Matching block and matching system of FBAR filter

Abstract

The present invention provides a matching block and matching system of an FBAR filter, wherein the matching block of the FBAR filter comprises: a substrate, the substrate comprises a first surface and a second surface arranged oppositely; a matching module, comprising a plurality of capacitor modules with different capacitance values, an inductor module with adjustable inductance value and a plurality of 1 / 4 wavelength microstrip line modules with different lengths, which are integrated and arranged on the second surface of the substrate; wherein a plurality of bonding points are provided on the inductor module with adjustable inductance value and the plurality of 1 / 4 wavelength microstrip line modules with different lengths, and the capacitor module and the bonding points can be connected to the FBAR filter to be matched to adjust the transmission characteristics of the FBAR filter. When matching the FBAR filter, different modules on the matching block can be used for matching without repeatedly welding capacitors or inductors, which is convenient for later debugging, and can be repeatedly debugged, which is faster and more convenient, and can save a lot of manpower and time costs.

Description

Technical Field

[0001] The present invention relates to the field of radio frequency microwave technology, and in particular to a matching block and a matching system of an FBAR filter. Background Art

[0002] Film Bulk Acoustic Resonator (FBAR) is made of silicon substrate using MEMS technology and thin film technology. FBAR filters are widely used in the microwave field due to their small size, small transmission delay, and small frequency band drift.

[0003] The operating frequency band of FBAR filters is very wide, and the volume is generally less than 2mm*2mm*0.4mm. The size varies slightly depending on the frequency band. In order to miniaturize microwave components, FBAR filters are generally assembled directly onto microwave circuit boards using micro-assembly processes, and matching circuits are not integrated on FBAR filters.

[0004] Since the FBAR filter does not have an integrated matching circuit, its input and output standing waves are poor, generally above 2.0, and worse above 2.6, which seriously affects the microwave transmission characteristics of the FBAR filter. In order to ensure that the FBAR filter is directly cascaded with the front and rear stages, necessary matching methods must be used on the microwave board. The existing matching method usually uses direct welding of the capacitors or inductors that need to be matched. If the matching fails, the original capacitors or inductors need to be replaced, which is inconvenient and takes a long time to complete. Summary of the invention

[0005] The embodiment of the present invention provides a matching block and a matching system of an FBAR filter, so as to solve the problem that the matching of the FBAR filter is inconvenient and takes a long time.

[0006] In a first aspect, an embodiment of the present invention provides a matching block of an FBAR filter, comprising:

[0007] A substrate, the substrate comprising a first surface and a second surface arranged opposite to each other;

[0008] A matching module, comprising a plurality of capacitor modules with different capacitance values, an inductor module with adjustable inductance value and a plurality of 1 / 4 wavelength microstrip line modules with different lengths, which are integrated and arranged on the second surface of the substrate;

[0009] Among them, multiple bonding points are provided on the inductance module with adjustable inductance value and multiple 1 / 4 wavelength microstrip line modules with different lengths. The capacitor module and the bonding points are used to connect with the FBAR filter to be matched to adjust the transmission characteristics of the FBAR filter.

[0010] In a possible implementation, the inductor module with adjustable inductance value is a spiral inductor, bonding points are arranged at different positions of the spiral inductor, and different bonding points are connected by gold wires to match different inductance values.

[0011] In a possible implementation, multiple bonding points disconnect the spiral inductor to form multiple sections of different lengths, and two or more bonding points are set on each section of the spiral inductor; different inductance values ​​are matched by short-circuiting or serially connecting the bonding points.

[0012] In a possible implementation, the spiral inductor segment disconnected by the bonding point is used as a 1 / 4 wavelength microstrip line module, and the switching between the 1 / 4 wavelength microstrip line module and the spiral inductor is achieved by bonding the corresponding bonding points with gold wires.

[0013] In a possible implementation, the matching module further includes a replaceable chip device, which is a chip capacitor or a chip inductor; wherein the chip device is welded or bonded to the capacitor module with conductive glue.

[0014] In a possible implementation, the capacitor module is a single-layer capacitor, which is composed of a combination of capacitance values ​​of different orders of magnitude.

[0015] In a possible implementation, the capacitances of the capacitor modules with different capacitance values ​​are 100 pF, 40 pF and 10 pF respectively.

