Automated Testing System, Method, Electronic Device and Storage Medium for Silicon Photonic Chip

Abstract

The present invention discloses a silicon photonics chip automated test system, method, electronic device, and storage medium. The silicon photonics chip automated test system includes: a source measurement module, a probe card, an optical coupling module, a moving component, and a control module; the control module is configured to output a driving signal to the moving component to move the silicon photonics chip to be tested to a test station, move the probe card to connect the probe card to the silicon photonics chip to be tested at the test station, and move the optical coupling module to couple and connect the optical coupling module to the silicon photonics chip to be tested; and is further configured to receive the electrical signal measurement data sent by the source measurement module and the optical signal measurement data sent by the optical coupling module, and output a test report according to the electrical signal measurement data and the optical signal measurement data, capable of realizing the automated test of the silicon photonics chip to be tested, effectively improving the test efficiency, and further improving the accuracy and consistency of the test results.

Description

Technical Field

[0001] The present invention relates to the technical field of testing silicon photonic chips to be tested, and particularly to an automated testing system, method, electronic device, and storage medium for silicon photonic chips. Background Art

[0002] The silicon photonic chip to be tested has a complex structure and is composed of multiple components, capable of realizing specific functions. During the production process of the silicon photonic chip to be tested, the quality of the physical properties of the silicon photonic chip to be tested will directly affect the yield of the silicon photonic chip to be tested and increase the manufacturing cost of related products of the silicon photonic chip to be tested. Therefore, after the design of the silicon photonic chip to be tested is completed, the testing of the silicon photonic chip to be tested is an important link in the production process of the silicon photonic chip to be tested and also a key step in the research and development and production of related products of the silicon photonic chip to be tested.

[0003] The traditional method for testing a silicon photonic chip to be tested is to manually pick and place the silicon photonic chip to be tested. During the testing process, the testing system needs to be frequently changed according to different testing conditions of different components on the silicon photonic chip to be tested, and the instrument equipment is manually controlled to test different components of the silicon photonic chip to be tested. Moreover, the traditional method for testing a silicon photonic chip to be tested is prone to damaging the chip, has a slow testing speed, a large operation difficulty, a complex testing system, and poor accuracy and consistency of the testing results. Summary of the Invention

[0004] The main purpose of the embodiments of the present invention is to provide an automated testing system, method, electronic device, and storage medium for silicon photonic chips, which can realize the automated testing of silicon photonic chips to be tested, effectively improve the testing efficiency of silicon photonic chips to be tested, and also improve the accuracy and consistency of the testing results.

[0005] To achieve the above object, an embodiment of the present invention provides an automated testing system for silicon photonic chips, including:

[0006] A source measurement module, configured to output a test electrical signal to the silicon photonic chip to be tested, receive the electrical signal output by the silicon photonic chip to be tested, and measure the electrical signal output by the silicon photonic chip to be tested to obtain electrical signal measurement data;

[0007] A probe card, connected to the source measurement module, configured to transmit the electrical signal between the source measurement module and the silicon photonic chip to be tested;

[0008] An optical coupling module, configured to output a test optical signal to the silicon photonic chip to be tested, receive the optical signal output by the silicon photonic chip to be tested, and measure the optical signal output by the silicon photonic chip to be tested to obtain optical signal measurement data;

[0009] A moving component;

[0010] A control module, configured to output a driving signal to the moving component, so that the moving component moves the silicon photonics chip under test to a test station, and moves the probe card to connect the probe card to the silicon photonics chip under test at the test station, and moves the optical coupling module to couple the optical coupling module to the silicon photonics chip under test;

[0011] The control module is further configured to receive the electrical signal measurement data sent by the source measurement module and the optical signal measurement data sent by the optical coupling module, and output a test report according to the electrical signal measurement data and the optical signal measurement data.

[0012] To achieve the above object, an embodiment of the present invention further provides an automatic test method for a silicon photonics chip under test, which is applied to a silicon photonics chip automatic test system. The silicon photonics chip automatic test system includes:

[0013] A source measurement module, configured to output a test electrical signal to the silicon photonics chip under test, receive the electrical signal output by the silicon photonics chip under test, and measure the electrical signal output by the silicon photonics chip under test to obtain electrical signal measurement data;

[0014] A probe card, connected to the source measurement module, configured to transmit the electrical signal between the source measurement module and the silicon photonics chip under test;

[0015] An optical coupling module, configured to output a test optical signal to the silicon photonics chip under test, receive the optical signal output by the silicon photonics chip under test, and measure the optical signal output by the silicon photonics chip under test to obtain optical signal measurement data;

[0016] A moving component;

[0017] The method includes:

[0018] Output a driving signal to the moving component, so that the moving component moves the silicon photonics chip under test to a test station, and moves the probe card to connect the probe card to the silicon photonics chip under test at the test station, and moves the optical coupling module to couple the optical coupling module to the silicon photonics chip under test;

[0019] Receive the electrical signal measurement data sent by the source measurement module and the optical signal measurement data sent by the optical coupling module, and output a test report according to the electrical signal measurement data and the optical signal measurement data.

