A connector plating process

Abstract

The application relates to the technical field of electroplating, in particular to a connector plating process, which comprises the following steps: pretreating the surface of an electric connector; electroplating a copper layer on the surface of the pretreated electric connector; electroplating a palladium layer on the surface of the copper layer; and electroplating a noble metal layer on the surface of the palladium layer. The copper layer and the palladium layer are simultaneously arranged on the surface of the electric connector, and then the noble metal layer is electroplated, because the substrate of the existing electric connector is usually made of copper, the copper layer can avoid damaging the substrate of the electric connector in subsequent electroplating, and can effectively ensure the electric conductivity of the electric connector; the palladium layer can well block the copper layer, avoid the outward diffusion of the substrate and the copper layer, and also can avoid damaging the substrate in subsequent electroplating of the noble metal layer; and the noble metal layer can effectively improve the electric conductivity of the electric connector.

Description

[0001] The present application relates to the technical field of electroplating, in particular to a connector plating process.

[0002] An electric connector is an indispensable electronic component in electronic products. With the development and progress of electronic technology, people have increasingly high requirements for electronic products, which inevitably puts forward higher requirements for electric connectors.

[0003] Due to the diversity of working environments, in order to ensure the working performance and service life of the electric connector, a layer is arranged on the electric connector.

[0004] However, in the prior art, the layer structure of the electric connector is not well arranged, which causes the electrolyte of the subsequent electric layer to easily affect the base body of the electric connector during electroplating, and even the conductivity of the electric connector is also affected.

[0005] To solve the problem that the existing electric connector is easily adversely affected by the base body during electroplating, the present application provides a connector plating process.

[0006] The technical problem of the present application is solved by providing a connector plating process, comprising the following steps:

[0007] The surface of the electric connector is pretreated;

[0008] A copper layer is formed on the surface of the pretreated electric connector;

[0009] A palladium layer is formed on the surface of the copper layer;

[0010] A noble metal layer is formed on the surface of the palladium layer.

[0011] Preferably, the step of forming a copper layer on the surface of the pretreated electric connector comprises the following steps:

[0012] A copper layer is formed on the surface of the electric connector, and the thickness of the copper layer is 1.25-8um;

[0013] The copper layer is activated.

[0014] Preferably, the step of forming a palladium layer on the surface of the copper layer comprises the following steps:

[0015] A palladium layer is formed on the surface of the copper layer, and the thickness of the palladium layer is 0.1-0.8um;

[0016] The palladium layer is activated.

[0017] ​​​Preferably, the step of forming a noble metal layer on the surface of the palladium layer comprises the following steps:

[0018] forming a first auxiliary layer on the surface of the palladium layer;

[0019] forming an electrically conductive layer on the surface of the first auxiliary layer.

[0020] Preferably, the first auxiliary layer is a first gold layer, and the electrically conductive layer is a silver layer.

[0021] Preferably, the step of forming a first auxiliary layer on the surface of the palladium layer comprises the following steps:

[0022] forming the first auxiliary layer on the surface of the palladium layer, the thickness of the first auxiliary layer being 0.075-0.25um;

[0023] activating the first auxiliary layer.

[0024] Preferably, the step of forming an electrically conductive layer on the surface of the first auxiliary layer comprises the following steps:

[0025] forming the electrically conductive layer on the surface of the first auxiliary layer, the thickness of the electrically conductive layer being 4-10um;

[0026] activating the electrically conductive layer.

[0027] Preferably, the method further comprises forming a protective layer on the surface of the noble metal layer.

[0028] Preferably, the step of forming a protective layer on the surface of the noble metal layer comprises the following steps:

[0029] forming a second auxiliary layer on the side of the noble metal layer away from the palladium layer;

[0030] forming a reinforcing layer on the surface of the second auxiliary layer.

[0031] Preferably, the method further comprises, after forming the protective layer, performing a sealing treatment and a drying treatment on the electric connector.

