Detection method, device and optical detection equipment

Abstract

The present invention relates to the field of semiconductor detection technology, and discloses a detection method, detection device, and optical detection equipment. The detection method includes: controlling a light source to irradiate a light beam toward an object to be detected, the light beam passing through a portion reflected by the object to be detected, passing through a spectroscope, and incident on a first image acquisition device, while part of the light beam is reflected by the spectroscope and incident on a second image acquisition device; obtaining a first image captured by the first image acquisition device based on the incident light beam, and a second image captured by the second image acquisition device based on the incident light beam; performing binary image processing on the first image and the second image respectively; locating a detection area on the first image and the second image after the binary image processing; performing foreign matter detection on the first image after the detection area is located, and performing gold wire detection on the second image after the detection area is located. Through the above-mentioned method, the embodiment of the present invention can detect dust particles or gold wire positions on the surface of semiconductor materials.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of semiconductor detection technology, and in particular to a detection method, device, and optical detection equipment. Background Art

[0002] A chip, also known as a microcircuit, is a component with circuits engraved on the surface of a silicon wafer. With the advancement of semiconductor technology, chip size has become smaller and smaller, and their application in electronic devices has become increasingly widespread. Chips are installed in electronic devices through soldering. Improper soldering can damage the chip, affecting the performance of the electronic device. Therefore, during the production process, chips must be inspected for dust particles and the position, size, and shape of the gold wires on the pins must be checked.

[0003] However, in the process of realizing the present invention, the inventors found that the existing detection method is unable to simultaneously detect the dust particles on the chip and the position, size and shape of the gold wires on the chip. When the chip needs to be detected for dust particles and gold wires, two independent devices at different workstations are required to detect the dust particles and gold wires on the chip respectively, which is very troublesome. Summary of the Invention

[0004] The main technical problem solved by the embodiments of the present invention is to provide a detection method, an apparatus and an optical detection device, which can perform dust particle detection and gold wire detection on chips.

[0005] To solve the above technical problems, the present invention adopts a technical solution: providing a detection method, which is applied to an optical detection device, wherein the optical detection device includes a frame, a first image acquisition device, a second image acquisition device, a spectroscope, and a light source, wherein the first image acquisition device and the second image acquisition device are both arranged on the frame, the optical axis of the second image acquisition device and the optical axis of the first image acquisition device are perpendicular to each other, the spectroscope is arranged on the frame, and the spectroscope is arranged at the intersection of the optical axes of the first image acquisition device and the second image acquisition device, and the light source is arranged on the frame, including:

[0006] Controlling the light source to irradiate a light beam toward the object to be tested, wherein the light beam is partially reflected by the object to be tested, passes through the beam splitter, and is incident on the first image acquisition device, and partially reflected by the beam splitter to the second image acquisition device;

[0007] Acquire a first image captured by the first image acquisition device according to the incident light beam, and a second image captured by the second image acquisition device according to the incident light beam;

[0008] performing binary image processing on the first image and the second image respectively;

[0009] Performing detection area positioning on the first image and the second image after binary image processing;

[0010] Foreign matter detection is performed on the first image after the detection area is positioned, and gold line detection is performed on the second image after the detection area is positioned.

[0011] Optionally, the first image acquisition device includes a first camera, a first lens and a first light source. Along the optical axis of the first camera, the first lens is arranged in front of the first camera, the spectrometer is arranged in front of the first lens, the first light source is mounted on the frame and the first light source is used to illuminate the object to be measured along the optical axis of the first image acquisition device.

[0012] Optionally, the method includes:

[0013] Scaling the pixel values ​​of the first image and the second image respectively to obtain a first scaled image and a second scaled image;

[0014] Scanning the first scaled image and the second scaled image in rows and columns respectively to obtain the color value of each coordinate of the first scaled image and the second scaled image;

[0015] Adding a first mark to coordinates in the first scaled image whose color values ​​are within a preset range, and adding a second mark to coordinates outside the preset range; and adding a first mark to coordinates in the second scaled image whose color values ​​are within a preset range, and adding a second mark to coordinates outside the preset range;

[0016] The step of performing binary image processing on the first image and the second image respectively includes performing image binarization processing on the first scale image and the second scale image to which the first mark and the second mark are attached, to obtain a first binary image and a second binary image.

[0017] Optionally, performing detection area positioning on the first image and the second image after binary image processing includes:

[0018] The first image after image processing is matched with a preset template to determine the detection area of ​​the first image after image processing, and the second image after image processing is matched with a preset template to determine the detection area of ​​the second image after image processing.

[0019] Optionally, the performing foreign object detection on the first image after positioning the detection area includes:

[0020] After the detection area is located, the first image is subjected to contour extraction calculation to detect the contour of the foreign body in the area.

