Electronic Devices

Abstract

An electronic device is provided. The electronic device may include a display panel, a board arranged below the display panel and including a code area where a unique code is arranged, and a circuit film electrically connected to the display panel. The circuit film includes a first portion and a second portion extending from the first portion and covering the code area.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2020-0061002, filed on May 21, 2020, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to electronic devices with improved reliability. Background Art

[0004] The electronic device may include a display panel. In a process of manufacturing the display panel, a unique code may be provided to the display panel to manage the display panel. The unique code may be provided in the form of a barcode or a Quick Response (QR) code. The unique code may be provided directly to the display panel or to another component bonded to the display panel.

[0005] It will be understood that the present background technology of the technology section is intended, in part, to provide a useful background for understanding the technology. However, the present background technology of the technology section may also include ideas, concepts, or cognitions that were not part of what was known or clear to a person skilled in the relevant art before the corresponding effective filing date of the subject matter disclosed herein. Summary of the invention

[0006] The present disclosure can provide an electronic device capable of reducing the possibility of occurrence of electrical noise.

[0007] The present disclosure may also provide an electronic device capable of improving impact durability.

[0008] In an embodiment of the present disclosure, an electronic device may include a display panel, a board disposed below the display panel and including a code area where a unique code may be disposed, and a circuit film electrically connected to the display panel. The circuit film may include a first portion and a second portion extending from the first portion and covering the code area.

[0009] In an embodiment, the electronic device may further include a plurality of lower layers disposed on a bottom surface of the board and exposing the code region.

[0010] In an implementation, the thickness of the second portion of the circuit film may be equal to or less than the thickness of the plurality of lower layers.

[0011] In an embodiment, a portion of the second portion may be surrounded by a plurality of lower layers.

[0012] In an implementation, the thickness of the first portion of the circuit film may be greater than the thickness of the second portion.

[0013] In an embodiment, the display panel includes a first area, a second area, and a third area. The first area, the second area, and the third area may be arranged along a first direction. The second area may be foldable along a folding axis extending in a second direction intersecting the first direction. An opening may be defined in a portion of the plate facing the second area.

[0014] In an embodiment, the electronic device may also include a covering layer arranged on the bottom surface of the board and covering the opening, a plurality of lower boards arranged on the bottom surface of the covering layer and spaced apart from each other in a first direction, a plurality of heat sinks respectively arranged on the bottom surfaces of the plurality of lower boards, and a plurality of insulating films respectively arranged on the bottom surfaces of the plurality of heat sinks.

[0015] In an implementation, a thickness of the second portion of the circuit film may be equal to or less than a height from a bottom surface of the board to a bottom surface of each of the plurality of insulating films.

[0016] In an embodiment, the code region may be disposed below the third region, and the circuit film may be disposed in a peripheral region of the display panel, the peripheral region being adjacent to the third region.

[0017] In an embodiment, the electronic device may further include a conductive tape disposed between the first portion and the board.

[0018] In embodiments, a conductive tape may extend between the second portion of the circuit film and the board.

[0019] In an embodiment, the electronic device may further include an adhesive layer disposed between the second portion of the circuit film and the board.

[0020] In an embodiment, the board may include at least one of a metal and a metal alloy, and the second portion of the circuit film may include an insulating material.

[0021] In an implementation, the second portion of the circuit film may extend from the first portion in the first direction, and a width of the second portion in a second direction intersecting the first direction may be smaller than a width of the first portion in the second direction.

[0022] In an embodiment of the present disclosure, an electronic device may include a display panel, a board disposed below the display panel and having a bottom surface on which a unique code is disposed, and a circuit film electrically connected to the display panel and disposed on the bottom surface of the board. The circuit film may include a first portion having a first thickness and a second portion having a second thickness smaller than the first thickness.

[0023] In an embodiment, the second portion of the circuit film may cover an area of ​​the board, and the unique code may be arranged in the area of ​​the board.

[0024] In an embodiment, the electronic device may further include a plurality of lower layers arranged on the bottom surface of the board and not overlapping the circuit film. The plurality of lower layers may protrude from the bottom surface of the board to the same level as the bottom surface of the second portion of the circuit film or to a level lower than the bottom surface of the second portion of the circuit film.

[0025] In an embodiment, the board may include at least one of a metal and a metal alloy, and the second portion of the circuit film may include an insulating material.

[0026] In an embodiment of the present disclosure, an electronic device may include a display panel, a board arranged below the display panel and including a bottom surface and a top surface arranged between the bottom surface and the display panel, the bottom surface including a first area where a unique code is arranged and a second area adjacent to the first area. The electronic device may include an insulating film arranged below the second area of ​​the board and a circuit film including a first portion arranged in the second area of ​​the board and a second portion covering the first area.

[0027] In an embodiment, a distance between a bottom surface of the board and a bottommost surface of the insulating film may be equal to or greater than a distance between a bottom surface of the board and a bottom surface of the second portion of the circuit film. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification. The accompanying drawings illustrate embodiments of the present disclosure and together with the description serve to explain the principles of the present disclosure. In the drawings:

[0029] Figure 1A is a schematic perspective view showing an electronic device according to an embodiment of the present disclosure;

[0030] Figure 1B is a schematic perspective view showing an electronic device according to an embodiment of the present disclosure;

[0031] Figure 2 is along Figure 1A A schematic cross-sectional view of an electronic device according to an embodiment of the present disclosure is shown;

[0032] Figure 3A is a schematic cross-sectional view showing a display panel according to an embodiment of the present disclosure;

[0033] Figure 3B is a schematic cross-sectional view showing a display panel according to an embodiment of the present disclosure;

[0034] Figure 4 is an exploded schematic perspective view showing components of an electronic device according to an embodiment of the present disclosure;

[0035] Figure 5is a schematic rear view showing components of an electronic device according to an embodiment of the present disclosure;

[0036] Figure 6 is a schematic rear view showing components of an electronic device according to an embodiment of the present disclosure;

[0037] Figure 7 yes Figure 6 An enlarged schematic rear view of region AA';

[0038] Figure 8 is along Figure 7 A schematic cross-sectional view of an electronic device according to an embodiment of the present disclosure is shown;

[0039] Fig. 9 is along Figure 7 A schematic cross-sectional view of an electronic device according to an embodiment of the present disclosure is shown;

[0040] Fig.10 is a schematic perspective view showing an electronic device according to an embodiment of the present disclosure;

[0041] Fig.11 is a schematic perspective view showing components of an electronic device according to an embodiment of the present disclosure; and

[0042] Fig.12 is a schematic rear view showing components of an electronic device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0043] Now will be described more fully below with reference to the accompanying drawings showing various embodiments. However, the content of the present disclosure can be implemented in many different forms, and should not be interpreted as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art. Throughout the specification, similar reference numerals refer to similar elements.

[0044] The technical terms used herein are for the purpose of describing specific embodiments only and are not intended to be limiting. Unless the content clearly indicates otherwise, the singular forms "a", "an" and "the" as used herein are also intended to include plural forms, thereby including "at least one". "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. It will be understood that when an element such as a layer, a region or a substrate is referred to as being "on" another element, it can be directly on the other element, or there may be an intermediate element. On the contrary, the term "directly" means that there may be no intermediate element.

[0045] It will also be understood that terms such as “comprises” and / or “comprising”, “has” and / or “having”, or “includes” and / or “including” specify the presence of stated features, regions, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components, and / or clusters thereof.

[0046] Spatially relative terms, such as "beneath," "below," "lower," "above," and "upper," etc., may be used herein for ease of description to describe the relationship of one element or feature to another element or feature as shown in the figures. It will be understood that, in addition to the orientations shown in the accompanying drawings, spatially relative terms are intended to cover different orientations of the device in use or operation. For example, if the device in the figure is turned over, an element described as being "below" or "beneath" other elements or features will subsequently be oriented to be "above" the other elements or features. Thus, the term "below" can cover both the above and below orientations. The device may be oriented in other ways (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0047] It will be understood that, although the terms first, second, etc. can be used to describe various elements, components, regions, layers and / or parts in this article, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, the first "element", "component", "region", "layer" or "part" discussed below can be referred to as the second element, component, region, layer or part, without departing from the teachings herein.

