Three-dimensional heat dissipation device

Abstract

A three-dimensional heat dissipation device includes a vapor chamber, a heat pipe, and a solder joint. The vapor chamber includes an inner chamber and a first joint having a passage opening to the inner chamber. The heat pipe has a pipe space and a second joint. The second joint is sleeved around the first joint so that an end surface of the second joint directly contacts a surface of the vapor chamber. The pipe space is connected to the inner chamber through the passage. The pipe space and the inner chamber are filled with a working fluid. The solder joint combines the heat pipe and the vapor chamber. Therefore, the above structure can prevent the solder from flowing into the vapor chamber and the heat pipe during soldering. In this way, not only the soldering effect is improved, but also the product yield and the working efficiency of the heat dissipation structure are improved.

Description

Technical Field

[0001] The present invention relates to a heat dissipation device, and in particular to a three-dimensional heat dissipation device. Background Art

[0002] Current thermal structures include vapor chambers and heat pipes. Their advantages include excellent heat conduction, light weight, and simple structure, making them widely used in high-performance heat dissipation. For example, a thermal structure includes a vapor chamber and a heat pipe, which are welded together.

[0003] However, solder overflow is likely to occur during the soldering process and penetrate into the heat pipe, which not only affects the soldering effect but also affects the product yield, thereby reducing the working efficiency of the heat conduction structure.

[0004] Therefore, how to develop a solution to improve the above-mentioned deficiencies and inconveniences has become an urgent and important issue for relevant industries. Summary of the Invention

[0005] An object of the present invention is to provide a three-dimensional heat dissipation device to solve the difficulties mentioned in the above-mentioned prior art.

[0006] One embodiment of the present invention provides a three-dimensional heat dissipation device. The three-dimensional heat dissipation device includes a heat spreader, a working fluid, at least one solder joint and at least one heat pipe. The heat spreader includes an inner chamber and at least one first joint. The first joint has a channel connected to the inner chamber. The heat pipe has an inner tube space and at least one second joint. The second joint is sleeved and surrounds the first joint, so that the end face of the second joint directly contacts one side of the heat spreader. The inner tube space is connected to the inner chamber through the channel. The working fluid is filled in the inner tube space and the inner chamber. The solder joint connects the second joint and this surface of the heat spreader to combine the heat pipe and the heat spreader into one.

[0007] According to one or more embodiments of the present invention, in the three-dimensional heat dissipation device, the second joint is connected to and surrounds one end of the heat pipe, and gradually expands outward from the end of the heat pipe toward the heat pipe and the first joint, so that the second joint surrounds a conical space. The maximum diameter of the conical space is larger than the maximum diameter of the space within the pipe.

[0008] According to one or more embodiments of the present invention, in the three-dimensional heat dissipation device described above, the vapor chamber includes a cover and a shell. The shell and the cover are sealed to each other, forming the inner chamber between the shell and the cover. The first joint is formed on the top surface of the cover.

[0009] According to one or more embodiments of the present invention, in the above-mentioned three-dimensional heat dissipation device, the solder joint portion surrounds the periphery of the first joint and closes the gap between the second joint and the vapor chamber.

[0010] According to one or more embodiments of the present invention, the three-dimensional heat dissipation device further includes a first capillary structure and a second capillary structure. The first capillary structure is located within the inner chamber and is used to guide the flow of the working fluid. The second capillary structure includes a first section and at least one second section. The first section is fixedly located within the space within the tube and connected to the second section. The second section extends in a curved manner from one end of the first section, is located within the inner chamber, and is connected to the first capillary structure to guide the flow of the working fluid.

[0011] According to one or more embodiments of the present invention, in the three-dimensional heat dissipation device, the first capillary structure includes a first plate. The first plate is directly formed on a side of the housing facing the cover. The first plate is directly overlapped between the second section of the second capillary structure and the housing.

[0012] According to one or more embodiments of the present invention, in the three-dimensional heat dissipation device described above, the first capillary structure includes a second sheet. The second sheet is directly formed on a surface of the cover that faces the housing. A portion of the first section of the second capillary structure is located within the inner chamber and contacts the first sheet or the second sheet of the first capillary structure.

[0013] According to one or more embodiments of the present invention, the three-dimensional heat dissipation device further includes a fin assembly. The fin assembly includes a plurality of heat dissipation fins. The heat dissipation fins are parallel to each other and spaced apart and juxtaposed, and are penetrated by heat pipes.

[0014] According to one or more embodiments of the present invention, in the above-mentioned three-dimensional heat dissipation device, the heat pipe is in one of a straight shape, an L shape, and a U shape.

[0015] According to one or more embodiments of the present invention, the above-mentioned three-dimensional heat dissipation device further includes two first fin groups and a second fin group. The first fin groups are located on the temperature equalizer at intervals. Each first fin group includes a plurality of first heat dissipation fins. There are multiple heat pipes, and the heat pipes have a long axis direction, which passes perpendicularly through the top surface of the temperature equalizer. These first heat dissipation fins are spaced apart and arranged in parallel along the long axis direction. These heat pipes include at least one first heat pipe and at least one second heat pipe. These first heat dissipation fins of one first fin group are vertically penetrated by the first heat pipe. These first heat dissipation fins of another first fin group are vertically penetrated by the second heat pipe. The second fin group includes a trapezoidal body. The trapezoidal body is located between these first fin groups. The trapezoidal body includes a plurality of second heat dissipation fins. These second heat dissipation fins are spaced apart and arranged in parallel on the temperature equalizer along a transverse direction perpendicular to the long axis direction. The trapezoidal body has a top, a bottom and two opposing inclined portions. The bottom is opposite to the top and is fixed to the temperature equalizer, and the top is located between these inclined portions. Each inclined portion is separated from one of the adjacent first fin groups by a gap.

[0016] According to one or more embodiments of the present application, in the three-dimensional heat dissipation device, each of the first gaps between two adjacent first heat dissipation fins is smaller than each of the second gaps between the heat spreader and the first heat dissipation fins closest to the heat spreader.