[0021] Optionally, the step of performing foreign object detection on the first image after positioning the detection area further includes:

[0022] Extracting the foreign body contour from the first image after positioning the detection area;

[0023] Calculating a first similarity between the obtained foreign body contour and a preset foreign body contour;

[0024] Determining whether the first similarity is greater than a preset threshold;

[0025] If yes, it is determined that there is a foreign object in the object to be tested;

[0026] If not, it is determined that there is no foreign matter in the object to be tested.

[0027] Optionally, the step of performing gold line detection on the second image after positioning the detection area further includes:

[0028] Extracting the gold wire outline from the second image after positioning the detection area;

[0029] Calculating a second similarity between the obtained gold line profile and a preset gold line profile;

[0030] Determining whether the second similarity is greater than a preset threshold;

[0031] If yes, it is determined that the gold wire of the object to be tested is qualified;

[0032] If not, it is determined that the gold wire of the tested object is unqualified.

[0033] Optionally, controlling the light source to irradiate a light beam toward the object to be tested includes:

[0034] The light source is controlled to irradiate a light beam containing a first color and a second color toward the object to be tested, wherein the light beam of the first color reflected by the object to be tested passes through the spectroscope and is incident on the first image acquisition device, and the light beam of the second color reflected by the object to be tested is reflected by the spectroscope to the second image acquisition device.

[0035] The present invention further provides an embodiment of an optical detection device, comprising:

[0036] a control module, configured to control the light source to irradiate a light beam toward the object to be tested, wherein the light beam is partially reflected by the object to be tested, passes through the beam splitter, and is incident on the first image acquisition device, and partially reflected by the beam splitter to the second image acquisition device;

[0037] an acquisition module, configured to acquire a first image acquired by the first image acquisition device according to the incident light beam, and a second image acquired by the second image acquisition device according to the incident light beam;

[0038] a processing module, configured to perform binary image processing on the first image and the second image respectively;

[0039] a positioning module, configured to perform detection area positioning on the first image and the second image after image processing;

[0040] The detection module is used to perform foreign body detection on the first image after the detection area is positioned, and to perform gold line detection on the second image after the detection area is positioned.

[0041] The present invention also provides an embodiment of an optical detection device, comprising:

[0042] frame;

[0043] a first image acquisition device, the first image acquisition device being disposed on the frame;

[0044] a second image acquisition device, disposed on the frame, wherein an optical axis of the second image acquisition device and an optical axis of the first image acquisition device are perpendicular to each other;

[0045] A beam splitter is disposed on the frame, and the beam splitter is disposed at the intersection of the optical axis of the first image acquisition device and the optical axis of the second image acquisition device;

[0046] A controller includes at least one processor and a memory communicatively connected to the at least one processor, wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the method described in any one of the above embodiments.

[0047] In an embodiment of the present invention, a light source is controlled to irradiate a light beam toward the object to be tested by using a first image acquisition device and a second image acquisition device that are arranged perpendicular to each other. The light beam irradiated toward the object to be tested passes through the reflective portion through the spectroscope and is incident on the first image acquisition device, and part of the light beam is reflected by the spectroscope and is incident on the second image acquisition device. The first image acquisition device captures a first image based on the incident light beam and sequentially performs binary image processing, detection area positioning, and foreign object detection on the first image. The second image acquisition device captures a second image based on the incident light beam and sequentially performs binary image processing, detection area positioning, and gold wire detection on the second image, thereby completing simultaneous foreign object detection and gold wire detection on the object to be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 is an overall schematic diagram of an embodiment of an optical detection device of the present invention;

[0049] Figure 2 is an exploded schematic diagram of an embodiment of an optical detection device of the present invention;

[0050] Figure 3 This is a schematic diagram of the electrical connection relationship of an embodiment of the optical detection device of the present invention;

[0051] Figure 4 is a schematic diagram of a first image acquisition device in an embodiment of an optical detection device of the present invention;

[0052] Figure 5 1 is a schematic diagram of the overall steps of an embodiment of the detection method of the present invention;

[0053] Figure 6 yes Figure 5 Detailed flow chart of step S30;

[0054] Figure 7 yes Figure 5 Detailed flow chart of step S50;

[0055] Figure 8 yes Figure 7 Detailed flowchart of step S501;

[0056] Figure 9 yes Figure 7 Detailed flowchart of step S502;

[0057] Figure 10 yes Figure 7 Another detailed flow chart of step S50;

[0058] Figure 11 yes Figure 10 Detailed flowchart of step S513;

[0059] Figure 12 It is a module schematic diagram of the detection device of the present invention. DETAILED DESCRIPTION

[0060] For ease of understanding of the present invention, the present invention will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are for illustrative purposes only.

[0061] Unless otherwise defined, all technical and scientific terms used in this specification have the same meanings as those commonly understood by those skilled in the art to which this invention belongs. The terms used in this specification and in the description of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the relevant listed items.

