 132 and on the passivation surface 124 of the die 110. The first elastomer 202 couples the die 110 to the second non-conductive layer 132 and separates the passivation surface 124 of the die 110 from the second non-conductive layer 132 by a second dimension d2. The first elastomer 202 extends between the sidewalls 118 of the opening 108 in the substrate 102. In some embodiments, the first elastomer 202 may not extend to the sidewalls 118 of the opening 108 in the substrate 102.

[0052] The second elastomer 204 is on the die 110 and the active surface 120 of the first elastomer 202. The second elastomer 204 is between the sidewalls 118 of the opening 108 and the sidewalls 117 of the die 110, and between the active surface 120 of the die 110 and the first non-conductive layer 126. Thus, the die 110, the first elastomer 202, and the second elastomer 204 fill the opening 108 in the substrate 102. The second elastomer 204 can be a different elastomer material than the first elastomer 202, or can be the same elastomer material as the first elastomer 202.

[0053] In some embodiments, the third elastomer may be on the die 110 and the active surface 120 of the second elastomer 204. Thus, in some embodiments, any number of elastomers as appropriate may be used to surround the die 110 in the opening 108 of the substrate 102.

[0054] Figure 3A package 300 is shown that includes a first die 302 and a second die 304 in an elastomer 112 that fills an opening 108 in a substrate 102. The first die 302 and the second die 304 may have similar functionality or may have different functionality. The first die 302 and the second die 304 are separated by the elastomer 112 by a dimension d3, which may be any suitable dimension. In some embodiments, more than two dies may be present within the elastomer 112 and the opening 108. Thus, in some embodiments, any suitable number of dies may be present within the opening 108 of the substrate 102 and surrounded by the elastomer 112.

[0055] Figure 4 A package 400 is shown that includes a first die 402 surrounded by a first elastomer 406 in a first opening 404 of the substrate 102 and a second die 408 surrounded by a second elastomer 412 in a second opening 410 of the substrate 102. The first die 402 and the second die 408 may have similar functionality or may have different functionality. For example, the first die 402 may be a vibration sensor die and the second die 408 may be an ASIC die.

[0056] The first elastomer 406 is separated from the second elastomer 412 by a portion 414 of the substrate 102 having a dimension d4. The dimension d4 can be any suitable dimension. The first elastomer 406 can be a different elastic material than the second elastomer 412, or can be the same elastic material as the second elastomer 412.

[0057] The first opening 404 may have the same size or a different size as the second opening 410 as appropriate. For example, the capacity of the first opening 404 may be larger than the capacity of the second opening 410 because the first die 402 is larger than the second die 408, or vice versa.

[0058] In view of the above Figures 1A to 4 With reference to the discussion of the packages 100, 200, 300, 400 shown in FIG, some potential advantages of the packages 100, 200, 300, 400 over conventional semiconductor die packages are as follows.

[0059] By embedding die 110 within package 100 and surrounding die 110 with elastomer 112, die 110 is less susceptible to failure due to external stress. For example, if package 100 is dropped, elastomer 112 surrounding die 110 absorbs external forces and stresses to which die 110 would be directly exposed if it were within a conventional package and not surrounded by elastomer 112.

[0060] Another example of external stresses and forces is that caused by expansion and compression due to temperature changes. For example, when package 100 is exposed to an increase in temperature, substrate 102 and layers 126, 132, 136, 140 expand, causing elastomer 112 to flex and bend without causing die 110 to flex and bend. Similarly, when package 100 is exposed to a decrease in temperature, substrate 102 and layers 126, 132, 136, 140 compress, causing elastomer 112 to flex, bend, and compress without causing die 110 to flex, bend, and compress. The flexing, bending, and compression of elastomer 112 due to temperature changes reduces the likelihood of package 100 failure due to damage to die 110.

[0061] Given the above discussion regarding how elastomer 112 protects die 110 , package 100 is more robust and less likely to fail due to cracks within die 110 .

[0062] Similar to protecting the die 110 , the elastomer 112 also helps reduce failures in the substrate 102 and the layers 126 , 132 , 136 , 140 of the package 100 in a similar manner as discussed above with respect to the die 110 being embedded in the package 100 .

[0063] By embedding die 110 within substrate 102 of package 100, package 100 is less thick than other conventional packages containing semiconductor dies, which may also be a PCB. For example, conventional packages with a cap on the die would be thicker than package 100 because the cap must be spaced apart from the die.

