Adapter and method for manufacturing the same

Abstract

The application is suitable for the technical field of package testing, and provides a switching device and a manufacturing method of the switching device. The switching device comprises a first microwave dielectric substrate and a second microwave dielectric substrate; the first microwave dielectric substrate is provided with a first metallized via, one end of the first metallized via is fixedly provided with a first pad, the other end of the first metallized via is fixedly provided with a second pad, and the second pad is fixedly provided with a conductive ball structure; the second microwave dielectric substrate is provided with a second metallized via, one end of the second metallized via is fixedly provided with a third pad connected with the conductive ball structure, and the other end of the second metallized via is fixedly provided with a fourth pad. The first pad is used for abutting and electrically connecting with one of a test object and a test PCB, and the fourth pad is used for abutting and electrically connecting with the other of the test object and the test PCB. The switching device provided by the application realizes the electrical connection test of the test object and the test PCB, and has low manufacturing cost and long service life.

Description

Technical Field

[0001] The present invention belongs to the technical field of packaging and testing, and more particularly, relates to a switching device and a method for manufacturing the switching device. Background Art

[0002] QFN (Quad Flat No-lead Package) and BGA (Ball Grid Array) packages utilize an array of solder balls on the underside of the package substrate, serving as I / O terminals for interconnection with the printed circuit board (PCB). Devices packaged using this technology are surface-mount devices, characterized by their compact size, surface-mount mounting, and ease of use. In electronic systems, QFN / BGA packages are a very common packaging format. However, as the application frequency of electronic systems gradually moves toward the millimeter-wave band, the number of QFN / BGA packages suitable for high-frequency applications is increasing. Mature high-frequency QFN / BGA package products are already in use both domestically and internationally. However, during the development process, accurate testing of QFN / BGA packages in high-frequency bands, even in the millimeter-wave band, becomes a crucial challenge. In order to accurately guide the development and application of high-frequency QFN / BGA packaging, tools or tooling that can achieve high-frequency band testing, non-destructive testing, high-precision testing, and low insertion loss testing are necessary to accurately evaluate the performance of QFN / BGA packaged devices.

[0003] Currently, QFN / BGA packaged products are primarily secured to a test fixture equipped with a PCB using a press-fit fixture. The PCB and QFN / BGA packaged products in the test fixture also require a corresponding test adapter. Popular test adapters include flexible interposers, which primarily consist of a film-like soft dielectric embedded with a gold-plated metal post. A conductive and flexible conductive dielectric is then placed beneath the metal post. The contact area between the existing flexible interposer and the device pad is a needle-tip structure (which can easily scratch the device pad). When the device pad contacts the metal post and applies a certain amount of pressure, the flexible conductive dielectric contacts the test substrate pad on the test fixture, achieving signal continuity. This method enables non-destructive testing and ensures that every test point can contact the test pad. However, this type of interposer is expensive (a single piece costs around 30,000 RMB and is mostly imported). The flexible conductive dielectric is prone to deformation and shedding, and has a short service life. It typically breaks down after a dozen or even dozens of extreme environmental tests (such as temperature cycling), making it unsuitable for high-volume testing. Summary of the Invention

[0004] The object of the present invention is to provide a switching device, aiming to solve or at least to a certain extent improve the technical problems of high price and short life of existing switching devices for testing QFN / BGA packaged products.

[0005] To achieve the above-mentioned object, the present invention adopts a technical solution that provides a transfer device, including a first microwave dielectric substrate and a second microwave dielectric substrate located between a device under test and a test PCB board; the first microwave dielectric substrate is provided with a plurality of first metallized vias, one end of each of the first metallized vias being fixedly provided with a first soldering pad, the other end of each of the first metallized vias being fixedly provided with a second soldering pad, and the second soldering pads being further fixedly provided with a conductive ball structure; the second microwave dielectric substrate is provided with a plurality of second metallized vias, one end of each of the second metallized vias being fixedly provided with a third soldering pad connected to the conductive ball structure, and the other end of each of the second metallized vias being fixedly provided with a fourth soldering pad;

[0006] The first pad is used to abut against and electrically connect to one of the device under test and the test PCB, and the fourth pad is used to abut against and electrically connect to the other of the device under test and the test PCB.

