A support component, a semiconductor processing chamber, and an off-line inspection and debugging method for the support component

Abstract

The present invention belongs to the technical field of integrated circuit production equipment, and specifically provides a support component, a semiconductor processing chamber, and an off-line detection and debugging method for the support component, which are applicable to the assembly, debugging, inspection, and testing of various semiconductor devices. After the height and level of each component to be debugged of the support component are adjusted, it can be directly aligned and installed on the semiconductor device without further debugging. This solution provides a possibility for off-line operation, enabling operators to conveniently and quickly complete the assembly, inspection, and testing of the support component, improving production efficiency, production quality, and reducing labor intensity.

Description

Technical Field

[0001] The present invention belongs to the technical field of integrated circuit production equipment, and specifically provides a support component, a semiconductor processing chamber including the support component, and an offline detection and debugging method for the support component, which is applicable to the assembly, debugging, inspection, and testing of various semiconductor devices. Background Art

[0002] With the country's strong promotion of the semiconductor industry, many new domestic semiconductor devices have developed rapidly. During the assembly process of semiconductor devices, there are many movable parts in the support component. The setting and adjustment of parameters such as the level, concentricity, height, and stroke of these parts are very important and cumbersome. Previously, when adjusting these parameters inside the equipment, it was necessary to perform fine operations in a narrow space for a long time, and there was no effective detection method to achieve accurate detection, which brought difficulties to the work of detection and debugging personnel, consumed a lot of man-hours and manpower, and it was easy for operators to make mistakes due to long-term fatigue work. Summary of the Invention

[0003] To solve one of the above problems, the present invention provides a support component installed in the processing chamber of a semiconductor device. The support component is provided with a support frame, an installation plate is provided on the support frame, and two sets of support structures are also provided. The support structure includes an intermediate installation column and three floating ring support rods evenly distributed around the installation column. The center formed by the three floating ring support rods coincides with the center of the heating plate support column. A support plate support rod is also provided inside the circle formed by the three floating ring support rods and close to the intermediate installation column. A V-shaped pin support plate is fixed at the upper end of the support rod, and the height of all support rods is adjustable; a leveling structure is provided at the bottom of the support plate support rod for adjusting the level of the pin support plate; and two motors are also included, which are respectively connected to the installation column for controlling the height of the installation column.

[0004] Further, a clamping member with a boss is provided at the upper end of each floating ring support rod, and the three floating ring support rods form three support points to support the floating ring.

[0005] Further, each support rod is connected to a cylinder to control the lifting height of the support rod.

[0006] Further, for the leveling structure, the structure includes an upper support end face and a lower support end face. Three sliding rods with three-point support are provided between the two support end faces. A limit block is provided at the lower end of the sliding rod, and the upper end has a thread. The head end passes through the lower support end face and the upper support end face in sequence and then a nut is fixed at the head end. A spring is sleeved on the sliding rod between the two support end faces. By adjusting the tightness of the spring, the support rod is adjusted to be in a vertical state, and further the level of the pin support plate is adjusted.

[0007] According to another aspect of the present invention, there is also provided a semiconductor processing chamber, which includes a cavity, a support base, and the support assembly described above. An opening for substrate transfer is provided on the side wall of the cavity, and the substrate is a wafer or a square wafer. The support base is placed inside the cavity, and the support base and the mounting posts on the support assembly match each other, that is, each mounting post of the support assembly is equipped with a support base.

[0008] Further, the support base is selected as a heating plate.

[0009] According to another aspect of the present invention, there is also provided an offline detection and debugging method for the above support assembly, which is applicable to pre-commissioning before installing the support assembly on a semiconductor device. The support assembly is installed on a substrate with through holes, and the method includes the following steps:

[0010] Step 1: Install the support assembly and the heating plate

[0011] After the substrate is leveled and fixed, the mounting plate of the support assembly is fixed under the substrate, and each support rod passes through the through holes on the substrate correspondingly. At the same time, the heating plate is installed on the middle mounting post.