[0020] To achieve the above object, an embodiment of the present invention further provides an electronic device, including a memory, a processor, and a computer program stored on the memory and executable on the processor. When the computer program is executed by the processor, the control method of the foregoing video conferencing system is implemented.

[0021] To achieve the above object, an embodiment of the present invention further provides a computer-readable storage medium, on which an information processing program is stored. When the information processing program is executed by a processor, it implements the control method of the foregoing video conferencing system.

[0022] An automated test system, method, electronic device and storage medium for a silicon photonics chip provided by an embodiment of the present invention. The automated test system for a silicon photonics chip includes: a source measurement module, configured to output a test electrical signal to a silicon photonics chip to be tested, receive the electrical signal output by the silicon photonics chip to be tested, and measure the electrical signal output by the silicon photonics chip to be tested to obtain electrical signal measurement data; a probe card, connected to the source measurement module, configured to transmit the electrical signal between the source measurement module and the silicon photonics chip to be tested; an optical coupling module, configured to output a test optical signal to the silicon photonics chip to be tested, receive the optical signal output by the silicon photonics chip to be tested, and measure the optical signal output by the silicon photonics chip to be tested to obtain optical signal measurement data; a moving component; a control module, configured to output a driving signal to the moving component to move the silicon photonics chip to be tested to a test station, move the probe card to connect the probe card to the silicon photonics chip to be tested at the test station, and move the optical coupling module to couple the optical coupling module to the silicon photonics chip to be tested, and is further configured to receive the electrical signal measurement data sent by the source measurement module and the optical signal measurement data sent by the optical coupling module, and output a test report according to the electrical signal measurement data and the optical signal measurement data. The solution of the embodiment of the present invention can achieve the automated test of the silicon photonics chip to be tested, effectively improve the test efficiency of the silicon photonics chip to be tested, and can also improve the accuracy and consistency of the test results. Description of the Drawings

[0023] Figure 1 is a schematic structural diagram of an automated test system for a silicon photonics chip provided by an embodiment of the present invention;

[0024] Figure 2 is a flowchart of a method for automatically testing a silicon photonics chip to be tested provided by an embodiment of the present invention;

[0025] Figure 3 is a flowchart of a method for automatically testing a silicon photonics chip to be tested provided by another embodiment of the present invention;

[0026] Figure 4 is a flowchart of a method for automatically testing a silicon photonics chip to be tested provided by another embodiment of the present invention;

[0027] Figure 5 is a flowchart of a method for automatically testing a silicon photonics chip to be tested provided by another embodiment of the present invention;

[0028] Figure 6 It is a flowchart of an automated test method for a silicon photonics chip to be tested provided by another embodiment of the present invention;

[0029] Figure 7 It is a flowchart of an automated test method for a silicon photonics chip to be tested provided by another embodiment of the present invention;

[0030] Figure 8 It is a flowchart of an automated test method for a silicon photonics chip to be tested provided by another embodiment of the present invention;

[0031] Figure 9 It is a schematic structural diagram of an automated test system for a silicon photonics chip provided by another embodiment of the present invention;

[0032] Figure 10 It is a schematic diagram of an electronic device provided by another embodiment of the present invention. Detailed implementation manners

[0033] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0034] It should be noted that although the functional modules are divided in the device schematic diagram and the logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in a different order from the module division in the device or the flowchart. Terms such as "first" and "second" in the description, claims or the above-mentioned drawings are used to distinguish similar objects and do not necessarily need to describe a specific order or sequence.

[0035] This embodiment provides a silicon photonics chip automated test system, method, electronic device, and storage medium. The silicon photonics chip automated test system includes: a source measurement module for outputting a test electrical signal to a silicon photonics chip under test, receiving the electrical signal output by the silicon photonics chip under test, and measuring the electrical signal output by the silicon photonics chip under test to obtain electrical signal measurement data; a probe card connected to the source measurement module for transmitting the electrical signal between the source measurement module and the silicon photonics chip under test; an optical coupling module for outputting a test optical signal to the silicon photonics chip under test, receiving the optical signal output by the silicon photonics chip under test, and measuring the optical signal output by the silicon photonics chip under test to obtain optical signal measurement data; a moving component; and a control module for outputting a driving signal to the moving component to move the silicon photonics chip under test to a test station, moving the probe card to connect the probe card to the silicon photonics chip under test at the test station, and moving the optical coupling module to couple the optical coupling module to the silicon photonics chip under test, and also for receiving the electrical signal measurement data sent by the source measurement module and the optical signal measurement data sent by the optical coupling module, and outputting a test report based on the electrical signal measurement data and the optical signal measurement data. The solution of the embodiment of the present invention can achieve the automated test of the silicon photonics chip under test, effectively improve the test efficiency of the silicon photonics chip under test, and also improve the accuracy and consistency of the test results.

[0036] The following further elaborates on the embodiments of the present invention in conjunction with the accompanying drawings.

[0037] In one embodiment, referring to Figure 1 , Figure 1 is a schematic diagram of the silicon photonics chip automated test system provided by the embodiment of the present invention. The silicon photonics chip automated test system is used to measure a silicon photonics chip under test and includes: a probe card 110, an optical coupling module 120, a source measurement module 130, a moving component 140, and a control module 150. The source measurement module 130 is connected to the probe card 110, and the control module 150 is respectively connected to the source measurement module 130, the optical coupling module 120, and the moving component 140.

