A highly insulating shock-absorbing heat sink

Abstract

The present invention provides a highly insulating shock-absorbing heat sink, which comprises: an insulating layer, a shock-absorbing layer and a heat-dissipating layer; the insulating layer includes: an insulating layer body and ear pieces extending from both sides of the insulating layer body, the shock-absorbing layer is combined at the middle position in the width direction of one side of the insulating layer, the shock-absorbing layer is a shock-absorbing strip, which extends from the ear piece on one side to the ear piece on the other side, the heat-dissipating layer is located at the middle position in the length direction of the other side of the insulating layer and is combined with the insulating layer body, the heat-dissipating layer is a square thin sheet, and there are also several conduction regions on the insulating layer, and each conduction region is covered with a release film. The highly insulating shock-absorbing heat sink of the present invention combines multiple functional film layers, so that the film product of the present invention can meet the actual use requirements of the notebook computer motherboard. At the same time, in order to meet the conduction requirements during the use of the notebook computer motherboard, conduction regions are also provided at multiple local positions of the insulating layer, and each conduction region is covered with a release film that plays a protective role.

Description

Technical Field

[0001] The present invention relates to a heat sink, and more particularly to a high-insulation shock-absorbing heat sink. Background Art

[0002] At present, for the main board of a notebook computer, it is necessary to attach a film product to some of its functional areas to meet the usage requirements during its use. However, the existing film products lack special design and usually require the use of multiple functional films in combination, resulting in inconvenient mounting. Therefore, in view of the above problems, it is necessary to propose a further solution. Summary of the Invention

[0003] The present invention aims to provide a high-insulation shock-absorbing heat sink to overcome the deficiencies in the prior art.

[0004] To solve the above technical problems, the technical solution of the present invention is as follows:

[0005] A high-insulation shock-absorbing heat sink, comprising: an insulating layer, a shock-absorbing layer, and a heat-dissipating layer;

[0006] The insulating layer includes: an insulating layer body and ear pieces extending from both sides of the insulating layer body. The shock-absorbing layer is combined at the middle position in the width direction of one side of the insulating layer. The shock-absorbing layer is a shock-absorbing strip that extends from one ear piece to the other ear piece. The heat-dissipating layer is located at the middle position in the length direction of the other side of the insulating layer and is combined with the insulating layer body. The heat-dissipating layer is a square thin sheet. The insulating layer also has a plurality of conduction regions, and each conduction region is covered with a release film.

[0007] As an improvement of the high-insulation shock-absorbing heat sink of the present invention, the insulating layer is a Mylar sheet made of polycarbonate.

[0008] As an improvement of the high-insulation shock-absorbing heat sink of the present invention, the shape of the insulating layer is T-shaped.

[0009] As an improvement of the high-insulation shock-absorbing heat sink of the present invention, the shock-absorbing layer is a strip-shaped shock-absorbing foam, and one end of the shock-absorbing foam is designed as a U-shaped bending structure.

[0010] As an improvement of the high-insulation shock-absorbing heat sink of the present invention, the shock-absorbing layer is combined at the middle position in the width direction of one side of the insulating layer through a first double-sided adhesive.

[0011] As an improvement of the high-insulation shock-absorbing heat sink of the present invention, the heat-dissipating layer is combined with the insulating layer body through a second double-sided adhesive, and the shape of the second double-sided adhesive corresponds to the contour shape of the insulating layer.

[0012] As an improvement of the high-insulation shock-absorbing heat sink of the present invention, the heat dissipation layer is a copper foil layer, and a second double-sided adhesive is further covered on the back of the side where the copper foil layer is combined with the insulation layer.

[0013] As an improvement of the high-insulation shock-absorbing heat sink of the present invention, the second double-sided adhesive includes: a PET polyester film and acrylic resins located on both sides of the PET polyester film.

[0014] As an improvement of the high-insulation shock-absorbing heat sink of the present invention, the release film includes: a PET base film and a release agent coated on one side of the PET base film.

