Board-to-board connectors, connector assemblies

Abstract

A substrate-to-substrate connector and a connector assembly, wherein a cantilever spring (110D) is located in a slit (110C) of a housing (110) and has a free end (110E) and a fixed end (110F) fixed to the housing (110). The cantilever spring (110D) extends in the height direction of the housing (110). The fixed end (110F) of the cantilever spring (110D) is located near a portion (110B) that can be mounted on a substrate, and the free end (110E) of the cantilever spring (110D) is away from the portion (110B).

Description

Technical Field

[0001] The present invention relates to a substrate-to-substrate connector for parallel connection of two substrates, and a connector assembly in which the substrate-to-substrate connector and a substrate-to-substrate connector as a mating part of the substrate-to-substrate connector are mutually engaged, and in particular to a substrate-to-substrate connector and a connector assembly with reduced EMI (Electromagnetic Interference). Background Art

[0002] In order to connect two substrates, two substrate-to-substrate connectors are usually used. The first substrate-to-substrate connector is fixed to one side of the first substrate, and the second substrate-to-substrate connector is fixed to one side of the second substrate. In the case of parallel connection, the first substrate-to-substrate connector and the second substrate-to-substrate connector are engaged with each other in a state where one side of the first substrate and one side of the second substrate face each other in parallel. The first substrate and the second substrate are electrically connected to each other through the connector assembly in which the first substrate-to-substrate connector and the second substrate-to-substrate connector are engaged with each other.

[0003] As a prior art of such a connector assembly, Figure 1 Indicates two board-to-board connectors disclosed in Patent Document 1 (Japanese Patent Laying-Open No. 2017-33654) (in Patent Document 1, one board-to-board connector is referred to as a first electrical connector 10, and the other board-to-board connector is referred to as a second electrical connector 20). Figure 1 This is a copy of FIG. 27 of Patent Document 1.

[0004] like Figure 1 As shown, the housing of the first electrical connector 10 has a contact piece 12i as a cantilever spring. When the first electrical connector 10 and the second electrical connector 20 are fitted with each other, the contact piece 12i contacts the inner wall surface of the housing of the second electrical connector 20. Through this contact, the first electrical connector 10 and the second electrical connector 20 are electrically connected to each other. The housing of the first electrical connector 10 is bonded to the ground pad of one substrate, and the housing of the second electrical connector 20 is bonded to the ground pad of the other substrate.

[0005] like Figure 1 As shown, generally, considering the mating of two substrate-to-substrate connectors, the free end of a cantilever spring of a substrate-to-substrate connector is located near the substrate on which the substrate-to-substrate connector is mounted, and the fixed end of the cantilever spring faces the substrate-to-substrate connector as the mating part when the substrate-to-substrate connector and the substrate-to-substrate connector as the mating part of the substrate-to-substrate connector face each other.

[0006] In recent years, electronic devices such as high-performance portable communication devices that can process a large amount of digital information such as high-definition images or videos at high speed have become popular. In order to process a large amount of digital information at high speed, high-frequency signals are used inside electronic devices. Inside such electronic devices, signal transmission circuits and a plurality of small electronic components are usually mounted on a substrate at a high density. Therefore, it is desirable to reduce the intrasystem electromagnetic interference EMI (Intrasystem Electromagnetic Interference) that causes malfunctions of other electronic parts and the like inside the same electronic device caused by electromagnetic waves generated from electronic components or signal transmission circuits.

[0007] However, as the transmission of radiated electromagnetic waves, "conductor conduction" in which electromagnetic waves propagate in a signal transmission circuit on a substrate, etc. and "spatial conduction" in which electromagnetic waves are conducted in space are known. In the case of a substrate-to-substrate connector as an electronic component, it is important to block the spatial conduction of electromagnetic waves from the inside of the substrate-to-substrate connector by a conductive housing electrically connected to a ground pad of the substrate. Summary of the invention

[0008] In view of such technical background, the present invention provides a board-to-board connector having a housing that effectively blocks spatial conduction of electromagnetic waves from the inside of the board-to-board connector, and a connector assembly including the board-to-board connector.

[0009] The technical matters described in this section are not intended to explicitly or implicitly limit the invention described in the claims, nor are they intended to indicate the possibility of allowing persons other than those who benefit from the invention (such as the applicant and the right holder) to make such limitations. They are only recorded to facilitate understanding of the main points of the invention. The summary of the invention from other viewpoints can be understood, for example, from the scope of the claims at the time of filing the patent application.

[0010] In brief, the conductive housing of the board-to-board connector of the present invention has a cantilever spring extending in a direction opposite to the extending direction of the cantilever spring used in the prior art.

