Mounting configuration for optoelectronic components in lidar systems

Abstract

A laser radar system includes: a first optical lens, and one or more first optoelectronic packages spaced apart from the first optical lens along an optical axis of the first optical lens. Each corresponding first optoelectronic package includes a first plurality of optoelectronic components positioned on the corresponding first optoelectronic package, such that a surface of each corresponding optoelectronic component is substantially located on a first optimal focusing surface. The laser radar system also includes a second optical lens, and one or more second optoelectronic packages spaced apart from the second optical lens along an optical axis of the second optical lens. Each corresponding second optoelectronic package includes a second plurality of optoelectronic components positioned on the corresponding second optoelectronic package, such that a surface of each corresponding optoelectronic component is substantially located on a second optimal focusing surface.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit of and priority to U.S. Provisional Application No. 62 / 823,406, filed on March 25, 2019, entitled “Mounting Configuration for Optoelectronic Components in a LiDAR System,” the entire contents of which are incorporated herein by reference for all purposes. Background Art

[0003] Three-dimensional sensors can be used in autonomous vehicles, drones, robots, security applications, and more. Scanning laser radar (LiDAR) sensors can achieve high angular resolution suitable for such applications at an affordable cost. LiDAR sensors can include optoelectronic components, such as a light source for emitting a laser beam and a detector for detecting the reflected laser beam. Improved mounting configurations for optoelectronic components in LiDAR sensors are needed. Summary of the Invention

[0004] According to some embodiments, the lidar system includes a first optical lens characterized by a first optical axis, a first lens center, and a first optimal focusing surface, and includes one or more first optoelectronic packages spaced apart from the first optical lens along the first optical axis. Each corresponding first optoelectronic package includes a first plurality of optoelectronic components positioned on the corresponding first optoelectronic package such that a surface of each corresponding optoelectronic component in the first plurality of optoelectronic components is substantially located on the first optimal focusing surface. The lidar system also includes a second optical lens characterized by a second optical axis, a second lens center, and a second optimal focusing surface, and also includes one or more second optoelectronic packages spaced apart from the second optical lens along the second optical axis. Each corresponding second optoelectronic package includes a second plurality of optoelectronic components positioned on the corresponding second optoelectronic package such that a surface of each corresponding optoelectronic component in the second plurality of optoelectronic components is substantially located on the second optimal focusing surface.

[0005] According to some embodiments, an optoelectronic package for a laser radar system is provided. The laser radar system includes an optical lens characterized by an optical axis, a lens center, and a best focus surface. The optoelectronic package includes a substrate spaced apart from the optical lens along the optical axis and a plurality of optoelectronic components positioned on the substrate such that a surface of each respective optoelectronic component is substantially located on the best focus surface of the optical lens.

[0006] According to some embodiments, an optoelectronic package for a laser radar system is provided. The laser radar system includes an optical lens characterized by an optical axis, a lens center, and a best focus surface. The optoelectronic package includes a substrate spaced apart from the optical lens along the optical axis and a plurality of optoelectronic components positioned on the substrate such that each respective optoelectronic component is oriented substantially toward the lens center. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 A lidar sensor for three-dimensional imaging according to some embodiments is schematically illustrated.

[0008] Figure 2 An exemplary lidar system is schematically illustrated in accordance with some embodiments.

[0009] Figure 3 A scanning lidar system is schematically illustrated in accordance with some embodiments.

[0010] Figure 4 A schematic cross-sectional view is shown of a mounting configuration for optoelectronic components in a scanning lidar system that may account for lens field curvature, according to some embodiments.

[0011] Figure 5 Schematic cross-sectional views of mounting configurations for optoelectronic components in a scanning lidar system are shown according to some other embodiments.

[0012] Figure 6 Schematic cross-sectional views of mounting configurations for optoelectronic components in a scanning lidar system are shown according to some other embodiments.

[0013] Figure 7 Schematic cross-sectional views of mounting configurations for optoelectronic components in a scanning lidar system are shown according to some further embodiments.

[0014] Figure 8 Schematic cross-sectional views of mounting configurations for optoelectronic components in a scanning lidar system are shown according to some other embodiments.

[0015] Figure 9 Schematic cross-sectional views of mounting configurations for optoelectronic components in a scanning lidar system are shown according to some other embodiments.

[0016] Figure 10 Schematic cross-sectional views of mounting configurations for optoelectronic components in a scanning lidar system are shown according to some other embodiments.

[0017] Figure 11 Schematic cross-sectional views of mounting configurations for optoelectronic components in a scanning lidar system are shown according to some other embodiments.

[0018] Figure 12 Schematic cross-sectional views of mounting configurations for optoelectronic components in a scanning lidar system are shown according to some other embodiments.

[0019] Figure 13A schematic top view of a mounting configuration for optoelectronic components in a scanning lidar system is shown according to some other embodiments.

[0020] Figure 14 Shown as Figure 13 Schematic perspective view of a platform with multiple light sources and multiple detectors mounted thereon is shown in .

[0021] Figure 15A A cross-sectional view of an optoelectronic package for a lidar system is shown, according to some embodiments.

[0022] Figure 15B Shown Figure 15A A perspective view of the optoelectronic package shown in FIG.

[0023] Figure 16 A perspective view of an optoelectronic package for a lidar system is shown, according to some embodiments.

[0024] Figure 17A A schematic cross-sectional view of a surface mount device (SMD) package is shown in accordance with some embodiments.

[0025] Figure 17B Shown Figure 17A End view of the SMD package shown in .

[0026] Figure 18A An end view of an SMD package is shown in accordance with some embodiments.

[0027] Figure 18B An end view of an SMD package is shown in accordance with some embodiments.

[0028] Figure 19 The underside of an SMD package according to some embodiments is shown.

[0029] Figure 20 An SMD package according to some embodiments is shown.

[0030] Figure 21A An exemplary two-dimensional electro-optical array for a lidar system is shown, in accordance with some embodiments.

[0031] Figure 21B A two-dimensional optoelectronic array is shown in accordance with some embodiments.

[0032] Figure 22A and Figure 22B A cross-sectional view and a perspective view, respectively, are shown of an exemplary two-dimensional optoelectronic array for a lidar system according to some embodiments.

[0033] Figure 23 A two-dimensional optoelectronic array is shown in accordance with some embodiments.

[0034] Figure 24A and Figure 24B Shown are schematic end views of some exemplary SMD packages that may be used in a two-dimensional optoelectronic array according to some embodiments. DETAILED DESCRIPTION

[0035] A lidar system may include an array of light sources (e.g., multiple light sources) for emitting light beams that may be projected onto a target scene through a transmitting lens. Some form of scanning mechanism may be used to scan the light beams across the target scene. The lidar system may include a receiving lens for collecting return light beams reflected from the target scene and focusing them onto a detector array. In some embodiments, the light sources may be mounted at different distances from the transmitting lens so as to minimize field curvature from the transmitting lens. Alternatively or additionally, each light source may be oriented so that it points substantially toward the center of the transmitting lens to more optimally project the light beam. Similarly, the detectors may also be mounted at various distances from the receiving lens and oriented so that the normal of the detection surface of each detector points substantially toward the center of the receiving lens. In mass production, low-cost and precise automated placement of light sources and detectors is required.

