Device for thermal management in electronic equipment

Abstract

An apparatus and thermal management mechanism are described. The apparatus includes a housing that surrounds at least one heat-generating electronic structure, such as a plurality of electronic components included on at least a printed circuit board, the housing having an inner surface and an outer surface. The apparatus and thermal management mechanism also include a heat dissipation structure that is thermally coupled to the heat-generating structure or the printed circuit board, the heat dissipation structure forming an open-ended columnar channel that allows air to flow within the heat dissipation structure in a direction parallel to a surface of the heat-generating structure or the printed circuit board.

Description

Technical Field

[0001] The present disclosure relates to an electronic device and associated thermal management device and component mechanisms therein. Background Art

[0002] The present disclosure is applicable to most electronic devices that include thermal management mechanisms. Such electronic devices or equipment in the art are described as typically assembled devices having multiple walls and a top and bottom surface that are generally designed to enclose and protect internal components. Some exemplary electronic devices include, but are not limited to, set-top boxes, OTT media devices, gateways, etc.

[0003] Most of these electronic devices are designed so that the top view shape is rectangular, and the device is a horizontal electronic device, where the height of the device is less than the horizontal width of the front wall, rear wall and side walls. Such horizontal devices are mechanically stable given their wide base and their top is a flat horizontal structure. However, the form factor of the horizontal device requires a large amount of shelf space and may be inconvenient for electronic devices that can stand and / or can be placed in a location with more vertical space than horizontal space.

[0004] New vertical electronic devices are becoming more prevalent in designs for the consumer electronics and communications equipment markets, where the height of the device is greater than the horizontal width of at least one of the walls. Despite the design changes, the need for thermal management systems remains critical, especially given the need for compact vertical designs. Compact vertical designs and increasing performance and functionality requirements have created an internal vertical space that is filled with heat-generating electronic components. Therefore, there is a need for a system that can appropriately diffuse, dissipate and / or exhaust heat without interfering with the internal electrical components and in addition minimize the impact on the mechanical assembly and structural integrity, or even enhance the mechanical assembly and structural integrity. In many cases, there is a further need for a thermal management system to minimize any requirement to increase the internal volume of the device. Summary of the invention

[0005] These and other deficiencies and disadvantages presented by vertically oriented devices are addressed by the principles of the present disclosure relating to thermal management mechanisms in electronic devices. However, those skilled in the art will appreciate that the principles of the present disclosure may also provide advantages in horizontally oriented devices.

[0006] According to an implementation, a device is described. The device includes a housing that surrounds a plurality of electronic components included on at least one printed circuit board, the housing having an inner surface and an outer surface. The device also includes a heat dissipation structure that is coupled to the at least one printed circuit board, the heat dissipation structure forming an open-ended columnar channel that allows air to flow within the heat dissipation structure in a direction parallel to the at least one printed circuit board.

[0007] According to an implementation, a thermal management device is described. The thermal management device includes a heat dissipation structure that is thermally coupled to a heat generating electronic structure, the heat dissipation structure forming an open-ended columnar channel that allows air to flow within the heat dissipation structure in a direction parallel to a planar surface of the heat generating electronic structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The principles of the present disclosure may be better understood with reference to the following exemplary drawings, in which:

[0009] Figure 1 is a side view of a vertically oriented electronic device to which the principles of the present disclosure are applicable;

[0010] Figure 2 is a first perspective view of a vertically oriented electronic device to which the principles of the present disclosure are applicable;

[0011] Figure 3 is a second perspective view of a vertically oriented electronic device to which the principles of the present disclosure are applicable;

[0012] Figure 4 is a third perspective view of a vertically oriented electronic device to which the principles of the present disclosure are applicable;

[0013] Figure 5 The principles of the present disclosure are applicable to electronic devices along Figure 1 A cross-sectional view taken along line 5--5;

[0014] Figure 6a is an exemplary heat sink or heat spreader used in an electronic device to which the principles of the present disclosure are applicable;

[0015] Figure 6b is another exemplary heat sink or heat spreader used in electronic devices to which the principles of the present disclosure are applicable;

[0016] Figure 6c is yet another exemplary heat sink or heat spreader used in an electronic device to which the principles of the present disclosure are applicable;

[0017] Figure 7a is an exemplary heat sink or heat spreader including electronic component interface features for use in electronic devices to which the principles of the present disclosure are applicable;

[0018] Figure 7b is an exemplary spacer for use with a heat sink or heat spreader used in an electronic device to which the principles of the present disclosure are applicable;

[0019] Figure 8a is a perspective view of an electronic device showing internal components including a baffle element to which the principles of the present disclosure are applicable;

[0020] Figure 8b is along Figure 8a A cross-sectional view of an electronic device taken along line 8--8 in FIG. 8 , showing a baffle element to which the principles of the present disclosure are applicable;

[0021] Fig. 9 is along Figure 1 A cross-sectional view of an electronic device taken along line 9--9 in FIG. 1 , showing airflow through an electronic device to which the principles of the present disclosure are applicable;

[0022] Fig.10 The principles of the present disclosure are applicable along Figure 1 A cross-sectional view of another exemplary internal structure contained within a housing of an electronic device taken along line 5--5 in FIG.

[0023] Fig.11a is an exemplary attachment ring for internal structures contained within a housing of an electronic device to which the principles of the present disclosure are applicable;

[0024] Fig.11b is an exemplary mechanical assembly including an attachment ring and internal structure for mounting in a housing of an electronic device to which the principles of the present disclosure are applicable;

[0025] Fig.12 is an exemplary baffle structure for installation in a housing of an electronic device to which the principles of the present disclosure are applicable;

[0026] Fig.13 is an exploded view of an exemplary set of components that may be used to assemble a portion of an electronic device to which the principles of the present disclosure apply. DETAILED DESCRIPTION

[0027] The present disclosure may also be applied to electronic devices or equipment described in the art as typically assembled devices having multiple walls and a thermal management system or mechanism including one or more heat sinks. The present disclosure also relates to how to incorporate a thermal management system or mechanism including one or more heat sinks into an assembly process for electronic devices and equipment.

[0028] This specification illustrates the principles of the present disclosure. It will therefore be appreciated that those skilled in the art will be able to devise various arrangements that, although not explicitly described or shown herein, embody the principles of the present disclosure and are included within the scope of the claims.

