Integrated tool lift

Abstract

A semiconductor processing tool is provided, comprising: an upper support frame; a plurality of semiconductor processing chambers arranged along a first axis; a linear guide system fixedly supported by the upper support frame and extending along a second axis substantially parallel to the first axis; and a carrier. Each processing chamber has a base fixedly mounted relative to the upper support frame and has a removable upper cover including one or more lifting features. The carrier includes a lifting arm configured to pivot about a vertical axis substantially perpendicular to the second axis, and the carrier is configured to movably engage the linear guide system and translate relative to the linear guide system along the second axis. The carrier and the lifting arm are both movable so that the lifting feature engagement interface of the lifting arm can be moved to engage with the lifting feature of any of the removable upper covers.

Description

[0001] Incorporated by Reference

[0002] The PCT application form is filed concurrently with this specification as a part of this application. Each application to which this application claims the benefit or priority as identified in the concurrently filed PCT application form is incorporated herein by reference in its entirety and for all purposes. Background Art

[0003] Many semiconductor processing tools have large and bulky components that are removed during maintenance, servicing and repair. Summary of the invention

[0004] The novel apparatus and systems described herein are configured to move components of semiconductor processing tools for maintenance, servicing, and repair. These tools may have multiple semiconductor processing chambers that are mounted directly or indirectly on a support frame of the tool and arranged side by side in a linear array. Although conventional lifting equipment such as a crane or forklift that is separate from the tool and fully supported by the floor is traditionally used to lift and move many components of the semiconductor processing chambers, some of the tools described herein have a lifting system integrated into the tool itself to move removable components. In some implementations, the lifting system may include a linear guide system that is mounted directly or indirectly to the support frame and extends along a linear array of semiconductor processing chambers. A mobile carrier is connected to and supported by the linear guide system and has a mobile lifting arm that can connect to, lift, and move components of any semiconductor processing chamber; the carrier and its lifting arm can move along the linear guide system so that the lifting arm can connect to and move removable components of any semiconductor processing chamber. The lifting arm and the removable component have complementary connection features that allow the lifting arm to connect to and lift the removable component. When the carrier lifts the removable component, its weight is fully transferred to the support frame through the lifting arm, the carrier and the linear guide system. In some embodiments, the carrier can be suspended from the linear guide system, for example, below the linear guide system or to the side of the linear guide system.

[0005] In some implementations, a person can move the carriage along the linear guide system and can also move the lifting arm to a position to connect with the removable component. In some such implementations, various aspects of the carriage can be driven by a motor, such as a lifting mechanism on the carriage for raising and lowering the lifting arm. In some other embodiments, a motor and other movement mechanism can move the carriage along the linear guide system and / or move the lifting arm horizontally and / or vertically. A controller having a processor and a memory can control the movement of the carriage and the lifting arm.

[0006] In some alternative embodiments, the tool may have a lift system that is different from the carrier and linear guide system. In these alternative embodiments, a removable lift system is used, which is connected to one or more attachment points, which in turn are connected to a support frame. The removable lift system is positioned on and supported by the floor, and has vertical members connected to attachment points on the support frame to provide lateral support for the vertical members. The removable lift system also includes a lift arm that is movably connected to the vertical members, and once the vertical members are connected to the one or more attachment points, the lift arm can be connected to and lift a removable component from one of the semiconductor processing chambers. In some embodiments, once the removable lift system is connected to the one or more attachment points, it is fixed except for its lift arm, while in some other embodiments, the removable lift system and the attachment points to which it is connected can be moved simultaneously along the array of semiconductor processing chambers.

[0007] In some embodiments, a semiconductor processing tool may be provided. The semiconductor processing tool may include: an upper support frame; a first plurality of semiconductor processing chambers arranged along a first axis; a first linear guide system fixedly supported by the upper support frame and extending along a second axis substantially parallel to the first axis; and a first carrier. Each semiconductor processing chamber may have a base fixedly mounted relative to the upper support frame and may have a removable upper cover including one or more lifting features, the first carrier may include a first lifting arm including one or more connecting rods, the first lifting arm may be configured to pivot about a vertical axis, the vertical axis being substantially perpendicular to the second axis, the first carrier may be configured to be movably engaged with the first linear guide system and to translate along the second axis relative to the first linear guide system, the first lifting arm may include a lifting feature engagement interface, the lifting feature engagement interface being configured to engage with the lifting feature of any one of the removable upper covers of the first plurality of semiconductor processing chambers, and the first carrier and the first lifting arm may both be movable so that the lifting feature engagement interface can be moved to engage with the lifting feature of any one of the removable upper covers of the first plurality of semiconductor processing chambers.

[0008] In some embodiments, the first carrier may further include a first vertical translation system configured to vertically translate the first lifting arm relative to the first linear guide system in a direction parallel to the vertical axis.

[0009] In some such embodiments, the semiconductor processing tool may further include a power source. The first vertical translation system may include a motor configured to provide a first mechanical input to the first vertical translation system, the first mechanical input being capable of causing the first lift arm to vertically translate in a direction parallel to the vertical axis, the first carrier may further include an electrical control cable connected to the power source, disposed along the first lift arm, and terminated at a connector, each removable cover may further include an electrical interface configured to be coupled to the connector, and the length of the electrical control cable may be such that the connector and the lift feature engagement interface of the first lift arm can only be simultaneously engaged with the electrical interface and the lift feature of a single chamber in the semiconductor processing chamber at a time.

[0010] In some additional such embodiments, the semiconductor processing tool may also include a controller having one or more processors and one or more non-volatile memory devices storing instructions for controlling the one or more processors to: receive information about the operating status of each semiconductor processing chamber, and only when the information about the operating status of one of the semiconductor processing chambers indicates that the semiconductor processing chamber is under personnel safe conditions, cause a first actuation signal provided by the electrical interface of the semiconductor processing chamber to operate the first vertical translation system.

[0011] In some additional such embodiments, the semiconductor processing tool may also include: a first carrier positioning sensor configured to generate data regarding the position of the first carrier along the first linear guide system; and a controller comprising one or more processors and one or more non-volatile memory devices storing instructions for controlling the one or more processors to: determine the position of the first carrier along the first linear guide system based on the data generated by the first carrier positioning sensor, and based on the determination of the position of the first carrier, power the electrical interface of only one semiconductor processing chamber of the first plurality of semiconductor processing chambers at a time.

[0012] In some additional embodiments, the semiconductor processing tool may also include an arm position sensor, which is configured to generate data about the position of the first lifting arm relative to the semiconductor processing chamber in the first plurality of semiconductor processing chambers, and the one or more non-temporary memory devices store further instructions for controlling the one or more processors to: determine the position of the lifting arm for each of the semiconductor processing chambers in the first plurality of semiconductor processing chambers based on the data generated by the arm position sensor, and based on the determination of the position of the lifting arm and the determination of the position of the first carrier, only power the electrical interface of the semiconductor processing chamber in the first plurality of semiconductor processing chambers that is closest to the lifting feature engagement interface of the first lifting arm.

[0013] In some additional embodiments, the one or more non-transitory memory devices may store further instructions for controlling the one or more processors to cause the first lifting arm to move only on a first side of a vertical plane that passes through the first carrier, is parallel to the vertical axis and is perpendicular to the second axis.

[0014] In some additional embodiments, the semiconductor processing tool may also include: an engagement sensor configured to generate data regarding whether the lifting feature engagement interface of the first lifting arm is engaged with the lifting feature of one of the removable upper covers, and a controller comprising one or more processors and one or more non-temporary memory devices storing instructions for controlling the one or more processors to: determine whether the lifting feature engagement interface of the first lifting arm is engaged with the lifting feature of one of the removable upper covers of the first plurality of semiconductor processing chambers based on the data generated by the engagement sensor, and in response to determining that the lifting feature engagement interface is engaged with the lifting feature of one of the removable upper covers of the first plurality of semiconductor processing chambers, only power the electrical interface of the semiconductor processing chamber among the first plurality of semiconductor processing chambers that includes the removable upper cover.

[0015] In some additional embodiments, the removable cover can receive power from the power source via the cable.

[0016] In some such embodiments, the first carrier may further include a first interlock device, which is configured to: engage with the lifting feature of any one of the removable upper covers of the first plurality of semiconductor processing chambers, and prevent the first vertical translation system from vertically translating the first lifting arm when not engaging with the lifting feature of one of the removable upper covers of the first plurality of semiconductor processing chambers.

[0017] In some such embodiments, the first vertical translation system can be selected from the group consisting of: a linear ball screw actuator, a hydraulic actuator, a rack and pinion actuator, and a cable winch.

[0018] In some such embodiments, the semiconductor processing tool may also include a controller including one or more processors and one or more non-transitory memory devices. The first linear guide system may also include a carrier translation system, which is configured to translate the first carrier along the second axis, the first carrier may also include a lifting arm movement system, which is configured to move the first lifting arm in a plane perpendicular to the vertical axis, and the one or more non-transitory memory devices may store instructions for controlling the one or more processors to: cause the carrier translation system to move the first carrier along the second axis, cause the lifting arm movement system and the first vertical translation system to move the first lifting arm so that the lifting feature engagement interface engages with the lifting feature of one of the removable top covers of the first plurality of semiconductor processing chambers, when the lifting feature engagement interface engages with the lifting feature of one of the removable top covers, cause the first vertical translation system to vertically translate the removable top cover, and when the lifting feature engagement interface engages with the lifting feature of one of the removable top covers, cause the lifting arm movement system to translate the removable top cover in a plane perpendicular to the vertical axis.

[0019] In some such embodiments, the one or more non-transitory memory devices may store further instructions for controlling the one or more processors to: when the lifting feature engagement interface engages with the lifting feature of one of the removable top covers, cause the lifting arm movement system and the first vertical translation system to move the first lifting arm to disengage the lifting feature engagement interface from the lifting feature of the removable top cover.

[0020] In some additional such embodiments, the one or more non-transitory memory devices may store further instructions for controlling the one or more processors to: when the lifting feature engagement interface engages with the lifting feature of one of the removable top covers, cause the carrier translation system and the lifting arm movement system to translate the removable top cover in the plane perpendicular to the vertical axis.

[0021] In some embodiments, the semiconductor processing chambers of the first plurality of semiconductor processing chambers can all be located within a tool housing, and the first lifting arm is movable so that any of the removable upper covers of the first plurality of semiconductor processing chambers can be moved outside the tool housing.

[0022] In some embodiments, the first linear guide system may further include a first rail and a second rail that are parallel to each other and offset from each other in a direction parallel to the vertical axis, and the first carrier may be configured to simultaneously engage with the first rail and the second rail and translate along the second axis relative to the first linear guide system while simultaneously engaging with the first rail and the second rail.

[0023] In some such embodiments, the first carrier may further include a first vertical translation system configured to vertically translate the first lift arm relative to the first linear guide system in a direction parallel to the vertical axis below the first linear guide system and above the bases of the first plurality of semiconductor processing chambers.

[0024] In some embodiments, the first vertical translation system may be further configured to vertically translate the first lifting arm over the first linear guide system.

[0025] In some embodiments, the first linear guide system can be vertically offset above the first plurality of semiconductor processing chambers in a direction parallel to the vertical axis, and the first carrier can be vertically offset below the first linear guide system.

[0026] In some embodiments, the lift feature engagement interface may be connected to the distal end of the first lift arm using a joint configured to allow the lift feature engagement interface to rotate about two or more axes perpendicular to the vertical axis.

[0027] In some such embodiments, the joint may be a spherical joint.

[0028] In some such embodiments, the joint may be further configured to allow the lift feature engagement interface to rotate about an axis parallel to the vertical axis.

[0029] In some embodiments, the lifting features of each removable upper cover may include a pair of saddle posts, each saddle post may include a pair of vertical lifting rods and a saddle plate spanning between and covering the vertical lifting rods, each saddle plate may include a first mechanical interface feature, the saddle posts of each lifting feature may be positioned so that the first mechanical interface features are spaced apart from each other by a first distance, the lifting feature joint interface may include a beam having two second mechanical interface features, the two second mechanical interface features are spaced apart by the first distance, and each first mechanical interface feature may be complementary to one of the second mechanical interface features.

[0030] In some embodiments, each of the first plurality of semiconductor processing chambers may include a removable component, which may be a radio frequency (RF) generator, a pump, and a cryogenic pump. Each removable component may include one or more second lifting features, the lifting feature engagement interface of the first lifting arm may be further configured to engage with the second lifting feature of any of the removable components of the first plurality of semiconductor processing chambers, and the first carrier and the first lifting arm may be movable so that the lifting feature engagement interface can be moved to engage with the second lifting feature of any of the removable components of the first plurality of semiconductor processing chambers.

[0031] In some embodiments, the first lift arm may include a linear section that is perpendicular to the vertical axis and that includes the lift feature engagement interface.

[0032] In some embodiments, the first lifting arm may include a pivot section in which the first lifting arm is configured to pivot about the vertical axis, and the first lifting arm may include an inclined section spanning between the pivot section and the linear section and positioned at an oblique angle relative to the vertical axis.

[0033] In some embodiments, the first plurality of semiconductor processing chambers can include two semiconductor processing chambers.

[0034] In some such embodiments, the plurality of semiconductor processing tools can include three semiconductor processing chambers.

[0035] In some additional such embodiments, the first plurality of semiconductor processing chambers may include five semiconductor processing chambers.

[0036] In some embodiments, the semiconductor processing tool may further include: a second plurality of semiconductor processing chambers configured along a third axis, the third axis being substantially parallel to and offset from the first axis; an internal area located between the first plurality of semiconductor processing chambers and the second plurality of semiconductor processing chambers; a second linear guide system fixedly supported by the upper support frame and extending along a fourth axis substantially parallel to the third axis; and a second carrier. The first linear guide system and the second linear guide system can be positioned outside the interior area, each of the second plurality of semiconductor processing chambers can have a second base fixedly mounted relative to the upper support frame and having a second removable upper cover comprising one or more second lifting features, the second carrier can include a second lifting arm having one or more connecting rods, the second lifting arm can be configured to pivot around a second vertical axis, the second vertical axis is substantially perpendicular to the fourth axis, the second carrier is configured to be movably engaged with the second linear guide system and translate along the fourth axis relative to the second linear guide system, the second lifting arm can include a second lifting feature engagement interface, the second lifting feature engagement interface is configured to engage with the second lifting feature of any second removable upper cover of the semiconductor processing chamber in the second plurality of semiconductor processing chambers, and the second carrier and the second lifting arm can both be movable so that the second lifting feature engagement interface can be moved to engage with the lifting feature of any second removable upper cover of the semiconductor processing chamber in the second plurality of semiconductor processing chambers.

[0037] In some such embodiments, the bases of the first plurality of semiconductor processing chambers, the second bases of the second plurality of semiconductor processing chambers, and the interior areas may be located within a second housing, the first lifting arm may be movable so that the removable upper covers of any of the first plurality of semiconductor processing chambers may be moved outside the second housing, and the second lifting arm may be movable so that the second removable upper covers of any of the second plurality of semiconductor processing chambers may be moved outside the second housing.

[0038] In some such embodiments, the second removable cover may be of the same type as the removable cover, the second lift feature engagement interface may be of the same type as the lift feature engagement interface, and the second lift feature may be of the same type as the lift feature.

[0039] In some embodiments, the semiconductor processing tool may further include a bellows that creates a seal at an interface of the first carrier and the first linear guide system when the first carrier is engaged with the first linear guide system.

[0040] In some embodiments, the semiconductor processing tool may also include a second carrier. The second carrier may include a second lift arm having one or more linkages, and the second lift arm is configured to pivot about a second vertical axis, the second vertical axis being perpendicular to the second axis, the second carrier may be configured to be movably engaged with the first linear guide system and to translate along the second axis relative to the first linear guide system, the second lift arm may include a second lift feature engagement interface, the second lift feature engagement interface being configured to engage with the lift feature of any one of the removable upper covers of the first plurality of semiconductor processing chambers, the second carrier and the second lift arm may both be movable so that the second lift feature engagement interface of the second lift arm can be moved to engage with the lift feature of any one of the removable upper covers of the first plurality of semiconductor processing chambers; and the first linear guide system may be further configured so that the first carrier and the second carrier can be simultaneously engaged to the first linear guide system and can move along the second axis.

