Display modules and electronic devices

Abstract

The present invention provides a display module and electronic device, the display module comprising: a display panel and a heat dissipation film, the display panel comprising a bending area, the bending area being located at at least one corner of the display panel, the edge of the bending area being a curved edge; the bending area being provided with: a flexible substrate and a heat-conducting pattern provided on the flexible substrate near the light-emitting surface of the display panel; the heat dissipation film being provided on the non-light-emitting surface of the display panel, the heat dissipation film comprising a hollow structure at the corner corresponding to the bending area, and the heat dissipation film being connected to the heat-conducting pattern. In the present invention, at least one corner of the heat dissipation film is provided with a hollow structure, and when the heat dissipation film is attached to a display panel having a curved corner, wrinkles and bubbles at the corner of the heat dissipation film can be avoided during the attachment process, thereby improving the yield of the product. At the same time, the heat dissipation film is connected to the heat-conducting pattern on the display panel, which can effectively improve the heat dissipation effect of the display panel.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of display technology, and in particular to a display module and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) display technology has rapidly emerged in recent years due to its characteristics such as large viewing angle, high brightness, fast response, low power consumption, and flexibility, and is considered to be the most promising display technology.

[0003] With the development of society and advancement of technology, people are demanding higher screen-to-body ratios in electronic products, and full-screen displays are becoming the trend. However, to achieve a truly full-screen display, especially for products with four curved corners (curved edges), the four corners of the screen need to be partially bendable to facilitate the subsequent module bonding process.

[0004] However, because the four corners serve as bending areas, module materials, especially hard materials such as SCF (heat dissipation film), are prone to wrinkles and bubbles during the attachment process. Summary of the Invention

[0005] The embodiments of the present invention provide a display module and an electronic device for solving the problem that wrinkles and bubbles are easily generated at the four corners of a heat dissipation film when a heat dissipation film is attached to a display panel with a four-sided curved structure.

[0006] In order to solve the above-mentioned technical problems, the present invention is achieved as follows:

[0007] In a first aspect, an embodiment of the present invention provides a display module, comprising:

[0008] A display panel, the display panel comprising a bending region, the bending region being located at at least one corner of the display panel, the edge of the bending region being a curved edge; the bending region being provided with: a flexible substrate and a heat conductive pattern provided on a side of the flexible substrate close to a light emitting surface of the display panel;

[0009] A heat dissipation film is provided on the non-light-emitting surface of the display panel, the heat dissipation film includes a hollow structure at a corner position corresponding to the bending area, and the heat dissipation film is connected to the heat conductive pattern.

[0010] Optionally, the bending area includes a plurality of island areas, an opening area between adjacent island areas, and a bridge area for connecting adjacent island areas;

[0011] Wherein, the flexible substrate is arranged in the island area and the bridge area, and a hole is opened in the opening area;

[0012] The heat conductive pattern is arranged on a side of the flexible substrate in the island area and / or the bridge area away from the heat dissipation film;

[0013] The display module further includes:

[0014] The thermal conductive adhesive is arranged on a side of the flexible substrate away from the thermal conductive pattern and in the opening, and is used for connecting the thermal conductive pattern and the heat dissipation film.

[0015] Optionally, the heat conductive pattern is provided in the island area and the bridge area, and a hole is opened in the opening area.

[0016] Optionally, the bending zone is further provided with:

[0017] a thin film transistor functional layer, disposed in the island region and located on a side of the thermal conductive pattern away from the flexible substrate;

[0018] The light emitting device is arranged in the island area and is located on a side of the thin film transistor functional layer away from the flexible substrate.

[0019] Optionally, the bending zone is further provided with:

[0020] A light-shielding pattern is provided in the island area and is provided in the same layer and material as the heat-conducting pattern;

[0021] The thin film transistor functional layer includes an active layer, and the orthographic projection of the active layer on the flexible substrate is located within the orthographic projection area of the light-shielding pattern on the flexible substrate.

[0022] Optionally, the thermally conductive adhesive is thermally conductive silica gel.

[0023] Optionally, the material of the thermal conductive pattern includes metal and metal alloy.

