Jig for observing attachment state of heat sink and method of using the same
By designing a fixture for observing the attachment status of heat sinks, using track slots to support the lead frame and observing the attachment status during flipping, the problem of the inability to observe the attachment status of heat sinks is solved, the risk of falling to the ground is reduced, and production efficiency and product quality are improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHUHAI GREE XINYUAN ELECTRONICS
- Filing Date
- 2021-06-18
- Publication Date
- 2026-04-24
AI Technical Summary
In existing technologies, the attachment status of heat sinks on lead frames cannot be observed, making it difficult to analyze defects and posing a risk of the lead frames falling to the ground, which affects production efficiency and product quality.
A fixture for observing the attachment status of heat sinks was designed, comprising a base plate, side walls, track slots, and a heat sink observation slot. The track slots support the lead frame to prevent it from falling off, and the attachment status is observed through the heat sink observation slots when flipped.
This enables timely inspection of the heatsink attachment status, reduces the risk of lead frames falling to the ground, and improves product quality and production efficiency.
Smart Images

Figure CN113611631B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of fixture technology, and in particular to a fixture for observing the attachment status of heat sinks and a method for using it. Background Technology
[0002] In semiconductor packaging, the bonding process involves attaching a heat sink to the semiconductor chip along with a leadframe. The heat sink is heated to a high temperature, which makes the resin layer adherent, allowing for pressure bonding between the heat sink and the leadframe. During bonding, the heat sink may be damaged or have foreign matter adhering to it. In traditional operations, the fixture for observing the bonded product is a solid design, making it impossible to observe the bonding status of the heat sink. This leads to uncontrolled monitoring of the heat sink, increasing the difficulty of analyzing defects and hindering timely adjustments, severely impacting production efficiency. Furthermore, there is a risk of the leadframe falling to the ground during the bonding process, resulting in losses.
[0003] In the prior art, patent CN102765066B (LED strip attaching fixture and corresponding LED strip attaching method) proposes an LED strip attaching fixture and a corresponding LED strip attaching method. The LED strip attaching fixture includes a base, a limiting member is disposed on the surface of the base, including a groove structure for fixing the corresponding heat sink; and a strip-shaped pad for cooperating with the groove structure to fix the LED strip on the LED strip fixing part of the heat sink, which can easily realize the linear attachment of the LED strip.
[0004] The aforementioned prior art has the following disadvantages:
[0005] After attaching a heatsink to a semiconductor chip on a leadframe, the attachment status cannot be observed because the heatsink is attached to the back of the leadframe. This increases the difficulty of analyzing heatsink malfunctions and poses a risk of the product slipping and falling off the fixture. Therefore, it is necessary to develop a fixture that allows observation of the heatsink's attachment status on the leadframe. Summary of the Invention
[0006] To overcome the problems existing in related technologies, this application provides a fixture for observing the attachment status of heat sinks. This fixture can check the attachment status of heat sinks in a timely manner, avoid the risk of lead frame falling to the ground, and improve product quality and production efficiency.
[0007] The first aspect of this application provides a fixture for observing the attachment status of heat sinks, comprising:
[0008] Fixture base plate 1 and fixture sidewalls 2 provided on both sides along the length of fixture base plate 1;
[0009] The fixture base plate 1 is provided with a frame placement area, which is used to place the lead frame 4 with the heat sink 3 attached. A heat sink observation slot 5 is provided at the bottom of the frame placement area.
[0010] The jig side wall 2 is provided with a track slot 6, which is used to support the lead frame 4 and prevent the lead frame 4 from falling off when it is flipped.
[0011] In one embodiment, positioning blocks 7 and movable blocks 8 are provided at both ends of the frame placement area along its length.
[0012] In one embodiment, a rotating shaft 81 is provided on the base plate 1 of the fixture;
[0013] The movable stop 8 is connected to the rotating shaft 81.
[0014] In one embodiment, the width of the track slot 6 matches the thickness of the lead frame 4;
[0015] Track slot 6 includes a first track slot and a second track slot;
[0016] The first track slot and the second track slot are on the same horizontal plane.