[0029] All examples and conditional language cited herein are intended for teaching purposes to help the reader understand the principles of the present disclosure and the concepts contributed by the inventors to advance the art, and should be construed as not being limited to these specifically recited examples and conditions.

[0030] In addition, all statements of principles, aspects and embodiments of the principles of the present disclosure, and specific examples thereof, are intended to cover structural and functional equivalents thereof. In addition, such equivalents are intended to include currently known equivalents as well as equivalents developed in the future, i.e., any elements developed to perform the same function, regardless of structure.

[0031] Steering Figure 1-4 , several views of an exemplary device 100 including thermal management mechanisms according to aspects of the present disclosure are shown. The electronic device 100 is oriented primarily in a vertical arrangement. It is important to note that while the electronic device 100 is shown as having a particular shape, the electronic device 100 may take a shape different than that shown without departing from the principles of the present disclosure. Because vertically oriented electronic devices appear to be of interest to the consumer marketplace, some focus of the present principles (such as those of the thermal management mechanisms described herein) is applied to vertically oriented electronic devices, but the principles may also be applied to electronic devices arranged in a more horizontal orientation. The same reference numerals will be used throughout the text. Figure 1-4 remains unchanged throughout the description.

[0032] Figure 1 A side view of an exemplary electronic device 100 is shown. The electronic device 100 includes an upper shell 110, a lower shell 120, and a base 130. The upper shell 110 and the lower shell 120 can be assembled using any of a variety of mechanical coupling mechanisms. In one embodiment, the upper shell 110 and the lower shell 120 can be mechanically coupled using a combination hook and latch mechanism. The hook and latch mechanism includes one or more hook mechanisms that are located at or near the mating edge of the inner surface of one of the faces or vertical planes of the upper shell 110 and the lower shell 120. The hook and latch mechanism also includes one or more latch mechanisms that are located at or near the mating edge of the inner surface of one of the faces or vertical planes on the upper shell 110 and the lower shell 120 opposite to the location of the hook mechanism. The hook and latch mechanism can be made of plastic as part of the plastic molding process when producing the upper shell 110 and the lower shell 120. Additional mechanical coupling mechanisms are used to assemble the base 130 to the bottom of the lower shell 120, including but not limited to the combination hook and latch mechanism described above.

[0033] Figure 2A first perspective view of an exemplary electronic device 100 is shown. An upper ventilation mechanism 140 is shown as being included in the top surface of the upper shell 110. The upper ventilation mechanism 140 may include a plurality of parallel ribs that form a grid with open spaces between the parallel ribs. The open spaces allow air to flow outward from the inside of the electronic device 100 between the ribs. Other shapes may be used to form the ventilation mechanism 140. It is important to note that in some embodiments, the upper ventilation mechanism 140 may be included near the top of one or more faces of the upper shell 110. In this case, it is advantageous that the upper ventilation mechanism 140 is located above any heat generating components included inside the electronic device 100.

[0034] Figure 3 A second perspective view of the exemplary electronic device 100 is shown. The lower ventilation mechanism 150 is shown as being included in the bottom surface of the lower housing 120. The lower ventilation mechanism 150 is similar in appearance to the upper ventilation mechanism 140, allowing air to flow inwardly from the exterior to the interior of the electronic device 100. The lower ventilation mechanism together with the upper ventilation mechanism 140 is shown as being included in the bottom surface of the lower housing 120. Figure 2 The upper ventilation mechanism 140 described in the foregoing is used to form part of the thermal management system of the electronic device 100. In some embodiments, the lower ventilation mechanism 150 can be part of the base 130 and is used to form the bottom surface of the lower shell 120 when assembled. It is important to note that in some embodiments, the lower ventilation mechanism 150 can be included near the bottom of one or more faces of the lower shell 120. In this case, it is advantageous for the lower ventilation mechanism 150 to be located below any heat-generating components included inside the electronic device 100.

[0035] Figure 4 A third perspective view of an exemplary electronic device 100 is shown. An electrical interface panel 160 is shown as being included on a face of the lower housing 120. In some embodiments, the electrical interface panel 160 is located on a back face of the electronic device 100. The electrical interface panel 160 may include connectors, switches, and buttons associated with the operation of the electronic device 100. In some embodiments, the connectors, switches, and buttons may be mounted on a printed circuit board included as part of the electronics housed in the electronic device 100 and may protrude and / or be accessible through one or more openings in the lower housing 120.

[0036] It should be understood that the electronic device 100 contains a number of electronic components for proper operation. The electronic components may include, but are not limited to, a printed circuit board (PCB), a hard drive, a smart card assembly, a tuner and antenna, an integrated circuit, and the like.

[0037] Furthermore, expressions such as "rear" and "front" and "vertical" and "horizontal", as well as other supplementary terms, are intended to be interpreted from the perspective of the observer of the figures; therefore, these expressions may be interchanged depending on the direction of the viewing device.

[0038] Figure 5 An electronic device (such as Figure 1-4 The electronic device 100 described in Figure 1 5. The cross-sectional view 500 is taken along line 5--5 in FIG. The cross-sectional view 500 shows an exemplary internal structure contained within the housing and the interface between the electronic devices and the thermal management mechanism included in the electronic device 100. The housing 505 may include multiple components (e.g., Figure 1-4 The shielding structure 515 may be formed as a frame and may surround all or part of the components mounted on the surface of the PCB 510. The shielding structure 515 may also include a cover (not shown) mechanically mounted to the frame of the shielding structure 515.

[0039] The second PCB 525 may also have multiple electronic components mounted on one or both surfaces and electrically connected to multiple conductive traces on the surface or within a layer of the PCB 525. A shielding structure 535 may be mounted to a first surface of the PCB 525 and electrically connected to one or more of the multiple conductive traces on this first surface. An additional shielding structure 540 may be mounted to a second surface of the PCB 525 and electrically connected to one or more of the multiple conductive traces on this second surface. The form and characteristics of the shielding structure 535 and the shielding structure 540 are similar to the shielding structure 515. One or more electrical interface components 530 (such as connectors, switches, and buttons) may be mounted to one surface of the PCB 525 and electrically connected to multiple conductive traces on this surface or within a layer of the PCB 525. One or more electrical connectors 530 may be positioned on the PCB 525 so that they can be connected in a manner similar to that of the PCB 515. Figure 4 The electrical interface panel 160 protrudes through at least one opening in the housing 505 in the manner described above.

