Open-Type BGA Socket Device for Testing Semiconductor Devices

Abstract

The present invention relates to a lidless type BGA socket device that removes a lid usually provided on the upper portion of a socket body for IC loading and unloading operations and can eliminate factors that may impede air flow during testing.

Description

Technical Field

[0001] The present invention relates to a BGA socket device for testing semiconductor devices, and more particularly to a lidless type BGA socket device that removes a lid typically provided on the upper part of the socket body for loading and unloading operations of an IC and can eliminate factors that may impede air flow during testing. Background Art

[0002] Generally, a socket for a semiconductor device (IC, Integrated Circuit) (hereinafter referred to as "IC") is provided on a test board or a burn-in board, and is connected to a burn-in chamber or its peripheral devices that input and output a power supply and an electronic signal of a predetermined voltage required to drive the IC through I / O terminals (input / output terminals) formed on the board, and other test devices for testing IC characteristics, so as to be used in an IC test system.

[0003] In an IC that is widely used generally, a BGA (Ball Grid Array) type IC significantly reduces the size and thickness of the IC by arranging IC terminals, i.e., balls, on the entire bottom surface of the IC. Figure 1 Figures (a) and (b) are a plan view and a side view of a BGA type IC, and a plurality of spherical terminals 2 are provided on the bottom surface of the IC1.

[0004] Figure 2 is a plan view of a BGA socket device with a pinch type contact of the prior art, Figure 3 is along Figure 2 a sectional configuration diagram taken along line A-A of Figure 4 is Figure 3 a partial enlarged view of

[0005] Refer to Figures 2 to 4, the prior art BGA socket device includes: a contact 16 having a fixed-side terminal 20 and a movable-side terminal 21 that contact the spherical terminals 2 of a BGA-type IC; a body 17 that houses the body of the contact 16; a stopper 18 provided at the lower end of the body 17 for fixing the contact 16; a lead guide 19 that guides the position of the leads of the contact 16; a cover 11 that is elastically supported on the upper part of the body 17 and is arranged to be movable up and down within a predetermined stroke range relative to the body 17; a slider 15 provided on the upper part of the body 17 and moving left and right in a manner linked to the up and down movement of the cover 11, thereby performing an opening and closing operation on the movable-side terminal 21; a plurality of IC holders 14 rotatably assembled to the slider 15 and pressing and fixing the upper part of the IC as the cover 11 moves up and down; and a holder spring 13 provided on the slider 15 and elastically supporting the IC holder 14.

[0006] The contact 16 has a fixed-side terminal 20 and a movable-side terminal 21 symmetrically arranged left and right to contact the spherical terminals 2 of the IC1. The lower ends of the fixed-side terminal 20 and the movable-side terminal 21 are fixed to the main body 24 and have leads 25 extending from the main body 24. The leads 25 are fixed by soldering to a PCB (not shown).

[0007] The cover 11 is elastically supported on the upper part of the body 17 by a spring 9, so that it can move up and down within a predetermined distance range, and is provided with a sliding cam that operates the slider 15 left and right according to the up and down position.

[0008] The slider 15 is formed with a terminal hole 23. Two terminals 20 and 21 of the contact 16 vertically fixed to the body 17 are arranged through the terminal hole 23. Among them, the terminal hole 23 is provided with a movable member 22 that divides the fixed-side terminal 20 from the movable-side terminal 21.

[0009] In particular, referring to Figure 4 , when the cover 11 is pressed downward, the slider 15 moves to the right through the slider cam. At this time, the movable member 22 moves together and spreads the movable-side terminal 21 outward so that the spherical terminals of the IC can be located between the fixed-side terminal 20 and the movable-side terminal 21. In addition, it is designed that when the slider 15 is in the initial position, the distance between the fixed-side terminal 20 and the movable-side terminal 21 across the movable member 22 is smaller than the size of the spherical terminal.

[0010] The reference numeral 12 is an IC guide for the guiding position when loading the IC1.

[0011] Figure 5 (a), (b), and (c) show schematic diagrams of a brief operation example of the prior art socket device.

[0012] Figure 5(a) shows the initial state where the cover 11 is elastically supported by the main body 17 at a predetermined height. The fixed-side terminal 20 and the movable-side terminal 21 of the contact 16 are in close contact with the movable member 22, and a predetermined interval L1 is maintained between the two terminals 20 and 21.

[0013] After that, as shown in Figure 5 (b), when the cover 11 is pressed to move downward, the movable member 22 moves to the right in the figure together with the slider 15, so that the movable-side terminal 21 spreads outward, and the IC1 is loaded into the socket device. At this time, the distance L2 between the two terminals 20 and 21 has an interval wider than the diameter of the spherical terminal 2.

[0014] Finally, as shown in Figure 5 (c), when the cover 11 returns to the original position, the movable member 22 returns to the original position together with the slider, and the movable-side terminal 21 also returns to the original position, so that the fixed-side terminal 20 and the movable-side terminal 21 fix the spherical terminal 2.

[0015] The prior art BGA socket device configured as above has the following problems:

[0016] 1. Overall, a large number of components are required and it is relatively complex, so a large amount of assembly time is needed and the cost is high.

[0017] 2. Since it is configured such that the lead guiding member or the cover surrounds the IC on all sides in the state where the IC is loaded, the air flow is not smooth, and the heat generated by the IC cannot be effectively dissipated to the surroundings.

[0018] 3. Since there is a cover that operates up and down at the upper end, the height of the socket is high, and the height of the entire degradation board is also high. When multiple degradation boards are arranged in the up and down direction in the degradation chamber and proper air flow between the boards is required, the number of degradation boards that can be arranged is reduced.

[0019] 4. The forced flow of air in the degradation chamber is obstructed by the cover or the lead guiding member, etc., which are components of the socket itself. Therefore, the forced flow of air cannot be effectively transmitted to the surface of the IC, and it is difficult to maintain the uniformity of the IC temperature.

[0020] 5. Since the contact or release of the clamping type contact and the spherical terminal is achieved by the horizontal operation of the movable-side terminal, the movable-side terminal is repeatedly elastically deformed. Therefore, repeated use will cause a decrease in durability, resulting in a decrease in the contact force with the spherical terminal. In particular, according to the prior art BGA socket device, during the return process of the movable-side terminal (refer to Figure 5In the case of (c) thereof, an operating force for returning the slider to the initial position is generated by the elastic restoring force of the movable-side terminal. Therefore, as the number of uses of the movable-side terminal increases, the fatigue (stress) of the movable-side terminal causes the elastic restoring force to gradually decrease, and the contact force between the movable-side terminal and the spherical terminal weakens, which will lead to a reduction in the reliability of IC testing.

[0021] Generally, the clamping type BGA socket device is required to have a life cycle of about 20,000 cover cycles. Therefore, improving the durability of the terminals when the clamping type contacts are repeatedly used to improve the problem of the decrease in the elastic restoring force is very important for determining the test reliability of the BGA socket device.

[0022] Prior art documents

[0023] Patent documents

[0024] Korean Utility Model Patent Publication No. 20-0229127 (Publication Date: July 19, 2001) Summary of the Invention

[0025] Problems to be Solved by the Invention

[0026] The present invention aims to improve such an existing BGA socket device for testing semiconductor devices, and provides a lidless type BGA socket device for testing semiconductor devices. The lidless type BGA socket device removes the lid provided on the upper part of the socket body for the loading and unloading operations of the IC in the prior art, and can perform the testing of semiconductor devices in a state where the IC loaded on the socket body is exposed to the outside.

[0027] Moreover, the present invention aims to provide a mechanism that can improve the heat dissipation effect of the IC during the testing of the IC using such a BGA socket device.

[0028] Means for Solving the Problems

[0029] To achieve the above object, an open - type BGA socket device for semiconductor device testing according to an embodiment of the present invention includes: a contact having an upper - side pointed end and being elastic in the lateral direction, and being in electrical contact with the terminals of an IC; a main body portion including a slider receiving portion recessed from a horizontal upper surface of the main body portion and a cam support portion recessed from the upper surface around the slider receiving portion and forming one - end side walls, the contact being fixed to the lower surface of the slider receiving portion; a slider being arranged to be slidable back and forth in the horizontal direction within the slider receiving portion, and having a cam contact portion opposite to the cam support portion at one end, sliding back and forth by a lateral operating force applied to the cam contact portion, and transmitting the lateral operating force to the contact according to its back - and - forth sliding position to bring the terminals of the IC into contact with the contact; and a contact - contact - force generating spring being provided between the main body portion and the slider, elastically supporting the slider in the movable direction and providing the contact force between the contact and the terminals of the IC.

[0030] In addition, an open - type BGA socket device for semiconductor device testing according to another embodiment of the present invention includes: a contact having an upper - side pointed end and being elastic in the lateral direction, and being in electrical contact with the terminals of an IC; a main body portion having an IC - arranging portion for arranging an IC on a horizontally - formed upper surface and forming a slider receiving portion recessed from the upper surface of the main body portion, the contact being fixed to the lower surface of the sliding receiving portion; a slider being received in the slider receiving portion in a vertically - slidable manner, sliding up and down by an operating force applied in the vertical direction, and providing a lateral operating force to the contact according to its up - and - down sliding position to bring the terminals of the IC into contact with the contact; and a contact - contact - force generating spring being provided between the main body portion and the slider, elastically supporting the slider in the movable direction to provide the contact force between the contact and the terminals of the IC.

