Thermionic modules, thermoelectric devices, and wearable devices

Abstract

A thermoelectric module, a thermoelectric device and a wearable device can improve the efficiency of heat conduction. The thermoelectric module includes a thermoelectric unit, which is used to realize the conversion between thermal energy and electrical energy. The thermoelectric unit includes: a thermal conductive adhesive layer, an insulating film layer and a power generation unit; wherein the power generation unit includes an electrode layer, a P-type thermoelectric arm and an N-type thermoelectric arm, and the P-type thermoelectric arm and the N-type thermoelectric arm are connected in series through the electrode layer; the insulating film layer and the thermal conductive adhesive layer are stacked in sequence on the first surface of the electrode layer, and the first surface is the surface of the electrode layer away from the P-type thermoelectric arm and the N-type thermoelectric arm; the thermal conductive adhesive layer is used to conduct heat energy between the thermoelectric unit and the shell of the thermoelectric module.

Description

Technical Field

[0001] The present application relates to the field of electronic devices, and in particular to thermoelectronic modules, thermoelectric devices and wearable devices. Background Art

[0002] Thermoelectric materials are functional materials that can directly convert heat energy and electrical energy into each other. They are mainly semiconductor materials and have the advantages of being small, light, and long-lasting. If there is a temperature difference between the two ends of a thermoelectric material, heat energy can be converted into electrical energy. This effect is called the Seebeck effect. If an electric current is passed through a thermoelectric material, a certain temperature difference will be generated at both ends of the thermoelectric material, which can be used for heating or cooling to achieve precise temperature control. This effect is called the Peltier effect.

[0003] Thermoelectric materials can be used to make thermoelectric devices. For example, if a thermoelectric device is used to generate electricity, it is usually called a thermoelectric generator (TEG). If a thermoelectric device is used for temperature control, it is usually called a thermoelectric cooler (TEC). The smallest unit in a thermoelectric device is a pair of thermocouples, including a P-type thermoelectric material and an N-type thermoelectric material. By connecting conductive materials between different thermocouples, multiple thermocouples can be connected in series and in parallel to expand the output power capacity.

[0004] With the rise of wearable devices in recent years, semiconductor thermoelectric energy harvesting technology that uses the temperature difference between the human body and the environment has received more and more attention. For example, devices such as smart watches and smart wristbands can use the temperature difference between the human body and the ambient temperature to generate electricity. However, traditional thermoelectric devices and systems are mostly for industrial applications, which are quite different from wearable applications based on the human body. One of the typical problems is that industrial design devices are large in size and rigid in appearance, which cannot form effective heat conduction. Summary of the invention

[0005] The present application provides a thermoelectronic module, a thermoelectric device and a wearable device, which can improve the efficiency of heat conduction.

[0006] In a first aspect, a thermal electronic module is provided, comprising a thermoelectric unit, wherein the thermoelectric unit is used to realize the conversion between thermal energy and electrical energy, and the thermoelectric unit comprises: a thermal conductive adhesive layer, an insulating film layer and a power generation unit; wherein the power generation unit comprises an electrode layer, a P-type thermoelectric arm and an N-type thermoelectric arm, and the P-type thermoelectric arm and the N-type thermoelectric arm are connected in series through the electrode layer; the insulating film layer and the thermal conductive adhesive layer are stacked in sequence on a first surface of the electrode layer, and the first surface is a surface of the electrode layer away from the P-type thermoelectric arm and the N-type thermoelectric arm; the thermal conductive adhesive layer is used to conduct heat energy between the thermoelectric unit and the outer shell of the thermal electronic module.

[0007] By providing a thermal conductive adhesive layer between the shell and the insulating film layer of the thermal electronic module, the thermal conductivity between the shell and the insulating film layer can be improved, the thermal conduction performance can be improved, and thus the performance of the thermal electronic module can be improved.

[0008] In addition, the thermoelectric unit is designed in a modular way. Each thermoelectric unit is provided with a thermal conductive adhesive layer, an insulating film layer and a power generation unit. The modular feature enables the thermoelectric device to adjust the number of modules in the system according to the differences in human body height characteristics, thereby having relatively high maintainability and wearing comfort.

[0009] In combination with the first aspect, in a possible implementation manner, a low thermal conductivity material is disposed between the P-type thermoelectric arm and the N-type thermoelectric arm.

[0010] Low thermal conductivity material is filled between the P-type thermoelectric arm and the N-type thermoelectric arm, which can effectively block air convection, reduce heat loss caused by air flow, improve the power generation capacity of the system, and improve the mechanical strength of the thermoelectric module.

[0011] In combination with the first aspect, in a possible implementation, the power generation unit includes at least one P-type thermoelectric arm and at least one N-type thermoelectric arm; wherein the P-type thermoelectric arm and the N-type thermoelectric arm are placed in a vertical direction, the electrode layer is arranged at the upper and lower ends of the P-type thermoelectric arm and the N-type thermoelectric arm, and the vertical direction is parallel to the intersection line between the front surface and the left side surface of the thermal electronic module.

[0012] Each thermoelectric module is provided with one or more P-type thermoelectric arms and N-type thermoelectric arms, which can increase the power generation of a single thermoelectric module.

[0013] In combination with the first aspect, in a possible implementation manner, the at least one P-type thermoelectric arm and the at least one N-type thermoelectric arm are arranged at intervals.

[0014] In combination with the first aspect, in a possible implementation manner, the housing of the thermal electronic module includes at least one of the following: a metal housing and a ceramic housing.

[0015] The upper and lower layers of the thermoelectric unit are provided with metal shells to facilitate good heat conduction and protect the thermoelectric unit.

