Mask assembly

Abstract

A mask assembly is provided. The mask assembly according to an embodiment includes a mask frame including a frame opening portion, and a split mask coupled to the mask frame including a plurality of deposition pattern portions overlapping the frame opening portion and extending in a first direction, wherein each of the plurality of deposition pattern portions includes a first opening area including a first opening portion having a first width, and a second opening area including a second opening portion having a second width smaller than the first width, wherein the split mask has a first thickness in the first opening area and a second thickness smaller than the first thickness in the second opening area, the second thickness being greater than a value of the first thickness multiplied by a ratio of the second width to the first width.

Description

Technical Field

[0001] This invention relates to a mask assembly. Background Technology

[0002] Liquid crystal displays (LCDs) and organic light-emitting diodes (OLEDs) are widely used as flat panel display devices. Flat panel display devices include a metal layer with a specific pattern, and in the case of organic light-emitting diodes, an organic light-emitting layer with a specific pattern is formed in each pixel. Deposition methods utilizing mask components can be applied as methods for forming the metal layer and the organic light-emitting layer.

[0003] The mask assembly includes: a mask having openings corresponding to a pattern of a metal layer or an organic light-emitting layer; and a mask frame supporting the mask. In a segmented mask configuration, the mask is divided into multiple segmented masks formed in a rod-like shape, and each segmented mask is fixed to the mask frame by welding while stretched along its length.

[0004] Furthermore, as the size of pixels included in an organic light-emitting display device becomes more diverse, the shape of the opening included in a mask assembly also needs to be more diverse. Summary of the Invention

[0005] The problem to be solved by the present invention is to provide a mask assembly capable of stably depositing a material onto a substrate.

[0006] The subject matter of this invention is not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by those skilled in the art through the following content.

[0007] A mask assembly according to one embodiment for addressing the aforementioned technical problem includes: a mask frame including a frame opening; and a segmentation mask coupled to the mask frame, including a plurality of deposited pattern portions overlapping the frame opening and extending along a first direction, wherein each of the plurality of deposited pattern portions includes: a first opening region including a first opening portion having a first width; and a second opening region including a second opening portion having a second width smaller than the first width, wherein the segmentation mask has a first thickness in the first opening region and a second thickness in the second opening region that is smaller than the first thickness, the second thickness being greater than the first thickness multiplied by the ratio of the second width to the first width.

[0008] The first opening may include a first protrusion formed inside and protruding inward, and the second opening may include a second protrusion formed inside and protruding inward.

[0009] In the first opening region, the segmentation mask may have a first upper thickness from the upper surface of the segmentation mask to the first protrusion, and may have a first lower thickness from the first protrusion to the lower surface of the segmentation mask, wherein the first upper thickness may be less than the first lower thickness.

[0010] The thickness of the first upper part can be less than 0.2 times the thickness of the first part.

[0011] In the second opening region, the dividing mask may have a second upper thickness from the upper surface of the dividing mask to the second protrusion, and may have a second lower thickness from the second protrusion to the lower surface of the dividing mask, wherein the second upper thickness may be less than the second lower thickness.

[0012] The second upper part thickness can be less than 0.2 times the second thickness.

[0013] The thickness of the first upper part can be greater than the thickness of the second upper part, and the thickness of the first lower part can be greater than the thickness of the second lower part.

[0014] The second opening region can be arranged to be surrounded by the first opening region.

[0015] The plurality of deposition pattern portions can be arranged along the extension direction of the segmentation mask.

[0016] One end and the other end of the segmentation mask in the first direction can be fixed to the mask frame.

[0017] Specific details of other embodiments are provided in the detailed description and accompanying drawings.

[0018] According to one embodiment of the mask assembly, the mask can include openings of various sizes in different regions and can have high strength. Furthermore, the mask can have different thicknesses in different regions depending on the size of the openings. Therefore, a deposited material can be stably deposited on a target substrate where the deposited material is deposited in various sizes.

[0019] The effects of the embodiments of the present invention are not limited to those illustrated above, and more diverse effects are included in this specification. Attached Figure Description

[0020] Figure 1 This is a perspective view showing a display device according to an embodiment.

[0021] Figure 2 This is an unfolded view showing a display device according to an embodiment.

[0022] Figure 3 yes Figure 2An enlarged view of region A.

[0023] Figure 4 yes Figure 2 A magnified view of region B.

[0024] Figure 5 This is a schematic cross-sectional view of a display device according to one embodiment.

[0025] Figure 6 This is a schematic diagram illustrating a deposition apparatus according to one embodiment.

[0026] Figure 7 This is a schematic perspective view of a mask assembly according to one embodiment.

[0027] Figure 8 This is a schematic plan view of a segmentation mask according to one embodiment.

[0028] Figure 9 It is along Figure 8 A cross-sectional view of the IX-IX' cut.

[0029] Figure 10 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment.

[0030] Figures 11 to 13 This is a cross-sectional view showing a method of manufacturing a display device according to an embodiment.

[0031] Figure 14 This is a schematic plan view of a segmentation mask according to another embodiment.

[0032] Figure 15 This is a schematic plan view of a segmentation mask according to yet another embodiment.

[0033] Explanation of reference numerals in the attached figures

[0034] 1: Display device

[0035] 100: Mask assembly

[0036] 130: Mask frame

[0037] 140: Segmentation Mask

[0038] 142: Fixing part

[0039] 144: Depositional Pattern Section

[0040] 146: Ribs

[0041] H1: First opening

[0042] H2: Second opening

[0043] HA1: First opening region

[0044] HA2: Second opening region Detailed Implementation

[0045] References and Appendix Figure 1 The advantages and features of the present invention, as well as the methods for achieving them, will become clear from the detailed embodiments described below. However, the present invention can be implemented in many different forms and is not limited to the embodiments disclosed below. These embodiments are provided only to make the disclosure of the present invention complete and to fully inform those skilled in the art of the invention of its scope. The present invention is defined only by the scope of the claims.

[0046] The reference to elements or layers being "on" other elements or layers includes both cases where they are immediately above or adjacent to other elements, and cases where other layers or elements are sandwiched in between. Throughout this specification, the same reference numerals refer to the same constituent elements.

[0047] Although terms such as "first," "second," etc., are used to describe multiple constituent elements, these constituent elements are clearly not limited by these terms. These terms are only used to distinguish one constituent element from another. Therefore, the "first constituent element" mentioned below can obviously also be a "second constituent element" within the technical concept of this invention.

[0048] The specific embodiments will now be described with reference to the accompanying drawings.

[0049] Figure 1 This is a perspective view showing a display device according to an embodiment. Figure 2 This is an unfolded view showing a display device according to an embodiment. Figure 3 yes Figure 2 An enlarged view of region A. Figure 4 yes Figure 2 A magnified view of region B.

[0050] Reference Figures 1 to 4According to one embodiment, the display device 1 can be applied to portable electronic devices such as mobile phones, smartphones, tablet personal computers, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigators, and ultra-portable computers (UMPCs). Furthermore, the display device 1 can be applied to the display unit of televisions, laptop computers, monitors, billboards, or the Internet of Things (IoT). Moreover, the display device 1 can be applied to wearable devices such as smartwatches, watch phones, glasses-type displays, and head-mounted displays (HMDs). Furthermore, the display device 1 can be applied to a vehicle's dashboard, a vehicle's central dashboard, a central information display (CID) arranged on the vehicle's dashboard, an interior mirror display replacing a vehicle's side mirrors, or a display arranged on the back of the front seats as a rear-seat entertainment device.

[0051] In this specification, the first direction DR1 is a direction parallel to the short side of the display device 1 on a plane, and can be, for example, the lateral direction of the display device 1. The second direction DR2 is a direction parallel to the long side of the display device 1 on a plane, and can be, for example, the longitudinal direction of the display device 1. The third direction DR3 can be the thickness direction of the display device 1.

