Substrate cooling unit, substrate processing apparatus, semiconductor device manufacturing method, recording medium, and substrate processing method

Abstract

A technology is provided, comprising: a substrate holding mechanism that holds the substrate horizontally; a driving unit that raises and lowers the substrate holding mechanism; a cooling plate having an opposing surface opposite to the surface of the substrate; a laser emitting unit that is provided at one end of a side of a space in which the substrate is raised and lowered, and emits a laser that is distributed with a width in the direction in which the substrate holding mechanism is raised and lowered and is parallel to the surface of the substrate; a laser light receiving unit that is provided at the other end of the side of the space, and acquires light receiving position determination information, wherein the light receiving position determination information indicates a position in the direction in which the substrate holding mechanism is raised and lowered, at which the laser light emitted from the laser emitting unit is received; and a calculating unit that calculates the distance between the cooling plate and the substrate based on the light receiving position determination information acquired in the laser light receiving unit.

Description

Technical Field

[0001] The present invention relates to a substrate cooling unit, a substrate processing device, a method for manufacturing a semiconductor device, a recording medium, and a substrate processing method. Background Art

[0002] As one of the steps in the manufacturing process of a semiconductor device, a substrate heated in a film formation or annealing step is sometimes transferred to a cooling device and cooled (see, for example, Japanese Patent Application Laid-Open No. 2003-100579). Summary of the Invention

[0003] During substrate cooling, it is desirable to cool the substrate according to a desired cooling characteristic. This cooling characteristic varies depending on the substrate's position during cooling, such as the distance between the cooling element and the substrate. Therefore, it is desirable to achieve cooling that approximates the desired cooling characteristic by positioning the substrate in a reproducible and accurate position during cooling.

[0004] According to one embodiment of the present invention, a technology is provided, comprising: a substrate holding mechanism that holds the substrate horizontally; a driving unit that moves the substrate holding mechanism up and down; a cooling plate having an opposing surface opposite to the surface of the substrate held by the substrate holding mechanism; a laser emitting unit that is provided at one end of a side of a space in which the substrate held by the substrate holding mechanism is moved up and down, and emits a laser beam that is distributed with a width in the direction in which the substrate holding mechanism is moved up and down and is parallel to the surface of the substrate held by the substrate holding mechanism; a laser light receiving unit that is provided at the other end of a side of the space, and acquires light receiving position determination information, wherein the light receiving position determination information indicates a position in the direction in which the substrate holding mechanism is moved up and down, at which the laser beam emitted from the laser emitting unit is received; and a calculating unit that calculates the distance between the opposing surface of the cooling plate and the opposing surface of the substrate held by the substrate holding mechanism relative to the cooling plate based on the light receiving position determination information acquired in the laser light receiving unit.

[0005] Effects of the Invention

[0006] According to the technology of the present invention, cooling can be performed in a manner close to desired cooling characteristics in a cooling process for a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 This is a schematic structural diagram of a substrate processing apparatus used in one embodiment of the present invention, and is a diagram showing a horizontal cross section viewed from the top surface.

[0008] Figure 2This is a schematic structural diagram of a substrate processing apparatus used in one embodiment of the present invention, and is a diagram showing a vertical cross section viewed from the side.

[0009] Figure 3 This is a schematic structural diagram of a substrate cooling unit used in one embodiment of the present invention, and is a diagram showing a horizontal cross section viewed from the top surface.

[0010] Figure 4 This is a schematic structural diagram of a substrate cooling unit used in one embodiment of the present invention, and shows a state where a substrate is at a substrate loading / unloading position, as viewed from the side in a vertical cross section.

[0011] Figure 5 This is a schematic structural diagram of a substrate cooling unit used in one embodiment of the present invention, and shows a state where a substrate is in a substrate cooling processing position, as viewed from the side in a vertical cross section.

[0012] Figure 6 This is an explanatory diagram showing the arrangement of light-receiving elements constituting a laser sensor unit used in one embodiment of the present invention.

[0013] Figure 7 This is a schematic configuration diagram of a substrate cooling unit used in one embodiment of the present invention, and is an explanatory diagram showing the emission and reception of laser light at a substrate loading and unloading position.

[0014] Figure 8 This is a schematic configuration diagram of a substrate cooling unit used in one embodiment of the present invention, and is an explanatory diagram showing the emission and reception of laser light at a substrate cooling processing position.

[0015] Figure 9 This is a diagram showing the configuration of a control unit (controller) of a substrate processing apparatus preferably used in one embodiment of the present invention.

[0016] Figure 10 This is a schematic configuration diagram of a substrate cooling unit used in one embodiment of the present invention, and is an explanatory diagram showing how laser light is emitted and received when a substrate is warped. DETAILED DESCRIPTION

[0017] <Embodiment 1 of the present invention>

[0018] Embodiment 1 of the present invention will be described below.

[0019] (1) Structure of substrate processing apparatus

[0020] Below, while referring to Figure 1 、 2 , while explaining the structure of the substrate processing apparatus 10 of this embodiment.

[0021] The substrate processing apparatus 10 is centered around a transfer chamber 12 and includes load lock chambers 14a, 14b, and two processing chambers 16a, 16b. Furthermore, the transfer chamber 12 includes a cooling treatment chamber 101 formed within a cooling treatment housing 100, and a substrate cooling unit 18 is provided within the cooling treatment chamber 101. An atmospheric transfer chamber 20 is provided on the opposite side of the load lock chambers 14a, 14b from the transfer chamber 12. The atmospheric transfer chamber 20 includes a loading platform capable of accommodating a plurality of wafer cassettes, each of which can accommodate up to 25 substrates 22 (wafers in this embodiment) at fixed intervals in the longitudinal direction. Furthermore, an atmospheric robot 21 for transporting substrates between the atmospheric transfer chamber 20 and the load lock chambers 14a, 14b is provided in the atmospheric transfer chamber 20.

[0022] Gate valves are installed between the transfer chamber 12 and the load lock chambers 14a, 14b, between the transfer chamber 12 and the processing chambers 16a, 16b, and between the load lock chambers 14a, 14b and the atmospheric transfer chamber 20 to isolate the gas atmosphere between the two spaces. Vacuum pumps are connected to the transfer chamber 12, the load lock chambers 14a, 14b, and the processing chambers 16a, 16b, respectively, and are controlled to maintain the desired pressure in each space.

[0023] The substrate processing apparatus 10 includes a controller 121 as a control unit. In the above-described configuration, the controller 121 controls the entire apparatus.

[0024] (Vacuum Robot)

[0025] The transfer chamber 12 is provided with a vacuum robot 36 serving as a substrate transfer device configured to transfer substrates 22 between the load lock chambers 14a and 14b, the processing chambers 16a and 16b, and the substrate cooling unit 18. The vacuum robot 36 includes an arm 42 having a pair of manipulators 40, each of which includes an upper manipulator 38a (first substrate transfer support) and a lower manipulator 38b (second substrate transfer support), serving as substrate transfer supports.