[0062] See also Figures 1 to 3 The optical detection device 1 includes a frame 10, a first image acquisition device 20, a second image acquisition device 30, a spectroscope 40, and a processing device 50. The first image acquisition device 20, the second image acquisition device 30, and the spectroscope 40 are all arranged on the frame 10. The optical axis of the first image acquisition device 20 and the optical axis of the second image acquisition device 30 are perpendicular to each other. The spectroscope 40 is arranged at the intersection of the optical axes of the first image acquisition device 20 and the second image acquisition device 30. The processing device 50 is electrically connected to the first image acquisition device 20 and the second image acquisition device 30, respectively.

[0063] For the first image acquisition device 20, please refer to Figure 2 The first image acquisition device 20 includes a first camera 201, a first lens 202, and a first light source 203. The first lens 202 is positioned in front of the first camera 201 along the optical axis of the first camera 201. The beam splitter 40 is positioned in front of the first lens 202. The first light source 203 is mounted on the frame 10 and is configured to illuminate the object under test along the optical axis of the first image acquisition device 20. The first camera 201 and the first light source 203 are electrically connected to the processing device 50. When the first image acquisition device 20 needs to inspect the object under test, the processing device 50 controls the first light source 203 to illuminate the object under test. The first camera 201 captures an image of the object under test and transmits the image to the processing device 50. The processing device 50 then analyzes and processes the image captured by the first camera 201.

[0064] The first image acquisition device 20 further includes a mounting platform 204, which is mounted on an end of the first lens 202 away from the first camera 201. The mounting platform 204 is provided with an inclined surface (not labeled) and a light-transmitting hole (not labeled). The light-transmitting hole is provided in the inclined surface. The light-transmitting hole is used to allow the image of the object to be measured to enter the first lens 202 through the light-transmitting hole. The beam splitter 40 is mounted on the inclined surface.

[0065] In some embodiments, the angle between the inclined surface and the optical axis of the first image acquisition device 20 is 45°.

[0066] For details, please refer to Figure 2 and Figure 4 The frame 10 includes a frame body 101 and a mounting plate 102, wherein the mounting plate 102 is connected to the frame body 101. The number of the first light sources 203 is multiple, and the multiple first light sources 203 are mounted on the mounting plate 102 via multiple connecting posts 103. The multiple first light sources 203 are arranged around the first lens 202, wherein one first light source 203 is mounted on one of the connecting posts 103 by screws, and the illumination angle of the first light source 203 can be adjusted by loosening and tightening the screws. The multiple first light sources 203 can fully illuminate the object to be tested, thereby allowing the first camera 201 to capture a clearer image. The first camera 201 is a 6500W pixel-level industrial camera, and the first lens 202 is a 2x lens. Therefore, the first image acquisition device 20 can capture micron-level dust particles on the object to be tested.

[0067] In the embodiment of the present invention, the number of the first light sources 203 is four, and the first light sources 203 are point light sources. The four first light sources 203 are evenly distributed around the first lens 202. It is worth noting that the number of the first light sources 203 listed in the present invention is only exemplary, and the number of the first light sources 203 includes but is not limited to the number listed above.

[0068] The second image acquisition device 30 includes a second camera 301, a second lens 302, and a second light source 303. The second lens 302 is located in front of the second camera 301 along the optical axis of the second camera 301. The beam splitter 40 is located in front of the second lens 302. The second light source 303 is located adjacent to the second lens 302. The object to be measured is placed along the optical axis of the first image acquisition device 20. The second light source 303 is configured to emit light that is reflected by the beam splitter 40 to illuminate the object to be measured. The light reflected from the object to be measured is reflected by the beam splitter 40 and enters the second camera 301, thereby allowing the second camera 301 to capture an image of the object to be measured.

[0069] Furthermore, the second image acquisition device 30 also includes a third light source 304, which is electrically connected to the processing device 50. The third light source 304 is mounted on the frame 10 and along the optical axis of the first image acquisition device 20. The third light source 304 illuminates the object under test along the optical axis of the first image acquisition device 20. The third light source 304 is mounted on the side of the beam splitter 40 away from the first image acquisition device 20. The two cameras are 2000W pixel-class industrial cameras, and the second lens 302 is a 0.55x lens. Thus, the second camera 301 captures an image of the object under test from another perspective. The second camera 301 transmits the captured image to the processing device 50, which determines the shape and position of the object under test by analyzing the image transmitted by the second camera 301.

[0070] In some embodiments, the second light source 303 and the third light source 304 are both arranged in a hollow ring shape, and the second light source 303 and the third light source 304 are respectively monochromatic lights of different colors, and the second light source 303 and the third light source 304 are both different in color from the light emitted by the first light source 203. The ring-shaped second light source 303 and the third light source 304 can better illuminate the object under test.