[0038] Exemplarily, the source measurement module 130 can be used to output a test electrical signal to the silicon photonics chip under test 160, receive the electrical signal output by the silicon photonics chip under test 160, and measure the electrical signal output by the silicon photonics chip under test 160 to obtain electrical signal measurement data.

[0039] Exemplarily, the probe card 110 can be used to transmit the electrical signal between the source measurement module 130 and the silicon photonics chip under test 160.

[0040] Exemplarily, the optical coupling module 120 can be used to output a test optical signal to the silicon photonic chip 160 to be measured, receive the optical signal output by the silicon photonic chip 160 to be measured, and measure the optical signal output by the silicon photonic chip 160 to be measured to obtain optical signal measurement data.

[0041] Exemplarily, the moving component 140 can be used to move the silicon photonic chip 160 to be measured to the test station, move the probe card 110 to connect the probe card 110 with the silicon photonic chip 160 to be measured at the test station, and move the optical coupling module 120 to couple the optical coupling module 120 with the silicon photonic chip 160 to be measured.

[0042] Exemplarily, the control module 150 can be used to receive the electrical signal measurement data sent by the source measurement module 130 and the optical signal measurement data sent by the optical coupling module 120, and output a test report according to the electrical signal measurement data and the optical signal measurement data.

[0043] In one embodiment, the optical coupling module 120 can include an optical output device, an optical transmission device, and an optical measurement device. The optical output device is coupled to the silicon photonic chip to be measured through the optical transmission device, and the optical measurement device is coupled to the silicon photonic chip to be measured through the optical transmission device. Both the optical output device and the optical measurement device are connected to the control module 150.

[0044] It should be noted that the optical output device can be an adjustable light source or a narrowband light source, and the embodiments of the present invention do not make specific limitations thereto.

[0045] It should be noted that the optical transmission device can be an optical fiber, and the embodiments of the present invention do not make a unique limitation thereto.

[0046] It should be noted that the optical measurement device can be an optical power meter or an optical detector, and the embodiments of the present invention do not make specific limitations thereto.

[0047] It should be noted that the structure of the probe card 110 is set according to the silicon photonic chip to be measured, and the embodiments of the present invention do not make specific limitations to the specific form of the probe card 110. For example, the probe card 110 has the characteristics of small volume and stable testing. All the probes on the probe card 110 can be effectively connected to the silicon photonic chip 160 to be measured simultaneously.

[0048] It should be noted that the source measurement module 130 can include multiple sources with electrical signal output functions, multiple sources with electrical signal measurement functions, or multiple sources with both electrical signal output and measurement functions. The embodiments of the present invention do not make specific limitations thereto. For example, the source measurement module 130 can be a source meter or an SMU (Source measure unit) board, etc.

[0049] Exemplarily, the moving component 140 may include a first moving module, a second moving module, and a third moving module. The first moving module may be used to move the silicon photonics chip 160 to be tested to the test station and to transfer the silicon photonics chip from the test station. The second moving module may be used to move the probe card 110 to connect the probe card 110 to the silicon photonics chip 160 on the test station and to move the probe card to disconnect the probe card from the silicon photonics chip. The third moving module may be used to move the optical coupling module 120 to couple the optical coupling module 120 to the silicon photonics chip 160 and to move the optical coupling module to disconnect the optical coupling module from the silicon photonics chip.

[0050] It should be noted that the structure of the moving component 140 can be diverse, and any structure of the moving component 140 that can achieve the automatic connection of the probe card 110, the optical coupling module 120, and the silicon photonics chip 160 to be tested falls within the protection scope of this invention application.

[0051] Exemplarily, the first moving module may be a mechanical gripper, and this embodiment does not make a unique limitation on it.

[0052] Exemplarily, the second moving module may be a six-axis adjustment motor, and this embodiment does not make a unique limitation on it.

[0053] Exemplarily, the third moving module may be a six-axis adjustment motor, and this embodiment does not make a unique limitation on it.

[0054] Exemplarily, the control module 150 may include a host and a communication connection module. The host may be connected to the source measurement module 130, the optical coupling module, and the moving component 140 respectively through the communication connection module, so as to control the connected components.

[0055] It should be noted that the host may be a PC host or a motherboard card, and this invention embodiment does not make a specific limitation on it.

[0056] It should be noted that the communication connection module may be a network cable, an RS232 connection cable, an RS485 connection cable, or a GPIB board card, and this invention embodiment does not make a specific limitation on it.

[0057] It should be noted that the structure of the control module 150 can be diverse, and any structure of the control module 150 that can achieve the control of the source measurement module 130, the optical coupling module, and the moving component 140 falls within the protection scope of this invention application.