[0015] As an improvement of the high-insulation shock-absorbing heat sink of the present invention, the plurality of conduction regions are distributed at the edge positions of the insulation layer.

[0016] Compared with the prior art, the beneficial effects of the present invention are: the high-insulation shock-absorbing heat sink of the present invention combines multiple functional film layers, so that the film product of the present invention can meet the actual use requirements of the notebook computer motherboard. At the same time, in order to meet the conduction requirements during the use of the notebook computer motherboard, conduction regions are also provided at multiple local positions of the insulation layer, and each conduction region is covered with a release film that plays a protective role. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 It is a three-dimensional schematic diagram of an embodiment of the high-insulation shock-absorbing heat sink of the present invention;

[0019] Figure 2 is Figure 1 a three-dimensional exploded schematic diagram of the high-insulation shock-absorbing heat sink in DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0021] Such as Figure 1 、 2As shown in the figure, a highly insulating shock-absorbing heat sink according to an embodiment of the present invention includes: an insulating layer 10, a shock-absorbing layer 20, and a heat-dissipating layer 30.

[0022] The insulating layer 10 serves as the main body of the highly insulating shock-absorbing heat sink in this embodiment and plays an insulating role. Specifically, the insulating layer 10 includes: an insulating layer body 11 and lugs 12 extending from both sides of the insulating layer body 11. The above-mentioned insulating layer body 11 and the lugs 12 are integrally formed. In one embodiment, the shape of the insulating layer 10 is generally T-shaped, so as to meet the insulating requirements of the main board of a specific-shaped notebook computer. In terms of material, the insulating layer 10 can be a mylar sheet made of polycarbonate, that is, a black flame-retardant and environmentally friendly polycarbonate film. At this time, the insulating layer 10 has better mechanical properties and has a stable and uniform color. The thickness of the above-mentioned mylar sheet can be 0.1 mm.

[0023] The shock-absorbing layer 20 is used to meet the shock-absorbing requirements of the main board of the notebook computer. In this embodiment, the shock-absorbing layer 20 is combined at the middle position in the width direction of one side of the insulating layer 10. Structurally, the shock-absorbing layer 20 is a shock-absorbing strip that extends from the lug 12 on one side to the lug 12 on the other side. In this way, the shock-absorbing layer 20 can play a shock-absorbing effect in the middle area in the width direction of the insulating layer 10. In terms of material, the shock-absorbing layer 20 is a strip-shaped shock-absorbing foam, and one end of the shock-absorbing foam is designed as a U-shaped bending structure. In this way, the end of the shock-absorbing layer 20 can also cover a larger shock-absorbing area. The thickness of the above-mentioned shock-absorbing foam can be 2.9 mm. In addition, in order to realize the combination between the shock-absorbing layer 20 and the insulating layer 10, the shock-absorbing layer 20 is combined with the middle position in the width direction of one side of the insulating layer 10 through the first double-sided adhesive 40. The thickness of the above-mentioned first double-sided adhesive 40 can be 0.09 mm.

[0024] The heat-dissipating layer 30 is used to meet the heat-dissipating requirements when the main board of the notebook computer works, so as to avoid the accumulation of heat. Considering that the heat generation in the middle position is relatively large when the main board of the notebook computer works, the heat-dissipating layer 30 is located at the middle position in the length direction of the other side of the insulating layer 10 and is combined with the insulating layer body 11. Structurally, the above-mentioned heat-dissipating layer 30 can be a square thin sheet. In terms of material, the heat-dissipating layer 30 can adopt a copper foil layer. At this time, the back of the side of the copper foil layer combined with the insulating layer 10 is also covered with a second double-sided adhesive 50. The thickness of the above-mentioned copper foil layer can be 0.1 mm.

