Electronic component mounting apparatus

Abstract

An electronic component mounting apparatus capable of continuously attaching an ACF without stopping the electronic component mounting apparatus is provided. The electronic component mounting apparatus of the present invention includes: a supply device that supplies a film-shaped electronic component (F); a first attaching device (50a) that attaches an anisotropic conductive member to the film-shaped electronic component (F); a second attaching device (50b) that attaches the anisotropic conductive member to the film-shaped electronic component (F); a mounting device (60) that mounts the film-shaped electronic component (F) to which the anisotropic conductive member is attached to a display panel (D); and a transfer device (40) that receives the film-shaped electronic component (F) from the supply device, and after the anisotropic conductive member is attached by the first attaching device (50a) or the second attaching device (50b), is transferred to the mounting device (60).

Description

Technical Field

[0001] This invention relates to an electronic component mounting device. Background Technology

[0002] Liquid crystal displays (LCDs) or organic electroluminescent (EL) displays are widely used as monitors for televisions, personal computers, and the like. In the manufacturing process of such displays, there is an assembly process where electronic components for driving the display panel are mounted. In this assembly process, two methods are known: one is to directly mount the driver integrated circuit (IC), and the other is to mount the driver IC on a film-like circuit board, a method known as chip-on-film (COF) mounting of film-like electronic components.

[0003] The former involves mounting chip-shaped electronic components, such as driver ICs, onto the glass substrate that makes up the display panel, hence it is called Chip On Glass (COG) mounting. The latter involves mounting film-shaped electronic components onto the glass substrate, hence it is called Film On Glass (FOG) mounting. Furthermore, COG mounting uses electronic component mounting equipment called COG mounting apparatus, while FOG mounting uses electronic component mounting equipment called Outer Lead Bonding (OLB) apparatus or FOG mounting apparatus.

[0004] Traditionally, the size of the display panel was roughly used as a dividing line. For example, FOG (Flying-in-the-Glass) mounting was used for large display panels larger than 10 inches, while COG (Clothing-in-the-Glass) mounting was used for small display panels smaller than 10 inches. Therefore, in mounting devices for electronic components on display panels, FOG mounting devices were used for large display panels, and COG mounting devices were used for small display panels.

[0005] Furthermore, in the display panel manufacturing process, there is a growing demand for electronic component mounting equipment capable of selectively performing COG (Chip-on-Glove) and FOG (Foot-on-Foot) mounting. Here, COF is supplied by stamping a strip member. Additionally, driver ICs are supplied from a tray. Therefore, such electronic component mounting equipment needs to include both a stamping-based supply device and a tray-based supply device.

[0006] In this electronic component mounting apparatus, a driver IC or COF is temporarily pressed onto a display panel via an anisotropic conductive component called anisotropic conductive film (ACF), and then mounted onto the display panel by heat pressing (hereinafter also referred to as formal pressing). Specifically, in the preliminary stage of temporary pressing, the ACF is adhered to the display panel, and the driver IC or COF is temporarily and formally pressed onto the display panel. This ACF is a sheet-like component formed by incorporating a large number of small conductive particles into a thermosetting resin that serves as a substrate, and is supplied in the form of a strip component (hereinafter referred to as an ACF strip) attached to a release tape.

[0007] On the other hand, there is a prospective electronic component mounting device capable of bonding an ACF (Automatic Concrete Foil) to a COF (Copyright Frame) instead of a display panel, and mounting the ACF-bonded COF to the display panel. As a bonding device for bonding ACF to a COF, for example, a bonding device disclosed in Patent Document 1 is known. In Patent Document 1, an ACF strip formed by bonding ACF is supplied, and the ACF is bonded to the COF. A slit is pre-formed in this ACF according to the dimensions of the COF. After bonding to the COF, when the release tape is pulled away from the COF, the ACF bonded to the COF is separated from the ACF strip through the slit.

[0008] [Existing Technical Documents]

[0009] [Patent Literature]

[0010] [Patent Document 1] Japanese Patent Application Publication No. 2008-016594 Summary of the Invention

[0011] [The problem the invention aims to solve]

[0012] Furthermore, when the ACF tape supplied by the bonding device runs out, it needs to be replaced. During this time, the electronic component mounting device must be stopped, thus posing a challenge to temporarily halt production.

[0013] The purpose of this invention is to provide an electronic component mounting device that can continuously adhere to the ACF without stopping the electronic component mounting device.

[0014] [Technical means to solve the problem]

[0015] To achieve the aforementioned objective, the electronic component mounting apparatus of the present invention includes: a supply device for supplying a film-shaped electronic component; a first bonding device for bonding an anisotropic conductive member to the film-shaped electronic component; a second bonding device for bonding anisotropic conductive members to the film-shaped electronic component; a mounting device for mounting the film-shaped electronic component with the anisotropic conductive member bonded thereto on a display panel; and a transfer device for receiving the film-shaped electronic component from the supply device, bonding the anisotropic conductive member through the first bonding device or the second bonding device, and then transferring it to the mounting device.

[0016] [The effects of the invention]

[0017] This invention enables continuous bonding of ACF without stopping the electronic component mounting device. Attached Figure Description

[0018] Figure 1 (A) and Figure 1 (B) is a perspective view of the film-shaped electronic component (A) and the chip-shaped electronic component (B) of the embodiment.

[0019] Figure 2 This is a plan view showing the overall structure of the electronic component mounting device according to the implementation method.

[0020] Figure 3 (A) and Figure 3 (B) is an explanatory diagram (A) showing the process of mounting a film-shaped electronic component in an electronic component mounting apparatus according to an embodiment of the mounting method, and an explanatory diagram (B) showing the process of mounting a chip-shaped electronic component.

[0021] Figure 4 (A) and Figure 4 (B) is an explanatory diagram showing the stamping supply device of the embodiment before (A) and after (B) stamping.

[0022] Figure 5 (A) Figure 5 (F) is an explanatory diagram showing the pallet receiving process of the pallet supply device in an embodiment.

[0023] Figure 6 This is a perspective view showing the first holding head and the second holding head of the embodiment.

[0024] Figure 7 (A) and Figure 7 (B) is an explanatory diagram showing the operation of the moving mechanism in the embodiment.

[0025] Figure 8 (A) and Figure 8 (B) is a plan view showing the reference position of the implementation method.

[0026] Figure 9 This is an explanatory diagram showing the bonding device of the embodiment.

[0027] Figure 10 This is a functional block diagram illustrating the control device used in the implementation method.

[0028] Figure 11 This is a flowchart illustrating the installation sequence of the film-shaped electronic components in the implementation method.

[0029] Figure 12 This is a flowchart illustrating the installation sequence of the film-shaped electronic components in the implementation method.

[0030] Figure 13 (A) and Figure 13 (B) is an explanatory diagram showing the relationship between the reference position, half-tangent, and fitting position of the embodiment.

[0031] Figure 14 This is a flowchart illustrating the assembly sequence of the chip-shaped electronic components in the implementation method.

[0032] Figure 15 (A) Figure 15 (C) is an explanatory diagram showing the position alignment of the implementation method.

[0033] Figure 16 (A) Figure 16 (C) is an explanatory diagram showing the alignment of the ACF with the pressure head corresponding to various sizes of COF in the prior art.

