Loop heat pipe, method for reducing heat transfer temperature difference of loop heat pipe and component

Abstract

The present invention relates to the technical field of heat dissipation devices, and more particularly to a method for reducing the heat transfer temperature difference of a loop heat pipe. A second steam chamber is provided between a first steam chamber of an evaporator and a compensator, and the first and second steam chambers, as well as the second steam chamber and the compensator, are separated by a capillary structure. The first steam chamber is connected to a gas pipeline, and the second steam chamber is connected to a liquid pipeline via an auxiliary pipeline. The present invention also relates to an assembly for reducing the heat transfer temperature difference of a loop heat pipe and a loop heat pipe including the assembly. The assembly includes an evaporator and a compensator. A first steam chamber for connecting to the gas pipeline and a second steam chamber for connecting to the auxiliary pipeline are formed between the capillary structure of the evaporator and the housing. The auxiliary pipeline is used to connect to the liquid pipeline. The second steam chamber is located between the first steam chamber and the compensator. The first and second steam chambers, as well as the second steam chamber and the compensator, are separated by the capillary structure. This method can significantly reduce the amount of heat that leaks into the compensator.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation devices, and in particular to a method for reducing the heat transfer temperature difference of a loop heat pipe, a component for reducing the heat transfer temperature difference of a loop heat pipe, and a loop heat pipe comprising the component for reducing the heat transfer temperature difference of a loop heat pipe. Background Art

[0002] Heat pipes have long dominated the electronic cooling market. However, in recent years, as chip performance has become increasingly advanced, their heat generation has also continued to double. Existing heat pipes have limited performance and are unable to meet the increasing heat dissipation requirements of chips, thus failing to keep pace with chip development.

[0003] A loop heat pipe is an advanced thermal control product developed to meet the complex and demanding thermal control requirements of spacecraft. It consists of five basic components: an evaporator (including a capillary wick), a vapor line, a condenser, a liquid line, and a compensator. These five components are connected in sequence to form a closed loop, within which a working fluid circulates. The working principle of a loop heat pipe is as follows: the evaporator contacts a heat source, and the liquid working fluid vaporizes on the surface of the capillary wick inside the evaporator, generating the driving force for the working fluid circulation. The vaporized vaporous working fluid enters the condenser along the vapor line, where it releases heat and condenses into a liquid working fluid. The liquid working fluid then flows along the liquid line to the compensator, soaking the capillary wick inside the evaporator. The liquid working fluid is heated and evaporates again, entering the next cycle.

[0004] Loop heat pipes offer all the advantages of heat pipes while overcoming their inherent drawbacks and shortcomings. Heat pipes incorporate a sintered capillary wick within the tube's inner wall, while loop heat pipes incorporate a reinforced capillary wick within the evaporator, resulting in greater power. Loop heat pipes utilize both vapor and liquid lines, separating the vapor and liquid working fluid pathways. Both the vapor and liquid lines are smooth tubes, reducing fluid flow resistance. As a result, loop heat pipes offer significantly greater heat transfer capacity than heat pipes, reaching approximately 10 times greater. Their potential for civilian use is immensely valuable.

[0005] However, since the pressure and temperature of the evaporator are higher than those of the compensator when the loop heat pipe is operating normally, there is a heat load that leaks from the evaporator to the compensator, which is called heat leakage. According to the working principle of the loop heat pipe, this heat leakage needs to be offset by increasing the subcooling of the liquid working medium returning from the condenser to maintain the thermal balance of the compensator. The greater the heat leakage, the greater the subcooling of the returning liquid working medium is required. This leads to a large heat transfer temperature difference between the hot and cold ends of the loop heat pipe, affecting the heat transfer performance of the loop heat pipe. In particular, when it is applied to the heat dissipation of civilian devices such as chips and CPUs, the heat leakage problem is more prominent due to the high heat source heat generation and heat flux density. The heat transfer temperature difference of the loop heat pipe itself is even greater, making it impossible to actually use it.

[0006] Therefore, in order to make the loop heat pipe suitable for civilian use, reducing the heat transfer temperature difference of the loop heat pipe has become an urgent problem to be solved. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to provide a method and assembly for reducing the heat transfer temperature difference of a loop heat pipe, so as to overcome the above-mentioned defects of the prior art.

[0008] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0009] The present invention provides a method for reducing the heat transfer temperature difference of a loop heat pipe. A second steam chamber is set between the first steam chamber of an evaporator and a compensator, and the first steam chamber and the second steam chamber, as well as the second steam chamber and the compensator are isolated by a capillary structure. The first steam chamber is connected to a gas pipeline, and the second steam chamber is connected to a liquid pipeline through an auxiliary pipeline.

[0010] Preferably, a working medium channel connected to the liquid pipeline is additionally provided inside the condenser, and an auxiliary pipeline is connected to the second steam chamber and the working medium channel.

[0011] Preferably, an auxiliary condenser is provided on the auxiliary line.

[0012] Preferably, the auxiliary line is passed through a condenser.

[0013] The present invention also provides a component for reducing the heat transfer temperature difference of a loop heat pipe, including an evaporator and a compensator. The evaporator includes a shell and a capillary structure. A first steam chamber for connecting a gas pipeline and a second steam chamber for connecting an auxiliary pipeline are formed between the capillary structure and the shell. The auxiliary pipeline is used to connect a liquid pipeline. The second steam chamber is located between the first steam chamber and the compensator. The first steam chamber and the second steam chamber, as well as the second steam chamber and the compensator are isolated by the capillary structure.

[0014] Preferably, the capillary structure is an integrated structure.

[0015] Preferably, the capillary structure is a split structure, comprising a capillary wick forming a first steam chamber with the shell and a capillary tissue forming a second steam chamber with the shell, and the capillary wick and the capillary tissue are in contact or connected.