[0024] Optionally, the four corners of the display panel are all provided with the bending areas, and the four corners of the heat dissipation film are all hollow structures.

[0025] Optionally, the bending zone is specifically configured as follows:

[0026] A flexible substrate is provided in the island area and the bridge area, and has a hole in the opening area;

[0027] a metal layer, disposed on a side of the flexible substrate close to the light-emitting surface of the display backlight, the metal layer comprising: a light-shielding pattern and a heat-conducting pattern, the light-shielding pattern and the heat-conducting pattern being provided in the same layer and the same material, the heat-conducting pattern being provided on the island area and the bridge area, and having an opening in the opening area, and the light-shielding pattern being provided on the island area;

[0028] A buffer layer is provided on a side of the thermal conductive pattern away from the flexible substrate, wherein the buffer layer has a hole in the opening area;

[0029] an active layer, disposed in the island region and located on a side of the buffer layer away from the flexible substrate, wherein an orthographic projection of the active layer on the flexible substrate is located within an orthographic projection region of the light-shielding pattern on the flexible substrate;

[0030] a first gate insulating layer, disposed in the island region and located on a side of the active layer away from the flexible substrate;

[0031] a first gate metal layer, disposed in the island region and located on a side of the first gate insulating layer away from the flexible substrate;

[0032] a second gate insulating layer, disposed in the island region and located on a side of the first gate metal layer away from the flexible substrate;

[0033] a second gate metal layer, disposed in the island region and located on a side of the second gate insulating layer away from the flexible substrate;

[0034] an interlayer dielectric layer, disposed in the island region and located on a side of the second gate metal layer away from the flexible substrate;

[0035] a first source / drain metal layer, disposed in the island region and located on a side of the interlayer dielectric layer away from the flexible substrate, the first source / drain metal layer being connected to the active layer via vias penetrating the interlayer dielectric layer, the second gate insulating layer, and the first gate insulating layer;

[0036] a first passivation layer, disposed in the island region and located on a side of the first source / drain metal layer away from the flexible substrate;

[0037] a first planar layer, disposed in the island region and located on a side of the first passivation layer away from the flexible substrate;

[0038] a second passivation layer, disposed in the island region and the bridge region and located on a side of the first flat layer away from the flexible substrate, the second passivation layer having an opening in the opening region;

[0039] an anode, disposed in the island region and located on a side of the second passivation layer away from the flexible substrate, the anode being connected to the first source / drain metal layer via a via hole penetrating the second passivation layer and the first planar layer;

[0040] a pixel definition layer, disposed in the island region and located on a side of the anode away from the flexible substrate, the pixel definition layer defining a plurality of pixel regions;

[0041] a light-emitting layer, disposed in the island region and at least partially located in the pixel region;

[0042] a cathode, disposed in the island region and located on a side of the light-emitting layer away from the flexible substrate;

[0043] The thermal conductive adhesive is arranged on the side of the flexible substrate away from the metal layer and in the opening area. The thermal conductive adhesive in the opening area is connected to the thermal conductive pattern, and the thermal conductive adhesive on the side of the flexible substrate away from the metal layer is connected to the heat dissipation film.

[0044] The bending zone is further provided with:

[0045] a second source / drain metal layer, disposed in the island region and located on a side of the first planar layer away from the flexible substrate, the second source / drain metal layer being connected to the first source / drain metal layer via a via penetrating the first planar layer and the first passivation layer;

[0046] a second flat layer, disposed in the island region and the bridge region and located on a side of the first flat layer away from the flexible substrate, the second flat layer having a hole in the opening region;

[0047] Wherein, the anode is connected to the first source-drain metal layer through the second source-drain metal layer.

[0048] Optionally, the display module further includes:

[0049] A curved cover plate is arranged on a side of the light emitting surface of the display panel, the curved cover plate includes at least one corner, and the corners of the curved cover plate are arranged in a one-to-one correspondence with the corners of the display panel.

[0050] In a second aspect, an embodiment of the present invention provides an electronic device, comprising the display module described in the second aspect.