[0025] In order to realize the combination between the heat-dissipating layer 30 and the insulating layer 10, the heat-dissipating layer 30 is combined with the insulating layer body 11 through the second double-sided adhesive 50, and the shape of the second double-sided adhesive 50 corresponds to the contour shape of the insulating layer 10. Among them, the second double-sided adhesive 50 adopts an acrylic double-sided adhesive. At this time, the second double-sided adhesive 50 includes: a PET polyester film and acrylic resins on both sides of the PET polyester film. The thickness of the above-mentioned second double-sided adhesive 50 can be 0.05 mm.

[0026] In order to meet the conduction requirements during the use of the notebook computer motherboard, conduction regions are also provided at multiple local positions of the insulating layer 10. Specifically, there are several conduction regions on the insulating layer 10, and each conduction region is covered with a release film 60.

[0027] Among them, the release film 60 includes: a PET base film and a release agent coated on one side of the PET base film. In terms of the arrangement, several conduction regions are distributed at the edge positions of the insulating layer 10. In one embodiment, there are four conduction regions provided at the edge position of one long side of the insulating layer 10, and two conduction regions provided at the edge position of one short side of the insulating layer 10. In this way, during use, the corresponding release film 60 can be torn off at different workstations according to the process requirements, so as to meet the requirements of multi-stage sub-operations. The thickness of the above-mentioned release film 60 can be 0.075 mm.

[0028] In summary, the high-insulation shock-absorbing and heat-dissipating fin of the present invention combines multiple functional film layers, so that the film product of the present invention can meet the actual use requirements of the notebook computer motherboard. At the same time, in order to meet the conduction requirements during the use of the notebook computer motherboard, conduction regions are also provided at multiple local positions of the insulating layer, and each conduction region is covered with a release film that plays a protective role.

[0029] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, in any regard, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be encompassed by the present invention. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0030] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only includes an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A highly insulating shock-absorbing heat sink, characterized in that, the highly insulating shock-absorbing heat sink comprises: an insulating layer, a shock-absorbing layer and a heat-dissipating layer; the insulating layer comprises: an insulating layer body and lugs extending from both sides of the insulating layer body. The shock-absorbing layer is combined at the middle position in the width direction of one side of the insulating layer. The shock-absorbing layer is a shock-absorbing strip, which extends from the lug on one side to the lug on the other side. The heat-dissipating layer is located at the middle position in the length direction of the other side of the insulating layer and is combined with the insulating layer body. The heat-dissipating layer is a square thin sheet. There are also several conduction regions on the insulating layer, and each conduction region is covered with a release film; the insulating layer is a Mylar sheet made of polycarbonate; the shape of the insulating layer is T-shaped.

2. The highly insulating shock-absorbing heat sink according to claim 1, characterized in that, the shock-absorbing layer is a strip-shaped shock-absorbing foam, and one end of the shock-absorbing foam is designed as a U-shaped bending structure.

3. The highly insulating shock-absorbing heat sink according to claim 1, characterized in that, the shock-absorbing layer is combined at the middle position in the width direction of one side of the insulating layer through a first double-sided adhesive.

4. The highly insulating shock-absorbing heat sink according to claim 1, characterized in that, the heat-dissipating layer is combined with the insulating layer body through a second double-sided adhesive, and the shape of the second double-sided adhesive corresponds to the contour shape of the insulating layer.

5. The highly insulating shock-absorbing heat sink according to claim 1, characterized in that, the heat-dissipating layer is a copper foil layer, and the back of the side of the copper foil layer combined with the insulating layer is also covered with a second double-sided adhesive.

6. The highly insulating shock-absorbing heat sink according to claim 4 or 5, characterized in that, the second double-sided adhesive comprises: a PET polyester film and acrylic resins on both sides of the PET polyester film.

7. The highly insulating shock-absorbing heat sink according to claim 1, characterized in that, the release film comprises: a PET base film and a release agent coated on one side of the PET base film.

8. The highly insulating shock-absorbing heat sink according to claim 1, characterized in that, the several conduction regions are distributed at the edge positions of the insulating layer.

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