A method for manufacturing an electronic device

Abstract

The present invention discloses a method for manufacturing an electronic device, comprising: providing a metal sheet occupying a first area; removing unwanted portions of the metal sheet to form a first wire frame structure, wherein the first wire frame structure includes a plurality of unconnected metal segments; reconfiguring the positions of the plurality of unconnected metal segments to form a second wire frame structure, wherein the second wire frame structure occupies a second area, the second area being larger than the first area; and bridging at least two unconnected metal segments among the plurality of unconnected metal segments with a first component.

Description

Technical Field

[0001] The present invention relates to an electronic device, and more particularly to a method for manufacturing the electronic device. Background Art

[0002] A conventional method for manufacturing an electronic device includes: providing a metal sheet 101 such as Figure 1A Remove the unwanted portion of the metal sheet to form a lead frame structure 201, such as Figure 1B As shown, the lead frame structure 201 has a plurality of metal segments 202a, 202b, 203a, 203b, 204a, 204b, 205a, 205b, 206a, 206b, 207a, 207b. Figure 1B However, in this way, the metal sheet 101 needs a larger area, such as 81 mm×17.60 mm, to arrange the multiple components, and many parts of the metal sheet will be removed, which increases the cost.

[0003] Therefore, the industry needs a better solution to solve the above problems. Summary of the invention

[0004] An object of the present invention is to reduce the area of ​​a metal sheet to manufacture a lead frame of an electronic device.

[0005] An embodiment of the present invention discloses a method for manufacturing an electronic device, comprising: providing a metal sheet occupying a first area; removing unwanted portions of the metal sheet to form a first lead frame structure, wherein the first lead frame structure includes a plurality of unconnected metal segments; reconfiguring the positions of at least a portion of the plurality of unconnected metal segments to form a second lead frame structure, wherein the second lead frame structure occupies a second area, the second area being larger than the first area; and bridging at least two unconnected metal segments of the plurality of unconnected metal segments with a first component, wherein the first component electrically connects the at least two unconnected metal segments.

[0006] In one embodiment, the first component is a first coil, wherein the first coil electrically connects the two unconnected metal segments.

[0007] In one embodiment, the difference between the second area and the first area is greater than 30% of the first area.

[0008] In one embodiment, the method further comprises bridging two other unconnected metal segments among the plurality of unconnected metal segments with a second component, wherein the second component electrically connects the two other unconnected metal segments.

[0009] In one embodiment, the second component is a second coil, wherein the second coil is electrically connected to the other two unconnected metal segments.

[0010] An embodiment of the present invention discloses a method for manufacturing an electronic device, comprising: providing a metal sheet occupying a first area; removing unwanted portions of the metal sheet to form a first lead frame structure, wherein the first lead frame structure includes a plurality of unconnected metal segments; repositioning at least a portion of the plurality of unconnected metal segments to form a second lead frame structure, wherein the second lead frame structure occupies a second area, the second area being larger than the first area; and disposing a plurality of components on the second lead frame structure, wherein each component bridges and electrically connects corresponding at least two unconnected metal segments of the plurality of unconnected metal segments.

[0011] In one embodiment, the plurality of components include active components and passive components.

[0012] In one embodiment, the active component includes an integrated circuit.

[0013] In one embodiment, the active device includes a metal-oxide-semiconductor field effect transistor.

[0014] In one embodiment, the passive component includes a coil.

[0015] In one embodiment, the passive element includes a plurality of coils.

[0016] An embodiment of the present invention discloses a method for manufacturing an electronic device, comprising: providing a metal sheet occupying a first area; removing unwanted portions of the metal sheet to form a first lead frame structure, wherein the first lead frame structure includes a plurality of unconnected metal segments; repositioning at least a portion of the plurality of unconnected metal segments to form a second lead frame structure, wherein the second lead frame structure occupies a second area, the second area being larger than the first area; and disposing a plurality of coils on the second lead frame structure, wherein each coil bridges and electrically connects corresponding two unconnected metal segments of the plurality of unconnected metal segments.

