Radiation angle conversion element and light emitting device

Abstract

The radiation angle conversion element (10) bonded to a housing includes a glass substrate (12) and a resin layer (14) having a microlens array (16) disposed on the glass substrate (12). The resin layer (14) is not formed on the glass substrate (12) at a bonding portion (18) with the housing.

Description

Technical Field

[0001] The present invention relates to a radiation angle conversion element for converting the radiation angle of an incident light beam. Background Art

[0002] Radiation angle conversion elements that scatter incident light in various directions or convert the angle are used in display devices or screens of displays, and are widely used in various devices such as lighting devices for the purpose of obtaining uniform illumination intensity. Generally speaking, the radiation angle of light emitted from a light source is often expanded.

[0003] In recent years, higher performance has been required for light emission angles, intensity distribution at each angle, or uniformity of in-plane intensity when projecting diffused light. For example, there is a demand to diffuse light emitted from an array of surface-emitting lasers (VCSEL: Vertical Cavity Surface Emitting Laser) at a specified divergence angle to a wider angle range, and to make the diffusion angle anisotropic.

[0004] There are several types of elements that diffuse light or change the angle. For example, it is known that there are elements that disperse tiny spaces or disperse microparticles inside a flat plate (for example, a translucent resin plate), elements that randomly form tiny concave and convex shapes on the surface of a substrate (for example, glass whose surface is roughened by etching, etc.), elements that process the surface of a substrate to form designed concave and convex shapes (for example, a diffraction element), and elements that arrange a plurality of lenses on the surface of a substrate (for example, a microlens array).

[0005] Among these, a radiation angle conversion element using a microlens array has high transmittance and is easy to control the diffusion angle, and is therefore adopted when high diffusion performance is required (for example, refer to Patent Documents 1 and 2).

[0006] Prior Art Literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2009-42772

[0009] Patent Document 2: Japanese Patent Application Publication No. 2017-9669 Summary of the invention

[0010] Problems to be solved by the invention

[0011] Figure 11 is a schematic cross-sectional view showing an example of a light emitting device 100 using a conventional radiation angle conversion element 101 . The light emitting device 100 includes a housing 102 , a light emitting element 104 , and the radiation angle conversion element 101 .

[0012] The housing 102 is formed of, for example, ceramic and has a box shape with an open upper surface. A light emitting element 104 such as a VCSEL is fixed to the bottom surface 102a of the housing 102. The radiation angle conversion element 101 is an element in which a resin microlens array 108 is formed on a glass substrate 106. The radiation angle conversion element 101 is bonded to the housing 102 in a covered manner, whereby a space in which the light emitting element 104 is provided is sealed. The radiation angle conversion element 101 is generally provided in such a manner that the surface on which the microlens array 108 is formed faces the light emitting element 104 side.

[0013] Figure 2 yes Figure 1 1 is an enlarged view of the bonding portion C between the radiation angle conversion element 101 and the housing 102. As a method of bonding the radiation angle conversion element 101 to the housing 102, there are bonding using an adhesive such as a thermosetting adhesive or a UV curing adhesive, welding bonding, a bonding method of melting low melting point glass, diffusion bonding, etc. In any case, the radiation angle conversion element 101 and the housing 102 are bonded using the opposing portion C1 of the side surface of the glass substrate 106 and the microlens array 108 and the housing 102, and the opposing portion C2 of the microlens array 108 and the housing 102.

[0014] In the above-mentioned bonding, the bonding strength may be weakened at the portion where the resin microlens array 108 is bonded to the ceramic housing 102 due to the problem of the close adhesion of the materials. In addition, since the thermal expansion coefficients of the ceramic and the resin are different, the above-mentioned bonding has a side that is less susceptible to thermal shock. Furthermore, in the above-mentioned bonding, since the heat resistance of the resin microlens array is not that high, there is a problem that bonding methods that require high temperatures of several hundred degrees, such as welding bonding or bonding based on low-melting-point glass, cannot be used.

[0015] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a radiation angle conversion element that can be firmly joined to a housing.

