Plasma processing device and mounting table for plasma processing device

Abstract

The present invention provides a plasma processing device and a carrier for the plasma processing device that can easily replace consumable parts of the plasma processing device. The carrier for the plasma processing device includes a wafer loading surface, a ring loading surface, lift pins, and a drive mechanism. The wafer loading surface is used to load a wafer. The ring loading surface is used to load a first ring and a second ring. The second ring is arranged on the outer periphery of the first ring and is arranged at a position that does not overlap with the first ring in the vertical direction. The ring loading surface has a hole at a position corresponding to the boundary between the first ring and the second ring. The ring loading surface is arranged on the outer periphery of the wafer loading surface. The lift pin has a first retaining portion and a second retaining portion. The second retaining portion is connected to the first retaining portion in the axial direction of the first retaining portion, and the second retaining portion has a protrusion that protrudes from the outer periphery of the first retaining portion. The lift pin can be received in the hole of the ring loading surface in such a manner that the first retaining portion is located on the side of the ring loading surface. The drive mechanism is used to drive the lift pin to be raised and lowered.

Description

Technical Field

[0001] The present invention relates to a plasma processing device and a mounting table for the plasma processing device. Background Art

[0002] In systems that process substrates such as semiconductor wafers using plasma, an annular member is sometimes disposed near the radially outer edge of the substrate in order to adjust the plasma etching rate and / or etching profile.

[0003] For example, in the substrate processing system disclosed in Patent Document 1, an edge connecting ring is positioned adjacent to the radially outer edge of a pedestal within a processing chamber. This edge connecting ring is eroded by plasma during etching. Therefore, Patent Document 1 employs a structure that allows the edge connecting ring to be raised by an actuator and replaced by a robotic arm.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2016-146472 Summary of the Invention

[0007] Technical problem to be solved by the invention

[0008] The present invention provides a technology that can easily replace consumable parts of a plasma processing apparatus.

[0009] Means for solving technical problems

[0010] The mounting table and plasma processing apparatus of the present invention include a wafer mounting surface, a ring mounting surface, a lifting pin, and a drive mechanism. The wafer mounting surface is used to mount a wafer. The ring mounting surface is used to mount a first ring and a second ring. The second ring is arranged on the outer peripheral side of the first ring and is arranged at a position that does not overlap with the first ring in the vertical direction. The ring mounting surface has a hole at a position corresponding to the boundary between the first ring and the second ring. The ring mounting surface is provided on the outer peripheral side of the wafer mounting surface. The lifting pin has a first holding portion and a second holding portion. The second holding portion is connected to the first holding portion in the axial direction of the first holding portion, and the second holding portion has a protrusion protruding from the outer periphery of the first holding portion. The lifting pin can be accommodated in the hole of the ring mounting surface in such a manner that the first holding portion is located on the side of the ring mounting surface. The drive mechanism is used to drive the lifting pin to be able to be raised and lowered.

[0011] Effects of the Invention

[0012] According to the present invention, consumable parts of a plasma processing apparatus can be easily replaced. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1It is a cross-sectional view showing a schematic structure of a plasma processing apparatus according to an embodiment.

[0014] Figure 2 It is a cross-sectional view showing a schematic structure of a conveying mechanism according to the embodiment.

[0015] Figure 3A This is a diagram showing an example of a state at the start of conveyance of an edge ring by the conveyance mechanism according to the embodiment.

[0016] Figure 3B This is a diagram showing an example of a state in which the edge ring is lifted by the conveying mechanism according to the embodiment.

[0017] Figure 3C This is a diagram showing an example of a state before an edge ring lifted by the conveying mechanism according to the embodiment is placed on a robot arm.

[0018] Figure 3D This is a diagram showing an example of a state in which an edge ring lifted by the conveying mechanism according to the embodiment is placed on a robot arm.

[0019] Figure 4A This is a diagram showing an example of a state at the start of conveyance of a cover ring by the conveyance mechanism according to the embodiment.

[0020] Figure 4B This is a diagram showing an example of a state in which a cover ring is lifted by the conveying mechanism according to the embodiment.

[0021] Figure 4C This is a diagram showing an example of a state before a cover ring lifted by the conveying mechanism according to the embodiment is placed on a robot arm.

[0022] Figure 4D This is a diagram showing an example of a state in which a cover ring lifted by the conveying mechanism according to the embodiment is placed on a robot arm.

[0023] Figure 5A This is a diagram showing a second state example at the start of conveyance of a cover ring by the conveyance mechanism according to the embodiment.

[0024] Figure 5B This is a diagram showing a second example of a state in which the cover ring is lifted by the conveying mechanism according to the embodiment.

[0025] Figure 5C This is a diagram showing a second state example before the cover ring lifted by the conveying mechanism according to the embodiment is placed on the robot arm.

[0026] Figure 5D FIG2 is a diagram showing an example of a state in which the cover ring lifted by the conveying mechanism according to the embodiment is placed on the robot arm.

[0027] Figure 6This is a diagram for explaining the relationship between the length of each part of the lift pin, the conveying height, and the thickness of the cover ring.

[0028] Figure 7 A flowchart showing an example of the flow of a transport process performed by the transport mechanism according to the embodiment.

[0029] Description of Reference Numerals

[0030] 1 Plasma processing apparatus, 10 Processing container, 11 Susceptor (lower electrode), 12 Cylindrical holding member, 13 Cylindrical support member, 14 Exhaust path, 15 Baffle, 16 Exhaust port, 17 Exhaust pipe, 18 Exhaust device, 19 Inlet / outlet port, 20 Gate valve, 21a First high-frequency power source, 21b Second high-frequency power source, 22 Matching element, 23 Power supply rod, 24 Shower head, 25 Electrostatic chuck, 25a Center portion, 25b Inner circumference, 25c Outer Peripheral part, 25d, 25e electrode plates, 26, 28 DC power supply, 27, 29 switches, 35a, 35b heat transfer gas supply part, 36a gas supply line for wafer, 36b gas supply line for ring, 43 control part, 50 conveying mechanism, 51 lifting pin, 51a first holding part, 51b second holding part, 51c protrusion, 52 sealing part, 53 driving mechanism, 63, 64 holes, CR cover ring, ER edge ring, W wafer. DETAILED DESCRIPTION

[0031] A plurality of consumable components are arranged in a plasma processing apparatus. For example, there is an edge ring arranged radially outward of the wafer to improve the uniformity of plasma processing within the wafer surface. In addition, there is a cover ring arranged radially outward of the edge ring to protect the mounting table. When a dedicated conveying mechanism is provided for each of the consumable components in order to replace the plurality of consumable components, the internal structure of the mounting table becomes complicated. In addition, due to the limited space in the plasma processing apparatus, the position and size of the mechanism that can be arranged inside or below the mounting table are limited. Therefore, it is desirable to use a structure that is as compact as possible to convey the consumable components arranged in the plasma processing apparatus.