[0017] According to one or more embodiments of the present application, in the three-dimensional heat dissipation device, the number of the first joints is two, the number of the heat pipes is one, and the number of the second joints is two, each of which is located at an opposite end of the heat pipe. Each of the second joints of the heat pipe is sleeved with a corresponding one of the first joints. The number of the second sections of the second capillary structure is two, each of which is connected to an opposite end of the first section. Each of the second sections is connected to the first capillary structure in the inner chamber.

[0018] According to one or more embodiments of the present application, the three-dimensional heat dissipation device further comprises a third fin group. The third fin group comprises an opposite top and a bottom. The bottom is connected to the top surface of the heat spreader. The third fin group comprises a plurality of third heat dissipation fins. The third heat dissipation fins are parallel and spaced apart from each other along a longitudinal direction, which is orthogonal to a normal direction of the top surface of the heat spreader. The heat pipe is in a U shape, and a part of the heat pipe is placed on the top of the third fin group, and the other part of the heat pipe extends into the third heat dissipation fins from the top of the third fin group.

[0019] According to one or more embodiments of the present application, the three-dimensional heat dissipation device further comprises a third fin group and a fourth fin group. The third fin group comprises a plurality of third heat dissipation fins on the heat spreader, and the third heat dissipation fins are parallel and spaced apart from each other along a longitudinal direction, which is orthogonal to a normal direction of the top surface of the heat spreader. The fourth fin group is stacked on the third fin group and comprises a plurality of fourth heat dissipation fins, and the fourth heat dissipation fins are parallel and spaced apart from each other along the longitudinal direction. The heat pipe is in a U shape and is located in the third fin group and the fourth fin group.

[0020] According to one or more embodiments of the present application, the three-dimensional heat dissipation device further comprises a third fin group. The third fin group comprises an opposite top and a bottom. The bottom is connected to the top surface of the heat spreader. The third fin group comprises a plurality of third heat dissipation fins. The third heat dissipation fins are parallel and spaced apart from each other along a longitudinal direction, which is orthogonal to a normal direction of the top surface of the heat spreader. The heat pipe is in a U shape, and a part of the heat pipe is placed on the top of the third fin group, and the other part of the heat pipe extends into the third heat dissipation fins from the top of the third fin group.

[0021] According to one or more embodiments of the present application, the three-dimensional heat dissipation device further comprises a third fin set and a fourth fin set. The third fin set is disposed on the vapor chamber and comprises a plurality of third heat dissipation fins which are parallel and spaced apart from each other along a longitudinal direction, the longitudinal direction being perpendicular to a normal direction of the top surface of the vapor chamber. The fourth fin set is stacked on the third fin set and comprises a plurality of fourth heat dissipation fins which are parallel and spaced apart from each other along the longitudinal direction. The heat pipe is in an L shape and is disposed in the third fin set and the fourth fin set.

[0022] Thus, by the above-mentioned architecture of the embodiments, the three-dimensional heat dissipation device can prevent the solder from penetrating into the vapor chamber and the heat pipe during the soldering process. Thus, the soldering effect is improved, and the product yield and the working efficiency of the heat dissipation structure are also improved.

[0023] The above merely describes the problems to be solved by the present application, the technical means for solving the problems, and the technical effects thereof. The specific details of the present application will be described in the embodiments and the related drawings below. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to make the above and other objects, features, advantages and embodiments of the present application more apparent, the drawings of the specification are described as follows:

[0025] Figure 1 is a partial exploded view of a three-dimensional heat dissipation device according to an embodiment of the present application;

[0026] Figure 2 is a partial exploded view of a three-dimensional heat dissipation device according to an embodiment of the present application; Figure 1 is a partial cross-sectional view of a three-dimensional heat dissipation device according to an embodiment of the present application;

[0027] Figure 3 is a partial side view of a three-dimensional heat dissipation device according to an embodiment of the present application;

[0028] Figure 4 is a perspective view of a three-dimensional heat dissipation device according to an embodiment of the present application;

[0029] Figure 5 is a perspective view of a three-dimensional heat dissipation device according to an embodiment of the present application;

[0030] Figure 6A is a perspective view of a three-dimensional heat dissipation device according to an embodiment of the present application;

[0031] Figure 6B is a side view of a three-dimensional heat dissipation device according to an embodiment of the present application;

[0032] Figure 7A is a side view of a three-dimensional heat dissipation device according to an embodiment of the present application;

[0033] Figure 7Bis a side view of a three-dimensional heat dissipation device according to an embodiment of the present invention;

[0034] Figure 8A is a partial side view of a three-dimensional heat dissipation device according to an embodiment of the present invention; and

[0035] Figure 8B It is a partial side view of a three-dimensional heat dissipation device according to an embodiment of the present invention.

[0036] Description of reference numerals:

[0037] 10, 11, 12, 13, 14, 15, 16, 17, 18: Three-dimensional heat dissipation device