[0016] In combination with the first aspect, in a possible implementation, the thermoelectric module further includes at least one connection module, wherein the connection module is disposed on at least one side of the thermoelectric unit, and there is an electrical connection between the connection module and the thermoelectric unit.

[0017] By modularizing the thermal electronic modules in the thermoelectric device, the thermal electronic modules can be connected through the connecting modules. Since the connection position is located on the connecting module instead of on the thermoelectric material, it will not occupy the surface area of ​​the thermoelectric material. It can achieve local rigidity and overall flexible connection between the thermal electronic modules without affecting the performance of the thermoelectric device, which can better take into account the system reliability and the need for wearable scenarios to closely fit the irregular human body.

[0018] In combination with the first aspect, in a possible implementation manner, the upper surface and the lower surface of the thermal electronic module are used to contact a cold source and a heat source respectively, and the at least one connection module is disposed on the left side or the right side of the thermal electronic module.

[0019] In combination with the first aspect, in a possible implementation manner, the P-type thermoelectric arm and the N-type thermoelectric arm are used to achieve electrical connection with the connection module through an electrode layer.

[0020] The P-type thermoelectric arm and the at least one N-type thermoelectric arm are also used to achieve electrical connection with the connection module through the electrode layer, so that the connection piece can achieve electrical connection between the thermoelectric modules.

[0021] In combination with the first aspect, in a possible implementation, the length of the thermoelectric unit in a first direction is greater than the length of any one of the connecting modules, the first direction is parallel to the intersection line between the upper surface and the side surface of the thermoelectric module, the upper surface of the thermoelectric module is used to contact a heat source or a cold source, and the side surface of the thermoelectric module is adjacent to other thermoelectric modules.

[0022] The length of the thermoelectric unit in the first direction is greater than the length of the connecting modules on both sides, which can increase the surface area of ​​the thermoelectric unit and improve the power generation capacity. In addition, the connecting piece can be embedded in the recess formed by the above length difference, thereby increasing the firmness of the mechanical connection.

[0023] In combination with the first aspect, in a possible implementation manner, the material of the connection module is a material with low thermal conductivity.

[0024] The connection module can be made of low thermal conductivity material to reduce heat dissipation, thereby reducing losses when the thermal electronic module is working.

[0025] In a second aspect, a thermoelectric device is provided, comprising a plurality of thermoelectric modules as in the first aspect or any possible manner in the first aspect; and a plurality of connectors, wherein the plurality of connectors are connected to connection modules in the plurality of thermoelectric modules to achieve mechanical and electrical connections between the plurality of thermoelectric modules.

[0026] By modularizing the thermal electronic modules in the thermoelectric device, the thermal electronic modules are connected through connectors and connecting modules. Since the connection position is located on the connecting module instead of on the thermoelectric material, it will not occupy the surface area of ​​the thermoelectric material. It can achieve local rigidity and overall flexible connection between the thermal electronic modules without affecting the performance of the thermoelectric device, which can better balance the system reliability and the need for wearable scenarios to closely fit the irregular human body.

[0027] In combination with the second aspect, in a possible implementation manner, a connecting wire is provided in the connecting member for realizing electrical connection between two adjacent thermal electronic modules.

[0028] In combination with the second aspect, in a possible implementation manner, two connecting members are disposed between any two adjacent thermal electronic modules, and the two connecting members are respectively disposed on the front side and the rear side of the two adjacent thermal electronic modules.

[0029] In combination with the second aspect, in a possible implementation manner, the connecting member and the thermal electronic module are connected via a fixing member, the fixing member is a nut, and a bolt corresponding to the nut is provided in the connecting module.

[0030] In combination with the second aspect, in a possible implementation manner, the connecting member and the thermal electronic module are connected via a fixing member, the fixing member is a screw, and a thread corresponding to the screw is provided in the connecting module.

[0031] In a third aspect, a wearable device is provided, comprising a thermoelectric device as described in the second aspect or any possible implementation of the second aspect and a functional module, wherein the thermoelectric device is used to power the functional module.

[0032] In combination with the third aspect, in a possible implementation manner, the functional module includes a circuit module and / or a battery.

[0033] In combination with the third aspect, in a possible implementation manner, the wearable device further includes a snap-fit ​​device, and the snap-fit ​​device is used to connect the multiple thermal electronic modules into a ring shape.

[0034] In a fourth aspect, an electronic device is provided, the electronic device comprising the thermoelectronic module as described in the first aspect or any possible implementation of the first aspect, or the thermoelectric device as described in the second aspect or any possible implementation of the second aspect.

[0035] In a fifth aspect, a thermoelectric system is provided, which includes the thermoelectric module as described in the first aspect or any possible implementation of the first aspect, or the thermoelectric device as described in the second aspect or any possible implementation of the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 Schematic diagram of the working principle of a thermoelectric device 100 according to an embodiment of the present application.

[0037] Figure 2 Schematic diagram of an application scenario of a thermoelectric device 100 according to an embodiment of the present application.

[0038] Figure 3 FIG. 2 is a partial top view of a thermoelectric device 200 according to an embodiment of the present application.

[0039] Figure 4 FIG. 2 is a front view of a thermal electron module 210 according to an embodiment of the present application.

[0040] Figure 5 yes Figure 4 A cross-sectional view of the thermal electronic module 210 at 0-0'.

[0041] Figure 6 FIG. 2 is a front view of a thermal electron module 210 according to an embodiment of the present application.

[0042] Figure 7 yes Figure 6 The thermal electronic module 210 is a cross-sectional view at 1-1'.

[0043] Figure 8 FIG. 2 is a detailed schematic diagram of a thermal electron module 210 according to an embodiment of the present application.

[0044] Fig. 9 yes Figure 8 FIG. 2 is a cross-sectional view of the thermal electron module 210 in the direction 2-2'.