[0048] As used herein, "about" or "approximately" or "substantially" includes the stated value and the mean within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and the errors associated with measurements of the particular quantity (i.e., limitations of the measurement system).

[0049] Exemplary embodiments are described herein with reference to cross-sectional illustrations and / or planar illustrations, which may be idealized illustrations. In the accompanying drawings, the thickness of layers and regions may be exaggerated for clarity. Accordingly, variations in the shapes of the illustrations resulting from, for example, manufacturing techniques and / or tolerances will be expected. Therefore, the embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but will include deviations in shapes resulting from, for example, manufacturing. For example, an etched region shown as a rectangle will typically have rounded or curved features. Therefore, the regions shown in the figures are schematic in nature, and their shapes may not be intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the embodiments.

[0050] The term "overlapping" may include stacking, stacking, facing or facing, extending over, extending below, covering or partially covering, or any other suitable term as would be apparent and understood by one of ordinary skill in the art. The expression "non-overlapping" may include "spaced from" or "disposed to be separated from" or "offset from" and any other suitable equivalent forms as would be apparent and understood by one of ordinary skill in the art.

[0051] For purposes of its meaning and interpretation, the phrase “at least one” is intended to include “at least one selected from the group of…” For example, “at least one of A and B” may be understood to mean “A, B, or A and B.”

[0052] Figure 1A is a schematic perspective view showing an electronic device 1000 according to an embodiment of the present disclosure. Figure 1B is a schematic perspective view showing an electronic device 1000 according to an embodiment of the present disclosure. Figure 1A The electronic device 1000 is shown in an unfolded state, and Figure 1B A state in which the electronic device 1000 is folded is shown.

[0053] Reference Figure 1A and Figure 1B , the electronic device 1000 may be activated by an electrical signal. For example, the electronic device 1000 may be a portable phone, a tablet computer, a car navigation device, a game console, or a wearable device, but is not limited thereto. Figure 1A, a portable phone is shown as an example of the electronic device 1000.

[0054] The electronic device 1000 may display an image through the active region 1000A. In a state where the electronic device 1000 may be unfolded, the active region 1000A may include a plane defined by a first direction DR1 and a second direction DR2. A thickness direction of the electronic device 1000 may be parallel to a third direction DR3 intersecting the first direction DR1 and the second direction DR2. Therefore, a front surface (or top surface) and a rear surface (or bottom surface) of each of a plurality of components constituting the electronic device 1000 may be defined based on the third direction DR3.

[0055] The active region 1000A may include a first region 1000A1, a second region 1000A2, and a third region 1000A3. The second region 1000A2 may be bendable along a folding axis FX extending in a second direction DR2. Therefore, the first region 1000A1 and the third region 1000A3 may be referred to as non-folding regions, and the second region 1000A2 may be referred to as a folding region.

[0056] In the case where the electronic device 1000 can be folded, the first area 1000A1 and the third area 1000A3 can face each other. Therefore, the active area 1000A may not be exposed to the outside in a fully folded state, and this operation may be referred to as an inward folding operation. However, the operation of the electronic device 1000 is not limited thereto.

[0057] In certain embodiments, when the electronic device 1000 can be folded, the first area 1000A1 and the third area 1000A3 can be opposite to each other. Therefore, the active area 1000A can be exposed to the outside in the folded state, and this operation can be called an outward folding operation.

[0058] The electronic device 1000 may perform only one of the inward folding operation and the outward folding operation. In other embodiments, the electronic device 1000 may perform both the inward folding operation and the outward folding operation. The same area of ​​the electronic device 1000 (e.g., the second area 1000A2) may be foldable inward and foldable outward. In other embodiments, a portion of the electronic device 1000 may be foldable inward, and another portion of the electronic device 1000 may be foldable outward.

[0059] exist Figure 1A and Figure 1B A single folding region and two non-folding regions are shown as examples. However, the number of folding regions and non-folding regions is not limited thereto. In a specific embodiment, the electronic device 1000 may include three or more non-folding regions and a plurality of folding regions, and each of the plurality of folding regions may be arranged between non-folding regions adjacent to each other.

[0060] exist Figure 1A and Figure 1B , the folding axis FX may be parallel to the short axis of the electronic device 1000. However, the embodiments of the present disclosure are not limited thereto. In a specific embodiment, the folding axis FX may extend parallel to the long axis (e.g., the first direction DR1) of the electronic device 1000. The first region 1000A1, the second region 1000A2, and the third region 1000A3 may be arranged sequentially in the second direction DR2.

[0061] A plurality of sensing areas 100SA1, 100SA2, and 100SA3 may be defined in the electronic device 1000. Figure 1A 2 and 3. Three sensing areas 100SA1, 100SA2, and 100SA3 are shown as an example in FIG.

[0062] The plurality of sensing areas 100SA1, 100SA2, and 100SA3 may include a first sensing area 100SA1, a second sensing area 100SA2, and a third sensing area 100SA3. For example, the first sensing area 100SA1 may overlap with the camera module, and the second sensing area 100SA2 and the third sensing area 100SA3 may overlap with the proximity illumination sensor. However, embodiments of the present disclosure are not limited thereto.

[0063] Multiple electronic modules 2000 (see Figure 4 ) can receive an external input transmitted through the first sensing area 100SA1, the second sensing area 100SA2 or the third sensing area 100SA3, or can provide an output signal through the first sensing area 100SA1, the second sensing area 100SA2 or the third sensing area 100SA3.

[0064] The first sensing area 100SA1 may be surrounded by the active area 1000A, and the second sensing area 100SA2 and the third sensing area 100SA3 may be included in the active area 1000A. In other words, the second sensing area 100SA2 and the third sensing area 100SA3 may display an image. The transmittance of the first sensing area 100SA1, the second sensing area 100SA2, and the third sensing area 100SA3 may be higher than the transmittance of the active area 1000A. The transmittance of the first sensing area 100SA1 may be higher than the transmittance of the second sensing area 100SA2 and the third sensing area 100SA3.

[0065] According to an embodiment of the present disclosure, a plurality of electronic modules 2000 (see Figure 4 ) may overlap with the active area 1000A, and the plurality of electronic modules 2000 (see Figure 4) may be surrounded by the active region 1000A. Therefore, in the peripheral region 1000NA defined around the active region 1000A, the electronic module 2000 (see Figure 4 As a result, the area ratio of the active region 1000A to the front surface of the electronic device 1000 can be increased.

[0066] Figure 2 is along Figure 1A 1 is taken along line II′ of to illustrate a schematic cross-sectional view of the electronic device 1000 according to an embodiment of the present disclosure. Figure 3A is a schematic cross-sectional view showing a display panel 100 according to an embodiment of the present disclosure.

[0067] Reference Figure 2 , the electronic device 1000 may include a display panel 100 , an upper functional layer, and a lower functional layer.

[0068] Reference Figure 3A , the display panel 100 may generate an image and may sense an input applied from the outside. For example, the display panel 100 may include a display layer 110 and a sensor layer 120. The thickness of the display panel 100 may be in a range from about 25 micrometers to about 35 micrometers (for example, may be about 30 micrometers). However, the thickness of the display panel 100 is not limited thereto.

[0069] The display layer 110 may be a component for substantially generating an image. The display layer 110 may be a light-emitting display layer. For example, the display layer 110 may be an organic light-emitting display layer, a quantum dot display layer, a micro-LED display layer, or a nano-LED display layer.

[0070] The display layer 110 may include a base layer 111 , a circuit layer 112 , a light emitting element layer 113 , and an encapsulation layer 114 .

