A method for double-sided patterning based on an optically transparent substrate

Abstract

The present invention provides a method for double-sided patterning based on an optically transparent substrate, characterized in that the method comprises the following steps: (1) providing an optically transparent substrate with a UV blocking function; (2) coating a photoresist material on both surfaces of the optically transparent substrate; and (3) exposing the optically transparent substrate coated with the photoresist material to UV light and developing it to obtain a double-sided patterned optically transparent substrate. The method for double-sided patterning based on an optically transparent substrate provided by the present invention can avoid the photochemical reaction of the photoresist material on the other side of the substrate caused by the UV light irradiated from one side of the substrate, thereby realizing double-sided patterning by a one-time exposure; and the substrates used are all roll-to-roll production materials, and the coating of the photoresist material, exposure of the material, and subsequent processes can all be roll-to-roll and completed in one process, which not only significantly improves production efficiency, but also significantly reduces production costs.

Description

Technical Field

[0001] The present invention belongs to the field of photolithography patterning, and in particular, relates to a method for double-sided patterning based on an optically transparent substrate. Background Art

[0002] The photosensitive material is patterned by photolithography. This technology has been widely used in the field of electronics and microelectronics, especially in the field of printed circuit boards and chips in the electronics industry. This process has decades of application and production experience. In the photolithography process, the photosensitive material is selectively exposed to light radiation (usually ultraviolet radiation, visible light, infrared radiation or a combination thereof). The exposure changes the solubility of the photosensitive adhesive (light-insoluble - negative adhesive; light-soluble - positive adhesive), and then the exposed or unexposed areas of the photosensitive material are removed with a solvent or a developer. This photosensitive material is generally called a photoresist. In the above process, the pattern of the area not removed by the developer can be used as a protective barrier, which can be used to protect the area under the pattern from chemical or physical attacks in subsequent wet or dry processes.

[0003] For example, a photoresist is applied to a copper-clad epoxy glass plate. After photolithography development, the exposed copper layer will be etched away. The copper under the pattern protection area formed after exposure will not be affected by the etching solution. The photoresist on the copper surface is then removed to obtain the desired copper pattern. The photolithography process can also be used to pattern devices on transparent substrates. This is particularly common in the fields of information display and human-computer interface. Electrodes are patterned on a glass surface with optically transparent material ITO through photolithography technology. Capacitive touch units can be prepared for use in display devices, on which users can directly interact with the patterns displayed on the screen.

[0004] In the field of printed circuit boards, it is common to produce multi-layer structures. The usual practice is to coat photoresist materials on both sides of epoxy glass with copper on the top and bottom, and then perform patterning on both sides at the same time. Performing the exposure process on both sides at the same time can reduce the number and complexity of process steps, which is economically and technically beneficial. The key to double-sided patterning here is that the copper layer is opaque, and the light exposed on the top will not affect the photoresist coating on the bottom, and vice versa.

[0005] In display, touch screen, solar cell and lighting applications, it is not feasible to perform double-sided lithography on optically transparent substrates simultaneously, because the transparency of the substrate means that when one side of the material is exposed, light can also pass through the substrate to affect the photoresist material on the other side, which is manifested as interference between the patterns on both sides of the substrate, and the target pattern cannot be obtained. Therefore, these devices are usually composed of several substrates stacked together, with only one patterned layer on each substrate; or through two or more repeated exposure and development followed by etching process, this solution is also only applicable to negative photoresist, not positive photoresist, because the positive photoresist will still be affected by the light passing through the other side during the second exposure stage. Summary of the invention

[0006] The purpose of the present invention is to overcome the defect that the double-sided patterning method in the prior art is usually used for copper layers of opaque materials, but it is difficult to perform double-sided lithography simultaneously on optically transparent substrates, and to provide a method that can perform double-sided patterning simultaneously on the surface of an optically transparent substrate.

[0007] In one aspect, the present invention provides a method for double-sided patterning based on an optically transparent substrate, characterized in that the method comprises the following steps:

[0008] (1) Providing an optically transparent substrate with UV blocking function;

[0009] (2) coating a photoresist material on both surfaces of the optically transparent substrate; and

[0010] (3) exposing the optically transparent substrate coated with the photoresist material to UV light and developing the substrate to obtain a double-sided patterned optically transparent substrate.

