A boss-type hard-soft combination board and its manufacturing method and camera module

Abstract

The present invention belongs to the field of camera technology, and specifically relates to a boss-type rigid-flexible board and its manufacturing method and camera module, including an inner soft board, an upper covering film layer, an upper adhesive sheet, an upper copper foil and an upper ink layer are sequentially arranged on the upper surface of the inner soft board, and a lower covering film layer, a lower adhesive sheet, a lower copper foil and a lower ink layer are sequentially arranged on the lower surface of the inner soft board; an intermediate ink layer is partially arranged on the upper surface of the upper covering film layer, and the upper adhesive sheet, the upper copper foil and the upper ink layer are all convex upward after being pressed together, and a boss is formed on the upper surface of the upper ink layer; the photosensitive chip of the camera module is arranged on one side of the boss. The present invention designs a boss at a local position on the chip packaging surface of the boss-type rigid-flexible board, so that the lens base and the lens assembly are packaged on the surface of the rigid-flexible board in an inclined manner, so that the scanning and recognition clear range of the camera installed on the smart desk lamp falls entirely within the effective area of ​​learning.

Description

Technical Field

[0001] The invention belongs to the field of camera technology, and in particular relates to a boss-type hard-soft combination board and a manufacturing method thereof, and a camera module. Background Art

[0002] At present, camera modules are increasingly used in products in the electronics industry, from single mobile phones and cameras to current computers, televisions, drones, security monitoring, car-mounted, cash registers, face recognition and other electronic devices. Camera modules are needed; the more perfect the functional characteristics of electronic products, the more requirements are placed on the module cameras needed. The mainstream smart learning lamps on the market are also equipped with cameras that can scan, identify and upload various texts and pictures. In order to avoid occupying space, the cameras installed on the structure of smart learning lamps are tilted to the top of the lamps, but the lens and photosensitive chip of the camera module are packaged horizontally on the surface of the circuit board. The depth of field of the overall imaging surface is evenly distributed parallel to the module installation surface, resulting in the imaging depth of field surface and the desktop not being on the same plane. The image clarity range of the camera's scanning and recognition cannot partially cover the area where the photographed data is studied, so the image captured by the camera is partially blurred, affecting the user experience. How to solve this problem is a difficulty faced by the entire smart lamp industry. Summary of the invention

[0003] In order to overcome the shortcomings of the above-mentioned prior art, the purpose of the present invention is to provide a convex platform type soft-hard combination board and its manufacturing method and camera module, which can make the scanning and recognition clear range of the camera on the smart learning desk lamp consistent with the effective learning area of ​​personnel.

[0004] To achieve the above-mentioned purpose, the technical solution of the present invention is a boss-type hard-flex board, comprising an inner soft board, an upper covering film layer, an upper bonding sheet, an upper copper foil and an upper ink layer are sequentially arranged on the upper surface of the inner soft board, and a lower covering film layer, a lower bonding sheet, a lower copper foil and a lower ink layer are sequentially arranged on the lower surface of the inner soft board; an intermediate ink layer is partially arranged on the upper surface of the upper covering film layer, and the upper bonding sheet, the upper copper foil and the upper ink layer at the position corresponding to the intermediate ink layer are all convex upward after being pressed together, and a boss is formed on the upper surface of the upper ink layer.

[0005] Furthermore, the thickness of the intermediate ink layer is 20-40 μm.

[0006] Furthermore, the thickness of the upper ink layer is 20-30 μm, and the thickness of the lower ink layer is 20-30 μm.

[0007] Furthermore, the upper bonding sheet, the upper copper foil and the upper ink layer are hollowed out at positions corresponding to the bending areas and connected to form an upper groove; the lower bonding sheet, the lower copper foil and the lower ink layer are hollowed out at positions corresponding to the bending areas and connected to form a lower groove; the upper groove and the lower groove are symmetrically arranged.

[0008] Furthermore, the bottom of the upper groove and the bottom of the lower groove are both paved with electromagnetic shielding films.

[0009] Furthermore, the inner layer flexible board includes a double-sided copper foil FCCL, and a second circuit layer and a third circuit layer are respectively provided on the upper surface and the lower surface of the double-sided copper foil FCCL.

[0010] Furthermore, a first circuit layer is provided on the upper surface of the upper copper foil, and a fourth circuit layer is provided on the lower surface of the lower copper foil.

[0011] Furthermore, holes are drilled at corresponding positions of the inner soft board, the upper covering film layer, the upper bonding sheet, the upper copper foil, the lower covering film layer, the lower bonding sheet and the lower copper foil and connected to form a via hole for connecting each circuit layer, and the inner wall of the via hole is provided with a copper plating layer.