[0034] [Explanation of Symbols]

[0035] 10, 10a, 10b: Stamping supply device

[0036] 20, 20a, 20b: Pallet supply device

[0037] 40: Transfer device

[0038] 50, 50a, 50b: Bonding device

[0039] 51, 110: Supply Department

[0040] 52: Cut-off section

[0041] 53: Fitting Part

[0042] 54: Peeling section

[0043] 55: Transport Department

[0044] 56: Recycling Department

[0045] 60: Installation device

[0046] 80: Control device

[0047] 81: Mechanism Control Department

[0048] 82: Storage Department

[0049] 83: Input / Output Control Unit

[0050] 91: Input device

[0051] 92: Output device

[0052] 120, 610: Platform

[0053] 120a: Open

[0054] 130: Mold

[0055] 131: Mold head

[0056] 131a: Punching

[0057] 132: Punch

[0058] 140: Lifting mechanism

[0059] 141: Support section

[0060] 141a: Pillar

[0061] 141b: Support plate

[0062] 142: Drive Unit

[0063] 142a: Shaft

[0064] 210: Framework

[0065] 220: Control Department

[0066] 410: Installation Department

[0067] 411: Loading section

[0068] 412: Locking part

[0069] 420: Mobile Agency

[0070] 430: Transfer device

[0071] 431: First Arm

[0072] 431a, 432b: Adsorption nozzles

[0073] 432: Second Arm

[0074] 432a: Rotary head

[0075] 510: Supply reels

[0076] 511: Tension Mechanism

[0077] 511a: Fixed roller

[0078] 511b: Movable roller

[0079] 512, 561: Path rollers

[0080] 520: Cutting machine

[0081] 521, 531: Supporting components

[0082] 521a: Flat surface

[0083] 530: Pressure Head

[0084] 530a: Buffer component

[0085] 531a: Support roller

[0086] 540, 541: Peeling rods

[0087] 550: Conveyor Roller

[0088] 560: Recycle Reels

[0089] 620: Crimping part

[0090] 621: Pressure-applying component

[0091] 622: Support component

[0092] B: Cleaning device

[0093] B1: Brush

[0094] C: Chip-like electronic components

[0095] D: Display panel

[0096] F: Film-type electronic components

[0097] G: Measuring device

[0098] G1: Launching

[0099] H1: First Holding Head

[0100] H2: Second holding head

[0101] H11, H21: Retention section

[0102] H12, H22: Connecting parts

[0103] H13, H23: Support section

[0104] HC: Half-tangent

[0105] R1, R1a, R1b: Reference positions

[0106] R2: Fitting position

[0107] ST: Thin plate-shaped component

[0108] T: Tray

[0109] T1: Adhesive Tape

[0110] T2: Demolding belt

[0111] TP: Strip component Detailed Implementation

[0112] The embodiments of the present invention (hereinafter referred to as "this embodiment") will be specifically described with reference to the accompanying drawings. Furthermore, the drawings are schematic representations of the components and structural parts and do not accurately represent their dimensions or spacing.

[0113] [structure]

[0114] [Electronic components and mounting objects]

[0115] The electronic component in this embodiment is as follows: Figure 1 The film-shaped electronic component F shown in (A), and as shown in (A) Figure 1 The chip-shaped electronic component C is shown in (B). The film-shaped electronic component F is a component in which an electronic component is mounted on a flexible resin film and an electrode is formed at one end of one side. The film-shaped electronic component F is prepared as a mounting component by stamping multiple film-shaped electronic components F integrally formed on a sheet or strip-shaped thin plate member. In addition, the film-shaped electronic component F in this embodiment has various sizes. The chip-shaped electronic component C is a driver IC. The chip-shaped electronic component C is mounted on a tray T (see reference) in a state where it is individually separated into products in advance. Figure 3 (A) and Figure 3 (B) and prepare.

[0116] The film-type electronic component F and the chip-type electronic component C are components that are electrically connected to the electrodes of the film-type electronic component F or the chip-type electronic component C. In this embodiment, the mounting object is the display panel D that constitutes the display device. That is, it is a component that has display function and electrodes.

[0117] [Electronic component mounting device]

[0118] (Overall structure)

[0119] Reference Figure 2 as well as Figure 3 (A) and Figure 3 Section (B) describes the overall structure of the electronic component mounting device of this embodiment. For example... Figure 2 As shown, the electronic component mounting device includes a stamping supply device 10, a tray supply device 20, a transfer device 40, a bonding device 50, a mounting device 60, and a control device 80.

[0120] The stamping supply device 10 is a device for stamping film-shaped electronic components F from sheet-like components ST and supplying film-shaped electronic components F. The tray supply device 20 is a device for supplying trays T containing chip-shaped electronic components C.

[0121] The transfer device 40 is a device that receives film-shaped electronic components F from the stamping supply device 10 and transfers them to the mounting device 60 via the bonding device 50. Additionally, the transfer device 40 is also a device that receives chip-shaped electronic components C from the tray supply device 20 and transfers them to the mounting device 60. A first holding head H1 is used for the transfer of film-shaped electronic components F from the stamping supply device 10 to the transfer device 40. A second holding head H2 is used for the transfer of chip-shaped electronic components C from the tray supply device 20 to the transfer device 40. The first holding head H1 and the second holding head H2 are detachably mounted on the transfer device 40.

[0122] The bonding device 50 is a device for bonding an anisotropic conductive component called ACF (Anisotropic Conductive Film) to the electrodes of the film-shaped electronic component F. ACF is a sheet-like component formed by a large number of small conductive particles entering a resin that serves as a substrate. The mounting device 60 is a device for pressing the film-shaped electronic component F or the chip-shaped electronic component C onto the display panel D, which is the object to be mounted.

[0123] The control device 80 is a device for controlling the stamping supply device 10, the pallet supply device 20, the transfer device 40, the bonding device 50, and the mounting device 60. The control device 80 may include, for example, dedicated electronic circuitry or a computer running a specific program. The control device 80 programs the control content for each component, and executes the program through a processing device such as a programmable logic controller (PLC) or a central processing unit (CPU).

[0124] Furthermore, in a plane parallel to the mounting surface of the electronic component mounting device, the straight line from the stamping supply device 10 towards the mounting device 60 is designated as the Y direction, a direction orthogonal to it is designated as the X direction, the axis along the Y direction is designated as the Y-axis, and the axis along the X direction is designated as the X-axis. The XY plane formed by the Y-axis and X-axis is parallel to the film-shaped electronic component F, the chip-shaped electronic component C, the display panel D, and the planes supporting them. In the following description, the XY plane may also be referred to as a horizontal plane.

[0125] Furthermore, the direction orthogonal to the XY plane and upward from the mounting surface is defined as the Z direction, and the axis along the Z direction is defined as the Z-axis. When the mounting surface is horizontal, the Z-axis is vertical. The Z-axis is perpendicular to the film-shaped electronic component F, the chip-shaped electronic component C, the display panel D, and the planes supporting them. In the following description, the Z direction is defined as upward, and the opposite direction is defined as downward. Furthermore, the rotation direction parallel to the XY plane with the Z-axis as its center is defined as the θ direction, and the rotation direction perpendicular to the XY plane with the Y-axis as its center is defined as the α direction. These directions are used to describe the positional relationships of the various structures of the electronic component mounting device and do not limit the positional relationships or directions when mounted on the mounting surface.

[0126] (Stamping supply device)

[0127] like Figure 2 as well as Figure 4 (A) and Figure 4 As shown in (B), the stamping supply device 10 has a supply section 110, a platform 120, a mold 130, and a lifting mechanism 140.

[0128] Supply section 110 includes a reel wound with a thin sheet-like component ST forming an electronic part, and is a mechanism for sequentially feeding out the stamped portions of the electronic part (see reference). Figure 2 Therefore, the supply section 110 is provided with a shaft that serves as the rotation center for mounting the reel and as the rotation axis of the reel, and a conveyor roller for feeding out the thin plate-shaped member ST.

[0129] Platform 120 is a support for mold 130. Mold 130 has a die head 131 and a punch 132.

[0130] The die head 131 has a flat surface for mounting a thin plate-shaped component ST fed from the supply unit 110, and is a flat plate-shaped component with a punch 131a formed therein. The punch 131a is a through hole that is substantially consistent with the shape of the film-shaped electronic component F. The die head 131 is fixed to the upper surface of the platform 120, and an opening 120a, which is a through hole larger than the punch 131a, is provided on the platform 120 at a position corresponding to the punch 131a.

[0131] The punch 132 is a generally rectangular cutting die with an outer edge that roughly coincides with the inner edge of the punch 131a. The bottom surface of the punch 132 faces the thin plate-shaped member ST placed on the die head 131, and moves along the Z-axis to insert into the punch 131a, thereby punching out a film-shaped electronic component F from the thin plate-shaped member ST. Although not shown, an adsorption hole connected to a pneumatic circuit is formed on the bottom surface of the punch 132, and the punched film-shaped electronic component F is held by negative pressure adsorption.