[0071] The base layer 111 may include a synthetic resin layer. The synthetic resin layer may include a thermosetting resin. The base layer 111 may have a multilayer structure. For example, the base layer 111 may have a three-layer structure of a synthetic resin layer, an adhesive layer and a synthetic resin layer. In particular, the synthetic resin layer may be a polyimide-based resin layer. However, the embodiments of the present disclosure are not limited to the type of material of the synthetic resin layer. The synthetic resin layer may include at least one of an acrylic-based resin, a methacrylic-based resin, a polyisoprene-based resin, a vinyl resin, an epoxy-based resin, a polyurethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyamide-based resin and a perylene-based resin. In other embodiments, the base layer 111 may include a glass substrate, an organic / inorganic composite material substrate or a combination thereof.

[0072] The circuit layer 112 may be arranged on the base layer 111. The circuit layer 112 may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. The insulating layer, the semiconductor layer, and the conductive layer may be arranged (e.g., formed) on the base layer 111 by a coating method and / or a deposition method, and the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned using a photolithography process. Thus, the semiconductor pattern, the conductive pattern, and the signal line of the circuit layer 112 may be formed.

[0073] The light emitting element layer 113 may be disposed on the circuit layer 112. The light emitting element layer 113 may include a light emitting element. For example, the light emitting element layer 113 may include an organic light emitting material, a quantum dot, a quantum rod, a micro LED element, or a nano LED element.

[0074] The encapsulation layer 114 may be disposed on the light emitting element layer 113. The encapsulation layer 114 may include an inorganic layer, an organic layer, and an inorganic layer, which may be sequentially stacked on each other. However, the layers constituting the encapsulation layer 114 are not limited thereto.

[0075] The inorganic layer can protect the light emitting element layer 113 from water and oxygen, and the organic layer can protect the light emitting element layer 113 from foreign matter such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, an aluminum oxide layer, or a combination thereof. The organic layer may include an acrylic-based organic layer, but is not limited thereto.

[0076] The sensor layer 120 may be disposed on the display layer 110. The sensor layer 120 may sense an external input applied from the outside. The external input may be an input of a user. The input of the user may include at least one of various external inputs such as a part of the user's body (e.g., a finger), light, heat, a pen, and pressure.

[0077] The sensor layer 120 may be formed on the display layer 110 by a continuous process. The sensor layer 120 may be disposed on (e.g., directly on) the display layer 110. It is understood that in the case where the sensor layer 120 may be disposed directly on the display layer 110, another component may not be disposed between the sensor layer 120 and the display layer 110. In other words, no additional bonding member may be disposed between the sensor layer 120 and the display layer 110.

[0078] In other embodiments, the sensor layer 120 may be coupled to the display layer 110 by an adhesive member. The adhesive member may include a general adhesive or glue.

[0079] Refer again Figure 2 , the upper functional layer may be disposed on the display panel 100. For example, the upper functional layer may include an anti-reflection member 200 and an upper member 300.

[0080] The anti-reflection member 200 may be referred to as an anti-reflection layer. The anti-reflection member 200 may reduce the reflectivity of external light incident from the outside. The anti-reflection member 200 may include an elongated synthetic resin film. For example, the anti-reflection member 200 may be formed by dyeing a polyvinyl alcohol (PVA) film with an iodine compound. However, the material of the anti-reflection member 200 is not limited thereto. The thickness of the anti-reflection member 200 may be in a range from about 25 microns to about 35 microns (for example, may be about 31 microns). However, the thickness of the anti-reflection member 200 is not limited thereto.

[0081] The anti-reflection member 200 may be coupled to the display panel 100 via a first adhesive layer 1010. The first adhesive layer 1010 may be a transparent adhesive layer, such as a pressure sensitive adhesive (PSA) film, an optically clear adhesive (OCA) film, an optically clear resin (OCR) or a combination thereof. The adhesive layer described hereinafter may include a general adhesive, glue or a combination thereof. The thickness of the first adhesive layer 1010 may be in a range from about 20 microns to about 30 microns (e.g., may be about 25 microns). However, the thickness of the first adhesive layer 1010 is not limited thereto.

[0082] In certain embodiments, the first adhesive layer 1010 may be omitted. The anti-reflection member 200 may be disposed on (eg, directly on) the display panel 100. No additional adhesive layer may be disposed between the anti-reflection member 200 and the display panel 100.

[0083] The upper member 300 may be disposed on the anti-reflection member 200. The upper member 300 may include a first hard coating layer 310, a protective layer 320, a first upper adhesive layer 330, a window 340, a second upper adhesive layer 350, a light shielding layer 360, an impact absorbing layer 370, and a second hard coating layer 380. However, the components included in the upper member 300 are not limited to the above components. In certain embodiments, at least one of the above components may be omitted and / or other components may be added to the upper member 300.

[0084] The first hard coating layer 310 may be a layer disposed at the outermost surface of the electronic device 1000. The first hard coating layer 310 may be a functional layer for improving the use characteristics of the electronic device 1000, and may be disposed on the protective layer 320 through a coating process. For example, the first hard coating layer 310 may improve anti-fingerprint characteristics, anti-fouling characteristics, and / or anti-scratch characteristics.

[0085] The protective layer 320 may be arranged below the first hard coating layer 310. The protective layer 320 may protect the components arranged below the protective layer 320. A chemical resistance layer and / or an anti-fingerprint layer may be additionally provided in the protective layer 320 to improve chemical resistance and / or wear resistance. The protective layer 320 may include a film having an elastic modulus of about 15 GPa or less at room temperature. The thickness of the protective layer 320 may be in a range from about 50 microns to about 60 microns (e.g., may be about 55 microns). However, the thickness of the protective layer 320 is not limited thereto. In a specific embodiment, the protective layer 320 may be omitted.

[0086] The first upper adhesive layer 330 may be disposed below the protective layer 320. The protective layer 320 and the window 340 may be coupled to each other through the first upper adhesive layer 330. The thickness of the first upper adhesive layer 330 may be in a range from about 20 micrometers to about 30 micrometers (e.g., may be about 25 micrometers). However, the thickness of the first upper adhesive layer 330 is not limited thereto.

[0087] The window 340 may be arranged below the first upper adhesive layer 330. The window 340 may include an optically transparent insulating material. For example, the window 340 may include a glass substrate, a synthetic resin film, or a combination thereof. In the case where the window 340 may be a glass substrate, the thickness of the window 340 may be about 80 microns or less (e.g., about 30 microns). However, the thickness of the window 340 is not limited thereto.

[0088] In the case where the window 340 may be a synthetic resin film, the window 340 may include a polyimide (PI) film, a polyethylene terephthalate (PET) film, or a combination thereof.

[0089] The window 340 may have a single layer structure or a multi-layer structure. For example, the window 340 may include a plurality of synthetic resin films coupled to each other by an adhesive, or may include a glass substrate and a synthetic resin film coupled to each other by an adhesive.

[0090] The second upper adhesive layer 350 may be disposed below the window 340. The window 340 and the impact absorbing layer 370 may be coupled to each other through the second upper adhesive layer 350. The thickness of the second upper adhesive layer 350 may be in a range from about 30 micrometers to about 40 micrometers (e.g., may be about 35 micrometers). However, the thickness of the second upper adhesive layer 350 is not limited thereto.

[0091] In an embodiment, the sidewall 340S of the window 340 and the sidewall 350S of the second upper adhesive layer 350 may be laterally recessed from the sidewalls of other layers, for example, the sidewall of the display panel 100 and the sidewall 320S of the protective layer 320. It will be understood that where a component may be laterally recessed from another component, it may be closer to the active area 1000A than the other component.

[0092] The positional relationship between the layers may be changed by a folding operation of the electronic device 1000. According to an embodiment of the present disclosure, since the sidewall 340S of the window 340 may be laterally recessed from the sidewall 320S of the display panel 100 and the protective layer 320, even if the positional relationship between the layers may be changed, the possibility that the sidewall 340S of the window 340 protrudes from the sidewall 320S of the protective layer 320 may be reduced. Therefore, the possibility that an external impact may be transmitted through the sidewall 340S of the window 340 may be reduced. As a result, the possibility that a crack may occur at the window 340 may be reduced.