[0026] The upper robot 38a and the lower robot 38b both have the same forked shape. Furthermore, the upper robot 38a and the lower robot 38b are arranged to overlap with each other at a predetermined interval in the vertical direction, and extend substantially horizontally in the same direction from the arm 42 to support the substrate 22.

[0027] The arm 42 rotates about a rotation axis that rises and falls in the vertical direction and moves horizontally, thereby being able to simultaneously transport two substrates 22 in the vertical and horizontal directions. Hereinafter, the substrate 22 supported and transported by the upper robot 38a will be specifically referred to as substrate 22a, and the substrate 22 supported and transported by the lower robot 38b will be specifically referred to as substrate 22b.

[0028] (Load Lock Chamber)

[0029] Each load lock chamber 14a or 14b is equipped with a substrate support 24 that accommodates, for example, 25 substrates 22 spaced at regular intervals in the longitudinal direction. The substrate support 24 is composed of an upper plate 26, a lower plate 28, and support columns 30 connecting them. A loading portion 32 is formed parallel to the longitudinal inner side of the support columns 30. The substrate support 24 is moved and rotated vertically in each load lock chamber 14a or 14b by an L / L drive 25.

[0030] When loading substrates 22 from the transfer chamber 12 into the load lock chamber 14a or 14b, the substrates 22 are transferred to the loading sections 32 through the following operation. Specifically, the robot pair 40 supporting the substrates 22 is inserted between the loading sections 32 in the load lock chamber 14a or 14b. The substrate support 24 then moves vertically. This operation allows the two substrates mounted on the robot pair 40 to be transferred to the upper surface of the loading sections 32. Furthermore, the wafers loaded on the loading sections 32 are unloaded from the transfer chamber by performing the reverse operation to that performed when loading wafers from the transfer chamber 12 into the load lock chamber 14a.

[0031] (Processing Room)

[0032] The processing chambers 16a and 16b each have a reaction chamber, and each reaction chamber is provided with a substrate holding table 44a, 44b and a robot arm 17. A partition 46 is provided in the space between the substrate holding table 44a and the substrate holding table 44b. The robot arm 17 is configured to receive the substrate 22 held by the vacuum robot 36 and place it on the substrate holding tables 44a and 44b, respectively. In the processing chambers 16a and 16b, the two substrates 22 placed on the substrate holding tables 44a and 44b, respectively, are processed simultaneously in the same space. The substrate holding tables 44a and 44b each have a built-in heater as a heating unit, which can heat the substrate 22 to, for example, above 400°C.

[0033] (Substrate Cooling Unit)

[0034] use Figures 3-5, the substrate cooling unit 18 is described. The substrate cooling unit 18 is provided in the cooling process chamber 101 formed by the cooling process housing 100. The substrate cooling unit 18 is composed of a plurality of cooling plates (cooling thin plates) 102a (first substrate cooling plate) and 102b (second substrate cooling plate), substrate holding parts 103a (first substrate holding part) and 103b (second substrate holding part), and support shafts 104a and 104b, which will be described later. The substrate cooling unit 18 can be provided to include driving parts 105a and 105b, and can also be provided to include refrigerant supply units (refrigerant supply parts) 109a and 109b that supply refrigerant to refrigerant flow paths 106a and 106b provided in the cooling plates 102a and 102b, respectively.

[0035] The substrate cooling unit 18 is provided with two sets of substrate holding mechanisms for holding substrates 22a and 22b, respectively. The substrate holding mechanism for holding substrate 22a is composed of four substrate holding portions 103a configured to hold substrate 22a on the upper surface, and four support shafts 104a connected to and supporting each substrate holding portion 103a. Similarly, the substrate holding mechanism for holding substrate 22b is composed of four substrate holding portions 103b configured to hold substrate 22b on the upper surface, and four support shafts 104b connected to and supporting each substrate holding portion 103b. In addition, in this embodiment, although the substrate holding portions 103a and 103b are formed of plate-shaped members, this is not limited to this. Any structure capable of supporting substrate 22 at a point or surface, such as a pin-shaped structure that supports substrate 22 at a point from the lower surface, will suffice.

[0036] The substrate holding mechanism is configured to be raised and lowered by drive units (drive devices) 105a and 105b connected to support shafts 104a and 104b, respectively. Drive units 105a and 105b are, for example, composed of air cylinders. By controlling the drive units 105a and 105b, respectively, substrates 22a and 22b held by substrate holding units 103a and 103b can be raised and lowered between a substrate loading and unloading position and a substrate cooling position, described later.

[0037] The cooling plates 102a and 102b are made of a metal such as stainless steel. Furthermore, refrigerant flow paths 106a and 106b are provided within the cooling plates 102a and 102b, respectively, for cooling the lower surface of the cooling plate 102a and the upper surface of the cooling plate 102b, respectively. This cools the substrate 22 supported by the substrate holders 103a and 103b near the cooling plates 102a and 102b. The substrate cooling unit 18 further includes refrigerant supply units (refrigerant supply units) 109a and 109b that supply refrigerant to the refrigerant flow paths 106a and 106b.

[0038] Light transmission windows 107 a and 107 b are provided on the side surfaces of the cooling housing 100 at positions facing each other across the cooling chamber 101 , respectively, for transmitting light such as laser light between the outside and inside of the cooling chamber 101 .

[0039] (Laser emission unit)

[0040] Laser emitting units (laser emitters) 50a and 50b, serving as laser emitting units, are provided outside the cooling process housing 100 at positions opposing the light transmission window 107a. The laser emitting units 50a and 50b, serving as laser emitting units, are configured to emit laser light through the light transmission window 107a into the cooling process chamber 101. The laser emitting units 50a and 50b, respectively, emit laser light in a direction parallel to the surface of the substrate 22 held on the substrate holding portions 103a and 103b, preferably in a direction passing through the central axis of the surface of the substrate 22.

[0041] Furthermore, the laser emitting units 50a and 50b are each configured to emit laser light having a width distribution in the vertical direction (i.e., the direction in which the substrate holding mechanism is raised or lowered). Specifically, by diffusing the laser light emitted from a laser oscillator such as a laser diode in the vertical direction using a diffusion lens or the like, a laser light having a width distribution in the vertical direction can be generated. Alternatively, a plurality of laser oscillators such as laser diodes arranged at predetermined intervals in the vertical direction can be provided, and the plurality of laser light emitted from each laser oscillator can be used to generate a laser light having a width distribution in the vertical direction.

[0042] (Laser sensor unit)

[0043] On the outside of the cooling treatment housing 100, at a position opposite to the light transmission window 107b, laser sensor units (laser sensors) 60a, 60b are provided as laser light receiving parts configured to receive laser light emitted from the laser emitting units 50a, 50b through the light transmission window 107b.

[0044] The laser emitting unit 50a and the laser sensor unit 60a are disposed so as to face each other across the cooling chamber 101. Similarly, the laser emitting unit 50b and the laser sensor unit 60b are disposed so as to face each other across the cooling chamber 101.