[0012] The present invention also provides a camera module, including a lens assembly, a lens base, a photosensitive chip and the above-mentioned boss-type hard-soft combination board; the photosensitive chip is arranged on the top surface of the boss-type hard-soft combination board and is located on one side of the boss; the lens base is arranged above the photosensitive chip, and one side of the lens base is encapsulated on the top surface of the boss-type hard-soft combination board, and the other side is encapsulated on the boss; the lens assembly is installed on the lens base.

[0013] The present invention also provides a method for manufacturing the above-mentioned boss-type rigid-flexible board, comprising the following steps:

[0014] 1) Making an inner layer soft board, and making a second circuit layer and a third circuit layer on the upper surface and the lower surface of the inner layer soft board respectively;

[0015] 2) A cover film is pasted on the upper surface of the second circuit layer and the lower surface of the third circuit layer to form an upper cover film layer and a lower cover film layer, and the inner core board is made by pressing and curing.

[0016] 3) Printing an intermediate ink layer at a local position on the upper surface of the upper covering film layer of the inner core board;

[0017] 4) An upper bonding sheet and a lower bonding sheet are respectively attached to the upper surface of the upper covering film layer and the lower surface of the lower covering film layer, and the positions of the upper bonding sheet and the lower bonding sheet corresponding to the bending area of ​​the product have been hollowed out in advance;

[0018] 5) The upper copper foil and the lower copper foil are respectively attached to the upper surface of the upper bonding sheet and the lower surface of the lower bonding sheet, and then the whole is pressed and cured together to obtain a semi-finished rigid-flex board;

[0019] 6) Drill via holes connecting each circuit layer on the semi-finished rigid-flex board, and deposit copper on the inner wall of the via hole;

[0020] 7) Copper plating is performed on the semi-finished rigid-flex board to form a copper plating layer on the inner wall of the via hole and the upper and lower surfaces of the rigid-flex board;

[0021] 8) The first circuit layer and the fourth circuit layer are respectively manufactured on the upper copper foil and the lower copper foil of the semi-finished rigid-flexible board to obtain a four-layer rigid-flexible circuit board;

[0022] 9) Printing an upper ink layer and a lower ink layer on the upper surface of the first circuit layer and the lower surface of the fourth circuit layer respectively;

[0023] 10) Complete the subsequent processing steps of the rigid-flexible board to obtain the finished product of the boss-type rigid-flexible board.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] (1) The present invention designs a boss at a local position on the boss-type rigid-flexible board chip packaging surface, so that the lens base and lens assembly of the camera module are packaged on the rigid-flexible board surface in an inclined manner, and the clear range of camera scanning and recognition is adjusted, so that the clear range of scanning and recognition of the camera installed on the smart desk lamp falls entirely within the effective learning area, thereby improving the user experience;

[0026] (2) The present invention partially prints a 20-40 μm thick intermediate ink layer on the surface of the upper covering film layer of the inner core board, and after the copper foil and the upper adhesive sheet are attached to the board surface, the whole board is cured by pressure transfer, so that a locally protruding boss can be formed on the surface of the semi-finished hard-flex board, and the product yield is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 A schematic diagram of the structure of a boss-type rigid-flex board provided in an embodiment of the present invention;

[0029] Figure 2 A schematic diagram of the structure of a camera module provided by an embodiment of the present invention;

[0030] Figure 3 Provide an optical path diagram of a camera module for an embodiment of the present invention;

[0031] Figure 4 It is a structural schematic diagram of a rigid-flex board of a comparative example;

[0032] Figure 5 A schematic diagram of the structure of a camera module for comparison;

[0033] Figure 6 Provide an optical path diagram of the camera module for comparison;

[0034] In the figure: 1, upper ink layer; 2, upper copper foil; 3, upper bonding sheet; 4, middle ink layer; 5, upper covering film layer; 6, inner soft board; 601, second circuit layer; 602, third circuit layer; 603, double-sided copper foil FCCL; 7, lower covering film layer; 8, lower bonding sheet; 9, lower copper foil; 10, lower ink layer; 11, via hole; 100, boss-type hard-soft board; 200, lens assembly; 300, lens base; 400, photosensitive chip. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0037] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features.