[0132] The lifting mechanism 140 is a mechanism for stamping the diaphragm electronic component F by moving the punch 132 along the Z-axis. The lifting mechanism 140 has a support part 141 and a drive part 142.

[0133] The support part 141 is a structural part that supports the punch 132 in a lifting and lowering manner. The support part 141 has a support column 141a and a support plate 141b. The support column 141a is four rod-shaped members erected on the die 131. The support plate 141b is a plate-shaped body installed on the upper end of the support column 141a in a manner parallel to the upper surface of the die 131.

[0134] The drive unit 142 is a device connected to the punch 132 and driving the punch 132 in the direction of contact and separation from the die head 131. A cylinder or the like can be used as the drive source for the drive unit 142. The drive unit 142 has a shaft 142a. The shaft 142a is connected to the drive source and passes through the support plate 141b and is connected to the punch 132. The drive source moves the shaft 142a up and down, thereby causing the punch 132 to punch out a film-shaped electronic component F. Furthermore, the lower moving end of the punch 132 becomes a receiving position for the first holding head H1. That is, the punch 132 stops when it reaches a position where it can receive the first holding head H1, while simultaneously holding and descending the film-shaped electronic component F it has punched out.

[0135] like Figure 2 As shown, a pair of stamping supply devices 10 are arranged along the X-axis in a top view. One stamping supply device 10a and the other stamping supply device 10b are positioned in a top view, separated by the transfer device 430 described below. Hereinafter, without distinguishing between stamping supply device 10a and stamping supply device 10b, they will be referred to as stamping supply device 10.

[0136] [Pallet supply device]

[0137] like Figure 5 (A) Figure 5 As shown in (F), the pallet supply device 20 has a frame 210 and a gripping part 220. The frame 210 is a pair of parallel elongated members. The distance between the pair of frames 210 is approximately the width of the pallet T, allowing the pallet T to pass through vertically. The gripping part 220 is provided on the opposing sides of the frame 210, and is configured to move forward and backward in a direction that contacts and separates from the side of the pallet T via a drive mechanism (not shown).

[0138] In the pallet supply device 20, a pallet T is held by a holding part 220, and multiple pallets T are stacked on it. Figure 5 (A)). The lower surface of the bottom tray T is the opposite side to the side that houses the chip-shaped electronic component C, and becomes the receiving position of the second holding head H2. Figure 5 (B)

[0139] like Figure 2 As shown, a pair of pallet supply devices 20 are arranged along the X-axis in a top view. One pallet supply device 20a and the other pallet supply device 20b are positioned across the transfer device 430 described below in a top view. Hereinafter, without distinguishing between pallet supply device 20a and pallet supply device 20b, they will be referred to as pallet supply device 20.

[0140] (Transfer device)

[0141] like Figure 2 as well as Figure 3 (A) and Figure 3 As shown in (B), the transfer device 40 is a device that receives the film-shaped electronic component F from the stamping supply device 10 and transfers it to the mounting device 60 via the bonding device 50. Additionally, the transfer device 40 is also a device that receives the chip-shaped electronic component C from the tray supply device 20 and transfers it to the mounting device 60. Figure 3 (A) and Figure 3 (B) Figures 6 to 8 (A) and Figure 8 As shown in (B), the transfer device 40 has a mounting part 410, a moving mechanism 420, and a transfer device 430.

[0142] (Installation Department)

[0143] The first retaining head H1 or the second retaining head H2 can be attached or detached relative to the mounting part 410. The mounting part 410 has a mounting part 411 and a locking part 412. The mounting part 411 is a cylindrical member that mounts the first retaining head H1 or the second retaining head H2. The locking part 412 consists of multiple pins erected from the upper surface of the mounting part 411. (See reference...) Figure 6 The first retaining head H1 and the second retaining head H2, which are detached and reattached relative to the mounting part 410, will be described.

[0144] The first holding head H1 holds the film-shaped electronic component F (see reference) supplied from the stamping supply device 10. Figure 3 (A) and Figure 3 (B)). The first retaining head H1 has a retaining part H11, a connecting part H12, and a support part H13.

[0145] The holding part H11 is a generally cuboid-shaped component whose length direction corresponds to the side of the film electronic component F on which the electrodes are arranged. Although not shown, an adsorption hole connected to the pneumatic circuit is formed on the upper surface of the holding part H11, and the stamped film electronic component F is held by adsorption under negative pressure.

[0146] The connecting part H12 is a generally cuboid-shaped component placed on the mounting part 410. Although not shown, a hole for inserting the locking part 412 is provided on the bottom surface of the connecting part H12. The support part H13 is a generally cuboid-shaped component that rises from the upper surface of the connecting part H12 to support the bottom of the retaining part H11.

[0147] The second holding head H2 holds the pallet T (refer to) supplied from the pallet supply device 20. Figure 3 (A) and Figure 3 (B)). The second holding head H2 has a holding part H21, a connecting part H22, and a support part H23.

[0148] The holding part H21 is a generally rectangular parallelepiped shape with its upper surface outer edge extending above the outer edge of the tray T. Although not shown, an adsorption hole connected to a pneumatic circuit is formed on the upper surface of the holding part H21, holding the tray T by negative pressure adsorption. Furthermore, from the viewpoint of preventing static electricity, there is a case where the bottom surface of the tray T has an uneven shape. In this case, since there is a possibility that sufficient adsorption force cannot be obtained in the uneven portion, it is preferable to avoid the uneven portion and form the adsorption hole at a position corresponding to a flat surface. For example, providing the adsorption hole at a position corresponding to the edge of the bottom surface of the tray T ensures stable adsorption.

[0149] The connecting part H22 is a generally cuboid-shaped component mounted on the mounting part 410. Although not shown, a hole for inserting the locking part 412 is provided on the bottom surface of the connecting part H22. That is, the connecting parts H12 and H22 of the first retaining head H1 and the second retaining head H2 have a common structure that allows them to be detached from the common mounting part 410. The support part H23 is a generally cuboid-shaped component that rises from the upper surface of the connecting part H22 and supports the bottom of the retaining part H21.

[0150] (Mobile organization)

[0151] like Figure 7 As shown in (A), the moving mechanism 420 moves the mounting portion 410, on which the first holding head H1 is mounted, between the stamping supply device 10 and the transfer device 430 described below. Or as Figure 7 As shown in (B), the moving mechanism 420 moves the mounting portion 410, on which the second holding head H2 is mounted, between the tray supply device 20 and the transfer device 430. The moving mechanism 420 is configured below the transfer device 430, for example, by incorporating a drive source (not shown) and a ball screw, slider, etc., in a manner that allows it to move along the XYZ directions.

[0152] (Transfer device)

[0153] like Figure 2As shown, the transfer device 430 is a device that receives the film-shaped electronic component F held by the first holding head H1 and transfers it to the mounting device 60 via the bonding device 50. Additionally, the transfer device 430 is also a device that receives the chip-shaped electronic component C from the tray T held by the second holding head H2 and transfers it to the mounting device 60.

[0154] like Figure 2 as well as Figure 3 (A) and Figure 3 As shown in (B), the transfer device 430 has a first arm 431, a cleaning device B, a measuring device G, and a second arm 432.

[0155] The first arm 431 is a component that can rotate on a plane parallel to the XY plane by a drive source such as a motor (not shown). The first arm 431 is a cross-shaped arm formed by four roughly cuboid arms extending from the center in a cross direction, with the center fixed to the rotation axis of the drive source (not shown). At the front end of the four arms, an adsorption nozzle 431a connected to a pneumatic circuit is provided. The adsorption nozzle 431a uses the negative pressure of the vacuum source of the pneumatic circuit to adsorb and hold the back side of the electrode portion of the film electronic component F held by the first holding head H1 from above over the entire width in the direction in which the electrodes of the film electronic component F are arranged.

