Display device

Abstract

The present invention provides a display device that reduces an ineffective area while simplifying a manufacturing process. The display device includes a substrate, a first printed circuit board unit, and a second printed circuit board unit, wherein the first printed circuit board unit is located on a side surface of the substrate, and the second printed circuit board unit is located on an upper surface of the substrate, and a second end of the second printed circuit board unit facing a side surface of the substrate is joined to a first end of the first printed circuit board unit facing an upper surface of the substrate.

Description

Technical Field

[0001] Embodiments of the present invention relate to a display device, and more particularly, to a display device that reduces an inactive area while simplifying a manufacturing process. Background Art

[0002] With the rapid development of the display field for visually displaying various electrical signal information, various display devices have been introduced, which have excellent characteristics such as thinness, lightness, low power consumption, etc.

[0003] Typically, a display device includes a display area for displaying images and a peripheral area outside the display area that cannot display images. Such display devices need to reduce the area of ​​the peripheral area while ensuring a sufficient display area to improve user convenience, thereby reducing the overall size of the mobile device. Even non-mobile devices, such as televisions that include a display device as a component, need to increase the display area of ​​the display device while reducing the area of ​​the peripheral area. Summary of the Invention

[0004] Technical problems solved

[0005] However, in such a conventional display device, since the display device includes components for preparing and / or transmitting electrical signals to be applied to the display portion, there is a problem in that the peripheral area outside the display area (ie, the invalid area) becomes wider.

[0006] Embodiments of the present invention are intended to solve various problems including those described above, and can provide a display device that reduces an ineffective area while simplifying a manufacturing process. However, these problems are exemplary, and the scope of the present invention is not limited thereto.

[0007] Workaround

[0008] According to one aspect of the present invention, a display device is provided, comprising: a substrate; a first printed circuit board unit located on a side surface of the substrate; and a second printed circuit board unit located on an upper surface of the substrate, wherein a second end of the second printed circuit board unit facing toward the side surface of the substrate is joined to a first end of the first printed circuit board unit facing toward the upper surface of the substrate.

[0009] According to this embodiment, the wiring included in the first printed circuit board unit can be electrically connected to the wiring included in the second printed circuit board unit.

[0010] According to the present embodiment, the first printed circuit board unit may be bent such that the first other end of the first printed circuit board unit, which is located on the opposite side of the first end, is located at a lower portion of the substrate.

[0011] According to the present embodiment, an IC chip may be further included. The IC chip is electrically connected to at least a portion of the wirings included in the first printed circuit board unit and is located at a lower portion of the substrate.

[0012] According to the present embodiment, the first printed circuit board unit may include a first alignment assistant portion protruding toward the outside of the upper surface of the substrate.

[0013] According to this embodiment, the width of the first end may be greater than the width of the second end.

[0014] According to this embodiment, the width of the first end may be greater than the width of the second end by the sum of the widths of the first alignment assisting portion.

[0015] According to the present embodiment, the second printed circuit board unit may include a first alignment assisting portion protruding toward the outside of one side surface of the substrate.

[0016] According to this embodiment, the width of the second end may be greater than the width of the first end.

[0017] According to this embodiment, the width of the second end may be greater than the width of the first end by the sum of the widths of the first alignment assisting portion.

[0018] According to this embodiment, a third printed circuit board unit may be further included, which is located on the lower surface of the substrate, and a third end of the third printed circuit board unit facing the side surface of the substrate is joined to the first other end of the first printed circuit board unit located on the opposite side of the first end.

[0019] According to this embodiment, the wiring included in the first printed circuit board unit can be electrically connected to the wiring included in the second printed circuit board unit and the wiring included in the third printed circuit board unit.

[0020] According to the present embodiment, an IC chip may be further included. The IC chip is electrically connected to at least a portion of the wirings included in the third printed circuit board unit and is located at a lower portion of the substrate.

[0021] According to the present embodiment, the first printed circuit board unit may include a first alignment assisting portion protruding toward the outside of the upper surface of the substrate and a second alignment assisting portion protruding toward the outside of the lower surface of the substrate.

[0022] According to this embodiment, the width of the first end may be greater than the width of the second end, and the width of the first other end may be greater than the width of the third end.

[0023] According to this embodiment, the width of the first end may be greater than the width of the second end by the sum of the widths of the first alignment assisting parts, and the width of the first other end may be greater than the width of the third end by the sum of the widths of the second alignment assisting parts.

[0024] According to the present embodiment, the second printed circuit board unit may include a first alignment assisting portion protruding toward the outside of one side surface of the substrate.

[0025] According to this embodiment, the width of the second end may be greater than the width of the first end.

[0026] According to the present embodiment, the third printed circuit board unit may include a second alignment assisting portion protruding toward the outside of one side surface of the substrate.

[0027] According to this embodiment, the width of the third end may be greater than the width of the first other end.

[0028] Other aspects, features, and advantages besides those described above will become apparent from the following detailed description, claims, and accompanying drawings for implementing the invention.

[0029] Beneficial effects

[0030] According to one embodiment of the present invention constructed as described above, a display device can be realized that simplifies the manufacturing process while reducing the ineffective area. Of course, the scope of the present invention is not limited by these effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 FIG. 1 is a perspective view schematically showing a portion of a display device according to an embodiment of the present invention.

[0032] Figure 2 It is schematically shown Figure 1 A cross-sectional view of a portion of a display device.

[0033] Figure 3 FIG. 1 is a perspective view schematically showing a portion of a display device according to an embodiment of the present invention.

[0034] Figure 4 It is schematically shown Figure 3 A cross-sectional view of a portion of a display device.

[0035] Figure 5 is an exemplary view schematically showing a process of bonding printed circuit board units to each other;

[0036] Figure 6 It is schematically shown Figure 3 A cross-sectional view of a portion of a display device.

[0037] Figure 7 FIG. 1 is a perspective view schematically showing a portion of a display device according to another embodiment of the present invention.