[0045] The laser sensor units 60a and 60b are configured to receive laser light emitted from the laser emitting units 50a and 50b, which is distributed over a wide vertical direction, and to obtain at least one of information on the position of the light receiving element that has received the laser light (light receiving position) in the vertical direction (i.e., the direction in which the substrate holding mechanism is raised or lowered) and information on the position of the light receiving element that has not received the laser light (non-light receiving position). Hereinafter, information identifying the light receiving position, including both the light receiving position and the non-light receiving position, may be collectively referred to as light receiving position identification information.

[0046] Specifically, the laser sensor units 60a and 60b can be configured by respectively including Figure 6 As shown in FIG. 6 , an array 601 of light-receiving elements such as CCDs (Charge Coupled Devices) arranged at predetermined intervals in the vertical direction for detecting light receives and detects laser light having a wide distribution in the vertical direction. In this embodiment, the array 601 is composed of n light-receiving elements, namely, light-receiving elements 601-1 to 601-n (n is a natural number). For example, in FIG. Figure 6 When receiving laser light having a width from light receiving elements 601-1 to 601-m (m is a natural number), the laser sensor units 60a and 60b detect that the light receiving elements 601-1 to 601-m have received light and obtain the positions where these light receiving elements are arranged as the light receiving positions. On the other hand, the positions where the light receiving elements 601-(m+1) to 601-n have not received laser light are obtained as the non-light receiving positions.

[0047] The array 601 has a width (length) that covers at least the entire vertical distribution width of the laser light emitted from the laser emitting units 50a and 50b, and is positioned to receive laser light across the entire distribution width. The spacing between the light-receiving elements in the array 601 can be appropriately determined based on the accuracy of laser detection; for example, the spacing can be selected within a range of 1 μm to 1 mm, preferably 5 to 10 μm.

[0048] like Figure 7 As shown, in this embodiment, the laser emitting unit 50a emits laser light distributed between the height of the lower surface of the cooling plate 102a (i.e., the surface facing the substrate 22a) and the upper surface of the substrate 22a at the substrate loading / unloading position described later. Specifically, the laser light distribution includes the upper end at the height of the lower surface of the cooling plate 102a and the range in the height direction of the substrate 22a during its elevation.

[0049] Similarly, the laser emitting unit 50b emits laser light having a distribution between the height position of the upper surface of the cooling plate 102b (i.e., the surface facing the substrate 22b) and the height position of the lower surface of the substrate 22b at the substrate loading and unloading position described later.

[0050] In other words, the laser emission units 50a and 50b are respectively constructed to be located at one end of the side of the space for raising and lowering the substrate 22 held by the substrate holding mechanism (the space for raising and lowering the substrate 22 between the substrate loading and unloading position and the substrate cooling processing position described later), and emit laser light distributed in the width of the space in the vertical direction (height direction) toward the space.

[0051] In addition, if Figure 7 As shown, the laser sensor unit 60a is configured to receive laser light distributed over its entire distribution range, from the height of the lower surface of the cooling plate 102a to the height of the upper surface of the substrate 22a at the substrate loading / unloading position (described later). Specifically, the light-receiving elements in the array 601 of the laser sensor units 60a are arranged so as to receive laser light at least within this vertical distribution range. In this embodiment, the laser sensor units 60a are arranged so that the uppermost light-receiving element 601-1 in the array 601 is positioned at the height of the lower surface of the cooling plate 102a.

[0052] Similarly, the laser sensor unit 60b is configured to receive laser light distributed across its entire distribution range, from the height of the upper surface of the cooling plate 102b to the height of the lower surface of the substrate 22b at the substrate loading / unloading position (described later). Specifically, the light-receiving elements in the array 601 of the laser sensor units 60b are arranged so as to receive laser light within at least this vertical distribution range. In this embodiment, the laser sensor units 60b are arranged so that the lowest light-receiving element 601-n in the array 601 is positioned at the height of the upper surface of the cooling plate 102b.

[0053] Therefore, the laser sensor units 60a and 60b are respectively arranged at the other end of the side of the space where the substrate 22 held by the substrate holding mechanism is raised and lowered, and receive laser light emitted toward the space and distributed along the vertical width of the space.

[0054] Used here Figures 3-5 , indicating the substrate carrying in and out position and the substrate cooling processing position. Figure 3 、 4 The diagram shows a state where the substrate 22 is transferred (loaded) to the substrate cooling unit 18 and a state where the substrate 22 is unloaded (unloaded) from the substrate cooling unit 18. The position of the substrate 22 in this state is referred to as a substrate loading and unloading position.

[0055] In the process of transferring the substrate 22 to the substrate cooling unit 18, as shown in FIG. Figure 4 As shown, substrates 22a and 22b, which are carried into cooling chamber 101 while supported by manipulators 38a and 38b, are lowered by vacuum robot 36. As a result, substrates 22a and 22b are placed on the upper surfaces of substrate holders 103a and 103b, which are raised and lowered to their respective positions for loading and unloading substrates.

[0056] Furthermore, during the process of unloading the substrates 22 from the substrate cooling unit 18, the substrate holders 103a and 103b are raised and lowered, respectively, to their respective positions for loading and unloading the substrates, while holding the substrates 22a and 22b. Then, the vacuum robot 36 raises the manipulators 38a and 38b, which are inserted below the substrates 22a and 22b, respectively, thereby supporting the manipulators 38a and 38b. The substrates 22a and 22b, supported by the manipulators 38a and 38b, are then unloaded from the substrate cooling unit 18.

[0057] in addition Figure 5 The state in which the substrate 22 is cooled by being brought close to the cooling plates 102a and 102b is shown. The position of the substrate 22 in this state is referred to as a substrate cooling position.

[0058] In the process of cooling the substrate 22, as shown in FIG. Figure 5 As shown, the substrate holding portion 103a is raised by the driving portion 105a, and the substrate 22a held on the substrate holding portion 103a is transported to a position where it is cooled by the cooling plate 102a. Similarly, the substrate holding portion 103b is lowered by the driving portion 105b, and the substrate 22b held on the substrate holding portion 103b is transported to a position where it is cooled by the cooling plate 102b.

[0059] (Distance Calculation Controller)

[0060] The laser emitting unit 50a and the laser sensor unit 60a are connected to a first distance calculation controller 70a, which serves as a first calculation unit (first calculator). Similarly, the laser emitting unit 50b and the laser sensor unit 60b are connected to a second distance calculation controller 70b, which serves as a second calculation unit (second calculator). Furthermore, the first and second distance calculation controllers 70a and 70b are each connected to the controller 121. The first and second distance calculation controllers 70a and 70b obtain data (information) on at least one of the light-receiving position and the non-light-receiving position from the laser sensor units 60a and 60b, respectively.

[0061] The first distance calculation controller 70a calculates the distance (substrate distance DA) from the height position of the lower surface of the cooling plate 102a to the height position of the upper surface of the substrate 22a held by the substrate holding portion 103a based on the acquired data.

