A high-speed dual-camera three-dimensional detection system and method

Abstract

The application discloses a kind of high-speed dual-camera three-dimensional detection system and method, including projection device, first image acquisition device, second image acquisition device and processor, projection device is used to project structured light pattern to the surface of object to be measured;First image acquisition device is used to collect the part of projection area pattern of projection device, the acquisition area is configured as first acquisition area;Second image acquisition device is used to collect the part of projection area pattern of projection device, the acquisition area is configured as second acquisition area, and second acquisition area and first acquisition area partially overlap;Processor is used to obtain the image collected, and height information of object to be measured is obtained according to image analysis and calculation, by setting first image acquisition device and second image acquisition device, processor obtains the image collected and processes, obtains the height information of greater area under the same acquisition speed, and improves detection speed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of three-dimensional detection equipment, and particularly relates to a high-speed dual-camera three-dimensional detection system and method. BACKGROUND

[0002] Three-dimensional scanning technology has been widely applied in the fields of industrial detection, robot navigation, reverse engineering and target recognition. Especially in the fields of industrial automation and electronics, it is necessary to obtain accurate three-dimensional dimensions and surface shapes of the measured target. In the electronic assembly industry, the quality of tin paste on the surface mounting production line and the components on the circuit board need to be detected by machine vision. 3D SPI (3D Solder Paste Inspection) is usually used to detect the quality of tin paste printing, and 3D AOI (3D Optical Inspection) is used to detect the quality of PCB after furnace welding, thereby improving the yield of products. A 3D SPI / AOI device generally consists of five parts: a projection light source, an industrial camera, a lens, a two-dimensional light source, an image acquisition card and core software. The projection light source projects structured light onto the surface of the circuit board, the camera collects and analyzes the structured light pattern, and the height information of the tin paste printing on the circuit board is obtained quickly and accurately to eliminate defective products. The current technologies used in the projection light source part include line laser and surface projection device. The 3D SPI device also uses grating combined with mechanical driving to generate structured light. The surface projection device has the advantages of fast speed and no need for mechanical driving, and has become the mainstream technology of the current 3D SPI device. Chinese Patent Publication No. CN211042118U discloses a three-dimensional detection system and method. The system comprises: a first projection device for projecting a first waveband of light signals to a sample to be measured; a second projection device for projecting a second waveband of light signals to the sample to be measured, the second waveband being different from the first waveband, and the projection area of the first waveband of light signals and the projection area of the second waveband of light signals on the sample to be measured partially overlap; an image acquisition device arranged above the sample to be measured, for acquiring images of the projection area of the first projection device and the projection area of the second projection device; and a processor for acquiring the images acquired by the image acquisition device, calculating the specification parameters of the sample to be measured according to the images, and determining the specification parameters of the sample to be measured. The detection system obtains two projection areas by using two projection devices, and then acquires images of the two projection areas by using one image acquisition device. Although the detection system can obtain information of a larger area of the sample to be measured, and improves the detection efficiency to a certain extent, the detection accuracy and speed are limited due to the limited resolution of the image acquisition device. The detection system and method cannot meet the requirements of high detection accuracy and high detection speed. SUMMARY

[0003] The technical problem to be solved by the present application is to provide a high-speed dual-camera three-dimensional detection system, method and storage medium to improve detection speed and detection accuracy.

[0004] The high-speed dual-camera three-dimensional detection system comprises at least one projection device, a first image acquisition device, a second image acquisition device and a processor, wherein the projection device is used to project at least one structured light pattern onto the surface of an object to be detected; the first image acquisition device and the second image acquisition device are both arranged above the object to be detected, the first image acquisition device is used to acquire part of the projection area pattern of the projection device, and the acquisition area is configured as a first acquisition area; the second image acquisition device is used to acquire part of the projection area pattern of the projection device, and the acquisition area is configured as a second acquisition area, the second acquisition area and the first acquisition area partially overlap; and the processor is used to acquire images acquired by the first image acquisition device and the second image acquisition device, analyze and calculate according to the acquired images, and obtain height information of the object to be detected.

