Antenna package and image display device

Abstract

According to an embodiment of the present invention, an antenna package and an image display device are provided. The antenna package includes an antenna unit and a circuit board electrically connected to the antenna unit. The circuit board includes: a core layer; signal transmission wirings provided on one surface of the core layer, one end of the signal transmission wirings being connected to the antenna unit; a ground layer provided on the opposite surface of the core layer opposite to the one surface; and a first via structure formed through the core layer and provided around the one end of the signal transmission wirings to be in contact with the ground layer.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10 - 2020 - 0054546, filed on May 7, 2020, with the Korean Intellectual Property Office (KIPO), the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] The present invention relates to an antenna package and an image display device. More particularly, the present invention relates to an antenna package including an antenna device and a circuit board, and an image display device including the antenna package. Background Art

[0004] With the development of information technology, wireless communication technologies such as Wi - Fi and Bluetooth are combined with image display devices in the form of smart phones. In this case, an antenna can be combined with the image display device to provide a communication function.

[0005] With the rapid development of mobile communication technology, an antenna capable of performing high - frequency or ultra - high - frequency communication is required in an image display device.

[0006] However, as the driving frequency of the antenna increases, signal loss may also increase. In addition, as the length of the transmission path increases, the degree of signal loss may further increase.

[0007] In addition, when using an intermediate circuit structure such as a flexible printed circuit board (FPCB) to electrically connect a driving integrated circuit chip and an antenna for antenna feeding / driving control, additional signal loss and signal interference may occur.

[0008] For example, the radiation and impedance characteristics generated by the radiation electrodes and / or pads included in the antenna may be interfered with by the wirings or electrode patterns included in the FPCB, or signal loss may also be caused due to contact resistance.

[0009] Therefore, an antenna design that stably realizes radiation in a desired high - frequency band without being affected by an intermediate circuit structure is required. For example, Korean Patent Application Publication No. 2013 - 0095451 discloses an antenna integrated with a display panel. Summary of the Invention

[0010] According to one aspect of the present invention, an antenna package having improved operation reliability and signal efficiency is provided.

[0011] According to one aspect of the present invention, an image display device including an antenna package having improved operation reliability and signal efficiency is provided.

[0012] (1) An antenna package, comprising: an antenna unit; and a circuit board electrically connected to the antenna unit, the circuit board including: a core layer; signal transmission wirings provided on one surface of the core layer, one end of the signal transmission wirings being connected to the antenna unit; a ground layer provided on the opposite surface of the core layer opposite to the one surface; and a first via structure formed through the core layer and provided around the one end of the signal transmission wirings to contact the ground layer.

[0013] (2) The antenna package according to (1) above, wherein the circuit board further includes a bonding pattern provided around the one end of the signal transmission wirings on the one surface of the core layer.

[0014] (3) The antenna package according to (2) above, wherein the first via structure contacts the bonding pattern and the ground layer.

[0015] (4) The antenna package according to (2) above, wherein the antenna unit includes a plurality of antenna units provided in the width direction, and the signal transmission wirings include a plurality of signal transmission wirings, and each signal transmission wiring is connected to each antenna unit.

[0016] (5) The antenna package according to (4) above, wherein the bonding pattern includes a plurality of bonding patterns provided at intervals from the signal transmission wirings along the width direction, and the first via structure includes a plurality of first via structures contacting the bonding patterns, and the plurality of first via structures are provided along the width direction to form a first row of vias.

[0017] (6) The antenna package according to (2) above, wherein the antenna unit includes a radiation pattern, a transmission line extending from the radiation pattern, a signal pad formed at the end of the transmission line, and an antenna ground pad provided around the signal pad, and the signal transmission wiring is electrically connected to the signal pad, and the bonding pattern is electrically connected to the antenna ground pad.

[0018] (7) The antenna package according to (1) above, wherein the circuit board further includes a second via structure provided around the signal transmission wirings, and the second via structure is formed through the core layer to contact the ground layer.