[0062] Specifically, the first distance calculation controller 70a acquires light receiving position data from the laser sensor unit 60a and calculates the width (length) of the light receiving positions consecutively from the light receiving element 601-1 as the substrate distance DA. Specifically, the position of the light receiving element 601-1, which is positioned at a height relative to the lower surface of the cooling plate 102a, is used as a reference point, and the width (length) of the light receiving positions consecutively from this reference point is calculated as the substrate distance DA.

[0063] In addition, as an example of another calculation method, the first distance calculation controller 70a may obtain data on the non-light-receiving position from the laser sensor unit 60a, and calculate the length to the non-light-receiving position that first appears on the queue 601 when observed from the position of the light-receiving element 601-1 as the substrate distance DA.

[0064] Similarly, the second distance calculation controller 70b calculates the distance (substrate distance DB) from the height position of the upper surface of the cooling plate 102b to the height position of the lower surface of the substrate 22b held by the substrate holding portion 103b based on the acquired data.

[0065] Specifically, the second distance calculation controller 70b acquires light receiving position data from the laser sensor unit 60b and calculates the width (length) of the light receiving positions consecutively from the light receiving element 601-n as the substrate distance DB. Specifically, the position of the light receiving element 601-n, which is positioned at a height relative to the upper surface of the cooling plate 102b, is used as a reference point, and the width (length) of the light receiving positions consecutively from this reference point is calculated as the substrate distance DB.

[0066] In addition, as an example of another calculation method, the second distance calculation controller 70b may obtain data on the non-light-receiving position from the laser sensor unit 60b, and calculate the length to the non-light-receiving position that first appears on the queue 601 when observed from the position of the light-receiving element 601-n as the substrate distance DB.

[0067] (Substrate loading and unloading position)

[0068] When the substrate 22 is in the substrate carrying-in and carrying-out position, as shown in FIG. Figure 7As shown, the laser beams emitted from the laser emitting units 50a and 50b are received by the light receiving elements 601-1 to 601-n (i.e., all light receiving elements) of the array 601 of the laser sensor units 60a and 60b, respectively. Therefore, the width (length) of the continuous light receiving positions of the light receiving element 601-1 of the array 601 of the laser sensor unit 60a, i.e., the width (length) of the array of light receiving elements 601-1 to 601-n, is calculated as the substrate distance DA (i.e., substrate distance DA1). Similarly, the width (length) of the continuous light receiving positions of the light receiving element 601-n of the array 601 of the laser sensor unit 60b, i.e., the width (length) of the array of light receiving elements 601-1 to 601-n, is calculated as the substrate distance DB (i.e., substrate distance DB1).

[0069] (Substrate cooling process position)

[0070] In addition, when the substrate 22 is in the substrate cooling processing position, as shown in FIG. Figure 8 As shown, the laser beams emitted from laser emitting units 50a and 50b are blocked by substrates 22a and 22b within a portion of their respective distribution ranges. Consequently, the light-receiving elements in array 601 of laser sensor units 60a and 60b that correspond to the height of substrates 22a and 22b do not receive the laser beams. In other words, laser sensor units 60a and 60b identify the positions of light-receiving elements that correspond to the height between the upper and lower surfaces of substrates 22a and 22b as non-light-receiving positions, and identify the positions of all other light-receiving elements that receive the laser beam as light-receiving positions.

[0071] For example, when the positions of the light receiving elements 601-1 to 601-m in the queue 601 of the laser sensor unit 60a are acquired as light receiving positions and the positions of the next light receiving elements 601-(m+1) to 601-(m+100) are acquired as non-light receiving positions, the first distance calculation controller 70a calculates the width (length) of the continuous light receiving positions starting from the light receiving element 601-1 serving as the reference point, that is, the width (length) of the queue of the light receiving elements 601-1 to 601-m, as the substrate distance DA (that is, the substrate distance DA2).

[0072] Similarly, for example, in a case where the positions of the light receiving elements 601-(m′) to 601-n in the queue 601 of the laser sensor unit 60b are acquired as light receiving positions and the positions of the next light receiving elements 601-(m′-1) to 601-(m-100) are acquired as non-light receiving positions, the second distance calculation controller 70b calculates the width (length) of the continuous light receiving positions starting from the light receiving element 601-n serving as the reference point, that is, the width (length) of the queue of the light receiving elements 601-(m′) to 601-n, as the substrate distance DB (that is, substrate distance DB1).

[0073] Regarding the section between the substrate loading and unloading position and the substrate cooling processing position, the substrate distances DA and DB are calculated by the first distance calculation controller 70 a and the second distance calculation controller 70 b respectively through the same steps as those for the substrate cooling processing position.

[0074] The substrate cooling unit 18 is composed of cooling plates 102a, 102b, substrate holding portions 103a, 103b, support shafts 104a, 104b, and drive portions 105a, 105b. Alternatively, the substrate cooling unit 18 may further include laser emitting units 50a, 50b, laser sensor units 60a, 60b, a first distance calculation controller 70a, and a second distance calculation controller 70b.

[0075] (Controller)

[0076] like Figure 9 As shown, the controller 121, which serves as a control unit (control mechanism), is configured as a computer including a CPU (Central Processing Unit) 121a, RAM (Random Access Memory) 121b, a storage device 121c, and an I / O port 121d. The RAM 121b, storage device 121c, and I / O port 121d are configured to exchange data with the CPU 121a via an internal bus 121e. An input / output device 122, such as a touch panel, is connected to the controller 121.

[0077] The storage device 121c is composed of, for example, a flash memory, an HDD (Hard Disk Drive), and the like. In the storage device 121c, a control program for controlling the actions of the substrate processing device, a process recipe that records the steps and conditions of the substrate processing described later, and the like can be read out and stored. The process recipe is a combination that enables the controller 121 to execute each step in the substrate processing process described later and obtain a specified result, and functions as a program. Hereinafter, the process recipe and the control program are also collectively referred to as programs. In addition, the process recipe is also referred to as a recipe only. When the term program is used in this specification, there is a case where only one side of the recipe is included, a case where only one side of the control program is included, or a case where both sides are included. RAM121b is configured as a storage area (working area) for temporarily holding programs or data read out by CPU121a.

[0078] The I / O port 121d is connected to the atmospheric robot 21, the vacuum robot 36, the L / L drive device 25, the robotic arm 17, the drive parts 105a, 105b, the refrigerant supply units 109a, 109b, the first distance calculation controller 70a, the second distance calculation controller 70b, the gate valve, the vacuum pump, the heater, etc.

[0079] The CPU 121a is configured to read and execute a control program from the storage device 121c, and to read a recipe from the storage device 121c based on input of an operation command from the input / output device 122. The CPU 121a is configured to control the following operations in accordance with the contents of the read recipe: substrate transport by the atmospheric robot 21, substrate transport by the vacuum robot 36, lifting and rotating of the substrate support 24 by the drive device 25, substrate transport by the robot arm 17, adjustment of the temperature and flow rate of the refrigerant in the refrigerant supply units 109a and 109b, lifting and lowering of the substrate by the drive units 105a and 105b, calculation of the substrate distances DA and DB by the first and second distance calculation controllers 70a and 70b, opening and closing of the gate valve, starting and stopping of the vacuum pump, and temperature adjustment of the heater.