[0031] Preferably, the open - type BGA socket device for semiconductor device testing further includes an IC loading / unloading device, the IC loading / unloading device being detachably assembled to the upper end of the main body portion and operating the slider in the lateral or vertical direction to load and unload the IC.

[0032] Moreover, a heat - sink unit for achieving the object of the present invention includes: a housing having a through - opening portion formed therein, and provided with a first hook projection protruding downward from the periphery of the opening portion and a second hook projection assembled and fixed to the fixing arm; a heat sink being inserted into the opening portion and assembled in a vertically - movable manner, and the height of the vertical movement being limited by the first hook projection; and a spring being provided between the housing and the heat sink and elastically supporting the heat sink downward.

[0033] Furthermore, the heat sink socket for achieving the object of the present invention includes: a frame fixed to the PCB and having a quadrilateral structure, an opening for arranging an IC test socket device is formed in the quadrilateral structure; and a pair of fixing arms respectively extending upward and formed on two opposite sides of the frame, which can be assembled with the heat sink unit. The fixing arm includes: an arm member vertically extending from the frame; a hanging end bent and formed at the upper end of the arm member; and a release groove recessed inward at the upper end of the arm member.

[0034] Effects of the Invention

[0035] The lidless BGA socket device for testing semiconductor devices of the present invention includes: contacts; a main body part provided with a sliding receiving part recessed relative to the horizontal upper surface of the main body part, and the contacts are fixed to the lower surface of the sliding receiving part; a slider slidably arranged in the slider receiving part in the horizontal or vertical direction, and sliding up and down by the applied horizontal or vertical operating force, providing a lateral operating force to the contacts according to its front-back or up-down sliding position so that the terminals of the IC are in contact with the contacts; and a contact force generating spring arranged between the main body part and the slider, elastically supporting the slider in the movable direction to generate the contact force between the contacts and the terminals of the IC. Since the IC loading / unloading device is only temporarily assembled to the main body part when loading and unloading the IC, by eliminating the structure that may hinder the air flow around the IC arranged in the socket device during the test, the temperature of the IC can be kept uniform, and compared with the prior art, the height of the socket device can be halved. Therefore, by increasing the number of degradation plates that can be arranged in the degradation chamber, the effect of reducing the test cost can be achieved.

[0036] Furthermore, the present invention can maintain the contact between the contacts and the terminals of the IC for a long time and evenly, and can improve the degradation of the contacts caused by the decrease in the elastic restoring force of the contacts.

[0037] Furthermore, the socket device of the present invention can selectively install a detachable heat sink, so that the heat generated by the IC during the IC test can be effectively released. Description of the Drawings

[0038] Figure 1 (a) and (b) are the plan view and side view of the BGA type IC;

[0039] Figure 2 is the plan view of the prior art socket device;

[0040] Figure 3 is along Figure 2 the sectional constitution diagram of line A-A of

[0041] Figure 4 is Figure 3 a partially enlarged view of;

[0042] Figure 5 (a), (b), and (c) of are schematic diagrams showing a brief working example of a socket device of the prior art;

[0043] Figure 6 is a plan view of an uncovered BGA socket device according to a first embodiment of the present invention;

[0044] Figure 7 is along Figure 6 sectional view taken along line B-B of;

[0045] Figure 8 is along Figure 6 sectional view taken along line C-C of;

[0046] Figure 9 (a) and (b) of are respectively a front view and a side view of a double-clamping type contact in a first embodiment of the present invention;

[0047] Figure 10 is a plan view of a main body portion in a first embodiment of the present invention;

[0048] Figure 11 is along Figure 10 sectional view taken along line D-D of;

[0049] Figure 12 (a) and (b) of are respectively sectional views taken along line E-E and line F-F of; Figure 10 ;

[0050] Figure 13 is a plan view of a limiter body portion in a first embodiment of the present invention;

[0051] Figure 14 (a) and (b) of are respectively sectional views taken along line G-G and line H-H of; Figure 13 ;

[0052] Figure 15 is a plan view of a slider according to an embodiment of the present invention;

[0053] Figure 16 (a), (b), and (c) of are respectively sectional views taken along line I-I and line J-J of; Figure 15 ;

[0054] Figure 17 (a) and (b) of are respectively sectional views taken along line K-K and line L-L of; Figure 15 ;

[0055] Figure 18Planar configuration diagram of the IC loading / unloading device according to an embodiment of the present invention;

[0056] Figure 19 (a) and (b) of are respectively sectional configuration diagrams along Figure 18 the M-M line and N-N line of ;

[0057] Figures 20 to 22 Schematic diagram for briefly showing the contact process between the spherical terminals of the IC and the contacts in the lidless BGA socket device according to the first embodiment of the present invention;

[0058] Figure 23 (a) and (b) of are respectively the front and side configuration diagrams of the double-clamping type contacts according to another embodiment of the present invention;

[0059] Figure 24 Planar configuration diagram of the lidless BGA socket device according to the second embodiment of the present invention;

[0060] Figure 25 Along Figure 24 the sectional configuration diagram along the O-O line of ;

[0061] Figure 26 Along Figure 24 the sectional configuration diagram along the P-P line of ;

[0062] Figure 27 (a) and (b) of are respectively the front and side configuration diagrams of the single-pin type contacts in the second embodiment of the present invention;

[0063] Figure 28 (a), (b), and (c) of are schematic diagrams for briefly showing the contact process between the spherical terminals of the IC and the contacts in the lidless BGA socket device according to the second embodiment of the present invention;

[0064] Figure 29 Planar configuration diagram of the lidless BGA socket device according to the third embodiment of the present invention;

[0065] Figure 30 Along Figure 29 the sectional configuration diagram along the Q-Q line of ;

[0066] Figure 31 Along Figure 29 the sectional configuration diagram along the R-R line of ;

[0067] Figure 32 (a) and (b) of are respectively the front and side configuration diagrams of the double-clamping type contacts in the third embodiment of the present invention;

[0068] Figure 33(a), (b), and (c) are schematic diagrams showing the opening and closing operations of the contacts corresponding to the height of the movable member for opening and closing in the third embodiment of the present invention;

[0069] Figure 34 is a plan view of the IC loading / unloading device in the third embodiment of the present invention;

[0070] Figure 35 (a) and (b) respectively are along Figure 34 sectional structure diagrams along the S-S line and T-T line of

[0071] Figure 36 (a), (b), and (c) are schematic diagrams briefly showing the contact process between the spherical terminals of the IC and the contacts in the lidless BGA socket device of the third embodiment of the present invention;

[0072] Figure 37 is a plan view of the lidless BGA socket device in the fourth embodiment of the present invention;

[0073] Figure 38 (a) and (b) respectively are along Figure 37 sectional structure diagrams along the U-U line and V-V line of

[0074] Figure 39 is a plan view of the heat sink in the embodiment of the present invention;

[0075] Figure 40 (a) and (b) are along Figure 39 sectional structure diagram and exploded sectional structure diagram along the W-W line of

[0076] Figure 41 (a) and (b) respectively are sectional structure diagrams showing before and after loading the heat sink unit;

[0077] Figure 42 (a), (b), and (c) are sectional structure diagrams briefly showing the process of unloading the heat sink unit;

[0078] Figure 43 (a), (b), and (c) are respectively other modified examples for installing the heat sink unit on the socket device, are plan views of the heat sink socket, and are sectional structure diagrams along the X-X line and Y-Y line;

[0079] Figure 44 (a) and (b) respectively are showing before and after loading the heat sink unit using Figure 43 the heat sink socket of Detailed implementation manners

[0080] First, the terms or words used in this specification and the scope of the claims should not be construed in accordance with their ordinary dictionary meanings. Instead, based on the principle that the inventor can appropriately define the concepts of the terms in order to best explain their invention, they should be interpreted as meanings and concepts consistent with the technical idea of the present invention.

[0081] The embodiments described in this specification and the configurations shown in the accompanying drawings are merely a preferred embodiment of the present invention and do not represent all the technical ideas of the present invention. Therefore, it should be understood that there may be various equivalents and variations that can replace these at the time of this application.

[0082] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0083] First Embodiment

[0084] Figure 6 It is a plan view of an open - type BGA socket device (hereinafter referred to as "socket device") according to the first embodiment of the present invention. Figure 7 Along Figure 6 is a cross - sectional view taken along line B - B. Figure 8 Along Figure 6 is a cross - sectional view taken along line C - C.

