Thin temperature distribution plate structure

Abstract

The present invention provides a thin temperature distribution plate structure, including a first cover and a second cover. The first cover has a first surface and a first cluster pattern. The first cluster pattern is arranged on the first surface, has first protruding stripes, is spaced apart from each other, and extends along a first direction. The second cover has a second surface and a second cluster pattern. The first surface faces the second surface. The second cluster pattern is arranged on the second surface, has second protruding stripes, is spaced apart from each other, and extends along a second direction. The first cluster pattern and the second cluster pattern are spatially opposite to each other, contacting and connecting to form a microstructure, and the sidewalls of the first protruding stripes and the sidewall structures of the second protruding stripes form at least one microchannel, which zigzags between the first surface and the second surface.

Description

Technical Field

[0001] This case concerns a vapor chamber structure, specifically a thin vapor chamber structure that effectively reduces the impact of gas-liquid interference on capillary action. Background Art

[0002] The traditional vapor chamber structure includes a closed hollow container, a fluid, and a closed space circulation system. The rapid heat conduction and heat diffusion functions are achieved by changing the fluid's gas-liquid phase.

[0003] However, because traditional heat spreader structures utilize microstructures such as a copper mesh to generate capillary forces, driving the fluid in the heat spreader to undergo a cycle of evaporation and condensation, as heat spreaders become thinner, the air chamber space becomes smaller, and the relative flow of the gas phase fluid and the liquid phase fluid within the extremely small air chamber space is prone to mutual interference, causing the generated fluid droplets to scatter, thereby affecting the performance of the heat spreader. In addition, the interface between the gas phase fluid and the liquid phase fluid that generates the capillary force in traditional heat spreaders is formed in the height direction of the heat spreader (i.e., the thickness direction of the heat spreader, such as the Z-axis direction). Therefore, the area of mutual interference between the gas phase fluid and the liquid phase fluid is equivalent to the plane area of the heat spreader (i.e., the plane area formed by the length and width of the heat spreader, such as the XY-axis direction). This results in a larger mutual interference area between the gas phase fluid and the liquid phase fluid, thereby affecting the working performance of the heat spreader.

[0004] In view of this, it is necessary to provide a thin vapor chamber structure that effectively reduces the influence of gas-liquid interference on capillary action, so as to solve the aforementioned problem. Summary of the Invention

[0005] The present invention aims to provide a thin vapor chamber structure. The structure utilizes clustered patterns on two covers, assembled and connected to form a microstructure with at least one microchannel. This provides the capillary action (wicking power) required for liquid fluids, such as those flowing from the condensation zone to the evaporation zone, effectively reducing interference between the liquid fluid and the vapor fluid flowing from the evaporation zone to the condensation zone. Capillary action refers to the facilitation of the evaporation and condensation cycles of fluids (including vapor and liquid phases). Factors influencing the effectiveness of capillary action include flow resistance and capillary force. Because the raised stripes on the two covers are arranged in different directions, the overlapping and contacting raised stripes on the two covers form microchannels that zigzag across the surfaces of the two covers, allowing the liquid phase to flow back from the condensation zone to the evaporation zone through the continuous microchannels. The walls of the raised stripes provide the capillary action required for the fluid to flow back from the condensation zone to the evaporation zone. This makes the flow resistance and capillary force inversely proportional to the height of the raised stripes on the two covers, proportional to the width of the raised stripes on the two covers, and inversely proportional to the distance between adjacent raised stripes on the two covers, thereby controlling the efficiency of the fluid flow back from the condensation zone to the evaporation zone. Furthermore, the effectiveness of the capillary action can be adjusted by varying the height, width, and distance between adjacent raised stripes, independent of the planar dimensions of the two covers. Furthermore, the microchannels of the microstructures maintain communication with the flow channels located between the microstructures, ensuring that the flows of the liquid phase and the gas phase in the microchannels and flow channels, respectively, do not interfere with each other. In this way, fluids such as the gas phase fluid formed by evaporation from the evaporation zone and the liquid phase fluid formed by condensation from the condensation zone can flow through the flow channel and the microchannel respectively, effectively reducing the mutual interference caused by the relative flow, and also avoiding the fluid generating droplets from flying and affecting the performance of the temperature plate.

[0006] Another object of this invention is to provide a thin vapor chamber structure. Because the clustering patterns on the two covers each have protruding stripes arranged in different directions, when the two covers are assembled, the protruding stripes on the two covers contact and connect, thereby forming a micro-channel that zigzags between the two covers. To match the corresponding condensation and evaporation zones of the thin vapor chamber during use, the length, width, or end shape of the protruding stripes in the clustering patterns on the two covers can be adjusted. The density of the protruding stripes in the clustering patterns can also be varied to meet practical application requirements, increasing product versatility. Furthermore, in addition to being able to be assembled by diffusion bonding or brazing, the two covers can also be assembled using an adhesive layer to facilitate contact and connection of the protruding stripes on the two covers. This simplifies the process, reduces energy consumption, and prevents oxidation during high-temperature and high-pressure assembly, which can affect the contact and connection of the protruding stripes on the two covers and, in turn, the overall performance of the thin vapor chamber structure.