[0040] PCB 510 has a heat spreader 545 coupled to one of its surfaces through a thermal interface 560. Heat spreader 545 is a heat sink that provides heat dissipation properties, and it should be noted that the terms heat spreader and heat sink are often used interchangeably. Heat spreader 545 may have one or more contact areas with the surface of PCB 510 or with one or more heat-generating electronic components on the surface of PCB 510 through thermal interface 560. Heat spreader 545 may extend horizontally to at least span the horizontal width of PCB 510. Heat spreader 545 may also extend vertically to span all or part of the vertical height of PCB 510. Heat spreader 545 has a circumferential shape that is columnar and hollow along the vertical axis of the electronic device and open at both ends. The opening or shape formed by heat spreader 545 may be referred to as an open-ended columnar channel. The first surface portion 575 of heat spreader 545 extends parallel to the surface to both ends of PCB 510 in the horizontal direction, and further extends outward to the inner surface of the housing 505 of the electronic device. The second surface portion 580 of the heat spreader 545 extends or wraps horizontally from one side of the housing 505, stretches or extends along the contour of a portion or section of the inner surface of the housing 505, and terminates at the other side of the housing 505, connected to the first surface portion 575 of the heat spreader 545, thereby forming a shape surrounding or enclosing the open-ended cylindrical channel. The additional portion 585 of the heat spreader 545 can be formed as an extension of the open-ended cylindrical channel formed by the surface portions 575 and 580. The additional portion 585 can start at the intersection of the first surface portion 575 and the second surface portion 580. The additional portion 585 of the heat spreader 545 is formed to stretch or extend along the contour of the inner surface along a different portion of the inner surface of the housing 505 (e.g., the side of the housing 505 opposite to the side where the second surface portion 580 is located).

[0041] A second heat spreader 520 is coupled to a second surface of the PCB 510 via a thermal interface 565. The heat spreader 520 may also have one or more contact areas for a surface of the PCB 510, one or more electronic components, or one or more shields, as described above. The heat spreader 520 is also formed as an open-ended cylindrical channel, as described for the heat spreader 545.

[0042] The third heat spreader 550 is coupled to the surface of the PCB 525 through the thermal interface 570. The heat spreader 550 may have one or more contact areas for the surface of the PCB 525, one or more electronic components, or one or more shields, as described above. The heat spreader 550 includes a first surface portion 590 and a second surface portion 595 to form a shape similar to that described for the heat spreader 545 around the open-ended cylindrical channel. The heat spreader 550 may extend horizontally to span all or part of the horizontal width of the PCB 525. The heat spreader 545 may also extend vertically to span all or part of the vertical height of the PCB 525. The first surface portion 590 of the heat spreader 545 extends horizontally along the surface parallel to one end of the PCB 510 and further extends outward to the inner surface of the housing 505 of the electronic device closest to the end. Due to the presence of one or more electrical interface components 530, the first surface portion 590 does not extend to the other end of the PCB 510. The second surface portion 595 of the heat spreader 545 extends or wraps horizontally from one side of the housing 505 to the other side of the housing 505, stretches or extends along the contour of a portion or section of the inner surface of the housing 505, and connects to the first surface portion 590 of the heat spreader 550 without interfering with the one or more electrical interface components 530. It is important to note that in some embodiments, the shape of the heat spreader 520 and the heat spreader 550 can be different from the shape of the heat spreader 545 while still maintaining the desired characteristics of forming open-ended cylindrical channels.

[0043] Thermal interfaces 560, 565, and 570 may be one or more of several possible interface elements, including but not limited to heat sinks or thermal grease, pyrolytic graphite pads, silicon pads, phase change materials, thermal adhesives, and potting compounds. It is important to note that in some embodiments, one or more of thermal interfaces 560, 565, and 570 may be used as part of a mounting or support structure for a heat sink to PCB interface or as part of a mounting or support structure for an internal component structure.

[0044] As part of the principles of the present disclosure, the arrangement shown in cross-sectional view 500 may be referred to as a dual PCB stack thermal management mechanism. The arrangement and orientation of heat spreaders 545, 520, and 550 relative to PCB 510 and PCB 525 provide a balance of thermal management for the electronic components on PCB 510 and PCB 525 inside housing 505. The arrangement extracts heat from the heat-generating electronic components or elements of PCB 510 and PCB 525 and allows the heat to escape or dissipate through the open-ended columnar channels formed by heat spreaders 545, 520, and 550 using convective airflow from the air intake located below PCB 510 and PCB 525 to the exhaust located above PCB 510 and PCB 525. In addition, the open-ended cylindrical channel shapes of the heat spreaders 545, 520, and 550 provide heat extraction from the PCBs 510 and 525 through the interior regions of the heat spreaders 545, 520, and 550 due to convective airflow generated by the air inlets and outlets included as part of the housing 505. In this manner, the open-ended cylindrical channel shapes of the heat spreaders 545, 520, and 550 serve as convective channels. In addition, the planar and circumferential shapes and spans of the heat spreaders 545 and 550 also provide conduction of heat from surface portions (e.g., first surface portion 575 and first surface portion 590) coupled to the PCBs 510 and 525 around the circumference of the heat spreaders to surface portions (e.g., second surface portion 580 and second surface portion 595) near the interior surface of the housing 505. In addition, the relative orientation of the first surface portions 575, 590 and the second surface portions 590, 595 of the heat spreader 545 and the heat spreader 550 creates a heat reflection mechanism. For example, heat generated by the electronic components of the PCB 510 and the PCB 525 that is conducted to the first surface portions 575 and 590 and radiated into the interior area of ​​the heat spreaders 545 and 550 will be reflected back into the interior area due to the presence of the second surface portions 580 and 595. Forming the first surface portion 575 and the additional surface portion 585 of the heat spreader 545 to follow the shape of the inner surface of the housing 505 and extending along the inner surface additionally provides a uniform surface temperature, which is attributed to the heat radiation from the heat spreader along the majority of the inner surface of the housing 505. The uniform surface temperature results in the reduction or elimination of undesirable hot spots that the user may contact when touching the outer surface of the housing 505. It is important to note that these principles can be applied to various shapes and structures that utilize the convection channel principle and the open-ended cylindrical channel shape.