[0016] In one possible implementation, the substrate is Al 2 O 3 Ceramic substrate, and Al 2 O 3 The first surface of the ceramic substrate is provided with a gold-plated layer, and the bonding points on the second surface and the capacitor module are provided with a nickel / gold layer.

[0017] The present invention arranges a plurality of capacitor modules with different capacitance values, an inductor module with adjustable inductance value and a plurality of 1 / 4 wavelength microstrip line modules with different lengths on a ceramic substrate. When matching the FBAR filter, different modules on the matching block can be used for matching without repeatedly welding capacitors or inductors, which is convenient for later debugging and can be repeatedly debugged. The debugging is faster and more convenient, which can save a lot of manpower and time costs.

[0018] In a second aspect, an embodiment of the present invention provides a matching system for an FBAR filter, comprising:

[0019] A microwave circuit board, wherein the first surface of the microwave circuit board is provided with an input transmission strip line, an output transmission strip line and a large-area signal ground;

[0020] The FBAR filter is mounted on the signal ground of the microwave circuit board; wherein the input end and the output end of the FBAR filter are respectively connected to the corresponding input transmission strip line and the output transmission strip line, and the ground end is connected to the signal ground;

[0021] A matching block, whose structure is the same as that of the above matching block, is provided with at least two matching blocks and assembled on the signal ground; wherein, according to the matching requirements of the transmission characteristics of the FBAR filter, the input transmission strip line or the output transmission strip line is bonded to a bonding point on a matching block, or the input transmission strip line or the output transmission strip line is bonded to a capacitor module on a matching block.

[0022] In a possible implementation, when the FBAR filter uses a capacitor module for matching, a gold wire is used to connect the input transmission strip line or the output transmission strip line to any capacitor module on the matching block to match different capacitance values;

[0023] When the FBAR filter is matched with the parallel inductor module, the input end of the inductor module is connected to the signal ground with a gold wire, the output end of the inductor module is connected to the input transmission strip line or the output transmission strip line with a gold wire, and the gold wire is used to short-circuit or serially connect the bonding points to match different inductance values;

[0024] When the FBAR filter is matched with a 1 / 4 wavelength microstrip line module, gold wire is used to connect the input transmission strip line or the output transmission strip line to different bonding points on the inductor module to match 1 / 4 wavelength microstrip lines of different lengths;

[0025] When the capacitor module and the inductor module cannot meet the matching requirements of the FBAR filter, a chip capacitor or a chip inductor is welded on the capacitor module, and the chip capacitor or the chip inductor is connected to the input transmission strip line or the output transmission strip line and the signal ground respectively using gold wire.

[0026] In the present invention, the FBAR filter can achieve good microwave performance by only connecting and matching different modules in the matching block with the FBAR filter using gold wires, without first determining the inductance or capacitance value through simulation and then welding the inductance or capacitance to the FBAR filter. The matching process is faster and more convenient, and the pollution caused by welding is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0028] Figure 1is an application scenario diagram of the current FBAR filter provided by an embodiment of the present invention;

[0029] Figure 2 is a schematic diagram of the structure of a matching block of an FBAR filter provided by an embodiment of the present invention;

[0030] Figure 3 It is a structural schematic diagram of a matching system of an FBAR filter provided in an embodiment of the present invention;

[0031] Figure 4 It is a schematic diagram of the structure of the matching system of the FBAR filter provided by the embodiment of the present invention using a capacitor module for matching;

[0032] Figure 5 It is a schematic diagram of the structure of the matching system of the FBAR filter provided by an embodiment of the present invention using a 1 / 4 wavelength microstrip line module for matching;

[0033] Figure 6 It is a schematic diagram of the structure of the matching system of the FBAR filter provided by the embodiment of the present invention using the inductor module for matching;

[0034] Figure 7 It is a schematic diagram of the structure of the matching system of the FBAR filter provided by the embodiment of the present invention using patch device matching. DETAILED DESCRIPTION

[0035] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present invention. However, it should be clear to those skilled in the art that the present invention may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present invention.

[0036] In order to make the purpose, technical solutions and advantages of the present invention more clear, specific embodiments will be described below in conjunction with the accompanying drawings.

[0037] At present, FBAR filters are generally installed directly on microwave circuit boards using micro-assembly technology, such as Figure 1 The current application scenario of FBAR filter is shown in the figure, but the microwave transmission characteristics of FBAR filter are poor and cannot meet the requirements of use. The conventional matching methods of FBAR filter mainly include: adding T-junctions at the input and output ends of FBAR filter; connecting surface-mounted inductors and capacitors in series or in parallel on the transmission strip line; using special-shaped transmission strip lines to improve the standing wave characteristics and improve the microwave transmission characteristics of FBAR filter.