[0041] In some embodiments, the removable upper cover may not be a substrate.

[0042] In some embodiments, the first lifting arm may not be configured to support a substrate.

[0043] In some embodiments, the lift feature engagement interface may not be configured to support a substrate.

[0044] In some embodiments, a semiconductor processing tool may be provided. The semiconductor processing tool may include a support frame, a first plurality of semiconductor processing chambers arranged along a first axis, a first attachment point connected to the support frame, and a first detachable lifting system. Each semiconductor processing chamber may have a base fixedly mounted relative to the support frame and having a removable upper cover including one or more lifting features, the first detachable lifting system may include a vertical member, the vertical member including a top end with a complementary attachment point and a bottom end with a moving mechanism, the complementary attachment point can be detachably connected to the first attachment point, the moving mechanism can be supported by a floor, the first detachable lifting system may further include a lifting arm connected to the vertical member and having one or more connecting rods, the lifting arm may be configured to pivot about a vertical axis, the vertical axis being substantially perpendicular to the first axis, the lifting arm may include a lifting feature engagement interface, which is configured to engage with the lifting feature of any removable upper cover of the first plurality of semiconductor processing chambers.

[0045] In some embodiments, the first detachable lifting system may further include a vertical translation system configured to vertically translate the lifting arm relative to the support frame in a direction parallel to the vertical axis.

[0046] In some such embodiments, the first vertical translation system includes a motor configured to provide a first mechanical input to the first vertical translation system, wherein the first mechanical input causes the lifting arm to translate along the vertical member.

[0047] In some such embodiments, the first vertical translation system may move along the vertical member with the lifting arm as a unit.

[0048] In some embodiments, the movement mechanism may include foldable wheels.

[0049] In some embodiments, a semiconductor processing tool may be provided. The semiconductor processing tool may include a support frame having an upper attachment point and a lower attachment point vertically offset below the upper attachment point; a first plurality of semiconductor processing chambers arranged along a first axis; and a removable lift system. Each semiconductor processing chamber may have a base fixedly mounted relative to the support frame and having a removable component including one or more lifting features, the removable lift system may include a vertical member including a top end having an elevated attachment point, a bottom end having a bottom attachment point, and a movement mechanism, the elevated attachment point being removably connected to the upper attachment point, the bottom attachment point being removably connected to the lower attachment point, the removable lift system may further include a lift arm having one or more linkages and configured to pivot about a vertical axis substantially perpendicular to the first axis, and a vertical translation system configured to vertically translate the lift arm relative to the support frame in a direction parallel to the vertical axis. The lift arm may include a lift feature engagement interface configured to engage a lift feature of any removable component of the first plurality of semiconductor processing chambers.

[0050] In some embodiments, the vertical translation system includes a motor configured to provide a first mechanical input to the first vertical translation system, wherein the first mechanical input causes the lifting arm to translate in a direction parallel to the vertical axis.

[0051] In some such embodiments, the semiconductor processing tool may further include a power source. The removable lift system may further include an electrical control cable connected to the power source, arranged along the lift arm, and terminated at the connector, each removable component may further include an electrical interface configured to be connected to the connector, and the length of the electrical control cable may be such that the connector and the lift feature engagement interface of the lift arm can only be simultaneously engaged with the electrical interface and lift feature of a single processing chamber in the semiconductor processing chamber at a time.

[0052] In some further such embodiments, the semiconductor processing tool may also include a controller having one or more processors and one or more non-volatile memory devices storing instructions for controlling the one or more processors to: receive information about the operating status of each semiconductor processing chamber, and only when the information about the operating status of one of the semiconductor processing chambers indicates that the semiconductor processing chamber is under personnel safe conditions, cause a first actuation signal provided by the electrical interface of the semiconductor processing chamber to operate the vertical translation system.

[0053] In some further such embodiments, the removable component may receive power from a power source via a cable.

[0054] In some such embodiments, the vertical translation system may be a linear ball screw actuator, a hydraulic actuator, a rack and pinion actuator, or a cable winch.

[0055] In some such embodiments, the removable lift system further includes a first interlock device configured to engage with a lift feature of any removable component of the first plurality of semiconductor processing chambers and to prevent the first vertical translation system from vertically translating the first lift arm when not engaged with a lift feature of one of the removable components of the first plurality of semiconductor processing chambers.

[0056] In some embodiments, the movement mechanism may include four wheels.

[0057] In some embodiments, the movement mechanism may include a foldable set of wheels.

[0058] In some embodiments, the first vertical translation system may be configured to move along the vertical member with the lifting arm as a unit.

[0059] In some such embodiments, the vertical member may further include a slide rail along which the first vertical translation system is configured to move.

[0060] In some embodiments, when the movement mechanism is connected to the lower attachment point and the upper attachment point, the movement mechanism may not be supported by the floor.

[0061] In some embodiments, the movement mechanism can be supported by the floor when the movement mechanism is connected to the lower attachment point and the upper attachment point.

[0062] In some embodiments, the lower attachment point can be vertically offset below the base of the plurality of processing chambers.

[0063] In some embodiments, the support frame may further include a plurality of upper attachment points, the tool may further include a plurality of lower attachment points offset below the plurality of upper attachment points, the plurality of semiconductor processing chambers may include N processing chambers, the plurality of upper attachment points may include N-1 upper attachment points, and the plurality of lower attachment points may include N-1 lower attachment points.

[0064] In some embodiments, the lifting arm may further include three or more links, a double shoulder joint, and a double elbow joint.

[0065] In some embodiments, the removable component may not be a substrate.

[0066] In some embodiments, the lift arm may not be configured to support a substrate.

[0067] In some such embodiments, the lift feature engagement interface may not be configured to support a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] The various embodiments disclosed herein are illustrated by way of example and not limitation and in the accompanying drawings, like references refer to like elements.

[0069] Figure 1 Depicted is a top schematic view of an exemplary semiconductor processing tool including two sets of a plurality of semiconductor processing chambers.

[0070] Figure 2 Depicted Figure 1 A perspective view of a first example portion of an exemplary semiconductor processing tool.

[0071] Figure 3 Depicted Figure 2 Detailed perspective view of a portion of an exemplary semiconductor tool.

[0072] Figure 4A Depicted Figure 3 a cross-sectional view of a portion of an exemplary first lifting arm, Figure 4B Description Figure 3 An off-angle view of an exemplary removable cover.

[0073] Figure 5 Depicted Figure 3 Same detailed perspective view of that portion of the tool.

[0074] Figures 6A-6E Depicted Figure 2 A sequence of movement of example removable components of a first example portion of an example semiconductor tool.

[0075] Figure 7 An exemplary lifting arm is depicted.

[0076] Figure 8 Depicted Figure 1 A perspective view of a second alternative example portion of a tool schematic.

[0077] Fig. 9 Depicted Figure 8 The enlarged part.

[0078] Fig.10 Shows something like Figures 6A-6E An exemplary tool having two first carriers engaged with a linear guide system.

[0079] Fig.11 Depicts a top view of an exemplary semiconductor processing tool similar to Figure 1 but with additional details and features shown.

[0080] Fig.12 Depicted Fig. 6E A top view of a semiconductor processing tool of the type shown in FIG. 1 but with additional features shown.

[0081] Fig.13 A block diagram of a portion of an exemplary semiconductor processing tool 1200 is depicted.

[0082] Fig.14 Another exemplary semiconductor processing tool is depicted.

[0083] Fig.15A and 15B Depicted Fig.14 0014] A side view of another exemplary semiconductor processing tool and a first exemplary detachable lift system.

[0084] Fig.16 A perspective view of a second exemplary detachable lift system is depicted.

[0085] Fig.17 Yet another exemplary semiconductor processing tool is depicted.

[0086] Fig.18A and Fig.18B Describes the tools and Fig.16 and Fig.17 Side view of the attachment sequence between a second exemplary detachable lifting system.

[0087] Fig.19 Depicts connection to Figure 17-18B A perspective view of a second exemplary detachable lifting system for a tool.

[0088] Fig. 20A and20B Depicted is a sequence of movement of an example of removable components performed by a second example removable lift system.

[0089] Fig.21 Depicted Fig.16

[0026] Another configuration of a second exemplary detachable lifting system.

[0090] Specific implementation plan

[0091] In the following description, many specific details are set forth in order to provide a thorough understanding of the proposed embodiments. The embodiments of the present disclosure may be practiced without some or all of these specific details. In other cases, well-known processing steps and / or structures are not described in detail to avoid unnecessarily obscuring the embodiments of the present disclosure. Although the disclosed embodiments are described in conjunction with specific embodiments, it should be understood that this is not intended to limit the disclosed embodiments.

[0092] Semiconductor processing tools typically have at least one processing chamber in which one or more substrates are processed and other components capable of performing the processing. Exemplary substrate processing includes depositing materials on substrates using chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD) and atomic layer deposition (ALD), and patterning and etching various materials (including conductors, semiconductors and dielectric layers) using, for example, atomic layer etching (ALE). In this application, the terms "semiconductor wafer", "wafer", "substrate", "wafer substrate" and "partially manufactured integrated circuit" are used interchangeably. For example, the operation of depositing a film on a semiconductor substrate can be performed in a substrate processing device, which is a processing chamber with a single substrate holder, which is located in an internal volume maintained by a vacuum pump. The substrate holder (e.g., a susceptor) can have a heating element to heat the susceptor and the substrate. A gas delivery system and a showerhead fluid are also coupled to the processing chamber to deliver (for example) film precursors, carriers and / or sweep and / or processing gases, secondary reactants, etc. Means for generating a plasma within the processing chamber may also be included in the apparatus, such as an RF power supply and a matching network for supplying power to the plasma. The plasma energy may be controlled (e.g., via a system controller having appropriate machine-readable instructions) by controlling one or more of the processing station pressure, gas concentration, RF source power, RF source frequency, and plasma power pulse timing. The RF power supply may provide RF power of any suitable frequency, and may be configured as high-frequency and low-frequency RF power sources that are independently controlled from one another, and may include frequencies between 50 kHz and 500 kHz and between 1.8 MHz and 2.45 GHz.

[0093] Although many substrate processing equipment uses a single processing chamber, when it comes to time-consuming film deposition operations, it may be advantageous to increase substrate processing output by performing multiple substrate operations in parallel on multiple substrates. To this end, a multi-station substrate processing equipment may have a single substrate processing chamber containing multiple substrate processing stations, which are located in a single internal volume defined by the walls of the processing chamber. Some other multi-station substrate processing equipment may have multiple processing chambers, sometimes referred to as "cluster tools". A cluster tool may have a processing chamber containing multiple stations, such as 2, 3 or 4 stations in each processing chamber. Similarly, a cluster tool may have 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15 or 16 or more processing chambers.

[0094] In terms of equipment cost and operating expenses, various efficiencies can also be achieved by using tools (i.e., cluster tools) including multiple chambers. For example, a single vacuum pump can be used to create a single high vacuum environment for two or more processing chambers, and can also be used to evacuate used processing gases, etc. for the two or more chambers. Depending on the embodiment, the processing chambers can share the same gas delivery system, and certain elements of the plasma generator equipment can be shared between the processing chambers (e.g., power supplies). In some cluster tools, multiple processing chambers are connected to a wafer conveying system and other components for performing deposition, etching, or other operations, such as vacuum pumps and gas delivery systems. The wafer conveying system may include a robotic arm with one or more end effectors, which is configured to pick up and convey wafers in the tool, including conveying wafers in and out of the processing chambers and in and out of wafer boxes (e.g., cassettes or front-opening wafer boxes (FOUPs)). A single cluster tool may be able to perform multiple processes simultaneously in multiple chambers while sharing some operating systems such as gas delivery systems or generators.

[0095] Various efficiencies such as space and throughput can also be obtained by using cluster tools. Generally speaking, multiple cluster tools are located on the floor of a semiconductor manufacturing plant or wafer factory (Fab). However, the positioning of the tools on the floor relative to each other is subject to many restrictions, such as the electrical clearance area between the tools and the service area. The service area of ​​the tool may include the area required for performing the following operations: removing tool components (such as pumps, upper covers of processing chambers), performing maintenance on the tool, adding or replacing tool parts, areas for access to the tool, inspecting the tool, and may be defined at least in part according to ergonomics or other industry standards, such as to meet the requirements of OSHA (Occupational Safety and Health Administration); the electrical clearance area may include areas required for personal or equipment safety, and areas required to prevent electrical interference between one or more elements of adjacent tools.

[0096] The multiple chambers of each cluster tool can also be configured to maximize the number of chambers located on the Fab floor, thereby potentially achieving higher substrate processing throughput. For example, a cluster tool can be densely packed so that its components are closely positioned to each other, which results in limited space and clearance between components. Cluster tools with densely packed components pose challenges for performing tool maintenance and repair, such as limiting the ability to approach and move tool components required for countless maintenance and repair operations. For many densely packed tools, the positioning and configuration of tool components prevent traditional lifting mechanisms from approaching and moving components. For example, such access may be blocked by components that are closely mounted side by side, components that are stacked and mounted on each other, and supporting components of tools such as support frames. The tighter the configuration, the more space restrictions there are for approaching and moving tool components. In some cases, one or more components of the tool must be moved in order to allow traditional lifting mechanisms to enter and clear to connect, lift and move a component of the tool. For example, it is usually necessary to remove the upper cover of the processing chamber to inspect, repair, clean, repair and maintain the internal components of the processing chamber. For some densely packed tools, some conventional lift mechanisms cannot reach the cover without removing other components surrounding the cover (e.g., a heavy RF generator mounted above the cover). Even if there is some access to the cover, the support frame further prevents conventional lift mechanisms from reaching the cover.

[0097] Similarly, there may not be enough space above, below, or within the tool for a conventional lift mechanism to access tool components. For example, some conventional lift mechanisms are supported on long horizontal legs on the floor that can slide under the semiconductor processing tool (similar to the way a pallet lift can slide under a shipping pallet) and use one or more lift arms to perform the lift, but some tightly packed tools may not have enough space to accommodate the legs or lift arms necessary for such a mechanism to access and move removable components.

[0098] In addition, the footprint of some conventional lifts may adversely affect how close tools can be positioned to each other, i.e., the spacing distance between tools. For example, it may be desirable to space some tools a first minimum distance that provides all sufficient clearance area so that they can be placed as close together as possible and maximize the floor space of the Fab. However, some conventional lifts are moved to and supported by the floor, which may have a footprint larger than the first minimum distance. In these cases, it may be necessary to space the tools a distance greater than the first minimum distance to enable these conventional lifts to move and operate, thereby reducing the spacing efficiency of the tools on the Fab floor.

[0099] These conventional lifting mechanisms may also require additional time and labor to access and move the tool components, assuming that the tool components can even be accessed and moved at all. In addition, when other components must be moved out of the way to access a component, the movement, removal, and reinstallation of these other components may require additional realignment and recalibration of these components. This additional time and labor for routine and necessary maintenance and servicing can result in undesirable downtime of the tool. Therefore, it is desirable to have a tool with a lifting mechanism that allows easy, quick, and efficient access to tool components without expending undesirable time, labor, and tool downtime.

