Resin plugging device and method for PCB

Abstract

This invention discloses a resin via-plugging device and method for PCBs, belonging to the field of PCB technology. The resin via-plugging device for PCBs includes a housing, a control module, a temperature detection module, and a heat insulation module. The control module is located inside the housing; the temperature detection module is located inside the housing and connected to the control module; the heat insulation module is located inside the housing and connected to the control module. The temperature detection module is used to acquire the current temperature of the housing, and the control module is used to adjust the working state of the heat insulation module according to the current temperature to control the current temperature of the housing within a preset temperature range, so that the temperature of the PCB to be plugged, placed inside the resin via-plugging device, is always maintained within a suitable temperature range for via plugging. This resin via-plugging device for PCBs can maintain the temperature of the PCB to be plugged within a suitable temperature range for via plugging during transportation, reducing ink viscosity and improving via-plugging efficiency.

Description

Technical Field

[0001] This invention relates to the field of PCB technology, and more particularly to a resin plugging device and method for PCBs. Background Technology

[0002] Currently, during the resin via plugging process of PCBs, the ink viscosity often increases due to the temperature drop of the PCB during transportation, which affects the via plugging efficiency. This problem is particularly evident in the resin via plugging process of high aspect ratio chip test boards. Therefore, how to provide a resin via plugging device for PCBs that can keep the PCB temperature constant during transportation and reduce ink viscosity to improve via plugging efficiency has become an urgent problem to be solved. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a resin via-plugging device for PCBs, which enables the PCB to maintain a constant temperature during transportation, reduces ink viscosity, and improves via-plugging efficiency.

[0004] The present invention also proposes a resin plugging method for PCBs.

[0005] A resin plugging device for a PCB according to a first aspect embodiment of the present invention includes:

[0006] Box;

[0007] The control module is located inside the housing;

[0008] A temperature detection module is located inside the enclosure and is connected to the control module.

[0009] A thermal insulation module is located inside the housing and is connected to the control module.

[0010] The temperature detection module is used to obtain the current temperature of the enclosure, and the control module is used to adjust the working state of the insulation module according to the current temperature, so as to control the current temperature of the enclosure to be within a preset temperature range, so that the temperature of the PCB to be plugged placed in the resin plugging device remains unchanged.

[0011] The resin via-plugging device for PCBs according to embodiments of the present invention has at least the following beneficial effects: The device's housing includes a control module, a temperature detection module, and a heat preservation module. The temperature detection module acquires the current temperature of the housing, and the control module adjusts the operating state of the heat preservation module based on this temperature. The heat preservation module can change its operating state to regulate the temperature change inside the housing, ensuring the current temperature remains within a preset range. This keeps the temperature of the PCB to be plugged within the resin via-plugging device consistently within a suitable temperature range for via plugging. This device ensures that the temperature of the PCB to be plugged remains within this suitable range during transportation, reducing ink viscosity and preventing via voids or depressions, thus improving via plugging efficiency. In particular, for high aspect ratio chip test boards, this resin via-plugging device effectively mitigates the problem of via plugging defects caused by decreased temperature and increased ink viscosity during production and transportation, significantly improving the production efficiency and yield of high aspect ratio chip test boards.

[0012] According to some embodiments of the present invention, the resin plugging device further includes:

[0013] A heat insulation component is disposed on the inner surface of the enclosure to provide heat insulation for the enclosure and to mitigate temperature changes inside the enclosure.

[0014] According to some embodiments of the present invention, the heat insulation component is made of at least one of heat-reflective material, porous material, vacuum material, and thermally insulating material.

[0015] According to some embodiments of the present invention, the temperature detection module includes:

[0016] A temperature sensor is connected to the control module and is used to obtain the current temperature of the enclosure.

[0017] According to some embodiments of the present invention, the resin plugging device further includes:

[0018] The first limiting plate is disposed on the first side of the housing and is used to limit and fix the PCB to be plugged in the resin plugging device.

[0019] According to some embodiments of the present invention, the first limiting plate is provided with a plurality of first limiting members, which are used to limit the PCB of the hole to be plugged.

[0020] According to some embodiments of the present invention, the resin plugging device further includes:

[0021] The second limiting plate is disposed on the second side of the housing and is used to limit and fix the PCB to be plugged in the resin plugging device.

[0022] According to some embodiments of the present invention, the second limiting plate is provided with a plurality of second limiting members, which are used to limit the PCB of the hole to be plugged.

[0023] According to some embodiments of the present invention, the resin plugging device further includes:

[0024] A cover, which is used to cover the box.