[0038] When the filter operates at a lower frequency band, such as in the S band, the size of the T-junction will be large, which places high demands on the volume of the component. When inductors and capacitors need to be connected in series or in parallel, the inductor and capacitor values ​​need to be simulated in advance. When the capacitance parameters between microwave circuit boards are affected, the simulation results will be inaccurate. When the capacitor or inductor needs to be replaced, rosin will contaminate the FBAR filter chip, placing high demands on the operation and process conditions. When the FBAR filter is matched in the form of a special-shaped transmission strip line, the matching accuracy will also be affected by changes in the microwave circuit board parameters, resulting in matching failure. Later, manual intervention and debugging will be required, which will cost a lot of manpower and time. In the most extreme case, the microwave circuit board will need to be redesigned.

[0039] In order to solve the problems in the prior art, an embodiment of the present invention provides a matching block of an FBAR filter, which can facilitate later debugging and save labor costs and time costs.

[0040] The following first introduces the matching block of the FBAR filter provided in the embodiment of the present invention, which is described in detail as follows:

[0041] The matching block of the FBAR filter includes a substrate and a matching module. The substrate includes a first surface and a second surface arranged opposite to each other. The matching module includes a plurality of capacitor modules with different capacitance values, an inductor module with adjustable inductance value, and a plurality of 1 / 4 wavelength microstrip line modules with different lengths, which are integrated and arranged on the second surface of the substrate. Specifically, a plurality of bonding points are provided on the inductor module with adjustable inductance value and the plurality of 1 / 4 wavelength microstrip line modules with different lengths. The capacitor module and the bonding points can be used to connect with the FBAR filter to be matched to adjust the transmission characteristics of the FBAR filter.

[0042] In some embodiments, the substrate is Al 2 O 3 Ceramic substrate, and Al 2 O 3 The first surface of the ceramic substrate is provided with a gold-plated layer connected to the signal ground. When the matching block is assembled later, the matching block can be bonded to the signal ground on the microwave circuit board with conductive glue. The bonding points and capacitor modules on the second surface of the substrate are also provided with a nickel / gold layer bonded to the FBAR filter, which can be connected with gold wires when matching with the FBAR filter later.

[0043] Specifically, the substrate is a high dielectric ceramic with a thickness of 0.2 mm. The first surface of the substrate is a bottom gold-plated layer with a thickness of 0.017 mm, which is used as a signal ground. The second surface of the substrate is a graphic layer, namely various capacitor modules, inductor modules and bonding points, made of nickel / gold with a thickness of 0.017 mm.

[0044] In some embodiments, the inductor module with adjustable inductance value is a spiral inductor, and a plurality of bonding points are provided at different positions of the spiral inductor. Different bonding points are connected by gold wires to match different inductance values. By providing a spiral inductor, the area of ​​the matching block can be saved, and by providing a plurality of bonding points on the inductor and connecting different bonding points by gold wires, different inductance values ​​can be obtained, which is convenient for the debugging and matching needs of the FBAR filter. The length, number of turns and spacing between the lines of the spiral inductor determine the inductance value of the inductor. By connecting different bonding points by gold wires, a short circuit can be achieved, the length of the lines can be shortened, and the purpose of changing the inductance value can be achieved.

[0045] Optionally, the above-mentioned multiple different bonding points disconnect the spiral inductor to form multiple sections of different lengths, and two or more bonding points are set on each section of the spiral inductor. Different inductance values ​​can be matched by short-circuiting or connecting the bonding points in series with gold wires.

[0046] Optionally, 1 / 4 wavelength microstrip line is also a common means of matching. Different microwave wavelengths correspond to different 1 / 4 wavelength microstrip lines. The spiral inductor segment disconnected by multiple different bonding pressure points can be used as a 1 / 4 wavelength microstrip line module to adjust the FBAR filter. By bonding different bonding pressure points with gold wires, the switching between the 1 / 4 wavelength microstrip line module and the spiral inductor can be achieved. Not only can the area of ​​the matching block be reduced, but also switching matching between the inductor or microstrip line can be achieved.