[0052] According to one embodiment, the display device 1 may include a display panel 10. For example... Figure 1 and Figure 2 As shown, the display panel 10 may include a front surface portion FS, a first side surface portion SS1, a second side surface portion SS2, a third side surface portion SS3, a fourth side surface portion SS4, a first corner portion CS1, a second corner portion CS2, a third corner portion CS3, and a fourth corner portion CS4.

[0053] The display panel 10 may include a flexible substrate capable of bending, folding, and rolling. For example, the substrate may be polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), or combinations thereof. Alternatively, the substrate may include a metallic material. Furthermore, only a portion of the substrate may be flexible, or the entire substrate may be flexible.

[0054] The front surface portion FS can be located at the center of the display panel 10 and can have a planar shape that includes a short side extending along a first direction DR1 and a long side extending along a second direction DR2, but is not limited to this. The front surface portion FS can have other polygonal, circular, or elliptical planar shapes. Although in Figure 1 and Figure 2 The example shown illustrates a case where the front surface portion FS is formed flat, but it is not limited to this. The front surface portion FS may include a curved surface.

[0055] The first side surface portion SS1 can extend from the front surface portion FS on the other side in the first direction DR1. The first side surface portion SS1 can be bent along the first curvature line BL1 on the other side of the front surface portion FS in the first direction DR1, thereby having a first curvature.

[0056] The second side surface portion SS2 can extend from the front surface portion FS on the other side of the second direction DR2. The second side surface portion SS2 can be bent along the second curvature line BL2 on the other side of the front surface portion FS in the second direction DR2, thereby having a second curvature. The second curvature can be different from the first curvature, but is not limited to it.

[0057] The third side surface portion SS3 can extend from one side of the front surface portion FS in the first direction DR1. The third side surface portion SS3 can be bent along the third curvature line BL3 on one side of the front surface portion FS in the first direction DR1, thereby having a third curvature. The third curvature can be the same as the first curvature, but is not limited to it.

[0058] The fourth side surface portion SS4 can extend from one side of the front surface portion FS in the second direction DR2. The fourth side surface portion SS4 can be bent along the fourth curvature line BL4 on one side of the front surface portion FS in the second direction DR2, thereby having a fourth curvature. The fourth curvature can be the same as the second curvature, but is not limited to it.

[0059] A first corner portion CS1 can be disposed between a first side surface portion SS1 and a second side surface portion SS2. Specifically, the first corner portion CS1 can be connected to the other side of the first side surface portion SS1 in the second direction DR2 and the other side of the second side surface portion SS2 in the first direction DR1. The first corner portion CS1 can be a hyperbolic region that is bent by the first curvature of the first side surface portion SS1 and the second curvature of the second side surface portion SS2. Accordingly, the first corner portion CS1 can be stressed by the bending force of the first side surface portion SS1 and the bending force of the second side surface portion SS2.

[0060] The second corner portion CS2 can be arranged between the second side surface portion SS2 and the third side surface portion SS3. Specifically, the second corner portion CS2 can be connected to one side of the second side surface portion SS2 in the first direction DR1 and the other side of the third side surface portion SS3 in the second direction DR2. The second corner portion CS2 can be a hyperbolic region that is bent by the second curvature of the second side surface portion SS2 and the third curvature of the third side surface portion SS3. Accordingly, the second corner portion CS2 can be stressed by the bending force of the second side surface portion SS2 and the bending force of the third side surface portion SS3.

[0061] The third corner portion CS3 can be arranged between the third side surface portion SS3 and the fourth side surface portion SS4. Specifically, the third corner portion CS3 can be connected to one side of the third side surface portion SS3 in the second direction DR2 and one side of the fourth side surface portion SS4 in the first direction DR1. The third corner portion CS3 can be a hyperbolic region that is bent by the third curvature of the third side surface portion SS3 and the fourth curvature of the fourth side surface portion SS4. Accordingly, the third corner portion CS3 can be stressed by the bending force of the third side surface portion SS3 and the bending force of the fourth side surface portion SS4.

[0062] The fourth corner portion CS4 can be arranged between the first side surface portion SS1 and the fourth side surface portion SS4. Specifically, the fourth corner portion CS4 can be connected to one side of the first side surface portion SS1 in the second direction DR2 and the other side of the fourth side surface portion SS4 in the first direction DR1. The fourth corner portion CS4 can be a hyperbolic region that is bent by the first curvature of the first side surface portion SS1 and the fourth curvature of the fourth side surface portion SS4. Accordingly, the fourth corner portion CS4 can be stressed by the bending force of the first side surface portion SS1 and the bending force of the fourth side surface portion SS4.

[0063] To reduce stress caused by hypercurvature, each of the first corner portion CS1, the second corner portion CS2, the third corner portion CS3, and the fourth corner portion CS4 may include a cutting pattern defined by the cutting portion (see reference). Figure 3 (CP).

[0064] The display panel 10 may include a first display area DA1, a second display area DA2, a third display area DA3, a non-display area NDA, a curved portion BA, and a pad portion PA.

[0065] The first display area DA1 to the third display area DA3 can be areas that display images, including pixels or light-emitting areas, and the non-display area NDA can be an area that does not display images, excluding pixels or light-emitting areas. Signal wiring for driving pixels or light-emitting areas or in-panel driving circuitry can be arranged in the non-display area NDA.

[0066] The first display area DA1 may be the main display area of ​​the display panel 10. The first display area DA1 may include a portion of the front surface portion FS, the first side surface portion SS1, the second side surface portion SS2, the third side surface portion SS3, and the fourth side surface portion SS4.

[0067] The second display area DA2 can be an auxiliary display area to the first display area DA1. The second display area DA2 may include the first corner portion CS1 to the fourth corner portion CS4.

[0068] The third display area DA3 may be arranged in a portion of the front surface portion FS. The third display area DA3 may be arranged inside the front surface portion FS, but is not limited thereto. The planar shape of the third display area DA3 may be circular, but is not limited thereto. The third display area DA3 may be surrounded by the first display area DA1.

[0069] The non-display area NDA can be arranged outside the second display area DA2. At least a portion of the non-display area NDA can be arranged in one of the corner portions CS1, CS2, CS3, and CS4. Furthermore, at least a portion of the non-display area NDA can be arranged in two of the first side surface portions SS1 to the fourth side surface portions SS4.

[0070] The curved portion BA can extend from the second side surface portion SS2 on the other side of the second direction DR2. The curved portion BA can be arranged between the second side surface portion SS2 and the pad portion PA described later. The length of the curved portion BA in the first direction DR1 can be shorter than the length of the second side surface portion SS2 in the first direction DR1. The curved portion BA can be bent along the fifth bending line BL5 on the other side of the second side surface portion SS2 in the second direction DR2.

[0071] The pad PA can extend from the other side of the curved portion BA in the second direction DR2. The length of the pad PA in the first direction DR1 can be longer than the length of the curved portion BA in the first direction DR1, but is not limited thereto. The length of the pad PA in the first direction DR1 can be substantially the same as the length of the curved portion BA in the first direction DR1. The pad PA can be bent along the sixth bending line BL6 of the curved portion BA on the other side of the second direction DR2. The pad PA can be disposed on the lower surface of the front surface portion FS.

[0072] An integrated driver circuit (IDC) and a pad (PAD) can be arranged on the pad PA. The integrated driver circuit (IDC) can be formed using an integrated circuit (IC). The integrated driver circuit (IDC) can be attached to the pad PA using chip-on-glass (COG), chip-on-plastic (COP), or ultrasonic bonding methods. Alternatively, the integrated driver circuit (IDC) can be arranged on a circuit board arranged on the pad PAD of the pad PA.