[0045] It is important to note that the size of heat spreader 545 is much larger than the size of heat spreader 550 and the size of heat spreader 520. The difference in size, surface area and shape is to account for the difference in the heat generated by the electronic components of each PCB 510 and PCB 525. In this embodiment, the heat generated from PCB 510 is greater than the heat generated from PCB 525. In other embodiments, the heat generated may be equal or the magnitude may be opposite for PCB 510 and PCB 525. In these embodiments, the size of each heat sink and the surface area and shape may be adjusted based on the design technology of the heat generated and the space allocated within the housing 505 without departing from the principles of the present disclosure. Furthermore, in some embodiments, heat spreader 520 may be additionally coupled to PCB 525 via a thermal interface, or heat spreader 520 may not be present because it may not be required as part of the thermal management mechanism.

[0046] In addition, due to the difference that the heat generated from PCB 510 is greater than the heat generated from PCB 525, heat spreader 545 is shown extending in the area occupied by PCB 525 and heat spreader 550 to surround the inner surface of housing 505. The additional surface area of ​​heat spreader 545 allows additional heat diffusion or dissipation from PCB 510 and allows for a lower and more uniform surface temperature along the entire outer surface of housing 505. In addition, the transfer of heat generated from PCB 510 to the area occupied by PCB 525 and heat spreader 550 also provides a better thermal balance between the areas occupied by PCB 525 and PCB 510. Heat spreader 550 is not coupled or connected (e.g., with a thermal interface material) to heat spreader 545.

[0047] Although heat spreaders 545, 520, and 550 can be mechanically coupled or attached to PCB 510 and PCB 525 using only the characteristics of thermal interfaces 560, 565, and 570, additional attachment mechanisms (not shown) may be included. These attachment mechanisms may include, but are not limited to, screws, push pins, twist pins, or screw pins. Additional mechanical interfaces may be included on PCB 510 and PCB 525 and heat spreaders 545, 520, and 550 to accommodate the attachment mechanisms. In some embodiments, the attachment mechanisms can minimize or prevent direct thermal coupling by utilizing thermally insulating attachment mechanisms and / or by eliminating copper surfaces on and through PCB 510 and 525 below or around the attachment mechanisms.

[0048] In some embodiments, a fan or blower (not shown) may be included and placed above or below PCB 510 and PCB 525 to draw air or push air through the interior of housing 505 and through the convection channels formed by heat spreaders 545, 520, and 550. Additional airflow may further improve cooling efficiency. The fan may run continuously or may be controlled by electronic components and / or sensors and run based on measured conditions (e.g., air temperature) inside housing 505.

[0049] Figure 6a-6c According to aspects of the present disclosure, Figure 5 Exemplary materials and construction aspects of heat sinks or heat spreaders of heat spreader 545, heat spreader 520, or heat spreader 550 described in . Figure 6a-6c The heat sink shown in includes a circumferentially shaped element that acts as a convection channel having the properties and characteristics described above. Figure 6a A heat sink 610 is shown constructed or formed using an extrusion or casting process with aluminum or an aluminum compound as the substrate. The extrusion or casting process produces a heat sink that does not require any seams. It is important to note that if the heat sink 610 is formed using a casting process, zinc or a zinc compound can also be used as the substrate. The extrusion or casting process for the heat sink 610 will require a minimum defined thickness to avoid extrusion or casting defects.

[0050] Figure 6b A heat sink 620 is shown constructed or formed from an aluminum sheet using a cutting, pressing and bending process. The heat sink 620 is constructed by cutting a planar portion from an aluminum sheet that has been sized to produce the desired three-dimensional shape for the heat sink 620 when pressed and bent. The cut planar portions are bent and pressed using one or more pressing and forming tools. In some embodiments, closing of the convection channel aspect of the heat sink may require one or more fastening elements or welding steps. The material properties of aluminum allow the heat sink 620 to be manufactured using a thinner material than that required for the heat sink 610, but a minimum defined thickness will still be required to avoid stress fractures during the forming process.

[0051] Figure 6cA heat sink 630 is shown constructed or formed from a steel sheet using a cutting, pressing and bending process. The heat sink 630 is constructed by cutting planar portions from a steel sheet that has been sized to produce the desired three-dimensional shape for the heat sink 630 when pressed and bent. The cut planar portions are bent and pressed using one or more pressing and forming tools. In some embodiments, the closure of the convection channel aspects of the heat sink may require one or more fastening elements or welding steps. The material properties of the steel sheet allow the heat sink 630 to be manufactured using thinner materials than those required for the heat sink 620 and heat sink 610, and with less risk of stress fractures during forming. In some embodiments, the steel sheet may be pre-plated or post-plated after forming using any conventional electroplating method known to those skilled in the art. It is important to note that the heat sink may be made using other suitable materials and formed using other suitable processes known to those skilled in the art.

[0052] Figure 7a A heat sink or heat spreader 700 (similar to Figure 5 545, 520, or 550 as described in the foregoing) that include electronic component interface features according to aspects of the present disclosure. Heat sink 700 includes protruding element 710 that facilitates a surface contact interface with an electronic component (e.g., an integrated circuit, a portion of a shield, or an area on a PCB surface). In some embodiments, protruding element 710 can be formed or stamped as part of heat sink 700. The forming process can depend on the type of material used and / or the process used to form the heat sink. For example, if a steel plate is used, such as Figure 6c As described above with respect to heat sink 630 in FIG. 1 , protruding element 710 can be formed in the steel sheet when the heat sink is formed. In another example, if aluminum is used as part of the extrusion or casting process, a separate spacer can be formed to serve as protruding element 710 and attached to the heat sink using an adhesive (e.g., a thermally conductive adhesive). Example spacers 720 that can be used as protruding elements (e.g., protruding element 710) are shown in FIG. Figure 7b Shown in.

[0053] Figure 8a-8b An exemplary electronic device 800 (similar to electronic device 100 described above) is shown that incorporates aspects of a thermal management system according to the present embodiments. Figure 8a is a perspective view showing elements inside the electronic device 800 . Figure 8b is a cross-sectional view of the electronic device 800 taken along the line labeled 8--8 in FIG. 8 .