[0036] In some embodiments, an array of two or more light sources and / or detectors is placed into a surface mount device (SMD) package. The SMD package can be designed to be directly soldered to a printed circuit board (PCB). The light sources and / or detectors can be positioned at different heights in the SMD package to mitigate the effects of field curvature of the transmitting lens or the receiving lens. Alternatively or additionally, the light sources and / or detectors can be oriented so that they are substantially pointed toward the center of the transmitting lens or the receiving lens.

[0037] Figure 1 A lidar sensor 100 for three-dimensional imaging according to some embodiments is schematically shown. The lidar sensor 100 includes a transmitting lens 130 and a receiving lens 140. The lidar sensor 100 includes a light source 110a disposed substantially in the back focal plane of the transmitting lens 130. The light source 110a is operable to transmit laser pulses 120 from corresponding transmit positions in the back focal plane of the transmitting lens 130. The transmitting lens 130 is configured to collimate and direct the laser pulses 120 toward an object 150 located in front of the lidar sensor 100. For a given transmit position of the light source 110a, the collimated laser pulses 120′ are directed toward the object 150 at a corresponding angle.

[0038] A portion of the collimated laser pulse 120' may be reflected from the object 150 toward the receiving lens 140. The receiving lens 140 is configured to focus the portion 122 of the laser pulse reflected from the object 150 onto a corresponding detection position in the focal plane of the receiving lens 140. The lidar sensor 100 also includes a detector 160a disposed substantially at the focal plane of the receiving lens 140. The detector 160a is configured to receive and detect the portion 122 of the laser pulse 120 reflected from the object 150 at the corresponding detection position. The corresponding detection position of the detector 160a is optically conjugate with the corresponding emission position of the light source 110a.

[0039] Laser pulse 120 may have a short duration, such as a 10 ns pulse width. LiDAR sensor 100 further includes a processor 190 coupled to light source 110a and detector 160a. Processor 190 is configured to determine a time of flight (TOF) from emission to detection of laser pulse 120. Because laser pulse 120 travels at the speed of light, the distance between LiDAR sensor 100 and object 150 may be determined based on the determined time of flight.

[0040] One way to scan the laser beam 120' across the FOV is to move the light source 110a laterally relative to the transmitting lens 130 in the back focal plane of the transmitting lens 130. For example, Figure 1 As shown, the light source 110a can be raster scanned to multiple emission positions in the back focal plane of the emission lens 130. The light source 110a can emit multiple laser pulses at the multiple emission positions. Each laser pulse emitted at the corresponding emission position is collimated by the emission lens 130 and directed at a corresponding angle toward the object 150, and impinges at a corresponding point on the surface of the object 150. Therefore, when the light source 110a is raster scanned within a specific area in the back focal plane of the emission lens 130, the corresponding object area on the object 150 is scanned. The detector 160a can be raster scanned to be positioned at multiple corresponding detection positions in the focal plane of the receiving lens 140, as shown. Figure 1 The scanning of the detector 160a can be performed synchronously with the scanning of the light source 110a, so that the detector 160a and the light source 110a are always optically conjugate to each other at any given time. Other scanning patterns (such as Lissajous Pattern) are also possible.

[0041] By determining the time of flight of each laser pulse emitted at the corresponding emission position, the distance from the lidar sensor 100 to each corresponding point on the surface of the object 150 can be determined. In some embodiments, the processor 190 is coupled to a position encoder that detects the position of the light source 110a at each emission position. Based on the emission position, the angle of the collimated laser pulse 120' can be determined. Based on the angle and the distance to the lidar sensor 100, the XY coordinates of the corresponding point on the surface of the object 150 can be determined. Thus, a three-dimensional image of the object 150 can be constructed based on the measured distances from the lidar sensor 100 to each point on the surface of the object 150. In some embodiments, the three-dimensional image can be represented as a point cloud, that is, a collection of X, Y, and Z coordinates of points on the surface of the object 150.

[0042] In some embodiments, the intensity of the return laser pulse 122 is measured and used to adjust the power of subsequent laser pulses from the same emission point to prevent detector saturation, improve eye safety, or reduce overall power consumption. The power of the laser pulse can be varied by changing the duration of the laser pulse, the voltage or current applied to the laser, or the charge stored in the capacitor used to power the laser. In the latter case, the charge stored in the capacitor can be varied by changing the charging time, charging voltage, or charging current of the capacitor. In some embodiments, intensity can also be used to add another dimension to the image. For example, the image can contain X, Y, and Z coordinates as well as reflectivity (or brightness).

[0043] The Angular Field of View (AFOV) of the LiDAR sensor 100 can be estimated based on the scanning range of the light source 110a and the focal length of the transmitting lens 130 as follows:

[0044]

[0045] Wherein, h is the scanning range of the light source 110a along a specific direction, and f is the focal length of the transmitting lens 130. For a given scanning range h, a shorter focal length will produce a wider AFOV. For a given focal length f, a larger scanning range will produce a wider AFOV. In some embodiments, the lidar sensor 100 may include a plurality of light sources arranged in an array at the back focal plane of the transmitting lens 130, so that a larger total AFOV can be achieved while keeping the scanning range of each individual light source relatively small. Therefore, the lidar sensor 100 may include a plurality of detectors arranged in an array at the focal plane of the receiving lens 140, each detector being conjugated to a corresponding light source. For example, the lidar sensor 100 may include a second light source 110b and a second detector 160b, such as Figure 1. In other embodiments, the lidar sensor 100 may include four light sources and four detectors, or eight light sources and eight detectors. In one embodiment, the lidar sensor 100 may include eight light sources arranged in a 4×2 array and eight detectors arranged in a 4×2 array, so that the lidar sensor 100 may have an AFOV in the horizontal direction that is wider than its AFOV in the vertical direction. According to various embodiments, depending on the focal length of the transmitting lens, the scanning range of each light source, and the number of light sources, the total AFOV of the lidar sensor 100 may be in a range from about 5 degrees to about 15 degrees, or from about 15 degrees to about 45 degrees, or from about 45 degrees to about 120 degrees.

[0046] The light source 110a can be configured to emit laser pulses in the ultraviolet, visible, or near-infrared wavelength range. The energy of each laser pulse can be on the order of microjoules, which is generally considered eye-safe for repetition rates in the kHz range. For light sources operating at wavelengths greater than about 1500 nm, the energy level can be higher because the eye does not focus on those wavelengths. The detector 160a can include a silicon avalanche photodiode, a photomultiplier tube, a PIN diode, or other semiconductor sensor.