[0032] The following describes an embodiment of the present invention in detail based on the accompanying drawings. This embodiment is not restrictive and the various embodiments can be combined as appropriate within the scope of not causing conflicts in the processing contents.

[0033] (Implementation Method)

[0034] Figure 1 It is a cross-sectional view showing a schematic structure of a plasma processing apparatus 1 according to an embodiment. Figure 1The plasma processing apparatus 1 includes a safely grounded cylindrical processing container 10 made of metal, such as aluminum or stainless steel. A circular susceptor (lower electrode) 11 is disposed within the processing container 10 for mounting a wafer W, serving as a target object (substrate). The susceptor 11 is made of, for example, aluminum and is supported by a cylindrical support portion 13 extending vertically upward from the bottom of the processing container 10 via an insulating cylindrical holding member 12.

[0035] An exhaust path 14 is formed between the sidewall of the processing container 10 and the cylindrical support portion 13. An annular baffle 15 is disposed at the entrance or midway of the exhaust path 14. An exhaust port 16 is provided at the bottom of the exhaust path 14. An exhaust device 18 is connected to the exhaust port 16 via an exhaust pipe 17. Furthermore, a gate valve 20 is mounted on the sidewall of the processing container 10 for opening and closing a wafer W loading and unloading port 19.

[0036] The first and second high-frequency power supplies 21a and 21b are electrically connected to the base 11 via a matching device 22 and a power supply rod 23. Here, the first high-frequency power supply 21a is mainly used to output a first high frequency (usually above 40 MHz) that helps generate plasma. The second high-frequency power supply 21b is mainly used to output a second high frequency (usually below 13.56 MHz) that helps introduce ions to the wafer W on the base 11. The matching device 22 contains: a first matching device for matching the impedance of the first high-frequency power supply 21a side with the impedance of the load (mainly electrodes, plasma, and processing container 10); and a second matching device for matching the impedance of the second high-frequency power supply 21b side with the impedance of the load side. In addition, the voltage that helps introduce ions is not limited to high frequency. It can also be a DC voltage applied in a pulsed form. In addition, in Figure 1 1 and 2 show an example in which the first and second high-frequency power supplies 21a and 21b are connected to the susceptor 11, but the present invention is not limited thereto. Alternatively, the first high-frequency power supply may be connected to the shower head 24 (upper electrode) described later, and the second high-frequency power supply may be connected to the susceptor 11.

[0037] A shower head 24 serving as an upper electrode at a ground potential, described later, is disposed on the top of the processing chamber 10. Therefore, high-frequency voltages can be applied between the susceptor 11 and the shower head 24 from the first and second high-frequency power supplies 21a and 21b.

[0038] An electrostatic chuck 25 capable of attracting a wafer W using electrostatic attraction is disposed on the upper surface of the susceptor 11. The electrostatic chuck 25 comprises a disk-shaped center portion 25a for mounting the wafer W, an annular inner portion 25b, and an annular outer portion 25c. The center portion 25a protrudes upward in the figure relative to the inner and outer portions 25b and 25c. The inner and outer portions 25b and 25c are substantially flush with each other. The center portion 25a is an example of a wafer mounting surface for mounting the wafer W. The inner portion 25b is an example of a ring mounting surface for mounting the edge ring ER. The outer portion 25c is an example of a ring mounting surface for mounting the cover ring CR. Hereinafter, the structure for mounting the wafer W, including the susceptor 11 and the electrostatic chuck 25, will be referred to as a mounting table.

[0039] The edge ring ER is an annular component formed of a conductive material such as silicon. The edge ring ER has the function of making the plasma distribution within the wafer surface during plasma processing uniform, thereby improving the performance of the plasma processing. The cover ring CR is an annular component formed of an insulating material such as quartz. The cover ring CR has the function of protecting the base 11, the electrostatic chuck 25, etc. On the outer diameter side of the cover ring CR, an insulating component 30 is provided to protect the base 11. The edge ring ER is an example of a first ring. The cover ring CR is an example of a second ring. The first ring and the second ring are made of different materials, for example, as described above. The edge ring ER and the cover ring CR will be further described later.

[0040] The central portion 25a of the electrostatic chuck 25 can be formed by sandwiching an electrode plate 25d formed of a conductive film between a dielectric film. Furthermore, the inner peripheral portion 25b can be formed by sandwiching an electrode plate 25e formed of a conductive film between a dielectric film. A DC power supply 26 is electrically connected to the electrode plate 25d via a switch 27. A DC power supply 28 is electrically connected to the electrode plate 25e via a switch 29. Thus, the electrostatic chuck 25 can generate electrostatic force such as Coulomb force by applying a voltage from the DC power supply 26 to the electrode plate 25d, thereby adsorbing and holding the wafer W on the electrostatic chuck 25 using this electrostatic force. Furthermore, the electrostatic chuck 25 can generate electrostatic force such as Coulomb force by applying a voltage from the DC power supply 28 to the electrode plate 25e, thereby adsorbing and holding the edge ring ER on the electrostatic chuck 25 using this electrostatic force.

[0041] Furthermore, a refrigerant chamber 31, for example, extending in a circumferential direction, is provided inside the susceptor 11. A refrigerant, such as cooling water, at a predetermined temperature is circulated from a refrigeration unit 32 via pipes 33 and 34 into the refrigerant chamber 31. The temperature of the wafer W on the electrostatic chuck 25 is controlled by the temperature of the refrigerant.

[0042] The heat transfer gas supply unit 35a is connected to the electrostatic chuck 25 via a wafer gas supply line 36a. The heat transfer gas supply unit 35b is connected to the electrostatic chuck 25 via a ring gas supply line 36b. The wafer gas supply line 36a reaches the center portion 25a of the electrostatic chuck 25. The ring gas supply line 36b reaches the inner peripheral portion 25b of the electrostatic chuck 25. Alternatively, a common heat transfer gas supply unit may be connected to both the wafer gas supply line 36a and the ring gas supply line 36b. The heat transfer gas supply unit 35a can supply heat transfer gas to the space between the center portion 25a of the electrostatic chuck 25 and the wafer W via the wafer gas supply line 36a. Furthermore, the heat transfer gas supply unit 35b can supply heat transfer gas to the space between the inner peripheral portion 25b of the electrostatic chuck 25 and the edge ring ER via the ring gas supply line 36b. A heat transfer gas having thermal conductivity, such as He gas, is preferably used as the heat transfer gas.