[0038] 100: Vapor chamber

[0039] 110: Cover

[0040] 111: Top

[0041] 112: Back

[0042] 120: Shell

[0043] 121: Inner chamber

[0044] 122: Inside

[0045] 123: Bottom

[0046] 130: First connector

[0047] 131: Channel

[0048] 131A: Long axis direction

[0049] 200, 201, 202: Heat pipes

[0050] 210: Pipe body

[0051] 211: Long axis direction

[0052] 212: Space inside the tube

[0053] 214: Inner wall

[0054] 220: Second connector

[0055] 221: End face

[0056] 222: Closed end

[0057] 223: Conical space 230: Tube

[0058] 231: First paragraph

[0059] 231A: Long axis direction

[0060] 231B: Long axis direction

[0061] 232: Second paragraph

[0062] 232A: Long axis direction

[0063] 233: Bending part

[0064] 240: Pipe body

[0065] 241: First paragraph

[0066] 241A: Long axis direction

[0067] 242: Second paragraph

[0068] 242A: Long axis direction

[0069] 243: Bending part

[0070] 300: Working fluid

[0071] 400: First capillary structure

[0072] 410: First piece

[0073] 420: Second piece

[0074] 500, 501, 502: Second capillary structure

[0075] 510, 511, 512: First segment

[0076] 511A, 512A: first sub-segment

[0077] 511B, 512B: Second sub-segment

[0078] 511C, 512C: bending section

[0079] 520: Second Segment

[0080] 530: The third section

[0081] 600: Fin set

[0082] 610: cooling fins

[0083] 611: First Gap

[0084] 612: Second Gap

[0085] 620: First fin group

[0086] 621, 621A: First heat sink fin

[0087] 630: Second fin group

[0088] 640: Trapezoid

[0089] 641: Top

[0090] 642: Bottom

[0091] 643: Inclined part

[0092] 644: Gap

[0093] 645: Second heat sink

[0094] 646: Horizontal direction

[0095] 647: Straight line

[0096] 650: Third fin group

[0097] 651: Top

[0098] 652: bottom

[0099] 653: Third heat sink

[0100] 654: Vertical direction

[0101] 655: Through the channel

[0102] 660: Fourth fin group

[0103] 661: Horizontal groove

[0104] 662: Fourth heat sink

[0105] M: Area

[0106] D1, D2: Maximum inner diameter

[0107] S: Solder joint DETAILED DESCRIPTION

[0108] The following drawings illustrate various embodiments of the present invention. For clarity, many practical details are included in the following description. However, it should be understood that these practical details are not intended to limit the present invention. In other words, these practical details are not essential to the embodiments of the present invention. Furthermore, to simplify the drawings, some conventional structures and components are shown in simplified schematic form.

[0109] Figure 1 FIG. 1 is a partial exploded view of a three-dimensional heat dissipation device 10 according to an embodiment of the present invention. Figure 2 for Figure 1 A partial cross-sectional view of the three-dimensional heat dissipation device 10 in area M. Figure 1 and Figure 2As shown, the three-dimensional heat dissipation device 10 includes a vapor chamber 100 and a plurality (e.g., two) of heat pipes 200. The vapor chamber 100 includes a cover 110 and a shell 120. The shell 120 and the cover 110 are sealed with each other, and an inner chamber 121 is formed between the shell 120 and the cover 110. The cover 110 has a plurality (e.g., two) of first joints 130 on a surface facing away from the shell 120 (hereinafter referred to as the top surface 111). The first joints 130 are located at intervals on the top surface 111 of the cover 110. Each first joint 130 extends outward from the top surface 111 of the cover 110, and each first joint 130 has a channel 131 connected to the inner chamber 121. The long axis directions 131A of the channels 131 of the first joints 130 are parallel to each other. The shell 120 has an inner surface 122 and a bottom surface 123 that are opposite to each other.

[0110] Each heat pipe 200 includes a tube body 210 and a second connector 220. In this embodiment, each tube body 210 is linear, with the long axis 211 of the tube body 210 coaxially aligned with the long axis 131A of each channel 131 and perpendicular to the top surface 111 of the cover 110. One end of the tube body 210 is a closed end 222, and the other end is connected to the second connector 220. The tube body 210 defines an inner tube space 212 extending along the long axis 131A of the channel 131. In this embodiment, the second connector 220 connects to and surrounds the other end of the tube body 210. It gradually expands outward from the other end of the tube body 210 away from the tube body 210 and the first connector 130, thereby enclosing a tapered space 223. The maximum diameter of the tapered space 223 (see D1) is larger than the maximum diameter of the inner tube space 212 (see D2).

[0111] When the heat pipe 200 is connected to the vapor chamber 100, the second connector 220 of the heat pipe 200 is sleeved around and surrounds the first connector 130 of the vapor chamber 100. The second connector 220 is connected to the cover 110, and the internal space 212 within the tube 210 is connected to the internal chamber 121 of the vapor chamber 100 through the channel 131. The three-dimensional heat dissipation device 10 further uses solder to securely connect the heat pipe 200 and the vapor chamber 100. The solder forms a solder joint S between the second connector 220 and the top surface 111 of the cover 110, as well as in the space (see the tapered space 223) between the first connector 130, the second connector 220, and the top surface 111 of the cover 110. This allows the working fluid 300 to be filled into the internal space 212 and the internal chamber 121. In other words, a portion of the solder joint S surrounds the periphery of the first joint 130 and is located on the top surface 111 of the cover 110 , while another portion of the solder joint S is sealed and fills the gap between the first joint 130 , the second joint 220 and the vapor chamber 100 (refer to the conical space 223 ).

[0112] More specifically, when the second joint 220 of the heat pipe 200 is connected to the first joint 130 of the vapor chamber 100, because the maximum inner diameter D1 of the second joint 220 is greater than the maximum inner diameter D2 of the tube body 210, the first joint 130 can extend into the second joint 220 and a portion of the tube body 210, and the end surface 221 of the second joint 220 directly contacts the top surface 111 of the cover 110, thereby minimizing the gap between the second joint 220 and the cover 110. At this point, the solder joint S surrounds the periphery of the second joint 220 and closes the gap between the first joint 130, the second joint 220, and the top surface 111 of the cover 110 (see the tapered space 223).

[0113] In addition, the three-dimensional heat dissipation device 10 further includes a first capillary structure 400 and a second capillary structure 500. The first capillary structure 400 is located within the inner chamber 121. The second capillary structure 500 is located within the inner tube space 212 and the inner chamber 121 to guide the flow of the working fluid 300. Thus, when the temperature vapor chamber 100 absorbs working heat energy from a heat source (not shown) to heat and vaporize the working fluid 300, the gaseous working fluid 300 flows through the channel 131 to the inner tube space 212 and flows to the end away from the heat source (not shown), thereby condensing back into liquid form. Then, guided by the first capillary structure 400 and the second capillary structure 500, the gaseous working fluid 300 flows to the evaporation area, thereby bringing the working fluid 300 back away from the heat source to achieve the purpose of heat dissipation.