[0011] In one embodiment, the optically transparent substrate consists of one or more layers including at least a base layer and, optionally, further layers that modify the surface properties of the base layer.

[0012] In one embodiment, the base layer of the optically transparent substrate is made of at least one of polyethylene terephthalate (PET), transparent polyimide (CPI), cyclic olefin polymer (COP, which may be particularly cyclic olefin copolymer (COC)), super retardation film (SRF), polycarbonate (PC) and polyethylene naphthalate (PEN).

[0013] In one embodiment, the surface property is selected from at least one of adhesion, surface tension and chemical resistance.

[0014] In one embodiment, the UV blocking function of the optically transparent substrate is achieved by adding a UV blocking material during the production process of the optically transparent substrate; or by providing a UV blocking coating on one or more layers in the optically transparent substrate.

[0015] In one embodiment, the optically transparent substrate is planar, preferably in the form of a plate, sheet or film.

[0016] In one embodiment, the optically transparent substrate may be a polarizer, preferably in a linear or elliptical form.

[0017] In one embodiment, the photoresist materials coated on the two surfaces are independently selected from the same or different positive photoresist materials or negative photoresist materials.

[0018] In one embodiment, different exposure energies are matched to the photoresist material according to the blocking condition of the optically transparent substrate at the target exposure wavelength.

[0019] In one embodiment, the wavelength of the UV light is below 400 nm.

[0020] In one embodiment, the optically transparent substrate has a transmittance of ≤10%, preferably ≤2% at the wavelength of UV light.

[0021] In another aspect, the present invention also provides a visual display manufactured by the method described above.

[0022] In another aspect, the present invention further provides a touch screen, in particular a capacitive touch screen, which is manufactured based on the method described above.

[0023] Compared with the existing technical solutions, the technical solution of the present invention includes at least the following advantages:

[0024] (1) By selecting a suitable substrate, photoresist material and exposure parameters, it is possible to avoid the UV light irradiated from one side of the substrate causing a photochemical reaction in the photoresist material on the other side of the substrate, thereby achieving double-sided patterning through a single exposure, which greatly simplifies the process compared to the multiple development and multiple exposure processes in the previous technology;

[0025] (2) All substrates used are roll-to-roll production materials, and the coating of photoresist materials, exposure of materials, and subsequent processes (depending on the product, the process may include etching, evaporation, electroplating, and chemical plating) can all be completed in one process. This not only significantly improves production efficiency, but also significantly reduces production costs and improves production efficiency by reducing the number of processes.

[0026] (3) A double-layer pattern can be obtained on a single-layer transparent substrate. Based on this, a double-sided metal touch grid can be obtained by combining the single-layer wet and dry metal grid preparation processes. Compared with previous single-layer pattern products, this product can achieve capacitive touch screen functions with a single layer of film material, greatly reducing the overall thickness of the touch screen and having high market acceptance; and

[0027] (4) A wide range of substrates can be selected. Selecting different substrates can produce products with specific functions, such as achieving flexibility, high transmittance, eliminating color streaks, bendable, and touch screens that can replace polarizers. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention but do not constitute a limitation of the present invention. In the accompanying drawings:

[0029] Figure 1 A schematic diagram showing simultaneous patterning of both sides of an optically transparent substrate according to an embodiment of the present invention is shown.

[0030] Figure 2 An enlarged view of a pattern formed according to Example 1 of the present invention under a microscope is shown.

[0031] Figure 3 An enlarged view of a pattern formed according to Comparative Example 1 of the present invention under a microscope is shown. DETAILED DESCRIPTION

[0032] The specific embodiments of the present invention are described in detail below. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0033] The endpoints and any values ​​of the ranges disclosed in this article are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of each range, the endpoint values ​​of each range and the individual point values, and the individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed in this article.

[0034] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present invention.