[0043] The top showerhead 24 includes an electrode plate 37 having a plurality of gas vents 37a on its lower surface and an electrode support 38 for detachably supporting the electrode plate 37. A buffer chamber 39 is provided within the electrode support 38, and a gas supply pipe 41 from a process gas supply unit 40 is connected to a gas inlet 38a of the buffer chamber 39.

[0044] Each component of the plasma processing apparatus, such as the exhaust device 18, high-frequency power supplies 21a and 21b, switches 27 and 29 for the electrostatic chuck, DC power supplies 26 and 28, a cooling unit 32, heat transfer gas supply units 35a and 35b, and a processing gas supply unit 40, is connected to a control unit 43. The control unit 43 is used to control each component of the plasma processing apparatus.

[0045] The control unit 43 includes a central processing unit (CPU) and a storage device such as a memory (not shown), and can execute desired processing in the plasma processing apparatus by reading and executing programs and processing recipes stored in the storage device.

[0046] In addition, the control unit 43 and the conveying mechanism 50 (see Figure 2 The control unit 43 can control the conveying mechanism 50 to execute a process for conveying the edge ring ER and the cover ring CR.

[0047] (An example of the conveying mechanism 50)

[0048] Figure 2This is a cross-sectional view schematically illustrating the structure of a transport mechanism 50 according to an embodiment. The plasma processing apparatus according to the embodiment includes a transport mechanism 50 for transporting edge rings ER and cover rings CR placed on a mounting table. The transport mechanism 50 includes lift pins 51, a sealing portion 52, and a drive mechanism 53.

[0049] exist Figure 2 In the example shown, a wafer W is placed on the center portion 25a of the electrostatic chuck 25, and an edge ring ER is placed on the inner peripheral portion 25b. A cover ring CR is placed on the outer peripheral portion 25c. When positioned on the stage, the outer peripheral surface of the edge ring ER faces the inner peripheral surface of the cover ring CR with a predetermined gap therebetween. Although not shown in the drawings, a positioning structure may be provided, for example, on the portions where the inner peripheral surface of the cover ring CR faces the outer peripheral surface of the edge ring ER. For example, interengaging recesses and projections may be provided on the inner peripheral portion 25b, the outer peripheral portion 25c, and the surfaces of the edge ring ER and cover ring CR facing each other.

[0050] The electrostatic chuck 25 has a hole 63 formed at a position straddling the boundary between the inner peripheral portion 25b and the outer peripheral portion 25c. The hole 63 vertically penetrates the electrostatic chuck 25. The hole 63 has a substantially circular cross-section. Furthermore, a hole 64 is formed in the base 11 so as to communicate with the hole 63.

[0051] Lift pin 51 is housed within holes 63 and 64 and connected to drive mechanism 53 at its lower end. Hereinafter, the end of lift pin 51 connected to drive mechanism 53 is referred to as the base end, and the end of lift pin 51 opposite the base end is referred to as the distal end (or top end). Seal portion 52 is disposed within hole 64. Lift pin 51 extends downward through seal portion 52. Seal portion 52 prevents communication between the space above seal portion 52 and the space below seal portion 52 within holes 63 and 64. Seal portion 52 may be, for example, a shaft seal or bellows.

[0052] The driving mechanism 53 is used to move the lifting pin 51 up and down. The type of the driving mechanism 53 is not particularly limited. The driving mechanism 53 is, for example, a piezoelectric actuator, a motor, or the like.

[0053] The lift pin 51 has a first holding portion 51a and a second holding portion 51b. The first holding portion 51a is provided at the distal end of the lift pin 51. The first holding portion 51a is formed to a predetermined length L1 (see FIG. 1 ) from the distal end (upper end) of the lift pin 51. Figure 6The second retaining portion 51b is provided on the base end side of the lift pin 51. The second retaining portion 51b is connected to the axial base end side of the first retaining portion 51a. The second retaining portion 51b is formed to have a larger cross-sectional area than the first retaining portion 51a. Therefore, the second retaining portion 51b is formed with a protrusion 51c that protrudes from the outer periphery of the first retaining portion 51a. The protrusion 51c refers to the portion of the distal end surface of the second retaining portion 51b that forms a surface capable of retaining the edge ring ER or the cover ring CR.

[0054] The second retaining portion 51b has a cross-section that fits within the hole 63 with a predetermined clearance. When the lift pin 51 is positioned within the hole 63, the cross-section of the second retaining portion 51b, when projected upward, overlaps portions of both the edge ring ER and the cover ring CR. On the other hand, when the lift pin 51 is in the first position, the cross-section of the first retaining portion 51a overlaps only portions of the edge ring ER. When the lift pin 51 is in the second position, the cross-section of the first retaining portion 51a overlaps only portions of the cover ring CR. For example, the first retaining portion 51a is positioned toward the center of the electrostatic chuck 25 in the first position. The first retaining portion 51a is positioned toward the outer periphery of the electrostatic chuck 25 in the second position. For example, the second position is the position obtained by rotating the lift pin 51 180 degrees about its axis from the first position.

[0055] The specific shapes of the first retaining portion 51a and the second retaining portion 51b are not particularly limited. For example, the first retaining portion 51a may be a rod with a semicircular cross-section, and the second retaining portion 51b may be a rod with a circular cross-section approximately twice the cross-section of the first retaining portion 51a. Furthermore, the top cross-sections of the first retaining portion 51a and the second retaining portion 51b are each sized to independently support the edge ring ER and the cover ring CR.

[0056] The first retaining portion 51a and the second retaining portion 51b may have polygonal cross-sections. The ratio of the cross-sectional areas of the first retaining portion 51a and the second retaining portion 51b is not particularly limited. However, the distal end surfaces of the first retaining portion 51a and the distal end surfaces of the second retaining portion 51b are configured to satisfy the following conditions.

[0057] (1) When the lift pin 51 at the first position is raised, the distal end surface of the first holding portion 51 a comes into contact with only the edge ring ER.

[0058] (2) When the lift pin 51 at the first position is raised, the distal end surface of the second holding portion 51 b comes into contact with only the cover ring CR.

[0059] (3) When the lift pins 51 at the first position are raised, first, the first holding portion 51 a comes into contact with the edge ring ER, and then, the second holding portion 51 b comes into contact with the cover ring CR.