[0038] Figure 8 It is schematically shown Figure 7 A cross-sectional view of a portion of a display device.

[0039] Figure 9 FIG. 1 is a perspective view schematically showing a portion of a display device according to still another embodiment of the present invention.

[0040] Figure 10 It is schematically shown Figure 9 A cross-sectional view of a portion of a display device.

[0041] Figure 11 FIG. 1 is a perspective view schematically showing a portion of a display device according to still another embodiment of the present invention.

[0042] Figure 12 It is schematically shown Figure 11 A cross-sectional view of a portion of a display device.

[0043] Figure 13 FIG. 1 is a perspective view schematically showing a portion of a display device according to still another embodiment of the present invention.

[0044] Figure 14 It is schematically shown Figure 13 A cross-sectional view of a portion of a display device.

[0045] Figure 15 FIG. 1 is a perspective view schematically showing a portion of a display device according to still another embodiment of the present invention.

[0046] Figure 16 It is schematically shown Figure 15 A cross-sectional view of a portion of a display device.

[0047] Description of Reference Signs

[0048] 1: Display device

[0049] 10: First alignment aid

[0050] 20: Second alignment aid

[0051] 100: Substrate

[0052] 200: Display unit

[0053] 300: Thin film encapsulation layer

[0054] 400: IC chip

[0055] PD: pad part

[0056] PCB: Printed Circuit Board

[0057] PCB1: First printed circuit board unit

[0058] PCB2: Second printed circuit board unit

[0059] PCB3: Third printed circuit board unit DETAILED DESCRIPTION

[0060] The present invention is susceptible to various modifications and embodiments. Therefore, specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, as well as methods for achieving these effects and features, will become apparent with reference to the drawings and the embodiments described in detail below. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms.

[0061] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and in the description with reference to the accompanying drawings, the same or corresponding constituent elements will be denoted by the same reference numerals and repeated description thereof will be omitted.

[0062] In the following embodiments, the terms “first”, “second”, etc. are used to distinguish one constituent element from another constituent element, and are not used in a limiting sense.

[0063] In the following embodiments, a singular expression includes a plural expression unless a different meaning is clearly indicated in the context.

[0064] In the following embodiments, the terms “including” or “having” and the like mean the presence of the features or constituent elements described in the specification, and do not preclude the possibility of adding one or more other features or constituent elements.

[0065] In the following embodiments, when a part such as a film, a region, a constituent element, etc. is referred to as being "on" or "over" another part, it includes not only the case where it is directly on the other part, but also the case where other films, regions, constituent elements, etc. are interposed therebetween.

[0066] In the drawings, the sizes of components may be exaggerated or reduced for ease of explanation. For example, the sizes and thicknesses of the components shown in the drawings are arbitrarily indicated for ease of explanation, and the present invention is not necessarily limited to those shown in the drawings.

[0067] When a certain embodiment can be implemented differently, the specific process order can also be implemented differently from the described order. For example, two processes described in succession can be performed substantially simultaneously, or in the reverse order of the described order.

[0068] In this specification, "A and / or B" means A, B, or A and B. In addition, "at least one of A and B" means A, B, or A and B.

[0069] In the following embodiments, when films, regions, components, etc. are connected, this includes the cases where the films, regions, components, etc. are directly connected, and / or the cases where the films, regions, components, etc. are indirectly connected with another film, region, component, etc. interposed therebetween. For example, in this specification, when films, regions, components, etc. are electrically connected, this includes the cases where the films, regions, components, etc. are directly electrically connected, and / or the cases where the films, regions, components, etc. are indirectly electrically connected with another film, region, component, etc. interposed therebetween.

[0070] The x-axis, y-axis, and z-axis are not limited to the three axes on the rectangular coordinate system, but can be interpreted as a generalization including these three axes. For example, although the x-axis, y-axis, and z-axis can be orthogonal to each other, they can also indicate different directions that are not orthogonal to each other.

[0071] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0072] Figure 1 FIG. 1 is a perspective view schematically showing a portion of a display device according to an embodiment of the present invention.

[0073] A display device 1 according to an embodiment of the present invention is a device for displaying moving or still images. It can be used as a display screen for various products, including portable electronic devices such as mobile phones, smartphones, tablet personal computers (PCs), mobile communication terminals, electronic organizers, e-books, portable multimedia players (PMPs), navigation systems, and ultra-mobile personal computers (UMPCs), as well as televisions, notebook computers, monitors, billboards, and the Internet of Things (IoT). Furthermore, the display device 1 according to an embodiment can be used in wearable devices such as smart watches, watch phones, eyeglass displays, and head-mounted displays (HMDs).

[0074] exist Figure 1 In the figure, the display device 1 is shown as a flat-plate display device, but may be a flexible display device that is flexible and can be easily bent, folded, or rolled. For example, the display device 1 may be a foldable display device that can be folded and unfolded, a curved display device having a curved display surface, a bent display device in which an area other than the display surface is curved, a rollable display device that can be rolled or unfolded, a stretchable display device that can be stretched, and the like.

[0075] like Figure 1 As shown, the display device 1 according to an embodiment of the present invention includes a display area DA and a peripheral area PA, wherein the display area DA emits light, while the peripheral area PA does not emit light. The peripheral area PA may surround the entire display area DA. Figure 2) may include a first area corresponding to the display area DA and a second area corresponding to the peripheral area PA, and pixel circuits and display elements electrically connected to the respective pixel circuits may be arranged in the first area of ​​the substrate 100. In addition, the peripheral area PA may include a pad area PDA on at least one side thereof.

[0076] Figure 1 FIG. 1 shows a display device 1 having a display area DA that is rectangular in plan view. Figure 1 As shown, the display area DA can have a rectangular planar shape having a short side in the first direction (x direction) and a long side in the second direction (y direction). The corner where the short side in the first direction (x direction) meets the long side in the second direction (y direction) can be rounded to have a predetermined curvature or formed at a right angle. However, the planar shape of the display area DA is not limited to the above example, and can have other polygonal, elliptical, or irregular shapes, etc.

