An integrated circuit chip manufacturing apparatus

Abstract

The application belongs to the technical field of chip manufacturing, and particularly relates to an integrated circuit chip manufacturing device, which comprises a cleaning box body, a box cover, a recovery cavity, a liquid storage cavity and a fixing unit. The top of the cleaning box body is provided with the box cover. The middle part of the box cover is provided with a mounting groove. The box cover is connected with the top of the cleaning box body through bolts. The middle part of the bottom of the cleaning box body is provided with the recovery cavity. In the application, the wafer to be cleaned is fixed on the fixing ring, and the telescopic rod in the first cavity is started to push the end of the telescopic rod to drive the fixed plate to move upwards, so that the first groove is exposed, and the fixing ring is embedded in the first groove. The box cover does not need to be repeatedly opened, the speed of wafer fixing is accelerated, the cover plate is reset, the processing and cleaning efficiency of the wafer is improved, the spray heads are symmetrically arranged, the wafer is vertically installed, and the cleaning effect on the wafer surface is more uniform and comprehensive.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of chip manufacturing technology, in particular to an integrated circuit chip manufacturing device. BACKGROUND

[0002] Wafer refers to the silicon wafer used in the process of manufacturing silicon semiconductor integrated circuit chip. It is called wafer because of its circular shape. Various circuit element structures can be processed and manufactured on the silicon wafer to become integrated circuit products with specific electrical functions. The manufacturing of integrated circuit chip is the core of electronic information industry and one of the most important high-techs to promote the development of national economy and social informationization. With the development of wafer towards large size and fine lines, the requirement for wafer surface flatness is also higher and higher. Therefore, chemical mechanical polishing equipment is also paid more and more attention in the field of integrated circuit. In the process of chemical mechanical polishing, the cleaning mechanism is the last link of the whole polishing process. Each detail of cleaning action and each structure of cleaning mechanism must be strictly controlled to ensure the cleanliness and flatness of wafer surface after cleaning, so as to realize the full cleaning of wafer and make the pass rate of wafer polishing process higher.

[0003] The cleaning of large-diameter wafer is not easy to ensure the completion of the cleaning process by using ordinary cleaning method. Single wafer cleaning method is usually used, that is, the cleaning liquid is used to fully clean only a single wafer during work, and then the next wafer is cleaned.

[0004] A patent in the prior art also appears a technical scheme about a cleaning device for single crystal silicon carbide wafer, such as a Chinese patent with application number 2019219085620 discloses a cleaning device for single crystal silicon carbide wafer, which comprises a bottom plate, a base is fixedly connected inside one side of the bottom plate, a first motor is fixedly connected at the inside center of the base, the rotating shaft top end of the first motor is fixedly connected with a turntable, a plurality of suction cups are fixedly connected to the top end of the turntable, a waste liquid tank is fixedly connected to the bottom end of the bottom plate, a lifting groove is fixedly connected to the center of the bottom plate, a fifth motor is fixedly connected to the bottom end center of the lifting groove, the rotating shaft top end of the fifth motor is fixedly connected with a threaded rod, and the inside center of the lifting seat is threadedly connected with a threaded rod. The utility model realizes the multi-axis rotation of the cleaning nozzle through the setting of multiple motors and rotating seats, rotates the wafer through the turntable, cooperates with the multi-axis rotation of the nozzle, realizes the omnidirectional cleaning of the wafer, increases the cleaning area, and reduces the time used for single-point water flow pre-cleaning. However, the above-mentioned patent still has defects. The dust cover needs to be opened when the single crystal silicon carbide wafer is installed and after the cleaning is completed, and the opening process of the dust cover takes a long time. Therefore, during batch production, the installation of the single crystal silicon carbide wafer takes a long time, which affects the cleaning efficiency of the single crystal silicon carbide wafer. And during the cleaning process, the single crystal silicon carbide wafer is fixed horizontally, and the upper surface is mainly affected by the cleaning liquid, so that the cleaning effect on the upper and lower surfaces is uneven, which may cause the lower surface of the single crystal silicon carbide wafer not to be completely cleaned. At this time, in order to ensure the cleanliness of the single crystal silicon carbide wafer, the single crystal silicon carbide wafer needs to be installed upside down, so that the lower surface moves to the upper surface and is cleaned again. Such cleaning process takes a long time and is low in efficiency.

[0005] In view of this, the present application provides an integrated circuit chip manufacturing equipment to solve the above technical problems. SUMMARY

[0006] In order to make up for the shortcomings of the prior art, solve the low working efficiency of the wafer cleaning device in the existing integrated circuit chip manufacturing equipment, and make the cleaning effect on the wafer surface uniform and comprehensive.