[0007] To achieve the aforementioned objectives, the present invention provides a thin vapor chamber structure. The structure includes a first cover, a second cover, and a fluid. The first cover has a first surface and a first clustering pattern. The first clustering pattern is disposed on the first surface and comprises a plurality of first protruding stripes spaced apart from each other and extending along a first direction. The second cover has a second surface and a second clustering pattern. The first surface faces the second surface. The first and second covers are assembled to form a receiving space. The first clustering pattern and the second clustering pattern are spatially opposed to each other and connected to form a microstructure. The microstructure divides the receiving space into at least two flow channels located on two opposing sides of the microstructure. The second clustering pattern is disposed on the second surface and comprises a plurality of second protruding stripes spaced apart from each other and extending along a second direction, the first direction and the second direction being different. The plurality of first protruding stripes and the plurality of second protruding stripes at least partially contact each other, forming at least one microchannel connecting the at least two flow channels. The fluid is contained in the receiving space. When the fluid flows through at least one microchannel, a capillary force generated by the combination of the plurality of first protruding stripes and the plurality of second protruding stripes provides a capillary effect, so that the fluid circulates smoothly in the channel and the microchannel.

[0008] To achieve the aforementioned objectives, the present invention further provides a thin temperature distribution plate structure, comprising a first cover and a second cover. The first cover has a first surface and a first cluster pattern. The first cluster pattern is arranged on the first surface and has a plurality of first protruding stripes, the plurality of first protruding stripes are arranged at intervals from each other, and extend along a first direction. The second cover has a second surface and a second cluster pattern. The first surface faces the second surface. The second cluster pattern is arranged on the second surface and has a plurality of second protruding stripes, the plurality of second protruding stripes are arranged at intervals from each other, and extend along a second direction, and the first direction and the second direction are not the same direction. The first cluster pattern and the second cluster pattern are spatially opposite to each other and are in contact and connected to form a microstructure, and the sidewalls of the plurality of first protruding stripes and the sidewall structures of the plurality of second protruding stripes form at least one microchannel, zigzagging between the first surface and the second surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a structural exploded view of the thin vapor chamber structure according to the first embodiment of the present invention.

[0010] Figure 2 This is a three-dimensional structural diagram of the thin heat spreader structure according to the first embodiment of the present invention.

[0011] Figure 3 To reveal Figure 2 The cross-sectional structure diagram of the thin temperature distribution plate structure along the A-A' line segment.

[0012] Figure 4 for Figure 3 side view.

[0013] Figure 5 To reveal Figure 2 The cross-sectional structure diagram of the thin temperature distribution plate structure along the BB' line segment.

[0014] Figure 6 for Figure 5 Top view of .

[0015] Figure 7 This is a diagram illustrating the relationship between the evaporation zone and the condensation zone in the thin vapor chamber structure of the first embodiment of the present invention.

[0016] Figure 8 To reveal Figure 2 A three-dimensional structural diagram of the same thin temperature distribution plate structure.

[0017] Figure 9 To reveal Figure 8 The cross-sectional structure diagram of the thin temperature distribution plate structure along the C-C' line segment.

[0018] Figure 10 To reveal Figure 9 Magnified view of the middle area P1.

[0019] Figure 11 To reveal Figure 8 The cross-sectional structure diagram of the thin temperature distribution plate structure along the D-D' line segment.

[0020] Figure 12 To reveal Figure 11 Magnified view of the middle area P2.

[0021] Figure 13 This is a structural exploded view of the thin vapor chamber structure according to the second embodiment of the present invention.

[0022] Figure 14 This is a three-dimensional structural diagram of a thin temperature vapor chamber structure according to the second embodiment of the present invention.

[0023] Figure 15 To reveal Figure 14 The cross-sectional structure diagram of the thin temperature distribution plate structure along the E-E' line segment.

[0024] Figure 16 This is a diagram illustrating the relationship between the evaporation zone and the condensation zone in the thin vapor chamber structure of the second embodiment of the present invention.

[0025] Figures 17A to 17J Schematic diagram illustrating different implementations of the protruding stripes in the thin temperature vapor chamber of the present invention.

[0026] Figure 18 This is a structural exploded view of the thin vapor chamber structure according to the third embodiment of the present invention.

[0027] 19A to 19D Schematic diagram illustrating different implementation modes of the cover assembly in the thin heat spreader structure of this case.