[0054] The electronic device 800 includes a baffle element 810 and an internal component stack 820. The baffle element 810 is located inside the housing of the electronic device 800, in the space between the upper surface of the electronic device and the internal component stack 820. The internal component stack 820 may include one or more PCBs and associated thermal components, such as Figure 5 PCB 510 and PCB 525 and associated heat spreader described in . In one embodiment, baffle element 810 is located at the top plane of internal component stack 820 and is perpendicular to internal component stack 820, and the span is the distance across the inner surface of the electronic device. Baffle element 810 is used as a thermal barrier for airflow management inside the electronic device. The upward flow of air is controlled by one or more openings or vents 830 in baffle element 810. One or more openings or vents 830 can be formed as holes, slots or any other suitable type of openings. One or more openings or vents 830 can be positioned at specified or predetermined positions along the planar surface of baffle element 810. These positions can be selected based on empirical data collected as part of the design criteria for electronic devices. In some embodiments, the vents can be adjustable during assembly of the electronic device or during operation of the electronic device.

[0055] Fig. 9 A cross-sectional view (similar to FIG. 1 ) of an electronic device 900 according to aspects of the present embodiment is shown. Figure 1-4 8 ). The cross-sectional view of the electronic device 900 provides a representation of airflow control associated with a thermal management system according to aspects of the present disclosure. Airflow line 910 shows airflow upward through the electronic device 900. External air enters through vents at the bottom of the electronic device 900 (e.g., through the lower vent mechanism 150 described above), flows through the internal component stack and through the heat sink, and passes through openings in a baffle (e.g., the baffle element 810 described in FIG. 8 ) in an intentionally controlled manner. The airflow through the openings in the baffle further flows out of the top of the electronic device 900 (e.g., through the upper ventilation mechanism 140 described above). The baffle provides airflow restriction to control the airflow rate through the electronic device 900 and maintain a certain volume of air in the space occupied by the internal component stack in the electronic device 900 as part of the thermal management system.

[0056] Fig.10 is a cross-sectional view of an electronic device 1000 according to various aspects of the present disclosure (similar to Figure 1-4 The electronic device 100 described in Figure 15 in FIG. 1000). Cross-sectional view 1000 shows another exemplary internal structure contained within the housing and the interface between the electronic devices and thermal management mechanisms included in the electronic device 1000. The housing 1005 may include multiple components (e.g., upper housing 110 and lower housing 120, as described above) and may be made of a suitable aesthetic material (e.g., plastic). PCB 1010 may have multiple electronic components mounted on one or both surfaces and electrically connected to multiple conductive traces on the surfaces or within the layers, as described above. Figure 5 A shielding structure (not shown) may be mounted to one or both surfaces of PCB 1010 and formed and electrically connected to one or more of the plurality of conductive traces on the surface of PCB 1010, as described above.

[0057] The first heat sink 1045 is coupled to the first surface of the PCB 1010. The heat sink 1045 may have one or more contact areas with the surface of the PCB 1010, a metal shield (not shown) mounted to the surface of the PCB 1010, or one or more heat generating electronic components (not shown) on the surface of the PCB 1010 through a thermal interface (not shown), as described above. The heat sink 1045 has a circumferential shape to form a thermal interface similar to Figure 5 The open ended cylindrical channels of the heat spreader 545 described in . The outer portion of the heat spreader 1045 away from the PCB 1010 extends around, stretching or extending along the contour of the inner surface of the housing 1005, as described above.

[0058] A second heat sink 1050 is coupled to a second surface of the PCB 1010. The heat sink 1050 may have one or more contact areas with a surface on the PCB 1010, one or more electronic components, or one or more shields (not shown) mounted on the PCB 1010 through a thermal interface (not shown), as described above. The heat sink 1050 also has a circumferential shape forming an open-ended cylindrical channel, as described above for the heat spreader 550. As with the heat sink 1045, the outer portion away from the PCB 1010 follows the contour of the inner surface of the housing 1005 around, as described above. In the cross section 1000, the heat sink 1045 is thermally coupled to an electronic component, shield, or surface on one side of the PCB 1010, while the heat sink 150 is thermally coupled to an electronic component, shield, or surface on the other or second side of the PCB 1010. In addition, the outer portion of the heat sink 1050 extends along the contour of the inner surface on the opposite inner surface of the housing 1005 (as opposed to the inner surface along which the outer portion of the heat sink 1045 is located). In some embodiments, heat sink 1045 and heat sink 1050 may have some overlap and further may be directly thermally coupled. It is important to note that heat sink 1045 and heat sink 1050 are shown as being formed from sheet steel and including seam portion 1055. In some embodiments, other materials and other forming processes may be used, as described above.

[0059] Attachment interface 1095 is shown as mechanically coupling heat sink 1045 and heat sink 1050 to PCB 1010. In some embodiments, more than one attachment interface 1095 may be included. Further, in some embodiments, the mechanical coupling of attachment interface 1095 may not provide direct thermal coupling by utilizing a thermally insulating attachment mechanism (e.g., an insulating screw, push pin, twist pin, or screw pin) and by eliminating copper surfaces on and through PCB 1010 beneath attachment interface 1095.

[0060] As part of the principles of this disclosure, Fig.10The arrangement shown in can be referred to as a single PCB stack thermal management mechanism. The arrangement and orientation of the heat sink 1045 and the heat sink 1050 relative to the PCB 1010 provide balanced thermal management. The arrangement extracts heat from the electronic components on both sides of the PCB 1010 and allows the heat to escape or dissipate through the open-ended columnar channels formed by the heat sinks 1045 and 1050 using convective airflow from the air inlet below the PCB 1010 to the exhaust port above the PCB 1010, as described above. In addition, the flat and circumferential shape and span of the heat sink 1045 and the heat sink 1050 also provide heat from the electronic components on both sides of the PCB 1010, the shielding and the surface circumferentially surrounding the surface to the portion of the heat sink 1045 and 1050 near the inner surface of the housing 1005 Conduct, as described above. In addition, as described above, the open-ended columnar channel shape creates a heat reflection mechanism to the internal area of ​​the heat sink 1045 and 1050. Forming the exterior of heat sinks 1045 and 1050 to extend along the shape and contour of the interior surface of housing 1005 additionally provides uniform heat radiation along a majority of the interior surface of housing 1005 to prevent undesirable hot spots that a user may contact when touching the exterior surface of housing 505, as described above.