[0035] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. It should also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0036] In one aspect, the present invention provides a method for double-sided patterning based on an optically transparent substrate, characterized in that the method comprises the following steps:

[0037] (1) Providing an optically transparent substrate with UV blocking function;

[0038] (2) coating a photoresist material on both surfaces of the optically transparent substrate; and

[0039] (3) exposing the optically transparent substrate coated with the photoresist material to UV light and developing the substrate to obtain a double-sided patterned optically transparent substrate.

[0040] For step (1), the term "optically transparent substrate" as used herein refers to a substrate with high transmittance, wherein the high transmittance means that the substrate can transmit all or part of the visible spectrum light radiation (usually 380nm-720nm); or can transmit the full spectrum light mixed with different proportions of red, yellow and blue, and the lowest wavelength in this system can extend to about 420nm. In these two systems, the substrate does not need to transmit wavelength light shorter than the lowest wavelength to show transparency. In other words, the optically transparent substrate of the present invention can achieve the effect of optical transparency as long as it can transmit all or part of the visible spectrum light radiation.

[0041] The optically transparent substrate according to the present invention is not necessarily single in composition structure, and may be composed of one or more layers, which may include at least a base layer and, optionally, other layers that modify the surface properties of the base layer.

[0042] The present invention has no particular restrictions on the material of the base layer, and it can be made of various common materials in the art, as long as these materials can have optical transparency in the visible spectrum or one or more narrow-band spectra. For example, in one embodiment of the present invention, the base layer of the optically transparent substrate can be made of at least one of polyethylene terephthalate (PET), transparent polyimide (CPI), cycloolefin polymer (COP, which can be particularly cycloolefin copolymer (COC)), super retardation film (SRF), polycarbonate (PC) and polyethylene naphthalate (PEN).

[0043] The other layers for modifying the surface properties of the base layer mentioned above can be freely judged and selected by technicians in this field according to the actual needs of the surface properties. The surface properties can be selected from at least one of adhesion, surface tension and chemical resistance. Accordingly, these other layers can be set as layers for modifying or improving surface properties such as adhesion, surface tension and chemical resistance.

[0044] In addition, as described above, the optically transparent substrate provided by the present invention is an optically transparent substrate with UV blocking function, the purpose of which is to make the optically transparent substrate have a lower transmittance at the target exposure wavelength (usually a UV wavelength band, such as a UV wavelength band less than 400 nm). Specifically, the transmittance can be ≤10% (e.g., 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9% or 10%, etc.), preferably ≤2% (e.g., 0.1%, 0.5%, 1% or 2%, etc.), wherein the substrate transmittance is tested using a Lambda 850+ UV-visible spectrophotometer according to ASTM D1003 standard.

[0045] This "opaque" property in the low-wavelength band can limit the transmission of light of one or more wavelengths to which the photoresist material coated on the upper and lower surfaces of the substrate is sensitive. In one embodiment of the present invention, the UV blocking function of the optically transparent substrate can be achieved by adding a UV blocking material during the production process of the optically transparent substrate; or by providing a UV blocking coating on one or more layers (such as a base layer) in the optically transparent substrate.

[0046] In addition, the shape of the optically transparent substrate of the present invention can be a planar optically transparent substrate, for example, the optically transparent substrate can exist in the form of a plate, a sheet or a film. In addition, the optically transparent substrate of the present invention can also be a polarizer (linear or elliptical), so the use of appropriate polarized light can prevent light from passing through the substrate, thereby avoiding UV light irradiated from one side of the substrate causing a photochemical reaction in the photoresist material on the other side of the substrate. UV light irradiated from one side of the substrate causes the photoresist material on the other side of the substrate to solidify and undergo a photochemical reaction. This product can be directly used in a liquid crystal display that requires a polarizer, while meeting its needs for a polarizer and a touch unit, thereby reducing the thickness and weight of the device.

[0047] Further, the optically transparent substrate of the present invention can appropriately contain one or more types of additives. For additives, for example, the additives can be UV absorbers, antioxidants, lubricants, plasticizers, mold release agents, anti-coloring agents, flame retardants, surfactants, antistatic agents, pigments and colorants, etc.