[0064] The package 100 also allows for more complex functions to be performed because the package 100 has surfaces 146, 174 of the conductive layers 148, 170 exposed by openings 144, 172 on both sides of the package 100. This structure of the package 100 allows the package 100 on one side to be mounted within an electronic device and allows electronic components (e.g., a die, electrical connections, etc.) to be coupled to or stacked on the other side. This means that the package 100 can be incorporated into the small space available within the electronic device to provide the appropriate information for the electronic device to function and utilize the small space more efficiently than other conventional packages, allowing the electronic device to perform increasingly complex functions. For example, the electronic device may be a computer, a calculator, a phone, a tablet, a bendable or foldable electronic device, or some other suitable electronic device or combination of electronic devices.

[0065] While these are some potential advantages of the packages 100 , 200 , 300 , 400 over conventional packages, these advantages are not an exhaustive list, and there may be additional advantages of the packages 100 , 200 , 300 , 400 over conventional packages.

[0066] Figures 5A-5J Yes Figure 1A and 1B 1 and 2 are cross-sectional views of a method of manufacturing the package 100 shown in FIG. These cross-sectional views of the method of manufacturing are taken along the lines shown in FIG. Figure 1B 1A-1A of the package 100. During this embodiment of the manufacturing method, the features of the package 100 are as follows Figure 1A and Figure 1B The same reference numerals are used to represent the same figures in FIG.

[0067] Figure 5A is a cross-sectional view of the substrate 102 of the package 100 before the opening 108 is formed in the substrate 102. The conductive layer is on the first surface 104 of the substrate 102 and between the ends 156, 160. The conductive layer is on the second surface 106 of the substrate 102 and between the conductive layer 164 on the second surface 106 of the substrate 102. These conductive layers on the first surface 104 and the second surface 106 of the substrate 102 can be coupled to other conductive layers and conductive vias within the substrate 102, such as Figure 5A As shown in , the other conductive layers and conductive vias may not be visible in the cross-sectional view.

[0068] Figure 5B Step 502 is shown in which an opening 108 is formed in substrate 102. Opening 108 is formed by removing a portion of substrate 102, which may be formed by a cutting technique, an etching technique, or some other suitable removal technique or combination of removal techniques. For example, the cutting technique may include sawing, laser cutting, grinding, or some other suitable cutting technique or combination of cutting techniques; the etching technique may include chemical etching, photolithographic etching, water etching, or some other suitable etching technique or combination of etching techniques. Forming opening 108 may remove a portion of the conductive layer on first surface 104 of substrate 102 between end portions 156, 160. Forming opening 108 may remove a portion of the conductive layer on second surface 106 of substrate 102 between conductive layer 164 on second surface 106 of substrate 102.

[0069] Figure 5C Step 504 is shown in which a temporary carrier 506 is coupled to the second surface 106 of the substrate 102. The temporary carrier 506 can be a polyimide tape, a dummy substrate, or some other suitable temporary carrier or combination of temporary carriers. In some embodiments, the temporary carrier 506 can be a decomposable material. For example, the temporary carrier can be a thermally decomposable material, a water-decomposable material, a chemically decomposable material, a photosensitive decomposable material, or some other suitable decomposable material or combination of decomposable materials.

[0070] Second surface 106 of substrate 102 may be coupled to temporary carrier 506 by a temporary adhesive. The temporary adhesive may be a decomposable adhesive such as a thermally decomposable adhesive, a water decomposable adhesive, a chemically decomposable adhesive, a photosensitive decomposable adhesive, or some other suitable temporary adhesive or combination of temporary adhesives.

[0071] Figure 5D Step 508 is shown in which a portion 510 of the elastomer 112 is formed in the opening 108 and coupled to the temporary carrier 506, after which the die 110 is coupled to the portion 510 of the elastomer 112. The portion 510 of the elastomer 112 may be formed by a deposition technique, such as an injection forming technique, a sputtering forming technique, or some other suitable forming technique or combination of forming techniques.

[0072] The die 110 is coupled to the portion 510 of the elastomeric body 112 using a pick and place technique, a flip chip technique, or may be coupled to the portion 510 of the elastomeric body 112 using another placement technique or some combination of other placement techniques as appropriate. The die 110 is placed so that the center of the die 110 is aligned with the center of the opening 108. In some embodiments, the die 110 may be positioned so that the center of the die 110 is offset from the center of the opening 108. In some embodiments, multiple dies may be coupled to the portion 510 of the elastomeric body 112 within the opening 108, with the result that Figure 3 In some embodiments, a plurality of openings may be formed in substrate 102. Multiple portions of the elastomer may be formed in the multiple openings, and multiple dies may be coupled to the multiple portions of the elastomer in the multiple openings, resulting in the plurality of dies being formed in the substrate 102. Figure 4 See the package 400.

