A method for indirect analysis of high and low hardness bump lattice performance

Abstract

The present invention provides a method for indirectly analyzing the performance of high and low hardness bump lattices, and the method for indirectly analyzing the performance of high and low hardness bump lattices includes the following steps: S1: using a hard substance and applying a force of equal gram strength to press the surface of a gold bump; S2: slicing the pressed area of ​​the gold bump; S3: observing the sliced ​​gold bump using a SEM electron microscope; S4: observing the arrangement of the metal lattices, wherein the arrangement of the soft and hard gold bump lattices is more divergent than the arrangement of the high hardness gold bump lattices. The method for indirectly analyzing the performance of high and low hardness bump lattices provided by the present invention has the advantages that the analysis method can be used to detect and analyze the soft and hard anomalies of the gold bump, and combined with the gold bump manufacturing process, it can help improve the problem of soft and hard gold bumps.

Description

Technical Field

[0001] The present invention relates to the field of driver chip gold bump packaging, and in particular to a method for indirectly analyzing high and low hardness bump lattice performance. Background Art

[0002] IC packaging refers to connecting the circuit pins on the silicon chip to the external connector with wires so as to connect with other devices. It not only plays the role of installing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance, but also connects the contacts on the chip to the pins of the package shell with wires. These pins are connected to other devices through wires on the printed circuit board, thereby realizing the connection between the internal chip and the external circuit.

[0003] Gold bumps are required in driver IC packaging. In the gold bump packaging process, the softness and hardness of the gold bumps may be abnormal;

[0004] At present, in the gold bump packaging process, the hardness of the gold bump is tested. When encountering soft and hard gold bumps, how to quickly analyze the difference in the gold lattice arrangement of the soft and hard bumps is a problem that needs to be solved.

[0005] Therefore, it is necessary to provide a method for indirectly analyzing the performance of high and low hardness bump lattices to solve the above technical problems. Summary of the invention

[0006] The present invention provides a method for indirectly analyzing the lattice performance of high and low hardness bumps, which solves the problem of how to quickly analyze the difference in gold lattice arrangement of soft and hard gold bumps when detecting the hardness of gold bumps in the gold bump packaging process.

[0007] In order to solve the above technical problems, the present invention provides a method for indirectly analyzing the high and low hardness bump lattice performance, comprising the following steps:

[0008] S1: Use a hard substance and apply the same force to press the surface of the gold bump;

[0009] S2: Slice the gold bump pressing area;

[0010] S3: SEM electron microscope observation of the sliced ​​gold bumps;

[0011] S4: Observe the metal lattice arrangement, where the arrangement of the soft hardness gold bump lattice is more divergent than that of the high hardness gold bump lattice.

[0012] Preferably, the SEM electron microscope observation magnification in S3 is 2450-2550x.

[0013] Preferably, the gold bump is pressed and sliced ​​by a pressing and slicing device, which includes a support frame, a mounting frame is fixedly provided on the top of the support frame, a first telescopic cylinder is fixedly installed on the top of the mounting frame, and an extrusion plate is fixedly installed on one end of the output shaft of the first telescopic cylinder.

[0014] Preferably, the extrusion plate includes a connecting plate and a hard plate, the hard plate is fixed to the bottom of the connecting plate, both sides of the extrusion plate are fixedly installed with first side positioning members through a first adjustment mechanism, and both sides of the two first side positioning members are provided with second side positioning members through a second adjustment mechanism.

[0015] By setting a first telescopic cylinder and an extrusion plate, and setting a first side positioning piece and a second side positioning piece on the extrusion plate, the four sides of the gold bump can be positioned by the two first side positioning pieces cooperating with the two second side positioning pieces, so that the gold bump is more stable during cutting and the cutting quality is improved.

[0016] Preferably, the first adjustment mechanism and the second adjustment mechanism both include a first threaded column and a second threaded column, the surfaces of the first threaded column and the second threaded column are both sleeved with rings, and the surface of the first threaded column and on both sides of the ring are threadedly connected with star nuts.