[0156] The first arm 431 rotates intermittently every 90°. More specifically, viewed from the rotation axis of the first arm 431, when the Y-direction side where the stamping supply device 10 is located is set to the 12 o'clock position on a clock face, it rotates intermittently in a counterclockwise or clockwise direction, stopping at the 12 o'clock, 9 o'clock, 6 o'clock, and 3 o'clock positions. The first arm 431 rotates intermittently counterclockwise in the following sequence: receiving the film-shaped electronic component F from the first holding head H1 at the 12 o'clock position, bonding it with ACF using the bonding device 50 at the 9 o'clock position, transferring the film-shaped electronic component F with the bonded ACF to the second arm 432 at the 6 o'clock position, and passing through the 3 o'clock position.

[0157] like Figure 8 (A) Figure 8 As shown in (B), reference positions R1a and R1b are set at the front ends of the four arms of the first arm 431 to define the position of the receiving film electronic component F.

[0158] The reference position R1a is, for example, a reference line parallel to the direction of extension of each arm, set on the right side of the front end of each arm when viewed from the center side of the first arm 431. The reference position R1a is the reference position for bonding the film-shaped electronic component F to the ACF in the bonding device 50a described below, when the film-shaped electronic component F held by the first arm 431 is positioned at the 9 o'clock position by the rotation of the first arm 431. Here, it is the end of the supply side of the strip member TP of the pressure head 530 of the bonding device 50a. When the first arm 431 rotates counterclockwise and faces the bonding device 50a described below, the reference position R1a is the position aligned with the end of the film-shaped electronic component F (right side when viewed from the center of the first arm 431). Thus, the film-shaped electronic component F, regardless of its size, is transferred to the first arm 431 with one side aligned with the reference position R1a. In other words, the film-shaped electronic component F is aligned along the X direction at the 12 o'clock position with reference position R1a as a reference. Thus, when it faces the bonding device 50a by the rotation of the first arm 431, it is aligned with the bonding device 50a along the Y direction.

[0159] The reference position R1b is, for example, a reference line parallel to the direction of extension of each arm, set on the left side of the front end of each arm when viewed from the center side of the first arm 431. The reference position R1b is the reference position for bonding the film-shaped electronic component F to the ACF in the bonding device 50b described below, when the film-shaped electronic component F held by the first arm 431 is positioned at the 3 o'clock position by the rotation of the first arm 431. Here, it is the end of the supply side of the strip member TP of the pressure head 530 of the bonding device 50b. When the first arm 431 rotates clockwise and faces the bonding device 50b described below, the reference position R1b is the position aligned with the end of the film-shaped electronic component F (left side when viewed from the center of the first arm 431). Thus, the film-shaped electronic component F, regardless of its size, is transferred to the first arm 431 with one side aligned with the reference position R1b. In other words, the film-shaped electronic component F is aligned along the X direction at the 12 o'clock position with reference position R1b as the reference. Thus, when it faces the bonding device 50b by the rotation of the first arm 431, it is aligned with the bonding device 50b along the Y direction.

[0160] The cleaning device B is positioned below the first arm 431 at the aforementioned 12 points. The cleaning device B removes dirt and other contaminants adhering to the electrode portion of the stamped film-shaped electronic component F. The cleaning device B includes a brush B1. The brush B1 is arranged such that it can rotate about an axis in the X-axis direction, driven by a motor or other drive source (not shown). The cleaning device B is arranged such that it can move along a direction that separates from the electrode portion of the film-shaped electronic component F held by the first arm 431, driven by a drive mechanism (not shown).

[0161] The measuring device G is positioned below the first arm 431 at the aforementioned 12 o'clock position. The measuring device G has a push-out surface G1 parallel to the XZ plane. This push-out surface G1 can be moved along the Y direction via a drive mechanism (not shown). Thus, the push-out surface G1 of the measuring device G is extruded to the stamping supply device 10 side while being adsorbed by the adsorption nozzle 431a, causing the relative position of the film-shaped electronic component F with respect to the adsorption nozzle 431a to shift. That is, the measuring device G aligns the film-shaped electronic component F adsorbed by the adsorption nozzle 431a along the Y direction. Therefore, when the film-shaped electronic component F faces the bonding device 50 due to the rotation of the first arm 431, it is aligned with the bonding device 50 along the X direction. In other words, the measuring device G aligns the film-shaped electronic component F along the Y direction at the 12 o'clock position and along the X direction at the 9 o'clock position. By aligning the positions, the electrodes of the film electronic component F are positioned at the positions of the ACF supplied by the bonding device 50, thereby enabling high-precision bonding of the ACF using the bonding device 50.

[0162] The second arm 432 is disposed between the first arm 431 and the mounting device 60. The second arm 432 is a long strip member that can be rotated on a plane parallel to the XY plane by a drive source such as a motor. One end of the second arm 432 is fixed to the rotation shaft of a drive source (not shown). A rotating head 432a is provided at the front end of the second arm 432. The rotating head 432a is configured to rotate along the α direction with the length direction of the second arm 432 as the axis. The second arm 432 rotates intermittently every 180°. More specifically, it rotates intermittently in a counterclockwise or clockwise direction, stopping at the 12 o'clock position and the 6 o'clock position.

[0163] A suction nozzle 432b extending along the radius of the rotation circle is provided on the rotating head 432a. Although not shown, the suction nozzle 432b is connected to a pneumatic circuit and uses the negative pressure of a vacuum source to suction and hold film-shaped electronic components F or chip-shaped electronic components C. The direction of the tip of the suction nozzle 432b is changed by 180° by the rotating head 432a. That is, the second arm 432 is configured as a reverse transfer device capable of reversing the received components.

[0164] Therefore, when the adsorption nozzle 432b receives the film-shaped electronic component F held by the adsorption nozzle 431a of the first arm 431, it adsorbs and holds the electrode side of the film-shaped electronic component F from below. When picking up the chip-shaped electronic component C from the tray T held by the second holding head H2, it adsorbs and holds the chip-shaped electronic component C one by one from above. That is, the stamping supply device 10 stamps out the film-shaped electronic component F with the electrode portion facing down. The first holding head H1 holds the film-shaped electronic component F stamped out by the stamping supply device 10 from below with the electrode portion facing down and transfers it to the first arm 431. The adsorption nozzle 431a of the first arm 431 adsorbs and holds the film-shaped electronic component F held by the first holding head H1 from below from above. Therefore, when the adsorption nozzle 432b receives the film-shaped electronic component F from the adsorption nozzle 431a, the film-shaped electronic component F is held from above by the adsorption nozzle 431a with the electrode portion facing down, so the adsorption nozzle 432b adsorbs and holds the electrode side from below. In addition, a chip-shaped electronic component C is housed in a tray T held by the second holding head H2 with the electrode portion facing upwards, so the adsorption nozzle 432b adsorbs and holds the chip-shaped electronic component C from above.

[0165] When the rotating head 432a adsorbs and holds the film-shaped electronic component F through the adsorption nozzle 432b, it reaches the mounting device 60 with the electrode side facing down. That is, in this case, the rotating head 432a does not reverse. When the rotating head 432a adsorbs and holds the chip-shaped electronic component C through the adsorption nozzle 432b, the electrode side of the chip-shaped electronic component C faces down before reaching the mounting device 60. That is, in this case, the rotating head 432a reverses.

[0166] [Adhesion device]

[0167] The bonding device 50 bonds the electrode portion of the film-shaped electronic component F held by the suction nozzle 431a of the first arm 431 to the electrode portion (ACF). In this embodiment, a pair of bonding devices 50 are arranged along the X-axis from top view. One bonding device 50a and the other bonding device 50b are positioned across the transfer device 430 from top view. Specifically, bonding device 50a is located at the 9 o'clock position of the first arm 431, and bonding device 50b is located at the 3 o'clock position of the first arm 431. Hereinafter, bonding device 50a and bonding device 50b will not be distinguished as bonding device 50. Figure 9 As shown, the bonding device 50 includes a supply section 51, a cutting section 52, a bonding section 53, a peeling section 54, a conveying section 55, and a recycling section 56. Furthermore, Figure 9 The bonding device 50 shown is bonding device 50a, and bonding device 50b is described as a bonding device that includes a structure symmetrical to bonding device 50a with the YZ plane as the boundary.