[0073] The integrated driver circuit (IDC) can be electrically connected to the pad PAD of the PA unit. The IDC can receive digital video data and timing signals through the pad PAD of the PA unit. The IDC can convert the digital video data into analog data voltage and output it using the data wiring of display areas DA1, DA2, and DA3.

[0074] An anisotropic conductive film can be used to attach a circuit board to the pad of the PA. Thus, the pad of the PA can be electrically connected to the circuit board.

[0075] like Figure 2As shown, display areas DA1 and DA2 can be arranged on the front surface FS, the first side surface SS1, the second side surface SS2, the third side surface SS3, the fourth side surface SS4, the first corner CS1, the second corner CS2, the third corner CS3, and the fourth corner CS4 of the display panel 10. Therefore, images can be displayed not only on the front surface FS, the first side surface SS1, the second side surface SS2, the third side surface SS3, and the fourth side surface SS4 of the display panel 10, but also on the first corner CS1, the second corner CS2, the third corner CS3, and the fourth corner CS4.

[0076] Figure 3 The front surface portion FS shown may include a first display area DA1, and the first corner portion CS1 may include a second display area DA2. That is, the second display area DA2 may be arranged outside the first display area DA1.

[0077] The first display area DA1 may include multiple first light-emitting areas EA1. Each of the first light-emitting areas EA1 may include: a first sub-light-emitting area SEA1 emitting light of a first color; a second sub-light-emitting area SEA2 emitting light of a second color; a third sub-light-emitting area SEA3 emitting light of a third color; and a fourth sub-light-emitting area SEA4 emitting light of a fourth color. For example, the first color may be red, the second and fourth colors may be green, and the third color may be blue.

[0078] Each of the first sub-light-emitting region SEA1, the second sub-light-emitting region SEA2, the third sub-light-emitting region SEA3, and the fourth sub-light-emitting region SEA4 can have a rhomboid planar shape or a rectangular planar shape, but is not limited to these. Each of the first sub-light-emitting region SEA1, the second sub-light-emitting region SEA2, the third sub-light-emitting region SEA3, and the fourth sub-light-emitting region SEA4 can have a polygonal, circular, or elliptical planar shape other than a rectangle. Furthermore, in Figure 3 The example illustrates a case where the third sub-luminous region SEA3 has the largest area and the second and fourth sub-luminous regions SEA2 and SEA4 have the smallest areas, but it is not limited to this case.

[0079] A first dam DAM1 may be disposed at the edge of the first display area DA1. The first dam DAM1 may extend along the edge of the first display area DA1. At the corner, the first dam DAM1 may be disposed adjacent to the boundary between the first display area DA1 and the second display area DA2. The first dam DAM1 can prevent the spillage of materials disposed inside it. For example, it can prevent the spillage of the organic film of the encapsulation layer disposed inside the first dam DAM1.

[0080] The second display area DA2 may include cut patterns CP arranged spaced apart from each other. One end of each cut pattern CP may be connected to the first display area DA1, and the other end may be connected to the non-display area NDA. The planar shape of each cut pattern CP may be approximately trapezoidal. The width of the cut pattern CP may increase or decrease from the first display area DA1 to the non-display area NDA. Furthermore, the cut pattern CP may have a rectangular shape with a constant width tending towards the non-display area NDA.

[0081] In the second display area DA2, adjacent cut patterns CP can have different sizes. For example, the size of the cut pattern CP can decrease from the central area of ​​the second display area DA2 to one side edge.

[0082] The cut pattern CP can be formed by cutting the display panel 10 using a laser. Accordingly, a cutting gap CG can be formed between adjacent cut patterns CP. Since a second light-emitting region EA2 can be arranged in the cut pattern CP, the maximum width of the cut pattern CP can be greater than the maximum width of the cutting gap CG.

[0083] The cut pattern CP may include a second luminescent region EA2. Although in Figure 3 The second luminescent region EA2 is shown to be arranged in a column within a cutting pattern CP along the extension direction of the cutting pattern CP. However, it is not limited to this and the second luminescent region EA2 can be arranged in multiple columns.

[0084] Each of the second emitting regions EA2 may include: a first sub-emitting region SEA1' emitting light of a first color; a second sub-emitting region SEA2' emitting light of a second color; and a third sub-emitting region SEA3' emitting light of a third color. For example, the first color may be red, the second color may be green, and the third color may be blue.

[0085] The first sub-luminous region SEA1' and the second sub-luminous region SEA2' can be arranged adjacent to each other along a direction perpendicular to the extension direction of the cutting pattern CP, and the third sub-luminous region SEA3' can be arranged adjacent to the first sub-luminous region SEA1' and the second sub-luminous region SEA2' along the extension direction of the cutting pattern CP. That is, the first sub-luminous region SEA1', the second sub-luminous region SEA2' and the third sub-luminous region SEA3' can be arranged alternately along the extension direction of the cutting pattern CP.

[0086] Each of the first sub-luminous region SEA1', the second sub-luminous region SEA2', and the third sub-luminous region SEA3' can have a rectangular planar shape. For example, the first sub-luminous region SEA1' and the second sub-luminous region SEA2' can have a rectangular planar shape including a long side extending in the direction of the cutting pattern CP and a short side perpendicular to the direction of the cutting pattern CP, and the third sub-luminous region SEA3' can have a rectangular planar shape including a short side extending in the direction of the cutting pattern CP and a long side perpendicular to the direction of the cutting pattern CP. The first sub-luminous region SEA1' and the second sub-luminous region SEA2' can have long and short sides of the same length, and the length of the long side of the third sub-luminous region SEA3' can be greater than the length of the long side of the first sub-luminous region SEA1' and the second sub-luminous region SEA2', but is not limited thereto.

[0087] Each of the first sub-luminous region SEA1', the second sub-luminous region SEA2', and the third sub-luminous region SEA3' may have a planar shape other than a quadrilateral, such as a polygon, a circle, or an ellipse. Furthermore, the first sub-luminous region SEA1' to the third sub-luminous region SEA3' may have substantially the same area; however, they are not limited to this, and the first sub-luminous region SEA1' to the third sub-luminous region SEA3' may also have different areas from each other.

[0088] The resolution of the second display area DA2 may differ from the resolution of the first display area DA1. For example, the resolution of the second display area DA2 may be lower than that of the first display area DA1. That is, the number of second light-emitting areas EA2 per unit area in each of the second display areas DA2 may be less than the number of first light-emitting areas EA1 per unit area in the first display area DA1. However, this is not a limitation, and the resolution of each of the second display areas DA2 may be substantially the same as that of the first display area DA1.

[0089] A second dam DAM2 can be arranged at the edge of each cut pattern CP. The second dam DAM2 can be arranged outside the second light-emitting region EA2. That is, the second dam DAM2 can be arranged around the second light-emitting region EA2. The second dam DAM2 can prevent the material arranged inside the cut pattern CP from overflowing. For example, the second dam DAM2 can be a structure used to prevent the organic film of the encapsulation layer from overflowing. The second dam DAM2 can be arranged around the second light-emitting region EA2 arranged within the cut pattern CP.

[0090] The non-display area NDA can be arranged outside the second display area DA2. Although not shown, the non-display area NDA may include: a cut connection pattern (not shown) connected to the cut pattern CP; and a cut common pattern (not shown) connected to the cut connection pattern (not shown). The cut connection pattern (not shown) may be designed to facilitate stretching or contraction. The cut common pattern (not shown) may be arranged on the outermost side of the non-display area NDA. One end of each of the cut connection patterns (not shown) may be connected to the cut pattern CP, and the other end may be connected to the cut common pattern (not shown).