[0016] Preferably, the capillary structure is provided with a concave structure at a communication position between the evaporator and the auxiliary pipeline, and a second steam chamber is formed between the concave structure and the shell.

[0017] Preferably, the capillary structure is provided with a first groove and multiple second grooves, the first groove is located at the connecting position between the evaporator and the auxiliary pipeline, the multiple second grooves are distributed on the capillary structure and are all connected to the first groove, and the first groove and the multiple second grooves together form a second steam chamber between the shell.

[0018] Preferably, the shell is provided with a convex structure at a position where the evaporator is connected to the auxiliary pipeline, and a second steam chamber is formed between the convex structure and the capillary structure.

[0019] Preferably, the wall surface of the shell at the communication position between the evaporator and the auxiliary pipeline is thinned to form a groove, and a second steam chamber is formed between the groove and the capillary structure.

[0020] Preferably, a porous structure is provided in the second steam chamber.

[0021] The present invention further provides a loop heat pipe, comprising the above-mentioned component for reducing the heat transfer temperature difference of the loop heat pipe.

[0022] Preferably, it also includes a vapor pipeline, a condenser, a liquid pipeline and an auxiliary pipeline, the vapor pipeline connects the first steam chamber with the inlet of the condenser, the liquid pipeline connects the compensator with the outlet of the condenser, and the auxiliary pipeline connects the second steam chamber with the liquid pipeline.

[0023] Preferably, a working medium channel connected to the liquid pipeline is provided inside the condenser, and an auxiliary pipeline is connected to the second steam chamber and the working medium channel.

[0024] Preferably, an auxiliary condenser is provided on the auxiliary line.

[0025] Preferably, the auxiliary line passes through a condenser.

[0026] Compared with the prior art, the present invention has significant improvements:

[0027] The present invention adds a second steam chamber and an auxiliary pipeline so that the heat leakage from the evaporator to the compensator is thermally isolated by the second steam chamber. That is, the heat leakage causes part of the working medium to vaporize in the second steam chamber. The vaporized gaseous working medium in the second steam chamber enters the auxiliary pipeline and finally returns to the compensator through the liquid pipeline to complete the cycle. The vaporization of the working medium in the second steam chamber absorbs most of the heat leakage from the evaporator to the compensator, which can significantly reduce the amount of heat leaking into the compensator, thereby effectively reducing the heat transfer temperature difference of the loop heat pipe, so that the advantageous performance of the loop heat pipe can be brought into play in the civilian field. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a cross-sectional schematic diagram of a first embodiment of a component for reducing the heat transfer temperature difference of a loop heat pipe in the present invention.

[0029] Figure 2 It is a cross-sectional schematic diagram of a second embodiment of the component for reducing the heat transfer temperature difference of a loop heat pipe in the present invention.

[0030] Figure 3 It is a cross-sectional schematic diagram of a third embodiment of the component for reducing the heat transfer temperature difference of a loop heat pipe in the present invention.

[0031] Figure 4 It is a structural schematic diagram of a fourth embodiment of the component for reducing the heat transfer temperature difference of a loop heat pipe in the present invention.

[0032] Figure 5 yes Figure 4 Schematic diagram of the internal structure.

[0033] Figure 6 It is a structural schematic diagram of a fifth embodiment of the component for reducing the heat transfer temperature difference of a loop heat pipe in the present invention.

[0034] Figure 7 yes Figure 6 Schematic cross-section diagram.

[0035] Figure 8 It is a structural schematic diagram of a sixth embodiment of the component for reducing the heat transfer temperature difference of a loop heat pipe in the present invention.

[0036] Figure 9 yes Figure 8 Schematic cross-section diagram.

[0037] Figure 10 It is a structural schematic diagram of the first embodiment of the loop heat pipe in the present invention.

[0038] Figure 11 It is a structural schematic diagram of the second embodiment of the loop heat pipe in the present invention.

[0039] Figure 12 It is a structural schematic diagram of the third embodiment of the loop heat pipe in the present invention.

[0040] Figure 13 It is a structural schematic diagram of the fourth embodiment of the loop heat pipe in the present invention.

[0041] The description of the accompanying drawings is as follows:

[0042] 1 Evaporator

[0043] 11 Housing

[0044] 12 capillary wick

[0045] 13. First steam chamber

[0046] 2 gas pipelines

[0047] 3 Condenser

[0048] 31 working fluid channel

[0049] 4 Liquid pipelines

[0050] 5 Compensator

[0051] 6 Auxiliary pipelines

[0052] 7 Second steam chamber

[0053] 71 First Channel

[0054] 72 Second Slot

[0055] 8 capillary tissue

[0056] 9 Auxiliary condenser DETAILED DESCRIPTION

[0057] The following is combined with Figures 1 to 13 The specific embodiments of the present invention are further described in detail. These embodiments are only used to illustrate the present invention, but not to limit the present invention.

[0058] In the description of the present invention, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," and "outside" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0059] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0060] Furthermore, in the description of the present invention, unless otherwise specified, “plurality” means two or more.