[0019] (8) The antenna package according to (7) above, wherein the second via structure is provided along the extending direction of the signal transmission wirings to form a second column of vias, and wherein the signal transmission wirings include a plurality of signal transmission wirings, and the second column of vias is provided between the plurality of signal transmission wirings.

[0020] (9) The antenna package according to (1) above, wherein the circuit board further includes a ground pattern provided around the opposite end of the signal transmission wirings on the one surface of the core layer.

[0021] (10) The antenna package according to (9) above, wherein the circuit board further includes a third via structure that passes through the core layer to contact the ground pattern and the ground layer.

[0022] (11) The antenna package according to (10) above, wherein the third via structure includes a plurality of third via structures that are arranged along the extension direction of the signal transmission wiring or the ground pattern to form a third via column.

[0023] (12) The antenna package according to (11) above, wherein the third via column includes a plurality of third via columns, and the signal transmission wiring includes a plurality of signal transmission wirings, and the plurality of third via columns are arranged between the plurality of signal transmission wirings.

[0024] (13) The antenna package according to (1) above, further including an antenna driving integrated circuit (IC) chip that is electrically connected to the opposite end of the signal transmission wiring.

[0025] (14) The antenna package according to (13) above, further including an intermediate circuit board that is disposed between the opposite end of the signal transmission wiring and the antenna driving IC chip.

[0026] (15) The antenna package according to (14) above, wherein the circuit board includes a flexible printed circuit board (FPCB), and the intermediate circuit board includes a rigid printed circuit board.

[0027] (16) An image display device including the antenna package according to the above embodiment.

[0028] In an antenna package including an antenna device and a circuit board, the circuit board may include a ground layer and signal transmission wiring that face and overlap each other. Therefore, the dielectric characteristics of the signal transmission wiring can be uniformly maintained. In addition, the generation of an electric field around the signal transmission wiring can be promoted by the ground layer, thereby improving the feeding / signal transmission efficiency for the antenna unit.

[0029] In an exemplary embodiment, a via structure that connects the antenna bonding pattern and the ground layer of the circuit board to each other may be formed. The noise absorption / blocking efficiency and the generation of an electric field can be further promoted by the via structure in the bonding area, thereby suppressing signal / feeding loss and improving the antenna signal / radiation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 and Figure 2 are a schematic top plan view and a schematic cross-sectional view showing an antenna package according to an exemplary embodiment, respectively.

[0031] Figure 3is a schematic top plan view showing an antenna package according to an exemplary embodiment.

[0032] Figure 4 and Figure 5 is a schematic top plan view showing an antenna package according to an exemplary embodiment.

[0033] Figure 6 is a schematic top plan view showing an image display device according to an exemplary embodiment. Detailed Description

[0034] According to an exemplary embodiment of the present invention, there is provided an antenna package including an antenna unit and a circuit board that may include signal transmission wirings and a ground layer. In addition, there is provided an image display device including the antenna package.

[0035] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. However, those skilled in the art should understand that these embodiments described with reference to the accompanying drawings are for further understanding the spirit of the present invention and are not intended to limit the subject matter to be protected disclosed in the detailed description and the appended claims.

[0036] The terms "first", "second", "upper", "lower", "top", "bottom", etc. used in the present application do not represent absolute positions but are used to relatively distinguish different elements and positions.

[0037] Figure 1 and Figure 2 are respectively a schematic top plan view and a schematic cross-sectional view showing an antenna package according to an exemplary embodiment.

[0038] Referring to Figure 1 and Figure 2 , the antenna package may include an antenna device 100 and a circuit board 200. The circuit board 200 may include a core layer 230, a circuit wiring layer 210, and a ground layer 250, and the circuit wiring layer 210 and the antenna unit included in the antenna device 100 may be electrically connected to each other.

[0039] The antenna device 100 may include an antenna dielectric layer 110 and an antenna electrode layer 120 disposed on the antenna dielectric layer 110.