[0032] Compared with the prior art, the connector plating process of the present application has the following advantages:

[0033] 1. The present application simultaneously provides a copper layer and a palladium layer on the surface of the electric connector, and then electroplates a noble metal layer. Since the substrate of the existing electric connector is usually made of copper, the copper layer can avoid damage to the substrate of the electric connector caused by subsequent electroplating, and can effectively ensure the electric conductivity of the electric connector. The palladium layer can effectively block the copper layer, avoid the diffusion of the substrate and the copper layer outward, and also avoid damage to the substrate caused by subsequent electroplating of the noble metal layer. The noble metal layer can effectively improve the electric conductivity of the electric connector.

[0034] 2. The copper layer in this invention is thick, which helps to improve the corrosion resistance of the electrical connector.

[0035] 3. The present invention performs micro-corrosion treatment on the electrical connector before electroplating, which roughens the surface of the electrical connector, which helps to enhance the surface adhesion of the electrical connector and ensure the electroplating effect.

[0036] 4. The noble metal layer of the present invention employs an auxiliary layer and a conductive layer. Since the surface adhesion of the palladium layer is poor, the first auxiliary layer can effectively increase the surface adhesion between the layers; at the same time, the first auxiliary layer can effectively improve the corrosion resistance of the electrical connector.

[0037] 5. The conductive layer of this invention is a thick silver layer, which can greatly improve the conductivity of the electrical connector.

[0038] 6. The protective layer of the present invention includes a second auxiliary layer, which can encapsulate the conductive layer. Since the silver layer is relatively reactive, the second auxiliary layer can be made of a relatively stable metal to reduce the contact between the conductive layer and the outside world and prevent the conductive layer from oxidizing.

[0039] 7. The protective layer of the present invention also includes a reinforcing layer, which can be a metal layer with high hardness to further protect each metal layer. [Attached Image Description]

[0040] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 This is a block diagram of the connector plating process provided in the first embodiment of the present invention.

[0042] Figure 2 This is a block diagram of step 4 of the connector plating process provided in the first embodiment of the present invention.

[0043] Figure 3 This is a block diagram of step 5 of the connector plating process provided in the first embodiment of the present invention.

[0044] Figure 4 This is a schematic diagram of the layered structure of the electrical connector provided in the second embodiment of the present invention.

[0045] Explanation of reference numerals in the attached diagram:

[0046] 100. Electrical connectors;

[0047] 1, electric connector body; 2, copper layer; 3, palladium layer;

[0048] 4, noble metal layer; 41, first auxiliary layer; 42, conductive layer;

[0049] 5, protective layer; 51, second auxiliary layer; 52, reinforcing layer.

CONCRETE IMPLEMENTATIONS

[0050] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0051] The terms "vertical", "horizontal", "left", "right", "up", "down", "upper left", "upper right", "lower left", "lower right", and similar expressions used herein are only for illustrative purposes.

[0052] Please refer to Figures 1 to 3 , the first embodiment of the present application provides a connector plating process, comprising the following steps:

[0053] Step S1: pretreating the surface of the electric connector;

[0054] Step S2: forming a copper layer on the surface of the pretreated electric connector;

[0055] Step S3: forming a palladium layer on the surface of the copper layer;

[0056] Step S4: forming a noble metal layer on the surface of the palladium layer.

[0057] It can be understood that the present application simultaneously provides a copper layer and a palladium layer on the surface of the electric connector. Since the substrate of the existing electric connector is usually made of copper, the copper layer can avoid damaging the substrate of the electric connector in subsequent electroplating, and can effectively ensure the conductivity of the electric connector. The palladium layer can effectively block the copper layer, avoid the outward diffusion of the substrate and the copper layer, and also avoid damaging the substrate in subsequent electroplating of the noble metal layer. The noble metal layer can effectively improve the conductivity of the electric connector.

[0058] Further, step S1 specifically comprises the following steps:

[0059] Step S11: micro-etching the electric connector;

[0060] Step S12: pretreating the electric connector;

[0061] Step S13: surface activation treatment of the electric connector.