[0060] (4) When the lift pin 51 at the second position is raised, the distal end surface of the first holding portion 51 a comes into contact with only the cover ring CR.

[0061] (5) When the lift pin 51 at the second position is raised, the distal end surface of the second holding portion 51 b abuts only against the edge ring ER.

[0062] (6) When the lift pins 51 at the second position are raised, first, the first holding portion 51 a comes into contact with the cover ring CR, and then, the second holding portion 51 b comes into contact with the edge ring ER.

[0063] (Example of transporting edge ring ER)

[0064] Next, refer to Figures 3A to 3D The conveyance of the edge ring ER by the conveyance mechanism 50 of the embodiment will be described. Figures 3A to 3D In the example of FIG. 5 , the transport mechanism 50 arranges the lift pins 51 at the first position to transport the edge ring ER. Figure 3A 1 is a diagram showing an example of a state at the start of conveyance of the edge ring ER by the conveyance mechanism 50 according to the embodiment.

[0065] like Figure 3A As shown, the lifting pin 51 is housed in the holes 63 and 64 except when transporting. Figure 3A In the example shown in FIG, the distal ends of the lift pins 51 are in contact with the lower surface of the edge ring ER. However, the lift pins 51 may be stored in a position where they do not contact the edge ring ER.

[0066] Figure 3B This figure shows an example of a state in which the edge ring ER is lifted by the conveying mechanism 50 of the embodiment. When conveying the edge ring ER, the drive mechanism 53 first drives the lift pins 51 to lift it upward. As the lift pins 51 rise, the distal ends of the first retaining portions 51a first reach the loading table and abut against the bottom surface of the edge ring ER. As the lift pins 51 rise further, they separate the edge ring ER from the inner circumference 25b of the electrostatic chuck 25 and lift it upward. The drive mechanism 53 raises the distal ends of the lift pins 51 to a predetermined first conveying height H1. The first conveying height H1 will be described further below.

[0067] Figure 3CThis diagram illustrates an example of a state before the edge ring ER, lifted by the transport mechanism 50 of the embodiment, is placed on the robot arm AM. After the lift pins 51 lift the edge ring ER to the first transport height H1, the controller 43 causes the transport robot arm AM to enter the susceptor 11 from outside the processing chamber 10. The robot arm AM advances horizontally with its upper surface positioned at a height H2 below the first transport height H1. When the robot arm AM is positioned below the edge ring ER lifted by the lift pins 51, the drive mechanism 53 begins to lower the lift pins 51. As the lift pins 51 descend, the edge ring ER, held by the lift pins 51, is placed on the upper surface of the robot arm AM.

[0068] Figure 3D This figure shows an example of a state in which the edge ring ER, lifted by the transport mechanism 50 according to the embodiment, is placed on the robot arm AM. After the edge ring ER is placed on the robot arm AM, the lift pins 51 continue to descend from a height H2. Then, when the lift pins 51 are received in the holes 63 and 64, the controller 43 moves the robot arm AM, carrying the edge ring ER, out of the processing chamber 10.

[0069] (Conveyance of Cover Ring CR)

[0070] Next, refer to Figures 4A to 4D The conveyance of the cover ring CR by the conveyance mechanism 50 of the embodiment will be described. Figures 4A to 4D In the example of FIG. 5 , the transport mechanism 50 arranges the lift pins 51 at the first position to transport the cover ring CR. Figure 4A 1 and 2 are diagrams showing an example of a state at the start of conveyance of the cover ring CR by the conveyance mechanism 50 according to the embodiment.

[0071] Figure 4A The cover ring CR is carried out in the state where the wafer W and the edge ring ER are not placed on the stage. The lift pins 51 are placed at the first position.

[0072] Figure 4BThis figure shows an example of a state in which the cover ring CR is lifted by the conveying mechanism 50 of the embodiment. Unlike when conveying an edge ring ER, when conveying a cover ring CR, the drive mechanism 53 raises the distal ends of the lift pins 51 to a second conveying height H3, which is higher than the first conveying height H1. As the drive mechanism 53 gradually raises the lift pins 51, the first holding portion 51a first passes over the placement table, and then the distal end surface of the second holding portion 51b contacts the bottom surface of the cover ring CR. Further raising the lift pins 51 while the distal end surface of the second holding portion 51b contacts the bottom surface of the cover ring CR, separates the cover ring CR from the outer peripheral portion 25c of the electrostatic chuck 25, and lifts it upward. The drive mechanism 53 continues to raise the distal ends of the lift pins 51 to the second conveying height H3. As a result, the distal ends of the second holding portion 51b, i.e., the bottom surface of the cover ring CR, are located at the first conveying height H1.

[0073] Figure 4C This figure shows an example of a state before the cover ring CR, which has been lifted by the conveying mechanism 50 of the embodiment, is placed on the robot arm AM. After the lift pins 51 raise the cover ring CR to the first conveying height H1, the control unit 43 causes the conveying robot arm AM to enter the base 11 from outside the processing container 10. The robot arm AM advances horizontally so that the upper surface of the robot arm AM is located at a height H2 below the first conveying height H1. When the robot arm AM is positioned below the cover ring CR lifted by the lift pins 51, the drive mechanism 53 begins to lower the lift pins 51. The lift pins 51 descend, and when the distal end surface of the second holding portion 51b reaches the height H2, the cover ring CR held by the lift pins 51 is placed on the robot arm AM.

[0074] Figure 4D This figure shows an example of a state in which the cover ring CR, lifted by the transport mechanism 50 according to the embodiment, is placed on the robot arm AM. After the cover ring CR is placed on the robot arm, the lift pins 51 further descend, and the distal end surface of the first holding portion 51a moves downward from a height H2. Then, when the lift pins 51 are received within the holes 63 and 64, the controller 43 moves the robot arm AM, carrying the cover ring CR, out of the processing chamber 10.

[0075] As described above, in the conveying mechanism 50 of the embodiment, the lift pin 51 is positioned in the first position so that the lift pin 51's lift amount differs when conveying the edge ring ER and when conveying the cover ring CR. Thus, the conveying mechanism 50 can use the same lift pin 51 to convey both the edge ring ER and the cover ring CR. To this end, the lift pin 51 is composed of a first retaining portion 51a and a second retaining portion 51b. The second retaining portion 51b has a larger cross-section than the first retaining portion 51a. The second retaining portion 51b is located at the base end of the first retaining portion 51a and protrudes circumferentially from the first retaining portion 51a. Furthermore, a hole 63 is provided in the mounting table surface at a position corresponding to the boundary between the edge ring ER and the cover ring CR placed on the mounting table.