[0012] Step 2: Measure the level of the floating ring

[0013] Place the floating ring on the floating ring support rod. The upper end surface of the floating ring is provided with multiple horizontally concentric and evenly distributed support rods. Place a horizontal wafer on these support rods and measure the level of the wafer. If the wafer is not in a horizontal state, adjust the lifting height of the floating ring support rod to adjust the wafer to be horizontal.

[0014] Step 3: Adjust the height of the support plate support rod by using a cylinder in cooperation with a height reference block zeroing measurement tool.

[0015] Step 4: Use a horizontal wafer to measure and debug the level of the heating plate until the requirements are met, and then adjust the height of the heating plate through a motor.

[0016] Step 5: Measure the level of the pin support plate by using a horizontal wafer, and adjust the level of the pin support plate and the height of the support rod to meet the requirements.

[0017] Step 6: Adjust the positions of the three floating ring support rods to make the floating ring concentric with the heating plate.

[0018] Further, the substrate is designed in a rectangle and its level can be adjusted. The substrate is arranged on a support frame, and a jackscrew is provided at each of the four corners of the substrate. The lower end of the jackscrew is connected to the support frame. Adjust the jackscrew to achieve the leveling of the substrate. The substrate is provided with multiple through holes, and the size and position of the through holes match the installation through holes on the target semiconductor device. At the same time, the distribution of the through holes matches the positions of the support rods on the support assembly, and there is no interference when the support rods on the support assembly pass through the through holes during installation.

[0019] Further, in Steps 2 and 3, a dial indicator is used to measure the heights of the floating ring support rod and the pin support plate, and the cylinder is adjusted to meet the requirements of the height.

[0020] Further, in Step 4, the horizontal wafer is directly placed on the heating plate, and the levelness is measured by a laser leveling instrument, or three through holes are evenly arranged on the heating plate centered on the center of the circle. Three supports with threaded holes are evenly arranged on the back of the through holes. The jacking screw support rod is placed in the support, and the upper end face of the jacking screw support rod has a circular lifting part; the three jacking screw support rods are adjusted to move up and down so that the heights of their upper ends from the heating plate are the same. The horizontal wafer is placed on the three jacking screw support rods, and the levelness of the wafer is measured to obtain the level state of the heating plate, and the heating plate is debugged to meet the requirements.

[0021] Further, in Step 5, the V-shaped pin support plate is located below the heating plate. Three through holes are evenly arranged concentrically on the heating plate. A support rod is arranged at each through hole. The lower end of each support rod naturally hangs down and contacts the pin support plate. The wafer is placed on the upper ends of the three support rods, and the levelness of the wafer is measured to obtain the levelness of the pin support plate. If it is not in a horizontal state, the support plate support rod is adjusted to make the pin support plate horizontal, and the height is adjusted by the support rod cylinder.

[0022] The advantages of this solution are as follows:

[0023] After the height and level of each component of the support assembly that needs to be debugged are adjusted, it can be directly aligned and installed on the semiconductor device without further debugging. This solution provides a possibility for offline operation, enabling the operator to conveniently and quickly complete the assembly, inspection, and testing of the support assembly, improving production efficiency, production quality, and reducing labor intensity. Description of the Drawings

[0024] Figure 1 It is a schematic structural diagram of an embodiment of the support assembly;

[0025] Figure 2 It is a schematic diagram of the positions of the wafer, the heating plate, and the support plate;

[0026] Figure 3 It is a diagram of the floating ring and the mating position of the floating ring and the wafer;

[0027] Figure 4 It is a schematic diagram of the position of the support assembly after being installed on the substrate;

[0028] Figure 5 It is a schematic structural diagram of the semiconductor processing chamber;

[0029] In the figure, there are support frame - 1, mounting plate - 2, mounting post - 3, floating ring support rod - 4, support plate support rod - 5, pin support plate - 6, motor - 7, base plate - 8, support frame - 9, horizontal wafer - 10, heating plate - 11, small support rod - 12, floating ring support rod bracket - 13, floating ring - 14, reference block - 15. Detailed implementation mode