[0017] In one embodiment, the distance between the first bottom of the first track slot and the second bottom of the second track slot is equal to the width of the lead frame 4;
[0018] The distance between the top of the first slot of the first track slot and the top of the second slot of the second track slot is less than the width of the lead frame 4.
[0019] In one embodiment, a first shock-absorbing rubber 9 is provided in the side wall 2 of the fixture;
[0020] On the fixture base plate 1, the side with the positioning block 7 is the upper surface of the fixture base plate, and a second shock-absorbing rubber 10 is provided on the lower surface of the fixture base plate opposite to the upper surface of the fixture base plate.
[0021] In one embodiment, the first shock-absorbing rubber 9 is disposed in the side wall 2 of the fixture and is located above the track slot 6;
[0022] The second shock-absorbing rubber 10 is disposed on the lower surface of the fixture base plate and embedded in the fixture side wall 2.
[0023] In one embodiment, a fixture slot 11 is provided on at least one side along the width direction of the fixture base plate 1. The fixture slot 11 is used to engage with a material box 12 storing the lead frame 4. The material box 12 has a material box slot 121 for loading the lead frame 4.
[0024] In one embodiment, the width of the heat sink observation slot 5 is greater than the maximum side length of the heat sink 3;
[0025] The length of the heat sink observation slot 5 is greater than or equal to the length of the lead frame 4.
[0026] In one embodiment, the side wall 2 of the fixture is provided with a hollow channel 13, which is used for the movable stop 8 to rotate around the rotating shaft 81.
[0027] The second aspect of this application provides a method for using a fixture for observing the attachment status of heat sinks, including:
[0028] Connect the fixture to the material box where the lead frame is placed;
[0029] Move the lead frame from the material box along the track slot of the fixture into the fixture until the first end of the lead frame reaches the positioning block of the fixture.
[0030] Rotate the movable stop block to a position perpendicular to the side wall of the fixture and abut against the second end of the lead frame;
[0031] Rotate the fixture by a preset angle with the side wall of the fixture as the central axis, and inspect the heat sink through the heat sink observation slot of the fixture.
[0032] In one embodiment, docking the fixture with the hopper containing the lead frame includes:
[0033] The fixture's fixture slot is engaged with the material box, so that the track slot and the material box's tray slot are horizontally connected.
[0034] In one embodiment, moving the lead frame from the material box along the track slot of the fixture into the fixture until the first end of the lead frame reaches the positioning block of the fixture includes:
[0035] Move the lead frame from the feed box slot along the track slot into the fixture until the first end of the lead frame reaches the positioning block of the fixture.
[0036] The technical solution provided in this application may include the following beneficial effects:
[0037] In this embodiment, after the lead frame is placed in the frame placement area of the fixture base plate through the track slot on the side wall of the fixture, the fixture holding the lead frame can be flipped over (due to the support of the track slot, the lead frame will not fall off when flipped). The heat sink observation slot at the bottom of the frame placement area can be used to check the attachment status of the heat sink on the lead frame. Heat sinks with poor attachment status can be checked and adjusted in time, reducing the risk of the lead frame falling to the ground and improving product quality and production efficiency.
[0038] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description
[0039] The above and other objects, features and advantages of this application will become more apparent from the more detailed description of exemplary embodiments thereof in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments thereof.
[0040] Figure 1 This is a frontal global structural schematic diagram of a fixture for observing the attachment state of a heat sink with an assembled lead frame, as shown in an embodiment of this application.
[0041] Figure 2 This is a frontal global structural schematic diagram of a fixture for observing the attachment state of a heat sink without an assembled lead frame, as shown in an embodiment of this application.
[0042] Figure 3 This is a schematic diagram of the back structure of the fixture for observing the attachment state of the heat sink, as shown in an embodiment of this application;
[0043] Figure 4 This is a schematic diagram of a first partial structure of a fixture for observing the attachment state of a heat sink, as shown in an embodiment of this application.