[0100] Described herein are novel apparatus and systems for moving components of a semiconductor processing tool or cluster tool, all of which may be referred to herein as tools. In some embodiments, features configured for moving tool components are integrated into the tool itself. Figure 1 A schematic top view of an exemplary semiconductor processing tool is depicted, the exemplary semiconductor processing tool including two sets of multiple semiconductor processing chambers. Figure 1 As can be seen, tool 100 includes a first plurality of semiconductor processing chambers 102 having five semiconductor processing chambers 104 arranged along a first axis 106, and a second plurality of semiconductor processing chambers 108 including five processing chambers 110 also arranged along an axis 112 that is substantially parallel to first axis 106. "Substantially" is used herein because in practice, the axes or other components may not be perfectly aligned; in this case substantially means that the axes may be exactly parallel to each other, but may also be, for example, within + / -10 degrees, + / -5 degrees, or + / -1 degree of parallel to each other. Although each plurality of semiconductor processing chambers includes five processing chambers, each plurality of semiconductor processing chambers may, for example, have two, three, four, five, six, or more processing chambers. Tool 100 also includes an upper support frame 114 to which a portion of each semiconductor processing chamber 104 and 110 may be fixedly mounted. When one item is "fixedly mounted" to another item, it means that the item is mounted to the other item in a fixed position relative to the other item, either directly or through one or more intermediate components (e.g., a support frame). For example, a portion of each of semiconductor processing chambers 104 and 110 is fixedly mounted to upper support frame 114 such that the portions are fixed in their respective positions relative to upper support frame 114. Other portions of semiconductor processing chamber 104 may be removable / movable relative to upper support frame 114 during normal service operations, as will be discussed further below.

[0101] As described above, tool 100 has a service area 115 surrounding its footprint in which no portion of other tools is placed; a similar service area may also exist on the opposite side of tool 100 (although not shown). Service area 115 may also be considered a separation distance from other tools, allowing personnel and equipment to move between these tools. Some tool embodiments described herein add little to the static footprint of the tool.

[0102] The tool 100 may also include a linear guide system and a carrier configured to facilitate and enable removal and movement of removable components of a semiconductor processing chamber. As discussed in more detail below, in some implementations, the linear guide system may be fixedly connected to the support frame, and the carrier may be movably connected to the linear guide system and used to movably connect to the removable components of the semiconductor processing chamber, so that the carrier translates along the linear guide system to access, connect and move the removable components of the semiconductor processing chamber.

[0103] Figure 2 Depicted Figure 1 1 is a perspective view of a first example portion of an exemplary semiconductor processing tool of FIG. Here, although a first plurality of semiconductor processing chambers 102 are indicated, for illustrative purposes, only the base 116 of each of the five semiconductor processing chambers 104 and the removable upper cover 118 of the semiconductor processing chamber 104A shown in a removed state are shown (the remaining upper covers in the other semiconductor processing chambers 104 are not shown). Each base 116 of the semiconductor processing chambers 104 can be fixedly mounted to the upper support frame 114 directly or indirectly, although the interface between each base 116 and the upper support frame 114 is not visible. The base 116 can be fixedly mounted to the upper support frame 114 by any known means, such as bolts, welding, clamps, or pins.

[0104] Figure 2 Also depicted are a first linear guide system 120 and a first carrier 122, Figure 3 106 . The first linear guide system 120 may be fixedly supported by or mounted to the upper support frame 114; this may include directly or indirectly securing or connecting the first linear guide system 120 to the upper support frame 114 such that the first linear guide system 120 is fixed in position relative to the upper support frame 114. The first linear guide system 120 may also be arranged such that it extends along a second axis 124 that is substantially parallel to the first axis 106 (substantially meaning that the axes may be exactly parallel to one another or within, for example, + / -10 degrees, + / -5 degrees, or + / -1 degree of parallel to one another).

[0105] The first carriage 122 is configured to be movably engaged with the first linear guide system 120 such that the first carriage 122 can translate along the second axis 124. This configuration can include the first linear guide system 120 supporting the first carriage 122 and having features that enable the first carriage 122 to move in and along the first linear guide system 120. For example, the first carriage 122 can have wheels or bearings that can be received by one or more tracks or grooves of the first linear guide system 120, thereby enabling the first linear guide system 120 to support the first carriage 122 and enable the first carriage 122 to move along the first linear guide system 120 and the second axis 124, such as in a rolling or sliding manner. In some embodiments, the movably engaged first carriage 122 and the first linear guide system 120 can be passive such that a person can manually move the first carriage 122 along the first linear guide system 120. In other embodiments described below, this movable engagement may be powered by a carriage translation system to propel the first carriage 122 along the first linear guide system 120 .

[0106] Figure 3 Depicted Figure 2 Detailed perspective view of a portion of an exemplary semiconductor tool of FIG. Here can be seen a partial cross-sectional view of the first linear guide system 120, the first carrier 122, and the removable upper cover 118. The first linear guide system 120 can be seen extending along the second axis 124 and comprising two tracks 126A and 126B to which the wheels or bearings of the first carrier 122 are movably engaged, such that the first linear guide system 120 supports the first carrier 122, and the first carrier 122 can move along the second axis 124, as indicated by the double-headed arrow 128.

[0107] Additional features of the first carriage 122 will now be discussed. In some implementations, the first carriage can include a first lifting arm having one or more linkages and operable to pivot about a vertical axis. Figure 3In the embodiment, the first carrier 122 includes a first lifting arm 130 having a single link 132. The first lifting arm 130 is configured to pivot about a vertical axis 134 as indicated by arrow 136, for example relative to the first linear guide system 120 or the upper support frame 114; the vertical axis 134 is substantially perpendicular to the second axis 124 (substantially perpendicular here means that the axes are substantially perpendicular or orthogonal to each other within a degree of at least + / -10 degrees, + / -5 degrees or + / -1 degree). The ability of the first lifting arm 130 to pivot enables it to be at least partially movable to a plurality of positions so as to engage with components of the semiconductor processing chamber so as to move the components. The first lifting arm 130 is also connected to the first carrier 122 so that the first lifting arm 130 moves with the first carrier 122.

[0108] The first lifting arm and the removable component are configured to be connected to each other so that the removable component can be raised, lowered, and moved while being supported by the first carrier. In some implementations, this configuration includes a first lifting arm having a lifting feature engagement interface configured to engage with a lifting feature of the removable component; engagement between the lifting feature engagement interface and the lifting feature creates a connection between the first lifting arm and the removable component and enables the removable component to be raised, lowered, and supported by the first lifting arm and the first carrier.

[0109] Some examples of suitable lift feature engagement interfaces and lift features and their physical connection to each other (i.e. engagement with each other) may be conventional lifts and connection components, such as hooks or lifting eyes, shackles, threaded connections between components, pins and holes, rotary latches, and cables, belts or chains. For example, the lift feature of the removable component may be a hook connected to the removable component, the lift feature engagement interface may be a cable connected to the first lift arm, and the engagement therebetween may be the cable and hook connected together (e.g., by bolts or screws). This connects the first lift arm to the removable component, thereby allowing the first lift arm to raise, lower and move the removable component.

[0110] In some embodiments, the lift feature engagement interface may have a first structure connected to the end of the first lift arm and a second structure for engaging a removable component of the lift feature. Figure 3As shown, the first lifting arm 130 includes a lifting feature joint interface, which is a first structure 138 (i.e., beam 138) connected to the end 140 of the first lifting arm 130; the lifting features of the removable component or removable top, removable cover 118 (in some embodiments, it can also be considered as a removable top plate or removable top) are second structures 142A and 142B. The first structure 138 can be joined with the second structures 142A and 142B in a variety of ways, such as by pins, screws, clamps or screws.

[0111] In some implementations, the lift feature engagement interface can have a mechanical feature for engaging with a complementary mechanical feature of the lift feature. Figure 4A Depicted Figure 3 Cross section of a portion of the first lifting arm example, Figure 4B Description Figure 3 An off-angle view of an example of a removable top cover. Figure 4A In FIG. 1 , the beam (i.e., the first structure 138 of the lifting feature engagement interface) includes two first mechanical interface features, depicted as holes 144A and 144B, separated by a first distance 146. These first mechanical interface features are complementary to the second mechanical interface features of the lifting feature of the removable cover 118. Figure 4B , the lifting features of the removable upper cover 118 (i.e., the second structures 142A and 142B, which may be referred to herein as saddle posts) are enclosed within the dotted lines. Each second structure includes a pair of vertical lifting rods 148A and 148B and saddle plates 150A and 150B that span between and cover each pair of vertical lifting rods 148A and 148B. Each saddle plate 150A and 150B also includes second mechanical interface features 151A and 151B (depicted as pins), and these second mechanical interface features 151A and 151B are separated by a first distance 146. Based on the construction of these features, the second mechanical interface features 151A and 151B can be inserted into the first mechanical features of the lifting feature engagement interface, i.e., the holes 144A and 144B of the beam 138, which can be regarded as an engagement between the lifting feature engagement interface and the removable component. Alternatively, the pins can be located on the lifting beams, and the holes can be located on the saddle plates.

[0112] In some embodiments, the first structure 138 of the lift feature engagement interface may include a beam and a post perpendicular to the beam, similar to one of the vertical risers 148A, which may be connected to the removable component using hooks, clamps, bolts, etc. In some such implementations, the lift feature may be a hole, threaded hole, or other connection feature that may be connected to the lift feature engagement interface.

[0113] The first carrier and the first lifting arm are also movable so that the lifting feature engagement interface can be moved and engaged with the lifting feature of any removable component. Figure 2 The mobility includes the mobility of the first carrier 122 along the second axis 124 so that it can be close to or adjacent to any semiconductor processing chamber 104 and return to the first carrier 122 along the second axis 124. Figure 3 , which includes the ability for the first lifting arm 130 to rotate about a vertical axis 134. Rotation of the first lifting arm 130 about the vertical axis 134 causes the first lifting arm 130 to move in a plane perpendicular to the vertical axis 134, as discussed in more detail below.

[0114] The mobility of the first lifting arm 130 may also include the mobility of the lifting feature engagement interface. The lifting feature engagement interface may rotate about one or more axes. Return to Figure 4A , the lifting feature interface 152 is surrounded by a dotted shape and is connected to the single link 132 of the first lifting arm at a joint 158. The vertical axis 134, the axis 160 parallel to the vertical axis, and the two other axes 154 and 156 perpendicular to the axis 160 are all in Figure 4A and 5 . The joint 158 ​​where the lift feature engagement interface 152 is connected to the link 132 of the first lift arm 130 can be configured to allow the lift feature engagement interface 152 to rotate relative to the first link 132 about the one or more axes, which in this particular example include the vertical axis 134 and two other axes 154 and 156. For example, the lift feature engagement interface 152 can rotate relative to the link 132 at the joint 158 ​​about the axis 156, but can also rotate relative to the link 132 about an axis 160 parallel to the vertical axis 134. In some cases, the joint where the lift feature engagement interface 152 is connected to the link 132 of the first lift arm 130 can be a ball joint. The ball joint can allow partial swinging about an axis parallel to the vertical axis, which can help with planar alignment. A ball joint can be advantageous because it can align the process chamber cover with the process chamber if the two are misaligned. In some cases, certain moving axes may be lockable, such as using a spring plunger, pin, screw, or clamp to prevent movement about the locking axis.

[0115] In some embodiments, the first carrier may include a vertical translation system configured to vertically translate a lift arm relative to the first linear guide system or the upper support frame. Such vertical movement of the lift arm may also enable the first carrier to engage with and raise and lower a removable component of a semiconductor processing chamber. Figure 5 In, it is shown Figure 31, the vertical translation system 162 is enclosed by the dashed shape. The vertical translation system 162 is configured to vertically translate the first lifting arm 130 along a second vertical axis parallel to the vertical axis 134, with the double arrow 164 used to illustrate such translation. Figure 4A and 4B , the vertical translation system 162 can position the lifting feature engagement interface 152 below the second mechanical interface features 151A and 151B (i.e., pins), and then move vertically upward so that the second mechanical interface features 151A and 151B are inserted into the first mechanical interface features (i.e., holes 144A and 144B), respectively, thereby engaging the lifting feature engagement interface 152 with the lifting features of the removable cover 118. Once these are engaged, the removable cover can be raised and lowered using the vertical translation system 162 without the risk of disengaging the lifting feature engagement interface 152.

[0116] The vertical translation system 162 can utilize a variety of mechanisms to vertically translate the first lifting arm 130. For example, the vertical translation system 162 can be a linear ball screw actuator, a hydraulic actuator, a rack and pinion actuator, or a cable winch. The vertical translation system 162 can also include a motor 166 configured to provide a mechanical input to the vertical translation system 162. For example, the motor 166 can provide a mechanical drive force for any actuator such as a linear ball screw actuator.

[0117] In some embodiments, the tool may include one or more bellows to seal portions of the linear guide system and the first carrier from contamination by particles and other matter generated by these movable features; these contaminants may be harmful to the substrate and other portions of the tool. The interface between the linear guide system and the first carrier may be one of these movable components that may generate contaminants, and it may be advantageous to include a bellows around the interface between the linear guide system and the first carrier to create a seal at the interface. The vertical translation system may also have bellows because this system may generate contaminants.

[0118] The first carrier, the first lifting arm, or both may also be movable so that the removable component engaged with the first lifting arm can be moved. As described above, once the lifting feature engagement interface of the first lifting arm engages with the lifting feature of the removable component, the first carrier can be used to vertically translate the removable component in a direction parallel to the vertical axis 134, such as Figure 5 In addition, the first carrier is configured such that the removable component engaged with the first lifting arm can be moved horizontally or in one or more directions within a plane perpendicular to the vertical axis 134 . Figures 6A-6E Depicted Figure 21 and 2. For illustrative purposes, these figures are Figure 2 The tools are shown in simplified top views without the upper support frame; these figures are shown parallel to Figure 3 and Figure 5 124. Here, the first linear guide system 120 includes two rails 126A and 126B and extends along the second axis 124. The first carrier 122 is movably engaged with the first linear guide system 120 so that the first carrier 122 can translate along the second axis 124. Also visible in the figure are the first plurality of semiconductor processing chambers 102, as well as the bases 116 of the semiconductor processing chambers, the first lift arm 130, the connecting rod 132, and the lift feature engagement interface 152 that engages the lift feature (i.e., the second structures 142A and 142B of the removable cover 118).

[0119] like Figures 6A-6E As shown in FIG. 1 , the first lifting arm 130 , the connecting rod 132 , the lifting feature engagement interface 152 , the first carrier 122 , and the removable upper cover 118 are all movable in a plane perpendicular to the vertical axis. Fig. 6A It can be regarded as the starting position after the lifting feature of the removable upper cover 118 is engaged with the lifting feature engagement interface 152 of the first lifting arm 130. Figure 6B , the first carrier 122 has been translated along the second axis 124 in the direction of arrow 128, and the removable cover 118 has been moved in a horizontal direction 168 that is perpendicular to the second axis 124. This movement of the removable cover 118 can be viewed as movement in a plane that is perpendicular to the vertical axis. This movement of the cover 118 can also be achieved by rotation of the lift feature engagement interface 152 relative to the connecting rod 132 (as shown by arrow 169) and by linear translation of the carrier 122 along the second axis 124, as shown by arrow 136, by rotation of the first lift arm 130 about the vertical axis (entered into the page and marked by an "X" 134). Additional movement of the removable cover 118 in the horizontal direction 168, and corresponding movement and rotation of the first lift arm 130, the lift feature engagement interface 152, the connecting rod 132, and the first carrier 122 can be further seen in Figure 6C-6E .

[0120] The removable parts can be Figures 6A-6EThe removable component that engages with the first carrier is also not limited to linear movement in the horizontal direction 168 or along the second axis 124. In some embodiments, the removable component can move such that the movement has a vector component in the horizontal direction 168 and the second axis 124, and has a rotational component in the horizontal plane (including but not limited to the horizontal direction 168 and the second axis 124) about an axis parallel to the vertical axis (as shown by arrow 136), about an axis perpendicular to the first axis, and in a horizontal plane (including but not limited to the horizontal direction 168 and the second axis 124) about an axis parallel to the vertical axis (as shown by arrow 136).