[0016] Technical solutions to solve problems

[0017] In order to solve the above problems, a radiation angle conversion element according to one embodiment of the present invention is a radiation angle conversion element bonded to a housing, comprising a glass substrate and a resin layer having an optical function portion provided on the glass substrate. The resin layer is not formed on the glass substrate at the bonding portion with the housing.

[0018] The joining portion may be provided outside the resin layer.

[0019] In the bonding portion, a metal film may be formed on the glass substrate.

[0020] In the bonding portion, a metal film may be formed on the outside of the resin layer, and an exposed portion of the glass substrate may be provided on the outside of the metal film.

[0021] The optical function portion may be a microlens array in which a plurality of microlenses are two-dimensionally arranged.

[0022] Another embodiment of the present invention is a light emitting device. The device includes a housing, a light emitting element disposed in the housing, and a radiation angle conversion element that is joined to the housing and converts the radiation angle of light from the light emitting element. The radiation angle conversion element includes a glass substrate and a resin layer having an optical function portion provided on the glass substrate. No resin layer is formed on the glass substrate at the junction with the housing.

[0023] Furthermore, arbitrary combinations of the above-described constituting elements and modes in which the expressions of the present invention are converted into methods, apparatuses, systems, etc. may also be practiced as additional modes of the present invention.

[0024] Effects of the Invention

[0025] According to the present invention, it is possible to provide a radiation angle conversion element that can be firmly joined to a housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic cross-sectional view showing an example of a light emitting device using a conventional radiation angle conversion element.

[0027] Figure 2 yes Figure 1 An enlarged view of the joint between the radiation angle changing element and the housing is shown.

[0028] Figure 3 (a) and (b) are diagrams for explaining the radiation angle conversion element according to the first embodiment of the present invention.

[0029] Figure 4 It is a schematic cross-sectional view showing a light emitting device using the radiation angle conversion element according to the first embodiment of the present invention.

[0030] Figure 5 yes Figure 4 An enlarged view of the joint between the radiation angle changing element and the housing is shown.

[0031] Figure 6 (a) and (b) are diagrams for explaining a radiation angle conversion element according to a second embodiment of the present invention.

[0032] Figure 7 It is a schematic cross-sectional view showing a light emitting device using a radiation angle conversion element according to a second embodiment of the present invention.

[0033] Figure 8 yes Figure 7 An enlarged view of the joint between the radiation angle changing element and the housing is shown.

[0034] Fig. 9 (a) and (b) are diagrams for explaining a radiation angle conversion element according to a third embodiment of the present invention.

[0035] Fig.10 (a) to (g) are diagrams showing an example of a manufacturing process of a radiation angle conversion element.

[0036] Fig.11 (a) to (g) are diagrams showing an example of another manufacturing process of the radiation angle conversion element.

[0037] Fig.12 (a) to (g) are diagrams showing an example of another manufacturing process of the radiation angle conversion element. DETAILED DESCRIPTION

[0038] The following is a description of the embodiments of the present invention. The same or equivalent components, members, and processes shown in the drawings are marked with the same reference numerals, and repeated descriptions are appropriately omitted. In addition, the embodiments do not limit the invention but are exemplified, and all the features and combinations thereof described in the embodiments are not necessarily the essential contents of the invention.

[0039] Figure 3 (a) and (b) are diagrams for explaining the radiation angle conversion element 10 according to the first embodiment of the present invention. Figure 3 (a) is a top view of the radiation angle conversion element 10 . Figure 3 (b) is Figure 3 (a) is a cross-sectional view of the radiation angle conversion element 10 taken along the line AA.

[0040] The radiation angle conversion element 10 includes a glass substrate 12. The material of the glass substrate 12 may be, for example, soda-lime glass or borosilicate glass, and the thickness may be 300 μm. The plane size of the glass substrate 12 may be, for example, 2.5 mm×3.0 mm.