[0038] like Figure 1-Figure 2As shown, this embodiment provides a convex platform type rigid-flexible board 100, including an inner layer flexible board 6, on the upper surface of which an upper covering film layer 5, an upper bonding sheet 3, an upper copper foil 2 and an upper ink layer 1 are sequentially arranged, and on the lower surface of which a lower covering film layer 7, a lower bonding sheet 8, a lower copper foil 9 and a lower ink layer 10 are sequentially arranged; on the upper surface of the upper covering film layer 5, an intermediate ink layer 4 is partially arranged, and the upper bonding sheet 3, the upper copper foil 2 and the upper ink layer 1 at the position corresponding to the intermediate ink layer 4 are all convex upward after being pressed together, and a convex platform is formed on the upper surface of the upper ink layer 1. In this embodiment, a convex platform is designed at a local position of the chip packaging surface of the convex platform type rigid-flexible board 100, so that the lens base and lens assembly of the camera module can be fitted and packaged on the surface of the rigid-flexible board in an inclined manner, and by adjusting the clear range of the camera scanning and recognition, the scanning and recognition clear range of the camera installed on the smart desk lamp falls entirely within the effective area of ​​learning, thereby improving the user experience.

[0039] Furthermore, the thickness of the intermediate ink layer 4 is 20-40 μm. Figure 1 As shown, the cross section of the middle ink layer 4 of this embodiment is rectangular, the cross section of the boss is a trapezoid that is smaller at the top and larger at the bottom, and the thickness of the boss is 20-40 μm.

[0040] Furthermore, the thickness of the upper ink layer is 20-30 μm, and the thickness of the lower ink layer is 20-30 μm.

[0041] Furthermore, the upper bonding sheet 3, the upper copper foil 2 and the upper ink layer 1 are hollowed out at positions corresponding to the bending areas and connected to form an upper groove; the lower bonding sheet 8, the lower copper foil 9 and the lower ink layer 10 are hollowed out at positions corresponding to the bending areas and connected to form a lower groove; the upper groove and the lower groove are symmetrically arranged. Figure 1 As shown, in this embodiment, the layers above the upper surface of the upper covering film layer 5 and the layers below the lower surface of the lower covering film layer 7 are hollowed out at the position where the hard-flex board needs to be bent, forming symmetrical upper and lower grooves, so that the hard-flex board has better flexibility in the soft board area.

[0042] Furthermore, the bottom of the upper groove and the bottom of the lower groove are both paved with electromagnetic shielding films.

[0043] Furthermore, the inner layer soft board 6 comprises a double-sided copper foil FCCL603, and a second circuit layer 601 and a third circuit layer 602 are respectively provided on the upper surface and the lower surface of the double-sided copper foil FCCL603. Furthermore, a first circuit layer is provided on the upper surface of the upper copper foil 2, and a fourth circuit layer is provided on the lower surface of the lower copper foil 9. In this embodiment, the inner layer soft board 6 preferably adopts a double-sided copper foil FCCL603, and a second circuit layer 601 and a third circuit layer 602 are respectively made on the upper and lower surfaces thereof, and a first circuit layer and a fourth circuit layer are respectively made on the upper surface of the upper copper foil 2 and the lower surface of the lower copper foil 9, to form a four-layer hard-flex board.

[0044] Furthermore, holes are drilled at corresponding positions of the inner soft board 6, the upper cover film layer 5, the upper bonding sheet 3, the upper copper foil 2, the lower cover film layer 7, the lower bonding sheet 8 and the lower copper foil 9 to form a via hole 11 for connecting each circuit layer, and the inner wall of the via hole 11 is provided with a copper plating layer. In this embodiment, the first circuit layer, the second circuit layer 601, the third circuit layer 602 and the fourth circuit layer of the four-layer hard-flex board are connected through the via hole 11, and the via hole 11 has a conductive ability after copper deposition and copper plating.

[0045] like Figure 2 As shown, the present embodiment further provides a camera module, including a lens assembly 200, a lens base 300, a photosensitive chip 400 and the above-mentioned boss-type hard-soft board 100; the photosensitive chip 400 is arranged on the top surface of the boss-type hard-soft board 100 and is located on one side of the boss; the lens base 300 is arranged above the photosensitive chip 400, and one side of the lens base 300 is encapsulated on the top surface of the boss-type hard-soft board 100, and the other side is encapsulated on the boss; the lens assembly 200 is mounted on the lens base 300. The above-mentioned lens assembly 200, lens base 300, and photosensitive chip 400 are assembled to the hard board area of ​​the boss-type hard-soft board 100 according to the manufacturing process of the camera module. The assembled camera module is as shown in FIG. Figure 2 As shown, one side of the lens base 300 is packaged on the boss, and the other side is packaged on the side of the boss away from the soft board area, so that the lens assembly 200 is packaged on the surface of the boss-type soft-hard board 100 in an inclined manner; the power test effect of the assembled camera module product is verified, such as Figure 3 As shown, S2 is the clear depth of field area, c1-d1 position is the clear area of ​​the learning material photographed by the camera, and a-c1 and d1-e1 positions are the blurred areas of the learning material photographed by the camera.