[0058] As Figure 2 shown, Figure 2It is a flowchart of a method for automatically testing a silicon photonic chip to be tested in an embodiment. This method is applied to a silicon photonic chip automatic testing system. In one embodiment, it includes the following steps:

[0059] Step S210, output a driving signal to the moving component to enable the moving component to move the silicon photonic chip to be tested to the test station, move the probe card to connect the probe card with the silicon photonic chip to be tested at the test station, and move the optical coupling module to couple the optical coupling module with the silicon photonic chip to be tested.

[0060] In one embodiment, when it is necessary to measure the silicon photonic chip to be tested, a driving signal can be output to the moving component. The moving component can move the silicon photonic chip to be tested to a pre-set test station, and then the probe card can be moved to move the probe card closer to the test station and connect it with the silicon photonic chip to be tested at the test station. The optical coupling module can be moved to move the optical coupling module closer to the test station and couple it with the silicon photonic chip to be tested at the test station, making preparations for the next measurement step.

[0061] Step S220, receive the electrical signal measurement data sent by the source measurement module and the optical signal measurement data sent by the optical coupling module, and output a test report according to the electrical signal measurement data and the optical signal measurement data.

[0062] In one embodiment, after the probe card is connected to the silicon photonic chip to be tested and the optical coupling module is coupled to the silicon photonic chip to be tested, the silicon photonic chip to be tested can be measured by controlling the source measurement module and the optical coupling module. During the measurement process, the control module can receive the electrical signal measurement data sent by the source measurement module and the optical signal measurement data sent by the optical coupling module, and then output a test report according to the electrical signal measurement data and the optical signal measurement data. The entire measurement process is completed fully automatically, realizing the automatic testing of the silicon photonic chip to be tested and effectively improving the testing efficiency of the silicon photonic chip to be tested.

[0063] Exemplarily, the electrical signal measurement data can include first electrical signal measurement data and second electrical signal measurement data;

[0064] Among them, the first electrical signal measurement data represents the data obtained by measuring the electrical signal output by the silicon photonic chip to be tested under the condition of non-light transmission; the second electrical signal measurement data represents the data obtained by measuring the electrical signal output by the silicon photonic chip to be tested under the condition of light transmission.

[0065] It should be noted that the electrical signal measurement data can be current data or voltage data, and this embodiment does not make specific limitations on it.

[0066] Refer to Figure 3, if the moving component includes a first moving module, a second moving module, and a third moving module, where the first moving module is used to move the silicon photonics chip under test to the test station; the second moving module is used to move the probe card so that the probe card is connected to the silicon photonics chip under test at the test station; the third moving module is used to move the optical coupling module so that the optical coupling module is coupled to the silicon photonics chip under test. In one embodiment, before step S210, it further includes:

[0067] Step S310, output a first driving signal to the first moving module to cause the first moving module to move the silicon photonics chip under test to the test station.

[0068] In one embodiment, the position coordinates of the test station of the silicon photonics chip under test can be set, and a first driving signal can be output to the first moving module according to the position coordinates, that is, control the first moving module to move the silicon photonics chip under test to the test station, that is, determine the position of the silicon photonics chip under test, and make preparations for the subsequent step of connecting with the probe card.

[0069] Step S320, output a second driving signal to the second moving module to cause the second moving module to connect the probe card to the silicon photonics chip under test at the test station.

[0070] In one embodiment, according to the position coordinate information of the test station of the silicon photonics chip under test, a second driving signal can be output to the second moving module, that is, control the second moving module to move the probe card to the position corresponding to the position information, and connect all the probes of the probe card to the silicon photonics chip under test, so that the probe card is connected to the silicon photonics chip under test at the test station.

[0071] Step S330, output a third driving signal to the third moving module to cause the third moving module to couple the optical coupling module to the silicon photonics chip under test.

[0072] In one embodiment, according to the position coordinate information of the test station of the silicon photonics chip under test, a third driving signal can be output to the third moving module, that is, control the third moving module to move the optical coupling module to the position corresponding to the position information, and align the optical transmission device of the optical coupling module with the silicon photonics chip under test, so that the optical coupling module can be coupled to the silicon photonics chip under test at the test station.

[0073] In steps S310 to S330, the process of connecting the silicon photonics chip under test to the probe card and the optical coupling module is fully automated, so as to realize the automated test of the silicon photonics chip under test, and can effectively improve the test efficiency of the silicon photonics chip under test.

[0074] Refer to Figure 4, the first moving module is further configured to transfer the silicon photonics chip under test from the test station; the second moving module is further configured to move the probe card to disconnect the probe card from the silicon photonics chip under test; the third moving module is further configured to move the optical coupling module to disconnect the optical coupling module from the silicon photonics chip under test. In one embodiment, after receiving the electrical signal measurement data sent by the source measurement module and the optical signal measurement data sent by the optical coupling module in step S210, the following further includes:

[0075] Step S410, output a fifth driving signal to the second moving module to cause the second moving module to disconnect the probe card from the silicon photonics chip under test.

[0076] In one embodiment, after the control module receives the electrical signal measurement data sent by the source measurement module and the optical signal measurement data sent by the optical coupling module, the control module may output a fifth driving signal to the second moving module to cause the second moving module to disconnect the probe card from the silicon photonics chip under test, that is, control the second moving module to disconnect the probe card from the silicon photonics chip under test that has been tested.