[0061] It is important to note that the surface area and structure of heat spreader 1050 encompass an area that is larger than the size of heat spreader 1045. The size difference may be based on empirical data indicating that the heat generated from the lower surface of PCB 1010 that interfaces with heat spreader 1050 is greater than the heat generated by the upper surface of PCB 1010. In other embodiments, the heat generated may be more equal or may be opposite in magnitude for the two PCBs. In these embodiments, the size and surface area and shape of each heat spreader may be adjusted accordingly without departing from the principles of the present disclosure. In other embodiments, heat spreader 1050 may include additional portions that extend or wrap around the inner surface of housing 1005, similar to Figure 5 The method described in overlaps with the heat sink 1045 but is not in thermal contact with it.

[0062] It is important to note that the principles of the present embodiments related to thermal management may be applied to other devices, particularly those oriented vertically, that include electronic circuits that may be categorized as heat-generating structures or elements. Such devices may include, but are not limited to, hard disk drives, disk drive arrays, optical drives, processor-based server racks, and the like. For example, a first heat sink (similar to Figure 5 The heat sink 1045, or heat spreader 545, described in the foregoing can be thermally coupled to a first planar surface of a heat generating structure in the device. A second heat sink (similar to Figure 5The heat sink 1050, or heat spreader 550, described in the embodiment of the present invention can be thermally coupled to the second planar surface of the heat generating structure in the device. The exterior of the two heat sinks can extend or extend along the contour of the inner surface of the shell or housing surrounding the heat generating structure and / or forming the outer surface of the device. Other possible configurations of thermal management mechanisms in similar devices described in this embodiment can also be used, including Figure 5 Those described in .

[0063] In some embodiments, a fan or blower (not shown) may be included and placed at the top of housing 1005 above PCB 1010 or at the bottom of housing 1005 below PCB 1010. The fan may draw air or push air through the interior of housing 1005 and through convection channels in heat spreader 1045 and heat spreader 1050 to improve cooling efficiency. The fan may run continuously or may be controlled by electronics and / or sensors and run based on measured conditions (e.g., air temperature) inside housing 1005.

[0064] Fig.11a An exemplary attachment or mounting ring 1110 is shown for use in conjunction with a mechanical assembly that is part of an electronic device (e.g., electronic device 100 described previously) in accordance with aspects of the present disclosure. The mounting ring 1110 is used as an internal component stack (e.g., Figure 5 The two PCB stack thermal management mechanisms described in, or Fig.10 100 is a mounting bracket for a single PCB stack thermal management mechanism as described in the . Attachment or mounting ring 1110 includes mounting holes 1120 for attaching the mounting ring to the internal component stack. Mounting ring 1100 also includes upper retaining clips 1130 and lower retaining clips 1140 for securing mounting ring 1110 to the housing of the electronic device (e.g., upper shell 110 and lower shell 120 described above). It is important to note that mounting ring 1110 can be a complete or closed ring, or can include gaps or spaces along its circumference, referred to as an open ring.

[0065] Fig.11bA mechanical assembly 1100 is shown for use as part of an electronic device (e.g., electronic device 100 described previously) in accordance with the principles of the present disclosure. The mechanical assembly 1100 includes a mounting ring 1110, as described in FIG. 11, which is attached to an internal component stack 1115. The internal component stack 1115 also includes an electrical interface panel 1150, similar to the interface panel described above, positioned to span a gap in the circumference of the mounting ring 1110. The internal component stack 1115 is shown as a PCB stack thermal management mechanism, including internal mounting elements 1160. In other embodiments, a different component stack may be used, such as the two PCB stack thermal management mechanisms described above. The mounting ring 1110 is attached to the internal component stack 1115 using fasteners through mounting holes 1120. The fasteners may be any suitable type of attachment component, including, but not limited to, screws, bolts, rivets, and push pins.

[0066] Fig.12 Another exemplary baffle structure 1200 for use as part of an electronic device (e.g., the electronic device 100 described previously) according to the principles of the present disclosure is shown. The baffle structure 1200 includes an outer ring 1210 for coupling and / or attaching to a housing of an electronic device in a manner similar to the attachment or mounting ring 1110 described above. The baffle structure 1200 also includes a baffle 1220 positioned perpendicular to the space within the outer ring 1210 and located within it. In the case of an electronic device, the baffle structure 1200 can be located in a planar position above the internal component structure or PCB stack in a manner similar to the baffle element 810 described above. The baffle structure 1200 also includes one or more openings or vents 1230 on the baffle 1220 to control airflow in a manner similar to that described above. The location of the openings or vents 1230 can be selected based on empirical data collected as part of the design criteria for the electronic device. In some embodiments, the vents can be adjustable during assembly of the electronic device or during operation of the electronic device. The mounting ring 1210 can also include one or more retainer mechanisms (not shown) for attaching to one or more parts of the housing of the electronic device.

[0067] Fig.13 An exemplary exploded view of the assembled components of an electronic device 1300 similar to the electronic device 100 described above is shown in accordance with aspects of the present disclosure. Figure 2 The upper ventilation mechanism 140 described in FIG. 1 is mounted or attached to the housing extension 1320. The baffle structure 1330 (similar to Fig.12 The baffle structure 1200 described in Figure 1 The heat sink or heat spreader 1350 and the heat sink or heat spreader 1360 are similar to Fig.10The single PCB thermal management mechanism described in the above is mounted or attached to PCB 1355. The fixing ring 1365 (similar to Fig.11a The mounting ring 1110 described in the foregoing is attached to the assembly formed by the heat sink or heat spreader 1350, the heat sink or heat spreader 1360 and the PCB 1355 to form a similar Fig.11b The mechanical assembly is a mechanical assembly of the mechanical assembly 1100 described in the foregoing. The mechanical assembly is secured in position within and within the upper shell 1340 and the lower shell 1370 using a mounting or attachment ring 1365 between the upper shell 1340 and the lower shell 1370. The lower shell 1370 is similar to Figure 1 The lower shell 120 described in FIG. The base 1380 (similar to Figure 1 The base 130 described in the above is mounted or attached to the lower shell 1370. One or both of the lower shell 1370 and the base 1380 may include one or more Figure 3 The ventilation opening of the lower ventilation mechanism 150 described in .