[0093] The first distance 340W between the sidewall 340S of the window 340 and the sidewall 320S of the protective layer 320 may be a predetermined distance or more. Here, the first distance 340W may mean a distance parallel to the first direction DR1. When viewed in a plan view, the first distance 340W may correspond to the distance between the sidewall 340S and the sidewall 320S.

[0094] The first distance 340W may be in a range from about 180 microns to about 205 microns (e.g., may be about 196 microns). However, embodiments of the present disclosure are not limited thereto. In a particular embodiment, the first distance 340W may be 50 microns or greater (e.g., 300 microns). As the first distance 340W increases, the protective layer 320 may further protrude from the window 340, and a portion of the protective layer 320 may be bent to be arranged on (e.g., bonded to) other components (e.g., a housing). As the area of ​​the protective layer 320 increases, the possibility that foreign matter may be provided from an area on the protective layer 320 to an area below the protective layer 320 may be reduced.

[0095] The window 340 and the second upper adhesive layer 350 may be bonded to the impact absorbing layer 370 through a lamination process. Considering the tolerance of the lamination process, the area of ​​the window 340 and the area of ​​the second upper adhesive layer 350 may each be smaller than the area of ​​the impact absorbing layer 370. The area of ​​the second upper adhesive layer 350 may be smaller than the area of ​​the window 340. For example, in the process of bonding the window 340, pressure may be applied to the second upper adhesive layer 350. The second upper adhesive layer 350 may be stretched in the first direction DR1 and the second direction DR2 due to the pressure. At this time, the area of ​​the second upper adhesive layer 350 may be smaller than the area of ​​the window 340 so that the second upper adhesive layer 350 does not protrude from the window 340.

[0096] If the first upper adhesive layer 330 and the second upper adhesive layer 350 are adhered to each other, the window 340 may not slide in the folding operation of the electronic device 1000, and thus a warping phenomenon may occur at the window 340. However, according to an embodiment of the present disclosure, the area of ​​the second upper adhesive layer 350 may be smaller than that of the window 340. Therefore, the first upper adhesive layer 330 may not be adhered to the second upper adhesive layer 350, and the possibility of foreign matter being attached to the second upper adhesive layer 350 may be reduced.

[0097] The second distance 350W between the sidewall 350S of the second upper adhesive layer 350 and the sidewall 320S of the protective layer 320 may be a predetermined distance or more. Here, the second distance 350W may mean a distance parallel to the first direction DR1. When viewed in a plan view, the second distance 350W may correspond to the distance between the sidewall 350S and the sidewall 320S.

[0098] The second distance 350W may be about 392 microns, but is not limited thereto. In a specific example, the second distance 350W may be in a range from about 292 microns to about 492 microns. However, the second distance 350W is not limited to this range. The light shielding layer 360 may be arranged between the impact absorbing layer 370 and the second upper adhesive layer 350. The light shielding layer 360 may be printed on the top surface of the impact absorbing layer 370. The light shielding layer 360 may overlap with the peripheral area 1000NA. The light shielding layer 360 may be a colored layer and may be formed by a coating method. The light shielding layer 360 may include a colored organic material or an opaque metal. However, the material of the light shielding layer 360 is not limited thereto.

[0099] exist Figure 2 3 shows as an example a light shielding layer 360 arranged on the top surface of the impact absorbing layer 370. However, the position of the light shielding layer 360 is not limited thereto. In a specific embodiment, the light shielding layer 360 may be disposed on the top surface of the protective layer 320, the bottom surface of the protective layer 320, the top surface of the window 340, or the bottom surface of the window 340. In a specific embodiment, the light shielding layer 360 may include multiple layers. At least one of the multiple layers of the light shielding layer 360 may be disposed on the top surface of the impact absorbing layer 370, and at least another of the multiple layers of the light shielding layer 360 may be disposed on the top surface of the protective layer 320, the bottom surface of the protective layer 320, the top surface of the window 340, or the bottom surface of the window 340.

[0100] The impact absorbing layer 370 may be a functional layer for protecting the display panel 100 from the influence of external impact. The impact absorbing layer 370 may include a film having an elastic modulus of about 1 GPa or more at room temperature. The impact absorbing layer 370 may be a stretch film having an optical function. For example, the impact absorbing layer 370 may be an optical axis control film. The thickness of the impact absorbing layer 370 may be in a range from about 35 microns to about 45 microns (for example, may be about 41 microns). However, the thickness of the impact absorbing layer 370 is not limited thereto. In a specific embodiment, the impact absorbing layer 370 may be omitted.

[0101] The second hard coating layer 380 may be disposed on the surface of the impact absorbing layer 370. The impact absorbing layer 370 may include an uneven surface. The top surface of the impact absorbing layer 370 may be in contact with the second upper adhesive layer 350. The uneven portion of the top surface of the impact absorbing layer 370 may be filled with the second upper adhesive layer 350. Therefore, optical problems may not occur at the top surface of the impact absorbing layer 370. The bottom surface of the impact absorbing layer 370 may be flattened by the second hard coating layer 380. In other words, in the first hole 101H (see Figure 4 ) extends to the second adhesive layer 102, by the first hole 101H (see Figure 4 ) The exposed surface may be smooth. The second hard coating layer 380 may cover the uneven surface of the impact absorbing layer 370, and thus may prevent fog from occurring at the uneven surface.

[0102] The upper member 300 may be coupled to the anti-reflection member 200 via a second adhesive layer 1020. The second adhesive layer 1020 may include a general adhesive, glue, or a combination thereof. The thickness of the second adhesive layer 1020 may be in a range from about 20 microns to about 30 microns (e.g., may be about 25 microns). However, the thickness of the second adhesive layer 1020 is not limited thereto.

[0103] The lower functional layer may be arranged below the display panel 100. For example, the lower functional layer may include a lower protective film 400, a cushion member 500, a first lower member 600, a second lower member 700, and a step difference compensation member (or adhesive member) 800. However, the components included in the lower functional layer are not limited to the above components. At least one of the above components may be omitted and / or other components may be added to the lower functional layer.

[0104] The lower protective film 400 may be coupled to the rear surface of the display panel 100 through the third adhesive layer 1030. The lower protective film 400 may prevent scratches from occurring at the rear surface of the display panel 100 during the manufacturing process of the display panel 100. The lower protective film 400 may be a colored polyimide film. For example, the lower protective film 400 may be an opaque yellow film, but is not limited thereto.

[0105] The thickness of the lower protective film 400 may be in the range of about 30 micrometers to about 50 micrometers (for example, about 40 micrometers). The thickness of the third adhesive layer 1030 may be in the range of about 13 micrometers to about 25 micrometers (for example, about 18 micrometers). However, the thickness of the lower protective film 400 and the third adhesive layer 1030 is not limited thereto.

[0106] The cushion member 500 may be disposed under the lower protective film 400. The cushion member 500 may protect the display panel 100 from an impact transmitted toward the rear surface of the display panel 100. The impact resistance characteristic of the electronic device 1000 may be improved by the cushion member 500.

[0107] The cushion member 500 may include a first cushion adhesive layer 510, a barrier film 520, a cushion layer 530, and a second cushion adhesive layer 540. However, the components included in the cushion member 500 are not limited to the above components. At least one of the above components may be omitted and / or other components may be added to the cushion member 500.

[0108] The first liner adhesive layer 510 and the second liner adhesive layer 540 may include a general adhesive, glue, or a combination thereof. The first liner adhesive layer 510 may be bonded to the lower protective film 400, and the second liner adhesive layer 540 may be bonded to the first lower member 600. The thickness of the first liner adhesive layer 510 may be in the range of from about 20 microns to about 30 microns (e.g., may be about 25 microns). The thickness of the second liner adhesive layer 540 may be in the range of from about 4 microns to about 15 microns (e.g., may be about 8 microns). However, the thickness of the first liner adhesive layer 510 and the second liner adhesive layer 540 is not limited thereto.