[0047] In some embodiments, when the inductor module or capacitor module on the matching block cannot meet the requirements of adjusting the FBAR filter, the matching module further includes a replaceable patch device, which is a patch capacitor or a patch inductor. Two capacitor pads of the same area in the capacitor module can be cascaded and used as pads for surface-mount inductors or capacitors, and the patch capacitors or patch inductors can be welded or bonded with conductive adhesive.

[0048] In some embodiments, due to the high dielectric constant of high dielectric ceramics, a single-layer capacitor with small volume and high capacitance can be produced, so the capacitance of multiple capacitor modules with different capacitance values ​​can be prepared, and the capacitance values ​​can be 100pF, 40pF and 10pF respectively. The areas of multiple capacitors can be single-layer capacitors of 0.7mm*0.6mm, 0.4mm*0.4mm and 0.2mm*0.2mm respectively. Capacitors with different capacitance values ​​can match FBAR filters in different situations.

[0049] Specifically, two 100pF capacitors with the same area of ​​0.7mm*0.6mm can be set on the matching block. Specifically, the above two capacitor pads with an area of ​​0.7mm*0.6mm can be used in cascade and used as pads for 0402 type devices. When a single-layer capacitor cannot meet the matching requirements, the corresponding 0402 packaged inductor or capacitor can be welded or bonded on the pad, one end is connected in parallel to the transmission belt line, and the other end is connected to the signal ground. When the above method is adopted, it is necessary to use welding to weld the chip capacitor or chip inductor to the pad in advance, and then bond the matching block to the microwave circuit board with conductive glue. In addition, in the case where the contact resistance of the conductive glue is not required, the conductive glue bonding method can be used for debugging first, so that assembly can be performed multiple times. After determining the specifications, the chip capacitor or chip inductor is welded.

[0050] In some embodiments, a 25 μm gold wire may be used to connect the bonding pads and the transmission line or the signal ground.

[0051] Specifically, Figure 2 The matching block of the FBAR filter shown in the figure has a 0.017mm thick gold-plated layer electroplated on the first surface of a 0.2mm thick high dielectric ceramic substrate, and 4 capacitor modules with different capacitance values, an inductor module with adjustable inductance value, and multiple 1 / 4 wavelength microstrip line modules with different lengths are arranged on the second surface of the substrate. The capacitance values ​​of the capacitors are 100pF, 40pF, and 10pF, respectively, and the areas of the single-layer capacitors are 0.7mm*0.6mm, 0.4mm*0.4mm, and 0.2mm*0.2mm, respectively. There are two 100pF capacitors with an area of ​​0.7mm*0.6mm. Figure 2 B1 and B2 are 100pF capacitors with an area of ​​0.7mm*0.6mm, B3 is a 40pF capacitor, and B4 is a 10pF capacitor.

[0052] The inductor module with adjustable inductance value is a spiral inductor, on which a plurality of bonding points C1, C2, C3, C4 and C5 are arranged. Different inductances can be matched by connecting different bonding points through gold wires.

[0053] The multiple 1 / 4 wavelength microstrip line modules of different lengths are formed by disconnecting the above-mentioned inductor module by using bonding points to form multiple sections of 1 / 4 wavelength microstrip lines of different lengths. Figure 2 The E1, E2, E3 and E4 bonding points can not only adjust the inductance, but also adjust the length of the 1 / 4 wavelength microstrip line through the gold wire connection. The gold wire used is 25μm.

[0054] And when the above capacitors or inductors cannot meet the debugging requirements, the above two capacitors with an area of ​​0.7mm*0.6mm can be used as pads to weld or glue 0402 package chip capacitors or chip inductors.

[0055] In an embodiment of the present invention, by arranging a plurality of capacitor modules with different capacitance values, an inductor module with adjustable inductance values, and a plurality of 1 / 4 wavelength microstrip line modules with different lengths on a ceramic substrate, when matching the FBAR filter, different modules on the matching block can be used for matching without repeatedly welding capacitors or inductors, which is convenient for later debugging, and can be repeatedly debugged, making debugging faster and more convenient, and saving a lot of manpower and time costs. The present invention can also save manpower time consumed by simulating capacitor and inductance values ​​multiple times, and solves the cost of secondary microwave circuit board design and plate making caused by inaccurate simulation. The materials required for the matching block of the FBAR filter provided by the present invention are cheap, the process parameter requirements are low, and large-scale standardized manufacturing can be achieved.