[0030] In order to make the purpose, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0031] Refer to Figures 1-4 , the present invention provides a support assembly, which is installed in the processing chamber of a semiconductor device. There is a support frame 1 on the support assembly, and a mounting plate 2 is provided on the support frame 1. There are also two groups of support structures. The support structure includes an intermediate mounting post 3 and three floating ring support rods 4 evenly distributed around the mounting post 3. The center formed by the three floating ring support rods 4 coincides with the center of the mounting post 3. A support plate support rod 5 is also provided inside the circle formed by the three floating ring support rods 4 and close to the intermediate mounting post 3. A V - shaped pin support plate 6 is fixed at the upper end of the support rod 5.

[0032] A clamping part with a boss is provided at the upper end of each floating ring support rod 4. The three floating ring support rods 4 form three support points for supporting the floating ring. In this solution, the three support points are exactly on the edge of the supporting floating ring.

[0033] A cylinder is connected to the bottom of each support rod to control the lifting of the support rod and adjust the height of the support rod.

[0034] A leveling structure is provided at the bottom of the above - mentioned support plate support rod 5 for adjusting the level of the pin support plate. The leveling structure includes an upper support end face and a lower support end face. Three sliding rods are provided between the two support end faces to form a triangular support for the support plate support rod 5. A limit block is provided at the lower end of the sliding rod, and the upper end has a thread. The head end of the sliding rod passes through the large - diameter through - holes on the lower support end face and the upper support end face in sequence. The inner wall of the circular through - hole is designed to be smooth and its diameter is much larger than the diameter of the 3 sliding rods. The sliding rod can tilt left and right in the circular through - hole. A nut is fixed at the head end of the sliding rod, and a spring is sleeved on the sliding rod between the two support end faces. By adjusting the tightness of the spring, the level of the upper end face is adjusted, and then the support rod is adjusted to be in a vertical state.

[0035] The support assembly further includes two motors 7, which are respectively connected to the heating plate support column 3 for controlling the lifting of the heating plate 11 to achieve height adjustment.

[0036] Refer to Figure 5, According to another aspect of the present invention, there is also provided a semiconductor processing chamber, which includes a cavity, a support base 11, and the support assembly described in any one of the above, wherein there is an opening on the side wall of the cavity for substrate transfer, and the substrate is a wafer or a square piece; the support base 11 is placed inside the cavity, and the support base 11 matches the mounting posts 3 on the support assembly, that is, each mounting post 3 of the support assembly is equipped with a support base, and the support base is selected as a heating plate.

[0037] According to another aspect of the present invention, there is provided an off-line detection and debugging method for the above support assembly, which is applicable to the pre-installation debugging before installing the support assembly on a semiconductor device. The support assembly is installed on a substrate 8 with through holes, and the following debugging steps are included.

[0038] Step 1: Install the support assembly and the heating plate 11

[0039] The substrate 8 is designed in a rectangle and its level can be adjusted. The substrate 8 is arranged on a support frame 9. Each of the four corners of the substrate 8 is provided with a jackscrew 13, and the lower end of the jackscrew is connected to the support frame 9. The level of the substrate 8 is adjusted by adjusting the jackscrews. The substrate 8 is provided with a plurality of through holes, and the size and position of the through holes match the mounting through holes on the target semiconductor device. At the same time, the distribution of the through holes matches the positions of the support rods on the support assembly, and there is no interference when the support rods on the support assembly pass through the through holes during installation. After the substrate 8 is leveled and fixed, the mounting plate 2 of the support assembly is fixed under the substrate 8, and each support rod correspondingly passes through the through holes on the substrate 8. At the same time, the heating plate 11 is installed on the middle mounting post 3.