[0011] More specifically, the cantilever spring is located in the slit of the conductive housing and has a free end and a fixed end fixed to the conductive housing. The cantilever spring extends in the height direction of the conductive housing. The fixed end of the cantilever spring is located near the substrate on which the substrate-to-substrate connector is mounted, and the free end of the cantilever spring faces the substrate-to-substrate connector as a mating part when the substrate-to-substrate connector and the substrate-to-substrate connector as a mating part of the substrate-to-substrate connector face each other.

[0012] According to the present invention, reduction of EMI is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is FIG. 27 of Patent Document 1.

[0014] Figure 2 This is a perspective view of the first board-to-board connector when the first board-to-board connector is viewed from obliquely above.

[0015] Figure 3 This is a perspective view of the first board-to-board connector when the first board-to-board connector is viewed from obliquely below.

[0016] Figure 4 is a perspective view of a first insulator of a first substrate-to-substrate connector;

[0017] Figure 5 is a perspective view of a first housing of a first board-to-board connector.

[0018] Figure 6 This is a perspective view of the second board-to-board connector when the second board-to-board connector is viewed from obliquely above.

[0019] Figure 7 This is a perspective view of the second board-to-board connector when the second board-to-board connector is viewed from obliquely below.

[0020] Figure 8 is a perspective view of a second insulator of the second board-to-board connector.

[0021] Fig. 9 is a perspective view of a second housing of the second board-to-board connector.

[0022] Fig.10 It is a figure for demonstrating the structure of the connector assembly which concerns on embodiment.

[0023] Fig.11A It is a diagram for explaining the grounding performance of the connector assembly according to the embodiment.

[0024] Fig. 11B It is a diagram for explaining the grounding performance of the connector assembly according to the embodiment.

[0025] Fig. 12A This is a diagram for explaining the grounding performance of a conventional connector assembly.

[0026] Fig. 12B This is a diagram for explaining the grounding performance of a conventional connector assembly.

[0027] Fig.13 : is a graph for explaining EMI of the connector assembly according to the embodiment.

[0028] Description of Reference Numerals

[0029] 1: First substrate

[0030] 2: Second substrate

[0031] 100: First substrate-to-substrate connector

[0032] 110: First shell

[0033] 110A: First side wall portion

[0034] 110B: First part

[0035] 110C: Slit

[0036] 110D: Cantilever spring

[0037] 110E: Free end

[0038] 110F: Fixed end

[0039] 110G: Central

[0040] 111: Metal parts

[0041] 111a: First plate

[0042] 111b: Second plate

[0043] 111c: Hook

[0044] 111d: Support

[0045] 111e: convex part

[0046] 111g: Claw

[0047] 130: First Insulator

[0048] 131: Bottom

[0049] 131a: Central plate

[0050] 131b: Side panel

[0051] 132: Side wall

[0052] 132a: concave part

[0053] 132b: concave part

[0054] 150: First contact

[0055] 150a: one end

[0056] 150b: The other end

[0057] 150c: one end

[0058] 150d: The other end

[0059] 170: Conductor parts

[0060] 170a: Rod-shaped part

[0061] 170b: Wall

[0062] 170c: End

[0063] 200: Second substrate to substrate connector

[0064] 210: Second shell

[0065] 210A: Second side wall portion

[0066] 210B: Second part

[0067] 210b: Bottom

[0068] 210b1: Flat plate

[0069] 210b2: upright part

[0070] 210b21: Inverted U-shaped part

[0071] 210b22: Bridge Department

[0072] 210b23: Feet

[0073] 210b24: Claw

[0074] 210b25: Claw

[0075] 210e: convex part

[0076] 230: Second insulator

[0077] 230a: Slot

[0078] 230b: concave part

[0079] 230c: Slit

[0080] 230d: Bridge Department

[0081] 250: Second contact

[0082] 250a: U-shaped part

[0083] 250b: L-shaped part

[0084] 250c: U-shaped part

[0085] 250d: feet

[0086] 500: Connector assembly DETAILED DESCRIPTION

[0087] Reference Figures 2 to 13 , the structure of the first substrate-to-substrate connector 100 of the embodiment and the connector assembly 500 of the embodiment are described. The connector assembly 500 includes: the first substrate-to-substrate connector 100 that can be mounted on the first substrate 1, and the second substrate-to-substrate connector 200 that can be mounted on the second substrate 2 and can be mated with the first substrate-to-substrate connector 100 (see Fig.10 ).

[0088] (First Board-to-Board Connector)

[0089] Figure 2 and Figure 3 The first substrate-to-substrate connector 100 shown includes: a first housing 110 having a frame structure and being conductive; a first insulator 130 having electrical insulation; eight first contacts 150 having conductivity; and two conductor members 170 .