[0076] (Edge ring ER and cover ring CR are delivered simultaneously)

[0077] but, Figures 3A to 3D and Figures 4A to 4D The edge ring ER and the cover ring CR are conveyed separately, but the present invention is not limited thereto, and the conveying mechanism 50 may simultaneously lift the edge ring ER and the cover ring CR and deliver them to the robot arm AM.

[0078] For example, in Figure 4A In the process, the conveying process is started in a state where not only the cover ring CR but also the edge ring ER is placed on the electrostatic chuck 25. Then, at the moment when the distal end of the first holding portion 51a reaches the placement table, first, the edge ring ER is lifted by the distal end surface of the first holding portion 51a. When the lifting pin 51 continues to rise, then, the distal end surface of the second holding portion 51b abuts against the lower surface of the cover ring CR. Then, by further rising the lifting pin 51, the edge ring ER and the cover ring CR can be lifted simultaneously in a state where the edge ring ER is supported by the first holding portion 51a and the cover ring CR is supported by the second holding portion 51b (see FIG. 5 ). Figure 4B ). In this state, the robot arm AM is moved into the processing container 10. Then, first, the distal end surface of the second holding portion 51b is lowered to a height H2. The cover ring CR is placed on the robot arm AM. At this moment, the robot arm AM is temporarily retracted to the outside of the processing container 10, and the cover ring CR is sent out. Then, the robot arm AM is moved into the processing container 10 again. Then, the lift pins 51 are further lowered. The edge ring ER is maintained in a state supported on the first holding portion 51a of the lift pins 51. When the distal end surface of the first holding portion 51a is lowered to a height H2, the edge ring ER is placed on the robot arm AM. The lift pins 51 are further lowered, and the lift pins 51 are stored in the hole 63. Then, the robot arm AM is retracted to the outside of the processing container 10, and the edge ring ER is sent out.

[0079] As described above, the transport mechanism 50 can simultaneously lift the cover ring CR and the edge ring ER using the lift pins 51 and deliver them. Therefore, this embodiment eliminates the time required to raise and lower the lift pins from their storage positions each time consumable parts are delivered, reducing the time required for transport processing.

[0080] (Conveyance of Cover Ring CR When Lifting Pins Are in the Second Position)

[0081] Next, refer to Figures 5A to 5D Another example of conveying the cover ring CR by the conveying mechanism 50 of the embodiment will be described. Figures 5A to 5D In the example of FIG. 5 , the transport mechanism 50 arranges the lift pins 51 at the second position to transport the cover ring CR. Figure 5A This is a diagram showing a second state example at the start of conveyance of the cover ring CR by the conveyance mechanism 50 according to the embodiment.

[0082] Figure 5A The feeding of the cover ring CR shown can also be performed when the wafer W and the edge ring ER are placed on the stage. Figure 5A The figure shows a state where the wafer W and the edge ring ER are not placed on the stage. The lift pins 51 are placed at the second position, and the first holding portion 51a is placed at the position from which the wafer W and the edge ring ER are placed. Figure 3A The state is rotated 180 degrees.

[0083] Figure 5B 1 is a diagram showing a state example 2 in which the cover ring CR is lifted by the conveying mechanism 50 of the embodiment. Figure 4B ), when the lift pins 51 are in the second position, the drive mechanism 53 raises the distal ends of the lift pins 51 to the first transport height H1, which is lower than the second transport height H3. As the lift pins 51 rise, the distal ends of the first retaining portions 51a contact the bottom surface of the cover ring CR. As the lift pins 51 continue to rise, the cover ring CR moves away from the loading table. As a result, the distal ends of the first retaining portions 51a, i.e., the bottom surface of the cover ring CR, rise to the first transport height H1.

[0084] Figure 5CThe figure shows a state example 2 before the cover ring CR, which has been lifted by the conveying mechanism 50 of the embodiment, is placed on the robot AM. After the lift pins 51 raise the cover ring CR to the first conveying height H1, the control unit 43 causes the conveying robot AM to enter the base 11 from outside the processing container 10. The robot AM advances in the horizontal direction so that the upper surface of the robot AM is located at a height H2 below the first conveying height H1. When the robot AM is positioned below the cover ring CR lifted by the lift pins 51, the drive mechanism 53 begins to lower the lift pins 51. The lift pins 51 descend, and when the distal end surface of the first holding portion 51a reaches the height H2, the cover ring CR held by the lift pins 51 is placed on the robot AM.

[0085] Figure 5D This figure shows a second state example in which the cover ring CR, lifted by the transport mechanism 50 according to the embodiment, is placed on the robot arm AM. After the cover ring CR is placed on the robot arm, the lift pins 51 further descend, and the distal end surface of the first holding portion 51a moves downward from a height H2. Then, when the lift pins 51 are received within the holes 63 and 64, the controller 43 moves the robot arm AM, carrying the cover ring CR, out of the processing chamber 10.

[0086] As described above, the transport mechanism 50 of the embodiment can perform a lifting operation after positioning the lift pins 51 in two different positions: the first position and the second position. Therefore, when only the cover ring CR is to be transported, the transport mechanism 50 can position the lift pins 51 in the second position, thereby reducing the amount of lift pin 51 movement and transporting the cover ring CR. Consequently, the transport mechanism 50 can reduce the time required for the lift pins 51 to move upward and downward, thereby reducing downtime of the plasma processing apparatus.

[0087] Furthermore, according to the conveyance mechanism 50 of the present embodiment, when the edge ring ER and the cover ring CR are placed on the mounting table, the time required to convey the other after moving one can be omitted.

[0088] Figure 6 1 is a diagram for explaining the relationship between the length of each part of the lift pin 51, the conveying height, and the thickness of the cover ring CR. Figure 6 In the description, the first conveying height H1 and the second conveying height H3 are described with the height of the upper surface of the inner peripheral portion 25b and the outer peripheral portion 25c of the electrostatic chuck 25 as the reference plane. First, the length L1 of the first holding portion 51a is made substantially the same as the first conveying height H1 ( Figure 6 (a)). The second conveying height H3 is approximately twice the first conveying height H1. When the driving mechanism 53 uses the distal end surface of the first holding portion 51a to hold and convey the cover ring CR or edge ring ER, the distal end of the first holding portion 51a is raised to the first conveying height H1 ( Figure 6 (b)). In addition, when the cover ring CR is held and conveyed by the distal end surface of the second holding portion 51b, the distal end of the first holding portion 51a is raised to the second conveying height H3 ( Figure 6 (c)). Figure 6 In the example, the length L1 of the first holding portion 51a is set to be approximately the same as the first conveying height H1. Furthermore, the second conveying height H3 is set to be approximately twice the first conveying height. In this embodiment, by setting the lift pins 51 in the first position, the control method can be made the same when conveying the edge ring ER and the cover ring CR.