[0062] Further, the step S11 specifically comprises the following steps:

[0063] Step S111: the surface of the electric connector is treated by using chemical liquid for micro-corrosion, specifically, the pH value of the chemical liquid is 1-6, the treatment temperature is normal temperature, and the treatment time is 1-10 minutes; more preferably, when the surface of the electric connector is treated by micro-corrosion, the pH value of the chemical liquid is 3-5, the treatment temperature is normal temperature, and the treatment time is 5-8 minutes; it can be understood that the electric connector is treated by micro-corrosion before electroplating, so that the surface of the electric connector is roughened, which is beneficial to enhancing the surface adhesion of the electric connector and ensuring the electroplating effect.

[0064] Step S112: the electric connector is cleaned by using tap water or clean water until the surface is free of dirt.

[0065] In other embodiments, the physical sand blasting treatment can also be selected to replace the micro-corrosion treatment; sand with a mesh size of 100-1000 can be sprayed for 1-10 minutes; preferably, sand with a mesh size of 200-400 can be sprayed for 2-5 minutes.

[0066] Further, the step S12 specifically comprises the following steps:

[0067] Step S121: the electric connector is soaked by using acidic degreasing agent. Specifically, the treatment time is 2-12 minutes; this step can remove the oil and dirt on the surface of the electric connector; more preferably, when the electric connector is soaked by using the acidic degreasing agent, the treatment time is 5-10 minutes.

[0068] Step S122: the electric connector is cleaned by using tap water or clean water until the surface of the product is free of dirt;

[0069] Step S123: the water droplets on the inner and outer surfaces of the electric connector are dried by using a centrifugal dehydrator; specifically, the treatment time is 2-8 minutes; more preferably, when the water droplets on the inner and outer surfaces of the electric connector are dried by using the centrifugal dehydrator, the treatment time is 4 minutes;

[0070] Step S124: secondary surface oil removal; specifically, the electric connector is cleaned by using alkaline oil removal powder, the oil removal liquid concentration is 5-15 °Bé, the cleaning time is 4-10 minutes, and the temperature is maintained above 60°C during the process; more preferably, when the secondary surface oil removal is performed, the oil removal liquid concentration is 6-10 °Bé, the cleaning time is 5-10 minutes, and the temperature is maintained above 60°C during the process;

[0071] After completing the step 124, the step S122 and the step S123 are repeated once.

[0072] Further, the step S13 specifically comprises the following steps:

[0073] Step S131: acid activation treatment is performed on the electric connector, specifically, the activation acid concentration is 2-10%, and the treatment time is 1-10 min. More preferably, when the acid activation treatment is performed on the electric connector, the activation acid concentration is 5-8%, and the treatment time is 2-4 min;

[0074] Step S132: tap water or pure water is used to clean the electric connector until the product surface is free of dirt;

[0075] Step S133: a centrifugal dehydrator is used to dry the water droplets on the inner and outer surfaces of the electric connector; specifically, the treatment time is 2-8 min. More preferably, when the centrifugal dehydrator is used to dry the water droplets on the inner and outer surfaces of the electric connector, the treatment time is 4 min.

[0076] Further, step S2 specifically includes the following steps:

[0077] Step S21: a copper layer is formed on the surface of the electric connector; the thickness of the copper layer is ensured to be 1.25-8 um;

[0078] Step S22: the copper layer is activated; the specific processing steps are the same as those in step 13.

[0079] It can be understood that the thickness of the copper layer in the present application is large, which is beneficial to improve the corrosion resistance of the electric connector.

[0080] Preferably, the thickness of the copper layer is ensured to be 4-6 um.

[0081] Optionally, the copper layer can be formed by electroplating or chemical plating;

[0082] Specifically, in the present embodiment, the copper layer is electroplated on the surface of the electric connector in a water rolling plating manner, the plating copper liquid pH value is 10-14, the electroplating temperature is room temperature, the Baume degree is 10-20 °Bé, and the current size is 4-15 A. More preferably, when the copper layer is electroplated on the surface of the electric connector in a water rolling plating manner, the plating copper liquid pH value is 10-13, the electroplating temperature is room temperature, the Baume degree is 10-15 °Bé, and the current size is 4-10 A. It can be understood that in other embodiments, other electroplating methods such as hanging plating or brushing plating can also be used to form the metal layer, or a chemical plating method can be used to form the metal layer.

