Cable connection device, connection assembly and manufacturing method thereof

Abstract

The present invention discloses a cable connection device, a connection assembly and a manufacturing method thereof. The cable connection device comprises: a backplane, the backplane comprises a plate body and a ground layer, a via hole and a shielding hole are formed on the plate body, the shielding hole is arranged outside the via hole, the ground layer is arranged on two opposite sides of the plate body and connected to the shielding hole; a connector is in contact with or connected to the surface of one side of the backplane where the ground layer is arranged, a signal pin is arranged in the connector, and the signal pin is inserted into the via hole. The cable connection device provided by the present invention can achieve high-speed transmission of the signal on the signal pin by plugging and matching the signal pin on the connector with the via hole on the backplane, and the loss of the high-speed signal in the process of passing through the backplane is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of cable connection, and in particular to a cable connection device, a connection assembly and a manufacturing method thereof. Background Art

[0002] With the continuous development of high-speed communications, coaxial cables are increasingly used for interconnecting boards within the same cabinet. At the same time, high-speed electrical transmission within a printed circuit board (PCB) based on etched lines is affected by high-speed transmission loss, jitter and other issues, and the application of intra-board cable interconnection has also begun to appear. When transmitting high-speed signals, traditional cables need to be installed with plug-in structures at both ends to facilitate the connection between the cable and the PCB board. However, high-speed signals will be lost during transmission, and the plug-in structure is not only complex in structure and high in cost, but also more difficult to plug and unplug bundles of cables, especially in complex PCB board applications. There is also a risk of cables falling off due to their own weight. Therefore, it is particularly important to provide a connection device for a cable transmission high-speed signal interconnection system. Summary of the invention

[0003] The main technical problem solved by the present invention is to provide a cable connection device, a connection component and a manufacturing method thereof, so as to solve the problems of high-speed signal transmission loss, complex connection structure and high cost.

[0004] In order to solve the above technical problems, the first technical solution adopted by the present invention is: to provide a cable connection device, the cable connection device includes: a backplane, the backplane includes a board body and a ground layer, a via and a shielding hole are formed on the board body, the shielding hole is arranged outside the via, the ground layer is arranged on two opposite sides of the board body and connected to the shielding hole; a connecting piece, which is in contact with or connected to the surface of one side of the backplane where the ground layer is arranged, and a signal pin is arranged in the connecting piece, and the signal pin is inserted into the via.

[0005] The present invention solves the above technical problems, and the second technical solution adopted is: providing a connection component, the connection component comprising: a high-speed daughter card, a connection member, a signal pin in the connection member, one side of the connection member is fixedly connected to the high-speed daughter card, and the signal pin is connected to the high-speed daughter card; a backplane, the backplane is arranged on the side of the connection member away from the high-speed daughter card, the backplane comprises a board body and a ground layer, a via and a shielding hole are formed on the board body, the shielding hole is arranged on the outer layer of the via, the ground layer is arranged on two opposite sides of the board body and connected to the shielding hole; a plurality of first cables and a first fixing member, the first fixing member is located on one side of the backplane, and has a first through hole corresponding to the position of the via in the backplane and matching the diameter of the first cable; wherein the first cable is fixed on the first fixing member, one end of the first cable is exposed on the surface of the fixing member, and the exposed end of the first cable is connected to the signal pin, the side of the connection member away from the high-speed daughter card is in conflict with or connected to the side surface of the backplane provided with the ground layer, and the signal pin is inserted into the via.

[0006] The present invention solves the above technical problems, and the third technical solution adopted is: a method for manufacturing a connection component, comprising: providing a plurality of first cables, a first fixing plate, a back plate and a connector used in conjunction with the first cable, the connector having a signal pin, the back plate having a via and a ground layer, and the first fixing plate having a first through hole; fixing the first cable on the first fixing plate through the first through hole, so that one end of the first cable is exposed on the surface of the first fixing plate; connecting the connector to the back plate, so that the signal pin is inserted into the through hole; connecting the surface of the first fixing plate where the end face of the first cable is exposed to the surface of the back plate away from the connector; fixing a high-speed daughter card on the surface of the connector at the other end of the middle signal pin, so that the signal pin is connected to the high-speed daughter card.

[0007] The beneficial effects of the present invention are:

[0008] The present invention provides a cable connection device, in which a signal pin on a connector is plugged into and matched with a via hole on a backplane, so that the signal on the signal pin is transmitted at high speed, and the loss of the high-speed signal in the process of passing through the backplane is reduced.