[0061] The loop heat pipe includes an evaporator 1, a vapor line 2, a condenser 3, a liquid line 4 and a compensator 5. The evaporator 1 includes a shell 11 and a capillary wick 12. A first vapor chamber 13 connected to the vapor line 2 is formed between the capillary wick 12 and the shell 11, and the vapor line 2 connects the first vapor chamber 13 with the inlet of the condenser 3. The liquid line 4 connects the compensator 5 with the outlet of the condenser 3. The compensator 5 is separated from the first vapor chamber 13 of the evaporator 1 by the capillary wick 12. The capillary wick 12 can permeate the liquid phase working medium and prevent the gas phase working medium from flowing between the compensator 5 and the first vapor chamber 13. The working principle of the loop heat pipe is as follows: the evaporator 1 contacts the heat source, and the liquid working medium vaporizes on the surface of the capillary wick 12 in the evaporator 1, generating a driving force for the working medium circulation. The vaporized vapor working medium enters the vapor pipeline 2 from the first steam chamber 13, and enters the condenser 3 along the vapor pipeline 2, releases heat in the condenser 3 and condenses into liquid working medium. The liquid working medium enters the liquid pipeline 4 from the condenser 3 and flows along the liquid pipeline 4 to the compensator 5, then penetrates and infiltrates the capillary wick 12 in the evaporator 1. The liquid working medium is heated and evaporates again, entering the next cycle.

[0062] The heat transfer temperature difference of the loop heat pipe is caused by the heat load (heat leakage) leaked from the evaporator 1 to the compensator 5. The greater the heat leakage, the greater the heat transfer temperature difference of the loop heat pipe. The heat conduction through the shell 11 and the capillary core 12 between the loop heat pipe evaporator 1 and the compensator 5 is an important source of heat leakage. Therefore, reducing this heat conduction can reduce the heat leakage into the compensator 5, thereby reducing the heat transfer temperature difference of the loop heat pipe, so that the advantageous performance of the loop heat pipe can be brought into play in the civilian field. Based on this, the present invention provides a method for reducing the heat transfer temperature difference of a loop heat pipe, which reduces the heat transfer temperature difference of the loop heat pipe by reducing the heat leaking into the compensator 5. The present invention also provides a component for reducing the heat transfer temperature difference of a loop heat pipe, which can realize the above-mentioned method of reducing the heat transfer temperature difference of a loop heat pipe. The present invention further provides a loop heat pipe, which includes the above-mentioned component for reducing the heat transfer temperature difference of a loop heat pipe.

[0063] Example 1

[0064] See also Figures 10 to 12 , Example 1 provides an embodiment of the method for reducing the heat transfer temperature difference of a loop heat pipe of the present invention.

[0065] The method for reducing the heat transfer temperature difference of the loop heat pipe in the first embodiment is to set a second steam chamber 7 between the first steam chamber 13 of the evaporator 1 and the compensator 5, and isolate the first steam chamber 13 and the second steam chamber 7, and the second steam chamber 7 and the compensator 5 by a capillary structure. The capillary structure can penetrate the liquid phase working medium and prevent the gas phase working medium from flowing between the first steam chamber 13 and the second steam chamber 7, and between the second steam chamber 7 and the compensator 5. The first steam chamber 13 is connected to the gas pipeline 2, and the second steam chamber 7 is connected to the liquid pipeline 4 through the auxiliary pipeline 6. Therefore, when the evaporator 1 contacts the heat source and absorbs heat, the working medium in the first steam chamber 13 is vaporized, and the vaporized gaseous working medium enters the condenser 3 through the gas pipeline 2. After releasing heat and condensing, it returns to the compensator 5 and the evaporator 1 through the liquid pipeline 4, thereby completing a cycle; at the same time, since the temperature and pressure in the evaporator 1 are higher than the temperature and pressure of the working medium in the compensator 5, the evaporator 1 begins to transfer heat to the compensator 5. When the heat is transferred to the second steam chamber 7, the working medium in the second steam chamber 7 is heated and vaporized, absorbing most of the heat transferred from the evaporator 1 to the compensator 5, thereby significantly reducing the heat leaking into the compensator 5. The vaporized gaseous working medium in the second steam chamber 7 flows along the auxiliary pipeline 6 into the liquid pipeline 4, and returns to the compensator 5 through the liquid pipeline 4 together with the condensed working medium flowing through the gas pipeline 2, thereby completing another cycle; the two cycles are carried out in parallel and simultaneously.

[0066] Therefore, the method of reducing the heat transfer temperature difference of the loop heat pipe in the first embodiment is to add a second steam chamber 7 and an auxiliary pipeline 6 so that the heat leakage from the evaporator 1 to the compensator 5 is thermally isolated by the second steam chamber 7. That is, the heat leakage causes part of the working fluid to vaporize in the second steam chamber 7. The vaporized gaseous working fluid in the second steam chamber 7 enters the auxiliary pipeline 6 and finally returns to the compensator 5 through the liquid pipeline 4 to complete the cycle. The vaporization of the working fluid in the second steam chamber 7 absorbs most of the heat leakage from the evaporator 1 to the compensator 5, which can significantly reduce the amount of heat leaking into the compensator 5, thereby effectively reducing the heat transfer temperature difference of the loop heat pipe, so that the advantageous performance of the loop heat pipe can be brought into play in the civilian field.

[0067] In the first embodiment, the capillary structure may include a capillary wick 12 and a capillary tissue 8. A first steam chamber 13 is formed between the capillary wick 12 and the shell 11, and a second steam chamber 7 is formed between the capillary tissue 8 and the shell 11. The capillary tissue 8 isolates the first steam chamber 13 from the second steam chamber 7, and the capillary tissue 8 isolates the second steam chamber 7 from the compensator 5. The capillary tissue 8 can penetrate the liquid phase working medium and prevent the gas phase working medium from flowing between the first steam chamber 13 and the second steam chamber 7, and between the second steam chamber 7 and the compensator 5. The capillary wick 12 and the capillary tissue 8 can be an integrated structure, that is, the capillary tissue 8 is part of the capillary wick 12, and the capillary structure thus formed is an integrated structure. The capillary wick 12 and the capillary tissue 8 can also be split structures that are in contact or connected, and the capillary structure thus formed is a split structure.