[0007] The technical scheme adopted by the present application to solve its technical problems is: the integrated circuit chip manufacturing equipment comprises a cleaning box body, a box cover, a recovery cavity, a liquid storage cavity and a fixing unit, the box cover is installed on the top of the cleaning box body, the middle part of the box cover is provided with a mounting groove, the box cover is connected with the top of the cleaning box body through bolts, the middle part of the bottom of the cleaning box body is provided with a recovery cavity, the recovery cavity is communicated with the outside through a recovery pipe, and the top of the recovery cavity is concave downward and uniformly provided with a hole; the bottom of the cleaning box body is symmetrically provided with a liquid storage cavity on both sides of the recovery cavity, and the liquid storage cavity is communicated with the outside through a liquid inlet pipe; the fixing unit comprises a fixing plate, a fixing ring and a cover plate, the fixing plate is nested on the mounting groove and keeps vertical, the fixing plate is slidingly connected with the mounting groove, the fixing plate is fixedly connected with a No. 1 plate, and the No. 1 plate is in contact with the upper surface of the box cover; the upper surface of the box cover is provided with a No. 1 cavity corresponding to the No. 1 plate, a telescopic rod is fixedly connected in the No. 1 cavity, and the end of the telescopic rod is fixedly connected with the lower surface of the No. 1 plate corresponding to the No. 1 cavity; the end of the fixing plate located in the inside of the cleaning box body is opposite to the top of the recovery cavity, and the bottom of the fixing plate located in the inside of the cleaning box body is rotationally connected with the cover plate, the part of the cover plate opposite to the surface of the fixing plate is in contact with the surface of the fixing plate, and the top of the cover plate and the corresponding part of the fixing plate are fixedly connected with a fixed magnet respectively; the surface of the fixing plate opposite to the cover plate is provided with a No. 1 groove, the No. 1 groove is circular in cross section, and the fixing ring is embedded in the No. 1 groove, and the fixing ring is used for fixing the wafer; a No. 1 annular groove is arranged on the inner hole surface of the fixing ring, and the wafer is nested in the No. 1 annular groove; the fixing ring comprises two identical half rings, and the ends of the two half rings are connected through buckles; the No. 1 groove is provided with a circular No. 1 through hole, the No. 1 through hole extends towards the cover plate and penetrates through the cover plate, and the diameter of the No. 1 through hole is the same as that of the inner hole of the fixing ring; a nozzle is fixedly connected above the liquid storage cavity, the nozzle is communicated with the cleaning liquid filled in the inside of the liquid storage cavity, and the end of the nozzle points to the direction close to the No. 1 through hole.

[0008] In operation, for a wafer with a large diameter, in order to ensure that the wafer is subjected to a more rapid cleaning process, improve the cleaning efficiency, and further improve the working efficiency of the entire production line, the wafer to be cleaned is first fixed on the fixing ring; because the fixing ring is formed by splicing two identical half rings, when the wafer is installed, the edge portion of the wafer is first inserted into the No. 1 annular groove on the half ring, and then the two half ring ends are combined, so as to realize the fixation of the wafer by the fixing ring; and the width of the fixing ring is greater than the thickness of the wafer, so that the edge portion of the wafer can be protected during the stacking process and the cleaning process, avoiding damage to the edge portion of the wafer due to collision, and affecting the integrity of the wafer; the telescopic rod in the No. 1 cavity is started, and the extension distance of the telescopic rod is set, so that the end of the telescopic rod pushes the No. 1 plate to drive the fixed plate to move upward, and the No. 1 groove on the fixed plate is completely raised above the box cover; at this time, the cover plate is rotated to expose the No. 1 groove, the fixing ring is inserted into the No. 1 groove, and then the cover plate is reset; at this time, the cover plate is fixed by the mutual combination of the fixed magnets on the top and the fixed magnets on the corresponding parts of the fixed plate, so as to ensure that the fixing ring in the No. 1 groove is subjected to a limiting action; after installation is completed, the telescopic rod is reset, at this time the fixed plate drives the fixing ring to move vertically into the cleaning tank body, after the fixed plate moves to the corresponding position, the nozzles on both sides of the fixed plate are started, the cleaning liquid from the liquid storage cavity forms a fine stream under the action of the nozzles, and acts on the two side surfaces of the wafer through the No. 1 through hole; because the nozzles are symmetrically arranged, it is ensured that the impact on the two side surfaces of the wafer is uniform and symmetrical, and the water flow-shaped cleaning liquid contacts the wafer surface and flows outward along the wafer surface under the action of the impact force, and finally flows downward under the action of gravity, so that the cleaning effect on the wafer surface is more uniform and comprehensive; the cleaning liquid carrying the impurities and dust on the wafer flows downward along the fixed plate and falls on the top of the recovery cavity, enters the recovery cavity through the No. 1 hole for recovery treatment; after cleaning is completed, the telescopic rod is started again to move the fixed plate upward, the cover plate is opened to take out the cleaned wafer together with the fixing ring, and a new wafer to be cleaned is replaced; while ensuring the sealing of the cleaning tank body during the cleaning process, the box cover does not need to be repeatedly opened, the speed of wafer fixation is accelerated, and the wafer processing and cleaning efficiency is improved.

[0009] Preferably, the end of the nozzle is conical, and the end of the nozzle is inclined towards the top of the No. 1 through hole.