[0028] The accompanying drawings are denoted as follows:

[0029] 1. 1a, 1b: Thin vapor chamber structure

[0030] 10, 10a, 10b: first cover

[0031] 101: Accommodation Space

[0032] 11: First surface

[0033] 12, 12': First cluster pattern

[0034] 121, 122, 123: First cluster pattern

[0035] 12a: First raised stripe

[0036] 12b: Sidewall

[0037] 13: First side spacing

[0038] 14, 14': First interval

[0039] 15: First joint

[0040] 151, 151a: Depression area

[0041] 20, 20a, 20b: Second cover

[0042] 21: Second Surface

[0043] 22, 22': Second cluster pattern

[0044] 221, 222, 223: Second cluster pattern

[0045] 22a: Second raised stripe

[0046] 22b: Sidewall

[0047] 23: Second side spacing

[0048] 24, 24': Second interval

[0049] 25: Second joint

[0050] 251, 251a: Depression area

[0051] 32, 32a: Microstructure

[0052] 33: Runner

[0053] 34, 34a: Microfluidic channel

[0054] 40: Adhesive layer

[0055] A-A', B-B', C-C', D-D', E-E': line segments

[0056] H1: First height

[0057] H2: Second height

[0058] L1: First direction

[0059] L2: Second direction

[0060] P1, P2: Area

[0061] S1: First interval distance

[0062] S2: Second interval distance

[0063] T1, T3: evaporation zone

[0064] T2, T4: condensation zone

[0065] W1: first width

[0066] W2: Second width

[0067] X, Y, Z: Axis

[0068] θ: angle DETAILED DESCRIPTION

[0069] Some typical embodiments that embody the features and advantages of this invention will be described in detail in the following description. It should be understood that this invention is capable of various modifications in different aspects without departing from the scope of this invention, and that the descriptions and drawings are intended to be illustrative in nature and not to limit this invention.

[0070] Figure 1 This is a structural exploded view of the thin vapor chamber structure according to the first embodiment of the present invention. Figure 2 This is a three-dimensional structural diagram of the thin heat spreader structure according to the first embodiment of the present invention. Figure 3 To reveal Figure 2 The cross-sectional structure diagram of the thin temperature distribution plate structure along the A-A' line segment. Figure 4 for Figure 3 side view. Figure 5 To reveal Figure 2 The cross-sectional structure diagram of the thin temperature distribution plate structure along the BB' line segment. Figure 6 for Figure 5A top view of the heat spreader structure 1 is shown. In this embodiment, the thin heat spreader structure 1 includes a first cover 10, a second cover 20, and a fluid (not shown). The first cover 10 has a first surface 11 and a first clustered pattern 12. The first clustered pattern 12 is disposed on the first surface 11 and has a plurality of first protruding stripes 12a. The plurality of first protruding stripes 12a are spaced apart from each other and extend along a first direction L1. The second cover 20 has a second surface 21 and a second clustered pattern 22. The second clustered pattern 22 is disposed on the second surface 21 and has a plurality of second protruding stripes 22a. The plurality of second protruding stripes 22a are spaced apart from each other and extend along a second direction L2. In this embodiment, the first direction L1 and the second direction L2 are not aligned, that is, they are not parallel to each other. Therefore, the first direction L1 and the second direction L2 form an angle θ, which ranges from 20° to 160°. In this embodiment, the first surface 11 faces the second surface 21. The first cover 10 and the second cover 20 are assembled to form an accommodation space 101. The first clustering pattern 12 and the second clustering pattern 22 are spatially opposed to each other and connected to form a wick or micro-structure 32. The micro-structure 32 divides the accommodation space 101 into at least two channels 33 located on two opposing sides of the micro-structure 32. In this embodiment, the channels 33 are formed, for example, by first side spacers 13 on two opposing sides of the first clustering pattern 12 and second side spacers 23 on two opposing sides of the second clustering pattern 22. Furthermore, in this embodiment, at least a portion of the surfaces of the plurality of first protruding stripes 12a and at least a portion of the surfaces of the plurality of second protruding stripes 22a contact each other to form a microstructure 32. The microstructure 32 has at least one microchannel 34 connected to at least two channels 33. Any two adjacent first protruding stripes 12a have a first gap 14, and any two adjacent second protruding stripes 22a have a second gap 24. The microchannel 34 can be formed, for example, by connecting the first gap 14 with the second gap 24.In this embodiment, a fluid is contained within the accommodating space 101, for example, filling the accommodating space 101. The fluid comprises a vapor fluid and a liquid fluid. The flow channel 33 is for the vapor fluid to flow, while the microchannel 34 is for the liquid fluid to flow. When the liquid fluid flows through at least one microchannel 34, the capillary force generated by the combination of the plurality of first protruding stripes 12a and the plurality of second protruding stripes 22a provides a capillary effect, allowing the vapor fluid and the liquid fluid to circulate smoothly within the flow channel 33 and the microchannel 34, respectively, i.e., a cycle of evaporation and condensation.