[0089] In this embodiment, when the lift pins 51 are positioned at the first position, the cover ring CR and the edge ring ER may be raised simultaneously. Therefore, the lengths of the first holding portion 51a and the second holding portion 51b are set so that when the lift pins 51 are raised to the first transport height H1 and then lowered to deliver the cover ring CR, they do not interfere with the edge ring ER. Figure 6 (d) shows the state where the edge ring ER and the cover ring CR are lifted simultaneously by the lift pins 51. The distal end surface of the first holding portion 51a is located at the second conveying height H3. The distal end surface of the second holding portion 51b is located at the first conveying height H1. When the conveying mechanism 50 delivers the cover ring CR while holding the edge ring ER on the lift pins 51, the lift pins 51 are lowered to Figure 6 The height shown in (e). The distal end of the first holding portion 51a is located at the first conveying height H1. On the other hand, the cover ring CR is held on the upper surface of the robot arm AM which is arranged at the height H2. At this time, when the thickness of the cover ring CR is greater than the difference between the first conveying height H1 and the height H2, the conveyed cover ring CR may collide with the edge ring ER held by the first holding portion 51a. Therefore, Figure 6 In the example, the difference between the first conveying height H1 and the height H2 is set to be greater than the thickness of the cover ring CR. When the conveying mechanism 50 places the lifting pin 51 at the second position and raises the cover ring CR, the first holding portion 51a is raised to the first conveying height H1 and conveyed in the same manner as when the cover ring CR is at the first position (see FIG. Figure 6 (f)).

[0090] In this embodiment, the heights (H1, H3) at which the lift pins 51 stop during transport, the entry height (H2) of the robot arm AM, and the length (L1) of the first holding portion 51a are set as described above. Therefore, when the lift pins 51 are positioned at the first position and when the lift pins 51 are positioned at the second position, there is no need to change the position at which the lift pins 51 are raised and stopped, and transport can be achieved with a simple motion using the transport mechanism 50. Furthermore, according to this embodiment, there is no need to change the height of the robot arm AM depending on the type of consumable part being transported, and different consumable parts can be transported using the same motion. As described above, by adopting the solution of the embodiment, multiple consumable parts can be easily transported using a single transport mechanism 50.

[0091] However, the dimensions of the various parts of the lift pins 51 and the lift amount during transport are not limited to the above dimensions and lift amounts. The dimensions of the various parts of the lift pins 51 and the lift amount during transport can be adjusted according to the dimensions of the various parts of the components placed on the stage and the performance of the robot arm AM.

[0092] (Flow of transport processing)

[0093] However, the cover ring CR and edge ring ER have different levels of wear and replacement frequency. The edge ring ER is located closer to the wafer W and is more susceptible to the effects of plasma, and its wear significantly impacts processing performance. Compared to the edge ring ER, the cover ring CR wears more slowly and has a lower impact on processing performance. Therefore, multiple edge rings ER are often replaced during the time it takes to replace a single cover ring CR. Therefore, replacement times for the cover ring CR and edge ring ER can be pre-set and stored in the control unit 43, etc., so that when the replacement time arrives, the conveying mechanism 50 automatically conveys them. Furthermore, it can be pre-set whether the lift pins 51 are positioned in the first or second position during the conveying process at each replacement time.

[0094] For example, a setting can be set such that after replacing the edge ring ER four times, the cover ring CR is replaced once. In this case, the lift pins 51 can be placed in the first position when replacing the edge ring ER. When replacing the cover ring CR, the lift pins 51 can be placed in the second position. Alternatively, for example, a setting can be set such that after replacing the edge ring ER four times, both the edge ring ER and the cover ring CR are replaced once. In this case, the lift pins 51 can be placed in the first position to perform all five replacements.

[0095] Figure 7 This is a flowchart showing an example of the flow of a conveying process performed by the conveying mechanism of the embodiment. Figure 7 In the example, a control unit 43 (refer to Figure 1) Controls the replacement of both the edge ring ER and the cover ring CR. The control unit 43 stores a flow of the conveying process in advance.

[0096] First, the execution time of the transport process arrives. The method by which the control unit 43 detects the arrival of the execution time is not particularly limited. For example, the control unit 43 may detect the arrival of the execution time through input by the operator. Alternatively, the control unit 43 may determine that the execution time has arrived when a predetermined time has arrived.

[0097] The control unit 43 determines whether the edge ring ER and the cover ring CR are to be delivered simultaneously (step S700). If the determination is that they are to be delivered simultaneously ("Yes" in step S700), the control unit 43 controls the conveying mechanism 50 to position the lift pins 51 at the first position (step S710). The control unit 43 then raises the distal ends of the lift pins 51 to the second conveying height H3 (step S711). As the lift pins 51 are raised to the second conveying height H3, the first retaining portion 51a first contacts the edge ring ER, raising the edge ring ER. Furthermore, the second retaining portion 51b contacts the cover ring CR, raising the cover ring CR.

[0098] The control unit 43 controls the robot arm AM to enter the processing container 10 and arranges the robot arm AM below the cover ring CR (see FIG. Figure 4C ). The control unit 43 then gradually lowers the lift pins 51 to the first transport height H1 (step S712). The cover ring CR is then placed on the robot arm AM. At this point, the control unit 43 retracts the robot arm AM outside the processing chamber 10. The robot arm AM transports the cover ring CR outside the processing chamber 10.

[0099] Next, the control unit 43 controls the robot arm AM again to enter the processing container 10 and disposes the robot arm AM below the edge ring ER (see FIG. Figure 3C ). Then, the control unit 43 further lowers the lift pins 51 to the retracted position (step S713). While the lift pins 51 are lowering, the edge ring ER is placed on the robot arm AM. The control unit 43 further lowers the lift pins 51 to the retracted position (inside the mounting table). The control unit 43 retracts the robot arm AM, which is carrying the edge ring ER, out of the processing container 10. The robot arm AM delivers the edge ring ER out of the processing container 10.

