Bonding device, bonding system and bonding method

Abstract

A bonding device for bonding a first substrate to a second substrate comprises: a first holding portion, which holds the first substrate; a second holding portion, which holds the second substrate, the second holding portion being arranged opposite to the first holding portion; two camera units, the two camera units having a first camera unit and a second camera unit, the first camera unit photographing a first alignment mark formed on the bonding surface of the first substrate, and the second camera unit photographing a second alignment mark formed on the bonding surface of the second substrate; a first moving mechanism, which moves the two camera units along a first direction within a planar area between the first holding portion and the second holding portion; a second moving mechanism, which moves the first camera unit of the two camera units along a second direction orthogonal to the first direction; and a third moving mechanism, which moves the second camera unit of the two camera units along the second direction.

Description

Technical Field

[0001] The present disclosure relates to a joining device, a joining system and a joining method. Background Art

[0002] Patent document 1 discloses a bonding device for bonding substrates to each other. The bonding device includes a first holding portion for holding a first substrate, a second holding portion for holding a second substrate, a chamber for accommodating the first holding portion and the second holding portion, and an imaging portion provided outside the chamber. The imaging portion captures alignment marks formed on the first substrate and the second substrate via through holes formed in the chamber, the first holding portion, and the second holding portion, respectively.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-134446 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] The technology according to the present disclosure improves the bonding accuracy when bonding substrates to each other.

[0008] Solutions for solving problems

[0009] One embodiment of the present disclosure is a bonding device for bonding a first substrate to a second substrate, the bonding device comprising: a first holding portion that holds the first substrate; a second holding portion that holds the second substrate, the second holding portion being arranged opposite to the first holding portion; two camera units, the two camera units having a first camera unit and a second camera unit, the first camera unit photographing a first alignment mark formed on the bonding surface of the first substrate, and the second camera unit photographing a second alignment mark formed on the bonding surface of the second substrate; a first moving mechanism that moves the two camera units along a first direction within a planar area between the first holding portion and the second holding portion; a second moving mechanism that moves the first camera unit of the two camera units along a second direction orthogonal to the first direction; and a third moving mechanism that moves the second camera unit of the two camera units along the second direction.

[0010] Effects of the Invention

[0011] According to the present disclosure, it is possible to improve the bonding accuracy when substrates are indirectly bonded to each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a plan view schematically showing the structure of the joining system according to the present embodiment.

[0013] Figure 2 It is a side view schematically showing the internal structure of the joining system according to the present embodiment.

[0014] Figure 3 It is a side view schematically showing the structure of the superimposed substrates.

[0015] Figure 4 It is a plan view schematically showing the structure of the first substrate.

[0016] Figure 5 It is a side view schematically showing the structure of the bonding device.

[0017] Figure 6 It is a side view schematically showing the structure of the bonding device.

[0018] Figure 7 It is a plan view schematically showing the structure of the bonding device.

[0019] Figure 8 It is a cross-sectional view of the first holding portion and its surrounding structure.

[0020] Fig. 9 This is a plan view of the first holding portion and its surroundings as seen from below.

[0021] Fig.10 This is a plan view of the first holding portion and its surroundings as seen from above.

[0022] Fig.11 It is a cross-sectional view of the second holding portion and its surrounding structure.

[0023] Fig.12 It is a cross-sectional view of the second holding portion and its surrounding structure.

[0024] Fig.13 This is a plan view of the second holding portion and its surroundings as seen from above.

[0025] Fig.14 It is a plan view schematically showing the structure of the first imaging unit.

[0026] Fig.15 It is a side view schematically showing the structure of the first imaging unit.

[0027] Fig.16 It is an explanatory diagram schematically showing the internal structure of the first imaging unit.

[0028] Fig.17 This is an explanatory diagram schematically showing the internal structure of a conventional imaging unit.

[0029] Fig.18It is a side view schematically showing the structure of the reference mark portion.

[0030] Fig.19 This is a flowchart showing the main steps of the joining process.

[0031] Fig. 20 It is an explanatory diagram showing steps A3 and A6 of the joining process.

[0032] Fig.21 It is an explanatory diagram showing steps A7 and A8 of the joining process.

[0033] Fig. 22 It is an explanatory diagram showing step A9 of the joining process.

[0034] Fig.23 It is an explanatory diagram showing steps A9 and A10 of the joining process.

[0035] Fig.24 It is an explanatory diagram showing step A10 of the joining process.

[0036] Fig.25 It is an explanatory diagram showing step A11 of the joining process.

[0037] Fig.26 It is an explanatory diagram showing step A12 of the joining process.

[0038] Fig. 27 It is an explanatory diagram showing step A13 of the joining process.

[0039] Fig.28 It is an explanatory diagram showing step A14 of the joining process.

[0040] Fig.29 It is an explanatory diagram showing a load state when the first substrate and the second substrate are pressed.

[0041] Fig.30 It is an explanatory diagram showing step A15 of the joining process.

[0042] Fig.31 It is an explanatory diagram showing step A15 of the joining process. DETAILED DESCRIPTION

[0043] In the three-dimensional integration technology for stacking semiconductor devices three-dimensionally, two semiconductor substrates (hereinafter referred to as "substrates") are joined. Specifically, the substrates are joined to each other, for example, by van der Waals forces and hydrogen bonds (intermolecular forces). In addition, in order to properly manufacture semiconductor devices, it is important to properly align the first substrate arranged on the upper side and the second substrate arranged on the lower side when the substrates are joined and stacked.

[0044] Conventionally, for example, in the bonding apparatus disclosed in Patent Document 1, an imaging unit disposed outside the chamber photographs alignment marks of a first substrate and a second substrate accommodated inside the chamber. Based on the detection result of the photographed alignment marks, the horizontal position and orientation of the first holding unit are adjusted to align the first substrate and the second substrate.

[0045] However, in the bonding device of Patent Document 1, the imaging unit is fixed in the horizontal direction, so sometimes the alignment marks of the first substrate and the second substrate cannot be properly photographed. In this case, proper alignment cannot be performed, and there is room for further improvement in improving bonding accuracy.

[0046] The technology disclosed herein improves the joining accuracy. The joining device, joining system having the joining device, and joining method according to the present embodiment are described below with reference to the accompanying drawings. In addition, in this specification and the accompanying drawings, the same reference numerals are used to mark elements having substantially the same functional structure, thereby omitting repeated descriptions.

[0047] <Structure of the joining system 1>

[0048] First, the structure of the joining system according to the present embodiment will be described. Figure 1 It is a plan view schematically showing the structure of the joining system 1 . Figure 2 It is a side view schematically showing the internal structure of the joining system 1. In order to clarify the positional relationship, the X-axis direction, Y-axis direction, and Z-axis direction orthogonal to each other are defined below, and the positive Z-axis direction is defined as the vertical upward direction.

[0049] In the joint system 1, as Figure 3 As shown, the first substrate W1 and the second substrate W2 are joined to form a superimposed substrate T. Hereinafter, the surface of the first substrate W1 that is joined to the second substrate W2 is referred to as the "joining surface W1a", and the surface on the opposite side of the joining surface W1a is referred to as the "non-joining surface W1b". In addition, the surface of the second substrate W2 that is joined to the first substrate W1 is referred to as the "joining surface W2a", and the surface on the opposite side of the joining surface W2a is referred to as the "non-joining surface W2b". In addition, the first substrate W1 and the second substrate W2 are both semiconductor substrates such as silicon substrates.

[0050] like Figure 4As shown, two first alignment marks M11 and M12 are formed on the bonding surface W1a of the first substrate W1. The first alignment marks M11 and M12 are respectively formed on, for example, the Y-axis passing through the center of the first substrate W1. In addition, the first alignment marks M11 and M12 have a cross shape. Similarly, two second alignment marks M21 and M22 having a cross shape are formed on the bonding surface W2a of the second substrate W2, for example, on the Y-axis passing through the center of the second substrate W2. In addition, the shapes of the alignment marks M11, M12, M21, and M22 are not limited to the cross shape, and any shape can be adopted.

[0051] like Figure 1 As shown, the joining system 1 has a structure in which a loading and unloading station 2 and a processing station 3 are connected as a whole. The loading and unloading station 2, for example, carries out loading and unloading of boxes Cw1, Cw2, and Ct that can respectively accommodate multiple first substrates W1, second substrates W2, and overlapping substrates T between the outside, and the processing station 3 has various processing devices for performing desired processing on the substrates W1, W2, and overlapping substrates T.

[0052] A cassette stage 10 is provided at the loading / unloading station 2. A plurality of, for example, four, cassette mounting plates 11 are provided at the cassette stage 10. The cassette mounting plates 11 are arranged so as to extend in the X direction ( Figure 1 In the vertical direction of the connection system 1, the boxes Cw1, Cw2, Ct are arranged in a row. When the boxes Cw1, Cw2, Ct are carried in and out relative to the outside of the bonding system 1, the boxes Cw1, Cw2, Ct can be placed on these box loading plates 11. In this way, the loading and unloading station 2 is configured to be able to hold a plurality of first substrates W1, a plurality of second substrates W2, and a plurality of overlapping substrates T. In addition, the number of box loading plates 11 is not limited to the present embodiment and can be set arbitrarily. In addition, in addition to the boxes Cw1, Cw2, Ct, the box loading plates 11 can also be used to load boxes for recovering, for example, defective substrates.