[0077] As one embodiment, the display device 1 may include a component (not shown) located on one side of the display panel. The component may be an electronic component that utilizes light or audio. For example, the electronic component may be a sensor for receiving and using light (such as an infrared sensor), a camera for receiving light to capture an image, a sensor for outputting and sensing light or audio to measure distance or recognize a fingerprint, a small lamp for outputting light, or a speaker for outputting sound.

[0078] Figure 2 It is schematically shown Figure 1 A cross-sectional view of a portion of a display device.

[0079] like Figure 2 As shown, the display device 1 may include a substrate 100 , a display portion 200 disposed on the substrate 100 , and a thin film encapsulation layer 300 .

[0080] The substrate 100 may include glass, metal, or a polymer resin. If the substrate 100 has a flexible or bendable property, the substrate 100 may include a polymer resin, for example, polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. Of course, the substrate 100 may be modified in various ways. For example, the substrate 100 may have a multilayer structure including two layers each including the above-mentioned polymer resin and a barrier layer interposed therebetween, wherein the barrier layer includes an inorganic substance (such as silicon oxide, silicon nitride, silicon oxynitride, etc.).

[0081] The display portion 200 may include a pixel circuit layer 200A and a display element layer 200B.

[0082] The pixel circuit layer 200A may include at least one insulating layer and at least one circuit element. The insulating layer may include at least one inorganic film and / or at least one organic film. The circuit elements may include signal lines, driver circuits for the pixels PX, and the like. The pixel circuit layer 200A may be formed by processes for forming insulating layers, semiconductor layers, and conductive layers using coating, deposition, and the like, and patterning the insulating layers, semiconductor layers, and conductive layers using photolithography. For example, the pixel circuit layer 200A may include a thin-film transistor electrically connected to the display element of the display element layer 200B. In this case, each thin-film transistor may include a semiconductor layer comprising amorphous silicon, polycrystalline silicon, or an organic semiconductor material, a gate electrode, a source electrode, and a drain electrode. The gate electrode may include various conductive materials and may have various layered structures, such as a Mo layer and an Al layer. The source and drain electrodes may also include various conductive materials and may have various layered structures, such as a Ti layer and an Al layer.

[0083] In addition, a buffer layer (not shown) may be interposed between the thin film transistor and the substrate 100, wherein the buffer layer includes one or more of silicon oxide, silicon nitride, silicon oxynitride, titanium oxide, and aluminum oxide. Such a buffer layer may improve the flatness of the upper surface of the substrate 100 or prevent or minimize the penetration of impurities from the substrate 100 into the semiconductor layer of the thin film transistor.

[0084] A planarization layer (not shown) may be disposed on the thin film transistor. The planarization layer may serve to substantially planarize the upper portion of the thin film transistor. Such a planarization layer may be formed of an organic material, such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, benzocyclobutene (BCB), or hexamethyldisiloxane (HMDSO).

[0085] The display element layer 200B may be located on the pixel circuit layer 200A. The display element layer 200B may include a display element such as a light-emitting diode. The display element may be an organic light-emitting diode or a micro light-emitting diode including an organic light-emitting layer, a quantum dot light-emitting diode including a quantum dot light-emitting layer, or an inorganic light-emitting element including an inorganic semiconductor, etc., but is not limited to the above examples.

[0086] For example, the display element layer 200B as a display element may include an organic light emitting diode including a pixel electrode, an opposite electrode, and an intermediate layer interposed between the pixel electrode and the opposite electrode and including a light emitting layer.

[0087] The pixel electrode of the organic light emitting diode is in contact with one of the source electrode and the drain electrode of the thin film transistor of the pixel circuit layer 200A, thereby being electrically connected to the thin film transistor. In the case of a top emission type display device that emits light to the outside through the relative electrode, the pixel electrode can be formed by a metal material with high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd) and / or copper (Cu). In the case of a bottom emission type display device that emits light to the outside through the pixel electrode, the pixel electrode can include a transparent metal material (TCO, transparent conductive material) that can transmit light such as ITO and IZO, or a semi-transmissive metal material (semi-transmissive conductive material) such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag).

[0088] The intermediate layer of the organic light emitting diode may include a low molecular weight or high molecular weight material. When the intermediate layer includes a low molecular weight material, the intermediate layer may have a single structure of a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer (EML), an electron transport layer (ETL), an electron injection layer (EIL), etc., or a structure in which they are stacked into a composite structure, and may be formed by a vacuum deposition method. When the intermediate layer includes a high molecular weight material, the intermediate layer may have a structure including an HTL and an EML. At this time, the hole transport layer may include PEDOT, and the light emitting layer may include high molecular weight materials such as polyphenylene vinylene (PPV) and polyfluorene. Such an intermediate layer may be formed by screen printing, inkjet printing, laser induced thermal imaging (LITI), etc. Of course, the intermediate layer is not necessarily limited to this, but may also have a variety of structures. Moreover, the intermediate layer may include a layer formed as a whole across a plurality of pixel electrodes, or may include a layer patterned corresponding to each of a plurality of pixel electrodes.

[0089] The relative electrode of the organic light emitting diode is arranged above the display area DA and can be arranged to cover the display area DA. That is, the relative electrode is formed as one body in the plurality of organic light emitting elements and can correspond to a plurality of pixel electrodes. In the case of a top emission type display device, the relative electrode may include a transparent metal material (TCO, transparent conductive material) capable of transmitting light such as ITO and IZO, or a semi-transmissive metal material (semi-transmissive conductive material) such as magnesium (Mg), silver (Ag) or an alloy of magnesium (Mg) and silver (Ag). In the case of a bottom emission type display device, the relative electrode may include a metal material with high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd) and / or copper (Cu).