[0025] A resin via plugging method for a PCB according to a second aspect embodiment of the present invention includes:

[0026] The initial temperature of the resin plugging device is adjusted to the target temperature, wherein the target temperature is within a preset temperature range;

[0027] The PCB to be plugged, which has undergone baking treatment, is placed inside the resin plugging device;

[0028] The current temperature of the resin plugging device is detected in real time, and the current temperature is controlled within a preset temperature range;

[0029] The resin plugging device is controlled to move to the target position to perform resin plugging on the PCB to be plugged.

[0030] The resin via-plugging method for PCBs according to embodiments of the present invention has at least the following beneficial effects: This resin via-plugging method for PCBs adjusts the initial temperature of the resin via-plugging device to a target temperature; then, the PCB to be plugged, after baking, is placed inside the resin via-plugging device. The current temperature of the resin via-plugging device is detected in real time and controlled within a preset temperature range. Finally, the resin via-plugging device is moved to the target position to perform resin via-plugging on the PCB to be plugged. By controlling the current temperature of the resin via-plugging device within a preset temperature range, this method ensures that the temperature of the PCB to be plugged is always maintained within a suitable temperature range for via plugging, and also ensures that the temperature of the PCB to be plugged is always maintained within a suitable temperature range for via plugging during transportation. This reduces ink viscosity, avoids via voids or via depressions, and improves via-plugging efficiency. In particular, for high aspect ratio chip test boards, the use of this resin plugging device and method can effectively improve the problem of plugging defects caused by the decrease in temperature and increase in ink viscosity during the production and transportation of high aspect ratio chip test boards, and can significantly improve the production efficiency and yield of high aspect ratio chip test boards.

[0031] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0032] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0033] Figure 1 This is a schematic diagram of the resin plugging device for PCB according to an embodiment of the present invention;

[0034] Figure 2 This is a schematic diagram of a resin plugging device for a PCB according to another embodiment of the present invention;

[0035] Figure 3 This is a flowchart of a resin plugging method for PCBs according to an embodiment of the present invention;

[0036] Reference numerals: 100, housing; 101, control module; 102, temperature detection module; 103, insulation module; 104, temperature sensor; 105, insulation component; 200, cover; 201, first limiting plate; 202, first limiting component; 203, second limiting plate; 204, second limiting component; 205, handle. Detailed Implementation

[0037] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0038] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0039] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0040] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0041] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0042] Firstly, referring to Figure 1The resin plugging device for PCBs according to this embodiment of the invention includes a housing 100, a control module 101, a temperature detection module 102, and a heat preservation module 103. The control module 101 is located inside the housing 100; the temperature detection module 102 is located inside the housing 100 and is connected to the control module 101; the heat preservation module 103 is located inside the housing 100 and is connected to the control module 101; the temperature detection module 102 is used to obtain the current temperature of the housing 100, and the control module 101 is used to adjust the working state of the heat preservation module 103 according to the current temperature to control the current temperature of the housing 100 to be within a preset temperature range. Inside the housing 100 of the resin plugging device, there is a control module 101, a temperature detection module 102, and a heat preservation module 103. The temperature detection module 102 obtains the current temperature of the housing 100, and the control module 101 adjusts the working state of the heat preservation module 103 according to the current temperature. The heat preservation module 103 can change its working state to regulate the temperature change inside the housing 100, so that the current temperature of the housing 100 is within a preset temperature range. For example, by real-time monitoring of the current temperature of the enclosure 100 and controlling the working state of the insulation module 103, when the current temperature is lower than a preset temperature threshold, the insulation module 103 adjusts the current temperature by increasing the heating rate or activating more heating components, ensuring that the current temperature remains within a preset temperature range (e.g., greater than or equal to 30°C). This keeps the temperature of the PCB to be plugged within the resin plugging device within a suitable plugging temperature range. This device ensures that the temperature of the PCB to be plugged remains within this range during transportation, reducing ink viscosity and preventing voids or depressions in the plugged holes, thus improving plugging efficiency. In particular, for high aspect ratio chip test boards, this resin plugging device and method effectively address the problem of plugging defects caused by decreased ink viscosity due to temperature drop during production and transportation, significantly improving the production efficiency and yield of high aspect ratio chip test boards.

[0043] It should be noted that, in some specific embodiments, the housing 100 of the resin plugging device can have dimensions of 635mm × 400mm × 670mm, making the resin plugging device suitable for the storage and transportation of conventional PCBs and improving its applicability. In some other embodiments, the resin plugging device can also have other design dimensions, and is not limited thereto.

[0044] Reference Figure 1In some embodiments, the temperature detection module 102 includes a temperature sensor 104, which is connected to the control module 101. The temperature sensor 104 is used to acquire the current temperature of the enclosure 100. The temperature sensor 104 can acquire the current temperature of the enclosure 100 relatively quickly and accurately, improving temperature detection efficiency.