[0007] Furthermore, the conductive ball structure is an elastic metal ball structure.

[0008] Furthermore, the adapter device also includes a supporting dielectric plate fixedly connected to the first microwave dielectric substrate, the supporting dielectric plate is located between the first microwave dielectric substrate and the second microwave dielectric substrate, and a through hole is provided on the supporting dielectric plate for the conductive ball structure and the second pad to pass through, and the supporting dielectric plate is elastically connected to the second microwave dielectric substrate.

[0009] Furthermore, the supporting dielectric plate and the second microwave dielectric substrate are bonded together by an elastic adhesive.

[0010] Furthermore, the first metalized via is fixedly filled with a first metal conductive column, and the first metal conductive column is electrically connected to the first pad and the second pad respectively.

[0011] Furthermore, the first metal conductive column is a copper column component.

[0012] Furthermore, the second metalized via is fixedly filled with a second metal conductive column, and the second metal conductive column is electrically connected to the third pad and the fourth pad respectively.

[0013] Furthermore, the second metal conductive column is a copper column component.

[0014] Another object of the present invention is to provide a method for manufacturing a switching device, comprising:

[0015] Obtaining the first microwave dielectric substrate, and fabricating the first metallized via, the first solder pad, and the second solder pad on the first microwave dielectric substrate;

[0016] Obtaining the second microwave dielectric substrate, and fabricating the second metallized via, the third solder pad, and the fourth solder pad on the second microwave dielectric substrate;

[0017] Electroplating the first pad, the second pad, the third pad, and the fourth pad respectively to thicken and flatten the first pad, the second pad, the third pad, and the fourth pad;

[0018] A ball planting operation is performed to connect the second pad and the third pad via the conductive ball structure.

[0019] Compared with the prior art, the adapter provided by the present invention realizes electrical connection testing between a device under test and a test PCB board by providing a first microwave dielectric substrate having a first metallized via hole, a second microwave dielectric substrate having a second metallized via hole, and a conductive ball structure electrically connecting the first microwave dielectric substrate and the second microwave dielectric substrate. The entire device has low manufacturing cost and long service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the application of the switching device provided by an embodiment of the present invention;

[0021] Figure 2 A schematic diagram of the process of installing the adapter provided by an embodiment of the present invention on a test fixture;

[0022] Figure 3 A schematic diagram of a switching device provided in an embodiment of the present invention;

[0023] Figure 4 A schematic cross-sectional view of a switching device provided in an embodiment of the present invention;

[0024] Figure 5 A schematic diagram of a first microwave dielectric substrate after a first metallized via, a first pad, and a second pad are fabricated during the manufacturing process of the adapter provided by an embodiment of the present invention;

[0025] Figure 6 A schematic diagram of a first microwave dielectric substrate after filling and fixing metal conductive pillars during the manufacturing process of the adapter provided by an embodiment of the present invention;

[0026] Figure 7 A schematic diagram of the first microwave dielectric substrate after the first and second pads are thickened and leveled during the manufacturing process of the adapter provided by an embodiment of the present invention.

[0027] In the figure: 1. First solder pad; 2. Second solder pad; 3. First microwave dielectric substrate; 4. First metalized via; 5. Conductive ball structure; 6. First metal conductive column; 7. Support dielectric board; 8. Test piece; 9. Test PCB board; 10. Fixing fixture; 11. Pressing structure; 12. Transfer device; 13. Second microwave dielectric substrate; 14. Third solder pad; 15. Fourth solder pad; 16. Elastic adhesive. DETAILED DESCRIPTION

[0028] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0029] It should be noted that the terms "length", "width", "height", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0030] It should also be noted that, unless otherwise expressly specified or limited, terms such as "installed," "connected," "connect," "fixed," and "set" should be understood broadly. For example, they may refer to fixed or detachable connections, or integration; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and may encompass internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on specific circumstances.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referenced. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. Furthermore, "plurality" and "several" mean two or more, unless otherwise specifically defined.