[0090] The counter electrode covers the display area DA and extends to the peripheral area PA outside the display area DA. This counter electrode is electrically connected to an electrode power supply line in the peripheral area PA. This electrode power supply line is also called ELVSS.

[0091] In addition, the display element layer 200B may further include an organic film such as a pixel-defining film. The pixel-defining film has openings corresponding to each sub-pixel (i.e., an opening that exposes at least the central portion of the pixel electrode), thereby defining the pixel PX. Such a pixel-defining film can be formed of an organic material, such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or hexamethyldisilazane (HMDSO).

[0092] The thin film encapsulation layer 300 can be arranged on such a display element layer 200B. The thin film encapsulation layer 300 seals the display element layer 200B to protect the display element layer 200B from the influence of moisture / oxygen, and the organic encapsulation layer to be described later protects the display element layer 200B from the influence of impurities such as dust particles. The thin film encapsulation layer 300 can cover the display area DA and extend to at least a portion of the peripheral area PA. Such a thin film encapsulation layer 300 may include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. The first inorganic encapsulation layer and the second inorganic encapsulation layer may include silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide. The organic encapsulation layer may include acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin, etc.

[0093] In addition, although Figure 2 Although not shown in the figure, functional layers such as a touch sensing layer, an anti-reflection layer, a refractive index adjustment layer, etc. may be further included on the thin film encapsulation layer 300.

[0094] The peripheral area PA may include a pad area PDA on one side thereof. A pad portion PD including a plurality of pads may be arranged on the pad area PDA. Each of the plurality of pads included in the pad portion PD may be electrically contacted with a pad of a printed circuit board PCB to be described later, thereby receiving a signal input through the printed circuit board PCB. To this end, the pad portion PD may include a plurality of pads. The plurality of pads are not covered by an insulating layer but are exposed and may be electrically connected to the printed circuit board PCB, etc.

[0095] Figure 3 is a perspective view schematically showing a portion of a display device according to an embodiment, and Figure 4 It is schematically shown Figure 3 A cross-sectional view of a portion of a display device.

[0096] like Figure 3 and Figure 4 As shown, the printed circuit board PCB may be located on one side surface of the substrate 100. Specifically, the printed circuit board PCB may be located on one side surface of the peripheral area PA.

[0097] The printed circuit board (PCB) can generate electrical signals to be applied to display elements and the like located on the display area DA of the substrate 100, or can transmit electrical signals to the display area DA. The printed circuit board (PCB) can be a rigid circuit board or a flexible circuit board. The printed circuit board (PCB) can be directly bonded to the display panel of the display device 1, or can be electrically connected to the display panel via another circuit board.

[0098] Integrated circuit elements and IC chip 400, etc. can be located on a printed circuit board PCB. As a specific example, a data drive circuit for controlling the operation of the display device 1 can be arranged on the printed circuit board PCB. In addition, an input sensing circuit for controlling a functional layer (e.g., a touch sensing layer) can be arranged on the printed circuit board PCB. In this case, the data drive circuit and the input sensing circuit can be mounted on the printed circuit board PCB in the form of a single IC chip. In addition, the printed circuit board PCB may include a circuit board pad portion electrically connected to the display panel. The printed circuit board PCB may also include signal lines connecting the circuit board pad portion and the data drive circuit and / or the input sensing circuit.

[0099] As one embodiment, the "side surface" of the substrate 100 on which the printed circuit board PCB is located may be the side surface on which the pad area PDA is located. In this case, the electrodes or wirings of the printed circuit board PCB may be electrically connected to the pad portion PD on the side surface of the substrate 100 through a conductive adhesive such as silver (Ag) paste or an anisotropic conductive film.

[0100] However, the "side surface" of the substrate 100 where the printed circuit board PCB is located is not limited to the above example, but may be any side surface of the peripheral area PA of the substrate 100. For example, the printed circuit board PCB may be located on any side surface of the peripheral area PA instead of the side surface where the pad area PDA is located. In this case, the printed circuit board PCB may be electrically connected to wiring or electrodes arranged on any side surface of the peripheral area PA (other than the side surface where the pad area PDA is located).

[0101] According to an embodiment of the present invention, a display device 1 may include a printed circuit board (PCB) comprising a plurality of printed circuit board units joined to one another. That is, the display device 1 may include a printed circuit board (PCB) having a shape assembled from a plurality of printed circuit board units, rather than a printed circuit board (PCB) formed as a single unit. The number of printed circuit board units included in the printed circuit board PCB is not limited. For example, the printed circuit board (PCB) included in the display device 1 may include a first printed circuit board unit (PCB1) and a second printed circuit board unit (PCB2), or may include a first printed circuit board unit (PCB1), a second printed circuit board unit (PCB2), and a third printed circuit board unit (PCB3).

[0102] Each of the plurality of printed circuit board units can be positioned on one side surface, upper surface, or lower surface of the substrate 100 while being joined to an adjacent printed circuit board unit. Thus, the printed circuit board PCB can be positioned so as to surround one side surface of the substrate 100 at a right angle from the upper surface of the substrate 100 on one side of the peripheral area PA of the substrate 100. This significantly reduces the inactive area of ​​the display device 1. For example, the inactive area that inevitably arises as the printed circuit board PCB bends can be reduced.

[0103] Figure 3 and Figure 4 A case is shown in which the display device 1 includes a first printed circuit board unit PCB1 located on one side surface of a substrate 100 and a second printed circuit board unit PCB2 located on an upper surface of the substrate 100 .

[0104] As one embodiment, each of the printed circuit board units (e.g., PCB1 and PCB2) can be bonded to the substrate 100 using a conductive adhesive such as silver (Ag) paste or an anisotropic conductive film. As a specific example, each of the printed circuit board units can be bonded to the substrate 100 using a thermocompression bonding method (TCB) or a thermosonic bonding method (TSB) using ultrasonic waves. The thermocompression bonding method (TCB) applies heat and pressure to the conductive adhesive interposed between the printed circuit board unit and the substrate 100, causing the conductive particles within the adhesive of the conductive adhesive to form a conductive path through physical contact. This can also be applied to the embodiments described later.