[0041] The radiation angle conversion element 10 also includes a resin layer 14 having an optical function portion. The resin layer 14 is provided on at least one main surface of the glass substrate 12. In the first embodiment, as the optical function portion, the resin layer 14 has a microlens array 16 in which a plurality of microlenses 15 are arranged in two dimensions. The material of the resin layer 14 is not particularly limited as long as it is a resin with a sufficiently high transmittance at the wavelength to be used. For example, epoxy resin, acrylic resin, silicone resin, cycloolefin resin or a composite material thereof can be used. In the first embodiment, the microlens 15 is a convex lens, but the type of the microlens 15 is not particularly limited. It can also be a concave lens, or it can be composed of a mixture of convex lenses and concave lenses. The plurality of microlenses 15 can be arranged in a square, for example, or can be arranged densely. The shape of the microlens 15 can be, for example, circular when viewed from above, or rectangular when viewed from above. In each microlens 15 , the height from the interface between the resin layer 14 and the glass substrate 12 to the vertex position of the microlens 15 may be, for example, 50 μm, the radius of curvature may be, for example, 30 μm, and the droop amount may be, for example, 25 μm.

[0042] In the radiation angle conversion element 10 of the first embodiment, the resin layer 14 is provided in the central portion of one main surface of the glass substrate 12, and there is a portion 18 on the outer side thereof where the resin layer 14 is not provided on the one main surface of the glass substrate 12. That is, in the radiation angle conversion element 10, the resin layer 14 is not formed over the entire one main surface of the glass substrate 12, and there is a portion 18 where the surface of the glass substrate 12 is exposed around the resin layer 14. When the radiation angle conversion element 10 is mounted on a housing, the portion 18 where the surface of the glass substrate 12 is exposed serves as a bonding portion 18 for bonding the radiation angle conversion element 10 to the housing.

[0043] When the width of the glass substrate 12 is L0 and the width of the connection portion 18 is L1, the relationship between L1 and L0 is 0.01L0≦L1≦0.3L0, preferably 0.05L0≦L1≦0.2L0, and more preferably 0.1L0≦L1≦0.15L0. If L1 is smaller than 0.01L0, a connection area for obtaining sufficient adhesive strength and sealing cannot be obtained. On the other hand, if L1 is larger than 0.3L0, the area of ​​the connection portion is too large, which hinders the miniaturization of the element.

[0044] Figure 4 1 is a schematic cross-sectional view showing a light emitting device 20 using the radiation angle conversion element 10 according to the first embodiment of the present invention. The light emitting device 20 includes a housing 22 , a light emitting element 24 , and the radiation angle conversion element 10 .

[0045] The housing 22 is formed of ceramic and has a box shape with an open upper surface. A light emitting element 24 is fixed to the bottom surface 22a of the housing 22. As the light emitting element 24, in addition to a surface emitting laser (VCSEL), a FP-type semiconductor laser or light emitting diode (LED), a solid laser such as YAG, a gas laser such as an excimer laser, or a discharge lamp such as a metal halide lamp can also be used.

[0046] The radiation angle conversion element 10 is joined to the housing 22 in a covered manner, whereby the space in which the light emitting element 24 is set is sealed. The radiation angle conversion element 10 is set in a manner in which the surface on which the microlens array 16 is formed faces the light emitting element 24 side. In the light emitting device 20 formed in this way, the light emitted from the light emitting element 24 is diffused by each microlens 15 of the microlens array 16, and is radiated to the outside through the glass substrate 12. The glass substrate 12 is not only a base material of the microlens array 16, but also has the function of protecting the light emitting element 24, and in this sense is also called protective glass. The use of glass is advantageous from the aspects of mechanical strength and scratch resistance.

[0047] Figure 5 yes Figure 4 The enlarged view of the bonding portion C between the radiation angle conversion element 10 and the housing 22 is shown. A step portion 22b for bonding the radiation angle conversion element 10 is formed at the opening edge of the housing 22. The step portion 22b of the housing 22 and the bonding portion 18 of the radiation angle conversion element 10 are bonded by an adhesive 23.