[0048] In addition, the thickness of the optically transparent substrate of the present invention can be appropriately determined, however, generally speaking, considering its strength, processability and thin layer performance, the thickness can be determined between 1 μm and 500 μm. In particular, it is preferably a value between 1 μm and 300 μm, and more preferably a value between 5 μm and 200 μm.

[0049] For step (2), the term "photoresist material" as used herein refers to a material that undergoes a photochemical reaction after exposure to one or more specific wavelengths of light radiation to cause chemical or physical changes. The photochemical reaction usually causes a change in the molecular weight of the photoresist material, that is, a change in the solubility in a specific developer, and the reaction occurs at a certain rate. The current process usually uses two or more repeated exposure and development followed by an etching process to pattern both sides of the substrate, but this solution is only applicable to negative photoresist materials and cannot be applied to positive photoresist materials because the positive photoresist will still be affected by the light transmitted from the other side during the second exposure stage.

[0050] However, the double-sided patterning method of the present invention is not affected by the properties of the photoresist material, and positive photoresist materials or negative photoresist materials can be used arbitrarily as needed. In one embodiment of the present invention, the photoresist materials coated on the two surfaces can be independently selected from the same or different positive photoresist materials or negative photoresist materials.

[0051] In addition, the photoresist of the present invention may include a photoinitiator (also referred to as a sensitizer or photosensitizer, etc.), and depending on the photoinitiator, the photoresist may be polymerized at different wavelengths. Further, the type of the photoinitiator of the present invention is not particularly limited, and may be a common photoinitiator in the art. In one embodiment, the photoinitiator may be selected from at least one of the groups consisting of acetophenone compounds, benzophenone compounds, triazine compounds, thioxanthone compounds, and oxime ester compounds. Specific examples of acetophenone compounds may include 2-hydroxy-2-methyl-1-phenylpropane-1-one, diethoxyacetophenone, and 2-(4-methylbenzyl)-2-(dimethylamino)-1-(4-morpholinophenyl) butan-1-one, etc. Specific examples of benzophenone compounds may include benzophenone, methyl o-benzoylbenzoate, 4-benzoyl-4'-methyldiphenyl sulfide, and 2,4,6-trimethylbenzophenone, etc. Specific examples of triazine compounds may include 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)vinyl]-1,3,5-triazine and 2,4-bis(trichloromethyl)-6-2-(4-diethylamino-2-methylphenyl)vinyl]-1,3,5-triazine, etc. Specific examples of thioxanthone compounds may include 2-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone and 1-chloro-4-propoxythioxanthone, etc. Specific examples of the oxime ester compounds may include o-ethoxycarbonyl-α-oxyimino-1-phenylpropan-1-one, 1,2-octanedione, 1-(4-phenylthio)phenyl, 2-(o-benzoyl oxime), and the like.

[0052] For step (3), after the optically transparent substrate coated with the photoresist material is exposed to UV light, since the optically transparent substrate of the present invention has a UV blocking function, it is possible to avoid the UV light irradiated from one side of the substrate causing a photochemical reaction in the photoresist material on the other side of the substrate. The UV light irradiated from one side of the substrate causes the photoresist material on the other side of the substrate to solidify and undergo a photochemical reaction, thereby achieving double-sided simultaneous photolithography. In addition, according to actual needs, appropriate process parameters such as exposure energy, exposure intensity, and exposure time can be comprehensively evaluated. In particular, different exposure energies (e.g., 3-300 mJ / cm2) can be matched to the photoresist material according to the blocking conditions of the optically transparent substrate at the target exposure wavelength. 2 ).

[0053] After exposure, a developer is usually used for development to selectively remove the soluble photoresist coating from the upper and lower surfaces of the substrate, leaving behind an insoluble photoresist pattern, which is usually inconsistent on the upper and lower surfaces. The resulting photoresist pattern can play different roles in different process schemes, for example, it can be used as an etching mask to protect the underlying material from dry or wet etching; it can also form a mask to prevent subsequent materials from being deposited on the underlying material (for example, by metal evaporation or electroplating); or it can also form a template on which subsequent layers are formed (for example, chemical plating can be triggered by a catalyst of chemical palladium or platinum).