[0085] Referring to Figures 6 to 8 In this embodiment, the socket device 200 includes: a contact 100 having an upper pointed end, being elastic in the lateral direction and making electrical contact with the terminals of the IC1; a main body portion 210 including a slider receiving portion 210b recessed from the horizontal upper surface 210a of the main body portion 210, and a cam support portion 212a recessed from the upper surface 210a around the slider receiving portion 210b and forming one end side wall, with the contact 100 fixed to the lower surface of the slider receiving portion 210b; a slider 230 disposed to be able to slide back and forth horizontally (in the x - axis direction) within the slider receiving portion 210b provided on the upper part of the main body portion 210, and having a cam contact portion 231 opposite to the cam support portion 212a at one end, sliding back and forth by a lateral operating force applied to the cam contact portion 231, and transmitting a lateral operating force to the contact 100 according to its back - and - forth sliding position to bring the terminals of the IC into contact with the contact 100; and a contact force generating spring 241 disposed between the main body portion 210 and the slider 230, elastically supporting the slider 230 in the movable direction (x - axis direction) and providing the contact force between the contact 100 and the terminals of the IC1.

[0086] In the present invention, the contact 100 can be a dual - pinch type or a single - pin type contact. In this embodiment, a dual - pinch type contact is shown, and its specific configuration will be described later with reference to the relevant drawings.

[0087] The main body portion 210 has a horizontal upper surface 210a, and has a slider receiving portion 210b that is recessed in the center of the upper surface 210a for receiving the slider 230. The upper surface 210a around the slider receiving portion 210b is provided with a guide hole 211 and a recessed hole 212.

[0088] The guide hole 211 is used for assembling with an IC loading / unloading device that performs IC loading and unloading operations, and serves to guide the assembly position of the IC loading / unloading device. Figure 6 It shows a case where four guide holes are provided at the respective corners of the main body portion 210, but their positions and numbers are variable.

[0089] Specifically, referring to Figure 7 , the slider driving cam 313 of the IC loading / unloading device is inserted into the hole 212, and one end side wall of the hole 212 abuts against the slider driving cam 313, thereby functioning as a cam support portion 212a to support the slider driving cam 313. A cam contact portion 231 having a curved surface shape is provided at the upper end corner of the slider 230 facing the cam support portion 212a. Therefore, the slider driving cam 313 inserted between the cam contact portion 231 and the cam support portion 212a is supported by the cam support portion 212a and presses the cam contact portion 231 in the vertical direction. The curved cam contact portion 231 generates a lateral operating force through the vertical operating force of the slider driving cam 313, thereby realizing the horizontal direction (x-axis direction) movement of the slider 230.

[0090] Referring to Figure 6 , this embodiment shows a case where four cam contact portions 231 and cam support portions 212a are provided at vertically symmetric positions on the upper surface of the main body portion 210, but their positions and numbers are variable.

[0091] The lower end of the main body portion 210 may further have a limiter body portion 220 for fixing the contact 100. After the contact 100 is pre-assembled to the limiter body portion 220, it is then assembled to the main body portion 210, so that the contact 100 can be vertically and fixedly arranged on the main body portion 210. Additionally, as another modification, the contact may also be directly pressed and assembled into the main body portion, so that there is no need to separately provide a limiter body portion, and the contact can be fixed only by the main body portion.

[0092] In addition, the lower part of the limiter body 220 may further include a lead guiding member 250 through which the lead of the contact is inserted. During the process of assembling the socket device onto the PCB, the lead guiding member 250 guides the lead of the contact so that it can be accurately inserted into the through hole of the PCB. Reference numeral 260 is a welding pin, which extends downward from the main body and is welded to the PCB to firmly fix the socket device to the PCB.

[0093] The slider 230 is assembled to be slidable in the horizontal direction (x-axis direction) on the upper part of the main body 210. Corresponding to the cam support portion 212a of the main body 210, the slider 230 is provided with a cam contact portion 231 whose upper end corner is formed into a curved surface, so as to open and close the contact 100 in the horizontal direction according to the position of the forward and backward sliding.

[0094] The contact force generating spring 241 is disposed between the main body 210 and the slider 230, elastically supports the slider 230 in the movable direction (x-axis direction), and provides the contact force between the contact 100 and the terminal of the IC. In order to ensure sufficient operating force, a plurality of such contact force generating springs 241 may be configured. For reference, in Figure 6 it is configured that there are eight contact force generating springs 241 in a vertically symmetric manner, pressing the slider 230 in the right direction.

[0095] According to the socket device 200 configured as above, during the process of loading and unloading the IC, the IC loading / unloading device is temporarily assembled on the upper part of the main body 210 to perform the loading and unloading operation of the IC. After that, there is no other structure on the upper part of the main body 210 where the IC 1 is disposed, and the test is carried out in an open state. The following describes the specific embodiments of each component.

[0096] Figure 9 Figures (a) and (b) of

[0097] Refer to Figure 9 In this embodiment, the contact 100 is a dual pinch type contact, including a pair of terminals, namely a fixed side terminal 110 and a movable side terminal 120, which are relatively disposed across the spherical terminal 2 of the IC. The contact 100 includes: a contact body 130 that integrally fixes the lower ends of the fixed side terminal 110 and the movable side terminal 120; and a lead 140 that extends downward from the contact body 130. The lead 140 is assembled into the through hole of the PCB (not shown) and is welded and fixed.

[0098] The fixed-side terminal 110 includes a fixed-side pin 111 and an upper tip portion 112 provided at the upper end of the fixed-side pin 111 and directly contacting the spherical terminal. Similarly, the movable-side terminal 120 includes a movable-side pin 121 and an upper tip portion 122 provided at the upper end of the movable-side pin 121.

[0099] A support protrusion 111a protruding outward may be provided in the middle of the fixed-side pin 111. When the support protrusion 111a is located in the receiving hole of the main body portion, it is supported by the side wall, thereby serving to support the fixed-side terminal 110 in the horizontal direction.

[0100] Preferably, the upper tip portion 112 on the fixed side and the upper tip portion 122 on the movable side are offset by a predetermined interval d with respect to the center of the spherical terminal 2. Therefore, according to the present invention, when the double-clamping type contact touches the spherical terminal, the two upper tip portions 112 and 122 contact the spherical terminal 2 while being offset from each other by a predetermined interval d.

[0101] Figure 10 It is a plan view of the main body portion in the first embodiment of the present invention. Figure 11 Along Figure 10 is a sectional view taken along the D-D line, Figure 12 (a) and (b) of Figure 10 are sectional views taken along the E-E line and the F-F line of

[0102] Referring to Figures 10 to 12 , in the upper surface 210a of the main body portion 210, a slider receiving portion 210b for receiving a slider is recessed in the center. A plurality of first receiving holes 213 vertically penetrating in a predetermined pattern are formed in the lower surface of the slider receiving portion 210b. The contact 100 is vertically received in each of the first receiving holes 213. A fixing member 214 is provided between the fixed-side pin 111 and the movable-side pin 121 of the contact 100 at the upper opening end of each first receiving hole 213. The fixed-side pin 111 and the movable-side pin 121 are fixed to the main body portion 210 in the horizontal direction.

[0103] The upper surface 210a around the slider receiving portion 210b in the main body portion 210 has a horizontal planar structure, and a plurality of guide holes 211 are formed in the upper surface 210a. The slider receiving portion 210b is formed with a recessed hole 212, and one end side wall of the hole 212 functions as a cam support portion 212a, and the cam support portion 212a serves to support the slider drive cam of the IC loading / unloading device. As Figure 11 shown, the upper end surface of the cam support portion 212a has a curved surface, so that the slider drive cam of the IC loading / unloading device can be inserted into the hole 212 along the curved surface.

[0104] A guide pin 215 is formed to protrude from the lower part of the main body 210. The guide pin 215 guides the position during the assembly with the PCB during the process of assembling with the PCB. One or more such guide pins 215 may be provided.

[0105] A first fixing protrusion 216 is formed to protrude from a part of the inner side wall of the main body 210. The first fixing protrusion 216 serves as an assembly component for assembling with the limiter body 220.

[0106] Reference numeral 217 is a hook hanging table, which is assembled with the assembly hook 232 of the slider 230 to guide the front - rear movement direction of the slider 230 assembled to the upper part of the main body 210.

[0107] Figure 13 This is a plan view of the limiter body in the first embodiment of the present invention. Figure 14 (a) and (b) of which are respectively sectional views along Figure 13 the G - G line and the H - H line of

[0108] Refer to Figure 13 and Figure 14 The limiter body 220 is formed with a plurality of second receiving holes 221 vertically penetrating according to a predetermined pattern. The contact 100 is vertically fixed to each of the second receiving holes 221. The second receiving holes 221 are provided at positions substantially the same as the first receiving holes 213 of the main body for vertically arranging the contact 100.

[0109] Preferably, the second receiving hole 221 has a structure in which the inner diameter becomes narrower toward the lower part, and a supporting inclined surface 221a with a certain inclination is formed on the inner side wall. The contact body 130 is supported by the inclined surface 221a, and the lead 140 protrudes downward from the second receiving hole 221.

[0110] The limiter body 220 is provided with a plurality of fixing arms 222 extending vertically. A second fixing protrusion 222a is provided at the upper front end of the fixing arm 222. The second fixing protrusion 222a is assembled with the first fixing protrusion 215 of the main body 210 (refer to Figure 12 ), and the limiter body 220 is assembled to the lower end of the main body 210.