[0056] Based on the matching block of the FBAR filter provided in the above embodiment, the present invention also provides a specific implementation of a matching system applied to the matching block of the FBAR filter. Please refer to the following embodiment.

[0057] The matching system of the FBAR filter includes an FBAR filter and a matching block mounted on a microwave circuit board. An input transmission strip line, an output transmission strip line and a large area of ​​signal ground are provided on the first surface of the microwave circuit board. The FBAR filter is mounted on the signal ground of the microwave circuit board. Specifically, the input end and the output end of the FBAR filter are respectively connected to the corresponding input transmission strip line and the output transmission strip line, and the ground end of the FBAR filter is connected to the signal ground. The matching block of the FBAR filter introduced above is adopted, and at least two matching blocks are set and assembled on the signal ground. Specifically, the bonding points or capacitor modules on the matching blocks are connected to the transmission strip line and / or the signal ground through gold wires to adjust the transmission characteristics of the FBAR filter.

[0058] Specifically, Figure 3 The matching system of the matching block of the FBAR filter shown includes a FBAR filter F1 and matching blocks F2 and F3. G1 and G2 are input transmission strip lines and output transmission strip lines on the microwave circuit board, and H1 and H2 are large-area signal grounds on the microwave circuit board. The input end and output end of the FBAR filter F1 are connected to the transmission strip lines G1 and G2 respectively, and the ground end of the FBAR filter F1 is connected to the signal grounds H1 and H2. Matching blocks F2 and F3 are respectively located on both sides of the input end and output end of the above-mentioned FBAR filter F1.

[0059] The FBAR filter is connected to the module on the matching block by using gold wire to achieve matching. The specific matching process is as follows:

[0060] like Figure 4 As shown in the figure, when the FBAR filter is matched with a capacitor module, a gold wire is used to connect the input transmission strip line and the output transmission strip line to any capacitor module on the matching block to match different capacitance values. Modules with different capacitance values ​​are connected according to debugging requirements. Figure 4 In the embodiment, B1 in F2 is connected to the input transmission strip line G1, and B3 in F3 is connected to the output transmission strip line G2, thereby achieving the matching of the FBAR filter.

[0061] like Figure 5 As shown in the figure, when the FBAR filter uses a 1 / 4 wavelength microstrip line module for matching, gold wires are used to connect the input transmission strip line and the output transmission strip line to different bonding points on the inductor module to match 1 / 4 wavelength microstrip lines of different lengths. When a longer 1 / 4 wavelength microstrip line is required, gold wires can be used to bond E1 and E2 in the F2 matching block. When a shorter 1 / 4 wavelength microstrip line is required, gold wires are not used to connect E1 and E2 in the F3 matching block. C1 in F2 is connected to the input transmission strip line G1, and C1 in F3 is connected to the output transmission strip line G2, thereby achieving matching of the FBAR filter.

[0062] like Figure 6 As shown, when the FBAR filter F1 is matched with the parallel inductor module, the input terminal C4 of the left and right inductor modules can be connected to the signal ground H2 by gold wire, the output terminal C1 on the left and right inductor modules can be connected to the input transmission strip line G1 and the output transmission strip line G2 by gold wire, and the gold wire is used to short-circuit or serially bond the pressure points to match different inductance values, and the gold wire is used to bond E1, E2, E3 and E4 on the left and right inductor modules respectively. When a larger inductance value is required, C2, C4 and C5 on the matching block F2 can be suspended. When a smaller inductance value is required, C2, C4 and C5 can be selectively short-circuited to reduce the length of the inductor line, thereby reducing the inductance.

[0063] like Figure 7 As shown, when the inductors or capacitors in the matching blocks F2 and F3 cannot meet the matching requirements of the FBAR filter F1, SMD devices can be used for matching. 0402-type SMD inductors or SMD capacitors can be bonded to two capacitors with an area of ​​0.7mm*0.6mm. Figure 7 K1 and K2 in the figure represent chip capacitors or chip inductors of different specifications. Solder the 0402 chip inductor or chip capacitor to the matching block with solder paste, and then bond it to the input transmission strip line, output transmission strip line and signal ground with gold wire.

[0064] In the present invention, the FBAR filter can achieve good microwave performance by only connecting and matching different modules in the matching block with the FBAR filter using gold wires, without first determining the inductance or capacitance value through simulation and then welding the inductance or capacitance to the FBAR filter. The matching process is faster and more convenient, and the pollution caused by welding is reduced.