[0009] The present invention provides a connection component and a manufacturing method thereof, wherein a signal pin on a connection component is plugged into and matched with a via hole on a back panel, so that the signal on the signal pin can be transmitted at high speed through a first cable; the first cable is connected to the signal pin in the connection component through a first fixing component in the connection component. Since the first cable of the present application is connected through the first fixing component, it can prevent the cables from falling off when the number of cables is large. In addition, since the first fixing component of the present application has a simple structure, compared with a traditional dedicated connector, it can reduce the manufacturing cost and improve the application reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a structural schematic diagram of an embodiment of a cable connection device of the present invention;

[0011] Figure 2 It is a structural schematic diagram of an embodiment of a connection assembly of the present invention;

[0012] Figure 3 It is a structural schematic diagram of an embodiment of a high-speed daughter card in a connection assembly of the present invention;

[0013] Figure 4 It is a structural schematic diagram of another embodiment of a high-speed daughter card in a connection assembly of the present invention;

[0014] Figure 5 This is a flow chart of an embodiment of a method for manufacturing a connection assembly of the present application;

[0015] Figure 6 It is a flow chart of an embodiment of a method for manufacturing a high-speed daughter card in a connection assembly of the present application. DETAILED DESCRIPTION

[0016] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0017] The terms "first", "second", "third", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0018] The present invention is described in detail below with reference to the accompanying drawings and embodiments.

[0019] See also Figure 1 , Figure 1 The cable connection device 1 includes a back plate 11 and a connection member 12 .

[0020] The backplane 11 includes a board body 111 and a ground layer 113. A via 114 and a shielding hole 115 are formed on the board body 111. The position of the via 114 corresponds to the position of the signal pin 121 on the connector 12. The shielding hole 115 is arranged on the outer circle of the via 114 with the via 114 as the center. The ground layer 113 is arranged on two opposite sides of the board body 111 and is connected to the shielding hole 115. The middle layer of the back plate 11 is also provided with a ground layer 113, and the inner wall of the shielding hole 115 is provided with a metal layer, and the metal layer in the shielding hole 115 is connected to the ground layer 113. This is because there are many electromagnetic fields in the external space (such as induction cookers, chargers, etc.), and the metal layer in the shielding hole 115 will induce electric charges and secondary magnetic fields in the electromagnetic fields, affecting the high-speed signal transmitted on the signal pin 121. After being connected to the ground layer 113, the metal layer on the inner wall of the shielding hole 115 is connected to the ground layer 113 and will not be affected by the electric charges and secondary magnetic fields, thereby ensuring that the signal in the signal pin 121 can be transmitted at high speed. Among them, the back plate 11 is a high-speed PCB board.

[0021] The connector 12 is connected to the side surface of the backplane 11 provided with the ground layer 113, and a signal pin 121 is provided in the connector 12, one end of the signal pin 121 protrudes from the surface of the connector 12, and the protruding end of the signal pin 121 is inserted into the via hole 114. The cross section of the signal pin 121 is circular, and the signal pin 121 is inserted into the via hole 114. Compared with the general pointed pin, the contact area of ​​the round head signal pin 121 of the present application is larger, thereby improving the firmness of the connection. The diameter of the signal pin 121 is smaller than the diameter of the via hole 114, which is to fill the gap between the signal pin 121 and the backplane 11 with air. Since the dielectric constant of air is larger than that of the backplane 11, the air can effectively reduce the loss of the high-speed signal in the signal pin 121 during the process of passing through the backplane 11, thereby ensuring the integrity of the high-speed signal in the signal pin 121. In another optional embodiment, the connector 12 can also be in contact with the side surface of the backplane 11 provided with the ground layer 113. In another optional embodiment, the gap between the inner wall of the via 114 and the outer wall of the signal needle 121 can be a conductive metal, that is, the via 114 is metallized, and the inner wall of the metallized via 114 clamps the signal needle 121 inserted into the via 114, so that the conductive metal contacts the inner wall of the via 114 and the outer wall of the signal needle 121, thereby increasing the diameter of the signal needle 121 that transmits the signal, further making the signal transmission faster.

[0022] The side of the signal pin 121 protruding from the surface of the connector 12 can be welded to the back panel 11. It should be noted that after the signal pin 121 is inserted into the via 114 in the back panel 11, the end of the signal pin 121 inserted into the via 114 needs to be ground so that the end of the signal pin 121 is flush with the surface of the back panel 11 away from the connector 12. If it protrudes from the surface of the back panel 11, it will cause uneven welding during application. If it is recessed in the surface of the back panel 11, it will be difficult to connect with other components.

[0023] A cable connection device provided in this embodiment enables the signal on the signal pin to be transmitted at high speed by plugging and matching the signal pin on the connector with the via hole on the backplane, thereby reducing the loss of the high-speed signal in the process of passing through the backplane.

[0024] See also Figure 2 , Figure 2 The schematic diagram of the structure of an embodiment of a connection assembly of the present invention is as follows: The connection assembly 2 comprises a connection member 21 , a backplane 22 (not labeled), a plurality of first cables 23 (not labeled), a first fixing member 24 and a high-speed daughter card 25 .