[0045] Fig.10 yes Figure 8 FIG. 2 is a cross-sectional view of the thermal electron module 210 in the direction 3-3'.

[0046] Fig.11 yes Figure 8 FIG. 2 is a cross-sectional view of the thermal electron module 210 in the direction 4-4'.

[0047] Fig.12 Schematic diagram of a connection method between a thermal electronic module 210 and a connecting member 220 according to an embodiment of the present application.

[0048] Fig.13 2 is a schematic structural diagram of a thermal electron module 210 according to an embodiment of the present application.

[0049] Fig.14 yes Fig.13 Schematic diagram of the connection between the thermal electronic module 210 and the connecting member 220.

[0050] Fig.15 Schematic diagram of the connection between the thermal electronic module 210 and the connecting member 220 according to another embodiment of the present application.

[0051] Fig.16 It is a schematic diagram of a connection member 220 according to an embodiment of the present application that adopts a bolt-nut fixing method.

[0052] Fig.17 It is a schematic diagram of a connection member 220 according to an embodiment of the present application that adopts a screw-thread fixing method.

[0053] Fig.18 4 is a schematic diagram of a wearable device 400 in an extended state according to an embodiment of the present application.

[0054] Fig.19 4 is a schematic diagram of a wearable device 400 according to an embodiment of the present application in a closed connection state. DETAILED DESCRIPTION

[0055] The technical solution in this application will be described below in conjunction with the accompanying drawings.

[0056] For ease of understanding, the working principle of thermoelectric devices is first described.

[0057] Figure 1 FIG. 1 is a schematic diagram of the working principle of a thermoelectric device 100 according to an embodiment of the present application. The thermoelectric device 100 can be used to convert thermal energy into electrical energy. Figure 1 As shown, the smallest unit in the thermoelectric device 100 is a pair of thermocouples. A pair of thermocouples includes a P-type semiconductor thermoelectric material 101 and an N-type semiconductor thermoelectric material 102, which can also be referred to as P-type thermoelectric material 101 and N-type thermoelectric material 102. The first end of the P-type thermoelectric material 101 and the first end of the N-type thermoelectric material 102 are connected by a conductive material and serve as a terminal of the thermocouple, which is represented by T1. The second end of the P-type thermoelectric material 101 and the second end of the N-type thermoelectric material 102 are led out to two terminals through different conductive materials, and the two terminals can be represented by T 2p and T 2n, or the two terminals can also be collectively referred to as T2. The above conductive material can be a metal conductor, such as copper.

[0058] By connecting multiple thermocouples 2p End and T 2n The ends of a thermocouple can be connected in series or in parallel to expand the output power capacity of the thermoelectric device. 2p The T of the adjacent thermocouple 2n The two thermocouples can be connected in series if the ends are connected. The conductive material can be connected to the metallized ceramic substrate to form a thermoelectric device. As an example, the metallized ceramic substrate can include aluminum oxide (Al2O3) or aluminum nitride (AlN).

[0059] It should be understood that, in some examples, the P-type semiconductor thermoelectric material 101 and the N-type semiconductor thermoelectric material 102 may also be referred to as a P-type thermoelectric arm and an N-type thermoelectric arm, respectively.

[0060] Next, the power generation principle of thermoelectric devices is described. The T1 and T2 ends of the thermocouple are connected to the heat source and cold source respectively. The cold source and the heat source are relative. The temperature difference between the cold source and the heat source drives the carriers in the thermoelectric material to migrate in a directional manner. 2p End and T 2n When a load is connected between the terminals, current will be generated. The direction of the current has a certain correlation with the direction of the cold source and the heat source. Figure 1 As shown in the figure, if the top is cold and the bottom is hot, the current direction is from left to right. If the thermocouple is cold at the bottom and hot at the top, the current direction is from right to left.

[0061] As mentioned above, with the rise of wearable devices in recent years, energy harvesting technology based on semiconductor thermoelectric materials that utilizes the temperature difference between the human body and the environment has received increasing attention. However, traditional thermoelectric devices and systems are mostly for industrial applications, which are quite different from wearable applications based on the human body.

[0062] For example, the main differences include the following: traditional thermoelectric devices are packaged with ceramic substrates to provide support and fixation, and the losses caused by the thermal resistance of the ceramic substrate are more critical in low temperature difference scenarios, and have a greater impact on the losses of the thermoelectric devices; there is air space between the thermoelectric arms, and airflow generates additional heat losses; industrially designed devices are larger in size and more rigid in shape, and have poor fit with the irregular surface of the human body, and cannot form effective heat conduction.

[0063] Based on the above problems, the industry has proposed a variety of solutions. For example, in a design of a wearable thermoelectric device, a hole can be punched in the middle of the P-type and N-type thermoelectric materials, and then a fixed structure is used to pass through the thermoelectric material to fix it. The two ends of the fixed structure are then fixed to the external polymer hinges, and a copper heat sink is integrated on the top to form a modular thermoelectric unit. Finally, multiple modular thermoelectric units can be connected through external polymer hinges to form a long flexible chain-mounted thermoelectric system. This solution is characterized by overall flexibility and local rigidity, which can provide good support for thermoelectric materials while ensuring that the overall thermoelectric system fits the irregular human body surface.

[0064] However, this solution also has some disadvantages. For example, since it is necessary to punch holes in the thermoelectric material, the processing may cause the thermoelectric material to break, thereby increasing the material scrap rate; punching the thermoelectric material will lead to a reduction in cross-sectional area, thereby increasing resistance and reducing power generation capacity; for thermoelectric systems, the surface area of ​​the thermoelectric material is not high, which will affect the power generation capacity; using too many connectors will also lead to system reliability problems.