[0005] Optionally, the number of the projection devices is at least one, and the first image acquisition device and the second image acquisition device are arranged in parallel and located on one side of the projection device. In this way, the projection device can project a larger area onto the surface of the object to be detected, and the first image acquisition device and the second image acquisition device can more conveniently acquire part of the projection area pattern of the projection device.

[0006] Optionally, the processor comprises a height calculation module, the height calculation module comprises an initialization module, an acquisition module, a 3D reconstruction module, a data fusion module and an output module, the initialization module is used to import a position relationship or a calibration parameter between the projection device and the first image acquisition device and the second image acquisition device which are previously set or calibrated; the acquisition module is used to acquire image sequences acquired by the first image acquisition device and the second image acquisition device; the 3D reconstruction module is used to calculate height data of the first acquisition area and the second acquisition area respectively; the data fusion module is used to fuse height data of overlapping areas of the first acquisition area and the second acquisition area and overlapping areas of the second acquisition area and the first acquisition area; and the output module is used to output height information of the object to be detected.

[0007] The present application also provides a high-speed dual-camera three-dimensional detection method matched with the high-speed dual-camera three-dimensional detection system, and applied to the high-speed dual-camera three-dimensional detection system, which comprises the following steps.

[0008] S10, projecting a structured light pattern onto the surface of an object to be detected by using a projection device;

[0009] S20, acquiring a projection area pattern by using a first image acquisition device and a second image acquisition device;

[0010] S30, acquiring images of the first image acquisition device and the second image acquisition device by using a processor;

[0010] S30, analyzing the projection area pattern by the processor to obtain height information of the object to be measured.

[0011] Optionally, the step S30 is specifically:

[0012] S300, importing the position relationship or calibration parameters between the projection device and the first image acquisition device and the second image acquisition device by the initialization module in the processor;

[0013] S301, acquiring the image sequence acquired by the first image acquisition device and the second image acquisition device by the acquisition module;

[0014] S302, calculating the height data of the first acquisition area and the second acquisition area respectively by the 3D reconstruction module;

[0015] S303, fusing the height data of the overlapping area of the first acquisition area and the second acquisition area and the overlapping area of the second acquisition area and the first acquisition area by the data fusion module.

[0016] Beneficial effects: the projection device generates a projection area, and the first image acquisition device and the second image acquisition device acquire the projection area, so that two detection areas are obtained under the premise of ensuring the image accuracy acquired by the first image acquisition device and the second image acquisition device, the processor obtains and processes the acquired images in the first acquisition area and the second acquisition area, the same projection area has higher image resolution and faster data transmission and processing speed, so that the three-dimensional detection speed and detection accuracy are improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 A structure schematic view of a high-speed dual-camera three-dimensional detection system provided by the application.

[0018] Figure 2 An internal module schematic view of a processor provided by the application.

[0019] Figure 3 A structure schematic view of the first image acquisition device and the second image acquisition device arranged in front and back.

[0020] Figure 4 A structure schematic view of the first image acquisition device and the second image acquisition device arranged in left and right.

[0021] Figure 5 A structure schematic view of the projection area and the acquisition area acquired under the arrangement mode of Figure 3 .

[0022] Figure 6 A structure schematic view of the projection area and the acquisition area acquired under the arrangement mode ofFigure 4 Structure diagram of projection area and collection area obtained under arrangement of the application.

[0023] Figure 7 Flow block diagram of a high-speed dual-camera three-dimensional detection method provided by the application.

[0024] Figure 8 Flow block diagram of a processor processing method provided by the application.

[0025] Label explanation: 1, projection device; 2, first image collection device; 3, second image collection device; 5, processor; 10, projection area; 20, first collection area; 30, second collection area; 31, overlapping area; 50, initialization module; 51, collection module; 52, 3D reconstruction module; 53, data fusion module; 54, output module. DETAILED DESCRIPTION

[0026] The application will now be described in further detail with reference to the drawings. These drawings are simplified schematic diagrams, and only schematically show the basic structure of the application, and thus only show the configurations related to the application.