[0025] The backplane 22 includes a board body 221 and a ground layer 223. A via 224 and a shielding hole 225 are formed on the board body 221. The position of the via 224 corresponds to the position of the signal pin 210 set on the connector 21. The shielding hole 225 is arranged in the outer circle of the via 224 with the via 224 as the center. The ground layer 223 is arranged on the opposite sides of the board body 221. The ground layers 223 on both sides of the board body 221 are welding pads for welding the connector 21 and the first fixing member 24. The ground layer 223 is connected to the shielding hole 225. The middle layer of the back plate 22 is also provided with a ground layer 223, and the inner wall of the shielding hole 225 is provided with a metal layer, and the metal layer in the shielding hole 225 is connected to the ground layer 223. This is because there are many electromagnetic fields in the external space (such as induction cookers, chargers, etc.), and the metal layer in the shielding hole 225 will induce electric charges and secondary magnetic fields in the electromagnetic fields, affecting the signal transmitted on the signal pin 210. After being connected to the ground layer 223, the metal layer on the inner wall of the via 224 is connected to the ground layer 223 and will not be affected by the electric charges and secondary magnetic fields, thereby ensuring that the signal in the signal pin 210 can be transmitted at high speed. Among them, the back plate 22 is a high-speed PCB board.

[0026] The connector 21 is provided with a signal pin 210, one end of which protrudes from a surface of the connector 21, and the surface of the signal pin 210 protruding from the connector 210 is fixedly connected to the backplane 22, and the protruding end of the signal pin 210 is inserted into the via hole 224 of the backplane 22. A high-speed daughter card 25 is provided on the surface of the connector 21 protruding away from the signal pin 210, and the high-speed daughter card 25 is connected to the other end of the signal pin 210. The cross section of the signal pin 210 is circular, and the signal pin 210 is inserted into the via hole 224. Compared with a general pointed pin, the round-headed signal pin 210 of the present application has a larger contact area, thereby improving the firmness of the connection. The diameter of the signal needle 210 is smaller than the diameter of the via 224. This is to fill the gap between the signal needle 210 and the backplane 22 with air. Since the dielectric constant of air is larger than that of the backplane 22, the air can effectively reduce the loss of the high-speed signal in the signal needle 210 during the process of passing through the backplane 22, thereby ensuring the integrity of the high-speed signal in the signal needle 210. In another optional embodiment, the connector 21 can also be in contact with the side surface of the backplane 22 provided with the ground layer 223. In another optional embodiment, the gap between the inner wall of the via 224 and the outer wall of the signal needle 210 can be a conductive metal, that is, the inner wall of the via 224 is metallized, and the inner wall of the metallized via 224 clamps the signal needle 210 inserted into the via 224, so that the conductive metal contacts the inner wall of the via 224 and the outer wall of the signal needle 210, thereby increasing the diameter of the signal needle 210 that transmits the signal, further facilitating the smooth transmission of the high-speed signal.

[0027] A plurality of first cables 23 and first fixing members 24, wherein the first fixing member 24 is located on the side of the back plate 22 away from the connector 21, and has a first through hole 241 corresponding to the position of the through hole 224 in the back plate 22 and matching the diameter of the first cable 23. The first cable 23 is inserted into the first through hole 241 from the side of the first fixing member 24 away from the back plate 22 and fixed by the first fixing member 24, and the end of the first cable 23 inserted into the first through hole 241 is connected to the signal pin 210 in the back plate 22. In this embodiment, the material of the first fixing member 24 is a metal plate, which can be a rectangular metal plate or a circular metal plate, as long as it can play the role of fixing the first cable 23, and the specific shape is not limited. The first cable 23 includes a central conductor 234 and a dielectric layer 233, a shielding layer 232 and a protective layer 231 that wrap the central conductor 234 in sequence. In this embodiment, the first cable 23 is divided into a first part and a second part, wherein the first part is a part inserted into the first through hole 241, and the second part is a part outside the first through hole 241. In this embodiment, in order to ensure good electrical conductivity between the shielding layer 232 and the first fixing member 24, the first through hole 241 needs to be in contact with the shielding layer 232, that is, when the first part of the first cable 23 is inserted into the first through hole 241, the protective layer 231 of the first part is removed to expose the shielding layer 232. In order to improve the firmness between the first cable 23 and the first fixing member 24, the inner diameter of the first through hole 241 matches the outer diameter of the shielding layer 232.

[0028] In another optional embodiment, the connector 21 includes a first connector 211 and a second connector 212. The first connector 211 includes a first signal pin 2111, both ends of the first signal pin 2111 are exposed on the surface of the first connector 211, and the surface of the first connector 211 where one end of the first signal pin 2111 is exposed is fixedly connected to the high-speed daughter card 25; the second connector 212 includes a second signal pin 2121, one end of the second signal pin 2121 is exposed on one surface of the second connector 212, and the other end of the second signal pin 2121 protrudes from another surface of the second connector 212; In the embodiment, the surface of the second connector 212 where the second signal pin 2121 is exposed is connected or in conflict with the surface of the first connector 211 where the first signal pin 2111 is exposed. The surface of the second connector 212 where the second signal pin 2121 is protruded is fixedly connected to the surface of one side of the backplane 22 where the ground layer 223 is provided. The protruding end of the second signal pin 2121 is inserted into the via 224, and the second signal pin 2121 is connected to the first signal pin 2111. The other surface of the first connector 211 where the first signal pin 2121 is exposed is connected to the high-speed daughter card 25, and the first signal pin 2121 is connected to the high-speed daughter card 25. In order to make the high-speed daughter card 25 arranged on the backplane 22 regular, the first signal pin 2111 in the first connector 211 connected to the high-speed daughter card 25 is a bent structure, that is, the two ends of the first signal pin 2111 are distributed on two adjacent surfaces of the first connection block 211. The high-speed daughter card 25 is arranged vertically relative to the backplane 22.