[0065] Therefore, in order to solve the above problems, the embodiments of the present application provide a thermoelectric module, a thermoelectric device and a wearable device, wherein the thermoelectric module includes a modular thermoelectric unit, which can improve the thermal conductivity of the thermoelectric module. Furthermore, a connection module is also provided in the thermoelectric module, and multiple thermoelectric modules are connected by connectors to form an overall flexible and partially rigid system structure, which can be compatible with the rigid nature of thermoelectric materials and the requirements of irregular human body surface attachment. Compared with the existing solutions, the solution of the present application can reduce the number of connectors, avoid drilling holes in thermoelectric materials, and improve power generation capacity.

[0066] Next, the thermoelectric device and wearable device according to the embodiments of the present application will be introduced in conjunction with the accompanying drawings.

[0067] Figure 2 Schematic diagram of an application scenario of a thermoelectric device 100 according to an embodiment of the present application. Figure 2 As shown, the thermoelectric device 100 can be arranged in a wearable device 400, and the wearable device 400 is worn on the surface of the human body. For example, it can be worn on the wrist of a human body as a smart watch or smart bracelet. The wearable device 400 may include a thermoelectric device 400, an electric energy conversion system, and a functional module. The functional module may include a battery and / or a circuit module. As an example and not a limitation, the circuit module may include a processor, a display module, or a communication module.

[0068] Thermoelectric device 100 can be used to achieve conversion from thermal energy to electrical energy. Figure 2The flow of thermal energy and electrical energy is shown in Figure 1. Normally, the human body temperature is higher than the ambient temperature, so the human body acts as a heat source and continuously releases heat energy to the environment. Placing the thermoelectric device on the heat path of the human body to the environment will generate electrical energy based on the Seebeck effect of the thermoelectric material. The thermoelectric device outputs the generated electrical energy to the power conversion system for voltage boost regulation, and can directly supply power to other modules in the wearable device, such as batteries or circuit modules.

[0069] Figure 3 FIG. 2 is a partial top view of a thermoelectric device 200 according to an embodiment of the present application. Figure 3 As shown, the thermoelectric device 200 includes a plurality of thermoelectric modules 210 and a plurality of connecting members 220 .

[0070] Each of the thermoelectric modules 210 includes a thermoelectric unit 211 and two connection modules 213. The thermoelectric module 210 contains thermoelectric materials to achieve the conversion between thermal energy and electrical energy. The two connection modules 213 are respectively arranged on the left and right sides of the thermoelectric unit 211. Each connection module 213 is provided with a fixing connection point (not shown in the figure) and a connection wire connection point (not shown in the figure). There is an electrical connection between the connection wire connection point and the thermoelectric unit 211.

[0071] The above-mentioned multiple connecting members 220 are used to realize the mechanical connection and electrical connection of the multiple thermal electronic modules 210, wherein each connecting member 220 is arranged between two adjacent thermal electronic modules 210, and is connected to the fixing member connection point in the adjacent thermal electronic module 210 through a fixing member (not shown in the figure), and each connecting member 220 is also provided with a connecting wire 221, and the connecting wire 221 is used to connect to the connecting wire connection point in the adjacent thermal electronic module 210.

[0072] As an example, Figure 3 As shown, each two adjacent thermal electronic modules 210 can be connected in series in both mechanical and electrical dimensions through two independent connectors 220, and finally form a modular expansion structure. For example, multiple thermal electronic modules 210 can be connected in series to form a wristband of a smart watch or bracelet, and achieve electrical series connection.

[0073] It should be understood that Figure 3 The thermoelectric device 200 is only used as an example and not as a limitation. For example, every two adjacent thermoelectric modules 210 can also be connected in series in both mechanical and electrical dimensions through a connector 220 or more than two connectors 220, as long as the connector 220 can achieve mechanical and electrical connections between the thermoelectric modules.

[0074] It should be understood that in the embodiment of the present application, the upper and lower sides of the thermal electronic module 210 may refer to the directions of the cold source and the heat source, respectively. For example, the upper surface of the thermal electronic module 210 may refer to the surface of the thermal electronic module 210 in contact with the environment, and the lower surface of the thermal electronic module 210 may refer to the surface of the thermal electronic module 210 in contact with the human body. The left side and the right side of the thermal electronic module 210 are respectively used to connect with adjacent thermal electronic modules 210. The direction of the front surface of the thermal electronic module 210 can be used as the direction of the front view (see below). Figure 6 ).

[0075] exist Figure 3 In the figure, the surface of the thermal electronic module 210 facing the reader may refer to the upper surface of the thermal electronic module 210. For ease of understanding, the embodiment of the present application will mark the first direction X and the second direction Y in the drawings, the first direction X is a direction perpendicular to the front surface of the thermal electronic module 210, and the second direction Y is a direction perpendicular to the upper surface of the thermal electronic module 210.

[0076] In other words, the first direction X is parallel to the intersection line between the upper surface and the left side (or right side) of the thermal electronic module 210. The second direction Y is parallel to the intersection line between the front surface and the left side (or right side) of the thermal electronic module 210. The left side and the right side can be collectively referred to as side surfaces.

[0077] Figure 4 and Figure 5 2 is a front view and a cross-sectional view of a thermal electronic module 210 according to an embodiment of the present application. Figure 5 for Figure 4 The cross-sectional view in the 0-0' direction. Figure 4 As shown, the thermoelectric module 210 includes a thermoelectric unit 211, and the thermoelectric unit 211 is used to realize the conversion between thermal energy and electrical energy.