[0073] Figure 5E Step 512 is shown in which a portion 514 of the elastomer 112 is formed in the opening 108, on the active surface 120 of the die 110, and on the portion 510 of the elastomer 112 formed in step 508. The portion 514 of the elastomer 112 is formed to cover the active surface 120 of the die 110 and the sidewalls 117 of the die 110. The portion 514 of the elastomer 112 may be formed by a deposition technique, such as an implantation forming technique, a sputtering forming technique, or some other suitable forming technique or combination of forming techniques. In some embodiments, the portions 510, 514 of the elastomer 112 are allowed to cure within the opening 108, on the die 110, and on the temporary carrier 506. In some embodiments, the portions 510, 514 of the elastomer 112 in the opening 108 are different elastomeric materials, which may result in the die 110 being formed on the temporary carrier 506. Figure 2 See package 200.

[0074] Figure 5FStep 516 is shown in which the temporary carrier 506 is removed from the second surface 106 of the substrate 102. As previously discussed, the temporary carrier 506 can be any number of temporary carriers or temporary carrier materials. Thus, the temporary carrier 506 can be removed using various removal techniques depending on the composition and type of the temporary carrier 506 that was selected and previously coupled to the temporary carrier 506 as described with respect to FIG. Figure 5C The second surface 106 of the substrate 102 in step 504 is shown and discussed. For example, if the temporary carrier 506 is a dummy substrate coupled to the second surface 106 of the substrate 102 by a heat-decomposable adhesive, the heat-decomposable adhesive is exposed to heat to decompose the heat-decomposable adhesive. By decomposing the heat-decomposable adhesive, the substrate 102 can be removed from the temporary carrier 506 by a pick-and-place technique or some other suitable removal technique or combination of removal techniques.

[0075] Figure 5G Step 518 is shown in which non-conductive layers 126, 132 are formed on surfaces 104, 106 of substrate 102 and surfaces 114, 116 of elastomer 112. A first non-conductive layer 126 is formed on first surfaces 104, 114 of substrate 102 and elastomer 112, respectively. A second non-conductive layer 132 is formed on second surfaces 106, 116 of substrate 102 and elastomer 112. Non-conductive layers 126, 132 may be formed by deposition techniques, etching techniques, planarization techniques, or any other suitable processing technique or combination of processing techniques. For example, deposition techniques may include vapor deposition, sputtering, lamination, injection molding, compression molding, or some other suitable deposition technique or combination of deposition techniques; etching techniques may include chemical etching, photolithographic etching, water etching, or some other suitable etching technique or combination of etching techniques; and planarization techniques may include grinding, laser, or some other suitable planarization technique or combination of planarization techniques.

[0076] The formation of the first non-conductive layer 126 can be accomplished by first depositing a non-conductive material on the first surface 104 of the substrate 102 and the first surface 114 of the elastomer 112. After the non-conductive material is deposited and formed, the non-conductive material is then planarized to form a flat and substantially uniform surface, which results in the formation of the first non-conductive layer 126. The second non-conductive layer 132 can be formed by the same process as above, or can be formed by a suitable different process. In some embodiments, the non-conductive layers 126, 132 can be multiple layers of non-conductive material, wherein multiple non-conductive materials are deposited on each other and each is planarized after deposition.

[0077] Figure 5GStep 518 is shown again, also showing the conductive layers 148, 170 and vias 150, 152, 168 formed in the non-conductive layers 126, 132. The vias 150, 152, 168 are formed in the non-conductive layers 126, 132 by forming openings that extend into the non-conductive layers 126, 132. The openings may be formed by drilling, etching, or some other removal technique or combination of removal techniques. At least one of these openings is formed by removing portions of the non-conductive layer 126 and the elastomer 112 so that at least one opening exposes the contact 122 of the die 110. These openings in the non-conductive layers 126, 132 are filled with a conductive material to form the vias 150, 152, 168.

[0078] Figure 5G Step 518 is shown again, also showing the formation of conductive layers 148, 170, which can be formed by utilizing a mask layer, etching techniques, and conductive materials. For example, in some embodiments, a mask layer is formed on non-conductive layer 126, and then at least one opening is formed in the mask layer to expose the surface of non-conductive layer 126 and the surfaces of vias 150, 152. After the opening is formed, etching is completed to remove portions of non-conductive layer 126. Conductive material is then formed where the etching occurs to form conductive layer 148. After conductive layer 148 is formed, the mask layer is removed by etching techniques, removal techniques, or any suitable technique or combination of techniques capable of removing the mask layer. Conductive layer 170 can be formed using similar techniques and processes as discussed with respect to conductive layer 148.