[0051] In an embodiment of the present invention, at least one corner of the heat dissipation film is set to a hollow structure. When the heat dissipation film is attached to a display panel with a curved corner, wrinkles and bubbles can be avoided at the corner of the heat dissipation film during the attachment process, thereby improving the yield of the product. At the same time, the heat dissipation film is connected to the thermal conductive pattern on the display panel, which can effectively improve the heat dissipation effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present invention. The same reference symbols are used throughout the drawings to represent the same components. In the drawings:

[0053] Figure 1 Schematic diagram of the structure of a display module according to an embodiment of the present invention;

[0054] Figure 2 A schematic structural diagram of a heat dissipation film according to an embodiment of the present invention;

[0055] Figure 3 for Figure 1 A schematic cross-sectional structural diagram of the display module at AA';

[0056] Figure 4 A schematic structural diagram of a heat-conducting pattern according to an embodiment of the present invention;

[0057] Figure 5 A schematic structural diagram of a heat conductive pattern according to another embodiment of the present invention;

[0058] Figure 6 FIG. 4 is a schematic cross-sectional structural diagram of a display module according to another embodiment of the present invention. DETAILED DESCRIPTION

[0059] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0060] Please refer to Figure 1 An embodiment of the present invention provides a heat dissipation film 20 having at least one corner thereof formed as a hollow structure. In this embodiment of the present invention, by providing at least one corner of the heat dissipation film with a hollow structure, wrinkles and bubbles can be avoided at the corners of the heat dissipation film during attachment when the heat dissipation film is attached to a display panel with curved corners, thereby improving product yield.

[0061] Please refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 , an embodiment of the present invention provides a display module, comprising:

[0062] A display panel 10 includes a bending region 11 located at at least one corner of the display panel 10 and having a curved edge. The bending region 11 includes a flexible substrate 101 and a thermally conductive pattern 1021 disposed on a side of the flexible substrate 101 close to a light emitting surface of the display panel 10.

[0063] The heat dissipation film 20 is disposed on the non-light-emitting surface of the display panel 10 . The heat dissipation film 20 includes a hollow structure at the corner corresponding to the bending area 11 . The heat dissipation film 20 is connected to the thermal conductive pattern 1021 .

[0064] In the embodiment of the present invention, the heat dissipation film 20 may be directly connected to the thermal conductive pattern 1021 or indirectly connected via a medium.

[0065] In an embodiment of the present invention, at least one corner of the heat dissipation film is set to a hollow structure. When the heat dissipation film is attached to a display panel with a curved corner, wrinkles and bubbles can be avoided at the corner of the heat dissipation film during the attachment process, thereby improving the yield of the product. At the same time, the heat dissipation film is connected to the thermal conductive pattern on the display panel, which can effectively improve the heat dissipation effect of the display panel.

[0066] Figure 1-Figure 4 In the illustrated embodiment, the four corners of the display panel 10 are each provided with the bending regions 11 , and the four corners of the heat dissipation film 20 are each hollowed out, corresponding one-to-one to the bending regions 11 .

[0067] Optionally, the shape of the hollow structure of the heat dissipation film 20 may be consistent with the shape of the corresponding bending area 11 , and the size thereof may be the same as or similar to the size of the bending area 11 .

[0068] Please refer to Figure 3 In an embodiment of the present invention, the bending area 11 includes a plurality of island areas, an opening area between adjacent island areas, and a bridge area for connecting adjacent island areas;

[0069] The flexible substrate 101 is provided in the island area and the bridge area, and a hole is opened in the opening area;

[0070] The heat conductive pattern 1021 is provided on a side of the flexible substrate 101 in the island area and / or the bridge area away from the heat dissipation film 20 ;

[0071] The display module 10 further includes:

[0072] The thermal conductive adhesive 30 is disposed on a side of the flexible substrate 101 away from the thermal conductive pattern 1021 and in the opening, and is used to connect the thermal conductive pattern 1021 and the heat dissipation film 20 .

[0073] In the embodiment of the present invention, the heat dissipation film is connected to the heat conductive pattern through the opening area on the bending area and the thermal conductive adhesive applied to the bending area. The connection method uses the opening area of the existing structure and does not require modification, which is low in cost.