[0078] The thermoelectric unit 211 includes: a thermally conductive adhesive layer (21, 31), an insulating film layer (23, 33) and a power generation unit 218. The power generation unit 218 includes an electrode layer (25, 35), a P-type thermoelectric arm and an N-type thermoelectric arm, and the electrode layer (25, 35) is arranged at both ends of the P-type thermoelectric arm and the N-type thermoelectric arm to realize the series connection between the P-type thermoelectric arm and the N-type thermoelectric arm.

[0079] The insulating film layer (23, 33) and the thermally conductive adhesive layer (21, 31) are stacked in sequence on a first surface of the electrode layer (25, 35), and the first surface is a surface of the electrode layer (25, 35) that is away from the P-type thermoelectric arm and the N-type thermoelectric arm.

[0080] The thermal conductive adhesive layer (21, 31) is used to conduct heat energy between the thermoelectric unit and the outer shell of the thermoelectric module 210.

[0081] In the embodiment of the present application, by providing a thermal conductive adhesive layer (21, 31) between the outer shell and the insulating film layer (22, 33) of the thermal electronic module 210, the thermal conductivity efficiency between the outer shell and the insulating film layer (22, 33) can be improved, the thermal conduction performance can be improved, and thus the performance of the thermal electronic module 210 can be improved.

[0082] In some examples, the power generation unit includes a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs, thereby increasing the power of a single thermoelectric module 210 .

[0083] In some examples, the electrode layer (25, 35) includes a first electrode layer 25 and a second electrode layer 35, and is respectively disposed at both ends of a P-type thermoelectric arm and a plurality of N-type thermoelectric arms to achieve a series connection between the P-type thermoelectric arm and the plurality of N-type thermoelectric arms.

[0084] In some examples, a plurality of P-type thermoelectric arms and a plurality of N-type thermoelectric arms are placed in a vertical direction, and the electrode layers (25, 35) are arranged at the upper and lower ends of the P-type thermoelectric arms and the N-type thermoelectric arms. The vertical direction is the second direction Y. In some examples, such as Figure 5 As shown, in the power generation unit, a plurality of P-type thermoelectric arms and a plurality of N-type thermoelectric arms are arranged in multiple rows and columns.

[0085] In some examples, the P-type thermoelectric arm and the N-type thermoelectric arm have end faces and side faces, wherein the end faces may refer to the planes at both ends of the thermoelectric arm in contact with the power generation layer (25, 35), and the side faces refer to the surfaces of the thermoelectric arm adjacent to other thermoelectric arms.

[0086] Optionally, the layer where the P-type thermoelectric arm and the N-type thermoelectric arm are located may also be referred to as a power generation layer 30 .

[0087] It should be understood that in some examples, such as Figure 4 As shown, in the thermoelectronic module 210 , the insulating film layer ( 23 , 33 ) and the thermal conductive adhesive layer ( 21 , 31 ) are symmetrically distributed above and below the power generation unit 218 .

[0088] Optionally, the shell of the thermionic module comprises any one of the following: a metal shell, a ceramic shell, or the shell of the thermionic module may also be made of other materials.

[0089] Optionally, the housing of the thermoelectric module 210 and the thermoelectric unit 211 may be manufactured in an integrated manner, or may be manufactured and molded separately and then assembled together.

[0090] If the shell of the thermoelectronic module 210 and the thermoelectric unit 211 are manufactured in an integrated manner, the thermal conductive adhesive layer (21, 31) can fit the shell more closely, thereby further improving the thermal conductivity between the shell and the insulating film layer (22, 33), thereby improving the performance of the thermoelectronic module.

[0091] In the embodiment of the present application, the thermal electronic module is further modularly designed, and a connecting module is provided in the thermal electronic module, so that the thermal electronic modules are connected through connecting parts and the connecting module. Since this connection method does not occupy the surface area of ​​the thermoelectric material, it is possible to achieve a locally rigid and overall flexible connection between the thermal electronic modules without affecting the performance of the thermoelectric device, which can better take into account the system reliability and the need for the wearable scenario to closely fit the irregular human body, and takes into account the implementation method of the strap or wristband, which can effectively increase the power generation area.

[0092] Next, the internal structures of the thermal electronic module 210 and the connecting member 220 will be described.

[0093] Figure 6 and Figure 7 They are respectively a front view and a cross-sectional view of a thermal electronic module 210 according to an embodiment of the present application. Figure 7 for Figure 6 The cross-sectional view in the 1-1' direction. Figure 6 and Figure 7 As shown, the thermoelectric module 210 includes a thermoelectric unit 211, at least one connection module 213 and a housing 215. The thermoelectric unit 211 includes a thermoelectric material and is the main body of the thermoelectric module 210. The thermoelectric material may include a P-type thermoelectric arm and an N-type thermoelectric arm. The housing 215 is disposed on the upper and lower layers of the thermoelectric unit 211 to form a sandwich structure with the thermoelectric unit 211. At least one connection module 213 may be located on the left or right side of the thermoelectric unit 211.

[0094] The upper side and the lower side of the thermal electronic module 210 can be used to contact a heat source and a cold source, respectively, for example, can be used to contact the environment and the human body surface, respectively.

[0095] It should be understood that in some examples, the thermoelectric module 210 generally includes two connection modules 213, which are respectively arranged on the left and right sides of the thermoelectric unit 211, so as to be connected with other thermoelectric modules 210. In some examples, if the thermoelectric module 211 is located at an edge, only one connection module 213 may be included, which is arranged on the left and right sides of the thermoelectric unit 211. Alternatively, in some examples, for the consideration of quantitative production, the thermoelectric module 211 is arranged at an edge, but still includes two connection modules 213.

[0096] In some examples, the thermoelectric unit 211 is connected to the connection module 213 in an adhesive mode. The connection module 213 can be made of a material with low thermal conductivity to reduce heat dissipation, thereby reducing the loss of the thermoelectric unit 211 when it is working.