[0053] A substrate transport area 20 is provided at the transport station 2 and adjacent to the cassette stage 10 on the positive X-axis direction side of the cassette stage 10. A substrate transport device 22 that is movable on a transport path 21 extending in the Y-axis direction is provided in the substrate transport area 20. The substrate transport device 22 is also movable in the vertical direction and around the vertical axis (θ direction), and is capable of transporting the first substrate W1, the second substrate W2, and the overlapped substrate T between the cassettes Cw1, Cw2, and Ct on each cassette mounting plate 11 and the conveying devices 60 and 61 of the third processing block G3 of the processing station 3 described later.

[0054] The processing station 3 is provided with a plurality of, for example, three, processing blocks G1, G2, and G3 having various devices. Figure 1A first processing block G1 is provided on the negative side of the Y axis of the processing station 3. Figure 1 A second processing block G2 is provided on the positive Y-axis side of the processing station 3. Figure 1 A third processing block G3 is provided on the negative X-axis direction side.

[0055] A bonding apparatus 30 for bonding the substrates W1 and W2 is disposed in the first processing block G1. The structure of the bonding apparatus 30 will be described later.

[0056] like Figure 2 In the lower layer of the second processing block G2, the reforming device 40, the transfer chamber 41, and the load lock chamber 42 are arranged in the order described in the horizontal X-axis direction from the loading and unloading station 2 side.

[0057] The modification device 40 modifies the bonding surfaces W1a and W2a of the substrates W1 and W2. In the modification device 40, oxygen or nitrogen gas as a processing gas is excited to plasma in a reduced pressure atmosphere, thereby ionizing it. The bonding surfaces W1a and W2a are irradiated with the oxygen ions or nitrogen ions to perform plasma treatment on the bonding surfaces W1a and W2a to modify them.

[0058] The load lock chamber 42 is arranged on the Y-axis positive side of the substrate transfer area 70 to be described later, in a manner adjacent to the substrate transfer area 70 via a gate valve (not shown). The load lock chamber 42 is configured to be able to switch its internal space between an atmospheric pressure state and a vacuum state. In addition, a handover portion (not shown) for handing over the first substrate W1 and the second substrate W2 is provided inside the load lock chamber 42.

[0059] The transfer chamber 41 is arranged on the negative side of the Y-axis direction of the load lock chamber 42 in a manner adjacent to the load lock chamber 42 via a gate valve (not shown). A substrate transfer device (not shown) for transferring the first substrate W1 and the second substrate W2 is arranged in the transfer chamber 41. The substrate transfer device can transfer the first substrate W1 and the second substrate W2 between the load lock chamber 42 and the modification device 40.

[0060] In the upper layer of the second processing block G2, the hydrophilization devices 50 and 51 are arranged in the horizontal X-axis direction in the order described from the side of the loading and unloading station 2. The hydrophilization devices 50 and 51 hydrophilize the bonding surfaces W1a and W2a of the substrates W1 and W2 by, for example, pure water, and clean the bonding surfaces W1a and W2a. In the hydrophilization device 50, for example, pure water is supplied to the substrates W1 and W2 while rotating the substrates W1 and W2 held by a rotating suction cup (not shown). In this way, the supplied pure water spreads on the bonding surfaces W1a and W2a of the substrates W1 and W2 to hydrophilize the bonding surfaces W1a and W2a.

[0061] In the third processing block G3, the conveying devices 60 and 61 for the first substrate W1, the second substrate W2, and the superimposed substrate T are arranged in two layers in order from the bottom.

[0062] like Figure 1 As shown in FIG. 1 , a substrate transfer area 70 is formed in an area surrounded by the first to third processing blocks G1 to G3 . In the substrate transfer area 70 , for example, a substrate transfer device 71 is disposed.

[0063] The substrate transport device 71 has a transport arm that can be freely moved in the vertical direction, the horizontal direction (X-axis direction, Y-axis direction) and around the vertical axis. The substrate transport device 71 moves in the substrate transport area 70 and can transport the first substrate W1, the second substrate W2, and the overlapped substrate T to the desired devices in the surrounding first processing block G1, the second processing block G2, and the third processing block G3.

[0064] In the above bonding system 1, a control device 80 is provided as a control unit. The control device 80 is, for example, a computer, and has a program storage unit (not shown). The program storage unit stores a program for controlling the substrate processing in the bonding system 1. In addition, the program storage unit also stores a program for controlling the operation of the drive system of the various processing devices, conveying devices, etc. mentioned above to realize the substrate processing described later in the bonding system 1. In addition, the above program can be recorded in a computer-readable storage medium H and installed from the storage medium H to the control device 80.

[0065] <Structure of the bonding device 30>

[0066] Next, the structure of the above-mentioned bonding device 30 will be described. Figure 5 and Figure 6 It is a side view schematically showing the structure of the bonding device 30 . Figure 7 It is a plan view schematically showing the structure of the bonding device 30 .

[0067] The bonding device 30 has a structure in which various components are mounted on a base 100. Specifically, the bonding device 30 has a processing container 110, a first holding portion 120, and a second holding portion 130. In addition, the bonding device 30 has a chamber lifting mechanism 140 and a decompression portion 150 around the processing container 110. In addition, the bonding device 30 has a support portion 160, a horizontal position adjustment portion 170, a vertical position adjustment portion 180, and a pressurizing portion 190 around the first holding portion 120. In addition, the bonding device 30 has fixed camera portions 200 and 201 around the second holding portion 130. In addition, the bonding device 30 has camera units 210 and 211 that move between the inside and the outside of the processing container 110. The following describes each structure.

[0068] (Structure of the Processing Container 110 and Its Periphery)

[0069] First, the processing container 110 and its peripheral structure will be described.

[0070] The processing container 110 is a container that can be sealed inside, and is used to accommodate the first holding part 120 and the second holding part 130. The processing container 110 is divided into two parts, and the processing container 110 has a first chamber 111 on the side (upper side) of the first holding part 120 and a second chamber 112 on the side (lower side) of the second holding part 130. A sealing member 113 for maintaining the airtightness of the interior of the processing container 110 is provided on the joint surface between the second chamber 112 and the first chamber 111. The sealing member 113 uses an O-ring, for example. Moreover, by making the first chamber 111 and the second chamber 112 abut, a closed space is formed inside the processing container 110.

[0071] The first chamber 111 is supported by a support plate 114 provided on the upper surface of the first chamber 111. Furthermore, the support plate 114 is supported by a chamber lifting mechanism 140. The chamber lifting mechanism 140 has pillars 141 and lifting members 142. The pillars 141 and the lifting members 142 are respectively provided at, for example, four locations on the outer periphery of the support plate 114. The pillars 141 are provided in a manner extending vertically upward from the base 100. The lifting members 142 support the outer periphery of the support plate 114, and the base end of the lifting member 142 is mounted on the pillars 141. Furthermore, the lifting member 142 is lifted and lowered along the pillars 141 by a driving unit (not shown) such as a motor. By means of the chamber lifting mechanism 140 of this structure, the first chamber 111 is configured to be freely liftable. In addition, the front ends of the four lifting members 142 are supported by the top plate 143.

[0072] In addition, in this embodiment, four chamber lifting mechanisms 140 are provided on the outer periphery of the support plate 114, but the number of chamber lifting mechanisms 140 is not limited to this number. For example, when the outer periphery of the support plate 114 is supported at four locations, the chamber lifting mechanisms 140 may be provided at two locations, and the retractable shafts may be provided at the other two locations.

[0073] The second chamber 112 is supported by a support table 115 provided on the base 100. That is, the second chamber 112 does not move but is fixed. The support table 115 is hollow. In addition, a decompression unit 150 for decompressing the interior of the processing container 110 is provided in the second chamber 112. The decompression unit 150 includes an intake pipe 151 for sucking the atmosphere gas inside the processing container 110 and an intake device 152 such as a vacuum pump connected to the intake pipe 151.

[0074] (Structure of the First Holding Part 120 and Its Periphery)

[0075] Next, the first holding portion 120 and the surrounding structure will be described. Figure 8 2 is a cross-sectional view of the first holding portion 120 and its surrounding structure. Fig. 9 This is a plan view of the first holding portion 120 and its surroundings as seen from below. Fig.10 This is a plan view of the first holding portion 120 and its surroundings as seen from above.

[0076] The first holding part 120 is a holding part for holding the first substrate W1. The first holding part 120 has an electrostatic suction cup 121 and a cooling plate 122. The electrostatic suction cup 121 has an internal electrode and a dielectric, and uses an electrostatic force generated by applying a voltage to the internal electrode to adsorb the first substrate W1 to the adsorption surface. The cooling plate 122 is, for example, a water-cooled plate, and cooling water flows inside the cooling plate 122. The first substrate W1 held by the electrostatic suction cup 121 is adjusted to a desired temperature, for example, room temperature, by the cooling plate 122.

[0077] Two first chuck marks N11 and N12 are formed as first holding marks on the lower surface side of the first holding portion 120. The first chuck marks N11 and N12 are formed, for example, on the Y axis passing through the center of the electrostatic chuck 121 at the outer peripheral portion of the lower surface of the electrostatic chuck 121. In addition, the first chuck marks N11 and N12 each have a cross shape. In addition, the shape of the first chuck marks N11 and N12 is not limited to a cross shape, and any shape can be adopted.