[0080] The controller 121 can be configured by installing the above-mentioned program stored in an external storage device (e.g., a magnetic disk such as a hard disk, an optical disk such as a CD, an optical magnetic disk such as an MO, a semiconductor memory such as a USB memory) 123 into a computer. The storage device 121c and the external storage device 123 constitute a computer-readable recording medium. Hereinafter, they will also be collectively referred to as recording media. In this specification, when the term recording medium is used, there are cases where only the storage device 121c is included, only the external storage device 123 is included, or both are included. In addition, the program can be provided to the computer without using the external storage device 123, but using communication means such as the Internet or a dedicated line.

[0081] (About substrate distances DA and DB)

[0082] The following describes in detail the substrate distance DA (substrate distance DA1) and substrate distance DB (substrate distance DB1) at the substrate loading and unloading position, and the substrate distance DA (substrate distance DA2) and substrate distance DB (substrate distance DB2) at the substrate cooling processing position.

[0083] (Substrate distance DA1, DB1)

[0084] The substrate distances DA1 and DB1 are appropriately determined according to the positions of the cooling plates 102a and 102b and the interval between the robots 38a and 38b, and are each set to a predetermined distance within a range of 10 to 200 mm, for example.

[0085] (Substrate distance DA2, DB2)

[0086] Substrate distances DA2 and DB2 are primarily set based on the desired cooling characteristics for substrate 22 during the substrate cooling process. For example, each distance is set to a predetermined distance within the range of 1 to 20 mm, preferably 1 to 5 mm. Here, "cooling characteristics" primarily include characteristics related to the temperature change of substrate 22 over cooling time, particularly including characteristics related to the change in the average temperature of the entire surface of substrate 22 and the change in temperature deviation within the surface of substrate 22.

[0087] The cooling characteristics of the substrate 22 are significantly dependent on the substrate distances DA2 and DB2 during the substrate cooling process. Therefore, in order to cool the substrate 22 according to the desired cooling characteristics, it is necessary to accurately determine the substrate distances DA2 and DB2 and set the operating amounts of the drive units 105a and 105b so that these distances are the desired values.

[0088] Furthermore, as the cooling rate of the substrate 22 increases, the temperature deviation within the surface of the substrate 22 generally increases, and as the temperature deviation increases, the warping of the substrate 22 may increase. Therefore, from the perspective of suppressing the increase in the warping of the substrate 22, it is necessary to select the substrate distances DA2 and DB2 so that the warping amount or the temperature deviation within the surface of the substrate 22 does not exceed a predetermined value, and to accurately set the operating amounts of the drive units 105a and 105b so as to achieve these selected distances.

[0089] Furthermore, since substrate 22 cools more rapidly as substrate distances DA2 and DB2 decrease, it is desirable to minimize substrate distances DA2 and DB2 to improve cooling process throughput. However, if substrate 22 warps significantly during the cooling process, excessively small substrate distances DA2 and DB2 may cause substrate 22 to contact cooling plates 102a and 102b. Therefore, to avoid such contact, it is desirable to select substrate distances DA2 and DB2 with a margin that allows for the possibility of substrate 22 warping.

[0090] To address this issue, the substrate cooling unit 18 in this embodiment is configured to measure the substrate distances DA2 and DB2 during the substrate cooling process. In particular, when the substrate 22 is warped, the distance between the substrate 22 and the cooling plates 102a and 102b may vary depending on the in-plane position of the substrate 22. However, according to this embodiment, Figure 10As shown, even if substrate 22 is warped, the shortest distance between the upper surface of substrate 22a and the lower surface of cooling plate 102a can be calculated and measured. The same applies to the distance between the lower surface of substrate 22b and the upper surface of cooling plate 102b. The ability to reliably measure the shortest distance makes it particularly easy to assess the likelihood of contact between substrate 22 and cooling plates 102a, 102b and to set margins to prevent contact.

[0091] To address this issue, the substrate cooling unit 18 in this embodiment is configured to measure the amount of warpage of the substrate 22 that occurs during the substrate cooling process. Based on the measured warpage, the substrate distances DA2 and DB2 are selected so that the warpage or in-plane temperature deviation of the substrate 22 does not exceed a predetermined value. Furthermore, the operating amounts of the drive units 105a and 105b are set to achieve these selected distances.

[0092] (2) Operation of substrate processing apparatus

[0093] Next, the operation of the substrate processing apparatus 10 of this embodiment will be described. Figure 1 The substrate processing flow in the substrate processing apparatus 10 is shown.

[0094] (Atmosphere Side Carrying-in Step S100)

[0095] First, the unprocessed substrate 22 is transferred from the atmospheric transfer chamber 20 to the load lock chamber 14a, and the load lock chamber 14a is hermetically sealed. Then, the gate valve is opened to allow the load lock chamber 14a and the transfer chamber 12 to communicate with each other.

[0096] (First Transport Step S110)

[0097] Next, the vacuum robot 36 drives the arm 42 to take the substrate 22 in the load lock chamber 14a onto the robot arm pair 40. Then, the substrate 22 is carried into the processing chamber 16a.

[0098] The vacuum robot 36 inserts the robot pair 40 into the processing chamber 16a and places the substrate 22a on the substrate holding table 44a. Furthermore, the vacuum robot 36 transfers the substrate 22b between the robot arm 17 and the robot pair 40. The robot arm 17 operates to place the received substrate 22b on the substrate holding table 44b.

[0099] (Substrate Processing Step S120)

[0100] Then, the substrates 22 on the substrate holding stages 44 a and 44 b are heated by the heaters respectively and subjected to predetermined processing.

[0101] (Second transport step S130)

[0102] After the processing in the processing chamber 16a is completed, the vacuum robot 36 inserts the robot arm pair 40 into the processing chamber 116a, removes the substrate 22a from the substrate holding table 44a, and removes the substrate 22b from the robot arm 17. The vacuum robot 36 then transfers the substrate 22 from the processing chamber 16a to the substrate cooling unit 18 and loads it.

[0103] (Substrate Cooling Step S140)

[0104] The substrate 22 transported to the substrate cooling unit 18 is cooled to a predetermined temperature in the substrate cooling unit 18. Details of the second transport step S130 and the substrate cooling step S140 will be described later as step A.

[0105] (Third Transport Step S150)

[0106] After the substrate 22 is cooled to a predetermined temperature, the vacuum robot 36 inserts the robot pair 40 into the substrate cooling unit 18 , receives the substrate 22 onto the robot pair 40 , and then transfers the substrate 22 into the load lock chamber 14 b .

[0107] (Atmosphere Side Carrying Out Step S160)

[0108] After closing the gate valve on the transfer chamber 12 side, the load lock chamber 14b is opened to the atmosphere. Then, the substrate 22 is transferred from the load lock chamber 14b to the atmospheric transfer chamber 20 and carried out to the outside by an external transfer device (not shown).