[0091] Since the second display area DA2 is designed to facilitate stretching or contraction by means of the cutting pattern CP and cutting connection pattern (not shown) arranged on the second display area DA2, the stress and pressure applied to the second display area DA2 due to hyperbola can be reduced.

[0092] In addition, for Figure 2 The second display area DA2 and the non-display area NDA, arranged at the second corner CS2, the third corner CS3, and the fourth corner CS4, are compared with the reference area. Figure 3 The first corner CS1 is the same as the description.

[0093] A third display area DA3 may be surrounded by a first display area DA1. The third display area DA3 may be an auxiliary display area to the first display area DA1. The third display area DA3 may include: a transmissive area TA that allows light to pass through; and a third emitting area EA3, which includes pixels for displaying images. Within the third display area DA3, the third emitting area EA3 and the transmissive area TA may be arranged alternately along a first direction DR1 and a second direction DR2. The first display area DA1 may not include the transmissive area TA that allows light to pass through, but may only include the first emitting area EA1 containing pixels for displaying images. Therefore, the transmittance of the third display area DA3 may be higher than that of the first display area DA1.

[0094] The third display area DA3 can overlap with the optical device (not shown) along the third direction DR3. Therefore, since light passing through the third display area DA3 can be incident on the optical device (not shown), light incident from the front of the display device 1 can be sensed even if the optical device (not shown) is arranged to overlap with the display panel 10. For example, the optical device (not shown) can be at least one of a proximity sensor, an illuminance sensor, an iris sensor, and a camera sensor, but is not limited thereto.

[0095] Each of the third emitting regions EA3 may include: a first sub-emitting region SEA1" that emits light of a first color; a second sub-emitting region SEA2" that emits light of a second color; and a third sub-emitting region SEA3" that emits light of a third color. For example, the first color may be red, the second color may be green, and the third color may be blue.

[0096] The first sub-light-emitting region SEA1" and the second sub-light-emitting region SEA2" can be arranged along the second direction DR2, and the third sub-light-emitting region SEA3" can be arranged adjacent to the first sub-light-emitting region SEA1" and the second sub-light-emitting region SEA2" along the first direction DR1.

[0097] Each of the first sub-light-emitting region SEA1", the second sub-light-emitting region SEA2", and the third sub-light-emitting region SEA3" can have a rectangular planar shape. For example, the first sub-light-emitting region SEA1" and the second sub-light-emitting region SEA2" can have a rectangular planar shape including the long side of the first direction DR1 and the short side of the second direction DR2, and the third sub-light-emitting region SEA3" can have a rectangular planar shape including the short side of the first direction DR1 and the long side of the second direction DR2. The first sub-light-emitting region SEA1" and the second sub-light-emitting region SEA2" can have long and short sides of the same length, and the length of the long side of the third sub-light-emitting region SEA3" can be greater than the length of the long side of the first sub-light-emitting region SEA1" and the second sub-light-emitting region SEA2", but is not limited thereto.

[0098] Each of the first sub-light-emitting region SEA1", the second sub-light-emitting region SEA2", and the third sub-light-emitting region SEA3" may have a polygonal, circular, or elliptical planar shape other than a quadrilateral. Furthermore, the first sub-light-emitting region SEA1" to the third sub-light-emitting region SEA3" may have substantially the same area, but are not limited thereto, and the first sub-light-emitting region SEA1" to the third sub-light-emitting region SEA3" may have different areas from each other.

[0099] The resolution of the third display area DA3 may differ from the resolution of the first display area DA1. For example, the resolution of the third display area DA3 may be lower than that of the first display area DA1. That is, the number of third light-emitting areas EA3 per unit area in the third display area DA3 may be less than the number of first light-emitting areas EA1 per unit area in the first display area DA1.

[0100] Figure 5 This is a schematic cross-sectional view of a display device according to one embodiment.

[0101] Figure 5An example is shown of a top-emission type display device that emits light in the opposite direction to the base substrate SUB where the light-emitting layer EML is formed. However, it is not limited to this. It can be a bottom-emission type display device that emits light in the direction of the base substrate SUB where the light-emitting layer EML is formed, or it can be a dual-emission type display device that emits light in both directions along both sides of the base substrate SUB and the opposite direction of the base substrate SUB.

[0102] Reference Figure 5 The display device 1 may include a base substrate SUB. The base substrate SUB may be an insulating substrate. The base substrate SUB may include a transparent material. For example, the base substrate SUB may include a transparent insulating material such as glass or quartz. The base substrate SUB may be a rigid substrate. However, the base substrate SUB is not limited to this and may include plastics such as polyimide, and may also have flexible properties that allow it to be bent, folded, or rolled.

[0103] A buffer layer BL can be disposed on the base substrate SUB. To protect the thin-film transistor (TFT) and the light-emitting element (EMD) from moisture that penetrates through the easily permeable base substrate SUB, the buffer layer BL can be disposed on one side of the base substrate SUB. The buffer layer BL can be constructed using multiple inorganic films stacked alternately. The buffer layer BL can also be omitted.

[0104] Thin-film transistors (TFTs) can be arranged on the buffer layer BL as driving elements. A thin-film transistor (TFT) may include a semiconductor layer ACT, a source electrode SE, a drain electrode DE, and a gate electrode GE.

[0105] Figure 5 An example is shown of a thin-film transistor (TFT) formed in a top-gate configuration where the gate electrode GE is located on top of the semiconductor layer ACT; however, it is not limited to this. That is, a thin-film transistor TFT can be formed using a bottom-gate configuration where the gate electrode GE is located on the bottom of the semiconductor layer ACT, or a double-gate configuration where both the gate electrodes GE are located on the top and bottom of the semiconductor layer ACT.

[0106] For example, a semiconductor layer ACT of thin-film transistors (TFTs) can be disposed on the buffer layer BL. The semiconductor layer ACT can include polycrystalline silicon, monocrystalline silicon, low-temperature polycrystalline silicon, amorphous silicon, or oxide semiconductor. A light-shielding layer for blocking external light incident on the semiconductor layer ACT can be formed between the buffer layer BL and the semiconductor layer ACT.

[0107] A first insulating layer IL1 can be disposed on the semiconductor layer ACT. The first insulating layer IL1 can be formed using an inorganic film.

[0108] A gate electrode GE may be disposed on the first insulating layer IL1. The gate electrode GE may overlap with the semiconductor layer ACT. The gate electrode GE may be formed as a single layer or multiple layers using one or an alloy of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu).

[0109] A second insulating layer IL2 can be disposed on the gate electrode GE. The second insulating layer IL2 can be formed using an inorganic film.

[0110] The source electrode SE (or drain electrode) and drain electrode DE (or source electrode) of the thin-film transistor (TFT) can be disposed on the second insulating layer IL2. The source electrode SE and drain electrode DE can be connected to the semiconductor layer ACT through contact holes penetrating the second insulating layer IL2 and the first insulating layer IL1. The source electrode SE and drain electrode DE can be formed as a single layer or multiple layers using a low-resistivity material (e.g., one or an alloy of aluminum (Al), gold (Au), and copper (Cu)).

[0111] A third insulating layer IL3 can be disposed on the source electrode SE and the drain electrode DE. The third insulating layer IL3 can be a passivation film protecting the underlying thin-film transistor TFT. The third insulating layer IL3 can be formed using an inorganic film.

[0112] A via layer VIA can be disposed on the third insulating layer IL3. The via layer VIA can be a planarization film used to planarize the steps caused by the thin-film transistor (TFT). The via layer VIA can include an organic insulating material.

[0113] Light-emitting elements (EMDs) can be arranged on the via layer (VIA). The light-emitting element (EMD) may include a pixel electrode (PXE), a light-emitting layer (EML), and a common electrode (CME).