[0054] Figure 1 A schematic diagram showing simultaneous patterning of both sides of an optically transparent substrate according to an embodiment of the present invention is shown.

[0055] In another aspect, the present invention also provides a visual display manufactured by the method described above.

[0056] In another aspect, the present invention further provides a touch screen, in particular a capacitive touch screen, which is manufactured by the method as described above.

[0057] In summary, the method for double-sided patterning based on an optically transparent substrate provided by the present invention can avoid the UV light irradiated from one side of the substrate causing the photoresist material on the other side of the substrate to solidify and undergo a photochemical reaction by selecting a suitable substrate, photoresist material and exposure parameters, and then realize double-sided patterning by one-time exposure; and the substrates used are all roll-to-roll production materials, from the coating of the photoresist material, the exposure of the material, and the subsequent processes can all be roll-to-roll, and the process can be completed in one go, which not only significantly improves production efficiency, but also significantly reduces production costs and improves production efficiency by reducing the process. In addition, the product obtained by the double-sided patterning method of the present invention has a double-layer pattern obtained on a single-layer transparent substrate, which greatly reduces the overall thickness of the touch screen compared to the previous single-layer pattern products, and has high market acceptance.

[0058] The preferred embodiments of the present invention are described in detail above. However, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, a variety of simple modifications can be made to the technical solution of the present invention, and these simple modifications all belong to the protection scope of the present invention.

[0059] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations.

[0060] In addition, various embodiments of the present invention may be arbitrarily combined, and as long as they do not violate the concept of the present invention, they should also be regarded as the contents disclosed by the present invention.

[0061] The technical solutions in the embodiments of the present invention are described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0062] Example

[0063] Example 1

[0064] Take a transparent substrate 1, and the transmittance at a wavelength of 365nm measured by a UV-visible spectrophotometer is less than 2.4%. 800nm ​​photoresist material is simultaneously coated on the upper and lower surfaces of the substrate by roll-to-roll wet coating, and baked in an oven at 80°C for 30s to form a base film 1A, wherein the photoresist material is a negative photoresist having a specific reaction rate at a wavelength of 365nm.

[0065] Take the base film 1A, and use roll-to-roll wet coating to coat the upper and lower layers of the base film 1A with a catalyst containing palladium metal at a dosage of about 1.6 g / m 2 , and baked in an oven at 80°C for 30 seconds, then take the water-soluble protective coating, and apply a 500nm protective coating on the surface of the upper and lower catalyst layers by wet coating. After baking in an oven at 80°C for 20 seconds, a protective coating with the function of isolating water and oxygen is formed to prepare the base membrane 1B.

[0066] The obtained base film 1B was exposed on a UV exposure machine with a wavelength of 365 nm using a photomask with different patterns on both sides, and the exposure energy was 50 mJ / cm 2 , obtaining a base film 1C having partial area solidification.

[0067] The obtained base film 1C is developed to remove the uncured area, thereby obtaining a substrate having double-sided patterning. The pattern of the obtained substrate is as follows under a microscope: Figure 2 As shown, the pattern on each side is the same as the contacting mask pattern and does not affect each other. Based on the developed substrate, chemical copper plating can be performed in a copper plating solution to form a copper layer on the above-mentioned patterned area, that is, a capacitive touch grid with a conductive layer on both sides is obtained.

[0068] Comparative Example 1

[0069] Take a transparent substrate 2, and the transmittance at a wavelength of 314nm measured by a UV-visible spectrophotometer is greater than 12%. Coat the upper and lower surfaces of the substrate with a 650nm photoresist material by roll-to-roll wet coating, and bake in an oven at 80°C for 60s to form a base film 2A, wherein the photoresist material is a negative photoresist having a specific reaction rate at a wavelength of 314nm.