[0068] In the first embodiment, preferably, the second steam chamber 7 may be partially or completely filled with a porous structure (not shown in the figure) to play a supporting role.

[0069] In the first embodiment, the communication method between the auxiliary pipeline 6 and the liquid pipeline 4 is not limited, and preferably any one of the following three methods can be adopted.

[0070] See also Figure 10 In the first preferred method of connecting the auxiliary pipeline 6 and the liquid pipeline 4, a working medium channel 31 connecting to the liquid pipeline 4 can be added inside the condenser 3. The two ends of the auxiliary pipeline 6 are respectively connected to the second vapor chamber 7 and the working medium channel 31. The auxiliary pipeline 6 is connected to the liquid pipeline 4 through the working medium channel 31 and the outlet of the condenser 3, thereby achieving the connection between the second vapor chamber 7 and the liquid pipeline 4. In this way, the vaporized working medium in the second vapor chamber 7 enters the auxiliary pipeline 6, flows into the condenser 3 through the auxiliary pipeline 6 and the working medium channel 31, releases heat and condenses in the condenser 3, and then returns to the compensator 5 through the liquid pipeline 4 together with the condensed working medium flowing through the vapor line 2.

[0071] See also Figure 11 In the second preferred method of connecting the auxiliary pipeline 6 and the liquid pipeline 4, an auxiliary condenser 9 can be provided on the auxiliary pipeline 6, with both ends of the auxiliary pipeline 6 respectively connected to the second vapor chamber 7 and the liquid pipeline 4. Thus, the vaporized working medium in the second vapor chamber 7 enters the auxiliary pipeline 6, flows through the auxiliary pipeline 6, passes through the auxiliary condenser 9, and then condenses and enters the liquid pipeline 4, and finally returns to the compensator 5.

[0072] See also Figure 12In a third preferred method of connecting the auxiliary pipeline 6 and the liquid pipeline 4, the auxiliary pipeline 6 can pass through the condenser 3, with both ends of the auxiliary pipeline 6 respectively connected to the second vapor chamber 7 and the liquid pipeline 4, and a portion of the auxiliary pipeline 6 located on the side of the condenser 3. Thus, the vaporized working medium in the second vapor chamber 7 enters the auxiliary pipeline 6, flows within the auxiliary pipeline 6, and flows through the condenser 3. It can be condensed using the cooling capacity of the condenser 3, then enter the liquid pipeline 4, and finally return to the compensator 5.

[0073] The method for reducing the heat transfer temperature difference of a loop heat pipe in the first embodiment of the present invention breaks through the limitations of the principles of aerospace loop heat pipes and does not rely on restrictions on materials and working fluids to achieve heat leakage reduction. It can adopt more favorable materials, working fluids and supporting processes to meet the heat dissipation needs of civilian high-power and high-heat flux density. Compared with the existing loop heat pipe technology using the same working fluid and a near-capillary structure, the heat transfer temperature difference of the loop heat pipe is usually greater than 35°C. The method for reducing the heat transfer temperature difference of the loop heat pipe in the first embodiment of the present invention can reduce the heat transfer temperature difference of the loop heat pipe to below 5°C-10°C. Therefore, the performance of the improved loop heat pipe can meet the heat dissipation needs of civilian chips and power electronic devices.

[0074] Example 2

[0075] See also Figures 1 to 9 The second embodiment provides an embodiment of the component for reducing the heat transfer temperature difference of a loop heat pipe of the present invention. The component for reducing the heat transfer temperature difference of a loop heat pipe of the second embodiment can implement the method for reducing the heat transfer temperature difference of a loop heat pipe of the first embodiment.

[0076] The component for reducing the heat transfer temperature difference of a loop heat pipe in the second embodiment includes an evaporator 1 and a compensator 5. The evaporator 1 includes a shell 11 and a capillary structure. A first steam chamber 13 for connecting to a gas pipeline 2 and a second steam chamber 7 for connecting to an auxiliary pipeline 6 are formed between the capillary structure and the shell 11. The auxiliary pipeline 6 is connected to a liquid pipeline 4, which is connected to the compensator 5. The second steam chamber 7 is located between the first steam chamber 13 and the compensator 5. The first steam chamber 13 and the second steam chamber 7, as well as the second steam chamber 7 and the compensator 5, are separated by the capillary structure. The capillary structure can penetrate liquid-phase working fluid and prevent gas-phase working fluid from flowing between the first steam chamber 13 and the second steam chamber 7, and between the second steam chamber 7 and the compensator 5.

[0077] The component for reducing the heat transfer temperature difference of a loop heat pipe in the second embodiment adds a second steam chamber 7 and an auxiliary pipeline 6, so that heat leakage from the evaporator 1 to the compensator 5 is thermally isolated by the second steam chamber 7. When the evaporator 1 conducts heat to the compensator 5 and transfers it to the second steam chamber 7, the working fluid in the second steam chamber 7 is heated and vaporized. The vaporized working fluid in the second steam chamber 7 enters the auxiliary pipeline 6 and ultimately returns to the compensator 5 via the liquid pipeline 4, completing the cycle. The vaporization of the working fluid in the second steam chamber 7 absorbs the vast majority of the heat leakage from the evaporator 1 to the compensator 5, significantly reducing the amount of heat leaking into the compensator 5, thereby effectively reducing the heat transfer temperature difference of the loop heat pipe and enabling the advantageous performance of the loop heat pipe to be fully utilized in the civilian field.