[0121] The mobility of the first carrier, the first lifting arm, or both also enables the removable component engaged with the first lifting arm to be moved outside the tool housing. Fig. 6E , the base of the first plurality of semiconductor processing chambers may be located within the housing 170, and the aforementioned movement of the first carrier 122 may allow the removable cover 118 to be moved outside the housing 170. In some cases, the removable cover 118 may be moved outside the housing 170 but into a service area around the tool 100, such as Figure 1 The housing 170 may be considered to be the overall base of the semiconductor processing chamber containing the tools.

[0122] In some embodiments, the first lifting arm may have Figure 3 The linear section can be the same as the link 132 extending between the pivot section 133 and the end 140 of the first lift arm 130 (i.e., where the lift feature engages the interface connection), the pivot section 133 being the portion of the first lift arm 130 that pivots or rotates about the vertical axis 134 (as shown by arrow 136). In some such embodiments, the first lift arm can have a linear section and an inclined section. Figure 7 An exemplary lifting arm is depicted. Here, the exemplary lifting arm includes a linear section 732 having an end 740 connected to a lifting feature engagement interface 752, and further includes an inclined section 772 spanning between the pivot section 733 and the linear section 732. The inclined section 772 is oriented at an oblique angle 774 relative to the vertical axis 134, which can be an acute angle (e.g., Figure 7The angle may be in the range of about 15 to 75 degrees, about 30 to 60 degrees, including about 45 degrees. The inclined lifting arm may be advantageous because it enables a different vertical travel than a lifting arm having only a linear section. In some embodiments, the lifting arm may include two or more links and multiple joints, such as an elbow joint and a double elbow joint.

[0123] The positioning and arrangement of the first linear guide system and the first carrier may be different, thereby affecting the mobility of the first carrier and the first lifting arm. In some embodiments, the first linear guide system can be positioned above the first plurality of semiconductor processing chambers. For example, return to reference Figure 2 , it can be seen that the first linear guide system 120 is located directly above or vertically offset above the first plurality of semiconductor processing chambers 102, and the first plurality of semiconductor processing chambers 102 are located in a direction parallel to the vertical axis 134. In some implementations, the first carrier 122 can be vertically offset below the first linear guide system 120 in a direction parallel to the vertical axis 134, such as Figure 2 In some embodiments, when viewed along a direction parallel to the second axis 124, the first carrier 122 can be viewed as being vertically inserted between the first linear guide system 120 and a portion of the first plurality of semiconductor processing chambers 102 (eg, the base 116).

[0124] The first lifting arm 130 is capable of engaging with a variety of removable components of the semiconductor processing chamber 104 in the first plurality of semiconductor processing chambers 102, which can be connected to or around the base 116. These removable components can include, for example, a removable cover 118, a radio frequency (RF) generator, a pump, or a cryogenic pump. It may be desirable to remove these components from the semiconductor processing chamber to perform maintenance or repair on the removable components or another portion of the semiconductor processing chamber. Each of these removable components can include some of the lifting features discussed above so that the lifting feature engagement interface engages with these removable components so that the removable components can be raised, lowered, and removed. For example, any of the removable components has the above Figure 4B The lifting features described above, or they may have conventional lifting features, such as hooks, rings, etc. Regardless of the type of lifting features arranged on the removable component, the first carrier and the first lifting arm are movable so that the lifting feature engagement interface can be moved to engage with these lifting features of the removable component.

[0125] In some other embodiments, the linear guide system and the first carrier are configured and positioned so that the first carrier can access other parts of the tool. For situations with different component configurations, it is advantageous to have linear guide systems and carriers with different configurations. For example, Figure 2 The first example portion of the tool has components arranged in a particular manner that may be sufficient for positioning the linear guide system and the first carriage. In other cases, the tool has a configuration of removable components that makes these components inaccessible to the linear guide system and the first carriage. In these cases, the configuration may be different from that described above.

[0126] Figure 8 Depicted Figure 1 The tool 800 is a perspective view of a second alternative example portion of a schematic diagram of a tool. The arrangement of components of the tool 800 is similar to the tool 100 described above but is different therefrom. Figure 8 In, similar to Figure 2 In this example, the first plurality of semiconductor processing chambers 802 include three semiconductor processing chambers arranged along a first axis 806, each semiconductor processing chamber including a base 816 fixedly mounted on an upper support frame 814. Figure 8 As further shown, tool 800 includes components 874 above first plurality of semiconductor processing chambers 802, some of which may be removable. Components 874 are positioned and arranged to be used with the above, for example Figure 2 Different linear guidance systems as described, the first carrier, or both may be advantageous.

[0127] The tool 800 includes a second linear guide system 876 that is arranged along a second axis 824 that is substantially parallel to the first axis 806, as described above, and that includes a first track 878A and a second track 878B. As described above, the two tracks are parallel to each other and are vertically offset from each other along a vertical axis 834 that is perpendicular to the second axis 824. The second linear guide system 876 is also fixedly supported, directly or indirectly, by the upper support frame 814; Figure 8 A second linear guide system 876 is shown mounted directly and fixedly to the upper support frame 814. A second carriage 880 is also depicted within the dashed shape and is Fig. 9 We will see in more detail Figure 8 A magnified part of the Fig. 9 876 so that it is simultaneously movably engaged with both the first rail 878A and the second rail 878B, thereby enabling the second carrier to translate along the second axis 824 in the direction of arrow 828, as described above. It should be understood that reference to a "second" linear guide system and carrier is not intended to imply that there must be a corresponding "first" instance in every semiconductor tool of the same. The ordinal designation is used only to distinguish this linear guide system and carrier from the examples discussed previously.

[0128] The second carriage 880 also includes a first lifting arm 830, which (including its components, its ability to rotate about an axis parallel to the vertical axis 834, and its inclusion of a lifting feature engagement interface for engaging with a lifting feature of a removable component) may be the same as described above with respect to the first lifting arm 130. In some cases, the linkage 832 may be larger than the linkage 832. Figure 2 The second carriage 880 may be longer or shorter to reach other components of the tool 800. Also as described above, the second carriage 880 may include a first vertical translation system 862 for translating the first lifting arm 830 in a direction parallel to the vertical axis 834, as indicated by arrow 864. The first vertical translation system 862 includes a motor 866, which may use a pulley and cable or a screw actuator to drive the vertical translation as described above.

[0129] In some embodiments, the second linear guide system and the second carriage are configured to enable the second lifting arm to translate below, between, and above the second linear guide system. Figure 8 In some embodiments, the first lifting arm 830 can be translated below the second linear guide system 876 and between the first track 878A and the second track 878B; in some implementations, the vertical translation system can even extend above the second track 878B, allowing the second lifting arm to translate to a position above the second track 878B. This vertical translation range enables the lifting feature engagement interface of the first lifting arm 830 to access and move removable components below the second linear guide system 876, such as the removable upper cover 818 and the removable component 882A, and removable components located between the first track 878A and the second track 878B (or above the second track 878B), such as the removable component 882B. In some embodiments, the configuration of the first carriage allows the first lifting arm 830 to access and move removable components above the bottom of the second linear guide system 876.

[0130] Some embodiments of the tool may have two or more carriers simultaneously movably coupled to the same linear guide system. For example, Figure 2 and 3 The first linear guide system 120 in the embodiment can have two first carriages 122 simultaneously and movably engaged therewith. In some implementations, the two first carriages 122 can be copies of each other. For example, Fig.10 Describes Figures 6A-6EThe tool shown has two first carriers engaged with a linear guide system. Here, the first carrier 122A and the first carrier 122B (which can be considered as the second carrier) are simultaneously movably engaged with the first linear guide system 120 so that they can both translate along the second axis 124. In these embodiments, the first carrier 122A and the first carrier 122B are duplicates and are configured the same as the first carrier 122 described above. This allows the removable components of multiple semiconductor processing chambers 104 to be accessed and moved, thereby increasing the efficiency and reducing the time for repair and maintenance.

[0131] Back to Figure 1 , the tool 100 can have two pluralities of semiconductor processing chambers, namely a first plurality of semiconductor processing chambers 102 and a second plurality of semiconductor processing chambers 108. The second plurality of semiconductor processing chambers 108 can be arranged along a third axis that is considered to be the same as the axis 112, which is offset from but substantially parallel to the first axis 106. Figure 1 1 , the second plurality of semiconductor processing chambers 108 are offset from the first plurality of semiconductor processing chambers 102 in another direction perpendicular to the first axis, so that the tool has an interior region 184 (shown in dashed lines and with translucent shading) between the plurality of semiconductor processing chambers. The interior region can include a portion of the upper support frame 114 and components used for semiconductor processing, such as gas boxes, manifolds, gas sources, electronic equipment, conduits, etc. The interior region 184 can also include one or more substrate handling robots that are used to transfer one or more substrates into and out of the processing chambers or other parts of the tool. As discussed herein, these substrate handling robots are different from the disclosed carriers. For example, substrate handling robots are typically located in the interior region because this allows such robots to efficiently transfer wafers between different processing chambers while still keeping the wafers in a controlled environment, such as within a vacuum transfer module.

[0132] The tool 100 having multiple sets of multiple semiconductor processing chambers may have a linear guide system and a carrier in each set of multiple semiconductor processing chambers. Fig.11 Describes something like Figure 1 1 is a top view of an exemplary semiconductor processing tool similar to the tool schematic of FIG. 1 , but showing additional details and features. The first plurality of semiconductor processing chambers 102 may be similar to Figure 2-7 These semiconductor processing chambers can be arranged along the second axis 124, and their bases 116 can be fixedly mounted to the upper support frame 114. Figure 2-7 As described above, the first linear guide system 120 and the first carrier 122 are positioned and configured to access and move only the removable components, such as the removable upper covers 118 , of the first plurality of semiconductor processing chambers 102 .

[0133] Additionally, the second plurality of semiconductor processing chambers 108 may be arranged along a third axis. The second linear guide system 1120 may be arranged along a substantially parallel axis to the third axis 112 (see Figure 1 ). The second carrier 1122 can be movably engaged with the second linear guide system 1120, and it is configured to access and move only the removable components of the second plurality of semiconductor processing chambers 108. The second carrier 1122 can be configured to engage with the lifting features of the removable components (e.g., the removable cover 1118) of the second plurality of semiconductor processing chambers 108, as described above with respect to the first carrier 122. In some embodiments, the second linear guide system 1120 can be the same as the first linear guide system 120, the second carrier 1122 can be the same as the first carrier 122, and the removable components of the first and second plurality of semiconductor processing chambers can all be of the same or similar design. In other embodiments, the first linear guide system 120 can be different from the second linear guide system 1120, the first carrier 122 can be different from the second carrier 1122, but each of the first and second carriers can still be used to engage with the lifting features of the removable components of their respective semiconductor processing chambers.

[0134] In some embodiments, the first plurality of semiconductor processing chambers 102, the second plurality of semiconductor processing chambers 108, and the interior area can be located within the enclosure 170. In some examples, at least a portion of the first carrier and / or the linear guide system is positioned outside the enclosure 170. The first carrier 122 and the second carrier 1122, including their respective first and second lift arms, are movable so that removable components in each semiconductor processing chamber can be moved outside the enclosure. Fig.11 170. The removable covers 118 and 1118 are shown being moved and positioned outside of the housing 170.

[0135] The lifting aspects of the first carrier, such as the linear guide system and the first carrier, described herein may include powered and non-powered features to varying degrees. For example, in some implementations of the tool, movement of the first carrier 122 along the second axis 124 and horizontal and rotational movement of the first lifting arm may be non-powered, such that human, non-motor, electric, or mechanical power may be used to move the first carrier 122 and horizontally and rotationally move the first lifting arm. In some examples, mechanical power, such as a motor or hydraulic device, may vertically move the first carrier 122 and one or more portions of the first lifting arm 130, such as a motor causing the first lifting arm 130 to move vertically. In some other implementations, movement of the first carrier along the linear guide system and horizontal and rotational movement of the first lifting arm may be powered, such as movement using a motor, pump, hydraulics, or the like.

[0136] Some embodiments of the tools described herein may also include a controller that controls different aspects of the tools. In some implementations, the controller may be part of one or more processing chambers, one or more platforms for processing, and / or a specific processing component (wafer pedestal, gas flow system, etc.). These tools may be integrated with electronic devices for controlling their operation before, during, and after the processing of semiconductor wafers or substrates. The electronic device may be referred to as a "controller" that can control various components or subcomponents of the tool. Depending on the processing requirements and / or the type of tool, the controller may be programmed to control any of the processes disclosed herein, including, for example, controlling when power is provided to the lifting system disclosed herein and monitoring the operating status of the semiconductor processing chamber for maintaining safety conditions. The controller may also control other aspects of the tool operation, including controlling the delivery of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer transfer in and out of the tool and other transfer tools and / or load locks connected to or connected to a specific system through an interface, etc.

[0137] In general, a controller can be defined as an electronic device having various integrated circuits, logic, memory (including non-transitory media), and / or software that receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. The integrated circuit may include a chip in the form of firmware that stores program instructions, a digital signal processor (DSP), a chip defined as an application specific integrated circuit (ASIC), and / or one or more microprocessors, or a microcontroller that executes program instructions (e.g., software). The program instructions may be instructions sent to the controller in the form of various individual settings (or program files) that define operating parameters for performing specific processing on or for a semiconductor wafer or system. In some embodiments, the operating parameters may be part of a recipe defined by a process engineer to complete one or more processing steps during the manufacture of one or more (kinds of) layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0138] In some implementations, the controller may be part of or coupled to a computer that is integrated with the tool, coupled to the tool, otherwise networked to the tool, or a combination thereof. For example, the controller may be in the "cloud" or all or part of a wafer fab host system that may allow remote access to wafer processing. The computer may enable remote access to the system to monitor the current progress of a manufacturing operation, check the history of past manufacturing operations, check trends or performance criteria for multiple manufacturing operations, change parameters of the current processing, set processing steps to follow the current processing, or start a new processing. In some examples, a remote computer (e.g., a server) may provide a processing recipe to the system via a network (which may include a local network or the Internet). The remote computer may include a user interface that enables input or programming of parameters and / or settings, which are then sent from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of processing to be performed and the type of tool, and the controller is configured to interface with or control the tool. Thus, as described above, the controller may be distributed, for example, by including one or more discrete controllers networked together and working toward a common purpose (e.g., processing and control as described herein). An example of a distributed controller for such a purpose is one or more integrated circuits on a chamber that communicate with one or more integrated circuits remotely (e.g., at a platform level or as part of a remote computer), which combine to control processing on the chamber.

[0139] Exemplary tools may include, but are not limited to, plasma etch chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, chamfer edge etch chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etch (ALE) chambers or modules, ion implantation chambers or modules, or track chambers or modules. A tool may have multiple process chambers or modules.

[0140] As described above, depending on one or more processing steps to be performed by the tool, the controller can communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the factory, a host computer, another controller, or tools used in material transport to transport wafer containers to and from tool locations and / or load ports in a semiconductor manufacturing facility.

[0141] In some embodiments, various lifting aspects of the tool may be powered and a controller may be configured to control a drive system that controls movement of the carrier relative to the linear guide system and / or movement of the arm linkage relative to the carrier. Fig.12 Depicted Fig. 6E 12 is a top view of an exemplary semiconductor processing tool of the type shown in FIG. 1200 , but showing additional features. For example, tool 1200 has a first linear guide system 120 that includes a carrier translation system 1288 for translating a first carrier 122 along a first axis 124. Carrier translation system 1288 may include a movement mechanism (e.g., a motor) that moves first carrier 122 along first linear guide system 120. For example, first carrier 122 may have one or more motors that drive one or more wheels and move first carrier 122 along first linear guide system 120. In another embodiment, as shown in FIG. Fig. 6A As shown, the first linear guide system 120 may have a linear ball screw actuator having a motor 191 for rotating a linear ball screw 189 connected to the first carrier 122 , so that when the linear ball screw 189 is actuated by the motor 191 , the first carrier 122 moves along the first linear guide system 120 .