[0109] (2-1) A series of steps for cooling a substrate in a substrate cooling unit (step A)

[0110] Next, the operation of controlling the vacuum robot 36 and the driving units 105 a and 105 b to convey and cool the substrate 22 in a series of steps for cooling the substrate 22 by the substrate cooling unit 18 will be described in detail below.

[0111] (Substrate Loading Step SA10)

[0112] The process of loading the substrate 22 into the substrate cooling unit 18 and holding it on the substrate holding portions 103 a and 103 b is performed through the following steps ( SA100 to SA130 ).

[0113] (Robot Mounting Step SA100)

[0114] Two substrates, heated and subjected to heat treatment (e.g., annealing or film formation) in processing chamber 16a or 16b, are placed on upper and lower arms 38a and 38b, respectively, via robot arm 17. In this embodiment, substrate 22 is heated to approximately 400°C at this point.

[0115] (Robot Insertion Step SA110)

[0116] With the substrates 22a and 22b supported by the upper and lower manipulators 38a and 38b, the vacuum robot 36 inserts the manipulator pair 40 into the cooling chamber 101, positioning the upper manipulator 38a above the substrate holder 103a and the lower manipulator 38b above the substrate holder 103b. At this point, the substrate holders 103a and 103b are raised and lowered by the drive units 105a and 105b to the substrate loading and unloading positions. In this embodiment, the substrate 22 reaches approximately 300°C at this point.

[0117] (Robot lowering step SA120)

[0118] Next, the vacuum robot 36 holds the substrates 22a and 22b on the substrate holding parts 103a and 103b respectively by lowering the pair of manipulators 40. Alternatively, the substrate holding parts 103a and 103b may be raised and lowered respectively to hold the substrates 22a and 22b on the substrate holding parts 103a and 103b.

[0119] (Robot Retreat Step SA130)

[0120] Next, the vacuum robot 36 moves the pair of robots 40 so that the upper robot 38 a and the lower robot 38 b are retracted from below the substrate holding portion 103 a and 103 b to the outside of the cooling chamber 101 .

[0121] In the substrate moving-in step SA10, after the substrates 22a and 22b are held, the first distance calculation controller 70a and the second distance calculation controller 70b respectively control the laser emission units 50a and 50b to start emitting lasers, and based on at least one of the light receiving position and the non-light receiving position obtained from the laser sensor units 60a and 60b, start calculating the substrate distances DA and DB (i.e., distance measurement processing).

[0122] In this embodiment, laser emission is continued until the substrate unloading step S50 described later, and the distance measurement process is continuously performed at a predetermined cycle. The predetermined cycle can be arbitrarily set according to the purpose of the distance measurement, for example, within the range of 10 ms to 5 s.

[0123] However, as another embodiment, the distance measurement process may be performed only when the substrate 22 is in the substrate loading / unloading position or in the substrate cooling position, in conjunction with the control of the drive units 105a and 105b to raise and lower the substrate holding units 103a and 103b. Alternatively, the distance measurement process may be performed only when the substrate 22 is in the substrate cooling position.

[0124] (Substrate Lifting Step SA20)

[0125] Next, the drive unit 105a raises the substrate holding unit 103a and the substrate 22a to the substrate cooling position. Similarly, the drive unit 105b lowers the substrate holding unit 103b and the substrate 22b to the substrate cooling position. The drives 105a and 105b each perform a lifting motion based on the amount of motion instructed by the controller 121.

[0126] (Substrate Cooling Step SA30)

[0127] Next, while the substrate holders 103a and 103b are held stationary at the substrate cooling position for a predetermined period of time, the substrates 22a and 22b are cooled by the adjacent cooling plates 102a and 102b, respectively. In this embodiment, the cooling process in this step is performed for 60 seconds, cooling the substrates 22 to a temperature of approximately 100 to 150°C. Furthermore, the cooling plates 102a and 102b are cooled to a predetermined temperature by previously supplying refrigerant from the refrigerant supply units 109a and 109b into the refrigerant flow paths 106a and 106b. For example, the predetermined temperature is approximately -10 to 50°C.

[0128] In step B described later, an adjustment step is performed based on the substrate distances DA2 and DB2 measured during this step. In addition, steps C and D described later include steps of measuring the substrate distances DA2 and DB2 during this step.

[0129] (Substrate Lifting Step SA40)

[0130] Next, the substrate holding portion 103a and the substrate 22a are lowered to the substrate loading / unloading position by the driving portion 105a. Similarly, the substrate holding portion 103b and the substrate 22b are lowered to the substrate loading / unloading position by the driving portion 105b.

[0131] (Substrate Unloading Step SA50)

[0132] After the substrate 22 is raised and lowered to the substrate loading and unloading position, the vacuum robot 36 supports the substrate 22 again on the upper and lower manipulators 38a and 38b and unloads it from the cooling chamber 101. This step is performed by performing the above-described substrate loading step SA10 in reverse order.

[0133] (2-2) Step of Correcting the Driving Unit Based on Substrate Distance Measurement (Step B)

[0134] Next, the process of adjusting the operating amounts of the drive units 105a and 105b based on the substrate distances DA and DB measured in the above-mentioned series of substrate cooling processes (process A) will be described. Furthermore, process B and process A, which is performed before the adjustment in process B, are each performed as one of the adjustment processes for the substrate cooling unit 18.

[0135] The drive units 105a and 105b, which are composed of air cylinders or the like, operate based on the amount of movement indicated by the controller 121. While it is desirable to set the substrate distances DA2 and DB2 to the distances a and b, in reality, there are cases where the substrate distances DA2 and DB2 become different values ​​(distances a' and b') due to mechanical movement errors of the drive units 105a and 105b. Therefore, in this embodiment, the substrate distances DA2 and DB2 (distances a' and b') measured in the substrate cooling step SA30 of the above-mentioned process A are compared with the desired distances a and b, and the amount of movement of the drive units is adjusted based on the difference (a-DA2, b-DB2). Furthermore, since the substrate distances DA2 and DB2 may vary due to warping of the substrate 22 during the cooling process, it is particularly desirable to set the substrate distances DA2 and DB2 measured at the start of the substrate cooling step SA30 to the distances a' and b', and calculate the difference.

[0136] Specifically, the difference in the amount of movement instructed from the controller 121 to the drive units 105a and 105b is used to correct the value. Alternatively, a limiting unit (e.g., a limiting plate) may be provided to limit the range of movement of the drive units 105a and 105b within a predetermined range, and the limiting unit may be adjusted (e.g., by adjusting the position of the limiting plate) to correct the substrate distances DA2 and DB2 using the difference.

[0137] As described above, in this embodiment, the movement amount of the drive parts 105a, 105b (or substrate holding mechanism) can be adjusted based on the substrate distances DA2, DB2 measured in process A so that these values ​​become desired values, thereby making it easy to cool the substrate 22 with the desired cooling characteristics.