[0114] Thus, through the above-described structures of the embodiments, the three-dimensional heat dissipation device 10 can prevent the solder from overflowing during the soldering process and seeping into the heat pipe 200 and the vapor chamber 100. This not only improves the soldering effect, but also increases the product yield and the working efficiency of the thermal conductive structure.

[0115] More specifically, the first capillary structure 400 includes a first plate 410 and a second plate 420. The first plate 410 and the second plate 420 are located on opposite inner sides of the inner chamber 121 and are spaced apart from each other. For example, the first plate 410 is formed directly on the inner surface 122 of the housing 120, and the inner surface 122 of the housing 120 is completely covered by the first plate 410. In other words, the outer contour of the first plate 410 is substantially the same as, or at least similar to, the outer contour of the inner surface 122 of the housing 120. The second plate 420 is formed directly on the back surface 112 of the cover 110, and the back surface 112 of the cover 110 is completely covered by the second plate 420. In other words, the outer contour of the second plate 420 is substantially the same as, or at least similar to, the outer contour of the back surface 112 of the cover 110.

[0116] The second capillary structure 500 is L-shaped and includes a first section 510 and a second section 520. The first section 510 is located within the intra-tube space 212 and is connected to the second section 520. Both the first section 510 and the second section 520 are linear strips. The second section 520 of the second capillary structure 500 extends in a curved manner from one end of the first section 510, is located within the inner chamber 121, and is fixedly connected to the first capillary structure 400. For example, the second section 520 and the first section 510 are orthogonal to each other, or at least nearly orthogonal. The first section 510 of the second capillary structure 500 is not fixed to the inner wall 214 of the intra-tube space 212 and may hang down within the intra-tube space 212 or be loosely attached to the inner wall 214 of the intra-tube space 212. A portion of the first section 510 of the second capillary structure 500 is located within the inner chamber 121 and contacts the second plate 420 of the first capillary structure 400. The second section 520 of the second capillary structure 500 directly covers the first plate 410 of the first capillary structure 400, and the first plate 410 of the first capillary structure 400 is directly overlapped between the second section 520 of the second capillary structure 500 and the inner surface 122 of the housing 120.

[0117] In this way, a portion of the working fluid 300 away from the thermal energy can flow from the first section 510 of the second capillary structure 500 to the first capillary structure 400, and another portion of the working fluid 300 away from the thermal energy can flow from the second section 520 of the second capillary structure 500 to the first capillary structure 400, thereby flowing back to the preset evaporation positions in the temperature vapor chamber 100 respectively.

[0118] In one embodiment, the second capillary structure 500 includes a plurality of second sections 520, each of which extends in a curved manner from one end of the first section 510 and is located within the inner chamber 121. The plurality of second sections 520 are respectively fixedly connected to the first capillary structure 400 in different regions, but the present invention is not limited thereto. By designing the plurality of second sections 520, the temperature uniformity of the temperature distribution plate 100 can be increased, thereby improving the heat dissipation effect. In this way, if there are a plurality of heat sources (not shown in the figure) and they are spaced apart and distributed on the bottom surface 123 of the shell 120, the second sections 520 can be respectively arranged directly above these heat sources so as to quickly receive the working heat energy emitted by these heat sources (not shown in the figure).

[0119] Figure 3 FIG is a partial side view of a three-dimensional heat dissipation device 11 according to an embodiment of the present invention. Figure 3 As shown, the three-dimensional heat dissipation device 11 of this embodiment is Figure 1The three-dimensional heat dissipation device 10 is substantially the same as the three-dimensional heat dissipation device 11, and the difference is that the three-dimensional heat dissipation device 11 further includes a fin group 600. The fin group 600 includes a plurality of heat dissipation fins 610. These heat dissipation fins 610 are simultaneously penetrated by the heat pipe 200, and these heat dissipation fins 610 are parallel to each other and spaced apart. More specifically, these heat dissipation fins 610 are equidistant from each other and spaced apart on the heat pipe 200 along the long axis direction 211 of the tube body 210. There is a first gap 611 between any two adjacent heat dissipation fins 610, and there is a second gap 612 from the bottom heat dissipation fin (that is, the heat dissipation fin 610A closest to the temperature equalizing plate 100) to the top surface 111 of the cover body 110. Any two first gaps 611 between the heat dissipation fins 610 are substantially the same, and any second gap 612 is substantially the same as the first gap 611.

[0120] In this way, after the working heat energy is transferred to the heat pipe 200 , the working heat energy can be quickly transferred from the heat pipe 200 to the heat dissipation fins 610 , and then dissipated into the air through the heat dissipation fins 610 .

[0121] Figure 4 FIG is a perspective view of a three-dimensional heat dissipation device 12 according to an embodiment of the present invention. Figure 4 As shown, the three-dimensional heat dissipation device 12 of this embodiment is Figure 1 The three-dimensional heat dissipation device 10 is substantially similar to the heat pipe 201, except that the tube body 230 of each heat pipe 201 is L-shaped rather than linear, and the first section 511 of the second capillary structure 501 is L-shaped rather than linear. More specifically, each tube body 230 includes a first section 231, a second section 232, and a bend 233. The bend 233 connects the first section 231 and the second section 232, such that the long axis 231A of the first section 231 and the long axis 232A of the second section 232 are perpendicular to each other, and the long axis 232A of the second section 232 passes perpendicularly through the top surface 111 of the cover 110. The closed end 222 is located on the first section 231, and the second joint 220 is located on the second section 232.