[0142] In some implementations, the tool 1200 can have a first carrier (represented by box 1290) further including a lift arm movement system configured to move the first lift arm 130 in a plane perpendicular to the vertical axis described above. The configuration can include the ability to rotationally drive one or more pivot points of the first lift arm about a direction parallel to the vertical axis. For example, the first carrier 122 can include a motor connected to the first link 132 at the pivot section 133, which can rotate the first link 132 about the vertical axis in the direction of arrow 136. The first carrier 122 can also include another motor directly or indirectly connected to the lift feature engagement interface 152, which can rotate the lift feature engagement interface 152 about the axis 160, as shown. Figure 4A and above Figure 6C-6E 169. The other motor (pneumatic system or hydraulic system) can be located on the first lifting arm or can also be located in the first carrier 122 and connected to the lifting feature engagement interface 152 by a pulley, belt, drive chain, gear, connecting rod or the like. In some implementations, the lifting arm movement system can also rotate the lifting feature engagement interface 152 around one or more axes perpendicular to the vertical axis, such as around an axis parallel to the first axis as described above. The tool 1200 also includes the above-mentioned vertical translation system 162, which is configured to translate the first lifting arm 130 along the vertical axis 134.

[0143] The tool 1200 also includes a controller 1292, such as those similar to those described above for controlling the carriage translation system and the lift arm movement mechanism. The controller 1292 may include one or more non-transitory memory devices 1294 and one or more processors 1296. The processor 1296 may include one or more CPUs, multiple ASICs, one or more general purpose computers and / or special purpose computers (one or more), one or more analog and / or digital input / output connectors (one or more), one or more stepper motor controller panels, etc.

[0144] Controller 1292 may be communicatively coupled to carriage translation system 1288 , lift arm movement system 1290 , and vertical translation system 162 . Fig.13 A block diagram of a portion of an exemplary semiconductor processing tool 1200 is shown, as seen in which a controller 1292 is communicatively coupled to each semiconductor processing chamber 104 of the first plurality of semiconductor processing chambers 102, a carrier translation system 1288, a lift arm movement system 1290, and a vertical translation system 162. The controller 1292 stores instructions in its non-transitory memory 1294 for controlling one or more processors 1296 to move the first carrier 122, including the first lift arm 130. This includes causing the carrier translation system 1288 to move the first carrier 122 along the second axis 124, causing the vertical translation system 162 to move the first lift arm 130 (including the first linkage 132 and the lift feature engagement interface 152) in a vertical direction, as described above, and causing the lift arm movement system 1290 to move the first lift arm 130 in a plane perpendicular to the vertical axis 134, as described above.

[0145] In some implementations, the controller 1292 also stores instructions in its non-transitory memory 1294 for controlling one or more processors 1296 to cause the lift feature engagement interface 152 to engage with the lift features of the removable components of the semiconductor processing chamber 104. These instructions can cause various movements of the first carrier 122, such as linear translation along the second axis 124, vertical movement of the first lift arm 130, and horizontal movement of the first lift arm 130 (i.e., movement in a plane perpendicular to the vertical axis. For example, referring back to Figure 4A and 4B, the instructions may cause the vertical translation system 162 to move the first lifting arm 130 in a direction parallel to the vertical axis 134 so that the lifting feature engagement interface 152 (including holes 144A and 144B) is located below the second mechanical interface features 151A and 151B of the lifting feature, i.e., the second structures 142A and 142B. The instructions may also cause the first lifting arm 130 (which may include the lifting feature engagement interface 152) to rotate, move linearly, or both in a plane perpendicular to the vertical axis 134 so that the second mechanical interface features 151A and 151B are aligned with the holes 144A and 144B, respectively. Once these features are aligned (which can be determined, for example, based on the output of various sensors used to detect such alignment), the instructions can, or allow user manual input, cause the vertical translation system 162 to move the first lifting arm 130 upward in a direction parallel to the vertical axis 134 so that the second mechanical interface features 151A and 151B are inserted into holes 144A and 144B, respectively, and in some embodiments, the saddle plates 150A and 150B contact the lifting feature engagement interface 152.

[0146] Once the lifting feature of the removable component and the lifting feature engagement interface of the first lifting arm are engaged with each other, the instructions can control one or more processors to raise and / or lower the removable component in a direction parallel to the vertical axis; similarly, the instructions can cause the removable component to move in a plane perpendicular to the vertical axis by causing the lifting arm movement system, the carrier translation system, or both to move the first lifting arm in the above manner. For example, the controller 1292 may include instructions for causing the removable component to move in a plane perpendicular to the vertical axis. Figures 6A-6E The instructions for the movement sequence described occur.

[0147] In some implementations, the instructions may cause only the lift arm movement system to move the first lift arm, while the first carrier remains stationary. In some embodiments, the instructions may cause both the lift arm movement system and the carrier translation system to move the first lift arm, as shown above. Figures 6A-6E For example, the rotation of one or more lifting arm links combined with the simultaneous translation of the carrier causes the detachable component to travel along a substantially linear axis perpendicular to the carrier's translation axis. In other cases, the instructions may cause only the carrier translation system to move the first lifting arm, while the lifting arm movement system does not move the first lifting arm. In one illustrative example, with reference to Fig.12 , the lift feature engagement interface 152 engages with the lift feature of the removable cover 1218, and the carrier translation system 1288 may translate the first carrier 122 and thus the removable cover 1218 along the second axis 124. During the movement, the lift arm movement mechanism 1290 and the first vertical translation system 162 may not move the first lift arm 130.

[0148] The instructions may also cause disengagement of the lifting feature of the removable component and the lifting feature engagement interface of the first lifting arm, such as after the removable component has been returned to its original position and reinstalled. Figure 4A and 4B In one embodiment, this may include lowering the first lifting arm 130 such that the second mechanical interface features 151A and 151B are removed from the holes 144A and 144B.

[0149] In some embodiments, the tool may further include a first carriage position sensor configured to generate data regarding the position of the first carriage along the first linear guide system. Fig.13 , it can be seen that the first carrier position sensor 1298 is positioned on the first carrier 122 and is communicatively connected to the controller 1292 by wire or wireless communication so that the controller 1292 can receive data generated by the first carrier position sensor 1298. The controller 1292 can also interpret and determine the position of the first carrier along the first linear guide system 120 from the data, including data about which of the semiconductor processing chambers 104 is closest to the first carrier 122 and which is closest to or adjacent to the first carrier 122. For example, in Fig.13 In FIG. 1 , first carrier position sensor 1298 may generate data indicating that first carrier 122 is closest to semiconductor processing chamber 104A and adjacent to semiconductor processing chamber 104B. The carrier position may enable determination of which semiconductor processing chamber the lift arm may enter. For example, in FIG. Fig. 6A , the carrier position sensor 1298 may indicate that when the first carrier 122 is located proximate to two semiconductor processing chambers 104A and 104B, the first lift arm may be able to access removable components of both processing chambers.

[0150] In some implementations, the tool may further include a first arm position sensor configured to generate data regarding a position of the first lift arm relative to the semiconductor processing chamber. Fig.13, the first arm position sensor 12100 is positioned on the first lift arm 130 and is communicatively connected to the controller 1292 via a wired or wireless connector so that the controller 1292 can receive data generated by the first arm position sensor 12100. The controller 1292 can also interpret and determine the position of the first lift arm 130 relative to each semiconductor processing chamber 104 from the carrier position data and / or the arm position data, including, in the case of the position of the first carrier 122, which lift feature can be engaged by the first lift arm 130, which semiconductor processing chamber 104 is closest to or adjacent to the first lift arm 130, the position of the pivot section (i.e., shoulder) of the first lift arm 130 relative to each semiconductor processing chamber 104, the position of the first lift arm 130 relative to each removable component lift feature on each semiconductor processing chamber 104, and the position of the first lift arm 130 along the vertical axis (e.g., determining the vertical position of the first lift arm and lift feature engagement interface relative to the lift features of the removable components). The data may also include distances of aspects of the first lifting arm 130 from various features of the tool (e.g., as may be accomplished using proximity sensors). In some embodiments, the tool may also include an arm position sensor configured to generate data regarding the position of the lifting arm as it rotates about a vertical axis. The controller may, for example, determine from this data whether the arm is properly positioned to avoid known obstacles or engage lifting features when vertically translating. The controller may also include instructions to prevent the vertical translation system from translating the arm vertically above or below a certain height or not translating.

[0151] For example, the first arm position sensor 12100 may generate data indicating the position of the first lift arm, including the horizontal and vertical positions of its lift feature engagement interface relative to lift features of the semiconductor processing chamber; this position data may be used to determine which lift feature may be engaged by the first lift arm 130. Fig. 6A In the tool, for example, the first arm position sensor 12100 can generate data that the controller uses to determine that the lift feature engagement interface can engage with the lift feature of the semiconductor processing chamber 104A. As described above, the controller can determine the position of the first arm 130 along the vertical axis and further determine the position relative to the lift feature of the removable component. In some embodiments, the tool can have two or more arm position sensors, all of which generate data about the position of the first lift arm relative to the processing chamber.

[0152] In some embodiments, the tool may further include an engagement sensor configured to generate data regarding whether the lift feature engagement interface is engaged with a lift feature of any semiconductor processing chamber. Fig.13In the embodiment, the engagement sensor 12102 is positioned on the first lifting arm 130 and is communicatively connected to the controller 1292 via a wired or wireless connector so that the controller 1292 can receive data generated by the engagement sensor 12102. The controller 1292 can also interpret and determine whether the lifting feature engagement interface is engaged with any lifting feature based on this data. For example, the engagement sensor 12102 can be a conductive surface that is configured to be electrically connected to another conductive surface on the lifting feature so that when the lifting feature engagement interface is engaged with the lifting feature, electrical continuity is generated between these conductive surfaces. Return to reference Figure 4A and 4B For example, a first conductive surface may be positioned on a top surface of the first structure 138, and when the lift feature engagement interface 152 engages with the lift features 142A and 142B, the top surface of the first structure 138 may contact a second conductive surface located on the underside of the saddle plate 150A or 150B. The controller 1292 may detect whether there is an electrical community between the two surfaces and determine engagement between the lift feature engagement interface and the lift feature. The engagement sensor may be other types of sensors, such as proximity sensors, contact switches, visual sensors, etc. In some implementations, when the lift feature engagement interface is not engaged with either lift feature, the controller 1292 may include instructions to prevent the vertical translation system from translating the first arm vertically or not translating above a certain level (thereby allowing sufficient vertical translation to allow the lift feature engagement interface to engage with the lift feature).

[0153] In some embodiments, the tool may also include an alignment sensor configured to generate data regarding whether the lift feature engagement interface is aligned with the lift features of any semiconductor processing chamber. In some cases, the data may be used to determine whether vertical movement of the first lift arm 130 will cause engagement between the lift feature and the lift feature engagement interface. The alignment sensor may be positioned on the first lift arm 130, on the removable component, or on both, and communicatively connected to the controller 1292 via a wired or wireless connector so that the controller 1292 may receive the data generated by the alignment sensor. The controller 1292 may therefore interpret and determine based on the data whether the lift feature engagement interface is properly aligned with the lift features of any removable component such that vertical movement of the first lift arm engages the objects. For example, referring back to Figure 4A and 4B, the alignment sensor can generate data so that the controller 1292 can determine whether the holes 144A and 144B are located below and aligned with the second mechanical interface features 151A and 151B so that the upward movement of the first lifting arm 130 will cause the second mechanical interface features 151A and 151B to be inserted into the holes 144A and 144B. Such an alignment sensor can be, for example, a visual, magnetic or proximity sensor.

[0154] The controller can utilize data from any of the above sensors to execute the above movement of the first carrier and the removable component. Fig.13 , the controller 1292 may first determine the positioning and engagement of the first carrier 122; Fig.13 As shown, these determinations are that the position of the first carrier 122 is closest to the semiconductor processing chamber 104B, the position of the first lift arm 130 is closest to the semiconductor processing chamber 104C, and the lift feature engagement interface is not engaged with any lift feature. If it is desired to move the removable component of the semiconductor processing chamber 104A, the controller 1292 can use these determinations and data to move the first carrier 122 and / or the first lift arm 130 so that the first lift arm 130 can engage with the lift feature of the semiconductor processing chamber 104A. The movement can include instructing the carrier translation system 1288 to move the first carrier 122 to a position closer to the semiconductor processing chamber 104A and rotating the first lift arm 130 (e.g., approximately 180 degrees clockwise) so that it is closer to the semiconductor processing chamber 104A. Fig.13 Shown closer to semiconductor processing chamber 104A.

[0155] In some embodiments, the tool may have a number of safety features. For example, the controller may be configured to receive information about the operating state of each semiconductor processing chamber. The operating state may be whether the semiconductor processing chamber is actively processing a substrate, and whether the semiconductor processing chamber is in a personnel safety state to allow a person to enter the chamber, such as the chamber is not powered on, the pressure is at ambient pressure, and volatile chemicals have been removed from the chamber. If the information received by the controller is or determines that one of the semiconductor processing chambers is in a personnel safety state, the controller may allow the carrier translation system, the lifting arm movement system, and / or the vertical translation system to operate and move the removable components of the semiconductor processing chamber. Similarly, if the information received by the controller is or determines that one of the semiconductor processing chambers is not in a personnel safety state, the controller may prevent the carrier translation system, the lifting arm movement system, and / or the vertical translation system from operating in a manner that would cause the removable components of the semiconductor processing chamber to move (although it may allow the movable components of other chambers on the tool that are in a safe state to move to perform such activities).

[0156] In some embodiments, each semiconductor processing chamber may have an electrical interface, such as a power outlet, configured to be connected to a cable of the first carrier; such an electrical interface may be located on a removable portion thereof. The cable may be electrically connected to a power source on the first carrier or another power source on the tool (e.g., a system power distribution box (SPDB) of the tool). Power may be transmitted from the SPDB along the linear guide system to the first carrier and terminated to the lift mechanism, or may be transmitted along the first lift arm by a cable. The cable may terminate at a connector configured to connect to the electrical interface of any removable component and may be configured to supply power to such a component when powered and the connector is connected. Providing power to the removable component may allow maintenance tasks to be performed on the removed removable component (e.g., driving a motor located on the removable cover during calibration) and keep equipment on the removable cover powered and warm (e.g., a pressure gauge) to speed up maintenance recovery time.

[0157] In some embodiments, the electrical interface can be used as a part of a safety interlock. For example, the controller may include instructions for determining electrical continuity between the cable and the electrical interface. If it is determined that electrical continuity exists, the controller may allow vertical translation or other mobile mechanisms on the first carrier to operate. In addition, the controller can determine whether the chamber is in the atmosphere, and if the chamber is in the atmosphere, the controller allows the movement of removable components (such as top plates). In some embodiments, an atmospheric signal is generated by the chamber and relayed through the electrical interface and the cable, and the signal can be detected by the controller. The atmospheric signal can indicate that the chamber is in or not in the atmosphere.

[0158] In some embodiments, the cable may be arranged along the first lift arm and its length is such that the connector and the lift feature engagement interface of the first lift arm can only be engaged with the electrical interface and lift feature of a single process chamber in the semiconductor process chamber at a time. Figure 5 The first carrier 122 includes a cable 1104 arranged along the first lifting arm 130, and its length enables the connector 1106 to engage with the electrical interface 1108 of the removable upper cover 118. The length of the cable 1104 also allows the connector 1106 to engage with the electrical interface 1108 of the semiconductor processing chamber and allows the lifting feature engagement interface to engage with the lifting feature of the removable upper cover 118, such as Figure 4A and 4B As described, however, during the period in which the first lifting arm is engaged with the lifting feature of the depicted removable cover 118, the connector 1106 is prevented from being connected to a similar electrical interface of any other removable cover. Fig.12, when the lift feature engagement interface is engaged to the lift feature of the removable upper cover 118 of the semiconductor processing chamber 104A, the length of the cable 1104 prevents the connector 1106 from being simultaneously connected to the electrical interface 1108 of the removable upper cover 118 of the semiconductor processing chamber 104B.