[0138] Furthermore, in this embodiment, the surfaces of substrates 22a and 22b cooled by cooling plates 102a and 102b face different directions on their front and back sides. Therefore, it is desirable that the substrate distances DA2 and DB2 during the cooling process also be set differently depending on the type and / or structure of the film formed on the surfaces of substrates 22a and 22b. Therefore, as in this embodiment, it is preferable to adopt a configuration in which the substrate distances DA2 and DB2 can be measured independently.

[0139] (2-3) Substrate Warpage Monitoring Process Based on Substrate Distance Measurement (Process C)

[0140] Next, a description will be given of a process for detecting warpage occurring in the substrate 22 during the cooling process and measuring the amount of warpage based on the substrate distances DA and DB measured in the series of substrate cooling processes (process A). Process C can be performed as part of process A. Furthermore, process C can be performed as part of an adjustment process for the substrate cooling unit 18 or as part of a process for processing a product substrate.

[0141] In step C, the measurement (calculation) of the substrate distances DA2 and DB2 is continuously and repeatedly performed during the substrate cooling step SA30 in step A, thereby detecting the occurrence of warpage in the substrate 22 and measuring the amount of warpage.

[0142] Specifically, first, the substrate distances DA2 and DB2 at the start point of the substrate cooling step SA30, i.e., at the time when the substrate 22 is raised and lowered to the substrate cooling position, are measured. Here, the substrate distances DA2 and DB2 at this time point are specifically referred to as DA2 (T0) 、DB2 (T0) .

[0143] Next, while the substrate cooling process is being performed, that is, while the substrate 22 is maintained at the substrate cooling position, the substrate distances DA2 and DB2 are repeatedly measured. Here, the number of times from the start of the measurement to the execution of the measurement is counted from 1 to k (k is a natural number), and the substrate distances DA2 and DB2 measured for the kth time are specifically referred to as DA2 (Tk) 、DB2 (Tk) .

[0144] Then, the controller 121 sets DA2 (T0) With DA2 (Tk) The difference between DB2 and DB3 is calculated as the warpage amount of the substrate 22a generated during the cooling process. (T0) With DB2 (Tk) The difference is calculated as the warpage amount of the substrate 22b generated during the cooling process. Figure 10When substrate 22 warps in a convex shape as shown, the change in height of the center of substrate 22 is calculated as the amount of warpage generated during the cooling process. Alternatively, when substrate 22 warps in a concave shape, the change in height of the outer edge of substrate 22 is calculated as the amount of warpage generated during the cooling process.

[0145] You can also use DA2 (T0) With DA2 (Tk) The difference (or DB2 (T0) With DB2 (Tk) The controller 121 is configured to determine that the substrate 22 has warped when the difference between the values ​​of 0 and 1 exceeds a predetermined first threshold.

[0146] Furthermore, the controller 121 may be configured so that, when the difference exceeds a predetermined second threshold, the drive units 105a and 105b are controlled to move the substrate 22 away from the cooling plates 102a and 102b. This prevents warping of the substrate 22 from exceeding a predetermined amount. Furthermore, in this embodiment, since the surfaces of the substrates 22a and 22b cooled by the cooling plates 102a and 102b face different directions on the front and back, the second threshold for substrate 22a and the second threshold for substrate 22b may be different.

[0147] (2-4) Substrate contact avoidance step based on substrate distance measurement (step D)

[0148] Next, a process for preventing the substrate 22 from contacting the cooling plates 102a and 102b due to warping of the substrate 22 during the cooling process will be described based on the substrate distances DA and DB measured in the series of substrate cooling processes (process A). Process D can be performed as part of process A.

[0149] In process D, when it is detected that the warped substrate 22 is closer to the cooling plates 102a, 102b than the specified distance by continuously and repeatedly measuring (calculating) the substrate distances DA2, DB2 during the substrate cooling step SA30 in process A, the drive units 105a, 105b are controlled in such a manner as to move the substrate 22 away from the cooling plates 102a, 102b before the substrate 22 contacts the cooling plates 102a, 102b.

[0150] Specifically, in step D, similarly to step C, during the substrate cooling step SA30 in step A, DA2 is continuously measured (calculated). (Tk) . And, in DA2 (Tk) When the value of DB2 is smaller than a predetermined threshold, the controller 121 controls the driving unit 105a to lower the substrate 22a so as to move away from the cooling plate 102a.(Tk) When the value becomes smaller than a predetermined threshold value, the controller 121 is configured to control the driving unit 105b to raise the substrate 22b so as to separate it from the cooling plate 102b.

[0151] Industrial Applicability

[0152] According to the technology of the present invention, cooling can be performed in a manner close to desired cooling characteristics in a cooling process for a substrate.

[0153] The invention of Japanese Patent Application No. 2019-167921 filed on September 17, 2019 is incorporated herein by reference in its entirety.

[0154] All documents, patent applications, and technical standards described in this specification are incorporated herein by reference to the same extent as if each individual document, patent application, or technical standard was specifically and individually indicated to be incorporated by reference.

Claims

1. A substrate cooling unit comprising: a substrate holding mechanism that holds the substrate horizontally; a driving unit for raising and lowering the substrate holding mechanism; a cooling plate having an opposing surface opposing a surface of the substrate held by the substrate holding mechanism and having a refrigerant flow path therein for allowing a refrigerant to flow; a laser emitting unit provided at one end of a side of a space in which the substrate held by the substrate holding mechanism is raised and lowered, and emitting a laser beam having a width distributed in the direction in which the substrate holding mechanism is raised and lowered and parallel to the surface of the substrate held by the substrate holding mechanism; a laser light receiving portion provided at the other end of the side of the space and configured to obtain light receiving position determination information indicating a position in the direction in which the substrate holding mechanism is raised or lowered at which the laser light emitted from the laser emitting portion is received; and A calculation unit calculates a distance between the opposing surface of the cooling plate and a surface of the substrate held by the substrate holding mechanism that opposes the cooling plate, based on the light receiving position identification information acquired by the laser light receiving unit.

2. The substrate cooling unit according to claim 1, wherein: The laser emitting portion is configured to emit laser light having a predetermined width in the direction in which the substrate holding mechanism is raised or lowered.

3. The substrate cooling unit according to claim 1, wherein: The laser emitting portion is composed of a plurality of laser oscillating elements arranged at predetermined intervals along the direction in which the substrate holding mechanism is raised and lowered.

4. The substrate cooling unit according to claim 1, wherein: The laser emitting unit is configured to irradiate the laser beam so that the distribution of the laser beam includes the height position of the facing surface of the cooling plate.

5. The substrate cooling unit according to claim 4, wherein: The laser emitting unit is configured to irradiate the laser beam so that the distribution of the laser beam includes a range in the height direction of the substrate held by the substrate holding mechanism as it is moved up and down.

6. The substrate cooling unit according to claim 4 or 5, wherein: The laser light receiving unit acquires information on the light receiving position of the laser light as the light receiving position identification information. The calculation unit calculates, as the distance, a width of the light receiving positions continuous from a height position of the opposing surface of the cooling plate based on the information of the light receiving position acquired by the laser light receiving unit.