[0040] The antenna dielectric layer 110 may include, for example, a transparent resin film, such as polyester resins, such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulose resins, such as diacetyl cellulose and triacetyl cellulose; polycarbonate resins; acrylic resins, such as poly(methyl)methacrylate and poly(ethyl)methacrylate; styrene resins, such as polystyrene and acrylonitrile-styrene copolymer; polyolefin resins, such as polyethylene, polypropylene, cycloolefin, or polyolefin having a norbornene structure, and ethylene-propylene copolymer; vinyl chloride resins; amide resins, such as nylon and aromatic polyamide; imide resins; polyethersulfone resins; sulfone resins; polyetheretherketone resins; polyphenylene sulfide resins; vinyl alcohol resins; vinylidene chloride resins; vinyl butyral resins; allylated resins; polyoxymethylene resins; epoxy resins; urethane or acrylic urethane resins; silicone resins, etc. They may be used alone or in combination of two or more.

[0041] The antenna dielectric layer 110 may contain an adhesive material such as an optically clear adhesive (OCA), an optically clear resin (OCR), etc. In some embodiments, the antenna dielectric layer 110 may include an inorganic insulating material such as glass, silicon oxide, silicon nitride, silicon oxynitride, etc.

[0042] In some embodiments, the dielectric constant of the antenna dielectric layer 110 may be adjusted to a range of about 1.5 to about 12. When the dielectric constant exceeds about 12, the driving frequency may be excessively reduced, so that the driving at a desired high frequency band or ultra-high frequency band may not be achieved.

[0043] The antenna electrode layer 120 may be formed on one surface of the antenna dielectric layer 110. As Figure 2 shown, the antenna electrode layer 120 may include an antenna unit having a radiation pattern 122.

[0044] In an exemplary embodiment, the antenna unit may include an antenna pattern or radiator capable of radiating in a high frequency band or ultra-high frequency band of 3G, 4G, 5G, or higher.

[0045] The antenna unit may further include a transmission line 124, a signal pad 126, and an antenna ground pad 125. The radiation pattern 122 may have, for example, a polygonal flat shape, and the transmission line 124 may extend from one side of the radiation pattern 122 to be electrically connected to the signal pad 126. The transmission line 124 may be formed as a single member substantially integral with the radiation pattern 122.

[0046] The signal pad 126 may be connected to the end of the transmission line 124. The signal pad 126 may be provided as a member substantially integral with the transmission line 124, and this end of the transmission line 124 may serve as the signal pad 126.

[0047] In an exemplary embodiment, a pair of antenna ground pads 125 may face each other with the transmission line 124 or the signal pad 126 interposed therebetween. The antenna ground pads 125 may be electrically and physically separated from the transmission line 124 and the signal pad 126.

[0048] In an exemplary embodiment, vertical radiation (e.g., radiation in the thickness direction of the antenna device 100) may be substantially achieved through the radiation pattern 122. Additionally, the antenna ground pads 125 may face each other and may be close to the radiation pattern 122, such that horizontal radiation may be achieved through the antenna ground pads 125.

[0049] The antenna unit may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals. They may be used alone or in combination.

[0050] In one embodiment, the antenna unit may include silver (Ag) or a silver alloy (e.g., silver - palladium - copper (APC)) or copper (Cu) or a copper alloy (e.g., copper - calcium (CuCa)) to achieve a low resistance and a fine line width pattern.

[0051] The antenna unit may include a transparent conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnOx), indium zinc tin oxide (IZTO), etc.

[0052] In some embodiments, the antenna unit may include a stacked structure of a transparent conductive oxide layer and a metal layer. For example, the antenna unit may include a bilayer structure of a transparent conductive oxide layer - metal layer, or a trilayer structure of a transparent conductive oxide layer - metal layer - transparent conductive oxide layer. In this case, flexibility may be improved through the metal layer, and the signal transmission speed may also be increased through the low resistance of the metal layer. Corrosion resistance and transparency may be improved through the transparent conductive oxide layer.

[0053] In some embodiments, the radiation pattern 122 and the transmission line 124 may include a mesh pattern structure to improve the light transmittance. In this case, a dummy mesh pattern (not shown) may be formed around the radiation pattern 122 and the transmission line 124.