[0010] In operation, because of the action of gravity, the cleaning liquid stream sprayed by the nozzle has a tendency to bend downward, in order to ensure that the portion of the wafer surface close to the top of the No. 1 groove is subjected to sufficient cleaning effect, the end of the nozzle is inclined upward, so that the cleaning liquid stream sprayed by the nozzle first acts on the portion of the wafer surface close to the top in the No. 1 through hole, and because the wafer is vertically fixed, the cleaning liquid on the wafer flows downward along the wafer surface, so that the cleaning effect on the wafer surface is more comprehensive.

[0011] Preferably, the side wall of the first groove is provided with a second groove at the position opposite to the recovery cavity, and the width of the second groove is less than the diameter of the outer circle of the fixing ring; the side wall of the first annular groove of the fixing ring is uniformly provided with a plurality of first through grooves.

[0012] In operation, during the cleaning process of the wafer, the cleaning liquid seeps into the gap of the first annular groove of the fixing ring, flows inside the first annular groove, and finally flows into the first groove from the first through grooves uniformly distributed on the first annular groove; in this process, the cleaning liquid fully cleans the edge of the wafer and removes the impurity particles from the first through grooves, ensuring that the wafer is more fully cleaned, and ensuring that the inner surface of the first annular groove is clean, facilitating the continuous use of the fixing ring, accelerating the cleaning efficiency of the wafer, and further ensuring the quality of the final chip production; the cleaning liquid flowing into the first groove flows out through the second groove and falls on the top of the recovery cavity, and the width of the first groove is less than the diameter of the fixing ring, avoiding the fixing ring from falling off the first groove and accelerating the recovery of the cleaning liquid.

[0013] Preferably, the side wall of the first groove is provided with a third groove near the top, a first gear is rotatably connected in the third groove, and the first gear is connected with a motor inside the side wall of the third groove through a shaft fixed at the middle position; the outer surface of the fixing ring is uniformly provided with driving teeth, and the driving teeth are engaged with the first gear.

[0014] In operation, the motor connected with the shaft is started to drive the shaft to rotate the first gear, and the first gear is engaged with the driving teeth provided on the outer surface of the fixing ring, so that the first gear drives the fixing ring to rotate, and the rotating fixing ring drives the wafer to rotate, and the end of the nozzle is not opposite to the center of the wafer, so that the cleaning liquid jetted by the nozzle can act on different parts of the rotating wafer surface, so that the impact on the wafer surface is more uniform and the cleaning effect is more comprehensive; and as the fixing ring rotates, the cleaning liquid in the first annular groove rotates faster, so that the edge of the wafer and the inner surface of the first annular groove are more fully cleaned, further improving the cleaning efficiency of the wafer; and the driving teeth uniformly distributed on the outer surface of the fixing ring accelerate the flow of the cleaning liquid in the gap between the first groove and the outer surface of the fixing ring, on the one hand, accelerating the flow of the cleaning liquid out of the second groove and speeding up the recovery of the cleaning liquid; on the other hand, the inner surface of the second groove is more fully cleaned, thereby ensuring the cleanliness of the inner surface of the second groove; in addition, the cleaning liquid seeps into the gap between the end of the driving tooth and the inner surface of the second groove, lubricating the relative movement between the end of the driving tooth and the inner surface of the second groove, and reducing the wear of the end of the driving tooth on the inner surface of the second groove.

[0015] Preferably, the width of the first annular groove is greater than the thickness of the edge portion of the wafer, and a plurality of pairs of fixing blocks are fixed to the side wall of the first annular groove, and the spacing between each pair of fixing blocks is less than the thickness of the edge portion of the wafer, and the fixing blocks are made of rubber.

[0016] In operation, during the combination of the wafer and the fixing ring, the edge portion of the wafer is inserted into the gap between the fixing blocks, and because the spacing between the fixing blocks is less than the thickness of the edge portion of the wafer, the fixing blocks are deformed under pressure and are in close contact with the surface of the wafer, thereby ensuring the fixation of the wafer by the fixing ring and further ensuring the stability of the wafer during the rotation of the fixing ring, so as to avoid the wafer from slipping and colliding with the inner surface of the first annular groove during the rotation of the fixing ring; and the width of the first annular groove is greater than the thickness of the edge portion of the wafer, which is conducive to the flow of the cleaning liquid along the surface of the wafer and into the first annular groove through the gap between the adjacent fixing blocks, so as to accelerate the flow with the rotation of the fixing ring and make the edge portion of the wafer be more fully cleaned.

[0017] Preferably, the opposite surfaces of each pair of fixing blocks located at the inner portion of the first annular groove are provided with grooves, and the cross section of the grooves is triangular.

[0018] In operation, because the opposite surfaces of the fixing blocks located at the inner portion of the first annular groove are provided with triangular grooves, the cross section of the part of the fixing blocks in contact with the edge portion of the wafer is small and the pressure is high, so that the wafer is more stably fixed and further kept stable during the cleaning process; and when the cleaning liquid flows in the first annular groove, a part of the cleaning liquid flows into the gap between the opposite surfaces of the fixing blocks and the wafer through the grooves, and the part of the wafer located in the gap is cleaned, so that the wafer is more thoroughly cleaned.