[0079] Figure 5H Step 520 is shown in which a third nonconductive layer 136 and a fourth nonconductive layer 140 are formed on the first nonconductive layer 136 and the second nonconductive layer 132. The nonconductive layers 136, 140 may be formed using similar techniques as discussed above with respect to forming the nonconductive layers 126, 132. For example, the nonconductive layers 136, 140 may be formed by sputtering techniques, implantation techniques, vapor deposition techniques, or some other suitable deposition and formation technique or combination of deposition and formation techniques.

[0080] Figure 5I Step 522 is shown in which openings 144, 172 are formed in third non-conductive layer 136 and fourth non-conductive layer 140. Openings 144, 172 can be formed by sawing techniques, etching techniques, or any other suitable removal technique or combination of removal techniques. Openings 144, 172 are formed to expose surfaces 146, 174 of conductive layers 148, 172. In some embodiments, although not shown in this disclosure, under-bump metallization (UBM) can be formed within openings 144, 172 and on surfaces 146, 174 of conductive layers 148, 172.

[0081] Figure 5J Step 524 is shown in which solder balls 526 are coupled to surfaces 146, 174 of conductive layers 148, 170. Solder balls 526 are formed to allow package 100 to be mounted within electronic devices and other electronic components or devices to be mounted to or stacked on package 100. Solder balls 526 may be formed by a reflow technique or some other suitable solder ball forming technique or combination of solder ball forming techniques.

[0082] like Figures 5A to 5J The above steps in the manufacturing method shown in can be reorganized, adjusted or modified to form packages 100, 200, 300, 400 or any other package within the scope of the present disclosure. Figures 5A to 5J In an alternative embodiment of the fabrication method shown in , the substrate 102 may be a wafer coupled to a temporary carrier, wherein an array of openings is formed, each opening being filled with at least one die and an elastomer. Once the at least one die and elastomer are formed, the die is then fabricated using the same method as in . Figures 5A to 5J The temporary carrier is removed and various non-conductive and conductive layers are formed on both sides of the wafer in a similar process as discussed in the manufacturing method of . After the non-conductive and conductive layers are formed, the non-conductive layers, the conductive layers and the wafer with the die and elastomer in the openings of the wafer are then separated to form the wafer with the die and elastomer in the openings of the wafer. Figures 1A to 4 A package similar to the packages 100, 200, 300, 400 disclosed in .

[0083] In view of the above Figures 5A-5J A discussion of the fabrication method shown in FIG. 1 and FIG. 2 illustrates some potential advantages of the fabrication method compared to conventional methods of fabricating semiconductor die packages.

[0084] In view of the above discussion regarding the method of manufacturing package 100, the likelihood of deformation or components being outside of selected tolerances is reduced when compared to forming a conventional package with a cap. This is reduced because positioning the cap on the die requires a high level of precision, and if the cap is outside of the selected tolerances, the conventional package may not function properly. Furthermore, because placing the cap on a conventional package requires a high level of precision, it is expensive. Therefore, by forming package 100 without a cap, the likelihood of components being outside of selected tolerances is reduced, and the cost of formation is also reduced.

[0085] Although these are Figures 5A to 5J The manufacturing method shown in FIGURE 1 shows some potential advantages over conventional methods of manufacturing conventional packages, but these advantages are not an exhaustive list and may exist as follows: Figures 5A to 5J The fabrication method shown in has additional advantages over conventional methods of fabricating conventional semiconductor die packages.

[0086] The various embodiments described above can be combined to provide further embodiments. All U.S. patents, U.S. patent application publications, U.S. patent applications, foreign patents, foreign patent applications, and non-patent publications mentioned in this specification and / or listed in the application data sheet are incorporated herein by reference in their entirety. Aspects of the embodiments can be modified, if necessary, to utilize concepts from the various patents, applications, and publications to provide further embodiments.

[0087] These and other changes can be made to the embodiments in light of the above detailed description. Generally, in the following claims, the terms used should not be construed to limit the claims to the specific embodiments disclosed in the specification and claims, but should be construed to include all possible embodiments and the full scope of equivalents to which the claims are entitled. Therefore, the claims are not limited by this disclosure.

Claims

1. A device comprising: a substrate having a first surface and a second surface, the second surface being opposite to the first surface; an opening extending through the substrate from the first surface to the second surface; a die in the opening and between the first and second surfaces of the substrate; as well as An elastomeric body is in the opening and surrounds the die, wherein the elastomeric body includes a third surface substantially coplanar with the first surface and a fourth surface substantially coplanar with the second surface. 2 . The apparatus of claim 1 , wherein the opening comprises a plurality of sidewalls, and each of the plurality of sidewalls is separated from the die by the elastomer.