[0027] In the application, it should be noted that the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the application and simplifying the description, and thus cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus cannot be understood as limiting the application; the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance; in addition, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "linking" should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integrally connected; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, and can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0028] Example 1

[0029] As Figure 1As shown in the figure, a high-speed dual-camera three-dimensional detection system includes a projection device 1, a first image acquisition device 2, a second image acquisition device 3, and a processor 5; the projection device 1 is used to project at least one structured light pattern onto the surface of the object to be measured; the first image acquisition device 2 and the second image acquisition device 3 are both arranged above the object to be measured, the first image acquisition device 2 is used to acquire the pattern of the partial projection area of the projection device 1, and the acquisition area is configured as the first acquisition area 20; the second image acquisition device 3 is used to acquire the pattern of the partial projection area of the projection device 1, and the acquisition area is configured as the second acquisition area 30, the second acquisition area 30 and the first acquisition area 20 partially overlap; the processor 5 is used to acquire the images acquired by the first image acquisition device 2 and the second image acquisition device 3, analyze and calculate according to the acquired images, and obtain the height information of the object to be measured.

[0030] As shown in the figure, Figure 1 in the embodiment, the projection device 1 can be a projector, which can project at least one structured light pattern onto the surface of the object to be measured, and the first image acquisition device 2 and the second image acquisition device 3 are both cameras. Specifically, the first image acquisition device 2 and the second image acquisition device 3 have two arrangement modes: the first arrangement mode is to arrange the two cameras in front of and behind each other (as shown in the figure), Figure 3 the projection area and the acquisition area obtained by the first arrangement mode are as shown in the figure, Figure 5 the two cameras are arranged in front of and behind each other, and correspondingly, the camera acquisition area is also arranged in front of and behind the projection area, the trapezoidal area represents the projection area 10, the two square areas represent the first acquisition area 20 and the second acquisition area 30 respectively, the first acquisition area 20 is the FOV1 area, the second acquisition area 30 is the FOV2 area, and the overlapping part of the two square areas is the overlapping area 31, that is, the FOV3 area. The second arrangement mode is to arrange the two cameras side by side (as shown in the figure), Figure 4 the projection area and the acquisition area obtained by the second arrangement mode are as shown in the figure, Figure 6 the two cameras are arranged side by side, and correspondingly, the camera acquisition area is also arranged side by side relative to the projection area, the trapezoidal area represents the projection area 10, the two square areas represent the first acquisition area 20 and the second acquisition area 30 respectively, the first acquisition area 20 is the FOV1 area, the second acquisition area 30 is the FOV2 area, and the overlapping part of the two square areas is the overlapping area 31, that is, the FOV3 area. The relative distance and angle at which the acquisition device and the projection device are placed are pre-set according to the area of the projection area of the projection device 1 and the overlapping area 31 (FOV3 area) of the first image acquisition device 2 and the second image acquisition device 3.

[0031] As shown in the figure, Figure 1As shown, in the embodiment, the number of the projection device 1 is one, and the first image acquisition device 2 and the second image acquisition device 3 are arranged in parallel and located on one side of the projection device 1. By arranging in this way, the two image acquisition devices can maximize the pattern of the projection area collected.

[0032] As shown, Figure 2 The processor 5 includes a height calculation module, which includes an initialization module 50, an acquisition module 51, a 3D reconstruction module 52, a data fusion module 53, and an output module 54. The initialization module 50 is used to import the position relationship or calibration parameters between the projection device and the first image acquisition device and the second image acquisition device, which are pre-set or calibrated. The acquisition module 51 is used to acquire the image sequence collected by the first image acquisition device 2 and the second image acquisition device 3. The 3D reconstruction module 52 is used to calculate the height data of the first acquisition area 20 and the second acquisition area 30, respectively. The data fusion module 53 is used to fuse the height data of the overlapping area 31 of the first acquisition area 20 and the second acquisition area 30 and the overlapping area 31 of the second acquisition area 30 and the first acquisition area 20. The output module 54 is used to output the height information of the object to be measured. Further, the output module 54 can be connected with a display device to transmit the height information to the display device, which is more intuitive.