[0047] The angular resolution of the lidar sensor 100 may be effectively diffraction limited, which may be estimated as,

[0048] θ=1.22λ / D,

[0049] Where λ is the wavelength of the laser pulse and D is the diameter of the lens aperture. The angular resolution may also depend on the size of the emission area of ​​the light source 110a and the aberrations of the lenses 130 and 140. According to various embodiments, the angular resolution of the lidar sensor 100 may be in the range of about 1 mrad to about 20 mrad (about 0.05 degrees to 1.0 degrees), depending on the type of lens.

[0050] Figure 2 An exemplary lidar system 200 is schematically shown. Lidar system 200 may include two lenses—a transmitting lens 230 and a receiving lens 240. Each of transmitting lens 230 and receiving lens 240 may be a composite lens including multiple lens elements. Transmitting lens 230 and receiving lens 240 may be mounted in a lens mount 220. Lens mount 220 with transmitting lens 230 and receiving lens 240 attached may be referred to herein as a lens assembly.

[0051] The lidar system 200 may also include one or more light sources 210 (e.g., multiple light sources) and one or more detectors 260 (e.g., Figure 22. The four light sources 210 and four detectors 260 are shown in FIG. 2. The light sources 210 can be mounted on the photovoltaic panel 250 and positioned behind the transmitting lens 230 (e.g., in the focal plane of the transmitting lens 230). The detectors 260 can be mounted on the photovoltaic panel 250 and positioned behind the receiving lens 240 (e.g., in the focal plane of the receiving lens 240). The photovoltaic panel 250 with the light sources 210 and detectors 260 mounted thereon may be referred to herein as a photovoltaic assembly.

[0052] As referenced above Figure 1 As discussed, each corresponding light source 210a and the corresponding detector 260a are positioned on the photoelectric panel 250 so that the position of each corresponding light source 210a is optically conjugate with the position of the corresponding detector 260a. Therefore, the light beam emitted by the corresponding light source 210a can be projected or collimated by the transmitting lens 230 and reflected from an object in front of the lidar system 200; and the reflected light beam can be focused by the receiving lens 240 onto the corresponding detector 260a.

[0053] In some embodiments, the lens assembly can be flexibly attached to the base 202 via a pair of flexures 270a and 270b, such as Figure 2 As shown. One end of each of the pair of flexible members 270a and 270b is attached to the base 202, and the other end is attached to the lens assembly 220. The pair of flexible members 270a and 270b can be coupled to an actuator 204 (also referred to herein as a drive mechanism), such as a voice coil motor. The actuator 204 can be controlled by the controller 206 to deflect the pair of flexible members 270a and 270b to the left or right like a parallelogram, thereby causing the lens assembly 220 to be oriented as shown. Figure 2 Transmit lens 230 is moved left or right as indicated by the double-sided arrow in FIG. Lateral movement of transmit lens 230 causes the laser beam emitted by light source 210 to be scanned across the FOV in front of lidar system 200. When the entire lens assembly 220, including transmit lens 230 and receive lens 240, is moved as a single unit, the optical conjugate relationship between light source 210 and detector 260 is maintained while scanning lens assembly 220.

[0054] Although Figure 2 Two rod-shaped flexures 270a and 270b are shown for moving the lens assembly 220, but other flexure mechanisms or steps may be used. For example, springs, air bearings, etc. may be used. In some embodiments, the drive mechanism 204 may include a voice coil motor (VCM), a piezoelectric actuator, etc. At high scanning frequencies, the pair of flexures 270a and 270b and the drive mechanism 204 may operate at or near their resonant frequency to minimize power requirements.

[0055] Scanning can be achieved by other means. For example, the lens assembly can be fixed, and the photoelectric panel 250 can be scanned relative to the lens assembly (e.g., via a set of flexible members). In some embodiments, scanning can be implemented using a rotating platform including the transmitting lens 230, the receiving lens 240, the light source 210, and the detector 260. Alternatively, a rotating polygonal mirror or one or more oscillating mirrors can be used.

[0056] The lidar system 200 may include a plurality of light sources 210 and a plurality of detectors 260. The plurality of light sources 210 may be arranged in a one-dimensional array or a two-dimensional array (for example, in the case of a two-dimensional array, there may be one or more rows offset from each other in a direction perpendicular to the paper). Similarly, the plurality of detectors 260 may also be arranged in a one-dimensional array or a two-dimensional array.

[0057] Figure 3 Schematically illustrates a scanning lidar system 300 according to some embodiments. Figure 2 , lidar system 300 also includes two lenses—a first lens 330 and a second lens 340. First lens 330 and second lens 340 can be mounted in lens mount 320. First lens 330 has a first optical axis 332, and second lens 340 has a second optical axis 342 that is substantially parallel to first optical axis 332. Lidar system 300 also includes a plurality of light sources 310 and a plurality of detectors 360. The plurality of light sources 310 and the plurality of detectors 360 can be mounted on a photovoltaic panel 350.

[0058] Here, instead of Figure 2 Instead of placing all light sources 310 behind one lens and all detectors 360 behind another lens, as in the lidar system 200 shown in FIG, the first group of light sources 310a and the first group of detectors 360a are positioned in the focal plane of the first lens 330, and the second group of light sources 310b and the second group of detectors 360b are positioned in the focal plane of the second lens 340. The first group of light sources 310a and the first group of detectors 360a behind the first lens 330 can be referred to as a first transceiver array. Similarly, the second group of light sources 310b and the second group of detectors 360b behind the second lens 340 can be referred to as a second transceiver array. Thus, each of the first lens 330 and the second lens 340 functions as both a transmitting lens and a receiving lens. Therefore, the first lens 330 and the second lens 340 can be referred to as transceiver lenses.

[0059] Each corresponding detector 360b of the second group of detectors 360b is located at a corresponding detector position on the focal plane of the second lens 340 that is optically conjugate with the corresponding position of the corresponding light source 310a in the first group of light sources 310a on the focal plane of the first lens 330, so that the corresponding detector 360b in the second group of detectors 360b detects light emitted by the corresponding light source 310a in the first group of light sources 310a and detected by one or more objects ( Figure 3 The light beam reflected by (not shown).

[0060] Similarly, each corresponding detector 360a of the first group of detectors 360a is located at a corresponding detector position on the focal plane of the first lens 330 that is optically conjugate with the corresponding position of the corresponding light source 310b in the second group of light sources 310b on the focal plane of the second lens 340, so that the corresponding detector 360a in the first group of detectors 360a detects the light beam emitted by the corresponding light source 310b in the second group of light sources 310b and reflected by one or more objects.