[0017] In one embodiment, the plurality of coils includes six coils.

[0018] An embodiment of the present invention discloses a method for manufacturing an electronic device, comprising: providing a metal sheet occupying a first area; removing unwanted portions of the metal sheet to form a first lead frame structure, wherein the first lead frame structure includes a plurality of unconnected metal segments; reconfiguring the positions of at least a portion of the plurality of unconnected metal segments to form a second lead frame structure, wherein the second lead frame structure occupies a second area, the second area being larger than the first area; and bridging at least two of the plurality of unconnected metal segments with a first component, wherein the first component electrically connects the at least two unconnected metal segments, wherein the plurality of unconnected metal segments are not supported by a substrate.

[0019] An embodiment of the present invention discloses a method for manufacturing an electronic device, comprising: providing a metal sheet occupying a first area; removing unwanted portions of the metal sheet to form a first lead frame structure, wherein the first lead frame structure includes a plurality of unconnected metal segments; repositioning at least a portion of the plurality of unconnected metal segments to form a second lead frame structure, wherein the second lead frame structure occupies a second area, the second area being larger than the first area; and disposing a plurality of components on the second lead frame structure, wherein each component bridges and electrically connects corresponding at least two unconnected metal segments of the plurality of unconnected metal segments, wherein the plurality of unconnected metal segments are not supported by a substrate.

[0020] An embodiment of the present invention discloses a method for manufacturing an electronic device, comprising: providing a metal sheet occupying a first area; removing unwanted portions of the metal sheet to form a first lead frame structure, wherein the first lead frame structure includes a plurality of unconnected metal segments; repositioning at least a portion of the plurality of unconnected metal segments to form a second lead frame structure, wherein the second lead frame structure occupies a second area, the second area being larger than the first area; and disposing a plurality of coils on the second lead frame structure, wherein each coil bridges and electrically connects corresponding two unconnected metal segments of the plurality of unconnected metal segments, wherein the plurality of unconnected metal segments are not supported by a substrate.

[0021] In order to make the above and other features and advantages of the present invention more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.

[0023] Figure 1A It is a top view of a metal sheet according to the conventional method of manufacturing an electronic device;

[0024] Figure 1B Yes Remove Figure 1A The unwanted portion of the metal sheet is formed into a top view of a lead frame structure;

[0025] Figure 2A A flowchart of a method for manufacturing an electronic device according to an embodiment of the present invention;

[0026] Figure 2B is a top view of a metal sheet for making an electronic device according to an embodiment of the present invention;

[0027] Figure 2C Yes Remove Figure 2B The unwanted portion of the metal sheet is formed into a top view of a first lead frame structure;

[0028] Figure 2D The plurality of unconnected metal segments of the first lead frame structure are repositioned to form a second lead frame structure.

[0029] Explanation of the reference numerals: 101-metal sheet; 201-wire frame structure; 202a-metal fragment; 202b-metal fragment; 203a-metal fragment; 203b-metal fragment; 204a-metal fragment; 204b-metal fragment; 205a-metal fragment; 205b-metal fragment; 206a-metal fragment; 206b-metal fragment; 207a-metal fragment; 207b-metal fragment; 301a-metal sheet; 301b-first wire frame structure; 301c-second wire frame structure; 401-first component; 402-second component; 403-third component; 404-fourth component; 405-fifth component; 406-sixth component. DETAILED DESCRIPTION

[0030] Figure 2A is a flowchart of a method for manufacturing an electronic device according to an embodiment of the present invention. Figure 2B-2D , the method comprising:

[0031] Step S201: Provide a metal sheet 301a, which occupies a first area (85mm×9.65mm=820.25mm 2 ),like Figure 2B As shown;