[0070] Take the base film 2A and coat the upper and lower layers of the base film 2A with a catalyst containing palladium metal at a dosage of about 1.4 g / m 2 , and baked in an oven at 80°C for 30 seconds, then take the water-soluble protective coating, and apply a 500nm protective coating on the surface of the upper and lower catalyst layers by wet coating. After baking in an oven at 80°C for 20 seconds, a protective coating with the function of isolating water and oxygen is formed, and the base film 2B is prepared.

[0071] The obtained base film 2B was exposed on a UV exposure machine with a wavelength of 314 nm using a photomask with different patterns on both sides, and the exposure energy was 7 mJ / cm 2 , obtaining a base film 2C having partial area solidification.

[0072] The obtained base film 2C is developed to remove the uncured area, thereby obtaining a substrate having double-sided patterning. The pattern of the obtained substrate is as follows under a microscope: Figure 3 As shown, the patterns on both sides affect each other, that is, during the simultaneous exposure of both sides, the ultraviolet light on one side penetrates the substrate to irradiate the other side and solidifies the photoresist material in the corresponding area, so the upper and lower sides of the substrate have two mask patterns. Based on the developed substrate, chemical copper plating can be performed in the copper plating solution to form a copper layer on the above-mentioned patterned area, and a sample with two patterns on both sides is obtained, but the function of a capacitive touch screen cannot be realized.

[0073] The preferred embodiments of the present invention are described in detail above. However, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, a variety of simple modifications can be made to the technical solution of the present invention, and these simple modifications all belong to the protection scope of the present invention.

[0074] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations.

[0075] In addition, various embodiments of the present invention may be arbitrarily combined, and as long as they do not violate the concept of the present invention, they should also be regarded as the contents disclosed by the present invention.

Claims

1. A method for double-sided patterning based on an optically transparent substrate, characterized in that: The method comprises the following steps: (1) providing an optically transparent substrate having a UV blocking function, wherein the transmittance of the optically transparent substrate at the wavelength of UV light is ≤10%; (2) coating a photoresist material on both surfaces of the optically transparent substrate; and (3) exposing the optically transparent substrate coated with the photoresist material to UV light and developing the substrate to obtain a double-sided patterned optically transparent substrate, In step (3), different exposure energies are matched for the photoresist material according to the blocking condition of the optically transparent substrate at the target exposure wavelength, so as to avoid photochemical reaction of the photoresist material on the other side of the substrate caused by UV light irradiated from one side of the substrate.

2. The method according to claim 1, wherein: The optically transparent substrate consists of a base layer.

3. The method according to claim 1, wherein: The optically transparent substrate is composed of a plurality of layers including at least a base layer and other layers that modify the surface properties of the base layer.

4. The method according to claim 2 or 3, wherein: The base layer of the optically transparent substrate is made of at least one of polyethylene terephthalate (PET), transparent polyimide (CPI), cyclic olefin polymer (COP), super retardation film (SRF), polycarbonate (PC) and polyethylene naphthalate (PEN).

5. The method according to claim 4, wherein: The cycloolefin polymer is a cycloolefin copolymer (COC).

6. The method according to claim 3, wherein: The surface property is selected from at least one of adhesion, surface tension and chemical resistance.

7. The method according to claim 2 or 3, wherein: The UV blocking function of the optically transparent substrate is achieved by adding a UV blocking material during the production process of the optically transparent substrate; or by providing a UV blocking coating on one or more layers in the optically transparent substrate.

8. The method according to claim 1, wherein: The optically transparent substrate is planar.

9. The method according to claim 8, wherein: The optically transparent substrate is in the form of a plate, a sheet or a film.

10. The method according to claim 1, wherein: The optically transparent substrate is a polarizer.

11. The method according to claim 10, wherein: The optically transparent substrate exists in a linear or elliptical form.

12. The method according to claim 1, wherein: The photoresist materials coated on the two surfaces are independently selected from the same or different positive photoresist materials or negative photoresist materials.

13. The method according to claim 1, wherein: The wavelength of the UV light is below 400 nm.

14. A visual display manufactured by the method according to any one of claims 1 to 13.

15. A touch screen manufactured based on the method according to any one of claims 1-13.

16. The touch screen according to claim 15, wherein: The touch screen is a capacitive touch screen.

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