[0159] In some other embodiments, the electrical interface can provide power to the components on the carrier. The electrical interface can be located at a fixed location in each semiconductor processing chamber or can be located on a removable component. The cable can be connected to one or more motors of the first carrier, such as the motor of the vertical translation system and the motor of the lifting arm movement system (if present), and terminated in a connector that is configured to connect to the electrical interface of any removable component and, if powered and the connector is connected, the connector is configured to supply power to these components.

[0160] In some implementations, the controller may further include instructions for powering the electrical interface of the semiconductor processing chamber based on data from one or more of the above-mentioned sensors. For example, in some implementations, the controller may allow only the electrical interface of one semiconductor processing chamber in the first plurality of semiconductor processing chambers to be powered at a time based on the determination of the position of the first carrier, and only when it is determined that the operating state of the semiconductor processing chamber is in a condition where it is safe to remove the upper cover. If multiple carriers / lifting arms are included in a single group of multiple semiconductor processing chambers, this function can be extended to allow power to be supplied to the electrical interface of a specific semiconductor processing chamber only when one of the carriers / lifting arms is determined to be in a position suitable for removing a removable component from the semiconductor processing chamber and only when the semiconductor processing chamber is determined to be in a safe operating state. Reference Fig.13 , for example, the controller 1292 receives data regarding the position of the first carrier 122 from the first carrier position sensor 1298, determines the position of the first carrier based on the data, and then only powers the electrical interface of the semiconductor processing chamber 104B (after determining that the processing chamber is in a "safe" state) because the lifting feature of the first arm 130 can only reach the removable components of the semiconductor processing chamber 104A. As described above, this "safe" state can be when a person can safely approach the chamber, such as when the chamber is not powered, the chamber pressure is at ambient pressure, at a sufficiently low temperature for personnel to handle the removable components, and any volatile or hazardous chemicals have been purged from the chamber, and the removable components have been unlatched or unbolted from the chamber.

[0161] Similarly, based on the determination of the position of the first lift arm 130 and the first carrier 122, the controller 1292 may include instructions for controlling the processor 1296 to cause the electrical interfaces 1108 of only the semiconductor processing chambers of the first plurality of semiconductor processing chambers having lift features that can engage with the lift feature engagement interface 152 of the first lift arm 130 to be powered. Again, for example, Fig.13 These determinations may indicate that the lift feature of the removable component of the semiconductor processing chamber 104A may engage with the lift feature engagement interface of the first lift arm 130 and the controller 1292 may thereby power the electrical interface 1108 of the semiconductor processing chamber 104C.

[0162] Additionally or alternatively, the controller may, in response to determining that the lift feature engagement interface is engaged with the lift feature of one of the removable upper covers of the first plurality of semiconductor processing chambers, power only the electrical interface of the semiconductor processing chamber of the first plurality of semiconductor processing chambers that includes the removable upper cover as described above. Fig.13 For example, based on data generated by the engagement sensor 12104, the first arm position sensor 12100, and the carrier position sensor 1298, it can be determined that the lift feature engagement interface of the first lift arm 130 is engaged with the lift feature engagement of the removable component of the semiconductor processing chamber 104C, and based on this determination, the controller 1292 can only power the electrical interface of the semiconductor processing chamber 104C.

[0163] In some embodiments, the engagement sensor can be considered to be a first interlock sensor, which is configured to generate data regarding whether the lifting feature is engaged with the lifting feature engagement interface. The instructions can cause the controller to control the processor to determine whether the lifting feature engagement interface is engaged with the lifting feature of one of the removable components of the first plurality of semiconductor processing chambers based on the data generated by the first interlock sensor. The instructions can also cause the vertical translation system to vertically translate the first lifting arm in response to receiving the first input signal to cause the vertical translation system to operate and determining that the lifting feature engagement interface is engaged with the lifting feature of one of the removable upper covers. The instructions can further prevent the vertical translation system from vertically translating the first lifting arm in response to receiving the first input signal to cause the vertical translation system to operate and determining that the lifting feature engagement interface is not engaged with the lifting feature of one of the removable upper covers.

[0164] In some embodiments, another safety feature may be included that limits the movement of the first lifting arm to a sector less than 360 degrees, such as within a sector of substantially 180 degrees or 270 degrees (substantially meaning within + / - 10 degrees). This limitation may be provided by the use of one or more physical hard stops (e.g., one or more pins) to prevent the first lifting arm from rotating to a position outside the sector, or it may be provided by instructions in the controller (if present) to prevent the motor from rotating the first arm to a position outside the sector. In some cases, the first lifting arm that is limited to movement only on a first side of a vertical plane passing through the first carrier is parallel to the vertical axis and perpendicular to the second axis. For example, with reference to Figure 6B , showing that vertical plane 1110 is substantially perpendicular to second axis 124 (e.g., within + / - 5 degrees of orthogonal), substantially parallel to vertical axis 134 (e.g., within + / - 5 degrees of parallel), and passes through first carrier 122. Here, first lifting arm 130 can only rotate to a position to the left of vertical plane 1110. As described above, the instructions can control one or more processors to enable first lifting arm 130 to move only on a first or left side of vertical plane 1110. Alternatively, such a rotation limiting feature can be operated to limit the movement of the lifting arm to only a position on the right side.

[0165] To avoid any potential confusion, it should be noted that the carriers and lift arms discussed herein are not equivalent to robot arms or end effectors intended or used to transfer substrates. In addition, the removable components of the semiconductor processing chamber described herein should not be considered substrates, and the lift arms described herein are not configured or intended to support substrates.

[0166] In some embodiments, instead of a carrier and lift arm system that is intended to be permanently mounted to a semiconductor processing tool and supported entirely by a linear guide system to which it is attached, a lift system that is removable from the semiconductor processing tool may be used. In such an alternative system, the lift arm may be attached to a removable vertical member equipped with a vertical translation system (it should be understood that the reference to "vertical" in this embodiment refers to the orientation of the components when the lift system is mounted on the semiconductor processing tool; obviously, if such a lift system is removed from the semiconductor processing tool, rotated 90° and laid flat on the floor, then the parts previously described as "vertical" are technically horizontal, and vice versa, for the purposes of this disclosure, such components may still potentially be described as "vertical"). The removable vertical member may include one or more mechanical interfaces that allow the removable vertical member to be connected to corresponding attachment points located at various locations on the semiconductor processing tool (e.g., an upper support frame of the tool or other lower portion of a similar lower frame). The bottom of the vertical member may be equipped with rollers or wheels to allow it to be rotated and positioned in the semiconductor processing equipment so that it is positioned to allow it to interface with different semiconductor processing tools. The vertical member itself may have one or more arm links that are supported by a vertical translation system mounted on the vertical member. Once the vertical member is attached to the upper support frame of the semiconductor processing tool, the vertical translation system can be used to drive the one or more arm links vertically up and down.

[0167] Such a lifting system may be designed such that it is not freestanding and / or is not capable of supporting removable components without some form of support attached to the tool (e.g., via attachment points on an upper support frame). Thus, for example, in some embodiments, the lifting system may lack support feet (as previously discussed in the present disclosure) extending to a position approximately below the lifting arm, which would act to prevent the lifting system from tipping over due to its weight (and what it is lifting). In another example, the lifting system may have a lightweight support system that supports only the weight of the lifting system itself and not the weight of the removable components. Existing freestanding lifting systems include feet or equivalent structures that extend to a position approximately below the lifting arm. In contrast, the removable lifting systems discussed herein are not capable of supporting the weight of the lifting arm and / or removable components without some form of external support.

[0168] When such a lifting system is attached to a semiconductor processing tool via one or more attachment points, the attachment points may be used primarily to carry lateral loads, while axial (vertical) loads may alternatively be transmitted along the length of the removable vertical member and pass through the bottom of the removable vertical member into the facility floor (e.g., in some cases, may pass through wheels located at the base of the removable vertical member). Therefore, any torque caused by a vertical load applied away from the centerline of the removable vertical member may be offset by the resistance applied by the attachment points. In some cases, the attachment points may carry lateral loads as well as some or all of the vertical loads. Here, the tool may include an upper attachment point and a lower attachment point, so that the lateral and some or all of the vertical loads of the lifting system can be supported. The above torque can be offset by these multiple attachment points at the ends of the vertical members of the lifting system. The vertical load may also be transmitted to the vertical member, the upper attachment point and the upper support frame, and the lower attachment point, and ultimately directed to the ground, which is different from passing through the wheels of the lifting system. This can make the vertical member and its moving mechanism lighter and have less load-bearing structure.

[0169] Because such lift systems do not need to be self-supporting, they can have a very small footprint and be much lighter weight than free-standing lift systems. This makes them easier for personnel to operate and allows for use in tighter places.

[0170] Thus, the present disclosure includes additional alternative embodiments of another exemplary semiconductor processing tool that does not have the linear guide system and carrier described above, but instead has a removable lift system. In these alternative lift system embodiments, the tool still includes an upper support frame, a plurality of semiconductor processing chambers arranged along a first axis, and a base fixedly attached to the upper support frame. In some such implementations, the semiconductor chambers can be arranged along a manner other than a linear axis, such as a circular arrangement.

[0171] In some of these alternative embodiments, a removable lift system is supported by the Fab floor, is connectable to the support frame at elevated attachment points, and has a lift arm. The removable lift system is portable so that it can be moved to a position next to the tool in the service area of ​​the Fab floor and then secured to the upper support frame at the attachment points of the upper support frame. Once in place and connected to the upper support frame, the lift arm and vertical translation system can be used to raise, lower, and move one or more removable components of the semiconductor processing tool. As discussed in more detail below, the lift arm and vertical translation system can be the same or similar to the lift arm and vertical translation system described above.

[0172] Fig.14 Another exemplary semiconductor processing tool is depicted; the figure is similar to Figure 2In these embodiments, as described above, another tool example 1400 includes an upper support frame 1414, a first plurality of semiconductor processing chambers 1402 arranged along a first axis 1406, a base 1416 fixedly connected to the upper support frame 1414, and a removable component (e.g., a removable upper cover 1418) having a lifting feature (e.g., the second structure 1442 described above).

[0173] Compared to tool 100, another tool 1400 includes an attachment system that may include one or more attachment points 14112 fixedly supported by an upper support frame 1414. In some embodiments, two or more attachment points 14112 are connected to a fixed position of the upper support frame 1414 relative to the upper support frame 1414 and along a second axis 1424. In some other embodiments, the attachment system may include a rail to which one or more attachment points are movably connected. For example, in Fig.14 14. The guide rail 14114, highlighted by shading, extends along the second axis 1424, similar to the first linear guide system described above, and one or more attachment points 14112 are movably connected to the guide rail 14114 so that the one or more attachment points 14112 can translate along the second axis 1424 as shown by arrows 1428. In some such implementations, the attachment points can be locked or unlocked so that the attachment points can be fixed relative to the guide rail when locked, or can slide along the rail when unlocked, which can allow the attachment point position to be readjusted to accommodate new tool configurations or changes in maintenance procedures. As discussed below, one or more attachment points 14112 of the attachment system can be attached and connected to the upper support frame 1414 as a removable lifting system (i.e., elevated connection points).

[0174] Fig.15A and 15B Describe Fig.14 A side view of another exemplary semiconductor processing tool and a first exemplary detachable lift system. Fig.15A, a base 1416 can be seen attached to an upper support frame 1414 and having a removable portion 1418. An attachment point 14112 can also be seen connected to the upper support frame 1414; this can be a movable or fixed attachment point as discussed above. A first exemplary detachable lifting system 14116 can also be seen and includes a vertical member 14118 having a top end 14120 to which a complementary attachment point 14122 is attached and a bottom end 14124 to which a moving mechanism 14126 (e.g., wheels or tracks) is attached. The moving mechanism 14126 can be positioned on and supported by the Fab floor 14128 and allows the first exemplary detachable lifting system 14116 to move in various directions around the Fab floor. The complementary attachment point 14122 is configured to connect or attach to the attachment point 14112 of the attachment system, such as Fig. 15B 14127, the first exemplary removable lift system 14116 is attached to the upper support frame 1414. This attachment provides lateral support to the first exemplary removable lift system 14116, allowing it to have a relatively small footprint so that it can be installed within the service area 1415 and in close proximity to the tool 1400, and enables the first exemplary removable lift system 14116 to lift, lower, and support heavy removable components of the tool 1400. Without the elevated attachment between the upper support frame 1414 and the removable lift system 14116, the first exemplary removable lift system 14116 would not be able to lift, move, or support removable components, and would instead tip over in the absence of support features extending along the fab floor (similar to the feet extending from a traditional lift mechanism), which may be larger than the area allowed between the tools.

[0175] The first exemplary detachable lift system 14116 also includes a lift arm 14130, which can be the same or similar to the first lift arm described above. For example, the lift arm 14130 can include a lift feature engagement interface as described above, and can be configured to pivot about a vertical axis 1434, which is perpendicular to the second axis 1424 and the first axis 1406 and extends through the vertical member 14118. In some embodiments, the first exemplary detachable lift system 14116 can also include a vertical translation system 14132, which is configured to translate the lift arm 14130 along the vertical axis 1434 in the direction of arrow 1464, as described above. As described above, the vertical load of the removable component is borne by the lift arm 14130 and the vertical member 14118, and thus transferred to the Fab floor by the first exemplary detachable lift system 14116 connected to the Fab floor.

[0176] This vertical translation system 14132 can be motor powered or manually driven, such as by a hand crank or cable and winch drive, such as Fig. 15B In some embodiments, once the complementary attachment point 14122 of the first exemplary removable lift system 14116 is connected to the upper support frame 1414 at the attachment point 14112, the lift arm 14130 is movable so that the lift feature engagement interface can be moved to engage with the lift feature of one of the removable components of the first plurality 1402 of semiconductor processing chambers 1404. The mobility of the lift arm 14130 can be the same as described above, for example, with the lift arm 14130 included in the upper support frame 1414. Figures 6A-6E 1434 so that it can move horizontally or in a plane perpendicular to the vertical axis 1434.

[0177] In some embodiments, the first exemplary detachable lift system 14116 is configured to translate along the second axis 1424. In some such embodiments, the attachment system may have a rail 14114 and a movable attachment point 14112 connected to the rail 14114 and movable along the second axis 1424, as described above, such that when a complementary attachment point 14122 of the first exemplary detachable lift system 14116 is connected to the upper support frame 1414 at the attachment point 14112, the first exemplary detachable lift system 14116 and the attachment point 14112 simultaneously move together along the second axis 1424, as described above. Fig.14 As shown by arrow 1428 in FIG. Fig.15A and 15B , the movement can be viewed as entering and leaving the page. This movement enables the first exemplary detachable lift system 14116 to connect with any removable component of the first plurality of semiconductor processing chambers 1402, allowing the removable component to be raised, moved, and lowered. In such an embodiment, the moving mechanism 14126 contacts the Fab floor 14128 and moves the vertical member 14118 along the second axis 1424 along with the rest of the first exemplary detachable lift system 14116.

[0178] In some embodiments, a second exemplary detachable lift system may be provided that is similar in construction to the first exemplary detachable lift system but differs in certain respects. The second exemplary detachable lift system includes a vertical member, a lift arm, at least one attachment point for connecting to a tool, wheels or rollers for allowing movement around semiconductor processing equipment, and additional features and configurations described herein. In some cases, the second exemplary detachable lift system may not be self-contained or may not be able to support the load of the detachable component without being connected to the tool. Fig.16A perspective view of a second exemplary detachable lifting system 16116 is depicted, comprising a vertical member 16118 having a top end 16120 with an elevated attachment point 16121 (also referred to herein as a complementary attachment point) and a bottom end 16124 with a moving mechanism 16126 (e.g., wheels or tracks), and also comprising a lifting arm 16130 and a vertical translation system 16132.

