A small-area temperature-controlled platform for a probe station

Abstract

The present invention discloses a temperature control platform, particularly a small-area temperature control platform for a probe station, comprising: a first side plate and a second side plate, a radiator is arranged between the first side plate and the second side plate, a refrigeration sheet is arranged above the radiator, a heating sheet is arranged above the refrigeration sheet, and both the refrigeration sheet and the heating sheet are in contact with a heat conduction block. When in use, an article is placed above the heat conduction block, and air is pumped out through a vacuum adsorption air channel, generating negative pressure in the cavity, and then the article is adsorbed on the device through small holes on the heat conduction block, which is very convenient to use. At the same time, the first side plate of the device communicates the cavity with the outside by arranging a vacuum adsorption air channel and a groove, greatly simplifying the device, with a compact design, low cost, and good use effect.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor detection equipment, and particularly relates to a small-area temperature control platform for a probe station. Background Art

[0002] With the continuous development of semiconductor testing, considering cost, quality control, and process optimization, introducing high and low temperature testing in the wafer probe testing stage has become an essential topic, which includes high and low temperature electrical performance testing, as well as aging and reliability testing. The lifespan of most semiconductor devices can be as long as several years under normal use, but we cannot wait several years to study the devices. We must increase the applied stress (such as temperature, etc.) to accelerate the discovery of potential faults. In most cases, this accelerated testing will not change the physical characteristics of the faults, but only shorten the observation time. In the prior art in the field of probe station temperature control, there are different implementation methods for wafer chuck heating and cooling respectively. There are mainly two methods that can be compatible with both high and low temperature requirements: one is to use dry compressed air as the heat exchange medium, and control the temperature of the device under test by injecting compressed air at a specific temperature into the chuck. The disadvantage of this method is that it has high requirements for the factory compressed air, requires a continuous supply of high-pressure gas source, has a large energy consumption, a high equipment cost, and since the specific heat capacity of air is small, the heating and cooling efficiency is lower than that of the method using liquid as the refrigerant; the other is to use a thermoelectric cooler as the heating and cooling device to control the temperature of the device under test. Its principle is the Peltier effect. Briefly speaking, under the action of an external electric field, electrons move directionally, and part of the internal energy is carried to the other end of the electric field, but it will generate Joule heat, resulting in a limited lower limit of the extreme low temperature that can be achieved by this method, and due to its own power limitation and heat dissipation reasons, the upper limit of the high temperature that can be achieved is also limited. In addition, this device is prone to aging and damage, and it is extremely inconvenient to repair and replace.

[0003] Generally speaking, the existing solutions do not combine heating and cooling well, and are not very convenient to use, resulting in an unsatisfactory use effect. Summary of the Invention

[0004] The present invention aims to solve the problems existing in the above-mentioned prior art, and provides a small-area temperature control platform for a probe station to solve the current technical problems.

[0005] The technical solution adopted by the present invention to solve its technical problems is as follows:

[0006] The present invention provides a small-area temperature control platform for a probe station, including: a first side plate and a second side plate, a radiator is arranged between the first side plate and the second side plate, a thermoelectric cooler is arranged above the radiator, a heating plate is arranged above the thermoelectric cooler, and both the thermoelectric cooler and the heating plate are in contact with a heat conducting block.

[0007] Preferably, a third side plate and a fourth side plate are further connected between the first side plate and the second side plate, and the first side plate, the second side plate, the third side plate, the fourth side plate, the radiator and the heat conducting block enclose a cavity.

[0008] Preferably, a plurality of small holes penetrating through the heat conducting block are uniformly distributed on the heat conducting block, and the small holes are communicated with the cavity.

[0009] Preferably, a vacuum adsorption air channel penetrating through the first side plate is arranged on the first side plate, and the vacuum adsorption air channel is communicated with the cavity through a groove.

[0010] Preferably, the heating sheet and the cooling sheet are electrically connected to the outside through a 9P aviation plug, and the 9P aviation plug is arranged on the first side plate.