[0054] Considering reducing the feed resistance, improving the noise absorption efficiency, horizontal radiation characteristics, etc., the signal pad 126 and the antenna ground pad 125 can be solid patterns formed of the above-mentioned metal or alloy.

[0055] In some embodiments, at least a part of the antenna ground pad 125 can have a solid pattern structure. In one embodiment, the part of the antenna ground pad 125 close to the radiation pattern can have a mesh pattern structure. For example, the antenna ground pad 125 can additionally extend toward the radiation pattern 122 to be disposed in the display area of the image display device together with the radiation pattern 122.

[0056] In this case, the part of the antenna ground pad 125 disposed in the display area can have a mesh pattern structure.

[0057] In some embodiments, an antenna ground layer 130 can be disposed on the opposite surface of the antenna dielectric layer 110 opposite to the above-mentioned one surface. The antenna ground layer 130 can be disposed to face the radiation pattern 122 with the antenna dielectric layer 110 interposed therebetween. Therefore, the vertical radiation generated by the radiation pattern 122 can be promoted.

[0058] As Figure 2 shown, the antenna ground layer 130 can overlap a part of the antenna electrode layer 120 in the thickness direction. For example, the antenna ground layer 130 may not overlap the antenna ground pad 125 in a plan view. Therefore, the efficiency or concentration of the horizontal radiation of the antenna ground pad 125 can be improved.

[0059] In one embodiment, the conductive member of the display device to which the above antenna package is applied can be used as the antenna ground layer 130.

[0060] The conductive member can include, for example, the gate electrode of a thin film transistor (TFT) included in the display panel, various wirings such as scan lines or data lines, or various electrodes such as pixel electrodes or common electrodes.

[0061] In one embodiment, a metal member such as a SUS board, a sensor member such as a digital converter, a heat sink, etc. disposed at the rear of the display device can be used as the antenna ground layer 130.

[0062] The circuit board 200 can be electrically connected to the antenna device 100 via the signal pad 126 of the antenna unit. In an exemplary embodiment, the circuit board 200 can be a flexible printed circuit board (FPCB).

[0063] The circuit board 200 can include a core layer 230, a circuit wiring layer 210, and a ground layer 250.

[0064] The core layer 230 may include, for example, a flexible resin such as polyimide resin, modified polyimide (MPI), epoxy resin, polyester, cycloolefin polymer (COP), liquid crystal polymer (LCP), and the like.

[0065] The circuit wiring layer 210 may be formed on one surface of the core layer 230 ( Figure 2 the top surface of the core layer 230 as shown), and may include signal transmission wirings 212 and bonding patterns 214.

[0066] The signal transmission wirings 212 may be electrically connected to the signal pads 126 of the antenna unit. As Figure 1 shown, a plurality of antenna units may be arranged along the width direction, and the plurality of signal transmission wirings 212 may each be electrically connected to each signal pad 126 of the antenna unit.

[0067] The bonding patterns 214 may be electrically connected to the antenna ground pads 125 of the antenna unit. A pair of bonding patterns 214 may face each other with a signal transmission wiring 212 interposed at one end thereof, and may be electrically connected to each antenna ground pad 125.

[0068] In some embodiments, the bonding patterns 214 may overlap with the antenna ground pads 125 (e.g., two adjacent antenna ground pads 125) included in different antenna units in a plan view.

[0069] As Figure 2 shown, the circuit wiring layer 210 and the antenna electrode layer 120 may be bonded to each other through a conductive intermediate structure 150. For example, the conductive intermediate structure 150 may include an anisotropic conductive film (ACF).

[0070] In this case, the conductive intermediate structure 150 may be inserted into the region where the circuit board 200 and the antenna device 100 overlap each other, and the circuit board 200 and the antenna element 100 may be thermocompressed together.

[0071] Accordingly, the signal transmission wirings 212 and the signal pads 126 may be electrically connected to each other through the conductive intermediate structure 150. The bonding patterns 214 and the antenna ground pads 125 may also be electrically connected to each other through the conductive intermediate structure 150.