[0032] See Figures 1 to 7 The switching device 12 includes a first microwave dielectric substrate 3 and a second microwave dielectric substrate 13 that are located between the test piece 8 and the test PCB 9 when in use.

[0033] A first microwave dielectric substrate 3 is provided with a plurality of first metallized vias 4. A first solder pad 1 is fixed to one end of each first metallized via 4, and a second solder pad 2 is fixed to the other end of each first metallized via 4. A conductive ball structure 5 is fixed to the second solder pad 2. Of course, the first and second solder pads 1 and 2 must be electrically connected to the walls of the first metallized via 4. The conductive ball structure 5 must also be electrically connected to the second solder pad 2. The conductive ball structure 5 can be a solder ball structure, an alloy ball structure, a copper ball structure, or other conductive ball structures.

[0034] The second microwave dielectric substrate 13 is provided with a plurality of second metallized vias. A third pad 14 is fixed to one end of each second metallized via, and a fourth pad 15 is fixed to the other end of each second metallized via. The third pad 14 is connected to the conductive ball structure 5. Of course, the third and fourth pads 14, 15 are electrically connected to the walls of the second metallized vias. The conductive ball structure 5 is also electrically connected to the third pad 14.

[0035] The first pad 1 is used to abut and electrically connect to one of the device under test 8 and the test PCB 9 , and the fourth pad 15 is used to abut and electrically connect to the other of the device under test 8 and the test PCB 9 .

[0036] For ease of description, the following description uses the example of a test in which the first solder pad 1 abuts and electrically connects with the test piece 8, and the fourth solder pad 15 abuts and electrically connects with the test PCB 9. The adapter device 12 provided in this embodiment of the present invention is actually part of a test fixture. The test fixture includes a fixed fixture 10, a test PCB 9 fixedly mounted on the fixed fixture 10, the adapter device 12 provided in this embodiment of the present invention, and a pressing structure 11 detachably connected to the fixed fixture 10. When testing the test piece 8, the adapter device provided in this embodiment of the present invention is located on the upper side of the test PCB 9, the test piece 8 is located on the upper side of the adapter device provided in this embodiment of the present invention, and the pressing structure 11 is located on the upper side of the test piece 8. The pressing structure 11 is mounted and connected to the fixed fixture 10, securing the test piece 8 and the adapter device provided in this embodiment of the present invention. The fixed fixture 10, the test PCB 9, and the pressing structure 11 are all prior art and will not be described in detail here.

[0037] In this embodiment, the first microwave dielectric substrate 3 and the second microwave dielectric substrate 13 can be made of conventional RF / microwave dielectric materials (i.e., common RF / microwave substrates) with high hardness, low dielectric constant, and good high-frequency performance. The processing technologies for metallized vias and printed circuits for such substrates are quite mature, resulting in low processing costs (approximately a few hundred yuan), long service life, simple design, and strong process reconfigurability. Using printed circuit technology, circuit patterns corresponding to the eight ports of the device under test can be fabricated on the first microwave dielectric substrate 3 and / or the second microwave dielectric substrate 13. The first and fourth pads 15 typically have a flat contact surface, providing a larger contact area with the pins (or pads) of the device under test 8 or the pads of the test PCB 9. The shape of this contact surface can be modified to suit the pins (or pads) of the device under test 8 or the pads of the test PCB 9, without scratching the pins (or pads) of the device under test 8 or the pads of the test PCB 9. This ensures good contact and electrical conductivity between the first pad 1 and the pins of the device under test 8, or good contact between the fourth pad 15 and the pads of the test PCB 9. The second pad 2 is connected to a conductive ball structure 5, and the third pad 14 is electrically connected to the second pad 2 via the conductive ball structure 5. The entire structure utilizes relatively low-cost materials and processes, resulting in low manufacturing costs. Furthermore, the first microwave dielectric substrate 3 is relatively strong, and the connection structure between the first and second pads 1, 2, and the conductive ball structure 5 is relatively strong, not easily detached, and has a long service life. Similarly, the second microwave dielectric substrate 13 also has a long service life. Moreover, after actual testing, this device can be applied to millimeter wave testing, with a frequency of up to 40GHz, an insertion loss of <-1dB, a maximum test frequency of 40GHz, and a temperature range of -65℃-150℃.