[0011] Preferably, a cooling fan is arranged below the radiator.

[0012] Preferably, heat dissipation holes are arranged at the edges of the third side plate and the fourth side plate.

[0013] Preferably, the heating sheet is located between the cooling sheet and the heat conducting block.

[0014] Preferably, the heating sheet is a ceramic heating sheet.

[0015] Preferably, the cooling sheet is a semiconductor cooling sheet.

[0016] The beneficial effects of the present invention are as follows: When in use, an article is placed above the heat conducting block, and air is pumped out through the vacuum adsorption air channel, a negative pressure will be generated in the cavity, and then the article will be adsorbed on the device through the small holes on the heat conducting block, which is very convenient to use. At the same time, the first side plate of the device is communicated with the outside through the vacuum adsorption air channel and the groove, greatly simplifying the device, with a compact design, low cost and good use effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above aspects and advantages of the present invention will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 is a schematic structural diagram of a small-area temperature control platform of a probe station according to an embodiment of the present invention;

[0019] Figure 2 is another schematic structural diagram of a small-area temperature control platform of a probe station according to an embodiment of the present invention;

[0020] Figure 3 is a schematic structural diagram of the internal structure of a small-area temperature control platform of a probe station according to an embodiment of the present invention;

[0021] Figure 4It is another schematic structural diagram of the internal structure of the small-area temperature control platform of the probe station in the embodiment of the present invention;

[0022] Figure 5 It is another schematic structural diagram of the internal structure of the small-area temperature control platform of the probe station in the embodiment of the present invention;

[0023] Figure 6 It is another schematic structural diagram of the internal structure of the small-area temperature control platform of the probe station in the embodiment of the present invention;

[0024] Figure 7 It is a schematic structural diagram of the first side plate of the small-area temperature control platform of the probe station in the embodiment of the present invention;

[0025] Figure 8 It is another schematic structural diagram of the first side plate of the small-area temperature control platform of the probe station in the embodiment of the present invention;

[0026] Figure 9 It is a schematic structural diagram of the heat conduction block of the small-area temperature control platform of the probe station in the embodiment of the present invention;

[0027] Figure 10 It is another schematic structural diagram of the heat conduction block of the small-area temperature control platform of the probe station in the embodiment of the present invention.

[0028] Explanation of reference numerals:

[0029] In Figures 1 - 10 it, heat conduction block 1; first side plate 2; second side plate 3, third side plate 4; fourth side plate 5; heat dissipation hole 6; small hole 7; heating sheet 8; refrigeration sheet 9; groove 10; cavity 11; radiator 12; fan 13; 9P aviation plug 14; vacuum adsorption air duct 15; stepped groove 16; strip groove 17. Detailed implementation manners

[0030] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0031] The present invention provides a small-area temperature control platform for a probe station, comprising: a first side plate 2 and a second side plate 3. A radiator 12 is arranged between the first side plate 2 and the second side plate 3. A refrigeration chip 9 is arranged above the radiator 12, and a heating chip 8 is arranged above the refrigeration chip 9. Both the refrigeration chip 9 and the heating chip 8 are in contact with a heat conduction block 1. The first side plate 2, the second side plate 3, the third side plate 4 and the fourth side plate 5 can all be made of metal plates or plastic plates. The radiator 12 is a copper plate, on which a number of copper fins are installed. The heat conduction block 1 is a copper plate. As shown in the appendix Figure 9 it has a stepped groove 16 at the bottom; the stepped groove 16 is used to place the refrigeration chip 9 and the heating chip 8. A bar-shaped groove 17 with a deeper depth is also arranged at the bottom of the stepped groove 16, which is used to keep the small hole 7 in communication with the cavity 11.