[0044] Figure 5 This is a second partial structural schematic diagram of the fixture for observing the attachment state of the heat sink, as shown in an embodiment of this application;
[0045] Figure 6 This is a schematic diagram of the structure of the fixture for observing the attachment state of the heat sink after docking with the material box, as shown in the embodiments of this application;
[0046] Figure 7 This is a schematic diagram of the third partial structure of the fixture for observing the attachment state of the heat sink, as shown in the embodiments of this application;
[0047] Figure 8 This is a schematic diagram of the movable stop structure of the fixture for observing the attachment state of the heat sink, as shown in an embodiment of this application;
[0048] Figure 9 This is a first flowchart illustrating the method of using a fixture for observing the attachment state of a heat sink, as shown in an embodiment of this application.
[0049] Figure 10 This is a second flowchart illustrating the method of using a fixture for observing the attachment state of a heat sink, as shown in an embodiment of this application. Detailed Implementation
[0050] Preferred embodiments of the present application will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.
[0051] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.
[0052] It should be understood that although the terms "first," "second," "third," etc., may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0053] Example 1
[0054] In semiconductor packaging, the mounting process involves attaching heat sinks to the semiconductor chip on the lead frame. During mounting, the heat sink may be damaged or have foreign matter adhering to it. If these defects cannot be addressed promptly, production efficiency and quality will be severely affected. Furthermore, there is a risk of the lead frame falling off during the mounting process, resulting in losses. Existing technology proposes a light strip mounting fixture and corresponding method for convenient linear mounting of LED light strips. However, this existing technology has drawbacks. After the heat sink is attached to the semiconductor chip on the lead frame, its attachment status cannot be observed because it is attached to the back of the lead frame. This increases the difficulty of analyzing heat sink defects and poses a risk of the product slipping off the fixture. Therefore, there is a need to develop a fixture that allows observation of the heat sink's attachment status on the lead frame.
[0055] To address the aforementioned issues, this application provides a fixture for observing the attachment status of heat sinks. This fixture can promptly check the attachment status of heat sinks and avoid the risk of lead frames falling to the ground, thereby improving product quality and production efficiency.
[0056] The technical solutions of the embodiments of this application are described in detail below with reference to the accompanying drawings.
[0057] Please see Figures 1 to 3 The first embodiment of the fixture for observing the attachment state of the heat sink shown in this application includes:
[0058] The fixture base plate 1 and the fixture sidewalls 2 provided on both sides along the length of the fixture base plate 1.
[0059] The fixture base plate 1 is provided with a frame placement area, which is used to place the lead frame 4 with heat sink 3 attached. A heat sink observation groove 5 is provided at the bottom of the frame placement area. A track slot 6 is provided on the side wall 2 of the fixture, which is used to prevent the lead frame 4 from falling off when it is flipped.
[0060] Understandably, in practical applications, the condition of each structure in the lead frame 4 is checked by placing the lead frame 4 in the frame placement area. This is because if the lead frame 4 is picked up by hand, it is easy to break the fragile solder wires inside the lead frame 4. After flipping the fixture, the adhesion effect of the heat sink 3 attached to the back of the semiconductor chip can be observed through the heat sink observation slot 5. Moreover, due to the support of the track slot 6, the lead frame will not fall to the ground after being flipped.
[0061] The following beneficial effects can be seen from the above embodiment 1:
[0062] In this embodiment, after the lead frame is placed in the frame placement area of the fixture base plate through the track slot on the side wall of the fixture, the fixture holding the lead frame can be flipped over (due to the support of the track slot, the lead frame will not fall off when flipped). The heat sink observation slot at the bottom of the frame placement area can be used to check the attachment status of the heat sink on the lead frame. Heat sinks with poor attachment status can be checked and adjusted in time, reducing the risk of the lead frame falling to the ground and improving product quality and production efficiency.