[0068] One or more embodiments of the present disclosure provide a thermal management mechanism for an electronic device. The thermal management mechanism includes a heat dissipation structure that is particularly suitable for vertically oriented electronic devices. The heat dissipation structure includes one or more heat sinks or heat spreaders coupled to electronic components mounted on a printed circuit board or coupled to other heat-generating electronic elements or structures. The heat sink or heat spreader forms an open-ended columnar channel that allows air to pass through the open interior area of ​​the heat sink or heat spreader. The heat sink or heat spreader operates as a convection channel by allowing air to flow upward from the bottom of the housing of the electronic device below the heat-generating electronic elements or structures (such as electronic components on a printed circuit board) to the top of the housing. The arrangement and construction of the printed circuit board or other heat-generating electronic structure and the heat sink or heat spreader also provide an efficient assembly mechanism by simply stacking a set of coupling components that support the printed circuit board and heat sink or heat spreader assembly and provide stability to it within the housing of the electronic device.

[0069] According to the present disclosure, a device is described, comprising: a housing, the housing surrounding a plurality of heat-generating electronic components included on at least one printed circuit board, the housing having an inner surface and an outer surface. The device also includes a heat dissipation structure, the heat dissipation structure coupled to the at least one printed circuit board, the heat dissipation structure forming an open-ended cylindrical channel, the open-ended cylindrical channel allowing air to flow within the heat dissipation structure in a direction parallel to the at least one printed circuit board.

[0070] In some embodiments, the heat dissipation structure includes a first heat spreader, the first heat spreader having a first portion extending in a direction parallel to a portion of at least one printed circuit board and thermally coupled to one of a plurality of electronic components mounted on the portion of the at least one printed circuit board, the first heat spreader also having a second portion extending along a contour of the first portion of the inner surface of the housing and opposite to the first portion, the first portion and the second portion forming the open-ended columnar channel.

[0071] In some embodiments, the heat dissipation structure also includes a second heat spreader, the second heat spreader having a first portion extending in a direction parallel to at least a different portion of at least one printed circuit board and thermally coupled to one of a plurality of electronic components mounted on the different portion of the at least one printed circuit board, the second heat spreader also having a second portion extending along a contour of a second portion of an inner surface of the housing and opposite to a first portion of the additional open-ended columnar channel, the second portion of the inner surface being different from the first portion of the inner surface, the first portion and the second portion of the second heat spreader forming the additional open-ended columnar channel.

[0072] In some embodiments, the first heat spreader includes an additional portion mechanically coupled to at least one of the first portion and the second portion of the first heat spreader, the additional portion further extending along a contour of the second portion of the inner surface of the housing.

[0073] In some embodiments, the at least one printed circuit board is two circuit boards, and wherein the first heat spreader dissipates heat generated by electronic components on the first printed circuit board and the second heat spreader dissipates heat generated by electronic components on the second printed circuit board.

[0074] In some embodiments, the first heat spreader and the second heat spreader are not thermally coupled to each other.

[0075] In some embodiments, the second portion of the first heat spreader extends along a contour of a portion of the inner surface to maintain a uniform temperature of the outer surface of the housing.

[0076] In some embodiments, the device further comprises a baffle element surrounded by the housing and perpendicular to the opening in the heat dissipation structure, the baffle element being located outside one end of the printed circuit board, the baffle element comprising at least one opening for controlling airflow through the heat dissipation structure.

[0077] In some embodiments, the housing further includes a first vent structure located outside the first end of the printed circuit board and a second vent structure located outside the second end of the printed circuit board.

[0078] In some embodiments, the at least one printed circuit board is oriented vertically and parallel to the inner surface of the housing.

[0079] In some embodiments, the apparatus further comprises a mounting ring mechanically attached to the heat dissipation structure, the mounting ring being mounted between the first portion of the housing and the second portion of the housing, the mounting ring providing a fixed positioning of the heat dissipation structure within the housing.

[0080] In some embodiments, the heat dissipation structure is formed as part of a casting process using zinc or aluminum or as part of a sheet bending process using aluminum or steel.

[0081] According to the present disclosure, a thermal management device includes a heat dissipation structure thermally coupled to a heat generating electronic structure, the heat dissipation structure forming open-ended cylindrical channels that allow air to flow within the heat dissipation structure in a direction parallel to a planar surface of the heat generating electronic structure.

[0082] In some embodiments, the open-ended columnar channel includes a first portion extending in a direction parallel to at least a portion of at least one printed circuit board and thermally coupled to one or more of a plurality of electronic components mounted on the portion of the at least one printed circuit board, and wherein the open-ended columnar channel also includes a second portion extending along a contour of the first portion of the inner surface of the housing and opposite the first portion.

[0083] In some embodiments, the heat dissipation structure includes a first heat spreader, which has a first portion extending in a direction parallel to the planar surface of the heat generating structure and thermally coupled to at least a portion of the planar surface of the heat generating structure. The first heat spreader also has a second portion extending along the contour of the first portion of the inner surface of the shell of the heat management device and opposite to the first portion, and the first portion and the second portion form the end-opening columnar channel.

[0084] In some embodiments, the heat dissipation structure also includes a second heat spreader, the second heat spreader having a first portion extending in a direction parallel to the different planar surfaces of the heat generating structure and thermally coupled to at least a portion of the different planar surfaces of the heat generating structure, the second heat spreader also having a second portion extending along the contour of the second portion of the inner surface of the shell and opposite to the first portion of the additional end-opening columnar channel, the second portion of the inner surface is different from the first portion of the inner surface, the first portion and the second portion of the second heat spreader form an additional end-opening columnar channel.

[0085] In some embodiments, the first heat spreader includes an additional portion mechanically coupled to at least one of the first portion and the second portion of the first heat spreader, the additional portion further extending along a contour of the second portion of the inner surface of the housing.

[0086] In some embodiments, the heat generating structure is a printed circuit board, and wherein the first heat spreader dissipates heat generated by electronic components on a first surface of the printed circuit board and the second heat spreader dissipates heat generated by electronic components on a second surface of the printed circuit board.

[0087] In some embodiments, the first heat spreader and the second heat spreader are not thermally coupled to each other.