[0048] Here, in the radiation angle conversion element 10 of the present embodiment, since the resin layer 14 is not provided in the bonding portion 18 and the glass substrate 12 is exposed, it is not like Figure 2 The bonding between the resin and the ceramic shown is not the bonding between the glass and the ceramic. Therefore, the adhesion is improved compared with the bonding between the resin and the ceramic, and the housing 22 to which the light emitting element 24 is fixed can be firmly bonded.

[0049] Furthermore, since the difference in thermal expansion coefficient between glass and ceramics is smaller than that between resin and ceramics, the resistance to thermal shock can be improved.

[0050] Figure 6 (a) and (b) are diagrams for explaining a radiation angle conversion element 30 according to a second embodiment of the present invention. Figure 6 (a) is a top view of the radiation angle conversion element 30 . Figure 6 (b) is Figure 3 (a) is a cross-sectional view taken along the line AA of the radiation angle conversion element 30 .

[0051] The radiation angle conversion element 30 of the second embodiment is different from the radiation angle conversion element 10 of the first embodiment in that a metal film 32 is formed on one main surface of a glass substrate 12 at a bonding portion 18 outside a resin layer 14 .

[0052] The metal film 32 may be a single-layer film composed of a metal or an alloy of multiple metals, or a multilayer film in which a plurality of metal films composed of a single metal are stacked. As the types of metals constituting the metal film 32, Cr, Ni, Pt, Ti, Pd, Au, etc. are used, but are not limited to these. As an example of a case where a multilayer film is formed, a multilayer film formed in the order of Cr, Ni, and Au from the glass substrate 12 side can be cited. The thickness of the metal film 32 may be, for example, 0.5 μm.

[0053] When the width of the glass substrate 12 is L0, the width of the connection portion 18 is L1, and the width of the metal film 32 is L2, the relationship between L0, L1, and L2 is L1=L2, 0.01L0≦L2≦0.3L0, preferably 0.05L0≦L2≦0.2L0, and more preferably 0.1L0≦L2≦0.15L0. If L2 is smaller than 0.01L0, the bonding area based on the solder 44 cannot be fully obtained, and it may be difficult to obtain a strong bonding strength. On the other hand, if L2 is larger than 0.3L0, the area of ​​the connection portion is too large, which hinders the miniaturization of the element.

[0054] Figure 7 1 is a schematic cross-sectional view showing a light emitting device 40 using the radiation angle conversion element 30 according to the second embodiment of the present invention. The light emitting device 40 also includes a ceramic housing 22 , a light emitting element 24 , and a radiation angle conversion element 30 .

[0055] Figure 8 yes Figure 7 FIG. 2 is an enlarged view of the joint C between the radiation angle conversion element 30 and the housing 22. Figure 8 As shown, a step portion 22b for bonding the radiation angle conversion element 30 is formed at the opening edge of the housing 22, and a metal film 42 is formed on the step portion 22b. The metal film 42 can be formed by plating, vapor deposition or the like.

[0056] As described above, the radiation angle conversion element 30 of the second embodiment has the metal film 32 formed on the glass substrate 12 at the joint portion 18. Therefore, the metal film 32 on the radiation angle conversion element 30 side and the metal film 42 on the housing 22 side can be joined by the solder 44, so that strong joining strength can be obtained.

[0057] Fig. 9 (a) and (b) are diagrams for explaining a radiation angle conversion element 50 according to a third embodiment of the present invention. Fig. 9 (a) is a top view of the radiation angle conversion element 50 . Fig. 9 (b) is Fig. 9 (a) is a cross-sectional view taken along the line AA of the radiation angle conversion element 50 .

[0058] The radiation angle conversion element 50 of the third embodiment is different from the radiation angle conversion element 10 of the first embodiment in that, in the bonding portion 18, a metal film 32 is formed outside the resin layer 14, and an exposed portion 52 of the glass substrate 12 is provided outside the metal film 32. In other words, in the radiation angle conversion element 50 of the third embodiment, in the bonding portion 18, the metal film 32 is formed only in the inner portion, and the surface of the glass substrate 12 is exposed in the outer portion. In the bonding portion 18, the ratio of the area of ​​the metal film 32 to the area of ​​the exposed portion 52 can be 5:1 to 1:5.