[0109] The barrier film 520 may be provided to improve the impact resistance. The barrier film 520 may prevent deformation of the display panel 100. The barrier film 520 may be a synthetic resin film (e.g., a polyimide film), but is not limited thereto. The thickness of the barrier film 520 may be in a range from about 30 microns to about 40 microns (e.g., may be about 35 microns). However, the thickness of the barrier film 520 is not limited thereto.

[0110] The cushion layer 530 may include, for example, foam, sponge, or a combination thereof. The foam may include polyurethane foam, thermoplastic polyurethane foam, or a combination thereof. In the case where the cushion layer 530 includes foam, the cushion layer 530 may be formed using the barrier film 520 as a base layer. For example, a foaming agent may be provided on the barrier film 520 to form the cushion layer 530.

[0111] The thickness of the pad layer 530 may be in the range from about 80 micrometers to about 120 micrometers (eg, may be about 100 micrometers). However, the thickness of the pad layer 530 is not limited thereto.

[0112] At least one of the blocking film 520 and the cushion layer 530 may have a color capable of absorbing light. For example, at least one of the blocking film 520 and the cushion layer 530 may have a black color. It is possible to prevent components disposed under the cushion member 500 from being visible to the outside.

[0113] The first lower member 600 may be disposed below the cushion member 500. The first lower member 600 may include a plate 610, a lower adhesive layer 620, and a cover layer 630. However, the components included in the first lower member 600 are not limited to the above components. At least one of the above components may be omitted and / or other components may be added to the first lower member 600.

[0114] The board 610 may include a material having an elastic modulus of about 60 GPa or more at room temperature. The board 610 may include a metal, a metal alloy, or a combination thereof. For example, the board 610 may include SUS304, but is not limited thereto. The board 610 may support components arranged thereon. The heat dissipation performance of the electronic device 1000 may be improved by the board 610.

[0115] The board 610 may have a top surface 610up and a bottom surface 610bt. The top surface 610up of the board 610 may be disposed between the bottom surface 610bt of the board 610 and the display panel 100.

[0116] An opening 611 may be defined in a portion of the plate 610. The opening 611 may be defined in a region overlapping the second region 1000A2. When viewed in a plan view (e.g., in the third direction DR3 or the thickness direction of the plate 610), the opening 611 may overlap the second region 1000A2. The shape of the portion of the plate 610 may be more easily deformed due to the opening 611.

[0117] The cover layer 630 may be bonded to the board 610 through the lower adhesive layer 620. The lower adhesive layer 620 may include a general adhesive, glue, or a combination thereof. The cover layer 630 may cover the opening 611 of the board 610. Therefore, foreign matter can be prevented from entering the opening 611.

[0118] The cover layer 630 may include a material having an elastic modulus lower than that of the plate 610. For example, the cover layer 630 may include thermoplastic polyurethane, but is not limited thereto.

[0119] The thickness of the plate 610 may be in the range of about 120 microns to about 180 microns (e.g., may be about 150 microns). The thickness of the lower adhesive layer 620 may be in the range of about 4 microns to about 15 microns (e.g., may be about 8 microns). The thickness of the cover layer 630 may be in the range of about 4 microns to about 15 microns (e.g., may be about 8 microns). However, the thicknesses of the plate 610, the lower adhesive layer 620, and the cover layer 630 are not limited to the above values.

[0120] The second lower member 700 may be disposed below the first lower member 600. The plurality of second lower members 700 may be spaced apart from each other. For example, one of the plurality of second lower members 700 may overlap the first region 1000A1, and another of the plurality of second lower members 700 may overlap the third region 1000A3.

[0121] The plurality of second lower members 700 may be bonded to the first lower member 600 through the plurality of fourth adhesive layers 1040, respectively. For example, one of the plurality of fourth adhesive layers 1040 may be bonded to the bottom surface of the first lower member 600 overlapping the first region 1000A1, and another of the plurality of fourth adhesive layers 1040 may be bonded to the bottom surface of the first lower member 600 overlapping the third region 1000A3. The fourth adhesive layer 1040 may not overlap the second region 1000A2. The thickness of each of the plurality of fourth adhesive layers 1040 may be in the range of from about 8 microns to about 15 microns (for example, may be about 8 microns). However, the thickness of each of the plurality of fourth adhesive layers 1040 is not limited thereto.

[0122] Even though not shown in the drawings, a step difference compensation film may be further arranged between each of the plurality of second lower members 700 and the first lower member 600. For example, the step difference compensation film may be disposed in an area overlapping the second area 1000A2. The adhesive strength of one surface of the step difference compensation film may be lower than the adhesive strength of the other surface of the step difference compensation film. For example, the one surface may not have adhesive strength. The one surface may face the first lower member 600.

[0123] Each of the plurality of second lower members 700 may include a lower plate 710, a heat sink 720, and an insulating film 730. However, the components included in each of the plurality of second lower members 700 are not limited to the above components. At least one of the above components may be omitted and / or other components may be added to each of the plurality of second lower members 700.

[0124] A plurality of lower plates 710 may be provided, one of which may overlap the first region 1000A1 and a portion of the second region 1000A2, and another of which may overlap the third region 1000A3 and another portion of the second region 1000A2.

[0125] The plurality of lower plates 710 may be spaced apart from each other in the second area 1000A2. However, the plurality of lower plates 710 may be arranged as close to each other as possible to support a portion of the plate 610 where the opening 611 may be formed. For example, the lower plates 710 may prevent the shape of the portion of the plate 610 having the opening 611 from being deformed due to pressure applied from above.

[0126] The lower plate 710 may prevent the shape of components disposed on the second lower member 700 from being deformed by one or more components disposed below the second lower member 700 .

[0127] Each of the plurality of lower plates 710 may include a metal alloy, for example, a copper alloy. However, the material of the lower plate 710 is not limited thereto. The thickness of each of the plurality of lower plates 710 may be in a range from about 60 micrometers to about 100 micrometers (for example, may be about 80 micrometers). However, the thickness of each of the plurality of lower plates 710 is not limited thereto.

[0128] The heat sink 720 may be bonded to the bottom surface of the lower plate 710. The heat sink 720 may be a heat conductive sheet having high thermal conductivity. For example, the heat sink 720 may include a heat dissipation layer 721, a first heat dissipation adhesive layer 722, a second heat dissipation adhesive layer 723, and a gap tape 724.

[0129] The gap tape 724 may be bonded to the first heat dissipation adhesive layer 722 and the second heat dissipation adhesive layer 723, and the first heat dissipation adhesive layer 722 and the second heat dissipation adhesive layer 723 may be spaced apart from each other with the heat dissipation layer 721 interposed therebetween. The gap tape 724 may be composed of multiple layers. For example, the gap tape 724 may include a base material layer, an upper adhesive layer disposed on the top surface of the base material layer, and a lower adhesive layer disposed on the bottom surface of the base material layer.

[0130] The heat dissipation layer 721 may be bonded to the lower plate 710 by the first heat dissipation adhesive layer 722. The heat dissipation layer 721 may be sealed by the first heat dissipation adhesive layer 722, the second heat dissipation adhesive layer 723, and the gap band 724. The heat dissipation layer 721 may be a graphitized polymer film. The polymer film may be, for example, a polyimide film. The thickness of each of the first heat dissipation adhesive layer 722 and the second heat dissipation adhesive layer 723 may be in the range of from about 3 microns to about 8 microns (e.g., may be about 5 microns), and the thickness of each of the heat dissipation layer 721 and the gap band 724 may be in the range of from about 10 microns to about 25 microns (e.g., may be about 17 microns). However, the thickness of the first heat dissipation adhesive layer 722 and the second heat dissipation adhesive layer 723, the heat dissipation layer 721, and the gap band 724 is not limited to the above values.