7. The substrate cooling unit according to claim 4 or 5, wherein: The laser light receiving unit acquires information on a non-light receiving position of the laser light as the light receiving position identification information. The calculation unit calculates, as the distance, a distance from a height position of the opposing surface of the cooling plate to the non-light receiving position based on information on the non-light receiving position acquired by the laser light receiving unit.

8. The substrate cooling unit according to any one of claims 1 to 3, wherein: The laser emitting unit and the laser receiving unit are arranged outside the cooling treatment chamber with the substrate holding mechanism arranged inside, and emit and receive the laser light through windows for transmitting the laser light respectively arranged at one end and the other end of the side of the cooling treatment chamber.

9. The substrate cooling unit according to any one of claims 1 to 3, wherein: A control unit is provided, which is configured to perform a lifting process and a cooling process, and at least when performing the cooling process, the process of calculating the distance by the calculation unit is performed, wherein the lifting process is a process of controlling the driving unit to lift the substrate holding mechanism to a predetermined position in a manner that the substrate held on the substrate holding mechanism approaches the cooling plate, and the cooling process is a process of controlling the driving unit to cool the substrate by maintaining the lifting and lowering state of the substrate holding mechanism stopped for a predetermined time after the lifting process.

10. The substrate cooling unit according to claim 9, wherein: The control unit is configured to continuously and repeatedly perform the process of calculating the distance by the calculation unit at least during the cooling process.

11. The substrate cooling unit according to claim 10, wherein: The control unit is configured to calculate a difference between the distance calculated at the start of the cooling process and the distance continuously calculated during the cooling process as an amount of warping of the substrate generated during the cooling process.

12. The substrate cooling unit according to claim 10, wherein: The control unit is configured to control the driving unit so as to move the substrate held by the substrate holding mechanism away from the cooling plate when the distance calculated by the calculation unit is smaller than a predetermined threshold value.

13. The substrate cooling unit according to claim 11, wherein: The control unit is configured to control the driving unit to move the substrate held by the substrate holding mechanism away from the cooling plate when the calculated difference exceeds a predetermined threshold value.

14. A substrate processing apparatus comprising: and a cooling plate having an opposing surface opposed to the surface of the substrate held by the substrate holding mechanism and having a refrigerant flow path therein for flowing a refrigerant; a laser emitting portion provided at one end of a side of a space in which the substrate held by the substrate holding mechanism is elevated and lowered, emitting laser light having a wide distribution in the direction in which the substrate holding mechanism is elevated and lowered and parallel to the surface of the substrate held by the substrate holding mechanism; a laser light receiving portion provided at the other end of the side of the space, acquiring light receiving position determination information indicating a position in the direction in which the substrate holding mechanism is elevated and lowered at the location where the laser light emitted from the laser emitting portion is received; and a calculating portion calculating a distance between the opposing surface of the cooling plate and the opposing surface of the substrate held by the substrate holding mechanism with respect to the cooling plate based on the light receiving position determination information acquired by the laser light receiving portion; a processing chamber for performing a heat treatment on the substrate; as well as A substrate transport device transports the substrate processed in the processing chamber to the substrate cooling unit.

15. The substrate processing apparatus according to claim 14, wherein: A control unit is provided for performing a lifting process and a cooling process, wherein the lifting process is a process of controlling the driving unit to lift the substrate holding mechanism to a predetermined position so that the substrate held by the substrate holding mechanism approaches the cooling plate, and the cooling process is a process of controlling the driving unit to cool the substrate by maintaining the substrate holding mechanism in a stopped state for a predetermined time after the lifting process. The control unit is configured to control the calculation unit so that the calculation unit performs a process of calculating the distance at least when the cooling process is performed.

16. A method for manufacturing a semiconductor device, comprising the following steps: a step of causing a substrate holding mechanism that holds the substrate horizontally to hold the substrate; The step of raising and lowering the substrate holding mechanism to a predetermined position so that the substrate approaches a cooling plate having an opposing surface facing a surface of the substrate held by the substrate holding mechanism, wherein: The cooling plate is provided with a refrigerant flow path inside for the refrigerant to flow; a step of cooling the substrate by maintaining the substrate holding mechanism in a stopped state for a predetermined time after the step of raising and lowering the substrate holding mechanism; a step of emitting laser light from one end of a side of a space in which the substrate held by the substrate holding mechanism is raised and lowered toward the other end, with a width distributed in the direction in which the substrate holding mechanism is raised and lowered and parallel to the surface of the substrate held by the substrate holding mechanism, receiving the laser light at the other end, and acquiring light receiving position determination information indicating a position in the direction in which the laser light is received; and a step of calculating a distance between the opposing surface of the cooling plate and the opposing surface of the substrate held by the substrate holding mechanism with respect to the cooling plate based on the light receiving position identification information.

17. A recording medium, which is a computer-readable recording medium and stores a program for causing a substrate processing apparatus to execute the following steps via a computer: a step of causing a substrate holding mechanism of a substrate cooling unit provided in the substrate processing apparatus to hold the substrate horizontally; The step of raising and lowering the substrate holding mechanism to a predetermined position so that the substrate approaches a cooling plate having an opposing surface opposing a surface of the substrate held by the substrate holding mechanism, wherein: The cooling plate is provided with a refrigerant flow path inside for the refrigerant to flow; a step of cooling the substrate by maintaining the substrate holding mechanism in a stopped state for a predetermined time after the step of raising and lowering the substrate holding mechanism; a step of emitting laser light from one end of a side of a space in which the substrate held by the substrate holding mechanism is raised and lowered toward the other end thereof, with a width distributed in the direction in which the substrate holding mechanism is raised and lowered and parallel to the surface of the substrate held by the substrate holding mechanism, receiving the laser light at the other end of the side, and acquiring light receiving position determination information indicating a position in the direction in which the laser light is received by the substrate holding mechanism; and A step of calculating a distance between the opposing surface of the cooling plate and the opposing surface of the substrate held by the substrate holding mechanism with respect to the cooling plate based on the light receiving position identification information.

18. A substrate processing method comprising the following steps: a step of causing a substrate holding mechanism that holds the substrate horizontally to hold the substrate; The step of raising and lowering the substrate holding mechanism to a predetermined position so that the substrate approaches a cooling plate having an opposing surface facing a surface of the substrate held by the substrate holding mechanism, wherein: The cooling plate is provided with a refrigerant flow path inside for the refrigerant to flow; a step of cooling the substrate by maintaining the substrate holding mechanism in a stopped state for a predetermined time after the step of raising and lowering the substrate holding mechanism; a step of emitting laser light from one end of a side of a space in which the substrate held by the substrate holding mechanism is raised and lowered toward the other end, with a width distributed in the direction in which the substrate holding mechanism is raised and lowered and parallel to the surface of the substrate held by the substrate holding mechanism, receiving the laser light at the other end, and acquiring light receiving position determination information indicating a position in the direction in which the laser light is received; and a step of calculating a distance between the opposing surface of the cooling plate and the opposing surface of the substrate held by the substrate holding mechanism with respect to the cooling plate based on the light receiving position identification information.

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