[0059] When the width of the glass substrate 12 is set to L0, the width of the connecting portion 18 is set to L1, the width of the metal film 32 is set to L2, and the width of the exposed portion 52 is set to L3, the relationship between L0, L1, L2 and L3 is L1 = L2 + L3, 0.01L0 ≦ L2 + L3 ≦ 0.3L0, preferably 0.05L0 ≦ L2 + L3 ≦ 0.2L0, and more preferably 0.1L0 ≦ L2 + L3 ≦ 0.15L0. If L2 + L3 is smaller than 0.01L0, a connection area for obtaining sufficient adhesive strength and sealing cannot be obtained. On the other hand, if L2 + L3 is larger than 0.3L0, the area of ​​the connecting portion is too large, which hinders the miniaturization of the component. Furthermore, L2 and L3 can also satisfy the following. 0.01L2≦L3≦10L2, preferably 0.05L2≦L3≦L2, and more preferably 0.10L2≦L3≦0.5L2. If L3 is smaller than 0.01L2, it may be difficult to obtain a sufficient tolerance when cutting. On the other hand, if L3 is larger than 10L2, the bonding area based on the solder 44 cannot be fully obtained, and it may be difficult to obtain a strong bonding strength.

[0060] The metal film 32 may be a single-layer film composed of a metal or an alloy of multiple metals, or a multilayer film in which a plurality of metal films composed of a single metal are stacked. As the types of metals constituting the metal film 32, Cr, Ni, Pt, Ti, Pd, Au, etc. are used, but are not limited to these. As an example of a case where a multilayer film is formed, a multilayer film formed in the order of Cr, Ni, and Au from the glass substrate 12 side can be cited. The thickness of the metal film 32 may be, for example, 0.5 μm.

[0061] Generally speaking, the radiation angle conversion element is produced by preparing a glass substrate larger than the formation area of ​​the microlens array, forming the microlens array on at least one main surface, and then cutting the glass substrate in a manner of a prescribed size. It is a method of forming a plurality of radiation angle conversion elements on at least one surface of a large glass substrate, and then cutting out each radiation angle conversion element. As a method for cutting a glass substrate, there are methods using a rotating grindstone, a method of cutting using a laser, and a method of mechanically cutting after applying a line with a diamond or the like like a glass cutter. In the case of a method of cutting using a rotating grindstone of a glass substrate, if there is a resin layer in the cut portion, the resin layer constituting the microlens array may be peeled off from the portion due to the contact between the resin layer and the high-speed rotating grindstone. In the case of a method of cutting using a laser, if there is a resin layer or a metal film in the cut portion of the glass substrate, the laser is also irradiated to the resin layer or the metal film during laser irradiation, and there is a situation where a part of the microlens formed on the resin layer melts or evaporates, and the part becomes a defect. Furthermore, in the case of a method in which a line is scribed with diamond or the like and then mechanically cut, if a resin layer or a metal film exists at the cut portion, the scribe line is less likely to adhere to the glass substrate thereunder, resulting in a cutting defect that is likely to occur.

[0062] In the radiation angle conversion element 50 of the third embodiment, since the exposed portion 52 of the glass substrate 12 is formed outside the metal film 32 of the bonding portion 18, the grindstone, laser irradiation, or the tip of the knife directly acts on the glass substrate 12. As a result, the metal film 32 and the resin layer 14 are not damaged, thereby suppressing the generation of defective products due to a decrease in yield or the mixing of foreign matter during the cutting operation.

[0063] Next, a method for manufacturing a radiation angle conversion element will be described. However, the following description does not limit the method for manufacturing a radiation angle conversion element of the present invention.