[0071] For the above-mentioned controller 50, the controller 50 includes at least one processor 501 and a memory 502 in communication with the at least one processor 501, wherein the memory 502 stores instructions that can be executed by the at least one processor 501, and the instructions are executed by the at least one processor 501 so that the at least one processor 501 can perform the following Figures 5 to 9 The detection method.

[0072] The memory 502 is a non-volatile computer-readable storage medium that can be used to store non-volatile software programs, non-volatile computer executable programs and modules, such as the program instructions / modules corresponding to the detection method in the embodiment of the present application, for example, Figure 10 The processor 501 executes various functional applications and data processing of the server by running the non-volatile software programs, instructions and modules stored in the memory 502, that is, realizing the following FIG5- Figure 9 Detection method of method embodiment.

[0073] The memory 502 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and applications required for at least one function; the data storage area may store data created according to the use of the detection device, etc. In addition, the memory 502 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other non-volatile solid-state storage device. In some embodiments, the memory 502 may optionally include a memory remotely located relative to the processor 501, and these remote memories may be connected to the detection device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0074] The one or more modules are stored in the memory 502, and when executed by the one or more processors 501, perform the detection method in any of the above method embodiments, for example, perform the above described Figures 5 to 9 Method steps to achieve Figure 10 The functions of each module and unit in it.

[0075] The above-mentioned product can execute the method provided in the embodiment of this application, and has the functional modules and beneficial effects corresponding to the execution method. For technical details not fully described in this embodiment, please refer to the method provided in the embodiment of this application.

[0076] The present application also provides a non-volatile computer-readable storage medium, wherein the computer-readable storage medium stores computer-executable instructions, which are executed by one or more processors, for example, to execute the above-described Figures 5 to 9 Method steps to achieve Figure 10 The functions of each module in .

[0077] The present application also provides a computer program product, including a computer program stored on a non-volatile computer-readable storage medium, wherein the computer program includes program instructions. When the program instructions are executed by a computer, the computer executes the detection method in any of the above method embodiments, for example, the above described Figures 5 to 9 Method steps to achieve Figure 10 The functions of each module in .

[0078] In some embodiments, the optical detection device 1 further includes a stage 60 , which is disposed on the frame 10 and on a side of the third light source 304 away from the spectroscope 40 . The stage 60 is used to carry the object to be tested.

[0079] In some embodiments, the beam splitter 40 may also be disposed on the frame 10. The beam splitter 40 is disposed at a 45° angle to the optical axes of the first image acquisition device 20 and the second image acquisition device 30. Thus, light irradiated by the second light source 303 and the third light source 304 onto the object to be measured is reflected by the object to be measured to the beam splitter 40, and then reflected by the beam splitter 40 to reach the second lens 302. The light beam reflected by the second lens 302 is transmitted through the second lens 302 to the second camera 301, and the second camera 301 acquires a second image of the object to be measured.

[0080] The following describes the inspection process of the optical inspection device 1: When the optical inspection device 1 needs to inspect an object to be inspected, the object to be inspected is placed on the stage 60. Generally, the object to be inspected is a chip. After the chip is placed on the stage 60, the processing device 50 controls the first image acquisition device 20 and the second acquisition device to start. The first light source 203, the second light source 303, and the third light source 304 illuminate the chip. The image formed by the first light source 203 illuminating the chip is projected into the first lens 202 through the beam splitter 40. The image is magnified by the first lens 202 to become a first image. The first image is captured by the first camera 201, and the first camera 201 transmits the first image to the processing device 50. The processing device 50 executes a preset first inspection program to analyze the first image to determine whether the dust particles on the chip meet the standard. The second light source 303 and the third light source 304 illuminate the chip from two mutually perpendicular directions. The light emitted by the second light source 303 is reflected by the beam splitter before illuminating the chip, while the light emitted by the third light source 304 illuminates the chip. The light from the second and third light sources 303, 304, reflected by the chip, is reflected by the beam splitter 40 and enters the second lens 302. The light entering the second lens 302 is magnified by the second lens 302 to form a second image, which is captured by the second camera 301. The second camera 301 transmits the captured second image to the processing device 50. The processing device 50 executes a preset second inspection program to analyze the second image to determine whether the size, position, and integrity of the gold wires on the chip meet the standards. It is worth noting that the processing device 50 determines whether particles on the chip are present by identifying the presence of bright spots in the first image. That is, when there are no dust particles on the chip, the first image is a solid color image. When there are dust particles on the chip, bright spots are formed in the second image. The principle by which the processing device 50 analyzes and determines the size, position, and integrity of the gold wires on the chip is as follows: the third light source 304 constitutes the background color of the second image, and the second light source 303 illuminates the gold wires so that the position outline of the gold wires is distinguished from the background color. Thus, the processing device 50 can identify and determine the size, position, and integrity of the gold wires according to a preset second detection program.