[0122] More specifically, the first section 511 of the second capillary structure 501 is located within the tube space 212. In this embodiment, the first section 511 of the second capillary structure 501 is not fixed to the inner wall 214 of the tube space 212 and may hang down within the tube space 212 or be loosely attached to the inner wall 214 of the tube space 212. One end of the first section 511 of the second capillary structure 501 is connected to the closed end 222 of the tube body 230. The first section 511 of the second capillary structure 501 enters the inner chamber 121 in sequence along the first section 231, the bend 233, and the second section 232. The second section 520 of the second capillary structure 501 is linear, with the long axis 231B of the second section 520 being parallel, or at least nearly parallel, to the long axis 231B of the first section 231.

[0123] More specifically, the first section 511 includes a first sub-section 511A, a second sub-section 511B, and a bent section 511C. The first sub-section 511A and the second sub-section 511B are bent, with the bent section 511C connecting the first sub-section 511A and the second sub-section 511B. The first sub-section 511A is located in the tube space 212 within the first section 231, while the second sub-section 511B is located in the tube space 212 within the second section 232. The bent section 511C is located in the tube space 212 within the bent portion 233.

[0124] In one embodiment, the second capillary structure 501 includes multiple second sections 520, each of which extends in a curved manner from one end of the first section 511 (such as the second sub-section 511B) and is located within the inner chamber 121. Each of the second sections 520 is fixedly connected to different regions of the first capillary structure 400 (such as the first sheet 410 or the second sheet 420), but the present invention is not limited thereto. The design of multiple second sections 520 can increase the temperature uniformity of the vapor chamber 100 and thereby improve the heat dissipation effect. Thus, if there are multiple heat sources (not shown) and they are spaced apart and distributed on the bottom surface 123 of the housing 120, the second sections 520 can be respectively configured directly above these heat sources (not shown) so as to quickly receive the working heat energy emitted by these heat sources (not shown).

[0125] In one embodiment, the surface of the first section 231 of the tube 230 facing the vapor chamber 100 is a plane, but the present invention is not limited thereto.

[0126] Figure 5 FIG is a perspective view of a three-dimensional heat dissipation device 13 according to an embodiment of the present invention. Figure 5 As shown, the three-dimensional heat dissipation device 13 of this embodiment is Figure 1 The three-dimensional heat dissipation device 10 is substantially the same as the three-dimensional heat dissipation device 10, the difference being that the heat pipe 202 can be single or multiple, the tube body 240 is U-shaped instead of straight, and the number of the second joints 220 is two, located at two opposite ends of the tube body 240, and respectively connected to one of the corresponding first joints 130 (refer to Figure 1 ). In other words, the heat pipe 202 of this embodiment does not have a closed end. More specifically, the tube body 240 includes a first section 241, two second sections 242 and two bends 243. Each bend 243 connects one end of the first section 241 and one of the second sections 242, so that the long axis direction 241A of the first section 241 and the long axis direction 242A of the second section 242 are perpendicular to each other, and the long axis direction 242A of each second section 242 passes perpendicularly through the top surface 111 of the cover 110. Each second joint 220 is located at the end of the second section 242. In this way, referring to Figure 2The working fluid 300 can enter the inner chamber 121 of the vapor chamber 100 through one of the second joints 220 and then return to the inner chamber 121 through the other second joint 220 via the inner chamber 212 .

[0127] The second capillary structure 502 includes a first section 512, a second section 520, and a third section 530. The first section 512 of the second capillary structure 502 is U-shaped, rather than linear. The second section 520 and the third section 530 of the second capillary structure 502 extend from opposite ends of the first section 512 in a curved manner. These sections are located within the inner chamber 121 and are fixedly connected to the first capillary structure 400. The first section 512 of the second capillary structure 502 is located within the inner tube space 212.

[0128] In other words, the heat pipe 202 of this embodiment does not have a closed end. More specifically, the tube body 240 includes a first section 241, two second sections 242, and two bends 243. Each bend 243 connects one end of the first section 241 and one of the second sections 242, so that the long axis direction 241A of the first section 241 and the long axis direction 242A of the second section 242 are perpendicular to each other, or at least nearly perpendicular. The long axis direction 242A of each second section 242 passes through the top surface 111 of the cover 110 vertically, or at least nearly vertically. Each second joint 220 is located at the end of the second section 242. The first section 512 of the second capillary structure 502 is arranged in the heat pipe 202 in sequence along one of the second sections 242, one of the bends 243, the first section 241, the other bend 243, and the other second section 242. In this way, the vaporized working fluid 300 can enter the tube space 212 from the inner chamber 121 of the vapor chamber 100 via one of the second connectors 220. When the vaporized working fluid 300 condenses and returns to liquid form, the liquid working fluid 300 is guided by the second capillary structure 502 to flow to the first capillary structure 400, or even directly back to the evaporation heat source, thereby achieving heat dissipation.

[0129] More specifically, the first section 512 includes a first sub-section 512A, two second sub-sections 512B, and two bent sections 512C. The first sub-section 512A and one of the second sub-sections 512B are bent, with each bent section 512C connecting the first sub-section 512A and one of the second sub-sections 512B. The first sub-section 512A is located in the tube space 212 within the first section 241, while the second sub-section 512B is located in the tube space 212 within the second section 242. The bent section 512C is located in the tube space 212 within the bent portion 243.

[0130] In one embodiment, the second capillary structure 502 includes multiple second sections 520 and multiple third sections 530. Each of the multiple second sections 520 extends in a zigzag manner from one end of the first section 512 (e.g., a second sub-section 512B), is positioned within the inner chamber 121, and is fixedly connected to different regions of the first capillary structure 400 (e.g., the first sheet 410 or the second sheet 420). Each of the multiple third sections 530 extends in a zigzag manner from one end of the first section 512 (e.g., another second sub-section 512B), is positioned within the inner chamber 121, and is fixedly connected to different regions of the first capillary structure 400 (e.g., the first sheet 410 or the second sheet 420), but the present invention is not limited thereto. For example, the second capillary structure 502 includes two second sections 520, each of which is connected to two opposite ends of the first section 512. The design of multiple second sections 520 and multiple third sections 530 can enhance the temperature balancing effect of the vapor chamber 100, thereby improving the heat dissipation effect. Thus, if there are multiple heat sources (not shown) spaced apart on the bottom surface 123 of the housing 120, the second sections 520 and third sections 530 can be positioned directly above these heat sources to quickly receive the working heat energy generated by these heat sources (not shown).