[0111] Figure 15 This is a plan view of the slider in the embodiment of the present invention. Figure 16 (a), (b), and (c) of which are respectively sectional views along Figure 15 the I - I line and the J - J line of Figure 17 (a) and (b) of which are respectively sectional views along Figure 15 the K - K line and the L - L line of

[0112] Refer to Figures 15 to 17, the slider 230 is provided with a plurality of cam contact portions 231a, 231b. In a state where the main body portion 210 and the slider 230 are elastically supported and assembled by the spring 241 through the contact force of the contact, each of the cam contact portions 231a, 231b is exposed to the outside of the upper surface through the hole of the main body portion 210.

[0113] Each of the cam contact portions 231a, 231b is provided to integrally protrude from each side of the slider 230 and has a predetermined curved surface at the upper end corner portion. By the slider drive cam 312 provided in the IC loading / unloading device (refer to Figure 7 ), pressure is applied to realize the horizontal operation of the slider 230.

[0114] Reference numeral 232 is an assembly hook, which is assembled with the hook hanging table 217 of the main body portion 210 to play a role in guiding the horizontal movement along the sliding direction of the slider 230. Reference numeral 233 is a spring assembly guide for fixing the spring 241 that generates the contact force (refer to Figure 6 ).

[0115] The slider 230 is formed with a fixed-side terminal receiving hole 234 and a movable-side terminal receiving hole 235 through which the fixed-side pin 111 and the movable-side pin 121 of each contact 100 are respectively penetrated and arranged. Preferably, the fixed-side terminal receiving hole 234 and the movable-side terminal receiving hole 235 are offset by a predetermined interval d. Preferably, the length L1 of the fixed-side terminal receiving hole 234 is greater than the length L2 of the movable-side terminal receiving hole 235 (L1 > L2).

[0116] The upper surface of the slider 230 is provided with a spherical terminal guide 236. The spherical terminal guide 236 guides the arrangement position of the spherical terminal 2 during the process of loading the IC. In this embodiment, it is exemplified that the spherical terminal guide 236 is composed of a plurality of blocks arranged at equal distance intervals from the center of the arrangement of the spherical terminal 2, but it is not limited thereto.

[0117] Preferably, an opening / closing movable member 237 protruding in an inverted triangle shape is provided between the adjacent movable-side terminal receiving holes 235. The opening / closing movable member 237 has an inverted triangle shape, and the left end and the right end respectively function as an opening pressing end 237a and a closing pressing end 237b through two adjacent movable-side pins 121.

[0118] And, a distance maintaining movable member 238 protruding in an inverted triangle shape is provided between the adjacent fixed-side terminal receiving holes 234. One end 238a of the distance maintaining movable member 238 supports the inner side surface of the fixed-side pin 111, thereby playing a role in maintaining the minimum interval between the upper tip portion 112 on the fixed side and the upper tip portion 122 on the movable side.

[0119] Figure 18A plan view of the IC loading / unloading device according to an embodiment of the present invention. Figure 19 In (a) and (b) of Figure 18 are cross-sectional configuration diagrams along the M-M line and N-N line of

[0120] Referring to Figure 18 and Figure 19 , during the process of loading and unloading the IC, the IC loading / unloading device 300 is detachably assembled to the upper part of the main body 210, and presses the cam contact parts 231a, 231b of the slider 230 to provide an operating force for horizontally operating the slider 230. In addition, in the present invention, the so-called "the IC loading / unloading device 300 is detachably assembled to the main body 210" means that the IC loading / unloading device 300 is assembled to the upper part of the main body 210 in a male-female form and is assembled within a range where it can be easily separated. Therefore, it should be understood that an assembly form in which the IC loading / unloading device and the main body are integrally formed and cannot be separated, or the IC loading / unloading device is firmly fixed to the main body by a locking member such as a bolt and is not easily separated is excluded.

[0121] Specifically, the IC loading / unloading device 300 includes: a main body part 310, which is formed with a substantially rectangular storage hole 311 corresponding to the IC arrangement part of the main body part; and a slider driving cam 313, which protrudes from the lower end of the main body part 310, and may further include guide arms 312 protruding from the lower end of the main body part 310.

[0122] The main body part 310 includes a guiding side wall 314 forming the lower end opening of the storage hole 311, and an IC guiding inclined surface 315 formed by obliquely extending from the guiding side wall 314, so that the IC1 can be placed in the guiding side wall 314 along the IC guiding inclined surface 315, and thus can be accurately arranged in the IC arrangement part of the main body part 210.

[0123] The guide arms 312 are respectively arranged at positions corresponding to the guide holes 211 of the main body part 210, and guide the assembly position during the assembly with the main body part 210.

[0124] The slider driving cams 313 are respectively arranged at positions corresponding to the holes 212 of the main body part 210, and press the cam contact part 231 of the slider 230 during the assembly of the IC loading / unloading device 300 and the main body part 210. Figure 18 An example shows a case where four slider driving cams 313 are arranged at symmetric upper and lower positions of the main body part 310 in a manner corresponding to the holes 212 of the main body part 210, but their positions and numbers are variable.

[0125] Preferably, the slider driving cam 313 is in the shape of a wedge having a curved surface or an inclined surface formed at its lower front end portion 313a. Therefore, during the contact with the cam contact portion 231 of the slider 230, the vertical operating force of the slider driving cam 313 is converted into the horizontal operating force of the slider 230 during the contact with the cam contact portion 231 having the curved surface.

[0126] This IC loading / unloading device 300 is assembled with the main body portion 210 in a male-female form only when loading and unloading the IC. During the process of testing the IC, the IC loading / unloading device 300 is in a state of being separated and removed from the main body portion 210.

[0127] Figures 20 to 22 It is a schematic diagram briefly showing the contact process between the spherical terminals of the IC and the contacts in the socket device of the first embodiment of the present invention.

[0128] Figure 20 The initial state of the socket device is shown. The IC loading / unloading device 300 is in a state of being separated from the main body portion 210, and it is a step before loading the IC1. The slider 230 is elastically supported by the contact force generating spring 241 and is in a state of being pressed in the rightward direction.

[0129] In addition, with the body of the contact 100 fixed to the main body portion 210, the fixed side pin 111 of the contact 100 contacts and is supported by the distance maintaining movable member 238, and the movable side pin 121 contacts and is supported by the closing pressing end 237b of the opening / closing movable member 237. At this time, the initial interval w1 between the upper tip portion 112 on the fixed side and the upper tip portion 122 on the movable side is smaller than the diameter of the spherical terminal.

[0130] After that, as Figure 21 shown, the IC loading / unloading device 300 is assembled to the upper part of the main body portion 210. At this time, the slider driving cam 313 is inserted into the hole 212 of the main body portion 210 (refer to Figure 7 ) and pushes the cam contact portion 231 to push the slider 230 to the left. At this time, the contact force generating spring 241 is compressed, and at the same time, the slider 230 horizontally moves a predetermined displacement D to the left.

[0131] By the horizontal movement of the slider 230, the opening / closing movable member 237 also horizontally moves and pushes the movable side pin 121. At this time, the opening pressing end 237a of the opening / closing movable member 237 pushes the movable side pin 121. Therefore, the interval w2 between the two upper tip portions 112 and 122 is widened to more than the diameter of the spherical terminal 2. After that, the IC1 is loaded into the socket device, and the spherical terminal 2 is located between the two upper tip portions 112 and 122.

[0132] Refer toFigure 22 After the IC1 is disposed in the socket device, the IC loading / unloading device 300 is separated from the main body portion 210, and the slider 230 returns to its original position by the elastic restoring force of the contact force generating spring 241.

[0133] In addition, during the return process of the slider 230, the movable-side pin 121 contacts the spherical terminal 2 while being pressed by the closing pressing end 237b of the opening / closing movable member 237, and the initial interval w1 between the two upper tip portions 112 and 122 is designed to be smaller than the diameter of the spherical terminal 2 (refer to Figure 20 ), and thus, the upper tip portion 112 on the fixed side contacts the spherical terminal 2 with a contact force generated by a displacement equal to the distance difference b from the initial state.

[0134] After that, a test is performed in a state where the IC1 is loaded in the socket device, and during the test, the IC loading / unloading device 300 is in a state of being separated and removed. Regarding the unloading of the IC1 after the test of the IC1, the IC1 can be unloaded using the IC loading / unloading device 300 according to the above description.

[0135] Figure 23 Figures (a) and (b) of

[0136] Refer to Figure 23 , the contact 400 of the present embodiment is a double-clamping type contact including a pair of terminals, i.e., a fixed-side terminal 410 and a movable-side terminal 420. The contact 400 includes: a contact body 430 that integrally fixes the lower ends of the fixed-side terminal 410 and the movable-side terminal 420; and a lead 440 that extends downward from the contact body 430.

[0137] The fixed-side terminal 410 includes a fixed-side pin 411 and a fixed-side upper tip portion 412 provided at the upper end of the fixed-side pin 411 and directly contacting the spherical terminal 2. Correspondingly, the movable-side terminal 420 also includes a movable-side pin 421 and a movable-side upper tip portion 422 provided at the upper end of the movable-side pin 421.

[0138] The fixed-side upper tip portion 412 and the movable-side upper tip portion 422 are offset by a predetermined interval d with respect to the center of the spherical terminal 2.