[0114] Specifically, a pixel electrode PXE can be disposed on the via layer VIA. The pixel electrode PXE can be the first electrode (e.g., the anode electrode) of the light-emitting element EMD. The pixel electrode PXE can be connected to the drain electrode DE (or source electrode SE) of the thin-film transistor TFT through a contact hole penetrating the via layer VIA.

[0115] In a front-emitting structure that emits light in the direction of the common electrode CME based on the light-emitting layer EML, the pixel electrode PXE can be formed using a conductive material with high reflectivity.

[0116] As another example, in a back-emitting structure that emits light toward the pixel electrode PXE based on the light-emitting layer EML, the pixel electrode PXE can be formed using a transparent conductive material (TCO) or a semi-transmissive conductive material.

[0117] A pixel definition film (PDL) may be disposed on the pixel electrode (PXE). The PDL may be disposed on the pixel electrode (PXE) and may include an opening that exposes the pixel electrode (PXE). The PDL may include an organic insulating material.

[0118] An emissive layer (EML) may be disposed on the pixel electrode (PXE) exposed by the pixel definition layer (PDL). The EML may include an organic material layer. The organic material layer of the EML may include an organic light-emitting layer (OLED), and may also include a hole injection / transport layer and / or an electron injection / transport layer. In one embodiment, the EML may have a tandem structure comprising a plurality of OLEDs arranged overlapping along the thickness direction and a charge generation layer disposed therebetween. The overlapping OLEDs may emit light of the same wavelength, but may also emit light of different wavelengths. At least a portion of the layer may be separated from the same layer of adjacent pixels.

[0119] The organic material layer included in the light-emitting layer EML can be referenced Figure 6 The deposition apparatus described later (see reference) Figure 6 The above-mentioned deposition process is formed by performing a deposition process using "DD" (referring to the deposition apparatus). The size of the deposited organic material layer can be determined by the size of the organic material layer included in the deposition apparatus (referring to the deposition apparatus). Figure 6 The mask component of “DD” (see Figure 6 The size is determined by the opening dimensions (of the "100"). For details, please refer to [reference needed]. Figure 9 To be discussed later.

[0120] A common electrode CME is disposed on the light-emitting layer EML. The common electrode CME can be the second electrode (e.g., cathode electrode) of the light-emitting element EMD. The common electrode CME can be formed together on the pixel. In one embodiment, in a front-emitting structure, the common electrode CME can be formed using a transparent conductive material (TCO) or a semi-transmissive conductive material that allows light to pass through. In a back-emitting structure, the common electrode CME can be formed using a conductive material with high reflectivity.

[0121] Figure 6 This is a schematic diagram illustrating a deposition apparatus according to one embodiment. Figure 7 This is a schematic perspective view of a mask assembly according to one embodiment. Figure 8 This is a schematic plan view of a segmentation mask according to one embodiment. Figure 9 It is along Figure 8 A cross-sectional view of the IX-IX' cut.

[0122] Hereinafter, a deposition apparatus according to an embodiment is described as an example of a deposition apparatus for depositing organic material included in an organic light-emitting layer onto an organic light-emitting display device, but it is not limited thereto.

[0123] Reference Figures 6 to 9 According to one embodiment, the deposition apparatus DD may include a chamber 300, a deposition source 310 disposed inside the chamber 300, a support 320, and a mask assembly 100.

[0124] Chamber 300 provides space for performing a process of depositing organic material on substrate 330. The interior of chamber 300 can be maintained under a vacuum. Chamber 300 can be combined with a vacuum pump (not shown) to maintain the interior under a vacuum. Here, vacuum can refer to a low-pressure state that allows the deposition process to be performed smoothly.

[0125] A deposition source 310 may be arranged on the lower side inside the chamber 300. The deposition source 310 may be a container containing a deposition material. For example, the deposition source 310 may be a crucible. A mask assembly 100 according to one embodiment may be arranged on the upper side inside the chamber 300 opposite to the deposition source 310. The mask assembly 100 may be supported and fixed by a support member 320. A substrate 330 may be arranged on the mask assembly 100. For example, the substrate 330 may be used to manufacture an organic light-emitting display device. The mask assembly 100 and the substrate 330 may be directly connected, but are not limited to this; they may also be arranged at a predetermined distance.

[0126] At this time, the upper surface of the mask assembly 100 can face the substrate 330, and the lower surface of the mask assembly 100 can face the deposition source 310.

[0127] If deposited material (not shown) is ejected or evaporated from the deposition source 310 in the chamber 300 toward the mask assembly 100, the deposited material (not shown) is deposited in a patterned shape on a region of the substrate 330 through the deposition pattern portions 144 formed on the segmented mask 140 formed in the mask assembly 100.

[0128] According to one embodiment, a mask assembly 100 may include a mask frame 130 and a plurality of segmented masks 140 coupled to the mask frame 130.

[0129] The mask frame 130 constitutes the outer frame of the mask assembly 100 and may have a quadrilateral shape with a frame opening 132 formed in the center. In one embodiment, the mask frame 130 may have a predetermined thickness in the third direction DR3 to stably support the segmentation mask 140, etc. The mask frame 130 may include a pair of long sides and a pair of short sides, and may have a frame opening 132 arranged in the center along the third direction DR3. For example, the pair of long sides may extend along the first direction DR1 and be arranged side by side with each other along the second direction DR2, and the pair of short sides may extend along the second direction DR2 and be arranged side by side with each other along the first direction DR1.

[0130] In one embodiment, the frame opening 132 can provide a path for the deposited material to pass through, and its planar shape can be generally rectangular. In another embodiment, the mask frame 130 can also be a square strip shape with two opposite sides of equal length, and the planar shape of the frame opening 132 can also be square. The mask frame 130 can be constructed using a material with high rigidity (e.g., a metal such as stainless steel), but is not limited to this.

[0131] A slit mask 140 may be attached to a mask frame 130. The slit mask 140 may include one side (one surface on the third-direction DR3 in the figure) and another side (the other surface on the third-direction DR3 in the figure). One side of the slit mask 140 may be the side that contacts the substrate (not shown) during the deposition process, and the other side of the slit mask 140 may be the side to which deposited material (not shown) is ejected by the deposition source 310. At least a portion of the other side of the slit mask 140 may contact and abut against the mask frame 130.

[0132] The segmentation mask 140 may have a shape in which the length (e.g., the length in the second direction DR2) is greater than the width (e.g., the width in the first direction DR1). In one embodiment, there may be multiple segmentation masks 140, which may extend along the second direction DR2 and be arranged adjacent to each other along the first direction DR1. In another embodiment, the segmentation mask 140 may also be an initial mask having an area on the plane covering the frame opening 132 and being formed integrally.

[0133] In one embodiment, the segmentation mask 140 may be a fine metal mask made of a metallic material. The segmentation mask 140 may be made of a metal such as stainless steel, nickel, cobalt, or alloys thereof. In some embodiments, the deposition mask 140 may be magnetic.

[0134] The segmentation mask 140 may include a fixing portion 142 located at both ends in the length direction (i.e., the second direction DR2), a plurality of deposition pattern portions 144 located between the two fixing portions 142, and a rib 146 located between each deposition pattern portion 144.

[0135] The fixing part 142 is the part that contacts and joins with the mask frame 130. For example, the fixing part 142 can be welded to the mask frame 130. The welding method described above is not particularly limited, but examples include laser welding, resistance heating welding, etc. The fixing part 142 may include a welded part (not shown) formed by welding to the mask frame 130. The welded part (not shown) may be formed as multiple points in the corresponding area of ​​the fixing part 142. The welded parts (not shown) may be arranged in a row, but are not limited to this, and may also be arranged in two or more rows.