[0019] The beneficial effects of the present application are as follows:

[0020] 1. The integrated circuit chip manufacturing equipment disclosed by the present application can fix the wafer to be cleaned on the fixing ring, and start the telescopic rod in the first cavity to push the end of the telescopic rod to drive the fixing plate to move upwards, so that the first groove is exposed, the fixing ring is inserted into the first groove, and the cover plate is reset, thereby improving the processing and cleaning efficiency of the wafer; and the nozzles are symmetrically arranged, and the wafer is vertically installed, so that the cleaning effect on the surface of the wafer is more uniform and comprehensive.

[0021] 2. The integrated circuit chip manufacturing equipment of the present application, by connecting a gear and a rotating shaft in the third groove, and making the outer surface of the fixed ring uniformly distributed with driving teeth; starting the motor connected with the rotating shaft, so that the rotating shaft drives the gear to rotate, the rotating fixed ring drives the wafer to rotate, so that the cleaning liquid stream sprayed by the nozzle can act on different parts of the rotating wafer surface, so that the impact on the wafer surface is more uniform, and the cleaning effect is more comprehensive. BRIEF DESCRIPTION OF DRAWINGS

[0022] The present application will be further described below in conjunction with the drawings.

[0023] Figure 1 is a perspective view of the present application;

[0024] Figure 2 is a perspective view of the present application without the cover plate;

[0025] Figure 3 is Figure 2 is a partial enlarged view of A in FIG.

[0026] Figure 4 is a front view of the present application;

[0027] Figure 5 is Figure 4 is a sectional view of B-B direction in FIG.

[0028] Figure 6 is Figure 5 is a partial enlarged view of C in FIG.

[0029] Figure 7 is a perspective view of the fixed ring in the present application;

[0030] In the figure: cleaning tank body 1, tank cover 2, mounting groove 21, first cavity 22, telescopic rod 23, recovery cavity 3, recovery pipe 31, first hole 32, liquid storage cavity 4, liquid inlet pipe 41, nozzle 42, fixing unit 5, fixed plate 51, first plate 511, first groove 512, first through hole 513, second groove 514, third groove 515, first gear 516, rotating shaft 517, fixed ring 52, first annular groove 521, half ring 522, first through groove 523, driving teeth 524, fixed block 525, recess 526, cover plate 53, fixed magnet 531, wafer 6. DETAILED DESCRIPTION

[0031] In order to make the technical means, creative features, purposes and effects realized by the present application easy to understand, the present application will be further described below in conjunction with specific embodiments.

[0032] As Figures 1 to 7As shown, the integrated circuit chip manufacturing device comprises a cleaning box body 1, a box cover 2, a recovery cavity 3, a liquid storage cavity 4 and a fixing unit 5, the top of the cleaning box body 1 is provided with the box cover 2, the middle part of the box cover 2 is provided with a mounting groove 21, the box cover 2 is connected with the top of the cleaning box body 1 through bolts, the middle part of the bottom of the cleaning box body 1 is provided with the recovery cavity 3, the recovery cavity 3 is communicated with the outside through a recovery pipe 31, and the top of the recovery cavity 3 is concave downward and uniformly provided with a first hole 32; the bottom of the cleaning box body 1 is symmetrically provided with the liquid storage cavity 4 at both sides of the recovery cavity 3, and the liquid storage cavity 4 is communicated with the outside through a liquid inlet pipe 41; the fixing unit 5 comprises a fixing plate 51, a fixing ring 52 and a cover plate 53, the fixing plate 51 is nested on the mounting groove 21 and kept in a vertical state, and the fixing plate 51 is slidingly connected with the mounting groove 21, the fixing plate 51 is fixedly connected with a first plate 511, and the first plate 511 is in contact with the upper surface of the box cover 2; the upper surface of the box cover 2 is provided with a first cavity 22 corresponding to the first plate 511, a telescopic rod 23 is fixedly connected in the first cavity 22, and the end of the telescopic rod 23 is fixedly connected with the lower surface of the first plate 511 corresponding to the first cavity 22; the end of the fixing plate 51 located in the inside of the cleaning box body 1 is opposite to the top of the recovery cavity 3, and the bottom of the fixing plate 51 located in the inside of the cleaning box body 1 is rotationally connected with the cover plate 53, the part of the cover plate 53 opposite to the surface of the fixing plate 51 is in contact with the surface of the fixing plate 51, and the top of the cover plate 53 and the corresponding part of the fixing plate 51 are respectively fixedly connected with a fixed magnet 531; the surface of the fixing plate 51 opposite to the cover plate 53 is provided with a first groove 512, the first groove 512 is circular in cross section, and the fixing ring 52 is embedded on the first groove 512, and the fixing ring 52 is used for fixing a wafer 6; a first annular groove 521 is arranged on the inner hole surface of the fixing ring 52, and the wafer 6 is nested in the first annular groove 521; the fixing ring 52 comprises two identical half rings 522, and the ends of the two half rings 522 are connected through buckles; a circular first through hole 513 is arranged on the first groove 512, the first through hole 513 extends towards the cover plate 53 and penetrates through the cover plate 53, and the diameter of the first through hole 513 is the same as the diameter of the inner hole of the fixing ring 52; a shower head 42 is fixedly connected above the liquid storage cavity 4, the shower head 42 is communicated with the cleaning liquid filled in the inside of the liquid storage cavity 4, and the ends of the shower heads 42 all point to the direction close to the first through hole 513.