[0071] In this embodiment, the first cover 10, for example, has a first joint portion 15 arranged around the outer periphery of the first cover 10. The second cover 20 has a second joint portion 25 arranged around the outer periphery of the second cover 20 and spatially opposite to the first joint portion 15. In this embodiment, the first cover 10, the first cluster pattern 12 and the first joint portion 15 can be made, for example, of copper, aluminum or other heat-conducting metal in an integrally molded manner. The second cover 20, the second cluster pattern 22 and the second joint portion 25 can also be made, for example, of copper, aluminum or other heat-conducting metal in an integrally molded manner. The first joint portion 15 of the first cover 10 and the second joint portion 25 of the second cover 20 can be assembled to form a closed accommodating space 101, for example, by diffusion welding or brazing, and the first cluster pattern 12 and the second cluster pattern 22 are contacted and connected to form a microstructure 32 with at least one microchannel 34. Of course, in other embodiments, the first cover 10 and the second cover 20 may also be combined in other ways to form the enclosed accommodation space 101, and the first cluster pattern 12 and the second cluster pattern 22 may be contacted and connected to form a microstructure 32 having at least one microchannel 34. It is noteworthy that the at least one microchannel 34 is formed by the sidewalls 12b of the plurality of first protruding stripes 12a and the sidewalls 22b of the plurality of second protruding stripes 22a. Therefore, the microchannel 34 zigzags between the first surface 11 and the second surface 21. The plurality of first protruding stripes 12a and the plurality of second protruding stripes 22a can combine to generate a capillary force when fluid flows through, thereby providing a capillary effect to facilitate the smooth circulation of gas-phase fluid and liquid-phase fluid in the flow channel 33 and the microchannel 34, respectively, i.e., the cyclic flow of evaporation and condensation.

[0072] In this embodiment, the fluid, for example, fills the enclosed housing space 101 and includes both a gaseous and liquid phases. When the thin vapor chamber structure 1 provides heat dissipation for a heat-generating electronic component, the area in contact with the electronic component can be configured as a vaporization zone, while the remaining area can be configured as a condensation zone. Figure 7 This diagram illustrates the relationship between the evaporation zone and the condensation zone in the thin vapor chamber structure of the first embodiment of the present invention. In this embodiment, the thin vapor chamber structure 1 includes an evaporation zone T1 and a condensation zone T2. During use, fluid in the evaporation zone T1 is subjected to heat energy generated by, for example, the corresponding electronic component, causing it to evaporate and form a vapor-phase fluid. The vapor-phase fluid then flows through the flow channel 33 from the evaporation zone T1 to the condensation zone T2, releasing heat and condensing into a liquid-phase fluid. Furthermore, the microchannels 34 formed by the sidewalls 12b of the plurality of first protruding stripes 12a and the sidewalls 22b of the plurality of second protruding stripes 22a zigzag between the first surface 11 and the second surface 21. When the liquid-phase fluid enters the microchannels 34 within the microstructure 32 through capillary action, it can flow back from the condensation zone T2 to the evaporation zone T1. In this way, the gas-phase fluid and the liquid-phase fluid can circulate through the flow channel 33 and the microchannel 34 respectively, so that the interface between the gas-phase fluid and the liquid-phase fluid that generates capillary force is formed in the length and width directions of the temperature vapor chamber (i.e., the plane direction of the temperature vapor chamber, that is, the X-axis and Y-axis directions). Therefore, compared with the existing temperature vapor chamber, there is a smaller interference area between the gas-phase fluid and the liquid-phase fluid, which effectively reduces the mutual interference caused by the relative flow between them, and can also prevent the gas-phase fluid flow from causing droplet scattering of the liquid-phase fluid, thereby affecting the performance of the temperature vapor chamber.

[0073] Figure 8 To reveal Figure 2 A three-dimensional structural diagram of the same thin temperature distribution plate structure. Figure 9 To reveal Figure 8 The cross-sectional structure diagram of the thin temperature distribution plate structure along the C-C' line segment. Figure 10 To reveal Figure 9 Magnified view of the middle area P1. Figure 11 To reveal Figure 8 The cross-sectional structure diagram of the thin temperature distribution plate structure along the D-D' line segment. Figure 12 To reveal Figure 11An enlarged view of the middle region P2. In this embodiment, any two adjacent first protruding stripes 12a have a first spacing distance S1, which ranges from 50 μm to 300 μm. The first protruding stripes 12a have a first height H1 and a first width W1, which range from 10 μm to 200 μm, and from 50 μm to 500 μm. Furthermore, in this embodiment, any two adjacent second protruding stripes 22a have a second spacing distance S2, which ranges from 50 μm to 300 μm. The second protruding stripes 22a have a second height H2 and a second width W2, which range from 10 μm to 200 μm, and from 50 μm to 500 μm. In this embodiment, the first height H1 of the first protruding stripes 12a is smaller than the second height H2 of the second protruding stripes 22a. Because the first clustered pattern 12 on the first cover 10 includes the plurality of first protruding stripes 12a arranged along the first direction L1, and the second clustered pattern 22 on the second cover 20 includes the plurality of second protruding stripes 22a arranged along the second direction L2, the plurality of first protruding stripes 12a and the plurality of second protruding stripes 22a overlap and contact, forming microchannels 34 that zigzag between the first surface 11 and the second surface 21. This allows the liquid phase fluid to flow back from the condensation zone T2 to the evaporation zone T1. The capillary force generated by the overlapping contact of the first protruding stripes 12a and the second protruding stripes 22a provides the capillary action required for the liquid phase fluid to flow back from the condensation zone T2 to the evaporation zone T1. In this embodiment, the flow resistance and the capillary force are inversely proportional to, for example, the first height H1 of the first protruding stripes 12a and the second height H2 of the second protruding stripes 22a. Alternatively, the flow resistance and capillary force may be, for example, directly proportional to the first width W1 of the first protruding stripes 12a and the second width W2 of the second protruding stripes 22a. Alternatively, the flow resistance and capillary force may be, for example, inversely proportional to the first spacing S1 between two adjacent first protruding stripes 12a and inversely proportional to the second spacing S2 between two adjacent second protruding stripes 22a. Therefore, by designing the first height H1, first width W1, and first spacing S1 of the first protruding stripes 12a, and the second height H2, second width W2, and second spacing S2 of the second protruding stripes 22a, the capillary action efficiency required for the liquid phase fluid to flow back from the condensation zone T2 to the evaporation zone T1 can be controlled. In other words, the effectiveness of the capillary action in the thin vapor chamber structure 1 can be adjusted by changing the first height H1, first width W1, and first spacing S1 of the first protruding stripes 12a, or by changing the second height H2, second width W2, and second spacing S2 of the second protruding stripes 22a, regardless of the planar dimensions of the first cover 10 and the second cover 20.