[0063] Example 2
[0064] To facilitate understanding, the following is an example of a fixture for observing the attachment status of heat sinks. In practical applications, positioning blocks and movable stops are set on the base plate of the fixture to cooperate with the track slots to increase the stability and positioning accuracy of the lead frame during testing. Anti-vibration rubber is also added to reduce vibration during operation and lower the risk of wire breakage.
[0065] Please see Figures 1 to 8 Embodiment two of the fixture for observing the attachment state of the heat sink, as shown in this application, includes:
[0066] Positioning blocks 7 and movable stops 8 are provided at both ends of the frame placement area along its length.
[0067] In this embodiment, a rotating shaft 81 can be provided on the base plate 1 of the fixture. The movable block 8 is connected to the rotating shaft 81 to realize the mobility of the movable block 8. The movement trajectory of the movable block 8 can be either not passing through the base plate 1 of the fixture or passing through the base plate 1 of the fixture, depending on the actual application. There is no single limitation here. If the movement trajectory of the movable block 8 passes through the base plate 1 of the fixture, the movement plane of the movable block 8 is perpendicular to the base plate 1 of the fixture. If the movement trajectory of the movable block 8 does not pass through the base plate 1 of the fixture, the movement plane of the movable block 8 is parallel to the base plate 1 of the fixture. A hollow channel 13 can be provided in the side wall 2 of the fixture. The hollow channel 13 is used for the movable block 8 to pass through when it rotates around the rotating shaft 81. When the lead frame 4 reaches the positioning block 7 through the track slot 6, the movable block 8 rotates around the rotating shaft 81 to a position perpendicular to the side wall 2 of the fixture and abuts against the lead frame. Then, it can work with the positioning block 7 to stabilize the lead frame 4 in the horizontal direction.
[0068] In order for the track slot to support the lead frame 4, the width of the track slot 6 is matched with the thickness of the lead frame 4, so that the lead frame 4 can smoothly enter the track slot 6 and move along the track slot 6. Usually, the width of the track slot 6 is set to be slightly larger than the thickness of the lead frame 4. In practical applications, for example, the difference between the width of the track slot 6 and the thickness of the lead frame 4 can be a value greater than 0 and less than 1 mm. It needs to be set according to the actual application situation, and there is no unique limitation here.
[0069] Since the track slots 6 are provided on both side walls, they can be divided into a first track slot and a second track slot. The first track slot and the second track slot are on the same horizontal plane to avoid deformation or obstruction when the lead frame 4 enters both the first and second track slots simultaneously. The distance between the first bottom of the first track slot and the second bottom of the second track slot is equal to the width of the lead frame 4, allowing the lead frame 4 to fit snugly between the first and second track slots, thus improving stability. The distance between the first top of the first track slot and the second top of the second track slot is less than the width of the lead frame. In this embodiment, the top of the slot refers to the top of the slot wall of the track slot 6. The distance between the first top and the second top of the slot is less than the width of the lead frame, causing a portion of the surface of the slot wall of the track slot 6 to overlap with the length of the lead frame 4. This allows the slot wall of the track slot 6 to support the lead frame 4, preventing it from falling vertically.
[0070] In this embodiment, to reduce vibration during testing, a first anti-vibration rubber 9 is provided in the side wall 2 of the fixture, and the first anti-vibration rubber 9 is located above the track slot 6 on the bottom plate 1 of the fixture. In addition, with the side where the positioning block 7 is provided as the upper surface of the bottom plate of the fixture, a second anti-vibration rubber 10 is provided in the lower surface of the bottom plate of the fixture opposite to the upper surface of the bottom plate of the fixture and is embedded in the side wall 2 of the fixture, thereby reducing the risk of wire breakage during the testing process.
[0071] In this embodiment of the application, in order to improve the smoothness of the lead frame 4 entering the track slot 6, a fixture slot 11 is provided on at least one side along the width direction of the fixture base plate 1. The fixture slot 11 is used to engage the material box 12. The material box loading slot 121 in the material box 12 is loaded with the lead frame 4, so that the material box loading slot 121 and the track slot 6 are on the same horizontal line and are in a horizontal state. Thus, under the condition that the fixture slot 11 and the material box 12 are stably engaged, the material box loading slot 121 and the track slot 6 can be stably connected, and the lead frame 4 can smoothly reach the frame placement area along the track slot 6.