[0033] In operation, for a wafer 6 with a large diameter, in order to ensure that the wafer 6 is subjected to a more rapid cleaning process, improve the cleaning efficiency, and further improve the working efficiency of the entire production line, first, the wafer 6 to be cleaned is fixed on the fixing ring 52; because the fixing ring 52 is formed by splicing two identical half rings 522, when the wafer 6 is installed, the edge portion of the wafer 6 is first inserted into the No. 1 annular groove 521 on the half ring 522, and then the two half rings 522 are combined at the ends, so as to realize the fixation of the wafer 6 by the fixing ring 52; because the width of the fixing ring 52 is greater than the thickness of the wafer 6, the fixing ring 52 can protect the edge portion of the wafer 6 during the stacking process and the cleaning process, so as to avoid damage to the edge portion of the wafer 6 due to collision, and affect the integrity of the wafer 6; the telescopic rod 23 in the No. 1 cavity 22 is started, and the extension distance of the telescopic rod 23 is set, so that the telescopic rod 23 end pushes the No. 1 plate 511 to drive the fixed plate 51 to move upwards, and the No. 1 groove 512 on the fixed plate 51 is completely lifted above the box cover 2, at this time, the cover plate 53 is rotated to expose the No. 1 groove 512, the fixing ring 52 is inserted into the No. 1 groove 512, and then the cover plate 53 is reset, at this time, the cover plate 53 is fixed by the mutual combination of the fixed magnets 531 on the top and the fixed magnets 531 on the corresponding positions of the fixed plate 51, so as to ensure that the fixing ring 52 in the No. 1 groove 512 is subjected to a limiting action; after the installation is completed, the telescopic rod 23 is reset, at this time, the fixed plate 51 drives the fixing ring 52 to move vertically into the cleaning box body 1, after the fixed plate 51 moves to the corresponding position, the nozzles 42 on both sides of the fixed plate 51 are started, the cleaning liquid from the liquid storage cavity 4 forms fine water flow under the action of the nozzles 42, and acts on the two side surfaces of the wafer 6 through the No. 1 through hole 513; because the nozzles 42 are symmetrically arranged, it is ensured that the impact on the two side surfaces of the wafer 6 is uniform and symmetrical, and the water flow-shaped cleaning liquid contacts the surface of the wafer 6, and flows outward along the surface of the wafer 6 under the action of the impact force, and finally flows downward under the action of gravity, so that the cleaning effect on the surface of the wafer 6 is more uniform and comprehensive; the cleaning liquid carrying the impurities and dust on the wafer 6 flows downward along the fixed plate 51 and falls on the top of the recovery cavity 3, enters the recovery cavity 3 through the No. 1 hole 32, and is recovered; after the cleaning is completed, the telescopic rod 23 is started again to move the fixed plate 51 upward, the cover plate 53 is opened, the wafer 6 after cleaning is taken out together with the fixing ring 52, and a new wafer 6 to be cleaned is replaced, which ensures the sealing of the cleaning box body 1 during the cleaning process, does not need to be repeatedly opened, speeds up the fixing speed of the wafer 6, and improves the processing and cleaning efficiency of the wafer 6.

[0034] As an embodiment of the present application, the end of the nozzle 42 is conical, and the end of the nozzle 42 is inclined to the top portion inside the No. 1 through hole 513.

[0035] When working, the cleaning liquid jetted by the nozzle 42 has a tendency to bend downward due to the gravity, in order to ensure that the surface of the wafer 6 near the top of the first slot 512 is fully cleaned, the end of the nozzle 42 is inclined upward, so that the cleaning liquid jetted by the nozzle 42 first acts on the surface of the wafer 6 near the top in the first through hole 513, and because the wafer 6 is vertically fixed, the cleaning liquid on the wafer 6 flows downward along the surface of the wafer 6, so that the wafer 6 is more fully cleaned.

[0036] As an embodiment of the present application, the side wall of the first slot 512 opposite to the recovery cavity 3 is provided with a second slot 514, and the width of the second slot 514 is smaller than the diameter of the outer circle of the fixing ring 52; the side wall of the first annular groove 521 on the fixing ring 52 is uniformly provided with a plurality of first through grooves 523.

[0037] When working, in the cleaning process of the wafer 6, the cleaning liquid seeps into the gap in the first annular groove 521 on the fixing ring 52, and flows in the first annular groove 521, and finally flows into the first slot 512 from the first through grooves 523 uniformly distributed on the first annular groove 521; in this process, the cleaning liquid fully cleans the edge of the wafer 6, and carries away the impurity particles in the first through grooves 523 in the cleaning process, so that the wafer 6 is more fully cleaned, and the inner surface of the first annular groove 521 is cleaned, which facilitates the continuous use of the fixing ring 52, speeds up the cleaning efficiency of the wafer 6, and further ensures the quality of the final chip production; the cleaning liquid flowing into the first slot 512 flows out through the second slot 514 and falls on the top of the recovery cavity 3, and the width of the first slot 512 is smaller than the diameter of the fixing ring 52, so that the fixing ring 52 is prevented from falling off from the first slot 512, and the recovery of the cleaning liquid is accelerated.