[0078] In this second embodiment, the capillary structure may include a capillary wick 12 and a capillary tissue 8. A first steam chamber 13 is formed between the capillary wick 12 and the housing 11, and a second steam chamber 7 is formed between the capillary tissue 8 and the housing 11. The capillary tissue 8 isolates the first steam chamber 13 from the second steam chamber 7, and also isolates the second steam chamber 7 from the compensator 5. Therefore, the capillary tissue 8 is close to the compensator 5. The capillary tissue 8 can penetrate the liquid phase working medium and prevent the gas phase working medium from flowing between the first steam chamber 13 and the second steam chamber 7, and between the second steam chamber 7 and the compensator 5.

[0079] See also Figure 1 、 Figure 3 、 Figure 7 and Figure 9 The capillary core 12 and the capillary structure 8 can be an integrated structure, that is, the capillary structure 8 is a part of the capillary core 12, and the capillary structure thus formed is an integrated structure.

[0080] See also Figure 2 The capillary core 12 and the capillary structure 8 may also be a split structure that is in contact or connected, and the capillary structure thus formed is a split structure.

[0081] In the second embodiment, preferably, the second steam chamber 7 may be partially or entirely filled with a porous structure (not shown in the figure) to play a supporting role.

[0082] In this embodiment 2, see Figure 1 、 Figure 2 、 Figure 3 、 Figures 6 to 9 , the evaporator 1 can be a cylindrical structure; see Figure 4 and Figure 5 , the evaporator 1 can also be a flat plate structure.

[0083] In the second embodiment, the formation method of the second steam chamber 7 is not limited, and preferably any one of the following four methods can be adopted.

[0084] See also Figure 1 、 Figure 2 and Figure 5 In the first preferred method of forming the second steam chamber 7, the capillary structure is provided with a concave structure at the communication position between the evaporator 1 and the auxiliary pipeline 6. The concave structure is arranged on the capillary structure 8 close to the compensator 5 of the capillary structure, and the second steam chamber 7 is formed between the concave structure and the shell 11.

[0085] See also Figure 3 In the second preferred method of forming the second steam chamber 7, the shell 11 is provided with a convex structure at the communication position between the evaporator 1 and the auxiliary pipeline 6, and the second steam chamber 7 is formed between the convex structure and the capillary structure 8 close to the compensator 5.

[0086] See also Figure 6 、 Figure 7 and Figure 9 In the third preferred method of forming the second steam chamber 7, a first groove 71 and a plurality of second grooves 72 are provided on the capillary structure. The first groove 71 is located at the connection position between the evaporator 1 and the auxiliary pipeline 6. The plurality of second grooves 72 are distributed on the capillary structure and are all connected to the first groove 71. The first groove 71 and the plurality of second grooves 72 together form the second steam chamber 7 between the shell 11.

[0087] In the fourth preferred method of forming the second steam chamber 7, the wall of the shell 11 at the connection position between the evaporator 1 and the auxiliary pipeline 6 is thinned to form a groove, and the second steam chamber 7 is formed between the groove and the capillary structure 8 of the capillary structure close to the compensator 5.

[0088] Six specific implementations of the component for reducing the heat transfer temperature difference of the loop heat pipe according to the second embodiment are provided below.

[0089] See also Figure 1, which is the first embodiment of the component for reducing the temperature difference in heat transfer of a loop heat pipe according to the second embodiment. In this first embodiment of the component, the evaporator 1 is a cylindrical structure. The evaporator 1 includes a shell 11 and a capillary structure. The capillary structure includes a capillary wick 12 and a capillary structure 8. A first steam chamber 13 is formed between the capillary wick 12 and the shell 11. The first steam chamber 13 is connected to the vapor pipeline 2. A second steam chamber 7 is formed between the capillary structure 8 and the shell 11. The second steam chamber 7 is connected to the auxiliary pipeline 6, which is used to connect to the liquid pipeline 4. The capillary structure 8 separates the first steam chamber 13 from the second steam chamber 7, and also separates the second steam chamber 7 from the compensator 5. The capillary structure 8 is part of the capillary wick 12, and the capillary structure thus formed is an integrated structure. The capillary structure 8 near the compensator 5 is provided with a concave structure at the connection position between the evaporator 1 and the auxiliary pipeline 6. The concave structure forms an annular groove around the capillary structure 8. The second steam chamber 7 is formed between the annular groove and the housing 11. The second steam chamber 7 can also be partially or completely filled with a porous structure (not shown in the figure) to provide support.

[0090] See also Figure 2 , which is the second embodiment of the component for reducing the heat transfer temperature difference of a loop heat pipe of the second embodiment. This second embodiment of the component is substantially the same as the first embodiment of the component described above, and the similarities are not repeated here. The difference is that in this second embodiment of the component, the capillary wick 12 and the capillary structure 8 are a split structure that is in contact or connected, and the capillary structure thus formed is a split structure.

[0091] See also Figure 3 , which is the third embodiment of the assembly for reducing the heat transfer temperature difference of a loop heat pipe of the second embodiment. This third embodiment of the assembly is substantially the same as the first embodiment of the assembly described above, and the similarities are not repeated here. The difference is that, in this third embodiment of the assembly, the housing 11 is provided with a convex structure at the connection point between the evaporator 1 and the auxiliary pipeline 6. This convex structure surrounds the housing 11 to form an annular convex groove on the housing 11. This annular convex groove and the capillary structure 8 near the compensator 5 form a second vapor chamber 7.