[0032] Step S202: Remove the unwanted portion of the metal sheet to form a first lead frame structure 301b, such as Figure 2CAs shown, the first lead frame structure includes a plurality of unconnected metal segments 202a, 202b, 203a, 203b, 204a, 204b, 205a, 205b, 206a, 206b, 207a, 207b, as shown in FIG. Figure 2C As shown;

[0033] Step S203: repositioning at least a portion of the plurality of unconnected metal segments 202b, 203b, 204b, 205b, 206b, 207b to form a second lead frame structure 301c, wherein the second lead frame structure 301c occupies a second area (77.60mm×17.60mm=1365.76mm 2 ),like Figure 2D As shown, the second area: 1365.76mm 2 Larger than the first area: 820.25mm 2 ;as well as

[0034] Step S204: bridge at least two of the plurality of unconnected metal segments with a first component 401, wherein the first component 401 electrically connects the at least two unconnected metal segments. Figure 2D shown.

[0035] This embodiment of Figure 2B The area of ​​the metal sheet (85mm×9.65mm=820.25mm 2 ) is smaller than the traditional Figure 1A The area of ​​the metal sheet 101 (81 mm × 17.60 mm = 1425.6 mm 2 ), so the present invention can use a smaller area of ​​metal sheet and achieve the same final lead frame structure to save costs. Figure 2D With traditional Figure 1B The final lead frame structure in the can occupy the same area (77.60mm×17.60mm=1365.76mm 2 That is, the present invention can use a smaller area (85mm×9.65mm=820.25mm 2 ,like Figure 2B As shown in the figure, a metal sheet is used to make an electronic device, which is larger than the traditional method of making the same electronic device (81mm×17.60mm=1425.6mm 2 ,like Figure 1A The metal sheet (shown) is much smaller to save costs.

[0036] In one embodiment, the plurality of unconnected metal segments are not supported by a substrate.

[0037] In one embodiment, the metal sheet 301 a is made of copper.

[0038] In one embodiment, the metal sheet 301a is made of copper plated with tin.

[0039] In one embodiment, the first component 401 is a first coil, wherein the first coil electrically connects the two unconnected metal segments.

[0040] In one embodiment, the first component 401 is an integrated circuit (IC), wherein the IC connects a plurality of unconnected metal segments.

[0041] In one embodiment, the first component 401 is a metal-oxide-semiconductor field effect transistor (MOSFET), wherein the metal-oxide-semiconductor field effect transistor connects a plurality of unconnected metal segments.

[0042] In one embodiment, the difference between the second area and the first area is greater than 30% of the first area. In one embodiment, the difference between the second area and the first area is greater than 40% of the first area. In one embodiment, the difference between the second area and the first area is greater than 50% of the first area.

[0043] In one embodiment, the method further includes bridging two other unconnected metal segments among the plurality of unconnected metal segments with a second component 402 , wherein the second component 402 electrically connects the two other unconnected metal segments.

[0044] In one embodiment, the second component 402 is a second coil, wherein the second coil electrically connects two unconnected metal segments.

[0045] In one embodiment, the method further includes bridging two other unconnected metal segments among the plurality of unconnected metal segments with a third component 403 , wherein the third component 403 electrically connects the two other unconnected metal segments.

[0046] In one embodiment, the third component 403 is a third coil, wherein the third coil electrically connects two unconnected metal segments.

[0047] In one embodiment, the method further includes using a fourth component 404 to bridge another two unconnected metal segments among the plurality of unconnected metal segments, wherein the fourth component 404 electrically connects the another two unconnected metal segments.

[0048] In one embodiment, the fourth component 404 is a fourth coil, wherein the fourth coil electrically connects two unconnected metal segments.

[0049] In one embodiment, the method further includes bridging two other unconnected metal segments among the plurality of unconnected metal segments with a fifth component 405 , wherein the fifth component 405 electrically connects the two other unconnected metal segments.

[0050] In one embodiment, the fifth component 405 is a fifth coil, wherein the fifth coil electrically connects two unconnected metal segments.