[0077] Step S420, output a sixth driving signal to the third moving module to cause the third moving module to disconnect the optical coupling module from the silicon photonics chip under test.

[0078] In one embodiment, after the control module receives the electrical signal measurement data sent by the source measurement module and the optical signal measurement data sent by the optical coupling module, the control module may output a sixth driving signal to the third moving module to cause the third moving module to disconnect the optical coupling module from the silicon photonics chip under test, that is, control the third moving module to move the optical coupling module away from and / or deviate from the silicon photonics chip under test that has been tested.

[0079] Step S430, output a fourth driving signal to the first moving module to cause the first moving module to transfer the silicon photonics chip under test from the test station.

[0080] In one embodiment, after the probe card and the optical coupling module are disconnected from the silicon photonics chip under test that has been tested, the control module may be configured to transfer the silicon photonics chip under test from the test station, that is, control the third moving module to move the silicon photonics chip under test that has been tested away from the test station and transfer it to the placement platform for the silicon photonics chips that have completed the test.

[0081] It should be noted that the order in which the control module sends the fourth driving signal, the fifth driving signal, and the sixth driving signal to the first moving module, the second moving module, and the third moving module respectively can be set according to the actual situation, and this embodiment does not make specific limitations on it.

[0082] Refer to Figure 5, if the optical coupling module includes an optical output device, an optical transmission device, and an optical measurement device, wherein the optical output device is used to output a test optical signal; the optical transmission device is used to transmit the test optical signal output by the optical output device to the silicon photonic chip under test, and receive the optical signal output by the silicon photonic chip under test, and transmit the optical signal output by the silicon photonic chip under test to the optical measurement device; the optical measurement device is used to measure the optical signal output by the silicon photonic chip under test to obtain optical signal measurement data. In one embodiment, after step S330, it includes but is not limited to the following steps:

[0083] Step S510, controlling the optical output device to turn on or off.

[0084] In one embodiment, according to the measurement requirements, the optical output device can be controlled to turn on and off, so as to automatically implement the light passing performance test or non-light passing performance test of the chip under test.

[0085] Step S520, when the optical output device is turned off, the control module takes the received electrical signal measurement data as the first electrical signal measurement data.

[0086] In one embodiment, when the optical output device is turned off, the electrical signal received by the control module is the first electrical signal measurement data obtained by measuring the electrical signal output by the silicon photonic chip under test in the non-light passing case, and the control module can generate and output a test report according to the first electrical signal measurement data.

[0087] Step S530, when the optical output device is turned on, the control module takes the received electrical signal measurement data as the second electrical signal measurement data.

[0088] In one embodiment, when the optical output device is turned on, the electrical signal received by the control module is the second electrical signal measurement data obtained by measuring the electrical signal output by the silicon photonic chip under test in the light passing case, and the control module can generate and output a test report according to the second electrical signal measurement data.

[0089] Refer to Figure 6 , in one embodiment, step S320 includes but is not limited to the following steps:

[0090] Step S610, outputting a second driving signal to the second moving module to control the second moving module to adjust the position and / or angle of the probe card, so that the probe card is connected to the silicon photonic chip under test on the test station.

[0091] In one embodiment, when obtaining the connection requirement between the probe card and the silicon photonics chip to be tested, the control module can output a second driving signal to the second moving module according to the coordinate position of the test station of the silicon photonics chip to be tested, and by adjusting the position and / or angle of the probe card, the probe card can be effectively connected to the silicon photonics chip to be tested, so as to automatically complete the connection work between the probe card and the silicon photonics chip to be tested.

[0092] In one embodiment, if the first moving module is a mechanical gripper and the second moving module is a first six-axis adjustment motor, when obtaining the connection requirement between the probe card and the silicon photonics chip to be tested, the control module can output a first driving signal to the mechanical gripper, and the mechanical gripper can pick up the silicon photonics chip to be tested according to the first driving signal and place the silicon photonics chip to be tested on the test station. The control film can control the source measurement unit to perform a trial detection on the electrical signal of the probe card. Then, when obtaining the trial detection result of the electrical signal, the control module can output a second driving signal to the first six-axis adjustment motor according to the coordinate position of the test station and the trial detection result of the electrical signal. The first six-axis adjustment motor can adjust the position and / or angle of the probe card according to the second driving signal, so that the probe card can be effectively connected to the silicon photonics chip to be tested, so as to automatically complete the connection work between the probe card and the silicon photonics chip to be tested.

[0093] It should be noted that the process of the source measurement unit performing a trial detection on the electrical signal of the probe card can be that when the electrical signal of a certain part of the probes on the probe card received by the source measurement unit is less than the first test threshold, it is necessary to adjust the position and / or angle of the probe card until the electrical signals of all the probes on the probe card are greater than the first test threshold. It should be noted that the first test threshold is set according to the actual situation, and this embodiment does not make specific limitations on this.

[0094] Refer to Figure 7 , in one embodiment, step S330 includes but is not limited to the following steps:

[0095] Step S710, output a third driving signal to the third moving module, and control the third moving module to adjust the position and / or angle of the optical coupling module, so that the optical coupling module is coupled to the silicon photonics chip to be tested on the test station.