[0100] On the other hand, when it is determined in step S700 that the edge ring ER and the cover ring CR are not sent out simultaneously ("No" in step S700), the control unit 43 determines whether only the edge ring ER is replaced (step S720). When it is determined that only the edge ring ER is replaced ("Yes" in step S720), the control unit 43 arranges the lifting pin 51 at the first position (step S721). Then, the control unit 43 raises the distal end of the lifting pin 51 to the first conveying height H1 (step S722). The first holding portion 51a of the lifting pin 51 contacts the edge ring ER in the middle of the rise, causing the edge ring ER to rise (refer to Figure 3B The control unit 43 controls the robot arm AM to enter the processing container 10 and arranges the robot arm AM below the edge ring ER (see Figure 3C ). The control unit 43 then gradually lowers the lift pins 51. The edge ring ER is then placed on the robot arm AM. The control unit 43 further lowers the lift pins 51 to the retracted position (step S723). The control unit 43 then controls the robot arm AM to retract it outside the processing chamber 10. The robot arm AM then transports the edge ring ER outside the processing chamber 10.

[0101] On the other hand, when it is determined in step S720 that only the edge ring ER is not to be replaced ("No" in step S720), the control unit 43 determines whether only the cover ring CR is to be replaced (step S730). When it is determined that only the cover ring CR is to be replaced ("Yes" in step S730), the control unit 43 places the lift pin 51 at the second position (step S731). Then, the control unit 43 raises the distal end of the lift pin 51 to the first conveying height H1 (step S732). The first holding portion 51a of the lift pin 51 abuts against the cover ring CR in the middle of the rise, causing the cover ring CR to rise (refer to Figure 5B The control unit 43 controls the robot arm AM to enter the processing container 10 and arranges the robot arm AM below the cover ring CR (see Figure 5C The control unit 43 then gradually lowers the lift pins 51 to the retracted position (step S733). While the lift pins 51 are lowering, the cover ring CR is placed on the robot arm AM. The control unit 43 further lowers the lift pins 51 to the retracted position. The control unit 43 then controls the robot arm AM to retract it outside the processing chamber 10. The robot arm AM then transports the cover ring CR outside the processing chamber 10.

[0102] On the other hand, if it is determined in step S730 that only the cover ring CR is not replaced ("No" in step S730), the control unit 43 ends the process.

[0103] As described above, according to the plasma processing apparatus 1 of the embodiment, the edge ring ER and the cover ring CR can be transported using the same transport mechanism 50. Furthermore, the transport mechanism 50 can use the same lift pins 51 to transport the edge ring ER and the cover ring CR. Furthermore, the transport mechanism 50 can transport both the edge ring ER and the cover ring CR during a single lift operation of the lift pins 51. Furthermore, the transport mechanism 50 can change the direction of the lift pins 51 between a first position and a second position. Therefore, the transport mechanism 50 can ensure that the lift distances of the lift pins 51 used when transporting the edge ring ER and the cover ring CR are the same. Therefore, the transport mechanism 50 can make the transport time of each consumable component uniform and shorten that time.

[0104] (Consumable parts to be transported)

[0105] In the above embodiment, the conveying mechanism 50 is described as conveying the cover ring CR and the edge ring ER. However, the conveying mechanism 50 is not limited thereto and can be applied to convey multiple parts of any consumable component or multiple consumable components.

[0106] For example, the edge ring ER can be constructed from two components: an inner circumference member and an outer circumference member, with the outer circumference of the inner circumference member contacting the inner circumference of the outer circumference member. A hole can be provided on the mounting table at a position corresponding to the boundary between the inner and outer circumference members. Lift pins can be positioned in the holes of the mounting table so as to be liftable. With this configuration, each component of the edge ring ER can be easily and individually delivered.

[0107] (Variation of the structure of the conveying mechanism)

[0108] In the above embodiment, the number of lift pins 51 is not particularly limited. Providing two or more, preferably three or more, lift pins 51 allows the edge ring ER and cover ring CR to be raised and lowered. Furthermore, a drive mechanism 53 may be provided for each lift pin 51, or a single drive mechanism 53 may be provided for multiple lift pins 51.

[0109] In the above embodiment, to prevent discharge from occurring or becoming intense in the holes 63 and 64 provided in the electrostatic chuck 25 and the susceptor 11, the holes and the mounting table are made to have the same potential. For example, the area surrounding the holes is made of the same metal material as the rest of the mounting table.

[0110] (Effects of the embodiment)

[0111] As described above, the mounting table and plasma processing apparatus according to the embodiment include a wafer mounting surface, a ring mounting surface, lift pins, and a drive mechanism. The wafer mounting surface is used to mount a wafer. The ring mounting surface is used to mount a first ring and a second ring. The second ring is disposed on the outer periphery of the first ring and is positioned so as not to overlap with the first ring in the vertical direction. The ring mounting surface has a hole at a position corresponding to the boundary between the first and second rings. The ring mounting surface is disposed on the outer periphery of the wafer mounting surface. The lift pins have a first retaining portion and a second retaining portion. The second retaining portion is axially connected to the first retaining portion and has a protrusion that protrudes from the outer periphery of the first retaining portion. The lift pins can be received in the hole of the ring mounting surface with the first retaining portion positioned on the ring mounting surface side. The drive mechanism is used to drive the lift pins in a liftable manner. Therefore, according to the embodiment, the first retaining portion and the second retaining portion of a single lift pin can each retain different rings. Therefore, according to the embodiment, consumable parts of the plasma processing apparatus can be easily replaced using a single lift pin. Furthermore, according to embodiments, multiple consumable parts can be easily replaced using a single lift pin, reducing downtime of the plasma processing apparatus. Furthermore, according to embodiments, when two rings are placed on the mounting table, they can be transported without moving the other to replace one. Furthermore, according to embodiments, multiple consumable parts can be replaced using a single lift pin, effectively utilizing space within the mounting table.

[0112] Furthermore, in the mounting table of the embodiment, the first and second holding portions may be coaxial rod-shaped members, with the first holding portion having a smaller cross-sectional area than the second holding portion. Thus, the first holding portion can hold one of the first and second rings, while the protruding portion of the second holding portion can hold the other. Therefore, according to the embodiment, consumable parts can be efficiently transported and replaced.

[0113] In addition, in the mounting table of the embodiment, the lifting pins may be rotatable about the axis. Therefore, according to the embodiment, the object held by the first holding portion can be switched to either the first ring or the second ring to enable feeding and replacement.

[0114] In the mounting table of the embodiment, the second holding portion may have a cross-section that vertically overlaps a portion of each of the first and second rings placed on the ring mounting surface. Alternatively, the first holding portion may have a cross-section that vertically overlaps either the first or second ring placed on the ring mounting surface. Therefore, according to the embodiment, two rings can be selectively fed and replaced using the first and second holding portions.