[0092] See also Figure 4 and Figure 5, which is the fourth embodiment of the component for reducing the temperature difference of heat transfer in a loop heat pipe of the second embodiment. The fourth embodiment of the component is basically the same as the first embodiment of the above-mentioned component, and the similarities are not repeated here. The difference is that in the fourth embodiment of the component, the evaporator 1 is a flat-plate structure, and the capillary structure 8 near the compensator 5 is provided with a concave structure at the connection position between the evaporator 1 and the auxiliary pipeline 6. The concave structure extends along the length direction of the capillary structure 8 to form a straight groove. The length direction of the capillary structure 8 is defined as a direction perpendicular to the direction of heat transfer from the evaporator 1 to the compensator 5. The straight groove and the shell 11 form a second steam chamber 7. In the fourth embodiment of the component, the capillary structure 8 can be part of the capillary wick 12, and the capillary structure thus formed is an integrated structure. Alternatively, the capillary wick 12 and the capillary structure 8 can also be separate structures that are in contact or connected, and the capillary structure thus formed is a separate structure.

[0093] See also Figure 6 and Figure 7 , which is the fifth embodiment of the component for reducing the heat transfer temperature difference of a loop heat pipe in the second embodiment of this invention. The fifth embodiment of the component is substantially the same as the first embodiment of the component described above, and the similarities are not repeated here. The difference is that in the fifth embodiment of the component, a first channel 71 and a plurality of second channels 72 are provided on the capillary structure 8 near the compensator 5. The first channel 71 is located at the connection point between the evaporator 1 and the auxiliary pipeline 6. The plurality of second channels 72 are distributed on the capillary structure and are all connected to the first channel 71. Each second channel 72 extends along the circumference of the outer circumference of the capillary structure 8 to form an annular channel. The plurality of second channels 72 are evenly spaced along the axial direction of the capillary structure 8 on the outer circumference of the capillary structure 8. The first channel 71 extends along the axial direction of the capillary structure 8 on the outer circumference of the capillary structure 8 to connect all the second channels 72. The first channel 71 and the plurality of second channels 72 together form a second steam chamber 7 between the shell 11, and the auxiliary pipeline 6 is connected to the first channel 71.

[0094] See also Figure 8 and Figure 9, which is the sixth implementation method of the component for reducing the heat transfer temperature difference of the loop heat pipe in the second embodiment. The sixth embodiment of the component is basically the same as the first embodiment of the above-mentioned component, and the similarities are not repeated here. The difference is that, in the sixth embodiment of the component, a first groove 71 and a plurality of second grooves 72 are provided on the capillary structure 8 near the compensator 5. The first groove 71 is located at the connection position between the evaporator 1 and the auxiliary pipeline 6. The plurality of second grooves 72 are distributed on the capillary structure and are all connected to the first groove 71. Each second groove 72 is an axial groove hole opened in the capillary structure 8 and extending along the axial direction of the capillary structure 8. The plurality of second grooves 72 are evenly distributed in the capillary structure 8 along the circumferential intervals of the capillary structure 8. The first groove 71 extends along the circumference of the capillary structure 8 on the outer peripheral surface of the capillary structure 8 to form an annular groove and connects all the second grooves 72. The first groove 71 and the plurality of second grooves 72 together form a second steam chamber 7 between the shell 11, and the auxiliary pipeline 6 is connected to the first groove 71.

[0095] The component for reducing the heat transfer temperature difference of the loop heat pipe in the second embodiment of this invention breaks through the limitations of the aerospace loop heat pipe principle and does not rely on restrictions on materials and working fluids to achieve heat leakage reduction, so that it can adopt more favorable materials, working fluids and supporting processes to meet the heat dissipation needs of civilian high power and high heat flux density. Compared with the existing loop heat pipe technology using the same working fluid and a capillary structure, the heat transfer temperature difference usually exceeds 35°C. The component for reducing the heat transfer temperature difference of the loop heat pipe in the second embodiment of this invention can reduce the heat transfer temperature difference of the loop heat pipe to below 5°C-10°C. Therefore, the performance of the improved loop heat pipe can meet the heat dissipation needs of civilian chips and power electronic devices.

[0096] Example 3

[0097] See also Figures 10 to 13 Based on the component for reducing the heat transfer temperature difference of the loop heat pipe of the second embodiment, the third embodiment provides an embodiment of the loop heat pipe of the present invention. The loop heat pipe of the third embodiment includes the component for reducing the heat transfer temperature difference of the loop heat pipe of the second embodiment.

[0098] Furthermore, the loop heat pipe of the third embodiment also includes a vapor pipeline 2, a condenser 3, a liquid pipeline 4 and an auxiliary pipeline 6. The vapor pipeline 2 connects the first vapor chamber 13 with the inlet of the condenser 3, the liquid pipeline 4 connects the compensator 5 with the outlet of the condenser 3, and the auxiliary pipeline 6 connects the second vapor chamber 7 with the liquid pipeline 4.

[0099] The working principle of the loop heat pipe of the third embodiment is as follows: when the evaporator 1 contacts the heat source and absorbs heat, the working medium in the first steam chamber 13 is vaporized, and the vaporized gaseous working medium enters the condenser 3 through the steam pipeline 2, releases heat and condenses, and then returns to the compensator 5 and the evaporator 1 through the liquid pipeline 4, thus completing a cycle; at the same time, since the temperature and pressure in the evaporator 1 are higher than the temperature and pressure of the working medium in the compensator 5, the evaporator 1 begins to transfer heat to the compensator 5. When the heat is transferred to the second steam chamber 7, the working medium in the second steam chamber 7 is heated and vaporized, absorbing most of the heat transferred from the evaporator 1 to the compensator 5, thereby significantly reducing the heat leaking into the compensator 5, and the vaporized gaseous working medium in the second steam chamber 7 flows along the auxiliary pipeline 6 into the liquid pipeline 4, and returns to the compensator 5 through the liquid pipeline 4 together with the condensed working medium flowing through the steam pipeline 2, thus completing another cycle; the two cycles are carried out in parallel and simultaneously.