[0131] In one embodiment, the surface of the first section 241 of the tube 240 facing the vapor chamber 100 is a plane, but the present invention is not limited thereto.

[0132] In the above embodiment, the first sections 510, 511, and 512 of the present invention each occupy three-quarters of the corresponding inner tube space 212. At this time, the first sections 510, 511, and 512 can absorb more of the inner tube space 212 and convert the condensed working fluid 300 back into liquid form, and guide more of the liquid working fluid 300 to the first capillary structure 400 (such as the first plate 410 or the second plate 420), thereby improving the heat dissipation effect, but the present invention is not limited to this.

[0133] Figure 6A FIG. 1 is a perspective view of a three-dimensional heat dissipation device 14 according to an embodiment of the present invention. Figure 6B FIG is a side view of a three-dimensional heat dissipation device 14 according to an embodiment of the present invention. Figure 6A and Figure 6B As shown, the three-dimensional heat dissipation device 14 of this embodiment is Figure 3The three-dimensional heat dissipation device 11 is substantially the same as the three-dimensional heat dissipation device 11, with the difference being that the three-dimensional heat dissipation device 14 further includes two first fin groups 620 and a second fin group 630. These first fin groups 620 are located at intervals on the temperature dispersion plate 100. Each first fin group 620 includes a plurality of first heat dissipation fins 621. The above-mentioned heat pipes are divided into a plurality of first heat pipes 200A and a plurality of second heat pipes 200B. A portion of these first heat dissipation fins 621 are spaced and arranged in parallel along the above-mentioned long axis direction 211, and are vertically penetrated by these first heat pipes 200A. Another portion of these first heat dissipation fins 621 are spaced and arranged in parallel along the above-mentioned long axis direction 211, and are vertically penetrated by these second heat pipes 200B. The first fin group 620, the second fin group 630 and the other first fin group 620 are arranged in sequence in a longitudinal direction 654. The second fin group 630 includes a trapezoidal body 640. The trapezoidal body 640 is located between the first fin groups 620 and includes a plurality of second heat dissipating fins 645 . The second heat dissipating fins 645 are spaced apart and arranged in parallel along a transverse direction 646 . The transverse direction 646 is perpendicular to the long axis 211 and the longitudinal direction 654 .

[0134] The trapezoidal body 640 has a top surface 641, a bottom surface 642, and two opposing inclined portions 643. The bottom surface 642 is opposite the top surface 641 and is fixed to the vapor chamber 100. The top surface 641 is located between the inclined portions 643. Each inclined portion 643 is separated from the adjacent first fin group 620 by a gap 644. In this way, while a portion of the working heat energy can be transferred from the first heat pipe 200A to a portion of the first fin group 620 and from the second heat pipe 200B to another portion of the first fin group 620, another portion can be transferred from the vapor chamber 100 to the second fin group 630, and then dissipated into the air through the first heat dissipation fins 621 and the second heat dissipation fins 645, respectively. In one embodiment, each inclined portion 643 further includes a straight portion 647 between the side opposite the top surface 641 and the bottom surface 642. The straight portion 647 is perpendicular to the bottom surface 642, but this is not limited to this embodiment.

[0135] It should be understood that after the working heat energy is transferred to the second fin set 630 , the working heat energy can also be dissipated outwardly into the air through the gap 644 between the inclined portion 643 and the first fin set 620 .

[0136] Furthermore, a first gap 611 is defined between any two adjacent first heat sink fins 621, and any two first gaps 611 are substantially the same. A second gap 612 is defined between the vapor chamber 100 and the bottom-most first heat sink fin (i.e., the first heat sink fin 621A closest to the vapor chamber 100). The second gap 612 is larger than the first gap 611. This allows working heat energy to be dissipated into the air through the second gap 612 after being transferred to the vapor chamber 100.

[0137] Figure 7A FIG is a side view of a three-dimensional heat dissipation device 15 according to an embodiment of the present invention. Figure 7A As shown, the three-dimensional heat dissipation device 15 of this embodiment is Figure 5 The three-dimensional heat dissipation device 13 is substantially the same as the three-dimensional heat dissipation device 13, with the difference being that the three-dimensional heat dissipation device 15 further includes a third fin group 650. The third fin group 650 includes a top 651 and a bottom 652 opposite to each other. The bottom 652 is connected to the temperature equalization plate 100. The third fin group 650 includes a plurality of third heat dissipation fins 653. These third heat dissipation fins 653 are spaced apart and arranged in parallel along a longitudinal direction 654, and the longitudinal direction 654 is orthogonal to the above-mentioned transverse direction 646 and the long axis direction 211. The tube body 240 of the heat pipe 202 is U-shaped, and a portion of the U-shaped tube body 240 is placed on the top 651 of the third fin group 650, and the other portion extends from the top 651 of the third fin group 650 into the third heat dissipation fin 653.

[0138] More specifically, the third fin assembly 650 has two through-channels 655, each extending along the longitudinal direction 211 to connect the top 651 and bottom 652 of the third fin assembly 650. The first section 241 of the tube 240 is located outside the third heat dissipating fins 653 and directly on the top 651 of the third fin assembly 650. Each second section 242 extends from the top 651 of the third fin assembly 650 into one of the through-channels 655. In this embodiment, the width of the through-channel 655 is approximately the same as the width of the second section 242 of the tube 240, or the width of the through-channel 655 is greater than the width of the second section 242 of the tube 240.

[0139] In one embodiment, the surface of the first section 241 of the tube 240 facing the top 651 of the third fin set 650 is a plane, but the present invention is not limited thereto.