[0061] In accordance with some embodiments, multiple light sources and / or multiple detectors can be mounted on a platform in a configuration that takes into account the field curvature of the lens. Field curvature, also known as "field curvature" or "Petzval curvature," describes the optical aberration that prevents a flat object perpendicular to the optical axis from being properly focused in the plane of a flat image. Consider a single-element lens system, for which all plane wavefronts are focused to a point at a distance f from the lens, where f is the focal length of the lens. Placing the lens at a distance f from a planar image sensor, image points close to the optical axis can be in perfect focus, but off-axis rays may be focused before the image sensor. This may not be a problem when the imaging surface is spherical. Although modern lens designs, such as those utilizing multiple lens elements, can minimize field curvature (or "flatten the field") to some extent, some residual field curvature may still exist.

[0062] In the presence of field curvature of the lens, if the plurality of light sources 210 are mounted on a flat surface, e.g. Figure 2 As shown in , laser pulses emitted by light source 210 that are positioned away from the optical axis may not be perfectly collimated by emission lens 230 due to the field curvature of emission lens 230. Similarly, if multiple detectors 260 are mounted on a flat surface, such as Figure 2 As shown in , due to the field curvature of the receiving lens 240 , the laser pulse reflected from the object may not be perfectly focused by the receiving lens 240 at the detector located far away from the optical axis.

[0063] Figure 4A schematic cross-sectional view of a mounting configuration for optoelectronic components in a scanning lidar system that can account for lens field curvature, according to some embodiments, is shown. An optical lens 410 can be mounted on a lens holder 420. Lens 410 is characterized by an optical axis 412 passing through a lens center 414 and a best focus surface 416 located at a distance f from lens 410, where f is the focal length of lens 410. Best focus surface 416 can be curved due to field curvature as described above and can be referred to as the curved "focal plane" of lens 410. Multiple light sources 430 can be mounted on a surface 442 of a platform 440, which is positioned approximately at a distance f from lens 410 along optical axis 412. In some embodiments, surface 442 of platform 440 can have a curved shape that substantially matches best focus surface 416 of lens 410, such that an emitting surface 432 of each of the multiple light sources 430 can be located approximately at best focus surface 416 of lens 410. By mounting multiple light sources 430 in this configuration, the laser pulses emitted by each light source 430 can be nearly perfectly collimated by the lens 410 even if the light source 430 is positioned outside the optical axis 412 .

[0064] For example, assuming that the best focusing surface 416 of the lens 410 has a spherical shape, the surface 442 of the platform 440 can be configured to have a spherical shape so that the emission surface 432 of each light source 430 can be substantially located on the best focusing surface 416 of the lens 410. In the case where the best focusing surface 416 of the lens 410 has a curved shape other than a spherical shape (e.g., an elliptical shape, a conical shape, or a wavy shape), the surface 442 of the platform 440 can be shaped accordingly.

[0065] Similarly, Figure 4 The plurality of light sources 430 shown in FIG4 may be replaced by a plurality of detectors such that a detection surface 432 of each of the plurality of detectors 430 may be substantially located at the best focusing surface 416 of the lens 410. In this configuration, laser pulses reflected from an object may be nearly perfectly focused by the lens 410 at the detection surface 432 of each detector 430 even if the detectors 430 are positioned outside the optical axis 412 of the lens 410.

[0066] In some embodiments, multiple light sources and multiple detectors can share the same lens. The detector can be placed next to its corresponding laser so that some return light is intercepted by the detector. The position can be on the side of the laser, in front of the laser, or behind the laser. Because the laser beam typically has a narrow angular distribution and only utilizes the central portion of the lens, certain lens aberrations (such as spherical aberration) can be used to advantageously guide some return light from the outside of the lens to the detector without excessively interfering with the focusing properties of the outgoing laser beam. In an alternative design, a beam splitter can be used to separate the outgoing and incoming beams. This can allow the laser and detector to share the conjugate point of the lens without physically overlapping in space.

[0067] Figure 5 Schematic cross-sectional views of mounting configurations for optoelectronic components in a scanning lidar system according to some other embodiments are shown. Here, a platform 540 can have a flat surface 542, and a plurality of light sources (or detectors) 430 can be mounted on the flat surface 542 of the platform 540. The plurality of light sources 430 can have varying heights h depending on their positions relative to the optical axis 412 of the lens 410, such that the emitting surface 432 of each respective light source 430 can be substantially located on the optimal focus surface 416 of the lens 410. For example, for a spherical optimal focus surface 416, light sources 430 that are further away from the optical axis 412 can have a higher height than light sources 430 that are closer to the optical axis 412, as shown in FIG. Figure 5 , so as to account for the curvature of the best focusing surface 416. As an example, each light source 430 (or detector die) can be placed in a corresponding surface mount package that places the die at a corresponding height h above the bottom of the package. The corresponding height h can vary depending on the position of the light source 430 (or detector die) relative to the optical axis 412. The package is then soldered to a printed circuit board that is placed and positioned so that each die is correctly positioned at the image point of the lens 410.

[0068] Figure 6 A schematic cross-sectional view of a mounting configuration for optoelectronic components in a scanning lidar system according to some other embodiments is shown. Here, multiple light sources (or detectors) 430 may have substantially the same height h. However, the platform 640 may have a surface 642 with a stepped profile so that the emitting surface 432 of each corresponding light source 430 may be substantially located on the optimal focusing surface 416 of the lens 410.

[0069] In some embodiments, the light source and detector may be mounted in a configuration that also takes into account possible distortion and vignetting of the lens. Figure 7 Schematic cross-sectional view of a mounting arrangement for optoelectronic components in a scanning lidar system according to some further embodiments is shown. Figure 4 In the mounting configuration shown in FIG, multiple light sources (or detectors) 430 can be mounted on a curved surface 442 of a platform 440 such that the emitting surface 432 of each light source 430 is substantially located at the optimal focus surface 416 of the lens 410. Furthermore, the multiple light sources 430 are tilted at varying angles such that the normal to the emitting surface 432 of each light source 430 can be directed substantially toward the lens center 414. In this configuration, laser pulses emitted by the light sources 430 and positioned away from the optical axis 412 can be collimated by the lens 410 with minimal distortion and vignetting. It should be understood that the term "lens center" can refer to the optical center of the lens 410. In cases where the lens 410 can be characterized as a thin lens, the lens center 414 can be the geometric center of the lens 410. Some composite lenses can be partially telecentric, in which case the preferred orientation perpendicular to the laser emission or detector surface can be directed not toward the geometric center of the lens, but toward the optical center of the lens, which is typically at an angle closer to the optical axis of the lens.

[0070] In some embodiments, the plurality of detectors may be mounted on a flat surface of the platform 440. In other embodiments, the plurality of detectors may be mounted on a curved surface 442 of the platform 440 such that the detection surface of each detector is substantially directed toward the lens center 414. Thus, image rays may impinge on the detector substantially perpendicular to the detection surface of the detector, thereby achieving optimal detection efficiency.