[0081] In an embodiment of the optical inspection apparatus of the present invention, a first image acquisition device 20 and a second image acquisition device 30 are arranged perpendicular to each other, and a beam splitter 40 is provided at the intersection of the optical axes of the first image acquisition device 20 and the second image acquisition device 30. This allows the first image acquisition device 20 and the second image acquisition device 30 to simultaneously capture an image of the object to be inspected. The first image acquisition device 20 and the second image acquisition device 30 transmit the captured first image and the captured second image to the processing device 50. The processing device 50 performs a first inspection procedure and a second inspection procedure on the first image and the second image, respectively, to simultaneously inspect different inspection items of the object to be inspected.

[0082] See also Figure 5 The present invention provides an embodiment of a detection method applied to the above-mentioned optical detection device, the steps of which include:

[0083] Step S10: controlling the light source to irradiate a light beam toward the object to be tested, wherein the light beam is partially reflected by the object to be tested, passes through the beam splitter 40 and is incident on the first image acquisition device 20 , and partially reflected by the beam splitter 40 and is incident on the second image acquisition device 30 ;

[0084] The illumination light beam is used to illuminate the object to be measured, so that when the first image acquisition device and the second image acquisition device acquire images of the object to be measured, the image effect is better.

[0085] In some embodiments, the step of controlling the light source to irradiate a light beam toward the object to be tested includes: controlling the light source to irradiate a light beam including a first color and a second color toward the object to be tested;

[0086] The light beam of the first color reflected by the object to be tested passes through the spectroscope 40 and is incident on the first image acquisition device 20 , and the light beam of the second color reflected by the object to be tested is reflected by the spectroscope 40 to the second image acquisition device 30 .

[0087] It is worth noting that the light beam of the first color reflected by the object to be tested is emitted by the first light source 203 of the first image acquisition device 20, irradiated by the object to be tested, and then reflected by the object to be tested. The light beam of the first color reflected by the object to be tested passes through the beam splitter 40 and is incident on the first lens 202 of the first image acquisition device 20 and is captured by the first camera 201. The light beam of the second color reflected by the object to be tested is emitted by the second light source 303 of the second image acquisition device 30 and irradiated by the object to be tested, and then reflected by the object to be tested. The light beam of the second color reflected by the object to be tested passes through the beam splitter 40 and is incident on the second lens 303 of the second image acquisition device 30 and is captured by the second camera 301.

[0088] The first image acquisition device 20 and the second image acquisition device 30 are respectively used to realize foreign body detection (for example: dust particles) on the surface of semiconductor materials and gold wire position detection. Foreign body detection and gold wire position detection are different. Therefore, using light sources of different colors for illumination is conducive to improving the accuracy of foreign body detection and gold wire position detection.

[0089] Step S20: acquiring a first image captured by the first image capturing device 20 according to the incident light beam, and a second image captured by the second image capturing device 30 according to the incident light beam;

[0090] Step S30: performing binary image processing on the first image and the second image respectively;

[0091] Binary image processing is performed on the first image and the second image, that is, the first image and the second image are processed into black and white images. Usually, the part processed into the white image is the image that needs to be detected. Since white and black have a strong color difference, the first image and the second image after binary image processing can make the subsequent detection effect more accurate, that is, the outline of the foreign body and the outline of the gold wire are clear.

[0092] In some embodiments, as Figure 6 As shown, the steps of performing binary image processing on the first image and the second image respectively include:

[0093] Step S301: scaling the pixel values ​​of the first image and the second image respectively to obtain a first scaled image and a second scaled image.

[0094] In some embodiments, step S301 specifically includes: converting the color values ​​on the first image from 0-255 to 0-100% to obtain a first scale map, and converting the color values ​​on the second image from 0-255 to 0-100% to obtain a second scale map;

[0095] Step S302: Scan the first scaled image and the second scaled image in rows and columns respectively to obtain the color value of each coordinate of the first scaled image and the second scaled image;

[0096] Step S303: adding a first mark to the coordinates in the first scaled image whose color values ​​are within a preset range, and adding a second mark to the coordinates outside the preset range; and adding a first mark to the coordinates in the second scaled image whose color values ​​are within the preset range, and adding a second mark to the coordinates outside the preset range;

[0097] Step S304: performing image binarization processing on the first scale image and the second scale image to which the first mark and the second mark are attached, to obtain a first binary image and a second binary image;

[0098] It is worth noting that, in the process of performing row and column scanning on the first and second scaled images to obtain the color value of each coordinate in the first and second scaled images, the color value of each coordinate is stored in three RGB channels of the four RGBA channels. A first mark is added to coordinates in the first scaled image whose color values ​​are within a preset range, a second mark is added to coordinates in the first scaled image whose color values ​​are not within the preset range, and a first mark is added to coordinates in the second scaled image whose color values ​​are within the preset range, or a second mark is added to coordinates in the second scaled image whose color values ​​are not within the preset range. The coordinate information with the first mark or the second mark is stored in the A channel of RGBA. Exemplarily, the following is the process of binarizing the first and second scaled images: a binarization operation is performed on all coordinates in the first and second scaled images, and the color value of the coordinates in the A channel with the first mark (value 0) added is converted to 255 (white), and the color value of the coordinates with the second mark (value non-0) added is converted to 0 (black). After the first proportional image and the second proportional image are binarized, the first binary image and the second binary image are obtained respectively. The first binary image and the second binary image only have two colors, black and white, which is conducive to the subsequent extraction of the foreign body outline and the gold wire outline.