[0090] (first insulator, first contact, conductor component)

[0091] Figure 4 The first insulator 130 shown is a one-piece insulating component, including: a flat H-shaped bottom 131, and L-shaped side walls 132 standing upright at the four corners of the bottom 131. The four corners of the bottom 131 where the side walls 132 stand upright are equivalent to the four corners when the bottom 131 is assumed to be a rectangle. That is, two side walls 132 are located on one side of the two side plates 131b of the bottom 131 sandwiching the central plate 131a of the bottom 131, and the remaining two side walls 132 are located on the other side of the side plate 131b. The four side walls 132 extend from the bottom 131 in the same direction ( Figure 4 The Z direction shown extends.

[0092] Each of the four side wall portions 132 has a recess 132a on the inner side of the side wall portion 132 of the central plate portion 131a of the H-shaped bottom portion 131 when viewed from the front. The recess 132a has an opening on the upper surface of the first insulator 130. The “upper” and “lower” in the description are Figure 4 The height direction of the first insulator 130 shown (ie, Figure 4 The side wall 132 has two recesses 132b on the outer side of the side wall 132. The two recesses 132b have openings on the upper surface of the first insulator 130, respectively.

[0093] Six L-shaped first contacts 150 are mounted on the central plate portion 131a of the H-shaped bottom portion 131, and one L-shaped first contact 150 is mounted on each of the two side plates 131b of the H-shaped bottom portion 131. The six first contacts 150 mounted on the central plate portion 131a form two parallel contact rows having the same number of first contacts 150. The two contact rows are located near the two edges of the central plate portion 131a, and the length direction of the contact rows is parallel to the direction in which the two edges of the central plate portion 131a extend (i.e., the Y direction). The straight line connecting the two first contacts 150 mounted on the side plates 131b is parallel to the contact rows and passes between the two contact rows.

[0094] For each of the six first contacts 150 installed on the central plate portion 131a, one end 150a of the first contact 150 protrudes from the bottom 131 in a direction vertically extending toward the side wall portion 132, and the other end 150b of the contact 150 protrudes from the central plate portion 131a toward the outside of the central plate portion 131a in a direction parallel to the bottom 131 and perpendicular to the length direction of the contact column.

[0095] For each of the two first contacts 150 installed on the side plate portion 131b, one end 150c of the first contact 150 protrudes from the bottom 131 in a direction vertically extending toward the side wall portion 132, and the other end 150d of the first contact 150 protrudes from the side plate portion 131b toward the outside of the side plate portion 131b in a direction parallel to the bottom 131 and parallel to the length direction of the contact array.

[0096] In this embodiment, the two first contacts 150 mounted on the side plate 131b are contacts for high-frequency current (high-speed transmission), and the six first contacts 150 mounted on the central plate 131a are contacts for low-frequency current (low-speed transmission). The frequency of the high-frequency current is, for example, hundreds of MHz or more.

[0097] A conductor component 170 is mounted on each of the two side plate portions 131b of the bottom portion 131. The conductor component 170 is located near the boundary between the central plate portion 131a and the side plate portion 131b. The single-piece conductor component 170 is made of metal and includes: an elongated rod-shaped portion 170a and two wall portions 170b extending vertically from the rod-shaped portion 170a in the same direction.

[0098] The wall portion 170b protrudes in a direction vertically extending from the bottom 131 to the side wall portion 132, and both ends 170c of the rod-shaped portion 170a extending in a direction perpendicular to the longitudinal direction of the contact array slightly protrude from the side plate portion 131b to the outside of the side plate portion 131b in a direction parallel to the bottom 131. One wall portion 170b of one conductor member 170 and one wall portion 170b of another conductor member 170 are located on an imaginary extension line of one contact array, and the other wall portion 170b of one conductor member 170 and the other wall portion 170b of another conductor member 170 are located on an imaginary extension line of another contact array.

[0099] (First Shell)

[0100] Installed on Figure 4 The first housing 110 on the first insulator 130 shown in the figure has a frame structure, and the first insulator 130 is located inside the first housing 110 (refer to Figure 2 ). The first housing 110 has a first side wall portion 110A along the first insulator 130. The first side wall portion 110A of the first housing 110 has a first portion 110B that can be mounted on the first substrate 1. The first side wall portion 110A of the first housing 110 has a slit 110C. The first side wall portion 110A of the first housing 110 has a cantilever spring 110D, which is located in the slit 110C and has a free end 110E and a fixed end 110F fixed to the first side wall portion 110A of the first housing 110. The cantilever spring 110D extends in the height direction of the first housing 110. The fixed end 110F of the cantilever spring 110D is close to the first portion 110B of the first housing 110, and the free end 110E of the cantilever spring 110D is away from the first portion 110B of the first housing 110.

[0101] The first housing 110 having such features is described in detail below. Figure 5 The first housing 110 shown is composed of two metal components 111. The two metal components 111 have the same structure.