[0140] Figure 7B FIG is a side view of a three-dimensional heat dissipation device 16 according to an embodiment of the present invention. Figure 7B As shown, the three-dimensional heat dissipation device 16 of this embodiment is Figure 7A The three-dimensional heat dissipation device 15 is substantially similar to the three-dimensional heat dissipation device 15, except that the three-dimensional heat dissipation device 16 further includes a fourth fin set 660. The fourth fin set 660 is stacked above the third fin set 650. The fourth fin set 660 includes a plurality of fourth heat dissipation fins 662. These fourth heat dissipation fins 662 are spaced and arranged side by side along the longitudinal direction 654. A portion of the U-shaped tube 240 is placed within the fourth fin set 660, while another portion extends from the fourth fin set 660 into the third fin set 650.

[0141] More specifically, a transverse groove 661 is recessed on a surface of the fourth fin group 660 facing the third fin group 650. The transverse groove 661 is located between the fourth fin group 660 and the third fin group 650 and is formed together on a plurality of fourth heat dissipation fins 662. The first section 241 of the tube body 240 of the heat pipe 202 is located in the transverse groove 661 and is directly placed on the third fin group 650, and each second section 242 extends from the fourth fin group 660 into one of the through channels 655. In this embodiment, the width of the transverse groove 661 is approximately the same as the width of the first section 241 of the tube body 240, and the width of the through channel 655 is approximately the same as the width of the second section 242 of the tube body 240. Alternatively, the width of the transverse groove 661 is greater than the width of the first section 241 of the tube body 240, and the width of the through channel 655 is greater than the width of the second section 242 of the tube body 240.

[0142] Figure 8A FIG is a partial side view of a three-dimensional heat dissipation device 17 according to an embodiment of the present invention. Figure 8A As shown, the three-dimensional heat dissipation device 17 of this embodiment is Figure 7A The three-dimensional heat dissipation device 15 is substantially the same, the difference being that the tube body 230 of the heat pipe 201 is L-shaped, and a portion of the tube body 230 is placed on the top 651 of the third fin group 650, and the other portion extends from the top 651 of the third fin group 650 into the third heat dissipation fin 653.

[0143] More specifically, the first section 231 of the L-shaped tube 230 is located outside the third heat dissipating fins 653 and directly placed on the top 651 of the third fin assembly 650. The second section 232 extends from the top 651 of the third fin assembly 650 into one of the through-channels 655. In this embodiment, the width of the through-channel 655 is substantially the same as the width of the second section 232 of the tube 230, or the width of the through-channel 655 is greater than the width of the second section 232 of the tube 230.

[0144] In one embodiment, the surface of the first section 231 of the tube 230 facing the top 651 of the third fin set 650 is a plane, but the present invention is not limited thereto.

[0145] Figure 8B FIG is a partial side view of a three-dimensional heat dissipation device 18 according to an embodiment of the present invention. Figure 8B As shown, the three-dimensional heat dissipation device 18 of this embodiment is Figure 7B The three-dimensional heat dissipation device 16 is substantially the same as the heat pipe 201, except that the heat pipe 201 has an L-shaped body 230 instead of a U-shaped body. The L-shaped body 230 is located in both the fourth fin group 660 and the third fin group 650.

[0146] More specifically, the first section 231 of the L-shaped tube 230 is located within the transverse groove 661 of the fourth fin assembly 660, and the second section 232 extends from the fourth fin assembly 660 into one of the through-channels 655 of the third fin assembly 650. In this embodiment, the width of the transverse groove 661 is substantially the same as the width of the first section 231 of the tube 230, and the width of the through-channel 655 is substantially the same as the width of the second section 232 of the tube 230.

[0147] In summary, in each of the above embodiments, the vapor chamber and the heat pipe both comprise a metal material or a composite material with a high conductivity coefficient. The conductivity coefficient is, for example, the thermal conductivity, however, the present invention is not limited thereto. The metal material is, for example, copper, aluminum, stainless steel, or a heterogeneous metal, however, the present invention is not limited thereto. The working fluid is, for example, pure water, an inorganic compound, an alcohol, a ketone, liquid metal, refrigerant, an organic compound, or a mixture thereof, however, the present invention is not limited thereto. The first capillary structure and the second capillary structure are porous structures capable of providing capillary force to drive the working fluid. For example, the capillary structure is made of a powder sintered body, a mesh body, a fiber body, grooves, whiskers, or any combination thereof. When the capillary layer is a powder sintered body, the powder sintered body is a sintered metal formed on the inner wall of the tube space and the inner cavity; when the capillary layer is a fiber body, the fiber body comprises a fiber bundle formed by twisting and winding a plurality of fiber strands. The fiber wire is a metal fiber wire, a glass fiber wire, a carbon fiber wire, a polymer fiber wire, or other capillary materials capable of guiding the working fluid, but the present invention is not limited thereto.

[0148] Finally, the embodiments disclosed above are not intended to limit the present invention. Any skilled artisan may make various modifications and alterations without departing from the spirit and scope of the present invention, all of which would be protected by the present invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. A three-dimensional heat dissipation device, characterized in that: include: A temperature vapor chamber comprising a cover, a shell, and at least one first connector, wherein the shell and the cover are sealed to form an inner chamber between the shell and the cover, and the first connector is formed on a top surface of the cover and has a passage connected to the inner chamber; At least one heat pipe has an inner space and at least one second joint, the second joint being sleeved and surrounding the first joint so that an end surface of the second joint directly contacts the top surface of the cover, the inner space of the pipe being connected to the inner chamber through the passage, wherein the second joint is connected to and surrounding one end of the heat pipe and gradually expands outward from the end of the heat pipe in a direction away from the heat pipe and the first joint, so that the second joint surrounds a conical space, wherein the maximum diameter of the conical space is larger than the maximum diameter of the inner space of the pipe; A working fluid is filled in the space inside the tube and the inner cavity; and At least one solder joint connects the first joint, the second joint and the top surface of the cover to integrate the heat pipe and the temperature dispersion plate, wherein a portion of the solder joint is sealed and filled in the conical space, and another portion surrounds the periphery of the first joint.