[0099] Step S40: performing detection area positioning on the first image and the second image after binary image processing;

[0100] In some embodiments, the step of locating the detection area of ​​the first image and the second image after binary image processing includes: matching the first image after image processing with a preset template to determine the detection area of ​​the first image after image processing, and matching the second image after image processing with a preset template to determine the detection area of ​​the second image after image processing.

[0101] By matching the first image and the second image with a preset template, the area to be detected can be placed in a suitable position, reducing the situation where some areas are missed because the area to be detected is not in a suitable position, thereby making subsequent detection results more accurate and further improving the accuracy of detection.

[0102] Step S50: performing foreign matter detection on the first image after the detection area is positioned, and performing gold line detection on the second image after the detection area is positioned;

[0103] In some embodiments, see Figure 7 The steps of performing foreign matter detection on the first image after positioning the detection area, and performing gold line detection on the second image after positioning the detection area include:

[0104] Step S501: performing contour extraction calculation on the first image after the detection area is located to detect the contour of foreign objects in the area;

[0105] It is worth noting that the algorithm for calculating the first image after positioning the detection area to obtain the foreign body contour includes but is not limited to contour extraction calculation, and also includes other algorithms that can obtain the foreign body contour, such as: template matching algorithm, contour matching algorithm, DBSCAN algorithm, RANSAC algorithm, etc.

[0106] Further, in some embodiments, see Figure 8 The step of performing contour extraction calculation on the first image after positioning the detection area to detect the contour of the foreign body in the area includes:

[0107] Step S5011: extracting the foreign body contour from the first image after positioning the detection area;

[0108] Step S5012: Calculating a first similarity between the obtained foreign body contour and a preset foreign body contour;

[0109] Step S5013: determining whether the first similarity is greater than a preset threshold;

[0110] Step S5014: If yes, it is determined that there is a foreign object in the object to be tested;

[0111] Step S5015: If not, determine that there is no foreign matter in the object to be tested.

[0112] The foreign body contour obtained by contour extraction and calculation can restore the original contour of the foreign body to the greatest extent, improve the ability of foreign body detection, and reduce the situation where the subsequent objects to be tested cannot be identified even if there are foreign bodies due to excessive deviation of the foreign body contour, resulting in missed reports.

[0113] In some other embodiments, the steps of performing foreign object detection on the first image after the detection area is positioned, and performing gold line detection on the second image after the detection area is positioned include:

[0114] Step S502: performing Hough line calculation on the second image after the detection area is located to obtain the gold line contour;

[0115] It is worth noting that the algorithm for calculating the second image after positioning the detection area to obtain the gold line contour includes but is not limited to Hough line calculation, and also includes other algorithms that can obtain the gold line contour, such as: template matching algorithm, contour matching algorithm, region growing algorithm, etc.

[0116] Further, in some embodiments, see Figure 9 The step of performing Hough line calculation on the second image after the detection area positioning to obtain the gold line contour includes:

[0117] Step S5021: extracting the gold line outline from the second image after positioning the detection area;

[0118] Step S5022: calculating a second similarity between the obtained gold line profile and a preset gold line profile;

[0119] Step S5023: determining whether the second similarity is greater than a preset threshold;

[0120] Step S5024: If yes, determining that the gold wire of the object to be tested is qualified;

[0121] Step S5025: If not, it is determined that the gold wire of the tested object is unqualified.

[0122] It is worth noting that there is no order relationship between step S501 and step S502. Step S501 and step S502 can be performed simultaneously, or only step S501 or step S502 can be performed.

[0123] The gold wire profile obtained by Hough line calculation can restore the original profile of the gold wire to the greatest extent, improve the accuracy of subsequent judgment of whether the gold wire meets the standards, and reduce the phenomenon that the gold wire that originally meets the standards is judged as unqualified due to the large difference between the obtained gold wire profile and the gold wire's own profile.

[0124] In other embodiments, see Figure 10 The steps of performing foreign matter detection on the first image after positioning the detection area, and performing gold line detection on the second image after positioning the detection area include:

[0125] Step S511: performing pixel value proportional processing on the background color of the first image after the detection area is located to obtain a first background proportional map;

[0126] Step S512: performing binarization processing on the first background ratio map to obtain a first background binary map.