[0100] Therefore, the loop heat pipe of the third embodiment of the present invention, by adding a second steam chamber 7 and an auxiliary pipeline 6, causes the heat leakage from the evaporator 1 to the compensator 5 to be thermally isolated by the second steam chamber 7, that is, the heat leakage causes part of the working fluid to vaporize in the second steam chamber 7, and the vaporized gaseous working fluid in the second steam chamber 7 enters the auxiliary pipeline 6 and finally returns to the compensator 5 through the liquid pipeline 4, completing the cycle. The vaporization of the working fluid in the second steam chamber 7 absorbs most of the heat leakage from the evaporator 1 to the compensator 5, which can significantly reduce the heat leaking into the compensator 5, thereby effectively reducing the heat transfer temperature difference of the loop heat pipe, so that the advantageous performance of the loop heat pipe can be brought into play in the civilian field.

[0101] In the loop heat pipe of the third embodiment, the communication method between the auxiliary pipeline 6 and the liquid pipeline 4 is not limited, and preferably any one of the following three methods can be adopted.

[0102] See also Figure 10 In the first preferred method of connecting the auxiliary pipeline 6 and the liquid pipeline 4, a working medium channel 31 connecting to the liquid pipeline 4 can be added inside the condenser 3. The two ends of the auxiliary pipeline 6 are respectively connected to the second vapor chamber 7 and the working medium channel 31. The auxiliary pipeline 6 is connected to the liquid pipeline 4 through the working medium channel 31 and the outlet of the condenser 3, thereby achieving the connection between the second vapor chamber 7 and the liquid pipeline 4. In this way, the vaporized working medium in the second vapor chamber 7 enters the auxiliary pipeline 6, flows into the condenser 3 through the auxiliary pipeline 6 and the working medium channel 31, releases heat and condenses in the condenser 3, and then returns to the compensator 5 through the liquid pipeline 4 together with the condensed working medium flowing through the vapor line 2.

[0103] See also Figure 11In the second preferred method of connecting the auxiliary pipeline 6 and the liquid pipeline 4, an auxiliary condenser 9 can be provided on the auxiliary pipeline 6, with both ends of the auxiliary pipeline 6 respectively connected to the second vapor chamber 7 and the liquid pipeline 4. Thus, the vaporized working medium in the second vapor chamber 7 enters the auxiliary pipeline 6, flows through the auxiliary pipeline 6, passes through the auxiliary condenser 9, and then condenses and enters the liquid pipeline 4, and finally returns to the compensator 5.

[0104] See also Figure 12 and Figure 13 In a third preferred method of connecting the auxiliary pipeline 6 and the liquid pipeline 4, the auxiliary pipeline 6 can pass through the condenser 3, with both ends of the auxiliary pipeline 6 respectively connected to the second vapor chamber 7 and the liquid pipeline 4, and a portion of the auxiliary pipeline 6 located on the side of the condenser 3. Thus, the vaporized working medium in the second vapor chamber 7 enters the auxiliary pipeline 6, flows within the auxiliary pipeline 6, and flows through the condenser 3. It can be condensed using the cooling capacity of the condenser 3, then enter the liquid pipeline 4, and finally return to the compensator 5.

[0105] Four specific implementations of the loop heat pipe of the third embodiment are provided below.

[0106] See also Figure 10 , which is the first implementation of the loop heat pipe of this embodiment three. In this first implementation of the loop heat pipe, the structure of the first implementation of the component for reducing the heat transfer temperature difference of the loop heat pipe in embodiment two is adopted. The vapor pipeline 2 connects the first steam chamber 13 with the inlet of the condenser 3, the liquid pipeline 4 connects the compensator 5 with the outlet of the condenser 3, and the auxiliary pipeline 6 connects the second steam chamber 7 with the liquid pipeline 4. The auxiliary pipeline 6 and the liquid pipeline 4 are connected in such a way that a working fluid channel 31 connected to the liquid pipeline 4 is provided inside the condenser 3, and the auxiliary pipeline 6 connects the second steam chamber 7 with the working fluid channel 31. Of course, the structure of any other implementation of the component for reducing the heat transfer temperature difference of the loop heat pipe in embodiment two can also be adopted in the first implementation of the loop heat pipe.

[0107] See also Figure 11 , which is the second embodiment of the loop heat pipe of this third embodiment. The second embodiment of the loop heat pipe is basically the same as the first embodiment of the loop heat pipe described above, and the similarities are not repeated here. The difference is that in the second embodiment of the loop heat pipe, the auxiliary line 6 and the liquid line 4 are connected by an auxiliary condenser 9 provided on the auxiliary line 6.

[0108] See also Figure 12 , which is the third embodiment of the loop heat pipe of this third embodiment. The third embodiment of the loop heat pipe is basically the same as the first embodiment of the loop heat pipe described above, and the similarities are not repeated here. The difference is that in the third embodiment of the loop heat pipe, the auxiliary line 6 and the liquid line 4 are connected by the auxiliary line 6 passing through the condenser 3.

[0109] See also Figure 13 , which is the fourth embodiment of the loop heat pipe of this third embodiment. The fourth embodiment of the loop heat pipe is basically the same as the third embodiment of the loop heat pipe described above, and the similarities are not repeated here. The difference is that the fourth embodiment of the loop heat pipe adopts the structure of the fourth embodiment of the component for reducing the heat transfer temperature difference of the loop heat pipe in the second embodiment.

[0110] The loop heat pipe of the third embodiment of the present invention breaks through the limitations of the principles of aerospace loop heat pipes and does not rely on restrictions on materials and working fluids to achieve reduced heat leakage. It can adopt more favorable materials, working fluids and supporting processes to meet the heat dissipation needs of civilian high-power and high-heat flux density. Compared with the existing loop heat pipe technology using the same working fluid and a capillary structure, the heat transfer temperature difference of the loop heat pipe of the third embodiment of the present invention can be reduced to below 5°C-10°C. Therefore, the performance of the improved loop heat pipe can meet the heat dissipation needs of civilian chips and power electronic devices.