[0071] Figure 8 A schematic cross-sectional view of a mounting configuration for optoelectronic components in a scanning lidar system according to some other embodiments is shown. Here, platform 840 can have a surface 842 that includes a plurality of facets having different orientations such that the normal of each facet 844 points substantially toward lens center 414 of lens 410. Each of the plurality of light sources can include a surface emitting laser, such as a vertical-cavity surface-emitting laser (VCSEL), or a side-emitting laser mounted in a package in an orientation such that its light is emitted vertically relative to the package.

[0072] Figure 9 A schematic cross-sectional view of a mounting configuration for optoelectronic components in a scanning lidar system according to some other embodiments is shown. Here, a plurality of light sources 930 are mounted on a platform 940 having a flat surface 942. The plurality of light sources 930 can have varying heights h and varying surface tilt angles, depending on the position of each respective light source 930 relative to the optical axis 412, such that the normal of the emitting surface 932 of each respective light source 930 is substantially directed toward the lens center 414.

[0073] Figure 10 A schematic cross-sectional view of a mounting configuration for optoelectronic components in a scanning lidar system according to some other embodiments is shown. Here, a plurality of light sources 1030 are mounted on a platform 1040 having a substantially flat surface 1042. The plurality of light sources 1030 may have substantially the same height H but varying surface tilt angles, depending on the position of each respective light source 1030 relative to the optical axis 412 of the lens, such that the normal of the emitting surface 432 of each respective light source 1030 is directed substantially toward the lens center 414. As shown, the emitting surface 1032 of each respective light source 1030 may be substantially located at the focal plane 1016 of the lens 410.

[0074] Figure 11 A schematic cross-sectional view of a mounting configuration for optoelectronic components in a scanning lidar system according to some other embodiments is shown. Here, a plurality of light sources 1130 are mounted on a platform 1040 having a substantially flat surface 1042. Each of the plurality of light sources 1130 can be tilted at a respective tilt angle such that the normal of the emitting surface 1132 of each respective light source 1130 is directed substantially toward the lens center 414. As shown, the emitting surface 1132 of each respective light source 1130 can be positioned substantially at the focal plane 1016 of the lens 410.

[0075] Figure 12 A schematic cross-sectional view of a mounting configuration for optoelectronic components in a scanning lidar system according to some other embodiments is shown. The lidar system may include a first lens 1210 and a second lens 1220. The first lens 1210 has a lens center 1214 and is characterized by a first optimal focus surface 1216 and a first optical axis 1212 along a first direction. The second lens 1220 has a lens center 1224 and is characterized by a second optimal focus surface 1226 and a second optical axis 1222 substantially parallel to the first optical axis 1212.

[0076] The lidar system may also include a plurality of surface-emitting light sources 1230 and a plurality of detectors 1240 mounted on a platform 1250. In some embodiments, platform 1250 is a printed circuit board. Platform 1250 is spaced apart from first lens 1210 and second lens 1220 along a first direction. In some embodiments, platform 1250 may have a surface 1252 (extending substantially perpendicular to the paper (i.e., the Z direction)), which includes a plurality of first facets 1254. Each surface-emitting light source 1230 may be mounted on a corresponding first facet 1254. The plurality of first facets 1254 may be positioned and oriented such that the emitting surface 1232 of each corresponding light source 1230 is substantially located at the first optimal focus surface 1216 of first lens 1210, and its normal is substantially directed toward the lens center 1214 of first lens 1210. Surface 1252 of platform 1250 may further include a plurality of second facets 1256. Each detector 1240 may be mounted on a corresponding second facet 1256. The plurality of second facets 1256 may be positioned such that the detection surface 1242 of each corresponding detector 1240 is located at a corresponding position on the second optimal focus surface 1226 of the second lens 1220 that is optically conjugate with the corresponding position of the corresponding light source 1230. The plurality of second facets 1256 may be oriented such that the normal of the detection surface 1242 may be substantially directed toward the lens center 1224 of the second lens 1220.

[0077] Figure 13 A schematic top view of a mounting configuration for optoelectronic components in a scanning lidar system according to some other embodiments is shown. Here, a platform 1350 (e.g., a printed circuit board) can have a flat surface 1352 in the XY plane (i.e., the plane of the paper) and an edge surface 1354 extending in the Z direction (i.e., in a direction perpendicular to the paper). Figure 14 Shown as Figure 13, a schematic perspective view of a platform 1350 having a plurality of light sources 1230 and a plurality of detectors 1240 mounted thereon is shown in FIG. Each of the plurality of edge-emitting light sources 1330 may include an edge-emitting light source. The plurality of light sources 1330 may be arranged on a flat surface 1352 of the platform 1350 as an array along an arc such that the emitting surface 1332 of each respective light source 1330 is substantially located at the best focus surface 1216 of the first lens 1210, and its normal is substantially directed toward the lens center 1214 of the first lens 1210. The edge surface 1354 of the platform 1350 may include a plurality of facets 1356. Each detector 1240 may be mounted on a respective facet 1356 of the edge surface 1354. The plurality of facets 1356 may be positioned such that the detection surface 1242 of each respective detector 1240 is located at a respective position on the best focus surface 1226 of the second lens 1220 that is conjugate to the respective position of the corresponding light source 1330. The plurality of second facets 1356 may be oriented such that a normal to the detection surface 1242 may point substantially toward the lens center 1224 of the second lens 1220 .

[0078] In the mass production of LiDAR systems, it can be time consuming to precisely place the individual light sources and detectors in the desired positions and orientations. Therefore, there is a need for low-cost and precise automated placement of light sources and detectors. In some embodiments, an array of light sources and / or detectors is placed into a surface-mount device (SMD) package. The SMD package can be designed to be soldered directly onto a printed circuit board (PCB). The light sources and / or detectors can be located at different heights in the SMD package to mitigate the effects of the field curvature of the transmitting lens or receiving lens, and can also be oriented so that they point substantially toward the center of the transmitting lens or receiving lens, as described above with reference to FIG. Figure 4-14 discussed.

[0079] Figure 15A A cross-sectional view of an optoelectronic package 1510 for a lidar system is shown, according to some embodiments. Figure 15B A perspective view of an optoelectronic package 1510 is shown. Figure 15A , the laser radar system includes an optical lens 1502. For example, the optical lens 1502 may be Figure 1 The transmitting lens 130 or receiving lens 140 in the laser radar system 100 shown in FIG. The optical lens 1502 is characterized by an optical axis 1508, a lens center 1506 and a best focus surface 1504. It should be noted that although Figure 15AA single element optical lens is shown in FIG, but the optical lens 1502 may include a composite lens that includes multiple optical elements. For a thick lens or a composite lens, the term "lens center" may refer to the principal point of the optical lens 1502. The term "best focus surface" may refer to the "focal plane" of the optical lens 1502. The "focal plane" may be curved due to field curvature. It should be noted that although the best focus surface 1504 is Figure 15A 1504 is shown as a substantially spherical surface, but the best focus surface 1504 can have a shape other than a spherical shape. For example, for a compound lens, the best focus surface 1504 can have a complex or irregular shape.