[0131] The insulating film 730 may be bonded to the bottom surface of the heat sink 720. For example, the insulating film 730 may be bonded to the second heat dissipation adhesive layer 723. The insulating film 730 may prevent a rattle of the electronic device 1000 from occurring. The thickness of the insulating film 730 may be about 15 micrometers, but is not limited thereto.

[0132] The step difference compensating member 800 may be bonded to the bottom surface 610bt of the board 610. For example, the lower adhesive layer 620 may be bonded to a portion of the bottom surface 610bt of the board 610, and the step difference compensating member 800 may be bonded to another portion of the bottom surface 610bt of the board 610.

[0133] The step difference compensation member 800 may include a first compensation adhesive layer 810, a step difference compensation film 820, and a second compensation adhesive layer 830. The first compensation adhesive layer 810 may be bonded to the bottom surface 610bt of the board 610. The step difference compensation film 820 may be a synthetic resin film. The second compensation adhesive layer 830 may be bonded to the bottom surface of the step difference compensation film 820 and a kit (not shown). The kit may be a component including an intermediate housing bonded to the step difference compensation film 820. The component may also include a battery, a mainboard, and a camera module that may be arranged below the intermediate housing. However, embodiments of the present disclosure are not limited thereto.

[0134] Figure 3B is a schematic cross-sectional view showing a display panel 100aa according to an embodiment of the present disclosure.

[0135] Reference Figure 3B , and reference Figure 3A Compared with the above-mentioned display panel 100, the display panel 100aa may further include an anti-reflection layer 130. In the electronic device 1000 (see Figure 2 ), the anti-reflection member 200 (see Figure 2 ) and the first adhesive layer 1010 (see Figure 2 ) can be omitted.

[0136] The display panel 100 aa may include a display layer 110 , a sensor layer 120 , and an anti-reflection layer 130 .

[0137] The anti-reflection layer 130 according to an embodiment of the present disclosure may include a color filter. A plurality of color filters may be arranged in a predetermined form. The arrangement of the plurality of color filters may be determined in consideration of the luminous color of the pixels included in the display layer 110. The anti-reflection layer 130 may further include a black matrix adjacent to the color filter.

[0138] The anti-reflection layer 130 according to an embodiment of the present disclosure may include a destructive interference structure. For example, the destructive interference structure may include a first reflective layer and a second reflective layer that may be arranged on different layers. The first reflected light and the second reflected light reflected from the first reflective layer and the second reflective layer, respectively, may interfere destructively, and thus the reflectivity of the external light may be reduced.

[0139] Figure 4 is an exploded schematic perspective view showing components of an electronic device 1000 according to an embodiment of the present disclosure.

[0140] Reference Figure 4 , an electronic device 1000 is shown as an example (see Figure 2 ), a light shielding layer 360, a display panel 100, a driving chip 140, a circuit film 150, and a plurality of electronic modules 2000. The plurality of electronic modules 2000 may include a camera module 2100 and a proximity illumination sensor 2200.

[0141] The proximity lighting sensor 2200 may include a light emitting module 2210 and a light receiving module 2220. The light emitting module 2210 and the light receiving module 2220 may be mounted on a single substrate. The light emitting module 2210 may generate light and may output the generated light. For example, the light emitting module 2210 may output infrared light. The light emitting module 2210 may include a light emitting diode. The light receiving module 2220 may sense infrared light. In the case of sensing infrared light of a predetermined level or higher, the light receiving module 2220 may be activated. The light receiving module 2220 may include a CMOS sensor. After the infrared light generated in the light emitting module 2210 is output, the infrared light may be reflected by an external object (e.g., a finger or face of a user), and the reflected infrared light may be incident on the light receiving module 2220.

[0142] The display panel 100 may define an active area 100A and a peripheral area 100NA. The active area 100A may correspond to Figure 1A The active area 1000A shown in FIG. 1 and the peripheral area 100NA may correspond to Figure 1A The peripheral area 1000NA is shown in FIG.

[0143] The first sensing area 100SA1 overlapping the camera module 2100 may be surrounded by the active area 100A. The second sensing area 100SA2 overlapping the light transmitting module 2210 and the third sensing area 100SA3 overlapping the light receiving module 2220 may be parts of the active area 100A.

[0144] A first hole 101H may be defined in a portion of the display panel 100. The first hole 101H may be disposed to correspond to the first sensing area 100SA1. Thus, the camera module 2100 may receive an external input transmitted through the first hole 101H.

[0145] The light shielding layer 360 may include a first light shielding pattern 361 and a second light shielding pattern 362. The first light shielding pattern 361 may cover the peripheral area 100NA. The second light shielding pattern 362 may surround the camera module 2100 when viewed in a plan view.

[0146] The display panel 100 may define a first region 100A1, a second region 100A2, and a third region 100A3 that may be sequentially arranged in the first direction DR1. The second region 100A2 may be arranged along the folding axis FX (see FIG. 2 ). Figure 1A ) folded. The first area 100A1, the second area 100A2 and the third area 100A3 can be respectively Figure 1A The first area 1000A1, the second area 1000A2 and the third area 1000A3 shown in FIG. 1 overlap or correspond.

[0147] The driving chip 140 may be mounted in the peripheral area 100NA of the display panel 100 , and the circuit film 150 may be adhered to the peripheral area 100NA of the display panel 100 .

[0148] The driver chip 140 may be a chip-type timing control circuit. The driver chip 140 may be referred to as a display driver IC. However, the embodiments of the present disclosure are not limited thereto. In a specific embodiment, the driver chip 140 may be mounted on a film separated from the display panel 100. The driver chip 140 may be electrically connected to the display panel 100 through the film, and the circuit film 150 may be bonded to the film.

[0149] The circuit film 150 may be provided with a circuit for receiving a signal from the electronic device 1000 (see Figure 1A ) includes a connector 150c for connecting a signal provided by a central processing unit (CPU) included in the circuit film 150. The circuit film 150 may extend to a peripheral area 100NA adjacent to the third area 100A3.

[0150] Figure 5 is a schematic rear view showing components of the electronic device 1000 according to an embodiment of the present disclosure.

[0151] Reference Figure 4 and Figure 5 , the display panel 100 , the board 610 , the step difference compensating member 800 , the heat dissipation layer 721 , and the gap strip 724 are shown as examples.

[0152] The first hole 101H, the second hole 102H, and the third hole 103H may be disposed to correspond to the first sensing area 100SA1, the second sensing area 100SA2, and the third sensing area 100SA3, respectively. The first hole 101H, the second hole 102H, and the third hole 103H may be disposed to overlap the first area 100A1 of the display panel 100.

[0153] The first hole 101H, the second hole 102H, and the third hole 103H can be formed by removing the electronic device 1000 (see Figure 1A ) are formed by parts of some components, and this will be described in detail later.

[0154] The first hole 101H may overlap the step difference compensating member 800, and the second hole 102H and the third hole 103H may overlap the gap band 724. Therefore, when viewed in a plan view, the first hole 101H may be surrounded by the step difference compensating member 800, and when viewed in a plan view, each of the second hole 102H and the third hole 103H may be surrounded by the gap band 724.

[0155] Figure 6 is a schematic rear view showing components of the electronic device 1000 according to an embodiment of the present disclosure.

[0156] Reference Figure 4 and Figure 6 , the display panel 100 , the board 610 , the step difference compensating member 800 , the insulating film 730 , and the circuit film 150 are shown.

[0157] A first area (or code area) 610a1 and a second area 610a2 adjacent to the first area 610a1 may be defined in the bottom surface 610bt of the board 610. A unique code 610c may be printed in the first area 610a1. The second area 610a2 may mean the remaining area of ​​the bottom surface 610bt of the board 610 except the first area 610a1.

[0158] The unique code 610c may be provided on the bottom surface 610bt of the plate 610. For example, the unique code 610c may be provided in the form of a quick response (QR) code. However, the embodiments of the present disclosure are not limited thereto. In a specific embodiment, the unique code 610c may be provided in the form of a barcode or may be provided in the form of a unique number. The unique code 610c may be engraved on the bottom surface 610bt of the plate 610 by laser.