[0029] A connection component provided in this embodiment enables the signal on the signal pin to be transmitted at high speed through the first cable by plugging and matching the signal pin on the connecting piece with the via hole on the backplane; the first cable is connected to the signal pin in the connecting piece through the first fixing piece in the connection component. Since the first cable of the present application is connected through the first fixing piece, it can prevent the cables from falling off when there are a large number of cables. In addition, since the first fixing piece of the present application has a simple structure, compared with the traditional dedicated connector, it can reduce the production cost and improve the application reliability.

[0030] See also Figure 3 and Figure 4 , Figure 3 It is a structural schematic diagram of an embodiment of a high-speed daughter card in a connection assembly of the present invention; Figure 4 It is a structural schematic diagram of another embodiment of the high-speed daughter card in the connection assembly of the present invention.

[0031] The high-speed daughter card 3 includes a high-speed device 31 , a second cable 32 , a first circuit board 34 and a second fixing member 33 .

[0032] The first circuit board 34 includes a board body 342 and a ground layer 344. The first circuit board 34 has a first signal line 341. A barrier hole 346 is provided around the periphery of the first signal line 341. The barrier hole 346 is arranged around the outer circle of the first signal line 341 with the first signal line 341 as the center. The inner wall of the barrier hole 346 is connected to the ground layer 344 of the first circuit board 34. The second fixing member 33 and the high-speed device 31 are welded on the side of the first circuit board 34 with the ground layer 344. The inner wall of the barrier hole 346 is connected to the ground layer 344 because there are many electromagnetic fields in the external space (such as induction cookers, chargers, etc.). The metal layer on the inner wall of the metallized barrier hole 346 will induce electric charge and secondary magnetic field in the electromagnetic field, affecting the signal transmitted on the first signal line 341. After being connected to the ground layer 344, the metal layer will not be affected by the electric charge and secondary magnetic field when it is connected to the ground layer 344, thereby ensuring the integrity of the high-speed signal in the first signal line 341. The first circuit board 34 is a high-speed PCB board.

[0033] The second cable 32 and the second fixing member 33, the second fixing member 33 is located on one side of the first circuit board 34, and has a second through hole 331 corresponding to the position of the first signal line 341 in the first circuit board 34 and matching the diameter of the second cable 32. The second cable 32 is inserted into the second through hole 331 from the side of the second fixing member 33 away from the first circuit board 34 and fixed by the second fixing member 33, and the end of the second cable 32 inserted into the second through hole 331 is connected to one end of the first signal line 341 in the first circuit board 34, and the other end of the first signal line 341 on the first circuit board 34 is connected to the high-speed device 31. In this embodiment, the material of the second fixing member 33 is a metal plate, which can be a rectangular metal plate or a circular metal plate, as long as it can play the role of fixing the second cable 32, and the specific shape is not limited. The second cable 32 includes a central conductor 324 and a dielectric layer 323, a shielding layer 322 and a protective layer 321 that wrap the central conductor 324 in sequence. In this embodiment, the second cable 32 is divided into a first part and a second part, wherein the first part is a part inserted into the second through hole 331, and the second part is a part outside the second through hole 331. In this embodiment, in order to ensure good electrical conductivity between the shielding layer 322 and the second fixing member 33, the second through hole 331 needs to be in contact with the shielding layer 322, that is, when the first part of the second cable 32 is inserted into the second through hole 331, the protective layer 321 of the first part is removed to expose the shielding layer 322. In order to improve the firmness between the second cable 32 and the second fixing member 33, the inner diameter of the second through hole 331 matches the outer diameter of the shielding layer 322 (such as Figure 3 ).

[0034] In another optional embodiment, the high-speed daughter card 4 further includes a second circuit board 45, the second circuit board 45 has a second signal line 451, the second circuit board 45 is connected to the side of the first circuit board 451 away from the high-speed device 41, and a plurality of first circuit boards 451 are arranged on the second circuit board 45, and the second signal line 451 is respectively connected to different first circuit boards 44; thereby realizing the transmission of high-speed signals between different high-speed devices 41 in the high-speed daughter card 4 (such as Figure 4 ). The second circuit board 45 is a low-speed board. The first signal line 441 and the second cable 42 transmit high-speed signals between high-speed devices 41, and the second signal line 451 transmits low-speed signals between high-speed devices 41.

[0035] See also Figure 5 , Figure 5 This is a flow chart of an embodiment of a method for manufacturing a connection component of the present application.