[0033] The detection system generates a projection area through the projection device 1, and acquires the projection area through the first image acquisition device 2 and the second image acquisition device 3. On the premise of ensuring the accuracy of the images collected by the first image acquisition device 2 and the second image acquisition device 3, two detection areas are obtained. The processor 5 acquires and processes the collected images in the first acquisition area 20 and the second acquisition area 30, which can obtain higher image resolution and faster data transmission and processing speed in the same projection area, thereby improving the three-dimensional detection speed and detection accuracy.

[0034] Embodiment 2

[0035] The structure of the high-speed dual-camera three-dimensional detection system provided in this embodiment is basically the same as that of embodiment 1, and the main difference is that the number of the projection device 1 is two, the first image acquisition device 2 and the second image acquisition device 3 are arranged in parallel, and the two projection devices 1 are symmetrically arranged on the two sides of the first image acquisition device 2 and the second image acquisition device 3. By arranging two projection devices 1, the problems of shadow and reflection of the detection target can be solved, and the detection accuracy can be improved.

[0036] Embodiment 3

[0037] As shown, Figure 7 The application provides a high-speed dual-camera three-dimensional detection method, which is applied to the high-speed dual-camera three-dimensional detection system described above, and includes:

[0038] S10, projecting a structured light pattern onto the surface of the object to be measured by the projection device 1;

[0039] S20, collecting the projected area pattern by the first image acquisition device 2 and the second image acquisition device 3;

[0040] S30, analyzing the projected area pattern by the processor 5 to obtain the height information of the object to be measured; as Figure 8 shown, step S30 is specifically:

[0041] S300, using the initialization module 50 in the processor to import the position relationship or calibration parameters between the projection device and the first image acquisition device, the second image acquisition device, etc. which are pre-set or calibrated;

[0042] S301, using the acquisition module 51 to obtain the image sequence collected by the first image acquisition device 2 and the second image acquisition device 3, where the image sequence refers to one or more images collected by the first image acquisition device 2 and the second image acquisition device 3, which form a sequence;

[0043] S302, using the 3D reconstruction module 52 to calculate the height data of the first acquisition area and the second acquisition area respectively, the first acquisition area is the FOV1 area, and the second acquisition area is the FOV2 area;

[0044] S303, using the data fusion module 53 to fuse the height data of the overlapping area of the first acquisition area 20 and the second acquisition area 30, and the overlapping area of the second acquisition area 30 and the first acquisition area 20. For the convenience of the following description, the overlapping area of the first acquisition area 20 and the second acquisition area 30 can be named N1, and the overlapping area of the second acquisition area 30 and the first acquisition area 20 can be named N2. Since N1 and N2 refer to the same area, the height data calculated by N1 and N2 basically coincide.

[0045] The three-dimensional detection method collects the projected area pattern by the first image acquisition device 2 and the second image acquisition device 3, and the processor 5 obtains and processes the images collected in the first acquisition area 20 and the second acquisition area 30. Compared with the prior art document 1 (publication number CN211042118U), the processor 5 in the present technical solution does not need to perform segmentation processing on the collected images to obtain different detection areas, but only needs to compare the images collected by the first image acquisition device 2 and the second image acquisition device 3, and fuse and merge the height data of the FOV1 area and the FOV2 area calculated. The whole calculation process is simple and convenient. The present detection method obtains height information of a larger area at the same acquisition speed, and improves the three-dimensional detection speed.

[0046] In the description of the specification, the description of the terms "one embodiment", "certain embodiments", "exemplary embodiment", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Also, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in an appropriate manner.

[0047] The basic principles and main features of the present application and the advantages of the present application are shown and described above, and it is obvious to those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered as exemplary and non-limiting in any respect, and the scope of the present application is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be considered as limiting the claims to which they relate.

[0048] Furthermore, it should be understood that although the specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the specification is described in this way only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that those skilled in the art can understand.

Claims

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