[0102] The single-piece metal component 111 has a U-shaped staple-like appearance, and includes: a first plate portion 111a in the form of an elongated rectangular plate, and two second plate portions 111b in the form of elongated rectangular plates. The two second plate portions 111b extend from the first plate portion 111a in the length direction (i.e., Figure 5 The two ends of the X direction shown in FIG. Figure 5 The upper end of the first plate portion 111a and the upper ends of the two second plate portions 111b are bent 90 degrees toward the inner side of the metal component 111. The “upper” and “lower” in the description are not necessarily the same. Figure 5 The height direction of the metal component 111 shown (ie, Figure 5 The Z direction shown in the figure) follows the “up” and “down” of the paper.

[0103] A right-angled triangular brace 111d extends from one end of the upper end of the first plate portion 111a in the longitudinal direction to one end of the upper end of the second plate portion 111b in the longitudinal direction. Another right-angled triangular brace 111d extends from the other end of the upper end of the first plate portion 111a in the longitudinal direction to one end of the upper end of the second plate portion 111b in the longitudinal direction. Two rectangular plate-shaped hooks 111c extend downward from near both ends of the upper end of the first plate portion 111a in the longitudinal direction. The hook 111c has a claw 111g protruding in a direction perpendicular to the extension direction of the hook 111c. The lower end of the second plate portion 111b has a U-shaped notch 111b1.

[0104] The first plate portion 111a has a slit 110C and a cantilever spring 110D at both ends in the length direction of the first plate portion 111a. A portion of the slit 110C of the first plate portion 111a also serves as a gap between the first plate portion 111a and the second plate portion 111b formed by the bending process of the metal component 111. The tongue-shaped cantilever spring 110D is located inside the slit 110C and has a free end 110E and a fixed end 110F. The cantilever spring 110D extends in the height direction (i.e., the Z direction) of the first plate portion 111a, and the fixed end 110F of the cantilever spring 110D is fixed to the first plate portion 111a. The fixed end 110F of the cantilever spring 110D is located near the lower end of the first plate portion 111a, and the free end 110E of the cantilever spring 110D is located near the upper end of the first plate portion 111a.

[0105] Similarly, the second plate portion 111b has a slit 110C and a cantilever spring 110D at a portion of the second plate portion 111b located near the first plate portion 111a. The tongue-shaped cantilever spring 110D is located inside the slit 110C and has a free end 110E and a fixed end 110F. The cantilever spring 110D extends in the height direction (i.e., the Z direction) of the second plate portion 111b, and the fixed end 110F of the cantilever spring 110D is fixed to the second plate portion 111b. The fixed end 110F of the cantilever spring 110D is located near the lower end of the second plate portion 111b, and the free end 110E of the cantilever spring 110D is located near the upper end of the second plate portion 111b.

[0106] The first plate portion 111a has an elongated semi-cylindrical convex portion 111e protruding to the outside of the first plate portion 111a. The convex portion 111e of the first plate portion 111a extends in a direction perpendicular to the height direction of the first plate portion 111a. Both ends of the convex portion 111e of the first plate portion 111a are slightly separated from the cantilever spring 110D. Similarly, the second plate portion 111b has an elongated semi-cylindrical convex portion 111e protruding to the outside of the second plate portion 111b. The convex portion 111e of the second plate portion 111b extends in a direction perpendicular to the height direction of the second plate portion 111b. One end of the convex portion 111e of the second plate portion 111b is slightly separated from the cantilever spring 110D.

[0107] One metal component 111 is mounted on two side wall portions 132 of one side plate portion 131b of the first insulator 130, and the other metal component 111 is mounted on two side wall portions 132 of the other side plate portion 131b of the first insulator 130. At this time, the hook 111c having the claw 111g is pressed into the recess 132a of the side wall portion 132. As a result, the two metal components 111 are mounted on the first insulator 130 in a state where the front ends of the two second plate portions 111b of the one metal component 111 and the front ends of the two second plate portions 111b of the other metal component 111 face each other. The two metal components 111 in this state constitute the first housing 110. The end 170c of the rod-shaped portion 170a of the conductor component 170 is located in the U-shaped notch 111b1 of the second plate portion 111b.

[0108] When the first housing 110 is mounted on the first insulator 130, the first plate portion 111a and the second plate portion 111b extend along the outer side of the first insulator 130. That is, the first plate portion 111a and the second plate portion 111b correspond to the first side wall portion 110A. The lower end portion of the first plate portion 111a and the lower ends of the two second plate portions 111b (except for the U-shaped notch 111b1) are portions that can be mounted on the first substrate 1, and correspond to the first portion 110B. Therefore, the fixed end 110F of the cantilever spring 110D is close to the first portion 110B of the first housing 110, and the free end 110E of the cantilever spring 110D is away from the first portion 110B of the first housing 110.