3. The apparatus according to claim 1, further comprising: a first non-conductive layer on the first surface of the substrate and on the elastomer; as well as A second non-conductive layer is on the second surface of the substrate and on the elastomer. 4 . The device of claim 3 , wherein the die is separated from the first and second non-conductive layers by the elastomer.

5. The apparatus of claim 3, wherein electrical connections coupled to the die extend through the elastomer, the first non-conductive layer, the substrate, and the second non-conductive layer.

6. The device of claim 3, wherein the elastic body includes a first portion made of a first elastic material and a second portion formed of a second elastic material, the second elastic material being different from the first elastic material.

7. The device according to claim 6, wherein: the first portion is on the second non-conductive layer and between the second non-conductive layer and the die; and The second portion is on the first nonconductive layer, between the first nonconductive layer and the die, and between sidewalls of the die and sidewalls of the opening. 8 . The apparatus of claim 1 , wherein a first dimension of the die extending in a direction of a central axis of the opening is smaller than a second dimension of the opening extending in the direction.

9. The device of claim 3, wherein the elastomer is on the second non-conductive layer, between the second non-conductive layer and the die, on the first non-conductive layer, between the first non-conductive layer and the die, and between multiple sidewalls of the die and multiple sidewalls of the opening.

10. A device comprising: a substrate comprising a first opening extending completely through the substrate from a first surface of the substrate to a second surface of the substrate opposite the first surface; a first die within the first opening; as well as an elastomer, in the first opening, the elastomer encapsulating the die and separating a sidewall of the die from the substrate, wherein the elastomer includes a third surface substantially coplanar with the first surface and a fourth surface substantially coplanar with the second surface.

11. The apparatus according to claim 10, further comprising: a first non-conductive layer on the first surface of the substrate and on the elastomer; a second non-conductive layer on the second surface of the substrate and on the elastomer; a third non-conductive layer on the first non-conductive layer; a fourth non-conductive layer on the second non-conductive layer; as well as An electrical connection extends through the substrate, the elastomer, the first non-conductive layer, and the second non-conductive layer.

12. The apparatus according to claim 11, further comprising: a plurality of first openings in the third non-conductive layer, the plurality of first openings exposing first portions of the electrical connections; as well as A plurality of second openings are provided in the fourth non-conductive layer, the plurality of second openings exposing second portions of the electrical connections. 13 . The apparatus of claim 10 , further comprising a second die within the first opening, the elastic body surrounding the second die and separating the second die from the substrate and the first die.

14. The apparatus according to claim 10, further comprising: a second opening in the substrate, the second opening being separated from the first opening; a second die within the second opening; as well as An elastic body in the second opening surrounds the second die and separates the second die from the substrate.

15. A method comprising: forming an opening extending from a first surface of a substrate through the substrate to a second surface of the substrate opposite the first surface; forming a first portion of elastic material in the opening, the first portion of elastic material having a third surface substantially coplanar with the first surface; coupling a die to the first portion of the elastic material; as well as A second portion of elastic material is formed on the die, on the first portion of elastic material, and in the opening, the second portion of elastic material having a fourth surface that is substantially coplanar with the second surface.

16. The method according to claim 15, further comprising: coupling a temporary support to the substrate; forming a first portion of the elastic material on the temporary support; as well as The temporary support is removed from the substrate and the first portion of the elastic material.

17. The method according to claim 15, further comprising: forming a first non-conductive layer on the first surface of the substrate and on the second portion of the elastic material; forming a second non-conductive layer on the second surface of the substrate and on the first portion of the elastic material; as well as An electrical connection is formed that extends through the second portion of the elastic material, the first non-conductive layer, the substrate, and the second non-conductive layer.

18. The method according to claim 17, further comprising: forming a third non-conductive layer on the first non-conductive layer and the electrically connected first surface; forming a fourth non-conductive layer on the second non-conductive layer and the electrically connected second surface; forming a plurality of first openings in the third non-conductive layer to expose portions of the first surface of the electrical connections; as well as A plurality of second openings are formed in the fourth non-conductive layer to expose second portions of the second surface of the electrical connections.

19. The method of claim 15, wherein forming the first portion of the elastic material and forming the second portion of the elastic material comprises: Using a first elastic material for the first portion and a second elastic material for the second portion, the second elastic material being different from the first elastic material.

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