[0136] The deposition pattern section 144 can provide a path for the deposited material to pass through and can include multiple openings H. There can be multiple deposition pattern sections 144, which can be spaced apart and arranged along the length direction of the dividing mask 140 (i.e., the second direction DR2). Figure 7 and Figure 8 An example is shown where four deposited pattern portions 144 spaced apart along the second direction DR2 are formed on the segmentation mask 140; however, the number of deposited pattern portions 144 is not limited thereto. In a mask assembly 100 in which the segmentation mask 140 is incorporated into the mask frame 130, the deposited pattern portions 144 may overlap with the frame openings 132. In another embodiment, one deposited pattern portion 144 may also be formed on each segmentation mask 140.

[0137] As described above, ribs 146 may be arranged between adjacent deposition pattern portions 144 along the second direction DR2 of the dividing mask 140. The ribs 146 can divide the adjacent deposition pattern portions 144 along the second direction DR2. The ribs 146 do not form openings H, thereby blocking the passage of deposition material.

[0138] The pattern deposition section 144 can correspond to one display device 1. In this case, patterns corresponding to multiple display devices 1 can be deposited simultaneously using a single process of a mask assembly 100. That is, the mask assembly 100 can correspond to an initial substrate (mother substrate), and patterns corresponding to multiple display devices 1 can be formed simultaneously on the initial substrate.

[0139] The deposition patterning section 144 may include openings H that penetrate the segmentation mask 140. During the deposition process, the segmentation mask 140 may be neatly arranged on the substrate 330, and each opening H of the segmentation mask 140 may expose the deposition target area of ​​the substrate 330. That is, the openings H may have a planar shape that is substantially the same as the deposition pattern of the organic material to be formed on the substrate 330. Figure 7 An example is shown where the opening H is spaced apart along the first direction DR1 and the second direction DR2 and has dots arranged in a matrix shape on a plane. However, it is not limited to this. The opening H can be a slit shape that extends along the first direction DR1 or the second direction DR2 on a plane.

[0140] The deposited pattern section 144 may include a first opening region HA1 containing a first opening H1 and a second opening region HA2 containing a second opening H2. The first opening H1 may have a first width W1, and the second opening H2 may have a second width W2. The second opening region HA2 may have a circular shape in a plan view and may be surrounded by the first opening region HA1, but is not limited thereto. The area of ​​the region where the first opening H1 is located may be larger than the area of ​​the region where the second opening H2 is located, but is not limited thereto.

[0141] The opening H may have different sizes in different areas within the dividing mask 140. The size of the openings H arranged in the same area may be a constant size, but is not limited to this. As described above, the opening H may include a first opening H1 having a first width W1 and a second opening H2 having a second width W2.

[0142] Each opening H1, H2 may include protrusions LB1, LB2 formed inside and protruding inwards. For example, the first opening H1 may include a first protrusion LB1, and the second opening H2 may include a second protrusion LB2. The inclusion of protrusions LB1, LB2 in each opening H1, H2 provides higher strength to the corresponding segmentation mask 140. That is, the inclusion of protrusions LB1, LB2 minimizes the possibility of damage to the segmentation mask 140.

[0143] The spacing between each protrusion LB1, LB2 can be defined as a first width W1 and a second width W2. For example, the first width W1 of the first opening H1 can be defined as the spacing between the first protrusions LB1, and the second width W2 of the second opening H2 can be defined as the spacing between the second protrusions LB2. The internal width of each opening H can be represented as the width in the direction that maximizes the spacing between each protrusion LB1, LB2 among multiple directions in which the spacing between each protrusion LB1, LB2 can be measured.

[0144] The upper surface of the deposited pattern portion 144 in the first opening region HA1 and the upper surface of the second opening region HA2 may be located on the same plane. However, the lower surface of the deposited pattern portion 144 in the first opening region HA1 and the lower surface of the second opening region HA2 may not be located on the same plane, and a step may be formed at the boundary between them.

[0145] Furthermore, each opening H1 and H2 can be divided along the third direction DR3 with the plane including each protrusion LB1 and LB2 as a reference. For example, the first opening H1 may include a first upper opening H1u located on one side of the third direction DR3 with the plane including the first protrusion LB1 as a reference, and a first lower opening H1b located on the other side of the third direction DR3. The second opening H2 may include a second upper opening H2u located on one side of the third direction DR3 with the plane including the second protrusion LB2 as a reference, and a second lower opening H2b located on the other side of the third direction DR3.

[0146] The first upper opening H1u and the second upper opening H2u can be recessed in an arc shape toward the other side of the third direction DR3, and can have a shape that opens to the other side of the third direction DR3. In addition, the first lower opening H1b and the second lower opening H2b can be recessed in an arc shape toward the third direction DR3, and can have a shape that opens to the third direction DR3.

[0147] According to one embodiment, the segmentation mask 140 can have different thicknesses for different regions depending on the size of the opening H included in the respective regions. For example, a first opening region HA1 including a first opening H1 with a first width W1 can have a first thickness t1, and a second opening region HA2 including a second opening H2 with a second width W2 can have a second thickness t2. As described above, since the upper surface of the deposited pattern portion 144 of the first opening region HA1 and the upper surface of the second opening region HA2 are located on the same plane, a step can be formed at the boundary between the lower surface of the deposited pattern portion 144 of the first opening region HA1 and the lower surface of the second opening region HA2, as described above. The step between the lower surface of the first opening region HA1 and the lower surface of the second opening region HA2 can be the same as the difference between the first thickness t1 and the second thickness t2, but is not limited thereto.

[0148] When the first width W1 of the first opening H1 is greater than the second width W2 of the second opening H2 and the first thickness t1 of the first opening region HA1 is greater than the second thickness t2 of the second opening region HA2, the second thickness t2 of the second opening region HA2 can be greater than the value of the first thickness t1 multiplied by the ratio of the second width W2 to the first width W1. That is, the following relationship can be applied to the second thickness t2 of the second opening region HA2.

[0149] [Formula 1]

[0150]

[0151] Furthermore, an opening H can have different widths in the thickness direction (third direction DR3). For example, in the first opening H1, one side of the third direction DR3 can have a first upper width Wu1, and the other side of the third direction DR3 can have a first lower width Wb1. The first upper width Wu1 can be greater than the first width W1 and less than the first lower width Wb1, but is not limited thereto. Similarly, in the second opening H2, one side of the third direction DR3 can have a second upper width Wu2, and the other side of the third direction DR3 can have a second lower width Wb2. The second upper width Wu2 can be greater than the second width W2 and less than the second lower width Wb2, but is not limited thereto.

[0152] The thicknesses t1 and t2 of each opening H1 and H2 can be divided into upper thicknesses tu1 and tu2 and lower thicknesses tb1 and tb2, based on the plane including each protrusion LB1 and LB2. For example, the first upper thickness tu1 can represent the thickness from the first opening H1 on the third-direction DR3 side to the first protrusion LB1. Alternatively, the first upper thickness tu1 can represent the thickness from the upper surface of the dividing mask 140 in the first opening region HA1 to the first protrusion LB1.

[0153] The first lower thickness tb1 can represent the thickness from the third side to the other side of DR3 to the first protrusion LB1. Alternatively, the first lower thickness tb1 can represent the thickness from the lower surface of the dividing mask 140 in the first opening region HA1 to the first protrusion LB1.

[0154] The second upper thickness tu2 can represent the thickness from the second opening H2 on the third-direction DR3 side to the second protrusion LB2. Alternatively, the second upper thickness tu2 can represent the thickness from the upper surface of the dividing mask 140 in the second opening region HA2 to the second protrusion LB2.

[0155] The second lower thickness tb2 can represent the thickness from the third side to the other side of DR3 to the second protrusion LB2. Alternatively, the second lower thickness tb2 can represent the thickness from the lower surface of the dividing mask 140 in the second opening region HA2 to the second protrusion LB2.