[0109] Each cantilever spring 110D has a curved shape that bulges toward the outside of the first housing 110. The central portion 110G of the cantilever spring 110D located between the free end 110E and the fixed end 110F is located outside the first side wall portion 110A. The free end 110E of the cantilever spring 110D is not located outside the first side wall portion 110A of the first housing 110. Therefore, when an external force in the height direction (i.e., Z direction) of the first housing 110 is applied to the cantilever spring 110D, the cantilever spring 110D can be tilted toward the inside of the first housing 110 with the fixed end 110F as a fulcrum. When the cantilever spring 110D tilts due to the external force, the free end 110E of the cantilever spring 110D enters the recess 132b of the side wall portion 132. In other words, the movement of the cantilever spring 110D is not hindered by the presence of the recess 132b of the side wall portion 132.

[0110] Generally, from the viewpoint of blocking the spatial conduction of electromagnetic waves, the slit of the conductive housing is preferably located as far away from the contact for high-frequency current as possible. However, as can be seen from this embodiment, the slit 110C and the cantilever spring 110D can be located closer to the high-frequency contact (i.e., the two first contacts 150 installed on the side plate 131b) than the low-frequency contact (i.e., the six first contacts 150 installed on the central plate 131a). That is, compared with the prior art, there are fewer design constraints related to the positions of the slit and the cantilever spring.

[0111] The first substrate-to-substrate connector 100 is mounted on one surface of the first substrate 1. One surface of the first substrate 1 has a ground pad and a signal line. The other ends 150b and 150d of the first contact 150 are in contact with the signal line of the first substrate 1. The rod-shaped portion 170a of the conductor component 170 and the first portion 110B of the first housing 110 are in contact with the ground pad of the first substrate 1. Generally, the first substrate-to-substrate connector 100 is mounted on the first substrate 1 using solder.

[0112] (Second board-to-board connector)

[0113] Figure 6 and Figure 7 The second substrate-to-substrate connector 200 shown includes: a second housing 210 having a frame structure and being conductive; a second insulator 230 having electrical insulation; and eight second contacts 250 having conductivity.

[0114] (Second Insulator, Second Contact)

[0115] Figure 8 The second insulator 230 shown is a single-piece insulating component having a substantially rectangular parallelepiped appearance. The second insulator 230 has a central portion of the second insulator 230 with a longitudinal direction of the second insulator 230 (ie, Figure 8Two grooves 230a extending parallel to each other (in the Y direction shown in the figure). Three second contacts 250 are installed along one groove 230a, and three second contacts 250 are installed along the other groove 230a. These six second contacts 250 each have a shape obtained by bending a strip of metal plate, and have: a U-shaped portion 250a, and an L-shaped portion 250b extending from one end of the U-shaped portion 250a. The U-shaped portion 250a of the second contact 250 is located in the groove 230a of the second insulator 230. The U-shaped portion 250a is open upward. The "upper" and "lower" in the description are along Figure 8 The second insulator 230 is shown as being “up” and “down” in the height direction (ie, Z direction) of the paper. The end of the second contact 250 (ie, the end of the L-shaped portion 250 b ) is located at the lower end of the side wall of the second insulator 230 in the length direction.

[0116] The second insulator 230 has two recesses 230b at both ends in the length direction of the second insulator 230. The remaining two second contacts 250 are mounted in the two recesses 230b. The two second contacts 250 each have a shape obtained by bending a metal plate, and have a U-shaped portion 250c and a foot portion 250d extending from the bottom of the U-shaped portion 250c. The U-shaped portion 250c is open upward. The end of the second contact 250 (i.e., the end of the foot portion 250d) is located at the lower end of the side wall of the second insulator 230 in the width direction (i.e., the X direction).

[0117] The second insulator 230 has slits 230c extending in the width direction of the second insulator 230 between the concave portion 230b on one side where the second contacts 250 are located and the grooves 230a where the six second contacts 250 are located, and between the concave portion 230b on the other side where the second contacts 250 are located and the grooves 230a where the six second contacts 250 are located. That is, the second insulator 230 has two slits 230c.

[0118] The second insulator 230 has a bridge portion 230d connecting a central portion of the second insulator 230 and ends in the longitudinal direction of the second insulator 230. The slit 230c is located between the two bridge portions 230d.

[0119] (Second shell)

[0120] Fig. 9 The second housing 210 shown as a single piece has a bottom 210b and a second side wall portion 210A in a rectangular frame shape, and the second side wall portion 210A has a second portion 210B that can be mounted on the second substrate 2. The second housing 210 is made of metal. The bottom 210b has four flat portions 210b1 and two upright portions 210b2. The flat portion 210b1 is located at the corner of the second side wall portion 210A. The upright portion 210b2 is located from the width direction of the second housing 210 (i.e., Fig. 9 One of the two adjacent flat plate portions 210b1 in the X direction (shown) extends to the other. Each upright portion 210b2 extends in the width direction of the second housing 210 and stands vertically relative to the bottom portion 210b.