[0078] A suction cup 123 for holding the first substrate W1 by adsorbing the first substrate W1 is provided on the lower surface of the electrostatic suction cup 121. For example, the suction cup 123 is provided at three locations. The suction cup 123 is connected to a suction mechanism 126 for sucking the first substrate W1 via a suction tube 125 inserted into and passing through a through hole 124 formed in a manner penetrating the electrostatic suction cup 121 and the cooling plate 122. In addition, the suction cup 123 and the suction tube 125 are configured to be freely raised and lowered by the suction mechanism 126.

[0079] The first holding portion 120 is supported by the support portion 160 in a state of hanging from above. The first holding portion 120 is arranged in a state of being separated from the first chamber 111 by the support portion 160. The support portion 160 has a movable plate 161 and a transmission shaft 162. The movable plate 161 is provided outside the processing container 110 and above the support plate 114. The movable plate 161 has an opening in the center portion and has a circular ring shape.

[0080] On the lower surface of the movable plate 161, transmission shafts 162 are arranged at approximately evenly spaced intervals, for example, at three locations on a concentric circle concentric with the movable plate 161. Each transmission shaft 162 extends vertically downward from the movable plate 161, penetrates the support plate 114 and the first chamber 111, and is connected to the upper surface of the cooling plate 122 of the first holding portion 120.

[0081] A bellows 163 is provided on the outer periphery of the transmission shaft 162 to cover the transmission shaft 162. The upper end of the bellows 163 is connected to the lower surface of the movable plate 161, and the lower end of the bellows 163 is connected to the upper surface of the support plate 114. The bellows 163 can move the first holding portion 120 provided from the outside of the processing container 110 to the inside of the processing container 110 while ensuring the airtightness of the processing container 110.

[0082] In addition, a through hole 164 is formed in the support plate 114 and the first chamber 111, and the transmission shaft 162 is inserted through the through hole 164. In addition, as described later, the transmission shaft 162 moves in the horizontal direction by the horizontal position adjustment unit 170, so the inner diameter of the through hole 164 is sufficiently larger than the outer diameter of the transmission shaft 162.

[0083] A horizontal position adjusting unit 170 is provided between the lower surface of the movable plate 161 and the upper surface of the support plate 114. That is, the horizontal position adjusting unit 170 is provided outside the processing container 110. The horizontal position adjusting unit 170 is arranged at, for example, three locations at substantially uniform intervals on a concentric circle concentric with the movable plate 161.

[0084] As the horizontal position adjustment unit 170, for example, a UVW stage with U-axis, V-axis and W-axis as driving axes is used. In this case, the movable plate 161 can be moved in the X-axis direction, the Y-axis direction and the θ-axis direction by the horizontal position adjustment unit 170. Moreover, the horizontal movement of the movable plate 161 is transmitted to the first holding unit 120 via the transmission shaft 162 to adjust the horizontal position of the first holding unit 120. In addition, the horizontal position is the position in the X-axis direction, the Y-axis direction and the θ-axis direction, that is, the position and direction in the horizontal direction as described above.

[0085] In addition, a known stage can be used as the UVW stage of the horizontal position adjustment unit 170. In addition, the structure of the horizontal position adjustment unit 170 is not limited to this, and for example, an XYθ stage with an X-axis, a Y-axis, and a θ-axis as drive axes can be used, or a 4-axis stage with four drive axes of X1, X2, Y1, and Y2 that drives XYθ on one plane can be used.

[0086] The vertical position adjusting unit 180 is provided on the upper surface of the movable plate 161. That is, the vertical position adjusting unit 180 is provided outside the processing container 110. The vertical position adjusting unit 180 is arranged at, for example, three locations at substantially uniform intervals on a concentric circle concentric with the movable plate 161.

[0087] The vertical position adjusting unit 180 is provided with a driving unit (not shown) such as a motor. The vertical position adjusting unit 180 is connected to the transmission shaft 162 to raise and lower the transmission shaft 162. The raising and lowering of the transmission shaft 162 is transmitted to the first holding unit 120 to adjust the vertical position of the first holding unit 120. In addition, the first holding unit 120 is raised and lowered by using the three vertical position adjusting units 180 to adjust the inclination (horizontality) of the first holding unit 120.

[0088] A pressurizing unit 190 is provided in the opening at the center of the movable plate 161 so as to be inserted through the opening. That is, the pressurizing unit 190 is provided outside the processing container 110. The pressurizing unit 190 includes a pressing mechanism 191, a measuring mechanism 192, and a pressurizing rod 193. The pressing mechanism 191, the measuring mechanism 192, and the pressurizing rod 193 are provided in the order described from the top.

[0089] As the pressing mechanism 191, for example, a hydraulic cylinder is used. When a hydraulic cylinder is used in this way, the space of the device structure can be saved. In addition, the structure of the pressing mechanism 191 is not limited to a hydraulic cylinder, and for example, a pneumatic cylinder (air cylinder) may also be used.

[0090] The pressing mechanism 191 is supported by a support plate 194 provided on the upper surface of the pressing mechanism 191. In addition, the support plate 194 is supported by a plurality of, for example, three, support posts 195 provided on the lower surface of the support plate 194. The upper ends of the support posts 195 are connected to the lower surface of the support plate 194, and the lower ends of the support posts 195 are connected to the upper surface of the support plate 114. The support plate 194 has a substantially triangular shape when viewed from above. The three support posts 195 are provided at each vertex portion of the support plate 194.

[0091] As the measuring mechanism 192, for example, a load sensor is used. The measuring mechanism 192 is provided between the pressing mechanism 191 and a flange 196 provided at the upper end of the pressing rod 193. In addition, in the measuring mechanism 192, when the first substrate W1 and the second substrate W2 are pressed by the pressing mechanism 191, the load applied to the first substrate W1 and the second substrate W2 is measured. The measurement result of the measuring mechanism 192 is output to the control device 80.

[0092] The pressurizing rod 193 extends vertically downward from the flange 196, penetrates the support plate 114 and the first chamber 111, and is connected to the center of the upper surface of the cooling plate 122 of the first holding portion 120. In addition, a through hole 197 is formed in the support plate 114 and the first chamber 111, and the pressurizing rod 193 is inserted and passes through the inside of the through hole 197.

[0093] A bellows 198 is provided on the outer periphery of the pressurizing rod 193 to cover the pressurizing rod 193. The upper end of the bellows 198 is connected to the lower surface of the flange 196, and the lower end of the bellows 198 is connected to the upper surface of the support plate 114. The bellows 198 can press the first holding portion 120 provided from the outside of the processing container 110 to the inside of the processing container 110 while ensuring the airtightness of the processing container 110.

[0094] The pressurizing section 190 is configured as described above, and the pressurizing rod 193 is moved in the vertical direction using the pressing mechanism 191. As a result, the first holding section 120 approaches the second holding section 130, and the first substrate W1 held by the first holding section 120 is pressed against the second substrate W2 held by the second holding section 130. In addition, at this time, the measuring mechanism 192 is used to measure the load applied to the first substrate W1 and the second substrate W2.

[0095] (Structure of the Second Holding Part 130 and Its Periphery)

[0096] Next, the second holding portion 130 and the surrounding structure will be described. Fig.11 and Fig.12 It is a cross-sectional view of the second holding portion 130 and its surrounding structure. Fig.13 This is a plan view of the second holding portion 130 and its surroundings as seen from above.

[0097] The second holding portion 130 is a holding portion for holding the second substrate W2. The second holding portion 130 is arranged to face the first holding portion 120 in the vertical direction, and the second holding portion 130 is arranged to be placed in the center of the second chamber 112. In addition, the suction pipe 151 of the decompression portion 150 is connected to the second chamber 112 outside the second holding portion 130 when viewed from above.

[0098] The second holding portion 130 has an electrostatic suction cup 131 and a cooling plate 132. The electrostatic suction cup 131 has an internal electrode and a dielectric, and uses an electrostatic force generated by applying a voltage to the internal electrode to adsorb the second substrate W2 to the adsorption surface. The cooling plate 132 is, for example, a water-cooled plate, and cooling water flows inside the cooling plate 132. The second substrate W2 held by the electrostatic suction cup 131 is adjusted to a desired temperature, such as room temperature, by the cooling plate 132. In addition, these electrostatic suction cups 131 and cooling plates 132 have the same structure as the electrostatic suction cup 121 and cooling plates 122 of the first holding portion 120.

[0099] Two second suction cup marks N21 and N22 are formed as second holding marks on the upper surface side of the second holding portion 130. The second suction cup marks N21 and N22 are formed on the Y axis passing through the center of the electrostatic suction cup 131, for example, at the outer peripheral portion of the upper surface of the electrostatic suction cup 131. In addition, the second suction cup marks N21 and N22 each have a cross shape. In addition, these second suction cup marks N21 and N22 are arranged to face the first suction cup marks N11 and N12 formed on the first holding portion 120, respectively. In addition, the shape of the second suction cup marks N21 and N22 is not limited to a cross shape, and any shape can be adopted.

[0100] The second holding portion 130 is provided with, for example, three lifting pins 133 for supporting the second substrate W2 (or the superimposed substrate T) from below so as to lift it up and down. The lifting pins 133 are inserted through through holes 134 formed so as to penetrate the electrostatic chuck 131, the cooling plate 132, and the second chamber 112. The lifting pins 133 are configured to be freely lifted and lowered by a lifting mechanism 135 provided inside the support table 115.