[0074] Figure 13 This is a structural exploded view of the thin vapor chamber structure according to the second embodiment of the present invention. Figure 14 This is a three-dimensional structural diagram of a thin temperature vapor chamber structure according to the second embodiment of the present invention. Figure 15 To reveal Figure 14 The cross-sectional structure diagram of the thin temperature distribution plate structure along the E-E' line segment. Figure 16 This is a diagram showing the relationship between the evaporation zone and the condensation zone in the thin heat spreader structure of the second embodiment of this case. Figures 1 to 12The illustrated thin vapor chamber structure 1 is similar, and like component numbers represent like components, structures, and functions, and are not further described here. In this embodiment, the first clustering pattern 12' on the first cover 10 and the second clustering pattern 22' on the second cover 20 are assembled to form a microstructure 32a, and the microstructure 32a has at least one microchannel 34a connected to the flow channel 33. Any two adjacent first protruding stripes 12a have a first gap 14', and any two adjacent second protruding stripes 22a have a second gap 24'. The microchannel 34a can, for example, be formed by connecting the first gap 14' and the second gap 24'. In this embodiment, the distribution of the first clustering pattern 12' on the first cover 10 and the second clustering pattern 22' on the second cover 20 can be designed, for example, based on the positions of the evaporation zone T3 and the condensation zone T4 defined during use of the thin vapor chamber structure 1a. In this embodiment, the first clustering pattern 12' on the first cover 10 further comprises three sets of first clustering patterns 121, 122, and 123. The second clustering pattern 22' on the second cover 20 further comprises three sets of second clustering patterns 221, 222, and 223. In this embodiment, the first clustering pattern 12' connects to the second clustering pattern 22' to form a microstructure 32a located in the evaporation zone T3 and the condensation zone T4. At least two sets of first clustering patterns 121, 122, and 123 are spaced apart in the condensation zone T4 and converge in the evaporation zone T3. At least two sets of second clustering patterns 221, 222, and 223 are spaced apart in the condensation zone T4 and converge in the evaporation zone T3. Furthermore, the first side spacings 13 between two opposing sides of at least two sets of first clustering patterns 121, 122, and 123, and the second side spacings 23 between two opposing sides of at least two sets of second clustering patterns 221, 222, and 223 correspond to each other and are combined to form flow channels 33. Consequently, when liquid fluid evaporates into gaseous fluid in evaporation zone T3, it can flow directly to condensation zone T4 through at least one flow channel 33. The capillary force generated by the combination of the first protruding stripes 12a and the second protruding stripes 22a in at least one microchannel 34a provides a capillary effect, allowing the liquid fluid to flow back from condensation zone T4 to evaporation zone T3. In other embodiments, the first clustering patterns 12' and the second clustering patterns 22' may further vary the density of the first protruding stripes 12a and the second protruding stripes 22a to meet actual application requirements and increase product diversity. This is not a limitation of the present invention.

[0075] Furthermore, it should be noted that in the aforementioned embodiment, the flow channel 33 connects to the microchannels 34 and 34a. To improve the efficiency of fluid flowing from the flow channel 33 into the microchannels 34 and 34a, or vice versa, the shapes of the first protruding stripes 12a and the second protruding stripes 22a can be adjusted according to actual application requirements. Figures 17A to 17JSchematic diagrams illustrating different embodiments of the protruding stripes in the thin vapor chamber of the present invention. In this embodiment, the first protruding stripe 12a and the second protruding stripe 22a can be, for example, elongated stripes, each having a first end and a second end. The first end and the second end can be selected from the group consisting of a plane, an inclined surface, a curved surface, a triangular surface, and an irregular surface, such as Figures 17A to 17J Of course, this case is not limited to this.