[0083] Further, step S3 specifically includes the following steps:

[0084] Step S31: a palladium layer is formed on the surface of the copper layer, and the thickness of the palladium layer is ensured to be 0.1-0.8 um;

[0085] Step S32: the copper layer is activated; the specific processing steps are the same as those in step 13.

[0086] Preferably, the thickness of the palladium layer is 0.125-0.5um.

[0087] Optionally, the palladium layer can be formed by electroplating or electroless plating. In this embodiment, the palladium layer is formed on the surface of the copper layer by barrel plating. The pH value of the plating solution is 3-10, the plating temperature is greater than 60℃, the Baume degree is 2-10°Bé, and the current is 4-12A. Preferably, the pH value of the plating solution is 7-9.5, the plating temperature is greater than 60℃, the Baume degree is 3-7°Bé, and the current is 5-10A. It can be understood that in other embodiments, other electroplating methods such as hanging plating or brush plating can also be used to form the metal layer, or electroless plating can be used to form the metal layer.

[0088] Further, the step S4 specifically comprises the following steps:

[0089] Step S41: plating a first auxiliary layer on the surface of the palladium layer;

[0090] Step S42: plating a conductive layer on the surface of the first auxiliary layer;

[0091] It can be understood that the noble metal layer of the present application adopts a first auxiliary layer and a conductive layer. Since the surface adhesion of the palladium layer is poor, the first auxiliary layer can well increase the surface adhesion between the layers. At the same time, the first auxiliary layer can effectively improve the corrosion resistance of the electrical connector.

[0092] Specifically, in this embodiment, the first auxiliary layer is a first gold layer, the conductive layer is a silver layer, and the second auxiliary layer is a second gold layer.

[0093] Further, the step S41 specifically comprises the following steps:

[0094] Step S411: forming a first auxiliary layer on the surface of the palladium layer, and ensuring that the thickness of the first auxiliary layer is 0.075-0.25um;

[0095] Step S412: activating the first auxiliary layer; the specific processing steps are the same as those of step 13.

[0096] Preferably, the thickness of the first auxiliary layer is 0.125-0.25um.

[0097] Optionally, the first auxiliary layer can be formed by electroplating or electroless plating. Specifically, in this embodiment, the first auxiliary layer is formed on the surface of the palladium layer by water rolling plating. The first auxiliary layer is a first gold layer. The plating gold solution Baume degree of the first gold layer is 10-16°Bé. The electroplating temperature is normal temperature. The current size is 3-15 A. More preferably, when the first gold layer is formed on the surface of the palladium layer by water rolling plating, the plating gold solution Baume degree of the first gold layer is 10-14°Bé. The electroplating temperature is normal temperature. The current size is 4-10 A. Understandably, in other embodiments, other electroplating methods such as hanging plating or brush plating can also be used to form the metal layer, or the electroless plating method can be used to form the metal layer.

[0098] Further, the step S42 specifically includes the following steps:

[0099] Step S421: forming a conductive layer on the surface of the first auxiliary layer, and ensuring that the thickness of the conductive layer is 4-10 um;

[0100] Understandably, by setting the thickness of the conductive layer to be larger, the conductive performance of the electrical connector can be greatly improved.

[0101] Preferably, the thickness of the conductive layer is ensured to be 4-7 um.

[0102] Optionally, the conductive layer can be formed by electroplating or electroless plating. Specifically, in this embodiment, the conductive layer is formed on the surface of the first gold layer by water rolling plating. The conductive layer is a silver layer. The plating silver solution pH value is 10-14. The electroplating temperature is less than 30°C. The current size is 3-15 A. More preferably, when the silver layer is formed on the surface of the first gold layer by water rolling plating, the plating silver solution pH value is 10-14. The electroplating temperature is 15-25°C. The current size is 4-10 A. Understandably, in other embodiments, other electroplating methods such as hanging plating or brush plating can also be used to form the metal layer, or the electroless plating method can be used to form the metal layer.