[0064] The radiation angle conversion element can be made by the so-called step-and-repeat method. The step-and-repeat method refers to a method in which a structure is partially formed on a substrate using a mold of a specified size, and the structure is formed on the entire surface of the substrate by repeatedly forming while staggering the forming position. Regarding the steps of this method, Japanese Patent Publication No. 2014-188869, Japanese Patent Publication No. 2014-13902, Japanese Patent Publication No. 2010-245470, Japanese Patent Publication No. 2010-80632, Japanese Patent Publication No. 2008-168641, Japanese Patent Publication No. 2007-103924, Japanese Patent Publication No. 2007-103924, Japanese Patent Publication No. 2006-245072, etc. can be cited as references.

[0065] In a method for forming a structure such as a microlens on a substrate, a model (mold) smaller than a glass substrate is prepared, a workpiece having a light-curable resin layer is aligned with the mold (a predetermined lens shape is formed on the surface) on the glass substrate, a resin is filled between the two, and the resin is cured by irradiating the portion with ultraviolet light. At this time, the location where the ultraviolet light is irradiated is only directly below the mold. By sequentially performing such transfer within the glass substrate, a predetermined pattern can be formed on the entire surface of the glass substrate.

[0066] There are various methods for making a mold. For example, a mold in which a lens shape is formed on a metal such as Ni by machining, a mold in which a lens shape is formed on a glass or semiconductor substrate by photolithography, or a mold copied from these castings by electroplating, and a mold obtained by molding a photosensitive resin using these castings, etc., can be used. In the following example of the manufacturing method, a metal mold is used that is obtained by electroforming a resist pattern for making a microlens array by laser drawing.

[0067] Fig.10 (a) to (g) of FIG. 1 show an example of a manufacturing process of a radiation angle conversion element. First, Fig.10 As shown in (a) of FIG. 1 , a predetermined amount of ultraviolet curing resin 60 is dropped onto a predetermined location on one main surface of the prepared glass substrate 12. Fig.10 As shown in (b), the position of the mold (die) 62 is aligned on a surface parallel to the main surface of the glass substrate 12. Fig.10 As shown in (c), the mold 62 is pressed in such a way that the ultraviolet curing resin 60 is filled between the glass substrate 12 and the mold 62. And, while pressing the mold 62, ultraviolet rays are irradiated to a predetermined area with an irradiation size corresponding to the size of the mold 62. Next, as Fig.10 As shown in (d), the mold 62 is demolded. Fig.10 As shown in (e), the location is changed on the glass substrate 12 and repeated Fig.10 (a)~ Fig.10 By repeating these steps, such as Fig.10 As shown in (f), a plurality of radiation angle conversion elements are formed on the entire surface of the glass substrate 12. Heat treatment may be performed thereafter as required. In addition, a demolding process may be performed in the mold 62. Finally, as shown in Fig.10 As shown in (g), by cutting the glass substrate 12, the following Figure 3 The radiation angle conversion element 10 shown in (a) and (b).

[0068] Fig.11 (a) to (g) of FIG. 1 show an example of another manufacturing process of the radiation angle conversion element. Fig.10The difference between the manufacturing processes shown in (a) to (g) is that a pattern of the metal film 32 is pre-formed on a portion of the glass substrate 12 before the radiation angle conversion element is formed. In this case, since the pattern of the metal film 32 also functions as a light shielding film when irradiated with ultraviolet rays, it has the advantage that the ultraviolet curing resin 60 that leaks out of the mold 62 will not be cured. If the mold 62 is made of a light-transmitting material, ultraviolet rays can be irradiated from the back side of the mold, and the metal film 32 can also overlap a portion of the ultraviolet curing resin 60. Fig.11 As shown in (g), by cutting the glass substrate 12, the following Figure 6 The radiation angle conversion element 30 shown in (a) and (b).