[0038] As an embodiment of the present application, the side wall of the first slot 512 near the top is provided with a third slot 515, the third slot 515 is rotatably connected with a first gear 516, the first gear 516 is connected with a motor in the side wall of the third slot 515 through a rotating shaft 517 fixed at the middle position; the outer surface of the fixing ring 52 is uniformly provided with driving teeth 524, and the driving teeth 524 are engaged with the first gear 516.

[0039] In operation, the motor connected with the rotating shaft 517 is started to drive the rotating shaft 517 to rotate the first gear 516, and the first gear 516 is engaged with the driving teeth 524 arranged on the outer surface of the fixed ring 52, so that the first gear 516 drives the fixed ring 52 to rotate, and the end of the nozzle 42 is not directly opposite to the center of the wafer 6, so that the cleaning liquid sprayed by the nozzle 42 can act on different positions on the surface of the rotating wafer 6, so that the impact on the surface of the wafer 6 is more uniform, and the cleaning effect is more comprehensive; and with the rotation of the fixed ring 52, the cleaning liquid in the first annular groove 521 rotates faster, so that the edge of the wafer 6 and the inner surface of the first annular groove 521 are more fully cleaned, further improving the cleaning efficiency of the wafer 6; and the uniformly distributed driving teeth 524 on the outer surface of the fixed ring 52 accelerate the flow of the cleaning liquid in the gap between the first groove 512 and the outer surface of the fixed ring 52, on the one hand, the cleaning liquid flows out of the second groove 514, and the recovery of the cleaning liquid is accelerated; on the other hand, the inner surface of the second groove 514 is more fully cleaned, so as to ensure the cleaning of the inner surface of the second groove 514; in addition, the cleaning liquid seeps into the gap between the end of the driving tooth 524 and the inner surface of the second groove 514, lubricates the relative movement between the end of the driving tooth 524 and the inner surface of the second groove 514, and reduces the wear of the end of the driving tooth 524 on the inner surface of the second groove 514.

[0040] As an embodiment of the present application, the width of the first annular groove 521 is greater than the thickness of the edge of the wafer 6, and a plurality of pairs of fixed blocks 525 are fixedly connected to the side wall of the first annular groove 521, the spacing between each pair of fixed blocks 525 is less than the thickness of the edge of the wafer 6, and the fixed blocks 525 are made of rubber.

[0041] In operation, in the process of combining the wafer 6 and the fixed ring 52, the edge of the wafer 6 is embedded in the gap between the relative fixed blocks 525, because the spacing between the relative fixed blocks 525 is less than the thickness of the edge of the wafer 6, so that the fixed blocks 525 are deformed under pressure and tightly contact the surface of the wafer 6, which ensures the fixation of the wafer 6 by the fixed ring 52, further ensures the stability of the wafer 6 during the rotation of the fixed ring 52, and avoids the wafer 6 from slipping and colliding with the inner surface of the first annular groove 521 during the rotation of the fixed ring 52; and the width of the first annular groove 521 is greater than the thickness of the edge of the wafer 6, which is conducive to the flow of the cleaning liquid along the surface of the wafer 6 and into the first annular groove 521 through the gap between adjacent fixed blocks 525, so that the flow is accelerated with the rotation of the fixed ring 52, and the cleaning effect on the edge of the wafer 6 is more sufficient.

[0042] As an embodiment of the present application, the opposite surfaces of each pair of the fixing blocks 525 located at the inner part of the annular groove 521 are provided with a groove 526, and the cross section of the groove 526 is triangular.

[0043] In operation, because the opposite surfaces of each pair of the fixing blocks 525 located at the inner part of the annular groove 521 are provided with a triangular groove 526, the cross section of the part of the fixing blocks 525 contacting the edge of the wafer 6 is small, and the pressure is large, so the fixing effect of the wafer 6 is more obvious, and the wafer 6 is further kept stable during the cleaning process; and when the cleaning liquid flows in the annular groove 521, a part of the cleaning liquid flows into the gap between the opposite surfaces of the fixing blocks 525 and the wafer 6 through the groove 526, and the part of the wafer 6 located in the gap between the opposite surfaces of the fixing blocks 525 and the wafer 6 is subjected to the cleaning effect, so that the cleaning effect of the wafer 6 is more thorough.