[0074] In the embodiment of the present invention, the heat conductive pattern 1021 is provided in the island area and the bridge area, and a hole is opened in the opening area. Figure 4 , Figure 4 FIG. 1 is a schematic diagram of the structure of the heat conductive pattern in one embodiment of the present invention, Figure 4 As can be seen from the figure, the heat conductive pattern 1021 includes a plurality of through holes, which are openings in the opening area.

[0075] In addition, the thermal conductive pattern can also be in other forms, such as a grid shape, please refer to Figure 5 , and the grid is the opening in the opening area.

[0076] In the embodiment of the present application, optionally, the bending zone is further provided with:

[0077] a thin film transistor functional layer, disposed in the island region and located on a side of the thermal conductive pattern away from the flexible substrate;

[0078] The light emitting device is arranged in the island area and is located on a side of the thin film transistor functional layer away from the flexible substrate.

[0079] In the embodiment of the present invention, disposing a light-emitting device in the bending area can increase the proportion of the display area of the display panel and reduce the frame.

[0080] Optionally, the bending zone is further provided with:

[0081] A light-shielding pattern is provided in the island area and is provided in the same layer and material as the heat-conducting pattern;

[0082] The thin film transistor functional layer includes an active layer, and the orthographic projection of the active layer on the flexible substrate is located within the orthographic projection area of the light-shielding pattern on the flexible substrate.

[0083] That is, the heat conductive pattern and the light shielding pattern can be prepared by using one mask, thereby saving process steps.

[0084] Optionally, the material of the thermal conductive pattern 1021 includes metal and metal alloy.

[0085] Optionally, the thermally conductive adhesive 30 is thermally conductive silica gel.

[0086] Please refer to Figure 6 In the embodiment of the present invention, the bending area 11 is specifically configured as follows:

[0087] A flexible substrate 101, wherein the flexible substrate 101 has a hole in the hole area;

[0088] A metal layer is provided on one side of the flexible substrate 101, the metal layer including: a light-shielding pattern 1022 and a heat-conducting pattern 1021, the light-shielding pattern 1022 and the heat-conducting pattern 1021 being provided in the same layer and the same material, the heat-conducting pattern 1021 being provided on the island area and the bridge area, and having an opening in the opening area; the light-shielding pattern 1022 being provided on the island area;

[0089] A buffer layer 103 is provided on a side of the thermal conductive pattern 1021 away from the flexible substrate 101 , and the buffer layer 103 has a hole in the opening area;

[0090] an active layer 104 disposed in the island region and located on a side of the buffer layer 103 away from the flexible substrate 101 , wherein an orthographic projection of the active layer 104 on the flexible substrate 101 is located within an orthographic projection region of the light-shielding pattern 1021 on the flexible substrate 101 ;

[0091] A first gate insulating layer 105 is disposed in the island region and located on a side of the active layer 104 away from the flexible substrate 101 ;

[0092] a first gate metal layer 106 , disposed in the island region and located on a side of the first gate insulating layer 105 away from the flexible substrate 101 ;

[0093] a second gate insulating layer 107 , disposed in the island region and located on a side of the first gate metal layer 106 away from the flexible substrate 101 ;

[0094] a second gate metal layer 108 , disposed in the island region and located on a side of the second gate insulating layer 107 away from the flexible substrate 101 ;

[0095] an interlayer dielectric layer 109 , disposed in the island region and located on a side of the second gate metal layer 108 away from the flexible substrate 101 ;

[0096] a first source / drain metal layer 110 disposed in the island region and located on a side of the interlayer dielectric layer 1099 away from the flexible substrate 101 , the first source / drain metal layer 110 being connected to the active layer 104 via vias penetrating the interlayer dielectric layer 109 , the second gate insulating layer 107 , and the first gate insulating layer 105 ;

[0097] A first passivation layer 111 is disposed in the island region and located on a side of the first source / drain metal layer 110 away from the flexible substrate 101 ;

[0098] A first planar layer 112 is disposed in the island region and located on a side of the first passivation layer 111 away from the flexible substrate 101 ;

[0099] A second passivation layer 115 is provided in the island region and the bridge region and is located on a side of the first planar layer 112 away from the flexible substrate;