[0139] Specifically, in the present embodiment, the lead 440 has a partial curved section, and the lead 440 having the curved section has a certain elastic force in the vertical direction and is compressed when contacting the contact pad of the PCB to increase the contact, thereby being able to increase the contact force.

[0140] Second Embodiment

[0141] Figure 24 This is a plan view of the lidless BGA socket device according to the second embodiment of the present invention. Figure 25 Along Figure 24 is a cross-sectional view taken along the O-O line. Figure 26 Along Figure 24 is a cross-sectional view taken along the P-P line. In this embodiment, the contact is a single-pin type contact, and the IC loading / unloading device of the socket device can be disassembled and assembled. Therefore, the IC loading / unloading device is only assembled to the main body when loading and unloading the IC, which is the same as the first embodiment. Therefore, repeated descriptions are omitted, and the differences are mainly described.

[0142] Referring to Figures 24 to 26 , the socket device 500 according to the second embodiment includes: a contact 600, which is provided with an upper tip portion 611 and has elasticity in the lateral direction, and is in electrical contact with the terminal 2 of the IC1; a main body portion 510, which includes a slider receiving portion formed by being recessed from the horizontal upper surface 510a of the main body portion 510, and a cam support portion 512a formed by being recessed from the upper surface 510a around the slider receiving portion and constituting one end side wall, and the contact 600 is fixed to the lower surface of the slider receiving portion; a slider 530, which is arranged to be able to slide back and forth horizontally in the slider receiving portion provided on the upper part of the main body portion 510, and has a cam contact portion 531 opposite to the cam support portion 512a at one end, slides back and forth by a lateral operating force applied to the cam contact portion 531, and transmits a lateral operating force to the contact 600 according to its back and forth sliding position, so that the terminal 2 of the IC is in contact with the contact 600; and a contact force generating spring 541, which is provided between the main body portion 510 and the slider 530, elastically supports the slider 530 along the movable direction (x-axis direction), and provides the contact force between the contact 100 and the terminal of the IC.

[0143] The lower end of the main body portion 510 may further have another limiter body portion 520 for fixing the contact 600, and a lead guide 550 for guiding the lead of the contact 600.

[0144] Referring to Figure 27 , in this embodiment, the contact 600 is a single-pin type contact, and is provided with an upper tip portion 610 for contacting the spherical terminal of the IC, a terminal 620 having a predetermined elasticity, a contact body 630 fixed integrally with the lower end of the terminal 620, and a lead 640 extending downward from the contact body 630. The lead 640 is assembled into the through hole of the PCB (not shown) and is welded and fixed.

[0145] The contact body 630 may be provided with a support protrusion 631 formed to protrude. When the support protrusion 631 is located in the receiving hole of the main body portion 510, it is supported by the side wall, thereby serving to support the contact 600 in the horizontal direction.

[0146] Reference Figure 25 , on the upper surface of the slider 430, a plurality of spherical terminal guides 532 are provided at predetermined intervals. The spherical terminal guides 532 guide the arrangement position of the spherical terminals 2 during the process of loading the IC. A plurality of terminal receiving holes 533 are formed therethrough between the spherical terminal guides 532, and the terminals 620 of the contact 600 are located in each terminal receiving hole 533.

[0147] Preferably, a distance - maintaining movable member 534 formed in an inverted - triangular shape is provided between adjacent terminal receiving holes 533. The right - hand end of each distance - maintaining movable member 534 supports the terminal 620, thereby serving to maintain the minimum interval d2 between the spherical terminal guide 532 and the upper tip portion 610. Preferably, the minimum interval d2 is smaller than the diameter of the spherical terminal 2.

[0148] According to the socket device of the second embodiment configured as above, it can be assembled with the IC loading / unloading device only during the process of loading and unloading the IC. After loading or unloading the IC, the IC loading / unloading device is separated from the main body portion 510 and then the IC is tested. The configuration of the IC loading / unloading device is the same as that of the first embodiment, so its description is omitted. The reference numerals of the IC loading / unloading device used in the following description are the same as those of the first embodiment.

[0149] Figure 28 (a), (b), and (c) are schematic diagrams briefly showing the contact process between the spherical terminals of the IC and the contacts in the lidless BGA socket device of the second embodiment of the present invention.

[0150] Figure 28 (a) shows the initial state of the socket device. The IC loading / unloading device is in a state separated from the main body portion 510, and it is the step before loading the IC. The slider 530 is elastically supported by the contact - force - generating spring 541 and is in a state of being pressed in the right - hand direction. In addition, the right - hand end of the distance - maintaining movable member 534 supports the terminal 620, and the spherical terminal guide 532 and the upper tip portion 610 maintain the minimum interval d2, and the minimum interval d2 is smaller than the diameter of the spherical terminal.

[0151] After that, reference Figure 28In (b) thereof, the IC loading / unloading device 300 is assembled on the upper part of the main body 510. At this time, the slider driving cam 313 is inserted into the hole 512 of the main body 510 and pushes the cam contact part 531 to push the slider 530 to the left. At this time, the contact force generating spring 541 is compressed, and at the same time, the slider 530 horizontally moves a predetermined displacement D in the left direction.

[0152] By the movement of the slider 530 in the left direction, the spherical terminal guide 532 moves together to make the upper tip part 610 of the terminal 620 in a relatively open state. The spherical terminal 2 of the IC1 can be arranged on the upper surface of the slider 530. At this time, the distance d3 between the spherical terminal guide 532 and the upper tip part 510 is greater than the diameter of the spherical terminal 2.

[0153] Reference Figure 28 In (c) thereof, after the IC1 is arranged in the socket device, the IC loading / unloading device 300 is separated from the main body 510. In the process that the slider 530 returns to the original position by a predetermined distance D by the compression force of the contact force generating spring 541, the spherical terminal guide 532 pushes the spherical terminal 2 to the right, so that the spherical terminal 2 contacts the upper tip part 510 with an appropriate contact force.

[0154] Third Embodiment

[0155] Figure 29 FIG. is a plan configuration diagram of the lidless BGA socket device according to the third embodiment of the present invention. Figure 30 For along Figure 29 The Q-Q line of FIG. is a sectional configuration diagram. Figure 31 For along Figure 29 The R-R line of FIG. is a sectional configuration diagram. In this embodiment, the contact adopts a double-clamping type contact with a symmetrical structure. The IC loading / unloading device of the socket device can be disassembled and assembled. Therefore, the IC loading / unloading device is only assembled on the main body when loading and unloading the IC, which is the same as the above embodiment. Therefore, the repeated description is omitted, and the description is centered on the difference points.

[0156] Reference Figures 29 to 31, the socket device 700 of this embodiment includes: a contact 800, which has an upper tip and is elastic in the lateral direction and is in electrical contact with the spherical terminal of the IC1; a main body 710, whose upper surface 710a formed horizontally is provided with an IC configuration portion 710c for configuring the IC, and is formed with a slider receiving portion 710b recessed with respect to the upper surface 710a of the main body 710, and the contact 800 is fixed to the lower surface of the sliding receiving portion 710b; a slider 730, which is received in the slider receiving portion 710b in a vertically slidable manner, slides up and down by a vertical operating force applied in the vertical direction (z-axis direction), and provides a lateral operating force to the contact 800 according to its vertical sliding position, so that the terminal 2 of the IC1 contacts the contact 800; and a contact force generating spring 741, which is provided between the main body 710 and the slider 730, elastically supports the slider 730 along the movable direction (z-axis direction), and provides the contact force between the contact 800 and the terminal of the IC1.

[0157] The lower end of the main body 710 may also have another limiter body portion 720 for fixing the contact 800, and a lead guide 750 for guiding the lead of the contact 800.

[0158] The main body 710 is provided with a plurality of guide holes 711 adjacent to the IC configuration portion 710c. The guide holes 711 guide the assembly position of the IC loading / unloading device.

[0159] The main body 710 includes an upper surface 710a having a horizontal planar structure and an IC configuration portion 710c for configuring the lower edge of the IC1. Specifically, the IC configuration portion 710c vertically extends from the main body 710 and penetrates the slider 730, and protrudes upward from the upper end of the slider 730. Therefore, the bottom edge of the IC1 is partially disposed in the IC configuration portion 710c, and the area of the terminal 2 of the IC1 faces the slider 730 received in the main body 710. This embodiment shows the case where four IC configuration portions 710c are disposed corresponding to the positions of the respective corners of the IC. Preferably, the IC configuration portion 710c is provided with an inclined guide surface 710d, and during the process of loading the IC1, the IC1 can be accurately disposed in the IC configuration portion 710c along the guide surface 710d.

[0160] The upper surface of the slider 730 is provided with a spherical terminal guide 736 for guiding the assembly position of the spherical terminal 2 during the process of loading the IC. In this embodiment, a plurality of blocks equidistantly spaced from the assembly center of the spherical terminal 2 are illustrated as the spherical terminal guide 736, but it is not limited thereto.