[0111] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A method for reducing the heat transfer temperature difference of a loop heat pipe, characterized in that: A second steam chamber (7) is provided between a first steam chamber (13) of an evaporator (1) and a compensator (5), and the first steam chamber (13) and the second steam chamber (7), as well as the second steam chamber (7) and the compensator (5) are isolated by a capillary structure. The first steam chamber (13) is connected to a gas pipeline (2), and the second steam chamber (7) is connected to a liquid pipeline (4) via an auxiliary pipeline (6). The evaporator (1) leaks heat to the compensator (5), and the heat leakage causes part of the working medium to vaporize in the second steam chamber (7). The vaporized working medium in the second steam chamber (7) enters the auxiliary pipeline (6).

2. The method for reducing the heat transfer temperature difference of a loop heat pipe according to claim 1, characterized in that: A working medium channel (31) communicating with the liquid pipeline (4) is additionally provided inside the condenser (3), and the auxiliary pipeline (6) communicates with the second steam chamber (7) and the working medium channel (31).

3. The method for reducing the heat transfer temperature difference of a loop heat pipe according to claim 1, characterized in that: An auxiliary condenser (9) is provided on the auxiliary line (6).

4. The method for reducing the heat transfer temperature difference of a loop heat pipe according to claim 1, characterized in that: The auxiliary line (6) is passed through the condenser (3).

5. A component for reducing the temperature difference of heat transfer in a loop heat pipe, characterized in that: The invention comprises an evaporator (1) and a compensator (5), wherein the evaporator (1) comprises a shell (11) and a capillary structure, wherein a first steam chamber (13) for communicating with a gas pipeline (2) and a second steam chamber (7) for communicating with an auxiliary pipeline (6) are formed between the capillary structure and the shell (11), wherein the auxiliary pipeline (6) is used to communicate with a liquid pipeline (4), and the second steam chamber (7) is located between the first steam chamber (13) and the compensator (5), wherein the first steam chamber (13) and the second steam chamber (7) and the second steam chamber (7) and the compensator (5) are both separated by the capillary structure, wherein the evaporator (1) leaks heat to the compensator (5), wherein the heat leakage causes part of the working medium to vaporize in the second steam chamber (7), and the vaporized working medium in the second steam chamber (7) enters the auxiliary pipeline (6).

6. The component for reducing the temperature difference of heat transfer in a loop heat pipe according to claim 5, characterized in that: The capillary structure is an integrated structure.

7. The component for reducing the temperature difference of heat transfer in a loop heat pipe according to claim 5, characterized in that: The capillary structure is a split structure, comprising a capillary wick (12) forming the first steam chamber (13) with the shell (11) and a capillary tissue (8) forming the second steam chamber (7) with the shell (11), wherein the capillary wick (12) and the capillary tissue (8) are in contact with or connected to each other.

8. The component for reducing the temperature difference of heat transfer in a loop heat pipe according to claim 5, characterized in that: The capillary structure is provided with a concave structure at the communication position between the evaporator (1) and the auxiliary pipeline (6), and the second steam chamber (7) is formed between the concave structure and the shell (11).

9. The component for reducing the temperature difference of heat transfer in a loop heat pipe according to claim 5, characterized in that: The capillary structure is provided with a first groove (71) and a plurality of second grooves (72); the first groove (71) is located at a communication position between the evaporator (1) and the auxiliary pipeline (6); the plurality of second grooves (72) are distributed on the capillary structure and are all connected to the first groove (71); the first groove (71) and the plurality of second grooves (72) together form the second steam chamber (7) with the shell (11).

10. The component for reducing the temperature difference of heat transfer in a loop heat pipe according to claim 5, characterized in that: The shell (11) is provided with a convex structure at the communication position between the evaporator (1) and the auxiliary pipeline (6), and the second steam chamber (7) is formed between the convex structure and the capillary structure.

11. The component for reducing the temperature difference of heat transfer in a loop heat pipe according to claim 5, characterized in that: The wall surface of the shell (11) at the communication position between the evaporator (1) and the auxiliary pipeline (6) is thinned to form a groove, and the second steam chamber (7) is formed between the groove and the capillary structure.

12. The component for reducing the temperature difference of heat transfer in a loop heat pipe according to claim 5, characterized in that: A porous structure is provided in the second steam chamber (7).

13. A loop heat pipe, characterized in that: The invention comprises a component for reducing the heat transfer temperature difference of a loop heat pipe as claimed in any one of claims 5 to 12.

14. The loop heat pipe according to claim 13, characterized in that It also includes a vapor pipeline (2), a condenser (3), a liquid pipeline (4) and an auxiliary pipeline (6), wherein the vapor pipeline (2) connects the first vapor chamber (13) with the inlet of the condenser (3), the liquid pipeline (4) connects the compensator (5) with the outlet of the condenser (3), and the auxiliary pipeline (6) connects the second vapor chamber (7) with the liquid pipeline (4).

15. The loop heat pipe according to claim 14, characterized in that A working medium passage (31) communicating with the liquid pipeline (4) is provided inside the condenser (3), and the auxiliary pipeline (6) communicates with the second steam chamber (7) and the working medium passage (31).

16. The loop heat pipe according to claim 14, characterized in that An auxiliary condenser (9) is provided on the auxiliary pipeline (6).

17. The loop heat pipe according to claim 14, wherein: The auxiliary line (6) passes through the condenser (3).

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