[0121] Each upright portion 210b2 has: two inverted U-shaped portions 210b21, one bridge portion 210b22, and two legs 210b23. The inverted U-shaped portion 210b21 extends vertically from the flat portion 210b1 to the upper side of the second housing 210, and further folds vertically to the lower side of the second housing 210. The "upper" and "lower" in the description are along the Fig. 9 The "upper" and "lower" of the paper in the height direction (i.e., Z direction) of the second shell 210 shown. The bridge portion 210b22 extends from one inverted U-shaped portion 210b21 to the other inverted U-shaped portion 210b21. Two legs 210b23 extend from the central portion of the bridge portion 210b22 to the upper side of the second shell 210. The leg 210b23 has a claw 210b24 protruding in the width direction of the second shell 210 at the front end of the leg 210b23. The inverted U-shaped portion 210b21 has a claw 210b25 protruding toward the inner side of the inverted U-shaped portion 210b21.

[0122] Each side of the second side wall portion 210A has an elongated semi-cylindrical protrusion 210e protruding outward from the second side wall portion 210A. The protrusion 210e extends in a direction perpendicular to the height direction of the second side wall portion 210A.

[0123] The second housing 210 is mounted on the second insulator 230, and as a result, the second insulator 230 is located inside the second housing 210 (see Figure 6 ). At this time, the two upright portions 210b2 of the second shell 210 are accommodated in the two slits 230c of the second insulator 230. The bridge portion 230d of the second insulator 230 is pressed between the inverted U-shaped portion 210b21 having the claw 210b25. The second side wall portion 210A of the second shell 210 surrounds the outside of the second insulator 230. The lower end portion of the second side wall portion 210A of the second shell 210 corresponds to the second portion 210B that can be mounted on the second substrate 2.

[0124] The second substrate-to-substrate connector 200 is mounted on one surface of the second substrate 2. One surface of the second substrate 2 has a ground pad and a signal line. The ends of the L-shaped portions 250b of the six second contacts 250 and the ends of the legs 250d of the two second contacts 250 are in contact with the signal line of the second substrate 2. The second portion 210B of the second housing 210 and the bridge portion 210b22 of the second housing 210 are in contact with the ground pad of the second substrate 2. Usually, the second substrate-to-substrate connector 200 is mounted on the second substrate 2 using solder.

[0125] (Connector Components)

[0126] The first substrate-to-substrate connector 100 fixed on one surface of the first substrate 1 and the second substrate-to-substrate connector 200 fixed on one surface of the second substrate 2 are mated with each other in a state where one surface of the first substrate 1 and one surface of the second substrate 2 face each other in parallel (see Fig.10 ). The first substrate-to-substrate connector 100 and the second substrate-to-substrate connector 200 that fit together form a connector assembly 500. The first substrate 1 and the second substrate 2 are connected in parallel through the connector assembly 500, and the first substrate 1 and the second substrate 2 are electrically connected to each other. In the connector assembly 500, the first housing 110 of the first substrate-to-substrate connector 100 is located inside the second housing 210 of the second substrate-to-substrate connector 200.

[0127] In the connector assembly 500, one ends 150a of the six first contacts 150 forming the contact array in the first insulator 130 are embedded in the U-shaped portions 250a of the six second contacts 250 located in the grooves of the second insulator 230. Furthermore, in the connector assembly 500, one ends 150c of the remaining two first contacts 150 of the first insulator 130 are embedded in the U-shaped portions 250c of the two second contacts 250 located at both ends of the second insulator 230.

[0128] In the connector assembly 500, the wall portion 170b of the conductor component 170 mounted on the first insulator 130 is embedded between the inverted U-shaped portion 210b21 and the leg portion 210b23 in the upright portion 210b2 of the second housing 210. The combination of the conductor component 170 mounted on the first insulator 130 and the upright portion 210b2 of the second housing 210 acts as a shield to electromagnetically isolate the low-frequency contact and the high-frequency contact.

[0129] During the mutual mating of the first substrate-to-substrate connector 100 and the second substrate-to-substrate connector 200, the convex portion 111e of the first housing 110 passes over the convex portion 210e of the second housing 210. In the connector assembly 500, the convex portion 111e of the first housing 110 and the convex portion 210e of the second housing 210 are in contact with each other. As a result, the gap between the first housing 110 and the second housing 210 is reduced, so that the shielding performance of the connector assembly 500 is improved.

[0130] Furthermore, in the connector assembly 500, the cantilever spring 110D of the first substrate-to-substrate connector 100 contacts the second side wall portion 210A of the second housing 210 of the second substrate-to-substrate connector 200. As described above, when an external force in the height direction of the first housing 110 is applied to the cantilever spring 110D, the cantilever spring 110D can be tilted toward the inner side of the first housing 110 with the fixed end 110F as a fulcrum. Therefore, when the first substrate-to-substrate connector 100 is inserted into the second substrate-to-substrate connector 200, even if the second housing 210 collides with the cantilever spring 110D of the first housing 110, the cantilever spring 110D will not be buckled.