[0156] The first upper thickness tu1 can be greater than the second upper thickness tu2, and the first lower thickness tb1 can be greater than the second lower thickness tb2, but are not limited thereto. The first upper thickness tu1 can have a value less than 0.5 times, less than 0.3 times, less than 0.2 times, or less than 0.1 times the first thickness t1, but are not limited thereto. Similarly, the second upper thickness tu2 can have a value less than 0.5 times, less than 0.3 times, less than 0.2 times, or less than 0.1 times the second thickness t2, but are not limited thereto.

[0157] The segmentation mask 140 can be fixed to the mask frame 130 by welding while tensile forces are applied to both ends along the first direction DR1 or the second direction DR2. In another embodiment, the segmentation mask 140 can be stretched not only along the first direction DR1, but also along the second direction DR2.

[0158] According to one embodiment, the mask assembly 100 may further include a gap mask 150 disposed between the segmented masks 140. The gap mask 150 may be disposed in the gap between the segmented masks 140 to block the passage of deposited material between the segmented masks 140. The gap mask 150 may have the same length as the segmented masks 140 (length in the second direction DR2). The gap mask 150 does not have an opening, thereby blocking the passage of deposited material. However, it is not limited to this, and the gap mask 150 may also be omitted.

[0159] According to one embodiment, the mask assembly 100 may include a segmented mask 140 comprising openings H of various sizes in different regions. Furthermore, the segmented mask 140 may have different thicknesses t1 and t2 in different regions depending on the widths W1 and W2 of the openings H1 and H2. Therefore, a deposited material can be stably deposited on a substrate 330 on which the deposited material is deposited in various sizes.

[0160] Figure 10 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment.

[0161] Figures 11 to 13 This is a cross-sectional view showing a method of manufacturing a display device according to an embodiment.

[0162] Reference Figure 10A method for manufacturing a display device according to an embodiment may include the following steps: preparing a mask template including a first opening region and a second opening region (S11); performing half etching on the second opening region of the mask template (S21); forming a first opening portion having a first width in the first opening region of the mask template and forming a second opening portion having a second width smaller than the first width in the second opening region to manufacture a segmentation mask (S31); and preparing a substrate and a deposition apparatus, and using the deposition apparatus and the segmentation mask to deposit a deposition material on the substrate (S41).

[0163] Reference Figure 10 and Figure 11 A photomask MP is prepared for manufacturing a segmentation mask 140 according to one embodiment. The photomask MP can be manufactured into the segmentation mask 140 by processes described later. The photomask MP can be formed using a metal such as stainless steel, nickel, cobalt, or alloys thereof. In some embodiments, the photomask MP can be magnetic.

[0164] The photomask MP can be configured through subsequent processes to include a first opening region HA1 and a second opening region HA2 with openings H of different sizes. For example, a first opening H1 with a first width W1 can be formed in the first opening region HA1, and a second opening H2 with a second width W2 smaller than the first width W1 can be formed in the second opening region HA2.

[0165] As described above, in the segmentation mask 140 according to one embodiment, the region forming the opening H with a small width can have a small thickness. Therefore, the second opening region HA2 can have a smaller thickness than the first opening region HA1. In order to have a second thickness t2 smaller than the first thickness t1 of the first opening region HA1 in the second opening region HA2, half etching (S21) can be performed on one side of the second opening region HA2 of the mask MP. However, it can be omitted from the first opening region HA1. In this case, the half etching performed on one side of the second opening region HA2 can achieve a third thickness t3, which is the difference between the first thickness t1 and the second thickness t2. Through this half etching process, a step of the third thickness t3 can be formed at the boundary between the first opening region HA1 and the second opening region HA2.

[0166] In another embodiment, half-etching is performed on all one side of the mask MP. However, the half-etching is performed for a longer time on the second opening region HA2 than on the first opening region HA1, so that the second thickness t2 of the second opening region HA2 can be less than the first thickness t1 of the first opening region HA1. In this case, the half-etching of the second opening region HA2 can be performed for a third thickness t3, which is the difference between the first thickness t1 and the second thickness t2, more than that performed on the first opening region HA1.

[0167] Reference Figure 10 , Figure 12 and Figure 13 After the half etching step on the photomask MP, the following steps can be performed: forming a first opening with a first width in the first opening region of the photomask, and forming a second opening with a second width in the second opening region (S31). This step can be performed using a double etching process that involves a first etching followed by a second etching.

[0168] First, a first etching process can be performed. In the first opening region HA1 of the photomask MP, the first protective film PL1 is patterned such that the upper surface exposes a first upper mask width Wm1u and the lower surface exposes a first lower mask width Wm1b. The first lower mask width Wm1b can be larger than the first upper mask width Wm1u, but is not limited thereto. Similarly, in the second opening region HA2 of the photomask MP, the first protective film PL1 is patterned such that the upper surface exposes a second upper mask width Wm2u and the lower surface exposes a second lower mask width Wm2b. The second lower mask width Wm2b can be larger than the second upper mask width Wm2u, but is not limited thereto.

[0169] Furthermore, the width of the first upper mask Wm1u can be greater than the width of the second upper mask Wm2u, and the width of the first lower mask Wm1b can be greater than the width of the second lower mask Wm2b, but is not limited to these.

[0170] As described above, if the mask MP patterned with the first protective film PL1 is etched, a predetermined thickness can be etched according to each region of the mask MP. In one embodiment, the etching of the mask MP can be performed in an isotropic etching manner. Since the widths Wm1u, Wm1b, Wm2u, and Wm2b of the mask are sufficiently small, a larger width allows for the etching of a thicker thickness.

[0171] The upper surface of the first opening region HA1 can be etched with a first upper thickness tu1' and the lower surface can be etched with a first lower thickness tb1'. Here, the first lower thickness tb1' can be greater than the first upper thickness tu1'. The upper surface of the second opening region HA2 can be etched with a second upper thickness tu2' and the lower surface can be etched with a second lower thickness tb2'. Here, the second lower thickness tb2' can be greater than the second upper thickness tu2'. Furthermore, the first upper thickness tu1' can be greater than the second upper thickness tu2', and the first lower thickness tb1' can be greater than the second lower thickness tb2'.

[0172] In an exemplary embodiment, if etching is performed, the widths W1u, W1b', W2u, W2b' of the etched portion having a groove shape can be greater than the exposed widths Wm1u, Wm1b, Wm2u, Wm2b of the first protective film PL1 forming the corresponding portion.

[0173] Even if the first etching process is performed, the opening H may not be formed on the photomask MP. After the first etching process, a second etching process can be performed to form the opening H. The second etching process can be performed only on the lower surface of the photomask MP. Therefore, the second etching process can be performed with the exposed portion of the upper surface of the photomask MP protected by a second protective film PL2. For example, the second protective film PL2 may include resin or photoresist, but is not limited to these.

[0174] MP can be formed on the photomask through a second etching process. Figure 9 The opening H shown is used to form a dividing mask 140. Specifically, the first opening H1 and the second opening H2 are respectively manufactured by etching from bottom to top in the first opening region HA1 and the second opening region HA2.

[0175] If the first opening H1 and the second opening H2 are formed through a second etching process, then the first protective film PL1 and the second protective film PL2 can be removed by an ashing process to manufacture a product such as... Figure 9 The segmentation mask 140 is shown.

[0176] Reference Figure 6 and Figure 10 After fabricating the segmentation mask 140, the following steps may be included: preparing the substrate 330 and the deposition apparatus DD, and using the deposition apparatus DD and the segmentation mask 140 to deposit a deposition material onto the substrate 330 (S41). Specifically, as Figure 6As shown, after a mask assembly 100 including a partition mask 140 is placed on a deposition apparatus DD and a substrate 330 is arranged on the mask assembly 100, a deposition material (not shown) arranged inside the deposition source 310 can be deposited on the substrate 330. At this time, the deposition material (not shown) can be patterned in a shape corresponding to the opening H of the partition mask 140.