[0017] Preferably, a star nut is threadedly connected on the surface of the second threaded column and located on the outer side of the collar.

[0018] Preferably, the two star nuts located on the surface of the first threaded column are fixedly connected by a connecting rod, and the connecting rod passes through the collar.

[0019] The first adjusting mechanism cooperates with the second adjusting mechanism to adjust the positions of the first side positioning member and the second side positioning member according to the size of the gold bump, thereby being able to adapt to gold bumps of different sizes, being easy to use, and having simple adjustment operations.

[0020] Preferably, the first side positioning member includes a positioning plate and a connecting plate, the positioning plate is arranged in the middle of the bottom of the connecting plate, connecting arms are fixed on both sides of the top of the connecting plate, sliding cavities are symmetrically opened on both sides of the extrusion plate, and one end of the connecting arm is fixedly connected to the bottom of the ring located on the upper side of the extrusion plate through the sliding cavity.

[0021] Preferably, the second side positioning member comprises a limiting plate, both sides of the limiting plate are fixedly connected with a strip frame, one end of the strip frame is fixed to a ring located on the positioning plate, and the strip frame is connected to the inside of the ring.

[0022] Preferably, slideways are provided on both sides of the inner wall of the support frame, a mounting plate is slidably connected inside the slideway, a cutting assembly is fixedly installed on the mounting plate, a positioning door is provided on the outer side of the support frame, and a cutting groove is provided on the top of the support frame;

[0023] Preferably, the cutting assembly comprises a second telescopic cylinder, the second telescopic cylinder is fixedly mounted on the bottom of the mounting plate, one end of the output shaft of the second telescopic cylinder is fixedly connected to a fixing plate, a plurality of groups of internal threaded connecting pipes are fixedly connected to the top of the fixing plate, each group of the internal threaded connecting pipes has two internal threaded connecting pipes, and the internal threaded connecting pipes are symmetrically arranged, and a cutting piece is fixedly mounted on the internal threaded connecting pipes;

[0024] Preferably, the cutting piece includes a cutting knife and two fixed columns, a cylindrical groove is opened inside the fixed column, a columnar connecting piece is arranged inside the cylindrical groove, a fixed shaft is fixedly connected to the top of the columnar connecting piece, the top of the fixed column passes through the fixed column and extends to the outside of the fixed column, the bottom of the cutting knife is fixedly connected to the top of the two fixed columns, and rotating ears are fixedly connected to both sides of the surface of the fixed column.

[0025] Compared with the related art, the method for indirectly analyzing the high and low hardness bump lattice performance provided by the present invention has the following beneficial effects:

[0026] The present invention provides a method for indirectly analyzing the high and low hardness bump lattice performance. The analysis method can be used to detect and analyze the soft and hard anomalies of gold bumps. Combined with the gold bump manufacturing process, it can help improve the soft and hard gold bump problems. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A flowchart of the method for indirectly analyzing the high and low hardness bump lattice performance provided by the present invention;

[0028] Figure 2 This is a schematic diagram of the gold bump slice of the present invention;

[0029] Figure 3 for Figure 2 The local structure schematic diagram shown;

[0030] Figure 4 A schematic diagram of the structure of a second embodiment of the method for indirectly analyzing high and low hardness bump lattice performance provided by the present invention;

[0031] Figure 5 for Figure 4 The local structure schematic diagram shown;

[0032] Figure 6 for Figure 4 The structure diagram of the interior of the support frame shown;

[0033] Figure 7 for Figure 4 A schematic diagram of the structure of the cutting assembly shown;

[0034] Figure 8 for Figure 4 The schematic diagram of the structure of the cut piece shown;

[0035] Fig. 9 for Figure 4 A cross-sectional view of the first adjustment mechanism is shown.