[0080] The optoelectronic package 1510 may include a substrate 1520 spaced apart from the optical lens 1502 along an optical axis 1508, and a plurality of optoelectronic components 1530 embedded therein. The plurality of optoelectronic components 1530 may be positioned at a specific height on the substrate 1520 such that a surface 1532 of each respective optoelectronic component 1530 is located on the optimal focus surface 1504 of the optical lens 1502. Each optoelectronic component 1530 may be a light source or a detector. By positioning the optoelectronic components 1530 in this configuration, the effects of field curvature of the optical lens 1502 may be mitigated. For example, if the optoelectronic component 1530 is a light source, a laser beam emitted by the light source may be relatively well collimated by the optical lens 1502, even if the light source is positioned outside the optical axis 1508 of the optical lens 1502. Similarly, if the optoelectronic component 1530 is a detector, a return beam may be relatively well focused by the optical lens 1502 onto the surface 1532 of the detector. Alternatively or additionally, a plurality of optoelectronic components 1530 can be positioned on substrate 1520 in a particular orientation such that each optoelectronic component 1530 is substantially pointed toward lens center 1506. In the case of a partially or fully telecentric lens, the angle from the laser (or detector) to the effective lens center can be different than the angle from the lens to the object.

[0081] Note that in Figure 15A Four optoelectronic components 1530 are shown in the optoelectronic package 1510 shown in FIG. Figure 15B Five optoelectronic components 1530 are shown in the optoelectronic package 1510 shown in FIG. The number of optoelectronic components 1530 in the optoelectronic package 1510 can be changed to a fewer number or a greater number depending on the needs and design of the lidar system.

[0082] In some embodiments, the plurality of optoelectronic components 1530 may include a plurality of light sources. In this case, the optical lens 1502 may be used as an emission lens, for example Figure 1100 in the laser radar system 100 shown in FIG. In some embodiments, the plurality of optoelectronic components 1530 may include a plurality of detectors. In this case, the optical lens 1502 may be used as a receiving lens, for example Figure 1 The receiving lens 140 in the lidar system 100 shown in FIG.

[0083] In some embodiments, the plurality of optoelectronic components 1530 may include one or more light sources and one or more detectors, similar to Figure 3 15. In this case, optoelectronic package 1510 may be referred to as a transceiver package.

[0084] Figure 16 16. A perspective view of an optoelectronic package 1610 for a laser radar system according to some embodiments is shown. The optoelectronic package 1610 includes a substrate 1620 including a first surface 1622 and a second surface 1624 opposite the first surface 1622 (in FIG. Figure 16 The optoelectronic package 1610 includes a plurality of light sources 1630 mounted on a first surface 1622 of a substrate 1620 and a plurality of detectors 1640 mounted on a second surface 1624 of the substrate.

[0085] An optoelectronic package 1610 that includes both the light source 1630 and the detector 1640 in the same package can provide several advantages. For example, it can allow for more precise alignment between the light source 1630 and the detector 1640. Additionally, a higher packing density of the light sources 1630 and the detector 1640 can be achieved. Furthermore, by spreading the light sources 1630 and the detector 1640, the light sources 1630 can be effectively dispersed over a larger area, which can allow for higher total optical power levels without exceeding eye safety limits.

[0086] In some embodiments, optoelectronic package 1510 can be configured as a surface mount device (SMD) package. For example, wire bonding, conductive epoxy, or solder can be used to electrically connect each optoelectronic component 1530 (e.g., a laser or detector) to the SMD package. The metal traces in the SMD package are then connected to metal pads or contact pins on the bottom of the package, which allow the SMD to be soldered to a printed circuit board (PCB) 1540.

[0087] Figure 17A A schematic cross-sectional view of an SMD package 1700 is shown in accordance with some embodiments. Figure 17BAn end view of an SMD package 1700 is shown. The SMD package 1700 includes a substrate 1720 and a plurality of optoelectronic components 1730 (e.g., light sources and / or detectors) positioned at specific heights and orientations on the substrate 1720, as described above. In some embodiments, the optoelectronic components 1730 may include semiconductor chips.

[0088] The bottom of substrate 1720 may have solder pads 1734 formed thereon. Each optoelectronic component 1730 may have wire bonds 1732 electrically connected to solder pads 1734 via vias 1739 extending through substrate 1720. SMD package 1700 may be attached to PCB 1740. The top surface of PCB 1740 may have solder pads 1736 formed thereon, corresponding to solder pads 1734 at the bottom of substrate 1720. Thus, SMD package 1700 may be mechanically and electrically coupled to PCB 1740 via solder 1738 between solder pads 1736 on the bottom of substrate 1720 and solder pads 1736 on the top of PCB 1740. SMD package 1700 may be designed to be soldered to the surface of PCB 1740 using automated pick-and-place robots and wave soldering techniques for high-volume manufacturing.

[0089] The SMD package 1700 can be encapsulated by a clear sealant 1750 (e.g., epoxy, plastic, etc.). The sealant 1750 can cover the top and sides of the SMD package 1700. The sealant 1750 can protect the optoelectronic component 1730 from environmental influences. In some embodiments, the area above the optoelectronic component 1730 can be covered with a protective glass plate, or can be unprotected so that the light source can emit light from the SMD package 1700 and the detector can receive the light into the SMD package 1700. In some embodiments, the SMD package 1700 can also include a lens to help collimate the laser beam or shape the laser beam (e.g., to make them more geometrically symmetrical). In some embodiments, the SMD package 1700 can also include a filter, for example, to block sunlight and other unwanted light from interfering with the detector.

[0090] Figure 18AAn end view of an SMD package 1800 according to some embodiments is shown. The SMD package can include a transceiver package that includes a plurality of light sources 1830 (e.g., arranged in an array in a direction perpendicular to the page) and a plurality of detectors 1840 (e.g., arranged in an array in a direction perpendicular to the page). The light sources 1830 and the detectors 1840 can be mounted on the top surface of a substrate 1820. In some embodiments, the height of each light source can be different from the height of each detector. In this case, the top surface of the substrate can be stepped so that the top surface of each light source and the top surface of each detector can be located on the same plane (e.g., the best focusing surface) of the transceiver lens.

[0091] Figure 18B An end view of an SMD package 1850 is shown in accordance with some embodiments. Figure 18A The light sources 1830 may be positioned such that the top surface of each light source 1830 and the top surface of each detector 1840 may be located on the same plane (eg, the best focus surface) of the transceiver lens.