[0051] In one embodiment, the method further includes using a sixth component 406 to bridge another two unconnected metal segments among the plurality of unconnected metal segments, wherein the sixth component 406 electrically connects the another two unconnected metal segments.

[0052] In one embodiment, the sixth component 406 is a sixth coil, wherein the sixth coil electrically connects two unconnected metal segments.

[0053] An embodiment of the present invention discloses a method for manufacturing an electronic device, comprising: providing a metal sheet occupying a first area; removing unwanted portions of the metal sheet to form a first lead frame structure, wherein the first lead frame structure includes a plurality of unconnected metal segments; repositioning at least a portion of the plurality of unconnected metal segments to form a second lead frame structure, wherein the second lead frame structure occupies a second area, the second area being larger than the first area; and disposing a plurality of components on the second lead frame structure, wherein each component bridges and electrically connects corresponding at least two unconnected metal segments of the plurality of unconnected metal segments.

[0054] In one embodiment, the plurality of unconnected metal segments are not supported by a substrate.

[0055] In one embodiment, the plurality of components include active components and passive components.

[0056] In one embodiment, the passive element comprises a plurality of coils.

[0057] In one embodiment, the active component comprises an integrated circuit.

[0058] In one embodiment, the active element comprises a metal-oxide-semiconductor field effect transistor.

[0059] In one embodiment, the active element includes an integrated circuit and a metal-oxide-semiconductor field effect transistor.

[0060] An embodiment of the present invention discloses a method for manufacturing an electronic device, comprising: providing a metal sheet occupying a first area; removing unwanted portions of the metal sheet to form a first lead frame structure, wherein the first lead frame structure includes a plurality of unconnected metal segments; repositioning at least a portion of the plurality of unconnected metal segments to form a second lead frame structure, wherein the second lead frame structure occupies a second area, the second area being larger than the first area; and disposing a plurality of coils on the second lead frame structure, wherein each coil bridges and electrically connects corresponding two unconnected metal segments of the plurality of unconnected metal segments.

[0061] In one embodiment, the plurality of unconnected metal segments are not supported by a substrate.

[0062] In one embodiment, the plurality of coils includes six coils.

[0063] Please note that in this embodiment Figure 2D The component types, quantity and area shown are only schematic diagrams, and the component types, quantity and area can be adjusted according to actual needs. The present invention is not limited to the area of ​​the final lead frame structure, nor is the present invention limited to the component types or quantity.

[0064] Although the present invention has been described with reference to the above embodiments, it will be apparent to those skilled in the art that modifications may be made to the described embodiments without departing from the spirit of the present invention. Therefore, the scope of the present invention will be defined by the claims rather than by the above detailed description.

Claims

1. A method for manufacturing an electronic device, characterized in that: include: Providing a metal sheet, the metal sheet having a first length and a first width, the metal sheet occupies a first area, and the first area is equal to the product of the first length and the first width; removing unwanted portions of the metal sheet to form a first lead frame structure, wherein the first lead frame structure includes a plurality of unconnected metal segments; repositioning at least a portion of the plurality of unconnected metal segments to form a second lead frame structure, the second lead frame structure having a second length and a second width, the second lead frame structure occupying a second area, the second area being equal to the product of the second length and the second width, the second area being larger than the first area; and A first component is used to bridge at least two unconnected metal segments among the plurality of unconnected metal segments, wherein the first component electrically connects the at least two unconnected metal segments.

2. The method according to claim 1, characterized in that The first component is a first coil, wherein the first coil electrically connects the two unconnected metal segments.

3. The method according to claim 1, characterized in that The difference between the second area and the first area is greater than 30% of the first area.

4. The method according to claim 2, characterized in that: The method further comprises: A second component is used to bridge two other unconnected metal segments among the plurality of unconnected metal segments, wherein the second component electrically connects the other two unconnected metal segments.