[0103] Further, it further includes a step S5 of electroplating a protective layer on the surface of the noble metal layer.

[0104] Further, the step S5 specifically includes the following steps:

[0105] S51: forming a second auxiliary layer on the side of the noble metal layer away from the palladium layer;

[0106] S52: forming a reinforcing layer on the surface of the second auxiliary layer.

[0107] Further, the step S51 specifically includes the following steps:

[0108] Step S511: forming a second auxiliary layer on the side of the noble metal layer away from the palladium layer; and ensuring that the thickness of the second auxiliary layer is 0.075-1 um;

[0109] Step S512: activating the second subsidiary layer, the specific processing steps are the same as step 13.

[0110] It can be understood that the application can further improve the corrosion resistance of the electric connector and make it more beautiful by electroplating the protective layer on the surface of the noble metal layer.

[0111] Preferably, the thickness of the second subsidiary layer is 0.125-0.5um;

[0112] Specifically, in this embodiment, the second subsidiary layer is electroplated on the surface of the conductive layer by water rolling plating, the second subsidiary layer is a second gold layer, the gold plating solution of the second gold layer is 10-16°Bé, the electroplating temperature is room temperature, and the current size is 3-15A; more preferably, when the second gold layer is electroplated on the surface of the conductive layer by water rolling plating, the gold plating solution of the second gold layer is 10-14°Bé, the electroplating temperature is room temperature, and the current size is 4-10A; it can be understood that in other embodiments, other electroplating methods such as hanging plating or brush plating can also be used to form the metal layer, or chemical plating can also be used to form the metal layer.

[0113] Further, step S52 specifically includes the following steps:

[0114] Step S521: forming a reinforcing layer on the surface of the second subsidiary layer, and ensuring that the thickness of the reinforcing layer is 0.3-2um;

[0115] Step S522: activating the platinum layer, the specific processing steps are the same as step 13.

[0116] Preferably, the thickness of the layer is 0.5-0.8um;

[0117] Specifically, in this embodiment, the reinforcing layer is electroplated by water rolling plating, the reinforcing layer is a platinum layer, the pH value of the platinum plating solution is 0.5-2.5, the electroplating temperature is 40-70℃, and the electroplating current is 10-50A; more preferably, when the platinum layer is electroplated by water rolling plating, the pH value of the platinum plating solution is 0.5-1.5, the electroplating temperature is 40-60℃, and the electroplating current is 15-30A; it can be understood that in other embodiments, other electroplating methods such as hanging plating or brush plating can also be used to form the metal layer, or chemical plating can also be used to form the metal layer.

[0118] Further, it further includes step S6: hole sealing treatment and drying treatment are performed on the electric connector after the protective layer is formed.

[0119] Further, step S6 specifically includes the following steps:

[0120] S61: the electric connector after forming the protective layer is soaked in the sealing liquid with a screen, the concentration of the aqueous sealing liquid is 5-15%, the soaking time is 2-30 min, and the temperature is 50-60°C; more preferably, the concentration of the aqueous sealing liquid is 5-8%, the soaking time is 5-10 min, and the temperature is 50-55°C;

[0121] Step S62: the residual sealing liquid is washed away, specifically, the electric connector is first washed with pure water and then washed with hot water at 50-70°C;

[0122] Step S63: the electric connector after washing is dehydrated by using a centrifuge, and the processing time is 2-8 min.

[0123] Step S64: the electric connector after forming the protective layer is baked by using an oven, the temperature is 90-130°C, and the time is 0.5-2 h; more preferably, the processing temperature is 100-120°C, and the time is 0.5-1 h.

[0124] Please refer to Figure 4 The first embodiment of the present application provides an electric connector 100, which comprises an electric connector body 1 and a copper layer 2, a palladium layer 3 and a noble metal layer 4 arranged on the electric connector body 1 from inside to outside.