[0100] an anode 116 disposed in the island region and located on a side of the second passivation layer 115 away from the flexible substrate 101 , the anode 116 being connected to the first source / drain metal layer 110 via a via penetrating the second passivation layer 115 and the first planar layer 112 ;

[0101] a pixel definition layer 117 disposed in the island region and located on a side of the anode 116 away from the flexible substrate 101 , wherein the pixel definition layer 117 defines a plurality of pixel regions;

[0102] a light-emitting layer (not shown), disposed in the island region and at least partially located within the pixel region 117;

[0103] a cathode (not shown), disposed in the island region and located on a side of the light-emitting layer away from the flexible substrate 101;

[0104] The thermal conductive adhesive 30 is arranged on the side of the flexible substrate 101 away from the metal layer and in the opening area. The thermal conductive adhesive 30 located in the opening is connected to the thermal conductive pattern 1021, and the thermal conductive adhesive 30 located on the bottom side of the flexible substrate 101 away from the metal layer is connected to the heat dissipation film 20.

[0105] In the above embodiment, the display panel is a single-layer source-drain metal layer. In other embodiments of the present invention, it may also include a double-layer source-drain metal layer. That is, in other embodiments of the present invention, the bending region is further provided with:

[0106] a second source-drain metal layer 113, disposed in the island region and located on a side of the first planar layer 112 away from the flexible substrate 101, the second source-drain metal layer 113 being connected to the first source-drain metal layer 110 via vias penetrating the first planar layer 112 and the first passivation layer 111;

[0107] A second planar layer 114 is provided in the island region and the bridge region and is located on a side of the second source / drain metal layer 113 away from the flexible substrate 101 , and the second planar layer 114 has a hole in the opening region;

[0108] The anode 116 is connected to the first source-drain metal layer 110 through the second source-drain metal layer 113 .

[0109] In an embodiment of the present invention, optionally, the display module further includes:

[0110] A curved cover plate is arranged on a side of the light emitting surface of the display panel, the curved cover plate includes at least one corner, and the corners of the curved cover plate are arranged in a one-to-one correspondence with the corners of the display panel.

[0111] Optionally, the curved cover plate includes four corners, and the edges of the corners are curved edges. The curved edges may be arcs, for example, and the radius of the arcs may be set as required.

[0112] An embodiment of the present invention further provides an electronic device, comprising the display module of the above embodiment. The device with a brain can be, for example, a mobile phone, a tablet computer, etc.

[0113] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are protected by the present invention.

Claims

1. A display module, characterized in that: include: A display panel, the display panel comprising a bending region, the bending region being located at at least one corner of the display panel, the edge of the bending region being a curved edge; the bending region being provided with: a flexible substrate and a heat conductive pattern provided on a side of the flexible substrate close to a light emitting surface of the display panel; a heat dissipation film, disposed on the non-light-emitting surface of the display panel, the heat dissipation film including a hollow structure at a corner corresponding to the bending area, and the heat dissipation film being connected to the thermal conductive pattern; The bending area includes a plurality of island areas, an opening area between adjacent island areas, and a bridge area for connecting adjacent island areas; Wherein, the flexible substrate is arranged in the island area and the bridge area, and a hole is opened in the opening area; The heat conductive pattern is arranged on a side of the flexible substrate in the island area and / or the bridge area away from the heat dissipation film; The display module further includes: The thermal conductive adhesive is arranged on a side of the flexible substrate away from the thermal conductive pattern and in the opening, and is used for connecting the thermal conductive pattern and the heat dissipation film.

2. The display module according to claim 1, wherein: The heat-conducting pattern is arranged in the island area and the bridge area, and a hole is opened in the opening area.

3. The display module according to claim 1, wherein: The bending zone is further provided with: a thin film transistor functional layer, disposed in the island region and located on a side of the thermal conductive pattern away from the flexible substrate; The light emitting device is arranged in the island area and is located on a side of the thin film transistor functional layer away from the flexible substrate.

4. The display module according to claim 3, wherein: The bending zone is further provided with: A light-shielding pattern is provided in the island area and is provided in the same layer and material as the heat-conducting pattern; The thin film transistor functional layer includes an active layer, and the orthographic projection of the active layer on the flexible substrate is located within the orthographic projection area of the light-shielding pattern on the flexible substrate.