[0177] According to a method for manufacturing a display device according to one embodiment, a segmentation mask 140 with high strength, comprising openings H of various sizes in different regions, can be manufactured. Furthermore, the segmentation mask 140 can have different thicknesses t1 and t2 in different regions depending on the size of the openings H. Therefore, a deposited material can be stably deposited on a substrate 330 on which the deposited material is deposited in various sizes.

[0178] Hereinafter, another embodiment of the segmentation mask 140 will be described. In the following embodiments, descriptions of configurations identical to those in the above embodiments will be omitted or simplified, and the descriptions will focus primarily on the differences.

[0179] For other matters, refer to Figures 6 to 9 The content described is the same or similar, therefore additional detailed descriptions are omitted.

[0180] Figure 14 This is a schematic plan view of a segmentation mask according to another embodiment.

[0181] The segmentation mask 140_1 according to this embodiment may have a shape extending along the second direction DR2. The segmentation mask 140_1 may include a plurality of deposited pattern portions 144_1. The plurality of deposited pattern portions 144_1 may be spaced apart and arranged along the length direction (i.e., the second direction DR2) of the segmentation mask 140_1.

[0182] Each deposition pattern section 144_1 can provide a path for the deposited material to pass through and can include multiple openings H. The openings H can have different sizes in different regions within the partition mask 140_1. The deposition pattern section 144_1 can include a first opening region HA1_1 and a second opening region HA2_1 as regions with different sizes and different thicknesses within each deposition pattern section 144_1.

[0183] Each deposition pattern portion 144_1 may have a rectangular shape with a long side along the first direction DR1 and a short side along the second direction DR2 in a plan view, but is not limited to this. In each deposition pattern portion 144_1, the first opening region HA1_1 may occupy most of the area of ​​each deposition pattern portion 144_1 and be arranged in the center. The first opening region HA1_1 may be adjacent to at least one of the fixing portion 142_1 and the rib portion 146_1. Second opening regions HA2_1 may be arranged at the four corners of the first opening region HA1_1. The second opening regions HA2_1 may be arranged in the corner areas of each deposition pattern portion 144_1.

[0184] The first opening region HA1_1 may include multiple first openings H1, and the second opening region HA2_1 may include multiple second openings H2. Regarding the internal structural shapes of the first openings H1 and the second openings H2, compared with reference... Figure 9 The explanations are the same.

[0185] According to the segmentation mask 140_1 of this embodiment, the segmentation mask 140_1 includes a plurality of deposition pattern portions 144_1, each deposition pattern portion 144_1 including opening regions HA1_1, HA2_1 having openings H of various sizes in each region. Furthermore, the segmentation mask 140_1 can have different thicknesses t1, t2 in each region depending on the widths W1, W2 of the openings H1, H2. Therefore, the deposition material can be stably deposited on the substrate 330 on which the deposition material is deposited in various sizes.

[0186] Figure 15 This is a schematic plan view of a segmentation mask according to yet another embodiment.

[0187] The segmentation mask 140_2 according to this embodiment may have a shape extending along the second direction DR2. The segmentation mask 140_2 may include a plurality of deposited pattern portions 144_2. The plurality of deposited pattern portions 144_2 may be spaced apart and arranged along the length direction of the segmentation mask 140_2 (i.e., the second direction DR2).

[0188] Each deposition pattern section 144_2 can provide a path for the deposited material to pass through and can include multiple openings H. The openings H can have different sizes in different regions within the partition mask 140_2. The deposition pattern section 144_2 can include a first opening region HA1_2, a second opening region HA2_2, and a third opening region HA3_2, which are regions with different sizes and different thicknesses within each deposition pattern section 144_2.

[0189] Each deposition pattern portion 144_2 may have a rectangular shape with a long side along the first direction DR1 and a short side along the second direction DR2 in a plan view, but is not limited to this. In each deposition pattern portion 144_2, a first opening region HA1_2 may occupy most of the area of ​​each deposition pattern portion 144_2 and be arranged in the center. The first opening region HA1_2 may be adjacent to at least one of the fixing portion 142_2 and the rib portion 146_2. The second opening region HA2_2 may have a circular shape in a plan view and may be surrounded by the first opening region HA1_2. A third opening region HA3_2 may be arranged at the four corners of the first opening region HA1_2. The third opening region HA3_2 may be arranged at the corner areas of each deposition pattern portion 144_2.

[0190] The first opening region HA1_2 may include multiple first openings H1, the second opening region HA2_2 may include multiple second openings H2, and the third opening region HA3_2 may include multiple third openings H3. Regarding the internal structural shapes of the first openings H1 to the third openings H3, compared with the reference... Figure 9 The explanations are the same.

[0191] According to the segmentation mask 140_2 of this embodiment, the segmentation mask 140_2 may include a plurality of deposition pattern portions 144_2, and each deposition pattern portion 144_2 may include opening regions HA1_2, HA2_2, and HA3_2 containing openings H of different sizes in different regions. Furthermore, the segmentation mask 140_2 may have different thicknesses t in different regions depending on the size of the openings H. Therefore, a deposition material can be stably deposited on the target substrate 330 where the deposition material is deposited in various sizes.

[0192] The present invention has been described above with reference to embodiments thereof. However, these are merely examples and are not intended to limit the invention. Those skilled in the art will understand that various modifications or applications not illustrated above can be made without departing from the essential characteristics of the embodiments of the invention. For example, the constituent elements specifically appearing in the embodiments of the invention can be modified and implemented. Furthermore, differences related to such modifications and applications should be interpreted as being included within the scope of the invention as defined in the claims.

Claims

1.A mask assembly comprising: a mask frame including a frame opening portion; and a split mask coupled to the mask frame, including a plurality of deposition pattern portions overlapping the frame opening portion and extending in a first direction, wherein each of the plurality of deposition pattern portions includes: a first opening region including a first opening portion having a first width and a first thickness determined according to the first width; and a second opening region including a second opening portion having a second width smaller than the first width and a second thickness determined according to the second width, wherein the second thickness is smaller than the first thickness, the second thickness is greater than a value of the first thickness multiplied by a ratio of the second width to the first width. 2.The mask assembly of claim 1, wherein: the first opening portion includes a first protrusion portion formed inside and protruding toward an inside, the second opening portion includes a second protrusion portion formed inside and protruding toward the inside. 3.The mask assembly of claim 2, wherein: in the first opening region, the split mask has a first upper thickness from an upper surface of the split mask to the first protrusion portion, and has a first lower thickness from the first protrusion portion to a lower surface of the split mask, wherein the first upper thickness is smaller than the first lower thickness. 4.The mask assembly of claim 3, wherein: the first upper thickness is 0.2 times or less of the first thickness. 5.The mask assembly of claim 3, wherein: in the second opening region, the split mask has a second upper thickness from an upper surface of the split mask to the second protrusion portion, and has a second lower thickness from the second protrusion portion to a lower surface of the split mask, wherein the second upper thickness is smaller than the second lower thickness. 6.The mask assembly of claim 5, wherein: the second upper thickness is 0.2 times or less of the second thickness. 7.The mask assembly of claim 5, wherein: the first upper thickness is greater than the second upper thickness, the first lower thickness is greater than the second lower thickness. 8.The mask assembly of claim 1, wherein: the second opening region is disposed surrounded by the first opening region. 9.The mask assembly of claim 1, wherein: the plurality of deposition pattern portions are arranged in an extension direction of the split mask. 10.The mask assembly of claim 9, wherein: one end and the other end of the split mask in the first direction are fixed to the mask frame. ​

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