[0125] It can be understood that the substrate of the existing electric connector 100 is usually made of copper, the copper layer 2 can avoid damaging the substrate of the electric connector 100 during subsequent plating, and can effectively ensure the conductivity of the electric connector 100; the palladium layer 3 can effectively block the copper layer 2, avoid the diffusion of the substrate and the copper layer 2 to the outside, and also avoid damaging the substrate during subsequent plating of the noble metal layer 4; and the noble metal layer 4 can effectively improve the conductivity of the electric connector 100.

[0126] Further, the thickness of the copper layer 2 is greater than the thickness of the palladium layer 3. This design can effectively improve the corrosion resistance of the electric connector 100.

[0127] Further, the thickness of the copper layer 2 is 1.25-8 μm. Preferably, the thickness of the copper layer 2 is 4-6 μm.

[0128] Further, the thickness of the palladium layer 3 is 0.1-0.8 μm. Preferably, the thickness of the palladium layer 3 is 0.125-0.5 μm.

[0129] Further, preferably, the thickness of the noble metal layer 4 is 4-12 μm.

[0130] Further, the noble metal layer 4 comprises a conductive layer 42.

[0131] Further, the thickness of the conductive layer 42 is 4-10 μm; preferably, the thickness of the conductive layer 42 is 4-7 μm.

[0132] Specifically, in the embodiment, the conductive layer 42 is a silver plating layer. The silver layer can greatly improve the conductive performance of the electric connector 100.

[0133] Further, the noble metal layer 4 further comprises a first auxiliary layer 41.

[0134] It can be understood that, since the surface adhesion ability of the palladium layer 3 is poor, the first auxiliary layer 41 can well increase the surface adhesion ability between the plating layers; meanwhile, the first auxiliary layer 41 can effectively improve the corrosion resistance of the electric connector 100.

[0135] Further, the thickness of the first auxiliary layer 41 is 0.075-0.25 μm; preferably, the thickness of the first auxiliary layer 41 is 0.125-0.25 μm.

[0136] Specifically, in the embodiment, the first auxiliary layer 41 is a first gold layer.

[0137] Further, the outer layer of the conductive layer 42 away from the palladium layer 3 is further provided with a protective layer 5, and the thickness of the protective layer 5 is 0.375-3 μm.

[0138] Further, the protective layer 5 comprises a second auxiliary layer 51 arranged on the outer layer of the noble metal layer 4, and a reinforcing layer 52 arranged on the outer layer of the second auxiliary layer 51.

[0139] Further, the thickness of the second auxiliary layer 51 is 0.075-1 μm, and the thickness of the reinforcing layer 52 is 0.3-2 μm; preferably, the thickness of the second auxiliary layer 51 is 0.125-0.5 μm, and the thickness of the reinforcing layer 52 is 0.5-0.8 μm.

[0140] Specifically, in the embodiment, the second auxiliary layer 51 is a second gold layer, and the reinforcing layer 52 is a platinum layer. It can be understood that, since the silver layer is relatively active, the second auxiliary layer 51 can adopt a relatively stable metal to wrap the silver layer, so as to reduce the contact of the silver layer with the outside world and avoid the oxidation of the silver layer. The platinum layer selected as the reinforcing layer 52 can well compensate for the problem that the gold material is relatively soft, so as to improve the surface wear resistance of the electric connector 100, so that the electric connector 100 is not easy to be scratched, and the corrosion resistance of the electric connector 100 can be further improved, and the electric connector 100 is more beautiful.

[0141] Compared with the prior art, the connector plating process of the present application has the following advantages:

[0142] 1. This invention simultaneously deposits a copper layer and a palladium layer on the surface of the electrical connector before electroplating a noble metal layer. Since the substrate of existing electrical connectors is usually made of copper, the copper layer can prevent subsequent electroplating from damaging the substrate of the electrical connector and can effectively ensure the conductivity of the electrical connector. The palladium layer can effectively seal the copper layer, preventing the substrate and the copper layer from diffusing outward. At the same time, it can also prevent damage to the substrate during subsequent electroplating of the noble metal layer. The noble metal layer can effectively improve the conductivity of the electrical connector.