[0131] According to the above embodiment, the distance from the first portion 110B of the first substrate-to-substrate connector 100 to the second portion 210B of the second substrate-to-substrate connector 200 is sufficiently shorter than that in the prior art. As in the prior art, when the cantilever spring extends in the direction opposite to the extending direction of the cantilever spring 110D adopted in the above embodiment (see Fig. 12B ), the shortest path from the first portion 110B of the first substrate-to-substrate connector 100 to the second portion 210B of the second substrate-to-substrate connector 200 is as follows Fig. 12A , as shown by the thick solid line in 12B, it is a Z-shaped with a folded back shape. Fig. 12A The path indicated by the thick dashed line in Fig. 12B According to the above embodiment, the shortest path from the first portion 110B of the first substrate-to-substrate connector 100 to the second portion 210B of the second substrate-to-substrate connector 200 is as follows: Fig.11A , 11B The thick solid line in the middle shows a step-like shape without folding back. Therefore, the cantilever spring 110D of the embodiment exhibits good grounding performance. That is, EMI reduction is achieved in the connector assembly 500.

[0132] Fig.13A graph showing the EMI of the connector assembly 500 of the embodiment and the first comparative example and the second comparative example. The vertical axis of the graph represents the radiation electric field strength (unit: dBμV / m), and the horizontal axis represents the frequency (unit: GHz). The first comparative example has the same structure as the connector assembly 500 except that the cantilever spring extends in the direction opposite to the extension direction of the cantilever spring 110D used in the above embodiment. The second comparative example has the same structure as the connector assembly 500 except that it does not have the cantilever spring 110D used in the above embodiment. The solid line in the graph is the radiation electric field strength of the first comparative example, the dotted line is the radiation electric field strength of the second comparative example, and the double-dotted line is the radiation electric field strength of the connector assembly 500. From the comparison between the connector assembly 500 and the first comparative example, it can be seen that by adopting the cantilever spring 110D extending in the direction opposite to the extension direction of the cantilever spring used in the prior art, the EMI of the connector assembly 500 is greatly improved. In addition, from the comparison between the connector assembly 500 and the second comparative example, it can be seen that the combination of the gap reduction structure based on the contact between the protrusion 111e of the first shell 110 and the protrusion 210e of the second shell 210 and the cantilever spring 110D greatly improves the EMI of the connector assembly 500.

[0133] (appendix)

[0134] Although the present invention has been described with reference to exemplary embodiments, those skilled in the art may make various changes without departing from the scope of the present invention, and may replace its elements with equivalents. Furthermore, without departing from the essential scope of the present invention, many modifications may be made in order to make a specific system, device or its components suitable for the teachings of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed for the implementation of the present invention, but includes all embodiments included within the scope of the appended claims.

[0135] In addition, the use of terms such as "first" and "second" does not indicate order or importance, and terms such as "first" and "second" are used to distinguish elements. The terms used in this specification are terms used to describe the implementation methods and are not used to limit the present invention. When the term "include" and its word forms are used within the scope of this specification and / or the appended claims, it can clarify the existence of the mentioned features, steps, operations, elements, and / or components, but does not exclude the existence or addition of one or more other features, steps, operations, elements, components, and / or their combinations. If there are terms such as "and / or", all combinations of one or more of the elements in the relevant list are included. In the claims and the specification, unless otherwise specified, "connected", "combined", "joined", "linked", or their synonyms, and all their word forms, do not necessarily deny the existence of one or more intermediate elements between two elements that are "connected" or "combined" or "linked" to each other. In the claims and the specification, if there are terms such as "arbitrary", unless otherwise specified, they should be understood to mean that they are the same as the full name symbol. For example, the expression "regarding any X" has the same meaning as "regarding all X" or "regarding each X".

[0136] Unless otherwise specified, all terms (including technical terms and scientific terms) used in this specification have the same meaning as those generally understood by those skilled in the art to which the present invention belongs. Furthermore, terms defined in commonly used dictionaries and the like should be interpreted as having the same meaning as in the context of the relevant technology and the present disclosure, and unless clearly defined, terms will not be interpreted in an ideal or excessive formal way.

[0137] It should be understood that many techniques and steps are disclosed in the description of the present invention. These have individual advantages and can also be used in combination with one or more of the other disclosed skills or all of them according to the circumstances. Therefore, in order to avoid complexity, all possible combinations of various skills or steps are not described in this specification. Nevertheless, the description and claims should be understood and read as such combinations are fully within the scope of the present invention and the claims.

[0138] The corresponding structures, materials, acts, and equivalents of all functional elements combined with means or steps in the following claims, if they exist, include the structure, material, or act for performing the function in combination with the other elements.