[0032] A third side plate 4 and a fourth side plate 5 are also connected between the first side plate 2 and the second side plate 3. The first side plate 2, the second side plate 3, the third side plate 4, the fourth side plate 5, the radiator 12 and the heat conduction block 1 enclose a cavity 11. The heating chip 8 and the refrigeration chip 9 are both located in this cavity 11. The connection methods between the first side plate 2, the second side plate 3, the third side plate 4, the fourth side plate 5, the radiator 12 and the heat conduction block 1 are all bonded with glue and are all sealed connections. The joints are airtight and airtight. Therefore, the edges of this cavity 11 are all hermetically connected. There are only two paths for the cavity 11 to communicate with the outside world. One is the small hole 7 on the heat conduction block 1, and the other is the passage composed of the groove 10 and the vacuum adsorption air duct 15.

[0033] A number of small holes 7 penetrating the heat conduction block 1 are evenly distributed on the heat conduction block 1, and the small holes 7 are in communication with the cavity 11. A vacuum adsorption air duct 15 penetrating the first side plate 2 is arranged on the first side plate 2, and the vacuum adsorption air duct 15 is in communication with the cavity 11 through the groove 10. The vacuum adsorption air duct 15 is a through hole. The heating chip 8 and the refrigeration chip 9 are electrically connected to the outside through a 9P aviation plug 14, and the 9P aviation plug 14 is arranged on the first side plate 2. A cooling fan 13 is arranged below the radiator 12. Heat dissipation holes 6 are arranged at the edges of the third side plate 4 and the fourth side plate 5, and the heat dissipation holes 6 are a number of through holes. The heating chip 8 is located between the refrigeration chip 9 and the heat conduction block 1. The heating chip 8 is a ceramic heating chip. The refrigeration chip 9 is a semiconductor refrigeration chip.

[0034] During use, place an item above the heat conduction block 1 and evacuate air through the vacuum adsorption air duct 15, which will generate negative pressure in the cavity 11, and then adsorb the item on the device through the small holes 7 on the heat conduction block 1. It is very convenient to use. At the same time, the first side plate 2 of the device communicates the cavity 11 with the outside through the vacuum adsorption air duct 15 and the groove 10, greatly simplifies the device, has a compact design, low cost, and good use effect.

[0035] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A small-area temperature-controlled platform for a probe station, comprising: The first side plate and the second side plate, characterized in that: a radiator is arranged between the first side plate and the second side plate, a refrigeration sheet is arranged above the radiator, a heating sheet is arranged above the refrigeration sheet, and both the refrigeration sheet and the heating sheet are in contact with a heat conduction block; a third side plate and a fourth side plate are further connected between the first side plate and the second side plate, and the first side plate, the second side plate, the third side plate, the fourth side plate, the radiator and the heat conduction block enclose a cavity; a plurality of small holes penetrating through the heat conduction block are uniformly distributed on the heat conduction block, and the small holes are communicated with the cavity; a vacuum adsorption air passage penetrating through the first side plate is arranged on the first side plate, and the vacuum adsorption air passage is communicated with the cavity through a groove; the radiator is a copper plate, and a plurality of copper fins are installed on it, and the heat conduction block is a copper plate, and there is a stepped groove on the bottom surface of the heat conduction block; the stepped groove is used for placing the refrigeration sheet and the heating sheet.

2. The small-area temperature control platform of the probe station according to claim 1, wherein: The heating sheet and the refrigeration sheet are electrically connected to the outside through a 9P aviation plug, and the 9P aviation plug is arranged on the first side plate.

3. The small-area temperature control platform of the probe station according to claim 1, wherein: A cooling fan is arranged below the radiator.

4. The small-area temperature control platform of the probe station according to claim 1, wherein: Heat dissipation holes are arranged at the edges of the third side plate and the fourth side plate.

5. The small-area temperature control platform of the probe station according to claim 1, characterized in that: The heating sheet is located between the refrigeration sheet and the heat conduction block.

6. The small-area temperature control platform of the probe station according to claim 1, wherein: The heating sheet is a ceramic heating sheet.

7. The small-area temperature control platform of the probe station according to claim 1, characterized in that: The refrigeration sheet is a semiconductor refrigeration sheet.

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