[0038] In fact, the applicant's research has revealed that the conductive ball structure 5 is extremely susceptible to contamination. If the conductive ball structure 5 is in direct contact with the pins (or pads) of the device under test 8 or the pads of the test PCB 9 for an extended period of time, it is easily contaminated. This contamination can easily lead to a decrease in conductivity performance, or even to the complete absence of conductivity. Therefore, in this embodiment, a second microwave dielectric substrate 13 is specifically provided, connected to the conductive ball structure 5. The pads of the second microwave dielectric substrate are in direct contact with the pins (or pads) of the device under test 8 or the pads of the test PCB 9, preventing the conductive ball structure 5 from direct contact, thus preventing contamination and extending its service life.

[0039] In this case, a dielectric substrate is installed under the conductive ball structure 5, which greatly protects the conductive ball structure 5 and greatly enhances the conductive performance and service life.

[0040] Compared with the prior art, the adapter provided in the embodiment of the present invention realizes electrical connection testing between a device under test and a test PCB by providing a first microwave dielectric substrate having a first metallized via hole, a second microwave dielectric substrate having a second metallized via hole, and a conductive ball structure electrically connecting the first microwave dielectric substrate and the second microwave dielectric substrate. The entire device has low manufacturing cost and long service life.

[0041] In some embodiments, the conductive ball structure is an elastic metal ball structure. In fact, the applicant's research found that there are some processing errors in both the pins (or pads) of the tested object 8 and the pads of the test PCB board 9. These processing errors can cause the contact surface of the pins (or pads) of the tested object 8 or the pads of the test PCB board 9 to be uneven, which can lead to poor contact. In this embodiment, the conductive ball structure 5 is set to an elastic conductive ball structure. During testing, the pressing force of the pressing structure 11 can be borrowed and the elasticity of the conductive ball structure 5 can be fully utilized to make the conductive ball structure 5 compensate for the uneven contact surface of the pins (or pads) of the tested object 8 or the pads of the test PCB board 9, so that the first pad 1 or the fourth pad 15 can fully contact the pins (or pads) of the tested object 8 or the pads of the test PCB board 9, avoiding the problem of poor contact, thereby truly realizing the test application on large-scale products. The elastic conductive ball structure can adopt structures such as some alloy balls with elastic properties.

[0042] In some embodiments, see Figures 2 to 4 and Figures 6 to 7 First metallized via 4 is fixedly filled with a first metal conductive pillar 6, which is electrically connected to first pad 1 and second pad 2, respectively. After being filled with the first metallized via 4, the first metallized via 4 forms a quasi-coaxial transmission structure with the first microwave dielectric substrate 3, providing improved test performance.

[0043] In some embodiments, the second metallized via is fixedly filled with a second metal conductive pillar, which is electrically connected to the third pad 14 and the fourth pad 15. After the second metallized via is filled with the second metal conductive pillar, it forms a quasi-coaxial transmission structure with the second microwave dielectric substrate 13, which has better test performance.

[0044] In some embodiments, the first metal conductive pillar 6 is a copper pillar member to have better test performance.

[0045] In some embodiments, the second metal conductive pillar is a copper pillar member to have better test performance.

[0046] In some embodiments, see Figures 1 to 4The adapter device 12 provided in this embodiment of the present invention further includes a supporting dielectric plate 7 connected to the first microwave dielectric substrate 3. The supporting dielectric plate 7 is positioned between the first microwave dielectric substrate 3 and the second microwave dielectric substrate 13. The supporting dielectric plate 7 is provided with a through hole for the conductive ball structure 5 and the second soldering pad 2 to pass through. The supporting dielectric plate 7 is elastically connected to the second microwave dielectric substrate 13. The conductive ball structure 5 protrudes from the supporting dielectric plate 7, or the third soldering pad 14 can extend into the through hole, thereby achieving a connection between the conductive ball structure 5 and the third soldering pad 14.