[0036] Numbers in the figure: 1, support frame, 2, mounting frame, 3, first telescopic cylinder,

[0037] 4. Extruded board, 41. Connecting board, 42. Hard board,

[0038] 5. first adjustment mechanism, 51. first threaded column, 52. second threaded column, 53. star nut, 54. collar, 55. connecting rod,

[0039] 6. first side positioning member, 61. positioning plate, 62. connecting plate, 63. connecting arm,

[0040] 7. Second side positioning member, 71. Limiting plate, 72. Strip frame,

[0041] 8. The second regulating mechanism,

[0042] 9. Cutting assembly, 91. Second telescopic cylinder, 92. Fixed plate, 93. Internal thread connecting pipe, 94. Cutting piece, 941. Cutter, 942. Fixed column, 943. Columnar connecting piece, 944. Fixed shaft, 945. Rotating ear,

[0043] 10. slideway, 11. mounting plate, 12. positioning door, 13. fixing block, 14. slide cavity, 15. cutting groove;

[0044] a, Indentation in the pressed area, b, Slicing trajectory, c, SEM microscope magnification. DETAILED DESCRIPTION

[0045] The present invention will be further described below in conjunction with the accompanying drawings and implementation modes.

[0046] Please refer to Figure 1 , Figure 2 and Figure 3 ,in, Figure 1 A flowchart of the method for indirectly analyzing the high and low hardness bump lattice performance provided by the present invention; Figure 2 This is a schematic diagram of the gold bump slice of the present invention; Figure 3 for Figure 2 The method of indirectly analyzing the performance of high and low hardness bump lattices includes the following steps:

[0047] S1: Use a hard substance and apply the same force to press the surface of the gold bump;

[0048] S2: Slice the pressing area of ​​the gold bump;

[0049] S3: SEM electron microscope observation of the sliced ​​gold bumps;

[0050] S4: Observe the metal lattice arrangement, where the arrangement of the soft hardness gold bump lattice is more divergent than that of the high hardness gold bump lattice.

[0051] The SEM electron microscope observation magnification of S3 is 2450-2550x.

[0052] The pressure pressing on the gold bump is the same as the force of the weight of the block itself;

[0053] The slicing can be performed using physical cutting, grinding and polishing equipment, the hard material is preferably diamond, and the SEM electron microscope observation magnification is preferably set to 2500x.

[0054] Compared with the related art, the method for indirectly analyzing the high and low hardness bump lattice performance provided by the present invention has the following beneficial effects:

[0055] This analysis method can be used to detect and analyze the soft and hard anomalies of gold bumps. Combined with the gold bump manufacturing process, it can help improve the soft and hard gold bump problems.

[0056] Second embodiment

[0057] Please refer to Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Fig. 9 Based on the method of indirectly analyzing the high and low hardness bump lattice performance provided by the first embodiment of the present application, the second embodiment of the present application proposes another method of indirectly analyzing the high and low hardness bump lattice performance. The second embodiment is only a preferred method of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0058] Specifically, the difference between the method for indirectly analyzing the high and low hardness bump lattice performance provided by the second embodiment of the present application is that, in the method for indirectly analyzing the high and low hardness bump lattice performance, the gold bump is pressed and sliced ​​by a pressing and slicing device, and the pressing and slicing device includes a support frame 1, and a mounting frame 2 is fixedly provided on the top of the support frame 1, and a first telescopic cylinder 3 is fixedly installed on the top of the mounting frame 2, and an extrusion plate 4 is fixedly installed on one end of the output shaft of the first telescopic cylinder 3.

[0059] The first telescopic cylinder 3 and the second telescopic cylinder 91 can be electric telescopic cylinders, air cylinders or hydraulic cylinders, among which hydraulic cylinders are preferably provided, and the pushing force can be adjusted. The mounting frame 2 is L-shaped.

[0060] The extrusion plate 4 includes a connecting plate 41 and a hard plate 42, the hard plate 42 is fixed to the bottom of the connecting plate 41, and first side positioning members 6 are fixedly installed on both sides of the extrusion plate 4 through a first adjustment mechanism 5, and second side positioning members 7 are provided on both sides of the two first side positioning members 6 through a second adjustment mechanism 8.