[0161] The slider 730 is formed with a first terminal receiving hole 734 and a second terminal receiving hole 735 at a predetermined interval. The first terminal 810 and the second terminal 820 of the contact 800 are inserted into the respective receiving holes 734, 735. Between the adjacent terminal receiving holes 734, 735, there is a movable member 737 for opening which protrudes in an inverted triangle shape. The movable member 737 for opening is inserted between the first terminal 810 and the second terminal 820 and contacts the inner sides of the respective terminals 810, 820. In addition, between the adjacent contacts 800, there is a movable member 739 for closing which protrudes in an inverted triangle shape. The movable member 739 for closing contacts the outer sides of the respective terminals 810, 820.

[0162] The slider 730 is received in the upper part of the main body 710 and assembled with a clearance having a specified height d5, so that it can move up and down. The contact force generating spring 741 elastically supports the slider 730 upward.

[0163] Figure 29 In the figure, the reference numeral 712 indicates the position of the slider operation pin that presses the slider 730 downward when the IC loading / unloading device is disposed on the upper surface of the main body 710. The slider 730 generates a downward operating force through a plurality of slider operation pins, and the slider 730 moves up and down while maintaining a horizontal state during the up and down movement. Also, the slider 730 is elastically supported by a plurality of contact force generating springs 741 to provide sufficient contact force between the contact 800 and the terminals of the IC. The positions and numbers of the slider operation pins and the contact force generating springs of this IC loading / unloading device are variable.

[0164] Figure 32 (a) and (b) of are respectively the front view and the side view configuration diagrams of the double-clamping type contact in the third embodiment of the present invention.

[0165] Reference Figure 32 In this embodiment, the contact 800 is a symmetric double-clamping type contact having a left-right symmetric structure including a first terminal 810 and a second terminal 820. The first terminal 810 and the second terminal 820 face each other across the spherical terminal 2 of the IC and are offset from each other. The contact 800 includes: a contact body 830 that integrally fixes the lower ends of the first terminal 810 and the second terminal 820; and a lead 840 that extends downward from the contact body 830. The first terminal 810 and the second terminal 820 are elastic in the lateral direction, and the lead 840 is assembled into a through hole of a PCB (not shown) and welded and fixed.

[0166] The first terminal 810 includes a first pin 811 and an upper tip portion 812 provided at the upper end of the first pin 811 and directly contacting the spherical terminal 2. Similarly, the second terminal 820 includes a second pin 821 and an upper tip portion 822 provided at the upper end of the second pin 821.

[0167] When the contact body 830 is located in the receiving hole of the main body portion 710, it is supported by the side wall. Therefore, the two terminals 810 and 820 are elastically supported in the horizontal direction.

[0168] Preferably, the upper tip 812 of the first pin 811 and the upper tip 822 of the second pin 821 are offset by a predetermined interval d4 with respect to the center of the spherical terminal 2. Therefore, when the contact 800 of this embodiment comes into contact with the spherical terminal 2, the two upper tips 812 and 822 contact each other with a predetermined interval d4 offset with respect to the spherical terminal 2.

[0169] The first pin 811 and the second pin 821 respectively form inflection points 811a and 821a at a predetermined height, and the distance d5 between the two inflection points 811a and 821a is smaller than the distance d6 between the two upper tips 812 and 822. Therefore, the first pin 811 and the second pin 821 have a shape that separates outward at the upper end with respect to the respective inflection points 811a and 821a.

[0170] Figure 33 (a), (b), and (c) are schematic views showing the opening and closing operations of the contact corresponding to the height of the opening and closing movable member in the third embodiment of the present invention.

[0171] Figure 33 (a) shows the initial state of the socket device before loading the IC. The first terminal 810 and the second terminal 820 are in a state of contacting the adjacent closing movable member 739. At this time, the interval G1 between the two upper tips is smaller than the diameter of the spherical terminal 2.

[0172] Reference Figure 33 Referring to (b), as the opening movable member 737 moves downward between the two terminals 810 and 820 through the downward movement of the slider 730, the interval between the two terminals 810 and 820 is widened. At the lowermost position, the interval G2 between the two upper tips becomes a state where it is widened to be greater than the diameter of the spherical terminal 2.

[0173] As Figure 33 Shown in (c), through the upward movement of the slider in a state where the spherical terminal 2 is disposed between the two upper tips, the two terminals 810 and 820 gather inward due to the closing movable member 739, and the spherical terminal 2 contacts the two upper tips with a predetermined contact force.

[0174] Figure 34 This is a plan view of the IC loading / unloading device in the third embodiment of the present invention. Figure 35 (a) and (b) are respectively cross-sectional views along the S - S line and the T - T line of Figure 34 .

[0175] Reference Figure 34 and Figure 35 The IC loading / unloading device 900 of this embodiment is the same as the above embodiment, and is detachably assembled to the upper part of the main body during the loading / unloading process of the IC and presses the slider, providing an operating force for vertically operating the slider.

[0176] Specifically, the IC loading / unloading device 900 includes: a main body portion 910, which is formed with a substantially rectangular receiving hole 911 corresponding to the IC configuration portion of the main body portion 710; a guide arm 912, which protrudes from the lower end of the main body portion 910; and a slider operation pin 913, which protrudes from the lower end of the main body portion 910.

[0177] The main body portion 910 includes a guiding side wall 914 forming the lower end opening of the receiving hole 911, and an IC guiding inclined surface 915 extending obliquely from the guiding side wall 914, such that the IC is placed along the IC guiding inclined surface 915 within the guiding side wall 914, so that the IC configuration portion can be accurately disposed on the main body portion 710.

[0178] The guide arms 912 are respectively disposed at positions corresponding to the guide holes 711 of the main body portion 710, and guide the assembly position during the assembly process with the main body portion 710.

[0179] The slider operation pin 913 contacts the upper surface of the slider 730 and presses the slider 730 downward, and the positions and numbers of the guide arms 912 and the slider operation pin 913 are variable.

[0180] According to the IC loading / unloading device 900 of this embodiment, it is only assembled with the main body portion 710 when loading and unloading the IC to the socket device, and the IC loading / unloading device 900 is separated from the main body portion 910 during the process of testing the IC.

[0181] Figure 36 (a), (b), and (c) are schematic diagrams briefly showing the contact process between the spherical terminals and the contacts of the IC in the socket device of the third embodiment of the present invention.

[0182] Figure 36 (a) shows the initial state of the socket device. The IC loading / unloading device is in a state of being separated from the main body portion 710, and it is the step before loading the IC. The slider 730 is in a state of being elastically supported by the spring 741 due to the contact force of the contact and is located at the upper end. The first terminal 810 and the second terminal 820 are in a state of contacting the adjacent closing movable member 739, and at this time, the interval G1 between the two upper tip portions is smaller than the diameter of the spherical terminal.

[0183] Reference Figure 36In (b) thereof, the IC loading / unloading device 900 is assembled on the upper part of the main body 710. In this process, the slider operation pin 913 contacts the upper surface of the slider 730 and presses the slider 730. When the opening movable member 737 is inserted between the two terminals 810 and 820, the interval G2 between the two upper tip ends becomes a state where it is expanded to a diameter larger than that of the spherical terminal 2, thereby realizing the loading of the IC 1.

[0184] Reference Figure 36 In (c) thereof, after the IC 1 is arranged in the socket device, the IC loading / unloading device 900 is separated from the main body 710. When the slider 730 moves upward due to the compression force of the spring 741 generated by the contact force of the contact and returns to its original position, the two terminals 810 and 820 gather inward due to the closing movable member 739, so that the spherical terminal 2 contacts the upper tip end with a predetermined contact force.

[0185] Fourth Embodiment

[0186] Figure 37 FIG. is a plan configuration diagram of the lidless BGA socket device according to the fourth embodiment of the present invention. Figure 38 In (a) and (b) thereof, they are respectively sectional configuration diagrams along the Figure 37 U-U line and V-V line of

[0187] Reference Figure 37 and Figure 38 Referring to and, the socket device of this embodiment is detachably attached with a heat sink unit, and the heat sink unit can effectively release the heat generated by the IC 1 during the process of loading the IC 1 and performing tests. As a reference, the socket devices of the first, second, and third embodiments described above can all be equally applied to the heat sink unit described above. In the following description, the socket device of the first embodiment is taken as an example for description.

[0188] Specifically, the main body 210 includes a pair of fixed arms 1110 and 1120. The fixed arms 1110 and 1120 are vertically provided at both side ends of the main body 210 and can be assembled with the heat sink unit.

[0189] The fixed arms 1110 and 1120 are composed of a first fixed arm 1110 and a second fixed arm 1120 that are symmetrically arranged on both side ends of the main body 210. In the following, the first fixed arm 1110 is taken as the center for description.

[0190] The first fixed arm 1110 includes a plate-shaped arm plate 1111 vertically provided at the side end of the main body 210, a hanging end 1112 bent at the upper end of the arm plate 1111, and a release groove 1113 extending inward at the upper end of the arm plate 1111.

[0191] The arm plate 1111 constituting the first fixed arm 1110 may be a structure integrally formed with the main body 210, or a structure assembled to the main body 210 through a locking member such as a bolt. Also, the first fixed arm may not be directly fixed to the main body, but may be fixed to a PCB for fixing the main body 210 separately.

[0192] At the upper end of the arm plate 1111, a bent hanging end 1112 is formed, and this hanging end 1112 is assembled (locked) with a hook protrusion provided on the radiator unit. Also, at the upper end of the arm plate 111, a release groove 1113 recessed inward is formed, and this release groove 1113 can be used to unlock the radiator unit.