[0040] Step 2: Measure and adjust the level of the floating ring

[0041] Place the floating ring on the boss at the upper end of the floating ring support rod 4. The center of the upper end face of the floating ring is provided with a plurality of uniformly distributed support rods diverging outward. Place the horizontal wafer 10 on the support rods of the floating ring. Measure the level of the wafer 10 with a laser level instrument AMS. If the wafer 10 is not in a horizontal state, adjust the height of the support rods of the floating ring so that the wafer 10 meets the horizontal requirements, and then the level measurement and adjustment of the floating ring are completed.

[0042] Step 3: Adjust the height of the support plate support rod 5 by cooperating with the height reference block zeroing measurement tool through a cylinder;

[0043] In the above steps 2 and 3, a dial indicator is used to measure the height of the floating ring support rod 4 and the height of the pin support plate 6, and the height is adjusted through a cylinder to meet the requirements, with the assistance of the height measurement reference block 15.

[0044] Step 4: Use the horizontal wafer 10 to measure and debug the flatness of the heating plate 11 until the requirement is met, and then adjust the height of the heating plate 11 through the motor 7. Specifically, directly place the horizontal wafer on the heating plate 11, measure the flatness of the wafer through a laser leveling instrument, thereby obtaining the flatness state of the heating plate, and debug the flatness of the heating plate to meet the requirement. Or, three through holes are evenly arranged on the heating plate 11 with the center as the center. On the back of the through holes, three supports with threaded holes are evenly arranged. The jacking screw rod is placed inside the support, and the upper end surface of the jacking screw rod has a circular lifting part; adjust the up and down movement of the three jacking screw rods so that the height from their upper ends to the heating plate is the same. Place the horizontal wafer on the three jacking screw rods, measure the flatness of the wafer, thereby obtaining the flatness state of the heating plate, and debug the flatness of the heating plate to meet the requirement.

[0045] Step 5: Measure the flatness of the pin support plate 6 using the horizontal wafer 10, and adjust the flatness of the pin support plate 6 and the height of the support rod to meet the requirement. The V-shaped pin support plate 6 is located below the heating plate 11. There are 3 support points on the support plate. The V shape formed by the three support points matches the support plate. The positions of the support points match the positions of the three large through holes on the heating plate. A small support rod 12 is provided at each through hole. The diameter of the small support rod matches the diameter of the through hole of the heating plate 11 and can move up and down along the through hole of the heating plate 11 under the support of an external force. The lower end of the small support rod 12 is connected to the pin support plate 6. The up and down movement of the pin support plate 6 drives the up and down movement of the small support rod 12. The horizontal wafer 10 is placed on the upper ends of the 3 small support rods, and the flatness of the wafer 10 is measured to obtain the flatness of the pin support plate 6. If it is not in a horizontal state, adjust the support plate to be horizontal, and the height is adjusted through the support rod cylinder.

[0046] Step 6: Adjust the positions of the three floating ring support rods 4 so that the floating ring is concentric with the heating plate 11. In this solution, the three floating ring support rods 4 are arranged on the floating ring support rod bracket 13. The bracket 13 is arranged on the support frame 1 and can slide up, down, left, and right on the bracket 13 in cooperation with the slider and the cushion block, thereby driving the movement of the floating ring support rod 4 and adjusting the concentricity of the floating ring 14 and the heating plate 11.

[0047] After the height and flatness of each component of the support assembly that needs to be debugged are adjusted, it can be directly aligned and installed on the semiconductor device without further debugging. This solution provides a possibility for offline operation, enabling the operator to conveniently and quickly complete the assembly, inspection, and testing of the support assembly, improving production efficiency, production quality, and reducing labor intensity.

[0048] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A support component is installed in the processing chamber of a semiconductor device. It is characterized in that: The support component is provided with a support frame. An installation plate is provided on the support frame, and two groups of support structures are also provided. The support structure includes an intermediate installation column and three floating ring support rods evenly distributed around the installation column. A support plate support rod is also provided inside the circle formed by the three floating ring support rods near the intermediate installation column. A V-shaped pin support plate is fixed at the upper end of the support rod, and the height of all support rods is adjustable. It also includes two motors, which are respectively connected to the installation column and used to control the height of the heating plate. The three floating ring support rods are arranged on a floating ring support rod bracket. The floating ring support rod bracket is arranged on the support frame and can slide up, down, left and right on the support frame in cooperation with sliders and pads, thereby driving the floating ring support rods to move.