[0076] Figure 18 This is a structural decomposition diagram of the thin heat spreader structure of the third embodiment of the present invention. In this embodiment, the thin heat spreader structure 1b and Figures 1 to 12 The thin vapor chamber structure 1 shown is similar, and like component numbers represent like components, structures, and functions, and will not be further described here. In this embodiment, the thin vapor chamber structure 1b further includes an adhesive layer 40 disposed between the first joint portion 15 of the first cover 10 and the second joint portion 25 of the second cover 20. The first joint portion 15 and the second joint portion 25 can be connected via the adhesive layer 40, thereby assembling the first cover 10 and the second cover 20 to form a receiving space 101, and allowing the first clustering pattern 12 and the second clustering pattern 22 to contact and connect to form a microstructure 32 having at least one microchannel 34. It is worth noting that the formation of at least one microchannel 34 in the microstructure 32 must ensure that the first clustering pattern 12 and the second clustering pattern 22 are in contact and connected. Since the first clustering pattern 12 and the first joint portion 15 on the first cover 10 can be integrally formed, for example, the second clustering pattern 22 and the second joint portion 25 on the second cover 20 can also be integrally formed. The first and second joining portions 15, 25 are connected via an adhesive layer 40, preventing dimensional tolerances of the first or second joining portions 15, 25 from affecting the contact connection between the first and second clustering patterns 12, 22. In one embodiment, the heights of the first and second joining portions 15, 25 can be, for example, smaller than the first height H1 of the first protruding stripes 12a and the second height H2 of the second protruding stripes 22a. The adhesive layer 40 adjusts the height difference to ensure contact connection between the first and second clustering patterns 12, 22. Furthermore, compared to high-temperature, high-pressure assembly methods involving diffusion welding and brazing, in this embodiment, the assembly of the first and second covers 10, 20 via the adhesive layer 40 can be performed at lower temperatures, resulting in shorter processing times and lower energy consumption. Furthermore, it avoids oxidation caused by high-temperature, high-pressure assembly, effectively ensuring contact connection between the first and second protruding stripes 12a, 22a, on the first and second covers 10, 20, and thus maintaining the overall performance of the thin vapor chamber structure 1b. In this embodiment, the adhesive layer 40 may be, for example, at least one selected from the group consisting of glue, adhesive, tape, adhesive, and epoxy resin, but the present invention is not limited thereto.

[0077] On the other hand, in order to improve the efficiency of assembling the first cover 10 and the second cover 20 via the adhesive layer 40 , the shapes of the first joint portion 15 and the second joint portion 25 can be adjusted according to application requirements. 19A to 19D This is a schematic diagram showing different implementations of the cover assembly in the thin heat spreader structure of this case. Figure 19A As shown, the first joint portion 15 of the first cover 10a is further provided with a recessed area 151, and the adhesive layer 40 is at least partially accommodated in the recessed area 151, thereby increasing the contact area between the adhesive layer 40 and the first joint portion 15, thereby improving the efficiency of the adhesive layer 40 in assembling the first cover 10a and the second cover 20. As shown in FIG. 19B , the first joint portion 15 of the first cover 10b is further provided with a recessed area 151a, such as a groove, and the adhesive layer 40 is at least partially accommodated in the recessed area 151a, thereby increasing the contact area between the adhesive layer 40 and the first joint portion 15, thereby improving the efficiency of the adhesive layer 40 in assembling the first cover 10b and the second cover 20. As shown in FIG. 19C , the first joint portion 15 of the first cover 10a is further provided with a recessed area 151, and the second joint portion 25 of the second cover 20a is further provided with a recessed area 251, wherein the recessed area 151 of the first joint portion 15 is opposite to the recessed area 251 of the second joint portion 25, and the adhesive layer 40 is at least partially accommodated in the recessed areas 151 and 251, thereby increasing the contact area between the adhesive layer 40 and the first joint portion 15 and the second joint portion 25, thereby improving the efficiency of the adhesive layer 40 in assembling the first cover 10a and the second cover 20a. Figure 19D As shown, the first joining portion 15 of the first cover 10b is further provided with a recessed area 151a, such as a groove, and the second joining portion 25 of the second cover 20b is also provided with a recessed area 251a, such as a groove. The recessed area 151a of the first joining portion 15 and the recessed area 251a of the second joining portion 25 are opposite each other, and the adhesive layer 40 is at least partially accommodated in the recessed areas 151a and 251a. This increases the contact area between the adhesive layer 40 and the first joining portion 15 and the second joining portion 25, thereby improving the efficiency of the adhesive layer 40 in assembling the first cover 10b and the second cover 20b. Of course, in other embodiments, the first joining portion 15 and the second joining portion 25 can each be provided with a structure that increases their surface area, such as a rough surface or a notched structure, to further improve the efficiency of the adhesive layer 40 in assembling the first cover 10 and the second cover 20. This is not limited to this embodiment and will not be further described.