[0072] As Figure 1 shown, the antenna ground pads 125 and the bonding patterns 214 may partially overlap each other in a plan view. The bonding patterns 214 may be used as bonding pads to improve bonding adhesion through the conductive intermediate structure 150. In addition, the bonding patterns 214 may be used as ground patterns for shielding / absorbing noise around the signal transmission lines 212. The bonding patterns 214 may have a floating pattern or an island pattern shape provided around the signal transmission wiring in the bonding region.

[0073] As used herein, the term "bonding pattern" refers to a conductive structure for bonding to an antenna ground pad 125 having a specific shape without particular limitation, and is used to cover structures formed by various processes such as electroplating processes, deposition processes, etching processes, etc.

[0074] The ground layer 250 may be formed on the opposite surface of the core layer 230 that is opposite to the one surface described above (e.g., Figure 2 the bottom surface of the core layer 230).

[0075] In an exemplary embodiment, the ground layer 250 may overlap the bonding pattern 214 and the signal transmission wiring 212 in the thickness direction. The ground layer 250 may continuously extend so as to overlap the signal transmission wiring 212 and the bonding pattern 214 included in the circuit board 200 in common.

[0076] The ground layer 250 may overlap and face the signal transmission wiring 212 at the same time, so that the dielectric characteristics of the core layer 230 with respect to the signal transmission wiring 212 can be uniformly maintained. In addition, the generation of an electric field around the signal transmission wiring 212 can be promoted by the ground layer 250, so that the feeding / signal transmission efficiency for the antenna unit can be improved.

[0077] The ground layer 250 may be used as a barrier layer, which can shield the noise input toward the signal transmission wiring 212.

[0078] In an exemplary embodiment, the ground layer 250 and the bonding pattern 214 may be electrically connected to each other through a via structure 270. The via structure 270 may be formed through the core layer 230 to electrically connect the ground layer 250 and the bonding pattern 214 to each other.

[0079] The ground layer 250 and the bonding pattern 214 may be connected to each other through the via structure 270, so that the noise absorption / blocking efficiency in the bonding region can be improved, and the reliability of feeding / signal transmission for the antenna device 100 can be improved.

[0080] In addition, the via structures 270 may be distributed around the bonding region, and the generation of an electric field in the region near the antenna unit can be further promoted, thereby suppressing signal / feeding loss and improving the signal / radiation efficiency of the antenna.

[0081] For example, a through hole may be jointly formed by the bonding pattern 214, the core layer 230, and the ground layer 250. The via structure 270 may be formed by filling the through hole with a conductive material using an electroplating process or the like.

[0082] As Figure 1As shown, two or more via structures 270 may be connected to a bonding pattern 214, and a plurality of via structures 270 may be arranged in the width direction in the bonding region to form a horizontal row of vias. Therefore, the generation of an electric field in the bonding region can be further promoted.

[0083] The above-described antenna package may include an antenna driving integrated circuit (IC) chip 290. The feeding / signal transmission to the antenna unit through the signal transmission wiring 212 may be controlled by the antenna driving IC chip 290.

[0084] For example, an intermediate circuit board 280 may be disposed between the opposing end of the circuit board 200 and the antenna driving IC chip 290 to electrically connect the circuit board 200 and the antenna driving IC chip 290 to each other. The intermediate circuit board 280 may be, for example, a rigid printed circuit board. For example, the intermediate circuit board 280 may include an intermediate circuit pattern formed in a prepreg substrate.

[0085] The above-described signal transmission wiring 212, bonding pattern 214, via structure 270, and ground layer 250 may include a low-resistance conductive material such as a metal or an alloy.

[0086] Figure 3 is a schematic top plan view showing an antenna package according to an exemplary embodiment.

[0087] Referring to Figure 3 , the via structure 270 may include a first via structure 270a and a second via structure 270b. As described above, the first via structure 270a may be in contact with the ground layer 250 and the bonding pattern 214 within or around the bonding region.