[0096] In one embodiment, when obtaining the connection requirement between the optical coupling module and the silicon photonics chip to be tested, the control module can output a third driving signal to the third moving module according to the coordinate position of the test station of the silicon photonics chip to be tested, and by adjusting the position and / or angle of the optical coupling module, the optical coupling module can be effectively connected to the silicon photonics chip to be tested, so as to automatically complete the optical coupling connection work between the optical coupling module and the silicon photonics chip to be tested.

[0097] In one embodiment, if the first moving module is a mechanical gripper and the third moving module is a second six-axis adjustment motor, and the optical coupling module includes an optical transmission device, an optical measurement device, and an optical output device, when the connection requirement between the probe card and the silicon photonic chip to be tested is obtained, the control module can output a first driving signal to the mechanical gripper. The mechanical gripper can pick up the silicon photonic chip to be tested according to the first driving signal and place the silicon photonic chip to be tested on the test station. The control module can control the optical output device to output a first optical signal to the silicon photonic chip to be tested through the optical transmission device. After receiving the first optical signal, the silicon photonic chip to be tested will send a second optical signal to the optical transmission device. The control module controls the optical measurement device to perform a trial detection on the second optical signal through the optical transmission device to obtain the optical signal trial detection result. The control module can output a third driving signal to the second six-axis adjustment motor according to the coordinate position of the test station and the optical signal trial detection result. The second six-axis adjustment motor can adjust the position and / or angle of the optical transmission device according to the third driving signal, so that the optical transmission device can be effectively coupled to the silicon photonic chip to be tested, thereby automatically completing the coupling connection work between the optical transmission device and the silicon photonic chip to be tested.

[0098] It should be noted that the process of the optical measurement device performing a trial detection on the optical signal of the silicon photonic chip to be tested can be that when the second optical signal output by the silicon photonic chip to be tested received by the optical measurement device is less than the second test threshold, it is necessary to adjust the position and / or angle of the optical transmission device until the second optical signal output by the silicon photonic chip to be tested is greater than the second test threshold. It should be noted that the second test threshold is set according to the actual situation, and this embodiment does not make specific limitations on this.

[0099] It should be noted that parameters such as the power and / or wavelength of the first optical signal output by the optical output device to the silicon photonic chip to be tested through the optical transmission device can be set in advance according to the silicon photonic chip to be tested, or can be set during the test according to the actual situation. This embodiment does not make specific limitations on this.

[0100] Refer to Figure 8 , Figure 8 which is the flowchart of the automatic test method for the silicon photonic chip to be tested in another embodiment. This method is applied to Figure 9An automated test system for a silicon photonics chip. In one embodiment, the automated test system for a silicon photonics chip includes a probe card 110, an optical coupling module (not labeled in the figure), a source measurement module 130, a moving component (not labeled in the figure), and a control module 150. The source measurement module 130 is connected to the probe card 110. The moving component includes a first moving module (not labeled in the figure), a second moving module (not labeled in the figure), and a third moving module (not labeled in the figure). The optical coupling module includes an optical output device 940, an optical transmission device 950, and an optical measurement device 960. The control module 150 is respectively connected to the source measurement module 130, the optical output device 940, the optical measurement device 960, the first moving module, the second moving module, and the third moving module. Wherein the first moving module is a mechanical gripper 910, the second moving module is a first six-axis adjustment motor 920, and the third moving module is a second six-axis adjustment motor 930. Then the automated test method for the silicon photonics chip to be tested may include the following steps:

[0101] Step S810: According to the position coordinates of the silicon photonics chip to be tested and the position coordinates of the test station, output a first drive signal to control the mechanical gripper to pick up the silicon photonics chip to be tested and place it on the test station.

[0102] Step S820: According to the position coordinates of the test station, output a second drive signal to control the first six-axis adjustment motor to adjust the position and / or angle of the probe card so that the probe card is connected to the silicon photonics chip to be tested.

[0103] Step S830: Turn off the output switch of the optical output device and obtain the first electrical signal data output by the source measurement module. The first electrical signal data is the electrical signal data of the silicon photonics chip to be tested obtained by the source measurement module through the probe card.

[0104] Step S840: According to the position coordinates of the test station, output a third drive signal to control the second six-axis adjustment motor to adjust the position and / or angle of the optical coupling module so that the optical coupling module is coupled to the silicon photonics chip to be tested.

[0105] Step S850: Turn on the output switch of the optical output device and respectively obtain the second electrical signal data output by the source measurement module and the optical signal data output by the optical measurement device. The second electrical signal data is the electrical signal data of the silicon photonics chip to be tested obtained by the source measurement module through the probe card under the condition of light transmission.

[0106] Step S860: Output a fifth drive signal and a sixth drive signal to the second moving module and the third moving module respectively to disconnect the probe card and the optical coupling module from the silicon photonics chip to be tested that has been tested.

[0107] Step S870: Output a fourth drive signal to the first moving module to control the first moving module to pick up and transfer the silicon photonics chip to be tested.

[0108] Step S880: Output a test report based on the first electrical signal measurement data, the second electrical signal measurement data, and the optical signal measurement data.