[0092] Figure 19 The underside of an SMD package 1900 is shown in accordance with some embodiments. The SMD package 1900 includes solder pads 1936 on its bottom surface for soldering to a PCB. The SMD package 1900 may include a clear plastic or glass cover 1950 covering the optoelectronic components.

[0093] Figure 20 An SMD package 2000 according to some embodiments is shown. Here, the SMD package includes metal wires 2036 for soldering to a printed circuit board instead of pads.

[0094] In some LiDAR implementations, a two-dimensional array of light sources and a two-dimensional array of detectors may be used. According to some embodiments, multiple SMD packages (each including a one-dimensional array of optoelectronic components) may be arranged on a PCB to form a two-dimensional array.

[0095] Figure 21A An exemplary two-dimensional optoelectronic array 2100 for a lidar system according to some embodiments is shown. The optoelectronic array 2100 includes a plurality of SMD packages 2110 attached to a PCB 2140. Each SMD package 2110 includes a one-dimensional array of optoelectronic components 2130 (e.g., light sources or detectors, or a combination of light sources and detectors), similar to Figure 15B. The PCB 2140 is curved (e.g., like a cylindrical surface) so that all optoelectronic components 2130 of the different SMD packages 2110 can have their surfaces located on the best focusing surface of the optical lens 2102 and / or substantially pointed toward the lens center 2106. In some embodiments, the PCB 2140 can include a flexible PCB.

[0096] Figure 21B A two-dimensional optoelectronic array 2100 is shown where each SMD package 2110 includes a clear encapsulant 2150 covering an optoelectronic component 2130 .

[0097] Figure 22A and Figure 22B 21 , the two-dimensional optoelectronic array 2200 includes a plurality of SMD packages 2110. Each SMD package 2110 includes a one-dimensional array of optoelectronic components 2130 (e.g., light sources or detectors, or a combination of light sources and detectors), similar to FIG. Figure 15B . Here, multiple SMD packages 2110 are soldered to an insert 2220. The insert 2220 has multiple facets 2222. Each corresponding SMD package 2110 is mounted on a corresponding facet 2222. The multiple facets 2222 are manufactured at specific heights and angles so that all optoelectronic components 2130 of different SMD packages 2110 can have their surfaces located on the optimal focusing surface of the optical lens 2102 and / or substantially point toward the lens center 2106. The insert 2220 can then be soldered to a PCB 2240 (e.g., a planar PCB). The insert 2220 may include metal pads with electrical interconnects (not shown) to electrically couple the SMD packages 2110 to the PCB 2240. Other electrical connection methods, such as wire bonding and conductive epoxy, may also be used. Alternatively, the insert 2220 may be attached to the PCB 2240 first, and then the SMD packages 2110 may be attached to the insert 2220.

[0098] Figure 23 A two-dimensional optoelectronic array 2300 is shown according to some embodiments. The two-dimensional optoelectronic array 2300 is similar to Figures 22A-22B . Here, the interposer 2300 has stepped facets 2322. Each SMD package 2110 includes a clear encapsulant 2150 covering the optoelectronic components 2130. Each SMD package 2110 may include a substrate having an inclined surface inclined at a desired angle so that all optoelectronic components 2130 of different SMD packages 2110 can be substantially oriented toward the lens center 2106.

[0099] Figure 24A and 24B Schematic end views of some exemplary SMD packages 2410 and 2420 that can be used in the two-dimensional optoelectronic array 2300 according to some embodiments are shown. Each of the SMD packages 2410 and 2420 can include a one-dimensional array of optoelectronic components 2402 mounted on a substrate 2412 or 2422 (the array of optoelectronic components 2402 is distributed along a direction perpendicular to the page). Each of the substrates 2412 and 2422 has an inclined surface 2414 or 2424. The surface inclination angle α can vary depending on the position of the SMD package 2410 or 2420 relative to the optical axis. For example, the SMD package 2410 positioned closer to the optical axis can have an angle of 2414 or 2424. Figure 24A The relatively small tilt angle α shown in FIG, while the SMD package 2420 positioned further away from the optical axis can have a tilt angle as shown in FIG. Figure 24B The relatively large tilt angle α shown in FIG. The SMD package 2410 or 2420 may be covered with a transparent cover 2404 and may include pads 2406 and 2408 on a chip base 2412 or 2422. According to some embodiments, the height h of the substrate 2412 or 2422 may be the same. For example, Figure 23 As shown in , the height of the optoelectronic component 2130 in each corresponding SMD package 2110 can be correctly set by the height of the corresponding facet 2322. In some embodiments, the height h of the substrate 2412 or 2422 can vary depending on the position of the SMD package 2410 or 2420 relative to the optical axis. For example, the SMD packages 2410 and 2420 can be directly soldered to Figure 23 2240 , without the need for an interposer 2300 . The height of the optoelectronic component 2130 in each SMD package 2110 can be correctly set by the height h of the substrate 2412 or 2422 of the corresponding SMD package 2410 or 2420 .

[0100] It should also be understood that the examples and embodiments described herein are for illustrative purposes only, and that various modifications or changes based on these examples and embodiments will be suggested to those skilled in the art, and that various modifications or changes will be included within the spirit and scope of the present application and the appended claims.

Claims

1. A laser radar system comprising: a first optical lens characterized by a first optical axis, a first lens center, and a first best focus surface; a first optoelectronic package, the first optoelectronic package being spaced apart from the first optical lens along the first optical axis, the first optoelectronic package comprising a first plurality of optoelectronic components, the first plurality of optoelectronic components comprising a plurality of light sources and a plurality of detectors, the first plurality of optoelectronic components being positioned on a first substrate; a printed circuit board, wherein the printed circuit board is curved, and the first optoelectronic package is mounted on the printed circuit board; A second optoelectronic package is mounted on the printed circuit board, the second optoelectronic package comprising: a second substrate spaced apart from the first optical lens along the first optical axis; and a second plurality of optoelectronic components, the second plurality of optoelectronic components comprising a plurality of light sources and a plurality of detectors, the second plurality of optoelectronic components being positioned on the second substrate, wherein surfaces of respective optoelectronic components of the second plurality of optoelectronic components are substantially located on the first best focus surface; an interposer for mounting the first optoelectronic package on the printed circuit board, wherein: the interposer comprising a plurality of facets, the first optoelectronic package and the second optoelectronic package being mounted on respective facets, the plurality of facets being manufactured at specific heights and angles such that the interposer mounts the first optoelectronic package at a height different from the height at which the second optoelectronic package is mounted from the printed circuit board, such that a surface of a respective optoelectronic component of the first plurality of optoelectronic components is substantially located on the first best focus surface; and The first best focusing surface is curved; a second optical lens characterized by a second optical axis, a second lens center, and a second best focus surface; and a third optoelectronic package, the third optoelectronic package being spaced apart from the second optical lens along the second optical axis, the third optoelectronic package comprising a third plurality of optoelectronic components, the third plurality of optoelectronic components comprising a plurality of light sources and a plurality of detectors, the third plurality of optoelectronic components being positioned on a third substrate such that a surface of each respective optoelectronic component in the third plurality of optoelectronic components is substantially located on the second optimal focus surface, wherein the second optimal focus surface is curved.