2. A support component as described in claim 1. It is characterized in that: A clamping part with a boss is provided at the upper end of each floating ring support rod, and the three floating ring support rods form three support points to support the floating ring.

3. A support component as described in claim 1. It is characterized in that: Each support rod is connected to a cylinder to control the lifting height of the support rod.

4. A semiconductor processing chamber. It is characterized in that: It includes a cavity, a support base and the support component as described in any one of claims 1 to 3. There is an opening for substrate transmission on the side wall of the cavity. The support base is placed inside the cavity, and the installation columns of the support component are all installed with support bases.

5. A semiconductor processing chamber as described in claim 4. It is characterized in that: The support base is a heating plate.

6. An offline detection and debugging method for the support component as described in claim 3, which is applicable to the pre-installation debugging before installing the support component on a semiconductor device. The support component is installed on a substrate with through holes. It is characterized in that: It includes the following steps: Step 1: Install the support component and the heating plate. After the substrate is leveled and fixed, the installation plate of the support component is fixed under the substrate, and each support rod passes through the through hole on the substrate correspondingly. At the same time, the heating plate is installed on the intermediate installation column. Step 2: Measure the level of the floating ring. Place the floating ring on the floating ring support rods. There are multiple horizontally concentric and evenly distributed support rods on the upper end surface of the floating ring. Place a horizontal wafer on the support rods and measure the levelness of the wafer. If the wafer is not in a horizontal state, adjust the lifting height of the floating ring support rods to adjust the wafer to be horizontal. Step 3: Adjust the height of the support plate support rod by cooperating with the height reference block zeroing measurement tool through the cylinder. Step 4: Use a horizontal wafer to measure and debug the level of the heating plate until the requirements are met, and then adjust the height of the heating plate through the motor. Step 5: Measure the level of the pin support plate with a horizontal wafer and adjust the level of the pin support plate and the height of the support rod to meet the requirements. Step 6: Adjust the positions of the three floating ring support rods to make the floating ring concentric with the heating plate.

7. An offline detection and debugging method as described in claim 6. It is characterized in that: The substrate described above is rectangular in design and its level can be adjusted. The substrate is arranged on a support frame. There is a jackscrew at each of the four corners of the substrate. The lower end of the jackscrew is connected to the support frame. The level of the substrate is adjusted by adjusting the jackscrews. There are a plurality of through holes on the substrate. The size and position of the through holes match the mounting through holes on the target semiconductor device. At the same time, the distribution of the through holes matches the position of the support rods on the support assembly. When installing, the support rods on the support assembly pass through the through holes without interference.

8. An offline detection and debugging method as described in claim 6, characterized in that: In steps 2 and 3, a dial indicator is used to measure the height of the floating ring support rod and the height of the pin support plate, and the cylinder is adjusted to make its height meet the requirements.

9. An offline detection and debugging method as described in claim 6, characterized in that: In step 4, the flat wafer is directly placed on the heating plate, and the flatness of the wafer is measured by a laser leveling instrument to obtain the level state of the heating plate, and the heating plate is adjusted to be level to meet the requirements.

10. An offline detection and debugging method as described in claim 6, characterized in that: In step 5, the V-shaped pin support plate is located below the heating plate. There are 3 through holes concentrically and evenly arranged on the heating plate. There is a support rod at each through hole. The lower end of each support rod hangs naturally and contacts the pin support plate. The wafer is placed on the upper ends of the 3 support rods. The flatness of the wafer is measured to obtain the flatness of the pin support plate. If it is not in a horizontal state, the support plate support rods are adjusted to make the pin support plate horizontal, and the height is adjusted by the support rod cylinder.

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