[0036] S51: Provide a plurality of first cables, a first fixing plate, a back plate, and connectors used in conjunction with the first cables.

[0037] Specifically, the first cable is a coaxial cable, which specifically includes a central conductor and a dielectric layer wrapping the central conductor, a shielding layer wrapping the dielectric layer, and a protective layer wrapping the shielding layer, and the shielding layer is a metal shielding layer. In this embodiment, a signal pin is provided in the middle of the connector, and the signal pin is exposed on a surface of the connector. The back plate has a via and a ground layer, and the first fixing plate has a first through hole.

[0038] S52: Fix the first cable on the first fixing plate through the first through hole so that one end of the first cable is exposed on the surface of the first fixing plate.

[0039] The outer protective layer of one end of the first cable is removed to expose the shielding layer of the first cable; the end of the first cable exposed from the shielding layer is inserted into the first through hole and flush with the first surface of the first fixing member; conductive glue is provided around the first cable on the second surface of the first fixing member to fix the first cable in the first fixing member; the first cable on the first surface of the first fixing member is ground to make it flat.

[0040] Specifically, in order to ensure good electrical conductivity between the shielding layer of the first cable and the first fixing piece, the protective layer at one end of the first cable is removed to expose the shielding layer, and then the end without the protective layer is inserted into the first through hole to make the shielding layer contact the first fixing piece; since the first cable needs to be fixed to the connector after being inserted into the first through hole and connected to the signal pin in the connector, the first cable needs to be flush with a surface of the first fixing piece after being inserted into the first through hole and cannot be recessed in the first through hole; in order to strengthen the fixation between the first cable and the first fixing piece and prevent the first cable from falling off, when the first cable is inserted into the first through hole, After the first cable is inserted into the first through hole, the first cable is fixed around the first through hole by using conductive glue or high-temperature solder on the side of the first fixing piece close to the cable. In another embodiment, a layer of conductive glue can be applied on the shielding layer first, and then the first cable is fixed around the first through hole by using conductive glue or high-temperature solder after the first cable is inserted into the second through hole. In order to ensure the flatness of the connecting surface between the first fixing piece and the connecting piece, after the first cable is fixed to the first fixing piece, it is necessary to grind one end of the first cable inserted into the first through hole so that it is flush with one surface of the first fixing piece. It should be noted that the center conductor of the first cable needs to be fully exposed during the grinding process.

[0041] In this embodiment, in order to prevent the electromagnetic waves generated by the signal transmission of the first cable from affecting the signal, it is necessary to ensure good electrical conductivity between the shielding layer of the first cable and the first fixing member, so the inner diameter of the first through hole needs to match the outer diameter of the shielding layer of the first cable.

[0042] S53: Connect the connector to the backplane so that the signal pin is inserted into the via hole.

[0043] Specifically, a shielding hole is opened on the backplane, and the shielding hole is arranged in the outer circle of the through hole with the through hole as the center; the inner wall of the shielding hole is metalized, so that the metalized inner wall of the shielding hole is connected to the ground layer on the backplane. The two surfaces of the backplane are gold-plated, so that gold forms a ground layer on the backplane, and the ground layers on the upper and lower surfaces of the backplane are used as pads, and the ground layer is connected to the metalized inner wall of the shielding hole. Among them, the surface of the backplane between the through hole and the shielding hole is not gold-plated. The connector is arranged above the backplane, and the surface of the connector with the exposed end of the signal needle is close to the backplane, and the signal needle exposed on the surface of the connector is inserted into the through hole of the backplane, so that the surface of the connector is welded to one surface of the backplane. After the signal needle is inserted into the through hole in the backplane, one end of the signal needle inserted into the through hole is ground so that the end of the signal needle is flush with the surface of the backplane away from the connector.

[0044] In another optional embodiment, after the signal needle is inserted into the via hole, the gap of the via hole is filled with conductive metal, and the conductive metal fills the via hole so that the conductive metal is connected to the inner wall of the via hole and the outer wall of the signal needle, and the filled conductive metal is flush with the end face of the signal needle in the via hole.

[0045] S54: Connecting the surface of the first fixing member where the first cable end face is exposed to the surface of the back plate away from the connecting member.

[0046] Specifically, the surface of the exposed end face of the first cable of the first fixing member is oriented toward the backplane, so that the center conductor of the exposed end of the first cable corresponds to the position of the signal pin in the via hole on the backplane, and the first fixing member fixed with the first cable can be welded to the surface of the backplane away from the connector by soldering.

[0047] S55: Fix the high-speed daughter card on the surface of the connector at the other end of the middle signal pin, so that the signal pin is connected to the high-speed daughter card.

[0048] Specifically, the high-speed daughter card is crimped and fixed on the connector. It should be noted that during the crimping and fixing, the high-speed daughter card is butted against the end of the connector where the signal pin is away from the backplane.