[0193] Preferably, the arm plate 1111 has a horizontally arranged flange configuration surface 1114, so as to be used for configuring a flange provided on the radiator unit.

[0194] In this way, a pair of fixed arms 1110 and 1120 arranged symmetrically left and right are detachably assembled with the radiator unit, and the radiator unit releases the heat emitted by the IC during the test process to prevent the IC from overheating.

[0195] Figure 39 It is a plan view configuration diagram of the radiator according to an embodiment of the present invention. Figure 40 For (a) and (b), they are a sectional view configuration diagram and a sectional view configuration diagram along the W-W line of Figure 39 .

[0196] Referring to Figure 39 and Figure 40 , the radiator unit 1200 of this embodiment includes: a housing 1210, which is formed with a through opening, and is provided with a first hook protrusion 1211 protruding downward from the periphery of the opening, and a second hook protrusion 1212 assembled with the fixed arm; a radiator 1220, which is inserted into the opening and assembled in a vertically movable manner, and the vertical movement height of the radiator 1220 is restricted by the first hook protrusion 1211; and a spring 1230, which is interposed between the housing 1210 and the radiator 1220 and elastically supports the radiator 1220 downward.

[0197] In the center of the housing 1210, an opening for inserting the radiator 1220 is formed, and the first hook protrusion 1211 protrudes downward from the opening approximately and is fixed to the lower side edge of the radiator 1220. The housing 1210 is provided with a second hook protrusion 1212 extending downward, and this second hook protrusion 1212 is fixed to the hanging end 1112 of the fixed arm (refer to Figure 38 ). Preferably, the first hook protrusion 1211 is located at a lower position than the second hook protrusion 1212.

[0198] Preferably, the housing 1210 is provided with a flange 1213 formed by extending and protruding, and the lower surface 1213a of the flange 1213 is disposed on the flange arrangement surface 1114 provided on the fixed arm (refer to Figure 38 ).

[0199] The heat sink 1220 may have a plurality of cooling fins 1222 provided on a block-shaped main body. Preferably, a flat portion 1221 is provided in the middle of the upper surface of the heat sink 1220, and this flat portion 1221 can be used for vacuum pick-up during the process of loading and unloading the heat sink unit 1200.

[0200] The spring 1230 is interposed between the housing 1210 and the heat sink 1220 and elastically supports the heat sink 1220 downward, and a known helical spring can be used.

[0201] In addition, the heat sink 1220 has a spring housing portion 1223, and the spring housing portion 1223 is formed with a receiving hole 1223a for inserting the spring 1230. In this embodiment, the case where the lower end of the spring housing portion 1223 is defined by the first hook protrusion 1211 is shown. The upper end of the spring 1230 can be fixed by a spring position groove 1214 provided on the bottom surface of the housing 1210. Figure 41 Figs. (a) and (b) are cross-sectional configuration diagrams showing the loading of the heat sink unit.

[0202] Refer to Figure 41 In (a), when the IC 1 is loaded into the socket device 200, the loading of the IC 1 can be achieved by the IC loading / unloading device described above.

[0203] As Figure 41 shown in (b), when the heat sink unit 1200 is installed on the upper part of the socket device 200, the heat sink unit 1200 is fixed by the first fixed arm 1110 and the second fixed arm 1120.

[0204] Specifically, when described with reference to the second fixed arm 1120, the second hook protrusion 1212 is hooked and fixed to the hooking end 1122 at the upper end of the second fixed arm 1120. At this time, the heat sink 1220 is in a state of contacting the upper surface of the IC 1, and during the process in which the first hook protrusion 1211 is separated from the heat sink 1220 by a predetermined distance d7, the spring 1230 is compressed by an amount corresponding to this length, and the heat sink 1220 and the IC 1 are in a close contact state due to the compression force of the spring 1230. Therefore, during the process of testing the IC, the IC 1 is pressed against the heat sink 1220 and remains in contact, thereby effectively achieving heat dissipation.

[0205] Figure 42 Figs. (a), (b), and (c) are cross-sectional configuration diagrams briefly showing the unloading process of the heat sink unit.

[0206] Reference Figure 42 Figure 42 , when uninstalling the radiator unit 1200, an additional radiator uninstalling device 1300 can be used. The radiator uninstalling device 1300 can be composed of an uninstalling cam 1310 and a vacuum pickup mechanism 1320. The uninstalling cam 1310 moves downward and is inserted between the fixed arm 1110 and the housing 1210 of the radiator unit 1200, and spreads the fixed arm 1110 outward to release the fixed state between the hooked end of the fixed arm 1110 and the first hook protrusion of the radiator unit 1200.

[0207] In addition, a release groove 1113 is formed by concaving inward at the upper end of the first fixed arm 1110 to ensure that there is sufficient gap d8 between the fixed arm and the radiator unit 1200, so that the uninstalling cam 1310 can be easily inserted.

[0208] The vacuum pickup mechanism 1320 is located at the flat portion 1221 provided on the upper surface of the radiator 1210 (reference Figure 39 ), and can be used to pick up the vacuum radiator unit 1200.

[0209] Figure 43 (a), (b), and (c) of are respectively other modified examples for installing the radiator unit on the socket device, which are the plan configuration diagrams of the radiator socket and also the sectional configuration diagrams along the X-X line and the Y-Y line. For reference, the radiator socket of this embodiment uses the same radiator unit as the above examples.

[0210] Reference Figure 43 Figure 43 , the radiator socket 1400 of this embodiment includes: a frame 1410, which is fixed to the PCB and has a quadrilateral structure, and an opening 1411 is formed in the quadrilateral structure; and a pair of fixed arms 1420, 1430, which respectively extend vertically from two opposite sides of the frame 1410 and can be assembled with the radiator unit.

[0211] The frame 1410 has a quadrilateral structure, and an opening 1411 for configuring the socket device is provided at the center of the quadrilateral structure. The frame 1410 is also provided with a plurality of bolt holes 1412 for bolt fixation with the PCB. And the frame 1410 includes a pair of fixed arms 1420, 1430 extending upward along two opposite sides of each other, and a second guide pin 1441 protruding downward. The second guide pin 1441 guides the accurate assembly position with the PCB during the assembly process with the PCB. There can be one or more such guide pins 1441. Although not shown, the frame 1410 may also have welding pins for welding to the PCB.

[0212] The fixed arms 1420 and 1430 are composed of a first fixed arm 1420 and a second fixed arm 1430. The first fixed arm 1420 and the second fixed arm 1430 are symmetrically arranged on two opposite sides of the frame 1410. Hereinafter, the description will be centered around the first fixed arm 1420.

[0213] The first fixed arm 1420 includes an arm member 1421 vertically provided on the frame 1410, a hanging end 1422 bent and formed at the upper end of the arm member 1421, and a release groove 1423 recessed inward from the upper end of the arm member 1421.

[0214] The upper end of the arm member 1421 is formed with a bent hanging end 1422, and the hanging end 1422 is assembled (locked) with a hook protrusion provided on the radiator unit. And the release groove 1423 recessed inward from the upper end of the arm member 1421 can be used to unlock the radiator unit.

[0215] Preferably, a flange configuration surface 1424 with a partially horizontal section is provided at the upper end of the arm member 1421, which can be used to configure a flange provided on the radiator unit.

[0216] A pair of fixed arms 1420 and 1430 that are symmetric in this way are detachably assembled to the radiator unit.

[0217] Figure 44 (a) and (b) of respectively show the sectional configuration diagrams before and after loading the radiator unit using the Figure 43 After assembling the radiator socket 1400 to the PCB that has been assembled with the socket device 200 through a bolt 60, the radiator 1200 is fixed by a pair of fixed arms 1420 and 1430 provided on the radiator socket 1400.

[0218] In addition, the process of loading and unloading the radiator 1200 through the fixed arms 1420 and 1430 of the radiator socket 1400 is the same as that of the embodiment described above.

[0219] As described above, although the present invention has been described through non-limiting embodiments and drawings, those of ordinary skill in the technical field to which the present invention pertains can obviously make various modifications and variations within the equivalent scope of the technical idea of the present invention and the scope of the appended claims.