[0101] For example, two fixed imaging units 200 and 201 are provided below the second holding unit 130 and the second chamber 112. As the fixed imaging units 200 and 201, cameras are used respectively.

[0102] The first fixed imaging unit 200 is arranged at a position facing the first suction cup mark N11 and the second suction cup mark N21. In addition, a first observation window 202 is formed between the first fixed imaging unit 200 and the second suction cup mark N21, the electrostatic suction cup 131, the cooling plate 132 and the second chamber 112. The first observation window 202 is formed of, for example, quartz glass. Through the first observation window 202, the airtightness of the processing container 110 can be ensured in a manner that does not hinder the imaging performed by the first fixed imaging unit 200. Through this structure, the first fixed imaging unit 200 can photograph the second suction cup mark N21 and the first suction cup mark N11 through the first observation window 202. In addition, the first suction cup mark N11 is photographed through the second suction cup mark N21. The camera image of the first fixed imaging unit 200 is output to the control device 80.

[0103] The second fixed camera unit 201 and its surroundings also have the same structure as the first fixed camera unit 200. That is, the second fixed camera unit 201 is arranged at a position facing the first chuck mark N12 and the second chuck mark N22, and a second observation window 203 is formed in the electrostatic chuck 131, the cooling plate 132, and the second chamber 112. In addition, the second fixed camera unit 201 can capture the second chuck mark N22 and the first chuck mark N12 through the second observation window 203. The captured image of the second fixed camera unit 201 is output to the control device 80.

[0104] The second cavity 112 is provided with a displacement meter 204. A laser displacement meter is used as the displacement meter 204. The displacement meter 204 is provided at a plurality of locations, for example, three locations, on the outer peripheral portion of the lower surface of the second holding portion 130.

[0105] An observation window 205 is formed at a position corresponding to the displacement meter 204 in the electrostatic chuck 131, the cooling plate 132, and the second chamber 112. The observation window 205 is formed of, for example, quartz glass. The observation window 205 can maintain the airtightness of the processing container 110 in a manner that does not hinder the optical path of the laser of the displacement meter 204.

[0106] With this structure, the displacement meter 204 can irradiate the lower surface of the electrostatic chuck 121 of the first holding portion 120 with a laser through the observation window 205, and can receive the reflected light from the electrostatic chuck 121. Furthermore, the distance between the first holding portion 120 and the second holding portion 130 can be measured using the displacement meter 204. In addition, by using three displacement meters 204, the slope of the first holding portion 120 can also be measured. The measurement results of the displacement meter 204 are output to the control device 80.

[0107] Furthermore, the displacement meter 204 is not disposed inside the processing chamber 110 and does not need to be vacuumed. Therefore, as the displacement meter 204, an inexpensive displacement meter that can be used in an atmospheric environment can be used.

[0108] (Structure of the Image Capture Units 210 and 211 and Their Periphery)

[0109] Next, the structure of the camera units 210, 211 and their surroundings will be described. Figure 5 to Figure 7 As shown, the two imaging units 210 and 211 are configured to move between the inside and the outside of the processing container 110 .

[0110] Fig.14 It is a plan view schematically showing the structure of the first imaging unit 210 . Fig.15 It is a side view schematically showing the structure of the first imaging unit 210 . Fig.16 2 is an explanatory diagram schematically showing the internal structure of the first camera unit 210. Fig.16 In the figure, the solid arrows represent the imaging paths (the first imaging path Q1 and the second imaging path Q2) from the camera, and the dotted arrows represent the optical paths (the first optical path R1 and the second optical path R2) from the light source.

[0111] The first imaging unit 210 includes a first imaging section 220 , a second imaging section 230 , and a common lens section 240 .

[0112] The first imaging unit 220 includes a first camera 221, a first light source 222, a first lens 223, and a first path changing unit 224. Reflectors 222a and 223a for changing the first optical path R1 from the first light source 222 are provided inside the first light source 222 and the first lens 223, respectively. Reflectors 224a for changing the first imaging path Q1 of the first camera 221 and the first optical path R1 are provided inside the first path changing unit 224.

[0113] The second imaging unit 230 also has the same configuration as the first imaging unit 220 . That is, the second imaging unit 230 includes a second camera 231 , a second light source 232 , a second lens 233 , and a second path changing unit 234 .

[0114] The common lens portion 240 has an upper lens 241, a lower lens 242, and a reflector 243. The reflector 243 is arranged in a manner of being inclined at 45 degrees when viewed from the side. The first imaging path Q1 and the first optical path R1 starting from the first imaging portion 220 change directions vertically upward, from the upper lens 241 toward the vertical upward. In addition, the second imaging path Q2 and the second optical path R2 starting from the second imaging portion 230 change directions vertically downward, from the lower lens 242 toward the vertical downward. In addition, the first imaging path Q1 (first optical path R1) and the second imaging path Q2 (second optical path R2) extend coaxially in the vertical direction.

[0115] The first camera unit 210 has the above structure, and as described later, simultaneously performs the imaging of the first alignment mark M11 by the first camera unit 220 and the imaging of the second alignment mark M21 by the second camera unit 230. In addition, the first camera unit 210 also simultaneously performs the imaging of the first suction cup mark N11 by the first camera unit 220 and the imaging of the second suction cup mark N21 by the second camera unit 230. The image captured by the first camera unit 210 is output to the control device 80.

[0116] Here, the advantages of the first imaging unit 210 will be described in comparison with conventional imaging units. Fig.17 : is an explanatory diagram schematically showing the internal structure of the conventional camera unit 500. In the case of a specification for simultaneously photographing the vertically upper side and the vertically lower side, in the conventional camera unit 500, the first camera unit 510 for photographing the vertically upper side and the second camera unit 520 for photographing the vertically lower side are arranged in a vertically aligned manner. The first camera 511 of the first camera unit 510 has a focusing axis, and the first lens 512 is arranged above the first path changing unit 513. The second camera 521 of the second camera unit 520 has a focusing axis, and the second lens 522 is arranged below the second path changing unit 523. In this case, the vertical distance L2 between the first substrate W1 and the second substrate W2 is very long, for example, 220 mm.

[0117] In contrast, the first imaging unit 210 of the present embodiment has a common lens unit 240. Fig.16 As shown, the vertical distance L1 between the first substrate W1 and the second substrate W2 can be shortened to, for example, 110 mm. As described later, the video recording by the first camera unit 210 is performed when the processing container 110 is open, but the distance between the first chamber 111 and the second chamber 112 separated at this time can be made small. In this way, the moving distance when the first chamber 111 is lowered to seal the processing container 110 can be reduced. As a result, the positional deviation of the first substrate W1 and the second substrate W2 can be suppressed. In addition, the processing time can be shortened.

[0118] Furthermore, the first imaging unit 220 , the second imaging unit 230 , and the common lens unit 240 are supported on a support plate 250 , and a portion of the first imaging unit 220 and a portion of the second imaging unit 230 are covered by a cover 251 .

[0119] The second imaging unit 211 also has the same structure as the first imaging unit 210 , that is, includes a first imaging section 220 , a second imaging section 230 , and a common lens section 240 .

[0120] The first imaging unit 210 is further provided with displacement meters 252 and 253. Laser displacement meters are used as the displacement meters 252 and 253. The upper displacement meter 252 measures the thickness of the upper part, for example, the first substrate W1, and the lower displacement meter 253 measures the thickness of the lower part, for example, the second substrate W2.

[0121] like Figure 5 to Figure 7 As shown, the joining device 30 includes a first moving mechanism 260 , a second moving mechanism 270 , and a third moving mechanism 280 for moving the imaging units 210 , 211 .

[0122] The first moving mechanism 260 moves the two imaging units 210 and 211 in the plane region between the first holding portion 120 and the second holding portion 130 in the X-axis direction (first direction). The first moving mechanism 260 includes a door-shaped moving frame 261 that supports the two imaging units 210 and 211 and extends in the Y-axis direction when viewed from above. In addition, a pair of guide rails 262 and 262 extending from the negative direction side of the processing container 110 to the positive direction side of the X-axis are provided on the base 100. The moving frame 261 is mounted on the pair of guide rails 262 and 262. In addition, a driving unit (not shown) such as a motor is provided in the moving frame 261, and the moving frame 261 is configured to be movable along the guide rails 262 extending along the X-axis.

[0123] The second moving mechanism 270 moves the first imaging unit 210 in the Y-axis direction (second direction). The second moving mechanism 270 supports the first imaging unit 210 and is attached to the upper surface of the moving frame 261. The second moving mechanism 270 has a built-in drive unit such as a motor and is configured to be movable along the moving frame 261.

[0124] The third moving mechanism 280 moves the second imaging unit 211 in the Y-axis direction (second direction). The third moving mechanism 280 supports the second imaging unit 211 and is attached to the upper surface of the moving frame 261. The third moving mechanism 280 has a built-in drive unit such as a motor and is configured to be movable along the moving frame 261.

[0125] A reference mark portion 290 is provided on the negative side of the processing container 110 in the X-axis direction. Fig.18 1 is a side view schematically showing the structure of reference mark portion 290 . Reference mark portion 290 includes a first reference mark support body 291 and a second reference mark support body 292 .

[0126] First reference mark support 291 is provided on base 100 and has a gate-shaped frame structure extending in the Y-axis direction. First reference mark support 291 is formed larger than moving frame 261 , and moving frame 261 passes through the inside of first reference mark support 291 .