[0179] In some embodiments, lifting arm 16130 can be the same or similar to the first lifting arm and lifting arm 14130 described above. In some embodiments, lifting arm 16130 can include two or more connecting rods, such as Fig.16 Here, the lifting arm 16130 has three links, wherein the first link 16131 and the second link 16133 are parallel to each other and form a double shoulder joint 16135 and a double elbow joint 16137 with the third link 16139. The lifting arm 16130 is configured to pivot about a vertical axis 1634 at the double shoulder joint 16135, and the vertical axis 1634 is substantially parallel to the longitudinal axis of the vertical member 16118 (substantially means, for example, within about 5% or 1% of parallel). Fig.21 The longitudinal axis depicted in FIG. 1 extends along the length of the vertical member 16118 and intersects the top end 16120 and the bottom end 16124. The lifting arm 16130 is also configured to rotate about another axis 16141 parallel to the vertical axis 1634 at the elbow joint 16137. The distal end of the third link 16139 of the lifting arm 16130 may have any of the above-described lifting feature engagement interfaces, so that it is used to engage with the lifting features of any of the removable components described herein. Depending on the configuration of the lifting arm, it may be movable as described above, for example, including Figures 6A-6E , so that it can move horizontally or in a plane perpendicular to the vertical axis 1634. This movement is also shown Fig. 20A and 20B middle.

[0180] This vertical translation system 16132 can be powered by a motor or manually driven, for example, by a motor 16166 and a drive screw 16167, such as Fig.16 The vertical translation system 16132 is configured to translate the lifting arm 16130 along the vertical axis 1634. As described above, this enables the lifting arm 16130 to raise and lower the removable components of the tool.

[0181] The second exemplary detachable lift system can be attached to the tool in a number of ways. For example, similar to the first exemplary detachable lift system, the second exemplary detachable lift system can be connected to the tool at a single elevated attachment point while the bottom of the second exemplary detachable lift system is located on and supported by the floor of the manufacturing facility. In some embodiments, the second exemplary detachable lift system can be connected to the tool at two different attachment points (e.g., an upper attachment point and a lower attachment point). Fig.17 Another exemplary semiconductor processing tool is depicted. Similar to the other figures described above, the exemplary tool 1700 includes an upper support frame 1714, a first plurality 1702 of semiconductor processing chambers 1704 arranged along a first axis 1706, a base 1716 fixedly attached directly or indirectly to the upper support frame 1714, and a removable component (e.g., a removable upper cover 1718) having a lifting feature as described above. The tool also includes one or more upper attachment points 17112A-D fixedly attached to the upper support frame 1714 and one or more lower attachment points 17113A-D fixedly attached to a lower component of the tool (e.g., a lower frame or plate 17115). As shown in FIG. Fig.17 As shown, in some embodiments, each upper attachment point has a corresponding lower attachment point, and each pair is positioned parallel to each other along an axis perpendicular to the first axis 1706 (e.g., the vertical axis 1634).

[0182] Fig.18A and Fig.18B Shows the tools and Fig.16 and Fig.17 A side view of the attachment sequence between a second exemplary detachable lifting system. Fig.18A 16, the second exemplary detachable lift system 16116 is separated from the tool 1700 but aligned therewith so that the upper attachment point 17112 of the tool 1700 can be connected to the raised attachment point 16121 of the second exemplary detachable lift system 16116, and the lower attachment point 17113 of the tool can be connected to the bottom attachment point 16123 of the second exemplary detachable lift system 16116, as indicated by the dashed double arrow. The lower attachment point 17113 can be used to support the weight of the second exemplary detachable lift system 16116, such as a horizontal rod having a U-shaped container to receive the bottom attachment point 16123, as shown. Fig.18A shown.

[0183] exist Fig.18B1700, the second exemplary detachable lift system 16116 is connected to the tool 1700 at upper attachment points 17112 and lower attachment points 17113 of the tool 1700. This attachment provides lateral and vertical support to the second exemplary detachable lift system 16116, allowing it to have a relatively small footprint so that it can fit within the service area and in close proximity to the tool 1700, allowing the second exemplary detachable lift system 16116 to lift, lower, and support heavy removable components of the tool 1700. Without these upper and lower attachments, it would be impossible for the second exemplary detachable lift system 16116 to lift, move, or support removable components without tipping over. In some embodiments, such as Fig.18B As shown, when connected to the tool 1700, the second exemplary detachable lift system 16116 may not be in direct contact with or supported by the floor of the manufacturing facility. In some such embodiments, the vertical loads supported by the second exemplary detachable lift system 16116 are transferred to the tool 1700 through the upper and lower attachment points 17112 and 17113; these loads are not directly transferred to the floor through direct contact between the floor and the second exemplary detachable lift system 16116. In some other embodiments, the second exemplary detachable lift system 16116 may be in direct contact with and supported by the floor of the manufacturing facility so that the vertical loads supported by the second exemplary detachable lift system 16116 are directly transferred to the floor.

[0184] Once connected to the tool, the lift arm 16130 is movable so that its lift feature engagement interface can be moved to engage with a lift feature of one of the removable components described above. Fig.19 Depicts connection to Figure 17-18B A perspective view of a second exemplary detachable lifting system 16116 of the tool 1700 is shown. Fig.19 As shown, the lifting arm 16130 has been moved so that its lifting feature engagement interface 1652 can engage with the lifting feature 1942 of the removable component 1718. Once these items are engaged, the lifting arm 16130 can be moved to move the removable component 1718 in a plane transverse to the vertical axis 1634, which is in the x-axis and y-axis shown in the figure. The vertical translation system 16132 can also raise and lower the removable component along the depicted z-axis or vertical axis 1634, which can be substantially parallel to each other (e.g., within + / - 5% of parallel).

[0185] Fig. 20A and 20B Depicts the sequence of moving removable components of the second exemplary detachable lifting system 16116. Similar to the above Figures 6A-6E , these figures are Figure 17-19A simplified top view of the tool in FIG. 1 with a second exemplary detachable lifting system 16116 attached to the tool; Fig.16 , 18A They are viewed at an angle parallel to the vertical axis 1634 of 19 such that the vertical axis 1634 is perpendicular to the page and extends into the page. Also visible are the first plurality 1702 of semiconductor processing chambers 1704, as well as the bases 1716 of these processing chambers, the lift arms 16130, and the lift feature engagement interfaces 1752 that engage the lift features 1742 of the removable components 1718. Fig. 20B As shown, the lifting arm 16130 is movable so that the removable component 1718 can be removed from and away from the processing chamber 1704 in a direction at least perpendicular to the first axis 1706, as shown by the arrow on the removable component 1718. This movement is caused by the movement of the linkage and joints of the lifting arm 16130 (including rotation around the vertical axis 1634 and another axis 16141). In some embodiments, the lifting arm 16130 can have only one linkage, and the removable component 1718 can still move in a plane perpendicular to the vertical axis 1634 as described above, including examples where the first carrier remains fixed. As described above and in Fig. 20B Such movement of the lifting arm also enables a removable component engaged with the lifting arm to be moved outside of the housing 20170 of the tool, as partially depicted in FIG.

[0186] In some embodiments, the second exemplary detachable lift system is configured so that the vertical translation system and lift arm move together along the vertical member as a unit. This can allow the second exemplary detachable lift system to be easily moved around a manufacturing facility and stored close together when not in use. This can also advantageously allow the vertical translation system to be moved out of the way during installation and removal from the tool so that the vertical translation system does not block or hinder access to the elevated attachment points. Fig.21 Depicted Fig.16 Here, the second exemplary detachable lifting system 16116 includes a slide rail 16145 configured to allow the vertical translation system 16132 and the lifting arm 16130 to move together along the vertical member 16118 along the longitudinal axis 16147 of the vertical member 16118 as a unit. Fig.21 As shown, the vertical translation system 16132 and the lifting arm 16130 have moved together toward the bottom end of the vertical member 16118. In some embodiments, this movement is unpowered, while in other embodiments, it can be driven by a motor, linear actuator, or other mechanism described herein.

[0187] As described above, the second exemplary detachable lift system 16116 can be moved across the floor of a manufacturing facility by positioning the movement mechanism 16126 on the floor of the manufacturing facility. In some embodiments, the movement mechanism 16126 may include Fig.21 Here, the foldable wheel set 16149 is unfolded so that all four wheels of the second exemplary detachable lifting system 16116 are positioned on and supported by the floor so that it can be moved on the floor. The foldable wheel set 16149 is not intended to support the load of the removable components of the tool, but is intended to assist in moving the second exemplary detachable lifting system 16116. Fig.18A , it can be seen that the foldable wheel set 16149 is folded or closed to reduce the footprint of the installed second exemplary detachable lifting system 16116.

[0188] As described above, the tool may include additional upper and lower attachment points so that the second exemplary detachable lift system may be positioned at various locations in the tool to access all semiconductor processing chambers of the tool. Fig. 20B , tool 1700 can include additional upper and lower attachment points around some or all of the semiconductor processing chambers (e.g., around locations 20150). This enables the second exemplary removable lift system 16116 to be removably connected to tool 1700 at each of these locations 20150 so that it can access removable components on all of the semiconductor processing chambers 1704A-E. In some embodiments, each pair of upper and lower attachment points can be positioned approximately between two side-by-side chambers so that the second exemplary removable lift system 16116 can be positioned in one location and access removable components of two side-by-side chambers. For example, referring to Fig. 20A , wherein the upper and lower attachment points to which the second exemplary removable lift system 16116 is attached allow it to access removable components of two semiconductor processing chambers 1704D and 1704E. Thus, in some such embodiments, the number of upper and lower attachment point pairs may be one less than the number of chambers in the plurality of semiconductor processing chambers. For example, in Fig. 20A and 20B In the embodiment, the plurality of semiconductor processing chambers 1702 has five chambers 1704A-E, and there may be four upper and lower attachment point pairs positioned approximately between each of the chambers, such as Fig.17 As can be seen, it depicts four pairs of upper and lower attachment points 17112A-D and 17113A-D at positions 20150, respectively.

[0189] As described above, the connection between the removable lift system and the tool is reconfigurable, which allows the system to be attached to or removed from the tool without destructive means. This may include the use of bolts, pins, screws, clamps, or other features that can be secured together and removed without damaging the tool or system (such as damage caused by welding). Thus, the removable lift system can be moved into position and connected to the tool for a limited time (such as the time required for maintenance or repair), and then removed and moved to another tool or a different storage location within the facility.

[0190] The detachable lift system may also include any of the safety features described above, such as a power cord and safety interlocks along the lift arm.

[0191] In addition to the claims listed in this disclosure, it should be understood that the following other implementations are within the scope of this disclosure:

[0192] Implementation 1: A semiconductor processing tool, comprising: a support frame, a first plurality of semiconductor processing chambers arranged along a first axis, a first attachment point connected to the support frame, and a first detachable lifting system, wherein each semiconductor processing chamber has a base fixedly mounted relative to the support frame and has a removable upper cover comprising one or more lifting features, the first detachable lifting system may include a vertical member, the vertical member includes a top end having a complementary attachment point and a bottom end having a moving mechanism, the complementary attachment point is detachably connected to the first attachment point, the moving mechanism may be supported by a floor, the first detachable lifting system may further include a lifting arm connected to the vertical member, and it has one or more connecting rods, the lifting arm is configured to pivot around a vertical axis, the vertical axis is substantially perpendicular to the first axis, the lifting arm includes a lifting feature engagement interface, which is configured to engage with the lifting feature of any removable upper cover of the first plurality of semiconductor processing chambers.

[0193] Implementation 2: The semiconductor processing tool according to Implementation 1, wherein the first detachable lifting system further comprises a vertical translation system configured to vertically translate the lifting arm relative to the support frame in a direction parallel to the vertical axis.

[0194] Implementation 3: A semiconductor processing tool according to Implementation 2, wherein the first vertical translation system includes a motor configured to provide a first mechanical input to the first vertical translation system, and wherein the first mechanical input causes the lifting arm to translate along the vertical member.

[0195] Implementation 4: The semiconductor processing tool of Implementation 3, wherein the first vertical translation system moves along the vertical member with the lifting arm as a unit.

[0196] Implementation 5: The semiconductor processing tool according to Implementation 1, wherein the moving mechanism may include foldable wheels.

[0197] Implementation scheme 6: A semiconductor processing tool includes a support frame having an upper attachment point and a lower attachment point vertically offset below the upper attachment point; a first plurality of semiconductor processing chambers arranged along a first axis; and a detachable lifting system, wherein each semiconductor processing chamber has a base fixedly mounted relative to the support frame and has a removable component including one or more lifting features, the detachable lifting system includes a vertical member, the vertical member includes a top end having an elevated attachment point, a bottom end having a bottom attachment point, and a moving mechanism, the elevated attachment point is detachably connected to the upper attachment point, and the bottom attachment point is detachably connected to the lower attachment point, the detachable lifting system further includes: a lifting arm having one or more connecting rods, and configured to pivot around a vertical axis substantially perpendicular to the first axis, and a vertical translation system configured to vertically translate the lifting arm relative to the support frame in a direction parallel to the vertical axis, and the lifting arm includes a lifting feature engagement interface, which is configured to engage with the lifting feature of any removable component of the first plurality of semiconductor processing chambers.

[0198] Implementation 7: A semiconductor processing tool according to Implementation 6, wherein the vertical translation system includes a motor configured to provide a first mechanical input to the first vertical translation system, and wherein the first mechanical input causes the lifting arm to translate in a direction parallel to the vertical axis.

[0199] Implementation 8: A semiconductor processing tool according to Implementation 7, wherein the semiconductor processing tool also includes a power supply, wherein the detachable lifting system further includes an electrical control cable, which is connected to the power supply, arranged along the lifting arm, and terminated at a connector, each removable component further includes an electrical interface configured to be connected to the connector, and the length of the electrical control cable is such that the connector and the lifting feature engagement interface of the lifting arm can only be engaged with the electrical interface and lifting feature of a single processing chamber in the semiconductor processing chamber at a time.

[0200] Implementation 9: According to the semiconductor processing tool described in Implementation 8, it may also include a controller, wherein the controller has one or more processors and one or more non-temporary memory devices storing instructions for controlling the one or more processors to: receive information about the operating status of each semiconductor processing chamber, and only when the information about the operating status of one of the semiconductor processing chambers indicates that the semiconductor processing chamber is under personnel safety conditions, trigger the first actuation signal provided by the electrical interface of the semiconductor processing chamber to operate the vertical translation system.

[0201] Implementation 10: A semiconductor processing tool according to Implementation 8, wherein the removable component can receive power from a power source via a cable.

[0202] Implementation 11: The semiconductor processing tool of Implementation 7, wherein the vertical translation system is a linear ball screw actuator, a hydraulic actuator, a rack and pinion actuator, or a cable winch.

[0203] Implementation: According to the semiconductor processing tool described in the implementation, the detachable lifting system further includes a first interlocking device, which is configured to engage with the lifting features of any removable components of the first plurality of semiconductor processing chambers, and prevent the first vertical translation system from vertically translating the first lifting arm when it is not engaged with the lifting features of one of the removable components of the first plurality of semiconductor processing chambers.

[0204] Implementation 13: A semiconductor processing tool according to Implementation 6, wherein the moving mechanism includes four wheels.

[0205] Implementation 14: A semiconductor processing tool according to Implementation 6, wherein the moving mechanism includes a foldable wheel set.

[0206] Implementation 15: The semiconductor processing tool of Implementation 6, wherein the first vertical translation system is configured to move along the vertical member together with the lifting arm as a unit.

[0207] Implementation 16: The semiconductor processing tool of Implementation 15, wherein the vertical member further comprises a slide rail, and the first vertical translation system is configured to move along the slide rail.

[0208] Implementation 17: The semiconductor processing tool of Implementation 6, wherein the movement mechanism is not supported by the floor when the movement mechanism is connected to the lower attachment point and the upper attachment point.