[0061] The hard plate 42 is preferably made of diamond material. Figure 5 The first adjustment mechanism 5 here is located on the upper side of the pressing plate 4 .

[0062] The first adjustment mechanism 5 and the second adjustment mechanism 8 both include a first threaded column 51 and a second threaded column 52 , the surfaces of which are both sleeved with a collar 54 , and star nuts 53 are threadedly connected on the surface of the first threaded column 51 and on both sides of the collar 54 .

[0063] Both sides of the top of the extrusion plate 4 are symmetrically fixed with fixing blocks 13, wherein the first threaded column 51 and the second threaded column 52 located on the upper side of the extrusion plate 4 are respectively fixed on the fixing blocks 13, and the inner diameter of the ring 54 located on the first threaded column 51 is larger than the diameter of the first threaded column 51.

[0064] A star nut 53 is threadedly connected on the surface of the second threaded column 52 and located outside the collar 54 .

[0065] A star nut 53 is threadedly connected to the second threaded column 52 . When the star nut 53 on the first threaded column 51 is rotated, the movement of the first side positioning member 6 or the second side positioning member 7 is not blocked.

[0066] Two star nuts 53 located on the surface of the first threaded column 51 are fixedly connected via a connecting rod 55 , and the connecting rod 55 passes through the collar 54 .

[0067] No less than two connecting rods 55 are provided and symmetrically arranged, so as to support the inner side of the collar 54. Through the connecting rod 55, when one star nut 53 is rotated, two star nuts 53 can be driven to move simultaneously. Two star nuts 53 are provided and located on both sides of the collar 54 to position both sides of the first side positioning member 6 or the second side positioning member 7.

[0068] The first side positioning member 6 includes a positioning plate 61 and a connecting plate 62, the positioning plate 61 is arranged in the middle of the bottom of the connecting plate 62, connecting arms 63 are fixed on both sides of the top of the connecting plate 62, and sliding cavities 14 are symmetrically opened on both sides of the extrusion plate 4, and one end of the connecting arm 63 is fixedly connected to the bottom of the ring 54 located on the upper side of the extrusion plate 4 through the sliding cavity 14.

[0069] The position of the first side positioning member 6 can be adjusted by adjusting the position of the collar 54 to accommodate gold bumps of different sizes. The sliding cavity is located below the first threaded column 51 and the second threaded column 52 and has a length corresponding to the first threaded column 51 and the second threaded column 52 .

[0070] The second side positioning member 7 includes a limiting plate 71 , and both sides of the limiting plate 71 are fixedly connected with a strip frame 72 . One end of the strip frame 72 is fixed to a ring 54 located on the positioning plate 61 , and the strip frame 72 is connected to the inside of the ring 54 .

[0071] An opening is formed on the inner side of the collar 54 , which is connected to the interior of the strip frame 72 . When the first side positioning member 6 moves, the first threaded column 51 and the second threaded column 52 on the first side positioning member 6 can move along the interior of the strip frame 72 .

[0072] Slideways 10 are provided on both sides of the inner wall of the support frame 1, and a mounting plate 11 is slidably connected inside the slideway 10, and a cutting assembly 9 is fixedly installed on the mounting plate 11. A positioning door 12 is provided on the outer side of the support frame 1, and a groove 15 is opened on the top of the support frame 1.

[0073] One side of the positioning door 12 is hinged to one side of the support frame 1 through a hinge, and the other side is connected by threaded fitting or snap-on fitting, etc. The slideway 10 is composed of two strip plates, and the positioning door 12 cooperates with the inner side of the support frame 1 to position the mounting plate 11.

[0074] The cutting assembly 9 includes a second telescopic cylinder 91, which is fixedly mounted on the bottom of the mounting plate 11. One end of the output shaft of the second telescopic cylinder 91 is fixedly connected to a fixing plate 92. The top of the fixing plate 92 is fixedly connected to a plurality of groups of internal threaded connecting pipes 93. Each group of the internal threaded connecting pipes 93 has two internal threaded connecting pipes 93, which are symmetrically arranged. A cutting piece 94 is fixedly mounted on the internal threaded connecting pipes 93.