[0168] (Supply Department)

[0169] The supply unit 51 supplies a strip member TP to the bonding unit 53. The strip member TP is, for example, an adhesive tape T1 including ACF bonded to a release tape T2. The release tape T2 is a strip that can be peeled off from the adhesive tape T1, and is formed, for example, from a resin film such as polyimide. Furthermore, the width of the strip member TP in this embodiment is approximately 0.5 mm to 3.5 mm.

[0170] The supply unit 51 includes a supply reel 510, a tension mechanism 511, and a path roller 512. The supply reel 510 is a reel that winds up a strip member TP and feeds the strip member TP out by rotation. The tension mechanism 511 applies tension to the strip member TP. The tension mechanism 511 consists of a pair of rollers spaced vertically apart to guide the movement of the strip member TP pulled from the supply reel 510. One roller is a fixed roller 511a that does not move vertically, and the other roller is a movable roller 511b that can move vertically. The movable roller 511b moves vertically via a lifting mechanism (not shown), that is, it moves in the direction of the black arrow in the figure. The path roller 512 is a roller that changes the direction of movement of the strip member TP from the tension mechanism 511 and feeds it toward the cutting unit 52.

[0171] (Cut section)

[0172] The cutting section 52 cuts the tape T1 in the strip member TP. Hereinafter, cutting only the tape T1 as described above will be referred to as a half-cut, and the slit formed in the tape T1 by the cutting section 52 will be referred to as a half-cut line HC. The half-cut lines HC are formed at intervals corresponding to the dimensions of the film-shaped electronic component F. The intervals between the half-cut lines HC are approximately the same as the length of the side where the film-shaped electronic component F connects to the display panel. That is, the intervals between the half-cut lines HC are determined based on the dimensions of the side where the installed film-shaped electronic component F connects to the display panel.

[0173] A cutting section 52 is located upstream of the bonding section 53 and includes a cutting machine 520 and a support member 521. The cutting machine 520 is a member that cuts the tape T1 along its width direction. That is, the blade at the front end of the cutting machine 520 extends along the width direction of the strip member TP. In addition, the cutting machine 520 is separated from the tape T1 by a moving mechanism (not shown). As described above, the cutting machine 520 forms a semi-tangent HC on the strip member TP supplied by the supply section 51 according to the size of the film electronic component F. The support member 521 is a block with a generally rectangular parallelepiped shape. The support member 521 holds the strip member TP between itself and the cutting machine 520 and has a flat surface 521a that contacts the release belt T2.

[0174] (Adhesive part)

[0175] The bonding portion 53 bonds the tape T1 from the strip member TP to the electrode portion of the film-shaped electronic component F. The bonding portion 53 includes a pressure head 530 and a support member 531. The pressure head 530 moves up and down via a lifting device (not shown), thereby pushing up the strip member TP to heat and pressurize the tape T1 on the electrode portion of the film-shaped electronic component F. Therefore, a heater (not shown) is provided in the pressure head 530 to heat the contact surface with the strip member TP to a specific temperature. Furthermore, a buffer member 530a is provided in the pressure head 530 on the contact surface with the strip member TP. The buffer member 530a is, for example, a sheet formed of an elastomer, to prevent the tape T1, which softens due to heating, from adhering to the pressure head 530. The support member 531 is a member that supports the first arm 431 from above when the tape T1 is heated and pressed onto the electrode portion of the film-shaped electronic component F by the pressure head 530. The support member 531 has a pair of support rollers 531a in a position facing the pressure head 530. On the outer peripheral surface of the support rollers 531a, the film-shaped electronic component F is held by the adsorption nozzle 431a, supporting the upper surface of the first arm 431 that rotates and is aligned with the position of the bonding device 50.

[0176] A bonding position R2 is provided in the bonding section 53. The bonding position R2 is a reference position that is aligned with the position of the half-tangent HC of the tape T1 in the strip member TP by the conveying section 55 described below. Here, it is the position of the end of the supply section 51 side of the pressure head 530 in the moving direction of the strip member TP.

[0177] (Stripping section)

[0178] The peeling section 54 peels the release strip T2 from the adhesive tape T1 adhered to the film-shaped electronic component F. The peeling section 54 has peeling rods 540 and 541. Peeling rods 540 and 541 are, for example, round rods and are components that contact the release strip T2. Peeling rod 540 contacts the surface of the release strip T2, i.e., the surface on the side of the adhesive tape T1, and peeling rod 541 contacts the back surface of the release strip T2. Peeling rods 540 and 541 are moved by a mechanism (not shown) and... Figure 9 As shown, while holding the release strip T2, it moves horizontally along the upstream side of the strip member TP (in the direction of the dashed arrow), thereby peeling the release strip T2 off from the tape T1 pressed against the film electronic component F.

[0179] (Transportation Department)

[0180] The conveying unit 55 transports the strip member TP from the supply unit 51 to the bonding unit 53 and then to the recovery unit 56. Specifically, the conveying unit 55 delivers the strip member TP to the bonding position R2 with a semi-tangential alignment HC. The conveying unit 55 includes a transfer roller 550 and a transfer motor (not shown). The transfer roller 550 holds the demolding strip T2 between a pair of rollers, and the rotation of the rollers moves the strip member TP from the supply unit 51 side to the recovery unit 56 side. The transfer motor is the drive source for rotating the transfer roller 550. The rotation shaft of the transfer motor is connected to the transfer roller 550, and the motor drives the rotation shaft to rotate around the shaft, thereby causing the transfer roller 550 to rotate around the rotation shaft.

[0181] (Recycling Department)

[0182] The recycling unit 56 collects the release tape T2 that has been peeled off from the adhesive tape T1 attached to the electrode portion of the film-shaped electronic component F in the bonding unit 53. The recycling unit 56 includes a recycling reel 560 and a path roller 561. The recycling reel 560 is a reel that winds up and collects the release tape T2. The path roller 561 is a roller that changes the movement direction of the release tape T2 from the bonding unit 53 side and feeds it toward the recycling reel 560.

[0183] [Installation Device]

[0184] like Figure 2 as well as Figure 3 (A) and Figure 3 As shown in (B), the mounting device 60 is a device that heats and presses the electrodes of the film-shaped electronic component F or the electrodes of the chip-shaped electronic component C onto the electrodes of the display panel D through the ACF.

[0185] The mounting device 60 includes a platform 610 and a pressing part 620. The platform 610 is a horizontal plate-shaped body that holds the display panel D. Although not shown, an adsorption hole connected to a pneumatic circuit is formed on the upper surface of the platform 610, and the display panel D is held in place by negative pressure adsorption. The platform 610 is configured to be movable along the X-axis, Y-axis, and θ-axis directions by a drive mechanism (not shown).

[0186] like Figure 3 (A) and Figure 3 As shown in (B), the pressing part 620 includes a pressing member 621 and a support member 622. The pressing member 621, via a drive mechanism (not shown), causes the film-shaped electronic component F or the chip-shaped electronic component C to overlap onto the display panel D supported by the platform 610, and then heats and presses it. The pressing member 621 holds the film-shaped electronic component F or the chip-shaped electronic component C by adsorption via a holding part (not shown), and is heated by a heating device (not shown). The support member 622 is a member that supports the display panel D when the film-shaped electronic component F or the chip-shaped electronic component C is heated and pressed through the ACF by the pressing member 621.

[0187] Furthermore, although detailed descriptions are omitted in this embodiment, when heat-pressing the chip-shaped electronic component C, ACF is pre-attached to the display panel D side. Additionally, even when heat-pressing the film-shaped electronic component F, ACF can be pre-attached to the display panel D side. In these cases, the ACF is not attached using the bonding device 50.

[0188] The crimping section 620 is a device used to perform temporary crimping before final crimping. After temporary crimping using the crimping section 620, although not shown, formal crimping is performed using the formal crimping section located in the downstream process.

[0189] [Control Device]

[0190] like Figure 10 As shown, the control device 80 includes a mechanism control unit 81, a storage unit 82, and an input / output control unit 83. The mechanism control unit 81 controls the operation of each component of the stamping supply device 10, the tray supply device 20, the transfer device 40, the bonding device 50, and the mounting device 60. The storage unit 82 stores information required for control in this embodiment, such as programs and data, used to implement the control of each component. The input / output control unit 83 is an interface for controlling the conversion or input / output of signals between the components that are controlled.