[0045] Reference Figure 1 In some embodiments, the resin plugging device further includes a heat insulation element 105, which is disposed on the inner surface of the housing 100 to provide heat insulation for the housing 100, thereby mitigating temperature changes inside the housing 100. To improve heat insulation performance and maintain a constant temperature for the PCB to be plugged within the resin plugging device, the heat insulation element 105 can be made of at least one of heat-reflective materials, porous materials, vacuum materials, and thermally insulating materials. For example, the heat insulation element 105 can be heat-insulating cotton, etc. In some other embodiments, the heat insulation element 105 can also be made of other materials, and is not limited thereto.

[0046] Reference Figure 2 In some embodiments, the resin plugging device further includes a first limiting plate 201, which is disposed on a first side of the housing 100. The first limiting plate 201 is used to limit and fix the PCB to be plugged placed inside the resin plugging device. By providing the first limiting plate 201 in the width direction of the housing 100, the PCB to be plugged placed inside the resin plugging device can be limited and fixed. Furthermore, to improve the applicability of the resin plugging device, the first limiting plate 201 can be configured to be movable, that is, the first limiting plate 201 can move left and right in the length direction of the housing 100 to limit and fix PCBs of different specifications.

[0047] Furthermore, referring to Figure 2 In some specific embodiments, the first limiting plate 201 is provided with a plurality of first limiting members 202, which are used to limit the PCB to be plugged. For example, a PCB with a length of 24 feet and a width of less than 26 feet can be fixed by the first limiting members 202. In some other embodiments, PCBs of other sizes can also be fixed, and it is not limited thereto. In addition, the spacing between the first limiting members 202 can be set according to the actual situation and is not limited.

[0048] Reference Figure 2In some embodiments, the resin plugging device further includes a second limiting plate 203, which is disposed on the second side of the housing 100. The second limiting plate 203 is used to limit and fix the PCB to be plugged placed inside the resin plugging device. By providing the second limiting plate 203 in the length direction of the housing 100, the PCB to be plugged placed inside the resin plugging device can be limited and fixed. Furthermore, in order to improve the applicability of the resin plugging device, the second limiting plate 203 can be configured to be movable, that is, the second limiting plate 203 can move up and down in the width direction of the housing 100 to limit and fix PCBs of different specifications.

[0049] Furthermore, referring to Figure 2 In some specific embodiments, the second limiting plate 203 is provided with a plurality of second limiting members 204, which are used to limit the PCB to be plugged. For example, a PCB with a length of 21 feet and a width of less than 26 feet can be fixed by the second limiting members 204. In some other embodiments, PCBs of other sizes can also be fixed, and it is not limited to these. In addition, the spacing between the second limiting members 204 can be set according to the actual situation and is not limited.

[0050] Reference Figure 2 In some embodiments, the resin plugging device further includes a cover 200, which is used to cover the housing 100. To improve the thermal insulation performance of the resin plugging device, the resin plugging device further includes a cover 200, which is placed on the housing 100. The PCB to be plugged can be inserted or removed by opening or closing the cover 200, which is convenient to use.

[0051] It should be noted that, in order to provide rigidity to the resin plugging device, both the housing 100 and the cover 200 of the resin plugging device can be made of sheet metal, thereby improving the mechanical properties of the resin plugging device.

[0052] Reference Figure 2 In some specific embodiments, in order to improve the performance of this resin plugging device, handles 205 are provided on both the housing 100 and the cover of the resin plugging device for easy use.

[0053] Reference Figure 2 In some specific embodiments, in order to improve the performance of this resin plugging device, handles 205 are provided on both the housing and the cover of the resin plugging device for easy use.

[0054] Secondly, referring to Figure 3 The resin plugging method for PCBs according to embodiments of the present invention includes:

[0055] S301 adjusts the initial temperature of the resin plugging device to the target temperature, wherein the target temperature is within a preset temperature range;

[0056] S302, Place the baked PCB to be plugged into the resin plugging device;

[0057] S303, real-time detection of the current temperature of the resin plugging device, and control of the current temperature within a preset temperature range;

[0058] S304 controls the resin plugging device to move to the target position to perform resin plugging on the PCB to be plugged.