[0072] In this embodiment, in order to maximize the observation of the heat sink's attachment effect, the width of the heat sink observation slot 5 is greater than the maximum side length of the heat sink 3. For example, if the maximum side length of the heat sink 3 is 13mm, the width of the heat sink observation slot 5 can be set to 13.8mm. The length of the heat sink observation slot 5 is greater than or equal to the length of the lead frame 4. For example, if a lead frame 4 contains 5 sets of semiconductor chips with a total length of 270mm, the length of the heat sink observation slot 5 can be set to 270mm or 275mm, so that all heat sinks can be displayed within the visual range through the heat sink observation slot 5, thereby improving the detection effect.
[0073] The following beneficial effects can be seen from the above embodiment two:
[0074] By setting positioning blocks and movable stops on the base plate of the fixture, and using the track slots to fix the lead frame, the stability and positioning accuracy of the lead frame after flipping during testing are increased. Adding first and second anti-vibration rubber reduces vibration during flipping, lowering the risk of wire breakage. The clamping between the fixture and the material box improves the smoothness and stability of the lead frame entering the track slots. During testing, after flipping the fixture containing the lead frame, the heat sink observation slot 5 allows for thorough observation of the heat sink's attachment status. Heat sinks with poor attachment are promptly inspected and adjusted, reducing the risk of the lead frame falling to the ground, improving product quality and production efficiency, and simultaneously reducing the risk of damage to the lead frame during testing, thus enhancing testing stability.
[0075] Example 3
[0076] Corresponding to the aforementioned application structure embodiments, this application also provides a method for using a fixture for observing the attachment status of heat sinks and corresponding embodiments.
[0077] Figure 9 This is a first flowchart illustrating the method of using a fixture for observing the attachment state of a heat sink, as shown in an embodiment of this application.
[0078] Please see Figure 9 Embodiment three of the method for using the fixture for observing the attachment state of the heat sink, as shown in this application, includes:
[0079] 901. Connect the fixture to the material box that holds the lead frame;
[0080] When inspecting the quality of the heatsink attachment, a box containing a lead frame is placed on the inspection table, and a fixture is used to align with the box, with the fixture in a horizontal position.
[0081] In the embodiments of this application, the lead frame refers to the chip carrier of integrated circuits. It is a key structural component that uses bonding materials to realize the electrical connection between the internal circuit leads of the chip and the external leads, forming an electrical circuit. It plays the role of a bridge connecting with external wires. Most semiconductor integrated circuits require the use of lead frames, which are important basic materials in the electronic information industry.
[0082] 902. Move the lead frame from the material box along the track slot of the fixture into the fixture;
[0083] The lead frame is moved from the material box along the track slot of the fixture into the fixture. In practical applications, gripping tweezers are used to move the lead frame smoothly so that the lead frame passes through the track slot until the first end of the lead frame reaches the positioning block of the fixture, thus completing the positioning of the lead frame.
[0084] In this embodiment, the first end of the lead frame is the end at which the lead frame first enters the track slot.
[0085] 903. Rotate the movable stop block to a position perpendicular to the side wall of the fixture and abut against the second end of the lead wire frame;
[0086] In this embodiment, the motion plane of the movable stop is parallel to the base plate of the fixture. The movable stop rotates towards the area where the lead wire frame is placed until it is perpendicular to the side wall of the fixture and abuts against the second end of the lead wire frame. The second end of the lead wire frame refers to the end that is the last to enter the track slot opposite to the first end of the lead wire frame.
[0087] 904. Rotate the fixture by a preset angle with the side wall of the fixture as the central axis.