[0127] For example, three first reference marks S11, S12, and S13 are formed on the lower surface of the first reference mark support body 291. When the camera units 210 and 211 supported by the moving frame 261 pass through the first reference mark support body 291, the first camera unit 220 of each camera unit 210 and 211 respectively captures one of the first reference marks S11, S12, and S13. The captured image of the first camera unit 220 is output to the control device 80. In addition, in the present embodiment, three first reference marks S11, S12, and S13 are provided, but it is sufficient to have two or more first reference marks for the first camera unit 220 of each camera unit 210 and 211 to capture.

[0128] Second reference mark support bodies 292 are provided on base 100 so as to extend vertically upward. Three second reference mark support bodies 292 are provided below each of first reference marks S11, S12, and S13. Second reference mark support bodies 292 are provided inside moving frame 261, and moving frame 261 passes above first reference mark support bodies 291.

[0129] Second reference marks S21, S22, and S23 are formed on the upper surfaces of the three second reference mark supports 292. That is, the second reference marks S21, S22, and S23 are arranged to face the first reference marks S11, S12, and S13, respectively. Moreover, when the camera units 210 and 211 supported by the moving frame 261 pass through the second reference mark support 292, the second camera unit 230 of each camera unit 210 and 211 respectively captures one of the second reference marks S21, S22, and S23. The captured image of the second camera unit 230 is output to the control device 80.

[0130] Furthermore, the first imaging unit 220 simultaneously captures the first reference marks S11, S12, and S13, and the second imaging unit 230 simultaneously captures the second reference marks S21, S22, and S23. As described below, the postures (orientations) of the imaging units 210 and 211 are adjusted based on the captured images of the reference marks.

[0131] <Operation of the Joint System 1>

[0132] Next, a description will be given of a process of joining the substrates W1 and W2 using the joining system 1 configured as described above. Fig.19 This is a flow chart showing the main steps of the substrate bonding process.

[0133] First, a cassette Cw1 containing a plurality of first substrates W1, a cassette Cw2 containing a plurality of second substrates W2, and an empty cassette Ct are placed on a desired cassette placement plate 11 of the loading / unloading station 2. Then, the first substrate W1 in the cassette Cw1 is taken out by the substrate transfer device 22 and transferred to the conveyor device 60 of the third processing block G3 of the processing station 3.

[0134] Next, the first substrate W1 is transferred to the load lock chamber 42 of the second processing block G2 by the substrate transfer device 71. Thereafter, the load lock chamber 42 is sealed and depressurized. Next, the first substrate W1 is transferred to the reforming device 40 by the substrate transfer device of the transfer chamber 41.

[0135] In the modification device 40, oxygen or nitrogen as a processing gas is excited to plasma in a desired reduced pressure atmosphere, thereby ionizing it. The bonding surface W1a of the first substrate W1 is irradiated with the oxygen ions or nitrogen ions to perform plasma treatment on the bonding surface W1a. Then, the bonding surface W1a of the first substrate W1 is modified ( Fig.19 Step A1).

[0136] Next, the first substrate W1 is transferred to the load lock chamber 42 by the substrate transfer device of the transfer chamber 41 . Thereafter, the load lock chamber 42 is sealed and opened to the atmosphere. Next, the first substrate W1 is transferred to the hydrophilization device 50 by the substrate transfer device 71 .

[0137] In the hydrophilizing device 50, pure water is supplied to the first substrate W1 while rotating the first substrate W1 held by the rotating chuck. In this way, the supplied pure water diffuses on the bonding surface W1a of the first substrate W1, and hydroxyl groups (silanol groups) are attached to the bonding surface W1a of the first substrate W1 modified in the modifying device 40, thereby hydrophilizing the bonding surface W1a. In addition, the bonding surface W1a of the first substrate W1 is cleaned by the pure water ( Fig.19 Step A2).

[0138] Next, regarding the first substrate W1, the horizontal direction of the first substrate W1 is adjusted by adjusting the position of the orientation plane or the cutout. In addition, the front and back surfaces of the first substrate W1 are turned over so that the bonding surface W1a of the first substrate W1 faces downward. In addition, the horizontal direction adjustment and the front and back surface turning over of the first substrate W1 are performed by a device (not shown) provided in the bonding system 1.

[0139] Next, the first substrate W1 is transported to the bonding device 30 of the first processing block G1 by the substrate transport device 71. At this time, the first chamber 111 is separated from the second chamber 112, and the processing container 110 is opened. The first substrate W1 is delivered to the suction cup 123 which is previously waiting at a position lower than the electrostatic suction cup 121 of the first holding portion 120, with the bonding surface W1a facing downward. Next, the suction cup 123 is raised, as shown in FIG. Fig. 20 As shown, the first substrate W1 is held on the electrostatic chuck 121 ( Fig.19 Step A3).

[0140] While the first substrate W1 is being processed in the above-mentioned steps A1 to A3 , the second substrate W2 is processed subsequent to the first substrate W1 . First, the second substrate W2 in the cassette Cw2 is taken out by the substrate transfer device 22 and transferred to the conveyor device 60 of the processing station 3 .

[0141] Next, the second substrate W2 is transferred to the load lock chamber 42 by the substrate transfer device 71, and is transferred to the modification device 40 by the substrate transfer device of the transfer chamber 41. In the modification device 40, the bonding surface W2a of the second substrate W2 is modified ( Fig.19 In addition, the modification of the bonding surface W2a of the second substrate W2 in step A4 is the same as that in the above-mentioned step A1.

[0142] Next, the second substrate W2 is transferred to the load lock chamber 42 by the substrate transfer device of the transfer chamber 41, and is transferred to the hydrophilization device 50 by the substrate transfer device 71. In the hydrophilization device 50, the bonding surface W2a of the second substrate W2 is hydrophilized and cleaned. Fig.19 In addition, the hydrophilization and cleaning of the bonding surface W2a of the second substrate W2 in step A5 are the same as those in the above-mentioned step A2.

[0143] Next, regarding the second substrate W2, the horizontal orientation of the first substrate W1 is adjusted by adjusting the position of the orientation plane or the cutout. The horizontal orientation adjustment and front and back flipping of the second substrate W2 are performed by a device (not shown) provided in the bonding system 1.

[0144] Next, the second substrate W2 is transported to the bonding device 30 by the substrate transport device 71. The second substrate W2 transported to the bonding device 30 is delivered to the lifting pins 133 which are previously waiting at a position higher than the electrostatic suction cup 131 of the second holding portion 130, with the bonding surface W2a facing upward. Next, the lifting pins 133 are lowered, as shown in FIG. Fig. 20 As shown, the second substrate W2 is held on the electrostatic chuck 131 ( Fig.19 Step A6).

[0145] Next, the postures (orientations) of the first camera unit 210 and the second camera unit 211 are adjusted ( Fig.19 Step A7).

[0146] In step A7, if Fig.21 As shown, the first moving mechanism 260 moves the imaging units 210 and 211 waiting outside the processing container 110 to the positive direction of the X-axis to the position of the reference mark portion 290. In the reference mark portion 290, while the first imaging unit 220 of the first imaging unit 210 captures the first reference mark S11, the second imaging unit 230 captures the second reference mark S21. The image captured by the first imaging unit 210 is output to the control device 80. In the control device 80, edge detection is performed on the acquired image data, thereby detecting the first reference mark S11 and the second reference mark S21 respectively. Moreover, the adjustment mechanism (not shown) of the first imaging unit 210 is controlled so that the first reference mark S11 is consistent with the second reference mark S21. Moreover, the posture (orientation) of the first imaging unit 210 is adjusted by the adjustment mechanism.

[0147] In step A7, the posture (orientation) of the second imaging unit 211 is adjusted by the same method as the above-mentioned adjustment method for the first imaging unit 210. By adjusting the postures of the imaging units 210 and 211 in this way, it is possible to improve the imaging accuracy of the imaging units 210 and 211. As a result, it is possible to improve the adjustment accuracy (alignment accuracy) of the horizontal positions of the substrates W1 and W2 in step A9 described later.

[0148] Next, the thickness of the first substrate W1 and the second substrate W2 is measured ( Fig.19 Step A8).

[0149] In step A8, if Fig.21 As shown, the imaging units 210 and 211 are further moved to the positive direction of the X-axis so as to be arranged inside the processing container 110. Inside the processing container 110, while the first imaging unit 210 is moved from one end to the other end of the substrates W1 and W2 along the X-axis direction, the thickness of the first substrate W1 and the thickness of the second substrate W2 are respectively measured using the displacement meters 252 and 253. The measurement results of the displacement meters 252 and 253 are output to the control device 80. In the control device 80, the thickness of the first substrate W1 and the thickness of the second substrate W2 are used to manage the interval (gap) between the substrates W1 and W2 when the first substrate W1 and the second substrate W2 are bonded in step A13 described later.

[0150] In addition, the horizontality (vertical position) of the first holding part 120 may also be adjusted in step A8. In the control device 80, the horizontality of the first holding part 120 is measured based on the measurement results of the displacement meters 252 and 253. In addition, the three vertical position adjustment parts 180 are controlled so that the adsorption surface of the electrostatic chuck 121 of the first holding part 120 becomes horizontal. By driving the three vertical position adjustment parts 180 separately, the three transmission axes can be raised and lowered separately, thereby adjusting the horizontality of the first holding part 120.