[0088] The second via structure 270b may be disposed around the signal transmission wiring 212. In an exemplary embodiment, the second via structure 270b may be spaced apart or separated from the signal transmission wiring 212 and may be continuously arranged along the contour of the signal transmission wiring 212. The second via structure 270b may penetrate the core layer 230 and may be in contact with the ground layer 250.

[0089] For example, the second via structure 270b may be arranged in a direction substantially parallel to the signal transmission wiring 212 or along the extending direction of the signal transmission wiring 212.

[0090] As Figure 3 shown, the first via structure 270a may be arranged in the width direction to form a first horizontal row of vias. The second via structure 270b may be continuously arranged along the signal transmission wiring 212 to form a second vertical column of vias. For example, a plurality of second vertical columns of vias may be arranged in the width direction. The second vertical columns of vias may be disposed between adjacent signal transmission wirings 212.

[0091] According to the above exemplary embodiment, the second via structure 270b may be formed around the signal transmission wiring 212, so as to shield the mutual interference / noise between the signal transmission wirings 212, and thus the independence / reliability between the antenna units may be improved.

[0092] In addition, the generation of the electric field passing through the signal transmission wiring 212 may be additionally promoted by the second via structure 270b, so as to improve the feeding / signal directivity toward the antenna unit.

[0093] Figure 4 and Figure 5 is a schematic top plan view showing an antenna package according to an exemplary embodiment. Details of elements and / or structures that are substantially the same or similar to the elements and / or structures described with reference to Figure 1 and Figure 2 are omitted.

[0094] Referring to Figure 4 , as described with reference to Figure 1 , one end of the circuit board 200 may be joined to the antenna unit, and the opposite end of the circuit board 200 may be electrically connected to the antenna driving IC chip 290. For example, the above opposite end of the circuit board 200 may include a chip mounting area coupled to the antenna driving IC chip 290.

[0095] The circuit wiring layer 210 of the circuit board 200 may further include a ground pattern 216 provided around the end of the signal transmission wiring 212. The ground pattern 216 may also be provided between adjacent signal transmission wirings 212 to absorb or shield signal noise in the chip mounting area.

[0096] In the exemplary embodiment, the via structure 270 may further include a third via structure 270c. The third via structure 270c may be formed through the core layer 230 and may be in contact with the ground pattern 216 and the ground layer 250.

[0097] The via structure 270c may be provided in or around the chip mounting area, which may promote the generation of the electric field in the area near the antenna driving IC chip 290. Therefore, the generation and directivity of the electric field at one end and the opposite end of the circuit board 200 may be improved respectively by the first via structure 270a and the third via structure 270c, thereby improving the overall signal efficiency of the antenna package.

[0098] In some embodiments, two or more third via structures 270c may be formed on a ground pattern 216. For example, two or more third via structures 270c may be arranged along the extending direction of the signal transmission wiring 212 or the ground pattern 216 to form a third via column. A plurality of third via columns may be arranged around the end portion of the signal transmission wiring 212 along the width direction.

[0099] The ground layer 250 at the opposite end portions of the circuit board 200 may substantially completely cover the ground pattern 216 in a plan view.

[0100] Refer to Figure 5 , the ground layer 250 may not overlap with the end portion of the ground pattern 216 in a plan view. For example, in a plan view, the ground pattern 216 may protrude from the ground layer 250. In this case, it is possible to prevent the feeding / signal transmission generated from the antenna driving IC chip 290 from being partially interfered by the ground layer 250.

[0101] Figure 6 is a schematic top plan view showing an image display device according to an exemplary embodiment.

[0102] Refer to Figure 6 , the image display device 300 may be formed in the form of, for example, a smart phone, and Figure 6 shows the front portion or the window surface of the image display device 300. The front portion of the image display device 300 may include a display area 310 and a peripheral area 320. The peripheral area 320 may correspond to, for example, a light-shielding portion or a frame portion of the image display device.

[0103] The antenna device 100 included in the antenna package described above may be arranged toward the front portion of the image display device 300, and may be arranged on the display panel, for example. In one embodiment, the radiation pattern 122 may at least partially overlap with the display area 310 in a plan view.