[0191] Furthermore, the control device 80 is connected to an input device 91 and an output device 92. The input device 91 is an input component used by the operator to operate the electronic component mounting device via the control device 80, such as a switch, touch panel, keyboard, and mouse. The output device 92 is an output component such as a display device used to confirm the status of the electronic component mounting device so that the information is visible to the operator.

[0192] [effect]

[0193] The function of the above-mentioned electronic component mounting device will be explained in the cases of mounting film-shaped electronic components F and mounting chip-shaped electronic components C.

[0194] (Assembly of film-type electronic components)

[0195] First, refer to Figure 3 (A) Figures 11 to 13 (A) and Figure 13 Section (B) describes the sequence of mounting the film-shaped electronic component F. For the mounting section 410, the first retaining head H1 is pre-mounted. Furthermore, the conveying section 55 positions the semi-tangent HC of the strip-shaped member TP, which has a semi-tangent HC, at the bonding position R2. (As...) Figure 11As shown, the moving mechanism 420 moves the first holding head H1, which is mounted on the mounting portion 410, to a position directly below the stamping supply device 10 (step S01). In the stamping supply device 10, a film-shaped electronic component F is stamped out (step S02). The stamped film-shaped electronic component F descends in a state adsorbed by the punch 132, and upon release from adsorption, is adsorbed by the holding portion H11 of the first holding head H1. Thus, the first holding head H1 receives the film-shaped electronic component F (step S03).

[0196] The moving mechanism 420 moves the first holding head H1, which receives the film-shaped electronic component F, to the lower part of the adsorption nozzle 431a at the end of the first arm 431 (step S04). That is, the moving mechanism 420 moves the first holding head H1 so that the film-shaped electronic component F is located directly below the adsorption nozzle 431a of the arm located at the aforementioned 12 o'clock position among the four arms of the first arm 431.

[0197] Then, the moving mechanism 420 positions the film-shaped electronic component F along the X direction with its end aligned with the reference position R1a or reference position R1b of the first arm 431 (step S05). The position at which the end of the film-shaped electronic component F is aligned with the reference position R1a or reference position R1b is determined based on the rotation direction of the first arm 431. That is, when the first arm 431 is rotated counterclockwise so that the film-shaped electronic component F faces the bonding device 50a, the end of the film-shaped electronic component F (viewed from the center of the first arm 431 to the right) is aligned with the reference position R1a. Conversely, when the first arm 431 is rotated clockwise so that the film-shaped electronic component F faces the bonding device 50b, the end of the film-shaped electronic component F (viewed from the center of the first arm 431 to the left) is aligned with the reference position R1b. After aligning the end of the film electronic component F with the reference position R1a or the reference position R1b, the adsorption of the holding part H11 of the first holding head H1 is released, and adsorption is performed using the adsorption nozzle 431a. Thus, the first arm 431 receives the film electronic component F while the end of the film electronic component F is aligned with the reference position R1a or the reference position R1b (step S06).

[0198] Next, at the aforementioned 12 o'clock position, the cleaning device B rises and contacts the rotating brush B1, thereby cleaning the electrode portion of the film-shaped electronic component F (step S07). Then, after the cleaning device B finishes cleaning and descends, the push surface G1 of the measuring device G moves towards the 12 o'clock position and comes into contact with the film-shaped electronic component F, thereby aligning the film-shaped electronic component F adsorbed by the adsorption nozzle 431a along the Y direction (step S08).

[0199] Then, referring to Figure 12The bonding of the ACF to the film electronic component F and the temporary pressing of the film electronic component F to the display panel D will be described. After cleaning with the cleaning device B and positioning with the measuring device G at the 12 o'clock position, the first arm 431 is rotated counterclockwise or clockwise, thereby positioning the film electronic component F in the bonding device 50a at the 9 o'clock position or the bonding device 50b at the 3 o'clock position (step S11). More specifically, the upper surface of the first arm 431 abuts against the support roller 531a and enters between the support member 531 and the strip member TP, so that it is positioned with the film electronic component F attached to the first arm 431.

[0200] At this time, when the reference position R1a or reference position R1b set on the first arm 431 rotates to the bonding device 50 at the 12 o'clock position, it is set at the bonding ACF position. Therefore, the reference position R1a or reference position R1b set on the first arm 431 coincides with the bonding position R2 set on the pressure head 530. In addition, as described above, the semi-tangent HC of the strip member TP with the semi-tangent HC is positioned at the bonding position R2. That is, as Figure 13 As shown in (A), the reference position R1a, the semi-tangent HC, and the mating position R2 are all consistent. Additionally, as... Figure 13 As shown in (B), the reference position R1b, the half-tangent HC, and the bonding position R2 are all consistent. Therefore, in the bonding device 50, whenever the size of the film electronic component F changes, it is not necessary to control the position of the half-tangent HC of the strip member TP or to set a moving mechanism to move the end of the pressure head 530, and the ACF can be bonded to the film electronic component F of different sizes.

[0201] In this state, the support roller 531a of the support member 531 supports the upper surface of the first arm 431. Then, the pressure head 530 rises (step S12), pushing the strip member TP from the demolding tape T2 side, causing the half-cut adhesive tape T1 to adhere to the electrode portion of the film electronic component F (step S13). After the adhesive tape T1 is adhered, the pressure head 530 descends, causing the peeling rods 540 and 541 to move horizontally to the upstream side of the strip member TP, thereby peeling the demolding tape T2 from the adhesive tape T1 adhered to the electrode portion of the film electronic component F (step S14). The adhesive tape T1, i.e., ACF, is adhered to the film electronic component F in this manner.

[0202] After the film-shaped electronic component F is attached to the ACF, the first arm 431 is rotated, thereby positioning the film-shaped electronic component F at the 6 o'clock position. The film-shaped electronic component F is then moved to the upper part of the adsorption nozzle 432b of the second arm 432, which is waiting at the 12 o'clock position (step S15). Then, the adsorption using the adsorption nozzle 431a of the first arm 431 is released, while adsorption using the adsorption nozzle 432b is performed simultaneously, thereby transferring the film-shaped electronic component F to the second arm 432 (step S16).

[0203] The second arm 432 rotates 180° in the XY plane, moving the film-shaped electronic component F to the pressing section 620 of the mounting device 60 (step S17). The adsorption using the adsorption nozzle 432b of the second arm 432 is released, while adsorption using the pressure member 621 is performed simultaneously, thereby holding the film-shaped electronic component F in place by the pressure member 621. Then, the pressure member 621 with the film-shaped electronic component F adsorbed descends, thereby heating and pressing the electrode of the film-shaped electronic component F onto the electrode of the display panel D through the ACF (step S18). The adsorption using the pressure member 621 is released, and the display panel D with the film-shaped electronic component F temporarily pressed onto it is transported to the formal pressing section for formal pressing.

[0204] Furthermore, the supply of the film-shaped electronic component F is initially performed via one of the stamping supply devices 10a. Then, after the sheet-like component ST in the supply section 110 of the stamping supply device 10a is depleted, the system switches to another stamping supply device 10b to continue supplying the film-shaped electronic component F. During this period, the reel of the sheet-like component ST from the stamping supply device 10a is replaced, and after the sheet-like component ST from the other stamping supply device 10b is depleted, the system switches back to supplying the film-shaped electronic component F using the stamping supply device 10a. Thus, installation can be performed continuously without stopping the electronic component mounting device.

[0205] In addition, such as Figure 2 As shown, the supply and bonding of the strip member TP is first performed by one of the bonding devices 50a. Then, after the supply section 51 of the bonding device 50a has used up the strip member TP, it is switched to another bonding device 50b to continue supplying the strip member TP. In this case, as Figure 8 As shown in (B), the first arm 431 rotates clockwise, changing the position of the end aligned with the film-shaped electronic component F from reference position R1a to reference position R1b. This allows for continuous ACF bonding without stopping the electronic component mounting device. Furthermore, during this period, the reel of the strip member TP of the bonding device 50a is replaced, and after the strip member TP of the other bonding device 50b is used up, the system switches back to supplying the strip member TP from the bonding device 50a, as shown in (B). Figure 8As shown in (A), the rotation direction of the first arm 431 becomes counterclockwise again, so that the position of the end aligned with the film electronic component F returns from the reference position R1b to the reference position R1a.