[0047] The supporting dielectric plate 7 is primarily designed to fill the space between the first microwave dielectric substrate 3 and the second microwave dielectric substrate 13. During testing, the elasticity of the conductive ball structure 5 allows the first and second microwave dielectric substrates 3 and 13 to abut against the DUT 8 and the test PCB 9, respectively. The supporting dielectric plate 7 acts as a "connector" between the first and second microwave dielectric substrates 3 and 13, enabling them to interact indirectly during testing. The elastic connection between the supporting dielectric plate 7 and the second microwave dielectric substrate 13 is similar to the elasticity of the conductive ball structure 5.

[0048] Thus, during testing, the first microwave dielectric substrate 3 or the second microwave dielectric substrate 13 can directly abut against the body of the test PCB 9, thereby preventing the first soldering pads 1 or the fourth soldering pads 15 from abutting against the soldering pads on the test PCB 9 and damaging the soldering pads on the test PCB 9. The material of the supporting dielectric plate 7 is not limited and can also be the same material as the microwave dielectric substrate 3.

[0049] In some embodiments, see Figure 3 The supporting dielectric plate 7 and the second microwave dielectric substrate 13 can be elastically connected by bonding with an elastic adhesive 16 .

[0050] In some embodiments, see Figures 1 to 2 When used for testing, the first pad 1 abuts against and is electrically connected to the device under test 8, and the fourth pad 15 abuts against and is electrically connected to the test PCB board 9.

[0051] Another object of the present invention is to provide a method for manufacturing a switching device, see Figures 3 to 7 , used to manufacture the adapter provided by the embodiment of the present invention. The manufacturing method of the adapter comprises the following steps:

[0052] S100: Obtain a first microwave dielectric substrate 3, and fabricate a first metallized via 4, a first solder pad 1, and a second solder pad 2 on the first microwave dielectric substrate 3. The process in this step is relatively mature and has a low process cost.

[0053] S300: Obtain the second microwave dielectric substrate 13, and fabricate a second metallized via, a third solder pad 14, and a fourth solder pad 15 on the second microwave dielectric substrate 13. The process in this step is relatively mature and has a low process cost.

[0054] S500 performs electroplating and flattening on the first pad 1, the second pad 2, the third pad 14, and the fourth pad 15, respectively, to thicken and flatten the first pad 1, the second pad 2, the third pad 14, and the fourth pad 15. After thickening and flattening, the first pad 1, the second pad 2, the third pad 14, and the fourth pad 15 respectively have flat contact surfaces, their hardness is significantly improved, and they protrude from the first microwave dielectric substrate 3 or the second microwave dielectric substrate 13, respectively, so that the first pad 1 and the fourth pad 15 can better contact with the outer pads, respectively, and also facilitate the ball planting operation of the second pad 2 and the third pad 14.

[0055] S700 performs a ball planting operation to connect the second pad 2 and the third pad 14 via the conductive ball structure 5 .

[0056] The manufacturing method of the adapter provided by the embodiment of the present invention has a simple process, a fast manufacturing process and a low cost.

[0057] In some embodiments, the ball implantation operation is to respectively connect the conductive ball structure 5 to the second pad 2 and the third pad 14 by soldering.

[0058] In some embodiments, the apertures of the first metallized via 4 and the second metallized via are generally 100-150 μm, and the heights of the first pad 1 and the second pad 2 after electroplating are respectively about 40-80 μm higher than the first microwave dielectric substrate 3; the heights of the third pad 14 and the fourth pad 15 after electroplating are respectively about 40-80 μm higher than the second microwave dielectric substrate 13.