[0151] Next, the horizontal position of the first holding portion 120 is adjusted, and the horizontal positions of the first substrate W1 and the second substrate W2 are adjusted ( Fig.19 Step A9).

[0152] In step A9, if Fig. 22 and Fig.23 As shown, the imaging units 210 and 211 are moved in the X-axis direction by the first moving mechanism 260, and the common lens portion 240 of each imaging unit 210 and 211 is arranged at the center position of the substrates W1 and W2 in the X-axis direction.

[0153] Next, the first camera unit 210 is moved in the positive direction of the Y axis by the second moving mechanism 270, and the common lens unit 240 is arranged at a position facing the first alignment mark M11 and the second alignment mark M21. Moreover, while the first camera unit 220 photographs the first alignment mark M11, the second camera unit 230 photographs the second alignment mark M21. The photographed image of the first camera unit 210 is output to the control device 80. Since the photographing of the first alignment mark M11 and the photographing of the second alignment mark M21 are performed simultaneously in this way, the photographing time can be shortened, and the adjustment accuracy (alignment accuracy) of the horizontal position described later can also be improved.

[0154] Similarly, the second camera unit 211 is moved in the negative direction of the Y axis by the third moving mechanism 280, and the common lens unit 240 is arranged at a position facing the first alignment mark M12 and the second alignment mark M22. Moreover, while the first camera unit 220 photographs the first alignment mark M12, the second camera unit 230 photographs the second alignment mark M22. The camera image of the second camera unit 211 is output to the control device 80.

[0155] In the control device 80, edge detection is performed on the acquired image data, thereby detecting the alignment marks M11, M21, M12, and M22 respectively. In addition, the horizontal position adjustment unit 170 is controlled so that the cross shape of the first alignment mark M11 is consistent with the cross shape of the second alignment mark M21, and the cross shape of the first alignment mark M12 is consistent with the cross shape of the second alignment mark M22. The horizontal position (position and orientation in the horizontal direction) of the first holding unit 120 is adjusted by controlling the horizontal position adjustment unit 170.

[0156] The horizontal position adjusting unit 170 moves the first holding unit 120 in the horizontal direction or rotates the first holding unit 120 about the vertical axis, thereby adjusting the horizontal positions of the first substrate W1 and the second substrate W2.

[0157] As described above, in step A9, the alignment marks M11, M21, M12, and M22 are photographed by the two imaging units 210 and 211, and the horizontal positions of the first substrate W1 and the second substrate W2 are adjusted, so that the accuracy of the adjustment (alignment accuracy) can be improved. In addition, the adjustment can be performed in a short time.

[0158] Next, the first suction cup marks N11, N12 and the second suction cup marks N21, N22 are detected ( Fig.19 Step A10).

[0159] In step A10, if Fig.23 and Fig.24 As shown, the first camera unit 210 is moved in the positive direction of the Y axis by the second moving mechanism 270, and the common lens unit 240 of the first camera unit 210 is arranged at a position facing the first suction cup mark N11 and the second suction cup mark N21. Moreover, while the first camera unit 220 photographs the first suction cup mark N11, the second camera unit 230 photographs the second suction cup mark N21. The photographed image of the first camera unit 210 is output to the control device 80.

[0160] Similarly, the second camera unit 211 is moved in the negative direction of the Y axis by the third moving mechanism 280, and the common lens unit 240 is arranged at a position facing the first suction cup mark N12 and the second suction cup mark N22. Moreover, while the first camera unit 220 photographs the first suction cup mark N12, the second camera unit 230 photographs the second suction cup mark N22. The photographed image of the second camera unit 211 is output to the control device 80.

[0161] Here, before adjusting the horizontal position of the substrates W1 and W2 in step A9, the coordinates (x, y) of the pair of suction cup marks N11 and N21 facing each other are the reference coordinates (0, 0). Then, when the first holding unit 120 is moved in the horizontal direction in step A9, the suction cup marks N11 and N21 are also moved, so the coordinates (x, y) of the suction cup marks N11 and N21 are (Δx1, Δy1). Similarly, the coordinates (x, y) of the other pair of suction cup marks N12 and N22 facing each other are (Δx2, Δy2).

[0162] The control device 80 performs edge detection on the acquired image data, thereby detecting the suction cup marks N11, N21, N12, and N22, respectively. Furthermore, the coordinates (Δx1, Δy1) of the suction cup marks N11 and N21 and the coordinates (Δx2, Δy2) of the suction cup marks N12 and N22 are calculated. The control device 80 uses the coordinates (Δx1, Δy1) and (Δx2, Δy2) of these suction cup marks when adjusting the horizontal position of the first holding unit 120 in step A12 described later.

[0163] In addition, in the present embodiment, the alignment marks M11, M21, M12, M22 and the suction cup marks N11, N21, N12, N22 are respectively arranged on the same Y axis. Therefore, the movement of the camera units 210, 211 in step A10 is only the movement in the Y axis direction. Moreover, each distance D between the alignment marks M11, M21, M12, M22 and the suction cup marks N11, N21, N12, N22 is small, for example, 20 mm to 30 mm. In this case, the deviation of the posture caused by the movement of the camera units 210, 211 can be suppressed, so that the camera accuracy of the camera units 210, 211 can be improved.

[0164] When the above steps A8 to A10 are completed, the first moving mechanism 260 moves the imaging units 210 and 211 in the negative direction of the X axis and withdraws them to the outside of the processing container 110. In addition, in steps A9 and A10, if Fig.23 As shown, the first camera unit 210 moves in a first area B1 on the positive side of the Y axis and takes pictures, and the second camera unit 211 moves in a second area B2 on the negative side of the Y axis and takes pictures.

[0165] Next, the processing container 110 is sealed, and the interior of the processing container 110 is depressurized to a desired vacuum degree ( Fig.19 Step A11).

[0166] In step A11, if Fig.25As shown, the first chamber 111 is lowered by the chamber lifting mechanism 140 to make the first chamber 111 contact with the second chamber 112. Then, a closed space is formed inside the processing container 110. After that, the suction device 152 of the decompression unit 150 is operated to decompress the inside of the processing container 110. Thus, the inside of the processing container 110 is maintained at a desired vacuum level of, for example, 1 Pa or less.

[0167] Here, when the camera units 210 and 211 are used as described above, the vertical distance L1 between the first substrate W1 and the second substrate W2 is short, so the moving distance when the first chamber 111 is lowered can be reduced. Therefore, it is possible to suppress the positional deviation of the horizontal position of the first holding portion 120 caused by the lowering of the first chamber 111. In addition, the time spent in step A11 can be shortened.

[0168] Next, adjust the horizontal position of the first holding portion 120 ( Fig.19 Here, in the above-mentioned step A11, the pressure in the processing container 110 is reduced to generate pressure fluctuations, and therefore, due to the impact, the horizontal position of the first holding unit 120 adjusted in step A9 is slightly deviated. Therefore, the horizontal position of the first holding unit 120 is adjusted again.

[0169] In step A12 , the first fixed imaging unit 200 captures the first suction cup mark N11 and the second suction cup mark N21 , and the second fixed imaging unit 201 captures the first suction cup mark N12 and the second suction cup mark N22 . The images captured by the fixed imaging units 200 and 201 are output to the control device 80 .

[0170] In the control device 80, edge detection is performed on the acquired image data, thereby detecting the suction cup marks N11, N21, N12, and N22 respectively. In addition, the coordinates (Δx1, Δy1) of the suction cup marks N11 and N21 and the coordinates (Δx2, Δy2) of the suction cup marks N12 and N22 acquired in the above-mentioned step A10 are restored. That is, Fig.26 As shown, the horizontal position adjustment unit 170 is controlled so that the suction cup marks N11 and N21 are located at the coordinates (Δx1, Δy1), and the suction cup marks N12 and N22 are located at the coordinates (Δx2, Δy2). The horizontal position (position and orientation in the horizontal direction) of the first holding unit 120 is adjusted by controlling the horizontal position adjustment unit 170.

[0171] Next, the first substrate W1 and the second substrate W2 are bonded ( Fig.19 Step A13).

[0172] In step A13, if Fig. 27As shown, the first holding part 120 is lowered using three vertical position adjustment parts 180 to make the first substrate W1 abut against the second substrate W2. At this time, in the control device 80, the interval between the first substrate W1 and the second substrate W2 is controlled while considering the thickness of the first substrate W1 and the second substrate W2 measured in step A8.

[0173] In steps A1 and A4, the bonding surface W1a of the first substrate W1 and the bonding surface W2a of the second substrate W2 are modified, so that firstly, van der Waals force (intermolecular force) is generated between the bonding surfaces W1a and W2a to bond the bonding surfaces W1a and W2a to each other. In addition, in steps A2 and A5, the bonding surface W1a of the first substrate W1 and the bonding surface W2a of the second substrate W2 are hydrophilized, so that the hydrophilic groups between the bonding surfaces W1a and W2a generate hydrogen bonding (intermolecular force) to bond the bonding surfaces W1a and W2a to each other.

[0174] Next, the first substrate W1 and the second substrate W2 are pressed to further firmly bond them ( Fig.19 Step A14).