[0049] In another optional embodiment, the connector may also include a first connector and a second connector, the second connector having a second signal pin, and the second signal pin is exposed on a surface of the second connector, the diameter of the second signal pin is smaller than the via hole, the first connector having a first signal pin, and the first signal pin is exposed on a surface of the first connector. One end of the exposed second signal pin in the second connector is inserted into the via hole of the backplane, the first connector is fixedly crimped with the high-speed daughter card, one end of the first signal line is connected to the high-speed daughter card, the other end surface of the exposed first signal pin of the first connector is connected to the surface of the second connector away from the backplane, and it should be noted that the other end of the first signal pin is connected to the second signal pin. The high-speed daughter card is fixedly connected to the backplane through the first connector and the second connector.

[0050] A method for manufacturing a connection component is provided in this embodiment, in which a signal pin on the connection component is plugged into and matched with a via on the backplane, so that the signal on the signal pin can be transmitted at high speed through a first cable; the first cable is connected to the signal pin in the connection component through a first fixing member in the connection component. Since the first cable of the present application is connected through the first fixing member, it can prevent the cables from falling off when the number of cables is large. In addition, since the first fixing member of the present application has a simple structure, compared with the traditional dedicated connector, it can reduce the manufacturing cost and improve the application reliability.

[0051] See also Figure 6 , Figure 6 This is a flow chart of an embodiment of a method for manufacturing a high-speed daughter card in a connection assembly of the present application. This embodiment is a method for manufacturing a high-speed daughter card connection structure in the above embodiment.

[0052] S61: Provide a plurality of second cables, a second fixing board, a first circuit board, a second circuit board and high-speed devices.

[0053] Specifically, the second cable has the same structure as the first cable but different sizes. The second cable is a coaxial cable, specifically including a central conductor and a dielectric layer wrapping the central conductor, a shielding layer wrapping the dielectric layer and a protective layer wrapping the shielding layer, and the shielding layer is a metal shielding layer.

[0054] In this embodiment, the first circuit board has a first signal line, and both ends of the first signal line are exposed on the surface of the first circuit board. The first circuit board has a ground layer, and the first circuit board is a high-speed board, the second circuit board is a low-speed board, the second circuit board has a second signal line, and the second fixing plate has a second through hole.

[0055] S62: Disposing a first signal line and a barrier hole in the first circuit board.

[0056] Specifically, a channel is provided in the first circuit board, and the two ends of the channel are on the surface of the first circuit board. The inner wall of the channel is metallized, and the metallized inner wall of the channel is connected to the two ends of the channel to form a hollow first signal line. A barrier hole is provided on the periphery of the first signal line, and the barrier hole is arranged around the outer ring of the first signal line with the first signal line as the axis. The barrier hole is metallized, and the metallized shielding hole is connected to the ground layer in the first circuit board. The upper and lower surfaces of the first circuit board are gold-plated to form a ground layer on the upper and lower surfaces of the first circuit board. The ground layers on the upper and lower surfaces of the first circuit board can be used as pads, and the ground layer is connected to the end of the barrier hole. The surface of the first circuit board between the end of the channel and the barrier hole is not gold-plated.

[0057] In another optional embodiment, in order to further ensure that the first signal line in the first circuit board can conduct the two ends of the channel, the metallized channel can be filled with conductive metal so that the conductive metal fills the through hole, and the conductive metal at both ends of the through hole is flush with the surface of the first circuit board to form a solid first signal line.

[0058] S63: Fix the second cable on the second fixing plate through the second through hole so that one end of the second cable is exposed on the surface of the second fixing plate.

[0059] The outer protective layer of one end of the second cable is removed to expose the shielding layer of the second cable; the end of the second cable exposed from the shielding layer is inserted into the second through hole and flush with the first surface of the second fixing member; conductive glue is provided around the second cable on the second surface of the second fixing member to fix the second cable in the second fixing member; the second cable on the first surface of the second fixing member is ground to make it flat.

[0060] Specifically, in order to ensure good electrical conductivity between the shielding layer of the second cable and the second fixing piece, the protective layer at one end of the second cable is removed to expose the shielding layer, and then the end without the protective layer is inserted into the second through hole to make the shielding layer contact with the second fixing piece; since the second cable needs to be fixed to the first circuit board after being inserted into the second through hole, the second cable needs to be flush with a surface of the second fixing piece after being inserted into the second through hole, and cannot be recessed in the second through hole; in order to strengthen the fixation between the second cable and the second fixing piece and prevent the second cable from falling off, when the second cable is inserted into the second through hole, after the second cable is inserted into the second through hole, the second fixing piece can be inserted into the second through hole. The second cable is fixed around the second through hole by conductive glue or high-temperature solder on one side of the second fixing member close to the second cable. In another embodiment, a layer of conductive glue may be first applied on the shielding layer, and then the second cable may be fixed around the second through hole by conductive glue or high-temperature solder after being inserted into the second through hole. In order to ensure the flatness of the connection surface between the second fixing member and the first circuit board, after the second cable is fixed to the second fixing member, one end of the second cable inserted into the second through hole needs to be ground so that it is flush with one surface of the second fixing member. It should be noted that the center conductor of the second cable needs to be fully exposed during the grinding process.