[0105] The first printed circuit board unit PCB1 and the second printed circuit board unit PCB2 joined to the substrate 100 can be joined to each other. Specifically, the second end of the second printed circuit board unit PCB2 facing the side surface of the substrate 100 can be joined to the first end of the first printed circuit board unit PCB1 facing the upper surface of the substrate 100. As a result, the wiring of the first printed circuit board unit PCB1 can be electrically connected to the wiring of the second printed circuit board unit PCB2. That is, the joining of the first printed circuit board unit PCB1 and the second printed circuit board unit PCB2 can be understood as the joining of the wiring of the first printed circuit board unit PCB1 and the wiring of the second printed circuit board unit PCB2 to be electrically connected. In addition, it is obvious that not only the wiring of each of the first printed circuit board unit PCB1 and the second printed circuit board unit PCB2, but also their base layers can be joined.

[0106] Figure 5 is an exemplary view schematically showing a process of bonding printed circuit board units to each other.

[0107] As one embodiment, printed circuit board units (e.g., PCB1, PCB2) can be joined together using ultrasonic welding. Ultrasonic welding is a method in which electrical energy is input into an oscillator and converted into mechanical energy. A horn is then used to generate instantaneous, powerful frictional heat on the joint surfaces of the welded objects, thereby causing the joint surfaces of the welded objects to melt and join. Printed circuit board units can be joined together using ultrasonic welding, thereby allowing for the joining to occur without surface damage, deformation, or deterioration, and improving the reliability of the joining between the wiring. This also applies to the embodiments described below.

[0108] like Figure 5As shown, a welding head 500 may be arranged on the upper portion of the contact portion of the first printed circuit board unit PCB1 and the second printed circuit board unit PCB2 bonded to the substrate 100 to perform ultrasonic welding. The welding head 500 applies pressure and vibration energy to the contact portion of the first printed circuit board unit PCB1 and the second printed circuit board unit PCB2 to bond the first printed circuit board unit PCB1 and the second printed circuit board unit PCB2 to each other.

[0109] In addition, as an embodiment, Figure 5 As shown, the end of the welding head 500 can be formed at a right angle. As a result, the welding head 500 can more easily join the first printed circuit board unit PCB1 and the second printed circuit board unit PCB2, which intersect perpendicularly with each other. An ultrasonic welding machine (not shown) equipped with such a welding head 500 can be provided separately or can be provided integrally with the equipment for manufacturing the display device (not shown).

[0110] Figure 6 It is schematically shown Figure 3 A cross-sectional view of a portion of a display device.

[0111] like Figure 6 As shown, the first printed circuit board unit PCB1 of the display device 1 according to an embodiment of the present invention is bent so that the first other end of the first printed circuit board unit PCB1 can be located at the bottom of the substrate 100, wherein the first other end is located on the opposite side of the first end toward the upper surface of the substrate 100. In addition, the display device 1 may further include an IC chip 400 that is electrically connected to at least a portion of the wiring of the first printed circuit board unit PCB1 and is located at the bottom of the substrate 100.

[0112] Figure 7 is a perspective view schematically showing a portion of a display device according to another embodiment, and Figure 8 It is schematically shown Figure 7 A cross-sectional view of a portion of a display device.

[0113] For reference, although Figure 7 and Figure 8 For the sake of convenience, the first printed circuit board unit PCB1 is shown in a state where it is not bent, but the first printed circuit board unit PCB1 according to this embodiment may be bent as shown in FIG. Figure 6 As shown, the first other end thereof, which is located on the opposite side of the first end, is located at the lower portion of the substrate 100. Figure 8 The IC chip 400 is omitted in the figure, but the display device 1 according to the present embodiment may include the IC chip 400 electrically connected to at least a portion of the wirings possessed by the first printed circuit board unit PCB1 and located at a lower portion of the substrate 100 .

[0114] like Figure 7 and Figure 8 As shown, a display device 1 according to another embodiment of the present invention includes a first printed circuit board unit PCB1 and a second printed circuit board unit PCB2, wherein the first printed circuit board unit PCB1 may include a first alignment assisting portion 10 protruding toward the outside of the upper surface of the substrate 100. Hereinafter, descriptions of contents overlapping with the above contents will be omitted, and the first alignment assisting portion 10 will be mainly described.

[0115] When a plurality of printed circuit board units are bonded to the substrate 100, the printed circuit board units need to be aligned so that the printed circuit board units are accurately bonded to a predetermined position. In addition, in order to improve the alignment accuracy, a reference point for alignment needs to be provided.

[0116] As an embodiment, as a reference point for alignment, a mark can be arranged on the same layer as the pattern layer on one surface of the substrate 100 or the printed circuit board unit. For example, the mark can be formed of the same material on the same layer as the pattern layer initially formed on the substrate 100 or the printed circuit board unit. A mark having a preset shape is formed in a preset area on the substrate 100 or the printed circuit board unit. In addition, the shape of the mark can be a polygonal shape such as a triangle, rectangle, pentagon, etc., a circular shape, an elliptical shape, a "+" shape, a "-" shape, etc., but is not limited to the above examples and can have any shape. In addition, a plurality of marks having the same or different shapes can be located on the substrate 100 or the printed circuit board unit. Such a mark serves to assist the printed circuit board unit in precise alignment.

[0117] As another embodiment, at least one of the printed circuit board units may have a first alignment auxiliary portion 10 as a reference point for alignment. The first alignment auxiliary portion 10 serves to assist the printed circuit board units in aligning to accurate positions with each other. Specifically, the first alignment auxiliary portion 10 serves as follows: when any one of the first printed circuit board unit PCB1 and the second printed circuit board unit PCB2 is bonded to a side surface, upper surface or lower surface of the substrate 100, the first alignment auxiliary portion 10 provides a reference point for determining the position relative to the other printed circuit board unit that has been bonded to the substrate 100. Thus, before fine alignment is performed by marking, rough alignment can be performed by the first alignment auxiliary portion 10. That is, the first alignment is performed by the first alignment auxiliary portion 10, and the second alignment is performed by marking, thereby improving the alignment accuracy.