[0139] The embodiments of the present invention have been described above, but the present invention is not limited to these embodiments. Various changes and modifications are allowed within the scope of the main purpose of the present invention. The selected and described embodiments are used to explain the principles of the present invention and its practical application. The present invention is used as various embodiments with various changes or modifications, and various changes or modifications are determined according to the expected use. All such changes and modifications are intended to be included in the scope of the present invention as defined by the attached claims, and are intended to be given the same protection when interpreted in accordance with the scope given by fairness, legality and justice.

Claims

1. A substrate-to-substrate connector, capable of being mounted on a substrate, characterized in that: include: A casing having a frame structure and being conductive; An insulator with electrical insulation properties; having at least one contact point of electrical conductivity, The at least one contact is mounted on the insulator, The housing is mounted on the insulator. The insulator is located inside the shell, The housing has a side wall portion along the insulator, The side wall portion of the housing has a portion that can be mounted on the substrate. The side wall portion of the housing has a slit, The side wall portion of the housing has a cantilever spring, the cantilever spring is located in the slit and has a free end and a fixed end fixed to the side wall portion of the housing, The cantilever spring extends in the height direction of the housing, The fixed end of the cantilever spring is close to the portion of the housing, and the free end of the cantilever spring is far away from the portion of the housing.

2. The substrate-to-substrate connector according to claim 1, wherein: The cantilever spring has a curved shape bulging toward the outside of the housing, The portion of the cantilever spring between the free end and the fixed end is located outside the side wall portion of the housing. The free end of the cantilever spring is not located outside the side wall portion of the housing.

3. The substrate-to-substrate connector according to claim 1, wherein: The side wall portion of the housing has a convex portion protruding toward the outside of the housing, The convex portion extends in a direction perpendicular to a height direction of the housing.

4. The substrate-to-substrate connector according to claim 2, wherein: The side wall portion of the housing has a convex portion protruding toward the outside of the housing, The convex portion extends in a direction perpendicular to a height direction of the housing.

5. The substrate-to-substrate connector according to claim 1, wherein: The at least one contact includes at least two contacts, At least one of the at least two contacts is a high-frequency contact for high-frequency current, At least one of the at least two contacts other than the high-frequency contact is a low-frequency contact for low-frequency current, The cantilever spring is closer to the high frequency contact than to the low frequency contact.

6. The substrate-to-substrate connector according to claim 2, wherein: The at least one contact includes at least two contacts, At least one of the at least two contacts is a high-frequency contact for high-frequency current, At least one of the at least two contacts other than the high-frequency contact is a low-frequency contact for low-frequency current, The cantilever spring is closer to the high frequency contact than to the low frequency contact.

7. The substrate-to-substrate connector according to claim 3, wherein: The at least one contact includes at least two contacts, At least one of the at least two contacts is a high-frequency contact for high-frequency current, At least one of the at least two contacts other than the high-frequency contact is a low-frequency contact for low-frequency current, The cantilever spring is closer to the high frequency contact than to the low frequency contact.

8. The substrate-to-substrate connector according to claim 4, wherein: The at least one contact includes at least two contacts, At least one of the at least two contacts is a high-frequency contact for high-frequency current, At least one of the at least two contacts other than the high-frequency contact is a low-frequency contact for low-frequency current, The cantilever spring is closer to the high frequency contact than to the low frequency contact.

9. A connector assembly, characterized in that: include: a first substrate-to-substrate connector mountable on a first substrate; a second substrate-to-substrate connector mountable on a second substrate and mating with the first substrate-to-substrate connector, The first substrate-to-substrate connector comprises: A first shell having a frame structure and being conductive; a first insulator having electrical insulation properties; A first contact having electrical conductivity, The first contact is mounted on the first insulator, The first housing is mounted on the first insulator. The first insulator is located inside the first shell. The first housing has a first side wall portion along the first insulator, The first side wall portion of the first housing has a first portion that can be mounted on the first substrate. The first side wall portion of the first housing has a slit, The first side wall portion of the first housing has a cantilever spring, the cantilever spring is located in the slit and has a free end and a fixed end fixed to the first side wall portion of the first housing, The cantilever spring extends in the height direction of the first housing, The fixed end of the cantilever spring is close to the first portion of the first housing, and the free end of the cantilever spring is far away from the first portion of the first housing. The second substrate-to-substrate connector comprises: A second housing having a frame structure and being conductive; a second insulator having electrical insulating properties; A second conductive contact, The second contact is mounted on the second insulator, The second housing is mounted on the second insulator, The second insulator is located inside the second shell. The second housing has a second side wall portion surrounding the second insulator, The second side wall portion of the second housing has a second portion that can be mounted on the second substrate. In the connector assembly in which the first substrate-to-substrate connector and the second substrate-to-substrate connector are engaged with each other, the first shell of the first substrate-to-substrate connector is located on the inner side of the second shell of the second substrate-to-substrate connector, and the cantilever spring of the first substrate-to-substrate connector contacts the second side wall of the second shell of the second substrate-to-substrate connector.

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