[0046] Figure 4Schematic diagram of the structure of the rigid-flexible board of the comparative example; the structure of the rigid-flexible board of the comparative example is similar to the boss-type rigid-flexible board 100 of the present embodiment, but does not include the intermediate ink layer 4 and the corresponding boss, and is assembled using the same camera module manufacturing process. The assembled camera module is as shown in FIG. Figure 5 As shown in FIG. 1 , the lens base and lens assembly of the camera module are horizontally packaged on the surface of the rigid-flex board; the power test effect of the assembled camera module product is verified, as shown in FIG. Figure 6 As shown, S2 is the clear depth of field area, the cd position is the clear area of ​​the learning material photographed by the camera, and the ac and de positions are the blurred areas of the learning material photographed by the camera.

[0047] according to Figure 1-Figure 6 It can be seen that after the lens base 300 and the lens assembly 200 are encapsulated in an inclined manner on the surface of the raised platform hard-soft combination board 100 of this embodiment to form a camera module, the clear range of the learning materials photographed by the camera module all falls within the effective area of ​​​​learning, which can effectively solve the problem of the small overlap between the scanning and recognition clear range of the camera on the smart learning desk lamp and the effective area of ​​​​personnel learning, thereby improving the user experience.

[0048] This embodiment also provides a method for manufacturing the above-mentioned boss-type rigid-flexible board, comprising the following steps:

[0049] 1) Making an inner layer soft board 6, and respectively making a second circuit layer 601 and a third circuit layer 602 on the upper surface and the lower surface of the inner layer soft board 6 by exposure, development, and etching methods, and punching a target hole for lamination and positioning on the inner layer soft board 6;

[0050] 2) A cover film is pasted on the upper surface of the second circuit layer 601 and the lower surface of the third circuit layer 602 of the inner soft board 6 after the target hole is punched to form an upper cover film layer 5 and a lower cover film layer 7, which are pressed and cured to form an inner core board;

[0051] 3) Printing a 20-40 μm intermediate ink layer 4 at a local position on the upper surface of the upper covering film layer 5 of the inner core board;

[0052] 4) The upper adhesive sheet 3 and the lower adhesive sheet 8 are respectively attached to the upper surface of the upper covering film layer 5 and the lower surface of the lower covering film layer 7, and the positions of the upper adhesive sheet 3 and the lower adhesive sheet 8 corresponding to the bending area of ​​the product have been hollowed out in advance;

[0053] 5) The upper copper foil 2 and the lower copper foil 9 are respectively attached to the upper surface of the upper bonding sheet 3 and the lower surface of the lower bonding sheet 8, and the upper copper foil 2, the upper bonding sheet 3, the inner layer soft board 6, the lower bonding sheet 8, and the lower copper foil 9 are stacked and pressure-cured together in order from top to bottom to obtain a semi-finished hard-soft board; through overall pressure-curing, the upper copper foil 2 and the upper bonding sheet 3 are both convex upward at the position corresponding to the middle ink layer 4, and a partially protruding boss is formed on the upper surface of the semi-finished hard-soft board;

[0054] 6) Drilling via holes 11 connecting each circuit layer on the semi-finished rigid-flex board, and depositing copper on the inner wall of the via hole 11;

[0055] 7) Copper plating is performed on the semi-finished rigid-flex board to form a copper plating layer on the inner wall of the via hole 11 and the upper and lower surfaces of the rigid-flex board; the copper thickness of the via hole 11 is: single point>15μm, average ≥18μm;

[0056] 8) The first circuit layer and the fourth circuit layer are respectively manufactured on the upper copper foil 2 and the lower copper foil 9 of the semi-finished rigid-flexible board to obtain a four-layer rigid-flexible circuit board;

[0057] 9) Printing an upper ink layer 1 and a lower ink layer 10 on the upper surface of the first circuit layer and the lower surface of the fourth circuit layer of the four-layer rigid and flexible circuit board respectively;

[0058] 10) Complete the subsequent processing steps of the rigid-flexible board production board, complete the subsequent processing steps of the rigid-flexible board, and obtain the finished product of the boss-type rigid-flexible board; quality inspection and storage.

[0059] The performance of the finished product of the boss-type rigid-flex board 100 manufactured by the manufacturing method of this embodiment was verified, and the results showed that the performance tests of the finished product of the boss-type rigid-flex board 100 were qualified, and the trial production yield could reach more than 95%, meeting the manufacturability requirements.