[0127] Generally, when the background color is a single color, the first background binary image is obtained after the first background binary image is binarized.

[0128] Step S513: performing contour extraction calculation on the first background binary image to detect the contour of foreign objects in the area;

[0129] It is worth noting that the algorithm for calculating the first image after positioning the detection area to obtain the foreign body contour includes but is not limited to contour extraction calculation, and also includes other algorithms that can obtain the foreign body contour, such as: template matching algorithm, contour matching algorithm, DBSCAN algorithm, RANSAC algorithm, etc.

[0130] For further information, see Figure 11 The step of performing contour extraction calculation on the first background binary image to detect the contour of the foreign body in the area includes:

[0131] S5131: extracting the foreign body contour from the first background binary image;

[0132] S5132: Calculating a first similarity between the obtained foreign body contour and a preset foreign body contour;

[0133] S5133: Determine whether the first similarity is greater than a preset threshold;

[0134] S5134: If yes, determining that there is a foreign object in the object to be tested;

[0135] S5135: If not, determine that there is no foreign matter in the object to be tested.

[0136] In some other embodiments, the steps of performing foreign matter detection on the first image after the detection area is positioned, and performing gold line detection on the second image after the detection area is positioned include:

[0137] Step S521: performing row and column scanning on the second image after positioning the detection area;

[0138] Step S522: searching for bright spot pixels during row and column scanning;

[0139] Step S523: Counting whether the cumulative area of ​​bright spot pixels reaches a threshold;

[0140] Step S524: If yes, then determine that the gold wire of the object to be tested is qualified;

[0141] Step S525: If not, it is determined that the gold wire of the tested object is unqualified.

[0142] It is worth noting that there is no order relationship between step S511 and step S521. Step S511 and step S521 can be performed simultaneously, or only step S511 or step S502 can be performed.

[0143] In an embodiment of the detection method of the present invention, a light source is controlled to irradiate a light beam to the object to be tested, and a first image and a second image are respectively obtained after the light beam reflected by the object to be tested passes through a spectrometer 40. The first image and the second image are subjected to binary image processing, and then the detection area is positioned on the binary image processed first image and the second image. Finally, foreign matter detection is performed on the first image after the detection area is positioned, and gold wire detection is performed on the second image after the detection area is positioned, thereby completing the simultaneous detection of foreign matter and gold wire on the object to be tested, thereby improving the detection efficiency and accuracy when the object to be tested needs to undergo foreign matter detection and gold wire detection.

[0144] The present invention also provides a detection device embodiment, such as Figure 10 As shown, the detection device 100 includes a control module 200, an acquisition module 300, a processing module 400, a positioning module 500, and a detection module 600. The control module 200 is used to control the light source to irradiate a light beam toward the object to be detected. The light beam is partially reflected by the object to be detected, passes through the beam splitter 40, and is incident on the first image acquisition device 20. Part of the light beam is reflected by the beam splitter 40 and is incident on the second image acquisition device 30. The acquisition module 300 is used to acquire a first image captured by the first image acquisition device 20 based on the incident light beam, and a second image captured by the second image acquisition device 30 based on the incident light beam. The processing module 400 is used to perform binary image processing on the first and second images, respectively. The positioning module 500 is used to locate the detection area on the first and second images after image processing. The detection module 600 is used to perform foreign object detection on the first image after the detection area is located, and to perform gold wire detection on the second image after the detection area is located.

[0145] In an embodiment of the present invention, a light source is controlled to irradiate a light beam toward the object to be tested by using a first image acquisition device 20 and a second image acquisition device 30 that are arranged perpendicular to each other. The light beam irradiated onto the object to be tested partially passes through the beam splitter 40 and is incident on the first image acquisition device 20, while partially is reflected by the beam splitter 40 and is incident on the second image acquisition device 30. The first image acquisition device 20 captures a first image based on the incident light beam and sequentially performs binary image processing, detection area positioning, and foreign object detection on the first image. The second image acquisition device 30 captures a second image based on the incident light beam and sequentially performs binary image processing, detection area positioning, and gold wire detection on the second image, thereby completing simultaneous foreign object detection and gold wire detection on the object to be tested.