[0088] Rotate the fixture by a preset angle with the side wall of the fixture as the central axis, and inspect the heat sink through the heat sink observation slot of the fixture. For example, the preset angle can be set between 90° and 180°. It is understood that in actual application, the preset angle can be reasonably set according to the actual application situation for the purpose of better inspection effect. There is no unique limitation here.
[0089] After flipping, the distance between the lead frame and the test table surface is large, preventing the lead frame from contacting the test table surface. This allows for observation of the heat sink condition, and any defects can be detected and rectified promptly.
[0090] The following beneficial effects can be seen from the above embodiment three:
[0091] By aligning the fixture with the material box, the lead frame is moved into the fixture along the track slot and positioned by the positioning block. After rotating the movable stop block to abut against the lead frame, the fixture holding the lead frame is flipped over. The heat sink is inspected through the heat sink observation slot of the fixture to check the adhesion status of the heat sink on the lead frame. Heat sinks with poor adhesion are checked and adjusted in time, which reduces the risk of the lead frame falling to the ground and improves product quality and production efficiency.
[0092] Example 4
[0093] To facilitate understanding, the following is an example of how to use a fixture to observe the attachment status of the heat sink. In practical applications, in order to improve the smoothness and stability of the process of transferring the lead frame from the material box to the fixture, the fixture and the material box are connected by a fixture bayonet to increase stability.
[0094] Figure 10 This is a first flowchart illustrating the method of using a fixture for observing the attachment state of a heat sink, as shown in an embodiment of this application.
[0095] Please see Figure 10 Embodiment four of the method for using the fixture for observing the attachment state of the heat sink, as shown in this application, includes:
[0096] 1001. Connect the fixture's clamp to the material box;
[0097] The purpose of engaging the fixture's clamp with the material box is to increase the relative stability between the fixture and the material box, and to prevent damage to the lead frame caused by relative movement between the fixture and the material box during the movement of the lead frame. At the same time, when the engagement is completed, the track slot and the material box's loading slot are horizontally connected, and the material box loading slot carries the lead frame.
[0098] In this embodiment, the edge of the material box is provided with a slot that matches the fixture slot. When the fixture slot engages with the slot, a locking force is generated, which allows the fixture to be fixed to the edge of the material box. It is understood that in practical applications, there are various methods to fix the fixture to the edge of the material box, and the method of using the fixture slot for engagement is not the only limitation of the method of fixing the fixture to the edge of the material box.
[0099] 1002. Move the lead frame from the material box along the track slot of the fixture into the fixture.
[0100] Move the lead frame from the feed box slot along the track slot into the fixture until the first end of the lead frame reaches the positioning block of the fixture.
[0101] The following beneficial effects can be seen from the above embodiment four:
[0102] The fixture and the material box are connected by a clamping mechanism, which makes the fixture and the material box relatively stable. The track slot is horizontally connected to the material box loading slot of the material box. The lead frame is moved from the material box loading slot along the track slot into the fixture until the first end of the lead frame reaches the positioning block of the fixture. This improves the smoothness and stability of the lead frame moving into the fixture and reduces the risk of damage to the lead frame during the transfer process.
[0103] The solution of this application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of each embodiment have different emphases; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments. Those skilled in the art should also understand that the actions and modules involved in the specification are not necessarily essential to this application. Furthermore, it is understood that the steps in the method of this application embodiment can be adjusted, combined, and deleted according to actual needs, and the modules in the device of this application embodiment can be combined, divided, and deleted according to actual needs.
[0104] Furthermore, the method according to this application can also be implemented as a computer program or computer program product, which includes computer program code instructions for performing some or all of the steps in the method described above.
[0105] Alternatively, this application may be implemented as a non-transitory machine-readable storage medium (or computer-readable storage medium, or machine-readable storage medium) storing executable code (or computer program, or computer instruction code) that, when executed by a processor of an electronic device (or electronic device, server, etc.), causes the processor to perform some or all of the steps of the methods described above according to this application.
[0106] Those skilled in the art will also understand that the various exemplary logic blocks, modules, circuits, and algorithm steps described in connection with the present application can be implemented as electronic hardware, computer software, or a combination of both.