[0118] As a specific example, Figure 7 and Figure 8As shown, the first printed circuit board unit PCB1 may include a first alignment aid portion 10. The first alignment aid portion 10 protrudes from a first end of the first printed circuit board unit PCB1 in a direction toward the upper surface of the substrate 100 toward the outside of the upper surface of the substrate 100. In this case, the first alignment aid portion 10 may be integrally formed with the first printed circuit board unit PCB1.

[0119] In this case, the first printed circuit board unit PCB1 is first bonded to one side surface of the substrate 100, and then the second printed circuit board unit PCB2 is bonded to the upper surface of the substrate 100. At this time, the second printed circuit board unit PCB2 should be bonded to the substrate 100 so that the first end of the first printed circuit board unit PCB1, which faces the upper surface of the substrate 100, contacts the second end of the second printed circuit board unit PCB2, which faces the one side surface of the substrate 100. To this end, the second printed circuit board unit PCB2 can be aligned with the first alignment aid 10 of the first printed circuit board unit PCB1, which has already been bonded to one side surface of the substrate 100.

[0120] In addition, the width d1 of the first end of the first printed circuit board unit PCB1 facing the upper surface of the substrate 100 may be greater than the width d2 of the second end of the second printed circuit board unit PCB2 facing the side surface of the substrate 100. Figure 7 As shown, when the first alignment auxiliary portion 10 is formed at both ends of the first end of the first printed circuit board unit PCB1, the width d1 of the first end of the first printed circuit board unit PCB1 can be greater than the width d2 of the second end of the second printed circuit board unit PCB2 by the sum of the widths of the first alignment auxiliary portion 10.

[0121] Figure 9 is a perspective view schematically showing a portion of a display device according to yet another embodiment of the present invention, and Figure 10 It is schematically shown Figure 9 A cross-sectional view of a portion of a display device.

[0122] For reference, although Figure 9 and Figure 10 For the sake of convenience, the first printed circuit board unit PCB1 is shown in a state where it is not bent, but the first printed circuit board unit PCB1 according to this embodiment may be bent as shown in FIG. Figure 6 As shown, the first other end thereof, which is located on the opposite side of the first end, is located at the lower portion of the substrate 100. Figure 10 The IC chip 400 is omitted in the figure, but the display device 1 according to the present embodiment may include the IC chip 400 electrically connected to at least a portion of the wirings possessed by the first printed circuit board unit PCB1 and located at a lower portion of the substrate 100 .

[0123] The order of bonding the first printed circuit board unit PCB1 and the second printed circuit board unit PCB2 to the substrate 100 is not limited. Figure 9 and Figure 10 , shows a situation where the first printed circuit board unit PCB1 is bonded to one side surface of the substrate 100 after the second printed circuit board unit PCB2 is bonded to the upper surface of the substrate 100. In this case, the second printed circuit board unit PCB2 is first bonded to the upper surface of the substrate 100, and then the first printed circuit board unit PCB1 is bonded to the one side surface of the substrate 100. At this time, the first printed circuit board unit PCB1 should be bonded to the substrate 100 so that the first end of the first printed circuit board unit PCB1, which faces the upper surface of the substrate 100, contacts the second end of the second printed circuit board unit PCB2, which faces the one side surface of the substrate 100. To this end, the first printed circuit board unit PCB1 can be aligned with the first alignment aid 10 of the second printed circuit board unit PCB2, which has already been bonded to the upper surface of the substrate 100.

[0124] like Figure 9 and Figure 10 As shown, the second printed circuit board unit PCB2 may include a first alignment aid 10. The first alignment aid 10 is formed to protrude from a second end of the second printed circuit board unit PCB2, which faces the side surface of the substrate 100, toward the outside of the side surface of the substrate 100. In this case, the first alignment aid 10 may be integrally formed with the second printed circuit board unit PCB2.

[0125] In addition, the width d2 of the second end of the second printed circuit board unit PCB2 facing the side surface of the substrate 100 may be greater than the width d1 of the first end of the first printed circuit board unit PCB1 facing the upper surface of the substrate 100. Figure 9 As shown, when the first alignment auxiliary portion 10 is formed at both ends of the second end of the second printed circuit board unit PCB2, the width d2 of the second end of the second printed circuit board unit PCB2 can be greater than the width d1 of the first end of the first printed circuit board unit PCB1 by the sum of the widths of the first alignment auxiliary portion 10.

[0126] Figure 11 is a perspective view schematically showing a portion of a display device according to yet another embodiment of the present invention, and Figure 12 It is schematically shown Figure 11 A cross-sectional view of a portion of a display device.

[0127] like Figure 11 and Figure 12As shown, the display device 1 according to this embodiment may include a first printed circuit board unit PCB1, a second printed circuit board unit PCB2, and a third printed circuit board unit PCB3.

[0128] The first printed circuit board unit PCB1 is located on one side surface of the substrate 100, the second printed circuit board unit PCB2 is located on the upper surface of the substrate 100, and the third printed circuit board unit PCB3 is located on the lower surface of the substrate 100. Furthermore, the first end of the first printed circuit board unit PCB1, which faces the upper surface of the substrate 100, is bonded to the second end of the second printed circuit board unit PCB2, which faces the one side surface of the substrate 100, and the first other end of the first printed circuit board unit PCB1, located opposite the first end, is bonded to the third end of the third printed circuit board unit PCB3, which faces the one side surface of the substrate 100. This means that the wiring of the first printed circuit board unit PCB1 is electrically connected to the wiring of the second printed circuit board unit PCB2 and the wiring of the third printed circuit board unit PCB3. Furthermore, it is apparent that not only the wiring of each of the first printed circuit board unit PCB1, the second printed circuit board unit PCB2, and the third printed circuit board unit PCB3, but also their underlying layers may be bonded.