[0220] Description of Reference Numerals

[0221] 100, 400, 600, 800: Contact

[0222] 200, 500, 700: Socket Device

[0223] 210, 510, 710: Main Body

[0224] 210a: Upper surface

[0225] 210b: Slide block housing part 211: Guide hole

[0226] 212a: Cam support part 213: First receiving hole

[0227] 214: Fixing part 215: Guide pin

[0228] 216: First fixing protrusion 220, 520, 720: Limiter body part

[0229] 230, 530, 730: Slide block 231: Cam contact part

[0230] 232: Assembly catch 233: Spring assembly guide

[0231] 234: Fixed side terminal receiving hole 235: Movable side terminal receiving hole

[0232] 236: Spherical terminal guide 237: Movable part for opening and closing

[0233] 237a: Pressing end for opening 237b: Pressing end for closing

[0234] 238: Distance - maintaining movable part

[0235] 241, 541, 741: Contact force - generating spring

[0236] 250: Lead wire guide

[0237] 300, 900: IC loading / unloading device

[0238] 310: Body part 311: Receiving hole

[0239] 312: Guide arm 313: Slide block driving cam

[0240] 314: Fixed side wall 315: Guide inclined surface

[0241] 1110, 1120: Radiator fixing arm

[0242] 1200: Radiator unit

[0243] 1300: Radiator unloading device

[0244] 1400: Radiator socket

Claims

1. An uncovered BGA socket device for testing semiconductor devices, characterized in that, Comprising: A contact, which has an upper tip portion and is elastic in the lateral direction, and is in electrical contact with the terminals of the IC; A main body portion, which includes a slider receiving portion formed by being recessed from a horizontal upper surface of the main body portion, and a cam support portion formed by being recessed from the upper surface around the slider receiving portion and constituting one end side wall, and the contact is fixed to a lower surface of the slider receiving portion; A slider, which is arranged to be able to slide back and forth horizontally within the slider receiving portion, and has a cam contact portion opposite to the cam support portion at one end, slides back and forth by a lateral operating force applied to the cam contact portion, and transmits the lateral operating force to the contact according to its back-and-forth sliding position, so that the terminals of the IC are in contact with the contact; And A contact contact force generating spring, which is arranged between the main body portion and the slider, elastically supports the slider in the movable direction, and provides a contact force between the contact and the terminals of the IC; A spherical terminal guide, which is arranged on an upper surface of the slider and is used to guide the arrangement position of the terminals of the IC; The contact includes: A pair of terminals, namely a fixed-side terminal and a movable-side terminal, and the upper tip portions are provided at the front ends of the respective terminals; The slider is formed with a fixed-side terminal receiving hole for the fixed-side terminal to pass through and a movable-side terminal receiving hole for the movable-side terminal to pass through, and the offset amount between the fixed-side terminal receiving hole and the movable-side terminal receiving hole is equivalent to the offset length between the two upper tip portions of the fixed-side terminal and the movable-side terminal, and the length of the fixed-side terminal receiving hole is greater than the length of the movable-side terminal receiving hole.

2. The lidless BGA socket device for semiconductor device testing according to claim 1, wherein, Further comprising: An IC loading / unloading device, which is detachably assembled to the upper end of the main body portion and is inserted between the cam support portion and the cam contact portion to provide a lateral operating force for the slider.

3. The lidless BGA socket device for semiconductor device testing according to claim 2, characterized in that, The IC loading / unloading device includes: A main body portion, which has an opening; and A slider driving cam, which protrudes from the lower end of the main body portion and is inserted between the cam support portion and the cam contact portion.

4. The lidless BGA socket device for testing semiconductor devices according to claim 3, characterized in that, The slider driving cam is in the shape of a wedge with a curved surface or an inclined surface formed at the lower front end portion.

5. The lidless BGA socket device for semiconductor device testing according to claim 1, characterized in that The upper tip portions are opposite to each other and aligned with a predetermined interval offset from the terminals of the IC; And A contact body, which integrally fixes the lower ends of the fixed-side terminal and the movable-side terminal; and Leads, which extend downward from the contact body.

6. The lidless BGA socket device for semiconductor device testing according to claim 5, wherein The slider further includes: A plurality of movable-side terminal receiving holes, which are correspondingly arranged with a plurality of the contacts; and An opening / closing movable member, which is arranged between the adjacent movable-side terminal receiving holes, and includes an opening pressing end for pressing the movable-side terminal in the opening direction and a closing pressing end for pressing the movable-side terminal in the closing direction.

7. The lidless BGA socket device for semiconductor device testing according to claim 6, characterized in that, The slider further includes: A distance-keeping movable member is disposed between the fixed-side terminal receiving holes adjacent to each other, and supports the inner side surfaces of the fixed-side terminals to maintain the minimum distance between the upper tip portions on the fixed side and the upper tip portions on the movable side.

8. The lidless BGA socket device for testing semiconductor devices according to claim 1, characterized in that, The contact includes: A single-pin type terminal having the upper tip portion at its front end; A contact body fixed integrally with the lower end of the terminal; and A lead wire extending downward from the contact body.

9. The lidless BGA socket device for semiconductor device testing according to claim 8, wherein: The slider is formed with terminal receiving holes corresponding to a plurality of contacts. The terminal receiving holes are configured to allow the terminals of the contacts to pass through. A distance-keeping movable member protruding downward is provided between the adjacent terminal receiving holes. One side end of each distance-keeping movable member supports the terminal to maintain the minimum interval between the spherical terminal guide and the upper tip portion to be less than the diameter of the terminal of the IC.

10. An open-top BGA socket device for testing semiconductor devices, characterized in that, Comprising: A contact having an upper tip portion and being elastic in the lateral direction, and electrically contacting the terminal of the IC; A main body portion having an IC placement portion for placing the IC on its horizontally formed upper surface, and formed with a slider receiving portion recessed with respect to the upper surface of the main body portion. The contact is fixed to the lower surface of the slider receiving portion; A slider slidably received in the slider receiving portion, sliding up and down by an operating force applied in the vertical direction, and providing a lateral operating force to the contact according to its up and down sliding position to bring the terminal of the IC into contact with the contact; And A contact contact force generating spring disposed between the main body portion and the slider, elastically supporting the slider in the movable direction to provide the contact force between the contact and the terminal of the IC; A spherical terminal guide located on the upper surface of the slider for guiding the placement position of the terminal of the IC; The contact includes: Pin-type first and second terminals, and the upper tip portions are respectively provided at the front ends of the first and second terminals; The slider is formed with first terminal receiving holes and second terminal receiving holes corresponding to a plurality of the contacts at a predetermined interval. The first terminal receiving holes are for inserting and arranging the first terminals, and the second terminal receiving holes are for inserting and arranging the second terminals. The first terminal receiving holes and the second terminal receiving holes are defined by movable members respectively disposed inside and outside the first and second terminals and protruding downward.

11. The lidless BGA socket device for semiconductor device testing according to claim 10, wherein, Further comprising: An IC loading / unloading device detachably assembled to the upper end of the main body portion, and pressing the upper surface of the slider to provide the vertical direction operating force of the slider.

12. The lidless BGA socket device for testing semiconductor devices according to claim 11, characterized in that, The IC loading / unloading device includes: A main body portion having an opening; and A slider operating pin protruding from the lower end of the main body portion and pressing the upper surface of the slider.

13. The lidless BGA socket device for semiconductor device testing according to claim 11, wherein, The first terminal and the second terminal are symmetric left and right; The contact further includes: The contact body integrally fixes the lower ends of the first terminal and the second terminal; The lead wire extends downward from the contact body, The first terminal and the second terminal are respectively formed with inflection points at the same height, and the distance between the two inflection points is less than the distance between the two upper tip portions.

14. The lidless BGA socket device for testing semiconductor devices according to claim 5, 8 or 13, characterized in that: The lead wire has a partial curved section.

15. The lidless BGA socket device for testing semiconductor devices according to claim 1 or 10, characterized in that, The main body portion further includes a pair of fixing arms, which are vertically arranged at both end portions of the main body portion and are assembled with the radiator unit.

16. The lidless BGA socket device for testing semiconductor devices according to claim 15, wherein, Further included: A radiator unit, which is fixed by the fixing arm, contacts the loaded IC and dissipates heat.

17. The lidless BGA socket device for semiconductor device testing according to claim 16, characterized in that, The radiator unit includes: A housing, which is formed with a through opening portion, and is provided with a first hook protrusion formed by protruding downward from the periphery of the opening portion, and a second hook protrusion assembled and fixed with the fixing arm; A radiator, which is inserted into the opening portion and assembled in a vertically movable manner, and the vertical movement height of the radiator is limited by the first hook protrusion; and A spring, which is interposed between the housing and the radiator and elastically supports the radiator downward.

18. A heat sink unit for a socket device, which is a heat sink unit assembled to the lidless BGA socket device for testing semiconductor devices according to any one of claims 1 to 17 to dissipate heat from an IC, characterized in that, Including: A housing, which is formed with a through opening portion, and is provided with a first hook protrusion formed by protruding downward from the periphery of the opening portion, and a second hook protrusion assembled and fixed with the socket device; A radiator, which is inserted into the opening portion and assembled in a vertically movable manner, and the height of the vertical movement is limited by the first hook protrusion; A spring, which is interposed between the housing and the radiator and elastically supports the radiator downward.

19. The radiator unit for the socket device according to claim 18, characterized in that: The first hook protrusion is located at a lower position than the second hook protrusion.

20. A heat sink socket, which is a heat sink socket for installing the heat sink unit as described in claim 18 or 19 for dissipating heat from an IC in a socket device for IC testing assembled on a PCB, characterized in that Including: A frame, which is fixed to the PCB and has a quadrilateral structure, and the quadrilateral structure is formed with an opening portion for arranging the IC test socket device inside; And A pair of fixing arms, which respectively extend upward and are formed on two opposite sides of the frame and can be assembled with the radiator unit, The fixing arm includes: An arm member, which vertically extends from the frame; A hanging end, which is bent and formed at the upper end of the arm member; and A release groove, which is recessed inward at the upper end of the arm member.

Images