[0104] In this case, the radiation pattern 122 may have a mesh pattern structure, and it is possible to prevent a reduction in the light transmittance due to the radiation pattern 122. The antenna driving IC chip 280 included in the antenna package may be arranged in the peripheral area 320 to prevent a decrease in the image quality in the display area 310.

[0105] In some embodiments, the antenna package may be bent by the circuit board 200, so that, for example, the intermediate circuit board 280 and the antenna driving IC chip 290 may be arranged at the rear portion of the image display device 300.

[0106] As described above, the ground layer 250 of the circuit board 200 and the structure of the via structure 270 can be used to achieve efficient antenna radiation with suppressed signal loss while improving the signal reliability from the antenna driving IC chip 290.

Claims

1. An antenna package, characterized in that, It includes: An antenna unit; And A circuit board electrically connected to the antenna unit, the circuit board including: A core layer; Signal transmission wirings provided on one surface of the core layer, one end of the signal transmission wirings being connected to the antenna unit; A ground layer provided on the opposite surface of the core layer opposite to the one surface; and A first via structure formed through the core layer and provided around the one end of the signal transmission wirings to contact the ground layer, Wherein, the circuit board further includes a ground pattern provided around the opposite end of the signal transmission wirings on the one surface of the core layer.

2. The antenna package according to claim 1, wherein The circuit board further includes a bonding pattern provided around the one end of the signal transmission wirings on the one surface of the core layer.

3. The antenna package according to claim 2, characterized in that, The first via structure contacts the bonding pattern and the ground layer.

4. The antenna package according to claim 2, characterized in that, The antenna unit includes a plurality of the antenna units arranged in the width direction, and the signal transmission wirings include a plurality of the signal transmission wirings, wherein each of the signal transmission wirings is connected to each of the antenna units.

5. The antenna package according to claim 4, wherein The bonding pattern includes a plurality of the bonding patterns arranged at intervals from the signal transmission wirings along the width direction, and The first via structure includes a plurality of the first via structures contacting the bonding pattern, and the plurality of the first via structures are arranged along the width direction to form a first row of vias.

6. The antenna package according to claim 2, wherein The antenna unit includes a radiation pattern, a transmission line extending from the radiation pattern, a signal pad formed at the end of the transmission line, and an antenna ground pad provided around the signal pad, and The signal transmission wiring is electrically connected to the signal pad, and the bonding pattern is electrically connected to the antenna ground pad.

7. The antenna package according to claim 1, characterized in that, The circuit board further includes a second via structure provided around the signal transmission wirings, and the second via structure is formed through the core layer to contact the ground layer.

8. The antenna package according to claim 7, characterized in that, The second via structure is arranged along the extending direction of the signal transmission wirings to form a second column of vias, and Wherein the signal transmission wirings include a plurality of the signal transmission wirings, and the second column of vias is provided between the plurality of the signal transmission wirings.

9. The antenna package according to claim 1, wherein, The circuit board further includes a third via structure formed through the core layer to contact the ground pattern and the ground layer.

10. The antenna package according to claim 9, wherein The third via structure includes a plurality of the third via structures arranged along the extending direction of the signal transmission wirings or the ground pattern to form a third column of vias.

11. The antenna package according to claim 10, characterized in that, The third column of vias includes a plurality of the third columns of vias, and the signal transmission wirings include a plurality of the signal transmission wirings, and The plurality of the third columns of vias are provided between the plurality of the signal transmission wirings.

12. The antenna package according to claim 1, wherein It further includes an antenna driving integrated circuit chip electrically connected to the opposite end of the signal transmission wiring.

13. The antenna package according to claim 12, wherein It further includes an intermediate circuit board provided between the opposite end of the signal transmission wiring and the antenna driving integrated circuit chip.

14. The antenna package according to claim 13, characterized in that, The circuit board includes a flexible printed circuit board, and the intermediate circuit board includes a rigid printed circuit board.

15. An image display device, characterized in that, It includes the antenna package according to claim 1.

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