[0044] The specific working process is as follows:

[0045] For the larger diameter wafer 6, in order to ensure that the wafer 6 is subjected to the cleaning process more quickly, improve the efficiency of cleaning, and then improve the work efficiency of the entire production line, first, the wafer 6 to be cleaned is fixed on the fixed ring 52; because the fixed ring 52 is spliced by two identical half rings 522, when installing the wafer 6, first, the edge part of the wafer 6 is inserted into the first annular groove 521 on the half ring 522, and then the two half rings 522 are combined at the end, so as to realize the fixation of the wafer 6 by the fixed ring 52; and the width of the fixed ring 52 is greater than the thickness of the wafer 6, so that the fixed ring 52 can protect the edge part of the wafer 6 during stacking and cleaning, so as to avoid damage to the edge part of the wafer 6 due to collision, and affect the integrity of the wafer 6; the telescopic rod 23 in the first cavity 22 is started, and the extension distance of the telescopic rod 23 is set, so that the telescopic rod 23 end pushes the first plate 511 to drive the fixed plate 51 to move upwards, and the first groove 512 on the fixed plate 51 is completely raised above the box cover 2, at this time, the cover plate 53 is rotated to expose the first groove 512, the fixed ring 52 is inserted into the first groove 512, and then the cover plate 53 is reset, at this time, the cover plate 53 is fixed by the mutual combination of the fixed magnets 531 on the top and the fixed magnets 531 on the corresponding part of the fixed plate 51, so as to ensure that the fixed ring 52 in the first groove 512 is subjected to the limiting action; after installation, the telescopic rod 23 is reset, at this time, the fixed plate 51 drives the fixed ring 52 to move vertically to the inside of the cleaning tank 1, after the fixed plate 51 moves to the corresponding position, the nozzles 42 on both sides of the fixed plate 51 are started, the cleaning liquid from the liquid storage cavity 4 forms a fine stream under the action of the nozzles 42, and acts on the two side surfaces of the wafer 6 through the first through hole 513; because the nozzles 42 are symmetrically arranged, it is ensured that the impact on the two side surfaces of the wafer 6 is uniform and symmetrical, and the water flow-shaped cleaning liquid contacts the surface of the wafer 6, and then flows outward along the surface of the wafer 6 under the action of the impact force, and finally flows downward under the action of gravity, so that the cleaning effect on the surface of the wafer 6 is more uniform and comprehensive; the cleaning liquid with the impurities and dust on the wafer 6 flows downward along the fixed plate 51 and falls on the top of the recovery cavity 3, enters the recovery cavity 3 through the first hole 32 and is recovered; after cleaning, the telescopic rod 23 is started again to move the fixed plate 51 upward, the cover plate 53 is opened, the cleaned wafer 6 together with the fixed ring 52 is taken out, and a new wafer 6 to be cleaned is replaced, which ensures the sealing of the inside of the cleaning tank 1 during the cleaning process, and does not need to be opened repeatedly, speeds up the fixing speed of the wafer 6, and improves the processing and cleaning efficiency of the wafer 6; during the cleaning process of the wafer 6, the cleaning liquid seeps into the gap part of the first annular groove 521 in the fixed ring 52, and flows in the first annular groove 521, and finally flows into the first groove 512 from the first through groove 523 uniformly distributed on the first annular groove 521;In the process, the cleaning liquid fully cleans the edge of the wafer 6, and the impurity particles in the cleaning process are taken away from the first through groove 523, ensuring that the wafer 6 is more fully cleaned, and ensuring that the inner surface of the first annular groove 521 is clean, facilitating the continuous use of the fixing ring 52, speeding up the cleaning efficiency of the wafer 6, and further ensuring the quality of the final chip production; the cleaning liquid flowing into the first groove 512 flows out through the second groove 514 and falls on the top of the recovery cavity 3, and the width of the first groove 512 is smaller than the diameter of the fixing ring 52, avoiding the fixing ring 52 from falling off the first groove 512, and speeding up the recovery of the cleaning liquid; starting the motor connected to the rotating shaft 517, so that the rotating shaft 517 drives the first gear 516 to rotate, and the first gear 516 is engaged with the driving teeth 524 arranged on the outer surface of the fixing ring 52, so that the first gear 516 drives the fixing ring 52 to rotate, and the rotating fixing ring 52 drives the wafer 6 to rotate, and the end of the nozzle 42 is not opposite to the center of the wafer 6, so that the water flow sprayed by the nozzle 42 can act on different parts of the rotating wafer 6, so that the impact on the surface of the wafer 6 is more uniform, and the cleaning effect is more comprehensive; and with the rotation of the fixing ring 52, the cleaning liquid in the first annular groove 521 rotates faster, so that the edge of the wafer 6 and the inner surface of the first annular groove 521 are more fully cleaned, further improving the cleaning efficiency of the wafer 6; and the evenly distributed driving teeth 524 on the outer surface of the fixing ring 52 accelerate the flow of cleaning liquid in the gap between the first groove 512 and the outer circular surface of the fixing ring 52, on the one hand, accelerating the flow of cleaning liquid out of the second groove 514 and speeding up the recovery of the cleaning liquid; on the other hand, the inner surface of the second groove 514 is more fully cleaned, thereby ensuring the cleanliness of the inner surface of the second groove 514; in addition, the cleaning liquid seeps into the gap between the end of the driving tooth 524 and the inner surface of the second groove 514, lubricating the relative movement between the end of the driving tooth 524 and the inner surface of the second groove 514, and reducing the wear of the end of the driving tooth 524 on the inner surface of the second groove 514.