[0069] Fig.12 (a) to (g) of FIG. 1 show another example of a manufacturing process of the radiation angle conversion element. The pattern of the metal film 32 is formed in advance on a portion of the glass substrate 12 before the radiation angle conversion element is formed. Fig.11 The manufacturing process (a) to (g) of FIG. 1 is the same as that shown in FIG. 1 , but the present manufacturing process is to pre-form a portion (a portion of the surface of the glass substrate 12 exposed) on the outside of the metal film 32 without forming the metal film 32. Fig.11 The manufacturing processes shown in (a) to (g) are different. Fig.12 As shown in (g), by cutting off the exposed portion of the glass substrate 12 outside the metal film 32, a Fig. 9 The radiation angle conversion element 50 shown in (a) and (b).

[0070] In the above manufacturing process, an example is shown in which an appropriate amount of UV curable resin 60 is dropped onto the glass substrate 12 and aligned with the mold 62, but conversely, uncured UV curable resin 60 can also be dropped onto the mold 62 and aligned with the glass substrate 12.

[0071] Furthermore, before cutting the glass substrate 12 , an anti-reflection coating (AR coating) may be applied to the surface of the microlens array 16 or the back surface of the glass substrate 12 (the surface on which the microlens array 16 is not formed), or to both.

[0072] As a method for patterning the metal film 32 on the glass substrate 12, there is a method of forming a metal film by plating, sputtering, or evaporation, forming a resist pattern thereon by photolithography, and removing unnecessary metal film by etching using the resist pattern as a mask. Alternatively, there is a method of forming a resist pattern on the glass substrate 12 before forming a metal film, and after forming a metal film thereon, removing the resist and the metal film formed thereon (stripping method).

[0073] The type of metal film 32 is appropriately selected in consideration of adhesion and sealing properties with glass, or adhesion with sealing materials, etc. Sometimes it is composed of a single metal, and sometimes it is a multilayer film in consideration of the adhesion of each part. For example, a three-layer film formed in the order of Cr, Ni, and Au from the glass substrate 12 side is used. Of course, the combination of metals is not limited to this, and can be selected from various metal films and metal films formed by combining them.

[0074] The present invention has been described above based on the embodiments. It should be understood by those skilled in the art that these embodiments are illustrative only and that the combination of the constituent elements and the processing steps may have various modifications, and such modifications are also within the scope of the present invention.

[0075] Industrial Availability

[0076] The present invention can be used for a radiation angle conversion element that converts the radiation angle of an incident light beam.

[0077] Description of Reference Numerals

[0078] 10, 30, 50: radiation angle conversion element, 12: glass substrate, 14: resin layer, 15: microlens, 16: microlens array, 18: bonding portion, 20, 40: light-emitting device, 22: housing, 24: light-emitting element, 32, 42: metal film, 52: exposed portion, 60: ultraviolet curing resin, 62: mold.

Claims

1. A radiation angle conversion element, the radiation angle conversion element being connected to a housing, It is characterized in that Including: glass substrate, and a resin layer having an optical function portion and disposed on the glass substrate; A first metal film is formed on the outside of the resin layer on the glass substrate at a portion of the housing that is bonded to the housing, and the first metal film is bonded to a second metal film formed on a portion of the housing by solder. An exposed portion of the glass substrate is provided outside the first metal film.

2. The radiation angle conversion element according to claim 1, wherein: The optical function portion is a microlens array in which a plurality of microlenses are two-dimensionally arranged. 3 . A light emitting device comprising a housing, a light emitting element disposed in the housing, and the radiation angle conversion element according to claim 1 , which is joined to the housing and converts the radiation angle of light from the light emitting element.

4. The light emitting device according to claim 3, characterized in that: The housing includes a step portion having the second metal film at a portion joined to the radiation angle conversion element.

5. A method for manufacturing a radiation angle conversion element, characterized in that: The following processes are available: A step of forming a pattern of a metal film at a predetermined location on a glass substrate, wherein an exposed portion of the glass substrate is provided outside the metal film; a step of dropping a predetermined amount of resin inside a region surrounded by the pattern of the metal film on the glass substrate; a step of pressing a mold formed with a predetermined lens shape onto the resin on the glass substrate; A step of curing the resin; Demolding the mold to obtain a resin layer having an optical function portion; as well as The step of cutting the exposed portion of the glass substrate to obtain a radiation angle conversion element.

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