[0143] 2. The copper layer in this invention is thick, which helps to improve the corrosion resistance of the electrical connector.

[0144] 3. The present invention performs micro-corrosion treatment on the electrical connector before electroplating, which roughens the surface of the electrical connector, which helps to enhance the surface adhesion of the electrical connector and ensure the electroplating effect.

[0145] 4. The noble metal layer of the present invention employs an auxiliary layer and a conductive layer. Since the surface adhesion of the palladium layer is poor, the first auxiliary layer can effectively increase the surface adhesion between the layers; at the same time, the first auxiliary layer can effectively improve the corrosion resistance of the electrical connector.

[0146] 5. The conductive layer of this invention is a thick silver layer, which can greatly improve the conductivity of the electrical connector.

[0147] 6. The protective layer of the present invention includes a second auxiliary layer, which can encapsulate the conductive layer. Since the silver layer is relatively reactive, the second auxiliary layer can be made of a relatively stable metal to reduce the contact between the conductive layer and the outside world and prevent the conductive layer from oxidizing.

[0148] 7. The protective layer of the present invention also includes a reinforcing layer, which may be a high-strength metal layer to further protect each metal layer.

[0149] The foregoing has provided a detailed description of a connector plating process disclosed in the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A connector plating process, wherein the connector substrate is made of copper, characterized in that, Includes the following steps: The surface of the electrical connector is pretreated, including micro-etching, pretreatment and surface activation. A copper layer is formed on the surface of the pre-treated electrical connector; A palladium layer is formed on the surface of the copper layer; A noble metal layer is formed on the surface of the palladium layer; The process of forming a noble metal layer on the surface of the palladium layer includes the following steps: depositing a first auxiliary layer on the surface of the palladium layer; and depositing a conductive layer on the surface of the first auxiliary layer. The first subsidiary layer is a first gold layer, and the conductive layer is a silver layer; a second subsidiary layer is formed on the side of the noble metal layer away from the palladium layer; the second subsidiary layer is a second gold layer; and a reinforcing layer is formed on the surface of the second subsidiary layer.

2. The connector plating process as described in claim 1, characterized in that, The process of forming a copper layer on the surface of the pretreated electrical connector specifically includes the following steps: A copper layer with a thickness of 1.25-8 μm is formed on the surface of the electrical connector; The copper layer is subjected to acid activation treatment with an acid concentration of 2-10% and a treatment time of 1-10 minutes.

3. The connector plating process as described in claim 1, characterized in that, The formation of a palladium layer on the surface of the copper layer specifically includes the following steps: A palladium layer is formed on the surface of the copper layer, the palladium layer having a thickness of 0.1-0.8 μm; the palladium layer is electroplated on the surface of the copper layer using a water-based roller plating method, the pH value of the palladium plating solution being 3-10, the electroplating temperature being greater than 60℃, the Baume degree being 2-10°Bé, and the current being 4-12A. The palladium layer is activated.

4. The connector plating process as described in claim 1, characterized in that: The thickness of the first auxiliary layer is 0.075-0.25 μm; the thickness of the conductive layer is 4-10 μm.

5. The connector plating process as described in claim 4, characterized in that, The process of depositing a first auxiliary layer on the surface of the palladium layer specifically includes the following steps: The first auxiliary layer is formed on the surface of the palladium layer, and the thickness of the first auxiliary layer is 0.075-0.25 μm; The first auxiliary layer is activated.

6. The connector plating process as described in claim 4, characterized in that, The surface conductive layer in the first auxiliary layer specifically includes the following steps: A conductive layer is formed on the surface of the first auxiliary layer, the thickness of the conductive layer being 4-10 μm; The conductive layer is activated.

7. The connector plating process as described in claim 1, characterized in that, It also includes the following steps: The electrical connector, after the protective layer is formed, undergoes sealing and drying processes.

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