[0107] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems and methods according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.
[0108] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.
Claims
1. A fixture for observing the attachment status of heat sinks, characterized in that, include: The fixture includes a base plate (1) and fixture sidewalls (2) on both sides along the length of the base plate (1); the base plate (1) has a frame placement area for placing a lead frame (4) with a heat sink (3) attached thereto, and a heat sink observation groove (5) is provided at the bottom of the frame placement area; the fixture sidewalls (2) have a track slot (6) for supporting the lead frame (4) and preventing the lead frame (4) from falling off when flipped. Positioning blocks (7) and movable blocks (8) are provided at both ends of the frame placement area along its length; a rotating shaft (81) is provided on the base plate (1) of the fixture; the movable block (8) is connected to the rotating shaft (81); A fixture slot (11) is provided on at least one side along the width direction of the fixture base plate (1). The fixture slot (11) is used to engage with the material box (12) storing the lead frame (4). The material box (12) has a material box slot (121) for loading the lead frame (4).
2. The fixture for observing the attachment state of heat sinks according to claim 1, characterized in that, The width of the track slot (6) matches the thickness of the lead frame (4); the track slot (6) includes a first track slot and a second track slot; the first track slot and the second track slot are on the same horizontal plane.
3. The fixture for observing the attachment state of heat sinks according to claim 2, characterized in that, The distance between the first bottom of the first track slot and the second bottom of the second track slot is equal to the width of the lead frame (4); the distance between the first top of the first track slot and the second top of the second track slot is less than the width of the lead frame (4).
4. The fixture for observing the attachment state of heat sinks according to claim 1, characterized in that, The jig sidewall (2) is provided with a first shock-absorbing rubber (9); on the jig base plate (1), the side where the positioning block (7) is provided is the upper surface of the jig base plate, and a second shock-absorbing rubber (10) is provided on the lower surface of the jig base plate opposite to the upper surface of the jig base plate.
5. The fixture for observing the attachment state of heat sinks according to claim 4, characterized in that, The first shock-absorbing rubber (9) is disposed in the side wall (2) of the fixture and is located above the track slot (6); the second shock-absorbing rubber (10) is disposed on the lower surface of the bottom plate of the fixture and is embedded in the side wall (2) of the fixture.
6. The fixture for observing the attachment state of heat sinks according to claim 1, characterized in that, The width of the heat sink observation slot (5) is greater than the maximum side length of the heat sink (3); the length of the heat sink observation slot (5) is greater than or equal to the length of the lead frame (4).
7. The fixture for observing the attachment state of heat sinks according to claim 1, characterized in that, The fixture has a hollow channel (13) in its side wall (2), which is used for the movable stop (8) to rotate through the rotating shaft (81) as the center.
8. A method for using a fixture for observing the attachment status of heat sinks, characterized in that, A fixture for observing the attachment status of a heat sink as described in any one of claims 1 to 7, comprising the following steps: docking the fixture with a material box for placing a lead frame; moving the lead frame from the material box along the track slot of the fixture into the fixture until the first end of the lead frame reaches the positioning block of the fixture; rotating the movable stop block to a position perpendicular to the side wall of the fixture and abutting against the second end of the lead frame; rotating the fixture by a preset angle with the side wall of the fixture as the central axis, and inspecting the heat sink through the heat sink observation slot of the fixture.
9. The method of using the fixture for observing the attachment state of heat sinks according to claim 8, characterized in that, The process of connecting the fixture to the material box for placing the lead frame includes: engaging the fixture slot of the fixture with the material box, so that the track slot is horizontally connected to the material box slot of the material box.
10. The method of using the fixture for observing the attachment state of heat sinks according to claim 9, characterized in that, The step of moving the lead frame from the material box along the track groove of the fixture into the fixture until the first end of the lead frame reaches the positioning block of the fixture includes: translating the lead frame from the material box's loading slot along the track groove into the fixture until the first end of the lead frame reaches the positioning block of the fixture.
Citation Information
Patent Citations
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