[0206] (Assembly of chip-shaped electronic components)

[0207] Then, referring to Figure 3 (B) Figure 5 (A) Figure 5 of (F), Figure 14 The installation sequence of the chip-shaped electronic component C is explained. For the mounting section 410, the second retaining head H2 is pre-installed. (As follows...) Figure 5 As shown in (A), the moving mechanism 420 moves the pallet feeder 20 such that the second retaining head H2 mounted on the mounting portion 410 is positioned directly below it (step S21). In the pallet feeder 20, as... Figure 5 As shown in (B), the holding portion H21 of the second holding head H2 comes into contact with the bottom surface of the lowest tray T and is held in place (step S22). Then, the holding portion H21 of the second holding head H2 receives the tray T in the following sequence (step S23).

[0208] like Figure 5 As shown in (C), the tray supply device 20 releases the grip of the gripping part 220. Then, as... Figure 5 As shown in (D), the second holding head H2 lowers by the amount of a tray T. The holding part 220 is as follows... Figure 5 As shown in (E), the tray T, which is one level higher than the bottom layer, is held by the holding part 220. Figure 5 As shown in (F), the second holding head H2 descends, transferring the tray T to the holding part H21.

[0209] The moving mechanism 420 moves the second holding head H2, which has received the tray T, to the lower part of the suction nozzle 432b of the second arm 432 (step S24). That is, the moving mechanism 420 moves the second holding head H2 such that the tray T is located below the suction nozzle 432b of the second arm 432, which is located at the 12 o'clock position. The suction nozzle 432b of the second arm 432 faces the tray T held by the second holding head H2 by the rotation of the rotating head 432a.

[0210] The moving mechanism 420 sequentially positions each chip-shaped electronic component C on the tray T opposite the suction nozzle 432b of the second arm 432. Furthermore, this positioning can be performed by scanning the tray T with a scanning unit (not shown). More specifically, the tray T is provided with grid-like receiving sections, within which the chip-shaped electronic components C are housed. Therefore, each receiving section is sequentially positioned at the position where the suction nozzle 432b of the second arm 432 receives the chip-shaped electronic component C, i.e., directly below the suction nozzle 432b when the second arm 432 stops at the 12 o'clock position. Then, after positioning one receiving section on the tray T, suction is initiated using the suction nozzle 432b, thereby transferring the chip-shaped electronic component C to the second arm 432 (step S25).

[0211] The second arm 432 rotates 180° in the XY plane, moving the chip-shaped electronic component C to the crimping portion 620 of the mounting device 60 (step S26). During this movement, the rotating head 432a rotates in the α direction while the electrodes of the chip-shaped electronic component C face downwards. The suction of the second arm 432 using the suction nozzle 432b is released, while the pressure member 621 of the crimping portion 620 is used to hold the chip-shaped electronic component C. Then, the electrode portion of the chip-shaped electronic component C is heated and crimped to the electrodes of the display panel D through the ACF (step S27). The suction of the pressure member 621 is released, and the display panel D with the chip-shaped electronic component C temporarily crimped is moved to the formal crimping portion for formal crimping.

[0212] Furthermore, after removing the chip-shaped electronic component C from a tray T, the moving mechanism 420 conveys the second holding head H2, which holds the empty tray T, to the receiving portion of the empty tray T prepared in the tray supply device 20, and transfers the tray T to the receiving portion. Then, as described above, the moving mechanism 420 receives the tray T containing the chip-shaped electronic component C through the second holding head H2 and performs the installation of the chip-shaped electronic component C. Furthermore, the receiving portion of the empty tray T can, for example, be provided in an adjacent position to the tray supply device 20 with the same structure as the tray supply device 20. By configuring it in this way, the reverse order of the tray supply device 20 can be performed, i.e., in... Figure 5 The empty tray T is stacked sequentially from (F), (E), (D), (C), (B), and (A) and contained therein.

[0213] The supply of this tray T is initially carried out through one of the tray supply devices 20a. Then, after the tray T containing the chip-shaped electronic component C is used up, the supply is switched from tray supply device 20a to another tray supply device 20b to continue supplying the tray T. During this period, the tray T of tray supply device 20a is replaced, and after the tray T of the other tray supply device 20b is used up, the supply is switched back to the tray T supplied by tray supply device 20a. Thus, installation can be continued without stopping the electronic component mounting device.

[0214] [Effect]

[0215] (1) The electronic component mounting apparatus of this embodiment includes: a supply device for supplying a film-shaped electronic component F; a first bonding device 50a for bonding an anisotropic conductive member to the film-shaped electronic component F; a second bonding device 50b for bonding anisotropic conductive members to the film-shaped electronic component F; a mounting device 60 for mounting the film-shaped electronic component F with the anisotropic conductive member bonded to the display panel D; and a transfer device 40 for receiving the film-shaped electronic component F from the stamping supply device 10, bonding anisotropic conductive members through the first bonding device 50a or the second bonding device 50b, and then transferring it to the mounting device 60.

[0216] Therefore, even if the strip member TP in the first bonding device 50a runs out, the bonding of tape T1, i.e., ACF, can continue using the second bonding device 50b, thus improving productivity. Furthermore, the strip member TP can be replenished to the first bonding device 50a during ACF bonding using the second bonding device 50b, allowing ACF bonding to continue without stopping the electronic component mounting apparatus. Moreover, even in the event of a malfunction in the first bonding device 50a, the second bonding device 50b can still operate, thus preventing an immediate decrease in productivity.

[0217] (2) In this embodiment, the transfer device 40 is set with a reference position for aligning the bonding position R2 of the anisotropic conductive component with the first bonding device 50a or the second bonding device 50b. The transfer device 40 receives the film electronic component F from the supply device by aligning the end of the film electronic component F with the reference position.

[0218] In existing technologies, when bonding ACF to COF of various sizes, the end of the pressure head needs to be aligned with the slit in the ACF each time the size of the COF changes. For example, as Figure 16 (A) Figure 16 As shown in (C), in order to deal with COFs of different sizes, it is necessary to add an adjustment mechanism to align the cut of the ACF with the end face of the COF, a moving mechanism to align the end of the pressure head with the cut of the ACF, and the aforementioned adjustment and moving mechanisms.

[0219] On the other hand, in the electronic component mounting apparatus of this embodiment, such as Figure 15 (A) Figure 15 As shown in (C), even for film-shaped electronic components F of different sizes, their ends are aligned with the reference position R1. Therefore, even if the size of the supplied film-shaped electronic component F changes, the ACF can be accurately bonded to the film-shaped electronic component F without the need for a moving mechanism that moves the pressure head 530 of the bonding device 50. This eliminates the time and effort spent on aligning the pressure head 530 of the bonding device 50, thus improving productivity, and also eliminates the need for a moving mechanism that moves the pressure head 530, thus reducing costs.

[0220] (3) The reference positions in this embodiment include: a first reference position R1a, used to align with the bonding position R2 of the first bonding device 50a; and a second reference position R1b, used to align with the bonding position R2 of the second bonding device 50b. As described above, by individually setting reference positions for each bonding device 50, the bonding devices 50 can be freely configured in the overall structure of the electronic component mounting device. In particular, by symmetrically setting reference positions R1a and R1b on the first arm 431, the bonding devices 50a and 50b can be symmetrically arranged on the junction device 40, thus making efficient use of space.

[0221] (4) The transfer device 40 of this embodiment includes: a first arm 431 for receiving a film-shaped electronic component F from the stamping supply device 10; and a measuring device G for adjusting the position of the first arm 431 receiving the film-shaped electronic component F while aligning the end of the film-shaped electronic component F with the reference position R1. Thus, the position alignment of the anisotropic conductive component and the film-shaped electronic component F can also be performed in the width direction of the anisotropic conductive component.