[0061] In this embodiment, in order to prevent the electromagnetic waves generated by the signal transmission of the second cable from affecting the signal, it is necessary to ensure good electrical conductivity between the shielding layer of the second cable and the second fixing member, so the inner diameter of the second through hole needs to match the outer diameter of the shielding layer of the second cable.

[0062] S64: Fix the high-speed device and the second fixing member fixed with the second cable on the first circuit board respectively.

[0063] Specifically, the two ends of the first signal line on the first circuit board are arranged on the same surface of the first circuit board. The high-speed device is arranged above the first circuit board and fixed to the first circuit board by crimping, so that one end of the first signal line on the first circuit board is connected to the high-speed device. The second fixing member fixed with the second cable is arranged above the first circuit board, and the surface of the second fixing member fixed with the second cable, on which the end of the second cable is exposed, is directed toward the first circuit board, so that the center conductor of the exposed end of the second cable corresponds to the end position of the first signal line on the first circuit board, and the first fixing member fixed with the second cable can be welded to the ground layer of the second circuit board by soldering. Multiple high-speed devices are connected through the second cable to realize the transmission of high-speed signals.

[0064] In another optional embodiment, the first signal line on the first circuit board runs through the first circuit board, and the two ends of the first signal line are respectively arranged on the upper and lower surfaces of the first circuit board. The high-speed device is arranged above the first circuit board and fixed to the first circuit board by crimping, so that one end of the first signal line on the first circuit board is connected to the high-speed device. The surface of the second fixing member on which the second cable is fixed, where the end of the second cable is exposed, is directed toward the bottom surface of the first circuit board, so that the center conductor of the exposed end of the second cable corresponds to the end position of the first signal line on the first circuit board, and the first fixing member on which the second cable is fixed can be soldered to the ground layer of the second circuit board away from the high-speed device by soldering.

[0065] S65: Connect the plurality of first circuit boards to the second circuit board.

[0066] Specifically, the first circuit board is arranged above the second circuit board, and the first circuit board is fixed to the second circuit board by welding. It should be noted that the two ends of the second signal line in the second circuit board are connected to the two first circuit boards respectively.

[0067] The manufacturing method of the high-speed daughter card provided in this embodiment fixes the second cable by a second fixing member, and then welds and fixes the high-speed device and the second fixing member fixed with the second cable to the first circuit board, and finally fixes multiple first circuit boards to the second circuit board by welding, so as to connect the high-speed device through the second cable to transmit the high-speed signal between each high-speed device, connect and support each first circuit board through the second circuit board, and then connect each high-speed device to transmit the low-speed signal between each high-speed device, and fix the second cable to the first circuit board by the second fixing member, thereby increasing the connection strength between the cable and the first circuit board, so that the cable will not fall off the first circuit board, and the structure is simple, cost-saving and feasible.

[0068] The above description is only an implementation mode of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A connection assembly, characterized in that: The connection component includes: a high-speed daughter card, A connector, wherein the connector has a signal pin, one side of the connector is fixedly connected to the high-speed daughter card, and the signal pin is connected to the high-speed daughter card; A backplane, the backplane is arranged on a side of the connector away from the high-speed daughter card, the backplane comprises a board body and a ground layer, a via hole and a shielding hole are formed on the board body, the shielding hole is arranged on an outer layer of the via hole, the ground layer is arranged on two opposite sides of the board body and connected to the shielding hole; the high-speed daughter card is arranged vertically relative to the backplane; A plurality of first cables and a first fixing member, wherein the first fixing member is located at one side of the back plate and has a first through hole corresponding to the position of the through hole in the back plate and matching the diameter of the first cable; Among them, the first cable is fixed on the first fixing part, one end of the first cable is exposed on the surface of the first fixing part, and the exposed end of the first cable is connected to the signal pin, the side of the connecting part away from the high-speed daughter card is in contact with or connected to the side surface of the backplane where the ground layer is set, and the signal pin is inserted in the via.

2. The connection assembly according to claim 1, characterized in that: The connecting member includes a first connecting member and a second connecting member, The first connector has a first signal pin therein, both ends of the first signal pin are exposed on the surface of the first connector, and the surface of the first connector where one end of the first signal pin is exposed is fixedly connected to the high-speed daughter card; The second connecting member has a second signal needle in the second connecting member, one end of the second signal needle is exposed on one surface of the second connecting member, and the other end of the second signal needle protrudes from the other surface of the second connecting member; Among them, the surface of the second connecting member exposing the second signal pin is connected to or in conflict with the surface of the first connecting member exposing the first signal pin, the surface of the second connecting member protruding the second signal pin is fixedly connected to the side surface of the backplane provided with the ground layer, the protruding end of the second signal pin is inserted into the via hole, and the second signal pin is connected to the first signal pin; the other surface of the first connecting member exposing the first signal pin is connected to the high-speed daughter card, and the first signal pin is connected to the high-speed daughter card.