[0175] In step A14, if Fig.28 As shown, the pressing mechanism 191 of the pressing part 190 is used to move the pressing rod 193 in the vertical direction. As a result, the first holding part 120 approaches the second holding part 130, and the first substrate W1 held by the first holding part 120 is pressed against the second substrate W2 held by the second holding part 130. In addition, at this time, the load applied to the first substrate W1 and the second substrate W2 is measured using the measuring mechanism 192. In addition, the pressing load is, for example, 30 kN. Moreover, by pressing the first substrate W1 and the second substrate W2, the first substrate W1 and the second substrate W2 are further firmly joined to form a superimposed substrate T.

[0176] Fig.29 1 is an explanatory diagram showing the load condition when the first substrate W1 and the second substrate W2 are pressed. As described above, the pressing load P1 of the pressurizing portion 190 is 30 kN. On the other hand, a pressure differential load P2 of 18 kN is applied to the upper surface of the support plate 114 of the processing container 110, which is the atmospheric pressure outside the processing container 110 and the vacuum pressure inside the processing container 110. In this way, the load substantially applied to the processing container 110 is 12 kN obtained by subtracting the pressure differential load P2 from the pressing load P1. The 12 kN is borne by the reaction force P3 generated by the chamber lifting mechanism 140. Therefore, in this embodiment, the pressing load P1 can be borne in a manner that does not apply a load to the processing container 110.

[0177] Even when the first substrate W1 and the second substrate W2 are pressed in this manner, no load is applied to the movable plate 161 of the support portion 160. The reason for this will be described below.

[0178] The first holding portion 120 is supported by the transmission shaft 162 in a state of hanging from above. In addition, the first holding portion 120 can be pressed from above by the pressurizing portion 190, and the transmission shaft 162 can release the pressing. Here, when the first holding portion 120 is pressed in a state where the first substrate W1 and the second substrate W2 are in contact, the first holding portion 120 may be deformed. When the first holding portion 120 is deformed, stress is applied to the movable plate 161 via the transmission shaft 162. In this regard, for example, if the motor of the vertical position adjustment portion 180 is stopped, the transmission shaft 162 and the movable plate 161 become free in the vertical direction. In this way, the movable plate 161 and the first holding portion 120 are independent of each other in the vertical direction, so no load is applied to the movable plate 161. In addition, since no load is applied to the movable plate 161, of course, no load is applied to the horizontal position adjustment portion 170.

[0179] Therefore, in the bonding apparatus 30 of the present embodiment, it is possible to simultaneously realize a high-load bonding process by the pressurizing portion 190 and a high-precision alignment by the horizontal position adjusting portion 170 via the supporting portion 160 .

[0180] Next, the processing container 110 is opened and the interior of the processing container 110 is set to atmospheric pressure ( Fig.19 Step A15).

[0181] In step A15, if Fig.30 As shown, the first chamber 111 is raised by the chamber lifting mechanism 140 to open the processing container 110. At this time, the electrostatic chuck 121 of the first holding part 120 stops adsorbing and holding the first substrate W1, and the first holding part 120 is raised by the vertical position adjustment part 180. In addition, the pressing of the pressurizing part 190 is also stopped.

[0182] Next, the electrostatic chuck 131 of the second holding portion 130 stops adsorbing and holding the second substrate W2 (overlapping substrate T), and then the overlapping substrate T is lifted from the electrostatic chuck 131 by the lifting pins 133. Fig.31 As shown, the superimposed substrate T is delivered from the lift pins 133 to the substrate transfer device 71 and is carried out from the bonding device 30 .

[0183] Next, the superimposed substrate T is transported to the conveyor 61 by the substrate transport device 71, and then transported to the desired cassette Ct on the cassette mounting plate 11 by the substrate transport device 22 of the loading / unloading station 2. Thus, a series of bonding processes of the substrates W1 and W2 are completed.

[0184] According to the above embodiment, the horizontal positions of the first substrate W1 and the second substrate W2 can be appropriately adjusted in step A9, so that the bonding accuracy when bonding the first substrate W1 and the second substrate W2 in step A13 can be improved. In addition, the productivity of the bonding process can be improved.

[0185] In the above embodiment, after the first substrate W1 and the second substrate W2 are bonded in step A13, the first substrate W1 and the second substrate W2 are pressed in step A14. However, if sufficient bonding strength can be obtained by step A13, step A14 may be omitted. In this case, the pressurizing unit 190 may also be omitted.

[0186] Alternatively, the pressurizing portion 190 may be omitted and a striker may be provided to lower only the center of the upper surface of the first holding portion 120. In this case, the center of the first substrate W1 is brought into contact with the center of the second substrate W2 while the first substrate W1 is warped convexly downward, and bonding is performed sequentially from the center of the substrate toward the periphery.

[0187] In the above embodiment, an example in which the pressurizing portion 190 presses the first holding portion 120 vertically downward has been described, but the pressurizing portion 190 may press the second holding portion 130 vertically upward.

[0188] Furthermore, in the above embodiment, the alignment mechanism composed of the support portion 160 , the horizontal position adjustment portion 170 , and the vertical position adjustment portion 180 is provided in the first holding portion 120 , but may be provided in the second holding portion 130 .

[0189] In addition, in the above embodiment, an example is described in which the first holding portion 120 is arranged at the top and the second holding portion 130 is arranged at the bottom, but the first holding portion 120 and the second holding portion 130 may be arranged upside down and reversely. In addition, in the above embodiment, the first holding portion 120 is configured to be movable in the vertical direction, but the second holding portion 130 may be freely movable in the vertical direction, or both the first holding portion 120 and the second holding portion 130 may be freely movable in the vertical direction.

[0190] In addition, in the above embodiment, the first substrate W1 and the second substrate W2 are bonded together in a vacuum atmosphere, but the present embodiment can also be applied to a case where the bonding is performed in an air atmosphere.

[0191] The embodiments disclosed herein are to be considered in all respects as illustrative and non-restrictive. The embodiments described above may be omitted, replaced, or modified in various ways without departing from the appended claims and the gist thereof.

[0192] In addition, the following structures also belong to the technical scope of the present disclosure.

[0193] (1) A bonding device for bonding a first substrate to a second substrate, the bonding device comprising: a first holding portion for holding the first substrate; a second holding portion for holding the second substrate, the second holding portion being arranged opposite to the first holding portion; two camera units, the two camera units having a first camera unit and a second camera unit, the first camera unit photographing a first alignment mark formed on the bonding surface of the first substrate, and the second camera unit photographing a second alignment mark formed on the bonding surface of the second substrate; a first moving mechanism for moving the two camera units along a first direction within a planar area between the first holding portion and the second holding portion; a second moving mechanism for moving the first of the two camera units along a second direction orthogonal to the first direction; and a third moving mechanism for moving the second of the two camera units along the second direction.

[0194] (2) The bonding device described in (1) further includes a control unit that controls the first moving mechanism, the second moving mechanism, and the third moving mechanism so that the first imaging unit images the first area and the second imaging unit images the second area.

[0195] (3) In the bonding device described in (1) or (2), the camera unit has a reflector, which changes the first optical axis of the first camera unit to the first substrate side, and changes the second optical axis of the second camera unit to the second substrate side and changes it to be coaxial with the first optical axis.

[0196] (4) In the bonding device described in any one of (1) to (3) above, the first imaging unit images a first holding mark formed on the first holding unit, and the second imaging unit images a second holding mark formed on the second holding unit.

[0197] (5) The joining device described in (4) further comprises: a processing container for accommodating the first holding portion and the second holding portion; and a fixed camera unit for photographing the first holding mark and the second holding mark from outside the processing container.

[0198] (6) In the joining device described in any one of (1) to (5), there is provided: a first reference mark, which is arranged at a position separated from the first holding portion and the second holding portion in the first direction when viewed from above, and the first reference mark is photographed by the first camera unit; and a second reference mark, which is arranged opposite to the first reference mark, and the second reference mark is photographed by the second camera unit.

[0199] (7) A joining system for joining a first substrate to a second substrate, the joining system comprising: a processing station having a joining device for joining the first substrate to the second substrate; and a loading and unloading station for loading and unloading the first substrate, the second substrate, or a superimposed substrate formed by joining the first substrate to the second substrate relative to the processing station, wherein the joining device comprises: a first holding portion for holding the first substrate; a second holding portion for holding the second substrate, the second holding portion being arranged opposite to the first holding portion; two camera units, the two camera units comprising a first camera unit and a second camera unit, the first camera unit photographing a first alignment mark formed on the joining surface of the first substrate, and the second camera unit photographing a second alignment mark formed on the joining surface of the second substrate; a first moving mechanism for moving the two camera units along a first direction within a plane region between the first holding portion and the second holding portion; a second moving mechanism for moving the first of the two camera units along a second direction orthogonal to the first direction; and a third moving mechanism for moving the second of the two camera units along the second direction.

[0200] (8) A bonding method is a bonding method for bonding a first substrate to a second substrate using a bonding device, the bonding device comprising: a first holding portion that holds the first substrate; a second holding portion that holds the second substrate, the second holding portion being arranged opposite to the first holding portion; two camera units, the two camera units having a first camera unit and a second camera unit, the first camera unit photographing a first alignment mark formed on the bonding surface of the first substrate, and the second camera unit photographing a second alignment mark formed on the bonding surface of the second substrate; a first moving mechanism that moves the two camera units along a first direction within a planar area between the first holding portion and the second holding portion; a second moving mechanism that moves the first of the two camera units along a second direction orthogonal to the first direction; and a third moving mechanism that moves the second of the two camera units along the second direction. The bonding method includes the following steps: step (a), holding the first substrate by the first holding portion; step (b), holding the second substrate by the second holding portion; step (c), moving the first camera unit and the second camera unit in the first direction by the first moving mechanism; step (d), moving the first camera unit in the second direction by the second moving mechanism; step (e), moving the second camera unit in the second direction by the third moving mechanism; step (f), photographing the first alignment mark and the second alignment mark by the first camera unit and the second camera unit respectively; and step (g), adjusting the horizontal position of the first substrate held by the first holding portion and the second substrate held by the second holding portion based on the image photographed by the step (f).