[0209] Implementation 18: The semiconductor processing tool of Implementation 6, wherein the moving mechanism is supported by the floor when the moving mechanism is connected to the lower attachment point and the upper attachment point.

[0210] Implementation 19: The semiconductor processing tool of Implementation 6, wherein the lower attachment point is vertically offset below the base of the plurality of processing chambers.

[0211] Implementation 20: A semiconductor processing tool according to Implementation 6, wherein the support frame further includes a plurality of upper attachment points, the tool further includes a plurality of lower attachment points offset below the plurality of upper attachment points, the plurality of semiconductor processing chambers include N processing chambers, the plurality of upper attachment points may include N-1 upper attachment points, and the plurality of lower attachment points include N-1 lower attachment points.

[0212] Implementation 21: A semiconductor processing tool according to Implementation 6, wherein the lifting arm further includes three or more connecting rods, a double shoulder joint, and a double elbow joint.

[0213] Implementation 22: The semiconductor processing tool of Implementation 6, wherein the removable component is not a substrate.

[0214] Implementation 23: The semiconductor processing tool of Implementation 6, wherein the lift arm is not configured to support a substrate.

[0215] Implementation 24: The semiconductor processing tool of Implementation 23, wherein the lift feature engagement interface is not configured to support a substrate.

[0216] The tool features described herein provide numerous advantages for lifting and moving removable components over conventional lifting mechanisms. These features enable cluster tools to be placed closer together because no additional Fab floor space is required to accommodate independent lifting mechanisms, the footprint of the tool is not expanded or is only slightly expanded due to the inclusion of these features, and removable components can be more easily accessed and moved more quickly, thereby reducing tool downtime required for repair and maintenance. The ability to control the movement of the carrier and lifting arm using a moving mechanism and controller also enables more efficient, faster and safer control and movement of removable components.

[0217] Unless the context of the present disclosure clearly requires otherwise, throughout the present description and claims, words such as "comprises", "including", and the like should be interpreted as inclusive, rather than exclusive or exhaustive; that is, as "including, but not limited to". Words using the singular or plural number generally also include the plural or singular number, respectively. In addition, "herein", "below", "above", "below", and terms of similar meaning refer to the present application as a whole and not to any particular part of the present application. When the word "or" is used in a list of two or more items, this word applies to all of the following interpretations: any one of the items in the list, all of the items in the list, and any combination of the items in the list. The term "implementation" means an implementation of the techniques and methods described herein, as well as a physical object that embodies the structures described herein and / or incorporates the techniques and / or methods described herein. Unless otherwise specified, the term "substantially" herein means within 5% of a reference value. For example, substantially perpendicular means within + / -5% of perpendicular.

Claims

1. A semiconductor processing tool comprising: Upper support frame; a first plurality of semiconductor processing chambers arranged along a first axis; a first linear guide system fixedly supported by the upper support frame and extending along a second axis substantially parallel to the first axis; as well as The first carrier, wherein: Each semiconductor processing chamber has a base fixedly mounted relative to the upper support frame and has a removable upper cover including one or more lifting features. The first carriage comprises a first lifting arm having one or more connecting rods, The first lifting arm is configured to pivot about a vertical axis that is substantially perpendicular to the second axis, The first carrier is configured to movably engage the first linear guide system and to translate along the second axis relative to the first linear guide system, The first lift arm includes a lift feature engagement interface configured to engage with the lift feature of any one of the removable upper covers of the first plurality of semiconductor processing chambers, The first carrier and the first lift arm are movable so that the lift feature engagement interface can be moved to engage the lift feature of any one of the removable covers of the first plurality of semiconductor processing chambers, and The lift feature engagement interface is connected to the distal end of the first lift arm using a joint, and the joint is configured to allow the lift feature engagement interface to rotate about two or more axes perpendicular to the vertical axis.

2. The semiconductor processing tool of claim 1 , wherein the first carrier further comprises a first vertical translation system configured to vertically translate the first lift arm relative to the first linear guide system in a direction parallel to the vertical axis.

3. The semiconductor processing tool of claim 2, further comprising a power supply, wherein: The first vertical translation system includes a motor configured to provide a first mechanical input to the first vertical translation system, wherein the first mechanical input causes the first lifting arm to vertically translate in a direction parallel to the vertical axis, The first carrier further includes an electrical control cable connected to the power source, arranged along the first lifting arm, and terminated at a connector, Each removable cover further comprises an electrical interface configured to be connected to the connector, and The length of the electrical control cable is such that the connector and the lift feature engagement interface of the first lift arm can only simultaneously engage the electrical interface and the lift feature of a single one of the semiconductor processing chambers at a time.

4. The semiconductor processing tool of claim 3, further comprising a controller comprising one or more processors and one or more non-transitory memory devices storing instructions for controlling the one or more processors to: receiving information regarding the operating status of each semiconductor processing chamber, and Only when the information about the operating status of one of the semiconductor processing chambers indicates that the semiconductor processing chamber is under personnel safety conditions, the first actuation signal provided by the electrical interface of the semiconductor processing chamber causes the first vertical translation system to operate.

5. The semiconductor processing tool of claim 3, further comprising: a first carrier positioning sensor configured to generate data regarding a position of the first carrier along the first linear guide system; and A controller comprising one or more processors and one or more non-transitory memory devices storing instructions for controlling the one or more processors to: determining the position of the first carrier along the first linear guide system based on the data generated by the first carrier positioning sensor, and Based on the determination of the position of the first carrier, the electrical interface of only one semiconductor processing chamber of the first plurality of semiconductor processing chambers is powered at a time.

6. The semiconductor processing tool of claim 5 , further comprising an arm position sensor configured to generate data regarding the position of the first lift arm relative to the semiconductor processing chamber of the first plurality of semiconductor processing chambers, wherein the one or more non-transitory memory devices store further instructions for controlling the one or more processors to: determining the position of the lift arm with respect to each of the semiconductor processing chambers of the first plurality of semiconductor processing chambers based on the data generated by the arm position sensor, and Based on the determination of the position of the lift arm and the determination of the position of the first carrier, only the electrical interfaces of the semiconductor processing chambers of the first plurality of semiconductor processing chambers closest to the lift feature engagement interface of the first lift arm are powered.

7. A semiconductor processing tool according to claim 5, wherein the one or more non-volatile memory devices store further instructions for controlling the one or more processors to cause the first lifting arm to move only on a first side of a vertical plane that passes through the first carrier, is parallel to the vertical axis and is perpendicular to the second axis.

8. The semiconductor processing tool of claim 3, further comprising: an engagement sensor configured to generate data regarding whether the lift feature engagement interface of the first lift arm is engaged with the lift feature of one of the removable upper covers, A controller comprising one or more processors and one or more non-transitory memory devices storing instructions for controlling the one or more processors to: determining whether the lift feature engagement interface of the first lift arm is engaged with the lift feature of one of the removable upper covers of the first plurality of semiconductor processing chambers based on the data generated by the engagement sensor, and In response to determining that the lifting feature engagement interface is engaged with the lifting feature of one of the removable upper covers of the first plurality of semiconductor processing chambers, only the electrical interface of the semiconductor processing chamber of the first plurality of semiconductor processing chambers that includes the removable upper cover is powered.

9. The semiconductor processing tool of claim 3, wherein the removable cover receives power from the power supply via the cable.

10. The semiconductor processing tool of claim 2, wherein the first carrier further comprises a first interlock, the first interlock being configured to: engaging the lift feature of any of the removable covers of the first plurality of semiconductor processing chambers, and The first vertical translation system is prevented from vertically translating the first lift arm when not engaged with the lift feature of one of the removable lids of the first plurality of semiconductor processing chambers.

11. The semiconductor processing tool of claim 2, wherein the first vertical translation system is selected from the group consisting of: a linear ball screw actuator, a hydraulic actuator, a rack and pinion actuator, and a cable winch.

12. The semiconductor processing tool of claim 2, further comprising a controller comprising one or more processors and one or more non-transitory memory devices, wherein: The first linear guide system further comprises a carriage translation system configured to translate the first carriage along the second axis, The first carrier further comprises a lift arm movement system configured to move the first lift arm in a plane perpendicular to the vertical axis, and The one or more non-transitory memory devices store instructions for controlling the one or more processors to: causing the carrier translation system to move the first carrier along the second axis, causing the lift arm movement system and the first vertical translation system to move the first lift arm so that the lift feature engagement interface engages with the lift feature of one of the removable upper covers of the first plurality of semiconductor processing chambers, When the lifting feature engagement interface engages with the lifting feature of one of the removable upper covers, causing the first vertical translation system to vertically translate the removable upper cover, and When the lift feature engagement interface engages the lift feature of one of the removable covers, the lift arm movement system is caused to translate the removable cover in a plane perpendicular to the vertical axis.

13. The semiconductor processing tool of claim 12, wherein the one or more non-transitory memory devices store further instructions for controlling the one or more processors to: When the lifting feature engagement interface engages with the lifting feature of one of the removable upper covers, the lifting arm movement system and the first vertical translation system move the first lifting arm to disengage the lifting feature engagement interface from the lifting feature of the removable upper cover.

14. The semiconductor processing tool of claim 12, wherein the one or more non-transitory memory devices store further instructions for controlling the one or more processors to: When the lift feature engagement interface engages the lift feature of one of the removable covers, the carrier translation system and the lift arm movement system are caused to translate the removable cover in the plane perpendicular to the vertical axis.

15. The semiconductor processing tool of claim 1, wherein: The semiconductor processing chambers of the first plurality of semiconductor processing chambers are each located within a tool housing, and The first lifting arm is movable so that any of the removable covers of the first plurality of semiconductor processing chambers can be moved outside the tool housing.

16. The semiconductor processing tool of claim 1, wherein: The first linear guide system further comprises a first rail and a second rail which are parallel to each other and offset from each other in a direction parallel to the vertical axis, and The first carrier is configured to simultaneously engage the first rail and the second rail and to translate along the second axis relative to the first linear guide system while simultaneously engaged with the first rail and the second rail.

17. A semiconductor processing tool according to claim 16, wherein the first carrier further includes a first vertical translation system, and the first vertical translation system is configured to vertically translate the first lifting arm relative to the first linear guide system in a direction parallel to the vertical axis below the first linear guide system and above the base of the first plurality of semiconductor processing chambers.

18. The semiconductor processing tool of claim 17, wherein the first vertical translation system is further configured to vertically translate the first lift arm over the first linear guide system.

19. The semiconductor processing tool of claim 1, wherein: The first linear guide system is vertically offset above the first plurality of semiconductor processing chambers in a direction parallel to the vertical axis, and The first carrier is vertically offset beneath the first linear guide system.

20. The semiconductor processing tool of claim 1, wherein the joint is a ball joint.

21. The semiconductor processing tool of claim 1 wherein the joint is further configured to allow the lift feature engagement interface to rotate about an axis parallel to the vertical axis.

22. The semiconductor processing tool of claim 1, wherein: The lifting feature of each removable cover includes a pair of saddle posts, Each saddle column includes a pair of vertical risers and a saddle plate spanning between and covering the vertical risers. Each saddle plate includes a first mechanical interface feature, the saddle posts of each lifting feature are positioned such that the first mechanical interface features are spaced apart from each other by a first distance, The lift feature engagement interface includes a beam having two second mechanical interface features, the two second mechanical interface features being spaced apart by the first distance, and Each first mechanical interface feature is complementary to one of the second mechanical interface features.

23. The semiconductor processing tool of claim 1, wherein: Each semiconductor processing chamber of the first plurality of semiconductor processing chambers comprises a removable component selected from the group consisting of: a radio frequency (RF) generator, a pump, and a cryogenic pump, each removable component comprises one or more second lift features, the lift feature engagement interface of the first lift arm being further configured to engage with the second lift features of any of the removable components of the first plurality of semiconductor processing chambers, and The first carrier and the first lift arm are movable such that the lift feature engagement interface can be moved to engage the second lift feature of any of the removable components of the first plurality of semiconductor processing chambers.

24. The semiconductor processing tool of claim 1, wherein said first lift arm comprises a linear section that is perpendicular to said vertical axis and that comprises said lift feature engagement interface.

25. The semiconductor processing tool of claim 24, wherein: The first lifting arm comprises a pivot section in which the first lifting arm is configured to pivot about the vertical axis, and The first lifting arm includes an inclined section spanning between the pivot section and the linear section and positioned at an oblique angle relative to the vertical axis.

26. The semiconductor processing tool of claim 1, wherein the first plurality of semiconductor processing chambers comprises two semiconductor processing chambers.

27. The semiconductor processing tool of claim 26, wherein the first plurality of semiconductor processing chambers comprises three semiconductor processing chambers.

28. The semiconductor processing tool of claim 27, wherein the first plurality of semiconductor processing chambers comprises five semiconductor processing chambers.

29. The semiconductor processing tool of claim 1, further comprising: a second plurality of semiconductor processing chambers arranged along a third axis substantially parallel to and offset from the first axis; an interior region located between the first plurality of semiconductor processing chambers and the second plurality of semiconductor processing chambers; a second linear guide system fixedly supported by the upper support frame and extending along a fourth axis substantially parallel to the third axis; as well as Second carrier, wherein: The first linear guide system and the second linear guide system are both positioned outside the inner area, Each semiconductor processing chamber of the second plurality of semiconductor processing chambers has a second base fixedly mounted relative to the upper support frame and has a second removable upper cover including one or more second lifting features, The second carriage comprises a second lifting arm having one or more connecting rods, The second lifting arm is configured to pivot about a second vertical axis, the second vertical axis being substantially perpendicular to the fourth axis, the second carrier being configured to movably engage the second linear guide system and to translate along the fourth axis relative to the second linear guide system, The second lift arm comprises a second lift feature engagement interface configured to engage with the second lift feature of any second removable upper cover of the semiconductor processing chamber of the second plurality of semiconductor processing chambers, and The second carrier and the second lift arm are movable so that the second lift feature engagement interface can be moved to engage with the lift feature of any of the second removable upper covers of the semiconductor processing chambers in the second plurality of semiconductor processing chambers.

30. The semiconductor processing tool of claim 29, wherein: The bases of the first plurality of semiconductor processing chambers, the second bases of the second plurality of semiconductor processing chambers, and the interior regions are located within a second enclosure, The first lifting arm is movable so that the removable cover of any of the first plurality of semiconductor processing chambers can be moved outside the second housing, and The second lifting arm is movable so that the second removable upper cover of any of the second plurality of semiconductor processing chambers can be moved outside the second housing.

31. The semiconductor processing tool of claim 29, wherein: The second removable upper cover is of the same type as the removable upper cover, the second lift feature engagement interface is of the same type as the first lift feature engagement interface, and The second lift feature is of the same type as the first lift feature.

32. The semiconductor processing tool of claim 1 further comprising a bellows that creates a seal at an interface of the first carrier and the first linear guide system when the first carrier is engaged with the first linear guide system.

33. The semiconductor processing tool of claim 1 further comprising a second carrier, wherein: The second carrier includes a second lifting arm having one or more links, and the second lifting arm is configured to pivot about a second vertical axis, the second vertical axis being perpendicular to the second axis, the second carriage being configured to movably engage the first linear guide system and to translate along the second axis relative to the first linear guide system, The second lift arm comprises a second lift feature engagement interface configured to engage with the lift feature of any one of the removable upper covers of the first plurality of semiconductor processing chambers, The second carrier and the second lift arm are movable so that the second lift feature engagement interface of the second lift arm can be moved to engage the lift feature of any one of the removable upper covers of the first plurality of semiconductor processing chambers; as well as The first linear guide system is further configured such that the first carrier and the second carrier can be simultaneously engaged to the first linear guide system and can move along the second axis.

34. The semiconductor processing tool of claim 1, wherein the removable cover is not a substrate.

35. The semiconductor processing tool of claim 1, wherein the first lift arm is not configured to support a substrate.

36. The semiconductor processing tool of claim 35, wherein the lift feature engagement interface is not configured to support a substrate.

Images