[0109] Each step in the embodiments of this method has been described in the above embodiments and will not be elaborated in detail here. The method steps based on the silicon photonics automated test system in this embodiment can achieve the automated test of the silicon photonics chip to be tested, effectively improving the test efficiency of the silicon photonics chip to be tested.

[0110] Another embodiment of the present invention also provides an electronic device 1000. Referring to Figure 10 , the electronic device 1000 includes a memory 1020, a processor 1010, and a computer program stored on the memory 1020 and executable on the processor 1010. When the computer program is executed by the processor 1010, it implements the automated test method for the silicon photonics chip to be tested according to any one of the foregoing. The electronic device 1000 controls the silicon photonics chip automated test system through the test method in the embodiments of the present invention, moves the silicon photonics chip to be tested to the test station, moves the probe card to connect the probe card to the silicon photonics chip to be tested at the test station, and moves the optical coupling module to couple the optical coupling module to the silicon photonics chip to be tested; after the connection is completed, it can control the source measurement module and the optical coupling module to measure the silicon photonics chip to be tested, receive the electrical signal measurement data sent by the source measurement module and the optical signal measurement data sent by the optical coupling module, and output a test report based on the electrical signal measurement data and the optical signal measurement data.

[0111] Another embodiment of the present invention also provides a computer-readable storage medium. The computer-readable storage medium stores computer-executable instructions. When the computer-executable instructions are executed by a processor 1010 or a controller, for example, executed by a processor 1010 in the embodiment of the above electronic device 1000, the above processor 1010 can execute the control method in the above embodiments, for example, execute the method steps S210 described above in Figure 2 , the method steps S310 to S330 in Figure 3 , the method steps S410 to S430 in Figure 4 , the method steps 510 to step S530 in Figure 5 , the method step S610 in Figure 6 , the method steps S710 in Figure 7 , the method steps S810 to S880 in Figure 8 .

[0112] Those of ordinary skill in the art will understand that all or some of the steps and systems disclosed above can be implemented as software, firmware, hardware, and appropriate combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include a computer storage medium (or non-transitory medium) and a communication medium (or transitory medium). As is well known to those of ordinary skill in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information, such as computer-readable instructions, data structures, program modules, or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to store the desired information and can be accessed by a computer. In addition, it is well known to those of ordinary skill in the art that communication media typically contain computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transmission mechanism, and can include any information delivery medium.

[0113] The above is a specific description of the preferred embodiments of the present invention, but the present invention is not limited to the above embodiments. Those skilled in the art can make various equivalent deformations or substitutions without departing from the spirit of the present invention, and these equivalent deformations or substitutions are all included in the scope defined by the claims of the present invention.

Claims

1. An automated test system for a silicon photonics chip, characterized in that, Including: A source measurement module, configured to output a test electrical signal to a silicon photonics chip under test, receive the electrical signal output by the silicon photonics chip under test, and measure the electrical signal output by the silicon photonics chip under test to obtain electrical signal measurement data; A probe card, connected to the source measurement module, for transmitting the electrical signal between the source measurement module and the silicon photonics chip under test; An optical coupling module, including an optical output device, an optical transmission device, and an optical measurement device; wherein, the optical output device is configured to output a test optical signal; the optical transmission device is configured to transmit the test optical signal output by the optical output device to the silicon photonics chip under test, receive the optical signal output by the silicon photonics chip under test, and transmit the optical signal output by the silicon photonics chip under test to the optical measurement device; the optical measurement device is configured to measure the optical signal output by the silicon photonics chip under test to obtain optical signal measurement data; A moving component; A control module, configured to output a driving signal to the moving component, so that the moving component moves the silicon photonics chip under test to a test station, moves the probe card to connect the probe card with the silicon photonics chip under test at the test station, and moves the optical coupling module to couple the optical coupling module with the silicon photonics chip under test; The control module is further configured to receive the electrical signal measurement data sent by the source measurement module and the optical signal measurement data sent by the optical coupling module, and output a test report according to the electrical signal measurement data and the optical signal measurement data.

2. The automated test system for silicon photonic chips according to claim 1, wherein The moving component includes: A first moving module, for moving the silicon photonics chip under test to a test station; A second moving module, for moving the probe card to connect the probe card with the silicon photonics chip under test at the test station; A third moving module, for moving the optical coupling module to couple the optical coupling module with the silicon photonics chip under test; The control module outputs a driving signal to the moving component, including: Outputting a first driving signal to the first moving module, so that the first moving module moves the silicon photonics chip under test to a test station; Outputting a second driving signal to the second moving module, so that the second moving module connects the probe card with the silicon photonics chip under test at the test station; Outputting a third driving signal to the third moving module, so that the third moving module couples the optical coupling module with the silicon photonics chip under test.