[0078] In summary, this invention provides a thin vapor chamber structure. By utilizing clustered patterns on two covers, the structure is assembled and connected to form a microstructure with at least one microchannel. This provides the capillary action required for liquid fluids, such as those flowing from the condensation zone to the evaporation zone, effectively reducing interference between the liquid fluid and the vapor fluid flowing from the evaporation zone to the condensation zone. Capillary action refers to the smoothness of the evaporation and condensation cycles of fluids (including vapor and liquid phases). Factors that influence the effectiveness of capillary action include flow resistance and capillary force. Because the raised stripes on the two covers are arranged in different directions, the overlapping and contacting raised stripes on the two covers form microchannels that zigzag across the surfaces of the two covers, increasing the fluid flow distance. This allows the liquid phase to flow back from the condensation zone to the evaporation zone through the continuous microchannels. The walls of the raised stripes provide the capillary action required for the fluid to flow back from the condensation zone to the evaporation zone. The flow resistance and capillary force are inversely proportional to the height of the raised stripes on the two covers, directly proportional to the width of the raised stripes on the two covers, and inversely proportional to the distance between adjacent raised stripes on the two covers, thereby controlling the efficiency of the fluid flow back from the condensation zone to the evaporation zone. Furthermore, the effectiveness of the capillary action can be adjusted by varying the height, width, and distance between adjacent raised stripes, regardless of the planar dimensions of the two covers. Furthermore, the microchannels of the microstructures maintain communication with the flow channels located between the microstructures, ensuring that the flows of liquid and gas phases in the microchannels and flow channels, respectively, do not interfere with each other. In this way, fluids, such as the vapor phase formed by evaporation from the evaporation zone and the liquid phase formed by condensation from the condensation zone, can flow through the flow channels and microchannels, respectively, effectively reducing interference caused by their relative flow and preventing the dispersion of fluid droplets that could affect the vapor chamber's performance. Because the clustering patterns on the two covers each have protruding stripes arranged in different directions, when the two covers are assembled, the protruding stripes on the two covers contact and connect, thereby forming microchannels that zigzag between the two covers. To match the corresponding condensation and evaporation zones of the thin vapor chamber structure during use, the clustering patterns on the two covers can adjust the length, width, or end shape of the protruding stripes. The density of the protruding stripes within the clustering pattern can also be varied to meet actual application requirements, increasing product diversity. On the other hand, in addition to being assembled by diffusion welding or brazing, the two covers can also be assembled by an adhesive layer to facilitate the contact connection of the protruding stripes on the two covers, simplifying the process time, reducing energy consumption, and avoiding oxidation caused by high-temperature and high-pressure assembly, which affects the contact connection of the protruding stripes on the two covers and further affects the overall performance of the thin heat spreader structure.

[0079] This case is free to be modified by those skilled in the art, but all modifications shall not deviate from the scope of protection sought by the attached patent application.

Claims

1. A thin heat spreader structure, comprising: A first cover having a first surface and a first cluster pattern, wherein the first cluster pattern is disposed on the first surface and has a plurality of first protruding stripes, the plurality of first protruding stripes are spaced apart from each other and extend along a first direction; a second cover having a second surface and a second clustering pattern, wherein the first surface faces the second surface, the first cover and the second cover are assembled to form a receiving space, the first clustering pattern and the second clustering pattern being spatially opposed to each other and connected to form a microstructure, the microstructure dividing the receiving space into at least two flow channels located on two opposite sides of the microstructure, wherein the second clustering pattern is disposed on the second surface and has a plurality of second protruding stripes, the plurality of second protruding stripes being spaced apart and extending along a second direction, the first direction being different from the second direction, wherein the plurality of first protruding stripes and the plurality of second protruding stripes are at least partially in contact with each other, and are assembled to form at least one microchannel connecting the at least two flow channels; as well as A fluid is contained in the accommodating space, wherein when the fluid flows through the at least one micro-channel, the plurality of first protruding stripes and the plurality of second protruding stripes are assembled to generate a capillary force and provide a capillary effect, so that the fluid circulates smoothly in the channel and the micro-channel; The first direction and the second direction form an angle, and the angle ranges from 20° to 160°.