[0075] The cutting piece 94 includes a cutting knife 941 and two fixed columns 942. A cylindrical groove is opened inside the fixed column 942. A cylindrical connecting piece 943 is arranged inside the cylindrical groove. A fixed shaft 944 is fixedly connected to the top of the column connecting piece 943. The top of the fixed shaft 944 passes through the fixed column 942 and extends to the outside of the fixed column 942. The bottom of the cutting knife 941 is fixedly connected to the top of the two fixed columns 942. Rotating ears 945 are fixedly connected to both sides of the surface of the fixed column 942.

[0076] There are multiple grooves 15, and the number of grooves 15 corresponds to that of cutters 941. The grooves 15 extend to the outer side of the support frame 1. The surface of the fixed column 942 is provided with an external thread adapted to the internal thread connection pipe 93. The rotating ear 945 is provided to facilitate the rotation of the fixed column 942. By fixing the cutter 941 on the fixed shaft 944, when the fixed column 942 is rotated, the cutter 941 does not need to rotate with it, and the cutter 941 can be fixed and limited by the fixed column 942.

[0077] When slicing the gold bump, firstly adjust the distance between the two first side positioning members 6 and the two second side positioning members 7 according to the size of the gold bump. Firstly, adjust the two first side positioning members 6. When adjusting, rotate the star nuts 53 in a group of two. By rotating one, the two nuts 53 can be driven to rotate, so that the position of the first side positioning member 6 can be adjusted. After the adjustment, rotate the single star nut 53 on the second threaded column 52 to position the outer side thereof. When adjusting, the first threaded column 51 and the second threaded column 52 on the positioning plate 61 move along the inner side of the strip frame 72.

[0078] After the two first side positioning members 6 are adjusted, the two second side positioning members 7 are adjusted in the same manner;

[0079] After adjustment, the gold bump is placed on the support frame 1, and then the first telescopic cylinder 3 is started to push the extrusion plate 4 to press the gold bump, and the four sides of the gold bump are limited by the two first side positioning members 6 and the two second side positioning members 7;

[0080] Then, the second telescopic cylinder 91 is turned on to push the fixed plate 92, thereby driving the cutter 941 to move upward to slice the gold bump. After the slicing is completed, the second telescopic cylinder 91 drives the cutter 941 to pull back, and the first telescopic cylinder 3 pulls up the extrusion plate 4;

[0081] By providing the first telescopic cylinder 3 and the extrusion plate 4, and the extrusion plate 4 is provided with a first side positioning piece 6 through a first adjustment mechanism 5, and the two sides of the first side positioning piece 6 are provided with second side positioning pieces 7 through a second adjustment mechanism 8, the four sides of the gold bump can be positioned by the two first side positioning pieces 6 cooperating with the two second side positioning pieces 7, so that the gold bump is more stable during cutting, and the cutting quality is improved;

[0082] At the same time, the first adjusting mechanism 5 cooperates with the second adjusting mechanism 8 to adjust the positions of the first side positioning member 6 and the second side positioning member 7 according to the size of the gold bump, so as to adapt to gold bumps of different sizes, which is easy to use and has simple adjustment operation.

[0083] The number of corresponding cutters 941 can be adjusted according to the size of the gold bump. When adjusting, the positioning door 12 can be opened, and then the mounting plate 11 can be pulled out. The two fixing columns 942 at the bottom of the cutter 941 can be rotated by rotating the ear 945 to separate it from the internal threaded connecting tube 93 and disassemble it. When installing, the fixing column 942 at the bottom of the cutter 941 can be threadedly connected with the corresponding threaded connecting tube 93. The operation is simple, and the number of cutters can be adjusted according to needs. It is easy to use.