[0065] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A matching system for an FBAR filter, characterized in that: include: A microwave circuit board, wherein an input transmission strip line, an output transmission strip line and a signal ground are provided on a first surface of the microwave circuit board; An FBAR filter is mounted on the signal ground of the microwave circuit board; wherein the input end and the output end of the FBAR filter are respectively connected to the corresponding input transmission strip line and the output transmission strip line, and the ground end is connected to the signal ground; A matching block, the structure of which includes a matching module, the matching module includes a plurality of capacitor modules with different capacitance values, an inductor module with adjustable inductance value and a plurality of 1 / 4 wavelength microstrip line modules with different lengths, at least two matching blocks are provided and assembled on the signal ground; wherein, according to the matching requirements of the transmission characteristics of the FBAR filter, the input transmission strip line or the output transmission strip line is bonded to a bonding point on the matching block, or the input transmission strip line or the output transmission strip line is bonded to the capacitor module on the matching block; When the FBAR filter is matched using a capacitor module, the input transmission strip line or the output transmission strip line is connected to any capacitor module on the matching block using a gold wire to match different capacitance values; When the FBAR filter is matched with the parallel inductor module, the input end of the inductor module is connected to the signal ground by a gold wire, the output end of the inductor module is connected to the input transmission strip line or the output transmission strip line by a gold wire, and the bonding points are short-circuited or connected in series by a gold wire to match different inductance values; When the FBAR filter is matched with a 1 / 4 wavelength microstrip line module, the input transmission strip line or the output transmission strip line is connected to different bonding points on the inductor module using gold wire to match 1 / 4 wavelength microstrip lines of different lengths; When the capacitor module and the inductor module cannot meet the matching requirements of the FBAR filter, a chip capacitor or a chip inductor is welded on the capacitor module, and the chip capacitor or the chip inductor is respectively connected to the input transmission strip line or the output transmission strip line and the signal ground using gold wire.

2. A matching block for an FBAR filter, characterized in that: As used in claim 1, comprising: A substrate, the substrate comprising a first surface and a second surface disposed opposite to each other; A matching module, comprising a plurality of capacitor modules with different capacitance values, an inductor module with adjustable inductance value and a plurality of 1 / 4 wavelength microstrip line modules with different lengths, which are integrated and arranged on the second surface of the substrate; Wherein, a plurality of bonding points are provided on the inductance module with adjustable inductance value and the plurality of 1 / 4 wavelength microstrip line modules with different lengths, and the capacitance module and the bonding points are used to connect with the FBAR filter to be matched to adjust the transmission characteristics of the FBAR filter.

3. The matching block of the FBAR filter according to claim 2, characterized in that The inductor module with adjustable inductance is a spiral inductor, the bonding points are arranged at different positions of the spiral inductor, and different bonding points are connected by gold wires to match different inductance values.

4. The matching block of the FBAR filter according to claim 3, characterized in that: The spiral inductor is disconnected by a plurality of bonding points to form a plurality of sections of different lengths, and each section of the spiral inductor is provided with a plurality of bonding points; different inductance values ​​are matched by short-circuiting or serially connecting the bonding points.

5. The matching block of the FBAR filter according to claim 4, characterized in that: The spiral inductor segment disconnected by the bonding pressure point is used as a 1 / 4 wavelength microstrip line module, and the switching between the 1 / 4 wavelength microstrip line module and the spiral inductor is achieved by bonding the corresponding bonding pressure points with gold wires.

6. The matching block of the FBAR filter according to claim 2, characterized in that: The matching module also includes a replaceable patch device, which is a patch capacitor or a patch inductor; The patch device is welded or bonded to the capacitor module with conductive adhesive.

7. The matching block of the FBAR filter according to claim 2, characterized in that: The capacitor module is a single-layer capacitor, which is composed of a combination of capacitor values ​​of different orders of magnitude.

8. The matching block of the FBAR filter according to claim 7, characterized in that: The capacitance values ​​of the plurality of capacitor modules with different capacitance values ​​are 100 pF, 40 pF and 10 pF respectively.

9. The matching block of the FBAR filter according to claim 2, characterized in that: The substrate is an Al2O3 ceramic substrate, and a gold-plated layer is arranged on the first surface of the Al2O3 ceramic substrate, and a nickel / gold layer is arranged on the bonding points on the second surface and the capacitor module.

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