[0097] In some examples, the connection module 213 may be provided with a fixing connection point and a connecting wire connection point. The fixing connection point can be used for mechanical fixation between the thermal electronic module 210 and the connector 220. The connecting wire connection point can be used for electrical connection between adjacent thermal electronic modules 210.

[0098] Optionally, the housing 215 may cover the connection module 213 or may not cover the connection module 213, which is not limited in the present embodiment, as long as the housing 213 covers the thermoelectric unit 211. Figure 6 In the description, the shell 215 covering the connection module 213 is taken as an example.

[0099] In some examples, the housing 215 is a metal housing, for example, the housing 215 may be made of stainless steel.

[0100] Figure 8 FIG. 2 is a detailed schematic diagram of a thermal electronic module 210 according to an embodiment of the present application. Figure 8 As shown, the thermoelectric unit 211 includes, from top to bottom, a first thermally conductive adhesive layer 21, a first insulating film layer 23, a first electrode layer 25, a power generation layer 30, a second electrode layer 35, a second insulating film layer 33, and a second thermally conductive adhesive layer 31. The first thermally conductive adhesive layer 21 and the second thermally conductive adhesive layer 31 are in contact with the housing 215.

[0101] It should be understood that in the embodiment of the present application, the upper side and the lower side of the thermal electronic module 210 may refer to the directions of the cold source and the heat source, respectively. For example, the upper side of the thermal electronic module 210 may refer to the surface of the thermal electronic module 210 in contact with the environment, and the lower side of the thermal electronic module 210 may refer to the surface of the thermal electronic module 210 in contact with the human body.

[0102] The power generation layer 30 includes one or more P-type thermoelectric arms and one or more N-type thermoelectric arms, and the gaps between the thermoelectric arms can be filled with low thermal conductivity materials to reduce the loss of the thermoelectric device. The working principles of the P-type thermoelectric arms and the N-type thermoelectric arms have been described above and will not be repeated here.

[0103] The function of the insulating film layer (23, 33) is to achieve insulation between the shell 215 and the electrode layer (25, 35). The function of the thermal conductive adhesive layer (21, 31) is to fill the gap between the shell 215 and the insulating film layer (23, 33) to achieve better contact and ensure effective heat conduction.

[0104] The connection modules 213 on both sides are also provided with a fixing connection point 22 and a connection wire connection point 24. The connection wire connection point 24 can be electrically connected to the thermoelectric unit 211 through the electrode layer (25, 35). As an example, the P-type thermoelectric arm and the N-type thermoelectric arm can be connected to the connection wire connection point 24 through the second electrode layer 35.

[0105] In some examples, the thermally conductive adhesive layer (21, 31) may be made of thermally conductive silica gel. The insulating film layer (23, 33) may be made of epoxy resin. The thickness of the insulating film layer (23, 33) may be less than 10 micrometers (μm).

[0106] In some examples, the electrode layer (25, 35) may be a copper electrode with a thickness ranging from 5 to 10 μm. Optionally, a magnetron sputtering layer may be added to the electrode layer (25, 35), and the material of the magnetron sputtering layer may be nickel (Ni) or titanium (Ti).

[0107] In some examples, the N-type thermoelectric arm and the P-type thermoelectric arm may be made of bismuth telluride-based thermoelectric materials. The low thermal conductivity material used to fill the gaps between the thermoelectric arms may be epoxy resin, or a mixture of epoxy resin and glass beads.

[0108] In some examples, the connection module 213 may also be made of low thermal conductivity materials, such as epoxy resin materials or engineering plastics. As an example, the thermal conductivity of the material used in the connection module 213 should generally be less than 1 Watt / (meter·Kelvin) (W / (m·K)), and a typical value is 0.5W / (m·K).

[0109] Fig. 9 yes Figure 8 FIG. 2 is a cross-sectional view of the thermal electron module 210 in the direction 2-2'. Fig. 9 The power generation layer 30 is shown. Fig. 9 As shown, a plurality of P-type thermoelectric arms and a plurality of N-type thermoelectric arms may be provided in the power generation layer 30. As an example, the P-type thermoelectric arms and the N-type thermoelectric arms may be arranged in multiple rows and columns and spaced apart. A low thermal conductivity material is filled between the P-type thermoelectric arms and the N-type thermoelectric arms.

[0110] In the embodiment of the present application, a low thermal conductivity material is filled between the P-type thermoelectric arm and the N-type thermoelectric arm, which can effectively block air convection, reduce heat loss caused by air flow, improve the power generation capacity of the system, and increase the mechanical strength of the thermoelectric module. In addition, each thermoelectric module 210 can be provided with multiple P-type thermoelectric arms and multiple N-type thermoelectric arms, which can increase the power generation power of a single thermoelectric module.

[0111] Fig.10 yes Figure 8FIG. 2 is a cross-sectional view of the thermal electron module 210 in the direction 3-3'. Fig.11 yes Figure 8 A cross-sectional view of the thermal electronic module 210 in the direction 4-4'. Fig.10 The first electrode layer 25 is shown in FIG. Fig.11 The second electrode layer 35 is shown in FIG. In order to facilitate understanding of the solution of the present application, Fig.10 and Fig.11 The power generation layer 30 is also shown. Fig.10 and Fig.11 It can be seen that the P-type thermoelectric arm and the N-type thermoelectric arm in the power generation layer 30 are connected through the first electrode layer 25 and the second electrode layer 35, so that the P-type thermoelectric arm and the N-type thermoelectric arm in the power generation layer 30 are connected in series. The P-type thermoelectric arm and the N-type thermoelectric arm are also connected to the connection wire connection point 24 through the second electrode layer 35.