5. The display module according to claim 1, wherein: The thermally conductive adhesive is thermally conductive silica gel.

6. The display module according to claim 1, wherein: The material of the thermal conductive pattern includes metal and metal alloy.

7. The display module according to claim 1, wherein: The four corners of the display panel are all provided with the bending areas, and the four corners of the heat dissipation film are all hollow structures.

8. The display module according to claim 4, wherein: The bending zone is specifically provided with: A flexible substrate is provided in the island area and the bridge area, and has a hole in the opening area; a metal layer, disposed on a side of the flexible substrate close to the light-emitting surface of the display panel, the metal layer comprising: a light-shielding pattern and a heat-conducting pattern, the light-shielding pattern and the heat-conducting pattern being provided in the same layer and the same material, the heat-conducting pattern being provided on the island area and the bridge area, and having an opening in the opening area, and the light-shielding pattern being provided on the island area; A buffer layer is provided on a side of the thermal conductive pattern away from the flexible substrate, wherein the buffer layer has a hole in the opening area; an active layer, disposed in the island region and located on a side of the buffer layer away from the flexible substrate, wherein an orthographic projection of the active layer on the flexible substrate is located within an orthographic projection region of the light-shielding pattern on the flexible substrate; a first gate insulating layer, disposed in the island region and located on a side of the active layer away from the flexible substrate; a first gate metal layer, disposed in the island region and located on a side of the first gate insulating layer away from the flexible substrate; a second gate insulating layer, disposed in the island region and located on a side of the first gate metal layer away from the flexible substrate; a second gate metal layer, disposed in the island region and located on a side of the second gate insulating layer away from the flexible substrate; an interlayer dielectric layer, disposed in the island region and located on a side of the second gate metal layer away from the flexible substrate; a first source / drain metal layer, disposed in the island region and located on a side of the interlayer dielectric layer away from the flexible substrate, the first source / drain metal layer being connected to the active layer via vias penetrating the interlayer dielectric layer, the second gate insulating layer, and the first gate insulating layer; a first passivation layer, disposed in the island region and located on a side of the first source / drain metal layer away from the flexible substrate; a first planar layer, disposed in the island region and located on a side of the first passivation layer away from the flexible substrate; a second passivation layer, disposed in the island region and the bridge region and located on a side of the first flat layer away from the flexible substrate, the second passivation layer having an opening in the opening region; an anode, disposed in the island region and located on a side of the second passivation layer away from the flexible substrate, the anode being connected to the first source / drain metal layer via a via hole penetrating the second passivation layer and the first planar layer; a pixel definition layer, disposed in the island region and located on a side of the anode away from the flexible substrate, the pixel definition layer defining a plurality of pixel regions; a light-emitting layer, disposed in the island region and at least partially located in the pixel region; a cathode, disposed in the island region and located on a side of the light-emitting layer away from the flexible substrate; The thermal conductive adhesive is arranged on the side of the flexible substrate away from the metal layer and in the opening area. The thermal conductive adhesive in the opening area is connected to the thermal conductive pattern, and the thermal conductive adhesive on the side of the flexible substrate away from the metal layer is connected to the heat dissipation film.

9. The display module according to claim 8, wherein: The bending zone is further provided with: a second source / drain metal layer, disposed in the island region and located on a side of the first planar layer away from the flexible substrate, the second source / drain metal layer being connected to the first source / drain metal layer via a via penetrating the first planar layer and the first passivation layer; a second flat layer, disposed in the island region and the bridge region and located on a side of the first flat layer away from the flexible substrate, the second flat layer having a hole in the opening region; Wherein, the anode is connected to the first source-drain metal layer through the second source-drain metal layer.

10. The display module according to any one of claims 1 to 8, wherein: Also includes: A curved cover plate is arranged on a side of the light emitting surface of the display panel, the curved cover plate includes at least one corner, and the corners of the curved cover plate are arranged in a one-to-one correspondence with the corners of the display panel.

11. An electronic device, characterized in that: Comprising the display module according to any one of claims 1-10.

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