2. The thin vapor chamber structure according to claim 1 , wherein any two adjacent first protruding stripes have a first spacing distance, the first spacing distance ranging from 50 μm to 300 μm, and the capillary force is inversely proportional to the first spacing distance. 3 . The thin vapor chamber structure according to claim 1 , wherein the first protruding stripe has a first height and a first width, the first height ranges from 10 μm to 200 μm, and the first width ranges from 50 μm to 500 μm. 4 . The thin vapor chamber structure as claimed in claim 3 , wherein the capillary force is inversely proportional to the first height of the first protruding stripe, and the capillary force is proportional to the first width of the first protruding stripe. 5 . The thin vapor chamber structure according to claim 1 , wherein any two adjacent second protruding stripes have a second spacing distance, the second spacing distance ranging from 50 μm to 300 μm, and the capillary force is inversely proportional to the second spacing distance. 6 . The thin vapor chamber structure according to claim 1 , wherein the second protruding stripe has a second height and a second width, the second height ranges from 10 μm to 200 μm, and the second width ranges from 50 μm to 500 μm. 7 . The thin vapor chamber structure according to claim 6 , wherein the capillary force is inversely proportional to the second height of the second protruding stripe, and the capillary force is proportional to the second width of the second protruding stripe.

8. The thin vapor chamber structure as described in claim 1 further includes an evaporation zone and a condensation zone, wherein the first clustering pattern has at least two groups of first clustering patterns, and the second clustering pattern has at least two groups of second clustering patterns, wherein the at least two groups of first clustering patterns are connected to the at least two groups of second clustering patterns to form the microstructure, which is located in the evaporation zone and the condensation zone, wherein the at least two groups of first clustering patterns are spaced apart from each other in the condensation zone and converge in the evaporation zone, and wherein the at least two groups of second clustering patterns are spaced apart from each other in the condensation zone and converge in the evaporation zone.

9. The thin vapor chamber structure of claim 1 , wherein the first protruding stripe and the second protruding stripe each have a first end and a second end, and the first end and the second end are each selected from any one of the group consisting of a plane, an inclined surface, a curved surface, a triangular surface, and an irregular surface.

10. The thin vapor chamber structure as described in claim 1, wherein the first cover has a first joint portion arranged around the outer periphery of the first cover, and the second cover has a second joint portion arranged around the outer periphery of the second cover and spatially opposite to the first joint portion, wherein the first joint portion is connected to the second joint portion so that the first cover and the second cover are assembled to form the accommodating space. 11 . The thin vapor chamber structure according to claim 10 , further comprising an adhesive layer disposed between the first joint portion and the second joint portion. 12 . The thin vapor chamber structure according to claim 11 , wherein at least one of the first joint portion and the second joint portion has at least one recessed area, and the adhesive layer is at least partially accommodated in the recessed area. 13 . The thin vapor chamber structure according to claim 11 , wherein the adhesive layer is selected from at least one of the group consisting of adhesive and tape; or the adhesive layer is selected from epoxy resin.

14. A thin temperature distribution plate structure, comprising: a first cover having a first surface and a first cluster pattern, wherein the first cluster pattern is disposed on the first surface and has a plurality of first protruding stripes, the plurality of first protruding stripes are spaced apart from each other and extend along a first direction; and a second cover having a second surface and a second clustering pattern, wherein the first surface faces the second surface, and the first cover and the second cover are assembled to form a receiving space, wherein the second clustering pattern is disposed on the second surface and has a plurality of second protruding stripes, the plurality of second protruding stripes being spaced apart and extending along a second direction, the first direction and the second direction being different, wherein the first clustering pattern and the second clustering pattern are spatially opposed to each other and contactingly connected to form a microstructure, wherein the microstructure divides the receiving space into at least two flow channels located on two opposite sides of the microstructure, and the sidewalls of the plurality of first protruding stripes and the sidewalls of the plurality of second protruding stripes form at least one microchannel that zigzags between the first surface and the second surface; When a fluid flows through the at least one microchannel, the plurality of first protruding stripes and the plurality of second protruding stripes are assembled to generate a capillary force and provide a capillary effect, so that the fluid circulates smoothly in the channel and the microchannel; The first direction and the second direction form an angle, and the angle ranges from 20° to 160°.

15. The thin vapor chamber structure as described in claim 14 further includes an evaporation zone and a condensation zone, wherein the fluid comprises a gas phase fluid and a liquid phase fluid, the liquid phase fluid evaporates into the gas phase fluid in the evaporation zone, the gas phase fluid flows through the flow channel to the condensation zone and condenses into the liquid phase fluid, and the liquid phase fluid flows through the at least one microchannel to the evaporation zone.

16. The thin vapor chamber structure of claim 14 , wherein the first cover has a first joint portion arranged around the outer periphery of the first cover, wherein the second cover has a second joint portion arranged around the outer periphery of the second cover and spatially opposite to the first joint portion, wherein the first joint portion is connected to the second joint portion, and the plurality of first protruding stripes of the first clustering pattern are in contact and connected with the plurality of second protruding stripes of the second clustering pattern to form the microstructure. 17 . The thin vapor chamber structure according to claim 16 , further comprising an adhesive layer disposed between the first joint portion and the second joint portion, wherein the adhesive layer is selected from at least one of the group consisting of adhesive and tape; or the adhesive layer is selected from epoxy resin. 18 . The thin vapor chamber structure according to claim 17 , wherein at least one of the first joint portion and the second joint portion has at least one recessed area, and the adhesive layer is at least partially accommodated in the recessed area.

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