3. The connection assembly according to claim 1, characterized in that: A surface of the backplane close to the first fixing member has the ground layer connected to the metal layer of the side wall of the shielding hole, and the first fixing member is welded on the ground layer of the backplane to fixedly connect the center conductor of the first cable with the signal pin.

4. The connection assembly according to claim 1, characterized in that: The high-speed daughter card includes a high-speed device, a second cable, a first circuit board and a second fixing member. The first circuit board has a first signal line, a barrier hole is arranged on the periphery of the first signal line, and the second fixing member and the high-speed device are fixed on the first circuit board; The second fixing member has a second through hole corresponding to the position of the first signal line and matching the diameter of the second cable, and the second cable is fixed in the second through hole; Among them, one end of the first signal line is connected to the second cable through the second fixing member, the other end of the first signal line is connected to the high-speed device, and the first circuit board is a high-speed board.

5. The connection assembly according to claim 4, characterized in that: The high-speed daughter card also includes a second circuit board, which has a second signal line. The second circuit board is connected to a side of the first circuit board away from the high-speed device, and the second signal line is respectively connected to different first circuit boards; wherein the second circuit board is a low-speed board.

6. The connection assembly according to claim 4, characterized in that: The end surface of the second cable is flush with the end surface of the second fixing member where the second cable is exposed.

7. The connection assembly according to claim 1, characterized in that: The signal pin has a circular cross section and is inserted into the via hole and connected to a central conductor of the first cable.

8. The connection assembly according to claim 1, characterized in that: The via hole is a metallized via hole, and the inner wall of the metallized via hole clamps the signal pin inserted in the via hole.

9. The connection assembly according to claim 1, characterized in that: The end surface of the signal pin inserted into the via hole is flush with the surface of the back plate away from the connecting piece.

10. A method for manufacturing a connection assembly, characterized in that: include: Provide a plurality of first cables, a first fixing plate, a back plate, and a connector used in conjunction with the first cables, wherein the connector has a signal pin, the back plate has a via hole and a ground layer, and the first fixing plate has a first through hole; Passing the first cable through the first through hole and fixing it on the first fixing plate, so that one end of the first cable is exposed on the surface of the first fixing plate; Connecting the connector to the backplane so that the signal pin is inserted into the via hole; Connecting the surface of the first fixing member exposing the first cable end surface to the surface of the back plate away from the connecting member; The high-speed daughter card is fixed on the surface of the connector at the other end of the signal pin, so that the signal pin is connected to the high-speed daughter card; the high-speed daughter card is vertically arranged relative to the backplane.

11. The method for manufacturing a connection assembly according to claim 10, characterized in that: The step of passing the first cable through the first through hole and fixing it on the first fixing plate so that one end of the first cable is exposed on the surface of the first fixing plate specifically includes: Removing the outer protective layer of one end of the first cable to expose the shielding layer of the first cable; Inserting the end of the first cable with the shielding layer exposed therefrom into the first through hole and flushing it with the first surface of the first fixing member; Conductive glue is provided around the first cable on the second surface of the first fixing member to fix the first cable in the first fixing member; The first cable on the first surface of the first fixing member is ground to make the end surface thereof flat.

12. The method for manufacturing a connection assembly according to claim 10, characterized in that: The connecting member includes a first connecting member and a second connecting member, the second connecting member includes a second signal needle, and the second signal needle is exposed on a surface of the second connecting member, the diameter of the second signal needle is smaller than the via hole, the first connecting member includes a first signal needle, and the first signal needle is exposed on a surface of the first connecting member, The specific steps of connecting the connecting member to the backplane so that the signal pin is inserted into the via hole include: A shielding hole is provided on the back plate, wherein the shielding hole is arranged at the periphery of the via hole; Metallizing the inner wall of the shielding hole, and connecting the metallized inner wall of the shielding hole to the ground layer on the backplane; The second connecting member is arranged above the back plate, and the second signal pin is inserted into the via hole; The step of fixing the high-speed daughter card on the surface of the connector at the other end of the signal pin to connect the signal pin to the high-speed daughter card specifically includes: Press-connect the high-speed daughter card with the first connector to fix the high-speed daughter card on the first connector, and connect the high-speed daughter card with one end of the first signal pin; The first connecting member is plugged into the second connecting member to connect the other end of the first signal pin to the second signal pin.

13. The method for manufacturing a connection assembly according to claim 12, characterized in that: After the step of arranging the second connecting member above the back plate and inserting the second signal pin into the via hole, the step further includes: Filling the via hole in which the second signal needle is inserted with metal, and making the metal fill up the via hole.

14. The method for manufacturing a connection assembly according to claim 10, characterized in that: The step of connecting the surface of the first fixing member that exposes the first cable end surface to the surface of the backplane away from the connecting member specifically includes: Grinding a surface of the via away from the connector to make the tip of the signal pin visible; The first fixing member is disposed below the back plate, and one end of the first cable inserted into the first through hole is connected to the signal pin in the back plate.

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