[0159] The circuit film 150 may be bonded to the peripheral area 100NA adjacent to the third area 100A3 of the display panel 100. The unique code 610c may be provided in an area adjacent to the circuit film 150. For example, the unique code 610c may be provided in a first area 610a1 of the bottom surface 610bt of the plate 610 overlapping the third area 100A3 of the display panel 100.

[0160] The circuit film 150 may be a flexible circuit board. The circuit film 150 may include a first portion 151 and a second portion 152. The first portion 151 may be used to transmit a signal provided from a central processing unit (not shown) to the display panel 100. Therefore, the first portion 151 may include an interconnection line for transmitting an electrical signal.

[0161] The first portion 151 may include a first connection portion 151c1 and a second connection portion 151c2. The second connection portion 151c2 may extend from the first connection portion 151c1, and Figure 4 The connector 150c in the embodiment may extend to the second connection portion 151c2. However, the shape of the first portion 151 is not limited thereto. Figure 6 2 shows as an example the second connection portion 151c2 protruding from the first connection portion 151c1 in the first direction DR1. In other embodiments, the second connection portion 151c2 may protrude from the first connection portion 151c1 in the second direction DR2. In certain embodiments, the second connection portion 151c2 may be omitted.

[0162] The second portion 152 may protrude and extend in the first direction DR1 from the first portion 151. A maximum width 151wt of the first portion 151 in the second direction DR2 may be greater than a maximum width 152wt of the second portion 152 in the second direction DR2.

[0163] Figure 7 yes Figure 6 An enlarged schematic rear view of area AA'. Figure 8 is along Figure 7 1 is taken along line II-II′ to illustrate a schematic cross-sectional view of the electronic device 1000 according to an embodiment of the present disclosure.

[0164] Reference Figure 7 and Figure 8 , showing a lower adhesive layer 620, a cover layer 630, a fourth adhesive layer 1040, a lower plate 710, a heat sink 720, and an insulating film 730 that may be disposed below the plate 610. The lower adhesive layer 620, the cover layer 630, the fourth adhesive layer 1040, the lower plate 710, the heat sink 720, and the insulating film 730 may be referred to as a plurality of lower layers 610BLS.

[0165] The plurality of lower layers 610BLS may be bonded to the board 610 and may expose the code region 610a1. The code region 610a1 of the board 610 exposed by the plurality of lower layers 610BLS may be covered by the second portion 152 of the circuit film 150.

[0166] A recessed area corresponding to the code area 610a1 may be defined in the plurality of lower layers 610BLS in a plan view or when viewed in the third direction DR3 or the thickness direction of the board 610. Since the second portion 152 of the circuit film 150 covers the code area 610a1, a portion of the second portion 152 may be surrounded by the plurality of lower layers 610BLS.

[0167] The second portion 152 of the circuit film 150 may include an insulating material. For example, the second portion 152 may include a polyimide film, or may include a polyimide film and at least one insulating layer stacked on the polyimide film.

[0168] When the plate 610 is in contact with the assembly, electrical noise may be generated. The electrical noise may degrade the sensor layer 120 (see Figure 3A ) and / or may be touch sensitive in the display layer 110 (see Figure 3A ) causes noise at the image displayed. However, according to an embodiment of the present disclosure, the code area 610a1 of the board 610 can be covered by the circuit film 150 having an insulating property. Therefore, the possibility of the board 610 contacting the kit arranged under the plurality of lower layers 610BLS can be reduced or eliminated. As a result, the reduction in touch sensitivity can be suppressed or prevented, and the possibility of noise occurrence can be reduced, and thus the electronic device 1000 (see Figure 1A ) reliability.

[0169] The second portion 152 of the circuit film 150 may compensate for the step difference between the region where the plurality of lower layers 610BLS may be disposed and the region where the plurality of lower layers 610BLS may not be disposed. Figure 1A )’s impact durability can be improved by the second portion 152.

[0170] The circuit film 150 may have different thicknesses in different regions. For example, the thickness 152tk of the second portion 152 of the circuit film 150 may be less than the thickness 151tk of the first portion 151 of the circuit film 150. Unlike the second portion 152, the first portion 151 may also include interconnects. Therefore, the first portion 151 may be thicker than the second portion 152.

[0171] For example, the thickness 152tk of the second portion 152 of the circuit film 150 may be similar to the thickness (or total thickness) 610Bh of the plurality of lower layers 610BLS. The thickness 152tk of the second portion 152 may be less than the thickness 610Bh of the plurality of lower layers 610BLS. Therefore, even if the second portion 152 is additionally provided, the second portion 152 may not interfere with the placement of the kit or battery under the plurality of lower layers 610BLS.

[0172] The plurality of lower layers 610BLS may protrude from the bottom surface 610bt of the board 610 to the same level as or lower than the bottom surface 152bt of the second portion 152. The distance between the bottom surface 610bt of the board 610 and the bottommost surface 730bm of the insulating film 730 may be equal to the thickness 610Bh of the plurality of lower layers 610BLS. Therefore, the distance between the bottom surface 610bt of the board 610 and the bottommost surface 730bm of the insulating film 730 may be equal to or greater than the distance 152Bh between the bottom surface 610bt of the board 610 and the bottom surface 152bt of the second portion 152. For example, a distance between the bottom surface 610bt of the plate 610 and the bottommost surface 730bm of the insulating film 730 may be about 146 micrometers, and a distance 152Bh between the bottom surface 610bt of the plate 610 and the bottom surface 152bt of the second portion 152 may be about 146 micrometers or less.

[0173] The conductive tape 151a may be disposed between the first portion 151 of the circuit film 150 and the board 610 (e.g., on the upper surface 152up of the circuit film 150). The conductive tape 151a may prevent charges from accumulating in the circuit film 150. For example, charges generated in the circuit film 150 may move to the board 610 through the conductive tape 151a. In other words, the conductive tape 151a may provide an anti-charging effect.

[0174] An adhesive layer 152a may be disposed between the second portion 152 of the circuit film 150 and the board 610. The adhesive layer 152a may include a general adhesive, glue, or a combination thereof. The adhesive layer 152a may fix the second portion 152 on the code region 610a1 of the board 610.

[0175] Fig. 9 is along Figure 7 The schematic cross-sectional view of the electronic device 1000 according to the embodiment of the present disclosure is taken along the line II-II'. Fig. 9 The implementation method and Figure 8 differences between the implementations of

[0176] Reference Fig. 9 , the conductive tape 150a may be disposed between the circuit film 150 and the board 610. The conductive tape 150a may be disposed between the first portion 151 and the board 610 and between the second portion 152 and the board 610.

[0177] In other words, unlike the above-described embodiment, the conductive tape 150 a bonded between the first portion 151 and the board 610 may extend between the second portion 152 and the board 610 .

[0178] Fig.10 is a schematic perspective view showing an electronic device 1000bb according to an embodiment of the present disclosure. Fig.11is a schematic perspective view showing components of an electronic device 1000bb according to an embodiment of the present disclosure. Fig.12 is a schematic rear view showing components of an electronic device 1000bb according to an embodiment of the present disclosure.

[0179] Reference Fig.10 , Fig.11 and Fig.12 , the electronic device 1000bb may be a bar-type portable phone. In other words, the shape of the electronic device 1000bb may not be modified or changed, and the electronic device 1000bb may have a fixed shape.

[0180] The electronic device 1000bb may include a display panel 100bb, a driving chip 140, a circuit film 150, a board 200bb, and a lower layer 300bb.

[0181] The display panel 100bb may define an active area 100Ab and a peripheral area 100NAb therein. The driving chip 140 may be mounted in the peripheral area 100Nab of the display panel 100bb, and the circuit film 150 may be adhered to the peripheral area 100NAb of the display panel 100bb.