[0112] It should be understood that Fig.10 and Fig.11 The connection relationship in the figure is only an example. By changing the connection method of the first electrode layer 25 and the second electrode layer 35, the P-type thermoelectric arm and the N-type thermoelectric arm in the power generation layer 30 can also be connected in parallel, or other connection methods can be realized.

[0113] Fig.12 Schematic diagram of a connection method between a thermal electronic module 210 and a connecting member 220 according to an embodiment of the present application. Fig.12 For top view, Fig.12 As shown, adjacent thermal electronic modules 210 can be connected by two connectors 220. The two connectors 220 can be located at the front side and the rear side of the thermal electronic module 210, respectively. The thermal electronic module 210 and the connector 220 can be fixed by a fixing member 230. As an example, the connection module and the connector 220 in the thermal electronic module 210 are both provided with a fixing member connection point, and the fixing member 230 can connect the thermal electronic module 210 and the connector 220 together through the fixing member connection point.

[0114] A connecting wire 221 is further disposed inside the connecting member 220 . The connecting wire 221 is used to connect connecting wire connection points in adjacent thermal electronic modules 210 , thereby achieving electrical connection between the thermal electronic modules 210 .

[0115] By connecting a plurality of thermal electronic modules 210 in series through a connector 220 , a wearable device such as a smart bracelet, a smart watch, etc. can be formed.

[0116] It should be understood that Fig.12The connection method is only used as an example and not a limitation. For example, every two adjacent thermal electronic modules 210 can also be connected in series in both mechanical and electrical dimensions through a connector 220 or more than two connectors 220, as long as the connector 220 can achieve mechanical and electrical connections between the thermal electronic modules 210.

[0117] In the embodiment of the present application, the thermoelectronic module and the connecting member are fixed by a fixing member. Since the connection point of the fixing member is arranged on the connecting module in the thermoelectronic module instead of on the thermoelectric material, it will not occupy the surface area of ​​the thermoelectric material, and can achieve flexible connection between the thermoelectronic modules without affecting the performance of the thermoelectric device.

[0118] Fig.13 2 is a schematic structural diagram of a thermal electron module 210 according to an embodiment of the present application. Fig.13 For top view, Fig.13 As shown, as an example, in a first direction X, the length of the thermoelectric unit 211 can be greater than the length of the connecting modules 213 on both sides, wherein the first direction X is perpendicular to the front surface or the rear surface of the thermoelectric module 210, thereby increasing the surface area of ​​the thermoelectric unit 211 and improving the power generation capacity.

[0119] Fig.14 yes Fig.13 Schematic diagram of the connection between the thermal electronic module 210 and the connecting member 220. Fig.14 As shown, when the length of the thermoelectric unit 211 is greater than the length of the connection modules 213 on both sides, the connection member 220 can be embedded in the recess formed by the above length difference, thereby increasing the firmness of the mechanical connection.

[0120] Fig.15 FIG. 2 is a schematic diagram of a connection method between a thermal electronic module 210 and a connector 220 according to another embodiment of the present application. Fig.15 As shown, the connection module 213 may also include two submodules arranged at the front and rear sides of the thermoelectric unit 211, and the two submodules may form a recess on the side of the thermoelectric module 210 to facilitate embedding of the connection member 220, thereby increasing the firmness of the mechanical connection. In this case, only one connection member 220 may be arranged between every two adjacent thermoelectric modules 210.

[0121] It should be understood that the specific shape of the connection module 213 in the embodiment of the present application is not limited to the above-mentioned examples, and appropriate deformations can be made based on the above-mentioned examples, all of which fall within the protection scope of the present application.

[0122] Optionally, the embodiment of the present application has multiple implementations for the fixing method between the connector and the thermal electronic module. For example, a bolt-nut fixing method or a screw-thread fixing method can be adopted. Alternatively, other fixing methods can also be adopted, which are not limited in the embodiment of the present application.

[0123] Fig.16 It is a schematic diagram of a connection member 220 according to an embodiment of the present application that adopts a bolt-nut fixing method. Fig.16 is a top view, wherein the fixing member 230 may refer to Fig.16 The fixing connection point 22 in the thermal electronic module 210 may refer to Fig.16 The nut in the connector 220 may refer to the fixing member connection point. Fig.16 A hole in the housing is provided to facilitate the passage of the fixing member 230.

[0124] Fig.17 It is a schematic diagram of a connection member 220 according to an embodiment of the present application that adopts a screw-thread fixing method. Fig.17 is a top view, wherein the fixing member may refer to Fig.17 The screws in the thermal electronic module can refer to the connection points of the fixings. Fig.17 The thread in the connector can refer to the fixing point in the connector. Fig.17 holes in the nut to allow the fasteners to pass through.

[0125] Fig.18 4 is a schematic diagram of a wearable device 400 in an extended state according to an embodiment of the present application. Fig.18 For top view, Fig.18 As shown, the wearable device 400 includes a thermal electronic module 210, a connector 220, a circuit module, a battery and a buckle device 260. Multiple thermal electronic modules 210 are connected in series through the connectors 220 at both ends, and are electrically connected to the circuit module and the battery in the wearable device 400 through the connecting wires 221 in the connector 220. Buckle devices 260 may be provided at both ends of the wearable device 400. The buckle device 260 may include a buckle A and a buckle B, so that when the buckle A and the buckle B are buckled, the wearable device 400 is closed into a ring shape to be fixed on the surface of the human body. Optionally, the connector 220 may also be provided between the buckle device 260 and the thermal electronic module 210 to realize the electrical connection and mechanical connection between the buckle device 260 and the thermal electronic module. The specific connection method is similar to the connection method between the connector 220 and the thermal electronic module 210, and will not be repeated here.