[0088] In some embodiments, the heat management device further comprises a mounting ring mechanically attached to the heat dissipation structure, the mounting ring providing fixed positioning of the heat dissipation structure within the housing of the heat management device.

[0089] It is important to note that the embodiments described herein are not necessarily intended to include mutually exclusive features or aspects of the principles of the present disclosure. Unless otherwise stated, any embodiment described herein or anticipated as a result of using the principles of the present disclosure may include any combination of features described in any of the above embodiments.

[0090] Although embodiments incorporating the teachings of the present disclosure have been shown and described in detail herein, those skilled in the art can readily devise numerous other varied embodiments that still incorporate these teachings. Having described preferred embodiments of an apparatus for thermal management in an electronic device (which are intended to be illustrative and not limiting), it should be noted that modifications and variations may be made by those skilled in the art in light of the above teachings. Therefore, it should be understood that changes may be made in the specific embodiments of the disclosure disclosed that are within the scope of the disclosure as outlined in the appended claims.

Claims

1. A thermal management device, comprising: a housing enclosing a plurality of heat-generating electronic components included on at least one printed circuit board, the housing having an inner surface and an outer surface; as well as a heat dissipation structure coupled to the at least one printed circuit board, the heat dissipation structure forming open-ended cylindrical channels that allow air to flow within the heat dissipation structure in a direction parallel to the at least one printed circuit board; The heat dissipation structure includes a first heat spreader, the first heat spreader having a first portion, the first portion extending in a direction parallel to a portion of the at least one printed circuit board and thermally coupled to one of a plurality of electronic components mounted on the portion of the at least one printed circuit board, the first heat spreader also having a second portion, the second portion extending along the contour of the first portion of the inner surface of the housing and opposite to the first portion, the first portion and the second portion forming the end-opening columnar channel, The first heat spreader includes an additional portion mechanically coupled to at least one of the first portion and the second portion of the first heat spreader, and the additional portion further extends along a contour of the second portion of the inner surface of the housing.

2. The thermal management device according to claim 1, wherein: The heat dissipation structure also includes a second heat spreader, the second heat spreader having a first portion extending in a direction parallel to at least a different portion of the at least one printed circuit board and thermally coupled to one of the plurality of electronic components mounted on the different portion of the at least one printed circuit board, the second heat spreader also having a second portion extending along a contour of a second portion of an inner surface of the housing and opposite to the first portion of the additional open-ended cylindrical channel, the second portion of the inner surface being different from the first portion of the inner surface, the first portion and the second portion of the second heat spreader forming the additional open-ended cylindrical channel.

3. The thermal management device according to claim 2, wherein: The at least one printed circuit board is two circuit boards, and wherein the first heat spreader spreads heat generated by electronic components on a first printed circuit board, and the second heat spreader spreads heat generated by electronic components on a second printed circuit board.

4. The thermal management device according to claim 2, wherein: The first heat spreader and the second heat spreader are not thermally coupled to each other.

5. The thermal management device according to claim 1, wherein: The second portion of the first heat spreader extends along a contour of a portion of the inner surface to maintain a uniform temperature of the outer surface of the housing.

6. The thermal management device according to claim 1, wherein: Also included is a baffle element surrounded by the housing and perpendicular to the opening in the heat dissipation structure, the baffle element is located outside one end of the printed circuit board, and the baffle element includes at least one opening for controlling airflow through the heat dissipation structure.

7. The thermal management device according to claim 1, wherein: The housing also includes a first vent structure located outside the first end of the printed circuit board and a second vent structure located outside the second end of the printed circuit board.

8. The thermal management device of claim 1, wherein: The at least one printed circuit board is oriented perpendicularly relative to and parallel to the inner surface of the housing.

9. The thermal management device of claim 1, further comprising a mounting ring mechanically attached to the heat dissipation structure, the mounting ring being mounted between the first portion of the housing and the second portion of the housing, the mounting ring providing fixed positioning of the heat dissipation structure within the housing.

10. The thermal management device of claim 1, wherein: The heat dissipation structure is formed as part of a casting process using zinc or aluminum or as part of a sheet bending process using aluminum or steel.

11. A thermal management device comprising: a heat dissipation structure thermally coupled to the heat generating electronic structure, the heat dissipation structure forming an open ended columnar channel that allows air to flow within the heat dissipation structure in a direction parallel to a planar surface of the heat generating electronic structure; The heat dissipation structure includes a first heat spreader, the first heat spreader having a first portion, the first portion extending in a direction parallel to the planar surface of the heat generating structure and thermally coupled to at least a portion of the planar surface of the heat generating structure, the first heat spreader also having a second portion, the second portion extending along the contour of the first portion of the inner surface of the housing of the heat management device and opposite to the first portion, the first portion and the second portion forming the end-opening columnar channel, The first heat spreader includes an additional portion mechanically coupled to at least one of the first portion and the second portion of the first heat spreader, and the additional portion further extends along a contour of the second portion of the inner surface of the housing.

12. The thermal management device of claim 11, wherein: The heat dissipation structure also includes a second heat spreader, which has a first portion extending in a direction parallel to the different planar surfaces of the heat generating structure and thermally coupled to at least a portion of the different planar surfaces of the heat generating structure, and the second heat spreader also has a second portion extending along the contour of the second portion of the inner surface of the shell and opposite to the first portion of the additional end-opening columnar channel, the second portion of the inner surface is different from the first portion of the inner surface, and the first portion and the second portion of the second heat spreader form the additional end-opening columnar channel.

13. The thermal management device of claim 12, wherein: The heat generating structure is a printed circuit board, and wherein the first heat spreader spreads heat generated by electronic components on a first surface of the printed circuit board, and the second heat spreader spreads heat generated by electronic components on a second surface of the printed circuit board.

14. The thermal management device of claim 12, wherein: The first heat spreader and the second heat spreader are not thermally coupled to each other.

15. The thermal management device of claim 11, further comprising a mounting ring mechanically attached to the heat dissipation structure, the mounting ring providing fixed positioning of the heat dissipation structure within a housing of the thermal management device.

16. The thermal management device of claim 11, wherein: The heat dissipation structure is formed as part of a casting process using zinc or aluminum or as part of a sheet bending process using aluminum or steel.

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