[0059] In some embodiments, the method for manufacturing a switching device provided by an embodiment of the present invention further includes step S200 of filling and fixing a first metal conductive pillar 6 into the first metalized via 4. This step is located between step S100 and step S300. After the first metalized via 4 is filled with the first metal conductive pillar 6, a quasi-coaxial transmission structure is formed with the first microwave dielectric substrate 3, which has better test performance.

[0060] In some embodiments, the method for manufacturing a switching device provided by an embodiment of the present invention further includes step S400 of filling and securing a second metal conductive pillar in the second metallized via. This step follows step S300. After the second metallized via is filled with the second metal conductive pillar, a quasi-coaxial transmission structure is formed with the second microwave dielectric substrate 13, resulting in improved testing performance.

[0061] In some embodiments, the method for manufacturing a transition device provided by an embodiment of the present invention further includes step S600 of obtaining a supporting dielectric plate 7 and connecting the supporting dielectric plate 7 to the first microwave dielectric substrate 3, and step S800 of elastically connecting the supporting dielectric plate 7 to the second microwave dielectric substrate 13. Step S600 is located between step S500 and step S700, and step S800 is located after step S700.

[0062] In some embodiments, the supporting dielectric plate 7 and the first microwave dielectric substrate 3 are fixedly connected by gluing, and the supporting dielectric plate 7 and the second microwave dielectric substrate 13 are bonded by using an elastic adhesive 16 .

[0063] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A switching device, characterized in that: It includes a first microwave dielectric substrate and a second microwave dielectric substrate located between the tested device and the test PCB board; The first microwave dielectric substrate is provided with a plurality of first metallized vias, one end of each of the first metallized vias being fixedly provided with a first soldering pad, the other end of each of the first metallized vias being fixedly provided with a second soldering pad, and the second soldering pads being further fixedly provided with a conductive ball structure; the second microwave dielectric substrate is provided with a plurality of second metallized vias, one end of each of the second metallized vias being fixedly provided with a third soldering pad connected to the conductive ball structure, and the other end of each of the second metallized vias being fixedly provided with a fourth soldering pad; The first pad is used to abut and electrically connect to one of the device under test and the test PCB, and the fourth pad is used to abut and electrically connect to the other of the device under test and the test PCB; The conductive ball structure is an elastic metal ball structure. A pressing structure for fixing the tested piece to the adapter is also installed above the adapter. The third pad is electrically connected to the second pad via the conductive ball structure.

2. The switching device according to claim 1, wherein: The adapter device also includes a supporting dielectric plate fixedly connected to the first microwave dielectric substrate. The supporting dielectric plate is located between the first microwave dielectric substrate and the second microwave dielectric substrate. The supporting dielectric plate is provided with a through hole for the conductive ball structure and the second pad to pass through. The supporting dielectric plate is elastically connected to the second microwave dielectric substrate.

3. The switching device according to claim 2, wherein: The supporting dielectric plate and the second microwave dielectric substrate are bonded together by an elastic adhesive.

4. The switching device according to any one of claims 1 to 3, characterized in that: The first metalized via is fixedly filled with a first metal conductive column, and the first metal conductive column is electrically connected to the first pad and the second pad respectively.

5. The switching device according to claim 4, wherein: The first metal conductive column is a copper column component.

6. The switching device according to any one of claims 1 to 3, characterized in that: The second metalized via is fixedly filled with a second metal conductive column, and the second metal conductive column is electrically connected to the third pad and the fourth pad respectively.

7. The switching device according to claim 6, wherein: The second metal conductive column is a copper column component.

8. A method for manufacturing a switching device, characterized in that: Used to manufacture the switching device according to any one of claims 1 to 7, comprising: Obtaining the first microwave dielectric substrate, and fabricating the first metallized via, the first solder pad, and the second solder pad on the first microwave dielectric substrate; Obtaining the second microwave dielectric substrate, and fabricating the second metallized via, the third solder pad, and the fourth solder pad on the second microwave dielectric substrate; Electroplating the first pad, the second pad, the third pad, and the fourth pad respectively to thicken and flatten the first pad, the second pad, the third pad, and the fourth pad; A ball planting operation is performed to connect the second pad and the third pad via the conductive ball structure.

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