[0126] Fig.19 FIG. 4 is a schematic diagram of a wearable device 400 in a closed connection state according to an embodiment of the present application. Fig.19As shown, with the connection point of the fixing member between the connector 220 and the thermal electronic module 210 as the axis, a certain relative rotation angle can be generated between the thermal electronic module 210 and the connector 220. Multiple thermal electronic modules 210 and connectors 220 connected in series can form a wide range of rotation angles, so that the buckle device (buckle A, buckle B) can be closed to form a closed connection state, thereby having the wearing characteristics of a common watchband.

[0127] In the embodiments of the present application, by modularizing the thermal electronic module in the thermoelectric device, the characteristics of local rigidity and overall flexibility can be achieved, better balancing the system reliability and the need for the wearable scenario to closely fit the irregular human body, and taking into account the implementation method of the strap or wristband, the power generation area can be effectively increased, the cold end surface has better heat dissipation characteristics, and the ceramic substrate is removed, which reduces heat loss and can greatly improve the power generation capacity.

[0128] The modular thermoelectric device in the embodiment of the present application can better fit the irregular surface of the human body at the hot end of the thermoelectric device and better achieve air convection at the cold end. The modular feature enables the thermoelectric device to adjust the number of modules in the system according to the differences in human body height characteristics, thereby having relatively high maintainability and wearing comfort.

[0129] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0130] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0131] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0132] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0133] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0134] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A thermal electronic module, characterized in that: The invention comprises a thermoelectric unit, wherein the thermoelectric unit is used to realize the conversion between thermal energy and electrical energy, and the thermoelectric unit comprises: Thermal conductive adhesive layer, insulating film layer and power generation unit; wherein, The power generation unit comprises an electrode layer, a P-type thermoelectric arm and an N-type thermoelectric arm, wherein the P-type thermoelectric arm and the N-type thermoelectric arm are connected in series through the electrode layer; The insulating film layer and the thermally conductive adhesive layer are stacked in sequence on a first surface of the electrode layer, and the first surface is a surface of the electrode layer away from the P-type thermoelectric arm and the N-type thermoelectric arm; The thermal conductive adhesive layer is used to conduct heat energy between the thermoelectric unit and the housing of the thermoelectric module; The thermoelectric module further comprises at least one connection module, wherein the connection module is disposed on at least one side of the thermoelectric unit, and there is an electrical connection between the connection module and the thermoelectric unit.

2. The thermal electronic module according to claim 1, characterized in that A low thermal conductivity material is arranged between the P-type thermoelectric arm and the N-type thermoelectric arm.

3. The thermal electronic module according to claim 1, characterized in that The power generation unit includes at least one P-type thermoelectric arm and at least one N-type thermoelectric arm; wherein the P-type thermoelectric arm and the N-type thermoelectric arm are placed in a vertical direction, the electrode layer is arranged at the upper end and the lower end of the P-type thermoelectric arm and the N-type thermoelectric arm, and the vertical direction is parallel to the intersection line between the front surface and the left side surface of the thermoelectric module.

4. The thermal electron module according to claim 3, characterized in that The P-type thermoelectric arm and the at least one N-type thermoelectric arm are spaced apart from each other.

5. The thermal electron module according to claim 1, characterized in that The housing of the thermal electronic module includes at least one of the following: a metal housing and a ceramic housing.

6. The thermal electron module according to claim 1, characterized in that The upper surface and the lower surface of the thermal electronic module are used to contact a cold source and a heat source respectively, and the at least one connecting module is arranged on the left side or the right side of the thermal electronic module.

7. The thermal electron module according to claim 1, characterized in that The P-type thermoelectric arm and the N-type thermoelectric arm are used to achieve electrical connection with the connection module through the electrode layer.

8. The thermal electron module according to claim 1, characterized in that The length of the thermoelectric unit in a first direction is greater than the length of any one of the connecting modules, the first direction is parallel to the intersection line between the upper surface and the side surface of the thermoelectric module, the upper surface of the thermoelectric module is used to contact a heat source or a cold source, and the side surface of the thermoelectric module is adjacent to other thermoelectric modules.

9. The thermionic module according to any one of claims 1 to 8, characterized in that The connection module is made of a material with low thermal conductivity.

10. A thermoelectric device, characterized in that: The thermoelectric device comprises a plurality of thermoelectric modules according to any one of claims 1 to 9; A plurality of connecting members are provided, wherein the plurality of connecting members are connected to the connecting modules in the plurality of thermal electronic modules to achieve mechanical and electrical connection between the plurality of thermal electronic modules.

11. The thermoelectric device according to claim 10, characterized in that The connecting member is provided with a connecting wire for realizing electrical connection between two adjacent thermal electronic modules.

12. The thermoelectric device according to claim 10, characterized in that Two connecting members are arranged between any two adjacent thermal electronic modules, and the two connecting members are respectively arranged at the front side and the rear side of the two adjacent thermal electronic modules.

13. The thermoelectric device according to any one of claims 10 to 12, characterized in that The connecting member and the thermal electronic module are connected via a fixing member, the fixing member is a nut, and a bolt corresponding to the nut is arranged in the connecting module.

14. The thermoelectric device according to any one of claims 10 to 12, characterized in that The connecting member and the thermal electronic module are connected via a fixing member, the fixing member is a screw, and a thread corresponding to the screw is arranged in the connecting module.

15. A wearable device, characterized in that: The invention comprises a thermoelectric device according to any one of claims 10 to 14 and a functional module, wherein the thermoelectric device is used to supply power to the functional module.

16. The wearable device according to claim 15, characterized in that: The functional module includes a circuit module and / or a battery.

17. The wearable device according to claim 15 or 16, characterized in that: The wearable device also includes a snap-fit ​​device, which is used to connect the multiple thermal electronic modules into a ring shape.

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