[0146] It should be noted that the preferred embodiments of the present invention are given in the specification and drawings of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. These embodiments are not intended to be additional limitations on the content of the present invention. The purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. In addition, the above-mentioned technical features can be combined with each other to form various embodiments not listed above, which are all considered to be within the scope of the description of the present invention. Furthermore, it is obvious to those skilled in the art that improvements or changes can be made based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A detection method, applied to an optical detection device, the optical detection device comprising a frame, a first image acquisition device, a second image acquisition device, a spectroscope, and a light source, wherein the first image acquisition device and the second image acquisition device are both mounted on the frame, the optical axis of the second image acquisition device and the optical axis of the first image acquisition device are perpendicular to each other, the spectroscope is mounted on the frame and is positioned at the intersection of the optical axes of the first and second image acquisition devices, and the light source is mounted on the frame, characterized in that: include: Controlling the light source to irradiate a light beam toward the object to be tested, wherein the light beam is partially reflected by the object to be tested, passes through the beam splitter, and is incident on the first image acquisition device, and partially reflected by the beam splitter to the second image acquisition device; Acquire a first image captured by the first image acquisition device according to the incident light beam, and a second image captured by the second image acquisition device according to the incident light beam; performing binary image processing on the first image and the second image respectively; Performing detection area positioning on the first image and the second image after binary image processing; Foreign matter detection is performed on the first image after the detection area is positioned, and gold line detection is performed on the second image after the detection area is positioned.

2. The detection method according to claim 1, wherein Performing binary image processing on the first image and the second image respectively includes: Scaling the pixel values ​​of the first image and the second image respectively to obtain a first scaled image and a second scaled image; Scanning the first scaled image and the second scaled image in rows and columns respectively to obtain the color value of each coordinate of the first scaled image and the second scaled image; Adding a first mark to coordinates in the first scaled image whose color values ​​are within a preset range, and adding a second mark to coordinates outside the preset range; and adding a first mark to coordinates in the second scaled image whose color values ​​are within a preset range, and adding a second mark to coordinates outside the preset range; The step of performing binary image processing on the first image and the second image respectively includes performing image binarization processing on the first scale image and the second scale image to which the first mark and the second mark are attached, to obtain a first binary image and a second binary image.

3. The detection method according to claim 1, wherein Performing detection area positioning on the first image and the second image after binary image processing, including: The first image after image processing is matched with a preset template to determine the detection area of ​​the first image after image processing, and the second image after image processing is matched with a preset template to determine the detection area of ​​the second image after image processing.

4. The detection method according to claim 1, wherein the step of performing foreign object detection on the first image after positioning the detection area comprises: After the detection area is located, the first image is subjected to contour extraction calculation to detect the contour of the foreign body in the area.

5. The detection method according to claim 1, wherein The step of performing foreign body detection on the first image after positioning the detection area further includes: Extracting the foreign body contour from the first image after positioning the detection area; Calculating a first similarity between the obtained foreign body contour and a preset foreign body contour; Determining whether the first similarity is greater than a preset threshold; If yes, it is determined that there is a foreign object in the object to be tested; If not, it is determined that there is no foreign matter in the object to be tested.

6. The detection method according to claim 1, wherein the step of performing gold line detection on the second image after positioning the detection area comprises: The second image after the detection area positioning is performed with Hough line calculation to obtain the gold line outline.

7. The detection method according to claim 1, characterized in that The step of performing gold line detection on the second image after positioning the detection area further includes: Extracting the gold wire outline from the second image after positioning the detection area; Calculating a second similarity between the obtained gold line profile and a preset gold line profile; Determining whether the second similarity is greater than a preset threshold; If yes, it is determined that the gold wire of the object to be tested is qualified; If not, it is determined that the gold wire of the tested object is unqualified.

8. The detection method according to claim 1, wherein The controlling the light source to irradiate a light beam toward the object to be tested comprises: The light source is controlled to irradiate a light beam containing a first color and a second color toward the object to be tested, wherein the light beam of the first color reflected by the object to be tested passes through the spectroscope and is incident on the first image acquisition device, and the light beam of the second color reflected by the object to be tested is reflected by the spectroscope to the second image acquisition device.

9. A detection device, characterized in that: include: a control module, configured to control the light source to irradiate a light beam toward the object to be tested, wherein the light beam is partially reflected by the object to be tested, passes through the beam splitter, and is incident on the first image acquisition device, and partially reflected by the beam splitter to the second image acquisition device; an acquisition module, configured to acquire a first image acquired by the first image acquisition device according to the incident light beam, and a second image acquired by the second image acquisition device according to the incident light beam; a processing module, configured to perform binary image processing on the first image and the second image respectively; a positioning module, configured to perform detection area positioning on the first image and the second image after image processing; The detection module is used to perform foreign body detection on the first image after the detection area is positioned, and to perform gold line detection on the second image after the detection area is positioned.

10. An optical detection device, characterized in that: include: frame; a first image acquisition device, the first image acquisition device being disposed on the frame; a second image acquisition device, disposed on the frame, wherein an optical axis of the second image acquisition device and an optical axis of the first image acquisition device are perpendicular to each other; A beam splitter is disposed on the frame, and the beam splitter is disposed at the intersection of the optical axis of the first image acquisition device and the optical axis of the second image acquisition device; A controller comprising at least one processor and a memory communicatively connected to the at least one processor, wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 8.

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