[0115] In addition, in the mounting table of the embodiment, the first ring and the second ring may be made of different materials. For example, the first ring may be an edge ring, and the second ring may be a cover ring.

[0116] In addition, the mounting table of the embodiment may further include a ring electrostatic chuck and a gas supply mechanism. The ring electrostatic chuck is configured to hold at least one of the first and second rings on the ring mounting surface. The gas supply mechanism is configured to supply a heat transfer gas between the lower surface of at least one of the first and second rings and the ring mounting surface.

[0117] In the mounting platform of the embodiment, the drive mechanism is capable of rotating the lift pins between a first position and a second position. The first position is where the first holding portion is positioned toward the center of the mounting platform. The second position is where the first holding portion is positioned toward the outer periphery of the mounting platform. Furthermore, the drive mechanism is capable of selectively setting the orientation of the lift pins to either the first position or the second position, thereby causing the lift pins to rise and fall.

[0118] Furthermore, in the mounting table of the embodiment, the driving mechanism may be capable of arranging the lift pins at the first position and raising the tops of the lift pins to the first height when conveying the first ring.

[0119] In the mounting table of the embodiment, the drive mechanism may be further capable of arranging the lift pins at the first position and raising the tops of the lift pins to a second height higher than the first height when conveying the first and second rings.

[0120] In the mounting table of the embodiment, the drive mechanism may be further capable of arranging the lift pins at the first position and raising the tops of the lift pins to the second height when conveying the second ring.

[0121] In the mounting table of the embodiment, the drive mechanism may be further capable of arranging the lift pins at the second position and raising the tops of the lift pins to the first height when conveying the second ring.

[0122] In addition, the plasma processing apparatus of the embodiment includes a wafer loading surface, a ring loading surface, a lifting pin, and a driving mechanism. The wafer loading surface is used to load the wafer. The ring loading surface is used to load the first ring and the second ring. The second ring is arranged on the outer peripheral side of the first ring and is arranged at a position that does not overlap with the first ring in the vertical direction. The ring loading surface has a hole at a position corresponding to the boundary between the first ring and the second ring. The ring loading surface is provided on the outer peripheral side of the wafer loading surface. The lifting pin has a first holding portion and a second holding portion. The second holding portion is connected to the first holding portion in the axial direction of the first holding portion, and the second holding portion has a protrusion protruding from the outer periphery of the first holding portion. The lifting pin can be accommodated in the hole of the ring loading surface in such a manner that the first holding portion is located on the side of the ring loading surface. The driving mechanism is used to drive the lifting pin to be raised and lowered.

[0123] The embodiments disclosed herein are to be considered in all respects as illustrative and not restrictive. The embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope of the appended claims and the spirit thereof.

Claims

1. A mounting table for a plasma processing device, characterized in that: include: a wafer mounting surface for mounting a wafer; a ring mounting surface provided on the outer peripheral side of the wafer mounting surface, for mounting a first ring and a second ring, the second ring being arranged on the outer peripheral side of the first ring and at a position not overlapping with the first ring in the vertical direction, the ring mounting surface having a hole at a position corresponding to a boundary between the first ring and the second ring; a lift pin having a first holding portion and a second holding portion, the second holding portion being connected to the first holding portion in an axial direction of the first holding portion, the second holding portion having a protrusion protruding from an outer periphery of the first holding portion, the lift pin being receivable in the hole of the ring mounting surface with the first holding portion positioned on the side of the ring mounting surface; and A driving mechanism for driving the lifting pin in a lifting manner. The second holding portion has a cross section that vertically overlaps with a portion of each of the first ring and the second ring placed on the ring placement surface. The first holding portion has a cross section that vertically overlaps with either the first ring or the second ring placed on the ring placement surface.

2. The mounting table according to claim 1, wherein: The first holding portion and the second holding portion are rod-shaped members, and a cross-sectional area of ​​the first holding portion is smaller than a cross-sectional area of ​​the second holding portion.

3. The mounting table according to claim 1 or 2, wherein: The lift pins are rotatable about an axis.

4. The mounting table according to claim 1 or 2, wherein: The first ring and the second ring are made of different materials.

5. The mounting table according to claim 1 or 2, wherein: Also includes: a ring electrostatic chuck for adsorbing at least one of the first ring and the second ring onto the ring mounting surface; and A gas supply mechanism is configured to supply a heat transfer gas between the lower surface of at least one of the first ring and the second ring and the ring mounting surface.

6. The mounting table according to claim 1 or 2, wherein: The driving mechanism is capable of rotating the lifting pin to: a first position where the first holding portion is arranged on the center side of the mounting table; and a second position where the first holding portion is arranged on the outer periphery side of the mounting table. The driving mechanism can selectively set the orientation of the lift pin to either the first position or the second position to move the lift pin up and down.

7. The mounting table according to claim 6, wherein: The driving mechanism is capable of arranging the lift pins at the first position and raising the tops of the lift pins to a first height when conveying the first ring.

8. The mounting table according to claim 7, wherein: The driving mechanism may further be configured to dispose the lift pins at the first position and raise the tops of the lift pins to a second height higher than the first height when conveying the first ring and the second ring.

9. The mounting table according to claim 7 or 8, wherein: The driving mechanism may further be configured to dispose the lift pins at the first position and raise the tops of the lift pins to a second height higher than the first height when conveying the second ring.

10. The mounting table according to claim 7 or 8, wherein: The driving mechanism may further be configured to dispose the lift pins at the second position and raise the tops of the lift pins to the first height when conveying the second ring.

11. A plasma processing device, characterized in that: include: a wafer mounting surface for mounting a wafer; a ring mounting surface provided on the outer peripheral side of the wafer mounting surface, for mounting a first ring and a second ring, the second ring being arranged on the outer peripheral side of the first ring and at a position not overlapping with the first ring in the vertical direction, the ring mounting surface having a hole at a position corresponding to a boundary between the first ring and the second ring; a lift pin having a first holding portion and a second holding portion, the second holding portion being connected to the first holding portion in an axial direction of the first holding portion, the second holding portion having a protrusion protruding from an outer periphery of the first holding portion, the lift pin being receivable in the hole of the ring mounting surface with the first holding portion positioned on the side of the ring mounting surface; and A driving mechanism for driving the lifting pin in a lifting manner. The second holding portion has a cross section that vertically overlaps with a portion of each of the first ring and the second ring placed on the ring placement surface. The first holding portion has a cross section that vertically overlaps with either the first ring or the second ring placed on the ring placement surface.

Images