5. The method according to claim 4, characterized in that The second component is a second coil, wherein the second coil is electrically connected to the other two unconnected metal segments.

6. A method for manufacturing an electronic device, characterized in that: include: Providing a metal sheet, the metal sheet having a first length and a first width, and occupying a first area, the first area being equal to the product of the first length and the first width; removing unwanted portions of the metal sheet to form a first lead frame structure, wherein the first lead frame structure includes a plurality of unconnected metal segments; repositioning at least a portion of the plurality of unconnected metal segments to form a second lead frame structure, the second lead frame structure having a second length and a second width, the second lead frame structure occupying a second area, the second area being equal to a product of the second length and the second width, the second area being larger than the first area; A plurality of components are disposed on the second lead frame structure, wherein each component bridges and electrically connects corresponding at least two unconnected metal segments among the plurality of unconnected metal segments.

7. The method according to claim 6, characterized in that The plurality of components include active components and passive components.

8. The method according to claim 7, characterized in that The active component includes an integrated circuit.

9. The method according to claim 7, characterized in that: The passive component includes a coil.

10. A method for manufacturing an electronic device, characterized in that: include: Providing a metal sheet, the metal sheet having a first length and a first width, and occupying a first area, the first area being equal to the product of the first length and the first width; removing unwanted portions of the metal sheet to form a first lead frame structure, wherein the first lead frame structure includes a plurality of unconnected metal segments; repositioning at least a portion of the plurality of unconnected metal segments to form a second lead frame structure, the second lead frame structure having a second length and a second width, the second lead frame structure occupying a second area, the second area being equal to the product of the second length and the second width, the second area being larger than the first area; and A plurality of coils are disposed on the second lead frame structure, wherein each coil bridges and electrically connects two corresponding unconnected metal segments among the plurality of unconnected metal segments.

11. The method according to claim 10, characterized in that The plurality of coils includes six coils.

12. A method for manufacturing an electronic device, characterized in that: include: Providing a metal sheet, the metal sheet having a first length and a first width, and occupying a first area, the first area being equal to the product of the first length and the first width; removing unwanted portions of the metal sheet to form a first lead frame structure, wherein the first lead frame structure includes a plurality of unconnected metal segments; repositioning at least a portion of the plurality of unconnected metal segments to form a second lead frame structure having a second length and a second width, wherein the second lead frame structure occupies a second area, the second area being equal to a product of the second length and the second width, and the second area being larger than the first area; and A first component is used to bridge at least two of the plurality of unconnected metal segments, wherein the first component electrically connects the at least two unconnected metal segments, wherein the plurality of unconnected metal segments are not supported by a substrate.

13. The method according to claim 12, characterized in that The first component is a first coil, wherein the first coil electrically connects the two unconnected metal segments.

14. The method according to claim 12, characterized in that The difference between the second area and the first area is greater than 30% of the first area.

15. A method for manufacturing an electronic device, characterized in that: include: Providing a metal sheet, the metal sheet having a first length and a first width, and occupying a first area, the first area being equal to the product of the first length and the first width; removing unwanted portions of the metal sheet to form a first lead frame structure, wherein the first lead frame structure includes a plurality of unconnected metal segments; repositioning at least a portion of the plurality of unconnected metal segments to form a second lead frame structure, the second lead frame structure having a second length and a second width, the second lead frame structure occupying a second area, the second area being equal to the product of the second length and the second width, the second area being larger than the first area; and A plurality of components are disposed on the second lead frame structure, wherein each component bridges and electrically connects corresponding at least two of the plurality of unconnected metal segments, wherein the plurality of unconnected metal segments are not supported by a substrate.

16. The method according to claim 15, characterized in that The plurality of components include an active component and a passive component.

17. The method according to claim 15, characterized in that The plurality of assemblies includes six coils.

18. The method according to claim 15, characterized in that The difference between the second area and the first area is greater than 30% of the first area.

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