[0182] A portion of the peripheral area 100NAb of the display panel 100bb may be bent to be arranged on the rear surface of the display panel 100bb. For example, a portion of the peripheral area 100NAb of the display panel 100bb to which the driving chip 140 and the circuit film 150 may be bonded may be bent toward the rear surface of the display panel 100bb.

[0183] The board 200bb may be bonded to the rear surface of the display panel 100bb. The display panel 100bb and the board 200bb may be bonded to each other through an adhesive layer. However, the embodiments of the present disclosure are not limited thereto. In a specific embodiment, other functional layers may be further arranged between the board 200bb and the display panel 100bb.

[0184] The board 200bb may include a metal, a metal alloy, or a combination thereof. For example, the board 200bb may include SUS304, but is not limited thereto. A unique code 200bbc may be provided on the bottom surface of the board 200bb. The unique code 200bbc may be engraved on the bottom surface of the board 200bb by laser. The bottom surface of the board 200bb may mean a surface facing the lower layer 300bb.

[0185] The lower layer 300bb may be bonded to the rear surface (ie, bottom surface) of the board 200bb. The lower layer 300bb and the board 200bb may be bonded to each other by an adhesive layer. The lower layer 300bb may be a single layer or may include a plurality of stacked layers.

[0186] The lower layer 300bb may overlap only a portion of the board 200bb. In particular, the lower layer 300bb may not overlap the unique code 200bbc disposed on the board 200bb. Therefore, the area of ​​the board 200bb where the unique code 200bbc is disposed may not be covered by the lower layer 300bb, but may be exposed.

[0187] The step difference compensating member (or adhesive member) 800bb may be adhered to the rear surface (or bottom surface) of the board 200bb. The step difference compensating member 800bb may be an adhesive member having adhesive properties on both surfaces. The step difference compensating member 800bb may be coupled to a kit arranged below the lower layer 300bb.

[0188] According to an embodiment of the present disclosure, the unique code 200bbc may be covered by the second portion 152 of the circuit film 150. For simplicity and convenience of explanation, Fig.12 , the unique code 200bbc covered by the second portion 152 is shown. However, the unique code 200bbc may not be visible because it may be covered by the second portion 152.

[0189] According to an embodiment of the present disclosure, the second portion 152 of the circuit film 150 can compensate for the step difference between the region where the lower layer 300bb is disposed and the region where the lower layer 300bb is not disposed. Therefore, the impact durability of the electronic device 1000bb can be improved by the second portion 152.

[0190] The area of ​​the board 200bb where the unique code 200bbc is arranged may be covered by the circuit film 150 having insulating properties. Therefore, the possibility of the board 200bb contacting the assembly arranged under the lower layer 300bb may be reduced or removed. The electrical noise caused by the contact between the board 200bb and the assembly may be reduced or removed, and thus the reliability of the electronic device 1000bb may be improved.

[0191] According to an embodiment of the present disclosure, an electronic device may include a display panel and a board arranged below the display panel and having a code area in which a unique code may be provided. The code area of ​​the board may be covered by a circuit film having insulating properties. Therefore, the possibility of the code area of ​​the board contacting the kit may be reduced or removed. As a result, the reduction in the touch sensitivity of the electronic device may be suppressed or prevented, and the possibility of noise occurrence may be reduced, and thus the reliability of the electronic device may be improved.

[0192] The circuit film can compensate for the step difference between an area of ​​the rear surface of the board where the lower layer can be arranged and another area of ​​the rear surface of the board where the unique code is printed. Therefore, the impact durability of the electronic device can be improved by the circuit film covering the code area.

[0193] Although various aspects have been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the present disclosure. Therefore, it will be understood that the above embodiments are not limiting but illustrative. Therefore, the scope of the present disclosure is determined by the broadest permissible interpretation of the appended claims and their equivalents, and should not be restricted or limited by the foregoing description.

Claims

1. An electronic device, comprising: Display panel; a plate disposed below the display panel and including a bottom surface having a code area having a unique code disposed therein; as well as a flexible circuit board electrically connected to the display panel and arranged on the bottom surface of the board, the flexible circuit board comprising: Part I; as well as A second portion of the unique code extends from the first portion and covers the unique code disposed in the code region.

2. The electronic device as claimed in claim 1, further comprising: A plurality of lower layers are disposed on the bottom surface of the board and expose the code area.

3. The electronic device as claimed in claim 2, wherein: The thickness of the second portion of the flexible circuit board is equal to or smaller than the thickness of the plurality of lower layers.

4. The electronic device as claimed in claim 2, wherein: A portion of the second portion is surrounded by the plurality of lower layers.

5. The electronic device as claimed in claim 1, wherein: The thickness of the first portion of the flexible circuit board is greater than the thickness of the second portion.

6. The electronic device as claimed in claim 1, wherein: The display panel includes a first area, a second area and a third area; The first area, the second area and the third area are arranged along a first direction; The second region is foldable along a folding axis extending in a second direction intersecting the first direction; and An opening is arranged in a portion of the plate facing the second area.

7. The electronic device as claimed in claim 6, further comprising: a cover layer disposed on the bottom surface of the plate and covering the opening; a plurality of lower plates arranged on a bottom surface of the cover layer and spaced apart from each other in the first direction; a plurality of heat sinks, the plurality of heat sinks being respectively arranged on bottom surfaces of the plurality of lower plates; as well as A plurality of insulating films are respectively arranged on bottom surfaces of the plurality of heat sinks.

8. The electronic device as claimed in claim 7, wherein: The thickness of the second portion of the flexible circuit board is equal to or smaller than a height from the bottom surface of the board to a bottom surface of each of the plurality of insulating films.

9. The electronic device as claimed in claim 6, wherein: The code area is arranged below the third area, and The flexible circuit board is arranged in a peripheral area of ​​the display panel, and the peripheral area is adjacent to the third area.

10. The electronic device as claimed in claim 1, further comprising: A conductive tape is disposed between the first portion and the plate.

11. The electronic device according to claim 10, wherein: The conductive tape extends between the second portion of the flexible circuit board and the board.

12. The electronic device as claimed in claim 1, further comprising: An adhesive layer is disposed between the second portion of the flexible circuit board and the board.

13. The electronic device according to claim 1, wherein: The plate comprises at least one of a metal and a metal alloy, and The second portion of the flexible circuit board includes an insulating material.

14. The electronic device according to claim 1, wherein: The second portion of the flexible circuit board extends from the first portion in a first direction, and A width of the second portion in a second direction intersecting the first direction is smaller than a width of the first portion in the second direction.

15. An electronic device comprising: Display panel; a plate disposed below the display panel and having a bottom surface on which a unique code is disposed; as well as a flexible circuit board electrically connected to the display panel and arranged on the bottom surface of the board, Wherein, the flexible circuit board comprises: a first portion having a first thickness; and a second portion having a second thickness less than the first thickness, wherein the second portion of the flexible circuit board covers the area of ​​the board, and The unique code is arranged in the area of ​​the plate.

16. The electronic device as claimed in claim 15, further comprising: A plurality of lower layers are arranged on the bottom surface of the board and do not overlap with the flexible circuit board, and the plurality of lower layers protrude from the bottom surface of the board to the same level as or a level lower than the bottom surface of the second portion of the flexible circuit board.

17. The electronic device as claimed in claim 15, wherein: The plate comprises at least one of a metal and a metal alloy, and The second portion of the flexible circuit board includes an insulating material.

18. An electronic device comprising: Display panel; a board arranged below the display panel and including a bottom surface and a top surface arranged between the bottom surface and the display panel, the bottom surface including: a first area having a unique code disposed therein; and a second area adjacent to the first area; an insulating film disposed below the second region of the board; and a flexible circuit board arranged on the bottom surface of the board, the flexible circuit board comprising: a first portion disposed in the second region of the plate; and A second portion of the unique code disposed in the first area is covered.

19. The electronic device as claimed in claim 18, wherein: A distance between the bottom surface of the plate and a bottommost surface of the insulating film is equal to or greater than a distance between the bottom surface of the plate and a bottom surface of the second portion of the flexible circuit board.

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