3. The automated test system for silicon optical chips according to claim 2, wherein, The moving component further includes: A first moving module, for moving the silicon photonics chip under test away from the test station; A second moving module, for moving the probe card to disconnect the probe card from the silicon photonics chip under test; A third moving module, for moving the optical coupling module to disconnect the optical coupling module from the silicon photonics chip under test; The control module outputs a driving signal to the moving component, further including: Outputting a fourth driving signal to the first moving module, so that the first moving module moves the silicon photonics chip under test away from the test station; Output a fifth driving signal to the second moving module, so that the second moving module disconnects the probe card from the silicon photonic chip under test; Output a sixth driving signal to the third moving module, so that the third moving module disconnects the optical coupling module from the silicon photonic chip under test.

4. The silicon photonic chip automatic test system according to claim 1, wherein The electrical signal measurement data includes first electrical signal measurement data and second electrical signal measurement data; Among them, the first electrical signal measurement data represents the data obtained by measuring the electrical signal output by the silicon photonic chip under test in a non-light-passing situation; The second electrical signal measurement data represents the data obtained by measuring the electrical signal output by the silicon photonic chip under test in a light-passing situation.

5. The automated silicon photonics chip testing system according to claim 1, characterized in that The control module is further configured to control the light output device to be turned on or off; When the light output device is turned off, the control module uses the received electrical signal measurement data as the first electrical signal measurement data; When the light output device is turned on, the control module uses the received electrical signal measurement data as the second electrical signal measurement data.

6. An automated test method for a silicon photonic chip to be measured, characterized in that, Applied to a silicon photonic chip automatic test system, the silicon photonic chip automatic test system includes: A source measurement module, configured to output a test electrical signal to the silicon photonic chip under test, receive the electrical signal output by the silicon photonic chip under test, and measure the electrical signal output by the silicon photonic chip under test to obtain electrical signal measurement data; A probe card, connected to the source measurement module, for transmitting the electrical signal between the source measurement module and the silicon photonic chip under test; An optical coupling module, including a light output device, a light transmission device, and a light measurement device; wherein, the light output device is used to output a test optical signal; the light transmission device is used to transmit the test optical signal output by the light output device to the silicon photonic chip under test, receive the optical signal output by the silicon photonic chip under test, and transmit the optical signal output by the silicon photonic chip under test to the light measurement device; the light measurement device is used to measure the optical signal output by the silicon photonic chip under test to obtain optical signal measurement data; A moving component; The method includes: Output a driving signal to the moving component, so that the moving component moves the silicon photonic chip under test to the test station, moves the probe card so that the probe card is connected to the silicon photonic chip under test at the test station, and moves the optical coupling module so that the optical coupling module is coupled to the silicon photonic chip under test; Receive the electrical signal measurement data sent by the source measurement module and the optical signal measurement data sent by the optical coupling module, and output a test report according to the electrical signal measurement data and the optical signal measurement data.

7. The automated test method for the silicon photonic chip to be tested according to claim 6, wherein The moving component includes: A first moving module, configured to move the silicon photonic chip under test to the test station; A second moving module, configured to move the probe card so that the probe card is connected to the silicon photonic chip under test at the test station; A third moving module, configured to move the optical coupling module so that the optical coupling module is coupled to the silicon photonic chip under test; The method further includes: Output a first driving signal to the first moving module to move the silicon photonic chip under test to the test station; Output a second driving signal to the second moving module to connect the probe card to the silicon photonic chip under test at the test station; Output a third driving signal to the third moving module to couple-connect the optical coupling module to the silicon photonic chip under test.

8. The automated test method for the silicon photonic chip to be tested according to claim 7, wherein The moving assembly further includes: A first moving module for transferring the silicon photonic chip under test from the test station; A second moving module for moving the probe card to disconnect the probe card from the silicon photonic chip under test; A third moving module for moving the optical coupling module to disconnect the optical coupling module from the silicon photonic chip under test; The method further includes: Output a fourth driving signal to the first moving module to transfer the silicon photonic chip under test from the test station; Output a fifth driving signal to the second moving module to disconnect the probe card from the silicon photonic chip under test; Output a sixth driving signal to the third moving module to disconnect the optical coupling module from the silicon photonic chip under test.

9. The automated test method for the silicon photonics chip to be measured according to claim 6, wherein, The electrical signal measurement data includes first electrical signal measurement data and second electrical signal measurement data; Wherein, the first electrical signal measurement data represents the data obtained by measuring the electrical signal output by the silicon photonic chip under test in a non-light-passing situation; The second electrical signal measurement data represents the data obtained by measuring the electrical signal output by the silicon photonic chip under test in a light-passing situation.

10. The automated test method for the silicon photonic chip to be tested according to claim 1, wherein, It further includes: Controlling the light output device to turn on or off; When the light output device is turned off, the control module takes the received electrical signal measurement data as the first electrical signal measurement data; When the light output device is turned on, the control module takes the received electrical signal measurement data as the second electrical signal measurement data.

11. An electronic device, characterized in that, It includes a memory, a processor, and a computer program stored on the memory and executable on the processor. When the computer program is executed by the processor, it implements the automated test method for the silicon photonic chip under test as described in any one of claims 6 to 10.

12. A computer-readable storage medium, characterized in that, An information processing program is stored on the computer-readable storage medium. When the information processing program is executed by the processor, it implements the automated test method for the silicon photonic chip under test as described in any one of claims 6 to 10.

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