[0222] (5) The electronic component mounting apparatus of this embodiment further includes: a tray supply device 20 that supplies a tray T containing a chip-shaped electronic component C, and a transfer device 40 that receives the chip-shaped electronic component C from the tray supply device 20 and transfers it to a mounting device 60, wherein the mounting device 60 mounts the chip-shaped electronic component C onto a display panel D pre-attached with an anisotropic conductive member. Thus, it is possible to selectively mount a film-shaped electronic component F with anisotropic conductive members attached to the display panel D, and to mount the chip-shaped electronic component C onto the display panel D with anisotropic conductive members attached.

[0223] [Variation Example]

[0224] (1) In the described embodiment, only the structure of alternating between one stamping supply device 10a and another stamping supply device 10b has been described. However, it is also possible to install thin plate-shaped members ST with film-shaped electronic components F of different sizes on one stamping supply device 10a and another stamping supply device 10b. With this embodiment, when the size of COF changes each time, it is not necessary to align the position of the slit of ACF with the end of COF. Therefore, multiple film-shaped electronic components F of different sizes can be easily installed on the display panel D without stopping the electronic component mounting device.

[0225] (2) In the embodiment described above, a stamping supply device 10 is used as the structure for supplying the film electronic component F, which is stamped out of the film electronic component F from the thin plate member ST, but it is not limited thereto. For example, a supply device for supplying film electronic components F that have been pre-stamped from the thin plate member ST may also be used.

[0226] (3) The bonding device 50 of the embodiment includes a supply section 51, a cutting section 52, a bonding section 53, a peeling section 54, a conveying section 55, and a recycling section 56, but is not limited thereto. The bonding device 50 may include at least the bonding section 53. Other structures, namely the supply section 51, the cutting section 52, the peeling section 54, the conveying section 55, and the recycling section 56, may be different from those of the bonding device 50.

[0227] (4) In the embodiment described above, the tape T1 has a semi-tangent line HC formed as a slit through the cutting portion 52, but it is not limited to this. The tape T1 may also be a tape with slits formed in advance according to the size of the film electronic component F. In addition, it is not necessary to form slits in the tape T1. For example, numerous fine holes may be formed on the entire surface of the tape T1, and the peeling portion 54 may be used to tear the tape with the end of the film electronic component F as the boundary line.

[0228] (5) In the described embodiment, when the strip member TP of the supply section 51 of the bonding device 50a is exhausted, the bonding device 50b is switched on, but this is not a limitation. The bonding devices 50a and 50b can also operate simultaneously. For example, the end of the film-shaped electronic component F can be aligned with the reference position R1a first, the first arm 431 can be rotated counterclockwise, the bonding device 50a can bond the ACF to the film-shaped electronic component F, and then the film-shaped electronic component F can be transferred to the second arm. Then, the end of the film-shaped electronic component F can be aligned with the reference position R1b, the first arm 431 can be rotated clockwise, the bonding device 50b can bond the ACF to the film-shaped electronic component F, and then the film-shaped electronic component F can be transferred to the second arm. In this case, even if one of the bonding devices 50 malfunctions, the other bonding device 50 can still operate.

[0229] (6) The electronic component mounting device may include a mounting portion 410 for a first holding head H1 and a second holding head H2, and is not limited to a structure that allows for the replacement of both. For example, it may be a device having multiple mounting portions 410, with the first holding head H1 fixed to one and the second holding head H2 fixed to the other. Thus, the mounting of the film-shaped electronic component F and the mounting of the chip-shaped electronic component C can be switched without replacing the first holding head H1 and the second holding head H2.

[0230] (7) A pair of moving mechanisms 420 may also be provided along the X-axis direction, separated by the transfer device 430. That is, one moving mechanism 420 may be provided corresponding to one of the stamping supply devices 10a and pallet supply devices 20a, and another moving mechanism 420 may be provided corresponding to the other stamping supply device 10b and pallet supply device 20b. In addition, a pair of first holding heads H1 and second holding heads H2 may also be provided corresponding to a pair of moving mechanisms 420, respectively.

[0231] (8) The moving paths of the film-shaped electronic component F and the chip-shaped electronic component C are common to the second arm 432. Therefore, by setting up cameras to photograph the film-shaped electronic component F and the chip-shaped electronic component C at two stopping positions (12 o'clock and 6 o'clock) on the second arm 432, positioning can be achieved using the common cameras. For example, at the 12 o'clock position, a pre-alignment camera is positioned above the adsorption nozzle 432b. When the film-shaped electronic component F is held by the adsorption nozzle 432b, the camera is used to photograph the alignment marks at both ends of the electrode portion provided in the film-shaped electronic component F, and the position of the film-shaped electronic component F is identified based on the alignment marks. Identification can be performed by the control device 80 using known image recognition technology. Based on the identified position, when transferring the film-shaped electronic component F to the pressure member 621, the relative position of the adsorption nozzle 432b and the pressure member 621 is adjusted. This ensures the positional accuracy of the film-shaped electronic component F when it is transferred to the pressure member 621.

[0232] Furthermore, when removing the chip-shaped electronic component C from the tray T, an alignment mark is photographed on the electrode surface of the chip-shaped electronic component C, and the position of the chip-shaped electronic component C is identified based on the alignment mark. Based on the identified position, the relative position of the adsorption nozzle 432b and the chip-shaped electronic component C is adjusted. This ensures the positional accuracy of the film-shaped electronic component F upon transfer to the pressure member 621.

[0233] On the other hand, a pair of simultaneous recognition cameras for temporary pressing are configured at the 6 o'clock position. These cameras simultaneously capture and photograph the alignment marks at one end of the electrode portion of both the film-shaped electronic component F and the chip-shaped electronic component C, as well as the corresponding alignment marks on the display panel D. The pair of simultaneous recognition cameras are configured to correspond to the alignment marks at both ends of the film-shaped electronic component F and the chip-shaped electronic component C. Therefore, accuracy can be ensured whether the film-shaped electronic component F or the chip-shaped electronic component C is being temporarily pressed.

[0234] [Other Implementation Methods]

[0235] The embodiments and variations of the present invention have been described above. However, these embodiments and variations are provided as examples and do not limit the scope of the invention. These novel embodiments can be implemented in various other ways, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments or variations thereof are included in the scope or spirit of the invention and are included in the invention as described in the claims.

Claims

1. An electronic component mounting device, comprising: Supply device, supplying membrane electronic components; The first bonding device bonds the anisotropic conductive component to the film-shaped electronic component; The second bonding device bonds the anisotropic conductive component to the film-shaped electronic component; The mounting device mounts the film-shaped electronic component, on which the anisotropic conductive component is attached, onto the display panel; as well as The transfer device receives the film-shaped electronic component from the supply device, attaches it to the anisotropic conductive component via the first bonding device or the second bonding device, and then transfers the film-shaped electronic component to the mounting device. The transfer device has a first arm that receives and rotates the film-shaped electronic component from the supply device. A reference position is set in the first arm, which is used to align the bonding position of the first bonding device or the second bonding device with the anisotropic conductive component. The first arm aligns the end of the film-shaped electronic component with the reference position and receives the film-shaped electronic component from the supply device.

2. The electronic component mounting device according to claim 1, wherein... The reference position includes: The first reference position is used to align the bonding position of the first bonding device; as well as The second reference position is used to align the bonding position of the second bonding device.

3. The electronic component mounting device according to claim 1, wherein... The handover device includes: The measuring device adjusts the position of the first arm receiving the film-shaped electronic component while aligning the end of the film-shaped electronic component with the reference position.

4. The electronic component mounting device according to claim 1, wherein... The first bonding device and the second bonding device include: A support member supports the first arm that receives the membrane electronic component, and The support member has a pair of support rollers, and the first arm is supported by the outer peripheral surface of the support rollers.

5. The electronic component mounting apparatus according to any one of claims 1 to 4, further comprising: A tray supply device supplies trays containing chip-shaped electronic components, and The transfer device receives the chip-shaped electronic component from the tray supply device and transfers the chip-shaped electronic component to the mounting device. The mounting device mounts the chip-shaped electronic components onto a display panel pre-attached with anisotropic conductive components.

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