2. The three-dimensional heat dissipation device according to claim 1, characterized in that: Also includes: a first capillary structure located in the inner chamber and configured to guide the flow of the working fluid; and A second capillary structure includes a first section and at least one second section. The first section is fixedly located in the space inside the tube and connected to the second section. The second section extends in a bent manner from one end of the first section and is located in the inner chamber and connected to the first capillary structure to guide the flow of the working fluid.

3. The three-dimensional heat dissipation device according to claim 2, wherein: The first capillary structure includes a first sheet. The first sheet is directly formed on a side of the shell facing the cover. The first sheet is directly overlapped between the second section of the second capillary structure and the shell.

4. The three-dimensional heat dissipation device according to claim 3, wherein: The first capillary structure includes a second sheet, and the second sheet is directly formed on a side of the cover facing the housing; and A portion of the first section of the second capillary structure is located in the inner chamber and contacts the first sheet or the second sheet of the first capillary structure.

5. The three-dimensional heat dissipation device according to claim 1, wherein: Also includes: A fin group includes a plurality of heat dissipation fins, which are parallel to each other and spaced apart and are penetrated by the heat pipe at the same time.

6. The three-dimensional heat dissipation device according to claim 1, wherein: The heat pipe is in one of a straight line, an L shape and a U shape.

7. The three-dimensional heat dissipation device according to claim 1, wherein: Also includes: Two first fin groups are located on the temperature vapor chamber at intervals, each of the two first fin groups includes a plurality of first heat dissipation fins, the at least one heat pipe is in a plurality, each of the plurality of heat pipes has a long axis direction, the long axis direction passes perpendicularly through the top surface of the temperature vapor chamber, the plurality of first heat dissipation fins are spaced apart and arranged in parallel along the long axis direction, the plurality of heat pipes include at least one first heat pipe and at least one second heat pipe, the plurality of first heat dissipation fins of one of the two first fin groups are vertically penetrated by the at least one first heat pipe, and the plurality of first heat dissipation fins of the other of the two first fin groups are vertically penetrated by the at least one second heat pipe; and A second fin group, comprising a trapezoidal body, the trapezoidal body being located between the two first fin groups, the trapezoidal body comprising a plurality of second heat dissipation fins, the plurality of second heat dissipation fins being spaced and arranged in parallel on the temperature homogenizing plate along a transverse direction perpendicular to the long axis direction, The trapezoidal body has a top, a bottom and two opposite inclined portions. The bottom is arranged opposite to the top and fixed to the temperature equilibrium plate. The top is located between the two inclined portions. Each of the two inclined portions is separated from one of the two adjacent first fin groups by a gap.

8. The three-dimensional heat dissipation device according to claim 7, wherein: There is a first gap between any two adjacent first heat dissipation fins, and there is a second gap between the temperature homogenizing plate and the first heat dissipation fin closest to the temperature homogenizing plate, and the second gap is larger than the first gap.

9. The three-dimensional heat dissipation device according to claim 2, wherein: The number of the at least one first connector is two; The number of the at least one heat pipe is one, the number of the at least one second joint is two, and the at least one second joint is located at two opposite ends of the heat pipe, wherein the two second joints of the heat pipe are respectively sleeved with one of the corresponding two first joints; as well as The at least one second section of the second capillary structure is two in number and is respectively connected to two opposite ends of the first section, wherein the two second sections are respectively connected to the first capillary structure in the inner chamber.

10. The three-dimensional heat dissipation device according to claim 1, wherein: Also includes: a third fin group, comprising a top and a bottom opposite to each other, the bottom being connected to the top surface of the vapor chamber, the third fin group comprising a plurality of third heat dissipating fins, the plurality of third heat dissipating fins being spaced apart and arranged in parallel along a longitudinal direction, the longitudinal direction being orthogonal to a normal direction of the top surface of the vapor chamber, The heat pipe is U-shaped, and a portion of the heat pipe is placed on the top of the third fin group, and the other portion extends from the top of the third fin group into the plurality of third heat dissipation fins.

11. The three-dimensional heat dissipation device according to claim 1, wherein: Also includes: a third fin group, located on the vapor chamber, comprising a plurality of third heat dissipating fins, wherein the plurality of third heat dissipating fins are spaced apart and arranged in parallel along a longitudinal direction, the longitudinal direction being orthogonal to a normal direction of a top surface of the vapor chamber; and a fourth fin group, stacked on the third fin group, comprising a plurality of fourth heat dissipation fins, wherein the plurality of fourth heat dissipation fins are spaced apart and arranged in parallel along the longitudinal direction; The heat pipe is U-shaped and is located inside the third fin group and the fourth fin group.

12. The three-dimensional heat dissipation device according to claim 1, wherein: Also includes: a third fin group, comprising a top and a bottom opposite to each other, the bottom being connected to the top surface of the vapor chamber, the third fin group comprising a plurality of third heat dissipating fins, the plurality of third heat dissipating fins being spaced apart and arranged in parallel along a longitudinal direction, the longitudinal direction being orthogonal to a normal direction of the top surface of the vapor chamber, The heat pipe is L-shaped, and a portion of the heat pipe is placed on the top of the third fin group, and the other portion extends from the top of the third fin group into the plurality of third heat dissipation fins.

13. The three-dimensional heat dissipation device according to claim 1, wherein: Also includes: a third fin group, located on the vapor chamber, comprising a plurality of third heat dissipating fins, wherein the plurality of third heat dissipating fins are spaced apart and arranged in parallel along a longitudinal direction, the longitudinal direction being orthogonal to a normal direction of a top surface of the vapor chamber; and a fourth fin group, stacked on the third fin group, comprising a plurality of fourth heat dissipation fins, wherein the plurality of fourth heat dissipation fins are spaced apart and arranged in parallel along the longitudinal direction; The heat pipe is L-shaped and is located inside the third fin group and the fourth fin group.

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