[0129] In addition, as described above, each of the printed circuit board units PCB1, PCB2 and PCB3 can be bonded to one side surface, upper surface or lower surface of the substrate 100 by using a conductive adhesive, and the printed circuit board units PCB1, PCB2 and PCB3 can be bonded to each other by using ultrasonic welding.

[0130] Furthermore, the display device 1 according to the present embodiment may include an IC chip 400 electrically connected to at least a portion of wirings possessed by the third printed circuit board unit PCB3 and located at a lower portion of the substrate 100 .

[0131] According to this embodiment, the first printed circuit board unit PCB1 can be electrically connected to the third printed circuit board unit PCB3 located on the lower surface of the substrate 100 without being bent. Specifically, the printed circuit board PCB can be positioned so as to vertically wrap around from one side surface of the substrate 100 to the lower surface of the substrate 100, thereby eliminating the need to bend the first printed circuit board unit PCB1 and eliminating the space formed between the bent portion of the first printed circuit board unit PCB1 and the substrate 100, thereby achieving an effect of significantly reducing the thickness of the display panel.

[0132] In addition, although Figure 11, the width d1 of the first end (or the first other end) of the first printed circuit board unit PCB1, the width d2 of the second end of the second printed circuit board unit PCB2, and the width d3 of the third end of the third printed circuit board unit PCB3 are the same, but are not limited thereto.

[0133] Figure 13 is a perspective view schematically showing a portion of a display device according to yet another embodiment of the present invention, and Figure 14 It is schematically shown Figure 13 A cross-sectional view of a portion of a display device.

[0134] The order in which the first printed circuit board unit PCB1, the second printed circuit board unit PCB2, and the third printed circuit board unit PCB3 are bonded to the substrate 100 is not limited. Figure 13 and Figure 14 , a case is shown in which the first printed circuit board unit PCB1 is first bonded to one side surface of the substrate 100, and then the second printed circuit board unit PCB2 or the third printed circuit board unit PCB3 is bonded to the upper or lower surface of the substrate 100. For example, the first printed circuit board unit PCB1 may be bonded to one side surface of the substrate 100, then the second printed circuit board unit PCB2 may be bonded to the upper surface of the substrate 100, and then the third printed circuit board unit PCB3 may be bonded to the lower surface of the substrate 100. Alternatively, the order may be as follows: the first printed circuit board unit PCB1 is bonded to one side surface of the substrate 100, then the third printed circuit board unit PCB3 is bonded to the lower surface of the substrate 100, and then the second printed circuit board unit PCB2 is bonded to the upper surface of the substrate 100.

[0135] At this time, the second printed circuit board unit PCB2 should be bonded to the substrate 100 so that the first end of the first printed circuit board unit PCB1, which faces the upper surface of the substrate 100, contacts the second end of the second printed circuit board unit PCB2, which faces the side surface of the substrate 100. To this end, the second printed circuit board unit PCB2 can be aligned with the first alignment aid 10 of the first printed circuit board unit PCB1, which has been bonded to the side surface of the substrate 100.

[0136] Furthermore, the third printed circuit board unit PCB3 should be bonded to the substrate 100 such that the first other end of the first printed circuit board unit PCB1, which is located on the opposite side of the first end, contacts the third end of the third printed circuit board unit PCB3, which is directed toward one side surface of the substrate 100. To this end, the third printed circuit board unit PCB3 may be aligned with respect to the second alignment aid 20 of the first printed circuit board unit PCB1 that has been bonded to one side surface of the substrate 100.

[0137] like Figure 13 and Figure 14 As shown, the first printed circuit board unit PCB1 may include a first alignment aid portion 10 and a second alignment aid portion 20 .

[0138] The first alignment auxiliary portion 10 is formed to protrude from a first end of the first printed circuit board unit PCB1 toward the upper surface of the substrate 100. Here, the first alignment auxiliary portion 10 may be integrally formed with the first printed circuit board unit PCB1.

[0139] In addition, the width d1 of the first end of the first printed circuit board unit PCB1 facing the upper surface of the substrate 100 may be greater than the width d2 of the second end of the second printed circuit board unit PCB2 facing the side surface of the substrate 100. Figure 13 As shown, when the first alignment auxiliary portion 10 is formed at both ends of the first end of the first printed circuit board unit PCB1, the width d1 of the first end of the first printed circuit board unit PCB1 can be greater than the width d2 of the second end of the second printed circuit board unit PCB2 by the sum of the widths of the first alignment auxiliary portion 10.

[0140] The second alignment auxiliary portion 20 is formed to protrude from the first other end of the first printed circuit board unit PCB1 opposite to the first end toward the outside of the lower surface of the substrate 100. At this time, the second alignment auxiliary portion 20 may be integrally formed with the first printed circuit board unit PCB1.

[0141] In addition, the width d3 of the third end of the third printed circuit board unit PCB3 in the direction facing the side surface of the substrate 100 may be equal to the width d2 of the second end of the second printed circuit board unit PCB2. In addition, the width d1 of the first other end of the first printed circuit board unit PCB1 located on the opposite side of the first end may be greater than the width d3 of the third end of the third printed circuit board unit PCB3 in the direction facing the side surface of the substrate 100. In addition, as Figure 13 As shown, when the second alignment auxiliary portion 20 is formed at both ends of the first other end of the first printed circuit board unit PCB1, the width d1 of the first other end of the first printed circuit board unit PCB1 can be greater than the width d3 of the third end of the third printed circuit board unit PCB3 by the sum of the widths of the second alignment auxiliary portion 20.

[0142] Figure 15 is a perspective view schematically showing a portion of a display device according to yet another embodiment of the present invention, and Figure 16 It is schematically shown Figure 15 A cross-sectional view of a portion of a display device.