[0201] (9) In the joining method described in (8), in the step (d), the first camera unit is moved in the first area, in the step (e), the second camera unit is moved in the second area, and in the step (f), the first area is photographed by the first camera unit, and the second area is photographed by the second camera unit.

[0202] (10) In the bonding method described in (8) or (9), the camera unit has a reflector, which changes the first camera path of the first camera part to the first substrate side, and changes the second camera path of the second camera part to the second substrate side and changes it to be coaxial with the first camera path. In the step (f), the first alignment mark and the second alignment mark are simultaneously photographed by the camera unit.

[0203] (11) In the joining method described in any one of (8) to (10), after the step (g), the first camera unit is moved in the second direction by the second moving mechanism, and the second camera unit is moved in the second direction by the third moving mechanism. In each of the first camera unit and the second camera unit, the first camera portion is used to photograph the first holding mark formed on the first holding portion, and the second camera portion is used to photograph the second holding mark formed on the second holding portion.

[0204] (12) In the joining method described in any one of (8) to (11), the joining device comprises: a first reference mark, which is arranged at a position separated from the first camera unit and the second camera unit in the first direction when viewed from above, and the first reference mark is photographed by the first camera unit; and a second reference mark, which is arranged opposite to the first reference mark, and the second reference mark is photographed by the second camera unit. In the step (c), the first reference mark is photographed by the first camera unit, and the second reference mark is photographed by the second camera unit.

[0205] Description of Reference Numerals

[0206] 30: bonding device; 120: first holding portion; 130: second holding portion; 210: first camera unit; 211: second camera unit; 220: first camera portion; 230: first camera portion; 260: first moving mechanism; 270: second moving mechanism; 280: third moving mechanism; W1: first substrate; W2: second substrate.

Claims

1. A bonding device for bonding a first substrate to a second substrate, the bonding device comprising: a first holding portion that holds the first substrate; a second holding portion for holding the second substrate, the second holding portion being arranged to face the first holding portion; Two camera units, each of the two camera units includes a first camera unit, a second camera unit, and an adjustment mechanism, the first camera unit photographs a first alignment mark formed on the bonding surface of the first substrate, and the second camera unit photographs a second alignment mark formed on the bonding surface of the second substrate; a first moving mechanism that moves the two camera units along a first direction within a plane region between the first holding portion and the second holding portion; a second moving mechanism, which enables a first camera unit of the two camera units to move along a second direction orthogonal to the first direction; a third moving mechanism, which enables the second camera unit of the two camera units to move along the second direction; a control unit configured to control the first moving mechanism, the second moving mechanism, and the third moving mechanism so that the first camera unit can capture a first area and the second camera unit can capture a second area; a first reference mark disposed at a position separated from the first holding portion and the second holding portion in the first direction when viewed from above, wherein the first camera captures an image of the first reference mark; as well as a second reference mark disposed opposite to the first reference mark, wherein the second imaging unit captures an image of the second reference mark; The control unit detects the image of the first reference mark taken by the first camera unit and the image of the second reference mark taken by the second camera unit, controls the adjustment mechanism of the first camera unit to adjust the posture of the first camera unit so that the detected first reference mark and the second reference mark are consistent, and controls the adjustment mechanism of the second camera unit to adjust the posture of the second camera unit so that the detected first reference mark and the second reference mark are consistent.

2. The joining device according to claim 1, characterized in that: The imaging unit includes a reflecting mirror configured to change a first optical axis of the first imaging unit toward the first substrate and to change a second optical axis of the second imaging unit toward the second substrate to be coaxial with the first optical axis.

3. The joining device according to claim 1 or 2, characterized in that: The first camera unit captures a first holding mark formed on the first holding unit. The second imaging unit images a second holding mark formed on the second holding unit.

4. The joining device according to claim 3, characterized in that: Also features: a processing container for accommodating the first holding portion and the second holding portion; and The imaging unit is fixed to capture an image of the first holding mark and the second holding mark from outside the processing container.

5. A bonding system for bonding a first substrate to a second substrate, the bonding system comprising: a processing station having a bonding device for bonding the first substrate to the second substrate; as well as a loading and unloading station for loading and unloading the first substrate, the second substrate, or a superimposed substrate formed by bonding the first substrate and the second substrate relative to the processing station, in, The engaging device comprises: a first holding portion that holds the first substrate; a second holding portion for holding the second substrate, the second holding portion being arranged to face the first holding portion; Two camera units, each of the two camera units includes a first camera unit, a second camera unit, and an adjustment mechanism, the first camera unit photographs a first alignment mark formed on the bonding surface of the first substrate, and the second camera unit photographs a second alignment mark formed on the bonding surface of the second substrate; a first moving mechanism that moves the two camera units along a first direction within a plane region between the first holding portion and the second holding portion; a second moving mechanism, which enables a first camera unit of the two camera units to move along a second direction orthogonal to the first direction; a third moving mechanism, which enables the second camera unit of the two camera units to move along the second direction; a control unit configured to control the first moving mechanism, the second moving mechanism, and the third moving mechanism so that the first camera unit can capture a first area and the second camera unit can capture a second area; a first reference mark disposed at a position separated from the first holding portion and the second holding portion in the first direction when viewed from above, wherein the first camera captures an image of the first reference mark; as well as a second reference mark disposed opposite to the first reference mark, wherein the second imaging unit captures an image of the second reference mark; The control unit detects the image of the first reference mark taken by the first camera unit and the image of the second reference mark taken by the second camera unit, controls the adjustment mechanism of the first camera unit to adjust the posture of the first camera unit so that the detected first reference mark and the second reference mark are consistent, and controls the adjustment mechanism of the second camera unit to adjust the posture of the second camera unit so that the detected first reference mark and the second reference mark are consistent.

6. A bonding method, comprising bonding a first substrate and a second substrate using a bonding device, The engaging device comprises: a first holding portion that holds the first substrate; a second holding portion for holding the second substrate, the second holding portion being arranged to face the first holding portion; Two camera units, each of the two camera units includes a first camera unit, a second camera unit, and an adjustment mechanism, the first camera unit photographs a first alignment mark formed on the bonding surface of the first substrate, and the second camera unit photographs a second alignment mark formed on the bonding surface of the second substrate; a first moving mechanism that moves the two camera units along a first direction within a plane region between the first holding portion and the second holding portion; a second moving mechanism, which enables a first camera unit of the two camera units to move along a second direction orthogonal to the first direction; a third moving mechanism, which enables the second camera unit of the two camera units to move along the second direction; a first reference mark disposed at a position separated from the first holding portion and the second holding portion in the first direction when viewed from above, the first reference mark being photographed by the first camera unit; as well as a second reference mark disposed opposite to the first reference mark, the second reference mark being photographed by the second camera unit, The bonding method comprises the following steps: Step (a), holding the first substrate by the first holding portion; Step (b), holding the second substrate by the second holding portion; Step (c), moving the first camera unit and the second camera unit in the first direction by the first moving mechanism; Step (d), moving the first camera unit in the second direction by the second moving mechanism; Step (e), moving the second camera unit in the second direction by the third moving mechanism; Step (f), photographing the first alignment mark and the second alignment mark by the first camera unit and the second camera unit respectively; and step (g) of adjusting the horizontal positions of the first substrate held by the first holding portion and the second substrate held by the second holding portion based on the image captured in the step (f); wherein, in the step (d), the first imaging unit is moved in the first area; In the step (e), the second imaging unit is moved in the second area. In the step (f), the first area is photographed by the first camera unit, and the second area is photographed by the second camera unit. In step (c), the first reference mark is photographed by the first camera unit, the second reference mark is photographed by the second camera unit, and the image of the first reference mark photographed by the first camera unit and the image of the second reference mark photographed by the second camera unit are detected, the posture of the first camera unit is adjusted by the adjustment mechanism of the first camera unit so that the detected first reference mark and the second reference mark are consistent, and the posture of the second camera unit is adjusted by the adjustment mechanism of the second camera unit so that the detected first reference mark and the second reference mark are consistent.

7. The bonding method according to claim 6, characterized in that: The imaging unit includes a reflecting mirror, the reflecting mirror changes the first imaging path of the first imaging unit toward the first substrate side, and changes the second imaging path of the second imaging unit toward the second substrate side and changes it to be coaxial with the first imaging path. In the step (f), the first alignment mark and the second alignment mark are simultaneously photographed by the imaging unit.

8. The bonding method according to claim 6, characterized in that: After the step (g), The first camera unit is moved in the second direction by the second moving mechanism, The second camera unit is moved in the second direction by the third moving mechanism. In each of the first imaging unit and the second imaging unit, the first imaging unit images the first holding mark formed on the first holding portion, and the second imaging unit images the second holding mark formed on the second holding portion.

Images