[0046] The above front, back, left, right, up and down are based on the drawings in the specification Figure 1 as the standard, the side of the device facing the observer is defined as the front, the left side of the observer is defined as the left, and the like.

[0047] In the description of the application, it should be understood that the terms "center", "longitudinal", "transverse", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the scope of protection of the application.

[0048] The basic principles, main features and advantages of the application are shown and described above. Those skilled in the art should understand that the application is not limited by the above examples, and the above examples and descriptions in the specification are only to illustrate the principles of the application. Without departing from the spirit and scope of the application, various changes and improvements can be made to the application, and these changes and improvements all fall within the scope of the application claimed. The scope of protection of the application is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit chip manufacturing apparatus, characterized by: Including the cleaning tank (1), tank cover (2), recycling cavity (3), liquid storage cavity (4) and fixed unit (5), the cleaning tank (1) top is equipped with tank cover (2), the middle part of tank cover (2) is equipped with installation groove (21), tank cover (2) and cleaning tank (1) top are connected through bolt, the middle part of cleaning tank (1) bottom is equipped with recycling cavity (3), recycling cavity (3) is communicated with outside through recycling pipe (31), recycling cavity (3) top is concave and is uniformly equipped with a hole (32);The part of cleaning tank (1) bottom is located recycling cavity (3) both sides and is equipped with liquid storage cavity (4), liquid storage cavity (4) is communicated with outside through liquid inlet pipe (41);The fixed unit (5) includes fixed plate (51), fixed ring (52) and cover plate (53), the fixed plate (51) is nested on installation groove (21) and keeps vertical state, the fixed plate (51) and installation groove (21) are connected, the fixed plate (51) is fixedly connected with a plate (511), the a plate (511) is in contact with the upper surface of tank cover (2);And the upper surface of tank cover (2) and the part corresponding to a plate (511) are equipped with a cavity (22), the a cavity (22) is fixedly connected with telescopic rod (23), the end of telescopic rod (23) is connected with the lower surface of a plate (511) and the part corresponding to a cavity (22), the end of telescopic rod (23) is connected with the lower surface of a plate (511) and the part corresponding to a cavity (22);The end of fixed plate (51) located inside cleaning tank (1) is opposite the top of recycling cavity (3), and the bottom of fixed plate (51) located inside cleaning tank (1) is rotatably connected with cover plate (53), the part of cover plate (53) opposite the surface of fixed plate (51) is in contact with fixed plate (51), and the top of cover plate (53) and the corresponding part of fixed plate (51) are respectively fixedly connected with fixed magnet (531);The surface of fixed plate (51) opposite cover plate (53) is equipped with a groove (512), the cross section of a groove (512) is circular, and the fixed ring (52) is embedded in the groove (512), the fixed ring (52) is used to fix the wafer (6);The inner hole surface of fixed ring (52) is equipped with a ring groove (521), and the wafer (6) is nested in the ring groove (521);The fixed ring (52) includes two identical half rings (522), and the ends of the two half rings (522) are connected by buckling;The a groove (512) is equipped with a circular through hole (513), the through hole (513) extends towards the cover plate (53) and penetrates the cover plate (53), and the diameter of the through hole (513) is the same as the diameter of the inner hole of the fixed ring (52);The upper part of the liquid storage cavity (4) is fixedly connected with a spray head (42), the spray head (42) is communicated with the cleaning liquid filled in the liquid storage cavity (4), and the end of the spray head (42) points to the direction close to the through hole (513).

2. An integrated circuit chip manufacturing apparatus according to claim 1, wherein: The end of the spray head (42) is conical, and the end of the spray head (42) is inclined towards the top of the through hole (513).

3. An integrated circuit chip manufacturing apparatus according to claim 2, wherein: The part of the side wall of the first slot (512) facing the recycling cavity (3) is provided with a second slot (514), and the width of the second slot (514) is smaller than the diameter of the outer circle of the fixing ring (52); the side wall of the first annular slot (521) on the fixing ring (52) is uniformly provided with a plurality of first through slots (523).

4. An integrated circuit chip manufacturing apparatus according to claim 3, wherein: The part of the side wall of the first slot (512) close to the top is provided with a third slot (515), the third slot (515) is rotatably connected with a first gear (516), the first gear (516) is connected with a motor inside the side wall of the third slot (515) through a rotating shaft (517) fixed at the middle part; the outer circle surface of the fixing ring (52) is uniformly provided with a driving tooth (524), the driving tooth (524) is engaged with the first gear (516).

5. An integrated circuit chip manufacturing apparatus according to claim 4, wherein: The width of the first annular slot (521) is greater than the thickness of the edge part of the wafer (6), a plurality of pairs of fixing blocks (525) are fixed to the side wall of the first annular slot (521), the spacing between each pair of fixing blocks (525) is smaller than the thickness of the edge part of the wafer (6), and the fixing blocks (525) are made of rubber.

6. An integrated circuit chip manufacturing apparatus according to claim 5, wherein: The opposite surfaces of each pair of fixing blocks (525) located inside the first annular slot (521) are provided with grooves (526), and the cross section of the grooves (526) is triangular.

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