[0059] In the process of resin plugging PCBs, the initial temperature of the resin plugging device must first be obtained and adjusted to the target temperature. Then, the PCB to be plugged, after being preheated, is placed inside the resin plugging device. This can be achieved by preheating at least one PCB in an oven to a temperature above 50°C. After placing the preheated PCB inside the resin plugging device, the current temperature of the device needs to be monitored in real time and controlled within a preset temperature range, for example, ensuring the current temperature is always greater than or equal to 30°C. Simultaneously, the resin plugging device is moved to the target position, where the plugging equipment is located, and resin plugging is performed on the PCB. This method, by controlling the current temperature of the resin plugging device within the preset temperature range, avoids excessively low temperatures that could cause the PCB temperature to drop, ensuring that the temperature of the PCB placed inside the device remains within a suitable plugging temperature range. This also helps maintain the PCB temperature within a suitable plugging temperature range during transportation, reducing ink viscosity and preventing issues such as voids or depressions in the plugged vias, thus improving plugging efficiency. In particular, for high aspect ratio chip test boards, the use of this resin plugging device and method can effectively improve the problem of plugging defects caused by the decrease in temperature and increase in ink viscosity during the production and transportation of high aspect ratio chip test boards, and can significantly improve the production efficiency and yield of high aspect ratio chip test boards.

[0060] In some embodiments, the resin via-plugging device described above can transport the PCB production board from the upper oven to the via-plugging equipment. During transportation, the resin via-plugging device ensures that when the PCB is at room temperature of approximately 20°C (20±2°C), the PCB to be plugged is maintained at the required temperature within the device, ensuring that the PCB temperature during via plugging remains above 30°C. This prevents the ink viscosity from increasing due to a drop in PCB temperature during subsequent via plugging, ensuring that the ink viscosity during subsequent via plugging is less than 360 dPa·s. It also avoids defects such as via voids and via depressions caused by excessively high ink viscosity due to low temperature, thus improving the yield of PCB resin via plugging. Actual production and processing verification shows that using the resin via-plugging device and method provided in this application can increase work efficiency by 50% and the yield from 70% to over 90%. Compared to ordinary resin via-plugging devices and methods, it can significantly improve the production efficiency and yield of high aspect ratio chip test boards.

[0061] It should be noted that when resin plugging is performed on each PCB, only this PCB needs to be removed from the resin plugging device, while the remaining PCBs are kept in the resin plugging device at a preset temperature. This ensures that the temperature of the other PCBs to be plugged will not drop and can always be maintained within a suitable temperature range for plugging. As a result, when it is time to plug the corresponding PCB, the temperature of the PCB to be plugged will still not drop and the viscosity will not be too high. This can effectively avoid plugging defects and improve production efficiency and yield.

[0062] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A resin plugging device for PCBs, characterized in that, include: The box body is equipped with a handle; The control module is located inside the housing; A temperature detection module is located inside the enclosure and is connected to the control module. A thermal insulation module is located inside the housing and is connected to the control module. A first limiting plate is disposed on the first side of the housing. The first limiting plate is used to limit and fix the PCB to be plugged in the resin plugging device. The first limiting plate is disposed in the width direction of the housing and can move in the length direction of the housing. The first limiting plate is provided with a plurality of first limiting members, which are used to limit the PCB to be plugged. The second limiting plate is disposed on the second side of the housing. The second limiting plate is used to limit and fix the PCB to be plugged in the resin plugging device. The second limiting plate is disposed in the length direction of the housing and can move in the width direction of the housing. The second limiting plate is provided with a plurality of second limiting members, which are used to limit the PCB to be plugged. The temperature detection module is used to obtain the current temperature of the enclosure, and the control module is used to adjust the working state of the insulation module according to the current temperature to control the current temperature of the enclosure to be within a preset temperature range, so that the temperature of the PCB to be plugged placed in the resin plugging device remains unchanged, thereby reducing the ink viscosity and avoiding voids or depressions in the plugged holes.

2. The resin plugging device according to claim 1, characterized in that, The resin plugging device further includes: A heat insulation component is disposed on the inner surface of the enclosure to provide heat insulation for the enclosure and to mitigate temperature changes inside the enclosure.

3. The resin plugging device according to claim 2, characterized in that, The heat insulation component is made of at least one of the following: heat reflective material, porous material, vacuum material, and heat insulating material.

4. The resin plugging device according to claim 1, characterized in that, The temperature detection module includes: A temperature sensor is connected to the control module and is used to obtain the current temperature of the enclosure.

5. The resin plugging device according to any one of claims 1 to 4, characterized in that, The resin plugging device further includes: A cover, which is used to cover the box.

6. A resin plugging method for PCBs, characterized in that, include: The initial temperature of the resin plugging device is adjusted to the target temperature, wherein the target temperature is within a preset temperature range; The PCB to be plugged, which has undergone baking treatment, is placed inside the resin plugging device; The current temperature of the resin plugging device is detected in real time, and the current temperature is controlled within a preset temperature range; The resin plugging device is controlled to move to the target position to perform resin plugging on the PCB to be plugged, thereby reducing the ink viscosity and avoiding voids or depressions in the plugged holes.

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