[0060] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A boss-type rigid-flexible board, characterized in that: It comprises an inner soft board, wherein an upper covering film layer, an upper bonding sheet, an upper copper foil and an upper ink layer are sequentially arranged on the upper surface of the inner soft board, and a lower covering film layer, a lower bonding sheet, a lower copper foil and a lower ink layer are sequentially arranged on the lower surface of the inner soft board; an intermediate ink layer is partially arranged on the upper surface of the upper covering film layer, and the upper bonding sheet, the upper copper foil and the upper ink layer at positions corresponding to the intermediate ink layer are all convex upward after being pressed together, and a boss is formed on the upper surface of the upper ink layer; the thickness of the intermediate ink layer is 20-40 μm; the thickness of the upper ink layer is 20-30 μm, and the thickness of the lower ink layer is 20-30 μm.

2. A boss-type rigid-flexible board as claimed in claim 1, characterized in that: The positions of the upper bonding sheet, the upper copper foil and the upper ink layer corresponding to the bending areas are hollowed out and connected to form an upper groove; the positions of the lower bonding sheet, the lower copper foil and the lower ink layer corresponding to the bending areas are hollowed out and connected to form a lower groove; the upper groove and the lower groove are symmetrically arranged.

3. A boss-type rigid-flexible board as claimed in claim 2, characterized in that: The groove bottom of the upper groove and the groove bottom of the lower groove are both paved with electromagnetic shielding films.

4. The boss-type rigid-flexible board according to claim 1, characterized in that: The inner layer flexible board comprises a double-sided copper foil FCCL, and a second circuit layer and a third circuit layer are respectively arranged on the upper surface and the lower surface of the double-sided copper foil FCCL.

5. The boss-type rigid-flexible board according to claim 4, characterized in that: A first circuit layer is arranged on the upper surface of the upper copper foil, and a fourth circuit layer is arranged on the lower surface of the lower copper foil.

6. The boss-type rigid-flexible board according to claim 5, characterized in that: The inner soft board, the upper covering film layer, the upper bonding sheet, the upper copper foil, the lower covering film layer, the lower bonding sheet and the lower copper foil are drilled at corresponding positions and connected to form a via hole for connecting each circuit layer, and the inner wall of the via hole is provided with a copper plating layer.

7. A camera module, characterized in that: It comprises a lens assembly, a lens base, a photosensitive chip and a boss-type hard-soft combination board as described in any one of claims 1 to 6; the photosensitive chip is arranged on the top surface of the boss-type hard-soft combination board and is located on one side of the boss; the lens base is arranged above the photosensitive chip, and one side of the lens base is encapsulated on the top surface of the boss-type hard-soft combination board, and the other side is encapsulated on the boss; the lens assembly is mounted on the lens base.

8. A method for manufacturing a boss-type rigid-flexible board according to any one of claims 1 to 6, characterized in that: The steps include: 1) manufacturing an inner layer flexible board, wherein the inner layer flexible board includes a double-sided copper foil FCCL, and manufacturing a second circuit layer and a third circuit layer on the upper surface and the lower surface of the double-sided copper foil FCCL respectively; 2) A cover film is pasted on the upper surface of the second circuit layer and the lower surface of the third circuit layer to form an upper cover film layer and a lower cover film layer, and the inner core board is made by pressing and curing. 3) Printing an intermediate ink layer at a local position on the upper surface of the upper covering film layer of the inner core board; 4) An upper bonding sheet and a lower bonding sheet are respectively attached to the upper surface of the upper covering film layer and the lower surface of the lower covering film layer, and the positions of the upper bonding sheet and the lower bonding sheet corresponding to the bending area of ​​the product have been hollowed out in advance; 5) Laying the upper copper foil and the lower copper foil on the upper surface of the upper bonding sheet and the lower surface of the lower bonding sheet respectively, and then pressurizing and curing the whole together to obtain a semi-finished rigid-flex board; 6) Drilling via holes connecting each circuit layer on the semi-finished rigid-flex board, and depositing copper on the inner wall of the via hole; 7) Copper plating is performed on the semi-finished rigid-flex board to form a copper plating layer on the inner wall of the via hole and the upper and lower surfaces of the rigid-flex board; 8) Making the first circuit layer and the fourth circuit layer on the upper copper foil and the lower copper foil of the semi-finished rigid-flexible board, respectively, to obtain a four-layer rigid-flexible circuit board; 9) printing an upper ink layer and a lower ink layer on the upper surface of the first circuit layer and the lower surface of the fourth circuit layer respectively; 10) Complete the subsequent processing steps of the rigid-flexible board to obtain a finished product of a boss-type rigid-flexible board.

Images