[0084] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for indirectly analyzing the performance of high and low hardness bump lattices, characterized in that: The following steps are involved: S1: Use a hard substance and apply the same force to press the surface of the gold bump; S2: Slice the pressing area of ​​the gold bump; S3: SEM electron microscope observation of the sliced ​​gold bumps; S4: Observe the metal lattice arrangement, where the arrangement of the soft hardness gold bump lattice is more divergent than that of the high hardness gold bump lattice; The gold bump is pressed and sliced ​​by a pressing and slicing device, and the pressing and slicing device includes a support frame, a mounting frame is fixedly arranged on the top of the support frame, a first telescopic cylinder is fixedly installed on the top of the mounting frame, and an extrusion plate is fixedly installed on one end of the output shaft of the first telescopic cylinder; Slideways are arranged on both sides of the inner wall of the support frame, a mounting plate is slidably connected inside the slideway, a cutting assembly is fixedly mounted on the mounting plate, a positioning door is arranged on the outer side of the support frame, and a cutting groove is opened on the top of the support frame; Wherein, the cutting assembly comprises a second telescopic cylinder, which is fixedly mounted on the bottom of the mounting plate, one end of the output shaft of the second telescopic cylinder is fixedly connected to a fixing plate, a plurality of groups of internal threaded connecting pipes are fixedly connected to the top of the fixing plate, each group of the internal threaded connecting pipes has two and are symmetrically arranged, and a cutting piece is fixedly mounted on the internal threaded connecting pipes; The cutting piece includes a cutting knife and two fixed columns, a cylindrical groove is opened inside the fixed column, a cylindrical connecting piece is arranged inside the cylindrical groove, a fixed shaft is fixedly connected to the top of the column connecting piece, the top of the fixed shaft passes through the fixed column and extends to the outside of the fixed column, the bottom of the cutting knife is fixedly connected to the top of the two fixed columns, and rotating ears are fixedly connected to both sides of the surface of the fixed column.

2. The method for indirect analysis of high and low hardness bump lattice performance according to claim 1, characterized in that: The SEM electron microscope observation magnification of S3 is 2450-2550x.

3. The method for indirect analysis of high and low hardness bump lattice performance according to claim 1, characterized in that: The extrusion plate includes a first connecting plate and a hard plate, the hard plate is fixed to the bottom of the first connecting plate, both sides of the extrusion plate are fixedly installed with first side positioning members through a first adjustment mechanism, and both sides of the two first side positioning members are provided with second side positioning members through a second adjustment mechanism.

4. The method for indirect analysis of high and low hardness bump lattice performance according to claim 3, characterized in that: The first adjustment mechanism and the second adjustment mechanism both include a first threaded column and a second threaded column, the surfaces of the first threaded column and the second threaded column are both sleeved with a collar, and the surface of the first threaded column and both sides of the collar are threadedly connected with a first star nut.

5. The method for indirect analysis of high and low hardness bump lattice performance according to claim 4, characterized in that: A second star nut is threadedly connected on the surface of the second threaded column and located on the outer side of the collar.

6. The method for indirect analysis of high and low hardness bump lattice performance according to claim 4, characterized in that: The two first star nuts located on the surface of the first threaded column are fixedly connected via a connecting rod, and the connecting rod passes through the collar.

7. The method for indirect analysis of high and low hardness bump lattice performance according to claim 6, characterized in that: The first side positioning member includes a positioning plate and a second connecting plate, the positioning plate is arranged in the middle of the bottom of the second connecting plate, connecting arms are fixed on both sides of the top of the second connecting plate, sliding cavities are symmetrically opened on both sides of the extrusion plate, and one end of the connecting arm is fixedly connected to the bottom of the ring located on the upper side of the extrusion plate through the sliding cavity.

8. The method for indirect analysis of high and low hardness bump lattice performance according to claim 7, characterized in that: The second side positioning member comprises a limiting plate, both sides of which are fixedly connected with a strip frame, one end of the strip frame is fixed to a collar located on the positioning plate, and the strip frame is communicated with the inside of the collar.

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