2. The laser radar system according to claim 1, wherein: the first plurality of optoelectronic components being positioned on the first optoelectronic package such that each respective optoelectronic component of the first plurality of optoelectronic components is oriented substantially toward the first lens center; and The second plurality of optoelectronic components are positioned on the second optoelectronic package such that each respective optoelectronic component in the second plurality of optoelectronic components is oriented substantially toward the second lens center.

3. The laser radar system according to claim 1, wherein: The first optoelectronic package includes a first surface mount device package, and the second optoelectronic package includes a second surface mount device.

4. The laser radar system according to claim 3, wherein the printed circuit board is a first printed circuit board, and the laser radar system further comprises: A second printed circuit board, wherein the first optoelectronic package is mechanically and electrically coupled to the first printed circuit board, and the second optoelectronic package is mechanically and electrically coupled to the second printed circuit board.

5. The laser radar system according to claim 4, wherein: The first printed circuit board has a first curved surface on which the first optoelectronic package is mounted, and the second printed circuit board has a second curved surface on which the second optoelectronic package is mounted.

6. The laser radar system according to claim 3, wherein: The second optoelectronic package is mechanically and electrically coupled to the printed circuit board.

7. The laser radar system according to claim 3, wherein: The first optoelectronic package is one of a plurality of first optoelectronic packages, and the second optoelectronic package is one of a plurality of second optoelectronic packages, the lidar system further comprising: a first interposer having a first plurality of facets, wherein the plurality of first optoelectronic packages are mounted on the first interposer, each respective first optoelectronic package being disposed on a respective facet of the first plurality of facets; and A second interposer having a second plurality of facets, wherein the plurality of second optoelectronic packages are mounted on the second interposer, each respective second optoelectronic package being disposed on a respective facet of the second plurality of facets.

8. A laser radar system, comprising: an optical lens characterized by an optical axis, a lens center, and a best focus surface; a printed circuit board, wherein the printed circuit board is curved; as well as A first optoelectronic package is mounted on the printed circuit board, the first optoelectronic package comprising: a first substrate spaced apart from the optical lens along the optical axis; and a first plurality of optoelectronic components, the first plurality of optoelectronic components comprising a plurality of light sources and a plurality of detectors, the first plurality of optoelectronic components being positioned on the first substrate; A second optoelectronic package is mounted on the printed circuit board, the second optoelectronic package comprising: a second substrate spaced apart from the optical lens along the optical axis; and a second plurality of optoelectronic components, the second plurality of optoelectronic components comprising a plurality of light sources and a plurality of detectors, the second plurality of optoelectronic components being positioned on the second substrate, wherein a surface of each respective optoelectronic component in the second plurality of optoelectronic components is substantially located on the best focus surface of the optical lens; and an interposer for mounting the first optoelectronic package on the printed circuit board, wherein: the interposer comprising a plurality of facets, the first optoelectronic package and the second optoelectronic package being mounted on respective facets, the plurality of facets being manufactured at specific heights and angles such that the interposer mounts the first optoelectronic package at a different height from the printed circuit board than the second optoelectronic package is mounted from the printed circuit board such that a surface of a respective optoelectronic component of the first plurality of optoelectronic components is substantially located on the best focus surface; and The best focus surface is curved.

9. The laser radar system according to claim 8, wherein: Each respective optoelectronic component of the first plurality of optoelectronic components is positioned on the first substrate such that the respective optoelectronic component of the first plurality of optoelectronic components is oriented substantially toward a center of a lens.

10. The lidar system of claim 8, wherein the optoelectronic package is configured as a surface mount device package for mechanically and electrically coupling to the printed circuit board.

11. The laser radar system according to claim 8, wherein: The first plurality of optoelectronic components includes a plurality of light sources or a plurality of detectors.

12. The laser radar system according to claim 8, wherein: The first plurality of optoelectronic components includes a set of light sources and a set of detectors.

13. The laser radar system according to claim 8, wherein: The first substrate has a surface characterized by a plurality of facets, each respective optoelectronic component of the first plurality of optoelectronic components being positioned on a respective facet of the plurality of facets.

14. The laser radar system according to claim 8, further comprising: The interposer mounts the second optoelectronic package on the printed circuit board.

15. The laser radar system according to claim 8, wherein: The first optoelectronic package is soldered to the interposer.

16. The laser radar system according to claim 8, wherein: The interposer includes metal pads for electrical interconnection.

17. A laser radar system, comprising: an optical lens characterized by an optical axis, a lens center, and a best focus surface; a printed circuit board PCB, wherein the printed circuit board is curved; A first optoelectronic package is mounted on the printed circuit board, the first optoelectronic package comprising: a first substrate spaced apart from the optical lens along the optical axis; and a first plurality of optoelectronic components, the first plurality of optoelectronic components comprising a plurality of light sources and a plurality of detectors, the first plurality of optoelectronic components being positioned on the first substrate; A second optoelectronic package is mounted on the printed circuit board, the second optoelectronic package comprising: a second substrate spaced apart from the optical lens along the optical axis; and a second plurality of optoelectronic components, the second plurality of optoelectronic components comprising a plurality of light sources and a plurality of detectors positioned on the second substrate, wherein a surface of each respective optoelectronic component of the second plurality of optoelectronic components is substantially located on the best focus surface of the optical lens; and an interposer for mounting the first optoelectronic package on the printed circuit board, wherein: the interposer comprising a plurality of facets, the first optoelectronic package and the second optoelectronic package being mounted on respective facets, the plurality of facets being manufactured at specific heights and angles such that the interposer mounts the first optoelectronic package at a different height from the printed circuit board than the second optoelectronic package is mounted from the printed circuit board such that a surface of a respective optoelectronic component of the first plurality of optoelectronic components is substantially located on the best focus surface; and The best focus surface is curved.

18. The laser radar system according to claim 17, wherein: The first optoelectronic package is configured as a surface mount device package for mechanical and electrical coupling to a printed circuit board.

19. The laser radar system according to claim 17, wherein: The first substrate has a top surface and a side surface, and wherein the plurality of light sources are disposed on the side surface, and the plurality of detectors are disposed on the top surface.

20. The laser radar system according to claim 17, further comprising: The interposer mounts the second optoelectronic package on the printed circuit board.

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