[0143] Figure 15 and Figure 16The figure shows a case where the second printed circuit board unit PCB2 and the third printed circuit board unit PCB3 are first bonded to the upper and lower surfaces of the substrate 100, respectively, and then the first printed circuit board unit PCB1 is bonded to one side surface of the substrate 100. For example, the second printed circuit board unit PCB2 may be bonded to the upper surface of the substrate 100, then the third printed circuit board unit PCB3 may be bonded to the lower surface of the substrate 100, and then the first printed circuit board unit PCB1 may be bonded to one side surface of the substrate 100. Alternatively, the order may be such that the third printed circuit board unit PCB3 is bonded to the lower surface of the substrate 100, then the second printed circuit board unit PCB2 is bonded to the upper surface of the substrate 100, and then the first printed circuit board unit PCB1 is bonded to one side surface of the substrate 100.

[0144] At this time, the first printed circuit board unit PCB1 should be bonded to the substrate 100 so that a first end of the first printed circuit board unit PCB1, which faces the upper surface of the substrate 100, contacts a second end of the second printed circuit board unit PCB2, which faces the side surface of the substrate 100. To this end, the first printed circuit board unit PCB1 can be aligned with the first alignment aid 10 of the second printed circuit board unit PCB2, which has already been bonded to the upper surface of the substrate 100.

[0145] Furthermore, the first printed circuit board unit PCB1 should be bonded to the substrate 100 such that the first other end of the first printed circuit board unit PCB1, located on the opposite side of the first end, contacts the third end of the third printed circuit board unit PCB3, which faces the side surface of the substrate 100. To this end, the first printed circuit board unit PCB1 may be aligned with respect to the second alignment aid 20 of the third printed circuit board unit PCB3 already bonded to the lower surface of the substrate 100.

[0146] like Figure 15 and Figure 16 As shown, the second printed circuit board unit PCB2 may include a first alignment aid portion 10 , and the third printed circuit board unit PCB3 may include a second alignment aid portion 20 .

[0147] The first alignment auxiliary portion 10 is formed to protrude from a second end of the second printed circuit board unit PCB2 toward one side surface of the substrate 100. In this case, the first alignment auxiliary portion 10 may be integrally formed with the second printed circuit board unit PCB2.

[0148] In addition, the width d2 of the second end of the second printed circuit board unit PCB2 facing the side surface of the substrate 100 may be greater than the width d1 of the first end of the first printed circuit board unit PCB1 facing the upper surface of the substrate 100. Figure 15 As shown, when the first alignment auxiliary portion 10 is formed at both ends of the second end of the second printed circuit board unit PCB2, the width d2 of the second end of the second printed circuit board unit PCB2 can be greater than the width d1 of the first end of the first printed circuit board unit PCB1 by the sum of the widths of the first alignment auxiliary portion 10.

[0149] The second alignment auxiliary portion 20 is formed to protrude from a third end of the third printed circuit board unit PCB3 toward one side surface of the substrate 100. In this case, the second alignment auxiliary portion 20 may be integrally formed with the third printed circuit board unit PCB3.

[0150] In addition, the width d3 of the third end of the third printed circuit board unit PCB3 in the direction toward the side surface of the substrate 100 may be equal to the width d2 of the second end of the second printed circuit board unit PCB2. In addition, the width d3 of the third end of the third printed circuit board unit PCB3 may be greater than the width d1 of the first other end of the first printed circuit board unit PCB1 located on the opposite side of the first end. In addition, as Figure 15 As shown, when the second alignment auxiliary portion 20 is formed at both ends of the third end of the third printed circuit board unit PCB3, the width d3 of the third end of the third printed circuit board unit PCB3 can be larger than the width d1 of the first other end of the first printed circuit board unit PCB1 by the sum of the widths of the second alignment auxiliary portion 20.

[0151] So far, the description has been mainly based on the display device, but the present invention is not limited thereto. For example, a display device manufacturing method for manufacturing such a display device also falls within the scope of the present invention.

[0152] The present invention has been described with reference to the embodiments shown in the accompanying drawings. However, these are merely illustrative, and those skilled in the art will appreciate that various modifications and equivalent embodiments are possible. Therefore, the true scope of protection of the present invention should be determined by the technical concepts of the appended claims.

Claims

1. A display device comprising: substrate; A first printed circuit board unit is located on one side surface of the substrate; as well as a second printed circuit board unit located on the upper surface of the substrate, wherein a second end of the second printed circuit board unit facing the side surface of the substrate is joined to a first end of the first printed circuit board unit facing the upper surface of the substrate, The wiring of the first printed circuit board unit is electrically connected to the wiring of the second printed circuit board unit, and the base layer of the first printed circuit board unit is bonded to the base layer of the second printed circuit board unit. The first printed circuit board unit includes a first alignment assisting portion protruding outward from the upper surface of the substrate, or the second printed circuit board unit includes a first alignment assisting portion protruding outward from the one side surface of the substrate.

2. The display device according to claim 1, wherein The first printed circuit board unit is bent so that a first other end of the first printed circuit board unit, which is located on an opposite side of the first end, is located at a lower portion of the substrate.

3. The display device according to claim 1, further comprising: The third printed circuit board unit is located on the lower surface of the substrate, and a third end of the third printed circuit board unit facing the one side surface of the substrate is joined to the first other end of the first printed circuit board unit located on the opposite side of the first end.

4. The display device according to claim 3, wherein The first printed circuit board unit includes a first alignment assisting portion protruding toward an outer side of the upper surface of the substrate and a second alignment assisting portion protruding toward an outer side of the lower surface of the substrate.

5. The display device according to claim 3, wherein The second printed circuit board unit includes a first alignment assisting portion protruding toward the outside of the one side surface of the substrate. The display device according to claim 5 , wherein: The width of the second end is greater than the width of the first end.

7. The display device according to claim 6, wherein: The third printed circuit board unit includes a second alignment assisting portion protruding toward an outer side of the one side surface of the substrate.

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